Apparatus for manufacturing display device and method for manufacturing display device

Abstract

An apparatus for manufacturing a display device and a method for manufacturing a display device are provided. The apparatus includes a first housing having a first chamber, a support member disposed in the first chamber and including a frame having a plurality of openings, a plurality of adhesive patterns disposed on the frame, and a plurality of electrostatic supports superposed with the plurality of openings and supported for reciprocal movement in a corresponding opening of the plurality of openings.

Description

[0001] This application claims priority and benefit to Korean Patent Application No. 10-2020-0051949, filed on April 29, 2020, which is incorporated herein by reference for all purposes, as fully set forth herein. Technical Field

[0002] Exemplary embodiments of the invention generally relate to display devices, and more specifically, to apparatus for manufacturing display devices and methods for manufacturing display devices. Background Technology

[0003] The importance of display devices has increased with the development of multimedia. Therefore, various types of display devices are now used, such as liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDs).

[0004] Portable electronic devices have become widely used recently. For example, in recent years, in addition to small electronic devices such as mobile phones, mobile electronic devices such as tablet PCs have become widely used.

[0005] Methods for forming thin films on a substrate include physical vapor deposition (PVD) methods (such as vacuum thermal evaporation or electron beam evaporation). To perform such a deposition method, the substrate needs to be fixed to a chuck plate such that the surface of the substrate on which the thin film is deposited faces downwards.

[0006] The information disclosed in this background section is only for understanding the background art of the inventive concept, and therefore may contain information that does not constitute prior art. Summary of the Invention

[0007] The applicant recognizes that the reliability of the display device is hampered by the conventional equipment and methods used to manufacture the display device, which may damage the display device and / or allow foreign matter to become attached to the substrate of the display device.

[0008] The apparatus and method for manufacturing a display device, constructed according to the principles and exemplary embodiments of the invention, can produce display devices with relatively high reliability and yield. The apparatus and method minimize damage to the substrate of the display device when it is attached to a chuck plate and reduce the ability of foreign matter to adhere to the upper surface of the substrate during manufacturing. For example, exemplary embodiments of the invention can prevent and / or reduce damage to the display device and the substrate by using one or more electrostatic chucks to secure the substrate to a support plate of the apparatus, with the electrostatic chucks contacting the lower surface of the substrate rather than the upper surface of the substrate on which elements of the display device will be formed. Furthermore, this configuration prevents foreign matter from adhering to the upper surface of the substrate.

[0009] Additional features of the inventive concept will be set forth in the following description and will be apparent in part from the description or may be learned by practice of the inventive concept.

[0010] According to one aspect of the invention, an apparatus for manufacturing a display device includes: a first housing having a first chamber; a support member disposed in the first chamber and including a frame having a plurality of openings; a plurality of adhesive patterns disposed on the frame; and a plurality of electrostatic supports superimposed on the plurality of openings and supported for reciprocating movement in corresponding openings of the plurality of openings.

[0011] Multiple adhesive patterns may include pressure-sensitive chucks spaced apart from each other, and the upper surfaces of the pressure-sensitive chucks may be positioned in substantially the same plane.

[0012] Pressure-sensitive chucks can have essentially the same shape and size.

[0013] Multiple electrostatic supports may include a first electrostatic support extending in a first direction and a second electrostatic support extending in a second direction intersecting the first direction.

[0014] The device may further include one or more lifting devices that move multiple electrostatic supports through the opening. The upper surfaces of the multiple electrostatic supports may be configured to move within the opening while maintaining substantially the same plane.

[0015] The electrostatic support may include multiple electrostatic chucks, and one or more lifting devices may be combined with multiple electrostatic chucks.

[0016] The device may further include: a control unit that operates one or more lifting devices to reciprocate multiple electrostatic supports through multiple openings, such that a target substrate to be mounted on the multiple electrostatic supports is pressed against the upper surface of the adhesive pattern.

[0017] The device may also include a movable support member that supports the support member. The movable support member may include one or more lifting devices that move the support member in a direction substantially perpendicular to the surfaces of the plurality of electrostatic supports.

[0018] The device may further include: a second housing having a second chamber spatially connected to the first chamber; and a substrate processing apparatus disposed in the second chamber.

[0019] The substrate processing apparatus may include a deposition source having material to be deposited and a nozzle for spraying material from the deposition source.

[0020] The support member may include a chuck plate, which includes a first region and a second region surrounding the first region. Material is deposited in the first region by a substrate processing device, and multiple adhesive patterns may be disposed in the second region.

[0021] According to another aspect of the invention, a method for manufacturing a display device includes the following steps: preparing a target substrate, a support plate including a frame and an opening defined in the frame, a plurality of adhesive patterns disposed on the frame, and an electrostatic support member superimposed on the opening and located above the support plate; placing and fixing the target substrate on the electrostatic support member; and moving the electrostatic support member toward the opening such that the target substrate is attached to the frame of the support plate via the adhesive patterns.

[0022] The step of placing and securing the target substrate onto the electrostatic support may include applying a voltage to the electrostatic support.

[0023] The step of placing and fixing the target substrate on the electrostatic support may further include generating a vacuum atmosphere in a first chamber in which the first housing on which the target substrate and the electrostatic support are disposed.

[0024] The method may further include the following steps: preparing a deposition apparatus in a second chamber of a second housing; moving a support plate attached to a target substrate to the second chamber; depositing a deposition material on the target substrate; moving the support plate to a first chamber; placing the support plate on an electrostatic support; and separating the target substrate from the adhesive pattern by lifting the electrostatic support.

[0025] The electrostatic support may include an electrostatic chuck, and the step of moving the electrostatic support may include stopping the application of voltage to the electrostatic chuck.

[0026] The steps of moving the electrostatic support may include using a lifting device located below the electrostatic support to lower it.

[0027] The support plate may include a chuck plate, and the step of moving the electrostatic support may include attaching the target substrate to an adhesive pattern including a pressure-sensitive chuck.

[0028] The method may further include the following steps: after attaching the target substrate to the pressure-sensitive chuck, further lowering the electrostatic support so that the upper surface of the electrostatic support is positioned below the rear surface of the chuck plate.

[0029] Further steps to reduce the static electricity support may include reducing the static electricity support so that the target substrate is locally bent around the opening of the chuck plate.

[0030] It will be understood that the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed invention. Attached Figure Description

[0031] The accompanying drawings are included to provide a further understanding of the invention. The drawings are incorporated in and form part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the description, serve to explain the inventive concept.

[0032] Figure 1 This is a schematic diagram of an exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the invention.

[0033] Figure 2 yes Figure 1 A perspective view of a portion of an exemplary embodiment of the clamping device.

[0034] Figure 3 yes Figure 2 A plan view of the clamping device.

[0035] Figure 4 It is along Figure 3 A sectional view taken from line IV-IV'.

[0036] Figure 5 This is a flowchart illustrating an exemplary embodiment of a method for manufacturing a display device based on the principles of the invention.

[0037] Figures 6 to 12 Is Figure 5 The diagram shows some of the process steps of the method used to manufacture display devices.

[0038] Figure 13 This is a schematic diagram of another exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the invention.

[0039] Figure 14 This is a schematic diagram of yet another exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the invention. Detailed Implementation

[0040] In the following description, numerous specific details are set forth for illustrative purposes to provide a thorough understanding of various exemplary embodiments or implementations of the invention. As used herein, “embodiment” and “implementation” are interchangeable terms and are non-limiting examples of apparatus or methods employing one or more inventive concepts disclosed herein. However, it will be apparent that various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, well-known structures and apparatuses are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Furthermore, the various exemplary embodiments may be different, but are not necessarily exclusive. For example, a particular shape, construction, and characteristic of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0041] Unless otherwise stated, the exemplary embodiments shown are to be understood as providing exemplary features of different details of some ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise stated, features, components, modules, layers, films, panels, regions and / or aspects (hereinafter individually or collectively referred to as “elements”) of various embodiments may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0042] The use of crosshairs and / or shading in the accompanying drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the specific material, material properties, size, scale, commonalities between the elements shown, or any other characteristics, properties, etc. Furthermore, in the drawings, the dimensions and relative dimensions of elements may be exaggerated for clarity and / or descriptive purposes. A particular process sequence may be performed differently than the described sequence when exemplary embodiments can be implemented differently. For example, two consecutively described processes may be performed substantially simultaneously or in the reverse order of the described sequence. Additionally, the same reference numerals denote the same elements.

[0043] When a component or layer is referred to as being "on," "connected to," or "bonded to" another component or layer, the component or layer may be directly on, connected to, or bonded to the other component or layer, or there may be intermediate components or layers present. However, when a component or layer is referred to as being "directly on," "directly connected to," or "directly bonded to" another component or layer, there are no intermediate components or layers present. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without intermediate components. Furthermore, the DR1, DR2, and DR3 axes are not limited to the three axes of a Cartesian coordinate system (such as the x, y, and z axes) and can be interpreted in a broader sense. For example, the DR1, DR2, and DR3 axes can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z (species / man)” and “at least one selected from the group consisting of X, Y, and Z (species / man)” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XYY, YZ, and ZZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0044] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, without departing from the publicly stated teachings, the first element discussed below may be referred to as the second element.

[0045] Spatial relative terms such as “below,” “under,” “below,” “down,” “above,” “above,” “higher,” and “side” (e.g., as in “sidewall”) may be used herein for descriptive purposes and thereby describe the relationship of one element to another (or other) elements as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the drawings is flipped, an element described as “below” or “under” other elements or features would subsequently be positioned “above” other elements or features. Thus, the exemplary term “below” can encompass both above and below orientations. Furthermore, the device may be otherwise positioned (e.g., rotated 90 degrees or in other orientations), and thus, the spatial relative descriptive terms used herein are interpreted accordingly.

[0046] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “the” are intended to include the plural forms as well. Furthermore, when the terms “comprising” and variations thereof, “including” and / or variations thereof are used in this specification, it indicates the presence of the stated features, integrals, steps, operations, elements, components, and / or groups thereof, but does not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. It should also be noted that, as used herein, the terms “substantially,” “about,” and other similar terms are used as approximate terms rather than terms of degree, and are thus used to interpret the inherent biases in measurements, calculated values, and / or provided values ​​that will be recognized by those skilled in the art.

[0047] Various exemplary embodiments are described herein with reference to cross-sectional and / or exploded views as schematic illustrations of idealized exemplary embodiments and / or intermediate structures. Thus, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances will be expected. Therefore, the exemplary embodiments disclosed herein should not necessarily be interpreted as limited to the shapes specifically shown for the regions, but rather include deviations in shape due to, for example, manufacturing processes. In this way, the regions shown in the figures can be essentially schematic, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and are thus not intended to be limiting.

[0048] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure is a part. Terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formalized sense unless expressly defined herein.

[0049] Figure 1 This is a schematic diagram of an exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the invention. Figure 2 yes Figure 1 A perspective view of a portion of an exemplary embodiment of the clamping device. Figure 3 yes Figure 2 A plan view of the clamping device. Figure 4 It is along Figure 3 A sectional view taken from line IV-IV'.

[0050] Figures 1 to 4 The apparatus 1 for manufacturing a display device may include a movable support in the form of a clamping device CD and a substrate processing apparatus. The clamping device CD may be a means for securing a target substrate SUB to a support member (or support plate) in the form of a chuck plate CP, and the substrate processing apparatus may be a means for performing manufacturing processes on the target substrate SUB mounted on the chuck plate CP via the clamping device CD. The substrate processing apparatus may be, for example, a deposition apparatus (such as...) Figure 1 The apparatus includes a deposition apparatus (DD), an etching apparatus, a cleaning apparatus, a heat treatment apparatus, a laser processing apparatus, a coating apparatus, an inspection apparatus, etc., but exemplary embodiments are not limited thereto. In the illustrated embodiment, the deposition apparatus (DD) for depositing a thin film on a target substrate (SUB) is shown as an example of a substrate processing apparatus.

[0051] The deposition apparatus DD can be an apparatus used in a process for manufacturing a display device. For example, the deposition apparatus DD can be used in a process for forming multiple thin films included in a liquid crystal display, field emission display, plasma display, and electroluminescent display.

[0052] The target substrate SUB can be an insulating substrate or a substrate comprising multiple thin film structures disposed on an insulating substrate. The target substrate SUB may include an upper surface SUBa and a rear surface SUBb opposite to the upper surface SUBa, wherein a thin film is formed on the upper surface SUBa in a deposition apparatus DD by depositing a material thereon.

[0053] Examples of methods for forming thin films on a target substrate SUB include physical vapor deposition (PVD) methods (such as vacuum evaporation, ion plating, and sputtering) and chemical vapor deposition (CVD) methods via gas reactions. Vacuum evaporation methods will be described below, but exemplary embodiments of the deposition apparatus DD are not limited thereto.

[0054] The deposition apparatus DD may include a deposition source DC in which the material to be deposited is stored and a nozzle NZ having a channel through which the material to be deposited is injected. A storage space containing the material to be deposited may be formed inside the deposition source DC. For example, the material to be deposited may be an organic material. Specifically, the material to be deposited may include organic light-emitting materials for organic light-emitting displays, hole injection / hole transport materials, and electron injection / electron transport materials. The material to be deposited, as an organic material, may be evaporated and then discharged through the nozzle NZ toward the target substrate SUB. Examples of methods for evaporating the material to be deposited include heating. For example, a heating coil may be formed on the inner wall of the deposited material, and an electric current may be applied to the heating coil to generate heat. However, methods for evaporating the material to be deposited are not limited to heating.

[0055] The first housing may have a loading chamber CH1, and the second housing may have a deposition chamber CH2. The clamping device CD and the deposition device DD may be positioned in different chambers. For example, the clamping device CD may be positioned in the loading chamber CH1, and the deposition device DD may be positioned in the deposition chamber CH2. The internal space of the loading chamber CH1 may be defined as a loading space LS, and the internal space of the deposition chamber CH2 may be defined as a deposition space DS. Furthermore, the loading space LS and the deposition space DS may be spatially connected to each other via a connecting space CS provided between the loading space LS and the deposition space DS. The connecting space CS may be the internal space of a connecting chamber CH3. The connecting space CS is a connecting channel through which a chuck plate CP, carrying a target substrate SUB in the loading space LS, moves to the deposition space DS. In the deposition space DS, a chuck plate CP carrying a target substrate SUB on which deposition material will be deposited moves to the loading space LS via the connecting channel formed by the connecting space CS.

[0056] The apparatus 1 for manufacturing a display device may include a first door G1 and a second door G2. The first door G1 is disposed on one side (e.g., the left side) of the loading space LS in a direction opposite to the first direction DR1 and is configured to allow the target substrate SUB to be pulled in or out from the outside. The second door G2 is disposed on the other side (e.g., the right side) of the loading space LS in the first direction DR1. For example, the second door G2 is configured to face the loading space LS in a direction opposite to the first direction DR1 and is connected to the connection space CS. The door can be flipped so that the second door G2 can be configured to face the connection space CS in the first direction DR1.

[0057] The apparatus 1 for manufacturing a display device may further include a third gate G3 disposed on the first direction DR1 between the connecting space CS and the deposition space DS. The third gate G3 may be disposed on one side (e.g., the left side) of the deposition space DS in a direction opposite to the first direction DR1.

[0058] In the deposition process, a vacuum atmosphere can be formed in the loading space LS and the deposition space DS to prevent foreign matter from adhering to the target substrate SUB and to stably deposit the material to be deposited. For this purpose, the apparatus 1 for manufacturing a display device may further include vacuum pumps VM1 and VM2, and vacuum tubes VP1 and VP2. Vacuum pumps VM1 and VM2 may include a first vacuum pump VM1 providing a vacuum atmosphere in the loading space LS and a second vacuum pump VM2 providing a vacuum atmosphere in the deposition space DS. The first vacuum pump VM1 can be connected to the loading space LS via a first vacuum tube VP1, and the second vacuum pump VM2 can be connected to the deposition space DS via a second vacuum tube VP2. Figure 1 The illustration shows that a vacuum atmosphere is provided in the loading space LS and the deposition space DS by two different vacuum pumps VM1 and VM2, but the exemplary embodiment is not limited thereto, and a vacuum atmosphere can also be provided in the loading space LS and the deposition space DS by a single vacuum pump.

[0059] The clamping device CD may include a chuck plate CP, a pressure-sensitive chuck PSC, an electrostatic support (which may be in the form of an electrostatic chuck ESC), a base unit BS, a support SP, and a lifting device SD.

[0060] The target substrate SUB can be mounted on the chuck plate CP. The chuck plate CP may include a plurality of openings OP passing through the chuck frame CF and the chuck frame CF surrounding the plurality of openings OP. The chuck plate CP may have a cuboid appearance, but exemplary embodiments are not limited thereto, and may have, for example, a cylindrical shape and other polygonal prism shapes.

[0061] The opening OP can be a through hole penetrating the chuck frame CF. Each opening OP can be cuboid in shape, but the exemplary embodiment is not limited thereto. Each opening OP can have substantially the same size, but the exemplary embodiment is not limited thereto. The opening OPs can have different sizes from each other. The shape and size of the opening OPs can be set differently depending on the specific design of the display device.

[0062] The chuck plate CP may include a first region superimposed on a region of the target substrate SUB where material is deposited in the deposition process, and a second region surrounding the first region and superimposed on a region of the target substrate SUB where no material is deposited. The first and second regions may be provided in the form of a deposition region DA and a non-deposition region NDA, respectively. Each opening OP may be included in the deposition region DA. The chuck frame CF located between the openings OP may be included in the non-deposition region NDA, but exemplary embodiments are not limited thereto, and may be included in the deposition region DA depending on the size, shape, or other specifications of the target substrate SUB to be mounted. For example, a portion of the chuck frame CF located between adjacent deposition regions DA may be included in the non-deposition region NDA. Another portion of the chuck frame CF located between multiple openings OP corresponding to areas in the target substrate SUB used for the same display device may be included in the deposition region DA.

[0063] An adhesive pattern, which can take the form of a pressure-sensitive adhesive chuck and / or a pressure-sensitive chuck PSC, can be formed on the chuck frame CF included in the non-deposition area NDA. The target substrate SUB mounted on the chuck plate CP can be micropatterned by performing various processes such as deposition, exposure, and etching. The pressure-sensitive chuck PSC can fix and / or attach the target substrate SUB to the chuck plate CP, ensuring that the position of the target substrate SUB remains unchanged during various processes. The pressure-sensitive chuck PSC can include pressure-sensitive pads, pressure-sensitive sheets, pressure-sensitive rubber, etc., with adhesive properties. The rear surface of the pressure-sensitive chuck PSC is fixed and / or attached to the chuck plate CP, and the upper surface of the pressure-sensitive chuck PSC can be fixed and / or attached to the target substrate SUB. The respective pressure-sensitive chuck PSCs are spaced apart from each other, and the upper surfaces of the pressure-sensitive chuck PSCs can be positioned substantially on the same plane. Furthermore, the respective pressure-sensitive chuck PSCs can have substantially the same shape and size.

[0064] When the deposition region DA includes an opening OP, multiple pressure-sensitive chucks PSCs can be disposed on the chuck frame CF surrounding the opening OP. When the deposition region DA includes multiple openings OP, the pressure-sensitive chucks PSCs may not be disposed on the portion of the chuck frame CF positioned between the openings OP. If the pressure-sensitive chucks PSCs are disposed in the deposition region DA including multiple openings OP, the pressure-sensitive material contained in the pressure-sensitive chucks PSCs melts during the high-temperature process and generates foreign matter such as spots on the target substrate SUB, causing defects in the display device. According to the principles of the invention and exemplary embodiments, the pressure-sensitive chucks PSCs may not be disposed in the deposition region DA, but rather in the non-deposition region NDA surrounding the deposition region DA, thereby avoiding the generation of foreign matter on the target substrate SUB.

[0065] In the plan view, the electrostatic chuck ESC can be disposed in each opening OP included in the chuck plate CP. The electrostatic chuck ESC can be stacked with each opening OP and can be configured to reciprocate on a third direction DR3 to pass through the opening OP. The electrostatic chuck ESC is connected to the power supply unit PW and can receive power from the power supply unit PW to use electrostatic force to attract and fix the target substrate SUB. The upper surface of the electrostatic chuck ESC can contact the rear surface SUBb of the target substrate SUB to fix the target substrate SUB. Specifically, because the voltage of the electrostatic chuck ESC causes an opposite potential to be charged into the target substrate SUB, and an attractive force is generated by the charging potential of the target substrate SUB and the voltage of the electrostatic chuck ESC, the electrostatic chuck ESC can fix the target substrate SUB when a voltage is applied to the electrostatic chuck ESC.

[0066] The electrostatic chuck (ESC) can have a substantially flat shape. The shape and size of each ESC can correspond to the shape and size of the opening (OP), and the corresponding ESC can be disposed within the opening OP. In an exemplary embodiment, the shape of the ESC is substantially the same as the shape of the opening OP, but the size of the ESC is smaller than the size of the opening OP. For example, a first width W1, which is the length of the long side of the opening OP, can be greater than a second width W2, which is the length of the long side of the ESC.

[0067] In addition, multiple electrostatic chucks (ESCs) can include those with features such as Figure 3 The electrostatic chuck ESC, as shown at ESC1, extends in the second direction DR2 and has the shape of... Figure 3 The electrostatic chuck ESC, as shown at ESC2, extends in the first direction DR1.

[0068] The lifting device SD can be attached to the lower part of the electrostatic chuck ESC and can cause the electrostatic chuck ESC to reciprocate through the opening OP on the third direction DR3. At this time, the upper surface of each electrostatic chuck ESC can move while maintaining substantially the same plane. In an exemplary embodiment, two or more lifting devices SD can be provided, and each lifting device SD can be attached to each electrostatic chuck ESC. For example, the lifting device SD may include a servo motor or a cylinder, but the exemplary embodiment is not limited thereto.

[0069] In the plan view, the electrostatic chuck ESC, stacked with the opening OP, can reciprocate back and forth through the opening OP. The upper surface of the electrostatic chuck ESC can be moved to a position below the rear surface of the chuck plate CP. Furthermore, the lower surface of the electrostatic chuck ESC can be moved to a position above the upper surface of the pressure-sensitive chuck PSC.

[0070] The operation of the lifting device SD to move the electrostatic chuck ESC on the third-party DR3 can be controlled by the control unit CT. The control unit CT can operate the lifting device SD to move the electrostatic chuck ESC through the opening OP, so that the target substrate SUB is placed on and / or pressed against the upper surface of the pressure-sensitive chuck PSC, so as to attach the target substrate SUB to the pressure-sensitive chuck PSC.

[0071] The lifting device SD can be integrated with the base unit BS located at the bottom. That is, the base unit BS can support the electrostatic chuck ESC and the lifting device SD that moves the electrostatic chuck ESC.

[0072] In an exemplary embodiment, the support member SP may be disposed on the opposite side of the base unit BS in a first direction DR1. The support member SP may support the chuck plate CP during the clamping process. The upper surface of the support member SP contacts the chuck plate CP and may include a substantially flat surface.

[0073] The apparatus 1 for manufacturing display devices can use an electrostatic chuck (ESC) to clamp (fix) a target substrate SUB onto a pressure-sensitive chuck (PSC) and / or a chuck plate (CP). The ESC contacts the rear surface (SUBb) of the target substrate SUB rather than its upper surface (SUBa), thereby preventing damage to the target substrate SUB and / or components disposed on its upper surface (SUBa). Furthermore, it can prevent and / or reduce the adhesion of foreign matter to the upper surface (SUBa) of the target substrate SUB.

[0074] Figure 5 This is a flowchart illustrating an exemplary embodiment of a method for manufacturing a display device based on the principles of the invention. Figures 6 to 12 Is Figure 5 The diagram shows some of the process steps of the method used to manufacture display devices.

[0075] In the following text, reference will be made to Figures 5 to 12 Description of use Figure 1 An exemplary method for manufacturing a display device using device 1.

[0076] Reference Figure 5 An exemplary method for manufacturing a display device may include the following steps: preparing a target substrate, a chuck plate having a pressure-sensitive chuck disposed on its upper surface, and an electrostatic chuck located above the chuck plate in a loading space (S100); placing and securing the target substrate on the electrostatic chuck (S200); attaching the target substrate to the pressure-sensitive chuck by lowering the electrostatic chuck (S300); continuing to lower the electrostatic chuck so that the upper surface of the electrostatic chuck is positioned below the rear surface of the chuck plate (S400); moving the chuck plate to a deposition space and depositing material on the target substrate in the deposition space (S500); moving the target substrate to a loading space and placing the target substrate on a support in the loading space (S600); and separating the target substrate from the pressure-sensitive chuck by raising the electrostatic chuck (S700).

[0077] First, step S100 can be performed to prepare the target substrate SUB, the chuck plate CP having a pressure-sensitive chuck PSC disposed on its upper surface, and the electrostatic chuck ESC located above the chuck plate CP in the loading chamber CH1. The loading chamber CH1, the target substrate SUB, the pressure-sensitive chuck PSC, the chuck plate CP, and the electrostatic chuck ESC have been referenced above. Figures 1 to 4 The description has been provided and will be omitted below to avoid redundancy.

[0078] Reference Figure 5 , Figure 6 and Figure 7 The process of placing and securing the target substrate SUB onto the electrostatic chuck ESC can be performed. At least a portion of the rear surface SUBb of the target substrate SUB can contact the electrostatic chuck ESC. A voltage can be applied to the electrostatic chuck ESC via the power supply unit PW. As described above, when a voltage is applied to the electrostatic chuck ESC, an electrostatic force is generated, and the target substrate SUB can be attracted to and / or secured to the electrostatic chuck ESC by the attraction force caused by the electrostatic force.

[0079] After the target substrate SUB is placed on the electrostatic chuck ESC, a vacuum atmosphere can be created in the loading space LS by the first vacuum pump VM1 while the first gate G1 and the second gate G2 are closed. All subsequent processes can be performed under a vacuum atmosphere.

[0080] When the rear surface SUBb of the target substrate SUB is fixed in contact with the electrostatic chuck ESC, step S300 can be performed to clamp and / or attach the target substrate SUB to the pressure-sensitive chuck PSC by lowering the electrostatic chuck ESC. The step of lowering the electrostatic chuck ESC can be performed by operating the lifting device SD via the control unit CT. The electrostatic chuck ESC can be lowered until the rear surface SUBb of the target substrate SUB contacts the upper surface of the pressure-sensitive chuck PSC. In this case, the upper surfaces of the electrostatic chuck ESC and the pressure-sensitive chuck PSC can be substantially on the same plane. Even after the rear surface SUBb of the target substrate SUB contacts the upper surface of the pressure-sensitive chuck PSC, the lifting device SD can push the electrostatic chuck ESC downward in the direction opposite to the third direction DR3. This allows for airtight clamping between the target substrate SUB and the pressure-sensitive chuck PSC.

[0081] Reference Figure 5 , Figure 8 and Figure 9 When the target substrate SUB is clamped and / or attached to the pressure-sensitive chuck PSC, step S400 can be performed to continue lowering the electrostatic chuck ESC so that the upper surface of the electrostatic chuck ESC is positioned below the rear surface of the chuck plate CP. This can also be performed by operating the lifting device SD via the control unit CT. At this time, the power supply unit PW can stop applying voltage to the electrostatic chuck ESC, but the exemplary embodiment is not limited thereto, and the power supply unit PW can continue to apply voltage to the electrostatic chuck ESC for airtight clamping between the target substrate SUB and the pressure-sensitive chuck PSC. Due to the voltage applied to the electrostatic chuck ESC, electrostatic force can be maintained to maintain the adhesion between the target substrate SUB and the electrostatic chuck ESC. The electrostatic chuck ESC, having electrostatic force that can serve as the adhesion between the target substrate SUB and the electrostatic chuck ESC, can press the target substrate SUB in the direction opposite to the third-party direction DR3 for airtight clamping between the target substrate SUB and the pressure-sensitive chuck PSC.

[0082] During the descent of the electrostatic chuck ESC, the lifting device SD can receive a larger load than when the voltage applied to the electrostatic chuck ESC is stopped, without ceasing the application of voltage to the electrostatic chuck ESC. Furthermore, even when the voltage application to the electrostatic chuck ESC is stopped, electrostatic force can remain between the target substrate SUB and the electrostatic chuck ESC, and the remaining electrostatic force allows the target substrate SUB to be pressed in the opposite direction to the third direction DR3 for airtight clamping between the target substrate SUB and the pressure-sensitive chuck PSC as the electrostatic chuck ESC descends.

[0083] When the upper surface of the electrostatic chuck ESC moves to a position lower than the upper surface of the pressure-sensitive chuck PSC, the target substrate SUB can be locally bent around the opening OP of the chuck plate CP due to the adhesion force with the electrostatic chuck ESC. Specifically, the area of ​​the target substrate SUB clamped to the electrostatic chuck ESC can move relative to other areas of the target substrate SUB in a direction opposite to the third direction DR3. Thus, the target substrate SUB can be pushed in a direction opposite to the third direction DR3 to perform hermetically tight clamping between the pressure-sensitive chuck PSC and the target substrate SUB.

[0084] The electrostatic chuck ESC and the target substrate SUB remain clamped until the ESC descends to a predetermined position. Then, the bent portion of the target substrate SUB can be separated and restored to its flat shape, and the ESC can continue to descend to its lower position. In subsequent processes, the chuck plate CP can be moved to one side in the first direction DR1. At this time, to facilitate the movement of the chuck plate CP, the ESC can descend until its upper surface is positioned below the rear surface of the chuck plate CP. Furthermore, the ESC can descend until its upper surface is positioned below the upper surface of the support SP.

[0085] Reference Figure 5 and Figure 10 After step S400, where the electrostatic chuck ESC is lowered to position it below the rear surface of the chuck plate CP, step S500, where the chuck plate CP is moved to the deposition space DS and material is deposited onto the target substrate SUB, can be performed. The deposition process can be performed in the deposition space DS within the deposition chamber CH2. The chuck plate CP can be transferred from the loading space LS to the deposition space DS via the transfer unit and the connection space CS. The chuck plate CP can be rotated 180° so that the upper surface SUBa of the target substrate SUB faces the deposition apparatus DD in a direction opposite to the third direction DR3. The step of rotating the chuck plate CP by 180° can be performed in the deposition space DS, but the exemplary embodiment is not limited thereto, and it can also be performed in the loading space LS or the connection space CS.

[0086] When the chuck plate CP, on which the target substrate SUB is fixed, enters the deposition space DS, a vacuum atmosphere can be generated in the deposition space DS by the second vacuum pump VM2 while the third door G3 is closed.

[0087] When a vacuum atmosphere is generated in the deposition space DS, material can be deposited on the upper surface SUBa of the target substrate SUB using the deposition apparatus DD. In an exemplary embodiment, the material to be deposited is stored in the deposition source DC of the deposition apparatus DD and then evaporated to be sprayed toward the upper surface SUBa of the target substrate SUB through the nozzle NZ.

[0088] Reference Figure 5 and Figure 11 After step S500, where material is deposited on the upper surface SUB of the target substrate SUB, step S600 can be performed to move the target substrate SUB to the loading space LS and place it on the support SP within the loading space LS. To perform another process on the target substrate SUB on which the deposition was performed, the target substrate SUB needs to be separated from the chuck plate CP. For this purpose, the chuck plate CP, on which the target substrate SUB is fixed, can return from the deposition space DS to the loading space LS. The step of separating the target substrate SUB from the chuck plate CP can be performed using a clamping device CD, but the exemplary embodiment is not limited thereto, and other devices can be used to perform the step of separating the target substrate SUB from the chuck plate CP.

[0089] When the chuck plate CP, on which the target substrate SUB is fixed, is mounted on the support member SP, the electrostatic chuck ESC can rise toward the chuck plate CP in the third direction DR3. The upper surface of the electrostatic chuck ESC can contact the rear surface SUBb of the target substrate SUB, which is substantially coplanar with the upper surface of the electrostatic chuck ESC. The lifting device SD can raise the electrostatic chuck ESC under the control of the control unit CT. A voltage can be applied to the electrostatic chuck ESC to fix the electrostatic chuck ESC to the target substrate SUB and / or to separate the target substrate SUB from the chuck plate CP. The voltage applied to the electrostatic chuck ESC can be applied before the upper surface of the electrostatic chuck ESC contacts the rear surface SUBb of the target substrate SUB, but the exemplary embodiment is not limited thereto. Furthermore, the voltage applied to the electrostatic chuck ESC can also be applied after the upper surface of the electrostatic chuck ESC contacts the rear surface SUBb of the target substrate SUB.

[0090] Reference Figure 5 and Figure 12 After performing step S600, step S700 can be performed to separate the target substrate SUB from the pressure-sensitive chuck PSC by lifting the electrostatic chuck ESC.

[0091] When the upper surface of the electrostatic chuck ESC moves to a position higher than the upper surface of the pressure-sensitive chuck PSC, the target substrate SUB can locally bend around the opening OP of the chuck plate CP due to the adhesive force between the target substrate SUB and the pressure-sensitive chuck PSC, as well as the pressure from the electrostatic chuck ESC. Specifically, the area of ​​the target substrate SUB clamped to the electrostatic chuck ESC can move relative to other areas of the target substrate SUB in the third direction DR3. This allows the target substrate SUB to be pushed in the third direction DR3, thereby weakening the adhesive force between the pressure-sensitive chuck PSC and the target substrate SUB.

[0092] The electrostatic chuck (ESC) and the target substrate (SUB) can be joined and secured together until the ESC rises to a predetermined position. Afterward, the pressure-sensitive chuck (PSC) and the target substrate (SUB) separate, allowing the bent portion of the target substrate (SUB) to return to its flat shape, and the ESC and the target substrate (SUB) can then rise to a position such that... Figure 6 The higher position shown in the diagram. At this point, the pressure-sensitive chuck PSC may not separate from the chuck plate CP. In an exemplary embodiment, the adhesion force between the pressure-sensitive chuck PSC and the chuck plate CP can be greater than the adhesion force between the pressure-sensitive chuck PSC and the target substrate SUB. Furthermore, even if the upper surface of the electrostatic chuck ESC rises while contacting the rear surface SUBb of the target substrate SUB, the chuck plate CP will not rise because the load on the chuck plate itself is greater than the adhesion force between the pressure-sensitive chuck PSC and the target substrate SUB. When the target substrate SUB separates from the pressure-sensitive chuck PSC, a voltage is continuously applied to the electrostatic chuck ESC, allowing the target substrate SUB to be stably separated while being fixed to the electrostatic chuck ESC.

[0093] In the following description, another exemplary embodiment of an apparatus for manufacturing a display device will be described. In the embodiments described below, descriptions of structures substantially the same as those described above will be omitted or simplified to avoid redundancy, and the differences will be described primarily.

[0094] Figure 13 This is a schematic diagram of another exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the invention.

[0095] Reference Figure 13 Equipment 1_1 used for manufacturing display devices and Figure 1 The difference between device 1 and device 1 is that, in the clamping device CD_1, the separate electrostatic chucks ESC_1 can be moved on the third-direction DR3 via a lifting device SD_1. In device 1_1, the electrostatic chuck ESC_1 can reciprocate within the corresponding opening OP on the third-direction DR3. The upper surface of the electrostatic chuck ESC_1 can be moved to a position lower than the rear surface of the chuck plate CP. Furthermore, the lower surface of the electrostatic chuck ESC_1 can be moved to a position higher than the upper surface of the pressure-sensitive chuck PSC. The operation of moving the electrostatic chuck ESC_1 on the third-direction DR3 by the lifting device CT can be controlled by the control unit CT.

[0096] The lifting device SD_1 can be integrated with the base unit BS located at the bottom. That is, the base unit BS can support the electrostatic chuck ESC_1 and the lifting device SD_1 that moves the electrostatic chuck ESC_1.

[0097] Device 1_1 can use an electrostatic chuck ESC_1 that contacts the rear surface SUBb of the target substrate SUB (instead of the upper surface SUBa of the target substrate SUB) to clamp (fix) the target substrate SUB onto a pressure-sensitive chuck PSC and / or a chuck plate CP, thereby preventing damage to the target substrate SUB and / or components disposed on the upper surface SUBa of the target substrate SUB. Furthermore, it can prevent and / or reduce the adhesion of foreign matter to the upper surface SUBa of the target substrate SUB.

[0098] Figure 14 This is a schematic diagram of yet another exemplary embodiment of an apparatus for manufacturing a display device constructed according to the principles of the invention.

[0099] Reference Figure 14 Equipment 1_2 used for manufacturing display devices and Figure 1 The difference of device 1 is that in the clamping device CD_2, the support SP_2 may include a first support SP1_2 and a second support SP2_2, the lifting device SD_2 is included in and / or combined with the first support SP1_2, and reciprocates on the third direction DR3 to support the chuck plate CP.

[0100] The electrostatic chuck ESC can be integrated with a second support SP2_2 located at the bottom. The second support SP2_2 supports the electrostatic chuck ESC during the clamping process. The second support SP2_2 may include wiring for applying the voltage supplied from the power supply unit PW to the electrostatic chuck ESC.

[0101] The chuck plate CP can be supported by a first support member SP1_2 located at the lower part. The chuck plate CP can be moved in a direction substantially perpendicular to the surface of the electrostatic chuck ESC (which can be a third direction DR3) by means of a lifting device SD_2 included in the first support member SP1_2. When the chuck plate CP moves in the third direction DR3, the electrostatic chuck ESC can reciprocate within the opening OP of the chuck plate CP. The rear surface of the chuck plate CP can be moved to a position higher than the upper surface of the electrostatic chuck ESC. Furthermore, the upper surface of the pressure-sensitive chuck PSC can be moved to a position lower than the lower surface of the electrostatic chuck ESC. The operation of the lifting device SD_2 to move the chuck plate CP in the third direction DR3 can be controlled by the control unit CT.

[0102] The apparatus 1_2 for manufacturing display devices can use an electrostatic chuck ESC that contacts the rear surface SUBb of the target substrate SUB (instead of the upper surface SUBa of the target substrate SUB) to clamp (fix) the target substrate SUB onto a pressure-sensitive chuck PSC and / or a chuck plate CP, thereby preventing damage to the target substrate SUB and / or components disposed on the upper surface SUBa of the target substrate SUB. Furthermore, it can prevent and / or reduce the adhesion of foreign matter to the upper surface SUBa of the target substrate SUB.

[0103] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but is limited to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those skilled in the art.

Claims

1. An apparatus for manufacturing a display device, the apparatus comprising: a first housing having a first chamber; a support member disposed in the first chamber and including a frame having a plurality of openings; a plurality of adhesive patterns disposed on the frame; a plurality of electrostatic chucks superposed with the plurality of openings; and a lifting device coupled to lower portions of the plurality of electrostatic chucks, wherein each of the plurality of electrostatic chucks is reciprocally moved in a vertical direction in a corresponding opening of the plurality of openings by the lifting device. The plurality of adhesive patterns includes pressure sensitive chucks spaced apart from each other, and upper surfaces of the pressure sensitive chucks are positioned in the same plane.

2. The apparatus of claim 1, wherein, The pressure sensitive chucks have the same shape and size.

3. The apparatus of claim 2, wherein, The plurality of electrostatic chucks includes first electrostatic chucks extending in a first direction and second electrostatic chucks extending in a second direction crossing the first direction, and a plane defined by the first and second directions is perpendicular to the vertical direction.

4. The apparatus of claim 1, wherein, 5.The apparatus of claim 1, the lifting device is provided as one or more, and wherein wherein upper surfaces of the plurality of electrostatic chucks are configured to be moved in the plurality of openings while maintaining the same plane. The plurality of electrostatic chucks includes a plurality of electrostatic chucks, and the one or more lifting devices are coupled to the plurality of electrostatic chucks.

6. The apparatus of claim 5, wherein, 7.The apparatus of claim 5, further comprising: a control unit operating the one or more lifting devices to reciprocally move the plurality of electrostatic chucks through the plurality of openings such that a target substrate to be mounted on the plurality of electrostatic chucks is pressed against upper surfaces of the plurality of adhesive patterns. 8.The apparatus of claim 1, further comprising: a movable support supporting the support member, wherein the movable support includes one or more of the lifting devices to move the support member in the vertical direction. 9.The apparatus of claim 1, further comprising: a second housing having a second chamber spatially connected with the first chamber; and a substrate processing device disposed in the second chamber. The substrate processing device includes a deposition source having a material to be deposited and a nozzle to jet the material from the deposition source. 11.The apparatus of claim 10, wherein:

10. The apparatus of claim 9, wherein, the support member includes a chuck plate including a first area and a second area surrounding the first area, the material is deposited in the first area by the substrate processing device, and the plurality of adhesive patterns are disposed in the second area. 12.A method of manufacturing a display device, the method comprising: preparing a target substrate, a support plate including a frame and openings defined in the frame, a plurality of adhesive patterns disposed on the frame, an electrostatic chuck superposed with the openings and positioned above the support plate, and a lifting device coupled to lower portions of the electrostatic chuck, placing and fixing the target substrate on the electrostatic chuck; and ​ ​ moving the electrostatic support in a vertical direction towards the opening using the lifting device such that the target substrate is attached to the frame of the support plate via the adhesive pattern.

13. The method of claim 12, wherein, The step of placing and securing the target substrate on the electrostatic support includes applying a voltage to the electrostatic support.

14. The method of claim 13, wherein, The step of placing and securing the target substrate on the electrostatic support further includes creating a vacuum atmosphere in a first chamber of a first housing in which the target substrate and the electrostatic support are disposed.

15. The method of claim 14, further comprising the steps of: preparing a deposition device in a second chamber of a second housing; moving the support plate with the target substrate attached thereto to the second chamber; depositing a deposition material on the target substrate; moving the support plate to the first chamber; placing the support plate on the electrostatic support; and separating the target substrate from the adhesive pattern by lifting the electrostatic support. The electrostatic support includes an electrostatic chuck, and the step of moving the electrostatic support includes stopping the application of voltage to the electrostatic chuck.

16. The method of claim 13, wherein, The step of moving the electrostatic support towards the opening includes lowering the electrostatic support using the lifting device.

17. The method of claim 12, wherein, The support plate includes a chuck plate, and the step of moving the electrostatic support includes attaching the target substrate to the adhesive pattern that includes a pressure sensitive chuck.

18. The method of claim 17, wherein, 19. The method of claim 18, further comprising the steps of: after attaching the target substrate to the pressure sensitive chuck, further lowering the electrostatic support such that an upper surface of the electrostatic support is positioned below a rear surface of the chuck plate. The step of further lowering the electrostatic support further includes lowering the electrostatic support such that the target substrate is locally bent around the opening of the chuck plate.

20. The method of claim 19, wherein, ​

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