High-temperature graphene electric heating plate for traditional chinese medicine moxibustion and manufacturing method thereof

Abstract

The present disclosure provides a high-temperature graphene electric heating plate capable of being used for traditional Chinese medicine moxibustion and a manufacturing method thereof. The high-temperature graphene electric heating plate utilizes the infrared rays generated by graphene at high temperature to cover the spectrum of moxa heat, adopts a high-temperature-resistant rigid substrate and a high-temperature-resistant protective layer to protect the high-temperature graphene electric heating film, and transfers graphene through an adhesive layer containing a dopant during preparation, thereby improving the transfer quality, high-temperature stability and yield of the graphene, and achieving the material requirements of traditional Chinese medicine moxibustion.

Description

Technical Field

[0001] This disclosure relates to the field of electrothermal film technology, specifically to a high-temperature graphene electrothermal plate for use in traditional Chinese medicine moxibustion and its manufacturing method. Background Technology

[0002] Moxibustion is a unique health resource in my country, possessing significant characteristics and advantages in both medical treatment and preventative healthcare, playing an irreplaceable role. The core of moxibustion technique is "deqi" (the attainment of Qi). Professor Chen Rixin and his team at Jiangxi University of Traditional Chinese Medicine, after 30 years of scientific research, discovered the relationship and patterns between "deqi" and therapeutic efficacy in moxibustion, winning the second prize of the National Science and Technology Progress Award in 2015. This achievement has been promoted and applied in over 500 hospitals across 27 provinces, municipalities, and autonomous regions nationwide. Research conducted by our research group under the National Key Basic Research and Development Program of China ("973 Program") reveals that appropriate moxibustion temperature, gentleness, and infrared spectrum are key factors in stimulating "deqi" in suspended moxibustion. Currently, the commonly used moxa heat is gentle and has a high rate of "deqi" activation, which is closely related to the unique infrared spectrum of moxa heat. However, the smoke, odor, and fire produced by burning moxa limit the application locations for moxibustion. Furthermore, the gentleness, comfort, and infrared spectrum range of physical heat sources used for suspended moxibustion on the market are significantly inferior to that of moxa heat, failing to meet the requirements for efficient "deqi" activation in clinical practice and affecting the therapeutic effect of suspended moxibustion. Graphene is a high-tech material with outstanding electrical and thermal properties. While it has been used in the field of human thermotherapy, it still falls short of the temperature requirements of traditional Chinese medicine moxibustion. Therefore, it is necessary to provide a novel graphene-based moxibustion heat source that can meet the temperature requirements of traditional Chinese medicine moxibustion, with a gentle heat sensation and an infrared spectrum close to that of moxa.

[0003] High-temperature graphene heating plates, as electric heating elements with outstanding characteristics, meet the temperature requirements of traditional Chinese medicine moxibustion because their temperature needs to reach above 200℃. They also have advantages such as gentle heat sensation, infrared spectrum similar to moxa heat, fast heating speed, wide driving voltage range, thinness, transparency, and surface heating energy, and have broad application prospects in the field of traditional Chinese medicine moxibustion. Summary of the Invention

[0004] This disclosure presents a high-temperature graphene heating plate and a method for manufacturing the same.

[0005] In a first aspect, this disclosure provides a high-temperature graphene heating plate, which includes:

[0006] High-temperature resistant rigid substrate;

[0007] A high-temperature graphene electrothermal film is disposed on the high-temperature resistant rigid substrate;

[0008] A high-temperature resistant protective layer is disposed on the high-temperature graphene electrothermal film.

[0009] In some optional embodiments, the high-temperature graphene heating plate further includes:

[0010] An adhesive layer is disposed between the high-temperature resistant rigid substrate and the high-temperature graphene electrothermal film;

[0011] In some alternative implementations, the adhesive layer contains a dopant.

[0012] In some alternative embodiments, the dopant is a lithium salt.

[0013] In some alternative embodiments, the high-temperature resistant rigid substrate is high-temperature resistant glass.

[0014] In some alternative embodiments, the high-temperature resistant glass is quartz glass or borosilicate glass.

[0015] In some alternative embodiments, the high-temperature graphene heating plate further includes an electrode layer disposed on the high-temperature graphene heating film.

[0016] In some alternative embodiments, the high-temperature graphene heating plate further includes an insulating layer in contact with the high-temperature resistant protective layer or the high-temperature resistant rigid substrate.

[0017] In some alternative implementations, the insulating layer is aluminum foil.

[0018] In some alternative implementations, the high-temperature graphene heating plate is used for moxibustion.

[0019] In some alternative embodiments, the temperature of the high-temperature graphene heating plate is greater than 200°C.

[0020] Secondly, this disclosure provides a method for manufacturing a high-temperature graphene heating plate, the method comprising:

[0021] A high-temperature graphene electrothermal film and electrode layer are formed on a high-temperature resistant rigid substrate;

[0022] A high-temperature resistant protective layer is provided on the electrode layer.

[0023] In some alternative embodiments, forming the high-temperature graphene electrothermal film and electrode layer on the high-temperature resistant rigid substrate includes:

[0024] Provide graphene layers / electrostatic films;

[0025] The graphene layer / electrostatic film is bonded to the high-temperature resistant rigid substrate, and the electrostatic film is removed after hot pressing.

[0026] The graphene layer is patterned, and electrodes are printed to obtain the high-temperature graphene electrothermal film.

[0027] In some alternative embodiments, forming the high-temperature graphene electrothermal film and electrode layer on the high-temperature resistant rigid substrate includes:

[0028] An adhesive layer, a high-temperature graphene electrothermal film, and an electrode layer are sequentially formed on a high-temperature resistant rigid substrate.

[0029] In some optional embodiments, the step of sequentially forming an adhesive layer, a high-temperature graphene electrothermal film, and an electrode layer on a high-temperature resistant rigid substrate includes:

[0030] Provide graphene layers / copper foil;

[0031] The adhesive layer is printed on the graphene layer / copper foil;

[0032] The graphene layer / copper foil is bonded to the high-temperature resistant rigid substrate via the adhesive layer;

[0033] Pattern the copper foil;

[0034] The graphene layer is patterned, and electrodes are printed to obtain the high-temperature graphene electrothermal film.

[0035] In some alternative embodiments, prior to printing the adhesive layer on the graphene / copper foil, the method further includes:

[0036] Adding dopants to the adhesive layer; and

[0037] The process of printing the adhesive layer on the graphene layer / copper foil includes:

[0038] An adhesive layer containing the dopant is printed on the graphene layer / copper foil.

[0039] In some alternative implementations, the method further includes: attaching the isolation layer to the high-temperature resistant rigid substrate or the high-temperature resistant protective layer.

[0040] To address the issues of complex manufacturing methods and low yield rates of high-temperature graphene heating plates currently used in moxibustion, this disclosure provides a high-temperature graphene heating plate and its manufacturing method, which can achieve the following beneficial effects:

[0041] 1. Using borosilicate glass as the substrate for the high-temperature graphene heating plate eliminates the need for adhesive bonding of the prepared high-temperature graphene heating film (PI substrate) to the copper plate, simplifying the fabrication process. Furthermore, the wiring terminals are conveniently welded onto the borosilicate glass substrate.

[0042] 2. The more complete the graphene transfer, the higher the integrity of the infrared imaging. Using an adhesive layer to transfer graphene can improve the transfer quality.

[0043] 3. By using an adhesive layer to transfer graphene and adding lithium salt dopants to the adhesive layer, the thermal stability of graphene and the yield of the product can be improved by not only increasing the resistance of the graphene but also adjusting the resistance of the graphene.

[0044] 4. By designing patterned high-temperature graphene films and patterned electrode layers, the resistance of high-temperature graphene heating plates is reduced, and the heating temperature of high-temperature graphene heating films is increased.

[0045] 5. The data from the heating temperature at 5 minutes and 10 minutes show that using borosilicate glass as the substrate of the high-temperature graphene heating plate results in a fast heating rate and good thermal stability.

[0046] 6. The non-working surface (non-heat radiation surface) of the high-temperature graphene heating plate is bonded with heat-reflective material. Due to the high reflectivity of the heat-reflective material, it can block high-temperature heat radiation and reduce heat loss from the non-working surface, thereby improving the heat radiation capacity of the working surface and increasing the heating temperature of the working surface. Attached Figure Description

[0047] Other features, objects, and advantages of this disclosure will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0048] Figures 1-3 These are the first to third structural schematic diagrams of the high-temperature graphene electric heating plate disclosed herein.

[0049] Symbol explanation:

[0050] 1-High temperature resistant rigid substrate, 2-Adhesive layer, 3-High temperature graphene electrothermal film, 4-Electrode layer, 5-High temperature resistant protective layer, 6-Insulation layer. Detailed Implementation

[0051] The specific embodiments of this disclosure will be described below with reference to the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by this disclosure and the resulting technical effects through the content described herein. It is understood that the specific embodiments described herein are merely illustrative of the relevant invention and not intended to limit the invention. Furthermore, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0052] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art in understanding and reading the content described herein, and are not intended to limit the implementation conditions of this disclosure. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this disclosure, should still fall within the scope of the technical content disclosed herein. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this disclosure. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this disclosure's implementation.

[0053] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a structure of an embodiment of the high-temperature graphene heating plate according to the present disclosure. The high-temperature graphene heating plate may include a high-temperature resistant rigid substrate 1, an adhesive layer 2, a high-temperature graphene heating film 3, an electrode layer 4, and a high-temperature resistant protective layer 5. The adhesive layer 2 may be disposed on the high-temperature resistant substrate. The high-temperature graphene heating film 3 may be disposed on the adhesive layer 2. The electrode layer 4 may be disposed on the high-temperature graphene heating film 3. The high-temperature resistant protective layer 5 may be disposed on the high-temperature graphene heating film 3.

[0054] In this embodiment, the adhesive layer can be made of a material with adsorption capacity, such as UV adhesive or liquid epoxy adhesive. The adhesive layer may contain dopants that can adjust the resistance of graphene and improve its thermal stability, such as lithium salts.

[0055] In this embodiment, the high-temperature resistant rigid substrate 1 and the high-temperature resistant protective layer 5 can protect the high-temperature graphene heating film 3 and have good high-temperature resistance. The high-temperature resistant rigid substrate 1 can be high-temperature resistant glass, such as borosilicate glass or quartz glass. When the operating temperature of the high-temperature graphene heating plate is greater than 200°C, the high-temperature resistant glass will not deform or curl.

[0056] In this embodiment, the high-temperature graphene electrothermal film 3 serves to transfer heat and maintain heating performance, and can be made of single-layer or multi-layer graphene material. The electrode layer 4 functions to conduct current to the high-temperature graphene electrothermal film 3, and can be made of materials with good electrical conductivity, such as nickel, silver, copper, and other metals or alloys with good electrical conductivity. The electrode layer 4 can be composed of busbars and multiple internal electrodes. The busbars are connected to the positive or negative terminal of the power supply, so that the polarities of two adjacent internal electrodes are opposite. When energized, the current provided by the positive busbar flows from each positive internal electrode into the corresponding negative internal electrode and finally all flows into the negative busbar.

[0057] In this embodiment, the heat insulation layer 6 can be a heat insulation material that can impede heat flow transfer, such as gold, silver, nickel, aluminum foil, metal plating, heat-reflective coating, etc. Figure 2 As shown, when the high-temperature resistant protective layer 5 is a non-working surface (non-heat radiation surface), the heat insulation layer 6 can contact the high-temperature resistant protective layer 5. Figure 3 As shown, when the high-temperature resistant rigid substrate 1 is a non-working surface (non-heat radiation surface), the heat insulation layer 6 can contact the high-temperature resistant rigid substrate 1. Due to the high reflectivity of the heat insulation layer 6, it blocks high-temperature heat radiation, reduces heat loss from the non-working surface, thereby improving the heat radiation capacity of the working surface and increasing the heating temperature of the working surface.

[0058] In one application scenario, this high-temperature graphene heating plate can be used in a moxibustion device, where the temperature can exceed 200°C.

[0059] Example 1

[0060] The high-temperature graphene heating plate provided in this embodiment is prepared as follows: an electrostatic film is bonded to graphene / copper foil; the copper foil is removed to obtain the graphene / electrostatic film; the graphene / electrostatic film is bonded to a borosilicate glass substrate, and the electrostatic film is removed to obtain a high-temperature graphene film. Unwanted graphene is removed using laser etching equipment. Silver paste electrodes are screen-printed on the remaining graphene surface. The borosilicate glass and the high-temperature graphene heating film are aligned and overlapped, and sealed with a rubber ring to obtain the high-temperature graphene heating plate. The distance between two adjacent inner electrodes is 17 mm, and the total length of the intersection area between the high-temperature graphene heating film and the inner electrodes is 231.7 mm.

[0061] Example 2

[0062] The high-temperature graphene heating plate provided in this embodiment is prepared as follows: UV adhesive is screen-printed on the graphene / copper foil surface; the copper foil / graphene / UV adhesive is bonded to a borosilicate glass substrate; a peelable adhesive mask is printed on the copper foil surface, and the copper foil not protected by the mask is removed using an etching method to obtain a high-temperature graphene film. Unwanted graphene is removed using laser etching equipment. Silver paste electrodes are screen-printed on the remaining graphene surface, overlapping with the remaining portion of the copper foil for welding terminals; the borosilicate glass and the high-temperature graphene heating film are aligned and overlapped, and encapsulated using a rubber ring to obtain the high-temperature graphene heating plate. The distance between two adjacent inner electrodes is 17 mm, and the total length of the area where the high-temperature graphene heating film intersects with the inner electrodes is 231.7 mm.

[0063] Example 3

[0064] The high-temperature graphene heating plate provided in this embodiment is prepared as follows: Lithium salt is added to UV adhesive to obtain lithium salt UV adhesive; UV adhesive is screen-printed on the graphene / copper foil surface; the copper foil / graphene / UV adhesive is bonded to a borosilicate glass substrate, and a peelable adhesive mask is printed on the copper foil surface. The copper foil not protected by the mask is removed using an etching method to obtain a high-temperature graphene film. Unwanted graphene is removed using laser etching equipment. Silver paste electrodes are screen-printed on the remaining graphene surface, overlapping with the remaining portion of the copper foil for soldering terminals; the borosilicate glass and the high-temperature graphene heating film are aligned and overlapped, and encapsulated using rubber rings to obtain the high-temperature graphene heating plate. The distance between two adjacent inner electrodes is 17 mm, and the total length of the area where the high-temperature graphene heating film intersects with the inner electrodes is 231.7 mm.

[0065] Example 4

[0066] The high-temperature graphene heating plate provided in this embodiment is prepared as follows: Lithium salt is added to UV adhesive to obtain lithium salt UV adhesive; UV adhesive is screen-printed on the graphene / copper foil surface; the copper foil / graphene / UV adhesive is bonded to a borosilicate glass substrate, and a peelable adhesive mask is printed on the copper foil surface. The copper foil not protected by the mask is removed using an etching method to obtain a high-temperature graphene film. Unwanted graphene is removed using laser etching equipment. Silver paste electrodes are screen-printed on the remaining graphene surface, overlapping with the remaining portion of the copper foil for soldering terminals; the borosilicate glass and the high-temperature graphene heating film are aligned and overlapped, and sealed with a rubber ring to obtain the high-temperature graphene heating plate. Aluminum foil is bonded to the borosilicate glass. The distance between two adjacent inner electrodes is 17 mm, and the total length of the area where the high-temperature graphene heating film intersects with the inner electrodes is 231.7 mm.

[0067] Comparative Example 1

[0068] The high-temperature graphene heating plate provided in this comparative example is prepared as follows: an electrostatic film is bonded to graphene / copper foil; the copper foil is removed using an etching method to obtain the graphene / electrostatic film; the graphene / electrostatic film is bonded to a PI epoxy film substrate, and the electrostatic film is removed to obtain a high-temperature graphene film. Unwanted graphene is removed using laser etching equipment. Silver paste electrodes are screen-printed on the remaining graphene surface; the PI epoxy film is bonded to the obtained high-temperature graphene heating film, and then the high-temperature graphene heating film is bonded to a copper plate using an adhesive to obtain the high-temperature graphene heating plate. The spacing between two adjacent inner electrodes is 17 mm, and the total length of the intersection area between the high-temperature graphene heating film and the inner electrodes is 231.7 mm.

[0069] Comparative Example 2

[0070] The high-temperature graphene heating plate provided in this embodiment is prepared as follows: an electrostatic film is bonded to graphene / copper foil; the copper foil is removed to obtain the graphene / electrostatic film; the graphene / electrostatic film is bonded to a borosilicate glass substrate, and the electrostatic film is removed to obtain a high-temperature graphene film. Unwanted graphene is removed using laser etching equipment. Silver paste electrodes are screen-printed on the remaining graphene surface. The borosilicate glass and the high-temperature graphene heating film are aligned and overlapped, and encapsulated using rubber rings to obtain the high-temperature graphene heating plate. The distance between two adjacent inner electrodes is 21.1 mm, and the total length of the intersection area between the high-temperature graphene heating film and the inner electrodes is 211.6 mm.

[0071] Furthermore, the graphene / copper foil in Examples 1-3 and Comparative Examples 1-2 can be obtained by depositing graphene on copper foil using chemical vapor deposition. The peelable mask can be a mask designed according to the electrode design structure. The shape of the borosilicate glass can be cut according to the shape of the high-temperature graphene heating plate (e.g., a circle with a diameter of 100mm × 100mm), for example, it can be a circular borosilicate glass with a diameter of 100mm × 100mm and a thickness of 0.7mm.

[0072] The performance of the high-temperature graphene films from Examples 1 to 3 and the comparative example was tested, and the results are shown in Table 1. The following explanations are provided for the test items in Table 1: The average sheet resistance at 220°C was measured after baking at 220°C for 1 hour. The initial average sheet resistance and the average sheet resistance at 220°C can be measured using the four-probe method.

[0073] Table 1. Performance test results of the high-temperature graphene films in Examples 1-3 and the comparative examples.

[0074] Average sheet resistance (Ω / □) 200 190 190 220 Average sheet resistance at 220℃ (Ω / □) 230 210 200 270 Shear resistance change rate 15％ 11％ 5％ 23％

[0075] Performance tests were conducted on the high-temperature graphene heating plates of Examples 1-3 and the comparative example, and the results are shown in Table 2. The following explanations are provided for the test items in Table 2: Resistance was obtained using a resistance meter. Thermal infrared imaging (presenting the temperature distribution image of the sample) was performed on N high-temperature graphene heating plates using an infrared thermal imager. The infrared yield was obtained by multiplying the ratio of the number of high-temperature graphene heating plates with qualified thermal infrared imaging (temperature meets heating standards / image is complete) to the total number of high-temperature graphene heating plates (N) by 100%. Initial power is the initial power when connected to 20V. Heating temperature was measured under the condition of operating at room temperature (25℃) with 20V for 5 minutes.

[0076] Table 2 shows the performance test results of the high-temperature graphene electric heating plates in Examples 1-3 and Comparative Examples 1-2.

[0077]

[0078]

[0079] Based on the performance test results of the high-temperature graphene electric heating film and high-temperature graphene electric heating plate in each embodiment and comparative example, it can be seen that:

[0080] 1. In Comparative Example 1, the high-temperature graphene heating plate uses a PI epoxy film as the substrate. When the operating temperature exceeds 200℃, it will curl. The copper plate can provide support and heat dissipation, so it is necessary to use an adhesive to bond the prepared high-temperature graphene heating film (PI substrate) to the copper plate before it can be used. The high-temperature graphene heating plate disclosed in this invention uses borosilicate glass as the substrate, eliminating the need for the adhesive bonding step between the prepared high-temperature graphene heating film (PI substrate) and the copper plate, thus simplifying the preparation process. Furthermore, the wiring terminals are welded onto the borosilicate glass substrate, making the operation convenient.

[0081] 2. The more complete the graphene transfer, the higher the integrity of the infrared imaging. Using an adhesive layer to transfer graphene can improve the integrity and quality of the graphene transfer.

[0082] 3. By using an adhesive layer to transfer graphene, and by adding lithium salt dopants to the adhesive layer, the integrity and quality of graphene transfer can be improved, and the resistance of graphene can be adjusted to improve the thermal stability of graphene and the yield of the product.

[0083] 4. By designing patterned high-temperature graphene films and patterned electrode layers, the resistance of high-temperature graphene heating plates can be reduced, thereby increasing their heating temperature. Specifically, by reducing the spacing between two adjacent inner electrodes in the electrode layer and increasing the total length of the intersection area between the high-temperature graphene heating film and the inner electrodes, the resistance of the high-temperature graphene heating plate can be reduced, thus increasing its heating temperature.

[0084] 5. The data from the heating temperature at 5 minutes and 10 minutes show that using borosilicate glass as the substrate of the high-temperature graphene heating plate results in a fast heating rate and good thermal stability.

[0085] 6. Heat reflective material (such as aluminum foil) is bonded to the non-working surface (non-heat radiation surface) of the high-temperature graphene heating plate. Due to the high reflectivity of the heat reflective material, it can block high-temperature heat radiation and reduce heat loss from the non-working surface, thereby improving the heat radiation capacity of the working surface and increasing the heating temperature of the working surface.

[0086] Although this disclosure has been described and illustrated with reference to specific embodiments thereof, such descriptions and illustrations are not limiting of this disclosure. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the true spirit and scope of this disclosure as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between the technical representation in this disclosure and actual equipment due to variables in the manufacturing process, etc. Other embodiments of this disclosure may exist that are not specifically described. The description and illustrations should be considered illustrative rather than restrictive. Modifications may be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this disclosure. All such modifications are intended to fall within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations may be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this disclosure. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit this disclosure.

Claims

1. A high-temperature graphene heating plate, comprising: High-temperature resistant rigid substrate; A high-temperature graphene electrothermal film is disposed on the high-temperature resistant rigid substrate; A high-temperature resistant protective layer is disposed on the high-temperature graphene electrothermal film; The high-temperature graphene heating plate also includes: An adhesive layer is disposed between the high-temperature resistant rigid substrate and the high-temperature graphene electric heating film. The adhesive layer contains a dopant, which is a lithium salt. The high-temperature graphene electric heating plate is used for moxibustion. The temperature of the high-temperature graphene electric heating plate is greater than 200°C. The high-temperature graphene heating plate also includes: An isolation layer is in contact with the high-temperature resistant protective layer or the high-temperature resistant rigid substrate. When the high-temperature resistant protective layer is a non-working surface, the isolation layer is in contact with the high-temperature resistant protective layer. When the high-temperature resistant rigid substrate is a non-working surface, the isolation layer is in contact with the high-temperature resistant rigid substrate.

2. The high-temperature graphene heating plate according to claim 1, wherein, The high-temperature resistant rigid substrate is high-temperature resistant glass.

3. The high-temperature graphene heating plate according to claim 2, wherein, The high-temperature resistant glass is either quartz glass or borosilicate glass.

4. The high-temperature graphene heating plate according to claim 1, wherein, The high-temperature graphene heating plate also includes an electrode layer disposed on the high-temperature graphene heating film.

5. The high-temperature graphene heating plate according to claim 1, wherein, The insulating layer is aluminum foil.

6. A method for manufacturing a high-temperature graphene heating plate, comprising: A high-temperature graphene electrothermal film and an electrode layer are sequentially formed on a high-temperature resistant rigid substrate; A high-temperature resistant protective layer is provided on the electrode layer; The step of sequentially forming a high-temperature graphene electrothermal film and an electrode layer on a high-temperature resistant rigid substrate includes: An adhesive layer, a high-temperature graphene electrothermal film, and an electrode layer are sequentially formed on a high-temperature resistant rigid substrate. The step of sequentially forming an adhesive layer, a high-temperature graphene electrothermal film, and an electrode layer on a high-temperature resistant rigid substrate includes: Provide graphene layers / copper foil; The adhesive layer is printed on the graphene layer / copper foil; Prior to printing the adhesive layer on the graphene / copper foil, the method further includes: Add a dopant, wherein the dopant is a lithium salt, to the adhesive layer; and The process of printing the adhesive layer on the graphene layer / copper foil includes: An adhesive layer containing the dopant is printed on the graphene layer / copper foil; The method further includes: attaching the isolation layer to the high-temperature resistant rigid substrate or the high-temperature resistant protective layer, wherein when the high-temperature resistant protective layer is a non-working surface, the isolation layer is in contact with the high-temperature resistant protective layer, and when the high-temperature resistant rigid substrate is a non-working surface, the isolation layer is in contact with the high-temperature resistant rigid substrate.

7. The method according to claim 6, wherein, The process of sequentially forming an adhesive layer, a high-temperature graphene electrothermal film, and an electrode layer on a high-temperature resistant rigid substrate includes: The graphene layer / copper foil is bonded to the high-temperature resistant rigid substrate via the adhesive layer; Pattern the copper foil; The graphene layer is patterned, and the electrode layer is printed.

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