Heat dissipation back clip and electronic equipment components

Abstract

The present application discloses a heat dissipation back clip and an electronic device component. The heat dissipation back clip comprises: a shell, a substrate, a heat dissipation component and a refrigeration component; a receiving cavity with an opening is formed on the shell, the heat dissipation component is arranged in the receiving cavity, and the substrate cover is arranged at the opening; the refrigeration component has a heat absorption end and a heat release end, the heat absorption end of the refrigeration component is arranged on one side of the substrate, and the heat release end of the refrigeration component is arranged between the other side of the substrate and the heat dissipation component; and / or the heat release end of the refrigeration component is arranged on the shell.

Description

Technical Field

[0001] The present application belongs to the field of electronic technology, and specifically relates to a heat dissipation back clip and an electronic equipment component. Background Art

[0002] With the rapid development of electronic devices, the functions of electronic devices are no longer limited to basic functions such as making calls and sending text messages. Current electronic devices also take into account other functions such as games, taking photos, and videos. As the configuration of electronic devices becomes higher and higher and the performance becomes stronger and stronger, various electronic components generate more and more heat when working, which will have a more and more serious impact on electronic devices. Therefore, the heat dissipation of electronic devices has become more and more important.

[0003] In order to better dissipate heat for electronic devices, a heat dissipation back clip is usually installed on the electronic device, and the heat dissipation back clip can assist the electronic device in additional heat dissipation. Currently, the contact thermal resistance between the back of the electronic device and the heat dissipation back clip is large, and the heat dissipation function of the heat dissipation back clip cannot be effectively exerted. Summary of the invention

[0004] The present application aims to provide a heat dissipation back clip and an electronic device assembly, which can solve the problem of poor heat dissipation effect of the existing heat dissipation back clip.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a heat dissipation back clip, comprising: a housing, a substrate, a heat dissipation component, and a refrigeration component;

[0007] The housing is formed with an open accommodating cavity, the heat dissipation assembly is arranged in the accommodating cavity, and the substrate cover is arranged at the open portion;

[0008] The refrigeration component has a heat absorbing end and a heat releasing end, the heat absorbing end of the refrigeration component is arranged on one side of the substrate, the heat releasing end of the refrigeration component is arranged between the other side of the substrate and the heat dissipation component, and / or the heat releasing end of the refrigeration component is arranged on the shell.

[0009] According to a heat dissipation back clip proposed in an embodiment of the present application, the cooling element is a first semiconductor refrigeration film, the heat absorption end of the first semiconductor refrigeration film is arranged on one side of the substrate, and the heat release end of the first semiconductor refrigeration film is arranged between the other side of the substrate and the heat dissipation component.

[0010] According to a heat dissipation back clip proposed in an embodiment of the present application, the cooling element is a second semiconductor refrigeration film, the heat absorption end of the second semiconductor refrigeration film is arranged on one side of the substrate, and the heat release end of the second semiconductor refrigeration film extends to the inner side or the outer side of the shell.

[0011] According to a heat dissipation back clip proposed in an embodiment of the present application, the cooling element includes a first semiconductor cooling film and a second semiconductor cooling film, the heat absorption end of the first semiconductor cooling film is arranged on one side of the substrate, and the heat release end of the first semiconductor cooling film is arranged between the other side of the substrate and the heat dissipation component;

[0012] The heat absorbing end of the second semiconductor refrigeration film is connected to a side of the heat absorbing end of the first semiconductor refrigeration film away from the substrate, and the heat releasing end of the second semiconductor refrigeration film extends to the inner side surface or the outer side surface of the shell.

[0013] According to a heat dissipation back clip proposed in an embodiment of the present application, the first semiconductor refrigeration film is "U"-shaped, and the second semiconductor refrigeration film is "L"-shaped;

[0014] The first semiconductor refrigeration film includes a first side plate, a second side plate and a bottom plate, and the second semiconductor refrigeration film includes a third side plate and a fourth side plate;

[0015] The base plate is located between the first side plate and the second side plate, the third side plate is connected to a side of the second side plate away from the base plate, and the fourth side plate is connected to an inner side surface or an outer side surface of the shell.

[0016] According to a heat dissipation back clip proposed in an embodiment of the present application, the first semiconductor refrigeration film and the second semiconductor refrigeration film are made of one of a P-type semiconductor, an N-type semiconductor and a PN junction and a viscous organic material.

[0017] According to a heat dissipation back clip proposed in an embodiment of the present application, the heat dissipation assembly includes a heat sink, the heat sink includes a heat dissipation plate and a heat sink, and the heat sink is arranged on a side of the heat dissipation plate away from the substrate.

[0018] According to a heat dissipation back clip proposed in an embodiment of the present application, the heat dissipation assembly also includes a fan, the fan is arranged on one side of the heat dissipation plate, and the heat sink is arranged around the fan.

[0019] According to a heat dissipation back clip proposed in an embodiment of the present application, the shell is provided with ventilation holes, and the ventilation holes are arranged along the circumferential direction of the shell.

[0020] In a second aspect, an embodiment of the present application proposes an electronic device assembly, comprising: an electronic device and the above-mentioned heat dissipation back clip, wherein the electronic device is connected to the heat absorption end of the refrigeration component.

[0021] In an embodiment of the present application, after the housing of the electronic device contacts the first side of the substrate, the heat absorbing end of the refrigeration component is located between the housing of the electronic device and the first side of the substrate, and the heat generated by the electronic device of the electronic device is transferred to the heat absorbing end of the refrigeration component through the housing, and the heat absorbing end of the refrigeration component can transfer the absorbed heat to the heat releasing end of the refrigeration component, and the heat releasing end of the refrigeration component can conduct the heat to the shell and / or the heat dissipation component located inside the accommodating cavity, and the heat is finally dissipated through the shell and / or the heat dissipation component. The heat absorbing end of the refrigeration component is directly in contact with the housing of the electronic device, and the heat releasing end of the refrigeration component is directly in contact with the heat dissipation component and / or the shell. Compared with the prior art that uses heat-conducting silicone and heat dissipation accessory shell for heat conduction, the two thermal resistances of the heat-conducting silicone and the heat dissipation accessory shell in the heat transfer path are reduced, and the heat is directly transported to the heat dissipation component and / or the shell through the heat releasing end of the refrigeration component, thereby improving the heat transfer efficiency and thus improving the user experience.

[0022] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0024] Figure 1 This is one of the structural schematic diagrams of the heat dissipation back clip according to an embodiment of the present application;

[0025] Figure 2 yes Figure 1 Schematic diagram of the decomposition of

[0026] Figure 3 is a schematic structural diagram of a first semiconductor refrigeration film according to an embodiment of the present application;

[0027] Figure 4 This is a second structural schematic diagram of the heat dissipation back clip according to an embodiment of the present application;

[0028] Figure 5 yes Figure 4 Schematic diagram of the decomposition of

[0029] Figure 6 is a schematic diagram of assembling a first semiconductor refrigeration film and a second semiconductor refrigeration film according to an embodiment of the present application;

[0030] Reference numerals:

[0031] 1: heat dissipation back clip; 11: shell;

[0032] 12: fan; 13: heat sink;

[0033] 14: first semiconductor refrigeration film; 15: substrate;

[0034] 16: The second semiconductor refrigeration film. DETAILED DESCRIPTION

[0035] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0036] In the description of the present application, it should be understood that the terms "one side", "the other side", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] At present, the heat dissipation back clip is generally fixed to the electronic device by clamping, placing, etc., so as to facilitate heat dissipation of the electronic device. For example, if the electronic device is a mobile phone, the heat dissipation back clip is generally in contact with the back shell of the mobile phone, and the contact surface of the heat dissipation back clip that fits the back shell of the mobile phone is generally made of interface materials such as thermal conductive silicone.

[0039] Usually, a fan, TEC cooling sheet, radiator and other components are installed inside the shell of the heat dissipation back clip to reduce the temperature of the side in contact with the mobile phone, thereby dissipating heat from the mobile phone. Among them, the TEC cooling sheet commonly used in the heat dissipation back clip on the market is a traditional semiconductor block, which is generally composed of a "sandwich" structure, that is, a ceramic substrate-semiconductor array-ceramic substrate. The semiconductor array is generally composed of multiple PN junctions, and the PN junction is generally composed of a P-type semiconductor and an N-type semiconductor in series. The TEC cooling sheet generally transports heat at both ends of the PN junction, that is, heat transport in the thickness direction of the TEC cooling sheet.

[0040] The TEC cooling sheet used in the heat dissipation back clip is inside, and the mobile phone cannot directly contact the TEC cooling sheet. The thermal conductive silicone is in direct contact with the back cover of the mobile phone. The thermal conductivity of the thermal conductive silicone is generally less than 5w / m / k, which is a larger thermal resistance in the heat transfer path and affects the heat dissipation effect.

[0041] In addition, for TEC coolers, under appropriate current, the larger the heat dissipation surface and the heat absorption surface, and the more internal PN junctions, the better the cooling effect. However, due to the volume and cost constraints of the TEC cooler, the heat dissipation surface can only contact a small part of the radiator. The heat released by the cooler at the center of the radiator needs to be conducted to the surroundings, affecting the heat dissipation efficiency.

[0042] In order to solve the above problems, Figure 1 , Figure 2 and Figure 3 As shown, the heat dissipation back clip 1 of the embodiment of the present application includes: a shell 11, a substrate 15, a heat dissipation component and a refrigeration component.

[0043] The housing 11 has a containing cavity with an opening. The heat dissipation assembly is fixed in the containing cavity, and the substrate 15 covers the opening.

[0044] The heat dissipation assembly is placed in the accommodating cavity, and the substrate 15 is covered at the opening. When the substrate 15 is covered at the opening, the accommodating cavity is a closed chamber. The substrate 15 is detachably connected to the inner wall of the accommodating cavity. For example, the substrate 15 and the accommodating cavity are assembled by means of a buckle and a slot.

[0045] The substrate 15 has a first side and a second side which are arranged opposite to each other.

[0046] The refrigeration element has a heat absorbing end and a heat releasing end. The heat absorbing end of the refrigeration element is arranged on the first side of the substrate 15, and the heat releasing end of the refrigeration element is arranged between the second side of the substrate 15 and the heat dissipation component.

[0047] Alternatively, the heat release end of the refrigeration element is disposed on the housing 11;

[0048] Alternatively, part of the heat release end of the refrigeration element is disposed between the second side of the substrate 15 and the heat dissipation assembly, and the remaining part is disposed in the housing 11 .

[0049] The first side of the substrate 15 is used to contact the housing of the electronic device, that is, the heat absorption end of the refrigeration element is located between the first side of the substrate 15 and the housing of the electronic device.

[0050] In order to improve the heat transfer efficiency, the substrate 15 can be made of a material with good thermal conductivity, for example, the substrate 15 is made of copper.

[0051] In the embodiment of the present application, after the housing of the electronic device contacts the first side of the substrate 15, the heat absorbing end of the refrigeration element is located between the housing of the electronic device and the first side of the substrate 15, and the heat generated by the electronic device of the electronic device is transferred to the heat absorbing end of the refrigeration element through the housing, and the heat absorbing end of the refrigeration element can transfer the absorbed heat to the heat releasing end of the refrigeration element, and the heat releasing end of the refrigeration element can conduct the heat to the housing 11 and / or the heat dissipation component located inside the accommodating cavity, and the heat is finally dissipated through the housing 11 and / or the heat dissipation component. The heat absorbing end of the refrigeration element is directly in contact with the housing of the electronic device, and the heat releasing end of the refrigeration element is directly in contact with the heat dissipation component and / or the housing 11. Compared with the prior art of using heat-conducting silica gel and heat dissipation accessory housing for heat conduction, the two thermal resistances of the heat-conducting silica gel and the heat dissipation accessory housing in the heat transfer path are reduced, and the heat is directly transported to the heat dissipation component and / or the housing 11 through the heat releasing end of the refrigeration element, thereby improving the heat transfer efficiency and thus improving the user experience.

[0052] Based on the above embodiment, the cooling element is a first semiconductor cooling film 14, the heat absorbing end of the first semiconductor cooling film 14 is arranged on the first side of the substrate 15, and the heat releasing end of the first semiconductor cooling film 14 is arranged between the second side of the substrate 15 and the heat dissipating component.

[0053] When a current is applied to one end of the first semiconductor refrigeration film 14 and the other end of the first semiconductor refrigeration film 14 is grounded, a cooling effect will be generated by the Peltier effect. At this time, the end loaded with current will actively absorb heat and transfer the heat to the other end connected to the ground to complete the heat transfer. In other words, the first semiconductor refrigeration film 14 has a heat absorbing end and a heat releasing end.

[0054] After the housing of the electronic device contacts the first side of the substrate 15, the heat absorption end of the first semiconductor refrigeration film 14 is located between the housing of the electronic device and the first side of the substrate 15, and the heat generated by the electronic device of the electronic device is transferred to the heat absorption end of the first semiconductor refrigeration film 14 through the housing. The heat absorption end of the first semiconductor refrigeration film 14 can transfer the absorbed heat to the heat release end of the first semiconductor refrigeration film 14, and the heat release end of the first semiconductor refrigeration film 14 can conduct the heat to the heat dissipation component, and the heat is finally dissipated through the heat dissipation component.

[0055] In an optional embodiment, the cooling element is a second semiconductor refrigeration film 16 , a heat absorbing end of the second semiconductor refrigeration film 16 is arranged on the first side of the substrate 15 , and a heat releasing end of the second semiconductor refrigeration film 16 extends to the inner side or the outer side of the shell 11 .

[0056] When a current is applied to one end of the second semiconductor refrigeration film 16 and the other end of the second semiconductor refrigeration film 16 is grounded, a cooling effect is generated by the Peltier effect. At this time, the end loaded with current actively absorbs heat and transfers the heat to the other end connected to the ground to complete the heat transfer. In other words, the second semiconductor refrigeration film 16 has a heat absorbing end and a heat releasing end.

[0057] After the housing of the electronic device contacts the first side of the substrate 15 , the heat absorption end of the second semiconductor refrigeration film 16 is located between the housing of the electronic device and the first side of the substrate 15 , and the heat generated by the electronic device of the electronic device is transferred to the heat absorption end of the second semiconductor refrigeration film 16 through the housing. The heat absorption end of the second semiconductor refrigeration film 16 can transfer the absorbed heat to the heat release end of the second semiconductor refrigeration film 16 , and the heat release end of the second semiconductor refrigeration film 16 can conduct the heat to the shell 11 , and the heat is finally naturally dissipated through the shell 11 .

[0058] In an optional embodiment, the refrigeration element includes a first semiconductor refrigeration film 14 and a second semiconductor refrigeration film 16, the heat absorption end of the first semiconductor refrigeration film 14 is arranged on the first side of the substrate 15, and the heat release end of the first semiconductor refrigeration film 14 is arranged between the second side of the substrate 15 and the heat dissipation component;

[0059] The heat absorbing end of the second semiconductor refrigeration film 16 is disposed on the first side of the substrate 15 , and the heat releasing end of the second semiconductor refrigeration film 16 extends to the inner side surface or the outer side surface of the housing 11 .

[0060] like Figure 4 , Figure 5 and Figure 6 As shown, the shape of the second semiconductor refrigeration film 16 is different from that of the first semiconductor refrigeration film 14. The shapes of the second semiconductor refrigeration film 16 and the first semiconductor refrigeration film 14 can be selected according to actual working conditions and are not specifically limited here.

[0061] The first semiconductor refrigeration film 14 and the second semiconductor refrigeration film 16 can absorb heat from the same place and transfer the heat to different places for dissipation, thereby improving the heat dissipation efficiency.

[0062] The heat dissipation back clip 1 may also include more than two semiconductor refrigeration films, the specific number of which can be selected according to actual working conditions and is not specifically limited here.

[0063] That is to say, at this time, the heat absorption end of the first semiconductor refrigeration film 14 and the heat absorption end of the second semiconductor refrigeration film 16 are both located on one side of the substrate 15, and the heat absorption end of the first semiconductor refrigeration film 14 and the heat absorption end of the second semiconductor refrigeration film 16 do not intersect, the heat release end of the first semiconductor refrigeration film 14 is in contact with the heat dissipation component, and the heat release end of the second semiconductor refrigeration film 16 is in contact with the inner side surface of the shell 11, that is, in contact with the inner wall of the accommodating cavity, or the heat release end of the second semiconductor refrigeration film 16 is in contact with the outer side surface of the shell 11.

[0064] After the housing of the electronic device contacts the first side of the substrate 15, the heat absorbing end of the first semiconductor refrigeration film 14 and the heat absorbing end of the second semiconductor refrigeration film 16 are located between the housing of the electronic device and the first side of the substrate 15, and current is applied to the heat absorbing end of the first semiconductor refrigeration film 14 and the heat absorbing end of the second semiconductor refrigeration film 16. At this time, part of the heat generated by the electronic device of the electronic device is transferred to the heat absorbing end of the first semiconductor refrigeration film 14 through the housing, and the heat absorbing end of the first semiconductor refrigeration film 14 can transfer the absorbed heat to the heat releasing end of the first semiconductor refrigeration film 14, and the heat releasing end of the first semiconductor refrigeration film 14 can conduct the heat to the heat dissipation component located inside the accommodating cavity, and the heat is finally dissipated through the heat dissipation component; another part of the heat generated by the electronic device of the electronic device is transferred to the heat absorbing end of the second semiconductor refrigeration film 16 through the housing, and the heat absorbing end of the second semiconductor refrigeration film 16 can transfer the absorbed heat to the heat releasing end of the second semiconductor refrigeration film 16, and the heat releasing end of the second semiconductor refrigeration film 16 can conduct the heat to the housing, and finally the heat is naturally dissipated at ambient temperature.

[0065] In an optional embodiment, the refrigeration element includes a first semiconductor refrigeration film 14 and a second semiconductor refrigeration film 16, the heat absorption end of the first semiconductor refrigeration film 14 is arranged on the first side of the substrate 15, and the heat release end of the first semiconductor refrigeration film 14 is arranged between the second side of the substrate 15 and the heat dissipation component;

[0066] To improve integration, the heat absorbing end of the second semiconductor refrigeration film 16 is connected to the heat absorbing end of the first semiconductor refrigeration film 14 away from the substrate 15 , and the heat releasing end of the second semiconductor refrigeration film 16 extends to the inner side or outer side of the shell 11 .

[0067] The heat absorbing end of the second semiconductor refrigeration film 16 is connected to the side of the heat absorbing end of the first semiconductor refrigeration film 14 away from the substrate 15, that is, the heat absorbing end of the second semiconductor refrigeration film 16 is arranged overlapping with the heat absorbing end of the first semiconductor refrigeration film 14. At this time, the heat generated by the electronic device of the thermal electronic device is transferred to the heat absorbing end of the second semiconductor refrigeration film 16 through the housing, and the heat absorbing end of the second semiconductor refrigeration film 16 can transfer the absorbed heat to the heat releasing end of the first semiconductor refrigeration film 14 and the heat absorbing end of the first semiconductor refrigeration film 14.

[0068] Wherein, when the heat absorbing end of the second semiconductor refrigeration film 16 is overlapped with the heat absorbing end of the first semiconductor refrigeration film 14 , the first semiconductor refrigeration film 14 may be “U” shaped, and the second semiconductor refrigeration film 16 may be “L” shaped.

[0069] At this time, the first semiconductor refrigeration film 14 includes a first side plate, a second side plate and a bottom plate, and the second semiconductor refrigeration film 16 includes a third side plate and a fourth side plate;

[0070] The base plate 15 is located between the first side plate and the second side plate, the third side plate is connected to a side of the second side plate away from the base plate 15 , and the fourth side plate is connected to an inner side surface or an outer side surface of the housing 11 .

[0071] In an optional embodiment, the first semiconductor refrigeration film 14 and the second semiconductor refrigeration film 16 are made of one of a P-type semiconductor, an N-type semiconductor and a PN junction and a viscous organic material.

[0072] For example, the first semiconductor refrigeration film 14 and the second semiconductor refrigeration film 16 are made of PN junction and adhesive organic material, wherein the adhesive organic material may be epoxy resin.

[0073] The thickness of the first semiconductor refrigeration film 14 and the thickness of the second semiconductor refrigeration film 16 can be much smaller than the thickness of the TEC refrigeration sheet. For example, the thickness of the first semiconductor refrigeration film 14 is 0.01 mm, while the thickness of the TEC refrigeration sheet is 0.5 mm.

[0074] The following description will be made by taking the first semiconductor refrigeration film 14 as an example.

[0075] The heat absorbing end of the first semiconductor refrigeration film 14 has a large contact area with the electronic device housing, and the heat releasing end of the first semiconductor refrigeration film 14 has a large contact area with the heat dissipation component, which is beneficial to the heat transfer between the first semiconductor refrigeration film 14 and the electronic device housing and the heat dissipation component.

[0076] In an optional embodiment, the heat dissipation assembly includes a radiator 13, which includes a heat dissipation plate and a heat dissipation fin. The heat dissipation plate is fixed in the accommodating cavity, the heat dissipation fin is arranged on the side of the heat dissipation plate away from the substrate 15, and the heat release end of the first semiconductor refrigeration film 14 is arranged between the second side of the substrate 15 and the other side of the heat dissipation plate.

[0077] The heat generated by the electronic device of the electronic device is transferred to the heat absorbing end of the first semiconductor refrigeration film 14 through the housing, and the heat absorbing end of the first semiconductor refrigeration film 14 can transfer the absorbed heat to the heat releasing end of the first semiconductor refrigeration film 14, and the heat releasing end of the first semiconductor refrigeration film 14 can conduct the heat to the heat sink, and the heat is finally dissipated through the heat sink. At this time, the heat can also be transferred to the substrate 15 through the housing, and the substrate 15 can transfer the absorbed heat to the heat sink, and the heat is finally dissipated through the heat sink.

[0078] The first semiconductor refrigeration film 14 can be mounted on one end of the substrate 15 . At this time, the heat absorbing end of the first semiconductor refrigeration film 14 is attached to the first side of the substrate 15 , and the heat releasing end of the first semiconductor refrigeration film 14 is attached to the second side of the substrate 15 .

[0079] There may be two first semiconductor refrigeration films 14 . In this case, the two first semiconductor refrigeration films 14 are respectively mounted on two opposite ends of the substrate 15 .

[0080] The first semiconductor refrigeration film 14 may also be arranged through the substrate 15 .

[0081] Compared with the prior art in which the TEC cooling fin is arranged at the center of the heat sink, and heat is transferred from the center to the edge of the heat sink, the heat release end of the first semiconductor refrigeration film 14 is directly fitted with the corresponding part of the heat sink on the heat sink, which not only increases the contact area between the two, but also improves the heat dissipation efficiency.

[0082] In an optional embodiment, in order to improve the heat dissipation efficiency, the heat dissipation assembly further includes a fan 12, the fan 12 is arranged on one side of the heat dissipation plate, and the heat dissipation fins are arranged around the fan 12. The fan 12 can be located at the center of the heat dissipation plate.

[0083] The heat generated by the electronic devices of the electronic device is transferred to the heat absorption end of the first semiconductor refrigeration film 14 through the casing. The heat absorption end of the first semiconductor refrigeration film 14 can transfer the absorbed heat to the heat release end of the first semiconductor refrigeration film 14. The heat release end of the first semiconductor refrigeration film 14 can conduct the heat to the heat sink. The heat is finally dissipated through the heat sink. Under the action of the fan 12, the air flow speed around the heat sink is accelerated, and the heat on the heat sink is dissipated faster.

[0084] In an optional embodiment, in order to facilitate the fixation of the heat dissipation back clip 1 and the electronic device, a clamping portion is extended from the open end of the shell 11.

[0085] The heat release end of the second semiconductor refrigeration film 16 can extend to the clamping portion after passing through the housing 11. The heat release end of the second semiconductor refrigeration film 16 can also extend to the inner wall of the accommodating cavity after passing through the substrate 15. The heat release end of the second semiconductor refrigeration film 16 can also extend to the outside of the housing corresponding to the accommodating cavity after passing through the housing 11.

[0086] At this time, the electronic device is fixed on the heat dissipation back clip through the clamping part. The number of the clamping parts can be two.

[0087] In an optional embodiment, in order to accelerate the exchange of air in the accommodating cavity with the outside air, the shell 11 is provided with ventilation holes, and the ventilation holes are arranged along the circumferential direction of the shell 11.

[0088] The number and shape of the ventilation holes are not limited here.

[0089] In addition, in other embodiments of the present application, an electronic device assembly is provided. The electronic device assembly includes: an electronic device and the above-mentioned heat dissipation back clip 1 , wherein the electronic device is connected to the first side of the substrate 15 .

[0090] In the embodiments of the present application, the electronic device includes but is not limited to a mobile phone, a tablet computer, a laptop computer, a PDA, a vehicle-mounted terminal, a wearable device, and a pedometer, etc. The embodiments of the present application do not specifically limit the specific type of the electronic device. For ease of explanation, the embodiments of the present application take the electronic device as a mobile phone as an example for explanation.

[0091] The mobile phone is clamped by the clamping part. After the rear shell of the mobile phone contacts the first side of the substrate 15, the heat absorption end of the refrigeration component is located between the housing of the electronic device and the first side of the substrate 15. Current is applied to the heat absorption end of the refrigeration component. The heat generated by the electronic device of the mobile phone is transferred to the heat absorption end of the refrigeration component through the housing. The heat absorption end of the refrigeration component can transfer the absorbed heat to the heat release end of the refrigeration component. The heat release end of the refrigeration component can conduct the heat to the clamping part and / or the heat dissipation component located inside the accommodating cavity. The heat is finally dissipated through the clamping part and / or the heat dissipation component.

[0092] In the description of this specification, the description of the reference term "optional implementation" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0093] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A heat dissipation back clip, characterized in that: include: Shell, substrate, heat dissipation components and refrigeration components; The housing is formed with an open accommodating cavity, the heat dissipation assembly is arranged in the accommodating cavity, and the substrate cover is arranged at the open portion; The refrigeration element includes a semiconductor refrigeration film, and the refrigeration element is "L"-shaped or "U"-shaped. The heat absorption end of the refrigeration element is arranged on one side of the substrate, and the heat release end of the refrigeration element is arranged between the other side of the substrate and the heat dissipation component, and / or the heat release end of the refrigeration element is arranged on the shell.

2. The heat dissipation back clip according to claim 1, characterized in that: The cooling element is a first semiconductor cooling film, a heat absorbing end of the first semiconductor cooling film is arranged on one side of the substrate, and a heat releasing end of the first semiconductor cooling film is arranged between the other side of the substrate and the heat dissipation component.

3. The heat dissipation back clip according to claim 1, characterized in that: The cooling element is a second semiconductor cooling film, a heat absorbing end of the second semiconductor cooling film is arranged on one side of the substrate, and a heat releasing end of the second semiconductor cooling film extends to the inner side surface or the outer side surface of the shell.

4. The heat dissipation back clip according to claim 1, characterized in that: The refrigeration element comprises a first semiconductor refrigeration film and a second semiconductor refrigeration film, wherein the heat absorbing end of the first semiconductor refrigeration film is arranged on one side of the substrate, and the heat releasing end of the first semiconductor refrigeration film is arranged between the other side of the substrate and the heat dissipation component; The heat absorbing end of the second semiconductor refrigeration film is connected to a side of the heat absorbing end of the first semiconductor refrigeration film away from the substrate, and the heat releasing end of the second semiconductor refrigeration film extends to the inner side surface or the outer side surface of the shell.

5. The heat dissipation back clip according to claim 4, characterized in that: The first semiconductor refrigeration film is "U" shaped, and the second semiconductor refrigeration film is "L" shaped; The first semiconductor refrigeration film includes a first side plate, a second side plate and a bottom plate, and the second semiconductor refrigeration film includes a third side plate and a fourth side plate; The base plate is located between the first side plate and the second side plate, the third side plate is connected to a side of the second side plate away from the base plate, and the fourth side plate is connected to an inner side surface or an outer side surface of the shell.

6. The heat dissipation back clip according to claim 4, characterized in that: The first semiconductor refrigeration film and the second semiconductor refrigeration film are made of one of a P-type semiconductor, an N-type semiconductor and a PN junction and a viscous organic material.

7. The heat dissipation back clip according to claim 1, characterized in that: The heat dissipation assembly comprises a heat sink, and the heat sink comprises a heat dissipation plate and a heat dissipation fin. The heat dissipation fin is arranged on a side of the heat dissipation plate away from the substrate.

8. The heat dissipation back clip according to claim 7, characterized in that: The heat dissipation assembly further includes a fan, which is arranged on one side of the heat dissipation plate, and the heat dissipation fins are arranged around the fan.

9. The heat dissipation back clip according to claim 1, characterized in that: The housing is provided with ventilation holes, and the ventilation holes are arranged along the circumferential direction of the housing.

10. An electronic device component, characterized in that: include: An electronic device and a heat dissipation back clip according to any one of claims 1 to 9, wherein the electronic device is connected to the heat absorption end of the refrigeration component.

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