Pump source packaging tooling, device and packaging method

Abstract

The present application provides a pump source packaging tool, device, and packaging method, comprising: a first base and a second base, the first base comprising a first main body and a first hollow area, the first main body enclosing the first hollow area to form a pump source housing; the second base comprising a heat sink layer; the heat sink layer being insertable into the first hollow area and connected to the pump source housing; the first main body being connected to a heat source, heat from the heat source being conducted to the pump source housing via the first main body; heat absorbed by the pump source housing being used to melt solder and form a molten solder layer at the pump source's interface to be welded; the heat sink layer being directly or indirectly connected to a heat sink, heat from the pump source housing being conducted to the heat sink layer via the heat sink layer to rapidly cool the solder layer from a molten state to a solidified state, thereby completing the welding and packaging of the pump source. The pump source packaging tool provided by the present application allows the solder to be rapidly solidified after melting, thereby improving the production efficiency of the pump source.

Description

Technical Field

[0001] The present application relates to the field of electronic packaging technology, and in particular to a pump source packaging tool. Background Art

[0002] During the packaging process of a semiconductor laser used as a pump source, a semiconductor laser chip module (COS) is generally soldered to a pump source base by heating solder, and the pump source base is also soldered to a pump source housing by heating solder.

[0003] However, the pump source welding packaging process of related technologies generally completes solder solidification by air cooling or natural cooling to ambient temperature, resulting in low heat dissipation efficiency and long heat dissipation time, which seriously affects the production efficiency of the pump source. Summary of the Invention

[0004] The embodiments of the present application provide a pump source packaging tool, device, and packaging method, which conducts heat from a heat source to a pump source housing through a first main body, and conducts heat from the pump source housing to a cold source through a heat sink layer, so that the solder is quickly solidified after melting, thereby improving the production efficiency of the pump source.

[0005] The present embodiment provides a pump source packaging tool, which includes:

[0006] A first base, comprising a first main body and a first hollow area, wherein the first main body encloses the first hollow area; the first hollow area is used to accommodate a pump source housing; and

[0007] a second base, the second base comprising a heat sink layer; the heat sink layer can be inserted into the first hollow area and connected to the pump source housing;

[0008] Among them, the first main body is connected to the heat source, and the heat of the heat source is conducted to the pump source shell through the first main body. The heat absorbed by the pump source shell is used to melt the solder and form a molten solder layer at the interface to be welded of the pump source; the heat sink layer is directly or indirectly connected to the cold source, and the heat of the pump source shell can be conducted to the cold source through the heat sink layer to quickly cool the solder layer from a molten state to a solidified state to complete the welding package of the pump source.

[0009] The present application also provides a pump source packaging device, which includes:

[0010] Pump source packaging tooling; and

[0011] a cooling fluid supply module;

[0012] The cooling fluid supply module is used to provide cooling fluid to the refrigeration plate.

[0013] The present invention also provides a method for packaging a pump source, which includes:

[0014] A pump source of a first structure is provided, wherein the pump source of the first structure includes a semiconductor laser module, a pump source base, and a pump source housing, wherein no welding layer is formed between the semiconductor laser module and the pump base, and between the pump base and the pump source housing;

[0015] placing solder on the contact interface between the semiconductor laser module and the pump source base, and placing solder on the contact interface between the pump source base and the pump source housing to form a pump source of the second structure;

[0016] The provided pump source packaging device engages the pump source of the second structure in the first hollow area to supply power to the electric heating structure; when the solder is heated and melted to form a molten welding layer, the power supply to the electric heating structure is stopped, while the semiconductor refrigeration plate is supplied with power and cooling water is continuously introduced into the channel of the refrigeration plate; when the welding layer is rapidly cooled from a molten state to a solidified state, the welding packaging of the pump source is completed.

[0017] In an embodiment of the present application, the first main body is connected to the heat source to guide the heat of the heat source to the pump source housing, and the pump source housing then guides the heat to the solder located at the interface to be welded of the pump source. The solder absorbs heat and melts to form a molten welding layer at the interface to be welded of the pump source. After the solder forms the molten welding layer, the pump source housing is connected to the cold source through the heat sink layer to guide the heat of the pump source housing to the cold source. The molten welding layer releases heat to become a solidified welding layer, so that the solder is quickly solidified after melting, thereby improving the production efficiency of the pump source. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0019] Figure 1 A schematic structural diagram of the pump source packaging tooling provided in an embodiment of the present application.

[0020] Figure 2 Schematic diagram of the pump source structure.

[0021] Figure 3 for Figure 1 Exploded diagram.

[0022] Figure 4 for Figure 1 The pump source packaging fixture shown is Figure 2 The state diagram of the pump source package is shown.

[0023] Figure 5 for Figure 4 The structure shown is a cross-sectional view taken along the P1-P1 direction.

[0024] Figure 6 for Figure 4 FIG2 is a cross-sectional view of the cooling plate shown in FIG2 after being cut along the P2-P2 direction.

[0025] Figure 7 for Figure 3 Schematic diagram of the structure of the clamping assembly shown in .

[0026] Figure 8 for Figure 7 Exploded view of the clamping assembly shown in .

[0027] Figure 9 for Figure 7 A cross-sectional view of the clamping assembly shown in FIG. 1 along the P3-P3 direction.

[0028] Figure 10 A schematic structural diagram of the pump source packaging device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0030] See also Figure 1 and Figure 2 An embodiment of the present application provides a pump source packaging tool, including a first base 2 and a second base 4.

[0031] See also Figure 1 、 Figure 3 and Figure 4 The first base 2 includes a first main body 220 and a first hollow area 240. The first main body 220 encloses the first hollow area 240. The first hollow area 240 is used to accommodate the pump source housing 360. Figure 3 and Figure 5 The second base 4 includes a heat sink layer 420 . The heat sink layer 420 can be inserted into the first hollow area 240 and connected to the pump source housing 360 .

[0032] Understandably, see Figure 3 and Figure 5The first main body 220 is connected to a heat source. Heat from the heat source is transferred to the pump source housing 360 through the first main body 220. The heat absorbed by the pump source housing 360 melts the solder, forming a molten solder layer at the interface to be soldered with the pump source 3. The heat sink layer 420 is directly or indirectly connected to a heat sink. Heat from the pump source housing 360 is transferred to the heat sink through the heat sink layer 420, rapidly cooling the solder layer from a molten state to a solidified state, thereby completing the soldering and packaging of the pump source 3.

[0033] Understandably, see Figure 2 The pump source 3 includes a semiconductor laser module 340, a pump source base 320, and a pump source housing 360. The pump source housing 360 includes a bottom wall 361 and side walls 362. The side walls 362 are perpendicular to the bottom wall 361 and together they form a housing cavity 363. The bottom wall 361 includes a connected bottom inner wall 3614 and a bottom outer edge 3612. The bottom inner wall 3614 is located inside the housing cavity 363, while the bottom outer edge 3612 is located outside the housing cavity 363. The semiconductor laser module 340 and the pump source base 320 are disposed in the accommodating cavity 363 ; the semiconductor laser module 340 is welded to the pump source base 320 , and the pump source base 320 is welded to the bottom inner wall 3614 of the pump source housing 360 facing the accommodating cavity 363 .

[0034] It is understood that the pump source packaging fixture can achieve rapid melting of solder. Figure 2 During the use of the pump source packaging tooling, the semiconductor laser module 340 and the pump source base 320 are placed inside the pump source housing 360 placed in the first hollow area 240, and a welding layer has not yet been formed between the semiconductor laser module 340 and the pump source base 320, and between the pump base and the pump source housing 360; solder is placed on the contact interface between the semiconductor laser module 340 and the pump source base 320, and solder is placed on the contact interface between the pump source base 320 and the pump source housing 360, to form a pump source structure to be welded and packaged.

[0035] It can be further understood that see Figure 2 and Figure 5 The first main body 220 is connected to the heat source. The heat generated by the heat source is conducted through the first main body 220 to the pump source housing 360 connected to the first main body 220, and then conducted from the pump source housing 360 to the solder located between the pump source housing 360 and the pump source base 320. The heat is then conducted from the pump source housing 360 to the pump source base 320 connected to the pump source housing 360, and then conducted from the pump source base 320 to the solder located between the pump source base 320 and the semiconductor laser module 340.

[0036] See also Figure 4 and Figure 6 The second base 4 includes a cooling plate 440 . The cooling plate 440 is directly or indirectly connected to the heat sink layer 420 so as to conduct heat from the heat sink layer 420 to the cooling plate 440 .

[0037] A channel 441 is provided in the refrigeration plate 440, and the refrigeration plate 440 is cooled by introducing a cold source into the channel 441; the refrigeration plate 440 is provided with an inlet end 4412 and an outlet end 4414, and the channel 441 is between the inlet end 4412 and the outlet end 4414; the cold source is a cooling fluid; the cold source flows into the channel 441 from the inlet end 4412 and flows out of the channel 441 from the outlet end 4414; the cold source enters the inlet end 4412 and flows in the channel 441 to exchange heat with the refrigeration plate 440 to absorb heat from the refrigeration plate 440, and the cold source takes away the heat from the refrigeration plate 440 by flowing out from the outlet end 4414.

[0038] It is understandable that the shape of the channel 441 can be a curve or a serpentine line to increase the heat exchange area between the cooling fluid and the refrigeration plate 440 .

[0039] It will be appreciated that the cooling plate 440 includes a first side 442 and a second side 443. The first side 442 can be connected to the heat sink layer 420. The second side 443 is perpendicular to the first side 442. The inlet end 4412 and the outlet end 4414 are disposed on the second side 443 so that the inlet end 4412 and the outlet end 4414 can be connected to the cooling plate 440 without affecting the connection between the cooling plate 440 and the heat sink layer 420 when the cooling fluid is introduced. In some embodiments, both the inlet end 4412 and the outlet end 4414 are equipped with a pipe 560 interface 444 for receiving the cooling fluid.

[0040] See also Figure 3 and 5 The second base 4 includes a semiconductor refrigeration plate 460, and the semiconductor refrigeration plate 460 includes a hot end side wall 462 and a cold end side wall 461; the cold end side wall 461 is connected to the heat sink layer 420, and the hot end side wall 462 is connected to the cooling plate 440; when the semiconductor refrigeration plate 460 is energized, the cold end side wall 461 absorbs the heat of the heat sink layer 420, and the hot end side wall 462 conducts the heat to the cooling plate 440; the heat conduction efficiency is improved by the semiconductor refrigeration plate 460 to quickly cool the heat sink layer 420.

[0041] See also Figure 1 、 Figure 3 and Figure 5 The pump source packaging tooling includes an electric heating structure 7. The electric heating structure 7 generates heat when energized. The electric heating structure 7 is cylindrical. The first main body 220 is a metal heat conductor.

[0042] The first main body 220 defines a slot 221 for accommodating the electric heating structure 7 to be inserted therein.

[0043] When the electric heating structure 7 is inserted into the slot body 221, the outer wall of the electric heating structure 7 contacts the inner wall of the slot body 221; when the electric heating structure 7 is inserted into the slot body 221 and the electric heating structure 7 is energized, the electric heating structure 7 generates heat, and the heat is conducted to the first main body 220 through the outer wall of the electric heating structure 7 and the inner wall of the slot body 221, and then conducted to the pump source housing 360 through the first main body 220.

[0044] See also Figure 1 and Figure 3 The pump source packaging tooling includes a thermocouple structure 9; the thermocouple structure 9 is columnar.

[0045] The first main body 220 is provided with a slot 221 for accommodating the insertion of the thermocouple structure 9 . The thermocouple structure 9 is used to monitor the temperature of the first main body when powered on, so as to facilitate the temperature control of the first main body.

[0046] The thermocouple structure 9 is connected to the first main body 220. The thermocouple structure 9 monitors the temperature of the first main body when power is turned on. When the temperature rises to the melting point of the solder, the electric heating structure 7 is powered off to prevent the first main body from being overheated and causing damage to electronic components such as chips inside the pump source device.

[0047] Please refer to 2, the pump source housing 360 includes a pump source housing bottom wall 361 and a pump source housing side wall 362; the pump source housing side wall 362 is arranged perpendicular to the pump source housing bottom wall 361, and the pump source housing side wall 362 and the pump source housing bottom wall 361 enclose a receiving cavity 363; the pump source housing bottom wall 361 includes a bottom wall inner wall 3614 and a bottom wall outer edge 3612 connected to each other, the bottom wall inner wall 3614 is located on the inner side of the receiving cavity 363; the bottom wall outer edge 3612 is located on the outer side of the receiving cavity 363.

[0048] Put in the instruction manual, it can be understood that, please refer to Figure 2 A semiconductor laser module 340 and a pump source base 320 are arranged in the accommodating cavity 363; solder is arranged between the semiconductor laser module 340 and the pump source base 320; solder is arranged between the pump source base 320 and the inner wall of the base; when the first main body 220 is connected to the heat source, heat is indirectly or directly conducted to the solder through the pump source housing 360, causing the solder to melt to form a welding layer, and then the heat sink layer 420 is directly or indirectly connected to the cold source, causing the welding layer to solidify, thereby completing the welding packaging process of the pump source 3.

[0049] See also Figure 3The first hollow area 240 includes a first sub-hollow area 241 and a second sub-hollow area 242 which are connected to each other; the first sub-hollow area 241 is used to set the bottom wall 361 of the pump source shell; the second sub-hollow area 242 is used to accommodate the heat sink layer 420 to pass through.

[0050] See also Figure 3 and Figure 5 The first main body portion 220 includes a first wall surface 222, which encloses a first sub-hollow area 241. The opening size of the first sub-hollow area 241 is larger than the cross-sectional area of ​​the heat sink layer 420. When the heat sink layer 420 is set in the first sub-hollow area 241, the side surface of the heat sink layer 420 facing the first wall surface 222 is spaced apart from the first wall surface 222, thereby preventing heat from the first main body portion 220 from being directly transferred to the heat sink layer 420.

[0051] See also Figure 3 and Figure 5 The first main body 220 further includes at least two second walls 223, which enclose a second sub-hollow area 242. When the pump source housing 360 is placed in the second sub-hollow area 242, the at least two second walls 223 are connected to the pump source housing bottom wall 361, so that the pump source housing bottom wall 361 is engaged between the at least two second walls 223, thereby enabling the pump source housing 360 to be engaged in the second sub-hollow area 242 and enabling the side of the heat sink layer 420 facing the pump source housing 360 to be connected to the side of the pump source housing bottom wall 361 facing the heat sink layer 420, so that heat from the pump source housing 360 is discharged through the heat sink layer 420.

[0052] See also Figure 1 The pump source packaging tooling includes a clamping component 6.

[0053] See also Figure 3 The first main body 220 includes a boss 224 structure, the second wall 223 is formed on the boss 224 structure, the boss 224 structure corresponds to the second wall 223 one by one, and the boss 224 structure encloses a second sub-hollow area 242; a groove 225 is formed between each two adjacent boss 224 structures.

[0054] See also Figure 3 and Figure 5 , the clamping assembly 6 is set in the sink 225. Please refer to Figure 2 、 Figure 3 and Figure 5The clamping assembly 6 can be engaged with the outer edge of the bottom wall 3612 to limit the pump source housing 360 to the second sub-hollow area 242, making the connection between the second wall surface 223 and the bottom wall 361 of the pump source housing more stable. The connection between the side of the heat sink layer 420 facing the pump source housing 360 and the side of the bottom wall 361 of the pump source housing facing the heat sink layer 420 is also more stable, thereby ensuring the stability of heat conduction.

[0055] See also Figure 7-Figure 9 The clamping assembly 6 includes a clamping portion 620, a fixing portion 640 and an adjusting rod 660. The adjusting rod 660 is rotatably connected to the clamping portion 620, and the adjusting rod 660 is threadedly connected to the fixing portion 640; the fixing portion 640 is fixedly connected to the bottom of the sink 225.

[0056] See also Figure 1 、 Figure 3 、 Figure 7 and Figure 8 The clamping portion 620 includes a clamping end 621, which includes a horizontal wall 6212 and a vertical wall 6214 that are perpendicularly connected to each other. The horizontal wall 6212 and the vertical wall 6214 form a right-angle space 6216. The horizontal wall 6212 is arranged toward the first base 2, and the vertical wall 6214 is arranged toward the second sub-hollow area 242. Figure 2 The surface of the bottom wall outer edge 3612 facing away from the second sub-hollow area 242 is defined as the first surface 3612a, and the surface of the bottom wall outer edge 3612 perpendicular to the first surface 3612a is defined as the second surface 3612b. Figure 2 and Figure 8 When the outer edge 3612 of the bottom wall extends into the right-angle space 6216, the horizontal wall 6212 is in contact with the first surface 3612a of the outer edge 3612 of the bottom wall, and the vertical wall 6214 is in contact with the second surface 3612b of the outer edge 3612 of the bottom wall, so that the first surface 3612a is limited to the side of the horizontal wall 6212 facing the first base 2, and the second surface 3612b is limited to the side of the vertical wall 6214 facing the second sub-hollow area 242.

[0057] It can be understood that when the adjusting rod 660 moves relative to the fixing portion 640 toward the second sub-hollow area 242, the adjusting rod 660 simultaneously drives the clamping portion 620 to move toward the second sub-hollow area 242, so that the outer edge 3612 of the bottom wall can extend into the right-angle space 6216, so that the clamping portion 620 is engaged and connected with the outer edge 3612 of the bottom wall; when the adjusting rod 660 moves relative to the fixing portion 640 toward away from the second sub-hollow area 242, the adjusting rod 660 simultaneously drives the clamping portion 620 to move away from the second sub-hollow area 242, so that the outer edge 3612 of the bottom wall can exit the right-angle space 6216, so that the clamping portion 620 and the outer edge 3612 of the bottom wall are released from the engagement.

[0058] See also Figure 7-Figure 9 The clamping assembly 6 also includes a limiting pin 680.

[0059] The clamping portion 620 also includes a connecting end 622, which is connected to the clamping end 621; the connecting end 622 is provided with a first hole groove 6222 and a second hole groove 6224, the first hole groove 6222 is used to accommodate the adjustment rod 660 passing through; the second hole groove 6224 is perpendicular to the first hole groove 6222 and is connected to the first hole groove 6222, and the second hole groove 6224 is used to accommodate the limit pin 680.

[0060] The adjusting rod 660 is provided with a limiting groove 661 . The limiting groove 661 is annular and is arranged around the outer periphery of the adjusting rod 660 . The limiting groove 661 is arranged opposite to the second hole groove 6224 .

[0061] Among them, when the adjusting rod 660 is installed on the clamping part 620, the adjusting rod 660 is set in the first hole groove 6222, the limit pin 680 is set in the second hole groove 6224, and the limit pin 680 is engaged in the limit groove 661. The adjusting rod 660 can rotate in the first hole groove 6222 but cannot move forward or backward along the first hole groove 6222.

[0062] For example, when the adjustment rod 660 rotates forward relative to the fixing portion 640, the adjustment rod 660 moves toward the second sub-hollow area 242, and the adjustment rod 660 simultaneously drives the clamping portion 620 to move away from the second sub-hollow area 242. When the adjustment rod 660 rotates backward relative to the fixing portion 640, the adjustment rod 660 moves away from the second sub-hollow area 242, and the adjustment rod 660 simultaneously drives the clamping portion 620 to move away from the second sub-hollow area 242.

[0063] See also Figure 3 and Figure 5, the pump source packaging tooling includes a third base 8, the third base 8 is located on the side of the first base 2 facing away from the boss 224, and the third base 8 is located on the side of the cooling plate 440 facing the first base 2; the third base 8 is fixed to the cooling plate 440; the third base 8 includes a second main body 820 and a second hollow area 840; the second main body 820 is made of heat-resistant and heat-insulating material; the second main body 820 encloses a second hollow area 840; the second hollow area 840 is used to accommodate the heat sink layer 420 passing through, To limit the heat sink layer 420 within the second hollow area 840; a sink groove 225 is provided on the side of the second main body 820 facing the first main body 220 to limit the first main body 220 within the sink groove 225; the projection area of ​​the first base 2 on the cooling plate 440 is located within the projection area of ​​the third base 8 on the cooling plate 440, to protect the operator from being burned by the first main body 220 and the heat sink layer 420 and to protect the peripheral electronic devices from being damaged by the heat of the first main body 220 and the heat sink layer 420.

[0064] The second main body 820 includes a second wall 223, which encloses a second hollow area 840. The opening of the second hollow area 840 is larger than the cross-sectional area of ​​the heat sink layer 420. When the heat sink layer 420 is disposed in the second hollow area 840, the side of the heat sink layer 420 facing the second wall 223 is spaced apart from the second wall 223, thereby preventing heat from the heat sink layer 420 from being directly transferred to the second main body 820. The second main body 820 may be made of bakelite.

[0065] The first main body 220 is a metal heat conductor; the heat sink layer 420 is a metal heat conductor; the cooling plate 440 is a metal heat conductor;

[0066] The heat sink layer 420 is made of copper or aluminum alloy. The first main body 220 is made of copper or aluminum alloy. The cooling plate 440 is made of copper or aluminum alloy.

[0067] An embodiment of the present application also provides a pump source packaging device.

[0068] See also Figure 10 The pump source packaging device includes a pump source packaging tool and a cooling fluid supply module 5.

[0069] The cooling fluid supply module 5 is used to provide cooling fluid to the refrigeration plate 440 .

[0070] See also Figure 10The cooling fluid supply module 5 is a water cooler, and the cooling fluid is cooling water, which is provided by the water cooler; the inlet end 4412 is connected to the water outlet end 520 of the water cooler through a pipe 560, so as to provide cooling water cooled by the water cooler to the channel 441, and the outlet end 4414 is connected to the water inlet end 540 of the water cooler through a pipe 560; so as to recover the cooling water that has absorbed the heat of the refrigeration plate 440 from the channel 441 to the water cooler for cooling.

[0071] In some embodiments, the cooling fluid supply module 5 may also be a liquid nitrogen circulation cooling system, in which the cooling fluid is liquid nitrogen. The liquid nitrogen circulation cooling system is used to provide liquid nitrogen to the refrigeration plate 440 .

[0072] An embodiment of the present application also provides a pump source packaging method.

[0073] Provide a pump source 3 of the first structure, see Figure 2 The pump source 3 of the first structure includes a semiconductor laser module 340, a pump source base 320 and a pump source housing 360. A welding layer has not yet been formed between the semiconductor laser module 340 and the pump base, and between the pump base and the pump source housing 360.

[0074] Solder is placed on the contact interface between the semiconductor laser module 340 and the pump source base 320 , and solder is placed on the contact interface between the pump source base 320 and the pump source housing 360 , to form a pump source 3 of the second structure;

[0075] supply Figure 10 The pump source packaging device shown engages the pump source 3 of the second structure in the first hollow area 240 to supply power to the electric heating structure; when the solder is melted by heat to form a molten welding layer, the power supply to the electric heating structure is stopped, and at the same time, power is supplied to the semiconductor cooling plate 460 and cooling water is continuously introduced into the channel 441 of the cooling plate 440; when the welding layer is rapidly cooled from the molten state to the solidified state, the welding packaging of the pump source 3 is completed.

[0076] The above is a detailed introduction to the pump source packaging tooling, device and packaging method provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A pump source packaging tool, characterized in that: include: A first base, comprising a first main body and a first hollow area, wherein the first main body encloses and forms the first hollow area; The first hollow area is used to accommodate the pump source housing; and a second base, the second base comprising a heat sink layer; the heat sink layer being capable of being inserted into the first hollow area and connected to the pump source housing; The first main body is connected to a heat source, and the heat of the heat source is conducted to the pump source housing through the first main body. The heat absorbed by the pump source housing is used to melt the solder and form a molten solder layer at the interface of the pump source to be soldered. The heat sink layer is directly or indirectly connected to a cold source, and the heat of the pump source housing can be conducted to the cold source through the heat sink layer, so as to quickly cool the solder layer from a molten state to a solidified state to complete the welding package of the pump source. The pump source housing includes a pump source housing bottom wall and a pump source housing side wall; the pump source housing side wall is arranged perpendicular to the pump source housing bottom wall, and the pump source housing side wall and the pump source housing bottom wall enclose a receiving cavity; the pump source housing bottom wall includes a bottom wall inner wall and a bottom wall outer edge connected to each other, the bottom wall inner wall is located inside the receiving cavity; the bottom wall outer edge is located outside the receiving cavity; The first hollow area includes a first sub-hollow area and a second sub-hollow area that are connected to each other; the first main body includes a first wall surface, and the first wall surface encloses the first sub-hollow area; the opening size of the first sub-hollow area is larger than the cross-sectional area of ​​the heat sink layer, so that when the heat sink layer is arranged in the first sub-hollow area, the side of the heat sink layer facing the first wall surface is spaced apart from the first wall surface, thereby preventing heat from the first main body from being directly transferred to the heat sink layer; The first main body also includes at least two second walls, which enclose the second sub-hollow area. When the pump source housing is set in the second sub-hollow area, the at least two second walls are connected to the bottom wall of the pump source housing, so that the bottom wall of the pump source housing is engaged between the at least two second walls, thereby enabling the pump source housing to be engaged in the second sub-hollow area and enabling the side of the heat sink layer facing the pump source housing to be connected to the side of the bottom wall of the pump source housing facing the heat sink layer, so as to conduct heat from the pump source housing through the heat sink layer.

2. The pump source packaging tool according to claim 1, characterized in that: The second base includes a cooling plate; the cooling plate is directly or indirectly connected to the heat sink layer so as to conduct heat from the heat sink layer to the cooling plate; The cooling plate is provided with a channel, and the cooling plate cools by introducing the cold source into the channel; the cooling plate is provided with an inlet end and an outlet end, and the channel is formed between the inlet end and the outlet end; the cold source is a cooling fluid; the cold source flows into the channel from the inlet end and flows out of the channel from the outlet end; The cold source enters the inlet end and exchanges heat with the refrigeration plate in the process of flowing in the channel to absorb the heat of the refrigeration plate. The cold source flows out from the outlet end to take away the heat of the refrigeration plate.

3. The pump source packaging tool according to claim 2, characterized in that: The second base includes a semiconductor refrigeration plate, which includes a hot end side wall and a cold end side wall; the cold end side wall is connected to the heat sink layer, and the hot end side wall is connected to the refrigeration plate; when the semiconductor refrigeration plate is powered on, the cold end side wall absorbs the heat of the heat sink layer, and the hot end side wall conducts the heat to the refrigeration plate; the heat conduction efficiency is improved by the semiconductor refrigeration plate to quickly cool the heat sink layer.

4. The pump source packaging tool according to claim 3, characterized in that: It includes an electric heating structure, which generates the heat source when powered on; the electric heating structure is columnar; the first main body is a metal heat conductor; The first main body is provided with a slot for accommodating the insertion of the electric heating structure; When the electric heating structure is inserted into the slot body, the outer wall of the electric heating structure contacts the inner wall of the slot body; when the electric heating structure is inserted into the slot body and the electric heating structure is energized, the electric heating structure generates heat, and the heat is conducted to the first main body through the outer wall of the electric heating structure and the inner wall of the slot body, and then conducted to the pump source housing through the first main body.

5. The pump source packaging tool according to claim 4, characterized in that: Comprising a thermocouple structure; the thermocouple structure is columnar; The first main body is provided with a slot for accommodating the insertion of a thermocouple structure. The thermocouple structure is used to monitor the temperature of the first main body when powered on, so as to facilitate the temperature control of the first main body.

6. The pump source packaging tool according to any one of claims 1 to 5, characterized in that: including a clamping assembly; The first main body includes a boss structure, the second wall surface is formed on the boss structure, the boss structure corresponds to the second wall surface one-to-one, and the boss structure encloses the second sub-hollow area; a recess is formed between each two adjacent boss structures; The clamping assembly is arranged in the sink groove, and the clamping assembly can be engaged with the outer edge of the bottom wall to limit the pump source housing to the second sub-hollow area, so that the connection between the second wall surface and the bottom wall of the pump source housing is more stable, and the connection between the side of the heat sink layer facing the pump source housing and the side of the bottom wall of the pump source housing facing the heat sink layer is more stable, so as to ensure the stability of heat conduction.

7. The pump source packaging tool according to claim 6, characterized in that: The clamping assembly includes a clamping portion, a fixing portion, and an adjusting rod, wherein the adjusting rod is rotatably connected to the clamping portion, and the adjusting rod is threadedly connected to the fixing portion; the fixing portion is fixedly connected to the bottom of the sink; The clamping portion includes a clamping end, and the clamping end includes a horizontal wall surface and a vertical wall surface that are perpendicular to each other, the horizontal wall surface and the vertical wall surface forming a right-angle space, the horizontal wall surface is arranged toward the first base, and the vertical wall surface is arranged toward the second sub-hollow area; the surface of the outer edge of the bottom wall facing away from the second sub-hollow area is defined as a first surface, and the surface of the outer edge of the bottom wall that is perpendicular to the first surface is defined as a second surface; when the outer edge of the bottom wall extends into the right-angle space, the horizontal wall surface is in contact with the first surface of the outer edge of the bottom wall, and the vertical wall surface is in contact with the second surface of the outer edge of the bottom wall, so that the first surface limit is located on the side of the horizontal wall surface facing the first base, and the second surface limit is located on the side of the vertical wall surface facing the second sub-hollow area; When the adjusting rod moves relative to the fixing portion toward the direction approaching the second sub-hollow area, the adjusting rod simultaneously drives the clamping portion to move toward the second sub-hollow area, so that the outer edge of the bottom wall can extend into the right-angle space, so that the clamping portion and the outer edge of the bottom wall are engaged and connected; when the adjusting rod moves relative to the fixing portion toward the direction away from the second sub-hollow area, the adjusting rod simultaneously drives the clamping portion to move toward the direction away from the second sub-hollow area, so that the outer edge of the bottom wall can exit the right-angle space, so that the clamping portion and the outer edge of the bottom wall are released from the engagement connection.

8. The pump source packaging tool according to claim 7, characterized in that: The clamping assembly further includes a limit pin; the clamping portion further includes a connecting end connected to the clamping end; the connecting end is provided with a first hole slot and a second hole slot, the first hole slot is used to accommodate the adjustment rod passing therethrough; the second hole slot is perpendicular to the first hole slot and communicates with the first hole slot, and the second hole slot is used to accommodate the limit pin; The adjusting rod is provided with a limiting groove, which is annular and arranged around the outer periphery of the adjusting rod; the limiting groove is arranged opposite to the second hole groove; Wherein, when the adjusting rod is installed on the clamping part, the adjusting rod is arranged in the first hole groove, the limit pin is arranged in the second hole groove, the limit pin is engaged in the limit groove, and the adjusting rod can rotate in the first hole groove but cannot move forward or backward along the first hole groove.

9. The pump source packaging tool according to claim 8, characterized in that: The third base is located on the side of the first base facing away from the boss, and the third base is located on the side of the cooling plate facing the first base; the third base is fixed to the cooling plate; the third base includes a second main body and a second hollow area; The second main body is made of heat-resistant and heat-insulating material; The second main body portion encloses to form the second hollow area; the second hollow area is used to accommodate the heat sink layer to pass through, so as to confine the heat sink layer in the second hollow area; A sink groove is provided on the side of the second main body facing the first main body, so as to confine the first main body in the sink groove; the first base is located in the projection area of ​​the cooling plate, and the third base is located in the projection area of ​​the cooling plate, so as to protect the operator from being burned by the first main body and the heat sink layer, and protect the peripheral electronic devices from being damaged by the heat of the first main body and the heat sink layer.

10. The pump source packaging tool according to claim 9, characterized in that: The first main body, the heat sink layer, and the cooling plate are all metal heat conductors.

11. A pump source packaging device, characterized in that: include: The pump source packaging tool according to any one of claims 2 to 10; and a cooling fluid supply module; The cooling fluid supply module is used to provide cooling fluid to the refrigeration plate.

12. The pump source packaging device according to claim 11, characterized in that: The cooling fluid supply module is a water cooler, and the cooling fluid is cooling water, which is provided by the water cooler; the inlet end is connected to the water outlet end of the water cooler through a pipe, so as to provide the cooling water cooled by the water cooler to the channel, and the outlet end is connected to the water inlet end of the water cooler through a pipe; so as to recover the cooling water that has absorbed the heat of the refrigeration plate from the channel to the water cooler for cooling.

13. A pump source packaging method, characterized in that: include: A pump source of a first structure is provided, wherein the pump source of the first structure comprises a semiconductor laser module, a pump source base, and a pump source housing, wherein no welding layer is formed between the semiconductor laser module and the pump source base, and between the pump source base and the pump source housing; placing solder on the contact interface between the semiconductor laser module and the pump source base, and placing solder on the contact interface between the pump source base and the pump source housing to form a pump source of the second structure; A pump source packaging device according to claim 12 is provided, wherein the pump source of the second structure is engaged with the first hollow area, and power is supplied to the electric heating structure; when the solder is melted by heat to form a molten welding layer, power is stopped to the electric heating structure, and at the same time, power is supplied to the semiconductor refrigeration plate and cooling water is continuously supplied to the channel of the refrigeration plate; when the welding layer is rapidly cooled from a molten state to a solidified state, the welding packaging of the pump source is completed.

Images