Solid-state batteries

Abstract

A solid battery is covered on a substrate, and a circuit for the solid battery is arranged on the substrate.

Description

Technical Field

[0001] The present invention relates to a solid battery, and more particularly to a packaged solid battery. Background Art

[0002] Currently, secondary batteries that can be repeatedly charged and discharged are used in various applications. For example, secondary batteries are used as power sources for electronic devices such as smartphones and notebook computers.

[0003] In a secondary battery, a liquid electrolyte is generally used as a medium for ion movement that facilitates charge and discharge. That is, a so-called electrolyte is used in a secondary battery. However, in such a secondary battery, safety is generally required in terms of preventing leakage of the electrolyte. In addition, since the organic solvent used in the electrolyte is a flammable substance, safety is also required in this regard.

[0004] Therefore, solid batteries using solid electrolytes instead of electrolyte solutions have been studied.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2015-220107

[0008] Patent Document 2: Japanese Patent Application Publication No. 2007-5279 Summary of the invention

[0009] Problems to be solved by the invention

[0010] The inventors of the present application have noticed that there are still problems to be overcome in solid-state batteries, and have found that it is necessary to take corresponding measures. Specifically, the inventors of the present application have found that there are the following problems.

[0011] Solid batteries need to have the following structure: the material that generates the battery reaction itself is isolated from the external environment, and water vapor and foreign matter are prevented from entering and the leakage of battery reaction materials is prevented. In this regard, lithium-ion batteries widely used as secondary batteries, for example, use aluminum laminated films as bags for sealing (hereinafter, the bags are also referred to as "aluminum laminated bags"). The peripheral circuit substrate is connected to the positive and negative terminals taken out of the aluminum laminated bag, and used as a package integrated with the battery.

[0012] In this lithium-ion battery, an aluminum laminate bag protects the battery body. Only the tabs led out from the electrodes are exposed to the outside of the aluminum laminate bag, and electricity is obtained through the tabs. However, the aluminum laminate bag requires the "adhesive portion" used for sealing to protrude to the surroundings, which makes it difficult to achieve miniaturization of the package volume in terms of structure. In addition, it is also considered to encapsulate the peripheral circuit substrate in the space outside the aluminum laminate bag, but this has almost no effect on reducing the overall volume. On the contrary, since it becomes a double packaging structure, it is possible to increase useless volume through such packaging.

[0013] Therefore, in the sealing of solid batteries, the idea of ​​following the aluminum laminate bag of lithium batteries may not be the best solution. As solid batteries, it is necessary to respond from a new perspective from the perspective of compactness.

[0014] The present invention has been made in view of the above problems. That is, the main object of the present invention is to provide a packaging technology for a solid battery that has sealing properties and contributes to compactness.

[0015] Means for solving problems

[0016] The inventors of the present application attempted to solve the above-mentioned problems by taking measures in a new direction, rather than extending the existing technology, and as a result, they completed the invention of a solid battery that can achieve the above-mentioned main purpose.

[0017] In the present invention, there is provided a solid battery having a substrate, wherein the solid battery is covered on the substrate, and a circuit for the solid battery is provided on the substrate.

[0018] Effects of the Invention

[0019] The solid battery according to the present invention is a solid battery package having sealing properties and suitable for compactness.

[0020] More specifically, from the viewpoint of preventing water vapor from penetrating, the solid battery is covered on the substrate for packaging, and from the viewpoint of compactness, the "circuit for the solid battery" is provided on the substrate. That is, the "circuit for the solid battery" is provided on the surface of the substrate rather than inside the substrate. Since the substrate is originally used for packaging and is also used to provide the peripheral circuit of the solid battery, the overall size will not be increased. Therefore, through the present invention, a package that is compact as a whole while achieving the sealing of the solid battery can be obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a cross-sectional view schematically showing the internal structure of a solid battery.

[0022] Figure 2 It is a cross-sectional view schematically showing the structure of a solid battery according to one embodiment of the present invention.

[0023] Figure 3 It is a cross-sectional view schematically showing the structure of a solid battery according to another embodiment of the present invention (a cover member composed of a cover insulating film and a cover inorganic film).

[0024] Figure 4 (a) to (d) are circuit diagrams of battery peripheral circuits provided on a substrate. Figure 4 (a): protection circuit, Figure 4 (b): Charging control circuit, Figure 4 (c): Temperature control circuit, Figure 4 (d): Output compensation circuit).

[0025] Figure 5 (a) to (c) are circuit diagrams in which a plurality of battery peripheral circuits arranged on a substrate are combined. Figure 5 (a): Charging control and protection circuit, Figure 5 (b): Charge control, protection, and output stabilization power supply circuit, Figure 5 (c): Charging control, protection, output stabilization, power supply, output compensation circuit).

[0026] Fig. 6A This is a schematic cross-sectional view for explaining a method of providing an electric circuit on a substrate in parallel with a solid battery.

[0027] Figure 6B This is a schematic cross-sectional view for explaining a method of providing an electric circuit on a substrate in parallel with a solid battery.

[0028] Figure 7 It is a schematic cross-sectional view for explaining a modification of the cover insulating film.

[0029] Figure 8 It is a schematic cross-sectional view for explaining a modification of the covering inorganic film.

[0030] Fig. 9 This is a schematic cross-sectional view for explaining a modified form of the covering inorganic film (using a metal pad).

[0031] Fig.10 It is a schematic cross-sectional view for explaining the modification of the cover insulating film and the cover inorganic film.

[0032] Fig.11 It is a cross-sectional view schematically showing the structure of a solid battery involved in another embodiment of the present invention (a filler-containing method of the covering insulating layer, a method in which the covering inorganic film is greatly extended to cover the supporting substrate, and a method in which the supporting substrate and the covering inorganic film are in the same plane).

[0033] Fig.12(a) to (d) are cross-sectional views schematically showing the steps of obtaining the solid battery of the present invention.

[0034] Fig.13 This is a schematic cross-sectional view for explaining the form of a cover film formed by a coating method. DETAILED DESCRIPTION

[0035] The solid battery of the present invention will be described in detail below. Although the description will be made with reference to the drawings as needed, the contents of the drawings are only schematically and exemplarily shown for the purpose of understanding the present invention, and the appearance, dimensional ratio, etc. may differ from the actual objects.

[0036] The solid battery of the present invention is equivalent to a packaged solid battery. The "packaged solid battery" mentioned in this specification refers to a solid battery that is protected from the external environment in a broad sense, and in a narrow sense, refers to a solid battery that is sealed so that water vapor from the external environment does not enter the interior of the solid battery. Preferably, such a solid battery of the present invention that prevents moisture penetration is packaged in a manner suitable for installation on a secondary substrate, in particular, in a manner suitable for surface mounting. Therefore, in a preferred embodiment, the battery of the present invention is an SMD (Surface Mount Device) type battery.

[0037] The "cross-section" mentioned in this specification refers to the form when observed from a direction roughly perpendicular to the thickness direction based on the stacking direction of each layer constituting the solid battery (in short, the form when cut along a surface parallel to the thickness direction). The "up and down directions" and "left and right directions" used directly or indirectly in this specification correspond to the up and down directions and left and right directions in the figure, respectively. Unless otherwise specified, the same symbols or signs represent the same parts, parts or the same meanings. In a preferred embodiment, it can be understood that the vertical direction downward (i.e., the direction of gravity) is equivalent to the "downward direction / bottom side", and the opposite direction is equivalent to the "upward direction / top side".

[0038] The "solid battery" mentioned in the present invention refers to a battery whose constituent elements are composed of solids in a broad sense, and refers to an all-solid battery whose constituent elements (particularly preferably all constituent elements) are composed of solids in a narrow sense. In a preferred embodiment, the solid battery in the present invention is a stacked solid battery in which each layer forming a battery constituent unit is stacked on each other, and preferably each layer is composed of a sintered body. It should be noted that the "solid battery" includes not only the so-called "secondary battery" that can be repeatedly charged and discharged, but also includes a "primary battery" that can only be discharged. In a preferred embodiment of the present invention, the "solid battery" is a secondary battery. "Secondary battery" is not overly restricted to the name, for example, it may also include "power storage devices" and the like.

[0039] Hereinafter, the basic structure of the solid battery of the present invention will be described first. The structure of the solid battery described here is only an example for understanding the invention and does not limit the invention.

[0040] [Basic structure of solid-state batteries]

[0041] A solid battery has at least a positive electrode layer and a negative electrode layer and a solid electrolyte. Figure 1 As shown, the solid battery 100 has a solid battery stack including a battery constituent unit, wherein the battery constituent unit is composed of a positive electrode layer 110, a negative electrode layer 120, and at least a solid electrolyte 130 interposed therebetween.

[0042] In a solid battery, each layer constituting the solid battery can be formed by firing, and the positive electrode layer, negative electrode layer and solid electrolyte are sintered layers. Preferably, the positive electrode layer, negative electrode layer and solid electrolyte are fired integrally with each other, so that the solid battery stack is an integrally sintered body.

[0043] The positive electrode layer 110 is an electrode layer containing at least a positive electrode active material. The positive electrode layer may further contain a solid electrolyte. In a preferred embodiment, the positive electrode layer is composed of a sintered body containing at least positive electrode active material particles and solid electrolyte particles. On the other hand, the negative electrode layer is an electrode layer containing at least a negative electrode active material. The negative electrode layer may further contain a solid electrolyte. In a preferred embodiment, the negative electrode layer is composed of a sintered body containing at least negative electrode active material particles and solid electrolyte particles.

[0044] The positive electrode active material and the negative electrode active material are substances that participate in the handover of electrons in a solid battery. Ions move (conduct) between the positive electrode layer and the negative electrode layer via a solid electrolyte to carry out the handover of electrons, thereby charging and discharging. The positive electrode layer and the negative electrode layer are particularly preferably layers that can embed and deintercalate lithium ions or sodium ions. That is, the solid battery is preferably a fully solid secondary battery in which lithium ions or sodium ions move between the positive electrode layer and the negative electrode layer via a solid electrolyte to carry out the charge and discharge of the battery.

[0045] (Positive electrode active material)

[0046] As the positive electrode active material contained in the positive electrode layer, for example, at least one selected from the group consisting of a lithium-containing phosphate compound having a NASICON structure, a lithium-containing phosphate compound having an olivine structure, a lithium-containing layered oxide, and a lithium-containing oxide having a spinel structure can be cited. As an example of a lithium-containing phosphate compound having a NASICON structure, Li 3 V 2 (PO 4 ) 3 As an example of a lithium-containing phosphate compound having an olivine structure, Li3 Fe 2 (PO 4 ) 3 、LiFePO 4 and / or LiMnPO 4 As an example of lithium-containing layered oxide, LiCoO 2 and / or LiCo 1 / 3 Ni 1 / 3 Mn 1 / 3 O 2 As an example of a lithium-containing oxide having a spinel structure, LiMn 2 O 4 and / or LiNi 0.5 Mn 1.5 O 4 wait.

[0047] In addition, as the positive electrode active material capable of embedding and de-embedding sodium ions, at least one selected from the group consisting of sodium-containing phosphate compounds having a NASICON structure, sodium-containing phosphate compounds having an olivine structure, sodium-containing layered oxides, and sodium-containing oxides having a spinel structure can be listed.

[0048] (Negative electrode active material)

[0049] The negative electrode active material contained in the negative electrode layer 120 may include, for example, at least one selected from the group consisting of an oxide containing at least one element selected from the group consisting of Ti, Si, Sn, Cr, Fe, Nb and Mo, a graphite-lithium compound, a lithium alloy, a lithium-containing phosphate compound having a NASICON structure, a lithium-containing phosphate compound having an olivine structure, and a lithium-containing oxide having a spinel structure. As an example of a lithium alloy, Li-Al and the like may be cited. As an example of a lithium-containing phosphate compound having a NASICON structure, Li 3 V 2 (PO 4 ) 3 and / or LiTi 2 (PO 4 ) 3 As an example of a lithium-containing phosphate compound having an olivine structure, Li 3 Fe 2 (PO 4 ) 3 and / or LiCuPO 4 As an example of a lithium-containing oxide having a spinel structure, Li 4 Ti 5 O 12 wait.

[0050] The negative electrode active material capable of inserting and extracting sodium ions may include at least one selected from the group consisting of sodium-containing phosphate compounds having a NASICON structure, sodium-containing phosphate compounds having an olivine structure, and sodium-containing oxides having a spinel structure.

[0051] The positive electrode layer and / or the negative electrode layer may contain a conductive aid. As the conductive aid contained in the positive electrode layer and the negative electrode layer, at least one of metal materials such as silver, palladium, gold, platinum, aluminum, copper and nickel, and carbon, etc. can be listed. Although not particularly limited, copper is difficult to react with positive electrode active materials, negative electrode active materials, and solid electrolyte materials, and has an effect on reducing the internal resistance of solid batteries, so it is preferred.

[0052] Furthermore, the positive electrode layer and / or the negative electrode layer may contain a sintering aid. Examples of the sintering aid include at least one selected from the group consisting of lithium oxide, sodium oxide, potassium oxide, boron oxide, silicon oxide, bismuth oxide, and phosphorus oxide.

[0053] (Solid Electrolyte)

[0054] A solid electrolyte is a material that can conduct lithium ions or sodium ions. In particular, a solid electrolyte that forms a battery constituent unit in a solid battery forms a layer that can conduct lithium ions or sodium ions between the positive electrode layer and the negative electrode layer. It should be noted that the solid electrolyte only needs to be provided between the positive electrode layer and the negative electrode layer. In other words, the solid electrolyte may also be present around the positive electrode layer and / or the negative electrode layer in a manner extending from between the positive electrode layer and the negative electrode layer. Specific examples of solid electrolytes include lithium-containing phosphate compounds having a NASICON structure, oxides having a perovskite structure, and oxides having a garnet-type or garnet-type-similar structure. Examples of lithium-containing phosphate compounds having a NASICON structure include Li x M y (PO 4 ) 3 (1≤x≤2, 1≤y≤2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr). As an example of a lithium-containing phosphate compound having a NASICON structure, for example, Li 1.2 Al 0.2 Ti 1.8 (PO 4 ) 3 As an example of an oxide having a perovskite structure, La 0.55 Li 0.35 TiO 3As an example of an oxide having a garnet-type or garnet-type similar structure, Li 7 La 3 Zr 2 O 12 wait.

[0055] It should be noted that, as solid electrolytes capable of conducting sodium ions, for example, sodium-containing phosphate compounds having a NASICON structure, oxides having a perovskite structure, oxides having a garnet type or a garnet type-like structure, etc. can be cited. As sodium-containing phosphate compounds having a NASICON structure, Na x M y (PO 4 ) 3 (1≤x≤2, 1≤y≤2, M is at least one selected from the group consisting of Ti, Ge, Al, Ga and Zr).

[0056] The solid electrolyte layer may contain a sintering aid. The sintering aid contained in the solid electrolyte layer may be selected from the same materials as the sintering aid that may be contained in the positive electrode layer and the negative electrode layer, for example.

[0057] (Positive electrode current collecting layer and negative electrode current collecting layer)

[0058] The positive electrode layer 110 and the negative electrode layer 120 may respectively include a positive electrode collector layer and a negative electrode collector layer. The positive electrode collector layer and the negative electrode collector layer may respectively have the form of a foil, and from the viewpoint of reducing the manufacturing cost of the solid battery and reducing the internal resistance of the solid battery by integral sintering, they may have the form of a sintered body. It should be noted that when the positive electrode collector layer and the negative electrode collector layer have the form of a sintered body, they may also be composed of a sintered body containing a conductive aid and a sintering aid. The conductive aid contained in the positive electrode collector layer and the negative electrode collector layer may, for example, be selected from the same material as the conductive aid that may be contained in the positive electrode layer and the negative electrode layer. The sintering aid contained in the positive electrode collector layer and the negative electrode collector layer may, for example, be selected from the same material as the sintering aid that may be contained in the positive electrode layer and the negative electrode layer. It should be noted that in a solid battery, the positive electrode collector layer and the negative electrode collector layer are not necessary, and a solid battery without such a positive electrode collector layer and a negative electrode collector layer may also be considered. That is, the solid battery in the present invention may be a solid battery without a current collecting layer.

[0059] (End electrode)

[0060] In a solid battery, an end surface electrode 150 is generally provided. In particular, an end surface electrode is provided on the side of the solid battery. More specifically, an end surface electrode 150A on the positive electrode side connected to the positive electrode layer 110 and an end surface electrode 150B on the negative electrode side connected to the negative electrode layer 120 are provided (see Figure 1). Such an end surface electrode preferably includes a material with a high electrical conductivity. The specific material of the end surface electrode is not particularly limited, and at least one selected from the group consisting of silver, gold, platinum, aluminum, copper, tin and nickel can be listed.

[0061] [Characteristics of the solid state battery of the present invention]

[0062] The solid battery of the present invention is a solid battery having a substrate. Preferably, the battery of the present invention is a packaged solid battery. That is, the solid battery has a packaging structure that helps to protect it from the external environment. In particular, in the present invention, the solid battery packages the peripheral circuit (preferably a circuit for solid battery control) together with the supporting substrate in a state where the peripheral circuit is arranged on the supporting substrate.

[0063] Specifically, a solid battery is covered on a substrate, and a circuit for the solid battery is provided on the substrate. In particular, the circuit is not embedded in a supporting substrate supporting the solid battery, but is arranged on the surface (particularly the main surface) of the substrate. Figure 2 1 shows the basic structure of the packaged battery of the present invention. Referring to this figure, a solid battery 100 includes a substrate 10 and a cover member 50, and a circuit 80 on the substrate is also integrally provided as a whole.

[0064] Circuit 80 is a peripheral circuit for a solid battery. It can be any type of circuit as long as it is related to a solid battery. For example, circuit 80 can be a protection circuit and / or a charge and discharge control circuit. In the present invention, the solid battery is packaged together with such a circuit and a supporting substrate. Figure 2 As shown, the circuit for the solid battery (especially the circuit for controlling the solid battery) is arranged on the main surface of the substrate 10, and the circuit can extend in the surface direction of the main surface of the substrate. That is, the circuit 80 is arranged on the main surface of the substrate 10 in a direction orthogonal to the stacking direction of the solid battery stack (that is, the stacking direction of the electrode layer of the solid battery). In short, the circuit is provided in a manner attached to the main surface of the substrate. By arranging the circuit in this way, the main surface of the substrate 10 can be more effectively utilized as a battery control surface. In addition, since the circuit and the solid battery are close to each other on the substrate, the heat from the circuit on such a substrate is easily transferred to the solid battery, and due to the heat, the charging efficiency of the battery can also be improved. It should be noted that the "main surface" referred to in the present invention refers to a surface having a normal in the stacking direction of the electrode layer in the solid battery.

[0065] As shown in the figure, in the package involved in the present invention, a substrate 10 and a covering member 50 are arranged around the solid battery 100 in such a way that the solid battery is surrounded as a whole (so that all surfaces constituting the solid battery are not exposed to the outside). Due to this sealing form, in the present invention, it is preferred to encapsulate the solid battery to prevent water vapor from penetrating. In particular, the prevention of water vapor from penetrating is achieved in the form of a circuit for a solid battery being arranged on a substrate as a package.

[0066] from Figure 2 As can be seen from the shown form, the substrate 10 is a substrate that supports at least the solid battery 100. In order to provide such "support", the substrate is positioned close to one side of the main surface constituting the solid battery. Compared with the case where the main surface size of the substrate is equal to the main surface size of the solid battery, the main surface size of the substrate is preferably larger than the main surface size of the solid battery. In addition, since it is a "substrate", it is preferably in a thin plate-like form as a whole.

[0067] In the present invention, the substrate 10 supports not only the solid battery 100 but also the circuit 80 on the surface of the substrate (see Figure 2 ). That is, the substrate 10 in the present invention is a substrate that supports the solid battery 100 and the circuit 80 together. Due to this method, the substrate 20 can also be called a "support substrate" (hereinafter, the substrate is appropriately called a "support substrate" for explanation).

[0068] The substrate 10 may be a resin substrate, or may be a ceramic substrate. The substrate 10 does not have to be a silicon substrate in particular. In a preferred embodiment, the substrate 10 is a ceramic substrate. That is, the substrate 10 includes ceramics, which occupy the matrix component of the substrate. A support substrate composed of ceramics helps prevent water vapor from penetrating, and is also a preferred substrate in terms of heat resistance during installation. Such a ceramic substrate can be obtained by firing, for example, by firing a green sheet stack. In this regard, the ceramic substrate may be, for example, an LTCC substrate (LTCC: Low Temperature Co-fired Ceramics), or may be an HTCC substrate (HTCC: High Temperature Co-fired Ceramic: High Temperature Co-fired Ceramic). Although it is only an example, the thickness of the substrate may be greater than 20 μm and less than 1000 μm, for example, greater than 100 μm and less than 300 μm.

[0069] For sealing, the cover member 50 is preferably provided in a manner to cover the top surface and the side surfaces of the solid battery on the substrate 10. Figure 2 As shown, the covering member 50 may be arranged in a manner exceeding the side of the solid battery. From the viewpoint of more preferred sealing, the covering member 50 is preferably as follows Figure 3The solid battery 100 is shown as being composed of a cover insulating layer 30 and a cover inorganic film 40. For example, the cover insulating layer 30 is preferably provided so as to cover the top and side surfaces of the solid battery 100, and the cover inorganic film 40 is provided on the cover insulating layer. This is because the property of preventing water vapor transmission can be particularly effectively improved.

[0070] In other words, the covering member 50 is preferably a layer provided so as to cover at least the top surface 100A and the side surface 100B of the solid battery 100. Figure 3 As shown, the solid battery 100 disposed on the support substrate 10 is largely surrounded by the covering member 50 as a whole. In a preferred embodiment, the covering member 50 is disposed on the entire battery surface area of ​​the top surface 100A and the side surface 100B of the solid battery 100 (at least the entire battery "top surface" area and the battery "side surface" area), and the covering member 50 is disposed in a manner that extends toward the substrate side beyond the battery side when viewed in cross section as shown in the figure.

[0071] As can be seen from the above description, the "top surface" mentioned in this specification refers to the surface relatively located on the upper side among the surfaces constituting the battery. Assuming that it is a typical solid battery with two opposing main surfaces, the "top surface" mentioned in this specification refers to one of the above main surfaces, especially the main surface on the different side from the main surface close to the supporting substrate (that is, the mounting surface side in the SMD type battery described later). Therefore, "arranged in a manner covering the top surface and side surfaces of the solid battery" mentioned in the present invention actually means that, assuming that the solid battery is arranged on a plane, a covering component is provided for at least the battery surface other than the surface area other than the surface in contact with the plane.

[0072] The covering insulating layer 30 of the covering member 50 is preferably equivalent to a resin layer. That is, the covering insulating layer 30 preferably includes a resin material that forms the base material of the layer. As can be seen from the diagram, this means that the solid battery disposed on the supporting substrate 10 is sealed by the resin material of the covering insulating layer 30. The covering insulating layer 30 composed of such a resin material complements the covering inorganic film 40 and contributes to appropriate water vapor barrier.

[0073] The material of the cover insulating layer 30 may be any type as long as it exhibits insulation properties. For example, when the cover insulating layer includes a resin, the resin may be a thermosetting resin or a thermoplastic resin. There is no particular limitation on the specific resin material of the cover insulating layer, and examples thereof include epoxy resins, silicone resins, and liquid crystal polymers. Although only illustrative, the thickness of the cover insulating layer may be greater than 30 μm and less than 1000 μm, for example, greater than 50 μm and less than 300 μm.

[0074] The cover inorganic film 40 of the cover member 50 is preferably provided to cover the cover insulating layer 30. In this case, since the cover inorganic film 40 is located on the cover insulating layer 30, it has a form that, together with the cover insulating layer 30, largely surrounds the solid battery 100 on the support substrate 10 as a whole.

[0075] The covering inorganic film 40 preferably has a thin film form. Therefore, in the covering member 50, the thickness of the covering inorganic film 40 is less than the thickness of the covering insulating layer 30. As long as it helps to have an inorganic layer with a thin film form, the material of the covering inorganic film 40 is not particularly limited, and can be any one of metal, glass, oxide ceramics, or a mixture thereof. In a preferred embodiment, the covering inorganic film 40 contains a metal component. That is, the covering inorganic film 40 is preferably a metal thin film. Although it is only an example, the thickness of the covering inorganic film can be greater than 0.1 μm and less than 100 μm, for example, greater than 1 μm and less than 50 μm.

[0076] The covering inorganic film 40 having a thin film morphology may be a plated film. In particular, depending on the manufacturing method, the covering inorganic film 40 may be a dry plated film. The dry plated film is a film obtained by a gas phase method such as physical vapor deposition (PVD) or chemical vapor deposition (CVD), and has a very small thickness of nanometer or micrometer level. Such a thin dry plated film contributes to a more compact package. The dry plated film may be composed of, for example, at least one metal component, semi-metal component, inorganic oxide and / or glass component selected from the group consisting of aluminum (Al), nickel (Ni), palladium (Pd), silver (Ag), tin (Sn), gold (Au), copper (Cu), titanium (Ti), platinum (Pt), silicon / silicon (Si) and SUS. The dry plated film composed of such a component is chemically and / or thermally stable, so it is possible to obtain a solid battery with excellent chemical resistance, weather resistance and / or heat resistance, and further improved long-term reliability. It should be noted that, as can be seen from the materials exemplified above, the covering inorganic film 40 may not be composed of tantalum.

[0077] In the present invention, the solid battery is packaged by forming it in a manner surrounded by a substrate and a covering member. It is particularly preferred that the solid battery is packaged in a manner suitable for surface mounting, and the substrate is a terminal substrate. It can also be said that the supporting substrate is preferably a terminal substrate. This means that the substrate according to a preferred manner constitutes a supporting substrate for the solid battery and the peripheral circuit, and becomes a terminal substrate for the external terminal of the packaged solid battery.

[0078] A solid battery having a supporting substrate as a terminal substrate can be mounted on other secondary substrates such as a printed wiring board and / or a motherboard in the form of a substrate. For example, a solid battery having a supporting substrate that can be used as a terminal substrate can also be installed on an external substrate such as a printed wiring board and / or a motherboard having electronic components and / or ICs. In addition, for example, the solid battery can be surface mounted via a supporting substrate by reflow soldering or the like. Therefore, the packaged solid battery of the present invention can be said to be an SMD type battery (i.e., a surface mounted product). In particular, when the terminal substrate is composed of a ceramic substrate, the heat resistance of the solid battery of the present invention is high, and it can become an SMD type battery that can be welded and mounted.

[0079] Since it is a terminal substrate, the substrate preferably has wiring, and it is particularly preferred to have wiring that electrically connects the upper and lower surfaces and the upper and lower surface layers. That is, a preferred embodiment of a support substrate has wiring that electrically connects the upper and lower surfaces of the substrate, and is a terminal substrate for the external terminal of a solid battery after packaging. In short, the support substrate that supports the solid battery and the circuit can have a connecting conductive portion that electrically connects the two main surfaces of the substrate to each other. In this method, since the wiring of the support substrate can be used when removing the solid battery from the external terminal, it is not necessary to use a metal label to remove it from the package while being wrapped by the water vapor barrier layer, thereby increasing the design freedom of the external terminal. There is no particular limitation on the wiring in the terminal substrate, and it can have any form as long as it facilitates the electrical connection between the upper and lower surfaces of the substrate. Since it facilitates electrical connection, it can also be said that the wiring in the terminal substrate is the conductive portion 17 of the substrate (refer to Figure 2 or Figure 3 ). The conductive part of such a substrate may have a wiring layer, a through hole and / or a pad. Figure 3 In the embodiment shown, a through hole 14 and / or a pad 16 are provided on the support substrate 10. The "through hole" mentioned here refers to a component for electrically connecting the support substrate in the vertical direction / substrate thickness direction, such as preferably a buried through hole, and may also be in the form of an internal through hole, etc. In addition, the "pad" mentioned here refers to a terminal portion / connection portion for electrical connection (preferably a terminal portion / connection portion connected to a through hole) provided on the upper main surface and / or the lower main surface of the support substrate, and may be, for example, a square pad, or a circular pad, etc.

[0080] In the terminal substrate having the conductive portion 17, the lead-out position of the external terminal of the battery package can be arbitrarily set at the lower part of the package. Figure 2 as well as Figure 3As shown in the form, the lead-out shape of such an external terminal is substantially free of bumps and can be used as a smooth surface in the same plane as the mounting package. In a solid battery having such a substrate, the terminal can be taken out of the battery to the outside of the package at a relatively short distance (preferably the shortest distance), so a battery package with less loss can be obtained.

[0081] The upper and lower surfaces of the terminal substrate in the present invention are electrically connected to each other. Therefore, as long as it is such a structure, the type of terminal substrate is not particularly limited. For example, as a terminal substrate, a substrate that can be connected up and down and facilitates component installation can also be used. Although it is only an example, an interposer whose upper and lower surfaces are electrically connected to each other can also be used (in this case, the substrate material of the interposer does not have to be specifically silicon, but can also be ceramic).

[0082] In a solid battery having a support substrate as a terminal substrate, the wiring of the support substrate is electrically connected to the terminal portion of the solid battery. That is, the conductive portion of the support substrate is electrically connected to the end face electrode of the solid battery. For example, the end face electrode on the positive side of the solid battery is electrically connected to the conductive portion on the positive side of the support substrate, and on the other hand, the end face electrode on the negative side of the solid battery is electrically connected to the conductive portion on the negative side of the support substrate. Thus, the conductive portions on the positive side and negative side of the support substrate (particularly the lower pad / bottom pad) can be used as the positive terminal and negative terminal of the solid battery package, respectively.

[0083] In the present invention, a component that facilitates proper electrical connection between the terminal substrate and the solid battery may also be provided. For example, the solid battery of the present invention may further include a conductive connecting component 60 (see Figure 3 The conductive connection member 60 may be formed using a paste containing at least one selected from the group consisting of silver (Ag), copper (Cu), palladium (Pd), gold (Au), platinum (Pt), aluminum (Al), and nickel (Ni).

[0084] from Figure 3 As can be seen from the illustrated method, the circuit 80 is located in the "gap between the solid battery 100 and the substrate 10" generated by the conductive connecting member 60 (i.e., the conductive connecting member 60 that electrically connects the end surface electrode 150 of the solid battery and the conductive portion 17 such as the wiring of the substrate). In this case, the gap generated by the conductive connecting member 60 can be effectively used as a space for installing the circuit 80, so it can contribute to reducing the height of the solid battery.

[0085] The solid battery 100 of the present invention is characterized in that it is packaged together with the circuit 80 using the substrate 10. That is, in the present invention, active components, passive components and / or auxiliary components constituting the circuit for the solid battery can be configured on the substrate together with the solid battery and packaged. As an active component, at least one selected from the group consisting of transistors, ICs, diodes, operational amplifiers, etc. can be listed. As a passive component, at least one selected from the group consisting of resistors, coils, capacitors, etc. can be listed. As an auxiliary component, at least one selected from the group consisting of connectors, terminals, wiring, and wires can be listed. Such circuit elements can also have a chip form.

[0086] For example, circuit elements for battery peripheral circuits such as protection circuits and / or charge and discharge control circuits are packaged together with solid batteries. That is, protection circuit elements for preventing the solid battery from being charged during overcharging, preventing the solid battery from being discharged during overdischarging, and / or stopping large current discharge during short circuits, and / or charge and discharge control circuit elements for controlling the charging and / or discharging of the solid battery are packaged integrally with the solid battery. In short, in the present invention, the circuit provided on the substrate may be a circuit for controlling the solid battery. It should be noted that, Figure 2 as well as Figure 3 As shown, such an electric circuit 80 can be in contact with the main surface of the substrate 10, and not in contact with the solid battery 100 itself. This can suppress problems caused by physical contact between the battery and the electric circuit.

[0087] From a broader perspective, in the present invention, at least one battery peripheral circuit selected from the group consisting of a protection circuit, a charging control circuit, a temperature control circuit, an output compensation circuit, and an output stabilization power supply circuit can be packaged together with the solid battery.

[0088] When the battery peripheral circuit is a protection circuit, it is possible to prevent overdischarge, overcharge, overcurrent, overheating, etc. of the solid battery. Figure 4 (a) shows an example of a circuit diagram in which the circuit provided on the substrate is a protection circuit. Although it is only an example, the protection circuit performs control so that a predetermined voltage or current does not become excessive.

[0089] When the battery peripheral circuit is a charge control circuit, the charge of the solid battery can be controlled. Figure 4 (b) shows an example of a circuit diagram in which the circuit provided on the substrate is a charging control circuit. Although it is only an example, the charging control circuit performs control so as to achieve desired constant current constant voltage (CCCV) charging.

[0090] When the battery peripheral circuit is a temperature control circuit, the solid battery can be controlled to an appropriate temperature to improve the charge and discharge efficiency. Figure 4 (c) shows an example of a circuit diagram in which the circuit provided on the substrate is a temperature control circuit. Although it is only an example, when the temperature of the solid battery is controlled by the temperature control circuit, the temperature of the solid battery can be detected by a temperature detection unit such as a thermocouple or thermistor, and based on the temperature information obtained, power is supplied to the thermoelectric element via the temperature control circuit to heat and / or cool the battery.

[0091] When the battery peripheral circuit is an output compensation circuit, the internal impedance of the solid battery can be suppressed to be low, and the decrease in the battery voltage can be alleviated. Figure 4 (d) shows an example of a circuit diagram in which a circuit provided on a substrate serves as an output compensation circuit.

[0092] The above circuit can be configured to have a single function or a combination of multiple functions. For example, by combining multiple sub-circuits, the control of the solid battery can be given the characteristics of each circuit. As an example, Figure 5 (a) represents a combination of a charging control circuit and a protection circuit. Figure 5 (b) represents a combination of a charging control circuit, a protection circuit, and an output stabilization power supply circuit. Figure 5 (c) represents a combination of a charging control circuit, a protection circuit, an output stabilization power supply circuit, and an output compensation circuit. It should be noted that the output stabilization power supply circuit may be a circuit in which a DC-DC converter is incorporated.

[0093] In the package of the present invention, a circuit 80 is provided on a substrate 10 supporting a solid battery 100. That is, the circuit dedicated to the solid battery is arranged on the surface of the substrate, not inside the substrate constituting the solid battery package (i.e., the "battery package substrate"). The circuit only needs to be provided on the battery package substrate, and therefore is not particularly limited to Figure 3 The form shown can also be Fig. 6A as well as Figure 6B The form shown.

[0094] exist Figure 3 In the embodiment shown, the circuit 80 is located between the substrate 10 and the solid battery 100. That is, the solid battery disposed on the substrate has a gap between its lower side and the substrate, and the circuit is disposed in the gap. Fig. 6A as well as Figure 6BIn the embodiment, the circuit 80 is arranged side by side with the solid battery 100 on the surface of the substrate 10, not between the substrate 10 and the solid battery 100. That is, on the main surface of the substrate where the solid battery is arranged, the circuit is arranged in a non-battery arrangement area that does not overlap with the solid battery.

[0095] The present invention integrates a solid battery and a peripheral circuit dedicated to the battery via the same substrate. Figure 3 , Fig. 6A as well as Figure 6B As shown, since it is the same substrate, the dedicated circuit and the solid battery are arranged adjacent to each other on the substrate. The "adjacent arrangement" mentioned here refers to the positional relationship in which the circuit and the solid battery are close in a broad sense, and in a narrow sense, it refers to the configuration of the circuit on the substrate in a manner directly below or directly to the side of the solid battery. According to the form shown in the figure, although the circuit is provided as a package, the overall size of the package will not be unnecessarily large. That is, in the present invention, a more preferred SMD (surface mounted device) can be obtained by making it a compact solid battery package.

[0096] In a more specific manner, various electronic components such as IC and / or other chip components and wiring etc. can be provided as a circuit for controlling the solid battery. For example, various electronic components 80 represented by IC and / or other chip components etc. for protection circuit and / or charge and discharge control circuit and wiring etc. are provided adjacent to the solid battery 100 on the main surface of the substrate.

[0097] Here, the inclusion of ICs in the circuit means that in addition to the control effect based on the circuit, it can also achieve the effect of utilizing heat. The chip components of the circuit will generate heat, but the present invention can effectively utilize this heat. Specifically, since the circuit and the solid battery are arranged adjacent to each other on the substrate, the heat from the circuit on such a substrate is easily transferred to the solid battery, and the heat can also improve the charging efficiency of the battery.

[0098] right Figure 3 , Fig. 6A as well as Figure 6B Each form is described in detail.

[0099] exist Figure 3 In the illustrated embodiment, the circuit 80 is located in the gap between the substrate 10 and the solid battery 100. As described above, in the solid battery of the present invention, it is preferred to provide a conductive connection portion 60 that electrically connects the end surface electrode 150 and the conductive portion 17 to each other, but the circuit 80 is located in the gap formed by the conductive connection portion 60. Since the circuit is provided in the region where the solid battery and the support substrate overlap each other, the volume of the package is not increased due to the presence of electronic components, wiring, etc. used for the circuit, which is particularly helpful in realizing a compact battery package.

[0100] For a compact battery package, it is preferred that the top-view size of the substrate (the size of the main surface of the substrate with the battery mounted thereon) is approximately the same as or larger than the top-view size of the solid battery (the size of the main surface of the battery). In addition, it is preferred that the top-view size of the substrate is larger than the circuit size. For example, if the top-view size of the substrate is set to S1 and the top-view size of the solid battery is set to S2, then it can be 1.1×S2<S1<1.5×S2, so it can be 1.1×S2<S1<1.4×S2, 1.1×S2<S1<1.3×S2, or 1.1×S2<S1<1.2×S2, etc. If the top-view size of the substrate is larger than the top-view size of the solid battery, it is not only preferred in terms of supporting the solid battery and the circuit, but also the main surface of the substrate becomes larger, and the design freedom of the circuit may be higher.

[0101] exist Figure 3 In the illustrated embodiment, the circuit 80 is provided on the main surface of the substrate 10 directly below the solid battery 100, so the solid battery 100 and the circuit 80 are particularly close to each other. Therefore, the heat from the circuit is easily and efficiently transferred to the solid battery, which is particularly likely to improve the charging efficiency of the solid battery.

[0102] The conductive connecting part 60 between the substrate and the solid battery not only contributes to the mutual electrical connection between the solid battery and the substrate (especially the terminal substrate), but also contributes to the gap between the solid battery and the substrate for circuit setting. Therefore, the conductive connecting part forms a spacer, and therefore, such a connecting part is equivalent to a conductive spacer. In other words, in a preferred embodiment of the present invention, it can be said that there is a conductive spacer between the substrate and the solid battery. The conductive spacer is, for example, a part containing a metal component. As such a metal component, a metal component selected from the group consisting of silver (Ag), copper (Cu), palladium (Pd), gold (Au), platinum (Pt), aluminum (Al) and nickel (Ni) can be cited as an example.

[0103] The conductive spacer can be composed of a single component, or it can be composed of at least two components. For example, the conductive spacer can have a non-cleaning type component that does not require flux cleaning during welding (hereinafter, also referred to as "non-cleaning type bonding material"). In particular, at least a portion of the conductive spacer can be a non-cleaning type bonding material. In this regard, the portion in direct contact with the solid battery can contain a non-cleaning type bonding material. The non-cleaning type bonding material is set due to the packaging process. Specifically, the non-cleaning type bonding material can be set by mounting the solid battery on the substrate without performing flux cleaning after the circuit is set on the substrate.

[0104] In the package of the present invention, a resin material may be provided between the substrate and the solid battery. In other words, a resin material may be provided in the "gap between the solid battery and the supporting substrate" formed by the presence of the conductive connecting member such as the conductive spacer. Figure 3 In the embodiment shown in FIG. 1 , the resin material 30 ′ may be provided to fill the gap between the substrate and the solid battery except for the circuit. Figure 3 In the cross-sectional view shown, the resin material 30' can be provided inside the conductive connection part 60 in a manner that fills the gap between the substrate 10 and the solid battery 100. It should be noted that, according to the illustrated form, the resin material 30' that fills the gap between the substrate 10 and the solid battery 100 is located inside the covering inorganic film 40.

[0105] The resin material can be any one of a thermosetting resin material or a thermoplastic resin material. Although there is no particular limitation, as with the covering insulating layer, for example, epoxy resins, silicone resins, liquid crystal polymers, etc. can be listed. In this regard, the resin material between the substrate and the solid battery can also be provided integrally with the above-mentioned covering member (especially the covering insulating layer). In other words, the covering insulating layer 30' is not only provided on the top surface and the side surface of the solid battery 100, but can also be provided in the gap between the bottom surface of the solid battery 100 and the upper surface of the supporting substrate 10. Such a resin material can function as a protective material for properly protecting the circuit between the substrate and the solid battery in the package involved in the present invention. In addition, if the gap between the substrate and the solid battery is filled with a resin material, the reliability of the circuit can also be improved due to the insulating effect. Therefore, the resin material can also be referred to as a circuit protection material.

[0106] exist Fig. 6A as well as Figure 6B In the embodiment shown, the circuit is provided not in the gap between the substrate and the solid battery but on a substrate other than the gap. In the main surface of the substrate on which the solid battery is provided, the circuit is provided in a substrate region away from the battery installation region.

[0107] Fig. 6A as well as Figure 6B The form and Figure 3 The shape is the same as that of the solid-state battery, and a peripheral circuit dedicated to the solid-state battery is provided on the same substrate. However, since there is no gap between the solid-state battery and the substrate, it is easy to reduce the height dimension of the package as a whole.

[0108] exist Fig. 6AIn the embodiment, the circuit 80 for the solid battery is covered by the covering member 50. More specifically, various electronic components such as IC and chip components used in the circuit 80 are covered by the covering member 50. It is particularly preferred that various electronic components of the circuit 80 are covered by the covering insulating layer 30 of the covering member 50. On the other hand, in Figure 6B In the embodiment, the circuit 80 for the solid battery is not covered by the covering member 50. More specifically, various electronic components such as IC and / or chip components used in the circuit 80 provided on the substrate are not covered by the covering member 50. If sealing is more important, it is preferred as follows Fig. 6A In this way, the circuit 80 is covered by the cover member 50, but depending on the size of the electronic components used in the circuit, it may not be suitable to be sealed by the cover insulating layer 30. This is because if the cover insulating layer 30 is used to cover a larger electronic component, the thickness of the cover insulating layer 30 will inevitably increase, and the sealed portion will become larger. Figure 6B In the embodiment shown, the circuit may be sealed separately by a covering member different from the covering member that seals the solid battery.

[0109] Thus, the present invention has the feature of packaging the solid battery together with the circuit, and also has the feature of preventing water vapor from penetrating.

[0110] The solid battery of the present invention is encapsulated by a supporting substrate, a covering insulating layer, and a covering inorganic film, and becomes a battery with particularly excellent water vapor permeability prevention. That is, in the battery package involved in the present invention, at least due to the covering insulating layer and the covering inorganic film covering the top and side surfaces of the solid battery on the supporting substrate, the degradation of the battery characteristics caused by water vapor (more specifically, the phenomenon of the degradation of the characteristics of the solid battery due to the mixing of water vapor from the external environment). That is, it is preferred to provide a covering insulating layer and a covering inorganic film as a packaging layer to prevent the intrusion of water vapor from the external environment surrounding the solid battery, rather than blocking the internal components of the solid battery.

[0111] Preferably, the covering inorganic film is a water vapor barrier film. That is, it is preferred that the covering inorganic film covers the top and side surfaces of the solid battery to serve as a barrier to prevent moisture from entering the solid battery. Preferably, the covering inorganic film extends in a manner exceeding the main surface of the substrate (that is, the substrate surface on which the circuit is provided) as shown in the cross-sectional view shown in the figure. Thus, for the circuit on the main surface of the substrate, the covering inorganic film serves as a more preferred water vapor barrier. The term "barrier" as used in this specification refers in a broad sense to having the property of preventing water vapor from passing through, so that water vapor from the external environment will not pass through the covering inorganic film and cause degradation of the properties that are unfavorable to the solid battery. In a narrow sense, it refers to a water vapor permeability of less than 1.0×10 -3 g / (m 2·Day). Therefore, in short, it can be said that the water vapor barrier film preferably has a value of 0 or more and less than 1.0×10 -3 g / (m 2 ·Day) water vapor permeability. It should be noted that the "water vapor permeability" referred to here refers to the permeability obtained by using a gas permeability measuring device, model GTms-1, manufactured by ADVANCE RIKO Co., Ltd., and the measuring conditions are 40°C 90% RH differential pressure 1atm. According to a preferred embodiment of the present invention, it is a battery package composed of a supporting substrate, a solid-state battery, a non-conductive material and a water vapor barrier layer, and in particular, a battery package in which electronic components such as capacitors, resistors, and ICs of peripheral circuits are accommodated inside the water vapor barrier layer.

[0112] The covering insulating layer and the covering inorganic film may be integrated with each other. Therefore, the covering inorganic film forms a water vapor barrier for the solid battery together with the covering insulating layer. That is, by combining the integrated covering insulating layer and the covering inorganic film, it is possible to more appropriately prevent water vapor from the external environment from intruding into the solid battery. That is, it can be said that the covering inorganic film and the covering insulating layer complement each other to form a water vapor barrier layer, and the covering insulating layer also complements the covering inorganic film to form a water vapor barrier.

[0113] In the present invention, the support substrate supporting the solid battery is positioned to cover the lower side (bottom side) of the solid battery, thereby helping to prevent water vapor from passing through the lower side (bottom side). That is, the support substrate is preferably a water vapor barrier substrate. The "barrier" mentioned here has the same meaning as above, which means that it has the property of preventing water vapor from passing through, so that water vapor from the external environment will not pass through the covering inorganic film and cause the degradation of the characteristics that are unfavorable to the solid battery. In a narrow sense, it means that the water vapor permeability of the substrate is less than 1.0×10 -3 g / (m 2 ·Day). Therefore, the water vapor barrier substrate preferably has a value of 0 or more and less than 1.0×10 - 3 g / (m 2 ·Day) of water vapor permeability. Thus, in the case where the supporting substrate is a water vapor barrier substrate, the substrate itself has a barrier effect, so a method in which no covering inorganic film is provided on the bottom surface side of the substrate can also be considered. In other words, although the covering inorganic film is provided to largely surround the solid battery, a method in which a part of the supporting substrate (specifically, the bottom surface) is not provided can also be considered (that is, in a preferred method, although the covering inorganic film is provided on most of the surfaces of the battery package, it may not be provided on all surfaces).

[0114] In the case where the supporting substrate is a ceramic substrate, it is easy to prevent water vapor from penetrating through the supporting substrate. In the case where the supporting substrate has water vapor barrier properties, water vapor penetration from the upper and side sides of the solid battery can be prevented mainly by covering the insulating layer and the inorganic film. On the other hand, water vapor penetration from the lower side (bottom side) of the solid battery can be prevented mainly by the supporting substrate. Considering that the supporting substrate is preferably a terminal substrate, it can be said that water vapor penetration from the lower side (bottom side) of the solid battery is mainly prevented by the terminal substrate. It should be noted that Figure 3 As can be seen from the illustrated embodiment, it is possible to prevent water vapor from penetrating not only through the support substrate 10 but also from penetrating from the lower side (bottom side) by combining with the cover insulating layer 30 ′ provided on the upper surface thereof.

[0115] Considering other perspectives, such as Figure 3 As shown, the end face electrode 150 of the solid battery 100 is surrounded by a combination of a covering insulating layer 30, a covering inorganic film 40 and a supporting substrate 10. That is, it can be said that the end face electrode 150 of the solid battery 100 is sealed in a manner surrounded by a combination of these three components. Therefore, it is possible to more reliably prevent the possibility of water vapor from the external environment entering from the end face electrode 150 of the solid battery 100. Such a seal is particularly advantageous when the end face electrode of the solid battery is composed of a sintered metal system. This is because, in such an end face electrode, depending on the material, shape, manufacturing process, etc., holes and defects may sometimes be generated, which may not be sufficient for the permeation of water vapor in the air.

[0116] It should be noted that even when the supporting substrate is a resin substrate, it can also be a water vapor barrier substrate. It can be considered that the resin substrate itself constitutes a water vapor barrier substrate. In addition, for example, by providing a metal layer (for example, a metal foil such as copper foil, which is only an example) on the resin substrate, the effect of preventing water vapor from penetrating the substrate can be further improved. Therefore, in such a manner, the resin substrate is more preferably used as a water vapor barrier substrate for the battery package.

[0117] In a certain embodiment, a solid battery on a supporting substrate is covered by a covering inorganic film separated by a covering insulating layer, and the covering insulating layer can also act as a buffer material. Specifically, even in the case of expansion and contraction of the solid battery caused by charging and discharging, thermal expansion, etc., its influence will not directly affect the covering inorganic film. By sandwiching the covering insulating layer, the impact can be mitigated by the buffering effect. Therefore, even if it is a thin film such as a covering inorganic film, the generation of cracks and the like can be reduced, and a more preferred water vapor barrier can be obtained. In particular, when the covering insulating layer contains a resin material, the buffering effect of the covering insulating layer composed of the resin material may become larger.

[0118] The covering insulating layer may have an elastic modulus that more effectively suppresses the effects of the expansion and contraction of the above-mentioned solid battery. That is, in order to reduce the generation of cracks and the like caused by the expansion and contraction of the solid battery, a covering insulating layer having a relatively low elastic modulus may be provided. For example, the elastic modulus of the covering insulating layer may be less than 1 MPa, more specifically less than 0.5 MPa or less than 0.1 MPa, etc. The lower limit of the elastic modulus is not particularly limited, for example, 10 Pa. The "elastic modulus" referred to here refers to the so-called Young's modulus [Pa], and its value refers to the value obtained by following the method of the JIS standard (JISK 7161, JISK 7181, etc.).

[0119] It should be noted that the cover insulating layer 30 is not limited to Figure 3 The form shown can also be Figure 7 In other words, the covering insulating layer 30 covering the top and side surfaces of the solid battery 100 can also cover the side surfaces of the substrate 10. This means that the covering insulating layer 30 not only covers the inorganic film 40, but also extends to the side surfaces of the substrate. In other words, both the covering inorganic film and the covering insulating layer can be as shown. Figure 7 As shown in the cross-sectional view, it extends in a manner exceeding the main surface of the substrate (i.e., the substrate surface on which the circuit is provided). Thus, for the circuit on the main surface of the substrate, the covering inorganic film and the covering insulating layer serve as a more preferred water vapor barrier. It should be noted that such an extended form of the covering inorganic film and the covering insulating layer can also help avoid undesirable peeling of the covering insulating layer caused by the expansion and contraction of the solid battery. This is described in detail. Figure 3 In the embodiment shown, when the expansion and contraction of the solid battery (especially the expansion and contraction in the stacking direction of the solid battery) is excessive, the covering insulating layer 30 is likely to be peeled off from the substrate 10 starting from the bonding interface between the covering insulating layer 30 and the main surface of the substrate 10 (especially the bonding interface a forming the outermost edge in the direction orthogonal to the stacking direction), but Figure 7 The form shown reduces this possibility. This is because, Figure 7 The insulating cover layer 30 shown is not formed on the bonding surface forming the outermost edge with the main surface of the substrate 10 . Therefore, the insulating cover layer 30 is less likely to be affected by malfunctions caused by expansion and contraction of the solid battery in the stacking direction.

[0120] For peeling, the covering inorganic film 40 becomes more difficult to peel off from the substrate. Figure 8The form shown. Specifically, the covering inorganic film 40 can be further extended from the side surface of the substrate 10 to the lower main surface of the substrate 10. In this case, the bonding area between the covering inorganic film 40 and the substrate 10 is relatively increased, and the covering inorganic film 40 becomes more resistant to peeling. That is, in the cross-sectional view shown in the figure, the covering inorganic film 40 has a curved shape along the outer contour of the substrate 10. In addition, in the case where the substrate is composed of ceramics or the like, in order to make the bonding between the covering inorganic film 40 and the substrate 10 more secure, a metal pad may be interposed. For example, a metal pad 19 may be provided on the substrate, and the covering inorganic film 40 may be provided in a manner that covers the metal pad 19 (refer to Fig. 9 As shown in the figure, such a metal pad 19 can be provided at the periphery of the back side main surface (ie, the bottom side main surface) of the substrate 10, for example.

[0121] Furthermore, the cover insulating layer 30 and the cover inorganic film 40 may also have Fig.10 Specifically, the covering insulating layer 30 covers the side of the substrate 10, and the covering inorganic film 40 can extend to the lower main surface of the substrate 10. That is, the covering insulating layer 30 covering the top and side surfaces of the solid battery 100 extends to the side of the substrate 10, and the covering inorganic film 40 on the covering insulating layer 30 can extend beyond the side of the substrate 10 to the lower main surface of the substrate 10. In the case of such a form, a battery package that is more preferably prevented from moisture penetration (moisture permeating from the outside to the solid battery stack) can be obtained.

[0122] In addition, in the battery package of the present invention, although water vapor can be prevented from penetrating, the components that contribute to this are the covering inorganic film integrated with the covering insulating layer and the supporting substrate that can have a thin plate shape, so the package size does not become larger. That is, a compact package that can achieve water vapor permeability can be obtained. This means that the solid battery of the present invention can be used as a battery (packaged battery) with a higher energy density that can prevent water vapor from penetrating.

[0123] The solid battery of the present invention can be realized in various ways. For example, the following ways are conceivable.

[0124] (Multilayer wiring board method)

[0125] In this embodiment, the support substrate has a form of a multilayer wiring board. That is, the solid battery is supported by the support substrate having wiring extending to a plurality of layers.

[0126] When the substrate has multi-layer wiring, the degree of freedom in designing the external terminals of the package increases, that is, the external terminals can be positioned at any position on the bottom surface of the battery package.

[0127] The part where the wiring is provided on the support substrate or its vicinity is the interface of the wiring and the different materials of the main body of the support substrate. Although it sometimes becomes a part that accidentally causes water vapor to permeate, if the support substrate has the form of a multilayer wiring board, it can be equivalent to the "part with relatively high water vapor permeability" of the water vapor entry path becoming longer. Although it is only an example, such a water vapor entry path can reach the water vapor permeation path length of the capacitor terminal structure (up to about 200μm). That is, when the support substrate has the form of a multilayer wiring board, the movement resistance (resistance that can withstand moisture) of the moisture path from the external environment to the solid battery becomes larger, and it is more difficult for water vapor to enter from the external environment, thereby realizing a solid battery that can more appropriately prevent water vapor from permeating. In a preferred embodiment, it is also possible not to connect the upper and lower wirings in the multilayer wiring board by connecting the through holes in series, but to stagger the through hole positions to the left and right, so that the wiring extending in the up and down directions is meandering. Thus, if the through hole is lengthened, the water vapor entry path can be made longer, and water vapor can be more appropriately prevented from entering.

[0128] (Containing fillers)

[0129] In this embodiment, the cover insulating layer 30 (see Fig.11 ) contains filler. When the cover insulating layer 30 is composed of a resin material, the inorganic filler 35 is preferably dispersed in such a resin material.

[0130] The filler is preferably mixed into the covering insulating layer and composited with the base material (e.g., resin material) of the covering insulating layer. The shape of the filler is not particularly limited, and may be granular, spherical, needle-shaped, plate-shaped, fibrous, and / or irregular in shape. The size of the filler is also not particularly limited, and may be greater than 10 nm and less than 100 μm, for example, a nanofiller greater than 10 nm and less than 100 nm, a microfiller greater than 100 nm and less than 10 um, or a coarse filler greater than 10 μm and less than 100 μm. As the material of the filler, metal oxides such as silica, alumina, titanium oxide, zirconium oxide, minerals such as mica, and / or glass, etc. can be listed, but are not limited to these.

[0131] The filler is preferably a water vapor permeation preventing filler. In a preferred embodiment, the cover insulating layer contains a water vapor permeation preventing filler in its resin material. Thus, the cover insulating layer can be easily used as a more preferred water vapor permeation barrier together with the cover inorganic film.

[0132] The water vapor permeation preventing filler is not particularly limited, and may be a plate-shaped filler or the like. In addition, the water vapor permeation preventing filler may be made of materials such as silicon dioxide or aluminum oxide. In addition, it may also be made of materials such as mica such as synthetic mica. In order to better prevent water vapor permeation, the content of the water vapor permeation preventing filler contained in the resin material is preferably 50% by weight or more and 95% by weight or less, based on the entirety of the covering insulating layer, for example, 60% by weight or more and 95% by weight or 70% by weight or more and 95% by weight or less.

[0133] (Sputtering film method)

[0134] In this embodiment, the covering inorganic film 40 (see Fig.11 ) is a sputtered film. That is, a sputtered thin film is provided as a dry-plated film provided in a manner covering the cover insulating layer.

[0135] The sputtered film is a thin film obtained by sputtering, that is, a film in which ions are sputtered onto a target material and atoms thereof are knocked out and deposited on a cover insulating layer is used as a cover inorganic thin film.

[0136] The sputtered film has a very thin form at the nanoscale or micron level, and becomes a dense and / or homogeneous film, so it is suitable for use as a water vapor permeation barrier for solid batteries. In addition, the sputtered film is formed by atomic accumulation, so the adhesion is relatively high, and it can be more appropriately integrated with the covering inorganic film. Therefore, the sputtered film is easy to form a water vapor barrier film for solid batteries more appropriately together with the covering insulating layer. That is, the sputtered film is arranged in a manner that covers at least the top surface and the side of the solid battery together with the covering insulating layer, and is more preferably used as a barrier for preventing water vapor from the external environment from entering the solid battery.

[0137] In a preferred embodiment, the sputtered film includes, for example, at least one selected from the group consisting of Al (aluminum), Cu (copper) and Ti (titanium), and the film thickness is 1 μm or more and 100 μm or less, for example, 5 μm or more and 50 μm or less. In addition, although not particularly limited, the sputtered film preferably has substantially the same thickness dimension at any of the local parts located on the top surface of the solid battery and the local parts located on the side. This is because the package as a whole can more uniformly prevent water vapor from the external environment from entering the battery.

[0138] It should be noted that, from the perspective of water vapor barrier, such dry coating represented by sputtering film can be realized with a more appropriate thickness. For example, by relatively increasing the number of sputtering, it can be used as a thicker film, and on the other hand, by relatively reducing the number of sputtering, it can be used as a thinner film. In addition, for example, by changing the type of target material during sputtering, it can be used as a covering inorganic film with a stacked structure.

[0139] It should be noted that a wet coating may also be provided on a dry coating. That is, the covering inorganic film 40 may be composed of a dry coating and a wet coating. The film forming speed of a wet coating is generally faster than that of a dry coating. Therefore, when a thicker film is provided as a covering inorganic film, efficient film formation can be performed by combining a dry coating with a wet coating.

[0140] (Methods related to the production method)

[0141] In this embodiment, the solid battery has characteristics related to its packaging. The packaged solid battery of the present invention is obtained by the production method described below and has characteristics related to the packaging.

[0142] For example, in the solid battery of the present invention, the covering inorganic film is provided so as to cover the covering insulating layer, but is provided in a large amount so as to extend over the supporting substrate. Fig.11 As shown, in the cross-sectional view of the encapsulated solid battery 100, the covering inorganic film 40 extends beyond the covering insulating layer 30 and onto the side 10A of the supporting substrate 10. As can be seen from the morphology of the cross-sectional view shown in the figure, this means that the covering inorganic film 40 extends to a position beyond the boundary between the covering insulating layer 30 and the supporting substrate 10. Therefore, such a covering inorganic film can be more appropriately used as a water vapor permeation barrier for solid batteries together with the covering insulating layer. A solid battery of this type can be obtained by further covering a precursor on a large scale with a covering inorganic film, and the precursor is obtained by covering a solid battery on a supporting substrate with a covering insulating layer. That is, due to such a large-scale covering formation, the covering inorganic film 40 exceeds the covering insulating layer 30 and reaches the side 10A of the supporting substrate 10. For example, by sputtering the precursor as a whole, it is possible to obtain such a special morphology of a covering inorganic film, and the precursor is obtained by covering a solid battery on a supporting substrate with a covering insulating layer. It should be noted that in Fig.11 In the cross-sectional view shown, the covering inorganic film 40 on the side of the battery package has a straight extending shape (a shape extending straight in the vertical direction when observed in cross-section), but the present invention is not necessarily limited to this. For example, when the lateral outer surface 30A of the covering insulating layer 30 is located slightly inside (slightly inside in the left-right direction and horizontal direction) than the side surface 10A of the support substrate 10 as a whole when observed in cross-section, the covering inorganic film 40 extends accordingly. That is, when it is assumed that the covering inorganic film 40 extends in a direction from the top to the bottom when observed in cross-section, the covering inorganic film 40 may be a shape that extends slightly outward near the boundary between the covering insulating layer 30 and the support substrate 10.

[0143] In a preferred embodiment, the support substrate and the inorganic film cover are in the same plane on the bottom side of the solid battery and the substrate. That is, on the bottom side of the packaged solid battery, the support substrate 10 and the inorganic film cover 40 are preferably in the same plane (refer to Fig.11 ). That is, in the mounting surface of the solid battery package, the surface level of the support substrate is the same or substantially the same as the level of the covering inorganic film. Such a "same plane" feature is due to the formation of the covering inorganic film in a state where the above-mentioned precursor is placed on an appropriate table.

[0144] The solid battery having the characteristic of "being on the same plane" means that the mounting surface is appropriately flattened and smoothed as a package, and therefore, it is easy to have more preferred mounting characteristics (especially SMD characteristics). That is, the covering inorganic film 40 that extends beyond the covering insulating layer 30 and onto the side surface 10A of the supporting substrate 10 and becomes on the same plane as the supporting substrate 10 not only helps prevent water vapor from passing through, but also helps to have more preferred surface mounting characteristics.

[0145] The advantages of the solid state battery described above can also be summarized as follows. It should be noted that the following advantages are only examples and are not limited thereto, and additional advantages may also be present.

[0146] The inclusion of peripheral circuits can reduce the package size and enable use as a battery package with higher energy density.

[0147] The wiring distance between the solid battery and the peripheral circuit can be shortened, and a battery package with a higher reliability can be obtained with a reduced failure rate in the middle of the circuit.

[0148] The electronic components mounted on the supporting substrate not only have water vapor barrier properties but are also fixed to the supporting substrate with high rigidity, so they are subject to strong physical stress such as thermal stress, bending, dropping, vibration and shock.

[0149] Since the electrical contacts between the peripheral circuit and the support substrate can be joined using a highly reliable solder-based contact material, a highly reliable battery pack can be obtained.

[0150] · Peripheral circuits including multi-terminal electronic devices can be integrated with high reliability, and compact modularization can be achieved by including solid-state batteries.

[0151] In pads that can be SMD, multiple terminals can be placed at any position on a plane. This increases the freedom of design of the motherboard and enables higher density.

[0152] As the bonding material in direct contact with the battery, a no-clean bonding material (a bonding material that does not require flux cleaning after soldering) is used, so that during the manufacturing process, the solid battery can be installed after the electronic components are installed / cleaned. Therefore, even if the electronic components are bonded using a cheaper, more reliable solder that can increase the density of the mounting area, flux cleaning can be performed. On the other hand, the solid battery must be bonded without cleaning, and both the battery and the SMD components can be installed with the best bonding material in the package.

[0153] Since the barrier film that protects the all-solid-state battery from water vapor covers a wide area without gaps, it is possible to prevent the degradation of characteristics caused by water vapor in the external environment.

[0154] · As an SMD type surface mount component, it can be soldered and mounted on all electronic devices. In particular, it can be soldered and mounted as an SMD with improved heat resistance and / or chemical resistance.

[0155] In the case of an SMD type, when a weather-resistant treatment (for example, Ni / Au plating treatment) is applied to the surface for mounting a supporting substrate, the weather-resistant treatment further improves the effect of preventing water vapor transmission.

[0156] [Method for manufacturing solid state battery]

[0157] The object of the present invention can be obtained by the following process: preparing a solid battery including a battery constituent unit having a positive electrode layer, a negative electrode layer, and a solid electrolyte between these electrodes, and then packaging the solid battery together with a peripheral circuit.

[0158] The production of the solid battery can be roughly divided into production of the solid battery itself (hereinafter also referred to as "pre-packaged battery"), which corresponds to a pre-packaged stage, preparation of a support substrate, and packaging.

[0159] 《Method for manufacturing battery before packaging》

[0160] The pre-packaged battery can be manufactured by a printing method such as screen printing, a raw sheet method using a raw sheet, or a composite method thereof. That is, the pre-packaged battery itself can be manufactured according to a conventional solid battery manufacturing method (therefore, the raw materials of the solid electrolyte, organic binder, solvent, any additive, positive electrode active material, negative electrode active material, etc. described below can use materials used in the manufacture of known solid batteries).

[0161] In order to better understand the present invention, a certain production method is described below, but the present invention is not limited to this method. In addition, the following matters such as the order of recording over time are only for the convenience of explanation and are not limited to this.

[0162] (Laminated block formation)

[0163] A solid electrolyte, an organic binder, a solvent, and any additives are mixed to prepare a slurry. Next, the prepared slurry is formed into a sheet having a thickness of about 10 μm after firing.

[0164] The positive electrode active material, solid electrolyte, conductive aid, organic binder, solvent and any additives are mixed to prepare a positive electrode paste. Similarly, the negative electrode active material, solid electrolyte, conductive aid, organic binder, solvent and any additives are mixed to prepare a negative electrode paste.

[0165] The positive electrode paste is printed on the sheet, and a current collecting layer and / or a negative type is printed as needed. Similarly, the negative electrode paste is printed on the sheet, and a current collecting layer and / or a negative type is printed as needed.

[0166] The sheets printed with the positive electrode paste and the sheets printed with the negative electrode paste are alternately stacked to obtain a laminate. It should be noted that the outermost layer (uppermost layer or lowermost layer) of the laminate may be an electrolyte layer, an insulating layer, or an electrode layer.

[0167] (Battery sintered body formation)

[0168] After the stack is pressed and integrated, it is cut into a specified size. The cut stack is degreased and fired. Thus, a sintered stack is obtained. It should be noted that the stack can also be degreased and fired before cutting, and then cut.

[0169] (End surface electrode formation)

[0170] The end face electrode on the positive electrode side can be formed by applying a conductive paste to the exposed side of the positive electrode in the sintered laminate. Similarly, the end face electrode on the negative electrode side can be formed by applying a conductive paste to the exposed side of the negative electrode in the sintered laminate. When the end face electrodes on the positive electrode side and the negative electrode side are arranged in a manner extending over the main surface of the sintered laminate, they can be connected to the mounting pad with a small area in the next step, so it is preferred (more specifically, the end face electrodes arranged in a manner extending over the main surface of the sintered laminate have a folded portion on the main surface, and such a folded portion can be electrically connected to the supporting substrate). As a component of the end face electrode, at least one selected from silver, gold, platinum, aluminum, copper, tin and nickel can be selected.

[0171] It should be noted that the end surface electrodes on the positive electrode side and the negative electrode side are not limited to being formed after the sintering of the stacked body, but may be formed before sintering and sintered simultaneously.

[0172] By going through the above-described steps, a desired pre-packaged battery can be finally obtained.

[0173] 《Preparation of supporting substrate after component mounting》

[0174] (Preparation of Supporting Substrate)

[0175] The support substrate can be prepared, for example, by stacking and firing a plurality of green sheets. This is particularly applicable when the support substrate is a ceramic substrate. The support substrate can be prepared, for example, by manufacturing an LTCC substrate.

[0176] The support substrate used as a terminal substrate has through holes and / or pads. In such a case, for example, a hole (diameter size: about 50 μm to about 200 μm) can be formed on the raw sheet by a punch press or a carbon dioxide laser, etc., and a conductive paste material can be buried in the hole, or a precursor of a conductive part / wiring such as a through hole, a pad and / or a wiring layer can be formed by implementing a printing method. In particular, for the installation of components for peripheral circuits, it is preferred to provide pads, etc. on the surface of the support substrate. In addition, the support substrate sometimes has a non-connected metal layer that is not electrically connected as a water vapor permeation prevention layer. In this case, a metal layer (its precursor) can be formed on the raw sheet as a non-connected metal layer. The metal layer can be formed by a printing method, or it can be formed by configuring a metal foil, etc. Next, such raw sheets are overlapped by a specified number of sheets and hot-pressed to form a raw sheet stack, and the raw sheet stack is fired to obtain a support substrate. It should be noted that pads, etc. can also be formed after the raw sheet stack is fired.

[0177] A detailed description of the raw sheet in the case where the supporting substrate is obtained as a ceramic substrate is only an example and does not limit the present invention. The raw sheet itself can be a sheet-like component containing a ceramic component, a glass component and an organic binder component. For example, as a ceramic component, it can be an aluminum oxide powder (average particle size: about 0.5 to 10 μm), and as a glass component, it can be a borosilicate glass powder (average particle size: about 1 to 20 μm). In addition, as an organic binder component, for example, it can be at least one component selected from the group consisting of polyvinyl butyral resin, acrylic resin, vinyl acetate copolymer, polyvinyl alcohol and vinyl chloride resin. Although it is only an example, the raw sheet can be 40 to 50 wt% of aluminum oxide powder, 30 to 40 wt% of glass powder, and 10 to 30 wt% of organic binder component (based on the total weight of the raw sheet). In addition, from another point of view, the green sheet may be a green sheet in which the weight ratio of the solid component (alumina powder 50-60wt% and glass powder 40-50wt%: based on the weight of the solid component) to the organic binder component, that is, the weight of the solid component: the weight of the organic binder component is about 80-90:10-20. As the green sheet components, other components may be included as needed, for example, a plasticizer such as phthalate and / or dibutyl phthalate that imparts flexibility to the green sheet, a dispersant of ketones such as glycol, an organic solvent, etc. The thickness of each green sheet itself may be about 30μm to 500μm.

[0178] By going through the above-described steps, a desired supporting substrate can be finally obtained.

[0179] (Circuit Formation on Support Substrate)

[0180] First, a soldering material is provided to the support substrate obtained above. More specifically, for example, a metal mask is applied to the pads provided on the surface of the substrate and solder paste is applied. Next, a peripheral circuit for a solid battery is provided. More specifically, electronic components such as active components, passive components and / or auxiliary components required for the battery peripheral circuit are installed at specified positions on the substrate. In addition, conductive spacers and other solid batteries are helpful for the electrical connection (positive connection and negative connection) between the support substrate, and components that contribute to the formation of a gap between them (such as jumper pins, height adjustment terminal pins such as metal columns or metal blocks) are also installed. After such desired installation is completed, the support substrate is subjected to reflow soldering and flux cleaning is performed. Through the above, a support substrate with a completed circuit is obtained.

[0181] It should be noted that the support substrate itself only needs to have a water vapor transmission rate of less than 1.0×10 -3 g / (m 2·Day) substrate, and a substrate that has a pre-existing substrate shape can be used. In addition, in other methods, a substrate with a water vapor transmission rate of less than 1.0×10 -3 g / (m 2 ·Day) and a printed wiring board, LTCC board or HTCC board with a circuit on the surface.

[0182] Encapsulation

[0183] Fig.12 (a) to (d) schematically show the steps of obtaining the solid battery of the present invention by packaging. The solid battery 100 obtained as described above (hereinafter also referred to as "battery before packaging") and the support substrate 10 ( Fig.12 (a)).

[0184] First, a connection member 60" is formed on a conductive spacer 60' provided on a support substrate to facilitate electrical connection between the solid battery 100 and the support substrate 10, thereby mounting the solid battery 100 on a substrate ( Fig.12 (b)). Specifically, a conductive paste such as Ag is supplied on a conductive spacer (conductive spacers on the positive side and the negative side that contribute to the connection with the positive and negative electrodes of the solid battery, respectively) using a dispenser. Then, the bottom portions of the end face electrodes on the positive side and the negative side of the solid battery are placed on the conductive spacers on the positive side and the negative side, respectively, and are closely fitted with the Ag conductive paste, which is solidified to thereby perform bonding. To illustrate more specifically, the conductive spacer on the positive side provided on the surface of the supporting substrate matches the folded portion of the end face electrode on the positive side of the solid battery, and the conductive spacer on the negative side is aligned in a manner that matches the folded portion of the end face electrode on the negative side of the solid battery, and is bonded and connected via the Ag conductive paste. Such bonding materials, in addition to Ag conductive paste, can be used as long as they are conductive pastes such as nanopastes, alloy pastes, solders, etc. that do not require cleaning with flux, etc. after formation. By using such a conductive paste as the battery connecting material, the final conductive spacer 60 has a no-cleaning type member 60".

[0185] Then, if Fig.12As shown in (c), the covering insulating layer 30 is formed in a manner covering the solid battery 100 on the supporting substrate 10. Therefore, the raw material of the covering insulating layer is provided in a manner covering the solid battery on the supporting substrate as a whole. In the case where the covering insulating layer is composed of a resin material, a resin precursor is arranged on the supporting substrate and cured, etc. to form the covering insulating layer. In a preferred embodiment, the covering insulating layer can also be formed by pressurizing with a mold. Although it is only an example, the covering insulating layer that seals the solid battery on the supporting substrate can also be formed by compression molding. Generally, if it is a resin material used in molding, the raw material of the covering insulating layer can be in the form of particles, and its type can also be thermoplastic. It should be noted that such molding is not limited to mold molding, and can also be performed by grinding, laser processing and / or chemical treatment.

[0186] Then, if Fig.12 As shown in (d), a covering inorganic film 40 is formed. Specifically, a covering inorganic film 40 is formed for a "covering precursor in which each solid battery 100 is covered by a covering insulating layer 30 on a supporting substrate 10". For example, dry plating can be performed to form a dry plated film as a covering inorganic film. More specifically, dry plating is performed to form a covering inorganic film on an exposed surface other than the bottom surface of the covering precursor (i.e., other than the bottom surface of the supporting substrate). In a preferred embodiment, sputtering is performed to form a sputtered film on the exposed outer surface other than the bottom surface of the covering precursor.

[0187] By going through the above steps, a package having a circuit and a solid battery on a support substrate entirely covered by a cover insulating layer and a cover inorganic film can be obtained. That is, the "packaged solid battery" according to the present invention can be finally obtained.

[0188] Such a package has the following advantages: the terminal lead-out of the solid battery is relatively easy in terms of design and bonding process. In addition, the smaller the solid battery is, the smaller the area ratio of the package relative to the battery is. However, in the package involved in the present invention, this area can be extremely small, so it can be particularly helpful in miniaturizing small-capacity batteries.

[0189] Although the embodiments of the present invention have been described above, these are merely typical examples, and the present invention is not limited thereto, and it is easily understood by those skilled in the art that various embodiments can be conceived without changing the gist of the present invention.

[0190] For example, in the above description, a drawing is used in which the pads of the support substrate correspond to each other on the upper side and the lower side, but the present invention is not particularly limited to this. For the upper pads and the lower pads connected by through holes, their numbers may also be different. For example, with respect to a pair of upper pads and lower pads connected to each other by through holes, there may be two or more lower pads relative to one upper pad. As a result, as the battery package involved in the present invention, an SMD with a higher degree of design freedom can be achieved.

[0191] In addition, in the above description, the gap portion formed between the substrate and the solid battery is mainly obtained by a conductive spacer, but the present invention is not limited to this. For example, the end face electrode of the solid battery can also contribute to the formation of the gap between the substrate and the solid battery. Specifically, in the case where the end face electrode of the solid battery extends not only to the end face of the sintered laminate but also to a part of the main surface, the thickness of the end face electrode portion on the main surface contributes to the formation of the gap between the substrate and the solid battery. In addition, the end face electrode may also have an appropriate foot member that is particularly helpful in forming the gap between the substrate and the solid battery.

[0192] In addition, in the above description, it is assumed that the stacking direction of each layer constituting the solid battery on the substrate is in the normal direction of the main surface of the substrate, but the present invention is not limited to this. For example, the solid battery can also be arranged on the substrate in a direction in which the stacking direction of the solid battery is orthogonal to the normal direction of the main surface of the substrate. In this case, it is more difficult to cause the battery to contact the circuit on the substrate due to the expansion and contraction of the solid battery (especially the expansion and contraction in the stacking direction of the solid battery).

[0193] In the above description, the method of molding the covering insulating layer in a manner that the solid battery on the substrate is largely sealed by compression molding is described, but the present invention is not limited to this. The covering insulating layer can be formed by a coating method such as spraying. In the case of using a coating method, such as Fig.13 As shown, the cross-sectional shape of the cover insulating layer 30 can be a shape that largely reflects the outline of the substrate 10 and the solid battery 100 thereon. In this case, the cross-sectional shape of the cover inorganic film 40 provided on the cover insulating layer 30 can also be a shape that largely reflects the outline of the substrate 10 and the solid battery 100 thereon.

[0194] Furthermore, if necessary, an additional coating may be provided on the covering inorganic film from the viewpoint of preventing the covering inorganic film from rusting, etc. For example, an organic coating formed of a resin or the like may be provided on the covering inorganic film.

[0195] Industrial Applicability

[0196] The packaged solid battery of the present invention can be used in various fields where batteries and storage are envisioned. Although it is only an example, the packaged solid battery of the present invention can be applied to the field of electronic installation. In addition, the electrode of the present invention can also be applied to the following fields: electrical information and communication fields using electrical and electronic equipment, etc. (for example, electrical and electronic equipment fields or mobile equipment fields including small electronic equipment such as mobile phones, smart phones, laptops and digital cameras, activity meters, arm computers, electronic paper, etc., RFID tags, card-type electronic money, smart watches, etc.); home and small industrial uses (for example, power tools, golf carts, home and nursing robots); large industrial uses (for example, forklifts, elevators, and port cranes); transportation system fields (for example, hybrid vehicles, electric vehicles, buses, trams, electric power-assisted bicycles, electric motorcycles, etc.); power system uses (for example, various power generation, load regulators, smart grids, general household set-up storage systems, etc.); medical uses (medical equipment fields such as earphones and hearing aids); medical uses (medical management systems, etc.); and IoT fields; space and deep sea uses (for example, space probes, submersible survey ships, etc.).

[0197] Description of Reference Numerals

[0198] 10…support substrate, 14…through hole, 16…solder pad, 17…conductive portion of the support substrate (substrate wiring), 19…metal solder pad, 30…covering insulating layer, 30'…covering insulating layer (particularly, covering insulating layer between the solid battery and the support substrate), 35…filler, 40…covering inorganic film, 50…covering component, 60…conductive connecting portion, 80…circuit for solid battery, 100…solid battery, 100A…top surface (upper surface) of solid battery, 100B…side surface of solid battery, 110…positive electrode layer, 120…negative electrode layer, 130…solid electrolyte, 150…end surface electrode, 150A…end surface electrode on the positive electrode side, 150B…end surface electrode on the negative electrode side, 200…battery package (packaged solid battery).

Claims

1. A solid battery is a solid battery having a substrate, The solid battery is covered on the substrate, and a circuit for the solid battery is arranged on the substrate. A covering insulating layer is provided so as to cover the top surface and the side surfaces of the solid battery, and a covering inorganic film is provided on the covering insulating layer. When viewed from above, the cover inorganic film extends beyond the substrate surface on which the circuit is provided. The circuit is located between the substrate and the solid battery. A resin material is provided between the substrate and the solid battery in a gap portion excluding the circuit.

2. The solid battery according to claim 1, wherein: The circuit for the solid battery is provided on the main surface of the substrate, and the circuit extends in a plane direction of the main surface.

3. The solid battery according to claim 1 or 2, wherein: The circuit and the solid battery are arranged adjacent to each other on the substrate.

4. The solid battery according to claim 1, wherein: As the circuit, at least one selected from the group consisting of a protection circuit for the solid battery, a charge control circuit, a temperature control circuit, an output compensation circuit, and an output stabilization power supply circuit is provided.

5. The solid battery according to claim 1, wherein In cross-sectional view, both the cover inorganic film and the cover insulating layer extend beyond the substrate surface on which the circuit is provided.

6. The solid battery according to claim 1, wherein: The substrate serves as a support substrate that supports both the solid battery and the circuit on the surface of the substrate.

7. The solid battery according to claim 1, wherein The substrate includes wiring that electrically connects the upper and lower surfaces of the substrate, and the substrate serves as a terminal substrate for external terminals of the solid battery.

8. The solid battery according to claim 1, wherein A conductive spacer is provided between the substrate and the solid battery.

9. The solid battery according to claim 8, wherein: The conductive spacer is a no-cleaning type member that does not require flux cleaning during soldering.

10. The solid battery according to claim 7, wherein: The circuit is located in a gap between the solid battery and the substrate, and the gap is generated by a conductive connection member that connects the end surface electrode of the solid battery and the wiring of the substrate to each other.

11. The solid battery according to claim 1, wherein The covering inorganic film is a metal thin film.

12. The solid battery according to claim 1, wherein: The cover insulating layer includes a resin material.

13. The solid battery according to claim 1, wherein On the bottom side surface of the integrated product of the solid battery and the substrate, the substrate and the cover inorganic film are flush with each other.

14. The solid battery according to claim 1, wherein: The substrate includes ceramic.

15. The solid battery according to claim 1, wherein The solid battery is composed of a sintered body.

16. The solid battery according to claim 1, wherein: The positive electrode layer and the negative electrode layer of the solid battery are layers capable of inserting and extracting lithium ions.

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