A test fixture for components to be tested

Abstract

The present application discloses a test fixture for components to be tested, comprising an upper cover and a lower cover, wherein a groove is provided between the upper cover and the lower cover in the middle for accommodating the components to be tested, and a spring structure is provided on the upper cover at a position corresponding to the components to be tested, wherein the spring structure is made of a conductive material and extends from the periphery of the upper cover toward the center of the upper cover so that when the upper cover and the lower cover are closed, the spring structure can contact the components to be tested in the groove. By adopting the above structure, when the components to be tested are tested, except for the part where the spring structure contacts the components to be tested, the remaining parts are not subjected to pressure. The spring structure reduces the torque applied to the components to be tested, while achieving electrical connection, making the fixture a non-destructive test fixture, greatly reducing the breakage rate of components to be tested during testing.

Description

Technical Field

[0001] The present invention relates to the field of testing devices, and in particular to a testing fixture for components to be tested. Background Art

[0002] Existing testing of components, especially semiconductor components and circuit board structures, typically uses a probe fixture to ensure good contact. This involves contacting the probe with the pads of the component under test to form a test circuit. Since semiconductor components are precision devices and are very sensitive to stress, using a probe to directly press the component pads can easily generate torque, causing deformation and damage to the component under test. This renders the semiconductor components unusable after testing, resulting in a very high scrap rate. Summary of the Invention

[0003] In order to solve the problems existing in the above-mentioned prior art, the purpose of the present application is to provide a non-destructive testing device that does not damage the components to be tested.

[0004] The present invention provides a test fixture for components to be tested, comprising an upper cover and a lower cover, wherein a groove for accommodating the component to be tested is provided between the upper cover and the lower cover, and a spring structure is provided on the upper cover at a position corresponding to the component to be tested, wherein the spring structure is made of a conductive material and extends from the periphery of the upper cover toward the center of the upper cover so that when the upper cover and the lower cover are closed, the spring structure can contact the component to be tested in the groove.

[0005] In a preferred embodiment, the spring structure includes a spring and a gasket, wherein an end point of the spring is at a height difference from a plane on which the gasket lies, and the end of the spring contacts the component under test. When the end of the spring contacts the component under test, the spring automatically rebounds within the height difference to adjust the force applied to the component under test, thereby avoiding excessive torque on the component under test.

[0006] Preferably, the spring piece and the gasket are not on the same plane. This type of spring piece structure is in an oblique pressure manner with the component to be tested, which produces less pressure on the component to be tested, has a simple structure, and is easy to process.

[0007] Preferably, the spring and the gasket are on the same plane, and the end of the spring is provided with a bent portion. This type of spring structure is in direct pressure with the pad, and has better contact with the component to be tested.

[0008] In a preferred embodiment, a pressing structure is provided on the upper cover at a position corresponding to the spring sheet to adjust the contact distance between the spring sheet and the component under test, thereby ensuring that the spring sheet and the component under test always maintain contact during testing.

[0009] In a preferred embodiment, the lower or upper cover is provided with a through pinhole at a position corresponding to the spring structure. When a probe is inserted into the pinhole, the probe is electrically connected to the spring structure or the component under test. Once the probe is inserted through the pinhole and contacts the spring or component under test, electrical conduction is achieved, thereby reducing contact pressure on the component under test.

[0010] Preferably, the spring structure contacts the component under test symmetrically. The probe is inserted through the pinhole and presses against the spring structure, so that both sides of the component under test are electrically connected to the probe through the spring structure. The probe does not directly contact the component under test, but contacts the component under test through the spring structure, thereby reducing the contact pressure on the component under test.

[0011] Preferably, one side of the component under test contacts the spring structure, and then a probe is inserted through the pinhole on the lower cover corresponding to the spring structure to establish an electrical connection. The other side of the component under test is then directly connected to the probe by inserting the probe through the pinhole on the upper cover. When only one side of the component under test directly contacts the probe, no torsional force or deformation is generated, while fully utilizing the probe's excellent contact properties.

[0012] In a preferred embodiment, the two horizontal outer end faces of the lower or upper cover are respectively embedded in a circuit board. The circuit board is provided with connection holes that connect to the pin holes. When the upper and lower covers are closed, a probe is inserted through the pin hole and presses against the gasket, electrically connecting the component under test to the circuit board and the probe via the spring structure. This integrates the circuit board and the fixture, allowing for testing the performance of assembled components.

[0013] In a preferred embodiment, the test fixture is externally connected to the circuit board using surface-etched pads or the spring clips using a rigid-flex board. This allows for the circuit board and fixture to be separated. By adding etched pads or external connections, external connection wires can be added when component assembly testing is required.

[0014] The present invention discloses a test fixture for components to be tested, comprising an upper cover and a lower cover, wherein a groove for accommodating the component to be tested is provided between the upper cover and the lower cover, and a spring structure is provided on the upper cover at a position corresponding to the component to be tested, wherein the spring structure is made of a conductive material and extends from the periphery of the upper cover toward the center of the upper cover so that when the upper cover and the lower cover are closed, the spring structure can contact the component to be tested in the groove. By adopting the above structure, when the component to be tested is tested, except for the part where the spring structure contacts the component to be tested, the remaining parts are not subjected to pressure. The spring structure reduces the torque applied to the component to be tested, while achieving electrical connection, making the fixture a non-destructive test fixture, greatly reducing the breakage rate of the component to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Including attachment Figure 1-4 , to provide a further understanding of the embodiments and the accompanying drawings are incorporated into and constitute a part of this specification. The accompanying drawings illustrate the embodiments and, together with the description, serve to explain the working principles of the invention. Other embodiments and many of the expected advantages of the embodiments will be readily apparent as they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale with respect to each other. Like reference numerals designate corresponding similar parts.

[0016] Figure 1 1 is a schematic structural diagram of a test fixture for a component under test according to an embodiment of the present invention (non-conducting state);

[0017] Figure 2 1 is a schematic structural diagram of a test fixture for a component under test according to an embodiment of the present invention (in a conducting state);

[0018] Figure 3 Schematic diagram of the oblique pressure spring structure according to an embodiment of the present invention;

[0019] Figure 4 is a schematic diagram of a direct-pressure spring structure according to an embodiment of the present invention; DETAILED DESCRIPTION

[0020] To make the objectives, technical solutions, and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings. It is apparent that the embodiments described are only some, not all, of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are intended to fall within the scope of protection of the present invention.

[0021] The present invention will be described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, only portions relevant to the present invention are shown in the accompanying drawings.

[0022] It should be noted that, unless there is any conflict, the embodiments in this application and the technical features in the embodiments can be combined with each other.

[0023] like Figure 1 and Figure 2 As shown, the present invention provides a test fixture for components to be tested, comprising an upper cover 1 and a lower cover 2, wherein a groove 3 for accommodating a component to be tested 4 is provided between the upper cover 1 and the lower cover 2, and a spring structure 5 is provided on the upper cover 1 at a position corresponding to the component to be tested 4, wherein the spring structure 5 is made of a conductive material and extends from the periphery of the upper cover 1 toward the center of the upper cover 1 so that when the upper cover 1 and the lower cover 2 are closed, the spring structure 5 can contact the component to be tested 4 in the groove 3.

[0024] With the above structure, the component to be tested 4 is placed in the groove 3 between the upper cover and the lower cover. When the upper cover 1 and the lower cover 2 are closed, the spring structure 5 contacts and electrically connects with the component to be tested. Only the contact part of the component to be tested 4 is subjected to a small pressure, and the rest of the component is not subjected to pressure, and no torsional force or deformation will be generated, thereby enabling non-destructive testing.

[0025] This type of test fixture is suitable for components that are sensitive to stress and easily deformed, especially optical filter components. In the present invention, if the component to be tested is an optical filter component, the fixture cover 1 needs to have a corresponding light hole 11 at the position corresponding to the light hole in the optical filter component to be tested; at the same time, the spring structure 5 is in contact with and electrically connected to the soldering pad of the optical filter component to be tested.

[0026] This type of fixture is also suitable for batch testing. For example, if the test fixtures are arranged in an array as test units, and the control device completes the process of closing the upper cover on the lower cover and performing unified testing, it can greatly improve the testing efficiency of the product.

[0027] In a specific embodiment, Figure 3-4 As shown, the spring structure 5 includes a spring 51 and a gasket 52. The end of the spring 51 has a height difference with the plane on which the gasket 52 lies, and the end of the spring 51 contacts the component under test 4. When the end of the spring 51 contacts the component under test 4, it can automatically rebound within the height difference range to adjust the force applied to the component under test 4, thereby avoiding excessive torque on the component under test.

[0028] The spring piece 51 is elastic and can be a thin metal sheet, or a single or double metal needle with a smaller diameter. It can rebound within the height difference range and ensure good contact.

[0029] The gasket is provided with a fixing hole 53, and the spring structure 5 is fixed to the upper cover 1 by screws. Correspondingly, the lower cover 2 is provided with an avoidance hole 6 at the position corresponding to the fixing hole 53 to avoid interference of the screws when the upper and lower covers are closed.

[0030] In a specific embodiment, Figure 3 As shown, the spring 51 and the gasket 52 are not on the same plane. This type of spring structure is in an oblique pressure manner between the component to be tested, which produces less pressure on the component to be tested, has a simple structure and is easy to process.

[0031] In a specific embodiment, Figure 4 As shown, the spring piece 51 and the gasket 52 are on the same plane, and the end of the spring piece 51 is provided with a bent portion 510. This type of spring piece structure is in direct pressure with the component under test, and has better contact with the component under test.

[0032] In a specific embodiment, Figure 2 As shown, a pressing structure 7 is provided on the upper cover at a position corresponding to the spring piece to adjust the contact distance between the spring piece 51 and the component under test 4. When the upper cover 1 and the lower cover 2 are closed, if it is found that the component under test 4 is not in contact, the pressing structure 7 provided on the upper cover 1 can be adjusted to press downward to make contact between the spring piece 51 and the component under test 4, ensuring that the spring piece 51 and the component under test 4 always maintain contact during testing.

[0033] The pressing structure 7 can be a structure that can adjust the vertical distance by using screws or pressure blocks, compression springs, etc. In the case of a single test, it is more convenient to adjust with screws; if it is a batch test, it is more appropriate to use pressure blocks or compression springs.

[0034] In a specific embodiment, Figure 1-2 As shown, the lower cover 2 or upper cover 1 is provided with a through pin hole 8 at a position corresponding to the spring structure 5. When a probe 9 is inserted into the pin hole 8, it is electrically connected to the spring structure 5 or the component under test 4. Through the contact between the probe 9 and the spring structure 5 or the component under test 4, the component under test 4 is electrically connected to the external test instrument.

[0035] In a specific embodiment, Figure 1As shown, the spring structure 5 makes symmetrical contact with the component under test 4. The probe 9 is inserted through the pin hole 8 and presses against the spring structure 5, so that both sides of the component under test 4 are electrically connected to the probe 9 through the spring structure 5. In this configuration, the probe 9 does not directly contact the component under test 4, but is electrically connected to the component under test 4 through the spring structure 5, minimizing pressure on the component under test.

[0036] In this case, there are two options for testing the circuit.

[0037] One is that the probe 9 is inserted from the pin hole of the lower cover 2 to press the spring structure 5 on both sides of the component to be tested 4, and the other is that the probe 9 is inserted from the pin hole of the upper cover 1 to press the spring structure 5 on both sides of the component to be tested 4. The implementation effects of the two schemes are the same, and the specific settings are based on the application environment during the actual test.

[0038] In a specific embodiment, one side of the component under test 4 contacts the spring structure 5, and then a probe 9 is inserted from the pin hole 8 on the lower cover 2 corresponding to the spring structure 5 to make an electrical connection; the other side of the component under test 4 is directly contacted and electrically connected by inserting the probe 9 from the pin hole 8 on the upper cover 1.

[0039] Given that the probe has good contact but high pressure, while the spring has low pressure but poor contact, torsional deformation will occur on both sides of the component to be tested only when the probes are used at the same time. Therefore, using the spring structure to contact one side of the component to be tested 4 and the probe to directly contact the other side can ensure that there is no deformation and good contact performance.

[0040] In a specific embodiment, the circuit board and the fixture can be integrated. A circuit board 10 is embedded in the two horizontal outer end surfaces of the lower cover 2 or upper cover 1. The circuit board 10 is provided with a connection hole that connects to the pin hole 8. When the upper and lower covers 1 and 2 are closed, the probe 9 is inserted through the pin hole 8 and presses against the gasket 52, electrically connecting the component 4 to be tested to the circuit board 10 and the probe 9 through the spring structure 5. This integration of the circuit board and fixture allows for testing the performance of assembled components.

[0041] In a specific embodiment, the circuit board and the fixture can also be separated. The test fixture is connected to the circuit board externally via surface-etched pads or the spring clip using a rigid-flex board. This configuration allows for both individual testing of components under test and for testing the performance of assembled components via the external circuit board.

[0042] The above-mentioned specific embodiment discloses a test fixture for components under test, comprising an upper cover and a lower cover, wherein a recess is provided between the upper and lower covers to accommodate the component under test. A spring structure is provided on the upper cover at a position corresponding to the component under test. The spring structure is made of a conductive material and extends from the periphery of the upper cover toward the center of the upper cover, so that when the upper and lower covers are closed, the spring structure can contact the component under test in the recess. By adopting the above-mentioned structure, when the component under test is tested, except for the part where the spring structure contacts the component under test, the remaining parts are not subjected to pressure. The spring structure reduces the torque applied to the component under test while achieving electrical connection, making the fixture a non-destructive test fixture, greatly reducing the breakage rate of the component under test.

[0043] Although the principles of the present invention have been described in detail above with reference to specific embodiments, those skilled in the art should understand that the above embodiments are merely illustrative of implementations of the present invention and are not intended to limit the scope of the present invention. The details in the embodiments do not constitute limitations on the scope of the present invention. Without departing from the spirit and scope of the present invention, any obvious changes based on the technical solution of the present invention, such as equivalent transformations and simple substitutions, fall within the scope of protection of the present invention.

Claims

1. A test fixture for components to be tested, characterized in that: The tester comprises an upper cover and a lower cover, wherein a groove for accommodating a component to be tested is provided between the upper cover and the lower cover, and a spring structure is provided on the upper cover at a position corresponding to the component to be tested. The spring structure is made of a conductive material and extends from the periphery of the upper cover toward the center of the upper cover so that when the upper cover and the lower cover are closed, the spring structure can contact the component to be tested in the groove; the spring structure comprises a spring and a gasket, wherein the end point of the spring has a height difference with the plane where the gasket is located, and the end of the spring contacts the component to be tested.

2. A test fixture for components to be tested according to claim 1, characterized in that: The spring piece and the gasket are not on the same plane.

3. The test fixture for components to be tested according to claim 1, characterized in that: The spring piece and the gasket are on the same plane, and a bending portion is provided at the end of the spring piece.

4. A test fixture for components to be tested according to claim 2 or 3, characterized in that: A pressing structure is provided on the upper cover at a position corresponding to the spring sheet to adjust the contact distance between the spring sheet and the component to be tested.

5. A test fixture for components to be tested according to claim 4, characterized in that: A through pin hole is provided at a position of the lower cover or the upper cover corresponding to the spring structure. When a probe is inserted into the pin hole, the probe is electrically connected to the spring structure.

6. A test fixture for components to be tested according to claim 5, characterized in that: The spring structure contacts the component to be tested symmetrically on the left and right sides, and the probe is inserted from the pin hole to press the spring structure, so that both sides of the component to be tested are electrically connected to the probe through the spring structure.

7. The test fixture for components to be tested according to claim 5, characterized in that: One side of the component to be tested contacts the spring structure, and then a probe is inserted from the pin hole on the lower cover corresponding to the spring structure to make an electrical connection; the other side of the component to be tested is directly contacted and electrically connected by inserting a probe from the pin hole on the upper cover.

8. The test fixture for components to be tested according to claim 6, characterized in that: The two outer end surfaces of the lower cover in the horizontal direction are respectively embedded in the circuit board, and the circuit board is provided with a connection hole connected to the pin hole. When the upper cover and the lower cover are closed, the probe is inserted from the pin hole to press the gasket, so that the component to be tested is electrically connected to the circuit board and the probe through the spring structure.

9. The test fixture for components to be tested according to claim 6, characterized in that: The test fixture is connected to the outside of the circuit board using a rigid-flex board via surface-etched pads or the spring clip.

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