A flux coating device

Abstract

The present invention provides a flux coating device, comprising: a squeegee, at least one glue box, a squeegee drive mechanism, and at least one glue injection mechanism; the squeegee box is located above the squeegee, the squeegee box is in contact with the squeegee, a glue storage cavity is provided within the squeegee box, a squeegee opening is defined on the bottom surface of the squeegee, the squeegee opening is connected to the squeegee cavity, the squeegee box has at least one glue groove defined on the top surface, and the squeegee drive mechanism is connected to the squeegee; the squeegee box is configured to store flux through the glue storage cavity; the squeegee drive mechanism is configured to drive the squeegee to move relative to the squeegee box so that flux in the squeegee box enters the glue groove through the squeegee opening and forms a glue film within the glue groove driven by the squeegee; and the glue injection mechanism is configured to add flux to the glue storage cavity. The present invention automatically adds flux to the squeegee box, reducing labor costs and improving chip packaging efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device packaging, and in particular to a flux coating device. Background Art

[0002] With the continuous development of modern information technology, integrated circuit chips are increasingly moving towards high density and high performance. To meet the packaging requirements of integrated circuit chips, advanced packaging technologies such as 2.5D and 3D packaging have emerged.

[0003] Prior art advanced packaging techniques often require applying flux to one side of the chip to be packaged, followed by a die bonder or flip-chip machine to secure the chip to a substrate. This flux application process requires the use of a glue box and a squeegee. The glue box supplies flux into the squeegee's groove, allowing the squeegee to move relative to the glue box, depositing a uniform film of adhesive onto the chip. However, adding flux to the glue box often requires stopping the entire machine and manually injecting new flux into the box, which reduces chip packaging efficiency. Summary of the Invention

[0004] To solve the above problems, the present invention provides a flux coating device, which realizes the operation of automatically adding flux into the glue box by setting a glue injection mechanism, thereby reducing labor costs and improving chip packaging efficiency.

[0005] The present invention provides a soldering flux coating device, comprising: a scraper plate, at least one glue box, a scraper drive mechanism and at least one glue injection mechanism;

[0006] The glue box is located above the scraper, the glue box is in contact with the scraper, a glue storage cavity is provided in the glue box, a scraper opening is provided on the bottom surface of the glue box, the scraper opening is communicated with the glue storage cavity, at least one glue groove is provided on the upper surface of the scraper, and the scraper drive mechanism is connected to the scraper;

[0007] The glue box is used to store soldering flux through the glue storage cavity;

[0008] The scraper drive mechanism is used to drive the scraper plate to move relative to the glue box, so that the soldering flux in the glue box enters the glue groove through the scraper opening and forms a glue film in the glue groove under the drive of the scraper plate;

[0009] The glue injection mechanism is used to add soldering flux into the glue storage cavity.

[0010] Optionally, the glue injection mechanism includes: a glue injection syringe, a piston and a power assist member;

[0011] The injection syringe is filled with soldering flux, the piston is located in the injection syringe, and the booster is connected to the piston;

[0012] The power-assisting member is used to push the piston so that the piston pushes the soldering flux in the glue injection syringe to the glue storage cavity.

[0013] Optionally, the flux coating device further comprises: a workbench;

[0014] A slide is provided below the scraper plate. The slide is slidably connected to the workbench. The scraper plate is detachably fixedly connected to the slide.

[0015] Optionally, the scraper plate is plugged into the slide seat via a positioning pin;

[0016] The sliding seat is magnetically connected to the scraper.

[0017] Optionally, a support base is fixedly provided on the workbench;

[0018] The plastic box is detachably fixedly connected to the support seat.

[0019] Optionally, the plastic box is located above the support seat, and the plastic box is plugged into the support seat via a positioning pin;

[0020] The support seat is magnetically connected to the plastic box.

[0021] Optionally, the glue injection mechanism further includes: a support frame;

[0022] The support frame is slidably connected to the workbench along a first direction, and the slide is slidably connected to the workbench along a second direction, and the first direction intersects with the second direction;

[0023] The support frame is used to support the glue injection syringe.

[0024] Optionally, the glue injection mechanism further includes: a positioning member;

[0025] The positioning member is fixedly connected to the workbench, and the positioning member is used to fix the support frame when the injection syringe moves to the injection station;

[0026] The glue injection station is the position where the glue injection syringe adds flux into the glue storage cavity.

[0027] Optionally, a limiting member is fixedly provided on the workbench;

[0028] The limiting member is located on a side of the support frame away from the plastic box;

[0029] The limiting member is used to limit the sliding range of the support frame along the first direction.

[0030] Optionally, when there are multiple glue grooves, the multiple glue grooves are arranged along the second direction;

[0031] In the case that there are multiple plastic boxes, the multiple plastic boxes are arranged along the second direction.

[0032] Optionally, the flux coating device further comprises: a leveling mechanism;

[0033] The scraper is located above the workbench;

[0034] The leveling mechanism is used to adjust the inclination of the scraper plate relative to the horizontal plane.

[0035] Optionally, the workbench includes: a bottom plate and a base;

[0036] The bottom plate is located above the base, and is provided with a tightening hoop hole and a tightening hoop groove. Both the tightening hoop hole and the tightening hoop groove pass through the upper surface and the lower surface of the bottom plate, one end of the tightening hoop groove is communicated with the tightening hoop hole, and the other end of the tightening hoop groove is communicated with the outer side surface of the bottom plate;

[0037] The leveling mechanism includes: an adjusting screw, a hollow nut and a locking screw;

[0038] The top end of the adjusting screw is in conflict with the top end of the hollow nut, the bottom end of the adjusting screw passes through the hollow nut and is threadedly connected to the base, the hollow nut is threadedly connected to the base plate through the tightening hole, one end of the locking screw passes through the tightening groove horizontally from the side of the base plate, one end of the locking screw passing through the tightening groove is threadedly connected to the base plate, and the other end of the locking screw is in conflict with the base plate.

[0039] Optionally, a boss is provided on a side of the bottom plate facing the base, and the upper surface of the base is in conflict with the boss.

[0040] Optionally, the glue injection syringe is located directly above the glue box.

[0041] Optionally, the flux coating device further comprises: a glue quantity monitor;

[0042] The monitoring end of the glue quantity monitor faces the glue storage cavity;

[0043] The glue quantity monitor is used to monitor the remaining amount of soldering flux in the glue box, and trigger the glue injection mechanism to add soldering flux into the glue storage cavity when the remaining amount is less than a threshold value.

[0044] Optionally, the glue groove includes multiple bottom surfaces, and the distances between the multiple bottom surfaces and the upper surface of the scraper plate are different.

[0045] A flux coating device provided by an embodiment of the present invention realizes the operation of automatically adding flux into a glue box by setting a glue injection mechanism. In this way, there is no need to pause chip packaging and manually add flux into the glue box, thereby reducing labor costs and improving chip packaging efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 and Figure 2 Each of them is a three-dimensional diagram of a flux coating device according to an embodiment of the present application;

[0047] Figure 3 This is a front view of a flux coating device according to an embodiment of the present application;

[0048] Figure 4 A top view of a squeegee according to an embodiment of the present application;

[0049] Figure 5 A partial cross-sectional view of a flux coating device according to an embodiment of the present application;

[0050] Figure 6 A bottom view of a base plate according to an embodiment of the present application;

[0051] Figure 7 This is a three-dimensional diagram of a hollow nut according to an embodiment of the present application.

[0052] Reference numerals

[0053] 1. Workbench; 11. Bottom plate; 111. Tightening hole; 112. Tightening groove; 12. Base; 13. Working inclined surface; 2. Glue scraper; 21. Glue groove; 3. Glue box; 31. Glue storage chamber; 4. Glue scraper drive mechanism; 5. Glue injection mechanism; 51. Support frame; 52. Glue injection syringe; 53. Power assist member; 54. Positioning member; 6. Leveling mechanism; 61. Adjusting screw; 611. Screw; 612. Nut; 62. Hollow nut; 63. Locking screw; 64. Gasket; 71. Slide; 72. Support seat; 73. Limiting member; 74. Fixing screw; 75. Boss; 8. Glue quantity monitor. DETAILED DESCRIPTION

[0054] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0055] It should be noted that, in the present invention, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0056] This embodiment provides a flux coating device, see Figure 1 and Figure 2 The flux coating device includes: a workbench 1, a scraper 2, at least one glue box 3, a scraper drive mechanism 4 and at least one glue injection mechanism 5.

[0057] Combine Figure 3 The squeegee 2, at least one glue box 3, a squeegee drive mechanism 4, and at least one glue injection mechanism 5 are all arranged above the workbench 1. The number of the glue slots 21 is not less than the number of the glue boxes 3. The glue box 3 is located above the squeegee 2 and is in contact with the squeegee 2. A glue storage cavity 31 is provided in the glue box 3. A squeegee opening is provided on the bottom surface of the glue box 3, and the squeegee opening is connected to the glue storage cavity 31. The squeegee 2 has at least one glue slot 21 on its upper surface. The squeegee drive mechanism 4 is connected to the squeegee 2. The glue box 3 is used to store solder flux in the glue storage cavity 31. The squeegee drive mechanism 4 is used to drive the squeegee 2 to move relative to the glue box 3, so that the solder flux in the glue box 3 enters the glue slot 21 through the squeegee opening and forms a glue film in the glue slot 21 driven by the squeegee 2. The glue injection mechanism 5 is used to add solder flux to the glue storage cavity 31.

[0058] A slide 71 is provided below the scraper plate 2, and the slide 71 is slidably connected to the workbench 1 along the second direction through the corresponding slide rail. The scraper plate 2 is detachably fixedly connected to the slide 71, and support seats 72 are provided on opposite sides of the slide 71 along the second direction. The support seats 72 are fixedly connected to the workbench 1 through screws. The glue box 3 is located above the support seat 72, and the glue box 3 is detachably fixedly connected to the support seat 72. The glue injection mechanism 5 is slidably connected to the workbench 1 along the first direction through the corresponding slide rail.

[0059] In this embodiment, the first direction is the front-to-back direction, and the second direction is the left-to-right direction; the number of the glue box 3, the glue injection mechanism 5, and the glue groove 21 is two; each glue box 3 is installed by two support seats 72 respectively located on both sides of the slide 71; the two glue injection mechanisms 5 are slidably connected to the workbench 1 along the front-to-back direction on the rear side of the slide 71. The glue box 3 and the support seat 72 can be detachably fixedly connected by screws or magnets, and the scraper plate 2 and the slide 71 can also be detachably fixedly connected by screws or magnets. In this embodiment, the glue box 3 and the support seat 72, as well as the scraper plate 2 and the slide 71, are all detachably fixedly connected by magnets; the glue box 3 and the support seat 72, as well as the scraper plate 2 and the slide 71 are all positioned and installed accordingly by positioning pins.

[0060] Specifically, the support seat 72 and the slide 71 are both embedded with magnets, and the magnets can be permanent magnets or soft magnets. In the present embodiment, the magnets are permanent magnets. In the positioning and installation of the slide 71 and the scraper 2, a vertically placed first positioning pin is fixedly provided on the upper surface of the slide 71, and a first positioning hole is provided on the lower surface of the scraper 2. The first positioning pin is adapted to the first positioning hole, and the first positioning pin is plugged into the slide 71 through the first positioning hole, thereby realizing the positioning and installation of the slide 71 and the scraper 2 along the up and down directions. In the present embodiment, three vertically placed first positioning pins are fixedly provided on the upper surface of the slide 71 along the left and right directions, and the slide 71 is installed with the scraper 2 through the three first positioning pins. Among them, the positions of the first positioning pin and the first positioning hole can be interchanged, and this embodiment does not limit this.

[0061] In the positioning and installation of the plastic box 3 and the support seat 72, a vertically placed second positioning pin is fixedly provided at the front and rear ends of the plastic box 3 respectively, and a second positioning hole is opened on the upper surface of the support seat 72. The second positioning pin is plugged into the slide seat 71 through the second positioning hole, thereby realizing the positioning and installation of the plastic box 3 and the support seat 72 in the up and down directions.

[0062] In this embodiment, the use of magnets to fix the glue box 3 and the scraper 2 can facilitate the loading and disassembly of the glue box 3 and the scraper 2. By positioning and installing the glue box 3 and the scraper 2 in the up and down directions, the glue box 3 and the scraper 2 can be quickly and stably installed under the action of the corresponding magnets.

[0063] Combine Figure 4, each glue groove 21 includes multiple bottom surfaces, and the distances between the multiple bottom surfaces and the upper surface of the scraper 2 are different. By setting each glue groove 21 on the scraper 2 to have multiple depths, glue films of different thicknesses can be formed in the glue groove 21, so that there is no need to replace the scraper 2 when dipping the bumps of different heights on the chip, which expands the application range of the flux coating device and reduces the use cost of the scraper 2. In this embodiment, each glue groove 21 includes four bottom surfaces of different heights and the same size. The depth of the glue groove 21 on the scraper 2 can be made according to the height of the chip bumps, and this embodiment does not make specific limitations. Among them, the depth tolerance of the glue groove 21 is within ±2μm, the roughness of the upper surface of the scraper 2 is above level 13, and the hardness of the scraper 2 is greater than 54HRC.

[0064] Combine Figures 1 to 3 , the glue injection mechanism 5 includes: a support frame 51, a glue injection syringe 52, a piston and a power-assisting member 53. The glue injection syringe 52 is filled with flux, the piston is located in the glue injection syringe 52 and is slidably connected to the glue injection syringe 52, and the power-assisting member 53 is fixedly connected to the piston; the power-assisting member 53 is used to push the piston so that the piston pushes the flux in the glue injection syringe 52 to move the opening of the glue injection syringe 52 into the glue storage cavity 31. Among them, the support frame 51 is slidably connected to the workbench 1 along the front and back directions; the glue injection syringe 52 and the power-assisting member 53 are both fixedly connected to the support frame 51. The power-assisting member 53 can be a cylinder or an electric push rod, etc.

[0065] In this embodiment, a glue injection opening is opened on the upper surface of the glue box 3, and the opening of the glue injection syringe 52 faces the glue injection opening; the power assist member 53 is a cylinder, the movable rod of the cylinder is vertically downward and fixedly connected to the piston, and the outer shell of the cylinder is fixedly connected to the support frame 51.

[0066] The assisting member 53 pushes the piston, causing the glue injection mechanism 5 to add flux to the glue storage chamber 31. The timing can be determined by monitoring the remaining amount of flux in the glue storage chamber 31 or by setting a time interval. In this embodiment, the flux coating device determines the timing of adding flux to the glue storage chamber 31 by monitoring the remaining amount of flux in the glue storage chamber 31.

[0067] Specifically, the flux coating device also includes: a glue quantity monitor 8. The monitoring end of the glue quantity monitor 8 faces the glue storage cavity 31. The glue quantity monitor 8 is used to monitor the remaining amount of flux in the glue box 3, and trigger the glue injection mechanism 5 to add flux to the glue storage cavity 31 when the remaining amount is less than a threshold value. The glue quantity monitor 8 can be a camera or a sensor, etc. In this embodiment, the glue quantity monitor 8 is a glue quantity monitoring sensor. The glue quantity monitoring sensor monitors the position of the upper surface of the flux in the glue storage cavity 31 through the glue injection opening, thereby determining whether the remaining amount of flux is less than the threshold value. This embodiment does not make a specific limitation on the threshold value. By setting the glue quantity monitor 8, the automation of the flux coating device can be further improved, so that the flux coating device does not need human division of labor to monitor the remaining glue amount in the glue box 3, thereby ensuring that the flux coating device can work continuously.

[0068] Furthermore, the glue injection mechanism 5 also includes a positioning member 54. The positioning member 54 is fixedly connected to the workbench 1 and is used to secure the support frame 51 when the glue injection syringe 52 moves to the glue injection station. The glue injection station is where the glue injection syringe 52 adds solder flux to the glue storage chamber 31. In this embodiment, the glue injection syringe 52 is located directly above the glue box 3 when it moves to the glue injection station.

[0069] The positioning member 54 can be a screw, a positioning pin or an elbow clamp, etc. In this embodiment, the positioning member 54 is an elbow clamp. The elbow clamp seat is fixedly connected to the workbench 1 and is located on the right side of the support frame 51. By turning the elbow clamp wrench, the elbow clamp push rod can be made to contact the rear side of the support frame 51, and the front side of the support frame 51 can be made to contact the corresponding support seat 72, thereby achieving the fixation of the support frame 51. At this time, the glue injection syringe 52 is located at the glue injection station. When it is necessary to move the glue injection syringe 52 out of the glue injection station, it is only necessary to turn the elbow clamp wrench in the opposite direction to separate the elbow clamp push rod from the support frame 51, and at the same time adjust the position of the elbow clamp push rod so that the elbow clamp push rod moves to the right side of the support frame 51, so that the support frame 51 can move backward along the corresponding slide rail, so that the glue injection syringe 52 moves out of the glue injection station. This embodiment does not limit the structure of the elbow clamp. By arranging the glue injection mechanism 5 to be able to slide relative to the workbench 1, space can be provided for loading and unloading the glue box 3 and the scraper 2, thereby further improving the loading and unloading efficiency of the glue box 3 and the scraper 2.

[0070] Furthermore, a limiting member 73 is fixedly provided on the workbench 1. The limiting member 73 is located on the side of the support frame 51 away from the glue box 3; the limiting member 73 is used to limit the range of sliding of the support frame 51 along the first direction. In this embodiment, the limiting member 73 is a stopper, and the limiting member 73 is located directly behind the support frame 51 and is fixedly connected to the workbench 1. This embodiment does not make specific limitations on the limiting member 73. When the support frame 51 conflicts with the limiting member 73, the glue injection syringe 52 has been completely removed from the glue injection station. By providing the limiting member 73, the support frame 51 can be prevented from detaching from the workbench 1.

[0071] Furthermore, the flux coating device further comprises a leveling mechanism 6. The leveling mechanism 6 is connected to the workbench 1. The leveling mechanism 6 is used to adjust the inclination of the squeegee 2 relative to the horizontal plane.

[0072] Combine Figure 5 and Figure 6 The leveling mechanism 6 includes an adjusting screw 61, a hollow nut 62, and a locking screw 63. The adjusting screw 61 includes a screw rod 611 and a nut 612. The workbench 1 includes a bottom plate 11 and a base 12.

[0073] The bottom plate 11 is located above the base 12. The bottom plate 11 is provided with a tightening hole 111 and a tightening groove 112. The tightening hole 111 and the tightening groove 112 both pass through the upper surface and the lower surface of the bottom plate 11. One end of the tightening groove 112 passes through the tightening hole 111 horizontally. The other end of the tightening groove 112 communicates with the outer side surface of the bottom plate 11 to form a tightening opening.

[0074] Combine Figures 5 to 7 One end of the screw rod 611 is fixedly connected to the nut 612, and the other end of the screw rod 611 is threadedly connected to the base 12 through the through hole inside the hollow nut 62; the nut 612 is located above the hollow nut 62 and conflicts with the top of the hollow nut 62. The side of the hollow nut 62 is provided with an external thread (not shown in the figure), and the base plate 11 is provided with an internal thread that matches the external thread of the hollow nut 62 at the position of the tightening hole 111. The hollow nut 62 is threadedly connected to the base plate 11 through the tightening hole 111. In this embodiment, the side of the hollow nut 62 includes: a connecting portion and a driving surface. The external thread of the hollow nut 62 is provided at the connecting portion, and the driving surface is provided with a flat surface. A gasket 64 is provided above the hollow nut 62, and the nut 612 conflicts with the hollow nut 62 through the gasket 64.

[0075] The locking screw 63 is located on the side of the clamp hole 111 facing the clamp opening. One end of the locking screw 63 passes through the clamp groove 112 horizontally from the front side of the base plate 11 and is threadedly connected to the base plate 11; the other end of the locking screw 63 contacts the base plate 11.

[0076] In the process of adjusting the inclination of the scraper 2 relative to the horizontal plane, the hollow nut 62 is rotated by the driving surface, so that the hollow nut 62 moves upward or downward relative to the base plate 11, thereby causing the adjusting screw 61 to move upward or downward relative to the base plate 11, and then causing the base plate 11 to tilt downward or upward relative to the base 12 at the position of the tightening screw hole, thereby achieving the adjustment of the inclination of the scraper 2 relative to the horizontal plane, and then achieving the parallelism of the glue groove 21 and the patch head used to drive the chip to dip the glue, thereby ensuring the success rate of dipping the glue.

[0077] A boss 75 is provided on the side of the bottom plate 11 facing the base 12. The upper surface of the base 12 abuts against the boss 75. In this embodiment, the boss 75 is fixedly connected to the bottom plate 11. The provision of the boss 75 allows for a gap to be left between the bottom plate 11 and the base 12, thereby facilitating adjustment of the inclination of the squeegee 2 relative to the horizontal plane.

[0078] Furthermore, the workbench 1 is provided with a fixing screw 74. The fixing screw 74 vertically penetrates the base plate 11 and is threadedly connected to the base 12. The top of the fixing screw 74 contacts the base plate 11. In this embodiment, the fixing screw 74 also penetrates the boss 75. The provision of the fixing screw 74 ensures that the boss 75 is stably positioned between the base plate 11 and the base 12, preventing warping due to adjustment of the tightening screw.

[0079] In this embodiment, there are two leveling mechanisms 6. The two leveling mechanisms 6 are respectively located on the front and rear sides of the scraper 2, and the fixing screw 74 is located on the rear side of the scraper 2. In this way, a fixed point and two adjustment points are formed on the workbench 1. The positions of the one fixed point and the two adjustment points on the workbench 1 are distributed in a waist triangle, an equilateral triangle or a right triangle. The bottom plate 11 and the base 12 are provided with a working bevel 13, and the working bevel 13 forms a side surface for the bottom plate 11 and the base 12. The two adjustment points are located on the side of the fixed point facing the working bevel 13. In this embodiment, the positions of the one fixed point and the two adjustment points on the workbench 1 are distributed in a waist triangle; the working bevel 13 is the side surface of the left front side of the workbench 1. This makes the workbench 1 occupy a smaller area, making it easier for the operator to adjust the devices on the workbench 1.

[0080] In addition, the scraper drive mechanism 4 can be driven by either a linear drive or a crank drive. In this embodiment, the scraper drive mechanism 4 is driven by a linear drive, and the scraper activation mechanism is a screw drive mechanism. This embodiment does not limit the specific structure of the screw drive mechanism. The screw drive mechanism is fixedly mounted on the workbench 1, and the screw nut of the screw drive mechanism is fixedly connected to the slide 71. In this embodiment, the scraper plate 2 is moved back and forth in a left and right direction via the scraper drive mechanism 4.

[0081] In this embodiment, the flux coating device provides a dipping station for the chip to be dipped in glue, and the dipping station is located between the two glue boxes 3. The specific scraping process is as follows:

[0082] After the chip and the film in the glue groove 21 on the right are dipped in glue, the glue scraping drive mechanism 4 drives the glue scraper 2 to move to the right, and the glue groove 21 on the left passes under the glue box 3 on the left, and moves the glue film to the glue dipping station under the scraper brush at the bottom of the glue box 3 on the left; at this time, the glue box 3 on the right injects the solder flux into the glue groove 21 on the right and the glue scraping drive mechanism 4 continues to drive the glue scraper 2 to move to the right; when the glue box 3 on the left moves the glue film to the glue dipping station, the glue scraper 2 stops moving to the right At this time, the glue groove 21 on the right moves to the right side of the right glue box 3, and the chip head drives the new chip to continue dipping in glue at the dipping station; after the new chip is dipped in glue, the scraper drive mechanism 4 drives the scraper plate 2 to move left, and the glue groove 21 on the right passes under the right glue box 3. Under the scraper at the bottom of the right glue box 3, the glue film is moved to the dipping station; this cycle repeats, and the two glue grooves 21 alternately provide corresponding glue films for the chip to be dipped in glue at the dipping station. Combined with the large-lead screw drive structure, the flux coating device can quickly complete the chip dipping process.

[0083] In an optional embodiment, the flux coating device provides two dipping stations for the chip to be dipped in glue, and the two dipping stations are located on the right or left side of the corresponding glue box 3. Taking the two dipping stations located on the right side of the corresponding glue box 3 as an example, the specific scraping process is as follows:

[0084] When both glue grooves 21 are located directly below the corresponding glue box 3, the flux flows into the glue groove 21 from the bottom of the glue box 3; after the glue groove 21 is filled with flux, the scraper drive mechanism 4 drives the scraper plate 2 to move to the right, and the glue film formed under the two scraping brushes at the bottom of the glue box 3 on the left is moved to the corresponding dipping station for dipping; after dipping, the scraper drive mechanism 4 drives the scraper plate 2 to move to the left, so that the glue groove 21 moves to the bottom of the corresponding glue box 3, and the flux is reloaded. In this way, the two glue grooves 21 can provide glue films for dipping at the same time.

[0085] Optionally, before driving the scraper drive mechanism 4 to drive the scraper plate 2 to move rightward, the scraper drive mechanism 4 drives the scraper plate 2 to move leftward, so that the glue groove 21 moves to the left side of the corresponding glue box 3.

[0086] In an optional embodiment, there is one glue box 3 and two glue slots 21. The flux coating device provides two glue dipping stations for the chip to be dipped in glue, and the two glue dipping stations are located on the left and right sides of the glue box 3. The left glue slot 21 passes the glue film toward the chip through the left glue dipping station; the right glue slot 21 passes the glue film toward the chip through the right glue dipping station. The specific glue scraping process is as follows:

[0087] When the glue groove 21 on the right moves to the glue dipping station on the right to provide glue film for the corresponding chip for glue dipping, the glue groove 21 on the left is located just below the glue box 3, and the flux flows into the glue groove 21 on the left through the glue scraping opening; after the glue groove 21 on the right completes the glue dipping, the glue scraping drive mechanism 4 drives the glue scraper 2 to move to the left. At this time, the flux in the glue groove 21 on the left forms a glue film under the scraping brush of the glue box 3 and moves to the glue dipping station on the left; when the glue groove 21 on the left moves to the left When the glue dipping station is in the right side, the glue groove 21 is located just below the glue box 3, and the flux flows into the glue groove 21 on the left side through the glue scraping opening; after the glue groove 21 on the left side is dipped in glue, the glue scraping drive mechanism 4 drives the glue scraper 2 to move to the right. At this time, the flux in the glue groove 21 on the right side forms a glue film under the scraping brush of the glue box 3 and moves to the glue dipping station on the right side; this cycle is repeated, and the two glue grooves 21 can alternately provide corresponding glue films for the chip to be dipped in glue at two different glue dipping stations.

[0088] Optionally, after the right glue slot 21 is completely dipped in glue, and before the "glue drive mechanism 4 drives the squeegee 2 to the left" operation is executed, the glue drive mechanism 4 continues to drive the squeegee 2 to the right, so that the left glue slot 21 moves to the right side of the glue box 3. Similarly, after the left glue slot 21 is completely dipped in glue, and before the "glue drive mechanism 4 drives the squeegee 2 to the right" operation is executed, the glue drive mechanism 4 continues to drive the squeegee 2 to the left, so that the right glue slot 21 moves to the left side of the glue box 3. This allows the flux in the glue slot 21 to pass through the glue box 3 multiple times, thereby ensuring a uniform glue film.

[0089] In an optional embodiment, the flux coating device further includes a control module. The control module is electrically connected to the glue injection mechanism 5 and the glue quantity monitor 8. In this optional embodiment, the control module is electrically connected to a booster 53 in the glue injection mechanism 5. When the control module detects, via the glue quantity monitor 8, that the remaining amount of flux in the glue cartridge 3 is less than a threshold, the booster 53 is triggered to push the piston downward, thereby adding flux to the glue storage chamber 31.

[0090] In an alternative embodiment, this alternative embodiment differs from the previous alternative embodiment in that the glue quantity monitor 8 is replaced with a timing module. The timing module is configured to send a glue injection signal to the control module after a specified time interval. Upon receiving the glue injection signal, the control module controls the glue injection mechanism 5 to add solder flux to the glue storage chamber 31.

[0091] The flux coating device has a simple structure and high space utilization. By setting up the glue injection mechanism 5, the operation of automatically adding flux into the glue box 3 is realized. In this way, there is no need to suspend the chip packaging and manually add flux into the glue box 3, thereby reducing labor costs and improving the efficiency of chip packaging.

[0092] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A flux coating device, characterized in that: include: A workbench, a leveling mechanism, a scraper, at least one glue box, a scraper drive mechanism and at least one glue injection mechanism; A slide is provided below the scraper plate, the slide is slidably connected to the workbench, and the scraper plate is detachably fixedly connected to the slide; support seats are provided on opposite sides of the slide along the second direction, the support seats are fixedly arranged on the workbench, and the glue box is detachably fixedly connected to the support seat; the glue box is located above the scraper plate, the glue box is in contact with the scraper plate, and a glue storage cavity is provided in the glue box, a scraper opening is provided on the bottom surface of the glue box, and the scraper opening is communicated with the glue storage cavity, at least one glue groove is provided on the upper surface of the scraper plate, and the scraper drive mechanism is connected to the scraper plate; The glue box is used to store soldering flux through the glue storage cavity; The scraper drive mechanism is used to drive the scraper plate to move relative to the glue box, so that the soldering flux in the glue box enters the glue groove through the scraper opening and forms a glue film in the glue groove under the drive of the scraper plate; The glue injection mechanism is used to add soldering flux into the glue storage cavity; The scraper is located above the workbench; the leveling mechanism is used to adjust the inclination of the scraper relative to the horizontal plane; The workbench comprises: a bottom plate and a base; the bottom plate is located above the base, and is provided with a tightening hoop hole and a tightening hoop groove, wherein both the tightening hoop hole and the tightening hoop groove pass through the upper surface and the lower surface of the bottom plate, one end of the tightening hoop groove is communicated with the tightening hoop hole, and the other end of the tightening hoop groove is communicated with the outer side surface of the bottom plate to form a tightening hoop opening; The leveling mechanism comprises: an adjusting screw, a hollow nut and a locking screw; The top end of the adjusting screw is in conflict with the top end of the hollow nut, the bottom end of the adjusting screw passes through the hollow nut and is threadedly connected to the base, and the hollow nut is threadedly connected to the base plate through the tightening hole. One end of the locking screw passes through the tightening groove horizontally from the side of the base plate, and the locking screw is located on the side of the tightening hole facing the tightening opening. One end of the locking screw passes through the tightening groove and is threadedly connected to the base plate, and the other end of the locking screw is in conflict with the base plate.

2. The flux coating device according to claim 1, characterized in that: The glue injection mechanism includes: a glue injection syringe, a piston and a power assist member; The injection syringe is filled with soldering flux, the piston is located in the injection syringe, and the booster is connected to the piston; The power-assisting member is used to push the piston so that the piston pushes the soldering flux in the glue injection syringe to the glue storage cavity.

3. The flux coating device according to claim 2, characterized in that: The scraper plate is plugged into the slide seat via a positioning pin; The sliding seat is magnetically connected to the scraper.

4. The flux coating device according to claim 2, characterized in that: The plastic box is located above the support seat, and the plastic box is plugged into the support seat through a positioning pin; The support seat is magnetically connected to the plastic box.

5. The flux coating device according to claim 2, characterized in that: The glue injection mechanism further includes: a support frame; The support frame is slidably connected to the workbench along a first direction, and the slide is slidably connected to the workbench along a second direction, and the first direction intersects with the second direction; The support frame is used to support the glue injection syringe.

6. The flux coating device according to claim 5, characterized in that: The glue injection mechanism further includes: a positioning member; The positioning member is fixedly connected to the workbench, and the positioning member is used to fix the support frame when the injection syringe moves to the injection station; The glue injection station is the position where the glue injection syringe adds flux into the glue storage cavity.

7. The flux coating device according to claim 5, characterized in that: When there are multiple glue grooves, the multiple glue grooves are arranged along the second direction; In the case that there are multiple plastic boxes, the multiple plastic boxes are arranged along the second direction.

8. The flux coating device according to claim 2, characterized in that: The glue injection syringe is located above the glue box.

9. The flux coating device according to claim 1, wherein: The soldering flux coating device further comprises: a glue quantity monitor; The monitoring end of the glue quantity monitor faces the glue storage cavity; The glue quantity monitor is used to monitor the remaining amount of soldering flux in the glue box, and trigger the glue injection mechanism to add soldering flux into the glue storage cavity when the remaining amount is less than a threshold value.

10. The flux coating device according to claim 1, wherein: The glue groove comprises a plurality of bottom surfaces, and the distances between the plurality of bottom surfaces and the upper surface of the scraper plate are different from each other.

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