Coil assembly

Abstract

The present invention discloses a coil component, which includes: a main body; a support substrate arranged in the main body; and a coil portion, including a first coil pattern located on one surface of the support substrate, a first lead-out pattern extending from the first coil pattern to an end surface of the main body, and a second lead-out pattern arranged on the one surface of the support substrate and spaced apart from the first coil pattern and extending to the other end surface of the main body. A reinforcement pattern portion is arranged between each lead-out pattern and the one surface of the support substrate, a first slot portion and a second slot portion are arranged in an edge portion of the main body and expose the first lead-out pattern and the second lead-out pattern, respectively, and a first external electrode is arranged on an inner surface of the first slot portion and connected to the first lead-out pattern, and a second external electrode is arranged on an inner surface of the second slot portion and connected to the second lead-out pattern.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2020-0050608 filed on April 27, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. Technical Field

[0002] The present disclosure relates to a coil assembly. Background Art

[0003] An inductor, a type of coil component, is a representative passive electronic component used together with resistors and capacitors in electronic devices.

[0004] As electronic devices gradually become higher performance and smaller, the number of electronic components used in such electronic devices may increase and the electronic components may be miniaturized.

[0005] The outer electrodes of the coil component may be generally formed on two surfaces of the body facing each other. In this case, the total length or total width of the coil component may increase due to the thickness of the outer electrodes. In addition, when the coil component is mounted on a mounting substrate, the outer electrodes of the coil component may contact another component disposed adjacent to the mounting substrate, thereby generating an electrical short circuit. Summary of the invention

[0006] An aspect of the present disclosure is to more stably support a support substrate during a manufacturing process.

[0007] Another aspect of the present disclosure is to provide a coil component capable of minimizing loss of a main body.

[0008] According to one aspect of the present disclosure, a coil component includes: a body having one surface and another surface opposite to each other; a support substrate disposed in the body; and a coil portion including a first coil pattern, a first lead-out pattern, and a second lead-out pattern, wherein the first coil pattern is disposed on one surface of the support substrate facing the one surface of the body, the first lead-out pattern extends from the first coil pattern to the end surface of the body, and the second lead-out pattern is disposed on the one surface of the support substrate and is spaced apart from the first coil pattern and extends to the other end surface of the body. A reinforcement pattern portion is disposed between each of the first lead-out pattern and the second lead-out pattern and the one surface of the support substrate, a first slot portion and a second slot portion are respectively disposed in an edge portion of the one surface of the body, the first slot portion exposes the first lead-out pattern from an inner surface of the first slot portion, the second slot portion exposes the second lead-out pattern from an inner surface of the second slot portion, a first external electrode is disposed on the inner surface of the first slot portion and connected to the first lead-out pattern, and a second external electrode is disposed on the inner surface of the second slot portion and connected to the second lead-out pattern.

[0009] According to another aspect of the present disclosure, a coil component includes: a body having one surface and another surface opposite to each other; a support substrate disposed in the body; and a coil portion including a first coil pattern, a first lead-out pattern, and a second lead-out pattern, wherein the first coil pattern is disposed on one surface of the support substrate facing the one surface of the body, the first lead-out pattern extends from the first coil pattern to the end surface of the body, and the second lead-out pattern is disposed on the one surface of the support substrate and is spaced apart from the first coil pattern and extends to the other end surface of the body. A first slot portion and a second slot portion are respectively formed in an edge portion of the one surface of the body, the first slot portion exposes the first lead-out pattern from an inner surface of the first slot portion, the second slot portion exposes the second lead-out pattern from an inner surface of the second slot portion, and a first external electrode is disposed on the inner surface of the first slot portion and connected to the first lead-out pattern, and a second external electrode is disposed on the inner surface of the second slot portion and connected to the second lead-out pattern. The thickness of each of the first lead-out pattern and the second lead-out pattern is greater than the thickness of the first coil pattern.

[0010] According to another aspect of the present disclosure, a coil component includes: a body; a support substrate disposed in the body; and a coil portion, including a first coil pattern disposed on one surface of the support substrate and a first lead-out pattern and a second lead-out pattern extending between the first coil pattern and corresponding end surfaces of the body. A first reinforcement pattern portion and a second reinforcement pattern portion are formed using a conductive material, the first reinforcement pattern portion is disposed between the one surface of the support substrate and only the first lead-out pattern of the first lead-out pattern and the first coil pattern, and the second reinforcement pattern portion is disposed between the one surface of the support substrate and only the second lead-out pattern of the first lead-out pattern and the first coil pattern. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a diagram schematically showing a coil component according to a first embodiment of the present disclosure.

[0013] Figure 2 When viewed from below Figure 1 Illustration of a coil assembly (except for some configurations).

[0014] Figure 3 yes Figure 2 Illustration of a coil assembly (except for some configurations).

[0015] Figure 4 It is shown Figure 1 Schematic diagram of a cross section of a coil assembly taken along line II'.

[0016] Figure 5 It is shown Figure 1 Schematic diagram of a cross section of a coil assembly taken along line II-II'.

[0017] Figure 6 This is an exploded view of the coil section.

[0018] Figure 7 is a diagram schematically showing a coil component according to a second embodiment of the present disclosure.

[0019] Figure 8 It is shown Figure 7 Schematic diagram of a cross section of a coil assembly taken along line III-III'.

[0020] Fig. 9 is a diagram schematically showing a coil component according to a third embodiment of the present disclosure.

[0021] Fig.10 It is shown Fig. 9 Schematic diagram of a cross section of a coil assembly taken along line IV-IV'.

[0022] Fig.11 is a diagram schematically showing a coil component according to a fourth embodiment of the present disclosure.

[0023] Fig.12 It is shown Fig.11 Schematic diagram of a cross section of a coil assembly taken along line V-V'. DETAILED DESCRIPTION

[0024] The terms used in the description of the present disclosure are used to describe specific illustrative embodiments and are not intended to limit the present disclosure. Unless otherwise indicated, singular terms include plural forms. The terms "including", "comprising", "constructed to", etc. in the description of the present disclosure are used to indicate the presence of features, quantities, steps, operations, elements, parts, or combinations thereof, and do not exclude the possibility of combining or adding one or more additional features, quantities, steps, operations, elements, parts, or combinations thereof. In addition, the terms "disposed on...", "located on...", etc. may indicate that an element is located on an object or below an object, and do not necessarily mean that an element is located above an object relative to the direction of gravity.

[0025] The terms “coupled to,” “combined to,” and the like may not only indicate that elements are in direct and physical contact with each other but may also include a configuration in which other elements are interposed between the elements such that the elements are also in contact with the other elements.

[0026] For ease of description, sizes and thicknesses of elements shown in the drawings are indicated as examples, and the present disclosure is not limited thereto.

[0027] In the drawings, the L direction may be defined as a first direction or a length (longitudinal) direction, the W direction may be defined as a second direction or a width direction, and the T direction may be defined as a third direction or a thickness direction.

[0028] Hereinafter, a coil component according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. With reference to the accompanying drawings, the same or corresponding components may be denoted by the same reference numerals, and repeated descriptions will be omitted.

[0029] In electronic devices, various types of electronic components may be used, and various types of coil components may be used between the electronic components to remove noise or for other purposes.

[0030] In other words, in electronic devices, the coil component can be used as a power inductor, a high frequency (HF) inductor, a general magnetic bead, a high frequency (GHz) magnetic bead, a common mode filter, etc.

[0031] First embodiment

[0032] Figure 1 is a diagram schematically showing a coil component according to a first embodiment of the present disclosure. Figure 2 When viewed from below Figure 1 Illustration of a coil assembly (except for some configurations). Figure 3 yes Figure 2 Illustration of a coil assembly (except for some configurations). Figure 4 It is shown Figure 1 Schematic diagram of a cross section of a coil assembly taken along line II'. Figure 5 It is shown Figure 1 Schematic diagram of a cross section of a coil assembly taken along line II-II'. Figure 6 is an exploded view of the coil portion. To help gain an understanding of the present disclosure, Figure 2 Shown is a diagram with the surface insulation layer removed therefrom when viewed from below. Figure 1 In addition, Figure 3 Shows Figure 2 The structure excluding the electrodes.

[0033] Reference Figures 1 to 6 The coil component 1000 according to the first embodiment of the present disclosure may include a body 100 , a support substrate IL, slot parts S1 and S2 , a coil part 200 , and external electrodes 410 and 420 .

[0034] The body 100 may form an appearance of the coil component 1000 according to this embodiment, and the support substrate IL and the coil part 200 may be embedded in the body 100 .

[0035] The body 100 may be formed to have a hexahedral shape as a whole.

[0036] Reference Figures 1 to 5 , the body 100 may include a first surface 101 and a second surface 102 opposite to each other in the length direction L, a third surface 103 and a fourth surface 104 opposite to each other in the width direction W, and a fifth surface 105 and a sixth surface 106 opposite to each other in the thickness direction T. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the body may correspond to a wall surface of the body 100 connecting the fifth surface 105 and the sixth surface 106 of the body 100. Hereinafter, the two end surfaces of the body 100 may represent the first surface 101 and the second surface 102 of the body 100, and the two side surfaces of the body 100 may represent the third surface 103 and the fourth surface 104 of the body 100. In addition, one surface of the body 100 may represent the sixth surface 106 of the body 100, and the other surface of the body 100 may represent the fifth surface 105 of the body 100.

[0037] For example, the body 100 may be formed such that the coil component 1000 according to this embodiment in which the external electrodes 410 and 420 to be described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto.

[0038] The main body 100 may include a magnetic material and a resin. Specifically, the main body 100 may be formed by stacking one or more magnetic composite sheets including a resin and a magnetic material dispersed in the resin. The main body 100 may have a structure other than a structure in which the magnetic material may be dispersed in the resin. For example, the main body 100 may be formed using a magnetic material such as ferrite.

[0039] The magnetic material may be ferrite powder particles or metal magnetic powder particles.

[0040] Examples of ferrite powder particles may include one or more of spinel ferrites (such as Mg-Zn-based ferrites, Mn-Zn-based ferrites, Mn-Mg-based ferrites, Cu-Zn-based ferrites, Mg-Mn-Sr-based ferrites, Ni-Zn-based ferrites, etc.), hexagonal ferrites (such as Ba-Zn-based ferrites, Ba-Mg-based ferrites, Ba-Ni-based ferrites, Ba-Co-based ferrites, Ba-Ni-Co-based ferrites, etc.), garnet-type ferrites (such as Y-based ferrites, etc.) and Li-based ferrites.

[0041] The metal magnetic powder particles may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), boron (B), zirconium (Zr), hafnium (Hf), phosphorus (P) and nickel (Ni). For example, the metal magnetic powder particles may be one or more of pure iron powder, Fe-Si-based alloy powder, Fe-Si-Al-based alloy powder, Fe-Ni-based alloy powder, Fe-Ni-Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Si-Cu-Nb-based alloy powder, Fe-Ni-Cr-based alloy powder and Fe-Cr-Al-based alloy powder.

[0042] The metal magnetic powder particles may be amorphous or crystalline. For example, the metal magnetic powder particles may be Fe-Si-B-Cr based amorphous alloy powder particles, but are not limited thereto.

[0043] The metal magnetic powder particles may have an average diameter of about 0.1 μm to 30 μm, but are not limited thereto.

[0044] The body 100 may include two or more types of magnetic materials dispersed in a resin. In this case, the term "different types of magnetic materials" means that the magnetic materials dispersed in the resin are distinguishable from each other by average diameter, composition, crystallinity, and shape.

[0045] The resin may include epoxy resin, polyimide, liquid crystal polymer, etc. in a single form or in a combined form, but is not limited thereto.

[0046] The body 100 may include a core 110 passing through a coil part 200 to be described later. The core 110 may be formed by filling a through hole of the coil part 200 with a magnetic composite sheet, but is not limited thereto.

[0047] The support substrate IL may be disposed in the body 100. The support substrate IL may support the coil part 200 (to be described later).

[0048] The support substrate IL may be formed using an insulating material including a thermosetting insulating resin (such as an epoxy resin), a thermoplastic insulating resin (such as polyimide), or a photosensitive insulating resin, or may be formed using an insulating material in which a reinforcing material (such as glass fiber or an inorganic filler) is impregnated with a thermosetting insulating resin, a thermoplastic insulating resin, or a photosensitive insulating resin. For example, the support substrate IL may be formed using materials such as a prepreg, an Ajinomoto Build-up Film (ABF), FR-4, a bismaleimide triazine (BT) resin, a photosensitive dielectric (PID), etc., but is not limited thereto.

[0049] One or more selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc, mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3) and calcium zirconate (CaZrO3) can be used as the inorganic filler.

[0050] When the support substrate IL is formed using an insulating material including a reinforcing material, the support substrate IL may provide better rigidity. When the support substrate IL is formed using an insulating material not including glass fiber, the support substrate IL may be advantageous in reducing the thickness of the entire coil portion 200. When the support substrate IL is formed using an insulating material including a photosensitive insulating resin, the number of processes for forming the coil portion 200 may be reduced. Therefore, it may be advantageous in reducing production costs, and fine vias may be formed.

[0051] The thickness of the support substrate IL may be, for example, 10 μm or more and 50 μm or less, but is not limited thereto.

[0052] The slit portions S1 and S2 may be formed in an edge portion of the sixth surface 106 of the body 100. Specifically, the slit portions S1 and S2 may be formed along an edge portion between each of the first surface 101 and the second surface 102 of the body 100 and the sixth surface 106 of the body 100. For example, the first slit portion S1 may be formed along an edge portion between the first surface 101 of the body 100 and the sixth surface 106 of the body 100, and the second slit portion S2 may be formed along an edge portion between the second surface 102 of the body 100 and the sixth surface 106 of the body 100. The slit portions S1 and S2 may have a shape extending from the third surface 103 of the body 100 to the fourth surface 104 of the body 100. The slit portions S1 and S2 may not extend to the fifth surface 105 of the body 100. For example, the slit portions S1 and S2 may not pass through the body 100 in the thickness direction T of the body 100.

[0053] The slot portions S1 and S2 may be formed by performing pre-cutting on one surface of the coil bar along the conceptual boundary line corresponding to the width direction of each coil component in the conceptual boundary line that makes each individual in the coil component in the state of the coil bar (for example, in the state before each in the coil component is individualized). The depth of the pre-cutting may be adjusted so that the lead-out patterns 231 and 232 to be described later are exposed from the inner surfaces of the slot portions S1 and S2. The inner surfaces of the slot portions S1 and S2 may have inner walls substantially parallel to the first surface 101 and the second surface 102 of the main body 100 and a lower surface connecting the inner wall and the first surface 101 and the second surface 102 of the main body 100. Hereinafter, for ease of description, the slot portions S1 and S2 will be described as having an inner wall and a lower surface, but the scope of the present disclosure is not limited thereto. As an example, the inner surface of the first slot portion S1 may be formed so that the shape of the cross section of the first slot portion S1 has a curved shape connecting the first surface 101 of the main body 100 and the sixth surface 106.

[0054] The inner surfaces of the slot portions S1 and S2 may also correspond to the surface of the body 100 , but in this specification, for ease of understanding and explanation of the present disclosure, the inner surfaces of the slot portions S1 and S2 may be distinguished from the surface of the body 100 .

[0055] The coil part 200 may be embedded in the body 100 to exhibit characteristics of a coil component. For example, when the coil component 1000 according to this embodiment is used as a power inductor, the coil part 200 may be used to stabilize the power supply of an electronic device by storing electric energy as a magnetic field and maintaining an output voltage.

[0056] The coil part 200 may include coil patterns 211 and 212 , lead-out patterns 231 and 232 , auxiliary lead-out patterns 241 and 242 , and a connection via 220 .

[0057] Reference Figures 4 to 6 ,based on Figure 4 and Figure 5 The first coil pattern 211, the first lead-out pattern 231, and the second lead-out pattern 232 may be arranged on the lower surface of the support substrate IL facing the lower surface (sixth surface 106) of the main body 100, and the second coil pattern 212, the first auxiliary lead-out pattern 241, and the second auxiliary lead-out pattern 242 may be arranged on the upper surface of the support substrate IL opposite to the lower surface of the support substrate IL. On the lower surface of the support substrate IL, the first coil pattern 211 may be in contact with the first lead-out pattern 231 and connected (e.g., directly connected) to the first lead-out pattern 231, and the first coil pattern 211 and the first lead-out pattern 231 may be arranged to be spaced apart from (and not in direct contact with) the second lead-out pattern 232. The first lead-out pattern 231 may be formed to extend from the outermost turn of the first coil pattern 211 to the end surface 101 of the main body 100. On the upper surface of the support substrate IL, the second coil pattern 212 may be in contact with and connected to (e.g., directly connected to) the second auxiliary lead-out pattern 242, and the second coil pattern 212 and the second auxiliary lead-out pattern 242 may be arranged to be spaced apart from (and not in direct contact with) the first auxiliary lead-out pattern 241. The second auxiliary lead-out pattern 242 may be formed to extend from the outermost turn of the second coil pattern 212 to the end surface 102 of the body 100. The connecting via 220 may pass through the support substrate IL to contact and connect to the innermost turn of the first coil pattern 211 and the innermost turn of the second coil pattern 212. The first lead-out pattern 231 and the first auxiliary lead-out pattern 241 may be connected to each other through the first reinforcement pattern portion 311, the first auxiliary reinforcement pattern portion 321, and the first through via TV1, which will be described later. The second lead-out pattern 232 and the second auxiliary lead-out pattern 242 may be connected to each other through a second reinforcement pattern portion 312, a second auxiliary reinforcement pattern portion 322, and a second through via TV2 to be described later. By doing so, the coil portion 200 may be integrated as one coil.

[0058] Each of the first and second coil patterns 211 and 212 may be provided in a planar spiral shape having at least one turn formed around the core 110. For example, the first coil pattern 211 may form at least one turn around the core 110 on one surface of the support substrate IL.

[0059] The first lead-out pattern 231 may be exposed from the lower surface of the first slot portion S1, and the second lead-out pattern 232 may be exposed from the lower surface of the second slot portion S2. External electrodes 410 and 420, which will be described later, may be formed on the lower surfaces and inner walls of the slot portions S1 and S2. Since the lead-out patterns 231 and 232 are exposed on the lower surfaces of the slot portions S1 and S2, the lead-out patterns 231 and 232 and the external electrodes 410 and 420 may contact and be connected to each other.

[0060] Compared with other surfaces of the lead-out patterns 231 and 232, the areas exposed from the lower surfaces of the slit portions S1 and S2 in the surfaces facing the sixth surface 106 of the body 100 may have a higher surface roughness. For example, when the lead-out patterns 231 and 232 are formed by electroplating and then the slit portions S1 and S2 are formed on the body 100, the cutting end may contact the portions of the lead-out patterns 231 and 232 facing the sixth surface 106 of the body 100, and the corresponding areas of the lead-out patterns 231 and 232 may be ground by the cutting end. As will be described later, the external electrodes 410 and 420 may be formed using a thin film that generally has a relatively weak bonding force with the lead-out patterns 231 and 232. However, since the areas exposed from the lower surfaces of the slit portions S1 and S2 in the areas of the lead-out patterns 231 and 232 have a relatively high surface roughness, the bonding force between the lead-out patterns 231 and 232 and the external electrodes 410 and 420 may be improved.

[0061] The lead-out patterns 231 and 232 and the auxiliary lead-out patterns 241 and 242 may be exposed from the end surfaces 101 and 102 of the body 100, respectively. For example, the first lead-out pattern 231 may be exposed from the first surface 101 of the body 100, and the second lead-out pattern 232 may be exposed from the second surface 102 of the body 100. The first auxiliary lead-out pattern 241 may be exposed from the first surface 101 of the body 100, and the second auxiliary lead-out pattern 242 may be exposed from the second surface 102 of the body 100. Thus, the first lead-out pattern 231 may be exposed from the lower surface of the first slot portion S1 and the first surface 101 of the body 100, and the second lead-out pattern 232 may be exposed from the lower surface of the second slot portion S2 and the second surface 102 of the body 100.

[0062] At least one of the coil patterns 211 and 212, the connection vias 220, the lead-out patterns 231 and 232, and the auxiliary lead-out patterns 241 and 242 may include one or more conductive layers 10 and 20. For example, when the first coil pattern 211, the lead-out patterns 231 and 232, and the connection vias 220 are formed on one surface of the support substrate IL by plating, the first coil pattern 211, the lead-out patterns 231 and 232, and the connection vias 220 may include a first conductive layer 10 formed by electroless plating or the like and a second conductive layer 20 disposed on the first conductive layer 10. The first conductive layer 10 may be a seed layer for forming the second conductive layer 20 on the support substrate IL by plating. The second conductive layer 20 may be an electroplating layer. In this case, the electroplating layer may have a single-layer structure or a multi-layer structure. The electroplating layer of the multi-layer structure may be formed as a conformal film structure in which one electroplating layer is covered by another electroplating layer, or may have a form in which another electroplating layer is stacked only on one surface of one electroplating layer. The seed layer of the first coil pattern 211 and the seed layer of the first lead pattern 231 may be integrally formed without a boundary therebetween, but are not limited thereto. The plating layer of the first coil pattern 211 and the plating layer of the first lead pattern 231 may be integrally formed without a boundary therebetween, but are not limited thereto.

[0063] The second conductive layer 20 may cover the first conductive layer 10 to contact the support substrate IL. Figure 5, the first conductive layer 10 of the first coil pattern 211 may be formed to have a width narrower than that of the second conductive layer 20 of the first coil pattern 211, and the second conductive layer 20 of the first coil pattern 211 may be formed to cover the surface of the first conductive layer 10 to contact one surface of the supporting substrate IL. The structure of the first coil pattern 211 may be constructed by: forming the first conductive layer 10 having a planar spiral shape on one surface of the supporting substrate IL; forming a plating resist having a planar spiral shape opening to expose the first conductive layer 10 on one surface of the supporting substrate IL; and filling the second conductive layer 20 as a plating layer in the opening of the plating resist with the first conductive layer 10 as a seed layer. Since the diameter of the opening of the plating resist is larger than the line width of the first conductive layer 10, the line width of the second conductive layer 20 filling the opening of the plating resist may be larger than the line width of the first conductive layer 10. Therefore, the second conductive layer 20 may directly contact one surface of the supporting substrate IL. In this embodiment, compared with the case where the seed layer may not be formed into a planar spiral shape and the electroplating layer may be formed, since the first conductive layer 10 (which may be a seed layer) is formed into a planar spiral shape and then electroplating is performed, the removal of the plating resist and the patterning of the seed layer can be omitted. As a result, the number of processes can be reduced, and damage to the support substrate IL and conductor loss of the electroplating layer that may occur during the removal of the plating resist and the patterning of the seed layer can be prevented. At least a portion of the above-mentioned plating resist may be retained to be used as a portion of the insulating film IF to be described later.

[0064] For example, Figure 4 and Figure 5 As shown in , the coil patterns 211 and 212, the lead patterns 231 and 232, and the auxiliary lead patterns 241 and 242 may be formed to protrude from the lower surface and the upper surface of the support substrate IL. As another example, the first coil pattern 211 and the lead patterns 231 and 232 may be formed to protrude from the lower surface of the support substrate IL, and the second coil pattern 212 and the auxiliary lead patterns 241 and 242 may be embedded in the upper surface of the substrate IL to be exposed from the upper surface of the support substrate IL. In this case, since a groove may be formed on at least one of the upper surface of the second coil pattern 212 and the upper surfaces of the auxiliary lead patterns 241 and 242, the upper surface of the support substrate IL and the upper surface of the second coil pattern 212, and / or the upper surfaces of the auxiliary lead patterns 241 and 242 may not be located on the same plane.

[0065] The coil patterns 211 and 212, the lead-out patterns 231 and 232, the auxiliary lead-out patterns 241 and 242, and the connection via 220 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited thereto.

[0066] The first auxiliary lead-out pattern 241 may be independent of the electrical connection of the rest of the configuration of the coil part 200 and thus may be omitted in this embodiment. In this case, the volume of the magnetic material in the body 100 may be increased by the volume corresponding to the first auxiliary lead-out pattern 241. In order to omit the process of distinguishing the fifth surface 105 and the sixth surface 106 of the body 100, as shown in FIG. Figures 1 to 6 As shown in FIG. 2 , a first auxiliary lead-out pattern 241 may be formed.

[0067] The reinforcement pattern portions 311 and 312 may be disposed between the lead-out patterns 231 and 232 and one surface of the support substrate IL. The auxiliary reinforcement pattern portions 321 and 322 may be disposed between the auxiliary lead-out patterns 241 and 242 and the other surface of the support substrate IL. Specifically, the first reinforcement pattern portion 311 may be disposed between the first lead-out pattern 231 and one surface of the support substrate IL, and the second reinforcement pattern portion 312 may be disposed between the second lead-out pattern 232 and one surface of the support substrate IL. The first auxiliary reinforcement pattern portion 321 may be disposed between the first auxiliary lead-out pattern 241 and the other surface of the support substrate IL, and the second auxiliary reinforcement pattern portion 322 may be disposed between the second auxiliary lead-out pattern 242 and the other surface of the support substrate IL. The above-mentioned structure of the reinforcement pattern portions 311 and 312 and the auxiliary reinforcement pattern portions 321 and 322 may be realized by first forming the reinforcement pattern portions 311 and 312 and the auxiliary reinforcement pattern portions 321 and 322 to one surface and the other surface of the support substrate IL, respectively, before the coil portion 200 is formed on the support substrate IL.

[0068] This is advantageous because, based on the same size of the body, as the support substrate is thinner, the volume of the coil conductor and the magnetic material in the body can be increased. When the support substrate becomes thinner, it may be difficult to handle the support substrate during the process, and the possibility of deformation of the support substrate may be increased. In particular, considering that a plurality of components are formed together by performing the manufacturing process on a large scale rather than being formed in separate units, the above-mentioned problem may be directly related to the increase in defect rate. In the case of this embodiment, the above-mentioned problem can be solved by forming the enhancement pattern parts 311 and 312 and the auxiliary enhancement pattern parts 321 and 322 on the support substrate IL. For example, by forming the width of each of the enhancement pattern parts 311 and 312 and the auxiliary enhancement pattern parts 321 and 322 to be greater than the width of the cutting line, a plurality of adjacent support substrates IL can be effectively supported during the manufacturing process. As a result, the support substrate IL can be more stably handled and supported in subsequent processes to prevent the support substrate IL from deforming. Therefore, the support substrate IL can be relatively thin, and as a result, the characteristics of the component can be improved. Hereinafter, in order to avoid duplication of description, description will be made based on the reinforcement pattern portions 311 and 312 , but the description of the reinforcement pattern portions 311 and 312 may be applied to the auxiliary reinforcement pattern portions 321 and 322 .

[0069] The reinforcement pattern portions 311 and 312 may be configured such that one surface of the reinforcement pattern portions 311 and 312 contacting the support substrate IL has a larger area than the other surface of the reinforcement pattern portions 311 and 312 opposite to the one surface. Figure 4In the direction of the reinforcing pattern portions 311 and 312, the area of ​​the upper surface of each of the reinforcing pattern portions 311 and 312 contacting the lower surface of the supporting substrate IL may be larger than the area of ​​the lower surface of each of the reinforcing pattern portions 311 and 312 facing away from the supporting substrate IL and substantially parallel to the upper surface of the reinforcing pattern portions. Since the area of ​​the upper surface of each of the reinforcing pattern portions 311 and 312 is made larger than the area of ​​the lower surface of each of the reinforcing pattern portions 311 and 312, the function of the reinforcing pattern portions 311 and 312 for supporting the supporting substrate IL may be improved. Due to the area difference between the upper surface and the lower surface of the reinforcing pattern portions 311 and 312, one side surface of each of the reinforcing pattern portions 311 and 312 facing the first coil pattern 211 may be inclined in the thickness direction T of the body 100, and as a result, the contact area between each of the reinforcing pattern portions 311 and 312 and each of the lead-out patterns 231 and 232 may be increased. Therefore, the bonding force between the reinforcing pattern portions 311 and 312 and the lead-out patterns 231 and 232 may be improved. For example, a structure having an area difference between the upper and lower surfaces of the reinforcement pattern parts 311 and 312 may be realized by entirely forming a metal film for forming the reinforcement pattern parts 311 and 312 on one surface of the support substrate IL and removing portions of the metal film except for portions corresponding to the reinforcement pattern parts 311 and 312 by isotropic etching, but is not limited thereto. A copper clad laminate (CCL) may be used in the above-described method for forming the reinforcement pattern parts 311 and 312, but is not limited thereto.

[0070] The thickness of each of the reinforcement pattern portions 311 and 312 may be the same as the thickness of the support substrate IL. For example, when each of the reinforcement pattern portions 311 and 312 and the support substrate IL are formed by using a thick CCL having a 20 μm thick copper film stacked on both surfaces of a 20 μm thick insulating material, the thickness of each of the reinforcement pattern portions 311 and 312 may be the same as the thickness of the support substrate IL.

[0071] Under the condition that the lead-out patterns 231 and 232 cover the reinforcement pattern parts 311 and 312, the shape and size of the reinforcement pattern parts 311 and 312 are not limited. When the area and thickness of the reinforcement pattern parts 311 and 312 are increased under the above conditions, the plating time for forming the lead-out patterns 231 and 232 can be advantageously reduced. Each of the reinforcement pattern parts 311 and 312 may have: another side surface, respectively exposed from the first surface 101 and the second surface 102 of the body 100, and opposite to one side surface of each of the reinforcement pattern parts 311 and 312 facing the first coil pattern 211. The lead-out patterns 231 and 232 may cover all surfaces of the reinforcement pattern parts 311 and 312 except the other side surface. In this case, the first conductive layer of the lead-out patterns 231 and 232 may cover all surfaces of the reinforcement pattern parts 311 and 312 except the other side surface of the reinforcement pattern parts 311 and 312.

[0072] The reinforcement pattern portions 311 and 312 and the auxiliary reinforcement pattern portions 321 and 322 may be connected to each other through through holes TV1 and TV2 passing through the reinforcement pattern portions 311 and 312, the support substrate IL, and the auxiliary reinforcement pattern portions 321 and 322. For example, the first reinforcement pattern portion 311 and the first auxiliary reinforcement pattern portion 321 may be connected to each other through the first through hole TV1 passing through the first reinforcement pattern portion 311, the support substrate IL, and the first auxiliary reinforcement pattern portion 321, and the second reinforcement pattern portion 312 and the second auxiliary reinforcement pattern portion 322 may be connected to each other through the second through hole TV2 passing through the second reinforcement pattern portion 312, the support substrate IL, and the second auxiliary reinforcement pattern portion 322. Due to this structure, the lead-out patterns 231 and 232 respectively formed on the reinforcement pattern portions 311 and 312 and the auxiliary lead-out patterns 241 and 242 respectively formed on the auxiliary reinforcement pattern portions 321 and 322 may be respectively electrically connected to each other.

[0073] The reinforcement pattern portions 311 and 312, the auxiliary reinforcement pattern portions 321 and 322, and the through vias TV1 and TV2 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but are not limited thereto.

[0074] As described above, when the first auxiliary lead-out pattern 241 is omitted in this embodiment, the first auxiliary reinforcement pattern portion 321 and the first through via TV1 may also be omitted in this embodiment, but is not limited thereto. For example, although the first auxiliary lead-out pattern 241 is omitted in this embodiment, the first auxiliary reinforcement pattern portion 321 may be formed on the other surface of the support substrate IL.

[0075] The external electrodes 410 and 420 may be disposed on the slot portions S1 and S2, respectively, and may be connected to the coil portion 200. Specifically, the first external electrode 410 may be disposed on an inner surface of the first slot portion S1, and may be connected to the first lead-out pattern 231 exposed from the lower surface of the first slot portion S1. The second external electrode 420 may be disposed on an inner surface of the second slot portion S2, and may be connected to the second lead-out pattern 232 exposed from the lower surface of the second slot portion S2. Each of the first external electrode 410 and the second external electrode 420 may extend to the sixth surface 106 of the body 100 and be spaced apart from each other thereon.

[0076] The external electrodes 410 and 420 may be formed along the inner wall of a corresponding one of the slot portions S1 and S2 and along the sixth surface 106 of the body 100. For example, the external electrodes 410 and 420 may be formed in the form of a conformal film on the inner wall of a corresponding one of the slot portions S1 and S2 and on the sixth surface 106 of the body 100. The external electrodes 410 and 420 may be integrally formed on the inner wall of each of the slot portions S1 and S2 and on the sixth surface 106 of the body 100. To this end, the external electrodes 410 and 420 may be formed by a thin film process such as a sputtering process or a plating process.

[0077] The external electrodes 410 and 420 may be formed using a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), chromium (Cr), titanium (Ti), or an alloy thereof, but are not limited thereto. The external electrodes 410 and 420 may be formed to have a single layer or multiple layers. For example, each of the external electrodes 410 and 420 may be formed to contact the lower surface of a corresponding one of the slot portions S1 and S2, the inner wall of a corresponding one of the slot portions S1 and S2, and the sixth surface 106 of the body 100, and may be formed to have a first layer of copper (Cu), a second layer of nickel (Ni) formed on the first layer, and a third layer of tin (Sn) formed on the second layer, but are not limited thereto.

[0078] The insulating film IF may insulate the lead-out patterns 231 and 232, the coil patterns 211 and 212, and the auxiliary lead-out patterns 241 and 242 from the body 100. The insulating film IF may include, for example, polyparaxylene, but is not limited thereto. The insulating film IF may be formed by a vapor deposition method or the like, but is not limited thereto, and may also be formed by stacking insulating films on both surfaces of the support substrate IL. The insulating film IF may be a structure including a portion of a plating resist used when forming the second plating layer by electroplating, but is not limited thereto.

[0079] The surface insulating layer 500 may be disposed on the surface of the body 100 and may cover portions of the external electrodes 410 and 420 disposed on the inner surfaces of the slot portions S1 and S2, respectively. Specifically, the surface insulating layer 500 may be disposed on the inner surfaces of the slot portions S1 and S2 and the first surface 101, the second surface 102, the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the body 100, but may expose portions of the sixth surface 106 on which the external electrodes 410 and 420 are disposed. The surface insulating layer 500 may be formed by a printing process, a vapor deposition process, a spraying process, a film stacking process, etc., but is not limited thereto. The surface insulating layer 500 may include a thermoplastic resin (such as a polystyrene-based resin, a vinyl acetate-based resin, a polyester-based resin, a polyethylene-based resin, a polypropylene-based resin, a polyamide-based resin, a rubber-based resin, an acrylic-based resin, etc.), a thermosetting resin (such as a phenol-based resin, an epoxy-based resin, a urethane-based resin, a melamine-based resin, an alkyd resin, etc.), a photosensitive resin, polyparaxylene, SiO x or SiN x A portion of the surface insulating layer 500 may be formed on the body 100 before performing a process for forming the external electrodes 410 and 420, and may be used as a mask when forming the external electrodes 410 and 420, but is not limited thereto. The surface insulating layer 500 may be formed integrally, but may be formed by a plurality of processes to form a boundary between a portion of a region in the surface of the body 100 and a portion formed on other regions.

[0080] By doing so, the coil component 1000 according to the embodiment can easily realize the lower electrode structure while reducing the size of the coil component. For example, unlike the conventional method, since the external electrodes 410 and 420 may not be formed to protrude from both the end surfaces 101 and 102 of the main body 100 or the side surfaces 103 and 104 of the main body 100, the total length and total width of the coil component 1000 may not be increased. In addition, the external electrodes 410 and 420 are formed by a thin film process and can be formed to be relatively thin to minimize the increase in the thickness of the coil component 1000. In addition, since the reinforcement pattern parts 311 and 312 and the auxiliary reinforcement pattern parts 321 and 322 are formed on both surfaces of the support substrate IL, the coil component 1000 according to the embodiment can improve the ease of handling the support substrate IL during the manufacturing process, and can prevent the support substrate IL from being deformed.

[0081] Second embodiment

[0082] Figure 7 is a diagram schematically showing a coil component according to a second embodiment of the present disclosure. Figure 8 It is shown along Figure 7 Illustration of a cross section taken along line III-III'.

[0083] Reference Figures 1 to 6 as well as Figures 7 and 8 , when the coil component 2000 according to this embodiment is compared with the coil component 1000 according to the first embodiment of the present disclosure, the lead-out patterns 231 and 232 and the auxiliary lead-out patterns 241 and 242 may be differently arranged. Therefore, when describing this embodiment, only the lead-out patterns 231 and 232 and the auxiliary lead-out patterns 241 and 242 that are different from the first embodiment will be described. The rest of the configuration of this embodiment may be applied as described in the first embodiment of the present disclosure.

[0084] In this embodiment, the distance (r1) from one surface of the body 100 to each of the lead-out patterns 231 and 232 may be shorter than the distance (r2) from one surface of the body 100 to the first coil pattern 211. For example, the thickness of each of the lead-out patterns 231 and 232 may be thicker than the thickness of the first coil pattern 211. In this case, the thickness of each of the lead-out patterns 231 and 232 may represent the distance from one surface of each of the lead-out patterns 231 and 232 contacting the support substrate IL to the other surface of each of the lead-out patterns 231 and 232 facing the sixth surface 106 of the body 100 in the vertical direction. The thickness of the first coil pattern 211 may represent the distance from one surface of the first coil pattern 211 contacting the support substrate IL to the other surface of the first coil pattern 211 facing the sixth surface 106 of the body 100 in the vertical direction. In addition, the above-mentioned thickness and distance may represent an average thickness and an average distance, respectively.

[0085] Due to the above-described structure, the slit portions S1 and S2 may be formed at a relatively shallow depth compared to the first embodiment of the present disclosure.

[0086] As described above, the slot portions S1 and S2 that expose the lead-out patterns 231 and 232 from the lower surfaces of the slot portions S1 and S2 may be formed by performing a pre-cutting process on the sixth surface 106 of the body 100. In the case of this embodiment, due to the above-described structure of the lead-out patterns 231 and 232, the volume of the body 100 that will be removed during the pre-cutting may be reduced. Therefore, the component characteristics may be improved by minimizing the reduction in the amount of magnetic material of the body 100.

[0087] The content (e.g., thickness) of the above-mentioned lead-out patterns 231 and 232 may also be applied to the auxiliary lead-out patterns 241 and 242, but is not limited thereto. For example, since the auxiliary lead-out patterns 241 and 242 are not configured to be exposed through the slit portions S1 and S2, the content (e.g., thickness) of the above-mentioned lead-out patterns 231 and 232 may be selectively applied. Specifically, when the content of the above-mentioned lead-out patterns 231 and 232 is similarly applied to the auxiliary lead-out patterns 241 and 242, the process of distinguishing the fifth surface 105 and the sixth surface 106 of the main body 100 may be omitted when the slit portions S1 and S2 are formed. When the content of the above-mentioned lead-out patterns 231 and 232 is not applied to the auxiliary lead-out patterns 241 and 242, the auxiliary lead-out patterns 241 and 242 may not be formed to be relatively thick, and therefore, the volume of the magnetic material of the main body 100 may be increased.

[0088] Third embodiment

[0089] Fig. 9 is a diagram schematically showing a coil component according to a third embodiment of the present disclosure. Fig.10 It is shown along Fig. 9 Illustration of a cross section taken along line IV-IV'.

[0090] Reference Figures 1 to 6 as well as Figures 9 and 10 , when the coil component 3000 according to this embodiment is compared with the coil component 1000 according to the first embodiment of the present disclosure, the lead-out patterns 231 and 232 may be differently arranged. Therefore, when describing this embodiment, only the form of the lead-out patterns 231 and 232 that is different from the first embodiment will be described. The rest of the configuration of this embodiment may be applied as described in the first embodiment of the present disclosure.

[0091] In this embodiment, the slit portions S1 and S2 may be formed to extend into the first lead-out pattern 231 and the second lead-out pattern 232, respectively. For example, the slit portions S1 and S2 may extend into at least a portion of the lead-out patterns 231 and 232. As a result, the first lead-out pattern 231 may be exposed from the lower surface and the inner wall of the first slit portion S1, and the second lead-out pattern 232 may be exposed from the lower surface and the inner wall of the second slit portion S2. Due to the presence of the slit portions S1 and S2, the lead-out patterns 231 and 232 may be formed such that the thickness of the region forming the lower surface of the slit portions S1 and S2 is different from the thickness of the region forming the inner wall of the slit portions S1 and S2, thereby having a step difference as a whole.

[0092] In this embodiment, since the lead-out patterns 231 and 232 can be exposed not only from the lower surface of the narrow groove portions S1 and S2 but also from the inner wall of the narrow groove portions S1 and S2, the bonding force between the lead-out patterns 231 and 232 and the external electrodes 410 and 420 can be increased by increasing the contact area therebetween.

[0093] Fourth embodiment

[0094] Fig.11 is a diagram schematically showing a coil component according to a fourth embodiment of the present disclosure. Fig.12 It is shown along Fig.11 Schematic diagram of a cross section taken along line V-V'.

[0095] Reference Figures 7 and 8 as well as Figure 11 to Figure 12 , when the coil component 4000 according to this embodiment is compared with the coil component 2000 according to the second embodiment of the present disclosure, the lead-out patterns 231 and 232 may be differently arranged. Therefore, when describing this embodiment, only the lead-out patterns 231 and 232 that are different from the second embodiment will be described. The rest of the configuration of this embodiment may be applied as described in the second embodiment of the present disclosure.

[0096] In this embodiment, the slit portions S1 and S2 may be formed to extend into the first lead-out pattern 231 and the second lead-out pattern 232, respectively. For example, the slit portions S1 and S2 may extend into at least a portion of the lead-out patterns 231 and 232. As a result, the first lead-out pattern 231 may be exposed from the lower surface and the inner wall of the first slit portion S1, and the second lead-out pattern 232 may be exposed from the lower surface and the inner wall of the second slit portion S2. Due to the presence of the slit portions S1 and S2, the lead-out patterns 231 and 232 may be formed such that the thickness of the region forming the lower surface of the slit portions S1 and S2 is different from the thickness of the region forming the inner wall of the slit portions S1 and S2, thereby having a step difference as a whole.

[0097] In the case of this embodiment, the effects of the coil component 2000 according to the second embodiment of the present disclosure and the effects of the coil component 3000 according to the third embodiment of the present disclosure can be provided. For example, in the case of this embodiment, as in the coil component 3000 according to the third embodiment of the present disclosure, the coupling force between the lead-out patterns 231 and 232 and the external electrodes 410 and 420 can be increased. In addition, as in the coil component 2000 according to the second embodiment of the present disclosure, the reduction of the magnetic material of the body 100 can be minimized.

[0098] In the case of this embodiment, unlike the second embodiment of the present disclosure, the distance (r1) from one surface of the body 100 to the lead-out patterns 231 and 232 and the thickness of the lead-out patterns 231 and 232 may be represented based only on the region in which the slit portions S1 and S2 are not formed, the distance (r1) and the thickness of the lead-out patterns 231 and 232. For this reason, the average distance from one surface of the body 100 to the lead-out patterns 231 and 232 and the average thickness of the lead-out patterns 231 and 232 described in the second embodiment of the present disclosure may be based only on a portion of the above-mentioned lead-out patterns 231 and 232.

[0099] According to an embodiment of the present disclosure, a support substrate may be more stably supported during a manufacturing process.

[0100] In addition, according to the embodiments of the present disclosure, loss of the main body can be minimized.

[0101] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications and variations may be made without departing from the scope of the present disclosure as defined by the appended claims.

Claims

1. A coil assembly, comprising: a body having one surface and another surface opposite to each other; A supporting substrate, disposed in the main body; a coil portion, comprising a first coil pattern, a first lead-out pattern, and a second lead-out pattern, wherein the first coil pattern is disposed on one surface of the support substrate facing the one surface of the body, the first lead-out pattern extends from the first coil pattern to an end surface of the body, and the second lead-out pattern is disposed on the one surface of the support substrate and is spaced apart from the first coil pattern and extends to the other end surface of the body; a reinforcing pattern portion disposed between each of the first lead-out pattern and the second lead-out pattern and the one surface of the support substrate; A first slot portion and a second slot portion, respectively provided in an edge portion of the one surface of the body, the first slot portion exposing the first lead-out pattern from an inner surface of the first slot portion, and the second slot portion exposing the second lead-out pattern from an inner surface of the second slot portion; as well as A first external electrode and a second external electrode, the first external electrode being disposed on the inner surface of the first slot portion and connected to the first lead-out pattern, and the second external electrode being disposed on the inner surface of the second slot portion and connected to the second lead-out pattern.

2. The coil assembly according to claim 1, wherein: A distance from the one surface of the body to each of the first lead-out pattern and the second lead-out pattern is shorter than a distance from the one surface of the body to the first coil pattern.

3. The coil assembly according to claim 1, wherein: An area of ​​one surface of the reinforcement pattern portion contacting the support substrate is larger than an area of ​​another surface of the reinforcement pattern portion opposite to the one surface of the reinforcement pattern portion.

4. The coil assembly according to claim 1, wherein: The thickness of the reinforcement pattern part is the same as the thickness of the support substrate.

5. The coil assembly according to claim 1, wherein: Each of the first lead-out pattern and the second lead-out pattern covers one side surface of the reinforcement pattern portion facing the first coil pattern, and contacts the one surface of the support substrate.

6. The coil assembly according to claim 5, wherein: Each of the reinforcement pattern parts is exposed from a corresponding end surface of the body.

7. The coil assembly according to claim 1, wherein: The first slot portion is formed to extend to contact at least a portion of the first lead-out pattern, and the second slot portion is formed to extend to contact at least a portion of the second lead-out pattern.

8. The coil assembly according to claim 1, wherein: Each of the first coil pattern, the first lead-out pattern, and the second lead-out pattern includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The second conductive layer covers the first conductive layer and contacts the one surface of the support substrate.

9. The coil assembly according to claim 8, wherein: The first conductive layer of each of the first lead-out pattern and the second lead-out pattern covers the reinforcement pattern part.

10. The coil assembly according to claim 1, wherein: The coil portion further includes: a second coil pattern provided on another surface of the support substrate opposite to the one surface of the support substrate, a first auxiliary lead-out pattern disposed on the other surface of the support substrate and spaced apart from the second coil pattern and overlapping the first lead-out pattern, a second auxiliary lead-out pattern disposed on the other surface of the support substrate and extending from the second coil pattern and overlapping the second lead-out pattern, a connecting via hole penetrating the support substrate to connect the first coil pattern and the second coil pattern, and An auxiliary reinforcement pattern portion is disposed between each of the first auxiliary lead-out pattern and the second auxiliary lead-out pattern and the other surface of the support substrate.

11. The coil assembly according to claim 10, wherein: The first lead-out pattern and the first auxiliary lead-out pattern are connected to each other through a first through via passing through the reinforcement pattern portion, the support substrate and the auxiliary reinforcement pattern portion, and the second lead-out pattern and the second auxiliary lead-out pattern are connected to each other through a second through via passing through the reinforcement pattern portion, the support substrate and the auxiliary reinforcement pattern portion.

12. The coil assembly according to claim 1, wherein: The coil portion further includes: a second coil pattern provided on another surface of the support substrate opposite to the one surface of the support substrate, a second auxiliary lead-out pattern disposed on the other surface of the support substrate and extending from the second coil pattern and overlapping the second lead-out pattern, a connecting via hole penetrating the support substrate to connect the first coil pattern and the second coil pattern, and The auxiliary reinforcing pattern portion is disposed between the second auxiliary lead-out pattern and the other surface of the support substrate.

13. The coil assembly according to claim 12, wherein: The second lead-out pattern and the second auxiliary lead-out pattern are connected to each other through a through via that passes through the reinforcement pattern portion, the support substrate, and the auxiliary reinforcement pattern portion.

14. A coil assembly, comprising: main body; A supporting substrate, disposed in the main body; a coil portion including a first coil pattern provided on one surface of the support substrate and a first lead-out pattern and a second lead-out pattern extending between the first coil pattern and respective end surfaces of the body; as well as The first reinforcement pattern portion and the second reinforcement pattern portion are formed using conductive materials, the first reinforcement pattern portion is only arranged between the one surface of the support substrate and the first lead-out pattern, and the second reinforcement pattern portion is only arranged between the one surface of the support substrate and the second lead-out pattern.

15. The coil assembly according to claim 14, wherein: The first reinforcement pattern portion and the second reinforcement pattern portion each have a surface facing the first coil pattern, and the surface of each of the first reinforcement pattern portion and the second reinforcement pattern portion is inclined so as not to be orthogonal to the one surface of the substrate.

16. The coil component according to claim 14 further comprises a first through via and a second through via, wherein the first through via extends through the support substrate and the first reinforcement pattern portion to directly contact the first lead-out pattern, and the second through via extends through the support substrate and the second reinforcement pattern portion to directly contact the second lead-out pattern.

17. The coil assembly according to claim 14, wherein: A thickness of each of the first reinforcement pattern portion and the second reinforcement pattern portion is equal to a thickness of the support substrate.

18. The coil assembly according to claim 14, wherein: A surface of the body facing the one surface of the support substrate has a first groove and a second groove, each of the first groove and the second groove is provided along a corresponding end surface of the body and each extends to a corresponding one of the first lead-out pattern and the second lead-out pattern, and A first external electrode and a second external electrode are spaced apart from each other on the surface of the body facing the one surface of the support substrate, the first external electrode extends in the first groove to contact the first lead-out pattern, and the second external electrode extends in the second groove to contact the second lead-out pattern.

19. The coil assembly according to claim 14, wherein: A distance from one surface of the body facing the one surface of the support substrate to each of the first lead-out pattern and the second lead-out pattern is shorter than a distance from the one surface of the body to the first coil pattern.

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