Multi-layer PCB stack-up for color mixing

Abstract

The present invention provides a lighting device (1000), the lighting device (1000) comprising a multi-layer PCB stack (100), the multi-layer PCB stack (100) comprising n stacked layers (110), wherein n≥2, wherein k layers (110) of the n stacked layers (110) each comprise a PCB (200) having a solid-state light source (10), wherein 2≤k≤n, wherein the solid-state light source (10) is configured to generate light source light (11), wherein the layers (110) are shaped and stacked such that the light source light (11) of the solid-state light source (10) of any one of the PCBs (200) is at least partially not physically blocked by any one of the other PCBs (200).

Description

Technical Field

[0001] The invention relates to a lighting device, a luminaire comprising such a lighting device, and a lighting system comprising such a lighting device. The invention also relates to a method of providing such a lighting device. Background Art

[0002] RGB stacked light emitting diode modules are known in the art. A paper titled “RGB-Stack Light Emitting Diode Modules with Transparent Glass Circuit Board and Oil Encapsulation” by Ying-Chang Li et al. (Materials 2018, vol. 11, 65 (2018 Materials (Basel). Mar 1; 11 (3). pii: E365. doi: 10.3390 / mal 1030365)) states that “Light emitting diodes (LEDs) are widely used in modern solid-state lighting applications, and their output efficiency is closely related to the material properties of the substrate. Most of the substrates currently used (such as low-power printed circuit boards (PCBs) or high-power metal core printed circuit boards (MCPCBs)) are not transparent and will seriously reduce the output light extraction. In order to meet the requirements of high light output and better color mixing, a three-dimensional (3-D) stacked flip chip (FC) LED module is proposed and demonstrated. In order to achieve light penetration and mixing, the above-mentioned 3-D vertically stacked RGB LED uses transparent glass as FC package substrate, which is called glass circuit board (GCB). The light emitted from each GCB stacked LED passes through each other and thus has good output efficiency and uniform light mixing characteristics.

[0003] US2010 / 0164346A1 discloses a light emitting device, which includes a thermally conductive substrate, at least one LED mounted in thermal communication with a surface of the substrate, and a housing attached to the substrate, the housing being configured such that the housing and the substrate together define a volume that completely surrounds the at least one LED. The housing includes at least a portion as a light-transmitting window, and at least one phosphor material disposed on an inner surface of the housing, the phosphor material being operable to absorb at least a portion of the excitation light emitted by the at least one light emitting diode and emit light in a second wavelength range. Summary of the invention

[0004] A spotlight may consist of a circuit system PCB board, wherein the available space on the board may be occupied by driver electronics, light emitting diodes (LEDs) and wiring tracks for closing the circuit and applying electrical power. The LED is placed in the center of the PCB board to have a light emitting surface (LES) that is as small as possible. The LES determines the size of the optical compound required to shape the beam of the spotlight. According to electronic and thermal rules, these components, LEDs and wiring may have a certain distance from each other, for example to prevent discharge or overheating of components and LEDs. This may mean that part of the available space in the LES cannot be used for lighting elements. Only in a simple light architecture does the wiring allow a layout that is packed tightly together. When a multi-color architecture with, for example, red, green, blue and white LEDs is composed, the associated wiring becomes much more complicated and may take up a lot of available space to connect all the different colors individually. It may be inevitable that wiring may have to be placed between adjacent LEDs, which may significantly expand the LED-to-LED distance and the LES of the entire architecture. As a result, the light spread may be undesirably increased. In particular, when smaller-sized LEDs can be used, the ratio of the effective luminous area to the total occupied area will increase. In the case of micro-LEDs, with typical dimensions of length x width = 200 μm x 100 μm, the width of the wiring may be roughly the same as the size of the micro-LED, or may even exceed the width dimension of the micro-LED. In this case, the wiring may take up more space than the LED itself would otherwise require, and thus a significant benefit of using, for example, micro-LEDs may be lost.

[0005] Therefore, one aspect of the present invention is to provide an alternative lighting device, which preferably further at least partially obviates one or more of the above disadvantages.An object of the present invention may be to overcome or ameliorate at least one disadvantage of the prior art, or to provide a useful alternative.

[0006] In an embodiment, the present invention particularly provides a method in which individual PCB boards (each board containing a part of the total lamp architecture) are stacked on top of each other, and the combined boards can have the total intended architecture of a spotlight. In the traditional method, the PCB can consist of multiple layers of PCB, where the wiring for connecting and addressing individual LEDs appears on multiple layers. This may require a large number of vias to electrically connect all the layers. Extensive wiring may consume a large amount of space for dissipating the heat generated by the LEDs. However, using the proposed method, in a particular embodiment, only a single color or a simple addressable combination of colors can be placed on a discrete PCB. The PCB can particularly consist of a single layer having a top surface and a bottom surface. In an embodiment, on a second or more PCB boards, other LEDs, parts of the total lamp architecture can be mounted. In an embodiment, by stacking different PCB boards on top of each other to combine them, the total lamp architecture becomes available. In an embodiment, the alignment of different PCBs can be done by pins and / or alignment marks, etc., and / or in combination with vias that connect the wiring and the PCB stacks to each other. Since in a particular embodiment, the LEDs can be placed at different levels, there is an opportunity in an embodiment to partially cover the LEDs with phosphor. In an embodiment, this can be done by a phosphor foil and / or in an embodiment by depositing phosphor on the deepest layer in the stack (in a further specific embodiment).

[0007] Thus, in one aspect, the present invention provides a lighting device comprising a multi-layer PCB stack including n stacked layers, where n > 2. Each of a plurality of layers (i.e., k of the n stacked layers) can include a PCB, the PCB particularly having solid-state light sources, particularly, a plurality of solid-state light sources (for each PCB). Particularly, 2 < k < n. Further, particularly, the (said) solid-state light sources are configured to generate source light. In a particular embodiment, the layers are shaped and stacked such that the source light of one of the PCBs is at least partially not physically blocked by one or more other PCBs. Thus, the present invention particularly provides a lighting device comprising a multi-layer PCB stack including n stacked layers, where n > 2, where k of the n stacked layers each include a PCB having solid-state light sources, particularly, a plurality of solid-state light sources (for each PCB), where 2 < k < n, where the solid-state light sources are configured to generate source light, where the layers are shaped and stacked such that: by applying a smaller PCB in a layer (110) on a layer (110) including a solid-state light source (10), the source light of the source of any one of the PCBs is at least partially not physically blocked by any one of the other PCBs.

[0008] Such a lighting device may allow for relatively simple production. Furthermore, with such a lighting device, a high density of light sources may be used on each PCB, since the wiring (on each PCB) may be simple. Thus, the LES may be reduced relative to known or alternative solutions, and / or the production and / or construction may be relatively simple. For example, there is no need to use transparent materials that may complicate production and / or construction. Furthermore, the optical properties of the generated light, such as one or more of the color point, color temperature, color rendering index, etc., may be controlled.

[0009] As described above, the present invention provides a lighting device comprising a multilayer PCB stack having n stacked layers. Thus, in an embodiment, two or more layers may be stacked. In a more specific embodiment, for example, two or more PCBs may be stacked. However, the stack may also include non-PCB layers.

[0010] When a layer comprises a PCB, the layer may comprise a single PCB. The layer may also comprise a plurality of PCBs, in particular, all in the same plane (i.e. not stacked in the layer). Such a plurality of PCBs (in particular, all in the same plane) may be functionally coupled. The invention is particularly illustrated by a plurality of PCBs in different layers, such as a stack of PCBs.

[0011] Two or more of the n layers may (each) comprise a PCB. Thus, k of the n stacked layers may each comprise a PCB. Thus, the lighting device comprises at least two PCBs in different layers. Each PCB comprises a solid-state light source, in particular a plurality of solid-state light sources. Since two or more of the n layers may comprise a PCB, in particular, 2 <k<n。

[0012] Below, some embodiments related to PCBs are described. Different layers may include different embodiments of PCBs. Basic PCB aspects may be associated with each PCB in the stack.

[0013] In an embodiment, the PCB may include an insulating layer arranged between the substrate and the conductive layer. As known in the art, a printed circuit board can mechanically support and electrically connect electronic or electrical components, using conductive tracks, pads, and other features etched from one or more copper sheets laminated to metal sheets and / or between metal sheets of a non-conductive substrate (referred to as "tracks" or "conductive tracks"). (Electronic) components (such as solid-state stage light sources) can usually be soldered to the PCB to electrically connect and mechanically fix them to the PCB. For example, a basic PCB may include a flat plate of insulating material laminated to a substrate and a layer of copper foil. Chemical etching separates copper into individual conductors (called tracks or circuit traces or wiring or wiring tracks), pads for connection, vias for transferring connections between copper layers, and features such as solid conductive areas for EM shielding or other purposes. Tracks serve as wires fixed in place and are insulated from each other by air and board substrate materials. The surface of the PCB may have a coating that protects the copper from corrosion and reduces the possibility of solder shorts between traces or poor electrical contact with stray bare wires. Due to its function of helping to prevent solder shorts, this coating is called solder resist.

[0014] Therefore, the shape of the PCB can generally be plate-like. In particular, in an embodiment, the PCB can have a length and a width and a height, wherein the aspect ratio of the length and the height is at least 5, such as in the range of 5-5000, such as 10-2500, but larger (more than 5000) is also possible, and wherein the aspect ratio of the width and the height is at least 2, such as the aspect ratio is at least 5, such as in the range of 5-5000, such as 10-2500, but larger (more than 5000) is also possible. The terms "length", "width" and "height" can also refer to "maximum length", "maximum width" and "maximum height" respectively. The PCB can particularly have a rectangular cross section (e.g., a square cross section). The PCB can also have a circular shape. Therefore, in an embodiment, the PCB can have a diameter and a height, wherein the aspect ratio of the diameter and the height is at least 5, such as in the range of 5-5000, such as 10-2500, but larger (more than 5000) is also possible.

[0015] In an embodiment, the height (or thickness) of the PCB can be selected from the range of 0.2-10mm, such as 0.5-5mm, such as 1-2mm, but thinner or thicker is also possible. The height (or thickness) can even be lower than 1mm, or even lower than 0.1mm. In an embodiment, the width of the PCB can be selected from the range of 5-200mm, such as 5-50mm, but other sizes are also possible. In an embodiment, the length of a single printed circuit board area can be selected from the range of 10-50mm, such as 15-40mm, but other sizes are also possible. In an embodiment, the length of a PCB including multiple (connected) PCB areas can be selected from the range of 20-2000mm, such as 20-1500mm. In an embodiment, the diameter of a single printed circuit board area can be selected from the range of 10-50mm, such as 15-40mm, but other sizes are also possible. Therefore, other sizes besides the above are also possible.

[0016] The PCB may include one or more of CEM-1PCE, CEM-3PCE, FR-1PCE, FR-2PCB, FR-3PCB, FR-4PCB and aluminum metal core PCB, in particular, one or more of CEM-1PCB, CEM-3PCB, FR-1PCB and FR4 PCB and aluminum metal core PCB, more in particular, one or more of CEM-1PCB, CEM-3PCB, FR-1PCB.

[0017] In certain embodiments, the PCB may be flexible. For example, in embodiments, the lighting device may comprise a flexible PCB foil stack. However, in other embodiments, the PCB may be (substantially) rigid.

[0018] In a specific embodiment, the PCB may be double-sided, ie, electrical components may be arranged on both sides of the PCB.

[0019] As mentioned above, in particular, the PCB does not substantially transmit visible light. This may particularly indicate that the material of the PCB is not light-transmissive. Therefore, the light source light of the light source is also particularly not blocked by the light-transmissive PCB. Therefore, in particular, in an embodiment, the PCB does not include light-transmissive material. Therefore, the light source light that vertically illuminates the PCB will not penetrate the PCB (height). Note that the PCB holes can of course transmit visible light.

[0020] The PCB may include a functional component functionally coupled to the board. In a further embodiment, the functional component may include a solid-state light source. The term "functional component" may also refer to a plurality of (different) functional components. In a further embodiment, the functional component may include an electronic component (or "electrical component"), in particular, an electronic component selected from a solid-state light source, a driver, an electronic module and a sensor. In particular, the electronic component may include a solid-state light source.

[0021] The term "light source" may refer to a semiconductor light emitting device, such as a light emitting diode (LED), a resonant cavity light emitting diode (RCLED), a vertical cavity laser diode (VCSEL), an edge emitting laser, etc. The term "light source" may also refer to an organic light emitting diode, such as a passive matrix (PMOLED) or an active matrix (AMOLED). In a particular embodiment, the light source comprises a solid-state light source (e.g., an LED or a laser diode). In one embodiment, the light source comprises an LED (light emitting diode). The term LED may also refer to a plurality of LEDs. The term "light source" may also refer to a plurality of (substantially the same (or different)) light sources, such as 2-2000 solid-state light sources.

[0022] In an embodiment, the phrase "different light sources" or "multiple different light sources" and similar phrases may refer to multiple solid-state light sources selected from at least two different bins. Similarly, the phrase "same light source" or "multiple same light sources" and similar phrases may refer to multiple solid-state light sources selected from the same bin in an embodiment.

[0023] Each PCB may include or be functionally coupled to at least a single solid-state light source. The phrase "a PCB including a solid-state light source" and similar phrases may refer to embodiments in which the PCB includes a solid-state light source, or in which the solid-state light source is functionally coupled to the PCB. In both embodiments, the functional coupling may refer to the fact that the wiring included by the PCB can provide electrical power to the solid-state light source.

[0024] However, in general, each PCB may include or may be functionally coupled to a plurality of solid-state light sources, such as at least 2, such as at least 4, such as at least 8, such as at least 16, such as at least 32, such as at least 64. Note that the number of solid-state light sources may be independently selected for each of the (k) different layers of PCBs.

[0025] Thus, the phrase "a PCB having a solid-state light source" and similar phrases may refer to a PCB having one or more light sources, and in embodiments specifically refers to a PCB having a plurality of light sources.

[0026] Here, the term "light source" particularly refers to a solid-state light source, in particular, a small solid-state light source, for example having a micro or tiny size. For example, the light source may include one or more of a micro-LED (or "miniLED") and a tiny LED (or "microLED" or "pLED"). In particular, in an embodiment, the light source includes a micro-LED. In this document, the term micro-size or micro-LED particularly refers to a solid-state light source having a size (e.g. die size, in particular length and width) selected from a range equal to or less than about 1 mm, for example selected from the range of 100μm-1mm. In this document, the term micro (μ) size or tiny LED particularly refers to a solid-state light source having a size (e.g. die size, in particular length and width) selected from the range of 100μm and smaller. In addition, in an embodiment, the solid-state light source may include a LED having a maximum of 1mm 2 For example, in an embodiment, the solid-state light source includes a die area (A) of at most 0.04 mm 2 (e.g., 200 μm*200 μm), for example, a maximum of 0.01 mm 2 (e.g., 100 μm*100 μm) die.

[0027] In particular, the solid-state light source is configured to generate light source light. In a specific embodiment, the light source light generated by the light source is the primary light of the solid-state light source. Therefore, the term "light source light" may refer to light emitted (directly) from a die (e.g., an LED die). Electrons in a (semiconductor) solid-state light source may recombine with electron holes, thereby releasing energy in the form of photons. This effect is called electroluminescence. Therefore, the term "light source light" may particularly refer to electroluminescence from a solid-state light source; such light is also referred to herein as "primary light". In an embodiment, the primary light may be at least partially converted into secondary light by a luminescent material (see also below). When a solid-state light source is particularly applied, the light source light of the corresponding solid-state light source may be substantially monochromatic. The light sources in the same bin may have substantially the same peak wavelength (e.g., varying within 10 nm). In addition, the light sources in the same bin may have substantially the same dominant wavelength (e.g., having variations within 10 nm). Light sources from different bins may, for example, have different colors (see also below).

[0028] Since a simple stacking of identical PCBs with light sources may result in the light source of an upstream configuration being blocked by the light source of a downstream configuration, a solution may have to be found for this problem. Therefore, in the present invention, in particular, the layers are shaped and stacked such that the light source light of one of the PCBs is at least partially not physically blocked by one or more other PCBs.

[0029] The terms "upstream" and "downstream" relate to the arrangement of items or features related to the propagation of light from a light generating device (here in particular a light source), wherein, relative to a first position in a light beam from the light generating device, a second position in the light beam close to the light generating device is "upstream" and a third position in the light beam away from the light generating device is "downstream".

[0030] As described above, the light source may not be physically blocked by (multiple) downstream configured PCBs by applying a smaller (smaller) PCB in a layer on the layer including the solid-state light source (i.e., downstream of the layer including the solid-state light source) so that the PCB does not block or at least partially does not block the light source (light), and optionally applying a PCB including a PCB hole (in a layer on the layer including the solid-state light source) so that the PCB does not block or at least partially does not block the light source (light) (because the PCB hole is configured downstream of the light source). Therefore, in an embodiment, one or more layers configured downstream of the first light source include one or more PCBs having one or more PCB holes, wherein the one or more PCB holes are configured downstream of the first light source. Therefore, in an embodiment, one or more layers configured downstream of the first solid-state light source include one or more PCBs, and the size of the one or more PCBs in the longitudinal direction is smaller than the PCB including the first solid-state light source.

[0031] In a specific embodiment, the light source may not be physically blocked by the layer(s) configured downstream by applying a layer (smaller) than the layer comprising the solid-state light source, so that the layer does not block or at least partially does not block the light source (light), and optionally applying a layer comprising a layer hole, so that the layer does not block or at least partially does not block the light source (light) (because the layer hole is configured downstream of the light source). Therefore, in an embodiment, one or more layers configured downstream of the first light source include one or more layer holes, wherein the one or more layer holes are configured downstream of the first light source. However, in other specific embodiments, PCB holes may be applied, but also light-emitting layers may be applied; the former may not (substantially) block the light source light, while the latter may physically block the light and convert part of the light source light.

[0032] Thus, the term "block" and similar terms may in particular refer to the presence of solid material downstream of the light source. Such solid material is in particular not available in the form of a PCB (by providing, for example, PCB holes). Thus, such solid material is in particular also not available in the form of a light-transmitting PCB material. However, in particular embodiments, luminescent material, for example in the form of a (luminescent) layer may be available. Thus, in particular, the PCB may not (substantially) block the light source, while in particular embodiments, layers or layer parts that are not the PCB may block the light source when they comprise luminescent material or are light-transmissive for the light source.

[0033] Thus, the layers are shaped and stacked so that the light source light of the light source of any one of the PCBs is at least partially not physically blocked by any of the other PCBs. The phrase "the light source light of the light source of any one of the PCBs is at least partially not physically blocked by any of the other PCBs" and similar phrases may indicate in embodiments that the optical axis of the light source partially does not coincide with a PCB configured downstream.

[0034] Thus, a PCB stack may be provided in this way, the PCB stack may have one or more stepped distributions. Such a stepped distribution may be obtained by one or more of the following: (i) using layers of different sizes, e.g. PCBs of different sizes, typically smaller (layers or PCBs, respectively) arranged on larger (layers or PCBs, respectively), and (ii) using one or more layers with one or more layer holes, e.g. one or more PCBs with one or more PCB holes. In the latter embodiment(s), the layers (or respectively PCBs) may have substantially the same outer dimensions (in a plane parallel to the layers), although in other embodiments they may also be different (as both embodiments may also be combined).

[0035] In an embodiment, one or more layers may be substantially a PCB. In such an embodiment, the layer hole(s) may be substantially a PCB hole(s).

[0036] In an embodiment, the layers may be numbered L1-Ln, with n>2. Thus, when n=2, there is a first layer L1 and a second layer L2. When n=3, there is a first layer L1, a second layer L2, and a third layer L3; etc. Thus, in an embodiment, the PCBs may be shaped and stacked such that a higher numbered PCB does not physically block at least a portion of the light source light of the light source of the lower numbered PCB.

[0037] For the present lighting device, it is also possible to have driver electronics on a single layer (such as a single PCB). These driver electronics can drive all the light sources of the lighting device. Therefore, in an embodiment, the lighting device may also include driver electronics, wherein the driver electronics are configured to control one or more (in particular, all) solid-state light sources. A "driver" or "driver electronics" may in particular be a circuit or other electronic component for controlling another circuit or electrical component (e.g. a solid-state light source or other electrical component, such as a high-power transistor). They are typically used to regulate the current flowing through the circuit or to control other factors, such as other components in the circuit, certain devices. For example, the term is typically used for application-specific integrated circuits that control electrical components (such as solid-state light sources). In a particular embodiment, the driver electronics include or are physically coupled to one of the n stacked layers, in particular, one of the PCBs.

[0038] Therefore, in an embodiment, the lighting device may further include one or more vias for functionally coupling the light source and the driver electronics. In an embodiment, the vias may be used to electrically connect the wiring of adjacent PCBs. The term "wiring" refers in particular to electrical tracks, for example for powering (multiple) solid-state light sources and / or other electrical components. Note that one or more PCBs may also include other electrical components. In addition to the term "electrical component", the term "electronic component" may also be applied.

[0039] The electrical component may include an active or passive electrical component. An active electrical component may be any type of circuit component that has the ability to electrically control the flow of electrons (electrically control electricity). An example is a diode, in particular, a light emitting diode (LED). LEDs are also represented herein by the more general term solid-state lighting device or solid-state light source. Therefore, in an embodiment, the electronic component includes an active electronic component. In particular, the electronic component includes a solid-state light source (see also above). Other examples of active electronic components may include power supplies, such as batteries, piezoelectric devices, integrated circuits (ICs), and transistors. In other embodiments, the electronic component may include a passive electronic component. Components that cannot control current through another electrical signal are called passive devices. Resistors, capacitors, inductors, transformers, etc. can all be considered passive devices. In one embodiment, the electronic component may include an RFID (radio frequency identification) chip. The RFID chip may be passive or active. In particular, the electronic component may include one or more of a solid-state light source (e.g., LED), an RFID chip, and an IC. The term "electronic component" may also refer to multiple identical or multiple different electronic components.

[0040] The present invention is particularly useful when applying micro solid-state light sources, in particular, when applying multiple micro solid-state light sources. As described above, each PCB may include or may be functionally coupled to multiple solid-state light sources, such as at least 2, such as at least 4, such as at least 8, such as at least 16, such as at least 32, such as at least 64. Therefore, in an embodiment, each layer of the k layers includes multiple light sources.

[0041] Furthermore, the present invention may also be particularly useful when a plurality of different types of solid-state light sources are applied. The term "different types" may particularly refer to different bins. Thus, in an embodiment, there may be a plurality of light sources, typically a plurality of subsets of light sources, wherein the light sources of different subsets differ from each other in peak wavelength.

[0042] For example, the difference between the peak wavelengths of different subsets can be at least 20nm. For example, different subsets can provide light of different colors, such as blue, green, yellow, orange and red. In an embodiment, one or more subsets can also provide violet or cyan light. In addition, within these colors, there may be sub-ranges, such as deep red and far red. The term "violet light" or "violet light emission" particularly relates to light with a wavelength in the range of about 380-440nm. The term "blue light" or "blue light emission" particularly relates to light with a wavelength in the range of about 440-495nm (including some purple and cyan shades). The term "green light" or "green light emission" particularly relates to light with a wavelength in the range of about 495-570nm. The term "yellow light" or "yellow light emission" particularly relates to light with a wavelength in the range of about 570-590nm. The term "orange light" or "orange emission" particularly relates to light with a wavelength in the range of about 590-620nm. The terms "red light" or "red emission" particularly relate to light with a wavelength in the range of about 620-780 nm. Deep red can be defined as one or more wavelengths selected from the 640-700 nm spectral range, while far red can be defined as one or more wavelengths selected from the 700-800 nm spectral range. Therefore, deep red is a sub-selection of red. The light source is particularly configured to generate visible light, but in embodiments, (additional) UV and / or additional IR light may also be generated. The terms "visible light", "visible light" or "visible emission" and similar terms refer to light with one or more wavelengths in the range of about 380-780 nm. The term "white light" herein is known to those skilled in the art. It particularly relates to light having a correlated color temperature (CCT) between about 2000 and 20000K, in particular between 2700-20000K, for general lighting, in particular in the range of about 2700K to 6500K, in particular within about 15SDCM (standard deviation of color matching) from the BBL (black body locus), in particular within about 10SDCM from the BBL, in particular within about 5SDCM from the BBL.

[0043] Thus, in an embodiment, there may be a plurality of light sources, typically a plurality of subsets of light sources, wherein the light sources of different subsets differ from each other, in particular in peak wavelength. In an embodiment, at least two of the k layers (in particular, each layer) each comprise a subset of light sources of the respective plurality of light sources, wherein the light sources in each respective subset are selected from the same bin, and wherein the light sources of different subsets of different layers are selected from different bins.

[0044] Therefore, in an embodiment, PCBs of different layers can generate light sources with different peak wavelengths, such as RGB generated in three different layers. Note that it is not excluded here that a single layer may also include, for example, two different solid-state light sources. However, in general, each PCB includes a maximum of two different types of different solid-state light sources. In a more specific embodiment, one or more PCBs each include a solid-state light source of the same bin (but different PCBs include light sources of different bins). In particular, the maximum benefit of the present invention can be achieved when each PCB includes a maximum of two different types of solid-state light sources (i.e., in an embodiment, solid-state light sources of different bins). For example, the peak wavelengths between different subsets may differ by at least 10 nm, for example, at least 20 nm, for example, at least 25 nm.

[0045] As described above, (multiple) solid-state light sources generally only provide a dominant wavelength and do not include luminescent materials. However, one or more solid-state light sources may be used in combination with luminescent materials. Therefore, in an embodiment, the lighting device may further include a luminescent material configured downstream of one or more solid-state light sources in the total number of solid-state light sources, wherein the luminescent material is configured to convert at least a portion of the light source light of the solid-state light source configured upstream of the luminescent material into luminescent material light. The term "luminescent material" may also refer to a variety of different luminescent materials. In an embodiment, the same or different luminescent materials may also be applied at different locations within the lighting device.

[0046] The phrase "the luminescent material is configured to convert at least a portion of the light source light of a solid-state light source configured upstream of the luminescent material into luminescent material light" and similar phrases may indicate in embodiments that a luminescent material may be configured downstream of a single solid-state light source or in embodiments downstream of a subset of less than a total number of light sources or even downstream of all solid-state light sources in specific embodiments. Further, such phrases and similar phrases may indicate that a portion of the light source light may be converted, and therefore a portion of the light source light may not be converted. This may result in a combination of light source light and luminescent material light downstream of the luminescent material. In other embodiments, substantially all of the light source light may be converted (without considering possible losses due to, for example, conversion into heat energy). In particular, the luminescent material is provided in a layer, wherein (multiple) solid-state light sources are configured upstream thereof, and the luminescent material may be emitted (away) from the luminescent material on the downstream side of the luminescent material. In further specific embodiments, the luminescent material may be provided as a layer that is also transmissive to the solid-state light source light, thereby being partially transmitted and partially converted.

[0047] The luminescent material may be arranged in the hole (above one or more light sources upstream of the hole). The luminescent material may also be used as a layer (comprising the luminescent material). Thus, in an embodiment, one or more of the following apply: (i) the luminescent material comprises one or more downstream PCB holes (as defined herein) in the total number of solid-state light sources, and (ii) n>2, and one or more layers comprise the luminescent material. The luminescent material may be a layer, such as a (plate-like) ceramic layer or a polymer layer.

[0048] Thus, in certain embodiments, the lighting device is configured to generate lighting device light comprising one or more of: (i) light source light of one or more light sources, and (ii) luminescent material light as defined herein.

[0049] Thus, in an embodiment, the n layers comprise two or more PCBs (with solid-state light sources) and (optionally) one or more light-emitting layers, wherein the two or more PCBs and (optionally) one light-emitting layer are stacked. In a specific embodiment, the n layers substantially comprise two or more PCBs (with solid-state light sources) and optionally one or more light-emitting layers, wherein the two or more PCBs and optionally one light-emitting layer are stacked. In particular, k=n, or k=nl, or k=nl (in particular k is at least 2). In the following embodiments, for example, a stack of PCBs and one or two light-emitting layers may be referred to. In particular, k=n or k=nl (in particular, k is at least 2).

[0050] Basically, two types of embodiments are possible; embodiments in which the spectral characteristics of the lighting device light may not be tunable, and embodiments in which the spectral characteristics of the lighting device light are tunable. In the former embodiments, the lighting device light may be white, but colored light is not excluded. In the latter embodiments, the lighting device may be configured to provide different types of light in different control modes (see also below), e.g. white light in a first control mode and colored light in a second control mode. Alternatively or additionally, the color point and / or the color rendering index may be controlled in the (further) control modes.

[0051] In yet another aspect, the invention also provides a luminaire comprising a lighting device as defined herein. The luminaire may further comprise a housing, an optical element, a shutter or the like.

[0052] The lighting device can be part of or can be applied to the following: for example, office lighting systems, home application systems, store lighting systems, home lighting systems, accent lighting systems, spotlight systems, theater lighting systems, fiber optic application systems, projection systems, self-luminous display systems, pixelated display systems, segmented display systems, warning sign systems, medical lighting application systems, indicator sign systems, decorative lighting systems, portable systems, automotive applications, (outdoor) road lighting systems, urban lighting systems, greenhouse lighting systems, horticultural lighting, etc.

[0053] In an aspect, the invention provides a spotlight comprising a lighting device as defined herein.In particular, in such an embodiment, the one or more PCBs may be circular.

[0054] In yet another aspect, the present invention also provides a lighting system comprising (i) a lighting device as defined herein, and (ii) a control system, wherein the control system is configured to control the light of the lighting device, in particular, at least its spectral properties. Thus, in a particular embodiment, the control system can be configured to cause the lighting device to perform one or more of the following: (a) generate white lighting system light in a first control mode, and (b) generate colored system light in a second control mode.

[0055] Note that the white light described herein may be based on different colors, such as RGB or other additive color mixing possibilities.

[0056] Therefore, in yet another aspect, the present invention also provides a lighting system comprising (i) a lighting device as defined herein, and (ii) a control system configured to control driver electronic devices as defined herein, wherein the control system is configured to cause the lighting device to perform one or more of the following: (a) generate white lighting system light in a first control mode, and (b) generate colored system light in a second control mode.

[0057] The phrase "perform one or more of the following: (a) generate white lighting system light in a first control mode, and (b) generate colored system light in a second control mode" may mean that the lighting system may be configured to generate white light in embodiments, the lighting system may be configured to generate colored light in other embodiments, and may indicate that in embodiments the system may be configured to provide these two types of light in different control modes.

[0058] The term "control" and similar terms refer at least in particular to determining the operation of a behavior or supervising an element. Therefore, "control" and similar terms herein may, for example, refer to applying behavior (determining the operation of a behavior or supervising an element) to an element, such as measuring, displaying, actuating, opening, moving, changing temperature, etc. In addition, the term "control" and similar terms may also include monitoring. Therefore, the term "control" and similar terms may include applying behavior to an element and applying behavior to an element and monitoring the element. The control of an element may be accomplished by a control system, which may also be represented as a "controller". The control system and the element may therefore be functionally coupled at least temporarily or permanently. The element may include a control system. In an embodiment, the control system and the element may not be physically coupled. Control may be accomplished by wired and / or wireless control. The term "control system" may also refer to a plurality of different control systems, in particular, functionally coupled, and wherein, for example, one control system may be a master control system, and one or more other control systems may be slave control systems. The control system may include or may be functionally coupled to a user interface.

[0059] The control system may also be configured to receive and execute instructions from a remote control. In an embodiment, the control system may be controlled by an application on a device, for example a portable device such as a smartphone or an iPhone, a tablet computer, etc. Thus, the device does not have to be coupled to the lighting system, but may be (temporarily) functionally coupled to the lighting system.

[0060] Thus, in an embodiment, the control system may (also) be configured to be controlled by an application on a remote device. In such an embodiment, the control system of the lighting system may be a slave control system or a control in slave mode. For example, the lighting system may be identified with a code, in particular, a unique code for the respective lighting system. The control system of the lighting system may be configured to be controlled by an external control system, which may access the lighting system based on knowledge of the (unique) code (via a user interface input with an optical sensor, such as a QR code reader). The lighting system may also include means for communicating with other systems or devices, for example based on Bluetooth, Wi-Fi, ZigBee, BLE or WiMAX, or other wireless technologies.

[0061] A system, or an apparatus or device may perform actions in a "mode" or "operating mode" or "mode of operation". Likewise, in a method, actions or phases or steps may be performed in a "mode" or "operating mode" or "mode of operation". The term "mode" may also be expressed as a "control mode". This does not exclude that the system, or an apparatus, or device may also be adapted to provide another control mode or a plurality of other control modes. Likewise, this does not exclude that one or more other modes may be performed before and / or after the execution of a mode.

[0062] However, in an embodiment, a control system may be used, which is adapted to provide at least a control mode. If other modes are available, the selection of such a mode may in particular be performed via a user interface, although other options are also possible, such as performing a mode according to a sensor signal or a (time) scheme. In an embodiment, an operating mode may also refer to a system, or a device or an apparatus that can only be operated in a single operating mode (i.e., "on", without further adjustability).

[0063] Therefore, in an embodiment, the control system may be controlled according to one or more of an input signal of a user interface, a sensor signal (of a sensor) and a timer. The term "timer" may refer to a clock and / or a predetermined time scheme.

[0064] In an embodiment, the control system can control a subset of the light sources individually. In this way, one or more of the intensity, color point, color temperature, color rendering of the lighting device light can be controlled.

[0065] In an embodiment, different subsets may be configured to provide light source light with different spectral distributions. Thus, in an embodiment, two or more different subsets include light sources from two or more different bins, respectively. For example, in an embodiment, two or more different subsets include light sources configured to provide different types of colored light, for example selected from blue, cyan, green, yellow, orange and red (and optionally other colors). In this way, for example, the color point, color temperature, color rendering of the lighting device light can be controlled (using the control system controlling the subsets).

[0066] The lighting device may be provided by stacking layers, such as stacking PCBs. The layers may be provided with holes before stacking, or may be provided as layers with holes. Holes may also be effectively created by stacking smaller layers on larger layers, such as stacking smaller PCBs on larger PCBs.

[0067] In yet another aspect, the present invention also provides a method of providing a lighting device (in particular, a lighting device as defined herein), the method comprising stacking n layers, where n > 2, where k of the n stacked layers each comprise a PCB having a solid-state light source, where 2 < k < n, and where the solid-state light source is configured to generate source light. One or more of the following apply: (i) one or more of the k layers comprise one or more layer holes, and (ii) after stacking, during a hole creation phase, one or more layer holes are created in one or more of the k layers of the n stacked layers. Further, the following apply: (iii) the stacking of the n layers, and (iv) during the hole creation phase, the creation of optional layer holes in the layer holes causes the source light of the light source of any one of the PCBs to be at least partially unphysically blocked by any one of the other PCBs due to the alignment of the light source and the layer holes. A smaller PCB is applied on a layer (110) over the layer comprising the solid-state light source. In one aspect, the present invention also provides a lighting device that can be obtained according to the method described herein.

[0068] In yet another embodiment, PCBs without solid-state light sources can be stacked to provide a PCB stack, and then (thus after stacking) the solid-state light sources can be functionally coupled to the corresponding PCBs. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Embodiments of the present invention will now be described by way of example only with reference to the drawings, in which corresponding reference numerals denote corresponding parts, and in which:

[0070] FIGS. 1a-1b schematically depict some aspects of the present invention;

[0071] FIGS. 2a-2e schematically depict some (additional) aspects of the present invention;

[0072] Figure 3 A lighting system and other aspects are schematically depicted.

[0073] The schematic drawings are not necessarily drawn to scale. DETAILED DESCRIPTION

[0074] FIG. 1a schematically depicts in cross-section an embodiment of a lighting device 1000 that includes a multi-layer PCB stack 100 that includes n stacked layers 110, where n > 2. Here, for example, n = 3. Further, k of the n stacked layers 110 each comprise a PCB 200 having a solid-state light source 10, where 2 < k < n. Here, k is also 3. Note that k is not necessarily n, but k is in particular at least 2. Three layers 110 (or levels) are depicted, indicated by reference numerals L1, L2, and L3. The solid-state light source 10 is configured to generate source light 11.

[0075] The layers 110 are shaped and stacked such that light source light 11 of light source 10 of any one of the PCBs 200 is at least partially not physically blocked by any of the other PCBs 200. Thus, a pyramid-like structure is provided with solid state light sources at steps in embodiments.

[0076] As schematically shown, due to the alignment of the one or more layer apertures 120 in one or more higher numbered layers 100 and the solid state light sources 10 in the layers, the PCB 200 of the higher numbered layer 110 does not physically block at least a portion of the light source light 11 of the light source 10 of another PCB 200. Therefore, in an embodiment, the light source light 11 of the light source 10 of any one of the PCBs 200 is at least partially not physically blocked by any one of the other PCBs 200. In particular, in an embodiment, the layers 110 may be shaped and stacked such that the higher numbered layers 110 do not physically block at least a portion of the light source light 11 of the light source 10 of the lower numbered layers 110.

[0077] The stack 100 may have a height H. In particular, the first layer L1 may have a first face 101 and the nth layer n may provide a second face 102. The first face 101 and the second face may define the height H of the multilayer PCB stack 100. The light source 10 may be considered to include a PCB (and thus the layer 110).

[0078] As shown, one or more layers 110 arranged downstream of the first light source 10 include one or more layer holes 120, wherein the one or more layer holes 120 are arranged downstream of the first light source 10 (in the first layer 110 / L1, the light source is indicated by reference numeral 10', in the second layer 100 / L2, the light source is indicated by reference numeral 10", and the light source of the third layer 110 can be indicated by reference numeral 10'"; however, these light sources are not blocked by the layers and / or PCBs). In addition, as shown, one or more layers 110 arranged downstream of the first light source 10 include one or more PCBs 200 having one or more PCB holes 220, wherein the one or more PCB holes 220 are arranged downstream of the respective first light source 10. Here, in this schematically depicted embodiment, the layer holes 120 are (substantially) identical to the PCB holes 220. Therefore, for example, the optical axes from the light source 10 indicated by reference numeral 10' or the light source 10 indicated by reference numeral 10" are at least partially not physically "blocked" by one or more other PCBs. These axes do not coincide with the PCB parts because of the presence of the PCB holes 220 (or layer holes).

[0079] The lighting device 1000 may further comprise driver electronics 30. In an embodiment, the driver electronics 30 is specifically configured to control all solid state light sources 10. Here, an embodiment is schematically depicted, wherein the driver electronics 30 comprises or is physically coupled to one of the n stacked layers 110.

[0080] As schematically depicted, here, each of the k layers 110 includes a plurality of light sources 10 .

[0081] In a particular embodiment, at least two (more particularly each) of the k layers 110 each include a subset of light sources 10 of the respective plurality of light sources 10. The light sources 10 in each respective subset may be selected from the same bin. In particular, the light sources 10 of different subsets of different layers 110 may be selected from different bins.

[0082] Fig. 1a also effectively schematically depicts an embodiment of a lighting system 1200 including the lighting device 1000 and the control system 60. In an embodiment, the control system 60 may be configured to control the driver electronics 30. In particular, in an embodiment, the control system 60 may be configured to cause the lighting device 1000 to do one or more of: (a) generate white lighting system light 1201 in a first control mode, and (b) generate colored system light 1201 in a second control mode.

[0083] FIG. 1 b schematically depicts an embodiment of a lighting device 1000 in a top view. Three layers 110 (or levels) are depicted, indicated by reference numerals L1, L2 and L3. Each layer 110 comprises a PCB having a light source 10. The light sources 10 of different levels are shaded differently. The light sources of each layer are represented by the levels between brackets, i.e. 10″ represents the light source of the second layer 110 or L2 (PCB in the second layer 110). Note that in an embodiment, an (inverted) pyramid shape may be provided. The second layer 110 or L2 and the third layer 110 or L3 provide holes 120 (or 220) for the light sources 10 (10′) of the first layer 110 (L1) and the light sources 10 (10′) of the first layer 110 (L1) and the light sources 10 (10″) of the second layer 110 (L2), respectively. Note that the light sources 10 of different layers 110 may be configured to generate light source light with different spectral distributions. For example, the three layers may generate RGB. However, other embodiments are possible (see also below).

[0084] Fig. 1b also schematically depicts the top surface, ie the die, of the solid-state light source 10. The solid-state light source 10 may thus comprise a die area A of, for example, a maximum of 1 mm 2 The tube core 12.

[0085] Such a lighting device can be obtained, for example, by a method comprising stacking n layers 110, where n > 2, where k of the n stacked layers 110 each comprise a PCB 200 having a solid-state light source 10, where 2 < k < n, where the solid-state light source 10 is configured to generate source light 11, where: (I) one or more of the following apply: (i) one or more of the k layers 110 comprise one or more layer holes 120, and (ii) after stacking, during a hole creation phase, one or more layer holes 120 are created in one or more of the k layers of the n stacked layers 110; (II) the following apply: (a) the stacking of the n layers 110, and (b) during the hole creation phase, the creation of optional layer holes 120 in the layer holes 120 causes the source light 11 of the light source 10 of any one of the PCBs 200 to be at least partially unphysically blocked by any one of the other PCBs 200 due to the alignment of the light source 10 and the layer holes 120.

[0086] In a particular embodiment, at least two (more particularly each) of the k layers 110 each comprise a respective subset 210 of the light sources 10 of a corresponding plurality of light sources 10. The light sources 10 within each respective subset 210 can be selected from the same bin. In particular, the light sources 10 of different subsets 210 of different layers 110 can be selected from different bins and can, for example, provide different colors, such as selected from blue, green, yellow, orange, and red. Here, by way of example, each layer includes a single subset, denoted by subset 210', 210", and 210"', respectively. However, note that a layer 110 can also include more than one subset. Generally, a layer 110, more precisely a PCB 200, generally does not include more than two different subsets that provide source light 11 having more than two substantially different spectral distributions. Thus, generally a PCB can not include more than two (e.g., only one) types of light sources 10 (i.e., all from two or one bin). A control system (not shown) can individually control the different subsets.

[0087] Using the proposed method, in a (particular) embodiment, only a single color or a simple addressable combination of colors can be placed on a discrete PCB. On a second or more PCB boards, other LEDs, parts of the total lamp architecture, can be mounted. By stacking different PCB boards on top of each other to combine them, the total lamp architecture becomes available. In an embodiment, the alignment of different PCBs can be accomplished by a combination of pins or alignment marks and vias that connect the wiring and the PCB stacks to each other (see also below).

[0088] For example, the designations 10', 10", 10'" and the like in Figures 1a and 1b and other figures do not necessarily mean that these light sources belong to different subsets. This may be the case, but not necessarily. Furthermore, the designation 10', or the designation 10", or the designation 10'" does not imply that all light sources respectively designated by such a designation belong to the same subset. This may be the case, but not necessarily.

[0089] Different subsets may provide source light with (substantially) different color points (and in particular with (substantially) different spectral distributions), but in other embodiments different subsets may provide source light with (substantially) the same color point (and in particular with the same spectral distribution).

[0090] Figure 2a shows another example. Reference numeral 207 designates alignment pins. However, other alignment options may also be applied, including adhesives. Reference numeral 208 designates possible contacts for connection to, for example, driver electronics. Reference numeral 221 denotes a support (eg, substrate).

[0091] Since the LEDs are placed at different levels, there is an opportunity to partially cover the LEDs with phosphor. In embodiments, this can be done by phosphor foil or phosphor deposition, in particular, on the deepest layer in the stack. An example is shown in FIG2 b , where the third layer 110 or L3 substantially comprises a luminescent material comprising a layer.

[0092] Another method of applying phosphor is to deposit the phosphor in the holes created by the PCB stack, as schematically shown in Figure 2c.

[0093] 2b and 2c, the lighting device 1000 may therefore further include a luminescent material 50 configured downstream of one or more of the total number of solid-state light sources 10. The luminescent material 50 is particularly configured to convert at least a portion of the light source light 11 of the solid-state light source 10 configured upstream of the luminescent material 50 into luminescent material light 51. The luminescent material 50 may include a PCB hole 220 (downstream of one or more of the total number of solid-state light sources 10). FIG. 2b shows an embodiment in which n>2 and one of the layers 110 includes the luminescent material 50.

[0094] In particular, in this way, the lighting device 1000 may in embodiments be configured to generate lighting device light 1001 comprising one or more of the following: light source light 11 of one or more light sources 10 and luminescent material light 51 .

[0095] FIG. 2d schematically depicts a top view of the embodiment of FIG. 2a for example.

[0096] In addition to the fact that wiring in a multi-layer PCB inevitably requires a lot of space near the LED to connect individual LEDs, the proposed method of stacking a single PCB into a module can provide more space for placing LEDs with different colors in a small light-emitting surface. Dividing LEDs with different colors on multiple PCBs makes it possible to use a small light-emitting surface (LES). On each individual PCB, it may be possible to apply LEDs of one or two color types, which makes wiring simple, with no vias or a limited number of vias and provides a relatively large heat dissipation space on the PCB. Of course, when using micro-LEDs or a combination of standard LEDs and micro-LEDs, the architecture will benefit from this method. The use of different heights in the placement of the LEDs enables the application of phosphors to a subset of the total LEDs. The LEDs on the deeper layers of the PCB can be covered without affecting the LEDs on the top layer. In an embodiment, each PCB portion of the entire PCB stack can be handled as a single-layer PCB. This can allow pick-and-place equipment to work in a traditional manner. Solder or adhesive can also be applied using traditional screen printing techniques. After filling, the individual PCBs that now contain the entire lightweight architecture are stacked. The base PCB that can contain the LEDs and driver electronics is mounted on the heat sink of the spotlight using alignment pins. Each next layer of PCB is placed on top of the base PCB and the previously mounted PCB. The individual PCBs can be connected by wire bonding connections on connection pads or by any other technique, for example, using wire clips. Another way to connect the individual PCBs is to use vias as part of the electrical routing. Here, for example, solder ball preforms are placed during the stack assembly process and the PCB layers are connected by reflow soldering.

[0097] In yet another embodiment, PCBs without solid-state light sources may be stacked, and then the solid-state light sources may be functionally coupled to the corresponding PCBs.

[0098] FIG. 2 e schematically depicts an embodiment further comprising one or more vias 40 for functionally coupling the light source 10 and the driver electronics 30 .

[0099] Figure 3 An embodiment of a luminaire 1100 comprising the lighting device 1000 is schematically depicted. In addition, Figure 3An embodiment of a lighting system 1200 comprising a lighting device 1000 is also schematically depicted. The lighting system 1200 may further comprise a control system 60. The control system 30 may be configured to control the spectral distribution of a lighting device lamp 1001 (or a luminaire lamp 1101 or a lighting system lamp 1201, which may all be substantially the same; the lighting system lamp 1201 may be a lighting device lamp 1001). The lighting system 1200 may comprise a plurality of lighting devices 1000. Furthermore, the lighting system 1000 may comprise a user interface 65, wherein the user interface 65 is functionally connected or connectable to the control system 60. The connection may be wireless or wired.

[0100] The term "plurality" means two or more.

[0101] Those skilled in the art will understand the terms "substantially" or "substantially" and similar terms herein. The terms "substantially" or "substantially" may also include embodiments with "entirely", "completely", "all", etc. Therefore, in embodiments, the adjectives substantially or substantially may also be removed. Where applicable, the term "substantially" or the term "substantially" may also relate to 90% or higher, such as 95% or higher, in particular, 99% or higher, even more particularly, 99.5% or higher, including 100%.

[0102] The term "comprising" also includes embodiments wherein the term "comprising" means "consisting of.

[0103] The term "and / or" specifically refers to one or more items mentioned before and after "and / or". For example, the phrase "item 1 and / or item 2" and similar phrases may refer to one or more of item 1 and item 2. The term "comprising" may refer to "consisting of" in one embodiment, but may also refer to "comprising at least the defined substances and optionally one or more other substances" in another embodiment.

[0104] In addition, the terms first, second, third, etc. in the specification and claims are used to distinguish similar elements and not necessarily to describe a sequential or chronological order. It should be understood that the terms so used are interchangeable under appropriate circumstances, and that the embodiments of the invention described herein are capable of operating in other sequences than those described or illustrated herein.

[0105] The apparatus, device or system may be described herein during operation. It will be clear to those skilled in the art that the present invention is not limited to operating methods, or apparatus, device or system in operation.

[0106] Note that the above-mentioned embodiments illustrate rather than limit the invention, and that those skilled in the art will be able to design many alternative embodiments without departing from the scope of the appended claims.

[0107] In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim.

[0108] The use of the verb "comprise" and its conjugations does not exclude the presence of other elements or steps than those stated in a claim. Unless the context clearly requires otherwise, throughout the specification and claims, the words "comprise", "comprising", etc. should be interpreted in an inclusive sense rather than an exclusive or exhaustive sense; that is, in the sense of "including but not limited to".

[0109] The article "a" or "an" preceding an element does not exclude the presence of a plurality of such elements.

[0110] The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In a device claim or an apparatus claim or a system claim, several means are enumerated, several of these means may be embodied by one and the same item of hardware. The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

[0111] The present invention also provides a control system that can control a device, apparatus or system, or can perform a method or process described herein. In addition, the present invention also provides a computer program product that, when run on a computer functionally coupled to or including a device, apparatus or system, controls one or more controllable elements of such a device, apparatus or system.

[0112] The present invention also applies to a device, apparatus or system comprising one or more features described in the specification and / or shown in the drawings. The present invention also relates to a method or process comprising one or more features described in the specification and / or shown in the drawings.

[0113] The various aspects discussed in this patent may be combined to provide additional advantages. In addition, those skilled in the art will appreciate that embodiments may be combined, and more than two embodiments may be combined. In addition, certain features may form the basis for one or more divisional applications.

Claims

1. A lighting device (1000), comprising: A multi-layer PCB stack (100) comprising n stacked layers (110), wherein n>2, and wherein k layers (110) of the n stacked layers (110) each include a PCB (200) having a solid-state light source (10), wherein 2≤k<n, wherein the solid-state light source (10) is configured to generate light source light (11), wherein by applying a PCB having an outer dimension smaller than the dimension of the PCB (200) having the solid-state light source (10) in the layer (110) on the layer (110) including the solid-state light source (10), the layer (110) is shaped and stacked so that the light source light (11) of the solid-state light source (10) of any one of the PCBs (200) is at least partially not physically blocked by any one of the other PCBs (200), and wherein at least two of the k layers (110) each comprise a subset (210) of light sources (10) of a respective plurality of light sources (10), wherein the light sources (10) within each respective subset (210) are selected from the same bin, and wherein the light sources (10) in different subsets (210) of different layers (110) are selected from different bins.

2. The lighting device (1000) according to claim 1, wherein one or more layers (110) arranged downstream of the solid-state light source (10) comprise one or more layer holes (120), wherein the one or more layer holes (120) are arranged downstream of the solid-state light source (10).

3. The lighting device (1000) according to claim 1, wherein the one or more layers (110) arranged downstream of the solid-state light source (10) include one or more PCBs (200) having one or more PCB holes (220), wherein the one or more PCB holes (220) are arranged downstream of the solid-state light source (10).

4. The lighting device (1000) according to claim 3, further comprising driver electronics (30), wherein the driver electronics (30) is configured to control all solid state light sources (10).

5. The lighting device (1000) according to claim 4, wherein the driver electronics (30) is physically coupled to or comprised by one of the n stacked layers (110).

6. The lighting device (1000) according to claim 5, further comprising one or more vias (40) for functionally coupling the solid state light source (10) and the driver electronics (30).

7. The lighting device (1000) according to any one of claims 5 to 6, wherein the solid-state light source (10) comprises a light source having a maximum diameter of 1 mm 2 The die area (A) of the die (12).

8. The lighting device (1000) according to any one of claims 5 to 6, wherein each of the k layers (110) comprises a plurality of solid-state light sources (10).

9. The lighting device (1000) according to Claim 8, further comprising a luminescent material (50), wherein the luminescent material (50) is arranged downstream of one or more solid-state light sources among all the number of solid-state light sources (10), and wherein the luminescent material (50) is configured to: convert at least a portion of the light source light (11) of the solid-state light source (10) arranged upstream of the luminescent material (50) into luminescent material light (51).

10. The lighting device (1000) according to claim 9, wherein the luminescent material (50) is further comprised by the PCB hole (220), the PCB hole (220) being downstream of the one or more solid-state light sources among the total number of solid-state light sources (10).

11. The lighting device (1000) according to any one of claims 9 to 10, wherein the lighting device (1000) is configured to generate lighting device light (1001), the lighting device light (1001) comprising one or more of the following: (i) the source light (11) of one or more of the solid-state light sources (10); and (ii) the luminescent material emits light (51).

12. A luminaire (1100), comprising the lighting device (1000) according to any one of Claims 1 to 11.

13. A lighting system (1200), comprising: (i) The lighting device (1000) according to any one of the preceding claims 1 to 11, and (ii) a control system (60) configured to control the driver electronics (30) in the lighting device (1000) according to any one of the preceding claims 4 to 6, The control system (60) is configured to enable the lighting device (1000) to perform one or more of the following: (a) generating white lighting system light in a first control mode, and (b) Generating colored system light in the second control mode.

14. A method of providing a lighting device (1000) according to any one of the preceding claims 1 to 11, the method comprising: Stack n layers (110), where n>2, wherein k layers (110) of the n stacked layers (110) each include a PCB (200) having a solid-state light source (10), wherein 2≤k <n, The solid-state light source (10) is configured to generate light source light (11), wherein: One or more of the following applies: (i) one or more of the k layers (110) include one or more layer holes (120), and (ii) after the stacking, in a hole creation phase, one or more layer holes (120) are created in one or more of the k layers (110) of the n stacked layers (110); The following applies: (iii) the n layers (110) are stacked, and (iv) in the hole creation stage, the creation of the optional layer holes (120) in the layer holes (120) makes: due to the alignment of the solid-state light sources (10) and the layer holes (120), the light source light (11) of the solid-state light source (10) of any one of the PCBs (200) is at least partially not physically blocked by any one of the other PCBs (200), A PCB having an outer dimension smaller than that of the PCB (200) having the solid-state light source (10) is applied in the layer (110) on the layer (110) including the solid-state light source (10).

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