System for fragmenting multiple wafer components

Abstract

The present invention relates to a system for fragmenting a plurality of wafer assemblies (1), one of the wafers of each assembly (1) comprising a embrittlement surface and each assembly (1) comprising a peripheral side groove, the apparatus comprising: - a carrier (8) for holding the assemblies (1) of the plurality of assemblies spaced apart and parallel to each other along a storage axis; - a separating device (12) for applying a separating force in the peripheral groove (6) of an assembly (1) disposed in a fragmentation area (13) of the separating device, the separating force being intended to separate the wafers of the assembly (1) from each other to initiate fragmentation of the wafers on the embrittlement surface (3); and a drive device configured to move along the axis for relatively storing the carrier (8) and the separating device to successively place the assemblies (1) of the carrier (8) in the fragmentation area (13) of the separating device.

Description

Technical Field

[0001] The present invention relates to a system for fracturing two material wafers assembled together on a embrittlement plane. The device is configured to process multiple such components jointly but not necessarily simultaneously. The device can be implemented in particular in the fracturing step of a method consistent with the Smart Cut TM layer transfer technology. Background Art

[0002] Document WO 2005 / 043615 states that the main steps of such a method include, for example, forming an embrittlement plane in a material wafer called a "donor wafer" by injecting light substances helium and / or hydrogen. The wafer is then assembled with a second wafer called a "support wafer", and an embrittlement heat treatment is applied to the assembly to cause the donor wafer to fracture on the embrittlement plane. In this way, a thin layer defined between the assembly surface of the donor wafer and the embrittlement plane is transferred onto the support wafer. Fracturing can be achieved in particular by various fracturing devices, the description of which can be found in documents FR 2919960, FR 2995440 or EP 867917.

[0003] The above-mentioned document WO 2005 / 043615 also states that when sufficient heat accumulation is provided to the assembly, fracturing can be obtained spontaneously during the embrittlement heat treatment. However, spontaneous detachment during the heat treatment is sometimes not suitable for some cases detailed in the prior art documents.

[0004] To overcome this problem, document WO 2005 / 043615 proposes another fracturing mode, in which an embrittlement heat treatment is applied to the assembly to fully embrittle the embrittlement plane without spontaneously initiating fracturing. Then, in a step after the heat treatment, an energy pulse is applied to the assembly to cause the initiation and propagation of a self-sustaining fracturing wave, which results in the detachment of the thin layer from the donor wafer and its transfer onto the support wafer. This fracturing mode can be particularly advantageous, especially since the surface finish of the added layer generally exhibits enhanced roughness compared to the surface finish of the layer transferred by spontaneous detachment during the heat treatment.

[0005] To implement this advantageous method, document WO 2005 / 043615 contemplates processing wafer components jointly and simultaneously to thermally embrittle them and apply energy pulses. Thus, it is contemplated that the separating device disclosed in document WO 2003 / 013815 is used to apply energy pulses simultaneously to a batch of components. For this purpose, the separating device uses a pusher to manipulate a plurality of components forming a batch disposed in a carrier so as to place them in a separating position. In this regard, it should be noted that the components are not firmly fixed in the carrier from which they are removed and they are prone to slight movement, which makes them difficult to handle. Subsequently, jaws are closed above the components, which tend to separate them into two parts by a wedging action applied to the embrittled surface of the components, thereby causing the initiation and propagation of a fragmentation wave. The first part includes a support wafer with a thin layer added, and the second part includes the residue of the donor wafer. The separating device then jointly processes the first and second parts in order to store them in separate carriers so as to be able to apply additional processing to them.

[0006] During the step of separating the two parts, the jaws respectively engage in a side groove and a peripheral groove of the component defined by a peripheral chamfer on the assembly surface of the donor wafer and the support wafer. The groove is very small, being approximately 200 to 300 microns deep and wide for a 300 mm circular wafer. Closing the jaws above all the components and simultaneously and very precisely engaging the wedges in the peripheral grooves of the components requires high precision, which makes the device in this application complex, expensive and unreliable. Moreover, if the components do not fragment correctly and the two parts of the components thus cannot be separated from each other after the jaws are closed, the first and second parts of the batch just processed cannot be jointly processed and the operation of the device must be interrupted. More generally, the separating device disclosed in the above documents is complex because it is designed to perform the fragmentation operation and the operations of processing the components and the separated parts using one piece of equipment.

[0007] Object of the Invention

[0008] The object of the present invention is to overcome the above disadvantages at least in part. More specifically, the object of the present invention is a system for fragmenting components that is simple and reliable and does not require processing the components individually or jointly to perform the fragmentation operation. Summary of the Invention

[0009] To achieve this object, the subject matter of the present invention proposes a system for fragmenting a plurality of wafer components, one of the wafers of each component including an embrittled surface and each component including a peripheral side groove, the device comprising:

[0010] - a carrier for holding the components among the plurality of components spaced apart from each other and parallel along a storage axis;

[0011] - A separating device for applying a separating force in a peripheral groove of a component disposed in a fragmentation area of the separating device, the separating force being intended to separate wafers of the component from each other to cause fragmentation thereof on a brittle surface;

[0012] - A driving device configured to move along an axis for relatively storing a carriage with respect to the separating device to sequentially place components of the carriage in the fragmentation area of the separating device.

[0013] Such a fragmentation system allows multiple components to be fragmented together without causing such fragmentation simultaneously on all components and without handling each component individually. The components are fragmented while being disposed in the carriage. These principles allow the fragmentation system to be significantly simplified and made more reliable.

[0014] Other advantageous and non - limiting features of the present invention considered individually or in any technically feasible combination:

[0015] - The distance between two separated components in the carriage is constant;

[0016] - The fragmentation area is configured to accommodate a single component and the separating device processes one component at a time;

[0017] - The driving device allows the carriage to move in the opposite direction to the separating device at a constant speed;

[0018] - The driving device allows the carriage to move in steps in the opposite direction to the separating device;

[0019] - The driving device is a carriage support of a furnace;

[0020] - The carriage rests on the carriage support;

[0021] - The separating device is fixed;

[0022] - The separating device is generated by a compressor allowing the generation of a high - pressure fluid jet;

[0023] - The separating system includes a nozzle for shaping the fluid jet;

[0024] - The separating system includes a tool disposed at an end of a movable arm;

[0025] - The carriage is provided with a separating portion;

[0026] - The separating portion has a plurality of blades that engage in peripheral side grooves of the component when the component is accommodated in the carriage;

[0027] - The separating device is a pressing device for applying a force on a component guided towards the separating portion;

[0028] - The separating device includes a screw having a spiral thread, and the blades are disposed in the thread on the right side of the fragmentation area.

[0029] According to another aspect, the present invention relates to a method for fragmenting a plurality of wafer assemblies disposed in a carrier, wherein the assemblies are held spaced apart and parallel from each other, one of the wafers of each assembly includes a embrittlement surface and each assembly includes a peripheral side groove, the method comprising the steps of:

[0030] - moving the carrier along a storage axis so that it faces a separating device to sequentially place the assemblies of the carrier in a fragmentation area of the separating device;

[0031] - applying a separating force by the separating device in the peripheral grooves of the assemblies disposed in the fragmentation area, the separating force being intended to separate the wafers of the assemblies from each other to cause fragmentation thereof on the embrittlement surface. Description of the Drawings

[0032] Further features and advantages of the present invention will become apparent from the following detailed description of the invention with reference to the drawings, in which:

[0033] Figure 1 Figure 1 a cross-sectional view depicting a specific example of a frangible assembly;

[0034] Figure 2 Figure 2 depicting the application of a separating force on a frangible assembly;

[0035] Figure 3 Figure 3 a horizontal furnace for applying an embrittlement heat treatment to a plurality of assemblies is schematically depicted;

[0036] Figure 4 Figure 4 a preferred embodiment of a fragmentation system is depicted;

[0037] Figure 5 Figure 5 an example of a carrier for holding a plurality of assemblies is depicted;

[0038] Figure 6 Figure 6 an embodiment of a separating device is depicted;

[0039] Figure 7 Figure 7 another embodiment of a separating device is depicted;

[0040] Figure 8 Figure 8 another embodiment of a separating device is depicted. Detailed Description

[0041] As described in the introduction of the present application, the fragmentation system according to the present specification is particularly intended for example in connection with Smart Cut TM ​​​​​​​​​​​​​​​​It is implemented during the fragmentation step of a technique-consistent layer transfer method. Before implementing this system, and according to the preparatory steps of this technique, components each composed of a donor wafer and a support wafer adjacent to each other are thus prepared. Each material wafer is defined by two facing main surfaces and a peripheral side edge. The two wafers are adjacent to each other on one of their main surfaces to form a component. It is also common for material wafers to assume a circular shape, but the present invention is in no way limited to such a shape. Figure 1 A cross-sectional view depicting a specific example of such a component 1 is shown. The component is formed by a donor wafer 2, in which a embrittlement plane 3 is formed, for example, by injecting light substances hydrogen and / or helium via the main surface of the wafer 2. The embrittlement plane 3 and the main surface of the donor wafer 2 define a thin layer 4 that is intended to be transferred onto the support wafer 5. Further details of the steps and their variants that can be implemented to generate such a component 1 can be referred to the extensive literature describing the Smart Cut TM technique.

[0042] To avoid sharp edges that are prone to breakage and become sources of particles and defects, the material wafers used to form the component 1 are usually provided with an annular chamfer (or a peripheral chamfer if these wafers are non-circular). The chamfer can extend over several millimeters at the periphery of each main surface of the wafer.

[0043] When the two wafers are assembled together to form a component such as Figure 1 the one depicted in, the chamfers of each wafer are combined so as to form a peripheral side groove 6 on the side edge of the component 1. A tool (e.g., a blade 7) is applied in the side groove 6 to cause contact points to be established on the edges of the two facing wafers 2, 3, and a force called the "separation force" is applied to each of these wafers, which is intended to separate them from each other, as Figure 2 depicted in. The term "blade" in this specification refers to any body presenting a blade shape, i.e., its end is tapered enough to engage in the side groove 6 sufficiently to be able to apply a separation force to the wafer. As an example, the thickness of the blade end can be 200 microns or less, and the two faces of the blade together form an angle of approximately 20°.

[0044] The separation force can provide sufficient energy to initiate a fragmentation wave on the embrittlement plane 3 and allow its self-sustaining propagation.

[0045] To allow or facilitate such fragmentation patterns, the layer transfer method for implementing the fragmentation system according to the present invention contemplates pre-applying a embrittlement heat treatment to the component 1. The purpose of this treatment is to apply a embrittlement heat accumulation that is insufficient to cause spontaneous fragmentation during the heat treatment itself, but that results in a decrease in the binding energy of the plane 3. The embrittlement heat treatment also helps to increase the adhesion energy between the two donor wafers 2 and the support wafer 5. The target heat accumulation of the substance that may depend on the type of material forming the wafers and that forms the embrittlement surface can only be determined experimentally. As an example, when the two wafers are made of silicon and the introduced substance consists of hydrogen and optionally helium (total dose between 1e16 at / cm^2 and 1e17 at / cm^2), the embrittlement heat treatment can be applied at several hundred degrees and within 500 °C for a period of several seconds to several hours.

[0046] Industrially, it is advantageous to apply the embrittlement treatment to a plurality of components 1 simultaneously. For this purpose, furnaces are known, called "horizontal furnaces", in which dozens of components 1 can be processed simultaneously. In such a furnace 10, as Figure 3 highly schematically depicted in, a plurality of components 1 (usually 20 to 50 components) are vertically fixed in a carrier 8. A plurality of carriers 8 can be arranged one after another and aligned on a carrier support 9. The carrier support can slide between a loading / unloading position where the carrier support 9 is removed from the furnace and an annealing position where the carrier support 9 is fully inserted into the furnace 10. This furnace basically consists of a chamber 11 with a controllable atmosphere and a heating element 11b for determining the temperature of this atmosphere.

[0047] Regardless of how the embrittlement heat treatment is carried out, when the preparatory steps for preparing the component 1 are completed, a plurality of wafer components 1 are available, and one of the wafers 2 of each component includes an embrittlement surface 3. This plane is brittle enough so that at least for most of these components, applying a reasonable force on the peripheral side groove 6 causes the initiation and self-sustaining propagation of a fragmentation wave.

[0048] To implement this fragmentation step, the present specification provides a fragmentation system. This includes a carrier 8 for holding a plurality of components 1 spaced apart and parallel to each other along a storage axis. It should also be noted here that the components are not forcibly fixed in the carrier, and all degrees of freedom of the components are not blocked, and they are therefore prone to slight movement. It can relate to highly conventional carriers, such as carriers for fixing wafers in a horizontal furnace, but the present invention is by no means limited to this type of carrier. More generally, the carrier in the present specification represents any device for holding a plurality of components 1 spaced apart and parallel to each other along a storage axis.

[0049] As an example, Figure 5Depicts a carrier in accordance with the present specification. In this case the carrier 8 consists of four longitudinal bars 14, which are parallel to each other and whose end portions are respectively fixed to the front portion 15 which also forms an element for supporting the carrier. The longitudinal bars 14 are provided with notches 16 facing each other to define a housing for receiving and fixing the assembly 1. The distance between two consecutive notches of the longitudinal bars thus defines the distance by which two assemblies are separated, and the storage axis X is collinear with these longitudinal bars. Preferably, in order to facilitate the implementation of the fragmentation system, which will become apparent throughout the remainder of the present specification, the distance by which two assemblies 1 of the carrier 8 are separated is constant.

[0050] The fragmentation system according to the present specification further comprises a separation device 12. The purpose of this device is to apply a separating force in the annular groove 6 of the assembly 1 when the assembly is in the region 13 for triggering the fragmentation of the device (throughout the remainder of the present specification, this region is more simply referred to as the "fragmentation region"), with the aim of causing the fragmentation of the donor wafer. Various mechanical means will be described hereinafter in the remainder of the present specification, which can be implemented by the separation device for applying these separating forces. In order to initiate the fragmentation of the assembly, the carrier 8 is thus arranged opposite the separation device to place the assembly 1 of the carrier 8 in the fragmentation region 13( Figure 4 ). Preferably, the fragmentation region 13 allows a single assembly to be received and the separation device is configured to apply a separating force on this single assembly aimed at causing fragmentation. This feature allows a particularly simple and reliable fragmentation system to be formed.

[0051] In order to allow the fragmentation of a plurality of assemblies 1 arranged in the carrier 8, it is envisaged that the carrier 8 moves in the storage direction opposite to the separation device, thus successively placing the assemblies 1 of the carrier 8 in the fragmentation region 13.

[0052] To this end, the fragmentation system comprises drive means for allowing the carrier 8 and / or the separation device to move relative to each other. This movement takes place along the storage axis so that the assemblies arranged in the carrier are successively placed one by one in the region for triggering fragmentation during the movement.

[0053] Advantageously, the drive device allows the carriage 8 to move in the opposite direction to the separating device 12 at a constant speed throughout the duration of the treatment implemented by the fragmentation system. According to an alternative embodiment, it may alternatively be provided that this movement is carried out step by step in order to place the components 1 one by one in the fragmentation area during successive movement steps. The components may then remain fixed in the fragmentation area for a determinable period of time in order to be processed therein by the separating device. In all cases, the components are fragmented while being in the carriage 8, which thus avoids processing the components individually or jointly in order to remove them from the carriage 8 and position them in the fragmentation position. The advantage of this feature also lies in the fact that when the components are fragmented, contact of elements with the free surface of the components (e.g., supporting it) is avoided. The applicant has indeed observed that these contacts on the free surface of the components during the propagation of the fragmentation wave can lead to deterioration of the surface quality of the thin layer transferred onto the support wafer.

[0054] In Figure 5 the preferred embodiment of the fragmentation system depicted in, the drive device comprises a carriage support 9 of the horizontal embrittlement furnace 10 and a carriage 8 of the fragmentation device for holding the component 1 vertically in the furnace 10. The carriage 8 is arranged on the carriage support 9. It should be noted that a plurality of carriages 8 can be placed on the carriage support 9 and, in this case, they will be arranged one after the other along their storage axis in order to be able to process successively the components 1 they contain.

[0055] In this preferred embodiment, the separating device 12 is fixed. It is positioned close to the loading opening of the chamber of the furnace 10 so that when the carriage support 9 moves from the annealing position to the loading / unloading position (e.g., at the end of the embrittlement heat treatment), the components 1 are successively arranged in the fragmentation area 13 during this movement in order to be processed one by one therein by the separating device 12.

[0056] For many reasons, this preferred embodiment is advantageous. First of all, the same carriage 8 used during the embrittlement heat treatment is used as the carriage of the fragmentation system. Thus, between the heat treatment step and the fragmentation step, the components 1 do not need to be processed in order to place them in a new carriage, which simplifies the sequence of these steps and avoids any risk of breakage. The mobility of the carriage support 9 is also exploited in order to generate the drive device for moving the carriage and successively placing the components 1 in the fragmentation area 13. Thus, no additional means need to be implemented.

[0057] In addition, the fixed configuration of the separating device 12 allows the distance separating the fragmentation zone 13 from the outlet of the furnace 10 to be fixed. With a constant speed of movement of the support 9 along the storage axis of the support 8, all the components 1 successively located in the fragmentation zone 13 are cooled for the same period of time and thus all reach the same temperature at the successive instants at which they are positioned in the fragmentation zone 13. Since the temperature of the components 1 can influence the initiation or propagation of the fragmentation wave, this embodiment ensures the same or very similar treatment of the components 1. The thin layers 4 added to the support wafers 4 thus all have characteristics that are similar to one another. In addition, in the accidental case where the component does not fragment completely, it is easy for the operator to remove the component from the support 8 when the treatment carried out by the fragmentation system is completed and to carry out the next step of the method with the remaining components 1 of the support 8.

[0058] However, the present invention is in no way limited to the preferred embodiment just described with reference to Figure 5 the description. It is thus possible to decide to associate the drive device with the separating device 12 and thus to move this device while the support 8 remains fixed. This embodiment is of particular interest when both the separating device 12 and the drive device are arranged in the chamber of the furnace so as to mechanically cause the in situ fragmentation of the components 1 during or at the end of the embrittlement heat treatment.

[0059] It is also conceivable to process the components 1 just before the step implemented by the fragmentation system in order to arrange them in a dedicated support. This operation may be necessary in the case where the embrittlement heat treatment is not carried out in a horizontal furnace such as that described previously, but in another type of furnace (for example, an RTA or microwave-type furnace) that generally processes wafers one by one without a support.

[0060] It is also conceivable to fragment several components 1 simultaneously without removing these components from the support 8. It is thus possible to provide several separating devices and several fragmentation zones, or alternatively, a single separating device capable of processing several components arranged in the same fragmentation zone 13.

[0061] Generally, any automatic movement means (for example, a robotic arm) that can be fixed with the separating device 12 or the support 8 can be selected to generate the drive device. In all cases, the drive device moves along the storage axis of the support (whether movable or fixed). In addition, the separating device is arranged relative to the support such that the movement brought about by the drive device causes the components 1 of the support to be successively arranged in the fragmentation zone 13.

[0062] Various embodiments of the separating device 12 will now be described, which can be used in combination with the carrier 8 and the drive means to form a fragmentation device according to the present specification. As previously indicated, the device is configured to apply separating forces in the peripheral side grooves 6 of the component 1 disposed in the fragmentation area 13, these separating forces being intended to separate the wafers of the component 1 from each other to initiate its fragmentation on the embrittlement plane 3. It should be noted that the separating forces do not inherently need to be pulsed forces to allow for this fragmentation, even though it can effectively be caused by pulsed-type forces.

[0063] The first embodiment of the separation device

[0064] Figure 6 A fragmentation system is depicted in which the separating device 12 is generated by a compressor that allows the generation of a high-pressure fluid jet 17, for example exceeding 1000 bar. The compressor is connected to a nozzle for shaping the fluid jet so that it has a limited size (e.g., a cross-section of approximately 1 mm² or less), and thus acts like a blade. The fluid preferably consists of a liquid (e.g., pure water). In the depicted schematic example, the carrier 8 rests on a carrier support 9 that moves along an axis for storing the component 1 in the carrier, and the carrier 8 supports three components 1. This movement can be intended to place the carrier support 9 in the unloading position when the embrittlement heat treatment is completed. The central component is precisely positioned in the fragmentation area 13 of the separating device 12, which generates a fluid jet 17 that is ejected into the peripheral side grooves of the component. The fluid exerts separating forces on the individual wafers forming the component 1, which causes the initiation and propagation of fragmentation waves.

[0065] The component 1 disposed downstream of the component in the fragmentation area 13 has been previously treated by the fluid jet 17. It is thus shown fragmented in this figure, and the two parts initially forming the component 1 on either side of the embrittlement plane are separated from each other. Some notches 14 provided on the longitudinal bars 16 of the carrier 8 can be provided with a V-shaped or W-shaped profile, thus allowing the two parts to remain separated after the fragmentation of the component 1 without contacting adjacent components.

[0066] The component 1 disposed upstream of the component in the fragmentation area 13 has not yet fragmented. Movement along the Figure 6 storage axis as indicated by the arrow X will cause this component to be placed in the fragmentation area 13.

[0067] The fluid jet 17 can be continuous such that when the drive device moves, each component 1 will successively be subjected to the force exerted by the jet 17 which engages in the peripheral groove at a specific moment as it passes through the fragmentation area 13 so as to cause its fragmentation. Alternatively, the jet can be intermittent and interrupted during periods when there is no component 1 in the fragmentation area 13. In this case, a step sequence of gradually moving the drive device (in this case, the carriage support) can be envisaged so as to successively and fixedly place the component 1 in the fragmentation area 13 using the step of generating the fluid jet 17. The separation device 12 can be provided with a detector which is used to identify the presence or passage of a component in the fragmentation area 13 and to accordingly start and interrupt the generation of the jet 17. In this intermittent mode, it can be provided that a plurality of components are placed in the fragmentation area 13 which will be processed by a plurality of fluid jets originating from a compressor. The advantage of this first embodiment is that it overcomes the problem of the relatively precise positioning of the separation device relative to the peripheral side groove, the fluid jet naturally engaging in the groove as the component passes beneath it.

[0068] The second embodiment of the separation device

[0069] In an alternative embodiment of the first embodiment not shown, the separation device consists of a tool (e.g., a blade) provided at the end of a movable arm. The tool is intended to be inserted into the peripheral side groove 6 of the component 1 provided in the fragmentation area 13 and to exert a force intended to trigger the fragmentation of the component 1. When a component is detected in the fragmentation area 13, the tool can be inserted into the groove by controlling the movable arm. The operation of this alternative embodiment is very similar to the operation of the first embodiment implementing an intermittent fluid jet and, for the sake of brevity, all the features already described with reference to this first embodiment which can be applied to it will not be reproduced here.

[0070] The third embodiment of the separation device

[0071] Figure 7 Another embodiment of the separation device is depicted. In this embodiment, the carriage 8 is provided with a separation part 18. This part 18 can be fixed to the end of the carriage 8 by a front face 15 like a longitudinal rod 14. The separation part 18 is provided with blades 19 whose end parts are respectively configured to be able to be received in the peripheral grooves of the component 1 provided in the carriage 8. The position of the blades 19 along the separation part 18 thus corresponds to the position of the notches 16 which can be provided on the longitudinal rod 14 such that when the component is placed in its corresponding housing in the carriage 8, the blades 19 also engage in the respective peripheral side grooves. It can be clearly seen from Figure 7 the illustration that the length of the blades is such that their ends contact the bottom of the grooves while the peripheral edges of the wafers of the component do not rest on the separation part 18 on either side of the blades 19.

[0072] In this case, the separating part 18 is arranged on the bracket to be located below the component 1 when the component 1 is received in its recess. However, it may be provided that the separating part 18 is placed at another point of the bracket 8, for example on one side of the bracket. A plurality of separating parts 18 may also be provided so that a plurality of blades engage in the respective slots 6.

[0073] In this third embodiment, the separating device 12 includes a pressing device 20 which is configured to apply a lateral force (i.e., substantially within the plane (Y, Z) reproduced in the figure) on the peripheral edge of the component 1 arranged in the fragmentation area 13. This force is directed towards or has a component directed towards the separating part 18 supporting the cutting blade 19.

[0074] During operation, when the component 1 is positioned in the fragmentation area 13, the pressing device 20 is activated to bear against the peripheral edge of the component. This bearing may be very brief so as not to impede the displacement movement of the drive device (e.g., the bracket support 9) when this movement is continuous. Bearing against the edge of the component 1 forces the cutting blade 19 of the separating part 18 to engage in the peripheral slot, which results in the application of a separating force intended to initiate and cause the propagation of a fragmentation wave on the embrittlement surface so as to divide the component into two parts.

[0075] Compared with the second embodiment implementing a tool arranged at the end of a movable arm, the advantage of this third embodiment is that it does not require dynamically placing the tool in the slot of the component 1 (which may require high precision). In this case, the tool (i.e., the cutting blade 19) is pre-positioned in the peripheral slots of the respective components 1 of the bracket 8, and only a thrust needs to be applied to each component 1 in order to cause fragmentation. This thrust can be fully intensity-controlled and does not need to have high positioning precision. It is thus conceivable to use this separating device also in combination with a continuous or stepwise movement of the bracket 8. For the first embodiment, the advantage of this third embodiment is that it overcomes the problem of relatively precise positioning of the separating device with respect to the peripheral side slots by pre-positioning the cutting blades in the respective slots of the component.

[0076] The fourth embodiment of the separation device

[0077] Figure 8 A fourth embodiment of the separating device 12 is depicted. This embodiment shows a drive device (in this case, the bracket support 9), and a conventional bracket 8 provided with a plurality of components 1 is received in the notch 16 of the longitudinal rod 14. This embodiment contemplates a drive device for continuously moving the bracket 8 at a substantially constant speed, although this does not constitute a necessary condition for its operation.

[0078] In this case, the separating device 12 is formed by a screw 21, the axis of which extends along the axis of the component 1 stored in the bracket 8. The screw 21 has a thread wound in a spiral manner. The pitch of the screw corresponds to the constant distance by which two consecutive components 1 accommodated in the bracket are separated. The spacing between two components 1 in the bracket 8 can also be conceived as a multiple of the pitch of the screw.

[0079] The screw 21 forming the separating device 12 is arranged opposite to the bracket 8 such that the edge of the component 1 can engage in the thread of the screw. As depicted in the figure, the screw 21 can be held by a support 22 in which it can rotate freely. The support 22 is detachable, thereby allowing the screw 21 to be positioned in a first position where the edge of the component can be easily accommodated in the thread, or positioning the screw in a second inactive position. The movement of the bracket 8 by means of the drive device 12 causes the screw 21 to rotate while keeping the component 1 engaged in the thread. Each component 1 will thus be guided from one end of the screw 21 to the other end as it moves through the thread of the screw. The screw 21 can exert a slight pressure on the edge of the component 1 in order to maintain the cohesion of the component during the movement of the drive device.

[0080] It is also conceivable that the screw 21 is rotated by a drive device connected thereto, the rotation of the screw being coordinated with the speed of movement of the drive device. This thus limits the pressure exerted by the component on the thread of the screw to cause its rotation.

[0081] As Figure 8 is clearly shown, the screw has blades at certain points of its thread, located on the right side of the fragmentation area 13. When the component 1 moves so as to enter the fragmentation area 13, the rotation of the screw forces the blades to engage in the peripheral groove of the component 1. As in the previous embodiment, the forced engagement of the blades in the groove causes the initiation of a fragmentation wave and its propagation along the embrittlement plane.

[0082] Of course, the present invention is not limited to the embodiments of the fragmentation system and the separating device described, and alternative embodiments can be added to the present invention without departing from the scope of the present invention defined by the claims.

Claims

1. A system for fragmenting a plurality of wafer assemblies (1), one of the wafers of each assembly (1) including a frangible surface (3) and each assembly (1) including a peripheral side groove (6), the system comprising: - a carrier (8) for holding the assemblies (1) of the plurality of wafer assemblies spaced apart from and parallel to each other along a storage axis; - a separating device (12) for applying a separating force in the peripheral side groove (6) of the assembly (1) disposed in a fragmentation area (13) of the separating device, the separating force being intended to separate the wafers of the assembly (1) from each other to initiate fragmentation of the wafers on the frangible surface (3); - a driving device configured to move along the axis to position the carrier (8) opposite the separating device so as to sequentially place the assemblies (1) of the carrier (8) in the fragmentation area (13) of the separating device, wherein the separating device (12) includes a screw (21) having a helical thread, and blades are provided in the thread on the right side of the fragmentation area (13).

2. The system according to claim 1, wherein The distance between two assemblies (1) in the carrier (8) is constant.

3. The system according to claim 1 or 2, wherein, The fragmentation area (13) is configured to accommodate a single assembly (1), and the separating device (12) processes one assembly at a time.

4. The system according to claim 1 or 2, wherein The driving device allows the carrier (8) to move opposite to the separating device (12) at a constant speed.

5. The system according to claim 1 or 2, wherein, The driving device allows the carrier (8) to move opposite to the separating device (12) step by step.

6. The system according to claim 1 or 2, wherein, The driving device is a carrier support (9) of a furnace (10).

7. The system according to claim 6, wherein, The carrier (8) rests on the carrier support (9).

8. The system according to claim 1 or 2, wherein The separating device (12) is fixed.

9. The system according to claim 1 or 2, wherein, The separating device (12) includes a tool provided at an end of a movable arm.

10. The system according to claim 1 or 2, wherein, The carrier (8) is provided with a separating part (18).

11. The system according to claim 10, wherein, The separating part (18) has a plurality of blades (19) which engage in the peripheral side groove (6) of the assembly (1) when the assembly (1) is received in the carrier (8).

12. A method for fragmenting a plurality of components (1) of a wafer disposed in a carrier (8), wherein, The assemblies (1) are held spaced apart from and parallel to each other, one of the wafers of each assembly (1) including a frangible surface (3) and each assembly (1) including a peripheral side groove (6), the method comprising the following steps: - moving the carrier (8) along the storage axis so that it is opposite the separating device (12) to sequentially place the assemblies (1) of the carrier in the fragmentation area (13) of the separating device (12); - applying, by the separating device (12), a separating force in the peripheral side groove (6) of the assembly (1) disposed in the fragmentation area (13), the separating force being intended to separate the wafers of the assembly (1) from each other to initiate fragmentation of the wafers on the frangible surface (3), wherein the separating device (12) includes a screw (21) having a helical thread, and blades are provided in the thread on the right side of the fragmentation area (13).

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