Multilayer printed circuit board of millimeter wave active phased array antenna and manufacturing method

Abstract

The invention discloses a multilayer printed circuit board of a millimeter wave active phased-array antenna and a manufacturing method, the multilayer printed circuit board comprises a first layer board, a second layer board, a fourteenth layer board, a nineteenth layer board, a 22th layer board, a first via hole, a second via hole and a third via hole, the outer side surface of the first layer board is provided with a radio frequency module and a power supply module; the second layer board is provided with a power division network module; the fourteenth layer of board is used for transmitting radio frequency signals; the nineteenth layer plate is provided with a radiation excitation module; the 22th layer plate is provided with an antenna array radiation module, and the antenna array radiation module is in gap coupling with the radiation excitation module; the first via hole is used for realizing signal transmission between the radio frequency module and the power division network module; the second via hole is used for transmitting a radio frequency signal output by the radio frequency module to the fourteenth layer plate; and the third via hole is used for transmitting the radio frequency signal of the fourteenth layer of board to the radiation excitation module. The system has the advantages of high integration level, reasonable spatial layout, low production and manufacturing cost, stable signal transmission performance and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and in particular to a multilayer printed circuit board of a millimeter wave active phased array antenna and a method for manufacturing the multilayer printed circuit board. Background Art

[0002] Traditional communication antennas are all mechanical passive phase shifters, which are large in size and weight, not suitable for automated production, have high processing costs, slow phase shift control, and poor accuracy.

[0003] The phased array antenna RF system contains a variety of components, such as: antenna array, RF module array, feed network, wave control module, power module, etc. The traditional phased array antenna system has the following shortcomings: 1. Different printed circuit boards are used to carry different modules, which results in a large number of printed circuit boards in the entire phased array antenna system, complex electrical connections between modules, cumbersome spatial layout, and high difficulty in installation and debugging; 2. Each printed circuit board has many layers, and the cost of combining and connecting layers is high. The volume of the finished printed circuit board after combination is also large, which is not convenient for application under extreme space conditions.

[0004] It can be seen that in the prior art, there are technical problems such as low integration of each RF module in the phased array antenna RF system, a large number of printed circuit boards, and complex and cumbersome spatial layout, which result in high production and application costs of the phased array antenna RF system and difficulty in application under extreme space conditions. Summary of the invention

[0005] The purpose of the present invention is to solve at least one of the technical problems existing in the prior art, and to provide a multilayer printed circuit board of a millimeter wave active phased array antenna and a method for manufacturing the multilayer printed circuit board, which have the advantages of high integration, reasonable spatial layout, low production cost, and stable signal transmission performance.

[0006] In a first aspect, an embodiment of the present invention provides a multilayer printed circuit board of a millimeter wave active phased array antenna, comprising a first layer board, a second layer board, a fourteenth layer board, a nineteenth layer board, a twenty-second layer board, a first via hole, a second via hole, and a third via hole, wherein: The outer surface of the first layer board is provided with a radio frequency module and a power module, the radio frequency module is provided with a radio frequency interface and a communication interface, and the power module is provided with a power interface; The second layer board is located below the first layer board, and the second layer board is provided with a power division network module, and the power division network module is implemented by embedded thin film resistors; The 14th layer board is located below the 2nd layer board, and the 14th layer board is used to transmit radio frequency signals; The 19th layer of board is located below the 14th layer of board, and the 19th layer of board is provided with a radiation excitation module; The 22nd layer board is located below the 19th layer board, and the 22nd layer board is provided with an antenna array radiation module, and the antenna array radiation module is gap-coupled with the radiation excitation module; The first via passes through the first layer board to the second layer board to achieve signal transmission between the radio frequency module and the power division network module; The second via hole passes through the first layer of the board to the fourteenth layer of the board, so as to transmit the radio frequency signal output by the radio frequency module to the fourteenth layer of the board; The third via hole passes through the 14th layer of board to the 19th layer of board to transmit the radio frequency signal of the 14th layer of board to the radiation excitation module.

[0007] The multilayer printed circuit board of the millimeter wave active phased array antenna provided according to the embodiment of the present invention has at least the following beneficial effects: by adopting a multilayer board to realize integrated lamination of modules such as the radio frequency module, the power module, the power division network module, the radiation excitation module and the antenna array radiation module, the radio frequency signal received from the radio frequency interface is transmitted to the power division network module of the second layer board through the first via hole and returns to the radio frequency module of the first layer board, and then transmitted to the 14th layer board through the second via hole, and transmitted to the radiation excitation module of the 19th layer board through the third via hole, and finally transmitted to the antenna array radiation module of the 22nd layer board through the gap coupling by the radiation excitation module, the phased array antenna function is realized through a unique lamination method, the radio frequency signal is transmitted to the middle layer through the via hole, the radio frequency signal crosstalk is avoided, and the output stable signal transmission is achieved; the multilayer printed circuit board of the millimeter wave active phased array antenna has the advantages of high integration, reasonable spatial layout, low production and manufacturing cost, stable signal transmission performance and the like.

[0008] The multilayer printed circuit board provided according to some embodiments of the present invention further includes a fifth layer board, a tenth layer board, a twelfth layer board and a fourth via; The fifth layer board is located between the second layer board and the fourteenth layer board, and the fifth layer board is provided with a radio frequency control wiring; The 10th layer board is located between the 5th layer board and the 14th layer board, and the 10th layer board is provided with a radio frequency control wiring; The 12th layer board is located between the 10th layer board and the 14th layer board, and the 12th layer board is provided with a radio frequency control wiring; The fourth via hole passes through the first layer of the board to the twelfth layer of the board to achieve electrical connection between the RF control trace and the RF module.

[0009] The multilayer printed circuit board provided according to some embodiments of the present invention further includes a third layer board; The third layer board is located between the second layer board and the fifth layer board, and the third layer board is provided with a radio frequency control wiring.

[0010] The multilayer printed circuit board provided according to some embodiments of the present invention further includes a seventh layer board; The seventh layer board is located between the fifth layer board and the tenth layer board, and the seventh layer board is used to transmit a power supply voltage of a first voltage level; The fourth via hole is also used to realize the electrical connection between the seventh layer board and the power module.

[0011] The multilayer printed circuit board provided according to some embodiments of the present invention further includes a ninth layer board; The ninth layer board is located between the seventh layer board and the tenth layer board, and the ninth layer board is used to transmit a power supply voltage of a second voltage level; The fourth via hole is also used to realize the electrical connection between the ninth layer board and the power module.

[0012] The multilayer printed circuit board provided according to some embodiments of the present invention further includes a 21st layer board and a fifth via; The 21st layer board is located between the 19th layer board and the 22nd layer board, the 21st layer board is grounded and realizes gap coupling with the 19th layer board through copper cladding and hollowing; The fifth via hole passes through the 21st layer board to the 22nd layer board to achieve electrical connection between the 21st layer board and the antenna array radiation module.

[0013] The multilayer printed circuit board provided according to some embodiments of the present invention further includes a 15th layer board, a 16th layer board, a 17th layer board and an 18th layer board located between the 14th layer board and the 19th layer board: The 15th layer board and the 18th layer board are non-circuit layer boards; The 16th layer board and the 17th layer board are ground circuit layer boards.

[0014] In a second aspect, an embodiment of the present invention provides a method for manufacturing a multilayer printed circuit board, comprising: Drilling the first layer board and the second layer board to obtain a first via hole; the first via hole penetrates from the first layer board to the second layer board; The first layer board and the second layer board, the third layer board and the fourth layer board are pressed together for the first time, and drilled to obtain a seventh via hole; the seventh via hole passes from the first layer board to the fourth layer board; The first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board are pressed together for the second time, and drilled to obtain a second via hole, a fourth via hole, an eighth via hole and a ninth via hole; the second via hole penetrates from the first layer board to the fourteenth layer board; the fourth via hole penetrates from the first layer board to the twelfth layer board; the eighth via hole penetrates from the first layer board to the sixteenth layer board; the ninth via hole penetrates from the thirteenth layer board to the sixteenth layer board; Drilling the 21st layer board and the 22nd layer board to obtain a fifth via hole; the fifth via hole passes through the 21st layer board to the 22nd layer board; The 17th and 18th layers of boards, the 19th and 20th layers of boards, the 21st and 22nd layers of boards, and the 23rd and 24th layers of boards are pressed together for the third time, and drilled to obtain a sixth via hole, which passes from the 17th layer of boards to the 21st layer of boards; The first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board, the seventeenth layer board and the eighteenth layer board, the nineteenth layer board and the twentieth layer board, the twenty-first layer board and the twenty-second layer board, the twenty-third layer board and the twenty-fourth layer board are pressed together for the fourth time, and drilled to obtain a third via hole and a tenth via hole; the third via hole passes through from the fourteenth layer board to the nineteenth layer board; the tenth via hole passes through from the first layer board to the twenty-fourth layer board.

[0015] According to the manufacturing method provided by some embodiments of the present invention, the second via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the fifteenth layer board to the sixteenth layer board and filling with resin; The fourth via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the thirteenth layer board to the sixteenth layer board and filling with resin; The ninth via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the first layer board to the twelfth layer board and filling with resin.

[0016] According to the manufacturing method provided by some embodiments of the present invention, the third via hole is realized by drilling a through hole from the first layer board to the 24th layer board and back drilling from the first layer board to the 13th layer board and from the 20th layer board to the 24th layer board and filling with resin; The sixth via hole is realized by drilling a through hole from the 17th layer board to the 24th layer board and back drilling from the 22nd layer board to the 24th layer board and filling with resin.

[0017] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures particularly pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are used to provide a further understanding of the technical solution of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention and do not constitute a limitation on the technical solution of the present invention.

[0019] The present invention is further described below in conjunction with the accompanying drawings and embodiments; Figure 1 It is a module block diagram of a multilayer printed circuit board provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the distribution of layers of a multilayer printed circuit board provided by an embodiment of the present invention; Figure 3 It is a flow chart of a method for manufacturing a multilayer printed circuit board provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0020] This section will describe in detail the specific embodiments of the present invention. The preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present invention, but it cannot be understood as a limitation on the scope of protection of the present invention.

[0021] In the description of the embodiments of the present invention, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, "above", "below", "within", etc. are understood to include the number itself, "at least one" means one or more, "at least one of the following" and similar expressions refer to any combination of these items, including any combination of single or plural items. If there is a description of "first", "second", etc., it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0022] It should be noted that the terms such as setting, installing, and connecting in the embodiments of the present invention should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the embodiments of the present invention in combination with the specific content of the technical solution. For example, the term "connection" can be a mechanical connection, an electrical connection, or mutual communication; it can be directly connected or indirectly connected through an intermediate medium.

[0023] It should be noted that the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0024] Traditional communication antennas are all mechanical passive phase shifters, which are large in size and weight, not suitable for automated production, have high processing costs, slow phase shift control, and poor accuracy.

[0025] The phased array antenna RF system contains a variety of components, such as: antenna array, RF module array, feed network, wave control module, power module, etc. The traditional phased array antenna system has the following shortcomings: 1. Different printed circuit boards are used to carry different modules, which results in a large number of printed circuit boards in the entire phased array antenna system, complex electrical connections between modules, cumbersome spatial layout, and high difficulty in installation and debugging; 2. Each printed circuit board has many layers, and the cost of combining and connecting layers is high. The volume of the finished printed circuit board after combination is also large, which is not convenient for application under extreme space conditions.

[0026] It can be seen that in the prior art, there are technical problems such as low integration of each RF module in the phased array antenna RF system, a large number of printed circuit boards, and complex and cumbersome spatial layout, which result in high production and application costs of the phased array antenna RF system and difficulty in application under extreme space conditions.

[0027] Based on this, the embodiments of the present invention provide a multilayer printed circuit board of a millimeter wave active phased array antenna and a method for manufacturing the multilayer printed circuit board, which have the advantages of high integration, reasonable spatial layout, low production cost, and stable signal transmission performance.

[0028] The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0029] Reference Figure 1 and Figure 2 The first aspect of the present invention provides a multilayer printed circuit board of a millimeter wave active phased array antenna, comprising a first layer board L1, a second layer board L2, a fourteenth layer board L14, a nineteenth layer board L19, a twenty-second layer board L22, a first via hole K01, a second via hole K02 and a third via hole K03, wherein: The outer surface of the first layer board L1 is provided with a radio frequency module and a power module, the radio frequency module is provided with a radio frequency interface and a communication interface, and the power module is provided with a power interface; The second layer board L2 is located below the first layer board L1. The second layer board L2 is provided with a power division network module, and the power division network module is implemented by embedded thin film resistors; The 14th layer board L14 is located below the 2nd layer board L2, and the 14th layer board L14 is used to transmit radio frequency signals; The 19th layer board L19 is located below the 14th layer board L14, and the 19th layer board L19 is provided with a radiation excitation module; The 22nd layer board L22 is located below the 19th layer board L19, and the 22nd layer board L22 is provided with an antenna array radiation module, and the antenna array radiation module is gap-coupled with the radiation excitation module; The first via K01 passes through the first layer board L1 to the second layer board L2 to realize signal transmission between the RF module and the power division network module; The second via K02 passes from the first layer board L1 to the fourteenth layer board L14, so as to transmit the RF signal output by the RF module to the fourteenth layer board L14; The third via hole K03 passes from the 14th layer board L14 to the 19th layer board L19 to transmit the radio frequency signal of the 14th layer board L14 to the radiation excitation module.

[0030] According to the multilayer printed circuit board provided by the embodiment of the present invention, the radio frequency module, the power module, the power division network module, the radiation excitation module and the antenna array radiation module are integratedly laminated by using a multilayer board. The radio frequency signal received from the radio frequency interface is transmitted to the power division network module of the second layer board L2 through the first via K01 and returns to the radio frequency module of the first layer board L1, and then transmitted to the 14th layer board L14 through the second via K02, and transmitted to the radiation excitation module of the 19th layer board L19 through the third via K03, and finally transmitted to the antenna array radiation module of the 22nd layer board L22 through gap coupling by the radiation excitation module. The phased array antenna function is realized through a unique lamination method, and the radio frequency signal is transmitted to the middle layer through the via to avoid radio frequency signal crosstalk, so that the output stable signal transmission; the multilayer printed circuit board has the advantages of high integration, reasonable spatial layout, low production and manufacturing cost, stable signal transmission performance, etc.

[0031] Reference Figure 2 In some embodiments of the present invention, the multilayer printed circuit board further includes a fifth layer board L5, a tenth layer board L10, a twelfth layer board L12 and a fourth via K04; The fifth layer board L5 is located between the second layer board L2 and the fourteenth layer board L14, and the fifth layer board L5 is provided with a radio frequency control line; The tenth layer board L10 is located between the fifth layer board L5 and the fourteenth layer board L14, and the tenth layer board L10 is provided with a radio frequency control line; The 12th layer board L12 is located between the 10th layer board L10 and the 14th layer board L14, and the 12th layer board L12 is provided with a radio frequency control line; The fourth via K04 passes through the first layer board L1 to the twelfth layer board L12 to achieve electrical connection between the RF control trace and the RF module.

[0032] In this embodiment, the RF control wiring adopts the inner layer wiring such as the 5th layer board L5, the 10th layer board L10, and the 12th layer board L12, which well realizes the connection from the connector to the RF module without crossing, can avoid interference, and ensures stable signal transmission.

[0033] Reference Figure 2 , in the multilayer printed circuit board provided in some embodiments of the present invention, further comprising a third layer board L3; The third layer board L3 is located between the second layer board L2 and the fifth layer board L5 , and the third layer board L3 is provided with a radio frequency control wiring.

[0034] In this embodiment, a reserved radio frequency control line is further provided on the third layer board L3 as a backup.

[0035] Reference Figure 2 , in the multilayer printed circuit board provided in some embodiments of the present invention, further comprising a seventh layer board L7; The seventh layer board L7 is located between the fifth layer board L5 and the tenth layer board L10, and the seventh layer board L7 is used to transmit a power supply voltage of a first voltage level; The fourth via K04 is also used to realize the electrical connection between the seventh layer board L7 and the power module.

[0036] In this embodiment, the power supply voltage of the first voltage level transmitted by the 7th layer board L7 may be 1.2V, and the power supply voltage is transmitted by the inner electrical layer to avoid interference.

[0037] Reference Figure 2 In some embodiments of the present invention, the multilayer printed circuit board further includes a ninth layer board L9; The ninth layer board L9 is located between the seventh layer board L7 and the tenth layer board L10, and the ninth layer board L9 is used to transmit a power supply voltage of a second voltage level; The fourth via K04 is also used to realize the electrical connection between the ninth layer board L9 and the power module.

[0038] In this embodiment, the power supply voltage of the second voltage level transmitted by the 9th layer board L9 may be 3.3V, and the power supply voltage is transmitted by the inner electrical layer to avoid interference.

[0039] Reference Figure 2 , in the multilayer printed circuit board provided in some embodiments of the present invention, it also includes a 21st layer board L21 and a fifth via K05; The 21st layer board L21 is located between the 19th layer board L19 and the 22nd layer board L22. The 21st layer board L21 is grounded and realizes gap coupling with the 19th layer board L19 through copper cladding and hollowing. The fifth via hole K05 passes from the 21st layer board L21 to the 22nd layer board L22 to achieve electrical connection between the 21st layer board L21 and the antenna array radiation module.

[0040] In this embodiment, the radiation excitation module of the 19th layer board L19 is gap-coupled to the 21st layer board L21, and then connected to the antenna array radiation module of the 22nd layer board L22 through the fifth via K05 to achieve electrical connection of the radio frequency signal.

[0041] Reference Figure 2 In some embodiments of the present invention, the multilayer printed circuit board further includes a 15th layer board L15, a 16th layer board L16, a 17th layer board L17 and an 18th layer board L18 located between the 14th layer board L14 and the 19th layer board L19: The 15th layer board L15 and the 18th layer board L18 are non-circuit layer boards; The 16th layer board L16 and the 17th layer board L17 are ground circuit layer boards.

[0042] In this embodiment, the radio frequency signal transmitted by the 14th layer board L14 and the radiation excitation module provided by the 19th layer board L19 are isolated through the 15th layer board L15 to the 18th layer board L18 to avoid mutual interference.

[0043] In addition, refer to Figure 2 In some embodiments of the present invention, the multilayer printed circuit board further includes a fourth layer board L4 located between the third layer board L3 and the fifth layer board L5, a sixth layer board L6 located between the fifth layer board L5 and the seventh layer board L7, an eighth layer board L8 located between the seventh layer board L7 and the ninth layer board L9, an eleventh layer board L11 located between the tenth layer board L10 and the twelfth layer board L12, and a fourth layer board L12 located between the twelfth layer board L12 and the fourteenth layer board L14. The 13th layer board L13, the 20th layer board L20 located between the 19th layer board L19 and the 21st layer board L21, the 23rd layer board located below the 22nd layer board, and the 24th layer board located below the 23rd layer board; among them, the 4th layer board L4, the 6th layer board L6, the 8th layer board L8, the 11th layer board L11, and the 13th layer board L13 are used for grounding, and the 20th layer board L20, the 23rd layer board, and the 24th layer board are empty layer boards without copper foil and circuits.

[0044] In addition, continue to refer to Figure 2The multilayer printed circuit board is also provided with a sixth via K06, a seventh via K07, an eighth via K08, a ninth via K09 and a tenth via K10, wherein the sixth via K06 passes from the 17th layer board L17 to the 21st layer board L21; the seventh via K07 passes from the 1st layer board L1 to the 4th layer board L4; the eighth via K08 passes from the 1st layer board L1 to the 16th layer board L16; the ninth via K09 passes from the 13th layer board L13 to the 16th layer board L16; the tenth via K10 passes from the 1st layer board L1 to the 24th layer board L24.

[0045] In addition, there are dielectric layers between the 1st layer board L1 and the 2nd layer board L2, between the 3rd layer board L3 and the 4th layer board L4, between the 5th layer board L5 and the 6th layer board L6, between the 7th layer board L7 and the 8th layer board L8, between the 9th layer board L9 and the 10th layer board L10, between the 11th layer board L11 and the 12th layer board L12, between the 13th layer board L13 and the 14th layer board L14, between the 15th layer board L15 and the 16th layer board L16, between the 17th layer board L17 and the 18th layer board L18, between the 19th layer board L19 and the 20th layer board L20, between the 21st layer board L21 and the 22nd layer board L22, and between the 23rd layer board L23 and the 24th layer board L24; PP boards are provided between the 2nd layer L2 and the 3rd layer L3, between the 4th layer L4 and the 5th layer L5, between the 6th layer L6 and the 7th layer L7, between the 8th layer L8 and the 9th layer L9, between the 10th layer L10 and the 11th layer L11, between the 12th layer L12 and the 13th layer L13, between the 14th layer L14 and the 15th layer L15, between the 16th layer L16 and the 17th layer L17, between the 18th layer L18 and the 19th layer L19, between the 20th layer L20 and the 21st layer L21, and between the 22nd layer L22 and the 23rd layer L23. The PP boards are layer boards formed after the PP adhesive is solidified.

[0046] Reference Figure 3 The second aspect of the present invention provides a method for manufacturing a multilayer printed circuit board, including but not limited to steps S310 to S360, specifically: Step S310: drilling the first layer board L1 and the second layer board L2 to obtain a first via hole K01; the first via hole K01 penetrates from the first layer board L1 to the second layer board L2; Step S320: performing a first pressing and drilling process on the first layer board L1 and the second layer board L2, the third layer board L3 and the fourth layer board L4 to obtain a seventh via hole K07; the seventh via hole K07 penetrates from the first layer board L1 to the fourth layer board L4; Step S330: laminating the first layer L1 and the second layer L2, the third layer L3 and the fourth layer L4, the fifth layer L5 and the sixth layer L6, the seventh layer L7 and the eighth layer L8, the ninth layer L9 and the tenth layer L10, the eleventh layer L11 and the twelfth layer L12, the thirteenth layer L13 and the fourteenth layer L14, the fifteenth layer L15 and the sixteenth layer L16 for the second time, and Drilling is performed to obtain a second via hole K02, a fourth via hole K04, an eighth via hole K08 and a ninth via hole K09; the second via hole K02 penetrates from the first layer board L1 to the fourteenth layer board L14; the fourth via hole K04 penetrates from the first layer board L1 to the twelfth layer board L12; the eighth via hole K08 penetrates from the first layer board L1 to the sixteenth layer board L16; the ninth via hole K09 penetrates from the thirteenth layer board L13 to the sixteenth layer board L16; Step S340: drilling the 21st layer board L21 and the 22nd layer board L22 to obtain a fifth via hole K05; the fifth via hole K05 penetrates from the 21st layer board L21 to the 22nd layer board L22; Step S350: laminating the 17th layer board L17 and the 18th layer board L18, the 19th layer board L19 and the 20th layer board L20, the 21st layer board L21 and the 22nd layer board L22, the 23rd layer board L23 and the 24th layer board L24 for the third time, and drilling the same to obtain the sixth via hole K06, which penetrates from the 17th layer board L17 to the 21st layer board L21; Step S360: Layer 1 L1 and layer 2 L2, layer 3 L3 and layer 4 L4, layer 5 L5 and layer 6 L6, layer 7 L7 and layer 8 L8, layer 9 L9 and layer 10 L10, layer 11 L11 and layer 12 L12, layer 13 L13 and layer 14 L14, layer 15 L15 and layer 16 L16, layer 17 L17 and layer 18 The layer L18, the 19th layer L19 and the 20th layer L20, the 21st layer L21 and the 22nd layer L22, the 23rd layer L23 and the 24th layer L24 are pressed for the fourth time and drilled to obtain the third via K03 and the tenth via K10; the third via K03 passes from the 14th layer L14 to the 19th layer L19; the tenth via K10 passes from the 1st layer L1 to the 24th layer L24.

[0047] In the manufacturing method provided in some embodiments of the present invention, the second via hole K02 is realized by drilling through holes on the first layer board L1 to the sixteenth layer board L16 and back drilling and resin filling on the fifteenth layer board L15 to the sixteenth layer board L16; The fourth via K04 is realized by drilling through holes on the first layer board L1 to the 16th layer board L16 and back drilling and resin filling on the 13th layer board L13 to the 16th layer board L16; The ninth via hole K09 is realized by drilling through holes on the first layer board L1 to the sixteenth layer board L16 and back drilling and resin filling on the first layer board L1 to the twelfth layer board L12.

[0048] In the manufacturing method provided in some embodiments of the present invention, the third via hole K03 is realized by drilling through holes in the first layer board L1 to the 24th layer board L24 and back-drilling and resin-filling the first layer board L1 to the 13th layer board L13 and the 20th layer board L20 to the 24th layer board L24; The sixth via hole K06 is realized by drilling through holes on the 17th layer board L17 to the 24th layer board L24 and back drilling and resin filling on the 22nd layer board L22 to the 24th layer board L24.

[0049] The present invention provides a multi-layer printed circuit board of a millimeter wave active phased array antenna and a method for manufacturing the multi-layer printed circuit board. The multi-layer printed circuit board is integrally formed to solve the problems existing in the prior art, such as low integration of various radio frequency modules in the radio frequency system of the phased array antenna, complex and cumbersome spatial layout, and difficulty in achieving extreme space conditions. At the same time, the production cost is reduced and the performance stability is improved.

[0050] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed methods above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or implemented as hardware, or implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium or a non-transitory medium and a communication medium or a temporary medium. As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information such as computer-readable instructions, data structures, program modules or other data. Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disk DVD or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0051] The embodiments of the present invention are described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A multilayer printed circuit board for a millimeter wave active phased array antenna, characterized in that: include: A first layer board, wherein a radio frequency module and a power module are provided on the outer surface of the first layer board, the radio frequency module is provided with a radio frequency interface and a communication interface, and the power module is provided with a power interface; A second layer board, the second layer board is located below the first layer board, the second layer board is provided with a power division network module, and the power division network module is implemented by embedded thin film resistors; A 14th layer board, the 14th layer board is located below the 2nd layer board, and the 14th layer board is used to transmit radio frequency signals; A 19th layer of board, the 19th layer of board is located below the 14th layer of board, and the 19th layer of board is provided with a radiation excitation module; A 22nd layer board, the 22nd layer board is located below the 19th layer board, the 22nd layer board is provided with an antenna array radiation module, and the antenna array radiation module is gap-coupled with the radiation excitation module; A first via hole, wherein the first via hole passes through the first layer board to the second layer board to realize signal transmission between the radio frequency module and the power division network module; a second via hole, the second via hole passing through the first layer of the board to the fourteenth layer of the board, so as to transmit the radio frequency signal output by the radio frequency module to the fourteenth layer of the board; A third via hole is formed, and the third via hole passes through the 14th layer of the board to the 19th layer of the board, so as to transmit the radio frequency signal of the 14th layer of the board to the radiation excitation module.

2. The multilayer printed circuit board according to claim 1, characterized in that: Also includes a 5th layer board, a 10th layer board, a 12th layer board and a fourth via; The fifth layer board is located between the second layer board and the fourteenth layer board, and the fifth layer board is provided with a radio frequency control wiring; The 10th layer board is located between the 5th layer board and the 14th layer board, and the 10th layer board is provided with a radio frequency control wiring; The 12th layer board is located between the 10th layer board and the 14th layer board, and the 12th layer board is provided with a radio frequency control wiring; The fourth via hole passes through the first layer of the board to the twelfth layer of the board to achieve electrical connection between the RF control trace and the RF module.

3. The multilayer printed circuit board according to claim 2, characterized in that: Also includes the 3rd layer board; The third layer board is located between the second layer board and the fifth layer board, and the third layer board is provided with a radio frequency control wiring.

4. The multilayer printed circuit board according to claim 2, characterized in that: Also includes the 7th layer board; The seventh layer board is located between the fifth layer board and the tenth layer board, and the seventh layer board is used to transmit a power supply voltage of a first voltage level; The fourth via hole is also used to realize the electrical connection between the seventh layer board and the power module.

5. The multilayer printed circuit board according to claim 4, characterized in that: Also includes the 9th layer board; The ninth layer board is located between the seventh layer board and the tenth layer board, and the ninth layer board is used to transmit a power supply voltage of a second voltage level; The fourth via hole is also used to realize the electrical connection between the ninth layer board and the power module.

6. The multilayer printed circuit board according to claim 1, characterized in that: Also includes the 21st layer board and the fifth via; The 21st layer board is located between the 19th layer board and the 22nd layer board, the 21st layer board is grounded and realizes gap coupling with the 19th layer board through copper cladding and hollowing; The fifth via hole passes through the 21st layer board to the 22nd layer board to achieve electrical connection between the 21st layer board and the antenna array radiation module.

7. The multilayer printed circuit board according to claim 1, characterized in that: Also included are a 15th layer board, a 16th layer board, a 17th layer board and an 18th layer board located between the 14th layer board and the 19th layer board: The 15th layer board and the 18th layer board are non-circuit layer boards; The 16th layer board and the 17th layer board are ground circuit layer boards.

8. A method for manufacturing a multilayer printed circuit board for a millimeter wave active phased array antenna, characterized in that: include: Drilling the first layer board and the second layer board to obtain the first via hole; The first via hole passes through the first layer of board to the second layer of board; The first layer board and the second layer board, the third layer board and the fourth layer board are pressed together for the first time, and drilled to obtain a seventh via hole; the seventh via hole passes from the first layer board to the fourth layer board; The first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board are pressed together for the second time, and drilled to obtain a second via hole, a fourth via hole, an eighth via hole and a ninth via hole; the second via hole penetrates from the first layer board to the fourteenth layer board; the fourth via hole penetrates from the first layer board to the twelfth layer board; the eighth via hole penetrates from the first layer board to the sixteenth layer board; the ninth via hole penetrates from the thirteenth layer board to the sixteenth layer board; Drilling the 21st layer board and the 22nd layer board to obtain a fifth via hole; the fifth via hole passes through the 21st layer board to the 22nd layer board; The 17th and 18th layers of boards, the 19th and 20th layers of boards, the 21st and 22nd layers of boards, and the 23rd and 24th layers of boards are pressed together for the third time, and drilled to obtain a sixth via hole, which passes from the 17th layer of boards to the 21st layer of boards; The first layer board and the second layer board, the third layer board and the fourth layer board, the fifth layer board and the sixth layer board, the seventh layer board and the eighth layer board, the ninth layer board and the tenth layer board, the eleventh layer board and the twelfth layer board, the thirteenth layer board and the fourteenth layer board, the fifteenth layer board and the sixteenth layer board, the seventeenth layer board and the eighteenth layer board, the nineteenth layer board and the twentieth layer board, the twenty-first layer board and the twenty-second layer board, the twenty-third layer board and the twenty-fourth layer board are pressed together for the fourth time, and drilled to obtain a third via hole and a tenth via hole; the third via hole passes through from the fourteenth layer board to the nineteenth layer board; the tenth via hole passes through from the first layer board to the twenty-fourth layer board.

9. The method according to claim 8, characterized in that: The second via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the fifteenth layer board to the sixteenth layer board and filling with resin; The fourth via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the thirteenth layer board to the sixteenth layer board and filling with resin; The ninth via hole is realized by drilling a through hole from the first layer board to the sixteenth layer board and back drilling from the first layer board to the twelfth layer board and filling with resin.

10. The manufacturing method according to claim 8, characterized in that: The third via hole is realized by drilling a through hole from the first layer board to the 24th layer board and back drilling from the first layer board to the 13th layer board and from the 20th layer board to the 24th layer board and filling with resin; The sixth via hole is realized by drilling a through hole from the 17th layer board to the 24th layer board and back drilling from the 22nd layer board to the 24th layer board and filling with resin.

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