Electronic component clamping device applied to SMT mounter

Abstract

The present invention discloses an electronic component clamping device applied to an SMT mounter, which includes a structural body. The structural body is provided with positioning holes for inserting electronic components. A convex structure protrudes from the inner side wall of the positioning holes, and a positioning surface structure is formed on the bottom surface of the positioning holes. At least one concave clearance structure is provided on the positioning surface structure, and the clearance structure is located directly below the convex structure. The clamping device of the present invention has the advantage of preventing debris from sticking to the electronic components.

Description

Technical Field

[0001] The present invention relates to the field of surface mounting technology, and in particular to a clamping device for electronic components applied to an SMT mounter. Background Art

[0002] SMT is called surface mounting technology, which is the most popular technology and process in the current electronic assembly industry. It is a circuit connection technology that mounts pinless or short-lead surface-mounted components on the surface of a printed circuit board or other substrates and is welded and assembled by methods such as reflow soldering or dip soldering.

[0003] Before SMT patching, for some components (such as PINs) for positioning needs, the PINs need to be placed in a clamping device, and then sucked up by a nozzle in a vacuum pressure manner and the clamping device is placed on the PCB. This type of clamping device is provided with positioning holes for inserting components, and protrusions protrude inside the positioning holes. When the PINs are inserted into the positioning holes, the PINs will squeeze some debris of the lower protrusions, and the debris will fall to the bottom of the positioning holes. As the PINs are continuously inserted, the debris will eventually be pressed by the PINs. When welding, the high-temperature PINs will melt some debris. After the clamping device is taken away after welding is completed, the melted debris adheres to the PINs, which is difficult to clean and affects the appearance.

[0004] Therefore, there is an urgent need for a clamping device that can prevent debris from sticking to the PINs to overcome the above defects. Summary of the Invention

[0005] The purpose of the present invention is to provide a clamping device that can prevent debris from sticking to electronic components.

[0006] To achieve the above purpose, the clamping device for electronic components applied to an SMT mounter of the present invention includes a structural body. The structural body is provided with positioning holes for inserting electronic components. A convex structure protrudes from the inner side wall of the positioning holes. The bottom surface of the positioning holes forms a positioning surface structure, and at least one concave clearance structure is provided on the positioning surface structure. The clearance structure is located directly below the convex structure.

[0007] Preferably, the structural body is provided with a plurality of positioning holes arranged at intervals.

[0008] Preferably, the positioning holes are arranged in a variable-size hole structure.

[0009] Preferably, a convex column structure protrudes from the structural body. The positioning holes are opened in the convex column structure. At least one notch structure communicating with the positioning hole structure is provided on the side wall of the convex column structure, and the notch structure penetrates to the top of the convex column structure.

[0010] Preferably, the structure body protrudes to form a plurality of positioning blocks arranged in an arc-shaped cross-section, and all the positioning blocks are assembled into the convex column structure. The end faces of two adjacent positioning blocks are arranged at intervals relative to each other, and the notch structure is defined between two adjacent positioning blocks. All the positioning blocks define the positioning hole.

[0011] Preferably, the convex structure is a convex rib, and the side surface of the convex rib faces the center of the positioning hole.

[0012] Preferably, the clearance structure is a slot hole structure or a through hole structure.

[0013] Preferably, the positioning surface structure is a planar structure.

[0014] Preferably, the clearance structure is arranged in a fan-shaped structure.

[0015] Preferably, the convex column structure is provided with a chamfer structure at the opening of the positioning hole.

[0016] Compared with the prior art, the electronic component clamping device applied to the SMT mounter of the present invention includes a structure body. The structure body is provided with a positioning hole for inserting an electronic component. A convex structure protrudes from the inner side wall of the positioning hole, and the bottom surface of the positioning hole forms a positioning surface structure. At least one concave clearance structure is formed on the positioning surface structure, and the clearance structure is located directly below the convex structure. During use, the electronic component is inserted into the positioning hole. During the insertion process, the electronic component is squeezed by the convex structure, and debris is formed during the squeezing process. The generated debris then falls into the clearance structure. When the electronic component is positioned on the positioning surface structure, the debris will not be pressed by the electronic component because it has been stored in the clearance structure. During welding, the electronic component under high temperature will not melt the debris, and the debris will not stick to the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. is a perspective structural view of the electronic component clamping device applied to the SMT mounter of the present invention when loading an electronic component.

[0018] Figure 2 FIG. Figure 1 is a perspective structural view of the clamping device shown when separating an electronic component.

[0019] Figure 3 FIG. is a perspective structural view of the electronic component clamping device applied to the SMT mounter of the present invention.

[0020] Figure 4 FIG. is a Figure 3 stereoscopic structural sectional view taken along the line A-A in FIG. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] In order to describe the technical content and structural features of the present invention in detail, the following further description is made in conjunction with the embodiments and with reference to the drawings.

[0022] As Figures 1 to 4 shown, the electronic component clamping device 100 applied to the SMT mounter of the present invention includes a structural body 10. The structural body 10 is provided with a positioning hole 11 for inserting an electronic component 200. A protruding structure 12 protrudes from the inner side wall of the positioning hole 11. The bottom surface of the positioning hole 11 forms a positioning surface structure 13. At least one concave clearance structure 14 is formed on the positioning surface structure 13. The clearance structure 14 is located directly below the protruding structure 12. During use, the electronic component 200 is inserted into the positioning hole 11. During the insertion process, the electronic component 200 is squeezed by the protruding structure 12, and debris is formed during the squeezing process. The generated debris then falls into the clearance structure 14. When the electronic component 200 is positioned on the positioning surface structure 13, the debris will not be pressed by the electronic component because it has been stored in the clearance structure 14. During welding, the high-temperature electronic component 200 will not melt the debris either, and the debris will not stick to the electronic component 200.

[0023] After the electronic component 200 is inserted into the positioning hole 11, the upper end of the electronic component 200 is exposed for welding with the PCB board. For example, the electronic component 200 is a PIN, but is not limited thereto. The electronic component 200 inserted into the positioning hole 11 remains squeezed by the protruding structure 12, so that an interference fit is formed between the positioning hole 11 and the PIN. The PIN is a cylindrical structure. Correspondingly, the positioning hole 11 is a cylindrical hole, but is not limited thereto. The structural body 10 is a square plate. The positioning hole 11 is provided on one side surface of the square plate. The other side surface opposite to the side surface where the positioning hole 11 is located is a plane for external mechanical suction / gripping. When the external mechanical sucks this plane, the electronic component 200 can be driven onto the mounting part of the PCB board.

[0024] As Figures 1 to 4 shown, the structural body 10 is provided with a plurality of positioning holes 11 arranged at intervals. The plurality of positioning holes 11 can simultaneously insert a plurality of electronic components 200. In the present invention, the structural body 10 is provided with two positioning holes 11, but is not limited thereto. According to actual needs, several rows of positioning holes 11 are provided, and each row of positioning holes 11 includes a plurality of positioning holes 11.

[0025] As Figures 1 to 4As shown, the positioning hole 11 is arranged in a hole-shaped structure with variable size, avoiding the difficulty of inserting the electronic component 200 and the difficulty of separating the clamping device 100 and the electronic component 200 after welding. A convex column structure 15 protrudes from the structure body 10. The positioning hole 11 is opened in the convex column structure 15. At least one notch structure 16 communicating with the positioning hole 11 is provided on the side wall of the convex column structure 15. The notch structure 16 penetrates to the top of the convex column structure 15. Such a structural arrangement enables the positioning hole 11 to deform within a small range, can effectively clamp the electronic component 200, and can also make the positioning hole 11 of variable size, facilitating insertion and extraction. Preferably, the height of the notch structure 16 is less than the height of the positioning hole 11, that is to say, the notch structure 16 does not extend to the bottom of the convex column structure 15, ensuring the structural strength of the convex column structure 15. Specifically, the structure body 10 protrudes to form a plurality of positioning blocks 151 arranged in an arc-shaped cross-section. All the positioning blocks 151 are assembled into the convex column structure 15. The end faces between two adjacent positioning blocks 151 are arranged at intervals. A notch structure 16 is formed between two adjacent positioning blocks 151. All the positioning blocks 151 enclose the positioning hole 11. For example, the positioning block 151 and the structure body 10 are integrally formed by injection molding, but it is not limited thereto. Preferably, the structure body 10 protrudes to form 3 positioning blocks 151, and 3 notch structures 16 are formed between the 3 positioning blocks 151. Of course, according to actual needs, the structure body 10 can be provided with a larger number of positioning blocks 151.

[0026] In this embodiment, the protruding structure 12 is a convex rib, and the side surface of the convex rib faces the center of the positioning hole 11. The setting of the convex rib facilitates clamping and positioning of the electronic component 200. Moreover, the clamping of the electronic component 200 by the 3 convex ribs enables the centering installation of the electronic component 200, so that the electronic component 200 is accurately inserted into the positioning hole 11. The thickness of the convex rib is small, so as to reduce the difficulty of inserting the electronic component 200 and the amount of debris generated under the condition of meeting the clamping requirement.

[0027] As Figures 1 to 4 shown, the clearance structure 14 is a slot hole structure. Of course, according to actual needs, the clearance structure 14 can also be set as a through hole structure. When debris is generated, the debris can leak out from the through hole structure to avoid accumulation. Preferably, the positioning surface structure 13 is a plane structure, enabling better positioning of the electronic component 200. Three slot hole structures are opened on the positioning surface structure 13, and each slot hole structure is correspondingly located directly below the convex rib. In this way, the debris generated by the extrusion of the electronic component 200 and each convex rib naturally falls into the slot hole structure directly below it. At this time, the positioning surface structure 13 is approximately in a "herringbone" structure, and the electronic component 200 realizes stable positioning by relying on the positioning surface structure 13 of this shape.

[0028] For example, the clearance structure 14 is arranged in a fan-shaped structure. That is to say, at this time, the avoidance structure 14 is a fan-shaped slot structure, forming a space with a larger volume to accommodate debris. Of course, according to actual needs, the clearance structure 14 can be set to other shapes, such as triangular, semi-circular, etc., so it is not limited to this. The convex column structure 15 is provided with a chamfer structure 152 at the opening of the positioning hole 11 to facilitate the quick alignment and insertion of the electronic component 200.

[0029] During processing, the electronic component 200 is inserted into the positioning hole 11. During the insertion process, the electronic component 200 presses against the convex rib and generates debris. The generated debris falls into the slot structure. Finally, the end of the electronic component 200 is pressed against the positioning surface structure 13, and the convex rib clamps and positions the electronic component 200, and the electronic component 200 is positioned in the positioning hole 11. After the manual / external mechanical grasping and clamping device 100 is grasped to the preset installation position on the PCB board, the electronic component 200 is welded to the preset installation position on the PCB board. After the welding is completed, the clamping device 100 is removed, and the installation of the electronic component 200 can be completed.

[0030] The above-disclosed are only the preferred examples of the present invention, and the scope of the rights of the present invention cannot be limited thereby. Therefore, all equivalent changes made according to the claims of the present invention are within the scope covered by the present invention.

Claims

1. An electronic component clamping device applied to an SMT mounter, characterized in that: It includes a structural body, the structural body is provided with positioning holes for inserting electronic components, a convex structure protrudes from the inner side wall of the positioning holes, a positioning surface structure is formed on the bottom surface of the positioning holes, at least one concave clearance structure is formed on the positioning surface structure, and the clearance structure is located directly below the convex structure; the positioning holes are arranged in a variable-size hole-shaped structure; a convex column structure protrudes from the structural body, the positioning holes are opened in the convex column structure, at least one notch structure communicating with the positioning hole structure is opened on the side wall of the convex column structure, and the notch structure penetrates to the top of the convex column structure; the structural body protrudes to form a plurality of positioning blocks arranged in an arc-shaped cross section, all the positioning blocks are assembled into the convex column structure, the end faces of two adjacent positioning blocks are arranged at intervals relatively, the notch structure is surrounded between two adjacent positioning blocks, and all the positioning blocks surround the positioning holes.

2. The electronic component clamping device applied to an SMT mounter according to claim 1, characterized in that The structural body is provided with a plurality of positioning holes arranged at intervals.

3. The electronic component clamping device applied to an SMT mounter according to claim 1, characterized in that The convex structure is a convex rib, and the side surface of the convex rib faces the center of the positioning hole.

4. The electronic component clamping device applied to an SMT mounter according to claim 1, characterized in that The clearance structure is a slot hole structure or a through hole structure.

5. The electronic component clamping device applied to an SMT mounter according to claim 1, characterized in that The positioning surface structure is a planar structure.

6. The electronic component clamping device applied to an SMT mounter according to claim 4, characterized in that The clearance structure is arranged in a fan-shaped structure.

7. The electronic component clamping device applied to an SMT mounter according to claim 1, characterized in that The convex column structure is provided with a chamfer structure at the opening of the positioning hole.

Images