Coil assembly

Abstract

This disclosure provides a coil assembly comprising: a body; a coil portion disposed in the body and having a first lead and a second lead spaced apart from each other and exposed on at least one surface of the body; a first external electrode and a second external electrode disposed on the at least one surface of the body and spaced apart from each other, and respectively connected to the first lead and the second lead; a dielectric layer disposed on the surface of the body; and a third external electrode disposed on the surface of the body on which the dielectric layer is disposed and spaced apart from each of the first external electrode and the second external electrode, and the third external electrode covering the dielectric layer.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2020-0062333, filed May 25, 2020, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The disclosure relates to a coil assembly. BACKGROUND

[0003] An inductor, a kind of coil assembly, is a typical passive electronic component used together with a resistor and a capacitor in an electronic device.

[0004] As electronic devices gradually become high-performance and smaller, the number of electronic components used in such electronic devices can increase, electronic components can be miniaturized, and the operating frequency of electronic components can increase.

[0005] For these reasons, the likelihood of problems arising due to relatively high frequency noise of a coil assembly increases. SUMMARY

[0006] An aspect of the disclosure is to provide a coil assembly capable of easily removing high frequency noise.

[0007] According to an aspect of the disclosure, a coil assembly includes a main body, a coil part disposed in the main body and having a first lead-out part and a second lead-out part exposed from at least one surface of the main body and spaced apart from each other, first and second outer electrodes disposed on the at least one surface of the main body and spaced apart from each other and connected to the first and second lead-out parts, respectively, a dielectric layer disposed on a surface of the main body, and a third outer electrode disposed on the surface of the main body on which the dielectric layer is disposed and spaced apart from each of the first and second outer electrodes and covering the dielectric layer.

[0008] According to another aspect of the disclosure, a coil assembly includes a main body, a coil part disposed in the main body and including a coil having a plurality of turns disposed adjacent to each other on a plane, first and second outer electrodes disposed on at least one surface of the main body and connected to both end portions of the coil, an insulating layer disposed on a surface of the main body intersecting the plane and having a different composition from the main body, and a third outer electrode disposed on the insulating layer so as not to be overlapped with the first and second outer electrodes.

[0009] According to still another aspect of the present disclosure, a coil assembly includes a main body, a coil portion including a coil disposed in the main body, first and second outer electrodes disposed on at least one surface of the main body, a dielectric layer disposed on at least one surface of the main body and not in contact with the first and second outer electrodes, and a third outer electrode disposed on the dielectric layer and not in contact with the first and second outer electrodes. BRIEF DESCRIPTION OF DRAWINGS

[0010] The above and other aspects, features, and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0011] Figure 1 is a view schematically illustrating a coil assembly according to a first embodiment of the present disclosure.

[0012] Figure 2 is a view illustrating a cross section taken along a line I-I' of Figure 1 .

[0013] Figure 3 is a view illustrating a cross section taken along a line II-II' of Figure 1 .

[0014] Figure 4 is a view schematically illustrating a coil assembly according to a first embodiment of the present disclosure as viewed from a lower side of Figure 1 .

[0015] Figure 5 is a view schematically illustrating a first modified example of the first embodiment of the present disclosure as viewed from a lower side of Figure 1 .

[0016] Figure 6 and Figure 7 are views schematically illustrating a second modified example of the first embodiment of the present disclosure, and illustrate views corresponding to the views of Figure 3 and Figure 4 , respectively.

[0017] Figure 8 is a view schematically illustrating a coil assembly according to a second embodiment of the present disclosure.

[0018] Figure 9 is a view illustrating an exploded portion of a coil assembly according to the second embodiment of the present disclosure.

[0019] Figure 10 is a view illustrating a cross section taken along a line III-III' of Figure 8 .

[0020] Figure 11is a view schematically showing a coil assembly according to a third embodiment of the present disclosure.

[0021] Figure 12 is a view showing an exploded portion of the coil assembly according to the third embodiment of the present disclosure.

[0022] Figure 13 is a view showing a cross section taken along Figure 11 line IV-IV' of FIG. 4.

[0023] Figure 14 is a view schematically showing a coil assembly according to a fourth embodiment of the present disclosure.

[0024] Figure 15 is a view schematically showing Figure 14 the coil assembly shown in FIG. 5 when viewed from above.

[0025] Figure 16 is a view showing a cross section taken along Figure 14 line V-V' of FIG. 6. DETAILED DESCRIPTION

[0026] The terms used in the description of the present disclosure are used to describe specific embodiments and are not intended to limit the present disclosure. Unless otherwise specified, the singular forms include the plural forms. The terms "include", "comprise", "be constructed to" and the like in the description of the present disclosure are used to indicate the presence of features, numbers, steps, operations, elements, components, or combinations thereof, and do not exclude the possibility of adding one or more additional features, numbers, steps, operations, elements, components, or combinations thereof. In addition, the terms "disposed on", "located on" and the like can indicate that an element is located on an object or below the object, and do not necessarily mean that the element is located above the object with respect to the direction of gravity.

[0027] The terms "coupled to", "combined to" and the like can not only indicate that elements are in direct and physical contact with each other, but also include a configuration in which another element is interposed between the elements such that the elements are also in contact with the other element.

[0028] For ease of description, the sizes and thicknesses of the elements shown in the drawings are indicated as examples, and the present disclosure is not limited thereto.

[0029] In the drawings, the X direction is a first direction or a length direction of the body, the Y direction is a second direction or a width direction of the body, and the Z direction is a third direction or a thickness direction of the body.

[0030] Hereinafter, a coil assembly according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings. Referring to the drawings, the same or corresponding components can be denoted by the same reference numerals, and repetitive descriptions will be omitted.

[0031] In electronic devices, various types of electronic components can be used, and various types of coil assemblies can be used between electronic components to remove noise or for other purposes.

[0032] In other words, in electronic devices, coil assemblies can be used as power inductors, high-frequency (HF) inductors, ordinary ferrite beads, high-frequency (GHz) ferrite beads, common-mode filters, etc.

[0033] First embodiment & modification examples

[0034] Figure 1 This is a schematic diagram illustrating a coil assembly according to a first embodiment of the present disclosure. Figure 2 It shows along Figure 1 A diagram showing the cross section intercepted by line I-I'. Figure 3 It shows along Figure 1 A diagram showing the cross section taken from line II-II'. Figure 4 This schematically illustrates a coil assembly according to a first embodiment of the present disclosure in the form of... Figure 1 A diagram showing the lower part of the structure when viewed.

[0035] Reference Figures 1 to 4 According to the first embodiment of the present disclosure, the coil assembly 1000 may include a main body 100, a support substrate 200, a coil portion 300, a dielectric layer 400, a first external electrode 510, a second external electrode 520, and a third external electrode 530.

[0036] The main body 100 can be formed into the shape of the coil assembly 1000 according to this embodiment, and the coil portion 300 can be embedded therein.

[0037] The main body 100 can be generally formed into a hexahedral shape.

[0038] Reference Figure 1 The main body 100 may include a first surface 101 and a second surface 102 opposite to each other in the longitudinal direction X of the main body 100, a third surface 103 and a fourth surface 104 opposite to each other in the width direction Y of the main body 100, and a fifth surface 105 and a sixth surface 106 opposite to each other in the thickness direction Z of the main body 100. Each of the first surface 101, the second surface 102, the third surface 103, and the fourth surface 104 of the main body 100 may correspond to the wall surface of the main body 100 that connects the fifth surface 105 and the sixth surface 106 of the main body 100. In the following, the two / opposite end surfaces of the main body 100 may refer to the first surface 101 and the second surface 102 of the main body 100, and the two / opposite side surfaces of the main body 100 may refer to the third surface 103 and the fourth surface 104 of the main body 100. In addition, one surface and the other surface of the main body 100 may refer to the sixth surface 106 and the fifth surface 105 of the main body 100, respectively.

[0039] For example, the body 100 can be formed such that the coil assembly 1000 according to this embodiment in which the first external electrode 510, the second external electrode 520, and the third external electrode 530 to be described later are formed has a length of 2.0 mm, a width of 1.2 mm, and a thickness of 0.65 mm, but is not limited thereto. Since the above values are merely illustrative design values that do not reflect process errors and the like, components having dimensions different therefrom should be considered to fall within the scope of the present disclosure to the extent that the difference falls within the range of process errors. Note that the present disclosure also encompasses components having dimensions different from the above-described dimensions.

[0040] The length, width, and thickness of the above-described coil assembly 1000 can be measured by a micrometer measurement method. The micrometer measurement method can be performed by setting a zero point with a micrometer (an apparatus) having a Gage R&R technique (i.e., a metrology repeatability and reproducibility technique), inserting the coil assembly 1000 between the tips of the micrometer, and rotating the measuring rod of the micrometer. In measuring the length of the coil assembly 1000 by the micrometer measurement method, the length of the coil assembly 1000 can refer to the value of one measurement, or can refer to the arithmetic mean of a plurality of values measured a different number of times or at different positions. This can be equally applied to the width and thickness of the coil assembly 1000.

[0041] The length, width, and thickness of the above-described coil assembly 1000 can be measured by a cross-sectional analysis method. As an example, a method of measuring the length of the coil assembly 1000 by the cross-sectional analysis method will be described. Based on an image of a cross-section (a cross-section extending along the length direction X and the thickness direction Z) passing through the central portion of the body 100 in the width direction Y, captured by an optical microscope or a scanning electron microscope (SEM), the length of the coil assembly 1000 can refer to the maximum value among the lengths of a plurality of line segments parallel to the length direction X of the body 100 and connecting the outermost boundary lines of the coil assembly 1000, as shown in the captured image. Alternatively, the length of the coil assembly 1000 can refer to the minimum value among the lengths of a plurality of line segments parallel to the length direction X of the body 100 and connecting the outermost boundary lines of the coil assembly 1000, as shown in the captured image. Alternatively, the length of the coil assembly 1000 can refer to the arithmetic mean of three or more lengths of a plurality of line segments parallel to the length direction X of the body 100 and connecting the outermost boundary lines of the coil assembly 1000, as shown in the captured image. This measurement method can be equally applied to the width and thickness of the coil assembly 1000.

[0042] The main body 100 can include a magnetic material and a resin. Specifically, the main body 100 can be formed by stacking one or more magnetic composite sheets including a resin and a magnetic material dispersed in the resin. The main body 100 can have a structure other than the structure in which the magnetic material is dispersed in the resin. For example, the main body 100 can be made of a magnetic material such as ferrite.

[0043] The magnetic material can be ferrite powder particles or metal magnetic powder particles.

[0044] Examples of the ferrite powder particles can include one or more of spinel-type ferrite such as Mg-Zn-based ferrite, Mn-Zn-based ferrite, Mn-Mg-based ferrite, Cu-Zn-based ferrite, Mg-Mn-Sr-based ferrite, Ni-Zn-based ferrite, etc., hexagonal ferrite such as Ba-Zn-based ferrite, Ba-Mg-based ferrite, Ba-Ni-based ferrite, Ba-Co-based ferrite, Ba-Ni-Co-based ferrite, etc., garnet-type ferrite such as Y-based ferrite, etc., and Li-based ferrite.

[0045] The metal magnetic powder particles can include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metal magnetic powder particles can be one or more of pure iron powder, Fe-Si-based alloy powder, Fe-Si-Al-based alloy powder, Fe-Ni-based alloy powder, Fe-Ni-Mo-based alloy powder, Fe-Ni-Mo-Cu-based alloy powder, Fe-Co-based alloy powder, Fe-Ni-Co-based alloy powder, Fe-Cr-based alloy powder, Fe-Cr-Si-based alloy powder, Fe-Si-Cu-Nb-based alloy powder, Fe-Ni-Cr-based alloy powder, and Fe-Cr-Al-based alloy powder.

[0046] The metal magnetic powder particles can be amorphous or crystalline. For example, the metal magnetic powder particles can be Fe-Si-B-Cr-based amorphous alloy powder particles, but are not limited thereto.

[0047] The ferrite powder particles and the metal magnetic powder particles can each have an average diameter of about 0.1 µm to 30 µm, but are not limited thereto. In this case, the average diameter can refer to a particle size distribution represented by D50 or D90.

[0048] The main body 100 can include two or more types of magnetic materials dispersed in the resin. In this case, the term "different types of magnetic materials" means that the magnetic materials dispersed in the resin are distinguished from each other by average diameter, composition, crystallinity, and shape.

[0049] The resin can include an epoxy resin, a polyimide, a liquid crystal polymer, etc., in a single form or a combined form, but is not limited thereto.

[0050] The main body 100 can include a core 110 that penetrates a central portion of each of the support substrate 200 and the coil part 300, which will be described later. The core 110 can be formed by filling a through-hole of the coil part 300 with a magnetic composite sheet, but is not limited thereto.

[0051] The support substrate 200 can be embedded in the main body 100. The support substrate 200 can support the coil part 300, which will be described later.

[0052] The support substrate 200 can be formed with an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or can be formed with an insulating material in which a reinforcing material such as a glass fiber or an inorganic filler is impregnated with an insulating resin. For example, the support substrate 200 can be formed with a material such as a prepreg, an ABF, FR-4, a BT resin, a PID, a CCL, etc., but is not limited thereto.

[0053] One or more selected from the group consisting of silicon dioxide (SiO2), aluminum oxide (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc powder, slurry, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used as an inorganic filler.

[0054] When the support substrate 200 is formed with an insulating material including a reinforcing material, the support substrate 200 can provide better rigidity. When the support substrate 200 is formed with an insulating material that does not contain a glass fiber, the support substrate 200 can be advantageous in reducing the thickness of the entire coil part 300. When the support substrate 200 is formed with an insulating material including a photosensitive insulating resin, the number of process steps for forming the coil part 300 can be reduced. Accordingly, it can be advantageous in reducing production costs, and a fine via hole can be formed.

[0055] The coil part 300 can be embedded in the main body 100, and can exhibit the characteristics of a coil assembly. For example, when the coil assembly 1000 of this embodiment is used as a power inductor, the coil part 300 can function to stabilize the power supply of an electronic device by storing an electric field as a magnetic field and maintaining an output voltage.

[0056] The coil part 300 can be disposed in the main body 100, and the first lead-out part 331 and the second lead-out part 332 can be exposed from a surface of the main body 100 and spaced apart from each other. Specifically, the coil part 300 applied to this embodiment can include a first coil pattern 311 and a second coil pattern 312 formed on opposite surfaces of the support substrate 200 opposite each other in the thickness direction Z of the main body 100, a via 320 penetrating the support substrate 200 to connect the first coil pattern 311 and the second coil pattern 312 to each other, and a first lead-out part 331 and a second lead-out part 332 connected to the first coil pattern 311 and the second coil pattern 312, respectively, and exposed from the first surface 101 and the second surface 102 of the main body 100, respectively.

[0057] Each of the first coil pattern 311 and the second coil pattern 312 can be in the form of having a planar spiral shape formed at least one turn around the core 110. For example, based on the direction of Figure 2 and Figure 3 , the first coil pattern 311 can be formed at least one turn around the core 110 on the lower surface of the support substrate 200, and the second coil pattern 312 can be formed at least one turn around the core 110 on the upper surface of the support substrate 200.

[0058] The first lead-out part 331 can connect the first coil pattern 331 and the first outer electrode 510 which will be described later, and the second lead-out part 332 can connect the second coil pattern 332 and the second outer electrode 520 which will be described later. For example, the first lead-out part 331 can extend from the first coil pattern 311 to be exposed from the first surface 101 of the main body 100, and the second lead-out part 332 can extend from the second coil pattern 312 to be exposed from the second surface 102 of the main body 100. As will be described later, since the first outer electrode 510 and the second outer electrode 520 can be formed on the first surface 101 and the second surface 102 of the main body 100, respectively, the first lead-out part 331 can be in contact with and connected to the first outer electrode 510, and the second lead-out part 332 can be in contact with and connected to the second outer electrode 520.

[0059] The coil pattern 311 and the lead-out part 331 can be integrally formed with each other, and the coil pattern 312 and the lead-out part 332 can be integrally formed with each other, such that a boundary therebetween can not be formed. For example, the first coil pattern 311 and the first lead-out part 331 can be simultaneously formed by the same process, such that a boundary in the vertical direction can not be formed. The scope of this embodiment is not limited thereto.

[0060] At least one of the coil patterns 311 and 312, the via 320, and the leads 331 and 332 can include at least one conductive layer. For example, when the second coil pattern 312, the via 320, and the second lead 332 are formed on the other surface of the support substrate 200 by plating, the second coil pattern 312, the via 320, and the second lead 332 can include a seed layer and a plated layer. The seed layer can be formed by a vapor deposition method such as electroless plating, sputtering, or the like. Each of the seed layer and the plated layer can have a single layer structure or a multi-layer structure. The plated layer of the multi-layer structure can be formed with a conformal film structure in which one plated layer is covered by another plated layer, or can have a form in which one plated layer is simply stacked on one surface of another plated layer. The seed layer of the second coil pattern 312, the seed layer of the via 320, and the seed layer of the second lead 332 can be integrally formed with each other, so that a boundary can not occur therebetween, but are not limited thereto. The plated layer of the second coil pattern 312, the plated layer of the via 320, and the plated layer of the second lead 332 can be integrally formed with each other, so that a boundary can not occur therebetween, but are not limited thereto.

[0061] based on the directions of Figure 2 and Figure 3 , the coil patterns 311 and 312 and the leads 331 and 332 can be formed to protrude from the lower and upper surfaces of the support substrate 200, respectively. As another example, based on the directions of Figure 2 and Figure 3 , the first coil pattern 311 and the first lead 331 can be formed to protrude from the lower surface of the support substrate 200, and the second coil pattern 312 and the second lead 332 can be formed to be embedded in the support substrate 200 but can have an upper surface that protrudes from the upper surface of the support substrate 200. In this case, a recess can be formed in the upper surface of the second coil pattern 312 and the second lead 332, so that the upper surface of the support substrate 200 and the upper surface of the second coil pattern 312 and the second lead 332 can not be located on the same plane. As another example, based on the directions of Figure 2 and Figure 3 , the second coil pattern 312 and the second lead 332 can be formed to protrude from the upper surface of the support substrate 200, and the first coil pattern 311 and the first lead 331 can be formed to be embedded in the lower surface of the support substrate 200 but can have a lower surface that protrudes from the lower surface of the support substrate 200. In this case, a recess can be formed in the lower surface of the first coil pattern 311 and the first lead 331, so that the lower surface of the support substrate 200 and the lower surface of the first coil pattern 311 and the first lead 331 can not be located on the same plane. As another example, based on the directions of Figure 2 and Figure 3In the direction when the first coil pattern 311 and the first lead-out part 331 disposed on the lower surface side of the support substrate 200 and the second coil pattern 312 and the second lead-out part 332 disposed on the upper surface side of the support substrate 200 are separately formed and then are collectively stacked on the support substrate 200 to form the coil part 300, the via 320 can include a high-melting-point metal layer and a low-melting-point metal layer having a melting point lower than that of the high-melting-point metal layer. In this case, the low-melting-point metal layer can be formed with a solder containing lead (Pb) and / or tin (Sn). At least a part of the low-melting-point metal layer can be melted due to pressure and temperature during bulk stacking. For this, an intermetallic compound layer (IMC layer) can be formed on at least a part of the boundary between the low-melting-point metal layer and the second coil pattern 312 and the boundary between the low-melting-point metal layer and the high-melting-point metal layer.

[0062] Each of the coil patterns 311 and 312, the via 320, and the lead-out parts 331 and 332 can be formed with a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0063] An insulating film IF can be disposed between each of the coil patterns 311 and 312 and the lead-out parts 331 and 332 and the main body 100. For example, referring to Figure 2 and Figure 3 The insulating film IF can be formed as a conformal film along the surfaces of the coil patterns 311 and 312, the lead-out parts 331 and 332, and the support substrate 200. The insulating film IF can protect each of the coil patterns 311 and 312 and the lead-out parts 331 and 332, can insulate the coil part 300 from the main body 100, and can include a known insulating material such as parylene. Any insulating material can be included in the insulating film IF without particular limitation. The insulating film IF can be formed by vapor deposition or the like, but is not limited thereto, and can be formed by stacking an insulating material such as an ABF on the support substrate 200.

[0064] A dielectric layer 400 can be disposed on the surface of the main body 100. Specifically, the dielectric layer 400 can be disposed between the surface of the main body 100 on which a third external electrode 530 to be described later is disposed and the third external electrode 530. The dielectric layer 400 can be configured to be disposed in an overlapping area (e.g., stacked in the Y direction) between the third external electrode 530 and the coil part 300, so that a capacitive coupling is formed between the third external electrode 530 and the coil part 300. In this embodiment, the dielectric layer 400 can be formed as a plurality of dielectric layers spaced apart from each other, and the plurality of dielectric layers can be disposed on the third surface 103 and the fourth surface 104 of the main body 100, respectively.

[0065] The dielectric layer 400 can have a different composition from the main body 100. Alternatively, the dielectric layer 400 can include a dielectric. Alternatively, the dielectric layer 400 can be formed using a ferroelectric material such as barium titanate (BaTiO3) having a relatively high dielectric constant (ε = ε0ε r ), a composite material in which inorganic fillers are dispersed in an insulating resin, or a composite material composed of an insulating resin. In this case, the inorganic fillers can be ferroelectric powder particles such as barium titanate, but are not limited thereto.

[0066] The dielectric layer 400 can be formed on the surface of the main body 100 in the form of a film using a material for forming a dielectric layer by a film formation method, or can be formed in the form of a paste by printing or spraying a material for forming a dielectric layer on the surface of the main body 100, but is not limited thereto.

[0067] The first and second external electrodes 510 and 520 can be connected to the first and second lead-out portions 331 and 332 of the coil portion 300, respectively. In this embodiment, the first external electrode 510 can be disposed on the first surface 101 of the main body 100 to be in contact with and connected to the first lead-out portion 331 of the coil portion 300 exposed from the first surface 101 of the main body 100, and to extend to a portion of the sixth surface 106 of the main body 100. The second external electrode 520 can be disposed on the second surface 102 of the main body 100 to be in contact with and connected to the second lead-out portion 332 of the coil portion 300 exposed from the second surface 102 of the main body 100, and to extend to a portion of the sixth surface 106 of the main body 100. On the sixth surface 106 of the main body 100, the first and second external electrodes 510 and 520 can be disposed to be spaced apart from each other.

[0068] The third external electrode 530 can be disposed on the surface of the main body 100 and spaced apart from the first external electrode 510 and the second external electrode 520, and can cover the dielectric layer 400. When the coil assembly 1000 according to the embodiment is mounted on a mounting substrate or the like, the third external electrode 530 can be connected to a ground of the mounting substrate, or when the coil assembly 1000 according to the embodiment is packaged in an electronic component package, the third external electrode 530 can be connected to a ground of the electronic component package. The third external electrode 530 can be a ground electrode of the coil assembly 1000 according to the embodiment. In the embodiment, the third external electrode 530 can be disposed as a plurality of third external electrodes spaced apart from each other and formed on the third surface 103 and the fourth surface 104 of the main body 100, respectively, to cover the dielectric layer 400 disposed on the third surface 103 and the fourth surface 104 of the main body 100, respectively. In addition, each of the plurality of third external electrodes 530 can extend to the sixth surface 106 of the main body 100, and can be disposed on the sixth surface 106 of the main body and spaced apart from each other. The third external electrode 530 can cover the dielectric layer 400 and extend beyond the edge of the dielectric layer 400 to contact the surface of the main body 100.

[0069] Each of the first external electrode 510, the second external electrode 520, and the third external electrode 530 can include at least one of a conductive resin layer and a plating layer. The conductive resin layer can be formed by printing a conductive paste on the surface of the main body 100 and curing the printed conductive paste, and the conductive resin layer can include any one or more conductive metals selected from the group consisting of copper (Cu), nickel (Ni), and silver (Ag), and a thermosetting resin. The plating layer can include any one or more selected from the group consisting of nickel (Ni), copper (Cu), and tin (Sn).

[0070] The third external electrode 530 can be capacitively coupled to the coil part 300 through the dielectric layer 400. Specifically, since the third external electrode 530 forms an overlapping area with the coil part 300, and the dielectric layer 400 is disposed between the third external electrode 530 and the coil part 300, the third external electrode 530 and the coil part 300 can form a capacitance. In this embodiment, the dielectric layer 400 and the third external electrode 530 can be formed on the surface of the main body 100, thereby removing high frequency noise in a relatively simple manner. In addition, in this embodiment, since the dielectric layer 400 and the third external electrode 530 can be formed on the third surface 103 and the fourth surface 104 of the main body 100 having a relatively short distance from the surface of the main body 100 to the coil part 300, the capacitive coupling between the third external electrode 530 and the coil part 300 can be further improved. In this case, in designing the coil assembly 1000 according to this embodiment, the term "high frequency noise" can refer to a signal having a frequency exceeding the upper limit of the frequency range set as the operating frequency. As a non-limiting example, in this embodiment, the high frequency noise can refer to a signal greater than or equal to 600 MHz.

[0071] The dielectric layer 400 can have a measured value in the thickness direction Z of the main body 100 that is greater than or equal to a measured value from the lower surface of the first coil pattern 311 to the upper surface of the second coil pattern 312. In addition, the dielectric layer 400 can be disposed on the third surface 103 and the fourth surface 104 of the main body 100, respectively, to cover the overlapping area between the coil part 300 and the third external electrode 530. To this end, the dielectric layer 400 can be disposed in the overlapping area between the coil part 300 and the third external electrode 530 to further improve the capacitive coupling between the coil part 300 and the third external electrode 530.

[0072] Figure 5 is a corresponding view schematically showing a first modification example of the first embodiment of the present disclosure. Figure 4 is a view schematically showing a first modification example of the first embodiment of the present disclosure.

[0073] Referring to Figure 5 In the first modification example, the dielectric layer 400 can be disposed on each of the third surface 103 and the fourth surface 104 of the main body 100 and can be spaced apart from each other, and the third external electrode 530 can be integrally formed on the third surface 103, the fourth surface 104, and the sixth surface 106 of the main body 100. Accordingly, the third external electrode 530 can be formed to extend from the sixth surface 106 of the main body 100 to both ends in the width direction Y of the main body 100. In this case, the third external electrode 530 can be easily formed by a printing method to improve the bonding reliability with the mounting substrate.

[0074] Figure 6 and Figure 7 is a view schematically showing a second modification example of the first embodiment of the present disclosure and corresponds toFigure 3 and Figure 4 the diagram shown in FIG. 2.

[0075] Referring to Figure 6 and Figure 7 In the case of the second modified example, each of the dielectric layer 400 and the third external electrode 530 can be integrally formed in a single form on the third surface 103, the fourth surface 104, and the sixth surface 106 of the main body 100. In this case, each of the dielectric layer 400 and the third external electrode 530 can be easily formed by a printing method, and the capacitive coupling between the coil portion 300 and the third external electrode 530 can also be formed on the sixth surface 106 of the main body 100.

[0076] In the above, it has been described on the assumption that each of the first external electrode 510 and the second external electrode 520 is L-shaped, but the scope of the embodiment is not limited thereto. For example, the shapes of the first external electrode 510 and the second external electrode 520 are not limited, as long as they are disposed on the sixth surface 106 of the main body 100 and spaced apart from each other and from the third external electrode 530. For example, each of the first external electrode 510 and the second external electrode 520 can be modified to have a form disposed only on the sixth surface 106 of the main body 100 (for example, in this case, both of the lead-out portions 331 and 332 of the coil portion 300 are exposed only to the sixth surface 106 of the main body 100), a form disposed on the first surface 101 of the main body 100 and extending to at least a portion of each of the fifth surface 105 and the sixth surface 106 of the main body 100, or a form disposed on the first surface 101 of the main body 100 and extending to at least a portion of each of the third surface 103, the fourth surface 104, the fifth surface 105, and the sixth surface 106 of the main body 100.

[0077] Second embodiment

[0078] Figure 8 is a diagram schematically showing a coil assembly according to a second embodiment of the disclosure. Figure 9 is a diagram showing an exploded portion of a coil assembly according to the second embodiment of the disclosure. Figure 10 is a diagram showing a cross section taken along line III-III' of Figure 8

[0079] Referring to Figures 1 to 4 and Figures 8 to 10 ​When the coil assembly 2000 according to this embodiment is compared with the coil assembly 1000 according to the first embodiment of the disclosure, the coil part 300 can be differently provided. Accordingly, in describing this embodiment, only the coil part 300 different from the first embodiment of the disclosure will be described. The remaining parts of the configuration of this embodiment can be applied as described in the first embodiment of the disclosure.

[0080] Referring to Figures 8 to 10 The coil part 300 applied to the coil assembly 2000 according to this embodiment can further include feeding parts 341 and 342 exposed through the surface of the main body 100 and spaced apart from the first and second lead-out parts 331 and 332. Specifically, the first feeding part 341 can be connected to the first coil pattern 311, can be spaced apart from the first lead-out part 331, and can be exposed through the third surface 103 of the main body 100. The second feeding part 342 can be connected to the second coil pattern 312, can be spaced apart from the second lead-out part 332, and can be exposed through the fourth surface 104 of the main body 100. The dielectric layer 400 can be provided on the exposed surfaces of the feeding parts 341 and 342, respectively, to cover the exposed surfaces of the feeding parts 341 and 342.

[0081] The feeding parts 341 and 342 and the coil patterns 311 and 312 can be formed together in the same process to be integrally formed with each other without forming a boundary, but the scope of this embodiment is not limited thereto.

[0082] In this embodiment, the feeding parts 341 and 342 of the coil part 300 can be formed to have a form extending from the coil patterns 311 and 312 to be exposed through the third and fourth surfaces 103 and 104 of the main body 100, respectively. Accordingly, the distance between the coil part 300 and the third external electrode 530 can be reduced. Accordingly, the capacitive coupling between the coil part 300 and the third external electrode 530 can be improved, and the capacitance formed by the coil part 300, the third external electrode 530, and the dielectric layer 400 can be improved. As a result, the effect of removing high-frequency noise of this embodiment can be improved.

[0083] Although not described in this embodiment, the modification examples described in the first embodiment of the disclosure can be applied to the coil assembly 2000 according to this embodiment.

[0084] Third embodiment

[0085] Figure 11 FIG. 4 is a diagram schematically showing a coil assembly according to a third embodiment of the disclosure. Figure 12 FIG. 5 is a diagram showing an exploded portion of the coil assembly according to the third embodiment of the disclosure. Figure 13 FIG. 6 is a diagram showing a cross-sectional view taken along Figure 11is a view schematically showing a cross section taken along line IV-IV' of FIG. 1A.

[0086] Referring to Figures 8 to 10 and Figures 11 to 13 When the coil assembly 3000 according to this embodiment is compared with the coil assembly 2000 according to the second embodiment of the disclosure, the feed portions 341 and 342 and the conductor film 600 can be differently provided. Thus, in describing this embodiment, only the feed portions 341 and 342 and the conductor film 600 that are different from the second embodiment of the disclosure will be described. The remaining parts of the configuration of this embodiment can be applied as described in the second embodiment of the disclosure.

[0087] Referring to Figures 11 to 13 , the coil assembly 3000 according to this embodiment can further include the conductor film 600 provided between the third and fourth surfaces 103 and 104 of the main body 100 and the dielectric layer 400 and covering the exposed surfaces of the feed portions 341 and 342, respectively. The conductor film 600 can be in contact with and connected to the feed portions 341 and 342, respectively.

[0088] The conductor film 600 can be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), chromium (Cr), or an alloy thereof, but is not limited thereto.

[0089] The dielectric layer 400 can cover the conductor film 600. Since the dielectric layer 400 covers the conductor film 600, short-circuiting between the conductor film 600 and the third external electrode 530 can be prevented.

[0090] Since the conductor film 600 is connected to the coil portion 300, the volume of the feed portions 341 and 342 provided in the main body 100 can be reduced. Thus, the proportion of the magnets in the main body 100 can be relatively increased. In addition, since the conductor film 600 is provided on the surface of the main body 100, the overlapping area thereof formed with respect to the third external electrode 530 can be easily controlled.

[0091] Although not described in this embodiment, the modification examples described in the first embodiment of the disclosure can be applied to the coil assembly 3000 according to this embodiment.

[0092] Fourth embodiment

[0093] Figure 14 is a view schematically showing a coil assembly according to a fourth embodiment of the disclosure. Figure 15 is a view schematically showing Figure 14 is a view schematically showing a coil assembly shown in FIG. 1C when viewed from above. Figure 16 is a view schematically showing a coil assembly shown in FIG. 1C when viewed from above. Figure 14a sectional view of a section taken by a line V-V' of FIG. 7. Also, in Figure 14 the case, the inner insulating layer 800 is omitted to clearly show the arrangement of the coil part 300 and the noise removal part 700.

[0094] Referring to Figures 1 to 4 and Figures 14 to 16 When the coil assembly 4000 according to this embodiment is compared with the coil assembly 1000 according to the first embodiment of the disclosure, the noise removal part 700 and the inner insulating layer 800 can be differently provided. Thus, in describing this embodiment, only the noise removal part 700 and the inner insulating layer 800 different from the first embodiment of the disclosure will be described. The remaining parts of the configuration of this embodiment can be applied as described in the first embodiment of the disclosure.

[0095] Referring to Figures 14 to 16 , the coil assembly 4000 according to this embodiment can further include the noise removal part 700 and the inner insulating layer 800.

[0096] The noise removal part 700 can be provided in the main body 100 to discharge noise transmitted to the assembly and / or noise generated from the assembly to a mounting substrate or the like. Specifically, the noise removal part 700 can include a ring pattern 710 provided in the main body 100 to be spaced apart from the coil part 300 and having opposite ends spaced apart from each other to form an open ring, and a lead-out pattern 720 connected to the ring pattern 710 and the third outer electrode 530. In this embodiment, the noise removal part 700 can be provided on the inner insulating layer 800 which will be described later, and can be provided on the second coil pattern 312 (e.g., provided to be overlaid on the second coil pattern 312 in the thickness direction Z). The noise removal part 700 can be electrically insulated from and capacitively coupled to the coil part 300 by the inner insulating layer 800 and the insulating film IF.

[0097] The ring pattern 710 can have opposite ends spaced apart from each other to form an open ring. For example, the ring pattern 710 can be formed to have a ring shape as a whole corresponding to the shape of the upper surface of the coil part 300, but a slit S can be formed in the ring pattern 710 to form an open ring. The opposite ends of the ring pattern 710 can be separated from each other by the slit S, and the ring pattern 710 can thus form an open ring. In this case, as shown in Figure 14 , "the ring pattern 710 can form an open ring" can mean that the ring pattern 710 can have a shape of a plate-like ring in which a through-hole is formed in a central portion as a whole, but one end and the other end of the ring pattern 710 can be completely spaced apart from each other due to the slit S or the like to form a structure not contacting each other. Alternatively, "the ring pattern 710 can form an open ring" can mean a pattern extending around most of a periphery of a central opening therein but including an interruption or slit therethrough, such that the pattern does not extend around the entire periphery of the central opening. AsFigure 14 and Figure 15 As shown in FIGS. 10A and 10B, as long as the loop pattern 710 satisfies a condition that one end portion and the other end portion are spaced apart from each other to form an open loop, the inner side surface and the outer side surface thereof can be formed as a whole to have a ring shape, an elliptical ring shape, but are not limited thereto. As another example, the loop pattern 710 can be formed to have a ring shape in which the inner side surface is entirely circular and the outer side surface is entirely rectangular.

[0098] The loop pattern 710 can be disposed to correspond to (or to be superposed on the thickness Z direction with) a region in which the coil portion 300 is disposed. As an example, referring to FIG. 10A, the loop pattern 710 can be disposed to correspond to (or to be superposed on the thickness Z direction with) a region in which the second coil pattern 312 is disposed. Figures 14 to 16 As an example, referring to FIG. 10A, the line width of the region of the loop pattern 710 projected onto the third surface 103 side of the main body 100 in the Y direction can have a value similar to the distance between the innermost turn and the outermost turn of the region of the second coil pattern 312 projected onto the third surface 103 side in the Y direction. Since the loop pattern 710 is disposed in a region corresponding to (or superposed on the Z direction with) the coil portion 300, it is possible to minimize the reduction of the magnetic material in the main body 100 while easily removing noise. Therefore, since the reduction of the magnetic material is minimized, it is possible to minimize the deterioration of the characteristics of the assembly.

[0099] The position of the slit S in the loop pattern 710 can be modified. Specifically, referring to FIGS. 10A and 10B, Figure 15 In this case, the distance d2 from one end portion of the loop pattern 710 to the third surface 103 of the main body 100 can refer to the shortest straight line distance d2 in the line width direction of the loop pattern 710 from the center of the side surface of the inner wall forming the slit S of one end portion of the loop pattern 710 to the third surface 103 of the main body 100. Also, the distance d1 from the other end portion of the loop pattern 710 to the fourth surface 104 of the main body 100 can refer to the shortest straight line distance d1 in the line width direction of the loop pattern 710 from the center of the side surface of the inner wall forming the slit S of the other end portion of the loop pattern 710 to the fourth surface 104 of the main body 100. In this case, since the slit S is formed in a region of the loop pattern 710 adjacent to the fourth surface 104 of the main body 100, and the lead-out pattern 720 is exposed from the third surface 103 of the main body 100, it is possible to minimize the path of high-frequency noise transmitted to the lead-out pattern 720 through the loop pattern 710. For example, it is possible to improve the effect of removing high-frequency noise.

[0100] The lead-out pattern 720 can be exposed from the third surface 103 of the main body 100. Since the lead-out pattern 720 is exposed from the third surface 103 of the main body 100, the noise removal portion 700 can be in contact with and connected to the third external electrode 530.

[0101] The noise removal portion 700 can be formed of a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or an alloy thereof, but is not limited thereto. The noise removal portion 700 and the slit S can be formed by a method including at least one of an electroless plating method, an electroplating method, a vapor deposition method such as sputtering, and an etching method, but is not limited thereto.

[0102] The inner insulation layer 800 can be disposed between the coil portion 300 and the noise removal portion 700. For example, as shown in FIG. 8B, the inner insulation layer 800 can be disposed on the second coil pattern 312, and can be disposed between the second coil pattern 312 and the noise removal portion 700. Figure 16

[0103] The inner insulation layer 800 can be formed by stacking an insulation film on a surface of the support substrate 200 on which the coil portion 300 and the insulation film IF are formed. The insulation film can be a conventional non-photosensitive insulation film such as an ABF or a prepreg, or a dry film or a photosensitive insulation film such as a PID. Since the coil portion 300 and the noise removal portion 700 can be capacitively coupled to each other, the inner insulation layer 800 can function as a dielectric layer together with the insulation film IF.

[0104] Although not described in this embodiment, the modification examples described in the first embodiment of the present disclosure can be applied to the coil assembly 4000 according to this embodiment.

[0105] According to the embodiments of the present disclosure, high-frequency noise can be easily removed.

[0106] While example embodiments have been shown and described above, it will be apparent to those skilled in the art that modifications examples can be made without departing from the scope of the present disclosure as defined by the appended claims.​

Claims

1. A coil assembly comprising: a main body; a coil portion provided in the main body and having a first lead-out portion and a second lead-out portion exposed from at least one surface of the main body and spaced apart from each other; first and second outer electrodes provided on the at least one surface of the main body and spaced apart from each other and connected to the first and second lead-out portions, respectively; a dielectric layer provided on a surface of the main body; and a third outer electrode provided on the surface of the main body on which the dielectric layer is provided and spaced apart from each of the first and second outer electrodes, and covering the dielectric layer in a direction in which the first and second outer electrodes face each other with the dielectric layer provided between the third outer electrode and the coil portion. The third outer electrode is in contact with the surface of the main body.

2. The coil assembly of claim 1, wherein, The coil portion further includes a feed portion exposed from the surface of the main body on which the dielectric layer is provided and spaced apart from each of the first and second lead-out portions, 3. The coil assembly of claim 1, wherein, wherein the dielectric layer is provided on an exposed surface of the feed portion. The feed portion includes a plurality of feed portions each spaced apart from the first and second lead-out portions and exposed from different surfaces of the main body and spaced apart from each other, and 4. The coil assembly of claim 3, wherein, the dielectric layer and the third outer electrode include a plurality of dielectric layers and a plurality of third outer electrodes, respectively, provided on exposed surfaces of the plurality of feed portions. At least two of the plurality of third outer electrodes are in contact with each other.

5. The coil assembly of claim 4, wherein, At least two of the plurality of third outer electrodes are not in contact with each other.

6. The coil assembly of claim 4, wherein, 7.The coil assembly of claim 3, further comprising a conductor film provided between the surface of the main body on which the dielectric layer is provided and the dielectric layer and covering the exposed surface of the feed portion. The dielectric layer covers the conductor film.

8. The coil assembly of claim 7, wherein, The feed portion includes a plurality of feed portions each spaced apart from the first and second lead-out portions and exposed from different surfaces of the main body and spaced apart from each other, and 9. The coil assembly of claim 7, wherein, the conductor film, the dielectric layer, and the third outer electrode include a plurality of conductor films, a plurality of dielectric layers, and a plurality of third outer electrodes, respectively, provided on exposed surfaces of the plurality of feed portions. The dielectric layer includes an insulating resin.

10. The coil assembly of claim 1, wherein, The main body has one surface and another surface opposite to each other, two end surfaces connecting the one surface and the another surface of the main body and opposite to each other, and two side surfaces connecting the end surfaces of the main body and opposite to each other, 11. The coil assembly of claim 1, wherein, wherein the first and second outer electrodes are provided on respective ones of the two end surfaces of the main body and connected to the first and second lead-out portions exposed on the respective ones of the two end surfaces of the main body, respectively, and the dielectric layer and the third outer electrode are provided on the two side surfaces of the main body. ​ 12. The coil assembly of claim 1, further comprising: a noise removing portion including a ring pattern having two ends spaced apart from each other to form an open ring and a lead-out pattern connected to the ring pattern and the third external electrode, and disposed in the main body spaced apart from the coil portion; and an inner insulating layer disposed between the coil portion and the noise removing portion.

13. The coil assembly of claim 12, wherein, The two ends of the ring pattern are disposed to be spaced apart from each other by a slit.

14. The coil assembly of claim 13, wherein, The main body has one surface and another surface opposite to each other, two end surfaces connecting the one surface and the another surface of the main body and opposite to each other, and two side surfaces connecting the end surfaces of the main body and opposite to each other, wherein the lead-out pattern is exposed from one side surface among the two side surfaces of the main body and connected to a third external electrode disposed on the one side surface of the main body, and a distance from one end of the ring pattern to the one side surface of the main body is greater than or equal to a distance from the other end of the ring pattern to the other side surface of the main body. 15.A coil assembly comprising: a main body; a coil portion disposed in the main body and including a coil having a plurality of turns disposed adjacent to each other on a plane; first and second external electrodes disposed on at least one surface of the main body and connected to both ends of the coil; an insulating layer disposed on a surface of the main body intersecting the plane and having a different composition from the main body; and a third external electrode disposed on the insulating layer with the insulating layer disposed between the third external electrode and the coil portion, the third external electrode not being superposed with the first and second external electrodes on the surface of the main body.

16. The coil assembly of claim 15, wherein, The coil portion includes a feed portion extending from an outermost turn among the plurality of turns to the surface of the main body on which the insulating layer is provided, and the insulating layer is superposed with the feed portion exposed to the surface of the main body. 17.The coil assembly of claim 16, further comprising a conductor disposed on the surface of the main body on which the insulating layer is provided to be located between the insulating layer and the surface of the main body, and the conductor contacts the feed portion.

18. The coil assembly of claim 15, wherein, The third external electrode contacts the surface of the main body along at least one edge of the insulating layer.

19. The coil assembly of claim 15, wherein, The insulating layer and the third external electrode are disposed only on a portion of the main body on which the first and second external electrodes are not provided.

20. The coil assembly of claim 15, wherein, The insulating layer includes a dielectric.

21. The coil assembly of claim 15, wherein, The plane is orthogonal to a coil axis of the coil. 22.A coil assembly comprising: a main body; a coil portion including a coil disposed in the main body; first and second external electrodes disposed on at least one surface of the main body; a dielectric layer disposed on at least one surface of the main body and not in contact with the first and second external electrodes; and a third outer electrode disposed on the dielectric layer with the dielectric layer disposed between the third outer electrode and the coil portion, and the third outer electrode not in contact with the first outer electrode and the second outer electrode.

23. The coil assembly of claim 22, wherein, the first outer electrode and the second outer electrode are disposed on respective opposite end surfaces of the main body, and the dielectric layer includes at least one dielectric layer disposed on opposite side surfaces of the main body.

24. The coil assembly of claim 22, wherein, the dielectric layer and the third outer electrode are disposed only on portions of the surface of the main body that are free of the first outer electrode and the second outer electrode.

25. The coil assembly of claim 22, wherein, the third outer electrode contacts the surface of the main body along at least one edge of the dielectric layer.

26. The coil assembly of claim 22, wherein, the coil portion extends to a surface of the main body on which the dielectric layer is disposed.

Images