A headlight system based on Micro LED technology and its control method

Abstract

The present invention relates to the control technology of automotive headlights, and particularly to a headlight system based on Micro LED technology and its control method, including a body control module, an ADAS module, a CAN transceiver, a left - MCU micro - control unit - 1, a left - MCU micro - control unit - 2, a left - LED driver chip, a left - Micro LED light source chip - 1, a left - Micro LED light source chip - 2, a right - MCU micro - control unit - 1, a right - MCU micro - control unit - 2, a right - LED driver chip, a right - Micro LED light source chip - 1, and a right - Micro LED light source chip - 2; the body control module and the ADAS module are respectively connected to the left - MCU micro - control unit - 1, the left - MCU micro - control unit - 2, the right - MCU micro - control unit - 1, and the right - MCU micro - control unit - 2 through the CAN transceiver for signal connection. The left - MCU micro - control unit - 1 supplies power to the left - Micro LED light source chip - 1 and the left - Micro LED light source chip - 2 through the left - LED driver chip respectively, which can realize the intelligent and precise control of automotive headlights, prevent dazzling the driver of the vehicle ahead, and improve the safety of night driving.

Description

Technical Field

[0001] The present invention relates to automobile headlamp control technology, and in particular to a headlamp system based on Micro LED technology and a control method thereof. Background Art

[0002] Traffic management statistics indicate that the probability of nighttime traffic accidents is 1.5 times higher than daytime, with 55% of accidents occurring at night. This is primarily due to factors such as poor lighting conditions and poor lighting habits, which alter drivers' visual function and lead to improper driving, thus causing accidents. Therefore, improving nighttime driving safety is crucial. To address this issue, European and Japanese automotive OEMs, Tier 1 suppliers, and lighting technology providers are reportedly entering the emerging ADB Adaptive Driving Beam market.

[0003] However, current mainstream ADB headlights generally have low pixel counts, meaning they can only control lighting in areas within 100 zones and are unable to project patterns or text warning symbols. While the most advanced DLP pixel headlights can project patterns or text warning symbols, their low brightness makes them unsuitable for low or high beam use. Summary of the invention

[0004] To solve the above technical problems, the present invention provides a headlamp system based on Micro LED technology and a control method thereof, which can realize intelligent and precise control of automobile headlights. According to the front road traffic information, that is, the position information of the vehicle in front, sent by the ADAS module, the light at the driver's position in front is turned off while keeping the road lights as much as possible to prevent glare to the driver of the vehicle in front, thereby improving the safety of night driving. In addition to playing an anti-glare role, warning symbols can also be projected under special road conditions to remind the driver of the vehicle to pay attention, thereby improving driving safety.

[0005] To solve the above technical problems, the present invention provides the following technical solutions: A headlamp system based on MicroLED technology, including a body control module, an ADAS module, a CAN transceiver, a left-MCU micro-control unit-1, a left-MCU micro-control unit-2, a left-LED driver chip, a left-MicroLED light source chip-1, a left-MicroLED light source chip-2, a right-MCU micro-control unit-1, a right-MCU micro-control unit-2, a right-LED driver chip, a right-MicroLED light source chip-1, and a right-MicroLED light source chip-2; the body control module and the ADAS module are respectively signal-connected to the left-MCU micro-control unit-1, the left-MCU micro-control unit-2, the right-MCU micro-control unit-1, and the right-MCU micro-control unit-2 through the CAN transceiver, the left-MCU micro-control unit-1 supplies power to the left-MicroLED light source chip-1 and the left-MicroLED light source chip-2 respectively through the left-LED driver chip, the left-MicroLED light source chip-1 is signal-connected to the left-MCU micro-control unit-1 through the SCI interface, the left-MicroLED light source chip-2 is signal-connected to the left-MCU micro-control unit-2 through the SCI interface, the right-MCU micro-control unit-1 supplies power to the right-MicroLED light source chip-1 and the right-MicroLED light source chip-1 respectively through the right-LED driver chip, the right-MCU micro-control unit-1 is signal-connected to the right-MicroLED light source chip-1 through the SCI interface, the right-MCU micro-control unit-2 is signal-connected to the right-MicroLED light source chip-2 and the left-MicroLED light source chip-2 and is arranged in a single-sided lamp, and the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2 are arranged in the single-sided lamp on the other side.

[0006] Preferably, the structures of the left-MicroLED light source chip-1 and the left-MicroLED light source chip-2 are the same as those of the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2, and both are arranged vertically one above the other and are on the same center line, the distance between the left-MicroLED light source chip-1 and the left-MicroLED light source chip-2 is less than 2 millimeters, and the distance between the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2 is less than 2 millimeters.

[0007] Preferably, the vertical light angles of the structures of the left-MicroLED light source chip-1 and the left-MicroLED light source chip-2 and those of the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2 are both -3.5° to 3.5°, and the horizontal broadening angles of the structures of the left-MicroLED light source chip-

[0008] 1 and the left-MicroLED light source chip-2 and those of the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2 are both -5° to 5°.

[0009] Preferably, the structures of the left-MicroLED light source chip-1 and the left-MicroLED light source chip-2 and those of the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2 are all composed of inverted trapezoid three-primary-color thin-film flip-chip Micro-LED chips; each Micro-LED chip is a three-primary-color thin-film flip-chip Micro-LED chip, and each three-primary-color thin-film flip-chip Micro-LED chip includes a thin-film flip-chip red Micro-LED chip and a thin-film flip-chip green / blue Micro-LED chip.

[0010] Preferably, the thin-film flip-chip red Micro-LED chip sequentially includes, from bottom to top: a GaAs substrate, an InGaP etching stop layer, an n-GaAs contact layer, an n-AlGaInP extended layer, an n-AlInP confinement layer, a GaInP / AlGaInP red multi-quantum well layer, a p-AlInP confinement layer, a p-AlGaInP extended layer, a p-GaP layer, a red Micro-LED chip metal mirror layer, a TiW / Pt diffusion barrier layer, and an n- / p-electrode layer; the thin-film flip-chip green / blue Micro-LED chip sequentially includes, from bottom to top: a sapphire substrate, a u-GaN layer, an n-GaN layer, an InGaN / GaN multi-quantum well layer, a p-AlGaN electron blocking layer, a p-GaN layer, a green / blue Micro-LED chip metal mirror layer, a TiW / Pt diffusion barrier layer, and an n- / p-electrode layer.

[0011] Preferably, the total thickness of the metal mirror layer of the red Micro-LED chip and the metal mirror layer of the green / blue Micro-LED chip in the thin-film flip-chip red Micro-LED chip and the thin-film flip-chip green / blue Micro-LED chip is 50 - 10 nm; the total thickness of the TiW / Pt diffusion barrier layer in the thin-film flip-chip red Micro-LED chip and the thin-film flip-chip green / blue Micro-LED chip is 10 - 80 nm, and the TiW / Pt diffusion barrier layer adopts a TiW / Pt / TiW / Pt / TiW / Pt stacked structure, the thickness of each TiW layer is 300 - 200 nm, and the thickness of each Pt layer is 10 - 100 nm; the TiW / Pt diffusion barrier layer completely wraps the boundary of the metal mirror layer and extends 20 - 50 μm beyond the boundary.

[0012] Preferably, the CAN transceiver is the TJA1042 chip of NXP.

[0013] Preferably, the left-MCU microcontroller unit-1, the left-MCU microcontroller unit-2, the right-MCU microcontroller unit-1, and the right-MCU microcontroller unit-2 are all RH850G4MH chips of Renesas.

[0014] To solve the above technical problems, the present invention provides the following technical solution: A control method for a headlight system, including the following steps: Step 1: The body control module collects the body state signal, and the ADAS module collects the road traffic information ahead;

[0015] Step 2: The body control module and the ADAS module communicate the above information with the left-MCU microcontroller unit-1, the left-MCU microcontroller unit-2, the right-MCU microcontroller unit-1, and the right-MCU microcontroller unit-2 respectively through the CAN transceiver;

[0016] Step 3: The left-MCU microcontroller unit-1 controls the left-LED driver chip through the SPI bus to supply power to the left-MicroLED light source chip-1 and the left-MicroLED light source chip-2 respectively, and the right-MCU microcontroller unit-1 also controls the right-LED driver chip through the SPI bus to supply power to the right-MicroLED light source chip-1 and the right-MicroLED light source chip-2 respectively;

[0017] Step 4: The left-MCU microcontroller unit-1, the left-MCU microcontroller unit-2, the right-MCU microcontroller unit-1, and the right-MCU microcontroller unit-2 send external control signals through the SCI interface according to the information collected by the body control module and the ADAS module;

[0018] Step 5: Left-MCU Microcontroller Unit-1 and Left-MCU Microcontroller Unit-2 control Left-MicroLED Light Source Chip-1 and Left-MicroLED Light Source Chip-2 through the SCI interface, and Right-MCU Microcontroller Unit-1 and Right-MCU Microcontroller Unit-2 control Right-MicroLED Light Source Chip-1 and Right-MicroLED Light Source Chip-2 through the SCI interface.

[0019] Advantages of the present invention: Compared with the currently mainstream ADB vehicle lights, the headlight system based on Micro LED technology and its control method of the present invention can not only achieve area lighting control for more than 100 zones, but also project pattern or text warning symbols.

[0020] Compared with the advanced DLP pixel headlamps, the brightness of the headlamp described in the present invention is much higher than that of the DLP headlamps, and it can be used as high beam and low beam. In addition, only the required LED pixel points will be lit, while the others are not activated, which is more energy-saving and environmentally friendly compared with the working mode of the DLP headlamp light source being always on.

[0021] The body control module mainly provides body status signals through the CAN bus, such as vehicle speed signal, low beam headlamp status signal, and ambient light intensity information, etc., to meet the on and off requirements of the intelligent headlamp system under different working conditions. The ADAS module obtains the road traffic information ahead through the CAN bus, that is, the position information of the vehicle ahead, including the relative distance and relative position between the vehicle ahead and the vehicle itself, etc. In the headlamp system described in the present invention, the MCU microcontroller units-1 of the left and right headlamps control 1 LED driver chip through the bus to supply power to two Micro LED light source chips. At the same time, each Micro LED light source chip is controlled by one MCU chip for the on and off control and brightness adjustment of the LED pixels through 4-way SCI interface. Among them, as Figure 2 shown, each SCI bus is responsible for one quadrant, that is, the on and off and brightness adjustment of 256 LED pixels.

[0022] To meet the requirements of the far light center brightness value Emax in the regulations, the chips are kept vertically up and down and on the same center line during mounting, and the distance between the two light source chips is < 2 mm. Through the external lens light distribution adjustment, the light of the two Micro LED light source chips on the upper and lower sides of the single-sided lamp can be evenly distributed within a rectangular range with an upper and lower angle of -3.5° to 3.5° and a left and right spreading angle of -5° to 5°, as shown in Figure 3 shown. Description of the Drawings

[0023] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention.

[0024] Figure 1 is the architecture diagram of the headlight system based on Micro LED technology of the present invention

[0025] Figure 2 : Schematic diagram of the Micro LED light source chip interface of the present invention

[0026] Figure 3 : Schematic diagram of the irradiation range of the Micro LED light source in the headlight of the present invention;

[0027] Figure 4 : Schematic diagram of the structure of the thin-film flip-chip red Micro-LED chip of the present invention;

[0028] Figure 5 : Schematic diagram of the structure of the thin-film flip-chip green / blue Micro-LED chip of the present invention.

[0029] Description of the drawings: 1. Body control module; 2. ADAS module; 3. CAN transceiver; 4. Left-MCU micro-control unit-1; 5. Left-MCU micro-control unit-2; 6. Left-LED driver chip; 7. Left-MicroLED light source chip-1; 8. Left-MicroLED light source chip-2; 9. Right-MCU micro-control unit-1; 10. Right-MCU micro-control unit-2; 11. Right-LED driver chip; 12. Right-MicroLED light source chip-1; 13. Right-MicroLED light source chip-2; 14. GaAs substrate; 15. InGaP etching stop layer; 16. n-GaAs contact layer; 17. n-AlGaInP extended layer; 18. n-AlInP confinement layer; 19. GaInP / AlGaInP red multi-quantum well layer; 20. p-AlInP confinement layer; 21. p-AlGaInP extended layer; 22. p-GaP layer; 23. Metal mirror layer of the red Micro-LED chip; 24. TiW / Pt diffusion barrier layer; 25. n-electrode layer; 26. p-electrode layer; 27. Sapphire substrate; 28. u-GaN layer; 29. n-GaN layer; 30. InGaN / GaN multi-quantum well layer; 31. p-AlGaN electron blocking layer; 32. p-GaN layer; 33. Metal mirror layer of the green / blue Micro-LED chip; 34. TiW / Pt diffusion barrier layer; 35. n-electrode layer; 36. p-electrode layer. Detailed implementation manners

[0030] The following describes the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustration and explanation of the present invention, and are not used to limit the present invention.

[0031] A headlight system based on MicroLED technology, comprising a body control module 1, an ADAS module 2, a CAN transceiver 3, a left-MCU microcontroller unit-1 4, a left-MCU microcontroller unit-2 5, a left-LED driver chip 6, a left-MicroLED light source chip-1 7, a left-MicroLED light source chip-2 8, a right-MCU microcontroller unit-1 9, a right-MCU microcontroller unit-2 10, a right-LED driver chip 11, a right-MicroLED light source chip-1 12, a right-MicroLED light source chip-2 13; the body control module 1 and the ADAS module 2 are respectively connected to the left-MCU microcontroller unit-1 4, the left-MCU microcontroller unit-2 5, the right-MCU microcontroller unit-1 9, and the right-MCU microcontroller unit-2 10 through the CAN transceiver 3 for signal connection. The left-MCU microcontroller unit-1 4 supplies power to the left-MicroLED light source chip-1 7 and the left-MicroLED light source chip-2 8 respectively through the left-LED driver chip 6. The left-MicroLED light source chip-1 7 is connected to the left-MCU microcontroller unit-1 4 for signal connection through the SCI interface. The left-MicroLED light source chip-2 8 is connected to the left-MCU microcontroller unit-2 5 for signal connection through the SCI interface. The right-MCU microcontroller unit-1 9 supplies power to the right-MicroLED light source chip-1 12 and the right-MicroLED light source chip-1 12 respectively through the right-LED driver chip 11. The right-MCU microcontroller unit-1 9 is connected to the right-MicroLED light source chip-1 12 for signal connection through the SCI interface. The right-MCU microcontroller unit-2 10 is connected to the right-MicroLED light source chip-2 13) for signal connection through the SCI interface. The left-MicroLED light source chip-1 7 and the left-MicroLED light source chip-2 8 are arranged in a single-sided lamp, and the right-MicroLED light source chip-1 12 and the right-MicroLED light source chip-2 13 are arranged in the single-sided lamp on the other side; the structures of the left-MicroLED light source chip-1 7 and the left-MicroLED light source chip-2 8 are the same as those of the right-MicroLED light source chip-1 12 and the right-MicroLED light source chip-2 13, both are arranged vertically one above the other and are on the same center line. The distance between the left-MicroLED light source chip-1 7 and the left-MicroLED light source chip-2 8 is less than 2 mm, and the distance between the right-MicroLED light source chip-1 12 and the right-MicroLED light source chip-2 13 is less than 2 mm; the upper and lower light angles of the left-MicroLED light source chip-1 7 and the left-MicroLED light source chip-2 8 and the right-MicroLED light source chip-1 12 and the right-MicroLED light source chip-2 13 are both -3.5° to 3.5°, the left - MicroLED light source chips - 17 and left - MicroLED light source chips - 28 and the right - MicroLED light source chips - 112 and right - MicroLED light source chips - 213 have a left - right broadening angle of - 5° to 5°; the structures of the left - MicroLED light source chips - 17 and left - MicroLED light source chips - 28 and the right - MicroLED light source chips - 112 and right - MicroLED light source chips - 213 are all composed of inverted trapezoidal three - primary - color thin - film flip - chip Micro - LED chips; each Micro - LED chip is a three - primary - color thin - film flip - chip Micro - LED chip, and each three - primary - color thin - film flip - chip Micro - LED chip includes a thin - film flip - chip red - light Micro - LED chip and a thin - film flip - chip green / blue - light Micro - LED chip; the thin - film flip - chip red - light Micro - LED chip includes, from bottom to top: a GaAs substrate 14, an InGaP etch - stop layer 15, an n - GaAs contact layer 16, an n - AlGaInP extended layer 17, an n - AlInP confinement layer 18, a GaInP / AlGaInP red - light multiple - quantum - well layer 19, a p - AlInP confinement layer 20, a p - AlGaInP extended layer 21, a p - GaP layer 22, a red - light Micro - LED chip metal mirror layer 23, a TiW / Pt diffusion - barrier layer 24, an n - / p - electrode layer 25 / 26; the thin - film flip - chip green / blue - light Micro - LED chip includes, from bottom to top: a sapphire substrate 27, a u - GaN layer 28, an n - GaN layer 29, an InGaN / GaN multiple - quantum - well layer 30, a p - AlGaN electron - blocking layer 31, a p - GaN layer 32, a green / blue - light Micro - LED chip metal mirror layer 33, a TiW / Pt diffusion - barrier layer 34, an n - / p - electrode layer 35 / 36; the total thickness of the red - light Micro - LED chip metal mirror layer 23 and the green / blue - light Micro - LED chip metal mirror layer 33 in the thin - film flip - chip red - light Micro - LED chip and the thin - film flip - chip green / blue - light Micro - LED chip is 50 to 10 nm; the total thickness of the TiW / Pt diffusion - barrier layer 34 in the thin - film flip - chip red - light Micro - LED chip and the thin - film flip - chip green / blue - light Micro - LED chip is 10 to 80 nm, and the TiW / Pt diffusion - barrier layer 34 adopts a TiW / Pt / TiW / Pt / TiW / Pt stacked structure, the thickness of each TiW layer is 300 to 200 nm, and the thickness of each Pt layer is 10 to 100 nm; the TiW / Pt diffusion - barrier layer 34 completely wraps the boundary of the metal mirror layer and extends 20 to 50 μm beyond the boundary.

[0032] The CAN transceiver 3 is the TJA1042 chip of NXP; the left-MCU microcontroller unit-14, left-MCU microcontroller unit-25, right-MCU microcontroller unit-19, and right-MCU microcontroller unit-210 are all the RH850G4MH chips of Renesas.

[0033] A control method for a headlamp system includes the following steps: Step 1: The body control module 1 collects body status signals, and the ADAS module 2 collects road traffic information ahead.

[0034] Step 2: The body control module 1 and the ADAS module 2 communicate the above information with the left-MCU microcontroller unit-14, left-MCU microcontroller unit-25, right-MCU microcontroller unit-19, and right-MCU microcontroller unit-210 respectively through the CAN transceiver 3.

[0035] Step 3: The left-MCU microcontroller unit-14 controls the left-LED driver chip 6 through the SPI bus to supply power to the left-MicroLED light source chip-17 and left-MicroLED light source chip-28 respectively, and the right-MCU microcontroller unit-19 also controls the right-LED driver chip 11 through the SPI bus to supply power to the right-MicroLED light source chip-112 and right-MicroLED light source chip-213 respectively.

[0036] Step 4: The left-MCU microcontroller unit-14, left-MCU microcontroller unit-25, right-MCU microcontroller unit-19, and right-MCU microcontroller unit-210 send external control signals through the SCI interface according to the information collected by the body control module 1 and the ADAS module 2.

[0037] Step 5: The left-MCU microcontroller unit-14 and left-MCU microcontroller unit-25 control the left-MicroLED light source chip-17 and left-MicroLED light source chip-28 through the SCI interface, and the right-MCU microcontroller unit-19 and right-MCU microcontroller unit-210 control the right-MicroLED light source chip-112 and right-MicroLED light source chip-213 through the SCI interface.

[0038] The left-Micro LED light source chip-1 and left-Micro LED light source chip-2 are arranged in a single-sided lamp, and the right-Micro LED light source chip-1 and right-Micro LED light source chip-2 are arranged in the single-sided lamp on the other side.

[0039] The sensors used in ADAS modules mainly include cameras, radars, lasers, and ultrasonic waves, etc. They can detect light, heat, pressure, or other variables for monitoring the vehicle's state, and are usually located on the front and rear bumpers, side mirrors, inside the steering column, or on the windshield of the vehicle. Early ADAS technologies mainly focused on passive alarms. When the vehicle detected potential dangers, it would issue an alarm to alert the driver to abnormal vehicle or road conditions;

[0040] Since the chip itself integrates high-performance graphics processing, central processing units, and memory controllers, it can achieve real-time four-channel video information processing in a hardware manner, avoiding the performance bottleneck when general video processing chips perform a large amount of real-time video information processing.

[0041] ADAS applications include visual assistance and recognition assistance. Visual assistance provides drivers with a more three-dimensional and extensive viewing range, reducing the blind spot range; recognition assistance detects approaching targets from the rear or side, alerts the driver to potential dangers when changing lanes, and can also prompt whether it is safe to open the car door after parking.

[0042] With the development of automotive electronics technology, the requirements for safety, comfort, etc. are constantly increasing, and the applications of body electrical appliances in vehicles are becoming more and more numerous. At the same time, it also brings problems such as increased costs, rising failure rates, and complex wiring. Therefore, it is necessary to design a powerful control module to implement these discrete control functions and control numerous electrical appliances, which is the body control module BCM.

[0043] The functions of the body control module include: electric window control, central locking control, remote anti-theft, lighting system control, electric rearview mirror heating control, instrument backlight adjustment, power distribution, etc.

[0044] BCM has the following development trends: more control objects for BCM; more and more functions for each electronic device, and various functions need to be implemented through BCM, making BCM more powerful; more and more information sharing among electronic devices, and one piece of information can be used by many components at the same time, requiring the data communication function of BCM to be faster and stronger; it is difficult for a single centralized BCM to complete more and more huge functions, making the bus-type and networked BCM become the development trend.

[0045] In the present invention, the body control module and the ADAS module are respectively signal-connected to the left-MCU micro-control unit-1, left-MCU micro-control unit-2, right-MCU micro-control unit-1, and right-MCU micro-control unit-2 through CAN transceivers, which can achieve high-speed signal processing functions and comprehensive analysis and processing functions, and the driving determination of the left-LED driver chip and the right-LED driver chip is more accurate and more stable.

[0046] A microcontroller unit (MCU), also known as a single-chip microcomputer or single-chip microcontroller, is a computer-on-a-chip that appropriately reduces the frequency and specifications of a central processing unit (CPU) and integrates peripherals such as memory, timer, USB, A / D conversion, UART, PLC, DMA, and even an LCD driver circuit on a single chip to provide different combined controls for different application scenarios. It can be seen in applications such as mobile phones, PC peripherals, remote controls, automotive electronics, industrial stepper motors, and robotic arm control.

[0047] Left-MCU Microcontroller Unit-1 and Right-MCU Microcontroller Unit-1 respectively control the left-LED driver chip and the right-LED driver chip through the SPI bus. The SCI interface uses four-way signal control. The CAN transceiver is the TJA1042 chip from NXP. The Left-MCU Microcontroller Unit-1, Left-MCU Microcontroller Unit-2, Right-MCU Microcontroller Unit-1, and Right-MCU Microcontroller Unit-2 are all RH850G4MH chips from Renesas. The structures of Left-Micro LED Light Source Chip-1 and Left-Micro LED Light Source Chip-2 are the same as those of Right-Micro LED Light Source Chip-1 and Right-Micro LED Light Source Chip-2. They are vertically stacked and centered on the same line, and the distance between the two power chips is less than 2 mm. The light passing through the upper and lower two Micro LED light source chips in a single-sided lamp is within a rectangular range with an up-down angle of -3.5° to 3.5° and a left-right spread angle of -5° to 5°.

[0048] Micro LED technology, that is, LED miniaturization and matrix technology, refers to a high-density, small-sized LED array integrated on a single chip. For example, each pixel of an LED display can be addressed and individually driven to light up, which can be regarded as a miniaturized version of an outdoor LED display, reducing the pixel pitch from the millimeter level to the micron level.

[0049] For a Micro LED display, an LED display driver circuit is fabricated using normal CMOS integrated circuit manufacturing processes at the bottom layer, and then an LED array is fabricated on the integrated circuit using an MOCVD machine, thus realizing a micro display, which is also known as a miniaturized version of an LED display.

[0050] The advantages of Micro LED are obvious. It inherits the characteristics of inorganic LEDs, such as high efficiency, high brightness, high reliability, and fast response time. It also has the characteristic of self-luminescence without a backlight source, and has advantages such as energy saving, simple structure, small size, and thinness.

[0051] In addition, Micro LED has another major characteristic, which is extremely high resolution. Because it is extremely small, it shows extremely high resolution. Compared with OLED, its color is easier to accurately adjust, has a longer luminous life, higher brightness, and has advantages such as better material stability, long life, and no image burn-in. Therefore, it is another display technology with the advantages of lightness, thinness, and power saving after OLED. Its commonality with OLED is that it also needs to be driven by a TFT backplane, so the TFT technology level is IGZO, LTPS, Oxide.

[0052] A control method for a headlight system includes the following steps: Step 1: The body control module collects body status signals, and the ADAS module collects road traffic information in front;

[0053] Step 2: The body control module and the ADAS module communicate the above information with the left-MCU microcontroller unit-1, left-MCU microcontroller unit-2, right-MCU microcontroller unit-1, and right-MCU microcontroller unit-2 respectively through the CAN bus;

[0054] Step 3: The left-MCU microcontroller unit-1 controls the left-LED driver chip through the SPI bus to supply power to the left-MicorLED light source chip-1 and left-Micor LED light source chip-2 respectively, and the right-MCU microcontroller unit-1 also controls the right-LED driver chip through the SPI bus to supply power to the right-Micor LED light source chip-1 and right-Micor LED light source chip-2 respectively;

[0055] Step 4: The left-MCU microcontroller unit-1, left-MCU microcontroller unit-2, right-MCU microcontroller unit-1, and right-MCU microcontroller unit-2 send external control signals through the SCI interface according to the information collected by the body control module and the ADAS module;

[0056] Step 5: The left-MCU microcontroller unit-1 and left-MCU microcontroller unit-2 control the left-MicorLED light source chip-1 and left-Micor LED light source chip-2 through the SCI interface, and the right-MCU microcontroller unit-1 and right-MCU microcontroller unit-2 control the right-Micor LED light source chip-1 and right-Micor LED light source chip-2 through the SCI interface.

[0057] The described Micro LED light source chip is a product designed and produced by Osram of Germany. It divides the LED light source into 1024 small LED pixels on an area of 4 square millimeters, and each pixel can provide a luminous flux of 3 lm. Each headlamp system of the present invention uses two such Micro LED light source chips. To meet the requirements of the regulations regarding the far - light center brightness value, when mounted, the chips are vertically arranged one above the other and on the same center line, and the distance between the two light source chips is < 2 mm. The two Micro LED light source chips are powered by one LED driver chip, and at the same time, each Micro LED light source chip is controlled for the on - off and brightness adjustment of the LED pixels by one MCU chip through a 4 - way SCI interface. Among them, as Figure 2 shown, each SCI bus is responsible for one quadrant, that is, the on - off and brightness adjustment of 256 LED pixels. Preferably, the MCU chip selects the RH850G4MH chip of Renesas, which can provide 4 - way SCI interfaces, and the main frequency can reach up to 400 MHz at most, which can fully meet the design requirements. The CAN transceiver preferably selects the TJA1042 of NXP, which has a lower cost and excellent reliability.

[0058] The body control module provides body status signals through the CAN bus, such as vehicle speed signal, low - beam headlamp status signal, and ambient light intensity information, etc., to meet the on - off requirements of the intelligent headlamp system under different working conditions. The ADAS module provides road traffic information in front through the CAN bus, that is, the position information of the vehicle in front, including the relative distance and relative position between the vehicle in front and the vehicle itself, etc. In the headlamp system of the present invention, the MCU micro - control unit - 1 of the left and right headlamps controls one LED driver chip through the bus to power the two Micro LED light source chips. At the same time, each Micro LED light source chip is controlled for the on - off and brightness adjustment of the LED pixels by one MCU chip through a 4 - way SCI interface. Among them, as Figure 2 shown, each SCI bus is responsible for one quadrant, that is, the on - off and brightness adjustment of 256 LED pixels.

[0059] To meet the requirements of the regulations regarding the far - light center brightness value Emax, when mounted, the chips are vertically arranged one above the other and on the same center line, and the distance between the two light source chips is < 2 mm. Through external lens light distribution adjustment, the light of the upper and lower two Micro LED light source chips of a single - side lamp can be evenly distributed within a rectangular range with an up - down angle of - 3.5° to 3.5° and a left - right spreading angle of - 5° to 5°, as shown in Figure 3 shown.

[0060] The above are the preferred embodiments of the present invention. Those skilled in the art to which the present invention pertains are also capable of making changes and modifications to the above embodiments. Therefore, the present invention is not limited to the above specific embodiments, and any obvious improvements, substitutions or variations made by those skilled in the art based on the present invention fall within the protection scope of the present invention.

Claims

1. A headlight system based on MicroLED technology, characterized in that: Including a body control module (1), an ADAS module (2), a CAN transceiver (3), a left-MCU microcontroller unit-1 (4), a left-MCU microcontroller unit-2 (5), a left-LED driver chip (6), a left-MicroLED light source chip-1 (7), a left-MicroLED light source chip-2 (8), a right-MCU microcontroller unit-1 (9), a right-MCU microcontroller unit-2 (10), a right-LED driver chip (11), a right-MicroLED light source chip-1 (12), a right- MicroLED light source chip-2 (13); the body control module (1) and the ADAS module (2) are respectively signal-connected to the left-MCU microcontroller unit-1 (4), the left-MCU microcontroller unit-2 (5), the right-MCU microcontroller unit-1 (9) and the right- MCU microcontroller unit-2 (10) through the CAN transceiver (3). The left-MCU microcontroller unit-1 (4) supplies power to the left-MicroLED light source chip-1 (7) and the left-MicroLED light source chip-2 (8) respectively through the left-LED driver chip (6). The left-MicroLED light source chip-1 (7) is signal-connected to the left-MCU microcontroller unit-1 (4) through four-way SCI. The left-MicroLED light source chip-2 (8) is signal-connected to the left-MCU microcontroller unit-2 (5) through four-way SCI. The right-MCU microcontroller unit-1 (9) supplies power to the right-MicroLED light source chip-1 (12) through the right- LED driver chip (11). The right-MCU microcontroller unit-1 (9) is signal-connected to the right-MicroLED light source chip-1 (12) through four-way SCI. The right-MCU microcontroller unit-2 (10) is signal-connected to the right-MicroLED light source chip-2 (13) through four-way SCI. Each SCI bus is responsible for one quadrant, that is, the on / off and brightness adjustment of 256 LED pixels. The left- MicroLED light source chip-1 (7) and the left-MicroLED light source chip-2 (8) are arranged in a single-sided lamp, and the right-MicroLED light source chip-1 (12) and the right-MicroLED light source chip-2 (13) are arranged in a single-sided lamp on the other side.

2. The headlamp system based on MicroLED technology according to claim 1, wherein: The structures of the left-MicroLED light source chip-1 (7) and the left-MicroLED light source chip-2 (8) are the same as those of the right-MicroLED light source chip-1 (12) and the right- MicroLED light source chip-2 (13), and they are all arranged vertically one above the other and are on the same center line. The distance between the left-MicroLED light source chip-1 (7) and the left-MicroLED light source chip-2 (8) is less than 2 mm. The right- distance between the MicroLED light source chip-1 (12) and the right-MicroLED light source chip-2 (13) is less than 2 mm.

3. The headlight system based on MicroLED technology according to claim 1, characterized in that: The structures of the left-MicroLED light source chip-1(7) and left-MicroLED light source chip-2(8) and those of the right-MicroLED light source chip-1(12) and right- The vertical light angles of the MicroLED light source chip-2(13) are both -3.5° to 3.5°, and the horizontal spreading angles of the left-MicroLED light source chip-1(7) and left-MicroLED light source chip-2(8) and those of the right-MicroLED light source chip-1(12) and right-MicroLED light source chip-2(13) are both -5° to 5°.

4. The headlight system based on MicroLED technology according to claim 1, characterized in that: The structures of the left-MicroLED light source chip-1(7) and left-MicroLED light source chip-2(8) and those of the right-MicroLED light source chip-1(12) and right- MicroLED light source chip-2(13) are all composed of inverted trapezoidal thin-film flip-chip Micro- LED chips; each Micro-LED chip is a thin-film flip-chip Micro-LED chip of three primary colors, and each thin-film flip-chip Micro-LED chip of three primary colors includes a thin-film flip-chip red Micro-LED chip and a thin-film flip-chip green / blue Micro-LED chip.

5. The headlamp system based on MicroLED technology according to claim 4, wherein: The thin-film flip-chip red Micro-LED chip successively includes from bottom to top: GaAs substrate(14), InGaP etching stop layer(15), n-GaAs contact layer(16), n-AlGaInP extended layer(17), n-AlInP confinement layer(18), GaInP / AlGaInP red multi-quantum well layer(19), p-AlInP confinement layer(20), p-AlGaInP extended layer(21), p-GaP layer(22), red Micro-LED chip metal mirror layer(23), TiW / Pt diffusion barrier layer(24), n- / p-electrode layer(25) / (26); The thin-film flip-chip green / blue Micro-LED chip successively includes from bottom to top: sapphire substrate(27), u-GaN layer(28), n-GaN layer(29), InGaN / GaN multi-quantum well layer(30), p-AlGaN electron blocking layer(31), p-GaN layer(32), green / blue Micro-LED chip metal mirror layer(33), TiW / Pt diffusion barrier layer(34), n- / p-electrode layer(35) / (36).

6. The headlight system based on MicroLED technology according to claim 4, characterized in that: The total thickness of the red Micro-LED chip metal mirror layer(23) and the green / blue Micro-LED chip metal mirror layer(33) in the thin-film flip-chip red Micro-LED chip and the thin-film flip-chip green / blue Micro-LED chip is 50 to 10nm; The thin-film flip-chip red Micro-LED chip and the thin-film flip-chip green / blue Micro- The total thickness of the TiW / Pt diffusion barrier layer (34) in the LED chip is 10 - 80 nm. The TiW / Pt diffusion barrier layer (34) adopts a TiW / Pt / TiW / Pt / TiW / Pt stacked structure. The thickness of each TiW layer is 300 - 200 nm, and the thickness of each Pt layer is 10 - 100 nm. The TiW / Pt diffusion barrier layer (34) completely wraps the boundary of the metal mirror layer and extends 20 - 50 μm beyond the boundary.

7. The headlamp system based on MicroLED technology according to claim 1, wherein: The CAN transceiver (3) is the TJA1042 chip of NXP Company.

8. The headlight system based on Micro LED technology according to claim 1, characterized in that: The left-MCU microcontroller unit-1 (4), left-MCU microcontroller unit-2 (5), right-MCU microcontroller unit-1 (9), and right-MCU microcontroller unit-2 (10) are all RH850G4MH chips of Renesas.

9. A control method for a headlight system as described in claim 1, characterized in that: It includes the following steps: Step 1: The body control module 1 collects the body status signal, and the ADAS module (2) collects the road traffic information ahead. Step 2: The body control module (1) and the ADAS module (2) communicate the above information with the left-MCU microcontroller unit-1 (4), left-MCU microcontroller unit-2 (5), right-MCU microcontroller unit-1 (9), and right-MCU microcontroller unit-2 (10) respectively through the CAN transceiver (3). Step 3: The left-MCU microcontroller unit-1 (4) controls the left-LED driver chip (6) through the SPI bus to supply power to the left-MicroLED light source chip-1 (7) and left-MicroLED light source chip-2 (8) respectively. The right-MCU microcontroller unit-1 (9) also controls the right-LED driver chip (11) through the SPI bus to supply power to the right-MicroLED light source chip-1 (12) and right-MicroLED light source chip-2 (13) respectively. Step 4: The left-MCU microcontroller unit-1 (4), left-MCU microcontroller unit-2 (5), right-MCU microcontroller unit-1 (9), and right-MCU microcontroller unit-2 (10) send external control signals through the four-channel SCI according to the information collected by the body control module (1) and the ADAS module (2). Step 5: The left-MCU microcontroller unit-1 (4), left-MCU microcontroller unit-2 (5) control the left-MicroLED light source chip-1 (7) and left- MicroLED light source chip-2 (8) through the four-channel SCI. The right-MCU microcontroller unit-1 (9) and right- MCU microcontroller unit-2 (10) control the right-MicroLED light source chip-1 (12) and right-MicroLED light source chip-2 (13) through the four-channel SCI. Each SCI bus is responsible for one quadrant, that is, the on / off and brightness adjustment of 256 LED pixels.

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