Purge nozzle assembly and semiconductor processing assembly including the same
By designing a mechanical connection mechanism and gasket that allows tilting and significant lateral movement, the problems of particle generation and leakage in existing purge nozzle assemblies during wafer cassette placement are solved, achieving frictionless sealing and improving the reliability of semiconductor processing assemblies.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ASM IP HLDG BV
- Filing Date
- 2021-05-21
- Publication Date
- 2026-07-10
AI Technical Summary
Existing purge nozzle assemblies are prone to generating particles and causing leaks when placing wafer cassettes, and the mechanical connection mechanism cannot adapt to the lateral movement of the wafer cassettes, resulting in friction and slippage, which affects the sealing performance.
A purge nozzle assembly was designed, employing a mechanical coupling mechanism that allows the nozzle body to tilt and move significantly laterally relative to the mounting body. Combined with gaskets and pull elements, it ensures frictionless or slip-free contact between the nozzle contact surface and the wafer cassette, achieving a sealed connection.
It effectively reduces particle release, prevents leakage, adapts to non-horizontal placement of wafer cassettes, and improves sealing and reliability.
Smart Images
Figure CN113725120B_ABST
Abstract
Description
Technical Field
[0001] This disclosure generally relates to a purge nozzle assembly and a semiconductor processing assembly including the purge nozzle assembly. Background Technology
[0002] For certain applications in the semiconductor industry, a system for purging wafer cassettes has been developed, which uses a wafer cassette with a purge port on its bottom. This system requires purge nozzles at certain locations where the wafer cassette is placed. The interface for placing the wafer cassette can be a motion coupling interface that allows the wafer cassette to move to one side during placement on these couplings and / or during placement at an angle. The purge nozzles can be used to insert particulate-free gas into the wafer cassette through its port. JP6519897B2 discloses a purge nozzle assembly. Summary of the Invention
[0003] This summary is provided to present the selected concepts in a simplified form. These concepts are further described in detail in the following detailed description of exemplary embodiments disclosed. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.
[0004] It is recognized that the placement of the purge nozzle against the wafer cassette surface around the purge port should be done in a manner that minimizes particle generation. Typically, a gasket can be installed around the purge port on the wafer cassette and / or purge nozzle assembly, and in this case, a purge nozzle contact surface can be provided. Furthermore, the engagement between the purge nozzle and the purge port should minimize any leakage.
[0005] Therefore, a purge nozzle assembly can be provided. More specifically, a purge nozzle assembly can be provided, which may include:
[0006] - A purge nozzle body, which may include an inlet opening and an outlet opening, wherein the outlet opening may lead to a purge nozzle contact surface;
[0007] - Mounting body for connecting the purge nozzle assembly to the external frame member;
[0008] - A mechanical coupling mechanism that can movably connect the purge nozzle body to the mounting body, and can be configured as follows:
[0009] - Allows the purging nozzle body to tilt relative to the mounting body; and
[0010] - Allows for significant lateral movement of the purge nozzle body relative to the mounting body, wherein the lateral movement has a motion component that is substantially parallel to the contact surface of the purge nozzle.
[0011] This disclosure may also provide a semiconductor processing assembly. More specifically, a semiconductor processing assembly may be provided, which may include at least one wafer cassette support location and at least one wafer cassette. The wafer cassette may include a purge port for supplying purge gas into the interior of the wafer cassette. The semiconductor processing assembly may include a purge nozzle assembly according to this disclosure, which may be positioned relative to the wafer cassette support location such that when the wafer cassette is placed on the wafer cassette support location, during wafer cassette placement, the purge nozzle contact surface engages the wafer cassette around the purge port without substantially any frictional or sliding movement between the purge nozzle contact surface and the wafer cassette.
[0012] Because the mechanical coupling mechanism of the purge nozzle allows for tilting of the purge nozzle body relative to the mounting body and significant lateral movement of the purge nozzle body relative to the mounting body, frictional or sliding motion between the purge nozzle contact surface and the wafer cassette can be minimized. The purge nozzle unit of JP6519897B2 also includes a purge nozzle body, a mounting body, and a mechanical coupling mechanism to movably connect the purge nozzle body to the mounting body and can be configured to allow tilting of the purge nozzle body relative to the mounting body. However, the mechanical coupling mechanism of JP'897 does not allow for significant lateral movement of the purge nozzle body relative to the mounting body, wherein the lateral movement may have a component of motion that is substantially perpendicular to the central axis.
[0013] Using the purge nozzle assembly according to this disclosure, during the placement of the wafer cassette in the cassette support position, once the purge nozzle contacts the wafer cassette around the purge port, the frictional force between the purge nozzle contact surface and the wafer cassette may be greater than the force required to move the purge nozzle body relative to the mount. A gasket may be positioned between the purge nozzle contact surface and the wafer cassette. The gasket may be mounted on the wafer cassette around the purge port. Alternatively, the gasket may be mounted on the purge nozzle contact surface. Because the mechanical coupling mechanism is configured to allow significant lateral movement of the purge nozzle body relative to the mount body, the purge nozzle body can accommodate any lateral movement of the wafer cassette without substantially any slippage or friction between the purge nozzle contact surface and the wafer cassette. Therefore, any possible particle release due to such slippage and friction can be prevented. Because the mechanical coupling mechanism allows tilting, the purge nozzle contact surface can always engage the wafer cassette around the purge port in a sealing manner, even if the wafer cassette is not perfectly horizontal. Therefore, leakage can be prevented even with such a non-horizontal wafer cassette or a non-horizontal gasket located between the purge nozzle contact surface and the wafer cassette surface surrounding the purge port.
[0014] To summarize the invention and its advantages over the prior art, certain objects and advantages of the invention have been described above. It should be understood, of course, that not all of these objects or advantages may necessarily be achieved according to any particular embodiment of the invention. Therefore, for example, those skilled in the art will recognize that the invention may be practiced or performed in a manner that achieves or optimizes one or more advantages as taught or suggested herein, without necessarily achieving other objects or advantages as taught or suggested herein.
[0015] Various embodiments are claimed in the dependent claims, and these embodiments will be further illustrated with reference to the examples shown in the accompanying drawings. These embodiments may be combined or applied separately from each other.
[0016] All of these embodiments are within the scope of the invention disclosed herein. These and other embodiments will become apparent to those skilled in the art from the following detailed description of certain embodiments with reference to the accompanying drawings, and the invention is not limited to any particular embodiment disclosed. Attached Figure Description
[0017] Although this specification concludes with claims, which specifically point out and clearly claim protection for what are considered embodiments of the invention, the advantages of the embodiments of this disclosure can be more readily determined from the description of certain examples of embodiments when read in conjunction with the accompanying drawings, wherein:
[0018] Figure 1 A cross-sectional view of a first example of a purging nozzle is shown;
[0019] Figure 2 It shows Figure 1 The example shown is a perspective sectional view;
[0020] Figure 3 It shows Figure 1 The perspective view shown in the example;
[0021] Figure 4 A cross-sectional view of a second example of a purging nozzle is shown;
[0022] Figure 5 A top view of a third example of a purge nozzle is shown;
[0023] Figure 6 It shows along Figure 5 A sectional view of line VI-VI in the middle;
[0024] Figure 7 A perspective view of the third example is shown;
[0025] Figure 8A A schematic cross-sectional view is shown of the purge nozzle in its initial position and the purge port of the wafer cassette moving downward in a vertical direction;
[0026] Figure 8B It shows the relationship with Figure 8A The same view, with the wafer cassette positioned vertically downwards at its end;
[0027] Figure 9A A schematic cross-sectional view is shown of the purge nozzle in its initial position and the purge port of the wafer cassette moving downward in an inclined direction;
[0028] Figure 9B It shows the relationship with Figure 9A The same view, in which the wafer cassette is positioned downwards along an inclined direction at its end;
[0029] Figure 10A A schematic cross-sectional view is shown of a purge nozzle in its initial position, a purge port of a wafer cassette moving vertically downward, and a wafer cassette with the purge port tilted relative to the horizontal plane.
[0030] Figure 10B The middle position of the wafer cassette is shown, with the gasket surrounding the purge port engaging the purge nozzle body on the right side;
[0031] Figure 10C The end position of the wafer cassette is shown, where the body of the purge nozzle is tilted at the same angle as the wafer cassette, such that the entire contact surface of the purge nozzle contacts the gasket of the purge port;
[0032] Figure 11 It shows something similar to Figure 10C The end position shown indicates that the wafer cassette does not move vertically downwards, but rather along an inclined direction; and
[0033] Figure 12 A schematic cross-sectional view of a semiconductor processing assembly is shown. Detailed Implementation
[0034] In this application, similar or corresponding features are indicated by similar or corresponding reference numerals. The description of various embodiments is not limited to the examples shown in the figures, and the reference numerals used in the detailed description and claims are not intended to limit the description of the embodiments, but are included to illustrate the embodiments.
[0035] Although certain embodiments and examples are disclosed below, those skilled in the art will understand that the invention extends beyond the specific disclosed embodiments and / or uses of the invention and their obvious modifications and equivalents. Therefore, it is intended that the scope of the disclosed invention should not be limited to the specific disclosed embodiments described below. The illustrations given herein are not intended to be actual views of any particular material, structure, or device, but are merely idealized representations used to describe embodiments of this disclosure.
[0036] As used herein, the term “wafer” can refer to any underlying material that can be used, or material on which devices, circuits, or thin films can be formed.
[0037] In its most general sense, this disclosure provides a purge nozzle assembly 10 including a purge nozzle body 12, the purge nozzle body 12 including an inlet opening 14 and an outlet opening 16, wherein the outlet opening 16 leads to a purge nozzle contact surface 18. The purge nozzle contact surface may be substantially perpendicular to the central axis L of the purge nozzle body 12. The purge nozzle assembly may further include a mounting body 20 for connecting the purge nozzle assembly 10 to an external frame member. A mechanical coupling mechanism may movably connect the purge nozzle body 12 to the mounting body 20. Figures 1 to 7 An example of a purge nozzle of this disclosure is shown. The mechanical coupling mechanism may be configured to allow the purge nozzle body 12 to tilt relative to the mounting body 20 and to allow significant lateral movement of the purge nozzle body 12 relative to the mounting body 20. The lateral movement may be defined substantially parallel to the purge nozzle contact surface and / or perpendicular to the central axis L.
[0038] The advantages of the purge nozzle assembly according to this disclosure have been described in the Summary of the Invention section and are incorporated herein by reference.
[0039] In embodiments of the purge nozzle assembly 10, an example is shown in Figure 1-7 As shown, the mechanical coupling mechanism may include at least one spring 22, which may be connected to the purge nozzle body 12 and the mounting body 20. The at least one spring 22 may be configured to bias the purge nozzle body 12 relative to the mounting body 20 in a direction along the central axis L and pointing away from the purge nozzle contact surface 18. In this embodiment, a plurality of pulling elements 24 may be connected to the purge nozzle body 12 and the mounting body 20. The pulling elements 24 may be tensioned by the at least one spring 22 to provide a defined initial position of the purge nozzle body 12 relative to the mounting body 20. The at least one spring 22 may be pre-stretched in the defined initial position. This pre-stretching may generate a sufficiently large force between the purge nozzle body 12 and the wafer cassette 104 or gasket 108 to obtain a proper seal between the purge nozzle body 12 and the wafer cassette 104 or gasket 108.
[0040] With the aid of the pulling element 24, a significant lateral movement M3 of the blow nozzle body 12 relative to the mounting body 20 is permitted. This lateral movement has a component of motion that is substantially perpendicular to the central axis (L), such as... Figure 9A , 9B Arrow M3 in 11 is clearly shown. Especially when the wafer cassette 104 is placed on the motion connector 110 (its example is in...). Figure 12(Illustrated schematically) This lateral movement may occur during the placement of the wafer cassette 104 onto the motion connector 110. By means of the pulling element 24, the purge nozzle body 12 can follow this combined lateral and downward movement of the wafer cassette 104 without any significant friction or sliding movement between the contact surface 18 of the purge nozzle body 12 and the wafer cassette 104 or the washer 108 that may be mounted on the wafer cassette 104. Therefore, particle release during placement of the wafer cassette 104 can be minimized.
[0041] In one embodiment, the length of the pulling element 24 is preferably such that, if the pulling element 24 is still taut and thus acts as a linkage, the circular motion that the purge nozzle body 12 can perform can have a sufficiently large radius, such that the lateral motion that the purge nozzle body 12 can perform can be equal to or greater than the limits defined in SEMI for the permissible lateral motion of the wafer cassette 102 placed on the motion connector 110. Therefore, the purge nozzle body 12 can follow any lateral motion within the limits of wafer cassette lateral motion as defined in SEMI. Typically, the length of each pulling element can be at least 10 mm, and the angle of the pulling element 24 relative to the horizontal plane can be in the range of 25° to 60°.
[0042] In embodiments of the purge nozzle assembly 10, the pulling elements 24 can each apply a pulling force along pulling directions D1, D2. See the example shown in FIG8 for this. The intersection point P of the pulling directions D1, D2 of the plurality of pulling elements 24 can be substantially within the plane defined by the purge nozzle contact surface 18. Due to this configuration, when very small movements are made at the beginning and end of contact with the wafer cassette 104 or the gasket 108 mounted thereon, the intersection point P acts as a “pole” around which the nozzle will rotate.
[0043] In a further description of this embodiment, the intersection point P may be on the central axis L of the purge nozzle body 12.
[0044] In one embodiment, the outlet opening 16 may define an outlet axis that is collinear with the central axis L of the purge nozzle body 12.
[0045] In one embodiment, at least one spring 22 may include at least one push spring 22. Figure 1-3 An example of an embodiment in which at least one spring 22 is a push spring is shown.
[0046] In one embodiment, at least one spring 22 may include at least one pull spring. Figure 4 and Figure 5-7 Two examples of embodiments in which at least one spring is a tension spring are shown.
[0047] In one embodiment, each pulling element 24 may include a cable, rope, or chain. Figure 5-7 An example of an embodiment in which the pulling element 24 includes a rope is shown.
[0048] In one embodiment, each pull element 24 may include a single link that can be slidably and pivotally connected to one of the purge nozzle body 12 and the mounting body 20, and can be at least pivotally and optionally slidably connected to the other of the purge nozzle body 12 and the mounting body 20. Figure 1-3 and Figure 4 Two examples are shown in which each pulling element 24 is implemented as a single link 24. A single link that can be slidably and pivotally connected to one of the purge nozzle body 12 and the mounting body 20 can be considered to have behavior similar to that of a chain with multiple links.
[0049] In embodiments of the purge nozzle assembly 10, at least one pulling element 24 may comprise three pulling elements 24. The three pulling elements 24, spaced more than 120 degrees apart, provide a stable and well-defined initial position of the purge nozzle body 12 relative to the mounting body 20. Furthermore, this rotationally symmetric configuration can provide similar motion behavior during lateral and tilting movements in all directions.
[0050] In an embodiment of the purge nozzle assembly 10, at least one spring 22 may be a single spring. An example of this embodiment is shown in... Figure 1-3 As shown in the image.
[0051] In an embodiment of the purge nozzle assembly 10, at least one spring 22 may be multiple springs, such as three springs. Figure 4 and Figure 5-7 Two examples of this embodiment are shown.
[0052] Preferably, at least one spring 22 applies its force to the blow nozzle body 12 at a sufficiently large distance from the central axis, such that the at least one spring 22 biases the blow nozzle body into a horizontal position. In embodiments where the at least one spring 22 can be a single spring 22, this allows the single spring to have a sufficiently large diameter to produce this leveling effect. A diameter of at least 10 mm may be required. In embodiments where the at least one spring 22 can be multiple springs 22 (e.g., three springs), these springs should be connected to the blow nozzle body 12 with a sufficiently large diameter to produce a leveling effect, for example, a diameter of at least 10 mm.
[0053] In embodiments of the purge nozzle assembly 10, at least one spring 22 may be a helical spring. In all the examples shown in the figures, at least one spring 22 is implemented as a disc spring, also known as a helical spring.
[0054] In an embodiment of the purge nozzle assembly 10, the purge nozzle body 12 may have a circular groove in its circumferential outer surface, and a purge body ring 26 may be installed in the circular groove. At least one pull element 24 may be connected to the purge body ring 26 to establish a connection between the purge nozzle body 12 and the at least one pull element 24. Figure 1-3 and Figure 5-7 An example of this embodiment is shown. An advantage of the purge body ring 26 used to connect at least one pulling element 24 is that the ring thickness can be very small, for example, 1 mm or less. Therefore, the friction between at least one pulling element 24 and the purge body ring 24 can be very small. Thus, these very small frictional forces are negligible and do not impede the movement of the purge nozzle body 12.
[0055] In an embodiment of the purge nozzle assembly 10, the mounting body 20 may have a circular groove in its circumferential inner surface, in which a mounting body ring 28 may be mounted. At least one pull element 24 may be connected to the mounting body ring 28 to establish a connection between the mounting ring 20 and the at least one pull element 24. Like the purge body ring 26, the mounting body ring 28 may have a very small thickness, for example, 1 mm or less. Similarly, the friction between the at least one pull element 24 and the mounting body ring 28 may be very small and negligible, such that it does not impede the movement of the purge nozzle body 12.
[0056] Furthermore, the installation of the pulling element 24 with the purge body ring 26 and the mounting body ring 28 is easy, and the structure is relatively cost-effective.
[0057] In embodiments of the purge nozzle assembly 10, an example is shown in Figure 5-7 As shown, the purge nozzle body 12 may have a second circular groove in its outer circumferential surface, and a second purge body ring 30 may be installed in the second circular groove. At least one spring 22 may be connected to the second purge body ring 30 to establish a connection between the purge nozzle body 12 and the at least one spring 22.
[0058] In embodiments of the purge nozzle assembly 10, an example is shown in Figure 5-7 As shown, the mounting body 20 may have a second circular groove in its circumferential inner surface, and a second mounting body ring 32 may be mounted in the second circular groove. At least one spring 22 may be connected to the second mounting body ring 32 to establish a connection between the mounting body 20 and the at least one spring 22.
[0059] Similar to the purge body ring 26 and mounting body ring 28 used to connect the pulling element 24, and the second purge body ring 30 and second mounting body ring 32 used to connect at least one spring 22, the friction between these rings 30, 32 and at least one spring 22 can be minimal and negligible, so that they do not impede the movement of the purge nozzle body 12. Furthermore, the second rings 30, 32 provide a simple, reliable, and cost-effective solution for connecting at least one spring 22 between the purge nozzle body 12 and the mounting body 20.
[0060] In an embodiment of the purge nozzle assembly 10, the purge nozzle body 12 may be generally cylindrical, and the mounting body 20 may be generally annular and have an annular opening. The diameter of the annular opening may be larger than the outer diameter of the purge nozzle body 12. Figure 1-3 , Figure 4 and Figure 5-7 The examples shown all have this configuration. Due to this configuration, the position and length of the pulling element 24 can be designed such that the degrees of freedom of movement of the blow-off nozzle body 12 can accommodate all movements of the wafer cassette 104 within the limits defined by SEMI.
[0061] In embodiments of the purge nozzle assembly 10, an example is shown in Figure 1-3 As shown, the push spring support frame 34 can be connected to the mounting body 20. The push spring 22 can be biased between the push spring support frame 34 and the purge nozzle body 12. The push spring support frame can be a separate part connected to the mounting body 20, or it can be integrally formed with the mounting body 20.
[0062] In one embodiment, the purge nozzle assembly can be a monolithic component encompassing the compliant system. The monolithic component can be manufactured using 3D printing. The monolithic purge nozzle assembly can be designed to be 3D printable. The advantage of 3D printing a compliant purge nozzle is that the design of the purge nozzle can be simplified. Because it can be a monolithic structure, assembly is not required. Since the purge nozzle assembly can be a single component, it can be easily maintained and more reliable. Compared to multi-part purge nozzles, 3D printed components can reduce costs.
[0063] Further elaboration on 3D printing purge nozzles reveals that multi-material 3D printing can be used for Foup and to meet varying customer requirements.
[0064] Instead of 3D printing, integral parts that include compliant systems can also be manufactured using injection molding, die casting, or similar molding techniques.
[0065] This disclosure also provides a semiconductor processing component 100. Figure 12Examples of all relevant portions of a semiconductor processing assembly 100 are schematically shown. The semiconductor processing assembly 100 may include at least one wafer cassette support location 102 and at least one wafer cassette 104. The wafer cassette may include a purge port 106 for supplying purge gas into the interior of the wafer cassette 104. Optionally, a gasket 108 may be mounted on the wafer cassette 104 and may surround the purge port 106. The semiconductor processing assembly 100 may include a purge nozzle assembly 10 according to the present disclosure, which may be positioned relative to the wafer cassette support location 102 such that when the wafer cassette 104 is placed on the wafer cassette support location 102, a purge nozzle contact surface 18 may engage the wafer cassette 104 during placement of the wafer cassette 104 without substantially any frictional or sliding movement between the purge nozzle contact surface 18 and the wafer cassette 104. Alternatively or in addition to being mounted on the wafer cassette 104, the gasket 108 may also be mounted on the purge nozzle assembly 10.
[0066] Figure 8A A schematic cross-sectional view is shown of a purge nozzle in its initial position and a purge port of a wafer cassette moving downward in the vertical direction indicated by arrow M1. At least one spring 22, not shown in the figure, can apply the force indicated by arrow Fs on the purge nozzle body 12. During placement of the wafer cassette 104, a washer 108 around the purge port 106 can apply the force indicated by arrow Fw on the purge nozzle body 12. Figure 8B A wafer cassette 104 is shown positioned vertically downwards at its end. From Figure 8B It is clear that the pulling element 24 is no longer tensioned, but rather relaxed due to the downward movement of the blow nozzle body. The force Fs applied by at least one spring 22 provides a good seal between the blow nozzle body 12 and the washer 108.
[0067] Figure 9A A schematic cross-sectional view is shown of the purge nozzle in its initial position and the purge port of the wafer cassette moving downwards in the inclined direction indicated by arrow M3. During the downward movement of the wafer cassette 104, the left pull element 24 remains taut, while the right pull element 24 becomes slack, as... Figure 9B Clearly visible in the image. The taut pulling element 24 allows the purge nozzle body 12 to move along arrow M3, including a lateral movement component. Therefore, even when the wafer cassette 104 moves downward in the inclined direction M2, any friction or slippage of the purge nozzle body 12 along the washer 108 is prevented.
[0068] Figure 10A A schematic cross-sectional view is shown of the purge nozzle in its initial position, the purge port of the wafer cassette moving downwards in the vertical direction M1, and the wafer cassette 104 with the purge port 106 in an inclined position relative to the horizontal plane. Note that the pulling element 24 is initially fully tightened ( Figure 10AThen the right-pulling element 24 becomes loose. Figure 10B ), and Figure 10C At the end position shown, both pulling elements 24 are slack. Also note that... Figure 10B In the first contact between the washer 108 and the purge nozzle body 12, the wafer cassette applies a force Fw at this point on the purge nozzle body. The contact surface of the purge nozzle body 12 is not yet parallel to the contact surface of the washer 108. In the next stage, as... Figure 10C As shown, the gasket contact surface and the purge nozzle contact surface 18 are in complete contact, thereby achieving a leak-proof joint. The forces Fs and Fw cancel each other out and provide sufficient compressive force between the purge nozzle contact surface 18 and the gasket contact surface to establish a sufficiently airtight joint.
[0069] Figure 11 It shows the relationship with Figure 10C A similar end position is shown, except that the wafer cassette does not move vertically downwards, but rather moves along the inclined direction M2. In this case, the left pull element 24 remains taut, while the right pull element is slack.
[0070] In embodiments of the semiconductor processing assembly, both the wafer cassette 104 and the wafer cassette support position 102 are positioned relative to each other via a motion connector 110. For this motion connector 110, the end position of the wafer cassette 104 is defined very precisely. Furthermore, when placed on this motion connector, the SEMI (Self-Equipping Equipment) defines the limits of lateral movement that the wafer cassette can make within it. Therefore, the design of the purge nozzle 10 can be adjusted to these limits, allowing the purge nozzle body 12 to move freely to accommodate all lateral movements of the wafer cassette 104 within the limits defined by the SEMI.
[0071] In embodiments of the semiconductor processing assembly, when the wafer cassette 104 is positioned on the wafer cassette support position 102, at least one spring 22 can apply a higher bias force than in the initial position of the purge nozzle body 12. At least one pulling element 24 is no longer tensioned by at least one spring 22. Therefore, the increased closing force provides an improved seal between the purge nozzle body 12 and the gasket 108 surrounding the purge port 106 of the wafer cassette 104.
[0072] In embodiments of semiconductor processing components, the wafer cassette may be implemented as a front opening unified cassette (FOUP).
[0073] Although illustrative embodiments of the invention have been described above in part with reference to the accompanying drawings, it should be understood that the invention is not limited to these embodiments. By studying the drawings, the disclosure, and the appended claims, those skilled in the art will understand and implement variations of the disclosed embodiments in practicing the claimed invention.
[0074] Throughout this specification, the phrase "an embodiment" or "one embodiment" means that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Therefore, the phrases "in one embodiment" or "in one embodiment" appearing in different places throughout this specification do not necessarily refer to the same embodiment.
[0075] Furthermore, it should be noted that one or more specific features, structures, or characteristics in the various embodiments described above can be used and implemented independently of each other, and can be combined in any suitable manner to form new embodiments not explicitly described. The reference numerals used in the detailed description and claims do not limit the description of the embodiments, nor do they limit the claims. The reference numerals are for clarification only.
Claims
1. A purge nozzle assembly (10), comprising: - A purge nozzle body (12) including an inlet opening (14) and an outlet opening (16), wherein the outlet opening (16) leads to the purge nozzle contact surface (18); - Mounting body (20) for connecting the purge nozzle assembly (10) to the external frame member; - A mechanical coupling mechanism that movably connects the purge nozzle body (12) to the mounting body (20), and is configured such that: - Allows the purging nozzle body (12) to tilt relative to the mounting body (20); and - Allows lateral movement of the purge nozzle body (12) relative to the mounting body (20), wherein the lateral movement has a motion component parallel to the purge nozzle contact surface (18). The mechanical connection mechanism includes: - At least one spring (22) is connected to the purge nozzle body (12) and the mounting body (20) and is configured to bias the purge nozzle body (12) relative to the mounting body (20) in a direction perpendicular to the purge nozzle contact surface (18) and pointing away from the purge nozzle contact surface (18); - A plurality of pull elements (24) connected to the purge nozzle body (12) and the mounting body (20), the pull elements (24) being tensioned by at least one spring (22) to provide a defined initial position of the purge nozzle body (12) relative to the mounting body (20).
2. The purge nozzle assembly according to claim 1, wherein, Each of the pulling elements (24) applies a pulling force along the pulling direction, wherein the intersection (P) of the pulling directions of the plurality of pulling elements (24) lies in the plane defined by the contact surface (18) of the blow nozzle.
3. The purge nozzle assembly according to claim 2, wherein, The intersection (P) is located on the central axis (L) of the purge nozzle body (12), which is perpendicular to the plane defined by the purge nozzle contact surface (18).
4. The purge nozzle assembly according to claim 3, wherein, The outlet opening (16) defines an outlet axis that is collinear with the central axis (L) of the purge nozzle body (12).
5. The purge nozzle assembly according to claim 1, wherein, The at least one spring (22) includes at least one push spring.
6. The purge nozzle assembly according to claim 1, wherein, The at least one spring (22) includes at least one tension spring.
7. The purge nozzle assembly according to claim 1, wherein, Each pulling element (24) includes a rope or chain.
8. The purge nozzle assembly according to claim 1, wherein, Each pull element (24) includes a single link that is slidably and pivotally connected to one of the purge nozzle body (12) and the mounting body (20), and the link is pivotally connected to at least the other of the purge nozzle body (12) and the mounting body (20).
9. The purge nozzle assembly according to claim 1, wherein, Each pull element (24) includes a single link that is slidably and pivotally connected to one of the purge nozzle body (12) and the mounting body (20), and the link is at least pivotally and slidably connected to the other of the purge nozzle body (12) and the mounting body (20).
10. The purge nozzle assembly according to claim 1, wherein, The plurality of pulling elements (24) includes three pulling elements (24).
11. The purge nozzle assembly according to claim 1, wherein, The at least one spring (22) is a single spring.
12. The purge nozzle assembly according to claim 1, wherein, The at least one spring (22) is a plurality of springs.
13. The purge nozzle assembly according to claim 1, wherein, The at least one spring (22) is a helical spring.
14. The purge nozzle assembly according to claim 1, wherein, The purge nozzle body (12) has a circular groove in the outer circumferential surface of the purge nozzle body (12), and a purge body ring (26) is installed in the circular groove, wherein at least one pull element (24) is connected to the purge body ring (26) to establish a connection between the purge nozzle body (12) and at least one pull element (24).
15. The purge nozzle assembly according to claim 1, wherein, The mounting body (20) has a circular groove in the inner circumference of the mounting body (20), and a mounting body ring (28) is mounted in the circular groove, wherein at least one pull element (24) is connected to the mounting body ring (28) to establish a connection between the mounting body (20) and at least one pull element (24).
16. The purge nozzle assembly according to claim 1, wherein, The purge nozzle body (12) has a second circular groove in the outer circumferential surface of the purge nozzle body (12), and a second purge body ring (30) is installed in the second circular groove, wherein at least one spring (22) is connected to the second purge body ring (30) to establish a connection between the purge nozzle body (12) and at least one spring (22).
17. The purge nozzle assembly according to claim 1, wherein, The mounting body (20) has a second circular groove in the inner circumference of the mounting body (20), and a second mounting body ring (32) is mounted in the second circular groove, wherein at least one spring (22) is connected to the second mounting body ring (32) to establish a connection between the mounting body (20) and at least one spring (22).
18. The purge nozzle assembly according to any one of the preceding claims, wherein, The blow nozzle body (12) is cylindrical, and the mounting body (20) has an annular opening, wherein the diameter of the annular opening is larger than the outer diameter of the blow nozzle body (12).
19. The purge nozzle assembly according to claim 5, wherein, The push spring support frame (34) is connected to the mounting body (20), wherein the push spring (22) is biased between the push spring support frame (34) and the blow nozzle body (12).
20. The purge nozzle assembly according to any one of claims 1-17, wherein, Each pull element is at least 10 mm long, and the angle of each pull element (24) relative to the horizontal plane is in the range of 25° to 60°.
21. A semiconductor processing assembly (100) comprising at least one wafer cassette support location (102) and at least one wafer cassette (104), wherein, The wafer cassette includes a purge port (106) for supplying purge gas into the interior of the wafer cassette (104), wherein the semiconductor processing assembly (100) includes a purge nozzle assembly (10) according to any of the preceding claims, which is positioned relative to the wafer cassette support position (102) such that when the wafer cassette (104) is placed on the wafer cassette support position (102), during the placement of the wafer cassette (104), the purge nozzle contact surface (18) engages the wafer cassette (104) around the purge port without friction or sliding movement between the purge nozzle contact surface (18) and the wafer cassette (104).
22. The semiconductor processing assembly of claim 21, wherein, The wafer cassette (104) and the wafer cassette support position (102) are positioned relative to each other via a motion connector (110).
23. The semiconductor processing assembly according to claim 21 or 22, wherein, When the wafer cassette (104) is placed on the wafer cassette support position (102), the at least one spring (22) applies a higher bias force than in the initial position of the blow nozzle body (12), and wherein at least one pulling element (24) is no longer tensioned by the at least one spring (22).
24. The semiconductor processing assembly according to claim 21 or 22, wherein, The wafer cassette is implemented as a front-opening unified cassette (FOUP).