Multilayer circuit board with impedance sensitive electronic components and method for manufacturing the same

Abstract

The present invention describes a multilayer circuit board with impedance-sensitive electronic components and a manufacturing method thereof, wherein the multilayer circuit board comprises a lower main board, an inner circuit board layer and an upper main board; wherein an inductor is provided on the top surface of the lower main board; the inner circuit board layer is located between the upper and lower main boards and has at least one inner circuit board surrounding the inductor, and the top surface of the inner circuit board layer is higher than or equal to the top surface of the inductor; the upper main board is provided with at least one impedance-sensitive electronic component and a plated through-hole structure; the electrode of the inductor is plugged into the plated through-hole structure and electrically connected to the plated through-hole structure; through the design of the above-mentioned multilayer circuit board, the distance between the impedance-sensitive electronic component and the inductor can be effectively shortened, and the impedance of the circuit layout can be effectively reduced.

Description

Technical Field

[0001] The invention relates to a multilayer circuit board and a manufacturing method thereof, and in particular to a multilayer circuit board provided with impedance sensitive electronic components. Background Art

[0002] Some circuit boards are provided with impedance-sensitive electronic components (such as power modules) due to functional requirements. Impedance-sensitive electronic components refer to electronic components whose characteristics or performance will be seriously affected by the impedance of the circuit layout. Taking the power module as an example, in the circuit layout of the circuit board, it is hoped that the circuit between the power module and the capacitor or inductor to which it is electrically coupled can be shortened as much as possible, thereby reducing the overall impedance of the circuit layout and improving the power output efficiency. However, the conventional circuit board design simply sets the above-mentioned impedance-sensitive electronic components on one of the layers of the multi-layer circuit board. The circuit layout and the configuration of the electronic components cannot effectively reduce the overall impedance. It can be seen that the conventional circuit board design is not perfect and there is still room for improvement. Summary of the invention

[0003] One of the purposes of the present invention is to improve upon the deficiencies of the prior art and to provide a multilayer circuit board having an impedance-sensitive electronic component and a method for manufacturing the same, wherein the distance between the impedance-sensitive electronic component and the circuit layout of the inductor is shorter, thereby effectively reducing the overall impedance of the circuit layout.

[0004] Therefore, according to the structure of a multilayer circuit board provided with an impedance-sensitive electronic component provided by the present invention, it includes a lower main board, an inner circuit board layer and an upper main board. Among them, the top surface of the lower main board is provided with an inductor, and the top surface of the inductor has an electrode. The inner circuit board layer is arranged above the lower main board and has at least one inner circuit board, the at least one inner circuit board surrounds the inductor and is electrically connected to the lower main board, and the top surface of the inner circuit board layer is higher than or equal to the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer and has at least one impedance-sensitive electronic component and a first electroplated through-hole structure on the top surface. The first electroplated through-hole structure passes through the top and bottom surfaces of the upper main board and is electrically connected to the at least one impedance-sensitive electronic component. The electrode of the inductor is plugged into the first electroplated through-hole structure and is electrically connected to the first electroplated through-hole structure.

[0005] Through the design of the multi-layer circuit board, since the inductor is plugged into the first plated through-hole structure through its electrode and electrically coupled thereto, the distance of the circuit layout between the impedance-sensitive electronic component and the inductor can be effectively shortened, thereby effectively reducing the overall impedance of the circuit layout.

[0006] In one aspect, in order to effectively adjust the height difference between the upper main board and the lower main board, the at least one inner circuit board may be a plurality of inner circuit boards, and the inner circuit boards are stacked and electrically connected to each other.

[0007] On the other hand, each inner circuit board includes a second electroplated through-hole structure, which includes a through-hole and two welding pads. The through-hole passes through the top and bottom surfaces of each inner circuit board, and the hole wall of the through-hole is paved with a metal layer. The two welding pads are respectively arranged on the top and bottom surfaces of each inner circuit board and cover the through-hole. The two welding pads are electrically connected to the metal layer, and each inner circuit board is electrically connected to each other through the second electroplated through-hole structure.

[0008] In another aspect, the impedance sensitive electronic component may be, but is not limited to, a Smart PowerStage chip.

[0009] The present invention also provides a structure of a multilayer circuit board with impedance-sensitive electronic components, which includes a lower main board, an inner circuit board layer and an upper main board. The top surface of the lower main board is provided with an inductor. The inner circuit board layer is provided above the lower main board and has a plurality of paired electrical connection components, the plurality of electrical connection components surround the inductor and are electrically connected to the lower main board, each of the plurality of electrical connection components includes a board-to-board connector and an inner circuit board, the board-to-board connector includes a connector body and a plug connected to the connector body. Each inner circuit board includes a plated through-hole structure, the plated through-hole structure includes a through hole and a welding pad, the through hole passes through the top and bottom surfaces of the inner circuit board, the hole wall of the through hole is paved with a metal layer, the welding pad is provided on one side of the inner circuit board and covers the through hole on the side, the plug is plugged into the through hole, and the top surface of each of the plurality of electrical connection components is coplanar with the top surface of the inductor. The upper main board is electrically connected to the inner circuit board layer and has at least one impedance-sensitive electronic component provided on the top surface, the at least one impedance-sensitive electronic component is electrically connected to the inductor.

[0010] In one aspect, the inner circuit board is located above the board-to-board connector, and in some cases, the inner circuit board and the board-to-board connector may be reversed.

[0011] The present invention further provides a method for manufacturing a multilayer circuit board, the steps of which include: preparing a plurality of inner circuit boards stacked on each other and electrically connected; preparing a lower main board, mechanically and electrically coupling an inductor having electrodes on the top surface to the top surface of the lower main board, disposing the plurality of inner circuit boards on the periphery of the inductor and surrounding the inductor, mechanically and electrically coupling the plurality of inner circuit boards to the lower main board; preparing an upper main board having a first plated through hole structure, mechanically and electrically coupling at least one impedance-sensitive electronic component to both sides of the first plated through hole structure; inserting the electrodes of the inductor into the first plated through hole structure of the upper main board, electrically coupling the electrodes of the inductor to the first plated through hole structure and electrically coupling the plurality of inner circuit boards to the upper main board.

[0012] In one aspect, before inserting the electrode of the inductor into the first plated through hole structure of the upper main board, the lower main board having the plurality of inner circuit boards and the inductor and the upper main board having the at least one impedance sensitive electronic component are inverted.

[0013] The present invention also provides a method for manufacturing a multilayer circuit board, the steps of which include: preparing a plurality of inner circuit boards, wherein each inner circuit board includes a plated through-hole structure, the plated through-hole structure includes a through hole and a welding pad, the through hole penetrates the top and bottom surfaces of the inner circuit board, the hole wall of the through hole is paved with a metal layer, the welding pad is arranged on one side of the inner circuit board and covers the through hole on the side, preparing a lower main board, mechanically and electrically coupling an inductor and a plurality of board-to-board connectors arranged on the periphery of the inductor to the top surface of the above-mentioned lower main board, wherein each board-to-board connector includes a connector body and a pin connected to the connector body , placing the plurality of inner circuit boards on the plurality of board-to-board connectors and making the plated through-hole structures of each inner circuit board correspondingly face the pins of each board-to-board connector, pressing the plurality of inner circuit boards downward by press-fit insertion until the top surfaces of the plurality of inner circuit boards are coplanar with the top surface of the inductor; preparing an upper main board, mechanically and electrically coupling at least one impedance-sensitive electronic component to the top surface of the upper main board; electrically connecting the upper main board and the plurality of inner circuit boards, and electrically coupling the at least one impedance-sensitive electronic component to the inductor through the upper main board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The detailed structure, features, and manufacturing method of the multilayer circuit board with impedance-sensitive electronic components will be described in the following embodiments. However, it should be understood that the embodiments and drawings described below are only exemplary and should not be used to limit the scope of the claims of the present invention, wherein:

[0015] Figure 1 is a cross-sectional schematic diagram of a multilayer circuit board of the first embodiment;

[0016] Figure 2 is a perspective view of an inductor according to a first embodiment;

[0017] Figure 3 is a cross-sectional schematic diagram of the inner circuit board of the first embodiment, used to illustrate the second plated through-hole structure;

[0018] Figure 4 is a flowchart of the steps of the method for manufacturing a multilayer circuit board according to the first embodiment;

[0019] Figures 5A to 5P is corresponding to Figure 4 A schematic cross-sectional view of each step;

[0020] Figure 6 is a cross-sectional schematic diagram of a multilayer circuit board of a second embodiment;

[0021] Figure 7 is a schematic diagram of the appearance of a board-to-board connector according to a second embodiment;

[0022] Figure 8 is a cross-sectional schematic diagram of an inner circuit board of the second embodiment, used to illustrate the plated through-hole structure;

[0023] Fig. 9 is a flowchart of the steps of the method for manufacturing a multilayer circuit board of the second embodiment; and

[0024] FIG. 10A to FIG. 10K is corresponding to Fig. 9 Schematic cross-sectional view of each step.

[0025] (Explanation of symbols)

[0026] 1, 1'...Multilayer circuit board 10...Lower main board

[0027] 10B…Lower motherboard connection piece 11…Solder pad

[0028] 12, 12'...inductor 13...body

[0029] 14...Electrode 20...Inner circuit board layer

[0030] 21…Inner circuit board 22…Board-to-board connector

[0031] 221…Connector body 222…Latch

[0032] 23...Through hole 24...Welding pad

[0033] 25...Metal layer 26...Resin

[0034] 30…upper main board 30B…upper main board connecting piece

[0035] 31…Solder pad 32…Impedance sensitive electronic components

[0036] 33...Through hole 34...Metal layer

[0037] 36…Thermal interface material 21B…Internal circuit board connection

[0038] 27B... first inner circuit board connecting piece 21a... first inner circuit board

[0039] 28B...Second inner circuit board connecting piece 21b...Second inner circuit board

[0040] 29B…third inner circuit board connecting piece 21c…third inner circuit board

[0041] G1, G2…Inner circuit board group G3…Electrical connection components

[0042] P1, P2, P3…plated through-hole structure DETAILED DESCRIPTION

[0043] The following is a detailed description of the technical content and features of the present invention through several examples listed in combination with the accompanying drawings. Directional descriptive terms such as "upper", "lower", "inner", "outer", "top", and "bottom" mentioned in this specification are only illustrative descriptive terms based on normal usage directions and are not intended to limit the scope of the claims.

[0044] In order to explain the technical features of the present invention in detail, the following two embodiments are given and described in conjunction with the accompanying drawings.

[0045] like Figure 1 As shown, the first embodiment provides a multi-layer circuit board 1 with impedance-sensitive electronic components, which includes a lower main board 10 , an inner circuit board layer 20 and an upper main board 30 .

[0046] A plurality of welding pads 11 are provided on the top surface of the lower main board 10, and an inductor 12 is provided in the center of the top surface of the lower main board 10. Figure 2 As shown, the inductor 12 structurally includes a body 13 and two electrodes 14 . The bottom of the body 13 is electrically connected to the lower main board 10 , and the two electrodes 14 are disposed on the top surface of the body 13 and extend upward.

[0047] The inner circuit board layer 20 is disposed above the lower main board 10 and includes a plurality of inner circuit boards 21. These inner circuit boards 21 are arranged in groups. Each group of inner circuit boards 21 is composed of a plurality of inner circuit boards 21 stacked up and down. In this embodiment, the number of each group of inner circuit boards 21 is three. These inner circuit boards 21 surround the inductor 12, and each group of inner circuit boards 21 is electrically connected to the lower main board 10. Please refer to Figure 3Each inner circuit board 21 includes a plated through hole structure P2 (PlatingThrough Hole). The plated through hole structure P2 includes a through hole 23 and two soldering pads 24. The through hole 23 passes through the top and bottom surfaces of each inner circuit board 21. The hole wall of the through hole 23 is paved with a metal layer 25 and a resin 26 is also provided in the through hole 23. The two soldering pads 24 are respectively arranged on the top and bottom surfaces of each inner circuit board 21 and cover the through hole 23. The two soldering pads 24 are electrically connected to the metal layer 25. Through the plated through hole structure P2, the stacked inner circuit boards 21 can be effectively electrically connected to each other, and the height of the top surface of the inner circuit board layer 20 can be controlled so that the top surface of the inner circuit board layer 20 is higher than or equal to the top surface of the inductor 12.

[0048] Please go back Figure 1 The upper main board 30 is disposed above the inner circuit board layer 20, and a plurality of solder pads 31 are provided on the top and bottom surfaces, so that the upper main board 30 can be electrically connected to the inner circuit board layer 20 through the solder pads 31. The top surface of the upper main board 30 is provided with two impedance-sensitive electronic components 32 arranged at intervals and two electroplated through-hole structures P1 ( Figure 1 Only one of them is shown). In the present embodiment, the impedance-sensitive electronic component 32 is a smart power stage module (Smart Power Stage) chip. In some cases, the number of the impedance-sensitive electronic component 32 may be only one. The structure of the plated through hole structure P1 of the upper main board 30 is different from the plated through hole structure P2 of the inner circuit board 21. Specifically, the plated through hole structure P1 of the upper main board 30 penetrates the top and bottom surfaces of the upper main board 30 and electrically connects the two impedance-sensitive electronic components 32 through a wire. The hole wall of the through hole 33 is paved with a metal layer 34. The electrode 14 of the inductor 12 is inserted into the through hole 33 of the plated through hole structure P1 and electrically connected to the plated through hole structure P1, so that the two impedance-sensitive electronic components 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper main board 30.

[0049] Through the design of the above-mentioned multi-layer circuit board 1, since the inductor 12 is inserted into the above-mentioned plated through hole structure P1 through its electrode 14 and forms an electrical coupling with the plated through hole structure P1 of the upper main board 30, the impedance-sensitive electronic component 32 can be electrically connected to the inductor 12 through the plated through hole structure P1 of the upper main board 30 with a shorter circuit layout distance, thereby effectively shortening the circuit layout distance between the impedance-sensitive electronic component 32 and the inductor 12, and effectively reducing the overall impedance on the circuit layout, thereby improving the output efficiency of the impedance-sensitive electronic component 32.

[0050] The following is a description of the manufacturing method of the multilayer circuit board 1 of the first embodiment. Figure 4 , Figures 5A to 5PThe above manufacturing method includes the following steps.

[0051] Step S1.1: prepare a plurality of internal circuit boards that are stacked and electrically connected to each other. Specifically, prepare a first internal circuit board connecting piece 27B (such as Figure 5A ), the first inner circuit board connecting piece 27B includes a plurality of first inner circuit boards 21a connected transversely, and each first inner circuit board 21a is provided with a plated through hole structure P2. A cutting process (routing) is performed to separate each first inner circuit board 21a (such as Figure 5B Next, a second inner circuit board connecting piece 28B is prepared. The second inner circuit board connecting piece 28B also has a plurality of second inner circuit boards 21b connected transversely, and the second inner circuit board 21b is also provided with a plated through hole structure P2 (such as Figure 5C ), placing each of the separated first inner circuit boards 21a on the soldering pads 24 of the second inner circuit board connecting piece 28B, and mechanically and electrically coupling the first inner circuit boards 21a and the second inner circuit board connecting piece 28B into one piece by using a surface mount process (SMT) (e.g. Figure 5D ), and then a cutting process (routing) is performed to cut the second inner circuit board connecting piece 28B, so as to form a plurality of inner circuit board groups G1 (such as Figure 5E ). Then, a third inner circuit board connecting piece 29B is prepared. The third inner circuit board connecting piece 29B also has a plurality of third inner circuit boards 21c connected transversely, and the third inner circuit board 21c is also provided with a plated through hole structure P2 (such as Fig. 5F ), placing the cut inner circuit board groups G1 on the soldering pads 24 of the third inner circuit board connecting piece 29B, and mechanically and electrically coupling the inner circuit board groups G1 to the third inner circuit board connecting piece 29B (such as Figure 5G ), and finally, a cutting process (routing) is performed to cut the third inner circuit board connecting piece 29B, so as to form a plurality of inner circuit board groups G2 (such as the inner circuit board groups G2) composed of the first to third inner circuit boards 21a-21c stacked up and down. Figure 5H ).

[0052] Next, a lower mainboard connecting piece 10B is prepared. The lower mainboard connecting piece 10B includes a plurality of lower mainboards 10 connected transversely. A plurality of welding pads 11 (such as Fig.5I), prepare a plurality of inductors 12 having electrodes 14 on the top surface, perform a dispensing process to adhere the inductors 12 to the soldering pads 11 on the top surface of the lower motherboard connecting piece 10B, and arrange the plurality of groups of inner circuit boards 21a to 21c stacked up and down on the soldering pads 11 on the top surface of the lower motherboard connecting piece 10B and on the periphery of the inductors 12, thereby surrounding the inductors 12. The inductors 12 and the inner circuit board group G2 (i.e., the inner circuit boards 21a to 21c) are mechanically and electrically coupled to the top surface (such as the bottom surface) of the lower motherboard 10 by a surface mounting process (SMT). Figure 5J ). A laser cutting process is performed to separate a plurality of lower main boards 10 (such as Figure 5K ).

[0053] Step S1.2: Prepare an upper motherboard connecting sheet 30B, the upper motherboard connecting sheet 30B includes a plurality of upper motherboards 30 connected laterally, each upper motherboard 30 has a plated through hole structure P1 and a plurality of welding pads 31 (such as Figure 5L ). A plurality of impedance-sensitive electronic components 32 are disposed on both sides of each plated through-hole structure P1, and the impedance-sensitive electronic components 32 are mechanically and electrically coupled to the top surface of the upper motherboard 30 (such as Figure 5M ), and a layer of thermal interface material 36 (TIM; such as Figure 5N ).

[0054] Step S1.3: Invert the lower main board 10 provided with the inner circuit boards 21a-21c and the inductor 12 and the upper main board connecting piece 30B provided with the impedance sensitive electronic element 32, so that the electrode 14 of the inductor 12 is inserted into the plated through hole structure P1 of the upper main board 30, and the inductor 12 is mechanically and electrically coupled to the plated through hole structure P1 by a surface mount process (SMT), and the inner circuit boards 21a-21c are electrically coupled to the upper main board 30 (such as Fig.5O Finally, a laser cutting process is performed to cut each upper main board connecting piece 30B provided with the inductor 12, the impedance-sensitive electronic component 32, and the inner circuit boards 21a to 21c, so that a plurality of multilayer circuit boards 1 provided with the impedance-sensitive electronic component 32 according to the first embodiment of the present invention (such as Figure 5P ).

[0055] It should be noted that step S1.2 may be executed before step S1.1, and step S1.2 may even be executed simultaneously with step S1.1.

[0056] The present invention further provides a second embodiment, please refer to Figure 6 The second embodiment also provides a multilayer circuit board 1' provided with an impedance sensitive electronic component, which can be applied to a surface mounted (SMD) inductor 12'. The multilayer circuit board 1' of the second embodiment structurally comprises a lower main board 10, an inner circuit board layer 20 and an upper main board 30.

[0057] The top surface of the lower mainboard 10 is provided with several welding pads 11, and an inductor 12' is provided in the center of the top surface of the lower mainboard 10. The top and bottom surfaces of the inductor 12' are provided with electrodes 14, and the inductor 12' is electrically connected to the lower mainboard 10 through the bottom electrodes 14.

[0058] The inner circuit board layer 20 is disposed above the lower main board 10 and has a plurality of pairs of electrical connection components G3, which surround the inductor 12' and are electrically connected to the lower main board 10. Each pair of electrical connection components G3 includes a board-to-board connector 22 (board-to-board connector; Figure 7 ) and an inner circuit board 21 (such as Figure 8 ). The board-to-board connector 22 includes a connector body 221 and a plug 222 connected to the connector body 221. The inner circuit board 21 includes a plated through hole structure P3, and the plated through hole structure P3 includes a through hole 23 and a soldering pad 24. The through hole 23 penetrates the top and bottom surfaces of the inner circuit board 21. The hole wall of the through hole 23 is paved with a metal layer 25. The soldering pad 24 is arranged on the top surface of the inner circuit board 21 and covers the through hole 23. The plug 222 of the board-to-board connector 22 is upwardly inserted into the through hole 23 of the plated through hole structure P3 of the inner circuit board 21, and the board-to-board connector 22 is electrically coupled to the inner circuit board 21 through the plug 222. In addition, by means of press-fit insertion, the top surface of each group of electrical connection components G3 is coplanar with the top surface of the inductor 12', so that the inner circuit board layer 20 and the inductor 12' can be smoothly electrically coupled with the upper main board 30 later.

[0059] The upper main board 30 is disposed above the inner circuit board layer 20, and a plurality of solder pads 31 are also provided on the top and bottom surfaces of the upper main board 30. Two impedance-sensitive electronic components 32 are provided on the top surface of the upper main board 30 at intervals (in this embodiment, the impedance-sensitive electronic components 32 are smart power stage chips. In addition, in some cases, the upper main board 30 may have only one impedance-sensitive electronic component 32). The upper main board 30 is electrically connected to the inner circuit board layer 20, and the two impedance-sensitive electronic components 32 are electrically connected to the inductor 12' through the upper main board 30, thereby shortening the distance of the circuit layout between the two impedance-sensitive electronic components 32 and the inductor 12'.

[0060] The design of the multilayer circuit board 1 ′ of the second embodiment can also shorten the distance of the circuit layout between the impedance sensitive electronic component 32 and the inductor 12 ′, and can effectively reduce the overall impedance of the circuit layout, thereby improving the output efficiency of the impedance sensitive electronic component 32 .

[0061] The following will describe the manufacturing method of the multilayer circuit board 1' of the second embodiment. Fig. 9 , FIG. 10A to FIG. 10K The above manufacturing method includes the following steps.

[0062] Step S2.1: prepare a plurality of internal circuit boards. Specifically, prepare an internal circuit board connection sheet 21B (such as Fig. 10A ), the inner circuit board connecting piece 21B includes a plurality of transversely connected inner circuit boards 21, each inner circuit board 21 includes a plated through hole structure P3 (please refer to Figure 8 ), the plated through hole structure P3 includes a through hole 23 and a soldering pad 24, the through hole 23 passes through the top and bottom surfaces of the inner circuit board 21, the hole wall of the through hole 23 is paved with a metal layer 25, and the soldering pad 24 is arranged on the top surface of the inner circuit board 21 and covers the through hole 23. Afterwards, a cutting process (routing) is performed to separate each inner circuit board 21 (such as Fig. 10B ).

[0063] Step S2.2: Prepare a lower mainboard connecting piece 10B, the lower mainboard connecting piece 10B includes a plurality of lower mainboards 10 connected transversely, and lay a plurality of welding pads 11 (such as Fig. 10C ). Prepare a plurality of surface mount (SMD) inductors 12' and a plurality of board-to-board connectors 22. Use a surface mount process (SMT) to mechanically and electrically couple the inductors 12' and the board-to-board connectors 22 to the top surface (such as the bottom surface) of the lower motherboard connecting piece 10B. Fig. 10D ), and the board-to-board connectors 22 are arranged at the periphery of the inductor 12' and surround the inductor 12'. Each board-to-board connector 22 includes a connector body 221 and a plug 222 connected to the connector body 221 (please refer to Figure 7 ), the pin 222 extends upward. Laser cutting is performed to separate the lower motherboard 10 (such as Fig.10EThe inner circuit boards 21 are placed on the board-to-board connectors 22, and the plated through-hole structures P3 of the inner circuit boards 21 are correspondingly facing the pins 222 of the board-to-board connectors 22. The inner circuit boards 21 are pressed down by a press-fit insertion machine until the top surfaces of the inner circuit boards 21 are coplanar with the top surface of the inductor 12' (e.g. Fig.10F ).

[0064] Step S2.3: Prepare an upper motherboard connecting sheet 30B, the upper motherboard connecting sheet 30B includes a plurality of upper motherboards 30 connected laterally, prepare a plurality of impedance-sensitive electronic components 32, and configure at least one of the impedance-sensitive electronic components 32 at a position corresponding to each upper motherboard 30, and mechanically and electrically couple the impedance-sensitive electronic components 32 to the top surface (such as the upper motherboard connecting sheet 30B) of the upper motherboard connecting sheet 30B by a surface mount process (SMT). Fig. 10H ).

[0065] Step S2.4: Invert the lower main board 10 having the board-to-board connector 22, the inner circuit board 21 and the inductor 12' and the upper main board connecting piece 30B having the plurality of impedance-sensitive electronic components 32, and place the inverted lower main board 10 above the inverted upper main board connecting piece 30B, and mechanically and electrically couple the inner circuit board 21 to the bottom surface of the upper main board connecting piece 30B (such as the bottom surface of the upper main board connecting piece 30B) by a surface mount process (SMT). Fig.10I ), and the impedance-sensitive electronic components 32 are electrically coupled to the inductor 12' through the upper motherboard connecting piece 30B. Then, a layer of thermal interface material 36 (TIM; such as Fig.10J Finally, a laser cutting process is performed to cut the upper motherboard connecting piece 30B, so that a plurality of multilayer circuit boards 1' (such as Figure 10K ).

[0066] It should be noted that step S2.3 may be executed before step S2.1, and step S2.3 may even be executed simultaneously with step S2.1.

[0067] Finally, it must be reiterated that the methods and constituent elements disclosed in the aforementioned embodiments of the present invention are merely illustrative and are not intended to limit the patent scope of the present invention. Any simple structural modifications or changes that do not deviate from the spirit of the present invention, or replacement with other equivalent elements, should still fall within the scope covered by the claims of the present invention.

Claims

1. A multilayer circuit board provided with an impedance-sensitive electronic component, characterized in that: Contains: A lower main board, wherein an inductor is disposed on a top surface of the lower main board, and an electrode is disposed on a top surface of the inductor; an inner circuit board layer, the inner circuit board layer being disposed above the lower main board and having at least one inner circuit board, the at least one inner circuit board surrounding the inductor and being electrically connected to the lower main board, the top surface of the inner circuit board layer being higher than or equal to the top surface of the inductor; as well as An upper main board, which is electrically connected to the inner circuit board layer and has at least one impedance-sensitive electronic component and a first electroplated through-hole structure on its top surface, the first electroplated through-hole structure passes through the top and bottom surfaces of the upper main board and is electrically connected to the at least one impedance-sensitive electronic component, the electrode of the inductor is plugged into the first electroplated through-hole structure and is electrically connected to the first electroplated through-hole structure.

2. The multi-layer circuit board with impedance sensitive electronic components as claimed in claim 1, characterized in that: The at least one inner circuit board is a plurality of inner circuit boards, and the plurality of inner circuit boards are stacked on top of each other and electrically connected.

3. The multi-layer circuit board with impedance sensitive electronic components as claimed in claim 2, characterized in that: Each of the inner circuit boards includes a second electroplated through-hole structure, which includes a through hole and two welding pads. The through hole passes through the top and bottom surfaces of each of the inner circuit boards, and the hole wall of the through hole is paved with a metal layer. The two welding pads are respectively arranged on the top and bottom surfaces of each of the inner circuit boards and cover the through hole. The two welding pads are electrically connected to the metal layer, and each of the inner circuit boards is electrically connected to each other through the second electroplated through-hole structure.

4. The multilayer circuit board provided with an impedance sensitive electronic component according to any one of claims 1 to 3, characterized in that: The at least one impedance sensitive electronic component is an intelligent power stage module chip.

5. A multilayer circuit board provided with an impedance-sensitive electronic component, characterized in that: Contains: a lower main board, wherein the top surface of the lower main board is provided with an inductor; an inner circuit board layer, the inner circuit board layer is arranged above the lower main board and has a plurality of paired electrical connection components, the plurality of electrical connection components surround the inductor and are electrically connected to the lower main board, each of the plurality of electrical connection components comprises a board-to-board connector and an inner circuit board, the board-to-board connector comprises a connector body and a plug connected to the connector body, the inner circuit board comprises a plated through-hole structure, the plated through-hole structure comprises a through-hole and a welding pad, the through-hole passes through the top and bottom surfaces of the inner circuit board, the hole wall of the through-hole is paved with a metal layer, the welding pad is arranged on one side of the inner circuit board and covers the through-hole, the plug is plugged into the through-hole, and the top surface of each of the plurality of electrical connection components is coplanar with the top surface of the inductor; as well as An upper main board is electrically connected to the inner circuit board layer and has at least one impedance-sensitive electronic component disposed on a top surface thereof, wherein the impedance-sensitive electronic component is electrically connected to the inductor.

6. The multi-layer circuit board with impedance sensitive electronic components as claimed in claim 5, characterized in that: The inner circuit board is located above the board-to-board connector.

7. The multi-layer circuit board with impedance sensitive electronic components according to claim 5 or 6, characterized in that: The at least one impedance sensitive electronic component is an intelligent power stage module chip.

8. A method for manufacturing a multi-layer circuit board, characterized in that: The following steps are involved: preparing a plurality of inner circuit boards stacked on top of each other and electrically connected; Prepare a lower mainboard, mechanically and electrically couple an inductor having electrodes on the top surface to the top surface of the lower mainboard, dispose a plurality of inner circuit boards on the periphery of the inductor and surround the inductor, and mechanically and electrically couple the plurality of inner circuit boards to the lower mainboard; Preparing an upper motherboard having a first plated through hole structure, and mechanically and electrically coupling at least one impedance sensitive electronic component to the first plated through hole structure; The electrode of the inductor is inserted into the first plated through hole structure of the upper main board, the electrode is electrically coupled to the first plated through hole structure and the plurality of inner circuit boards are electrically coupled to the upper main board.

9. The method for manufacturing a multi-layer circuit board according to claim 8, wherein: Before inserting the electrode of the inductor into the first plated through-hole structure of the upper main board, the lower main board provided with the plurality of inner circuit boards and the inductor and the upper main board provided with the impedance sensitive electronic component are inverted.

10. The method for manufacturing a multi-layer circuit board according to claim 8, wherein: Each of the inner circuit boards includes a second electroplated through-hole structure, which includes a through hole and two welding pads. The through hole passes through the top and bottom surfaces of each of the inner circuit boards, and the hole wall of the through hole is paved with a metal layer. The two welding pads are respectively arranged on the top and bottom surfaces of each of the inner circuit boards and cover the through hole. The two welding pads are electrically connected to the metal layer, and each of the inner circuit boards is electrically connected to each other through the second electroplated through-hole structure.

11. A method for manufacturing a multi-layer circuit board, characterized in that: The following steps are involved: Prepare a plurality of inner circuit boards, wherein each inner circuit board comprises a plated through-hole structure, wherein the plated through-hole structure comprises a through-hole and a welding pad, wherein the through-hole passes through the top and bottom surfaces of the inner circuit board, the hole wall of the through-hole is paved with a metal layer, and the welding pad is arranged on one side of the inner circuit board and covers the through-hole; A lower mainboard is prepared, and an inductor and a plurality of board-to-board connectors disposed on the periphery of the inductor are mechanically and electrically coupled to the top surface of the lower mainboard, wherein each of the board-to-board connectors comprises a connector body and a plug connected to the connector body; the plurality of inner circuit boards are placed on the plurality of board-to-board connectors and the plated through-hole structures of each of the inner circuit boards are correspondingly facing the plugs of each of the board-to-board connectors, and the plurality of inner circuit boards are pressed down in a press-fit insertion manner until the top surfaces of the plurality of inner circuit boards are all coplanar with the top surface of the inductor; Preparing an upper mainboard, and mechanically and electrically coupling at least one impedance-sensitive electronic component to a top surface of the upper mainboard; The upper main board is electrically coupled to the plurality of inner circuit boards, and the at least one impedance-sensitive electronic component is electrically coupled to the inductor through the upper main board.

12. The method for manufacturing a multi-layer circuit board according to claim 11, wherein: The method also includes laying a layer of thermal interface material on the at least one impedance sensitive electronic component.

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