MiniLED and manufacturing method thereof

Abstract

The present application relates to a MiniLED, which includes a MiniLED light source board, an LED chip and a sealing layer, wherein the LED chip is arranged on the MiniLED light source board; further includes a reflective film, wherein the sealing layer is connected to the reflective film, and the reflective film or the sealing layer is arranged on the MiniLED light source board; a through hole is provided on the reflective film, and the LED chip corresponds to the through hole. The present application has the effect of improving the brightness of the MiniLED.

Description

Technical Field

[0001] The present application relates to the technical field of LED display screens, and in particular to a MiniLED and a method for manufacturing the same. Background Art

[0002] Liquid crystal display (LCD) and organic light-emitting diode display (OLED) are the mainstream display technologies at present, among which OLED display screens are widely used in electronic products such as mobile phones and televisions. In recent years, the industry has proposed the concepts of mini light-emitting diode (miniLED) display and micro light-emitting diode (microLED) display.

[0003] How to improve the brightness of MiniLED while maintaining the same power consumption is a problem that the entire industry needs to break through. Summary of the invention

[0004] In order to improve the brightness of MiniLED, the present application provides a MiniLED and a manufacturing method thereof.

[0005] In the first aspect, the present application provides a MiniLED using the following technical solution:

[0006] A MiniLED comprises a MiniLED light source board, an LED chip and a sealing layer, wherein the LED chip is arranged on the MiniLED light source board; further comprising a reflective film, the sealing layer being connected to the reflective film, the reflective film or the sealing layer being arranged on the MiniLED light source board; a through hole is opened on the reflective film, and the LED chip corresponds to the through hole.

[0007] By adopting the above technical solution, the LED chip emits light, and the reflective film can effectively reflect the light emitted by the LED chip to increase the brightness; the set sealing layer can improve the stability of the LED chip and the reflective film; by setting the reflective film, the average reflectivity between 380 and 780 nanometers can be made higher than 97%.

[0008] Optionally, the reflective film is arranged on the MiniLED light source board, the end of the LED chip away from the MiniLED light source board passes through the through hole, the sealing layer is arranged on the side of the reflective film away from the MiniLED light source board, and the end of the LED chip away from the MiniLED light source board is located in the sealing layer.

[0009] By adopting the above technical solution, after the LED chip is placed on the MiniLED light source board, the through hole on the reflective film is aligned with the LED chip, and then the LED chip is passed through the through hole so that the reflective film contacts the MiniLED light source board, and finally sealed with glue to fix it.

[0010] Optionally, a guide groove communicating with the through hole is formed on a side of the reflective film close to the MiniLED light source board.

[0011] By adopting the above technical solution, the provided guide groove facilitates the installation of the reflective film.

[0012] Optionally, the sealing layer is arranged on the MiniLED light source board, and the LED chip is located in the sealing layer; and the reflective film is arranged on the sealing layer.

[0013] By adopting the above technical solution, after the LED chip is placed on the MiniLED light source board, it is first sealed and fixed, and then the reflective film is adhered to the sealing layer. This can not only improve the stability of the LED chip on the MiniLED light source board, but also facilitate the installation of the reflective film.

[0014] Optionally, a light expansion groove is provided on a side of the reflective film away from the MiniLED light source board.

[0015] By adopting the above technical solution, the light expansion groove can better reflect light.

[0016] Optionally, two layers of BEF films are further included, and the reflective film and the sealing layer are located between the two layers of the BEF films and the MiniLED light source panel.

[0017] By adopting the above technical solution, the two layers of BEF film can better enhance the brightness.

[0018] In a second aspect, the present application provides a method for manufacturing MiniLED, which adopts the following technical solution:

[0019] A method for manufacturing MiniLED includes, S1: material preparation; S2: laser coding; S3: dehumidification; S4: printing; S5: SPI; S6: crystal bonding, installing the LED chip on the MiniLED light source board; S7: reflow soldering; S8: AOI; S9: lighting; S10: pure water cleaning; S11: dehumidification; S12: plasma cleaning; S13: glue dispensing and film pressing, first installing the sealing layer and the reflective film on the MiniLED light source board, and then installing two layers of BEF film; S14: long baking; S15: cutting; S16: cleaning; S17: dehumidification; S18: lighting; S19: aging; S20: warehousing.

[0020] By adopting the above technical solution, after the MiniLED light source board is prepared, laser coding is performed, then dehumidification is performed, and then solder paste is printed on the MiniLED light source board, and then the SPI step is performed to detect the quality of solder paste printing. If it is unqualified, the reprinting step is performed. Then the MiniLED light source board with qualified printing is solidified, and the LED chip is installed on the MiniLED light source board. Then reflow soldering is performed to improve the stability of the LED chip on the MiniLED light source board; then the A0I step is performed to detect mounting errors and welding defects on the substrate. Then the products without defects are lit; the MiniLED light source board that can be lit is first cleaned with pure water, the impurities of the MiniLED light source board are preliminarily cleaned, and then dehumidified; then plasma cleaning is performed to clean the surface of the board so that it can be better combined with glue later. Then determine the installation order of the sealing layer and the reflective film according to the needs, first realize the installation of the sealing layer and the reflective film, and then install the two layers of BEF film to form MiniLED. Then a long baking is carried out to improve the stability of the installed MiniLED; then the four sides of the MiniLED are cut off and cleaned to remove impurities after cutting; then a dehumidification treatment is carried out to keep the MiniLED dry; then it is lit up to test whether the installed MiniLED can be used normally; then the MiniLED that is used normally is subjected to aging treatment test, and finally the MiniLED that has passed the aging test is put into storage.

[0021] Optionally, during the S9 lighting process, if an abnormality is detected and the light cannot be turned on, repair is performed first. If the light can be turned on after repair, S10 can be performed. If the light cannot be turned on after repair, all are recycled and subsequently disassembled for recycling.

[0022] By adopting the above technical solution, the LED chip is installed on the MiniLED light source board and a lighting test is performed to detect whether the LED chip can work normally. When it is detected that the LED chip cannot work normally, repair it first. If the LED chip can work normally after repair, the cleaning process can continue. If the LED chip still cannot work normally after repair, the MiniLED light source board with the LED chip will be uniformly recycled, and then the LED chip will be removed from the MiniLED light source board, and the MiniLED light source board or LED chip will be recycled for subsequent continued use.

[0023] In summary, this application includes the following beneficial technical effects:

[0024] 1. The reflective film can effectively reflect the light emitted by the LED chip to increase the brightness; the sealing layer can improve the stability of the LED;

[0025] 2. The two layers of BEF film can better enhance the brightness. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic diagram of the structure of MiniLED in Example 1 of the present application;

[0027] Figure 2 This is an exploded diagram of the MiniLED in Example 1 of the present application;

[0028] Figure 3 This is a schematic diagram of the structure of MiniLED in Example 2 of the present application;

[0029] Figure 4 This is an exploded diagram of the MiniLED in Example 2 of the present application.

[0030] Figure numerals: 1. MiniLED light source board; 2. LED chip; 3. Reflective film; 31. Through hole; 4. Sealing layer; 5. BLT film; 6. Quantum dot film; 7. BEF film. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-4 This application is described in further detail.

[0032] The embodiment of the present application discloses a MiniLED.

[0033] Embodiment 1:

[0034] refer to Figure 1 and Figure 2 The MiniLED includes a MiniLED light source board 1, a reflective film 3, a sealing layer 4, a BLT film 5, a quantum dot film 6 and two layers of BEF films 7 which are arranged in sequence from bottom to top.

[0035] The LED chip 2 is bonded to the MiniLED light source board 1 .

[0036] A through hole 31 is provided on the reflective film 3, and the through hole 31 corresponds one to one with the LED chip 2; a guide groove connected to the through hole 31 is provided on the side of the reflective film 3 close to the MiniLED light source board 1; the end of the LED chip 2 away from the MiniLED light source board 1 passes through the guide groove and the through hole 31 in sequence.

[0037] After the reflective film 3 is installed on the MiniLED light source board 1 , the sealing glue layer 4 is laid so that the end of the LED chip 2 away from the MiniLED light source board 1 is located in the sealing glue layer 4 .

[0038] Next, a BLT film 5 is bonded to the side of the sealing layer 4 away from the MiniLED light source board 1 , and then a quantum dot film 6 is bonded to the BLT film 5 . Finally, two layers of BEF film 7 are bonded to the quantum dot film 6 .

[0039] The implementation principle of Example 1 of the present application is as follows: firstly, the LED chip 2 is bonded to the MiniLED light source board 1, and then the LED chip 2 is passed through the guide groove and the through hole 31 in sequence, so that the reflective film 3 contacts the MiniLED light source board 1, and the reflective film 3 is bonded to the MiniLED light source board 1. Then, a sealing layer 4 is laid on the reflective film 3 and the LED chip 2 with glue. Then, a BLT film 5 is bonded to the sealing layer 4, and then a quantum dot film 6 is bonded to the BLT film 5. Finally, two layers of BEF film 7 are bonded to the quantum dot film 6.

[0040] The BLT film 5 mainly transmits blue light to excite the quantum dot film 6 to emit white light, and the light of other bands is reflected back and reflected back to the BLT film 5 again through the MiniLED light source. The light passing through the BLT film 5 is refracted by the BEF film 7 and then emitted from the surface of the MiniLED backlight, so that the light is recycled again to achieve the effect of improving the brightness.

[0041] The reflective film 3 can effectively reflect the light reflected by the BEF film 7, emit white light after passing through the quantum dot film 6, and then go out from the surface of the MiniLED backlight after being refracted by the BEF film 7, thereby achieving the effect of increasing the brightness.

[0042] NO. plan Reflectivity 1 No reflective film 84.35% 2 Reflective film 97.01% 3 Reflective film 97.04% 4 Reflective film 97.05%

[0043] Therefore, after the reflective film 3 is applied, the average reflectivity between 380 and 780 nanometers is higher than 97%.

[0044] Therefore, the reflective film 3 and the BLT film 5 can enhance the brightness of the MiniLED.

[0045] Embodiment 2:

[0046] refer to Figure 3 and Figure 4 The MiniLED includes a MiniLED light source board 1, a sealing layer 4, a reflective film 3, a BLT film 5, a quantum dot film 6 and two layers of BEF films 7 which are arranged in sequence from bottom to top.

[0047] The LED chip 2 is disposed on the MiniLED light source board 1 , and the LED chip 2 is located in the sealing layer 4 .

[0048] Then the reflective film 3 is bonded to the side of the sealing layer 4 away from the MiniLED light source board 1; the reflective film 3 is also provided with through holes 31 corresponding to the LED chips 2 one by one, and the side of the reflective film 3 away from the MiniLED light source board 1 is provided with a light expansion groove connected to the through holes 31.

[0049] Then, the BLT film 5 is bonded to the side of the reflective film 3 away from the MiniLED light source board 1 .

[0050] The implementation principle of Example 2 of the present application is as follows: firstly, the LED chip 2 is bonded to the MiniLED light source board 1, and then the sealing layer 4 is laid on the reflective film 3 and the LED chip 2 with glue. Then, the reflective film 3 is bonded to the sealing layer 4, and the through holes 31 on the reflective film 3 correspond to the LED chips 2 one by one; then, the BLT film 5 is bonded to the reflective film 3, and then the quantum dot film 6 is bonded to the BLT film 5. Finally, two layers of BEF film 7 are bonded to the quantum dot film 6.

[0051] The BLT film 5 mainly transmits blue light to excite the quantum dot film 6 to emit white light, and the light of other bands is reflected back and reflected back to the BLT film 5 again through the MiniLED light source. The light passing through the BLT film 5 is refracted by the BEF film 7 and then emitted from the surface of the MiniLED backlight, so that the light is recycled again to achieve the effect of improving the brightness.

[0052] The reflective film 3 can effectively reflect the light reflected by the BEF film 7, emit white light after passing through the quantum dot film 6, and then go out from the surface of the MiniLED backlight after being refracted by the BEF film 7, thereby achieving the effect of increasing the brightness.

[0053] NO. plan Reflectivity 1 No reflective film 84.35% 2 Reflective film 97.04% 3 Reflective film 97.05% 4 Reflective film 97.11%

[0054] Therefore, after the reflective film 3 is applied, the average reflectivity between 380 and 780 nanometers is higher than 97.05%.

[0055] Therefore, the reflective film 3 and the BLT film 5 can enhance the brightness of the MiniLED.

[0056] The embodiment of the present application also discloses a method for manufacturing MiniLED.

[0057] A method for manufacturing MiniLED includes: S1: material preparation;

[0058] S2: Laser coding;

[0059] S3: Dehumidification;

[0060] S4: printing;

[0061] S5: SPI;

[0062] S6: Die bonding, mounting the LED chip 2 on the MiniLED light source board 1;

[0063] S7: Reflow soldering;

[0064] S8: AOI;

[0065] S9: Lighting up. When an abnormality is detected and the light cannot be lit up, repair it first. If it can be lit up after repair, the subsequent steps can be carried out. If it cannot be lit up, it will be recycled uniformly.

[0066] S10: pure water cleaning;

[0067] S11: Dehumidification;

[0068] S12: plasma cleaning;

[0069] S13: Glue dispensing and film pressing, first install the sealing glue layer 4 and the reflective film 3 on the MiniLED light source board 1, and then install two layers of BEF film 7;

[0070] S14: long roast;

[0071] S15: cutting;

[0072] S16: cleaning;

[0073] S17: Dehumidification;

[0074] S18: Light up;

[0075] S19: aging;

[0076] S20: Storage.

[0077] The implementation principle of a MiniLED manufacturing method in the embodiment of the present application is as follows: after the MiniLED light source board 1 is prepared, laser coding is performed, and then dehumidification is performed, and then solder paste is printed on the MiniLED light source board 1. Then the SPI step is performed to detect the quality of solder paste printing, and a reprinting step is performed if it is unqualified; if the printing is qualified, the LED chip 2 is installed on the MiniLED light source board 1; then reflow soldering is performed to improve the stability of the LED chip 2 on the MiniLED light source board 1; then the A0I step is performed to detect mounting errors and welding defects on the substrate.

[0078] Then, a lighting test is performed on the products without defects to check whether the LED chip 2 can work normally. When it is detected that the LED chip 2 cannot work normally, repair it first. If the LED chip 2 can work normally after repair, subsequent cleaning can be continued; if the LED chip 2 still cannot work normally after repair, the MiniLED light source board 1 with the LED chip 2 will be uniformly recycled, and then the LED chip 2 will be removed from the MiniLED light source board 1, and the MiniLED light source board 1 or LED chip 2 will be recycled for subsequent continued use.

[0079] The MiniLED light source board 1 that can be lit is first cleaned with pure water, and the impurities of the MiniLED light source board 1 are preliminarily cleaned, and then dehumidified; then plasma cleaning is performed to clean the surface of the board so that it can be better combined with glue later.

[0080] Then, the installation order of the sealing layer 4 and the reflective film is determined according to the needs. The sealing layer 4 and the reflective film 3 are installed first, and then the two layers of BEF film 7 on both sides are installed to form MiniLED.

[0081] Then a long baking process is carried out to improve the stability of the installed MiniLED; then the four sides are cut off and cleaned to remove impurities after cutting; the cut MiniLED is then dehumidified to keep it dry; then it is lit up to test whether the installed MiniLED can be used normally; the MiniLED in normal use is subjected to aging test, and finally the MiniLED that has passed the aging process is put into storage.

[0082] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A MiniLED, comprising a MiniLED light source board (1), an LED chip (2) and a sealing layer (4), wherein the LED chip (2) is arranged on the MiniLED light source board (1); characterized in that: It also comprises a reflective film (3), the sealing layer (4) being connected to the reflective film (3), the reflective film (3) or the sealing layer (4) being arranged on the MiniLED light source board (1); a through hole (31) being provided on the reflective film (3), and the LED chip (2) corresponding to the through hole (31); The sealing layer (4) is arranged on the MiniLED light source board (1), and the LED chip (2) is located in the sealing layer (4); the reflective film (3) is arranged on the sealing layer (4), and a light expansion groove is provided on a side of the reflective film (3) away from the MiniLED light source board (1); A BLT film (5) is arranged on the side of the sealing layer (4) away from the reflective film (3), a quantum dot film (6) is arranged on the side of the BLT film (5) away from the sealing layer (4), and two layers of BEF films (7) are arranged on the side of the quantum dot film (6) away from the BLT film (5).

2. The MiniLED according to claim 1, characterized in that: A guide groove communicating with the through hole (31) is provided on a side of the reflective film (3) close to the MiniLED light source board (1).

3. A method for manufacturing MiniLED as claimed in claim 1, characterized in that: S1: Material preparation; S2: Laser coding; S3: Dehumidification; S4: printing; S5: SPI; S6: die bonding, mounting the LED chip (2) on the MiniLED light source board (1); S7: Reflow soldering; S8: AOI; S9: Light up; S10: pure water cleaning; S11: Dehumidification; S12: plasma cleaning; S13: Glue dispensing and film pressing, firstly installing the sealing glue layer (4) and the reflective film (3) on the MiniLED light source board (1), and then installing two layers of BEF film (7); S14: long roast; S15: cutting; S16: cleaning; S17: Dehumidification; S18: Light up; S19: aging; S20: Storage.

4. The method for manufacturing MiniLED according to claim 3, characterized in that: During the S9 lighting process, if an abnormality is detected and the light cannot be turned on, repair it first. If it can be turned on after repair, then S10 can be performed. If it cannot be turned on after repair, it will be collected and then disassembled for recycling.

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