Display substrate and display device

Abstract

The present invention provides a display substrate and a display device, belonging to the field of display technology. The display substrate can solve the problems of color mixing caused by reflection of light inside the display substrate, decreased sensitivity of the under-screen sensor, and high emissivity of the COE structure. The display substrate of the present invention includes a substrate substrate, a plurality of light-emitting devices, a pixel defining layer, an encapsulation layer, a reflective layer, and a light-absorbing material layer arranged on the substrate substrate; the pixel defining layer has a plurality of accommodating portions; each of the plurality of light-emitting devices includes a first electrode layer, a light-emitting layer, and a second electrode layer sequentially arranged on the substrate substrate and stacked; the first electrode layer of the light-emitting device is located on the side of the pixel defining layer close to the substrate substrate; the position of an accommodating portion is arranged corresponding to a first electrode layer; the encapsulation layer is located on the side of the second electrode layer of the light-emitting device away from the substrate substrate; the reflective layer is arranged on the side of the encapsulation layer away from the substrate substrate and has a plurality of first openings.

Description

Technical Field

[0001] The present invention belongs to the field of display technology, and in particular relates to a display substrate and a display device. Background Art

[0002] Currently, the display screens of display devices are developing towards full-screen and large-screen, and the requirements for the integration of electronic components inside the display panel are becoming higher and higher. However, existing display devices have the problem of light reflection inside the screen display substrate, which affects the screen display effect and sensor sensitivity. Therefore, improving the internal structure of the display substrate has become the only way for the development of full-screen and large-screen display screens. Summary of the invention

[0003] The present invention aims to improve the existing display substrate, solve the problem of light reflection inside the display substrate in the prior art, and provide a display substrate and a display device.

[0004] In a first aspect, an embodiment of the present disclosure provides a display substrate, comprising: a base substrate, a plurality of light-emitting devices, a pixel defining layer, an encapsulation layer and a reflective layer arranged on the base substrate; the pixel defining layer has a plurality of accommodating portions; each of the plurality of light-emitting devices comprises a first electrode layer, a light-emitting layer and a second electrode layer which are sequentially arranged on the base substrate and are stacked; the first electrode layer of the light-emitting device is located on a side of the pixel defining layer close to the base substrate; the position of one of the accommodating portions is arranged corresponding to one of the first electrode layers, and a light-emitting layer of the light-emitting device is arranged in one of the accommodating portions; the encapsulation layer is located on a side of the second electrode layer of the light-emitting device which is away from the base substrate; the reflective layer is arranged The packaging layer is provided with a plurality of first openings on a side away from the base substrate, and an orthographic projection of one of the first openings on the base substrate is located within an orthographic projection of one of the accommodating portions on the base substrate; the display substrate further comprises a light-absorbing material layer; the light-absorbing material layer is located on a side of the emission layer close to the base substrate, and is spaced a certain distance from the layer where the second electrode layer of the light-emitting device is located; wherein the light-absorbing material layer has a plurality of second openings, and an orthographic projection of one of the second openings on the base substrate is located within an orthographic projection of one of the accommodating portions on the base substrate; and an orthographic projection of one of the first openings on the base substrate is located within an orthographic projection of one of the second openings on the base substrate.

[0005] Among them, the encapsulation layer includes a first inorganic encapsulation layer, an organic encapsulation layer and a second inorganic encapsulation layer arranged in sequence along the side away from the base substrate; the light absorbing material layer is located between the organic encapsulation layer and the first inorganic encapsulation layer or between the organic encapsulation layer and the second inorganic encapsulation layer or between the second inorganic encapsulation layer and the reflective layer.

[0006] Wherein, the light absorbing material layer includes any one of a light absorbing resin layer, a metal material layer or a refractive index matching layer.

[0007] Wherein, the thickness of the light absorbing material layer is 1 μm-2 μm.

[0008] Wherein, the ratio of the width of the first opening to the width of the second opening is not less than 1.

[0009] The difference between the width of the first opening and the width of the second opening is not less than 1 μm and not more than 5 μm.

[0010] Wherein, the reflection layer comprises a mirror reflection layer.

[0011] Wherein, a touch layer is further arranged on the side of the reflective layer away from the base substrate.

[0012] Wherein, the reflective layer includes a touch signal line; and a touch layer is arranged on a side of the layer where the touch signal line is located away from the base substrate.

[0013] Among them, a color filter layer is formed on the side of the touch layer away from the base substrate; the color filter layer includes a plurality of color filters and a black matrix arranged between adjacent color filters; one color filter is arranged corresponding to one light-emitting device; the orthographic projection of the black matrix on the base substrate covers the orthographic projection of the touch line on the base substrate.

[0014] Among them, each black matrix is ​​connected into an integrated structure to form a black matrix layer; the black matrix layer is defined by the black matrix to have multiple third openings, and the orthographic projection of one of the second openings on the base substrate is located within the orthographic projection of one of the third openings on the base substrate.

[0015] Wherein, a distance between an orthographic projection of one of the second openings on the base substrate and an orthographic projection of one of the third openings on the base substrate is not less than 1 μm.

[0016] In a second aspect, an embodiment of the present disclosure provides a display device, which includes any of the above-mentioned display substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic plan view of a display panel according to an embodiment of the present disclosure;

[0018] Figure 2 A schematic diagram of a circuit structure of a flexible display panel according to an embodiment of the present disclosure;

[0019] Figure 3 is a cross-sectional structure at the position of the light emitting device of an embodiment of the present disclosure;

[0020] Figure 4 This is a structural diagram of an OLED mirror display substrate according to an embodiment of the present disclosure;

[0021] Figure 5 This is a structural diagram of another OLED mirror display substrate according to an embodiment of the present disclosure;

[0022] Figure 6 This is a structural diagram of another LED mirror display substrate according to an embodiment of the present disclosure;

[0023] Figure 7 This is a structural diagram of an OLED display substrate according to an embodiment of the present disclosure;

[0024] Figure 8 This is a structural diagram of another OLED display substrate according to an embodiment of the present disclosure;

[0025] Fig. 9 This is a structural diagram of another OLED display substrate according to an embodiment of the present disclosure;

[0026] Fig.10 This is a structural diagram of a display substrate containing a color film according to an embodiment of the present disclosure;

[0027] Fig.11 The structure diagram of another color film display substrate of the embodiment of the present disclosure is shown.

[0028] The figures are marked as follows: 0, light-absorbing material layer; 1, light-emitting device; 101, first electrode; 102, light-emitting layer; 103, second electrode; 2, encapsulation layer; 201, first inorganic encapsulation layer; 202, organic encapsulation layer; 203, second inorganic encapsulation layer; 3, thin film transistor; 301, source; 302, active layer; 303, gate; 304, drain; 401, substrate; 402, buffer layer; 403, flat layer; 404, pixel defining layer; 405, other module layers; 5, gate insulating layer; 501, first gate insulating layer; 502, second gate insulating layer; 6, reflective layer; 601, mirror layer; 602, touch signal line; 7, touch layer; 8, color filter layer; 801, black matrix layer. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0030] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0031] The specific implementations of the display substrate and the display device provided by the disclosed embodiments are described in detail below in conjunction with the accompanying drawings.

[0032] Figure 1 is a schematic plan view of a display panel according to an embodiment of the present disclosure; Figure 1 As shown, the display panel includes a substrate 401, and a plurality of pixel units 0 formed on the substrate 401, and a pixel driving circuit and an OLED device are provided in each pixel unit 0. The pixel driving circuit may include a 7T1C (i.e., seven transistors and one capacitor) structure, for example, including a driving transistor, a data writing transistor, a storage capacitor, a threshold compensation transistor, a first reset transistor, a second reset transistor, a first light emission control transistor, and a second light emission control transistor. Figure 2 is a schematic diagram of a circuit structure of a flexible display panel according to an embodiment of the present disclosure; Figure 2, the source 301 of the data writing transistor T4 is electrically connected to the source 301 of the driving transistor T3, the drain 304 of the data writing transistor T4 is configured to be electrically connected to the data line Vd to receive the data signal, and the gate 303 of the data writing transistor T4 is configured to be electrically connected to the first scanning signal line Ga1 to receive the scanning signal; the first plate CC1 of the storage capacitor Cst is electrically connected to the first power supply voltage terminal VDD, and the second plate CC2 of the storage capacitor Cst is electrically connected to the gate 303 of the driving transistor T3; the source 301 of the threshold compensation transistor T2 is electrically connected to the drain of the driving transistor T3 304, the drain 304 of the threshold compensation transistor T2 is electrically connected to the gate 303 of the driving transistor T3, and the gate 303 of the threshold compensation transistor T2 is configured to be electrically connected to the second scanning signal line Ga2 to receive the compensation control signal; the source 301 of the first reset transistor T1 is configured to be electrically connected to the first reset power supply terminal Vinit1 to receive the first reset signal, the drain 304 of the first reset transistor T1 is electrically connected to the gate 303 of the driving transistor T3, and the gate 303 of the first reset transistor T1 is configured to be electrically connected to the first reset control signal line Rst1 to receive The first sub-reset control signal; the source 301 of the second reset transistor T7 is configured to be electrically connected to the first reset power supply terminal Vinit1 to receive the first reset signal, the drain 304 of the second reset transistor T7 is electrically connected to the first electrode 101 of the light-emitting device 1, and the gate 303 of the second reset transistor T7 is configured to be electrically connected to the second reset control signal line Rst2 to receive the second sub-reset control signal; the source 301 of the first light-emitting control transistor T5 is electrically connected to the first power supply voltage terminal VDD, and the drain 304 of the first light-emitting control transistor T5 is electrically connected to the source 30 1, the gate 303 of the first light emitting control transistor T5 is configured to be electrically connected to the first light emitting control signal line EM1 to receive the first light emitting control signal; the source 301 of the second light emitting control transistor T6 is electrically connected to the drain 304 of the driving transistor T3, the drain 304 of the second light emitting control transistor T6 is electrically connected to the first electrode 101 of the light emitting device 1, and the gate 303 of the second light emitting control transistor T6 is configured to be electrically connected to the second light emitting control signal line EM2 to receive the second light emitting control signal; the second electrode 103 of the light emitting device 1 is electrically connected to the second power supply voltage terminal VSS.

[0033] Figure 3 is a cross-sectional structure of the light emitting device 1 according to an embodiment of the present disclosure; Figure 3 As shown, the driving circuit layer can be formed on the base substrate 401. For example, Figure 3As shown, the driving circuit layer can be formed on the buffer layer 402. The driving circuit layer can include an interlayer dielectric layer 406 located between the display device 1 and the transition region 10c. The interlayer dielectric layer 406 is made of inorganic materials, such as silicon oxide, silicon nitride and other inorganic materials, to achieve the effect of blocking water and oxygen and blocking alkaline ions.

[0034] like Figure 3 As shown, the thin film transistor 3 may be a top gate type, and the thin film transistor 3 may include an active layer 104, a first gate insulating layer 501, a gate 303, a second gate insulating layer 502, an interlayer dielectric layer 403, a source 301, and a drain 304. Specifically, the active layer 302 may be formed on the buffer layer 402, the first gate insulating layer 501 covers the buffer layer 402 and the active layer 302, the gate 303 is formed on a side of the first gate insulating layer 501 away from the active layer 302, the second gate insulating layer 502 covers the gate 303 and the first gate insulating layer 501, the interlayer dielectric layer 406 covers the second gate insulating layer 502, the source 301 and the drain 304 are formed on a side of the interlayer dielectric layer 406 away from the substrate 401 and are respectively located on opposite sides of the gate 303, and the source 301 and the drain 304 may be in contact with opposite sides of the active layer 302 through vias (e.g., metal vias), respectively. It should be understood that the thin film transistor 3 may also be a bottom-gate type.

[0035] like Figure 3 As shown, the capacitor structure may include a first plate 130 and a second plate 131 . The first plate 130 is disposed in the same layer as the gate 303 . The second plate 131 is located between the second gate insulating layer 502 and the interlayer dielectric layer 406 and is disposed opposite to the first plate 130 .

[0036] like Figure 3 As shown, the display device is located in the display area. The display device may include a first electrode 101 and a pixel defining layer 404 sequentially formed on an interlayer dielectric layer 406 . It should be understood that the display device may also include a light-emitting layer 102 and a second electrode 103 .

[0037] In detail, when the thin film transistor 3 is a top-gate type, a flat layer 403 may be formed before the display device is formed. The flat layer 403 may be a single-layer structure or a multi-layer structure. The flat layer 403 is usually formed of organic materials, such as photoresist, acrylic polymer, silicon polymer, etc. Figure 3As shown, the planar layer 403 is formed between the interlayer dielectric layer 103 and the first electrode 101. The first electrode 101 may be electrically connected to the drain 304 through a metal via, and the first electrode 101 may be an anode, which may be made of materials such as ITO (indium tin oxide), indium zinc oxide (IZO), and zinc oxide (ZnO); the pixel defining layer 404 may cover the planar layer 403, and the pixel defining layer 404 may be made of an organic material, such as an organic material such as a photoresist, and the pixel defining layer 404 may have a pixel opening exposing the first electrode 101; the light emitting layer 102 is located in the pixel opening and formed on the first electrode 101, and the light emitting layer 102 may include a small molecule organic material Or polymer molecular organic material, it can be a fluorescent light-emitting material or a phosphorescent light-emitting material, it can emit red light, green light, blue light, or white light, etc.; and, according to different actual needs, in different examples, the light-emitting layer 102 can further include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer; the second electrode 103 covers the light-emitting layer 102, and the polarity of the second electrode 103 is opposite to the polarity of the first electrode 101; this second electrode 103 can be a cathode, and this cathode can be made of metal materials such as lithium (Li), aluminum (Al), magnesium (Mg), and silver (Ag).

[0038] It should be noted that if Figure 3 As shown, the first electrode 101, the light-emitting layer 102 and the second electrode 103 can constitute a light-emitting device 1. The display device includes a plurality of light-emitting devices 1 arranged in an array. In addition, it should be noted that the first electrodes 101 of the light-emitting devices 1 are independent of each other, and the second electrodes 103 of the light-emitting devices 1 are connected on the entire surface; that is, the second electrode 103 is a whole-surface structure arranged on the display substrate, and is a common electrode for multiple display devices.

[0039] In a first aspect, an embodiment of the present disclosure provides a display substrate, which includes: a base substrate 401, a plurality of light-emitting devices 1, a pixel defining layer 404, an encapsulation layer 2 and a reflective layer 6 arranged on the base substrate 401; the pixel defining layer 404 has a plurality of accommodating portions; each of the plurality of light-emitting devices 1 includes a first electrode 101 layer, a light-emitting layer 102 and a second electrode 103 layer which are sequentially arranged on the base substrate 401 and are stacked; the first electrode 101 layer of the light-emitting device 1 is located on a side of the pixel defining layer 404 close to the base substrate 401; the position of one accommodating portion is arranged corresponding to one first electrode 101, and the light-emitting layer 102 of one light-emitting device 1 is arranged in one accommodating portion; the encapsulation layer 2 is located on the second electrode 103 of the light-emitting device 1 away from the base substrate 401 1; the reflective layer 6 is arranged on the side of the encapsulation layer 2 away from the base substrate 401, and has a plurality of first openings, and the orthographic projection of a first opening on the base substrate 401 is located within the orthographic projection of an accommodation portion on the base substrate 401; in particular, the display substrate in the embodiment of the present disclosure also includes a light-absorbing material layer; the light-absorbing material layer 0 is located on the side of the emission layer close to the base substrate 401, and there is a certain distance from the layer where the second electrode 103 of the light-emitting device 1 is located; wherein the light-absorbing material layer 0 has a plurality of second openings, and the orthographic projection of a second opening on the base substrate 401 is located within the orthographic projection of an accommodation portion on the base substrate 401; the orthographic projection of a first opening on the base substrate 401 is located within the orthographic projection of a second opening on the base substrate 401.

[0040] Since a light absorbing material layer 0 is added to the display substrate of the embodiment of the present disclosure, the light reflected by the emission layer can be absorbed by the light absorbing material, thereby avoiding the problem of crosstalk between the lights emitted by adjacent light emitting devices 1 .

[0041] In some examples, the encapsulation layer 2 in the embodiment of the present disclosure includes a first inorganic encapsulation layer 201, an organic encapsulation layer 202, and a second inorganic encapsulation layer 203 stacked in sequence on the side of the second electrode 103 layer away from the base substrate 401. The first inorganic encapsulation layer 201 and the second inorganic encapsulation layer 203 are formed by deposition, and the organic encapsulation layer 202 is formed by inkjet printing.

[0042] In some examples, the encapsulation layer 2 in the embodiment of the present disclosure has the property of reflecting light. When the light emitted by the light-emitting layer 102 irradiates the encapsulation layer 2, the light will be reflected inside the display substrate, causing the screen color mixing problem.

[0043] In some examples, the light absorbing material layer 0 in the embodiment of the present disclosure is disposed at any of the following positions: between the first inorganic encapsulation layer 201 and the organic encapsulation layer 202; between the organic encapsulation layer 202 and the second inorganic encapsulation layer 203; between the second inorganic encapsulation layer 203 and the reflective layer 6. The following content will specifically describe these three situations according to the accompanying drawings, so they will not be explained in detail here.

[0044] In some examples, the display substrate can be applied to a mirror display, wherein the reflective layer 6 is a mirror reflective layer 6, and the mirror reflective layer 6 includes a mirror layer 601 disposed on a side away from the base substrate 401. Specifically, when the reflective layer 6 in the display substrate is a mirror reflective layer 6, a specific example is described below.

[0045] First example: Figure 4 is a structural diagram of an OLED mirror display substrate; Figure 1As shown, the OLED mirror display substrate includes a base substrate 401 and a light absorbing material layer 0, a buffer layer 402 is arranged on the base substrate 401, and a plurality of thin film transistors 3 are arranged on the side of the buffer layer 402 away from the base substrate 401, and the thin film transistor 3 includes an active layer 302, a gate 303, a gate 303 insulating layer 5, a source 301, and a drain 304 arranged in sequence on the side of the buffer layer 402 away from the base substrate 401. The gate 303 insulating layer 5 includes a first gate insulating layer 501 and a first gate insulating layer 502. A flat layer 403 is arranged on the side of the second gate insulating layer 502 away from the base substrate 401, and a pixel defining layer 404 is arranged on the side of the flat layer 403 away from the base substrate 401, and the pixel defining layer 404 has a plurality of accommodating portions. A plurality of light-emitting devices 1 are also arranged on the substrate 401. The plurality of light-emitting devices 1 are arranged on the side of the flat layer 403 away from the substrate 401. Each light-emitting device 1 comprises a first electrode 101, a light-emitting layer 102, and a second electrode 103 stacked in sequence on the side of the pixel defining layer 404 away from the substrate 401; the position of one accommodation portion is arranged corresponding to the first electrode 101 of one light-emitting device 1, and a light-emitting layer 102 of one light-emitting device 1 is arranged in one accommodation portion. An encapsulation layer 2 is arranged on the side of the second electrode 103 away from the substrate 401. The encapsulation layer 2 comprises a first inorganic encapsulation layer 201, an organic encapsulation layer 202, and a second inorganic encapsulation layer 203 stacked in sequence on the side of the second electrode 103 away from the substrate 401. A reflective layer 6 is arranged on the side of the second inorganic encapsulation layer 203 away from the substrate 401. The reflective layer 6 has a plurality of first openings, and the orthographic projection of one of the first openings on the substrate 401 is located within the orthographic projection of one of the accommodation portions on the substrate 401. The reflective layer 6 includes a mirror layer 601 disposed on the side of the second inorganic encapsulation layer 203 away from the base substrate 401. The light absorbing material layer 0 has a plurality of second openings, and the orthographic projection of a second opening on the base substrate 401 is located within the orthographic projection of an accommodation portion on the base substrate 401. The light absorbing material layer 0 is disposed between the first inorganic encapsulation layer 201 and the organic encapsulation layer 202. In some examples, the thickness of the light absorbing material layer 0 is 1 μm-2 μm, and the width of the second opening differs from the width of the first opening by not less than 1 μm and not more than 5 μm. For example, the thickness of the light absorbing material layer 0 is 1 μm, and the width of the second opening differs from the width of the first opening by 1 μm.

[0046] The light-absorbing material layer 0 disposed between the first inorganic encapsulation layer 201 and the organic encapsulation layer 202 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2 and the reflective layer 6, avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. Setting the thickness of the light-absorbing material layer 0 to 1μm-2μm can make the reflective layer 6 flat while having strong light absorption; setting the width difference between the first opening and the second opening to be not less than 1μm and not more than 5μm, the first opening and the second opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0047] Second example: Figure 5 : is a structural diagram of an OLED mirror display substrate; except that the setting position of the light absorbing material layer 0 is different from the setting position of the light absorbing material in the first example, the structure of the OLED mirror display substrate is exactly the same as the OLED mirror display substrate structure provided in the first example. Figure 5 As shown, the light absorbing material layer 0 is disposed between the organic encapsulation layer 202 and the second inorganic encapsulation layer 203. In some examples, the thickness of the light absorbing material layer 0 is 1 μm-2 μm, and the difference between the width of the second opening and the width of the first opening is not less than 1 μm and not greater than 3 μm. For example, the thickness of the light absorbing material layer 0 is 1 μm, and the difference between the width of the second opening and the width of the first opening is 1 μm.

[0048] The light-absorbing material layer 0 disposed between the organic encapsulation layer 2022 and the second inorganic encapsulation layer 2032 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2 and the reflective layer 6, avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. Setting the thickness of the light-absorbing material layer 0 to 1μm-2μm can make the reflective layer 6 flat while having strong light absorption; setting the difference between the width of the first opening and the width of the second opening to be not less than 1μm and not more than 3μm, the first opening and the second opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0049] The third example: Figure 6 : is a structural diagram of an OLED mirror display substrate; except that the setting position of the light absorbing material layer 0 is different from the setting position of the light absorbing material in the first example, the structure of the OLED mirror display substrate is exactly the same as the OLED mirror display substrate structure provided in the first example. Figure 6As shown, the light absorbing material layer 0 is disposed between the second inorganic encapsulation layer 203 and the reflective layer 6. In some examples, the thickness of the light absorbing material layer 0 is 1 μm-2 μm, the width difference between the second opening and the first opening is not less than 1 μm, and the width ratio of the second opening to the first opening is not less than 1. For example, the thickness of the light absorbing material layer 0 is 1 μm, the width difference between the second opening and the first opening is 1 μm, and the width ratio of the second opening to the first opening is 1.1

[0050] The light-absorbing material layer 0 disposed between the second inorganic encapsulation layer 203 and the reflective layer 6 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2 and the reflective layer 6, avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. The thickness of the light-absorbing material layer 0 is set to 1μm-2μm, which can have strong light absorption while keeping the reflective layer 6 flat; the difference between the width of the first opening and the width of the second opening is set to be not less than 1μm, and the width ratio of the second opening to the first opening is not less than 1, and the first opening and the second opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0051] Regardless of any of the above examples, the display substrate of the embodiment of the present disclosure may further include a touch layer, and the touch layer is arranged on the side of the reflective layer 6 away from the base substrate 401, thereby realizing a display substrate with a touch function.

[0052] In some examples, the reflective layer 6 of the embodiment of the present disclosure includes a touch signal line 602, and a touch layer is provided on the side of the layer where the touch signal line 602 is located away from the base substrate 401. The touch signal line 602 has the characteristic of reflecting light. When the light emitted by the light-emitting layer 102 irradiates the touch signal line 602, the light will be reflected inside the display substrate, causing a color mixing problem. In order to solve the problem of light being reflected inside the display substrate when the reflective layer 6 includes the touch signal line 602 but does not include the mirror layer 601, the specific structure of the display substrate in the embodiment of the present disclosure may include the following examples.

[0053] First example: Figure 7 is a structural diagram of a display substrate; Figure 7As shown, the display substrate includes a base substrate 401 and a light absorbing material layer 0, a buffer layer 402 is arranged on the base substrate 401, and a plurality of thin film transistors 3 are arranged on the side of the buffer layer 402 away from the base substrate 401, and the thin film transistor 3 includes an active layer 302, a gate 303, a gate 303 insulating layer 5, a source 301, and a drain 304 arranged in sequence on the side of the buffer layer 402 away from the base substrate 401. The gate 303 insulating layer 5 includes a first gate insulating layer 501 and a second gate insulating layer 502. A flat layer 403 is arranged on the side of the second gate 3 insulating layer 502 away from the base substrate 401, and a pixel defining layer 404 is arranged on the side of the flat layer 403 away from the base substrate 401, and the pixel defining layer 404 has a plurality of accommodating portions. A plurality of light-emitting devices 1 are also arranged on the substrate 401. The plurality of light-emitting devices 1 are arranged on the side of the flat layer 403 away from the substrate 401. Each light-emitting device 1 comprises a first electrode 101, a light-emitting layer 102, and a second electrode 103 stacked in sequence on the side of the pixel defining layer 404 away from the substrate 401; the position of one accommodation portion is arranged corresponding to the first electrode 101 of one light-emitting device 1, and a light-emitting layer 102 of one light-emitting device 1 is arranged in one accommodation portion. An encapsulation layer 2 is arranged on the side of the second electrode 103 away from the substrate 401. The encapsulation layer 2 comprises a first inorganic encapsulation layer 201, an organic encapsulation layer 202, and a second inorganic encapsulation layer 203 stacked in sequence on the side of the second electrode 103 away from the substrate 401. A reflective layer 6 is arranged on the side of the second inorganic encapsulation layer 203 away from the substrate 401, and the reflective layer 6 has a plurality of first openings, and the orthographic projection of one of the first openings on the substrate 401 is located within the orthographic projection of one of the accommodation portions on the substrate 401. The reflective layer 6 comprises a touch signal line 602. A touch layer is provided on the side of the reflective layer 6 facing away from the base substrate 401. The light absorbing material layer 0 has a plurality of second openings, and the orthographic projection of a second opening on the base substrate 401 is located within the orthographic projection of an accommodation portion on the base substrate 401. In some examples, the light absorbing material layer 0 is provided between the first inorganic encapsulation layer 201 and the organic encapsulation layer 202, the distance between adjacent second openings is not less than 2 μm, and the width of the second opening should differ from the width of the accommodation portion by not less than 2*(the thickness of the pixel defining layer 404 + the thickness of the first inorganic encapsulation layer 201)*tan40°μm. For example, when the thickness of the pixel defining layer 404 is 1 um and the thickness of the first inorganic encapsulation layer 201 is 1 um, the distance between adjacent second openings is 2 μm, and the width of the second opening differs from the width of the accommodation portion by 3.36 μm.

[0054] The light-absorbing material layer 0 disposed between the first inorganic encapsulation layer 201 and the organic encapsulation layer 202 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2 and the reflective layer 6, avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. The distance between adjacent second openings is set to be no less than 2μm, and the width of the second opening should be set to be no less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201)*tan40°μm, so that the width of the light-absorbing material layer 0 can be sufficient to cover the area where the reflected light passes, and the first opening and the second opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0055] Second example: Figure 8 is a structural diagram of a display substrate; except that the setting position of the light absorbing material layer 0 is different from the setting position of the light absorbing material in the first example, the display substrate structure is completely the same as the display substrate structure provided in the first example. Figure 8 As shown, in some examples, the light absorbing material layer 0 is disposed between the organic encapsulation layer 202 and the second inorganic encapsulation layer 203, the distance between two adjacent second openings is not less than 2 μm, and the width of the second opening should differ from the width of the accommodation portion by not less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201+the thickness of the organic encapsulation layer 202)*tan40°μm. For example, when the thickness of the pixel defining layer 404 is 1 μm, the thickness of the first inorganic encapsulation layer 201 is 1 μm, and the thickness of the organic encapsulation layer is 8 μm, the distance between adjacent second openings is 2 μm, and the width of the second opening differs from the width of the accommodation portion by 8.4 μm.

[0056] The light-absorbing material layer 0 disposed between the organic encapsulation layer 202 and the second inorganic encapsulation layer 203 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2 and the reflective layer 6, avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. The distance between adjacent second openings is set to be no less than 2μm, and the width of the second opening should be set to be no less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201+the thickness of the organic encapsulation layer 202)*tan40°μm, so that the width of the light-absorbing material layer 0 can be sufficient to cover the area where the reflected light passes, and the first opening and the second opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0057] The third example: Fig. 9is a structural diagram of a display substrate; except that the setting position of the light absorbing material layer 0 is different from the setting position of the light absorbing material in the first example, the display substrate structure is completely the same as the display substrate structure provided in the first example. Fig. 9 As shown, in some examples, the light absorbing material layer 0 is disposed between the second inorganic encapsulation layer 203 and the reflective layer 6, the distance between two adjacent second openings is not less than 2 μm, and the width of the second opening should differ from the width of the accommodation portion by not less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201+the thickness of the organic encapsulation layer 202+the thickness of the second inorganic encapsulation layer 203)*tan40°μm. For example, when the thickness of the pixel defining layer 404 is 1 um, the thickness of the first inorganic encapsulation layer 201 is 1 um, the thickness of the organic encapsulation layer is 8 um, and the thickness of the second inorganic encapsulation layer 203 is 1 um, the distance between adjacent second openings is 2 μm, and the width of the second opening differs from the width of the accommodation portion by 9.23 μm.

[0058] The light-absorbing material layer 0 disposed between the second inorganic encapsulation layer 203 and the reflective layer 6 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2 and the reflective layer 6, avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. The distance between adjacent second openings is set to be no less than 2μm, and the width of the second opening should be set to be no less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201+the thickness of the organic encapsulation layer 202+the second inorganic encapsulation layer 203)*tan40°μm, so that the width of the light-absorbing material layer 0 can be sufficient to cover the area through which the reflected light passes, and the first opening and the second opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0059] In some examples, the display substrate in the embodiment of the present disclosure further includes a color filter layer 8 disposed on the side of the touch layer away from the base substrate 401; the color filter layer 8 includes a plurality of color filters and a black matrix disposed between adjacent color filters; one color filter is disposed corresponding to one light-emitting device 1; the orthographic projection of the black matrix on the base substrate 401 covers the orthographic projection of the touch signal line 602 on the base substrate 401. The black matrices are connected into an integrated structure to form a black matrix layer 801; the black matrix layer 801 is defined by the black matrix to have a plurality of third openings, and the orthographic projection of a second opening on the base substrate 401 is located within the orthographic projection of a third opening on the base substrate 401.

[0060] It should be noted that the edge of the third opening has the property of reflecting light. When the light emitted by the light emitting layer 102 irradiates the third opening, the light will be reflected inside the touch substrate, causing a color mixing problem.

[0061] When the touch substrate includes the color filter layer 8 , the specific structure of the display substrate in the embodiment of the present disclosure may include the following examples.

[0062] First example: Fig.10 is a structural diagram of a display substrate containing a color film, such as Fig.10As shown, the display substrate includes a base substrate 401 and a light absorbing material layer 0, a buffer layer 402 is arranged on the base substrate 401, and a plurality of thin film transistors 3 are arranged on the side of the buffer layer 402 away from the base substrate 401, and the thin film transistor 3 includes an active layer 302, a gate 303, a gate 303 insulating layer 5, a source 301, and a drain 304 arranged in sequence on the side of the buffer layer 402 away from the base substrate 401. The gate 303 insulating layer 5 includes a first gate insulating layer 501 and a first gate insulating layer 502. A flat layer 403 is arranged on the side of the second gate insulating layer 502 away from the base substrate 401, and a pixel defining layer 404 is arranged on the side of the flat layer 403 away from the base substrate 401, and the pixel defining layer 404 has a plurality of accommodating portions. A plurality of light-emitting devices 1 are also arranged on the substrate 401. The plurality of light-emitting devices 1 are arranged on the side of the flat layer 403 away from the substrate 401. Each light-emitting device 1 comprises a first electrode 101, a light-emitting layer 102, and a second electrode 103 stacked in sequence on the side of the pixel defining layer 404 away from the substrate 401; the position of one accommodation portion is arranged corresponding to the first electrode 101 of one light-emitting device 1, and a light-emitting layer 102 of one light-emitting device 1 is arranged in one accommodation portion. An encapsulation layer 2 is arranged on the side of the second electrode 103 away from the substrate 401. The encapsulation layer 2 comprises a first inorganic encapsulation layer 201, an organic encapsulation layer 202, and a second inorganic encapsulation layer 203 stacked in sequence on the side of the second electrode 103 away from the substrate 401. A reflective layer 6 is arranged on the side of the second inorganic encapsulation layer 203 away from the substrate 401, and the reflective layer 6 has a plurality of first openings, and the orthographic projection of one of the first openings on the substrate 401 is located within the orthographic projection of one of the accommodation portions on the substrate 401. The reflective layer 6 comprises a touch signal line 602. A touch layer is provided on the side of the reflective layer 6 facing away from the substrate 401, and a color filter layer 8 is provided on the side of the touch layer facing away from the substrate 401. The light-absorbing material layer 0 has a plurality of second openings, and the orthographic projection of a second opening on the substrate 401 is located within the orthographic projection of an accommodation portion on the substrate 401. In some examples, the light-absorbing material layer 0 is provided between the first inorganic encapsulation layer 201 and the organic encapsulation layer 202, and the width of the second opening should differ from the width of the accommodation portion by no less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201)*tan40°μm. The width of the third opening should differ from the width of the second opening by no less than 1μm. For example, when the thickness of the pixel defining layer 404 is 1um and the thickness of the first inorganic encapsulation layer 201 is 1um, the width of the second opening should differ from the width of the accommodation portion by 3.35μm, and the width of the third opening should differ from the width of the second opening by 1μm.

[0063] The light-absorbing material layer 0 disposed between the first inorganic encapsulation layer 201 and the reflective layer 6 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated on the encapsulation layer 2, the reflective layer 6 and the edge of the third opening, thereby avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. The width of the second opening should be set to a difference of not less than 2*(the thickness of the pixel defining layer 404 + the thickness of the first inorganic encapsulation layer 201)*tan40°μm with the width of the accommodating portion. The width of the third opening should be set to a difference of not less than 1μm with the width of the second opening, so that the width of the light-absorbing material layer 0 can be sufficient to cover the area through which the reflected light passes, and the first opening, the second opening and the third opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0064] Second example: Fig.11 FIG. 1 is a structural diagram of a display substrate including a color film, except that the location of the light absorbing material layer 0 is different from that of the light absorbing material in the first example. Fig.11 As shown, in some examples, the light absorbing material layer 0 is disposed between the organic encapsulation layer 202 and the second inorganic encapsulation layer 203, and the width of the second opening should differ from the width of the accommodating portion by no less than 2*(the thickness of the pixel defining layer 404+the thickness of the first inorganic encapsulation layer 201+the thickness of the organic encapsulation layer 202)*tan40°μm. The width of the third opening should differ from the width of the second opening by no less than 1μm. For example, when the thickness of the pixel defining layer 404 is 1um, the thickness of the first inorganic encapsulation layer 201 is 1um, and the thickness of the organic encapsulation layer is 8um, the width of the second opening should differ from the width of the accommodating portion by 8.4μm, and the width of the third opening differs from the width of the second opening by 1μm.

[0065] The light-absorbing material layer 0 disposed between the first inorganic encapsulation layer 201 and the reflective layer 6 can absorb the reflected light generated after the light emitted by the light-emitting layer 102 is irradiated to the encapsulation layer 2, the reflective layer 6 and the edge of the third opening, thereby avoiding the phenomenon of crosstalk between the light emitted by the adjacent light-emitting devices 1, thereby eliminating the color mixing problem, improving the display contrast, and increasing the display color purity. The width of the second opening should be set to a difference of not less than 2*(the thickness of the pixel defining layer 404 + the thickness of the first inorganic encapsulation layer 201 + the thickness of the organic encapsulation)*tan40°μm with the width of the accommodating portion. The width of the third opening should be set to a difference of not less than 1μm with the width of the second opening, so that the width of the light-absorbing material layer 0 can be sufficient to cover the area through which the reflected light passes, and the first opening, the second opening and the third opening will not affect the normal passage of the light emitted by the light-emitting layer 102.

[0066] In some examples, the planarization layer 403 in the embodiment of the present disclosure is used to planarize the thin film transistor 3 , and a plurality of via holes are disposed on the planarization layer 403 .

[0067] In some examples, the plurality of light emitting devices 1 in the embodiments of the present disclosure include a first electrode 101, a light emitting layer 102, and a second electrode 103. The first electrode 101 is connected to the source 301 of the thin film transistor 3 through a via hole in the planar layer 403.

[0068] In some examples, the source 301 and the cathode in the embodiments of the present disclosure both have a three-layer metal layer structure, such as a three-layer metal layer structure of titanium / aluminum / titanium, molybdenum / aluminum / molybdenum, titanium / copper / titanium, or molybdenum / copper / molybdenum.

[0069] In some examples, the source 301 and the drain 304 in the embodiments of the present disclosure are formed of at least one material selected from molybdenum, molybdenum-niobium alloy, aluminum, aluminum-neodymium alloy, titanium and copper, wherein molybdenum, molybdenum-niobium alloy, aluminum-neodymium alloy or titanium has only weak oxidizability, aluminum is less likely to be oxidized, and copper is most likely to be oxidized. From the perspective of resistivity, it is further preferred that the gate 3033, the source 301 and the drain 304 are all formed of copper.

[0070] In some examples, the first inorganic encapsulation layer 201 and the second inorganic encapsulation layer 203 in the embodiment of the present disclosure can be formed of inorganic materials such as silicon nitride, silicon oxide, silicon oxynitride, etc., and the organic encapsulation layer 202 can be formed of organic materials such as polyimide (PI) and epoxy resin. Thus, the first inorganic encapsulation layer 201, the organic encapsulation layer 202 and the second inorganic encapsulation layer 203 form a composite encapsulation layer 2, which can form multiple protections for the functional structures of the multiple light-emitting devices 1 on the substrate 401, and has a better encapsulation effect.

[0071] In some examples, a sensor is further provided on a side of the first electrode 101 of the light emitting device 1 in the embodiment of the present disclosure close to the base substrate 401 .

[0072] In some examples, the sensor in the embodiment of the present disclosure is applied to the fields of fingerprint recognition, under-screen camera, infrared probe, etc. In some examples, the display substrate in the embodiment of the present disclosure further includes other module layers 405 arranged on the side of the touch layer away from the display substrate, and the other module layers 405 include but are not limited to a cover plate and a conductive optical adhesive coating.

[0073] In a second aspect, the embodiments of the present disclosure provide a display device, including the display substrate provided by the embodiments of the present disclosure. The display device can be any product or component with a display function, such as a liquid crystal panel, electronic paper, an OLED panel, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0074] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A display substrate, comprising: A base substrate, a plurality of light-emitting devices, a pixel defining layer, an encapsulation layer and a reflective layer arranged on the base substrate; The pixel defining layer has a plurality of accommodation portions; Each of the plurality of light-emitting devices comprises a first electrode layer, a light-emitting layer, and a second electrode layer which are sequentially arranged on the base substrate and stacked; the first electrode layer of the light-emitting device is located on a side of the pixel defining layer close to the base substrate; the position of one of the accommodating portions is arranged corresponding to one of the first electrode layers, and a light-emitting layer of the light-emitting device is arranged in one of the accommodating portions; the encapsulation layer is located on a side of the second electrode layer of the light-emitting device away from the base substrate; the reflective layer is arranged on a side of the encapsulation layer away from the base substrate, and has a plurality of first openings, and an orthographic projection of one of the first openings on the base substrate is located within an orthographic projection of one of the accommodating portions on the base substrate; characterized in that The display substrate further comprises a light absorbing material layer; the light absorbing material layer is located on a side of the reflective layer close to the base substrate, and is spaced a certain distance from a layer where a second electrode layer of the light emitting device is located; wherein the light absorbing material layer has a plurality of second openings, an orthographic projection of one of the second openings on the base substrate is located within an orthographic projection of one of the accommodating portions on the base substrate; an orthographic projection of one of the first openings on the base substrate is located within an orthographic projection of one of the second openings on the base substrate; The ratio of the width of the first opening to the width of the second opening is not greater than 1; The difference between the width of the second opening and the width of the first opening is not less than 1 μm and not more than 5 μm.

2. The display substrate according to claim 1, characterized in that: The encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially arranged along a side away from the substrate; the light absorbing material layer is located at any of the following positions: between the organic encapsulation layer and the first inorganic encapsulation layer; between the organic encapsulation layer and the second inorganic encapsulation layer; between the second inorganic encapsulation layer and the reflective layer.

3. The display substrate according to claim 1, characterized in that: The light absorbing material layer includes any one of a light absorbing resin layer, a metal material layer or a refractive index matching layer.

4. The display substrate according to claim 1, characterized in that: The thickness of the light absorbing material layer is 1 μm-2 μm.

5. The display substrate according to any one of claims 1 to 4, characterized in that: The reflective layer includes a specular reflective layer.

6. The display substrate according to claim 5, characterized in that: A touch layer is also arranged on the side of the reflective layer facing away from the base substrate.

7. The display substrate according to any one of claims 1 to 4, characterized in that: The reflective layer includes a touch signal line; and a touch layer is arranged on a side of the layer where the touch signal line is located away from the base substrate.

8. The display substrate according to claim 7, characterized in that: A color filter layer is formed on the side of the touch layer facing away from the base substrate; the color filter layer includes a plurality of color filters and a black matrix arranged between adjacent color filters; one color filter is arranged corresponding to one light-emitting device; and the orthographic projection of the black matrix on the base substrate covers the orthographic projection of the touch signal line on the base substrate.

9. The display substrate according to claim 8, characterized in that: The black matrices are connected into an integrated structure to form a black matrix layer; the black matrix layer is defined by the black matrix to form a plurality of third openings, and the orthographic projection of one of the second openings on the base substrate is located within the orthographic projection of one of the third openings on the base substrate.

10. The display substrate according to claim 9, characterized in that: A distance between an orthographic projection of one of the second openings on the base substrate and an orthographic projection of one of the third openings on the base substrate is not less than 1 μm.

11. A display device, characterized in that: The display substrate comprises the display substrate according to any one of claims 1 to 10.

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