Method for manufacturing light emitting device and method for manufacturing light emitting module, and light emitting device and light emitting module

Abstract

Provided are a manufacturing method of a light emitting device having a narrow light emitting surface, a manufacturing method of a light emitting module, and a light emitting device and a light emitting module. The manufacturing method of the light emitting device (100) includes the following steps: a step of preparing a plurality of first element structures (15) each sequentially including a sub-mounting substrate (10), a light emitting element (20), and a light-transmitting member (30); a step of placing the plurality of first element structures (15) on a sheet member with the sub-mounting substrates (10) facing the sheet member; and a step of forming a first covering member (40) on the sheet member to cover the side surfaces of the first element structures (15).

Description

TECHNICAL FIELD

[0001] The present disclosure relates to a manufacturing method of a light emitting device and a manufacturing method of a light emitting module, and a light emitting device and a light emitting module. BACKGROUND

[0002] Conventionally, a light emitting device having a plurality of light emitting surfaces is known. For example, in Patent Literature 1, a light emitting device having a plurality of light emitting elements, a light-transmissive member covering upper surfaces of the light emitting elements, and a light-reflective member integrally covering side surfaces of the light emitting elements is disclosed.

[0003] Patent Literature 1: Japanese Patent Application Publication No. 2016-27620

[0004] There is room for further improvement in the configuration for densely arranging a plurality of light emitting surfaces.

[0005] An object of embodiments of the present disclosure is to provide a manufacturing method of a light emitting device having a narrow distance between light emitting surfaces and a manufacturing method of a light emitting module, and a light emitting device and a light emitting module. SUMMARY

[0006] The manufacturing method of a light emitting device of an embodiment of the present disclosure includes a step of preparing a plurality of first element structures each having, in order, a sub mounting substrate, a light emitting element, and a light-transmissive member; a step of placing the plurality of first element structures with the sub mounting substrates facing a sheet member; and a step of forming a first covering member covering side surfaces of the respective first element structures on the sheet member.

[0007] The manufacturing method of a light emitting device of an embodiment of the present disclosure includes a step of preparing a plurality of first element structures each having, in order, a sub mounting substrate, a light emitting element, and a light-transmissive member; a step of placing the plurality of first element structures with the sub mounting substrates facing a sheet member; a step of forming a second covering member covering side surfaces of the respective sub mounting substrates on the sheet member; and a step of forming a first covering member on the second covering member, the first covering member covering side surfaces of the respective light emitting elements and side surfaces of the respective light-transmissive members and having a higher light reflectance for light from the light emitting elements than the second covering member.

[0008] The manufacturing method of a light emitting device of an embodiment of the present disclosure includes the following steps: a step of preparing a plurality of second element structures each sequentially including a sub mounting substrate and a light emitting element; a step of placing the plurality of second element structures with the sub mounting substrates facing a sheet member; a step of providing a light transmissive member on each of the light emitting elements after the plurality of second element structures are placed on the sheet member; and a step of forming a first cover member on the sheet member, the first cover member covering side surfaces of each of the second element structures and side surfaces of each of the light transmissive members.

[0009] The manufacturing method of a light emitting device of an embodiment of the present disclosure includes the following steps: a step of preparing a plurality of second element structures each sequentially including a sub mounting substrate and a light emitting element; a step of placing the plurality of second element structures with the sub mounting substrates facing a sheet member; a step of providing a light transmissive member on each of the light emitting elements after the plurality of second element structures are placed on the sheet member; a step of forming a second cover member on the sheet member, the second cover member covering side surfaces of each of the sub mounting substrates; and a step of forming a first cover member on the second cover member, the first cover member covering side surfaces of each of the light emitting elements and side surfaces of each of the light transmissive members, and having a higher light reflectance for light from the light emitting elements than the second cover member.

[0010] The manufacturing method of a light emitting module of an embodiment of the present disclosure includes the following steps: a step of preparing a light emitting device using the manufacturing method of the light emitting device described above; and a step of placing the light emitting device with the sub mounting substrate facing a module substrate.

[0011] The manufacturing method of a light emitting module of an embodiment of the present disclosure includes the following steps: a step of preparing a plurality of first element structures each sequentially including a sub mounting substrate, a light emitting element, and a light transmissive member; a step of placing the plurality of first element structures with the sub mounting substrates facing a module substrate; a step of forming a frame around the plurality of first element structures on the module substrate; and a step of forming a first cover member inside the frame, the first cover member covering side surfaces of each of the first element structures.

[0012] The light emitting device of an embodiment of the present disclosure includes: a plurality of first element structures each sequentially including a sub mounting substrate, a light emitting element, and a light transmissive member; and a first cover member covering side surfaces of each of the first element structures to hold the plurality of first element structures.

[0013] The light emitting device of the embodiment of the present disclosure has: a plurality of first element structures each having a sub-mounting substrate, a light emitting element, and a light-transmissive member in this order; a second covering member covering side surfaces of each of the sub-mounting substrates to hold the plurality of first element structures; and a first covering member covering side surfaces of each of the light emitting elements and side surfaces of each of the light-transmissive members to hold the plurality of first element structures, and having a higher light reflectance for light from the light emitting elements than the second covering member.

[0014] The light emitting module of the embodiment of the present disclosure has: the light emitting device described above; and a module substrate on which the light emitting device is placed so as to face the sub-mounting substrate.

[0015] The manufacturing method of the light emitting device of the embodiment of the present disclosure can manufacture a light emitting device having a narrower light emitting surface.

[0016] The manufacturing method of the light emitting module of the embodiment of the present disclosure can manufacture a light emitting module having a narrower light emitting surface.

[0017] The light emitting device of the embodiment of the present disclosure can have a narrower light emitting surface.

[0018] The light emitting module of the embodiment of the present disclosure can have a narrower light emitting surface. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1A is a perspective view schematically showing a structure of a light emitting module having the light emitting device of the first embodiment.

[0020] Figure 1B is a plan view schematically showing a structure of a light emitting module having the light emitting device of the first embodiment.

[0021] Figure 1C is a sectional view of an IC-IC line of Figure 1B .

[0022] Figure 1D is a sectional view of an ID-ID line of Figure 1B .

[0023] Figure 1E is a sectional view schematically showing a structure of the light emitting device of the first embodiment.

[0024] Figure 1F is a bottom view schematically showing a structure of the light emitting device of the first embodiment.

[0025] Figure 2 is a flowchart of the manufacturing method of the light emitting device of the first embodiment.

[0026] Figure 3is a flowchart of a manufacturing method of a light emitting module of the first embodiment.

[0027] Figure 4A is a cross-sectional view showing a process of placing a light emitting element in the first element structure preparation process of the manufacturing method of the light emitting device of the first embodiment.

[0028] Figure 4B is a cross-sectional view showing a process of disposing a light-transmitting member in the first element structure preparation process of the manufacturing method of the light emitting device of the first embodiment.

[0029] Figure 4C is a cross-sectional view showing a process of manufacturing a first element structure in the first element structure preparation process of the manufacturing method of the light emitting device of the first embodiment.

[0030] Figure 4D is a cross-sectional view showing a process of forming a frame in the manufacturing method of the light emitting device of the first embodiment.

[0031] Figure 4E is a cross-sectional view showing a process of placing the first element structure in the manufacturing method of the light emitting device of the first embodiment.

[0032] Figure 4F is a cross-sectional view showing a process of forming a first cover member in the manufacturing method of the light emitting device of the first embodiment.

[0033] Figure 4G is a cross-sectional view showing a process of removing a sheet member in the manufacturing method of the light emitting device of the first embodiment.

[0034] Figure 4H is a cross-sectional view showing a process of placing the light emitting device in the manufacturing method of the light emitting module of the first embodiment.

[0035] Figure 4I is a plan view showing a process of placing the first element structure in the manufacturing method of the light emitting device of the first embodiment.

[0036] Figure 4J is a plan view showing a process of forming the first cover member in the manufacturing method of the light emitting device of the first embodiment.

[0037] Figure 4K is a plan view showing a process of placing the light emitting device in the manufacturing method of the light emitting module of the first embodiment.

[0038] Figure 5A is a plan view schematically showing a structure of a light emitting module provided with the light emitting device of the second embodiment.

[0039] Figure 5B is a cross-sectional view of the VB-VB line of Figure 5A

[0040] Figure 5C is a cross-sectional view schematically showing the structure of the light emitting device of the second embodiment.

[0041] Figure 6 is a flowchart of the manufacturing method of the light emitting device of the second embodiment.

[0042] Figure 7A is a cross-sectional view showing a step of forming the second cover member in the manufacturing method of the light emitting device of the second embodiment.

[0043] Figure 7B is a cross-sectional view showing a step of forming the first cover member in the manufacturing method of the light emitting device of the second embodiment.

[0044] Figure 7C is a cross-sectional view showing a step of removing the sheet member in the manufacturing method of the light emitting device of the second embodiment.

[0045] Figure 7D is a cross-sectional view showing a step of placing the light emitting device in the manufacturing method of the light emitting module of the second embodiment.

[0046] Figure 7E is a plan view showing a step of forming the second cover member in the manufacturing method of the light emitting device of the second embodiment.

[0047] Figure 7F is a plan view showing a step of forming the first cover member in the manufacturing method of the light emitting device of the second embodiment.

[0048] Figure 7G is a plan view showing a step of placing the light emitting device in the manufacturing method of the light emitting module of the second embodiment.

[0049] Figure 8A is a plan view schematically showing the structure of the light emitting module provided with the light emitting device of the third embodiment.

[0050] Figure 8B is a cross-sectional view of the VIIIB-VIIIB line of Figure 8A

[0051] Figure 8C is a cross-sectional view schematically showing the structure of the light emitting device of the third embodiment.

[0052] Figure 9 is a flowchart of the manufacturing method of the light emitting device of the third embodiment.

[0053] Figure 10A ​​is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0054] Figure 10B is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0055] Figure 10C is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0056] Figure 10D is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0057] Figure 10E is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0058] Figure 10F is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0059] Figure 10G is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0060] Figure 10H is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0061] Figure 11A is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0062] Figure 11B is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment. Figure 11A

[0063] Figure 11C is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0064] Figure 12 is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0065] Figure 13A is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.

[0066] Figure 13B is a cross-sectional view that schematically shows a structure of the light emitting module provided with the light emitting device of the fourth embodiment.​

[0067] Figure 13C is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0068] Figure 13D is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0069] Figure 13E is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0070] Figure 13F is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0071] Figure 13G is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0072] Figure 13H is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0073] Figure 14A is a plan view schematically showing a structure of a light emitting module of the light emitting device of another embodiment.

[0074] Figure 14B is a sectional view of line XIVB-XIVB of Figure 14A .

[0075] Figure 14C is a bottom view schematically showing a structure of the light emitting device of an embodiment of Figure 14A .

[0076] Figure 15A is a sectional view schematically showing a structure of the light emitting module of another embodiment.

[0077] Figure 15B is a flowchart of a manufacturing method of the light emitting module of an embodiment of Figure 15A . DETAILED DESCRIPTION

[0078] The following describes the mode with reference to the drawings. The following mode is an example of a manufacturing method of a light emitting device and a manufacturing method of a light emitting module, and a light emitting device and a light emitting module, which embody the technical idea of the present embodiment, and is not limited to the following. In addition, the size, material, shape, relative arrangement, and the like of the structural components described in the present embodiment are not intended to limit the scope of the present application to these, but are merely simple examples, unless otherwise specified. Furthermore, the size, positional relationship, and the like of the components shown in the respective drawings are sometimes exaggerated for the sake of clear description.

[0079] First Embodiment

[0080] Figure 1A is a perspective view schematically showing the structure of the light emitting module provided with the light emitting device of the first embodiment. Figure 1B is a plan view schematically showing the structure of the light emitting module provided with the light emitting device of the first embodiment. Figure 1C is Figure 1B is a cross-sectional view of the IC-IC line of Figure 1D is Figure 1B is a cross-sectional view of the ID-ID line of Figure 1E is a cross-sectional view schematically showing the structure of the light emitting device of the first embodiment. Figure 1F is a bottom view schematically showing the structure of the light emitting device of the first embodiment.

[0081] The light emitting module 200 is provided with the light emitting device 100 and a module substrate 80.

[0082] [Light Emitting Device]

[0083] First, the light emitting device 100 is described.

[0084] The light emitting device 100 is provided with: a plurality of first element structures 15, each of which is provided with a sub mounting substrate 10, a light emitting element 20, and a light-transmissive member 30 in this order; and a first cover member 40 that covers the side surface of each of the first element structures 15 to hold the plurality of first element structures 15.

[0085] In other words, the light emitting device 100 is mainly provided with the sub mounting substrate 10, the light emitting element 20, the protective element 25, the light-transmissive member 30, the first cover member 40, and the frame 50.

[0086] Hereinafter, each structure of the light emitting device 100 is described.

[0087] The sub mounting substrate 10 is a member on which the light emitting element 20 and the protective element 25 are placed, and has a wiring for electrically connecting the light emitting device 100 with the outside. The sub mounting substrate 10 is formed in a substantially rectangular shape in plan view, for example. The sub mounting substrate 10 has a base portion 2, a first wiring portion 3, an internal wiring portion 4, and a second wiring portion 5.

[0088] As the base portion 2, an insulating material is preferably used, and a material that is not easily transmissive to light emitted from the light emitting element 20, external light, or the like is preferably used. For example, a ceramic such as alumina, aluminum nitride, or mullite, a thermoplastic resin such as PA (polyamide), PPA (polyphthalamide), PPS (polyphenylene sulfide), or liquid crystal polymer, an epoxy resin, a silicone resin, a modified epoxy resin, a polyurethane resin, or a phenol resin can be used. Among these, a ceramic having excellent heat dissipation properties is preferably used.

[0089] In the light emitting device 100, the distance between the adjacent sub mounting substrates 10 is preferably 0.05 mm or more and 0.2 mm or less. Thus, the thickness of the first cover member 40 disposed between the sub mounting substrates 10 becomes 0.05 mm or more and 0.2 mm or less, and the adjacent sub mounting substrates 10 can be joined in close contact with each other, and the influence of thermal stress can be suppressed.

[0090] The first wiring portion 3 is provided on the upper surface of the base portion 2, and is electrically connected to the light emitting element 20 and the protective element 25. The second wiring portion 5 is provided on the lower surface side of the base portion 2, and is electrically connected to an external power source as an external electrode of the light emitting device 100. The internal wiring portion 4 is a wiring portion provided in a through-hole that penetrates the base portion 2, and electrically connects the first wiring portion 3 and the second wiring portion 5. In addition, the light emitting device can not have the protective element 25.

[0091] As the first wiring portion 3, the internal wiring portion 4, and the second wiring portion 5, a metal such as Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, or Pd, or an alloy containing at least one of these metals can be used, for example. The first wiring portion 3, the internal wiring portion 4, and the second wiring portion 5 can be formed by plating, electroless plating, vapor deposition, sputtering, or the like, for example.

[0092] The light emitting element 20 is a semiconductor element that emits light by itself when a voltage is applied. The shape, size, or the like of the light emitting element 20 can be selected arbitrarily. As the light emitting color of the light emitting element 20, a light emitting color of an arbitrary wavelength can be selected according to the use. For example, as a light emitting element 20 of a blue color system (light of a wavelength of 430 to 500 nm) or a green color system (light of a wavelength of 500 to 570 nm), a nitride-based semiconductor (InGaN, AlGaN, or the like) or a phosphor can be used. X Al Y Ga 1-X-YN, 0 ≤ X, 0 ≤ Y, X + Y ≤ 1), GaP, and the like. As the light emitting element 20 of the red color system (light of a wavelength of 610 to 700 nm), GaAlAs, AlInGaP, and the like can be used in addition to the nitride semiconductor element.

[0093] The light emitting element 20 has positive and negative element electrodes 23 on one face, and is flip-chip mounted on the first wiring portion 3 on the sub mounting substrate 10 by a conductive adhesive material. As the conductive adhesive material, for example, eutectic solder, conductive paste, bumps, and the like can be used.

[0094] The protection element 25 is, for example, a Zener diode. The protection element 25 has positive and negative element electrodes 27 on one face, and is flip-chip mounted on the first wiring portion 3 on the sub mounting substrate 10 by a conductive adhesive material.

[0095] The light transmissive member 30 is, for example, a light transmissive member formed of resin, glass, inorganic matter, and the like. The light transmissive member 30 is provided on the light emitting element 20. The light transmissive member 30 preferably has a top surface wider than that of the light emitting element 20.

[0096] In the light emitting device 100, the distance between the light transmissive members 30 adjacent to each other and exposed on the top surface of the light emitting device 100 is preferably 0.2 mm or less. If the distance between the light transmissive members 30 is 0.2 mm or less, for example, in the case where the light emitting device 100 is used for a light distribution variable headlamp (Adaptive Driving Beam: ADB) of a vehicle, the light source can be reduced, and thus the size of the headlamp lens can be reduced. Therefore, a main lens can be omitted in the optical system. In addition, the loss of light through the headlamp lens can be reduced. From the viewpoint of further reducing the light source, the distance between the light transmissive members 30 is more preferably 0.1 mm or less, and further preferably 0.05 mm or less. From the viewpoint of facilitating the manufacture of the light emitting device 100, the distance between the light transmissive members 30 is preferably 0.03 mm or more.

[0097] The planar shape of the light transmissive member 30 can be various shapes such as a circle, an ellipse, a square, a hexagon, and a polygon. Among them, a square, a rectangle, and the like are preferable, and a shape similar to the planar shape of the light emitting element 20 is more preferable.

[0098] The light-transmitting component 30 may also include a wavelength conversion component. For example, a phosphor can be used as a wavelength conversion component. Examples of light-transmitting components 30 containing phosphors include sintered bodies containing phosphors, and light-transmitting components that contain phosphor powder in resin, glass, ceramics, or other inorganic materials. Furthermore, the light-transmitting component 30 may also have a resin layer containing a phosphor or a glass layer containing a phosphor formed on the surface of a molded body such as resin, glass, or ceramics. Additionally, depending on the purpose, the light-transmitting component 30 may contain fillers such as diffusing materials. Furthermore, when fillers such as diffusing materials are included, the light-transmitting component 30 may contain fillers in resin, glass, ceramics, or other inorganic materials, and a resin layer containing fillers or a glass layer containing fillers may be formed on the surface of a molded body such as resin, glass, or ceramics.

[0099] As a phosphor, phosphors known in this field can be used. For example, yttrium-aluminum-garnet phosphors (e.g., Y3(Al,Ga)5O) can be cited as examples of phosphors that emit green light. 12 Ce), lutetium-aluminum-garnet phosphors (e.g., Lu3(Al,Ga)5O) 12 Ce), terbium-aluminum-garnet phosphors (e.g., Tb3(Al,Ga)5O 12 Ce-based phosphors, silicate-based phosphors (e.g., (Ba,Sr)₂SiO₄:Eu), and chlorosilicate-based phosphors (e.g., Ca₈Mg(SiO₄)₄C 12 Eu), β-silicon-aluminum-oxygen-nitrogen phosphors (e.g., Si) 6-z Al z O z N 8-z Examples of phosphors that emit yellow light include Eu (0 < z < 4.2) and SGS-based phosphors (e.g., SrGa₂S₄:Eu). Alpha-silicon-aluminum-oxygen-nitrogen phosphors (e.g., Mz(Si,Al)) are also examples of phosphors that emit yellow light. 12 (O,N) 16 (Where 0 < z ≤ 2, M is Li, Mg, Ca, Y, and lanthanide group elements other than La and Ce). In addition, among the aforementioned phosphors that emit green light, there are also phosphors that emit yellow light.

[0100] Further, for example, yttrium-aluminum-garnet-based fluorescent substances are capable of emitting yellow light by shifting the peak wavelength of luminescence to the long wavelength side by substituting Gd for a part of Y. Further, among them, there are fluorescent substances capable of emitting orange light. As fluorescent substances that emit red light, there are, for example, nitrogen-containing calcium aluminosilicate (CASN or SCASN)-based fluorescent substances (for example, (Sr, Ca)AlSiN3:Eu), BSESN-based fluorescent substances (for example, (Ba, Sr, Ca)2Si5N8:Eu), and the like. In addition to these, there are manganese-activated fluoride-based fluorescent substances (fluorescent substances represented by general formula (I) A2[M 1-a Mn a F6] (wherein, in the above general formula (I), A is at least one selected from the group consisting of K, Li, Na, Rb, Cs, and NH4, M is at least one element selected from the group consisting of Group 4 elements and Group 14 elements, and a satisfies 0 < a < 0.2). As a representative example of this manganese-activated fluoride-based fluorescent substance, there is a manganese-activated potassium fluorosilicate fluorescent substance (for example, K2SiF6:Mn).

[0101] As the diffusion material, a diffusion material known in the field can be used. For example, barium titanate, titanium oxide, aluminum oxide, silicon oxide, or the like can be used.

[0102] In the case where a resin is used as the light-transmissive member 30, and in the case where a resin is used as the adhesive of the fluorescent substance and the diffusion material, as the resin material, for example, a thermosetting resin such as an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, or the like can be used.

[0103] The first cover member 40 is a member provided around the plurality of first element structures 15. The first cover member 40 is preferably made of a resin material. The first cover member 40 is formed, for example, by covering the side surface of the first element structure 15 with a light-reflective resin that is a resin containing a reflective material. That is, the first cover member 40 covers the side surface of the sub mounting substrate 10, the side surface of the light-emitting element 20, and the side surface of the light-transmissive member 30. The first cover member 40 is also provided between the adjacent first element structures 15 to cover the outer peripheral side surface of each of the plurality of first element structures 15. Further, in the case where the light-emitting device 100 is provided with the frame 50, the first cover member 40 is provided between the frame 50 and the first element structures 15 and between the first element structures 15 within the frame 50.

[0104] As the resin material for the first cover member 40, for example, the resin material exemplified as the resin material for the light-transmitting member 30 can be cited. As the light-reflecting material for the first cover member 40, for example, titanium oxide, silica, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, boron nitride, and the like can be cited. Among them, from the viewpoint of light reflection, it is preferable to use titanium oxide having a high refractive index.

[0105] The frame body 50 is a member for surrounding the plurality of first element structures 15 and supporting the first cover member 40. The frame body 50 is formed in, for example, a rectangular shape in plan view, and is disposed around the plurality of first element structures 15.

[0106] The frame body 50 can be formed using a frame-shaped member composed of a metal, an alloy, or a ceramic. As the metal, for example, Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, and the like can be cited. As the alloy, for example, an alloy containing at least one of Fe, Cu, Ni, Al, Ag, Au, Pt, Ti, W, Pd, and the like can be cited.

[0107] In addition, a resin material can also be used as the frame body. In this case, the above-described metal, alloy, or ceramic member can be embedded in the frame body formed of a resin material, or a part of the frame body can be formed of a resin material and the other part can be formed of a metal, an alloy, or a ceramic member.

[0108] The light-emitting device 100 is provided with a plurality of first element structures 15. Here, the first cover member 40 supports a row of 11 first element structures 15. However, the light-emitting device can be provided with 10 or fewer first element structures 15, or 12 or more first element structures 15.

[0109] [Light-emitting module]

[0110] Next, the light-emitting module 200 will be described.

[0111] The light-emitting module 200 is provided with the above-described light-emitting device 100 and a module substrate 80 on which the light-emitting device 100 is placed so as to face the sub mounting substrate 10.

[0112] Further, in the case where the light-emitting device 100 is not provided with the protective element 25, it is preferable to have a structure in which the protective element 25 is provided on the side of the module substrate 80.

[0113] The light-emitting device 100 is as described above.

[0114] The module substrate 80 is a component on which the light emitting device 100 is placed, and electrically connects the light emitting device 100 to the outside. The module substrate 80 is formed in a substantially rectangular shape in plan view, for example. The module substrate 80 includes a substrate portion 6 and a third wiring portion 7.

[0115] As the material of the substrate portion 6, for example, the materials exemplified as the material of the base portion 2 of the sub mounting substrate 10 can be given. As the material of the third wiring portion 7, for example, the materials exemplified as the material of the first wiring portion 3 and the like of the sub mounting substrate 10 can be given.

[0116] The light emitting device 100 is mounted on the upper surface of the module substrate 80 in a manner that the second wiring portion 5 is joined to the third wiring portion 7 via the conductive adhesive material 8. As the conductive adhesive material 8, for example, a eutectic solder, a conductive paste, a tab, or the like can be used.

[0117] Since the frame 50 is joined to the module substrate 80 via the conductive adhesive material 8, the heat generated by the light emitting device 100 is dissipated to the module substrate 80 via the frame 50. Therefore, the heat dissipation of the light emitting module 200 is more excellent. In addition, the frame 50 can be joined to the module substrate 80 via a non-conductive adhesive material, or can be disposed on the module substrate 80 without the adhesive material.

[0118] [Operation of the light emitting module]

[0119] When the light emitting module 200 is driven, current is supplied from the external power source to the light emitting element 20 via the third wiring portion 7, the second wiring portion 5, the internal wiring portion 4, and the first wiring portion 3, and the light emitting element 20 emits light. As for the light emitted from the light emitting element 20, the light entering the upper side is extracted to the outside of the light emitting device 100 via the light-transmissive member 30. In addition, the light entering the lower side is reflected by the sub mounting substrate 10, and is extracted to the outside of the light emitting device 100 via the light-transmissive member 30. In addition, the light entering between the light emitting element 20 and the frame 50 is reflected by the first cover member 40 and the frame 50, and is extracted to the outside of the light emitting device 100 via the light-transmissive member 30. In addition, the light entering between the light emitting elements 20 is reflected by the first cover member 40, and is extracted to the outside of the light emitting device 100 via the light-transmissive member 30. At this time, by making the light-transmissive member 30 narrow (for example, 0.2 mm or less), it is possible to make the structure of the optical system simple and small, for example, in the case where the light emitting module 200 is used as a light source of a headlamp for a vehicle.

[0120] [Manufacturing method of the first embodiment]

[0121] Figure 2 is a flowchart of the manufacturing method of the light emitting device of the first embodiment. Figure 3is a flowchart of a manufacturing method of a light emitting module of the first embodiment. Figure 4A is a cross-sectional view showing a process of placing light emitting elements in the first element structure preparation process of the manufacturing method of the light emitting device of the first embodiment. Figure 4B is a cross-sectional view showing a process of disposing a light-transmissive member in the first element structure preparation process of the manufacturing method of the light emitting device of the first embodiment. Figure 4C is a cross-sectional view showing a process of manufacturing a first element structure in the first element structure preparation process of the manufacturing method of the light emitting device of the first embodiment. Figure 4D is a cross-sectional view showing a process of forming a frame in the manufacturing method of the light emitting device of the first embodiment. Figure 4E is a cross-sectional view showing a process of placing a first element structure in the manufacturing method of the light emitting device of the first embodiment. Figure 4F is a cross-sectional view showing a process of forming a first cover member in the manufacturing method of the light emitting device of the first embodiment. Figure 4G is a cross-sectional view showing a process of removing a sheet member in the manufacturing method of the light emitting device of the first embodiment. Figure 4H is a cross-sectional view showing a process of placing a light emitting device in the manufacturing method of the light emitting module of the first embodiment. Figure 4I is a plan view showing a process of placing a first element structure in the manufacturing method of the light emitting device of the first embodiment. Figure 4J is a plan view showing a process of forming a first cover member in the manufacturing method of the light emitting device of the first embodiment. Figure 4K is a plan view showing a process of placing a light emitting device in the manufacturing method of the light emitting module of the first embodiment.

[0122] [Manufacturing method of light emitting device]

[0123] First, one example of a manufacturing method of the light emitting device 100 will be described.

[0124] The manufacturing method of the light emitting device 100 includes a first element structure preparation process S101 which is a process of preparing a plurality of first element structures 15 sequentially provided with a sub mounting substrate 10, a light emitting element 20, and a light-transmissive member 30, a frame formation process S102 which is a process of forming a frame 50 that surrounds the plurality of first element structures 15 on a sheet member 70, a first element structure placement process S103 which is a process of placing the plurality of first element structures 15 with the sub mounting substrate 10 facing the sheet member 70, a first cover member formation process S104 which is a process of forming a first cover member 40 that covers a side surface of each of the first element structures 15 on the sheet member 70, and a sheet member removal process S105 which is a process of removing the sheet member 70.

[0125] The first element structure preparation process S101 includes a set substrate preparation process S101a which is a process of preparing a set substrate 11 including a plurality of sub mounting regions 12 which become sub mounting substrates 10 after the set substrate 11 is divided, a light emitting element placement process S101b which is a process of placing light emitting elements 20 on the plurality of sub mounting regions 12, a light transmissive member placement process S101c which is a process of placing a light transmissive member 30 on each of the light emitting elements 20, and a first element structure production process S101d which is a process of producing a plurality of first element structures 15 by dividing the set substrate 11 for each of the sub mounting regions 12.

[0126] Furthermore, regarding the material, the arrangement, and the like of each member, since they are as described in the description of the light emitting device 100 described above, the description is appropriately omitted here.

[0127] (First element structure preparation process)

[0128] The first element structure preparation process S101 is a process of preparing a plurality of first element structures 15 which sequentially include a sub mounting substrate 10, a light emitting element 20, and a light transmissive member 30.

[0129] This process S101 includes a set substrate preparation process S101a, a light emitting element placement process S101b, a light transmissive member placement process S101c, and a first element structure production process S101d.

[0130] <Set substrate preparation process>

[0131] The set substrate preparation process S101a is a process of preparing a set substrate 11 including a plurality of sub mounting regions 12 which become sub mounting substrates 10 after the set substrate 11 is divided.

[0132] The set substrate 11 is one substrate including a plurality of sub mounting regions 12 on which light emitting elements 20 are placed. In the present embodiment, for convenience, a set substrate 11 including four sub mounting regions 12 is illustrated, but the number of sub mounting regions 12 can be appropriately adjusted. Figure 4A <Light emitting element placement process>

[0133] The light emitting element placement process S101b is a process of placing light emitting elements 20 on a plurality of sub mounting regions 12.

[0134]

[0135] ​In this process S101b, the plurality of light emitting elements 20 are placed on each of the plurality of sub-mounting regions 12, respectively. The light emitting elements 20 are mounted on the first wiring provided on the mounting region 12 by flip-chip mounting through the conductive adhesive material with the electrode formation surface as the mounting surface.

[0136] Further, at this time, the plurality of protective elements 25 are placed on each of the plurality of sub-mounting regions 12, respectively.

[0137] <Light-transmissive member placement process>

[0138] The light-transmissive member placement process S101c is a process of placing the light-transmissive member 30 on each of the light emitting elements 20.

[0139] In this process S101c, the light-transmissive member 30 of a prescribed shape is bonded, for example, on the upper surface on the side opposite to the electrode formation surface of the light emitting element 20 (in other words, on the side of the main light extraction surface). In the case where the light-transmissive member 30 is bonded to the light emitting element 20, the bonding can be performed by direct bonding, or can be performed via a light-transmissive bonding member.

[0140] <First element structure production process>

[0141] The first element structure production process S101d is a process of producing a plurality of first element structures 15 by dividing the collective substrate 11 for each of the sub-mounting regions 12.

[0142] In this process S101d, the first element structures 15 are singulated by dividing the collective substrate 11 at prescribed positions to thereby produce a plurality of first element structures 15.

[0143] The manufacturing method of the light emitting device 100 is manufactured by combining the plurality of first element structures 15 that are singulated. In other words, since the selection process can be performed after the singulation for each of the first element structures 15, it is possible to select the first element structures 15 having a prescribed range of light emitting characteristics from among the singulated first element structures 15, and to form the light emitting device 100 by a desired combination. Thus, it is possible to obtain the light emitting device 100 of a desired light emitting color with a small color deviation.

[0144] Further, in the manufacturing process, when a defective condition occurs in a part of the first element structure 15, it is possible to discard only the first element structure 15 having the defective condition before the first element structure 15 is placed on the sheet member 70. When a light emitting device in which a plurality of light emitting elements are placed on one sub mounting substrate is the case, when a defective condition occurs in a part of the member, it is necessary to discard the entire light emitting device. Therefore, the manufacturing method of the light emitting device of the present embodiment can reduce the member to be discarded when a defective condition occurs in the process.

[0145] (Box formation process)

[0146] The box formation process S102 is a process of forming the box 50 that surrounds the plurality of first element structures 15 on the sheet member 70.

[0147] The box 50 can be formed, for example, by placing a box-shaped member composed of metal, alloy, or ceramic on the sheet member 70 at a desired position.

[0148] By using metal, alloy, or ceramic for the box 50, generation of warping of the first cover member 40 is suppressed, and it is possible to form the mounting surface of the light emitting device 100 flat. In the case where a resin material is used for the first cover member 40, there is a concern that warping occurs in the light emitting device 100 due to shrinkage of the resin at the time of curing and the like, but by using a material that is not flexible for the box 50, generation of warping can be suppressed. Thus, the mountability of the light emitting device 100 to the module substrate 80 becomes good.

[0149] Further, by forming the box 50 before the first element structure placement process S103, it is possible to place the first element structure 15 on the sheet member 70 with the box 50 as a reference. Thus, it is possible to place the first element structure 15 with high precision on the sheet member 70 that does not have an alignment mark for placing the first element structure 15.

[0150] (First element structure placement process)

[0151] The first element structure placement process S103 is a process of placing the plurality of first element structures 15 so that the sub mounting substrate 10 faces the sheet member 70. In other words, the plurality of first element structures 15 are placed on the sheet member 70 so that the lower surface (in other words, the surface on the side opposite to the surface on which the light emitting element 20 is placed) of the sub mounting substrate 10 contacts the upper surface of the sheet member 70. Here, since the first element structure 15 after singulation is placed on the sheet member 70, it is possible to arrange the first element structure 15 at a distance shorter than the width of the sheet, for example, in the case where a sheet is used at the time of singulation. Thus, it is possible to make the light emitting device 100 in which the light emitting surfaces are narrow.

[0152] In this process S103, a plurality of first element structures 15 are placed on the upper surface of the sheet member 70. The first element structures 15 are placed on the upper surface of the sheet member 70 with the surface on which the second wiring portion 5 is formed as a mounting surface.

[0153] As the sheet member 70, for example, a material known in the field such as a heat-resistant resin sheet can be cited.

[0154] (First Cover Member Forming Process)

[0155] The first cover member forming process S104 is a process of forming the first cover member 40 that covers the side surface of each first element structure 15 on the sheet member 70.

[0156] In this process S104, the first cover member 40 is formed in the frame 50 to cover the side surface of the first element structure 15 with the first cover member 40.

[0157] In this process S104, for example, an uncured resin material that forms the first cover member 40 is disposed between the frame 50 and the first element structure 15 and between the adjacent first element structures 15 by casting, jetting, or the like. Thereafter, the resin material is cured to form the first cover member 40.

[0158] In this process S104, the first cover member 40 is provided in a manner of covering the side surface of the first element structure 15 (in other words, the side surface of the sub mounting substrate 10, the side surface of the light emitting element 20, and the side surface of the light-transmissive member 30) and exposing the upper surface of the light-transmissive member 30. Further, the first cover member 40 can be provided in a manner of removing a part of the first cover member 40 by polishing, grinding, cutting, or the like to expose the upper surface of the light-transmissive member 30 after being provided to cover the upper surface of the light-transmissive member 30.

[0159] (Sheet Member Removing Process)

[0160] The sheet member removing process S105 is a process of removing the sheet member 70.

[0161] In this process S105, the sheet member 70 on which the first element structure 15 or the like is placed is peeled off to be the light emitting device 100.

[0162] [Manufacturing Method of Light Emitting Module]

[0163] Next, one example of a manufacturing method of the light emitting module 200 will be described.

[0164] The manufacturing method of the light emitting module 200 includes a light emitting device preparation step S11 which is a step of preparing the light emitting device 100 using the manufacturing method of the light emitting device 100, and a light emitting device placement step S12 which is a step of placing the light emitting device 100 with the sub mounting substrate 10 facing the module substrate 80.

[0165] Further, regarding the material, arrangement, and the like of each component, since it is as described in the above description of the light emitting module 200, the description is appropriately omitted here.

[0166] (light emitting device preparation step)

[0167] The light emitting device preparation step S11 is a step of preparing the light emitting device 100 using the above-described manufacturing method of the light emitting device.

[0168] In this step S11, the light emitting device 100 is manufactured by performing the above-described steps S101 to S105.

[0169] (light emitting device placement step)

[0170] The light emitting device placement step S12 is a step of placing the light emitting device 100 with the sub mounting substrate 10 facing the module substrate 80.

[0171] In this step S12, the light emitting device 100 is placed on the upper surface of the module substrate 80. The light emitting device 100 is mounted on the upper surface of the module substrate 80 with the sub mounting substrate 10 side as the mounting surface, by the conductive adhesive material 8.

[0172] <second embodiment>

[0173] Figure 5A is a plan view schematically showing the structure of the light emitting module provided with the light emitting device of the second embodiment. Figure 5B is a cross-sectional view of the VB-VB line of Figure 5A . Figure 5C is a cross-sectional view schematically showing the structure of the light emitting device of the second embodiment.

[0174] The light emitting module 200A is provided with the light emitting device 100A and the module substrate 80.

[0175] [light emitting device]

[0176] First, the light emitting device 100A is described.

[0177] The light emitting device 100A includes: a plurality of first element structures 15 each including, in order, a sub mounting substrate 10, a light emitting element 20, and a light transmissive member 30; a second cover member 60 covering side surfaces of the sub mounting substrates 10 to hold the first element structures 15; and a first cover member 40 covering side surfaces of the light emitting elements 20 and side surfaces of the light transmissive members 30 to hold the first element structures 15, and having a higher light reflectance for light from the light emitting elements 20 than the second cover member 60.

[0178] In other words, the light emitting device 100A mainly includes the sub mounting substrates 10, the light emitting elements 20, the protective elements 25, the light transmissive members 30, the second cover member 60, the first cover member 40, and the frame 50.

[0179] Hereinafter, matters different from the light emitting device 100 will be described regarding each structure of the light emitting device 100A.

[0180] The second cover member 60 is a member disposed around the sub mounting substrates 10 of the first element structures 15. The second cover member 60 is formed, for example, by covering side surfaces of the sub mounting substrates 10 with a resin containing a heat dissipation material, i.e., a heat dissipation resin. In addition, the second cover member 60 is disposed to the height of the upper surfaces of the sub mounting substrates 10 between the frame 50 and the sub mounting substrates 10, and among the sub mounting substrates 10, in the frame 50.

[0181] As a resin material for the resin of the second cover member 60, for example, a resin material exemplified as a resin material for the light transmissive member 30 can be cited.

[0182] As the heat dissipation material, for example, silicone, alumina, aluminum nitride, boron nitride, magnesium oxide, or the like for heat dissipation can be cited.

[0183] The second cover member 60 is preferably made of a material having a higher heat dissipation property than the first cover member 40.

[0184] The first cover member 40 is disposed on the upper surface of the second cover member 60. The first cover member 40 covers side surfaces of the light emitting elements 20 and side surfaces of the light transmissive members 30. In addition, the first cover member 40 is disposed between the frame 50 and the light emitting elements 20 and the light transmissive members 30, among the light emitting elements 20, and among the light transmissive members 30, in the frame 50.

[0185] The first cover member 40 is made of a material having a higher light reflectance for light from the light emitting elements 20 than the second cover member 60.

[0186] [Light emitting module]

[0187] Next, the light emitting module 200A will be described.

[0188] The light emitting module 200A is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100A is used.

[0189] Manufacturing method of the second embodiment

[0190] Figure 6 is a flowchart of the manufacturing method of the light emitting device of the second embodiment. Figure 7A is a cross-sectional view showing a step of forming the second cover member in the manufacturing method of the light emitting device of the second embodiment. Figure 7B is a cross-sectional view showing a step of forming the first cover member in the manufacturing method of the light emitting device of the second embodiment. Figure 7C is a cross-sectional view showing a step of removing the sheet member in the manufacturing method of the light emitting device of the second embodiment. Figure 7D is a cross-sectional view showing a step of placing the light emitting device in the manufacturing method of the light emitting module of the second embodiment. Figure 7E is a plan view showing a step of forming the second cover member in the manufacturing method of the light emitting device of the second embodiment. Figure 7F is a plan view showing a step of forming the first cover member in the manufacturing method of the light emitting device of the second embodiment. Figure 7G is a plan view showing a step of placing the light emitting device in the manufacturing method of the light emitting module of the second embodiment.

[0191] [Manufacturing method of the light emitting device]

[0192] First, one example of the manufacturing method of the light emitting device 100A will be described.

[0193] The manufacturing method of the light emitting device 100A includes: a first element structure preparation step S201 which is a step of preparing a plurality of first element structures 15 each of which successively includes a sub mounting substrate 10, a light emitting element 20, and a light transmissive member 30; a frame formation step S202 which is a step of forming a frame 50 that surrounds the plurality of first element structures 15 on a sheet member 70; a first element structure placement step S203 which is a step of placing the plurality of first element structures 15 with the sub mounting substrates 10 facing the sheet member 70; a second cover member formation step S204 which is a step of forming a second cover member 60 that covers sides of the respective sub mounting substrates 10 on the sheet member 70; a first cover member formation step S205 which is a step of forming a first cover member 40 on the second cover member 60, the first cover member 40 covering sides of the respective light emitting elements 20 and sides of the respective light transmissive members 30 and having a higher light reflectance for light from the light emitting elements 20 than the second cover member 60; and a sheet member removal step S206 which is a step of removing the sheet member 70.

[0194] The first element structure preparation step S201 includes: a collective substrate preparation step S201a which is a step of preparing a collective substrate 11 including a plurality of sub mounting regions 12 that become the sub mounting substrates 10 after the collective substrate 11 is divided; a light emitting element placement step S201b which is a step of placing the light emitting elements 20 on the plurality of sub mounting regions 12; a light transmissive member placement step S201c which is a step of placing the light transmissive members 30 on the respective light emitting elements 20; and a first element structure production step S201d which is a step of producing the plurality of first element structures 15 by dividing the collective substrate 11 for each of the sub mounting regions 12.

[0195] Furthermore, regarding the materials, arrangement, and the like of the respective members, since they are as described in the description of the light emitting device 100A described above, the description is appropriately omitted here.

[0196] (First element structure preparation step)

[0197] The first element structure preparation step S201 is the same as the first element structure preparation step S101 described above.

[0198] (Frame formation step)

[0199] The frame formation step S202 is the same as the frame formation step S102 described above.

[0200] (First element structure placement step)

[0201] The first component structure placement step S203 is the same as the first component structure placement step S103 described above.

[0202] (Second Covering Member Formation Step)

[0203] The second covering member formation step S204 is a step of forming the second covering member 60 that covers the side surfaces of the respective sub mounting boards 10 on the sheet member 70.

[0204] In this step S204, the second covering member 60 is formed in the frame 50 to cover the side surfaces of the sub mounting boards 10 by the second covering member 60.

[0205] In this step S204, for example, an uncured resin material containing a heat dissipation material is disposed between the frame 50 and the sub mounting boards 10 and between the side surfaces of the adjacent sub mounting boards 10 by casting, jetting, or the like. Thereafter, the resin material is cured to form the second covering member 60.

[0206] In this step S204, the second covering member 60 is preferably provided to the height of the upper surfaces of the sub mounting boards 10 in a manner of covering the side surfaces of the sub mounting boards 10. Further, the second covering member 60 can also cover the upper surfaces of the sub mounting boards 10, but is preferably separated from the light emitting elements 20.

[0207] (First Covering Member Formation Step)

[0208] The first covering member formation step S205 is a step of forming the first covering member 40 that covers the side surfaces of the respective light emitting elements 20 and the side surfaces of the respective light-transmissive members 30 on the second covering member 60. In this step S205, as the first covering member 40, a member having a higher light reflectance with respect to light from the light emitting elements 20 than the second covering member 60 is used.

[0209] In this step S205, the first covering member 40 is formed in the frame 50 to cover the side surfaces of the light emitting elements 20 and the side surfaces of the light-transmissive members 30 by the first covering member 40.

[0210] In this step S205, for example, an uncured resin material containing a reflection material is disposed between the frame 50 and the light emitting elements 20 and the light-transmissive members 30, between the adjacent light emitting elements 20, and between the adjacent light-transmissive members 30 by casting, jetting, or the like. Thereafter, the resin material is cured to form the first covering member 40.

[0211] In this process S205, the first cover member 40 is provided so as to cover the side surface of the light emitting element 20 and the side surface of the light transmissive member 30 and so as to expose the upper surface of the light transmissive member 30. Further, the first cover member 40 can also be provided so as to expose the upper surface of the light transmissive member 30 by removing a part of the first cover member 40 by polishing, grinding, cutting, or the like after being provided so as to cover the upper surface of the light transmissive member 30.

[0212] (Sheet member removing process)

[0213] The sheet member removing process S206 is the same as the sheet member removing process S105 described above.

[0214] [Manufacturing method of light emitting module]

[0215] Next, one example of a manufacturing method of the light emitting module 200A will be described.

[0216] The manufacturing method of the light emitting module 200A is the same as the manufacturing method of the light emitting module 200 of the first embodiment except that the light emitting device 100A prepared by using the manufacturing method of the light emitting device 100A described above is used.

[0217] [Third embodiment]

[0218] Figure 8A is a plan view schematically showing the structure of the light emitting module provided with the light emitting device of the third embodiment. Figure 8B is a sectional view of the VIIIB-VIIIB line of Figure 8A . Figure 8C is a sectional view schematically showing the structure of the light emitting device of the third embodiment.

[0219] The light emitting module 200B is provided with the light emitting device 100B and the module 80.

[0220] [Light emitting device]

[0221] First, the light emitting device 100B will be described.

[0222] The light emitting device 100B uses the first element structure 15A instead of the first element structure 15. The first element structure 15A is formed so that the width of the sub mounting substrate 10 in the longitudinal direction of the light emitting device 100B is narrower than the width of the light transmissive member 30 when viewed from the top.

[0223] The other matters are the same as the light emitting device 100 of the first embodiment.

[0224] [Light emitting module]

[0225] Next, the light emitting module 200B will be described.

[0226] The light emitting module 200B is the same as the light emitting module 200 of the first embodiment except that the light emitting device 100B is used.

[0227] Manufacturing method of the third embodiment

[0228] Figure 9 is a flowchart of the manufacturing method of the light emitting device of the third embodiment. Figure 10A is a cross-sectional view showing a process of placing a light emitting element in the second element structure preparation process of the manufacturing method of the light emitting device of the third embodiment. Figure 10B is a cross-sectional view showing a process of manufacturing a second element structure in the second element structure preparation process of the manufacturing method of the light emitting device of the third embodiment. Figure 10C is a cross-sectional view showing a process of forming a frame in the manufacturing method of the light emitting device of the third embodiment. Figure 10D is a cross-sectional view showing a process of placing the second element structure in the manufacturing method of the light emitting device of the third embodiment. Figure 10E is a cross-sectional view showing a process of disposing a light-transmitting member in the manufacturing method of the light emitting device of the third embodiment. Figure 10F is a cross-sectional view showing a process of forming a first cover member in the manufacturing method of the light emitting device of the third embodiment. Figure 10G is a cross-sectional view showing a process of removing a sheet member in the manufacturing method of the light emitting device of the third embodiment. Figure 10H is a cross-sectional view showing a process of placing the light emitting device in the manufacturing method of the light emitting module of the third embodiment.

[0229] [Manufacturing method of a light emitting device]

[0230] First, one example of the manufacturing method of the light emitting device 100B will be described.

[0231] The manufacturing method of the light emitting device 100B includes: a second element structure preparation step S301 which is a step of preparing a plurality of second element structures 16 each of which successively includes a sub mounting substrate 10 and a light emitting element 20; a frame formation step S302 which is a step of forming a frame 50 that surrounds the plurality of second element structures 16 on a sheet member 70; a second element structure placement step S303 which is a step of placing the plurality of second element structures 16 with the sub mounting substrates 10 facing the sheet member 70; a light transmissive member placement step S304 which is a step of placing a light transmissive member 30 on each of the light emitting elements 20 after the plurality of second element structures 16 are placed on the sheet member 70; a first cover member formation step S305 which is a step of forming a first cover member 40 on the sheet member 70, the first cover member 40 covering side surfaces of each of the second element structures 16 and side surfaces of each of the light transmissive members 30; and a sheet member removal step S306 which is a step of removing the sheet member 70.

[0232] The second element structure preparation step S301 includes: a collective substrate preparation step S301a which is a step of preparing a collective substrate 11 including a plurality of sub mounting regions 12, the sub mounting regions 12 becoming sub mounting substrates 10 after the collective substrate 11 is divided; a light emitting element placement step S301b which is a step of placing light emitting elements 20 on the plurality of sub mounting regions 12; and a second element structure production step S301c which is a step of producing a plurality of second element structures 16 by dividing the collective substrate 11 for each of the sub mounting regions 12.

[0233] Further, regarding the material, the arrangement, and the like of each member, since they are as described in the above description of the light emitting device 100B, the description is appropriately omitted here.

[0234] (Second Element Structure Preparation Step)

[0235] The second element structure preparation step S301 is a step of preparing a plurality of second element structures 16 each of which successively includes a sub mounting substrate 10 and a light emitting element 20.

[0236] This step S301 includes a collective substrate preparation step S301a, a light emitting element placement step S301b, and a second element structure production step S301c.

[0237] Collective Substrate Preparation Step

[0238] The collective substrate preparation step S301a is the same as the above-described collective substrate preparation step S101a.

[0239] Light Emitting Element Placement Step

[0240] The light emitting element placement process S301b is the same as the light emitting element placement process S101b described above.

[0241] <Second Element Structure Production Process>

[0242] The second element structure production process S301c is a process of producing a plurality of second element structures 16 by dividing the collective substrate 11 for each sub-mount region 12.

[0243] In this process S301c, the second element structures 16 are singulated by dividing the collective substrate 11 at a prescribed position, and are produced as a plurality of second element structures 16.

[0244] (Box Formation Process)

[0245] The box formation process S302 is a process of forming the box 50 around the plurality of second element structures 16 on the sheet member 70.

[0246] This process S302 is the same as the box formation process S102 in the first production method, except that the box 50 is formed around the region where the second element structures 16 are placed.

[0247] (Second Element Structure Placement Process)

[0248] The second element structure placement process S303 is a process of placing the plurality of second element structures 16 so that the sub-mount substrate 10 faces the sheet member 70.

[0249] This process S303 is the same as the first element structure placement process S103 in the first production method, except that the plurality of second element structures 16 are placed on the upper surface of the sheet member 70.

[0250] (Light Transmissive Member Placement Process)

[0251] The light transmissive member placement process S304 is a process of placing the light transmissive member 30 on each light emitting element 20 after the plurality of second element structures 16 are placed on the sheet member 70.

[0252] In this process S304, for example, a light transmissive member 30 of a prescribed shape is bonded on the upper surface (in other words, the main light extraction surface) side of the light emitting element 20. In the case where the light transmissive member 30 is bonded to the light emitting element 20, the bonding can be performed by direct bonding, or can be performed via a light-transmissive bonding member. By bonding the light transmissive member 30 to the light emitting element 20, the first element structure 15A is produced.

[0253] Here, by providing the light-transmissive members 30 each having an upper surface larger than the upper surface area of the light emitting element 20 on each light emitting element 20, the distance between the light-transmissive members 30 can be made closer than the distance between the second element structures 16 (in other words, the distance between the sub mounting substrates 10). Thus, the light emitting device 100B can be made narrower between the light emitting surfaces.

[0254] (First Covering Member Forming Step)

[0255] The first covering member forming step S305 is a step of forming the first covering members 40 on the sheet member 70, the first covering members 40 covering the side surfaces of each second element structure 16 and the side surfaces of each light-transmissive member 30. That is, this step S305 is a step of forming the first covering members 40 covering the side surfaces of each first element structure 15A on the sheet member 70.

[0256] This step S305 is the same as the first covering member forming step S104 in the first manufacturing method.

[0257] (Sheet Member Removing Step)

[0258] The step S306 of removing the sheet member is the same as the sheet member removing step S105 described above.

[0259] In the manufacturing method of the light emitting device 100 of the first embodiment, after the light emitting elements 20 and the light-transmissive members 30 are provided on the collective substrate 11, the collective substrate 11 is divided for each sub mounting region 12. Therefore, in plan view, the width of the sub mounting substrate 10 is the same as or larger than the width of the light-transmissive member 30. In this case, in order to shorten the distance between the light-transmissive members 30 on the sheet member 70, the distance between the sub mounting substrates 10 needs to be shortened. That is, the distance between the light-transmissive members 30 is limited by the width of the sub mounting substrate 10.

[0260] In contrast, in the manufacturing method of the light emitting device 100B of the third embodiment, the light-transmissive members 30 are provided after the second element structures 16 are placed on the upper surface of the sheet member 70. Therefore, in plan view, the width of the sub mounting substrate 10 can be made narrower than the width of the light-transmissive member 30. In this case, on the sheet member 70, the width of the light-transmissive member 30 is adjusted regardless of the distance between the sub mounting substrates 10, whereby the distance between the light-transmissive members 30 can be shortened. Therefore, the distance between the light-transmissive members 30 can be adjusted regardless of the width of the sub mounting substrate 10. In addition, it becomes easy to place the second element structures 16 on the sheet member 70, and the arrangement accuracy of the second element structures 16 is improved.

[0261] [Manufacturing Method of Light Emitting Module]

[0262] Next, one example of a manufacturing method of the light emitting module 200B will be described.

[0263] The manufacturing method of the light emitting module 200B is the same as the manufacturing method of the light emitting module 200 of the first embodiment except that the light emitting device 100B prepared by using the manufacturing method of the light emitting device 100B described above is used.

[0264] <Fourth Embodiment>

[0265] Figure 11A is a plan view schematically showing the structure of the light emitting module of the light emitting device of the fourth embodiment. Figure 11B is a cross-sectional view of the XIB-XIB line of Figure 11A Figure 11C is a cross-sectional view schematically showing the structure of the light emitting device of the fourth embodiment.

[0266] The light emitting module 200C is provided with the light emitting device 100C and the module substrate 80.

[0267] [Light Emitting Device]

[0268] First, the light emitting device 100C will be described.

[0269] The light emitting device 100C uses the first element structure 15A instead of the first element structure 15. The first element structure 15A is formed so that the width of the sub mounting substrate 10 in the longitudinal direction of the light emitting device 100C is narrower than the width of the light-transmitting member 30 when viewed from the top.

[0270] The other matters are the same as those of the light emitting device 100A of the second embodiment.

[0271] [Light Emitting Module]

[0272] Next, the light emitting module 200C will be described.

[0273] The light emitting module 200C is the same as the light emitting module 200A of the second embodiment except that the light emitting device 100C is used.

[0274] [Manufacturing Method of Fourth Embodiment]

[0275] Figure 12 is a flowchart of the manufacturing method of the light emitting device of the fourth embodiment.

[0276] [Manufacturing Method of Light Emitting Device]

[0277] First, one example of a manufacturing method of the light emitting device 100C will be described.

[0278] ​The manufacturing method of the light emitting device 100C includes a second element structure preparation step S401 that is a step of preparing a plurality of second element structures 16 each of which successively includes the sub mounting substrate 10 and the light emitting element 20, a frame formation step S402 that is a step of forming the frame that surrounds the plurality of second element structures 16 on the sheet member 70, a second element structure placement step S403 that is a step of placing the plurality of second element structures 16 with the sub mounting substrate 10 facing the sheet member 70, a light transmissive member placement step S404 that is a step of placing the light transmissive member 30 on each of the light emitting elements 20 after the plurality of second element structures 16 are placed on the sheet member 70, a second cover member formation step S405 that is a step of forming the second cover member 60 that covers the side surface of each of the sub mounting substrates 10 on the sheet member 70, a first cover member formation step S406 that is a step of forming the first cover member 40 on the second cover member 60, the first cover member 40 covering the side surface of each of the light emitting elements 20 and the side surface of each of the light transmissive members 30 and having a higher light reflectance for light from the light emitting element 20 than the second cover member 60, and a sheet member removal step S407 that is a step of removing the sheet member 70.

[0279] The second element structure preparation step S401 includes a collective substrate preparation step S401a that is a step of preparing the collective substrate 11 including a plurality of sub mounting regions 12 that become the sub mounting substrate 10 after the collective substrate 11 is divided, a light emitting element placement step S401b that is a step of placing the light emitting element 20 on the plurality of sub mounting regions 12, and a second element structure production step S401c that is a step of producing the plurality of second element structures 16 by dividing the collective substrate 11 for each of the sub mounting regions 12.

[0280] The manufacturing method of the light emitting device 100C is the same as the manufacturing method of the light emitting device 100A of the second embodiment except that the light transmissive member 30 is placed on the light emitting element 20 after the second element structure 16 is placed on the sheet member 70.

[0281] [Manufacturing method of light emitting module]

[0282] Next, one example of a manufacturing method of the light emitting module 200C will be described.

[0283] The manufacturing method of the light emitting module 200C is the same as the manufacturing method of the light emitting module 200 of the first embodiment except that the light emitting device 100C prepared using the manufacturing method of the light emitting device 100C described above is used.

[0284] The above describes the manufacturing method of the light emitting device and the manufacturing method of the light emitting module, and the light emitting device and the light emitting module according to the embodiments in detail, but the gist of the present application is not limited to these descriptions, and must be interpreted broadly based on the description of the claims. In addition, the content obtained by various modifications, changes, and the like based on these descriptions is also included in the gist of the present application.

[0285]

[0286] Figure 13A FIG. 14B is a cross-sectional view schematically showing the structure of the light emitting module provided with the light emitting device according to the other embodiment. Figure 13B-H FIG. 14C is a plan view schematically showing the structure of the light emitting module provided with the light emitting device according to the other embodiment. Figure 14A FIG. 14D is a plan view schematically showing the structure of the light emitting module provided with the light emitting device according to the other embodiment. Figure 14B FIG. 14E is a cross-sectional view of XIVB-XIVB line of FIG. 14D. Figure 14A FIG. 14F is a plan view schematically showing the structure of the light emitting device according to the embodiment of FIG. 14E. Figure 14C FIG. 14G is a cross-sectional view schematically showing the structure of the light emitting module according to the other embodiment. Figure 14A FIG. 14H is a bottom view schematically showing the structure of the light emitting device according to the embodiment of FIG. 14G. Figure 15A FIG. 14I is a cross-sectional view schematically showing the structure of the light emitting module according to the other embodiment. Figure 15B FIG. 14J is a flowchart of the manufacturing method of the light emitting module according to the embodiment of FIG. 14I. Figure 15A The frame 50A of the light emitting module 200D and the light emitting device 100D uses a resin containing a reflective material.

[0287] As the resin material for the frame 50A, for example, the resin material exemplified as the resin material for the light-transmitting member 30 can be given. As the light reflective material for the frame 50A, for example, the light reflective material exemplified as the light reflective material for the first cover member 40 can be given.

[0288] The frame 50A can be formed at a desired position on the sheet member 70 using, for example, an ejection device (resin ejection device) that can continuously eject a liquid resin by air pressure (see Japanese Patent Application Publication No. 2009-182307).

[0289] The frame 50B of the light emitting module 200E and the light emitting device 100E is substantially rectangular in plan view, and is formed of a plurality of different members. The two sides of the long side of the rectangle are rod-shaped members 51 composed of a material having a higher rigidity than the first cover member 40, and the two sides of the short side of the rectangle are resin members 52 composed of a resin containing a reflective material. As the rod-shaped members 51, specifically, a metal, an alloy, or a ceramic can be given.

[0290] The frame 50B of the light emitting module 200E and the light emitting device 100E is substantially rectangular in plan view, and is formed of a plurality of different members. The two sides of the long side of the rectangle are rod-shaped members 51 composed of a material having a higher rigidity than the first cover member 40, and the two sides of the short side of the rectangle are resin members 52 composed of a resin containing a reflective material. As the rod-shaped members 51, specifically, a metal, an alloy, or a ceramic can be given. ​

[0291] The frame 50B can be formed, for example, by placing the rod-shaped member 51 in the region of the long side of the rectangle and disposing the resin member 52 in the region of the short side of the rectangle. Alternatively, the rod-shaped member 51 can be disposed only in one of the long sides of the rectangle.

[0292] The frame 50C of the light emitting module 200F and the light emitting device 100F is substantially rectangular in plan view, and both sides of the long side of the rectangle contain metal, alloy, or ceramic. The frame 50C has the rod-shaped member 51 made of a material having a rigidity higher than that of the first cover member 40 placed in the long side of the rectangle and has the resin member 52 made of resin containing a reflective material disposed in the long side of the rectangle so as to cover the rod-shaped member 51.

[0293] The frame 50D of the light emitting module 200G and the light emitting device 100G has the rod-shaped member 51 placed only in one of the long sides of the rectangle. Other than this, the frame 50D is the same as that of the light emitting module 200F and the light emitting device 100F.

[0294] The light emitting device can suppress warping of the first cover member 40 when the first cover member 40 is cured by using the rod-shaped member 51 for a part of the frame. The same applies to curing of the second cover member 60.

[0295] The plurality of first element structures 15 of the light emitting module 200H and the light emitting device 100H are arranged in a matrix. Here, the first element structures 15 are arranged in three rows, and there are seven first element structures 15 in the first row, nine in the second row, and eleven in the third row, for a total of twenty-seven first element structures 15.

[0296] The plurality of first element structures 15 of the light emitting module 200I and the light emitting device 100I are arranged in a matrix of two rows and eleven columns. Here, the first element structures 15 at both ends of each row are arranged so as to be farther apart than the other first element structures 15 in the row direction.

[0297] The light emitting module 200J and the light emitting device 100J are obtained by combining the first element structures 15 having different sizes of light emitting surfaces. Here, the first element structures 15 having small light emitting surfaces are arranged in a matrix of 2 rows and 6 columns in the central portion of the light emitting device 100J. In addition, the first element structures 15 having large light emitting surfaces are arranged in three in the row direction on both sides of the assembly of the first element structures 15 having small light emitting surfaces. The light emitting module 200J and the light emitting device 100J can densely arrange many first element structures 15 in the central portion by arranging the first element structures 15 having small light emitting surfaces in the central portion, compared with the case of arranging the first element structures 15 having large light emitting surfaces. The light emitting module 200J and the light emitting device 100J can more highly accurately irradiate the central portion (mainly, the road) by densely arranging the first element structures 15 in the central portion, for example, in the case of using the light emitting module 200J as a light source for a vehicle headlamp.

[0298] The light emitting module 200K and the light emitting device 100K are arranged in 2 rows and in a staggered manner. Here, the first element structures 15 of the first row and the first element structures 15 of the second row are arranged in the row direction in a manner such that the gap in the row direction between the first element structures 15 of the first row and the first element structures 15 of the second row is 0 or less. The light emitting module 200K and the light emitting device 100K can set the gap in the row direction to 0 or less, and thus can more highly accurately irradiate the lateral direction, for example, in the case of using the light emitting module 200K as a light source for a vehicle headlamp.

[0299] Thus, the light emitting module and the light emitting device are not limited in the number of rows and the number of columns, and the number of first element structures 15 in each column and each row can be adjusted as appropriate in accordance with the desired light distribution pattern. In addition, the combination of the first element structures 15 having different sizes of light emitting surfaces, the arrangement of the first element structures 15, and the like of the light emitting module and the light emitting device can be adjusted as appropriate in accordance with the light distribution pattern.

[0300] The light emitting module 200L includes the light emitting device 100L and a module substrate 80.

[0301] The light emitting device 100L includes a plurality of third element structures 17 each including a sub-mount substrate 10, a light emitting element 20, and a light-transmissive member 30, and a first cover member 40 covering side surfaces of the third element structures 17 to hold the third element structures 17. The third element structures 17 each include a protection element 25.

[0302] In other words, the light emitting device 100L mainly includes the sub-mount substrate 10, the light emitting element 20, the protection element 25, the light-transmissive member 30, and the first cover member 40.

[0303] The third element structure 17 includes a red element structure 17a that emits red light, a blue element structure 17b that emits blue light, and a green element structure 17c that emits green light. Here, the third element structure 17 is arranged in 2 rows and 2 columns, with two red element structures 17a arranged diagonally, and a blue element structure 17b and a green element structure 17c arranged diagonally.

[0304] The third element structure 17 is arranged so that each protective element 25 is positioned on the outer side. By doing so, it is possible to arrange the four light-transmissive members 30 in a matrix with a narrower interval.

[0305] As the red element structure 17a, for example, a red element structure having a blue light-emitting element 20 and a light-transmissive member 30 containing a red phosphor can be given. As the blue element structure 17b, for example, a blue element structure having a blue light-emitting element 20 and a light-transmissive member 30 containing a diffusion material can be given. As the green element structure 17c, for example, a green element structure having a green light-emitting element 20 and a light-transmissive member 30 containing a diffusion material can be given. Alternatively, as the green element structure 17c, for example, a green element structure having a blue light-emitting element 20 and a light-transmissive member 30 containing a green phosphor can be given.

[0306] As the light-transmissive member 30 containing a red phosphor, a green phosphor, a light-transmissive member in which a resin layer containing a phosphor, a glass layer containing a phosphor is formed on the surface of a glass plate can be used. In addition, as the light-transmissive member 30 containing a diffusion material, a light-transmissive member in which a resin layer containing a diffusion material, a glass layer containing a diffusion material is formed on the surface of a glass plate can be used.

[0307] As the third element structure 17, in the case where a plurality of element structures having different light-emitting colors are combined, by making the height of each element structure to be the same degree in advance, it is possible to suppress the first cover member 40 from climbing up the upper surface of the light-transmissive member 30. In each element structure, in the case where the amount of phosphor required to obtain a desired light-emitting color is different, the difference in the thickness of the resin layer due to the presence or absence of the phosphor can be adjusted by the thickness of the glass plate that supports the resin layer.

[0308] The light-emitting device 100L described above of the light-emitting module 200L is placed on the module substrate 80.

[0309] As for other matters, the same as the light-emitting device 100 and the light-emitting module 200 of the first embodiment.

[0310] In addition, the light emitting device can include one each of the red element structure 17a, the blue element structure 17b, and the green element structure 17c. Further, the light emitting device can include the red element structure 17a, the blue element structure 17b, and the green element structure 17c arranged alternately in one row, or arranged in a matrix. Further, the light emitting device can include an element structure that emits white light, and an element structure that emits amber light. Further, the light emitting device can use various element structures by adjusting the wavelength of the light emitting element 20 used, the type of phosphor included in the light-transmitting member 30, and the mixing ratio. Further, the element structures can be arranged in a desired combination.

[0311] The light emitting module 200M is manufactured using the module substrate 80 instead of the sheet member 70 as another example of a manufacturing method of a light emitting module. In other words, the light emitting device is formed directly on the module substrate 80. Further, the light emitting device herein can be, for example, a portion of the light emitting module 200M that includes the first element structure 15, the first cover member 40, and the frame 50A.

[0312] For the light emitting module 200M, the frame 50A using resin is directly joined to the module substrate 80. Further, the first cover member 40 of the light emitting module 200M is provided on the module substrate 80 within the frame 50A, and the side surface of the third wiring portion 7 and the side surface of the conductive adhesive material 8 are also covered by the first cover member 40. The other matters are the same as those of the light emitting module 200 of the first embodiment.

[0313] The manufacturing method of the light emitting module 200M includes a first element structure preparation step S501 that is a step of preparing a plurality of first element structures 15 each including the sub mounting substrate 10, the light emitting element 20, and the light-transmitting member 30 in this order, a first element structure placement step S502 that is a step of placing the plurality of first element structures 15 with the sub mounting substrate 10 facing the module substrate 80, a frame formation step S503 that is a step of forming the frame 50A that surrounds the plurality of first element structures 15 on the module substrate 80, and a first cover member formation step S504 that is a step of forming the first cover member 40 that covers the side surface of each of the first element structures 15 within the frame 50A.

[0314] The first element structure preparation step S501 includes a collective substrate preparation step S501a, a light emitting element placement step S501b, a light-transmitting member placement step S501c, and a first element structure production step S501d. The first element structure preparation step S501 is the same as the first element structure preparation step S101 described above.

[0315] In the first element structure placement step S502, the plurality of first element structures 15 are placed on the upper surface of the module substrate 80. The first element structures 15 are placed on the upper surface of the module substrate 80 via the conductive adhesive material 8 with the surface on which the second wiring portion 5 is formed as the mounting surface.

[0316] In the frame formation step S503, the frame 50A is formed on the module substrate 80.

[0317] In the first cover member formation step S504, the first cover member 40 is formed inside the frame 50A, and the side surface of the third wiring portion 7, the side surface of the conductive adhesive material 8, and the side surface of the first element structure 15 are covered by the first cover member 40.

[0318] As for other matters, the manufacturing method of the light emitting module 200 and the light emitting module 200D can be followed.

[0319] Further, the manufacturing method of the light emitting module 200M can also place the first element structure 15 on the module substrate 80 after forming the frame 50A on the module substrate 80.

[0320] In addition, the frame can also use metal, alloy, or ceramic.

[0321] In addition, the light emitting device and the light emitting module described above can have a frame, or can not have a frame. In addition, in the case of having a frame, the frame can also be discontinuously arranged along the outer periphery of the light emitting device. In addition, the height of the frame can also be lower than the height of the first element structure. In addition, the sub mounting substrate, the module substrate can also be substantially square in plan view, and the frame can also be substantially square in plan view. The sub mounting substrate, the module substrate, the frame can also be other shapes.

[0322] In addition, the manufacturing method of the light emitting device and the manufacturing method of the light emitting module can also include other processes between the above processes, or before and after the processes, within a range that does not negatively affect the above processes. For example, a foreign matter removal process for removing foreign matter mixed in the middle of the manufacturing, or the like, can also be included.

[0323] In addition, the first element structure preparation step can place the light transmissive member 30 on each light emitting element 20 after placing the plurality of light emitting elements 20 on the sub mounting substrate 10. However, the light transmissive member 30 can also be placed on the light emitting element 20 before being placed on the sub mounting substrate 10. In addition, the light emitting element 20 and the light transmissive member 30 can also be placed on the sub mounting substrate 10 after the collective substrate 11 is divided. In the second element structure preparation step, the light emitting element 20 can also be placed on the sub mounting substrate 10 after the collective substrate 11 is divided.

[0324] Further, the light emitting device 100 of the first embodiment and the light emitting device 100A of the second embodiment can also be manufactured by disposing the light transmissive member 30 on the light emitting element 20 after the second element structure 16 is placed on the sheet member 70.

[0325] Further, in the manufacturing method of the light emitting device and the manufacturing method of the light emitting module, the order of some of the processes is not limited and can be reversed. For example, the frame forming process of the above-described manufacturing method of the light emitting device can be performed before the first element structure placement process or before the second element structure placement process. However, the frame forming process can also be performed after the first element structure placement process, before the first cover member forming process, or before the second cover member forming process. Further, the frame forming process can also be performed after the second element structure placement process, before the first cover member forming process, or before the second cover member forming process. Further, the frame forming process can also be performed before the first element structure preparation process or before the second element structure preparation process.

[0326] Further, in the case where the second cover member is disposed, the sheet member removal process can also be performed after the second cover member forming process, before the first cover member forming process.

[0327] Industrial applicability

[0328] The light emitting device and the light emitting module of the embodiment of the present disclosure can be used for a light distribution variable headlamp light source. In addition to this, the light emitting device and the light emitting module of the embodiment of the present disclosure can be used for a backlight light source of a liquid crystal display, various lighting fixtures, a large display, advertising, various display devices such as a destination guide, further used for an image reading device in a digital camera, a facsimile, a copier, a scanner, and the like, a projector device, and the like.

[0329] Explanation of reference signs

[0330] 2…base portion; 3…first wiring portion; 4…internal wiring portion; 5…second wiring portion; 6…substrate portion; 7…third wiring portion; 8…conductive adhesive material; 10…sub mounting substrate; 11…assembly substrate; 12…sub mounting region; 15, 15A…first element structure; 16…second element structure; 17…third element structure; 17a…red element structure; 17b…blue element structure; 17c…green element structure; 20…light emitting element; 23…element electrode of light emitting element; 25…protective element; 27…element electrode of protective element; 30…light-transmitting member; 40…first cover member; 50, 50A, 50B, 50C, 50D…frame; 51…rod-shaped member; 52…resin member; 60…second cover member; 70…sheet member; 80…module substrate; 100, 100A, 100B, 100C, 100D, 100E, 100F, 100G, 100H, 100I, 100J, 100K, 100L…light emitting device; 200, 200A, 200B, 200C, 200D, 200E, 200F, 200G, 200H, 200I, 200J, 200K, 200L, 200M…light emitting module.

Claims

1. A method for manufacturing a light-emitting device, wherein, The process includes the following steps: The process of preparing multiple first element structures, wherein the first element structures sequentially include a sub-mounting substrate, a light-emitting element, and a light-transmitting component; The process of mounting a plurality of the first element constructs in such a manner that the sub-mounting substrate and the sheet component face each other; as well as The process of forming a first covering member on the sheet member, which covers the side surfaces of the sub-mounting substrate, the side surfaces of the light-emitting elements, and the side surfaces of the light-transmitting components in each of the first element structures. The process of preparing multiple first element constructs includes the following steps: A process for preparing an assembly substrate comprising multiple sub-mounting areas, wherein the sub-mounting areas become the sub-mounting substrate after the assembly substrate is divided. The process of placing the light-emitting element in the plurality of said sub-mounting areas; The process of setting light-transmitting components on each of the light-emitting elements; and The process of dividing the assembly substrate into each of the sub-mounting regions to fabricate multiple first element structures.

2. The method for manufacturing the light-emitting device according to claim 1, wherein, The process includes the following steps: before forming the first covering member on the sheet member, forming a frame surrounding a plurality of the first element structures on the sheet member, and forming the first covering member within the frame to cover the side of the sub-mounting substrate, the side of the light-emitting element, and the side of the light-transmitting member in the first element structure.

3. The method for manufacturing the light-emitting device according to claim 2, wherein, The frame is rectangular when viewed from above, and one or both long sides of the rectangle are made of metal, alloy or ceramic.

4. The method for manufacturing the light-emitting device according to claim 2, wherein, The frame is made of metal, alloy, or ceramic.

5. A method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein, It also includes the process of removing the sheet component.

6. The method for manufacturing a light-emitting device according to any one of claims 1 to 4, wherein, The first covering component is a light-reflective resin.

7. A method for manufacturing a light-emitting device, wherein, The process includes the following steps: The process of preparing multiple first element structures, wherein the first element structures sequentially include a sub-mounting substrate, a light-emitting element, and a light-transmitting component; The process of mounting a plurality of first element constructs with the sub-mounting substrate and the sheet component facing each other; The process of forming a second cover member on the sheet member, covering the sides of each of the sub-mounting substrates and positioned at a height equal to the upper surface of the sub-mounting substrates; and The process of forming a first covering member on a second covering member, wherein the first covering member covers the side surfaces of each of the light-emitting elements and the side surfaces of each of the light-transmitting members, and has a higher light reflectivity for light from the light-emitting elements compared to the second covering member.

8. The method for manufacturing the light-emitting device according to claim 7, wherein, The second cover component has higher heat dissipation performance compared to the first cover component.

9. The method for manufacturing the light-emitting device according to claim 7 or 8, wherein, The process includes the following steps: before forming the second covering member on the sheet member, forming a frame surrounding a plurality of the first element structures on the sheet member, forming the second covering member and the first covering member within the frame member to cover the side of the sub-mounting substrate by the second covering member, and covering the side of the light-emitting element and the side of the light-transmitting member by the first covering member.

10. The method for manufacturing the light-emitting device according to claim 7 or 8, wherein, It also includes the process of removing the sheet component.

11. The method for manufacturing the light-emitting device according to claim 7 or 8, wherein, The first covering component is a light-reflective resin.

12. A method for manufacturing a light-emitting device, wherein, The process includes the following steps: A process for preparing multiple second element structures, wherein the second element structures sequentially include a sub-mounting substrate and a light-emitting element; The process of mounting a plurality of second element constructs with the sub-mounting substrate and the sheet component facing each other; The process of placing a plurality of the second element constructs onto the sheet component, and then providing light-transmitting components on each of the light-emitting elements; and The process of forming a first covering member on the sheet member, wherein the first covering member covers the side surface of the sub-mounting substrate, the side surface of the light-emitting element, and the side surface of each of the light-transmitting members in each of the second element structures. The process of preparing multiple second element constructs includes the following steps: A process for preparing an assembly substrate comprising multiple sub-mounting areas, wherein the sub-mounting areas become the sub-mounting substrate after the assembly substrate is divided. The process of placing the light-emitting element in the plurality of said sub-mounting areas; as well as The process of dividing the assembly substrate into each of the sub-mounting regions to fabricate a plurality of the second element structures.

13. The method for manufacturing a light-emitting device according to claim 12, wherein, The process includes the following steps: before forming the first covering member on the sheet member, forming a frame surrounding a plurality of second element structures on the sheet member, and forming the first covering member within the frame to cover the side of the sub-mounting substrate, the side of the light-emitting element, and the side of the light-transmitting member in the second element structure.

14. The method for manufacturing a light-emitting device according to claim 13, wherein, The frame is rectangular when viewed from above, and one or both long sides of the rectangle contain metal or ceramic.

15. The method for manufacturing a light-emitting device according to claim 13, wherein, The frame is made of metal or ceramic.

16. The method for manufacturing a light-emitting device according to any one of claims 12 to 15, wherein, It also includes the process of removing the sheet component.

17. A method for manufacturing a light-emitting device according to any one of claims 12 to 15, wherein, The first covering component is a light-reflective resin.

18. A method for manufacturing a light-emitting device, wherein, The process includes the following steps: A process for preparing multiple second element structures, wherein the second element structures sequentially include a sub-mounting substrate and a light-emitting element; The process of mounting a plurality of second element constructs with the sub-mounting substrate and the sheet component facing each other; The process of setting a light-transmitting component on each of the light-emitting elements after placing a plurality of the second element constructs on the sheet component; The process of forming a second cover member on the sheet member, covering the sides of each of the sub-mounting substrates and positioned at a height equal to the upper surface of the sub-mounting substrates; and The process of forming a first covering member on a second covering member, wherein the first covering member covers the side surfaces of each of the light-emitting elements and the side surfaces of each of the light-transmitting members, and has a higher light reflectivity for light from the light-emitting elements compared to the second covering member.

19. The method for manufacturing a light-emitting device according to claim 18, wherein, The second cover component has higher heat dissipation performance compared to the first cover component.

20. The method for manufacturing the light-emitting device according to claim 18 or 19, wherein, The process includes the following steps: before forming the second covering member on the sheet member, forming a frame surrounding a plurality of second element structures on the sheet member, forming the second covering member and the first covering member within the frame member to cover the side of the sub-mounting substrate with the second covering member, and covering the side of the light-emitting element and the side of the light-transmitting member with the first covering member.

21. A method for manufacturing a light-emitting module, wherein, The process includes the following steps: The process of preparing a light-emitting device using the manufacturing method of any one of claims 1 to 20; and The process of mounting the light-emitting device with the sub-mounting substrate and the module substrate facing each other.

22. A method for manufacturing a light-emitting module, wherein, The process includes the following steps: The process of preparing multiple first element structures, wherein the first element structures sequentially include a sub-mounting substrate, a light-emitting element, and a light-transmitting component; The process of mounting a plurality of first element constructs with the sub-mounting substrate and the module substrate facing each other. The process of forming a frame surrounding the plurality of first element constructs on the module substrate; and The process of forming a first covering member within the frame that covers the sides of the sub-mounting substrate, the sides of the light-emitting element, and the sides of the light-transmitting member in each of the first element structures. The process of preparing multiple first element constructs includes the following steps: A process for preparing an assembly substrate comprising multiple sub-mounting areas, wherein the sub-mounting areas become the sub-mounting substrate after the assembly substrate is divided. The process of placing the light-emitting element in the plurality of said sub-mounting areas; The process of setting light-transmitting components on each of the light-emitting elements; and The process of dividing the assembly substrate into each of the sub-mounting regions to fabricate multiple first element structures.

23. A light-emitting device, wherein, have: Multiple first element structures, each sequentially comprising a sub-mounting substrate, a light-emitting element, and a light-transmitting component; A second cover member covers the side of each of the sub-mount substrates and is positioned at a height above the upper surface of the sub-mount substrates to hold the plurality of first element structures. as well as A first covering member covers the sides of each of the light-emitting elements and the sides of each of the light-transmitting members to hold the plurality of first element structures, and has a higher light reflectivity for light from the light-emitting elements compared to the second covering member.

24. The light-emitting device according to claim 23, wherein, The second cover component has higher heat dissipation performance compared to the first cover component.

25. The light-emitting device according to claim 23 or 24, wherein, The frame has a plurality of first element structures surrounding it, and the second cover member and the first cover member are disposed within the frame.

26. The light-emitting device according to claim 23, wherein, The first covering component is a light-reflective resin.

27. A light-emitting module, wherein, have: The light-emitting device according to any one of claims 23 to 26; and A module substrate on which the light-emitting device is mounted is positioned so as to face the sub-mounting substrate.

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