Light-emitting device

Abstract

A light-emitting device is provided that can control multiple light-emitting elements separately without complicating the wiring structure of the substrate. In top view, a first external connection portion, a second external connection portion, and a third external connection portion are disposed between a first edge and a first light-emitting element. Each light-emitting element has a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light-emitting layer disposed between the first semiconductor layer and the second semiconductor layer, a first bonding member electrically connected to the first semiconductor layer, and a second bonding member electrically connected to the second semiconductor layer. The first bonding member of the first light-emitting element is bonded to a first wiring, the second bonding member of the first light-emitting element and the first bonding member of the second light-emitting element are bonded to a second wiring, and the second bonding member of the second light-emitting element is bonded to a third wiring.

Description

Technical Field

[0001] This invention relates to light-emitting devices. Background Technology

[0002] For example, Patent Document 1 (Japanese Patent Application Publication No. 2015-177181) discloses a light-emitting device that includes a substrate having multiple wiring layers and a plurality of semiconductor light-emitting elements mounted on the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2015-177181 Summary of the Invention

[0006] The problem that the invention will solve

[0007] The purpose of this invention is to provide a light-emitting device that can control multiple light-emitting elements separately without complicating the wiring structure of the substrate.

[0008] Methods for solving problems

[0009] According to one aspect of the present invention, a light-emitting device comprises: a substrate having a first side along a first direction and a second side along the first direction, the second direction from the first side toward the second side being orthogonal to the first direction; n light-emitting elements mounted on the substrate, including at least a first light-emitting element and a second light-emitting element, wherein n is a natural number of 2 or more; and (n+1) wirings disposed on the substrate, including at least a first wiring having a first external connection portion, a second wiring having a second external connection portion, and a third wiring having a third external connection portion. In plan view, the first light-emitting element is disposed between the first side and the second light-emitting element, and the second light-emitting element is disposed between the first light-emitting element and the second side. In plan view, the first external connection portion, the second external connection portion, and the third external connection portion are disposed between the first side and the first light-emitting element. Each light-emitting element has a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light-emitting layer disposed between the first semiconductor layer and the second semiconductor layer, a first bonding member electrically connected to the first semiconductor layer, and a second bonding member electrically connected to the second semiconductor layer. The first bonding member of the first light-emitting element is bonded to the first wiring, the second bonding member of the first light-emitting element and the first bonding member of the second light-emitting element are bonded to the second wiring, and the second bonding member of the second light-emitting element is bonded to the third wiring.

[0010] Invention Effects

[0011] According to the present invention, a light-emitting device is provided that can control multiple light-emitting elements separately without complicating the wiring structure of the substrate. Attached Figure Description

[0012] Figure 1 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the first embodiment of the present invention.

[0013] Figure 2 This is a schematic top view of the substrate and wiring in the light-emitting device according to the first embodiment of the present invention.

[0014] Figure 3 This is a schematic top view of the light-emitting element in the light-emitting device according to the first embodiment of the present invention.

[0015] Figure 4 yes Figure 3 A schematic cross-sectional view of line IV-IV.

[0016] Figure 5 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the second embodiment of the present invention.

[0017] Figure 6 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the third embodiment of the present invention.

[0018] Figure 7 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the fourth embodiment of the present invention.

[0019] Figure 8 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the fifth embodiment of the present invention.

[0020] Figure 9 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the sixth embodiment of the present invention.

[0021] Figure 10 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the seventh embodiment of the present invention.

[0022] Figure 11 This is a schematic top view of a light-emitting element according to one embodiment of the present invention.

[0023] Figure 12 yes Figure 11 A schematic cross-sectional view of line XII-XII.

[0024] Explanation of reference numerals in the attached figures

[0025] 1-3…Light-emitting device, 10…Substrate, 11…First side, 12…Second side, 21…First light-emitting element, 22…Second light-emitting element, 23…Third light-emitting element, 24…Fourth light-emitting element, 30…Supporting substrate, 31…Semiconductor laminate, 31p…First semiconductor layer, 31n…Second semiconductor layer, 31a…Light-emitting layer, 34…Reflective electrode, 37…First pad electrode, 38…Second pad electrode, 39…Third pad electrode, 41…First bonding member, 42…Second bonding member, 43…Third bonding member, 44…Fourth… 45… Fifth connecting component, 46… Sixth connecting component, 51… First wiring, 52… Second wiring, 53… Third wiring, 54… Fourth wiring, 55… Fifth wiring, 51a… First external connection, 52a… Second external connection, 53a… Third external connection, 54a… Fourth external connection, 55a… Fifth external connection, 61… First power supply terminal, 62… Second power supply terminal, 63… Third power supply terminal, 64… Fourth power supply terminal, 100… Circuit board, 200… Control element, 300… Light-emitting element Detailed Implementation

[0026] Hereinafter, the embodiments will be described with reference to the accompanying drawings. Furthermore, in each of the drawings, the same reference numerals are used to label the same components.

[0027] <First Implementation>

[0028] Figure 1 This is a schematic top view showing the configuration of the main components in the light-emitting device 1 according to the first embodiment of the present invention.

[0029] The light-emitting device 1 includes a substrate 10, n (n is a natural number of 2 or more) light-emitting elements mounted on the substrate 10, and (n+1) wirings disposed on the substrate 10. Figure 1 The example shown is n=2. Two light-emitting elements (first light-emitting element 21 and second light-emitting element 22) are mounted on a substrate 10, and three wirings (first wiring 51, second wiring 52 and third wiring 53) are provided on the substrate 10.

[0030] The substrate 10 is mounted on the circuit board 100. Figure 1 An example is shown where four substrates 10 are mounted on a circuit board 100. Each of the four substrates 10 has two light-emitting elements mounted on it and three wirings.

[0031] Figure 2 This is a schematic top view of the substrate 10 and the wiring (first wiring 51, second wiring 52 and third wiring 53) provided on the substrate 10.

[0032] The substrate 10 is an insulating substrate, such as an aluminum nitride (AlN) substrate. The substrate 10 has a first side 11 along a first direction X and a second side 12 along the first direction X. A second direction Y from the first side 11 toward the second side 12 is orthogonal to the first direction X. The side along the first direction X includes a portion parallel to the first direction X. The side along the second direction Y includes a portion parallel to the second direction Y.

[0033] The first wiring 51, the second wiring 52, and the third wiring 53 are metal components. The outermost surfaces of the first wiring 51, the second wiring 52, and the third wiring 53 may contain, for example, gold (Au) or copper (Cu). The first wiring 51, the second wiring 52, and the third wiring 53 are separated from each other on the substrate 10.

[0034] The first wiring 51 has a first external connection portion 51a located on the first side 11 of the substrate 10. The second wiring 52 has a second external connection portion 52a located on the first side 11 of the substrate 10. The third wiring 53 has a third external connection portion 53a located on the first side 11 of the substrate 10.

[0035] exist Figure 1 In the top view shown, the first light-emitting element 21 is disposed between the first side 11 of the substrate 10 and the second light-emitting element 22, and the second light-emitting element 22 is disposed between the first light-emitting element 21 and the second side 12 of the substrate 10. Figure 1 In the top view shown, the first external connection portion 51a of the first wiring 51, the second external connection portion 52a of the second wiring 52, and the third external connection portion 53a of the third wiring 53 are disposed between the first side 11 of the substrate 10 and the first light-emitting element 21. In the first direction X, the second external connection portion 52a is disposed between the first external connection portion 51a and the third external connection portion 53a.

[0036] like Figure 2 As shown, the second wiring 52 has a rectangular first portion 52b extending from the second external connection portion 52a in the second direction Y, a rectangular second portion 52c extending from the first portion 52b in the first direction X, and a rectangular third portion 52d extending from the second portion 52c in the second direction Y. Figure 2In the diagram, dashed lines virtually represent the boundaries between the first part 52b and the second part 52c, as well as the boundary between the second part 52c and the third part 52d. One end of the second part 52c in the first direction X is positioned in the second direction Y, adjacent to the first part 52b. The other end of the second part 52c in the first direction X is positioned in the second direction Y, adjacent to the third part 52d and the first wiring 51. One end of the second part 52c in the first direction X is adjacent to the first part 52b in the second direction Y. The other end of the second part 52c in the first direction X is adjacent to the third part 52d in the second direction Y.

[0037] like Figure 2 As shown, the third wiring 53 has a rectangular first portion 53b extending from the third external connection portion 53a in the second direction Y, and a rectangular second portion 53c extending from the first portion 53b in the first direction X. Figure 2 In the diagram, the boundary between the first portion 53b and the second portion 53c is virtually represented by dashed lines. In the second portion 53c, one end in the first direction X is positioned in the second direction Y, aligned with the first portion 53b. The other end in the second portion 53c is positioned in the second direction Y, aligned with the first portion 52b of the second wiring 52.

[0038] Next, the light-emitting element will be explained.

[0039] Figure 3 This is a schematic top view of the first light-emitting element 21. Figure 4 yes Figure 3 A schematic cross-sectional view along line IV-IV.

[0040] In the following explanation, the first conductivity type will be p-type and the second conductivity type will be n-type. Alternatively, the first conductivity type can be n-type and the second conductivity type can be p-type.

[0041] like Figure 4 As shown, the first light-emitting element 21 has a support substrate 30 and a semiconductor laminate 31. The semiconductor laminate 31 is grown on the support substrate 30. The support substrate 30 is, for example, a sapphire substrate. The semiconductor laminate 31 includes, for example, a nitride semiconductor layer. The shape of the first light-emitting element 21 in top view is, for example, rectangular. When the shape of the first light-emitting element 21 in top view is rectangular, the length of one side is, for example, more than 500 μm and less than 1500 μm.

[0042] The semiconductor stack 31 has a p-type first semiconductor layer 31p, an n-type second semiconductor layer 31n, and a light-emitting layer 31a disposed between the first semiconductor layer 31p and the second semiconductor layer 31n. On the support substrate 30, the second semiconductor layer 31n, the light-emitting layer 31a, and the first semiconductor layer 31p are sequentially disposed from the support substrate 30 side.

[0043] The second semiconductor layer 31n has multiple conductive portions 32. The conductive portions 32 do not have a light-emitting layer 31a or a first semiconductor layer 31p. The conductive portions 32 have a circular shape when viewed from above.

[0044] The first light-emitting element 21 also includes a reflective electrode 34, a first pad electrode 37, a second pad electrode 38, a third pad electrode 39, a first bonding component 41, a second bonding component 42, a third bonding component 43, a first insulating film 35, and a second insulating film 36.

[0045] The second light-emitting element 22 has the same configuration as the first light-emitting element 21. Furthermore, in the second light-emitting element 22, the configuration corresponding to the third bonding member 43 of the first light-emitting element 21 is designated as the fourth bonding member 44. The third bonding member 43 and the fourth bonding member 44 have the same configuration. That is, the second light-emitting element 22 includes a support substrate 30, a semiconductor laminate 31, a reflective electrode 34, a first pad electrode 37, a second pad electrode 38, a third pad electrode 39, a first bonding member 41, a second bonding member 42, a fourth bonding member 44, a first insulating film 35, and a second insulating film 36. The shape of the second light-emitting element 22 when viewed from above is, for example, rectangular. When the shape of the second light-emitting element 22 when viewed from above is rectangular, the length of one side is, for example, 500 μm or more and 1500 μm or less.

[0046] A reflective electrode 34 is disposed on the surface of the first semiconductor layer 31p and connected to the first semiconductor layer 31p. The reflective electrode 34 may contain, for example, silver (Ag). A first insulating film 35 is disposed on the surface of the first semiconductor layer 31p to cover the reflective electrode 34. The first insulating film 35 may be, for example, a silicon nitride film.

[0047] The second insulating film 36 covers the first insulating film 35. Furthermore, the second insulating film 36 covers the side surface of the light-emitting layer 31a and the side surface of the first semiconductor layer 31p.

[0048] A portion of the first pad electrode 37, a portion of the second pad electrode 38, and a portion of the third pad electrode 39 are disposed on the second insulating film 36. The first pad electrode 37, the second pad electrode 38, and the third pad electrode 39 are separated from each other on the second insulating film 36. The first pad electrode 37, the second pad electrode 38, and the third pad electrode 39 may contain, for example, aluminum (Al).

[0049] A portion of the first insulating film 35 and a portion of the second insulating film 36, located in the region overlapping with the reflective electrode 34, have openings that expose a portion of the reflective electrode 34. A portion of the first pad electrode 37 is connected to the reflective electrode 34 through the openings that expose a portion of the reflective electrode 34.

[0050] An opening is formed in a portion of the second insulating film 36 covering the conductive portion 32, exposing a portion of the conductive portion 32. A portion of the second pad electrode 38 is connected to the conductive portion 32 through the opening exposing a portion of the conductive portion 32. The second pad electrode 38 is connected to the second semiconductor layer 31n.

[0051] The third pad electrode 39 is disposed in the region overlapping with the reflective electrode 34 via the first insulating film 35 and the second insulating film 36. The first insulating film 35 and the second insulating film 36 are disposed between the third pad electrode 39 and the reflective electrode 34. The third pad electrode 39 is not connected to the reflective electrode 34.

[0052] Multiple first bonding components 41 are bonded to the first pad electrode 37. Figure 3 In the example shown, four first engaging parts 41 are arranged along the second direction Y. Additionally, in the top view of this application, the first engaging parts 41 are represented by circles with a shading pattern.

[0053] The first bonding component 41 is electrically connected to the first semiconductor layer 31p via the first pad electrode 37 and the reflective electrode 34.

[0054] Multiple second bonding components 42 are bonded to the second pad electrode 38. Figure 3 In the example shown, four second engaging members 42 are arranged along the second direction Y. In the top view of this application, the second engaging members 42 are represented by circles with a dotted pattern applied.

[0055] The second bonding component 42 is electrically connected to the second semiconductor layer 31n via the second pad electrode 38 and the conductive portion 32.

[0056] Multiple third bonding components 43 (fourth bonding components 44) are bonded to the third bonding pad electrode 39. Figure 3 In the example shown, four third bonding members 43 (fourth bonding members 44) are arranged along the second direction Y. The third bonding members 43 (fourth bonding members 44) are electrically insulated from the semiconductor stack 31.

[0057] In the first direction X, the second engaging member 42 is disposed between the first engaging member 41 and the third engaging member 43 (fourth engaging member 44).

[0058] The first bonding member 41, the second bonding member 42, and the third bonding member 43 (fourth bonding member 44) are bumps, spherical conductive members, or columnar conductive members formed by plating. The first bonding member 41, the second bonding member 42, and the third bonding member 43 (fourth bonding member 44) may contain, for example, gold or tin.

[0059] With the first light-emitting element 21 and the second light-emitting element 22 mounted on the substrate 10, the first light-emitting element 21 and the second light-emitting element 22 are disposed between the substrate 10 and the support substrate 30. When viewed from above, the shortest distance between the first light-emitting element 21 and the second light-emitting element 22 is, for example, more than 50 μm and less than 120 μm.

[0060] like Figure 1 As shown, the first bonding component 41 of the first light-emitting element 21 is bonded to the first wiring 51.

[0061] The second bonding member 42 of the first light-emitting element 21 and the first bonding member 41 of the second light-emitting element 22 are bonded to the second wiring 52. The second bonding member 42 of the first light-emitting element 21 is bonded to the first portion 52b of the second wiring 52. The first bonding member 41 of the second light-emitting element 22 is bonded to the third portion 52d of the second wiring 52.

[0062] The third bonding member 43 of the first light-emitting element 21, the second bonding member 42 of the second light-emitting element 22, and the fourth bonding member 44 are bonded to the third wiring 53. The third bonding member 43 of the first light-emitting element 21 is bonded to the first portion 53b of the third wiring 53. The second bonding member 42 and the fourth bonding member 44 of the second light-emitting element 22 are bonded to the second portion 53c of the third wiring 53.

[0063] When viewed from above, the second portion 52c of the second wiring 52 is located between the first light-emitting element 21 and the second light-emitting element 22.

[0064] The configuration of the first bonding member 41 of the first light-emitting element 21 is the same as that of the first bonding member 41 of the second light-emitting element 22. The configuration of the second bonding member 42 of the first light-emitting element 21 is the same as that of the second bonding member 42 of the second light-emitting element 22. The configuration of the third bonding member 43 of the first light-emitting element 21 is the same as that of the fourth bonding member 44 of the second light-emitting element 22.

[0065] The first bonding member 41 of the first light-emitting element 21 and the first bonding member 41 of the second light-emitting element 22 are arranged along the second direction Y. The second bonding member 42 of the first light-emitting element 21 and the second bonding member 42 of the second light-emitting element 22 are arranged along the second direction Y. The third bonding member 43 of the first light-emitting element 21 and the fourth bonding member 44 of the second light-emitting element 22 are arranged along the second direction Y.

[0066] exist Figure 1 In the example shown, four substrates 10 are arranged along the first direction X on the circuit board 100, four first light-emitting elements 21 are arranged along the first direction X on the circuit board 100, and four second light-emitting elements 22 are arranged along the first direction X on the circuit board 100. Furthermore, the number of substrates 10, first light-emitting elements 21, and second light-emitting elements 22 disposed on the circuit board 100 is not limited to... Figure 1 The quantity shown.

[0067] A first power supply terminal 61, a second power supply terminal 62, a third power supply terminal 63, and a fourth power supply terminal 64 are provided on the circuit board 100. The first power supply terminal 61, the second power supply terminal 62, the third power supply terminal 63, and the fourth power supply terminal 64 are formed as conductor patterns on the circuit board 100.

[0068] Additionally, a control element 200 is mounted on the circuit board 100. The control element 200 controls the driving of a plurality of light-emitting elements 21, 22 disposed on the circuit board 100. Each of the first power supply terminal 61, the second power supply terminal 62, the third power supply terminal 63, and the fourth power supply terminal 64 is electrically connected to the control element 200 via a conductive component 72. The conductive component 72 is, for example, a metal wire or a conductor pattern formed on the circuit board 100.

[0069] Multiple power supply terminals 61, 62, 63, and 64 are disposed between the first side 11 of the substrate 10 and the control element 200. The multiple power supply terminals 61, 62, 63, and 64 are arranged along a first direction X. At one end of the arrangement of the multiple power supply terminals 61, 62, 63, and 64 ( Figure 1 The left end of the middle is provided with a first power supply terminal 61, and the other end ( Figure 1 The right end of the middle is equipped with a fourth power supply terminal 64.

[0070] Configured at one end in the first direction X ( Figure 1 The first external connection portion 51a of the first wiring 51 (at the left end) is electrically connected to the first power supply terminal 61 by means of a conductive member 71. The conductive member 71 is, for example, a metal wire or a conductor pattern formed on the circuit board 100.

[0071] Configured at the other end of the first direction X ( Figure 1The third external connection portion 53a of the third wiring 53 (at the right end of the middle) is electrically connected to the fourth power supply terminal 64 by means of a conductive member 71.

[0072] Each of the second external connection portions 52a of the second wiring 52 is electrically connected to the second power supply terminal 62 via a conductive member 71.

[0073] The third external connection portion 53a and the first external connection portion 51a, which are adjacent in the first direction X, are electrically connected to the common third power supply terminal 63 by means of the conductive member 71.

[0074] The second wiring 52 connects the second bonding component 42, which is electrically connected to the n-type second semiconductor layer 31n of the first light-emitting element 21, and the first bonding component 41, which is electrically connected to the p-type first semiconductor layer 31p of the second light-emitting element 22. Thus, the first light-emitting element 21 and the second light-emitting element 22, which are mounted on a substrate 10, are connected in series with each other.

[0075] In addition, the n-type second semiconductor layer 31n of the second light-emitting element 22 of one of the two adjacent substrates 10 in the first direction X and the p-type first semiconductor layer 31p of the first light-emitting element 21 of the other substrate 10 are electrically connected via a third wiring 53 and a third power supply terminal 63 on one substrate 10 and a first wiring 51 on the other substrate 10.

[0076] That is, multiple light-emitting elements 21 and 22 on the circuit board 100 are connected in series using multiple wirings 51, 52, and 53 and multiple power supply terminals 61, 62, 63, and 64. Hereinafter, with reference to... Figure 1 One example is given whereby the light-emitting layer 31a of any one or more of the multiple light-emitting elements 21 and 22 emits light by imparting a potential difference between any two of the multiple power supply terminals 61, 62, 63, and 64.

[0077] exist Figure 1 In this process, by making the first power supply terminal 61 located on the left end and the second power supply terminal 62 located adjacent to the right side of the first power supply terminal 61 conductive, current can be supplied to the light-emitting layer 31a of the first light-emitting element 21 on the left end, so that the first light-emitting element 21 on the left end emits light.

[0078] exist Figure 1 In the circuit board 100, a first potential is applied to the first power supply terminal 61 located on the left end. A second potential lower than the first potential is applied to the fourth power supply terminal 64 located on the right end, causing the potentials of the other power supply terminals to fluctuate, thereby enabling current to be supplied to the light-emitting layer 31a of all light-emitting elements 21 and 22 on the circuit board 100, so that all light-emitting elements 21 and 22 emit light simultaneously.

[0079] exist Figure 1 In this process, by applying a voltage between the second power supply terminal 62, which is connected to the second external connection portion 52a disposed on the substrate 10 at the left end, and the third power supply terminal 63 disposed adjacent to the right side of the second power supply terminal 62, current can be supplied to the light-emitting layer 31a of the second light-emitting element 22 at the left end, so that the second light-emitting element 22 at the left end emits light.

[0080] exist Figure 1 In this process, by applying a voltage between the fourth power supply terminal 64 located on the right end and the second power supply terminal 62 located on the left side of the fourth power supply terminal 63, current can be supplied to the light-emitting layer 31a of the second light-emitting element 22 on the right end, so that the second light-emitting element 22 on the right end emits light.

[0081] exist Figure 1 In this process, by applying a voltage between the second power supply terminal 62, which is connected to the second external connection portion 52a on the substrate 10 at the right end, and the third power supply terminal 63, which is adjacent to the left side of the second power supply terminal 62, current can be supplied to the light-emitting layer 31a of the first light-emitting element 21 at the right end, so that the first light-emitting element 21 at the right end emits light.

[0082] By applying a voltage between the adjacent third power supply terminal 63 and the second power supply terminal 62 in the first direction X, any first light-emitting element 21 connected to the adjacent third power supply terminal 63 and the second power supply terminal 62 via the first wiring 51 and the second wiring 52, or any second light-emitting element 22 connected via the second wiring 52 and the third wiring 53, can emit light.

[0083] By applying a potential difference between any two power supply terminals that are separately arranged in the first direction X, multiple light-emitting elements 21, 22 connected in series between the two power supply terminals can be made to emit light simultaneously.

[0084] For example in Figure 1 In this process, a voltage is applied between the first power supply terminal 61 located at the left end and the second power supply terminal 62 connected to the second external connection portion 52a on the substrate 10 located second from the left. As a result, the first light-emitting element 21 at the left end, the second light-emitting element 22 at the left end, and the first light-emitting element 21 located second from the left end can emit light.

[0085] According to this embodiment, by using a simple wiring structure of (n+1) more wirings 51, 52, and 53 than the number of light-emitting elements 21 and 22 (n is a natural number greater than 2), it is possible to control the individual and simultaneous emission of multiple light-emitting elements 21 and 22. For example, compared to the case where a pair of wirings on the anode side and cathode side are provided on the substrate 10 for each light-emitting element 21 and 22, the wiring structure can be simplified.

[0086] The external connection portions 51a, 52a, and 53a of all wirings 51, 52, and 53 are disposed between the first side 11 of the substrate 10 and the first light-emitting element 21. This configuration, for example, compared to the case where multiple external connection portions are disposed to clamp the light-emitting elements 21 and 22, allows for a reduction in the overall planar size of the light-emitting device 1 while maintaining the same light-emitting area. Furthermore, by keeping the overall planar size of the light-emitting device 1 the same, the space required for disposing of the external connection portions can be reduced, thus increasing the light-emitting area compared to the reference example.

[0087] Furthermore, by arranging all external connection portions 51a, 52a, and 53a on the first side 11 of the substrate 10, the power supply terminals 61, 62, 63, and 64, as well as the control element 200, can be arranged on the first side 11, simplifying the arrangement of components on the circuit board 100. Moreover, by densely arranging multiple light-emitting elements 21 and 22, a wide light-emitting area with less brightness unevenness can be formed.

[0088] The first light-emitting element 21 has a third bonding member 43 in addition to the first bonding member 41 and the second bonding member 42 that ensure the conductivity between the semiconductor stack 31 and the wirings 51, 52, and 53. The second light-emitting element 22 has a fourth bonding member 44 in addition to the first bonding member 41 and the second bonding member 42 that ensure the conductivity between the semiconductor stack 31 and the wirings 51, 52, and 53. The third bonding member 43 and the fourth bonding member 44 enable the first light-emitting element 21 and the second light-emitting element 22 to be stably mounted on the substrate 10, and further improve the heat dissipation of the first light-emitting element 21 and the second light-emitting element 22.

[0089] <Second Implementation>

[0090] Figure 5 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the second embodiment of the present invention. (See attached image.) Figure 5 As shown, the second wiring 52 and the third wiring 53 can also be formed as lines extending along the second direction Y. In this case, the configuration of the first bonding member 41 and the second bonding member 42 in the first light-emitting element 21 and the configuration of the first bonding member 41 and the second bonding member 42 in the second light-emitting element 22 are different from those in the first embodiment.

[0091] The second bonding member 42 of the first light-emitting element 21 is disposed at the center of the first light-emitting element 21 in the first direction X. In the first direction X, the first bonding member 41 of the first light-emitting element 21 is disposed at a position closer to the end of the first light-emitting element 21 than the second bonding member 42. The first bonding member 41 of the second light-emitting element 22 is disposed at the center of the second light-emitting element 22 in the first direction X. In the first direction X, the second bonding member 42 of the second light-emitting element 22 is disposed at a position closer to the end of the second light-emitting element 22 than the first bonding member 41. Therefore, in the first light-emitting element 21 and the second light-emitting element 22, it is necessary to have different arrangements of the first pad electrode 37 bonded by the first bonding member 41 and the second pad electrode 38 bonded by the second bonding member 42.

[0092] In contrast, Figure 1 In the first embodiment shown, by making the second wiring 52 and the third wiring 53 non-linear, the configurations of the first bonding member 41 and the second bonding member 42 in the first light-emitting element 21 and the first bonding member 41 and the second bonding member 42 in the second light-emitting element 22 can be the same. That is, light-emitting elements with the same configuration of each bonding member can be shared in the first light-emitting element 21 and the second light-emitting element 22. There is no need to fabricate light-emitting elements with different configurations of each bonding member separately, thus achieving cost reduction.

[0093] In addition, Figure 1 In the first embodiment shown, the configuration of the third bonding member 43 in the first light-emitting element 21 is the same as the configuration of the fourth bonding member 44 in the second light-emitting element 22. Therefore, even when the third bonding member 43 and the fourth bonding member 44 are provided, light-emitting elements with the same configuration of each bonding member can be shared in the first light-emitting element 21 and the second light-emitting element 22.

[0094] <Third Implementation Method>

[0095] Figure 6 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the third embodiment of the present invention. Figure 6An example is shown where the second portion 52c of the second wiring 52 is located in the area overlapping with the second light-emitting element 22. The second wiring 52 is a wiring that connects the first light-emitting element 21 and the second light-emitting element 22 in series, with the second bonding member 42 of the first light-emitting element 21 and the first bonding member 41 of the second light-emitting element 22 as the bonding member. The second portion 52c is not bonded to the second bonding member 42 of the second light-emitting element 22, but instead to an electrically floating fourth bonding member 44. That is, a fourth bonding member 44 and three second bonding members 42 are arranged along the second direction Y at the central portion of the second light-emitting element 22 in the first direction X. In the first light-emitting element 21, also to make the appearance design the same as the second light-emitting element 22, a third bonding member 43 and three second bonding members 42 are arranged along the second direction Y at the central portion of the first light-emitting element 21 in the first direction X. With this configuration, and... Figure 1 Compared to the configuration of the first embodiment shown, the distance between the first light-emitting element 21 and the second light-emitting element 22 in the second direction Y can be shortened, and the overall size of the light-emitting device can be miniaturized.

[0096] exist Figure 1 In the first embodiment shown, the second portion 52c of the second wiring 52 is located between the first light-emitting element 21 and the second light-emitting element 22, and no connecting members 41, 42, 43, 44 are disposed in the second portion 52c of the second wiring 52. Figure 1 In the first embodiment shown, with Figure 6 Compared to the third embodiment shown, the number of second bonding members 42, each configured to be conductive with the semiconductor stack 31, can be increased for both the first light-emitting element 21 and the second light-emitting element 22. This improves heat dissipation from the semiconductor stack 31 and reduces resistance when supplying current to the semiconductor stack 31.

[0097] <Fourth Implementation>

[0098] Figure 7 This is a schematic top view showing the configuration of the main components in the light-emitting device 2 according to the fourth embodiment of the present invention.

[0099] In this light-emitting device 2, external connection portions 51a, 52a, and 53a are electrically connected to power supply terminals 61, 62, 63, and 64 via conductive portions 73. External connection portions 51a, 52a, and 53a are formed on the surface of the substrate 10, and portions of power supply terminals 61, 62, 63, and 64 extend from the back surface of the substrate 10. The conductive portions 73 penetrate the substrate 10, connecting the external connection portions 51a, 52a, and 53a to the power supply terminals 61, 62, 63, and 64.

[0100] <Fifth Implementation>

[0101] Figure 8 This is a schematic top view showing the configuration of the main components in the light-emitting device 3 according to the fifth embodiment of the present invention.

[0102] If Figure 1 If the components on the circuit board 100 shown (board 10, light-emitting elements 21, 22, wiring 51, 52, 53, power supply terminals 61, 62, 63, 64, conductive components 71, 72, and control element 200) are considered as a unit, then in Figure 8 In the light-emitting device 3 shown, two of the aforementioned units are disposed on the circuit board 100. The two units are arranged symmetrically along the second direction Y.

[0103] The number of light-emitting elements mounted on a substrate 10 is not limited to two, and can also be three or more. In this case, when the number of light-emitting elements on a substrate 10 is set to n, the number of wirings formed on a substrate 10 is n+1.

[0104] <Sixth Implementation Method>

[0105] Figure 9 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the sixth embodiment of the present invention. Figure 9 An example is shown where three light-emitting elements (first light-emitting element 21, second light-emitting element 22, and third light-emitting element 23) and four wirings (first wiring 51, second wiring 52, third wiring 53, and fourth wiring 54) are arranged on a substrate 10. Figure 9 The structure shown is Figure 1 Compared to the configuration shown, it also includes a third light-emitting element 23 and a fourth wiring 54. Additionally, Figure 9 The structure shown is Figure 1 Compared to the configuration shown, the third joining member 43, the fourth joining member 44, and the fifth joining member 45 are each arranged in two rows along the second direction Y.

[0106] The third light-emitting element 23 has the same configuration as the first light-emitting element 21 and the second light-emitting element 22. Figure 9 In the top view shown, the third light-emitting element 23 is disposed between the second light-emitting element 22 and the second side 12 of the substrate 10.

[0107] The fourth wiring 54 has a fourth external connection portion 54a. The first external connection portion 51a of the first wiring 51, the second external connection portion 52a of the second wiring 52, the third external connection portion 53a of the third wiring 53, and the fourth external connection portion 54a of the fourth wiring 54 are disposed between the first light-emitting element 21 and the first side 11 of the substrate 10.

[0108] In the first direction X, the second external connection portion 52a is disposed between the first external connection portion 51a and the third external connection portion 53a, and the third external connection portion 53a is disposed between the second external connection portion 52a and the fourth external connection portion 54a.

[0109] The third light-emitting element 23 has a first bonding member 41 electrically connected to the first semiconductor layer 31p and a second bonding member 42 electrically connected to the second semiconductor layer 31n. Furthermore, the third light-emitting element 23 has a fifth bonding member 45. The fifth bonding member 45 has the same configuration as the third bonding member 43 and the fourth bonding member 44, is insulated from the first semiconductor layer 31p and the second semiconductor layer 31n, and is in an electrically floating state.

[0110] The bonding components 41, 42, 43, 44, and 45 of each light-emitting element 21, 22, and 23 are configured identically. The first bonding components 41 of each light-emitting element 21, 22, and 23 are arranged in the second direction Y. The second bonding components 42 of each light-emitting element 21, 22, and 23 are arranged in the second direction Y. The third bonding component 43 of the first light-emitting element 21, the fourth bonding component 44 of the second light-emitting element 22, and the fifth bonding component 45 of the third light-emitting element 23 are arranged in the second direction Y.

[0111] A first bonding member 41 of the first light-emitting element 21 is joined to the first wiring 51. A second bonding member 42 of the first light-emitting element 21 and a first bonding member 41 of the second light-emitting element 22 are joined to the second wiring 52. A third bonding member 43 of the first light-emitting element 21, a second bonding member 42 of the second light-emitting element 22, a fourth bonding member 44, and a first bonding member 41 of the third light-emitting element 23 are joined to the third wiring 53. A third bonding member 43 of the first light-emitting element 21, a fourth bonding member 44 of the second light-emitting element 22, a second bonding member 42 of the third light-emitting element 23, and a fifth bonding member 45 are joined to the fourth wiring 54.

[0112] The first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 are connected in series between the first external connection portion 51a of the first wiring 51 and the fourth external connection portion 54a of the fourth wiring 54.

[0113] The first external connecting part 51a, the second external connecting part 52a, the third external connecting part 53a, and the fourth external connecting part 54a are connected with Figure 1 Similarly, they are electrically connected to the power supply terminal via conductive components. By applying a potential difference to any two of these external connection parts 51a, 52a, 53a, and 54a, one, two, or all of the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23 can be made to emit light.

[0114] <Seventh Implementation>

[0115] Figure 10 This is a schematic top view showing the configuration of the main components in the light-emitting device according to the seventh embodiment of the present invention. Figure 10 An example is shown where four light-emitting elements (first light-emitting element 21, second light-emitting element 22, third light-emitting element 23, and fourth light-emitting element 24) and five wirings (first wiring 51, second wiring 52, third wiring 53, fourth wiring 54, and fifth wiring 55) are arranged on a substrate 10. Figure 10 The structure shown is Figure 9 Compared to the configuration shown, it also includes a fourth light-emitting element 24 and a fifth wiring 55. Additionally, Figure 10 The structure shown is Figure 9 Compared to the configuration shown, the third joining member 43, the fourth joining member 44, the fifth joining member 45 and the sixth joining member 46 are each arranged in three rows along the second direction Y.

[0116] The fourth light-emitting element 24 has the same configuration as the first light-emitting element 21, the second light-emitting element 22, and the third light-emitting element 23. Figure 10 In the top view shown, the fourth light-emitting element 24 is disposed between the third light-emitting element 23 and the second side 12 of the substrate 10.

[0117] The fifth wiring 55 has a fifth external connection portion 55a. The first external connection portion 51a of the first wiring 51, the second external connection portion 52a of the second wiring 52, the third external connection portion 53a of the third wiring 53, the fourth external connection portion 54a of the fourth wiring 54, and the fifth external connection portion 55a of the fifth wiring 55 are disposed between the first light-emitting element 21 and the first side 11 of the substrate 10.

[0118] In the first direction X, the second external connection portion 52a is disposed between the first external connection portion 51a and the third external connection portion 53a, the third external connection portion 53a is disposed between the second external connection portion 52a and the fourth external connection portion 54a, and the fourth external connection portion 54a is disposed between the third external connection portion 53a and the fifth external connection portion 55a.

[0119] The fourth light-emitting element 24 also has a first bonding member 41 electrically connected to the first semiconductor layer 31p and a second bonding member 42 electrically connected to the second semiconductor layer 31n. Furthermore, the fourth light-emitting element 24 has a sixth bonding member 46. The sixth bonding member 46 has the same configuration as the third bonding member 43, the fourth bonding member 44, and the fifth bonding member 45, is insulated from the first semiconductor layer 31p and the second semiconductor layer 31n, and is in an electrically floating state.

[0120] The bonding components 41, 42, 43, 44, 45, and 46 of each light-emitting element 21, 22, 23, and 24 are configured identically. The first bonding components 41 of each light-emitting element 21, 22, 23, and 24 are arranged in the second direction Y. The second bonding components 42 of each light-emitting element 21, 22, 23, and 24 are arranged in the second direction Y. The third bonding component 43 of the first light-emitting element 21, the fourth bonding component 44 of the second light-emitting element 22, the fifth bonding component 45 of the third light-emitting element 23, and the sixth bonding component 46 of the fourth light-emitting element 24 are arranged in the second direction Y.

[0121] A first bonding member 41 of the first light-emitting element 21 is joined to the first wiring 51. A second bonding member 42 of the first light-emitting element 21 and a first bonding member 41 of the second light-emitting element 22 are joined to the second wiring 52. A third bonding member 43 of the first light-emitting element 21, a second bonding member 42 of the second light-emitting element 22, a fourth bonding member 44, and a first bonding member 41 of the third light-emitting element 23 are joined to the third wiring 53. A third bonding member 43 of the first light-emitting element 21, a fourth bonding member 44 of the second light-emitting element 22, a second bonding member 42 of the third light-emitting element 23, a fifth bonding member 45, and a first bonding member 41 of the fourth light-emitting element 24 are joined to the fourth wiring 54. A third bonding member 43 of the first light-emitting element 21, a fourth bonding member 44 of the second light-emitting element 22, a fifth bonding member 45 of the third light-emitting element 23, a second bonding member 42 of the fourth light-emitting element 24, and a sixth bonding member 46 are joined to the fifth wiring 55.

[0122] The first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fourth light-emitting element 24 are connected in series between the first external connection portion 51a of the first wiring 51 and the fifth external connection portion 54a of the fifth wiring 54.

[0123] The first external connecting part 51a, the second external connecting part 52a, the third external connecting part 53a, the fourth external connecting part 54a, and the fifth external connecting part 55a are connected to... Figure 1 Similarly, they are electrically connected to the power supply terminal via conductive components. By applying a potential difference to any two of these external connection parts 51a, 52a, 53a, 54a, and 55a, one, two, three, or all of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fourth light-emitting element 24 can be made to emit light.

[0124] Hereinafter, other examples of the first light-emitting element 21, the second light-emitting element 22, the third light-emitting element 23, and the fourth light-emitting element 24 will be described with reference to the accompanying drawings. Figure 11This is a schematic top view of the other light-emitting elements 300. Figure 12 yes Figure 11 A schematic cross-sectional view of line XII-XII.

[0125] Figure 11 as well as Figure 12 The other light-emitting elements 300 shown mainly include the configuration of the first pad electrode 37, the position where the first pad electrode 37 is connected to the reflective electrode 34, and the formation location of the first bonding member 41. Figure 3 as well as Figure 4 The first light-emitting element 21 shown is different.

[0126] like Figure 12 As shown, an opening 33, exposing a portion of the reflective electrode 34 disposed on the first insulating film 35 and the second insulating film 36, is formed in a region that does not overlap with the region where the first bonding member 41 is disposed. Furthermore, the first pad electrode 37 and the reflective electrode 34 are connected through this opening 33. The first pad electrode 37 has a covering portion 37a disposed overlapping the first insulating film 35 and the second insulating film 36, and the first bonding member 41 is provided in this covering portion 37a. Figure 11 As shown, when viewed from above, the openings 33 provided on the first insulating film 35 and the second insulating film 36 do not overlap with the first joining member 41.

[0127] like Figure 12 As shown, the first bonding member 41, the second bonding member 42, and the third bonding member 43 are located at approximately the same distance from the support substrate 30. Therefore, when the light-emitting element 300 is mounted on the wiring provided on the substrate 10, deviations in the pressure applied to the first bonding member 41, the second bonding member 42, and the third bonding member 43 can be suppressed, and the light-emitting element can be mounted efficiently.

[0128] The embodiments of the present invention have been described above with reference to specific examples. However, the present invention is not limited to these specific examples. All methods that can be implemented by those skilled in the art based on the above-described embodiments of the present invention, as long as they contain the spirit of the present invention, fall within the scope of the present invention. In addition, any modifications and alterations that can be conceived by those skilled in the art within the scope of the present invention also fall within the scope of the present invention.

Claims

1. A light emitting device, characterized by, Possessing: a substrate having a first side along a first direction and a second side along the first direction, a second direction from the first side toward the second side being orthogonal to the first direction; n light emitting elements mounted on the substrate, at least including a first light emitting element and a second light emitting element, where n is a natural number of 2 or more; and (n+1) wirings provided on the substrate, at least including a first wiring having a first external connection portion, a second wiring having a second external connection portion, and a third wiring having a third external connection portion, in a plan view, the first light emitting element is provided between the first side and the second light emitting element, and the second light emitting element is provided between the first light emitting element and the second side, in a plan view, the first external connection portion, the second external connection portion, and the third external connection portion are provided between the first side and the first light emitting element, each of the light emitting elements has a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a light emitting layer provided between the first semiconductor layer and the second semiconductor layer, a first junction member electrically connected to the first semiconductor layer, and a second junction member electrically connected to the second semiconductor layer, the first junction member of the first light emitting element is joined to the first wiring, the second junction member of the first light emitting element and the first junction member of the second light emitting element are joined to the second wiring, and the second junction member of the second light emitting element is joined to the third wiring, the first junction member and the second junction member of the first light emitting element are arranged in the same manner as the first junction member and the second junction member of the second light emitting element, the first junction member of the first light emitting element and the first junction member of the second light emitting element are arranged in the second direction, and the second junction member of the first light emitting element and the second junction member of the second light emitting element are arranged in the second direction, the second wiring has a first portion extending in the second direction and joined to the second junction member of the first light emitting element, a second portion extending in the first direction from the first portion, and a third portion extending in the second direction from the second portion and joined to the first junction member of the second light emitting element.

2. The light emitting device according to claim 1, wherein the second portion of the second wiring is positioned between the first light emitting element and the second light emitting element.

3. The light emitting device according to claim 1, wherein the first light emitting element further has a third junction member insulated from the first semiconductor layer and the second semiconductor layer, and joined to at least the third wiring, the second light emitting element further has a fourth junction member insulated from the first semiconductor layer and the second semiconductor layer, and joined to at least the third wiring.

4. The light emitting device according to claim 3, wherein The configuration of the third bonding member provided to the first light-emitting element is the same as the configuration of the fourth bonding member provided to the second light-emitting element.

5. The light-emitting device according to claim 1, wherein The second external connection portion is provided between the first external connection portion and the third external connection portion in the first direction.

6. The light-emitting device according to claim 3, wherein The third wiring has a first portion extending in the second direction and bonded to the third bonding member of the first light-emitting element, and a second portion extending in the first direction from the first portion and bonded to the second bonding member and the fourth bonding member of the second light-emitting element.

7. The light-emitting device according to claim 6, wherein The third wiring has a first portion extending in the second direction and bonded to the third bonding member of the first light-emitting element, and a second portion extending in the first direction from the first portion and bonded to the second bonding member and the fourth bonding member of the second light-emitting element.

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