Refrigerator

Abstract

The refrigerator includes an insulated cabinet and a machine compartment located below the insulated cabinet. A compressor is housed within the machine compartment. Additionally, a baseboard unit is located next to the compressor within the machine compartment. The control baseboard is housed within an electrical box (housing component). The back of the electrical box and the surface of the electrical box opposite the compressor are covered by a heat-conducting plate (a component with good heat conductivity).

Description

Technical Field

[0001] One aspect of the present invention relates to a refrigerator having a mechanical compartment. Background Technology

[0002] To provide insulation from the surrounding environment, an insulated cabinet is installed in the refrigerator to cover the outer perimeter of the storage space. A mechanical compartment is located on the lower back side of the insulated cabinet, where the compressor and other components that constitute the refrigeration cycle are housed.

[0003] In addition, the refrigerator has a control board for controlling electronic components such as the compressor.

[0004] As shown in, for example, Japanese Patent Application Publication No. 10-148463, the control board can be disposed in the machine compartment. In the refrigerator disclosed in Japanese Patent Application Publication No. 10-148463, the electrical component storage box for housing the control board is supported by a reinforcing plate and disposed in the machine compartment. As a result, the heat generated by the control board will not affect the interior of the refrigerator. Summary of the Invention

[0005] However, in the configuration disclosed in Japanese Patent Application Publication No. 10-148463, it is possible to avoid the heat generated by the control board from affecting the inside of the refrigerator, but it is difficult to release the heat generated in the control board, and it may cause heat to accumulate in the electrical component storage box or the mechanical room.

[0006] Therefore, in one aspect of the present invention, the object is to provide a refrigerator that allows heat generated on the control board in the machine compartment to dissipate easily.

[0007] One aspect of the present invention relates to a refrigerator comprising: an insulated cabinet; a machine compartment disposed below the insulated cabinet; a compressor disposed within the machine compartment; a control board disposed beside the compressor; and a housing member housing the control board. The back surface of the housing member and the surface of the housing member opposite to the compressor are covered by a material with good thermal conductivity.

[0008] According to one aspect of the present invention, a refrigerator is provided that allows heat generated on the control board inside the machine compartment to dissipate easily. Attached Figure Description

[0009] Figure 1 This is a plan view showing the configuration of the rear section of a refrigerator according to a first embodiment of the present invention.

[0010] Figure 2 It is shown Figure 1 The diagram shows a cross-sectional view of the internal structure of the refrigerator.

[0011] Figure 3 It is shown in Figure 1The diagram shows a refrigerator with the heat conduction plate of the substrate unit removed.

[0012] Figure 4 It is shown in Figure 1 The image shows a three-dimensional view of a refrigerator with the heat conduction plate of the base unit removed.

[0013] Figure 5 It is shown Figure 1 The diagram shows a cross-sectional view of the internal structure of the refrigerator's mechanical compartment.

[0014] Figure 6 It is shown schematically. Figure 1 A top view of the configuration area of ​​the baseboard unit in the mechanical compartment of the refrigerator shown.

[0015] Figure 7 This is a perspective view showing the electrical box of the base plate unit installed on the refrigerator according to the first embodiment.

[0016] Figure 8 This is a top view schematically showing the arrangement area of ​​the substrate unit in the mechanical compartment of a refrigerator according to a variation of the first embodiment.

[0017] Figure 9 This is a plan view showing the configuration of the rear section of a refrigerator according to a second embodiment of the present invention.

[0018] Figure 10 It is shown in Figure 9 The image shows a three-dimensional view of a refrigerator with the heat conduction plate of the base unit removed.

[0019] Figure 11 It is shown Figure 9 The diagram shows a cross-sectional view of the internal structure of the refrigerator's mechanical compartment.

[0020] Figure 12 This is a perspective view showing the electrical box of the base plate unit installed on the refrigerator according to the second embodiment.

[0021] Figure 13 This is a top view schematically showing the arrangement area of ​​the base plate unit in the mechanical compartment of the refrigerator according to the third embodiment.

[0022] Figure 14 This is a top view schematically showing the arrangement area of ​​the base plate unit in the mechanical compartment of the refrigerator according to the fourth embodiment. Detailed Implementation

[0023] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same components. Their names and functions are also the same. Therefore, detailed descriptions of them will not be repeated.

[0024] <First Implementation>

[0025] (The overall structure of a refrigerator)

[0026] First, the overall structure of the refrigerator 1 according to the first embodiment will be described. Figure 1 The configuration of the rear side of refrigerator 1 is shown. Additionally, Figure 2 The internal structure of refrigerator 1 is shown. Furthermore, in... Figure 2 In the diagram, the components inside the machine compartment 30 other than the compressor 31 are omitted.

[0027] like Figure 2 As shown, refrigerator 1 has a first refrigerator compartment 11 in the upper section, a freezer compartment 12 in the middle section, and a second refrigerator compartment 13 in the lower section. A refrigerator door 11a is provided in the first refrigerator compartment 11. A freezer door 12a is provided in the freezer compartment 12. A refrigerator door 13a is provided in the second refrigerator compartment 13.

[0028] As described above, the refrigerator 1 according to this embodiment is divided into an upper section, a middle section, and a lower section, and each section has a storage space. A partition 59 is provided between each storage space. However, the arrangement of each storage space is not limited to this.

[0029] In this embodiment, the surface with the door is referred to as the front or front surface of the refrigerator. Furthermore, based on the front surface, each surface of the refrigerator 1 is designated as the top surface, side surface, back surface, and bottom surface, according to its position when the refrigerator 1 is installed in its normal state.

[0030] A refrigeration cycle 40 is provided inside the refrigerator 1. The refrigeration cycle 40 is composed of a compressor 31, a condenser (not shown), an expander (not shown), and a cooler (evaporator) 32 connected through a refrigerant pipe (refrigerant channel) through which the refrigerant flows.

[0031] like Figure 2 As shown, the compressor 31 is located in the machine compartment 30 on the rear side of the bottom of the refrigerator 1. The cooler 32 is located in the cooling compartment 35 on the rear side of the refrigerator 1. In addition to the cooler 32, the cooling compartment 35 also includes a cooling fan 33. The cooling fan 33 is provided to circulate air between the cooling compartment 35 and each storage compartment.

[0032] Additionally, a control unit is provided inside the refrigerator 1. This control unit is, for example, mounted on a control board 21 described later. This control unit controls the operation of the refrigeration cycle 40. Specifically, the control unit starts the refrigeration cycle by driving the compressor 31, allowing refrigerant to circulate within the cycle.

[0033] Specifically, the high-temperature, high-pressure refrigerant, compressed by compressor 31, is condensed while being cooled by the condenser. Next, the high-pressure refrigerant expands through the expander to become low-temperature, low-pressure, and is sent to the cooler 32, which serves as the evaporator. The refrigerant flowing into the cooler 32 exchanges heat with the cold air circulating in the cooling chamber 35, absorbing heat and evaporating to become a low-temperature gaseous refrigerant, which is then sent to compressor 31. In this way, the refrigerant circulation drives the refrigeration cycle, and the airflow exchanging heat with the cooler 32 generates cold air.

[0034] (Composition of the insulated enclosure)

[0035] In refrigerator 1, an insulated enclosure 50 is provided as an insulation structure to insulate each storage compartment from the surrounding heat. The insulated enclosure 50 is provided to cover the outer perimeter of refrigerator 1. Figure 2 As shown, the heat insulation box 50 mainly includes an outer box 61, an inner box 62, vacuum insulation material 51, and foamed insulation material 56.

[0036] The outer casing 61 forms the outer peripheral surface of the insulated box 50. The outer casing 61 is mainly composed of an upper surface portion 50a, a side portion 50b, a back portion 50c, and a bottom portion 50d. The inner casing 62 forms the inner peripheral surface of the insulated box 50. In addition, the inner casing 62 forms the inner wall of the storage space (e.g., the first refrigerator compartment 11, the freezer compartment 12, and the second refrigerator compartment 13) and the rear wall of the cooling compartment 35.

[0037] Furthermore, a space for accommodating the machine compartment 30 is formed on the rear side below the insulated housing 50. That is, the machine compartment 30 is located on the outside of the insulated housing 50. This is because the temperature inside the machine compartment 30 rises when the compressor 31 is operated.

[0038] Vacuum insulation material 51 and foam insulation material 56 are disposed in the space between the outer casing 61 and the inner casing 62. Vacuum insulation material 51 is a sheet or plate-shaped insulation material. Vacuum insulation material 51 is disposed, for example, on the side, top surface, bottom surface, and back surface of refrigerator 1. Foam insulation material 56 may be formed, for example, from polyurethane foam (also known as rigid polyurethane foam).

[0039] (The internal structure of the machine room)

[0040] Next, refer to Figure 1 The more detailed configuration of the mechanical chamber 30 located on the lower rear side of the insulated enclosure 50 will be described. Figure 1 The rear of refrigerator 1 is shown. Figure 3 and Figure 4 Shown in Figure 1 The refrigerator 1 shown is in a state where the heat conduction plate 25 has been removed from the base plate unit 20 inside the machine room 30. Figure 5This is a cross-sectional view showing the structure of the refrigerator 1 inside the machine compartment 30. Figure 5 yes Figure 1 The cross-sectional view showing the structure of the A-A line section.

[0041] The rear section 50c of the insulated enclosure 50 is mainly composed of the back panel of the outer casing 61. The machinery compartment 30 is located below the rear section 50c. The machinery compartment 30 is mainly defined by the bottom plate 63 that forms the bottom section 50d of the insulated enclosure 50. (The text repeats itself here.) Figure 2 As shown, the rear portion of the base plate 63 rises upwards. The rearmost side of the base plate 63 becomes a generally flat shape in the horizontal direction, and this portion forms the top 63a of the machine room 30.

[0042] The base plate 63 has a top 63a and an upright portion 63c as an area for dividing the machine room 30 (see reference). Figure 2 The top 63a forms the upper surface (top) of the machine chamber 30. The upright portion 63c forms the front surface of the machine chamber 30. In addition, the side of the machine chamber 30 is formed by the side portion 50b of the outer casing 61.

[0043] The machine chamber 30 mainly houses a compressor 31, a substrate unit 20, and an evaporating dish 70. The compressor 31 is positioned slightly to the right of the machine chamber 30 when viewed from the rear (and to the left when viewed from the front). The substrate unit 20 is positioned next to the compressor 31. Figure 1 In the example shown, the substrate unit 20 is positioned on the left side of the compressor 31 (or the right side of the compressor 31 when viewed from the front). However, in another example, the substrate unit 20 may also be positioned on the right side of the compressor 31 (or the left side of the compressor 31 when viewed from the front).

[0044] A control board 21 is disposed within the board unit 20. In this embodiment, the control board 21 is disposed at an angle relative to the left-right direction of the machine chamber 30 (see reference). Figure 5 Specifically, the control board 21 is arranged along the inclined front surface portion 22c of the electrical box 22, which is an outer component of the board unit 20 (see reference). Figure 6 wait).

[0045] Furthermore, within the machine room 30, a space 30p is formed on the front side of the area where the base plate unit 20 is disposed. This space 30p is a substantially enclosed space defined by the side of the machine room 30 (e.g., the side portion 50b of the heat insulation box 50), the front surface of the machine room 30 (e.g., the raised portion 63c of the base plate 63), the upper surface of the machine room 30 (e.g., the top 63a), the bottom surface of the machine room 30, and the inclined front surface portion 22c of the electrical box 22. In other words, the space 30p is isolated from the space on the side where the compressor 31 is disposed within the machine room 30.

[0046] The space 30p is equipped with a wiring harness containing various types of wiring. The wiring harness is connected to various electrical components inside the insulated enclosure 50, various electrical components inside the machine room 30 such as the compressor 31, the control board 21, and the power supply unit (not shown).

[0047] In this embodiment, the space 30p is divided using the inclined front surface portion 22c. Therefore, as... Figure 5 As shown, the space 30p gradually narrows in width from the side of the machine compartment 30 (e.g., the side portion 50b of the insulated housing 50) toward the center. By configuring the substrate unit 20 within the machine compartment 30 with this space 30p, the distance between the side of the refrigerator 1 and the substrate unit 20 can be ensured. This makes it difficult for water to penetrate the electrical box 22 of the substrate unit 20 along the side of the refrigerator 1, and even if a through-hole 22d for the wiring harness is formed above the electrical box 22, water can be prevented from adhering to the control board 21.

[0048] An evaporating dish 70 is positioned above the compressor 31. Condensate (also called drain) generated within the cooling chamber 35 is discharged into the evaporating dish 70. The condensate generated within the cooling chamber 35 may contain, for example, defrost water generated during the defrosting of the cooler 32. By positioning the evaporating dish 70 above the compressor 31, the heat from the compressor 31 can be used to efficiently heat the drain stored in the evaporating dish 70, and the drain can be evaporated in a shorter time.

[0049] (Structure of substrate unit)

[0050] Next, the detailed structure of the substrate unit 20 will be described. Figure 6 The arrangement area of ​​the substrate unit 20 within the machine room 30 is schematically shown. Additionally, in Figure 6 The configuration of the control board 21 disposed within the board unit 20 is schematically shown. Figure 7 The configuration of the electrical box 22, which is an external component of the substrate unit 20, is shown.

[0051] As a main component, the substrate unit 20 includes a control substrate 21, an electrical box (accommodating component) 22, and a heat conduction plate (component with good heat conduction) 25.

[0052] The control board 21 includes various electronic components such as electronic circuits and coils. The control board 21 has a generally flat shape. The control board 21 is disposed within an electrical housing 22 made of resin material. Specifically, the control board 21 is disposed approximately parallel to the inclined front surface portion 22c near the inclined front surface portion 22c of the electrical housing 22. Thus, the control board 21 is disposed in a state inclined relative to the front-back direction of the machine chamber 30. Furthermore, the control board 21 may also be disposed in a state inclined relative to the left-right direction of the machine chamber 30.

[0053] By arranging the control board 21 in this tilted state, the area of ​​the control board 21 can be increased. That is, the limited space within the machine room 30 can be effectively utilized.

[0054] The electronic components mounted on the control board 21 include a heat-generating component 23 with higher heat generation and a non-heat-generating component 24 with lower heat generation than the heat-generating component 23. Examples of heat-generating components 23 include drive elements such as IPMs (Intelligent Power Modules), coils, and reactors. Examples of non-heat-generating components 24 include ICs such as control microcomputers and capacitors.

[0055] The electrical box 22 houses the control board 21 within its internal space 22S. In this embodiment, as... Figure 7 As shown, the electrical box 22 has a right-angled triangular prism shape. The electrical box 22 is mainly formed by an upper surface portion 22a, a bottom portion 22b, and an inclined front surface portion 22c. When the electrical box 22 is installed inside the machine chamber 30, the inclined front surface portion 22c is inclined relative to the machine chamber 30 in both the front-rear and left-right directions. A control board 21 is disposed along this inclined front surface portion 22c.

[0056] A hole 22d for wiring to be connected to the control substrate 21 is formed at the corner portion on the upper side of the inclined front surface portion 22c. Preferably, the hole 22d for wiring is provided in the upper portion of the inclined front surface portion 22c (a portion higher than the center position in the vertical direction).

[0057] Multiple wires within the wiring harness extending from near the top 63a of the machine room 30 into the machine room 30 branch within the space 30p, with a portion of them arranged from the hole 22d into the electrical box 22 and connected to the control board 21. By locating the hole 22d above the inclined front surface portion 22c, the length of the wiring connected to the control board 21 can be shortened.

[0058] The back and side portions (opposite to the compressor 31) of the electrical box 22 are open. With the control board 21 disposed in the internal space 22S of the electrical box 22, the back and side portions of the electrical box 22 are covered by the heat conduction plate 25.

[0059] The electrical box 22 is formed of a material with low thermal conductivity (i.e., high thermal insulation) compared to metal. Furthermore, the electrical box 22 is formed of a material with high electrical insulation. Examples of materials for the electrical box 22 include polypropylene, polyethylene, and silicone resins. Because the electrical box 22 is formed of a material with low thermal conductivity, it functions as a thermal insulation component.

[0060] The heat conduction plate 25 is formed, for example, of a material with higher thermal conductivity (a material with good thermal conductivity), such as metal. In this embodiment, the heat conduction plate 25 can be formed by bending a generally rectangular metal plate into a generally right angle. The heat conduction plate 25 is mainly composed of a back portion 25a and a side portion 25b.

[0061] The back portion 25a covers the back side of the internal space 22S of the electrical box 22. With the substrate unit 20 installed inside the machine room 30, the back portion 25a of the heat conduction plate 25 is located on the back side of the refrigerator 1 (see reference). Figure 5 ).

[0062] Side portion 25b covers the side of the internal space 22S of the electrical box 22 (the side opposite to the compressor 31). With the base plate unit 20 installed in the machine chamber 30, the side portion 25b of the heat conduction plate 25 is positioned adjacent to the compressor 31 and the evaporating dish 70. That is, the side portion 25b is disposed between the compressor 31 and the control base plate 21.

[0063] The back and side sides of the internal space 22S of the electrical box 22 are covered by a heat conduction plate 25 with good thermal conductivity. As a result, the area of ​​the heat conduction plate 25 on the control board 21 opposite to the heat-generating component 23 becomes larger, and thus, the heat generated by the control board 21 can be effectively released to the outside of the internal space 22S.

[0064] Furthermore, the electrical box 22, where the control board 21 is located, is separated from the compressor 31 by the side portion 25b of the heat conduction plate 25. In this way, the side portion 25b, which has good thermal conductivity, separates the control board 21 and the compressor 31, both of which generate heat, thus making the side portion 25b a heat sink and improving the heat dissipation of the control board 21. Moreover, the heat conduction plate 25 has a back portion 25a that is continuous with the side portion 25b, thereby promoting heat transfer between the side portion 25b and the back portion 25a. Therefore, the heat from the compressor 31 that is transferred to the side portion 25b near the compressor 31 can be efficiently transferred to the back portion 25a. The heat transferred to the back portion 25a is then discharged to the outside of the refrigerator 1.

[0065] (Regarding the configuration of electronic components on the control board)

[0066] Next, refer to Figure 6 The method of arranging various electronic components on the control board 21 will be described. The electronic components mounted on the control board 21 include multiple heat-generating components 23 and multiple non-heat-generating components 24.

[0067] exist Figure 6 The area within the dashed box shows the mounting surface of the electronic components on the control board 21. Figure 6In the case of the rectangular control board 21 mounted on the electrical box 22 in a top-down view, the horizontal direction is designated as X, and the vertical direction as Y. For example... Figure 6 As shown, the heating element 23, which generates more heat, is arranged near the center of the control substrate 21 in the X direction (within the dashed box). On the other hand, the non-heating element 24, which generates less heat, is arranged near both ends of the control substrate 21 in the X direction.

[0068] By arranging the electronic components on the control substrate 21 in this way, the heat-generating component 23 is positioned further away from the surface of the control substrate 21 and the heat conduction plate 25. For example, in Figure 6 In the example shown in the left figure, if the distance from the surface of the control substrate 21 in the area where the heating element 23 is disposed to the heat conduction plate 25 is set as L1, and the distance from the surface of the control substrate 21 in the area where the non-heating element 24 is disposed to the heat conduction plate 25 is set as L2, then L1>L2.

[0069] By arranging the electronic components (i.e., the heat-generating component 23 and the non-heat-generating component 24) on the control substrate 21 as described above, the heat-generating component 23 can be positioned further away from the heat conduction plate 25. This expands the space near the heat-generating component 23, suppressing heat buildup in its vicinity. Furthermore, by bringing the non-heat-generating component 24 closer to the heat conduction plate 25, the space near the non-heat-generating component 24 is cooled by the heat conduction plate 25. This suppresses the temperature rise of the non-heat-generating component 24.

[0070] (Summary of the first implementation method)

[0071] As described above, the refrigerator 1 according to this embodiment includes an insulated cabinet 50 and a machine compartment 30 disposed below the insulated cabinet 50. A compressor 31 is disposed within the machine compartment 30. An evaporator 70 is disposed above the compressor 31. Furthermore, a substrate unit 20 is disposed within the machine compartment 30, next to the compressor 31 and the evaporator 70. The substrate unit 20 includes a control substrate 21 and an electrical box 22, etc. The control substrate 21 is housed within the electrical box (housing component) 22. The back side of the electrical box 22 and the surface of the electrical box 22 opposite to the compressor 31 are covered by a heat-conducting plate (a component with good heat conductivity) 25.

[0072] In this way, the back of the electrical box 22 and the side of the electrical box 22 opposite to the compressor 31 are covered by a heat conduction plate 25 with good thermal conductivity, thereby effectively releasing the heat generated by the control board 21 to the outside of the internal space 22S.

[0073] Furthermore, the side portion 25b of the heat conduction plate 25 separates the electrical box 22, on which the control board 21 is disposed, from the compressor 31. In this way, the side portion 25b, which has good thermal conductivity, separates the control board 21 and the compressor 31, both of which generate heat, thus making the side portion 25b a heat sink and improving the heat dissipation of the control board 21. Moreover, the heat conduction plate 25 has a back portion 25a that is continuous with the side portion 25b, thereby promoting heat transfer between the side portion 25b and the back portion 25a. Therefore, heat from the compressor 31 that is transferred to the side portion 25b near the compressor 31 can be efficiently transferred to the back portion 25a.

[0074] As described above, the refrigerator 1 according to this embodiment can easily dissipate the heat generated by the control board 21 and the compressor 31 to the rear side of the refrigerator 1, thereby suppressing the temperature rise inside the machine compartment 30. Therefore, by reducing the temperature rise in the machine compartment 30, the possibility of malfunction of components disposed in the machine compartment 30 (e.g., the control board 21, etc.) can be reduced.

[0075] Furthermore, the control board 21 within the electrical box 22 is arranged at an angle relative to the front-back (or left-right) direction of the machine room 30. This allows for efficient use of the limited space within the machine room 30 when the control board 21 is placed there. Therefore, a larger control board 21 can be placed within the machine room 30.

[0076] (Modified Example)

[0077] Figure 8 The configuration of a modified example according to the first embodiment is shown. Figure 8 The diagram shows the configuration around the baseboard unit 20A within the mechanical compartment 30 of the refrigerator 1 in the modified example. Similar to the first embodiment, a control baseboard 21 is disposed within the baseboard unit 20A. The control baseboard 21 is disposed along the inclined front surface portion 22c of the electrical box 22, which serves as an external component of the baseboard unit 20.

[0078] Various electronic components, such as electronic circuits and coils, are mounted on the control substrate 21. These electronic components include a heating element 23 with higher heat generation and a non-heating element 24 with lower heat generation than the heating element 23. Figure 8 (Not shown in the diagram). Furthermore, the substrate unit 20A has a second heating element 23A on the outside of the electrical box 22. Examples of the second heating element 23A include a reactor. The second heating element 23A is disposed on the inclined front surface portion 22c of the electrical box 22. Therefore, by arranging the second heating element 23A, which generates a large amount of heat, in the space 30p, heat generation within the internal space 22S can be suppressed.

[0079] <Second Implementation Method>

[0080] Next, a second embodiment of the present invention will be described. In the second embodiment, the configuration of the substrate unit differs from that of the first embodiment. For other than these components, the same configuration as in the first embodiment can be applied. Hereinafter, the second embodiment will be described focusing on the differences from the first embodiment.

[0081] Figure 9 This shows the configuration of the rear side of the refrigerator 1 according to the second embodiment. In the refrigerator 1, an insulated cabinet 50 is provided as an insulated structure for insulating each storage space from the surrounding heat. The same configuration as in the first embodiment can be applied to the insulated cabinet 50.

[0082] A machine room 30 is located on the lower rear side of the insulated housing 50. The machine room 30 mainly houses a compressor 31, a substrate unit 120, and an evaporating dish 70. The compressor 31 and the evaporating dish 70 can be configured in the same way as in the first embodiment.

[0083] Figure 10 Shown in Figure 9 The refrigerator shown is in a state where the heat conduction plate 125 has been removed from the base plate unit 120 inside the machine compartment 30. Figure 11 This is a cross-sectional view showing the structure of the refrigerator 1 inside the machine compartment 30. Figure 11 yes Figure 9 The cross-sectional view showing the structure of the BB line section.

[0084] A control board 21 is disposed within the board unit 120. In this embodiment, the control board 21 is disposed at an angle relative to the left-right direction of the machine chamber 30 (see reference). Figure 10 and Figure 11 (etc.). Specifically, the control board 21 is arranged along the inclined front surface portion 122c of the electrical box 122, which is an outer component of the board unit 120 (see reference). Figure 11 wait).

[0085] Additionally, within the machine room 30, a space 30p is formed on the front side of the area where the substrate unit 120 is disposed. This space 30p is divided by the side of the machine room 30 (e.g., the side portion 50b of the heat insulation box 50), the front surface of the machine room 30 (e.g., the raised portion 63c of the base plate 63), the upper surface of the machine room 30 (e.g., the top 63a), the bottom surface of the machine room 30, and the inclined front surface portion 122c of the electrical box 122, forming a generally enclosed space.

[0086] The space 30p is equipped with a wiring harness containing various types of wiring. The wiring harness is connected to various electrical components inside the insulated enclosure 50, various electrical components inside the machine room 30 such as the compressor 31, the control board 21, and the power supply unit (not shown).

[0087] As a main component, the substrate unit 120 includes a control substrate 21, an electrical box (accommodating component) 122, and a heat conduction plate (component with good heat conduction) 125.

[0088] Similar to the first embodiment, the control board 21 is disposed approximately parallel to the inclined front surface portion 122c of the electrical box 122 near it. Thus, the control board 21 is disposed in a state inclined relative to the front-rear direction of the machine chamber 30. Furthermore, the control board 21 may also be disposed in a state inclined relative to the left-right direction of the machine chamber 30.

[0089] By arranging the control board 21 in this tilted state, the area of ​​the control board 21 can be increased. That is, the limited space within the machine room 30 can be effectively utilized.

[0090] Similar to the first embodiment, the electronic components mounted on the control board 21 include a heating component 23 with higher heat generation and a non-heating component 24 with lower heat generation. The method described in the first embodiment can be applied to the arrangement of the heating component 23 and the non-heating component 24 on the control board 21.

[0091] Figure 12 The configuration of the electrical box 122, which serves as an external component of the substrate unit 120, is shown. The electrical box 122 houses the control board 21 within its internal space 122S. In this embodiment, the electrical box 122 has a generally parallelogram shape when viewed from above (see reference). Figure 11 The electrical box 122 is mainly formed by an upper surface portion 122a, a bottom portion 122b, an inclined front surface portion 122c, and a front portion 122d. When the electrical box 122 is installed inside the machine chamber 30, the inclined front surface portion 122c is inclined relative to the front-rear and left-right directions of the machine chamber 30. A control board 21 is disposed along this inclined front surface portion 122c. Furthermore, the front portion 122d is located at the frontmost side inside the machine chamber 30 and is disposed approximately parallel to the rear portion of the machine chamber 30.

[0092] A hole 122e for allowing wiring connected to the control substrate 21 to pass through is formed at a corner portion of the front surface portion 122d near the upper side of the inclined front surface portion 122c. Preferably, the hole 122e for allowing such wiring to pass through is provided in the upper portion of the inclined front surface portion 122c (a portion higher than the center position in the vertical direction). By providing the hole 122e in the upper portion of the inclined front surface portion 122c, the length of the wiring connected to the control substrate 21 can be shortened.

[0093] The back and side portions (opposite to the compressor 31) of the electrical box 122 are open. With the control board 21 disposed in the internal space 122S of the electrical box 122, the back and side portions of the electrical box 122 are covered by the heat conduction plate 125.

[0094] Similar to the first embodiment, the electrical box 122 is formed of a material with low thermal conductivity (i.e., high thermal insulation) compared to metal. Additionally, the electrical box 122 is formed of a material with high electrical insulation.

[0095] The heat conduction plate 125 is formed, for example, of a material with higher thermal conductivity (a material with good thermal conductivity), such as metal. In this embodiment, the heat conduction plate 125 can be formed by bending a generally rectangular metal plate into an obtuse angle. The heat conduction plate 125 is mainly composed of a back portion 125a and a side portion 125b.

[0096] The back portion 125a covers the back side of the internal space 122S of the electrical box 122. With the substrate unit 120 installed within the machine room 30, the back portion 125a of the heat conduction plate 125 is located on the back side of the refrigerator 1 (see reference). Figure 11 ).

[0097] Side portion 125b covers the side of the internal space 122S of the electrical box 122 (the side opposite to the compressor 31). Side portion 125b is disposed between the compressor 31 and the control board 21. In this embodiment, side portion 125b is inclined relative to the front-back direction and the left-right direction of the machine chamber 30. Moreover, side portion 125b is substantially parallel to the control board 21.

[0098] The back and side sides of the internal space 122S of the electrical box 122 are covered by a heat conduction plate 125 with good thermal conductivity, thereby enabling the heat generated by the control substrate 21 to be efficiently released to the outside of the internal space 122S.

[0099] Furthermore, in this embodiment, the side portion 125b is inclined relative to the front-rear and left-right directions of the machine compartment 30, thus, especially at the rear, it is possible to separate the distance between it and the compressor 31. Therefore, not only can the heat generated from the compressor 31 be dissipated in the side portion 125b, but it can also be discharged to the outside of the refrigerator 1 by diffusion. In addition, in this embodiment, the internal space 122S of the electrical box 122 is smaller than that in the first embodiment. Therefore, although the heat generated by the heat-generating component 23 in the control board 21 is not large, it is preferable to apply it to refrigerators where the compressor 31 generates a large amount of heat (e.g., large refrigerators with high-efficiency inverter control circuits).

[0100] <Third Implementation Method>

[0101] Next, a third embodiment of the present invention will be described. In the third embodiment, the configuration of the substrate unit differs from that of the first embodiment. For other than these components, the same configuration as in the first embodiment can be applied. Therefore, in the third embodiment, the description will focus on the differences from the first embodiment.

[0102] Figure 13 This illustrates the configuration around the substrate unit 220 within the mechanical compartment 30 of the refrigerator 1 according to the third embodiment. Similar to the first embodiment, a control substrate 21 is disposed within the substrate unit 220. Various electronic components, such as electronic circuits and coils, are mounted on the control substrate 21. The electronic components mounted on the control substrate 21 include a heating element 23 with higher heat generation and a non-heating element 24 with lower heat generation than the heating element 23 (in... Figure 13 (Not shown in the image).

[0103] The electrical box 222, which serves as an external component of the substrate unit 220, houses the control board 21 within its internal space 222S. In this embodiment, the electrical box 222 has a generally rectangular shape. When viewed from above, the electrical box 222 has a generally rectangular shape and is arranged such that its long side runs along the side of the refrigerator 1. Furthermore, the control board 21 is arranged along the surface of the electrical box 222 formed on the side portion 50b of the insulated housing 50. Electronic components such as a heating element 23 are arranged on the side of the control board 21 facing the compressor 31.

[0104] The back and side portions (opposite to the compressor 31) of the electrical box 222 are open. With the control board 21 disposed in the internal space 222S of the electrical box 222, the back and side portions of the electrical box 222 are covered by the heat conduction plate 225.

[0105] The heat conduction plate 225 is formed, for example, from a material with higher thermal conductivity (a material with good thermal conductivity), such as metal. In this embodiment, the heat conduction plate 225 can be formed by bending a generally rectangular metal plate into a generally right angle. The heat conduction plate 225 is mainly composed of a back portion 225a and a side portion 225b.

[0106] The back portion 225a covers the back side of the internal space 222S of the electrical box 222. With the substrate unit 220 installed in the machine room 30, the back portion 225a of the heat conduction plate 225 is located on the back side of the refrigerator 1.

[0107] Side portion 225b covers the side of the internal space 222S of the electrical box 222 (opposite to the compressor 31). Side portion 225b is disposed between the compressor 31 and the control board 21.

[0108] The back and side sides of the internal space 222S of the electrical box 222 are covered by a heat conduction plate 225 with good thermal conductivity, thereby enabling the heat generated by the control board 21 to be efficiently released to the outside of the internal space 222S.

[0109] The configuration of this embodiment is useful when the area of ​​the control board 21 is small. That is, the configuration of this embodiment is preferably applied to small refrigerators and the like, where the volume of the machine compartment 30 is small and the current flowing through the compressor is also small.

[0110] <Fourth Implementation>

[0111] Next, a fourth embodiment of the present invention will be described. In the fourth embodiment, the configuration of the substrate unit differs from that of the first embodiment. For other than these components, the same configuration as in the first embodiment can be applied. Hereinafter, the fourth embodiment will be described focusing on the differences from the first embodiment.

[0112] Figure 14 This shows the configuration around the substrate unit 320 within the mechanical compartment 30 of the refrigerator 1 according to the fourth embodiment. Similar to the first embodiment, a control board 21 is disposed within the substrate unit 320. Electronic components such as a heating element 23 are mounted on the control board 21.

[0113] The electrical box 322, which serves as an external component of the substrate unit 320, houses the control board 21 within its internal space 322S. In this embodiment, the electrical box 322 has a generally rectangular shape. Viewed from above, the electrical box 322 has a generally rectangular shape and is arranged along the back of the refrigerator 1 along its long side. Furthermore, the control board 21 is arranged along the surface of the electrical box 322, which is formed along the back surface 50c of the heat-insulating housing 50. Electronic components such as a heating element 23 are disposed on the rear side surface of the control board 21.

[0114] The back and side portions (opposite to the compressor 31) of the electrical box 322 are open. With the control board 21 disposed in the internal space 322S of the electrical box 322, the back and side portions of the electrical box 322 are covered by the heat conduction plate 325.

[0115] The heat conduction plate 325 is formed, for example, of a material with higher thermal conductivity (a material with good thermal conductivity), such as metal. In this embodiment, the heat conduction plate 325 can be formed by bending a generally rectangular metal plate into a generally right angle. The heat conduction plate 325 is mainly composed of a back portion 325a and a side portion 325b.

[0116] The back portion 325a covers the back side of the internal space 322S of the electrical box 322. With the substrate unit 320 installed in the machine room 30, the back portion 325a of the heat conduction plate 325 is located on the back side of the refrigerator 1.

[0117] Side portion 325b covers the side of the internal space 322S of the electrical box 322 (opposite to the compressor 31). Side portion 325b is disposed between the compressor 31 and the control board 21.

[0118] The back and side sides of the internal space 322S of the electrical box 322 are covered by a heat conduction plate 325 with good thermal conductivity, thereby enabling the heat generated by the control board 21 to be efficiently released to the outside of the internal space 322S.

[0119] The configuration of this embodiment is useful when the heat generated by the heating element 23, etc., on the control board 21 is large.

[0120] (Summarize)

[0121] One aspect of the present invention relates to a refrigerator (e.g., refrigerator 1) comprising: an insulated cabinet (e.g., insulated cabinet 50); a machine compartment (e.g., machine compartment 30) disposed below the insulated cabinet; a compressor (e.g., compressor 31) disposed within the machine compartment; a control board (e.g., control board 21) disposed adjacent to the compressor; and a housing component (e.g., electrical boxes 22, 122, 222, 322) housing the control board. The back surface of the housing component and the surface of the housing component opposite to the compressor are covered by a heat-conducting component (e.g., heat-conducting plates 25, 125, 225, 325).

[0122] In the refrigerator (e.g., refrigerator 1) according to one aspect of the present invention described above, the control board (e.g., control board 21) may also be arranged in a state that is inclined in the front-back direction relative to the machine room (e.g., machine room 30).

[0123] In the refrigerator (e.g., refrigerator 1) according to one aspect of the present invention described above, at least one heating element (e.g., heating element 23) may be provided on the control substrate (e.g., control substrate 21), and the heating element may be disposed at a position further away from the surface of the control substrate from the well thermally conductive element (e.g., thermally conductive plates 25, 125).

[0124] In the refrigerator (e.g., refrigerator 1) according to one aspect of the present invention described above, a space (e.g., space 30p) may also be formed in the mechanical compartment (e.g., mechanical compartment 30) on the front side of the receiving member.

[0125] In the refrigerator (e.g., refrigerator 1) according to one aspect of the present invention described above, a through hole (e.g., hole 22d, hole 122e) for wiring connected to the control board (e.g., control board 21) may be provided on the front side of the housing member (e.g., electrical box 22, 122) above the central position in the vertical direction of the housing member.

[0126] In the refrigerator (e.g., refrigerator 1) according to one aspect of the present invention described above, a heating element (e.g., a second heating element 23A) connected to the control board (e.g., control board 21) may also be arranged in the space in front of the housing component (e.g., electrical box 22, 122).

[0127] It should be understood that the embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the invention is indicated by the scope of the claims, not by the foregoing description, and includes all modifications equivalent to and within the scope of the claims. Furthermore, configurations obtained by combining different embodiments described herein are also included within the scope of the invention.

Claims

1. A refrigerator, characterized in that, include: Insulated enclosure; The machine room is located below the rear side of the insulated enclosure; A compressor, which is located in the machine compartment; A control board is located next to the compressor; A housing component that houses the control board, with its rear portion located on the rear side of the insulated housing and its side portion opposite the compressor; and A heat-conducting plate that covers the back and side portions of the housing component. The heat-conducting plate is formed from a component with good thermal conductivity, which is higher than that of the housing component.

2. The refrigerator as described in claim 1, characterized in that, The control board is configured to be tilted relative to the front-back direction of the machine room.

3. The refrigerator as described in claim 2, characterized in that, The control board is provided with at least one heating element and a non-heating element with a lower heating power than the heating element. The heating element is positioned at a greater distance from the surface of the control substrate to the element with good thermal conductivity, compared to the non-heating element.

4. The refrigerator as described in any one of claims 1 to 3, characterized in that, In the machine room, a space is formed on the front side of the housing component, opposite to the rear side, in a direction orthogonal to the arrangement direction of the compressor and the housing component.

5. The refrigerator as described in claim 4, characterized in that, On the front side of the receiving component, above the center position in the vertical direction of the receiving component, there is a through hole for wiring connected to the control substrate.

6. The refrigerator as described in claim 4, characterized in that, A heating element connected to the control board is disposed in the space on the front side of the housing component.

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