Antenna package and image display device

Abstract

According to an embodiment of the present invention, an antenna package and an image display device are provided. The antenna package includes an antenna unit having a radiation pattern, a transmission line extending from the radiation pattern, and an antenna ground pad arranged around the transmission line, and a circuit board electrically connected to the antenna unit. The circuit board includes: a core layer; a circuit wiring layer arranged on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad; and a ground layer arranged on an opposite surface of the core layer opposite to the above-mentioned one surface. In a plan view, the ground layer does not overlap with a portion of the antenna ground pad outside the area bonded to the first ground pattern.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2020-0052083 filed on April 29, 2020 in the Korean Intellectual Property Office (KIPO), the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present invention relates to an antenna package and an image display device. More particularly, the present invention relates to an antenna package including an antenna device and a circuit board and an image display device including the antenna package. Background Art

[0004] With the development of information technology, wireless communication technologies such as Wi-Fi, Bluetooth, etc. are combined with image display devices such as smart phones. In this case, an antenna can be combined with the image display device to provide a communication function.

[0005] With the rapid development of mobile communication technology, an antenna capable of high frequency or ultra-high frequency communication is required in an image display device.

[0006] However, as the driving frequency of the antenna increases, the signal loss may also increase. In addition, as the length of the transmission path increases, the degree of signal loss may further increase.

[0007] Furthermore, when an intermediate circuit structure such as a flexible printed circuit board (FPCB) is used to electrically connect the driving integrated circuit chip and the antenna for antenna feeding / driving control, additional signal loss and signal interference may occur.

[0008] For example, radiation and impedance characteristics generated by a radiation electrode and / or pad included in the antenna may be interfered by wiring or electrode patterns included in the FPCB.

[0009] Therefore, there is a need for an antenna design that can stably achieve radiation in a desired high frequency band without being affected by an intermediate circuit structure. For example, Korean Patent Application Publication No. 2013-0095451 discloses an antenna integrated with a display panel, but does not provide an effective circuit connection. Summary of the invention

[0010] According to one aspect of the present invention, an antenna package having improved operational reliability and signal efficiency is provided.

[0011] According to one aspect of the present invention, there is provided an image display device including an antenna package having improved operational reliability and signal efficiency.

[0012] (1) An antenna package, comprising: an antenna unit, comprising a radiation pattern, a transmission line extending from the radiation pattern, and an antenna ground pad arranged around the transmission line; and a circuit board electrically connected to the antenna unit, the circuit board comprising: a core layer; a circuit wiring layer arranged on one surface of the core layer, the circuit wiring layer comprising a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern joined to the antenna ground pad; and a ground layer arranged on an opposite surface of the core layer opposite to the above-mentioned one surface, wherein in a plan view, the ground layer does not overlap with a portion of the antenna ground pad outside an area joined to the first ground pattern.

[0013] (2) The antenna package according to (1) above, wherein the antenna ground pad includes a joining region joined to the first ground pattern and a non-joining region not overlapping with the first ground pattern in a plan view.

[0014] (3) The antenna package according to (2) above, wherein the ground layer of the circuit board does not cover the non-bonding area of ​​the antenna ground pad in a plan view.

[0015] (4) The antenna package according to (3) above, wherein the ground layer of the circuit board partially covers the bonding area of ​​the antenna ground pad in a plan view.

[0016] (5) The antenna package according to (4) above, wherein an overlapping area of ​​the ground layer and the antenna ground pad is less than 20% of an area of ​​the bonding region.

[0017] (6) The antenna package according to (2) above, wherein the non-joining area has a mesh pattern structure, and the joining area has a solid pattern structure.

[0018] (7) The antenna package according to (1) above, wherein the ground layer of the circuit board does not overlap with the antenna ground pad in a plan view.

[0019] (8) The antenna package according to (1) above, wherein the antenna unit further includes a signal pad connected to an end of the transmission line and bonded to a signal transmission wiring of the circuit board.

[0020] (9) The antenna package according to (8) above, wherein the antenna ground pad includes a pair of antenna ground pads facing each other with the signal pad interposed therebetween.

[0021] (10) The antenna package according to (9) above, wherein the first ground pattern includes a pair of first ground patterns surrounding the signal transmission line, and each of the pair of first ground patterns is arranged on each of the pair of first antenna ground pads.

[0022] (11) The antenna package according to (8) above, wherein the length of the antenna ground pad is greater than the length of the signal pad and is less than the total length of the transmission line and the signal pad.

[0023] (12) The antenna package according to (1) above, wherein the circuit board further includes a first ground contact that passes through the core layer and electrically connects the first ground pattern and the ground layer to each other.

[0024] (13) The antenna package according to (1) above, further comprising an antenna driving integrated circuit (IC) chip electrically connected to an end portion of the circuit board.

[0025] (14) The antenna package according to (13) above, wherein the ground layer of the circuit board does not overlap with the antenna driving integrated circuit chip in a plan view.

[0026] (15) An antenna package according to (13) above, wherein the antenna unit includes multiple antenna units, the signal transmission wiring contained in the circuit wiring layer of the circuit board includes multiple signal transmission wirings connected to the transmission line of each of the multiple antenna units, and the ends of the multiple signal transmission wirings are electrically connected to the antenna driving integrated circuit chip.

[0027] (16) The antenna package according to (15) above, wherein the circuit wiring layer further includes a second ground pattern provided around end portions of the plurality of signal transmission wirings so as to be electrically separated therefrom.

[0028] (17) The antenna package according to the above (16), wherein the circuit board further includes a second ground contact which passes through the core layer and electrically connects the ground layer and the second ground pattern to each other.

[0029] (18) An image display device including the antenna package according to the above embodiment.

[0030] In an antenna package according to an embodiment of the present invention in which a circuit board including a signal transmission wiring and a ground layer is combined, the signal transmission wiring can be connected to a signal pad of an antenna unit, and the ground layer can be arranged to not overlap with a non-bonding area of ​​the antenna ground pad of the antenna unit in a vertical direction.

[0031] Therefore, the radiation interference caused by the interaction between the antenna ground pad and the ground layer can be suppressed. In addition, the efficiency of the horizontal radiation generated by the antenna ground pad can be improved.

[0032] In some embodiments, a ground layer may be substantially removed in a chip mounting region connected to an antenna driver integrated circuit (IC) chip, thereby improving the efficiency of signal transmission and power feeding between the antenna driver IC chip and the signal transmission wiring. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 and Figure 2 2 are a schematic cross-sectional view and a schematic top plan view respectively showing an antenna package according to an exemplary embodiment.

[0034] Figure 3 and Figure 4 2 are a schematic cross-sectional view and a schematic top plan view respectively showing an antenna package according to an exemplary embodiment.

[0035] Figure 5 is a schematic top plan view showing an image display device according to an exemplary embodiment.

[0036] Figure 6 is a schematic top plan view showing an antenna package according to a comparative example.

[0037] Figure 7 It is a graph showing the radiation characteristics of the antenna packages of the embodiment and the comparative example. DETAILED DESCRIPTION

[0038] According to an exemplary embodiment of the present invention, there is provided an antenna package in which an antenna unit and a circuit board which may include a signal transmission wiring and a ground layer are combined. In addition, there is provided an image display device including the antenna package.

[0039] However, those skilled in the art should understand that these embodiments described with reference to the accompanying drawings are provided for further understanding of the spirit of the present invention, and are not intended to limit the subject matter disclosed in the detailed description and the appended claims.

[0040] The terms “first”, “second”, “upper”, “lower”, “top”, “bottom” and the like used in the present application are not intended to indicate absolute positions, but to relatively distinguish different elements and positions.

[0041] The terms “one surface” and “opposing surface” used in the present application may refer to two different surfaces, such as two surfaces opposite to each other, and may be used to distinguish an upper surface from a lower surface.

[0042] Figure 1 and Figure 2 2 are a schematic cross-sectional view and a schematic top plan view respectively showing an antenna package according to an exemplary embodiment.

[0043] Reference Figure 1 and Figure 2 , the antenna package may include an antenna device 100 and a circuit board 200. The circuit board 200 may include a core layer 230, a circuit wiring layer 210, and a ground layer 250, and the circuit wiring layer 210 and the antenna unit included in the antenna device 100 may be electrically connected to each other.

[0044] The antenna device 100 may include an antenna dielectric layer 110 and an antenna electrode layer 120 disposed on the antenna dielectric layer 110 .

[0045] The antenna dielectric layer 110 may, for example, include a transparent resin film, such as a polyester resin, such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate and polybutylene terephthalate; a cellulose resin, such as diacetyl cellulose and triacetyl cellulose; a polycarbonate resin; an acrylic resin, such as polymethyl (meth)acrylate and polyethyl (meth)acrylate; a styrene resin, such as polystyrene and acrylonitrile-styrene copolymer; a polyolefin resin, such as polyethylene, polypropylene, cycloolefin or polyolefin with a norbornene structure and ethylene-propylene copolymer; a vinyl chloride resin; an amide resin, such as nylon and aromatic polyamide; an imide resin; a polyether sulfone resin; a sulfone resin; a polyether ether ketone resin; a polyphenylene sulfide resin; a vinyl alcohol resin; a vinylidene chloride resin; a vinyl butyral resin; an allyl compound resin; a polyoxymethylene resin; an epoxy resin; a polyurethane or acrylic polyurethane resin; a silicone resin, etc. These may be used alone or in combination of two or more.

[0046] The antenna dielectric layer 110 may include an adhesive material such as an optically clear adhesive (OCA), an optically clear resin (OCR), etc. In some embodiments, the antenna dielectric layer 110 may include an inorganic insulating material such as glass, silicon oxide, silicon nitride, silicon oxynitride, etc.

[0047] In some embodiments, the dielectric constant of the antenna dielectric layer 110 may be adjusted to be within a range of about 1.5 to about 12. When the dielectric constant exceeds about 12, the driving frequency may be excessively reduced, thereby failing to achieve a desired high frequency band or ultra-high frequency band driving.

[0048] The antenna electrode layer 120 may be formed on the upper surface of the antenna dielectric layer 110. Figure 2 As shown, the antenna electrode layer 120 may include an antenna element having a radiation pattern 122 .

[0049] In an exemplary embodiment, the antenna unit may include an antenna pattern or a radiator capable of radiating in a high frequency band or an ultra-high frequency band of 3G, 4G, 5G or higher.

[0050] The antenna unit may further include a transmission line 124, a signal pad 126, and an antenna ground pad 125. The radiation pattern 122 may have, for example, a polygonal flat plate shape, and the transmission line 124 may extend from one side of the radiation pattern 122 to be electrically connected to the signal pad 126. The transmission line 124 may be formed as a single member substantially integral with the radiation pattern 122.

[0051] The signal pad 126 may be connected to an end of the transmission line 124. The signal pad 126 may be provided as a substantially integral member with the transmission line 124, and the end of the transmission line 124 may serve as the signal pad 126.

[0052] In an exemplary embodiment, a pair of antenna ground pads 125 may face each other with the transmission line 124 or the signal pad 126 interposed therebetween. The antenna ground pad 125 may be electrically and physically separated from the transmission line 124 and the signal pad 126.

[0053] The length and area of ​​the antenna ground pad 125 may be greater than the length and area of ​​the signal pad 126. In one embodiment, the length of the antenna ground pad 125 may be less than the total length of the signal pad 126 and the transmission line 124.

[0054] In an exemplary embodiment, vertical radiation (eg, radiation in a thickness direction of the antenna device 100) may be substantially achieved by the radiation pattern 122. In addition, the antenna ground pads 125 may face each other and may be close to the radiation pattern 122, so that horizontal radiation may be achieved by the antenna ground pads 125.

[0055] Therefore, vertical radiation may be substantially achieved in a region where the radiation pattern 122 is disposed, and horizontal radiation may be substantially achieved in a region where the antenna ground pad 125 is disposed.

[0056] The antenna unit may include silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least one of these metals. They may be used alone or in combination.

[0057] In one embodiment, the antenna unit may include silver (Ag) or a silver alloy (eg, silver-palladium-copper (APC)) or copper (Cu) or a copper alloy (eg, copper-calcium (CuCa)) to achieve low resistance and fine line width patterns.

[0058] In some embodiments, the antenna unit may include a transparent conductive oxide, such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), indium zinc tin oxide (IZTO), and the like.

[0059] In some embodiments, the antenna unit may include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, the antenna unit may include a double-layer structure of a transparent conductive oxide layer-metal layer, or a three-layer structure of a transparent conductive oxide layer-metal layer-transparent conductive oxide layer. In this case, the flexibility may be improved by the metal layer, and the signal transmission speed may be improved by the low resistance of the metal layer. The corrosion resistance and transparency may be improved by the transparent conductive oxide layer.

[0060] In some embodiments, the radiation pattern 122 and the transmission line 124 may include a mesh pattern structure to improve light transmittance. In this case, a dummy mesh pattern (not shown) may be formed around the radiation pattern 122 and the transmission line 124.

[0061] Considering reduction of feeding resistance, improvement of noise absorption efficiency, horizontal radiation characteristics, etc., the signal pad 126 and the antenna ground pad 125 may be solid patterns formed of the above-mentioned metal or alloy.

[0062] In some embodiments, at least a portion of the antenna ground pad 125 may have a solid pattern structure. In one embodiment, a portion of the antenna ground pad 125 close to the radiation pattern (e.g., the non-joining region NBR) may have a mesh pattern structure, and the remaining portion of the antenna ground pad 125 (e.g., the joining region BR) may have a solid pattern structure. For example, the non-joining region NBR close to the radiation pattern 122 from the antenna ground pad 125 may be provided in the display area of ​​the image display device together with the radiation pattern 122.

[0063] In some embodiments, an antenna ground layer 130 may be disposed on the lower surface of the antenna dielectric layer 110. The antenna ground layer 130 may be disposed opposite to the radiation pattern 122 with the antenna dielectric layer 110 interposed therebetween. Thus, vertical radiation generated by the radiation pattern 122 may be promoted.

[0064] like Figure 1 As shown in , the antenna ground layer 130 may overlap a portion of the antenna electrode layer 120 in the thickness direction. For example, the antenna ground layer 130 may not overlap the antenna ground pad 125 in a plan view. Therefore, the efficiency or concentration of the horizontal radiation generated by the antenna ground pad 125 may be improved.

[0065] In one embodiment, the conductive member of the display device to which the antenna package is applied may be used as the antenna ground layer 130 .

[0066] The conductive member may include, for example, a gate electrode of a thin film transistor (TFT) included in the display panel, various wirings such as a scan line or a data line, or various electrodes such as a pixel electrode or a common electrode.

[0067] In one embodiment, a metal member such as a SUS plate, a sensor member such as a digitizer, a heat sink, etc., which is disposed at the rear of the display device, may be used as the antenna ground layer 130 .

[0068] The circuit board 200 may be electrically connected to the antenna device 100 via the signal pad 126 of the antenna unit. In an exemplary embodiment, the circuit board 200 may be a flexible printed circuit board (FPCB).

[0069] The circuit board 200 may include a core layer 230 , a circuit wiring layer 210 , and a ground layer 250 .

[0070] The core layer 230 may include, for example, a flexible resin such as polyimide resin, modified polyimide (MPI), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP), or the like.

[0071] The circuit wiring layer 210 may be formed on one surface of the core layer 230 ( Figure 1 The bottom surface of the core layer 230 is shown), and may include a signal transmission wiring 212 and a first ground pattern 214.

[0072] The signal transmission wiring 212 may be electrically connected to the signal pad 126 of the antenna unit. The first ground pattern 214 may be electrically connected to the antenna ground pad 125 of the antenna unit.

[0073] A pair of first ground patterns 214 may face each other with the signal transmission wiring 212 interposed therebetween, and may be electrically connected to each antenna ground pad 125 .

[0074] like Figure 1 As shown, the circuit wiring layer 210 and the antenna electrode layer 120 may be bonded to each other through a conductive intermediate structure 150. For example, the conductive intermediate structure 150 may include an anisotropic conductive film (ACF).

[0075] In this case, the conductive intermediate structure 150 may be inserted into a region where the circuit board 200 and the antenna device 100 overlap each other, and the circuit board 200 and the antenna device 100 may be thermally pressed together.

[0076] Therefore, the signal transmission wiring 212 and the signal pad 126 may be electrically connected to each other through the conductive intermediate structure 150. The first ground pattern 214 and the antenna ground pad 125 may also be electrically connected to each other through the conductive intermediate structure 150.

[0077] The first ground pattern 214 may be bonded to the antenna ground pad 125, thereby improving bonding stability between the circuit board 200 and the antenna device 100. The first ground pattern 214 may be used as a bonding pattern for the above-mentioned process for bonding with the antenna device 100.

[0078] like Figure 2 As shown, the antenna ground pad 125 and the first ground pattern 214 may partially overlap each other in a plan view. In an exemplary embodiment, the antenna ground pad 125 may be divided into a non-joining region NBR and a joining region BR. The joining region BR may be a portion of the antenna ground pad 125 that is joined to the first ground pattern 214 of the circuit board 200 (an area overlapping the first ground pattern 214 in a plan view).

[0079] The non-joining region NBR may be the remaining portion other than the joining region BR of the antenna ground pad 125. For example, the non-joining region NBR may be a portion that may not overlap with the first ground pattern 214 of the circuit board 200 in a plan view.

[0080] In some embodiments, the non-joining region NBR of the antenna ground pad 125 may be used as an auxiliary radiation pattern. For example, as described above, the non-joining region NBR of the antenna ground pad 125 may be close to the radiation pattern 122 to achieve horizontal radiation.

[0081] The ground layer 250 may be formed on the opposite surface of the core layer 230 (eg, Figure 1 The facing surface may refer to a surface opposite to one surface on which the circuit wiring layer 210 is formed.

[0082] The core layer 230 may overlap the antenna ground pad 125 in a plan view. In an exemplary embodiment, an overlapping area of ​​the ground layer 250 and the antenna ground pad 125 may be smaller than an overlapping area of ​​the core layer 230 and the antenna ground pad 125.

[0083] In some embodiments, the overlapping area of ​​the ground layer 250 and the antenna ground pad 125 in a plan view may be less than 10% of the area of ​​the antenna ground pad 125 .

[0084] In one embodiment, the ground layer 250 may be disposed in a plan view not substantially overlapping the non-joining region NBR of the antenna ground pad 125 included in the antenna device 100. For example, the ground layer 250 of the circuit board 200 may be substantially excluded on the non-joining region NBR of the antenna ground pad 125.

[0085] In a preferred embodiment, Figure 2 As shown, the ground layer 250 may not overlap with the antenna ground pad 125 included in the antenna device 100 in a plan view.

[0086] In one embodiment, the ground layer 250 may not cover the non-bonding region NBR of the antenna ground pad 125 in a plan view and may partially cover the bonding region BR. In this case, the ground layer 250 may overlap or cover an area of ​​less than about 20% of the bonding region BR.

[0087] Accordingly, if Figure 1 As shown, the first void area A1 may be formed on the facing surface of the core layer 230 by substantially removing a space of a conductive layer or a conductive pattern such as a ground layer 250 at a portion overlapping the antenna ground pad 125 in the thickness direction.

[0088] In some embodiments, the ground layer 250 and the first ground pattern 214 included in the circuit wiring layer 210 may be electrically connected to each other via the first ground contact 270. For example, as described above, the ground layer 250 may not overlap with the antenna ground pad 125 in a plan view, and may partially overlap with the first ground pattern 214. The first ground contact 270 may be formed through the core layer 230 and may electrically connect the ground layer 250 and the first ground pattern 214 to each other.

[0089] The ground layer 250 and the first ground pattern 214 may be connected to each other through the first ground contact 270 , so that noise absorption / blocking efficiency may be improved and reliability of feeding / signal transmission to the antenna device 100 may be improved.

[0090] According to the above exemplary embodiment, the antenna driving reliability can be improved using the noise absorption by the ground layer 250 on the facing surface of the circuit board 200. In addition, the area occupied by the ground layer 250 on the functional area of ​​the antenna ground pad 125 of the antenna unit can be reduced or substantially removed, so that the radiation interference caused by the ground layer 250 in the antenna ground pad 125 can be avoided.

[0091] For example, as described above, the ground layer 250 can be substantially removed from the first void area A1, thereby substantially converting the area of ​​the antenna device 100 where the antenna ground pad 125 is disposed into a horizontal radiation area. For example, the non-bonding area NBR of the antenna ground pad 125 can be used as a substantially horizontal radiation pattern.

[0092] Therefore, the region where the radiation pattern 122 is provided serves as a vertical radiation region and can be separated from a horizontal radiation region without interference, thereby improving radiation and signal reliability and suppressing signal loss.

[0093] Figure 3 and Figure 4 1 and 2 are schematic cross-sectional views and schematic top plan views respectively showing an antenna package according to an exemplary embodiment. Figure 1 and Figure 2 Detailed description of elements and / or structures that are substantially the same or similar to those described herein. Figure 4 The antenna dielectric layer 110, the first ground contact 270, etc. are omitted in the figure.

[0094] Reference Figure 3 and Figure 4 , the antenna package may include an antenna driving integrated circuit (IC) chip 290 .

[0095] In an exemplary embodiment, one end of the circuit board 200 may be electrically connected to the antenna device 100 in the bonding area B1 , and the other end of the circuit board 200 may be electrically connected to the antenna driving IC chip 290 in the chip mounting area B2 .

[0096] For example, an intermediate circuit board 280 may be provided between the other end of the circuit board 200 and the antenna driving IC chip 290 to electrically connect the circuit board 200 and the antenna driving IC chip 290 to each other. The intermediate circuit board 280 may be, for example, a rigid printed circuit board. For example, the intermediate circuit board 280 may include an intermediate circuit pattern 285 formed in a prepreg substrate.

[0097] like Figure 4 As shown, the antenna device 100 may include a plurality of antenna elements arranged in an array on an antenna dielectric layer 110. The circuit wiring layer 210 of the circuit board 200 may include a plurality of signal transmission wirings 212 connected to each signal pad 126 of the antenna element.

[0098] The signal transmission wiring 212 may extend toward the chip mounting area B2 on the core layer 230. The terminal portion of the signal transmission wiring 212 may be electrically connected to the antenna driving IC chip 290 through the intermediate circuit pattern 285 included in the intermediate circuit board 280. Therefore, the feeding and driving control signals from the antenna driving IC chip 290 may be transmitted to each antenna unit.

[0099] The antenna driving IC chip 290 may be directly mounted on the intermediate circuit board 280 by surface mounting technology, or may be mounted using conductive balls, solder, resist, or the like.

[0100] In some embodiments, the circuit wiring layer 210 of the circuit board 200 may further include a second ground pattern 216 disposed around the end of the signal transmission wiring 212. The second ground pattern 216 may also be disposed between the signal transmission wirings 212 adjacent to each other to absorb or shield signal noise around the signal transmission wirings 212.

[0101] The second ground pattern 216 of the circuit board 200 and the ground layer 250 may be electrically connected to each other by the second ground contact 275 passing through the core layer 230 , so that noise absorption efficiency may be improved.

[0102] In an exemplary embodiment, the ground layer 250 of the circuit board 200 may not extend over the chip mounting area B2 in a plan view. Figure 4 As shown, the ground layer 250 may not overlap the antenna driving IC chip 290 in the thickness direction. In one embodiment, the ground layer 250 may not overlap the intermediate circuit board 280 in the thickness direction.

[0103] Accordingly, if Figure 3 As shown, the conductive layer or conductive pattern overlapping the antenna driving IC chip 290 and / or the intermediate circuit board 280 in the thickness direction may be substantially removed on the facing surface of the core layer 230 , thereby defining a second gap area A2 .

[0104] As described above, the ground layer 250 may be removed from the chip mounting area B2 overlapping the antenna driving IC chip 290 , so that interference of a feeding / radiation signal of a corresponding frequency band generated by the signal transmission wiring 212 may be prevented and signal reliability may be improved.

[0105] In some embodiments, the antenna driving IC chip 290 may be directly mounted on the surface of the circuit board 200. In this case, the intermediate circuit board 280 may be omitted, and the antenna driving IC chip 290 may be directly connected to the end of the signal transmission wiring 212.

[0106] Figure 5 is a schematic top plan view showing an image display device according to an exemplary embodiment.

[0107] Reference Figure 5 , the image display device 300 may be made in the form of, for example, a smart phone, and Figure 5 The front portion or window surface of the image display device 300 is shown. The front portion of the image display device 300 may include a display area 310 and a peripheral area 320. The peripheral area 320 may correspond to a light shielding portion or a frame portion of the image display device, for example.

[0108] The antenna device 100 included in the above antenna package may be disposed toward the front portion of the image display device 300, and may be disposed on the display panel, for example. In one embodiment, the radiation pattern 122 may at least partially overlap the display area 310 in a plan view.

[0109] In this case, the radiation pattern 122 may have a mesh pattern structure, and a reduction in light transmittance due to the radiation pattern 122 may be prevented.

[0110] In some embodiments, the non-joining region NBR of the antenna ground pad 125 may also be disposed in the display area 310 together with the radiation pattern 122. In this case, the non-joining region NBR of the antenna ground pad 125 may include a mesh pattern structure.

[0111] The antenna driving IC chip 280 included in the antenna package may be disposed in the peripheral area 320 to prevent image quality in the display area 310 from being deteriorated.

[0112] In some embodiments, the antenna package may be bent by the circuit board 200 , such that, for example, the intermediate circuit board 280 and the antenna driving IC chip 290 may be disposed on the rear of the image display device 300 .

[0113] As described above, through the configuration of the ground layer 250 of the circuit board 200, vertical and horizontal radiation from the antenna unit can be independently achieved without mutual interference while improving the signal reliability of the antenna driving IC chip 290.

[0114] Hereinafter, preferred embodiments are proposed to more specifically describe the present invention. However, the following examples are given only to illustrate the present invention, and those skilled in the relevant art will clearly understand that various substitutions and modifications can be made within the scope and spirit of the present invention. These substitutions and modifications are appropriately included in the appended claims.

[0115] Test example

[0116] Evaluated based on Figure 1 and Figure 2 The antenna package of the embodiment of the structure shown is manufactured according to Figure 6 The antenna characteristics of the antenna package manufactured in the comparative example are shown.

[0117] Specifically, refer to Figure 6 , except that the ground layer 250 included in the circuit board completely covers the bonding area BR of the antenna ground pad 125 in a plan view and also partially covers the non-bonding area NBR of the antenna ground pad 125, the structure and size of the antenna package of the comparative example are manufactured to be the same as the structure and size of the antenna package of the embodiment.

[0118] In the embodiments and comparative examples, the radiation pattern 122 and the transmission line 124 are formed into a mesh pattern including a line width of 3 μm using silver-palladium-copper (APC) alloy, and the antenna ground pad 125 and the signal pad 126 are each formed by a solid pattern structure of the silver-palladium-copper (APC) alloy.

[0119] The size of the radiation pattern 122 is 2.4 mm×2.7 mm, and the size of the ground pad 125 is 2.765 mm×0.7 mm.

[0120] The circuit wiring layer 210 and the ground layer 250 included in the circuit board 200 are each formed as a copper layer, and LCP is used as the core layer 230 .

[0121] Specifically, in Embodiment 1, the ground layer 250 is formed to cover 20% of the area of ​​the bonding region BR of the antenna ground pad 125 bonded to the first ground pattern 214 .

[0122] In Example 2, Figure 2 As shown, the ground layer 250 is completely removed on the antenna ground pad 125 .

[0123] When power is supplied to the circuit boards of the antenna packages of the embodiment and the comparative example, a loss level generated by the radiation pattern is simulated by extracting S parameters according to frequency using a network analyzer ( S11 ) ( S11 ).

[0124] Figure 7 Graphs showing radiation characteristics of antenna packages according to the embodiment and the comparative example.

[0125] Reference Figure 7 The antenna package of the embodiment in which the ground layer 250 does not overlap the non-bonding region NBR of the antenna ground pad 125 significantly reduces signal loss, for example, by converting into horizontal radiation in the bonding region B1.

Claims

1. An antenna package, It is characterized in that It includes: An antenna unit comprising a radiation pattern, a transmission line extending from the radiation pattern, and an antenna ground pad disposed around the transmission line; as well as A circuit board electrically connected to the antenna unit, the circuit board comprising: Core layer; A circuit wiring layer provided on one surface of the core layer, the circuit wiring layer including a signal transmission wiring electrically connected to the transmission line of the antenna unit and a first ground pattern bonded to the antenna ground pad; and a ground layer disposed on a facing surface of the core layer opposite to the one surface, wherein in a plan view, the ground layer does not overlap a portion of the antenna ground pad except for a region joined to the first ground pattern, The antenna ground pad includes a bonding area bonded to the first ground pattern and a non-bonding area that does not overlap with the first ground pattern in a plan view.

2. The antenna package according to claim 1, It is characterized in that The ground layer of the circuit board does not cover the non-bonding area of ​​the antenna ground pad in a plan view.

3. The antenna package according to claim 2, It is characterized in that The ground layer of the circuit board partially covers the bonding area of ​​the antenna ground pad in a plan view.

4. The antenna package according to claim 3, It is characterized in that The overlapping area of ​​the ground layer and the antenna ground pad is less than 20% of the area of ​​the bonding area.

5. The antenna package according to claim 1, It is characterized in that The non-joining region has a mesh pattern structure, and the joining region has a solid pattern structure.

6. The antenna package according to claim 1, It is characterized in that The ground layer of the circuit board does not overlap the antenna ground pad in a plan view.

7. The antenna package according to claim 1, It is characterized in that The antenna unit further includes a signal pad connected to an end of the transmission line and bonded to the signal transmission wiring of the circuit board.

8. The antenna package according to claim 7, It is characterized in that The antenna ground pad includes a pair of the antenna ground pads facing each other with the signal pad interposed therebetween.

9. The antenna package according to claim 8, It is characterized in that The first ground pattern includes a pair of the first ground patterns surrounding the signal transmission wiring, and each of the pair of the first ground patterns is arranged on each of the pair of the antenna ground pads.

10. The antenna package according to claim 7, It is characterized in that The length of the antenna ground pad is greater than the length of the signal pad and is less than the total length of the transmission line and the signal pad.

11. The antenna package according to claim 1, It is characterized in that The circuit board also includes a first ground contact that passes through the core layer and electrically connects the first ground pattern and the ground layer to each other.

12. The antenna package according to claim 1, It is characterized in that It also includes an antenna driving integrated circuit chip electrically connected to the end of the circuit board.

13. The antenna package according to claim 12, It is characterized in that The ground layer of the circuit board does not overlap the antenna driving integrated circuit chip in a plan view.

14. The antenna package according to claim 12, It is characterized in that The antenna unit comprises a plurality of antenna units, The signal transmission wiring included in the circuit wiring layer of the circuit board includes a plurality of the signal transmission wirings connected to the transmission line of each of the plurality of the antenna units, and Ends of the plurality of signal transmission wirings are electrically connected to the antenna driving integrated circuit chip.

15. The antenna package according to claim 14, It is characterized in that The circuit wiring layer further includes a second ground pattern provided around end portions of the plurality of signal transmission wirings so as to be electrically separated therefrom.

16. The antenna package according to claim 15, It is characterized in that The circuit board further includes a second ground contact that passes through the core layer and electrically connects the ground layer and the second ground pattern to each other.

17. An image display device, It is characterized in that It comprises the antenna package according to claim 1.

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