Microdevice cylinder mapping and compensation

Abstract

This disclosure relates to compensation for microdevices based on cylindrical information.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to U.S. Provisional Patent Application No. 62 / 829,444, filed April 4, 2019, which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to compensation for microdevices based on cylindrical information. Summary of the Invention

[0004] According to one embodiment, a method for filling a system (receiver) substrate with microdevices can be provided. The method includes arranging microdevices in cylinders, extracting at least one parameter of at least one microdevice in the cylinder; and selecting and arranging cylinders to fill the system substrate such that the extracted parameters of adjacent cylinders are within a predetermined threshold.

[0005] According to another embodiment, a method for providing a system (receiver) substrate microdevice can be provided. The method includes arranging the microdevice in a cylinder; extracting a distribution map of at least one parameter for the microdevice in the cylinder; and selecting and arranging cylinders to fill the system substrate such that the distribution map of at least one parameter forms a continuous map with steps within a defined threshold between maps of cylinders associated with corresponding adjacent regions on the system substrate.

[0006] According to another embodiment, a method can be provided for calculating a compensation value for changes in microdevices transferred from different cylinders to a system substrate. The method includes using the microdevice location to obtain cylinder parameters; and using the cylinder parameters and microdevice values ​​to calculate the compensation value.

[0007] According to yet another embodiment, a compensation method for microdevices in a system substrate can be provided. The method includes providing different microdevices, wherein the output of at least one microdevice different from the microdevice is adjusted to compensate for parameters in the microdevice. Attached Figure Description

[0008] The foregoing and other advantages of this disclosure will become apparent from reading the following detailed description and referring to the accompanying drawings.

[0009] Figure 1 A graph showing the variation between at least one parameter of a device on a cylinder associated with an adjacent region on a system substrate.

[0010] Figure 2 The steps for packing adjacent areas of the cylinder are shown.

[0011] Figure 3 The diagram shows the distribution of at least one parameter created for the cylinder.

[0012] Figure 4An exemplary block diagram of cylinder parameter compensation is shown.

[0013] Figure 5 An exemplary implementation of this compensation is shown.

[0014] This disclosure is readily adaptable to various modifications and alternatives, specific embodiments, or implementations, as illustrated by way of example in the accompanying drawings and described in detail herein. However, it should be understood that this disclosure is not intended to be limited to the specific forms disclosed. Rather, this disclosure will cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims. Detailed Implementation

[0015] In this specification, the terms "device" and "microdevice" are used interchangeably. However, those skilled in the art will recognize that the embodiments described herein are independent of device size.

[0016] This invention relates to methods for filling a system substrate with microdevices. These methods also involve compensating for microdevices by considering thresholds for certain parameter values ​​and comparing them to adjacent microdevices. Furthermore, packaging is used to reduce parameter differences between microdevice regions on the system substrate.

[0017] Figure 1 A graph showing the variation between at least one parameter of a device on a cylinder 2110 associated with an adjacent region 2112 on the system substrate is provided. To reduce the differences between these regions, the cylinders associated with these regions can be packaged.

[0018] Figure 2 The steps for packing adjacent regions of a cylinder are illustrated. In a first step 2202, the average or median value of at least one parameter of the cylinder is calculated. In a second step 2204, the cylinders are packed and arranged to fill adjacent regions in the system substrate such that the average or median value (or any other representation of the measured parameter) of at least one parameter remains within a threshold value. In this case, the difference between at least one parameter (or its parameter representation) of the cylinders associated with adjacent regions remains within a threshold value.

[0019] Figure 3 A distribution map of at least one parameter created for the cylinder is shown. Here, in step 2302, a distribution map is extracted for at least one parameter of the device on the cylinder. In the second step 2304, the cylinders are boxed and arranged to fill adjacent regions in the system substrate, wherein the steps between the maps of the cylinders associated with adjacent regions are within a threshold value.

[0020] In another case, it can be used Figure 2 and Figure 3 The combination of packing processes in the process.

[0021] In another scenario, the characteristics of microdevices associated with adjacent regions are compensated so that the differences between devices in different adjacent regions are less than a threshold. In one case, if the parameter is a color point, other microdevices can be used to adjust the color point of said microdevice. Here, data extracted for the cylinder can be used to compensate the microdevices. In another scenario, the performance of microdevices associated with different cylinders can be measured after transfer to the system substrate.

[0022] Figure 4 An exemplary block diagram of cylinder parameter compensation is shown. Few of these blocks can be used in series or parallel if different parameters are being compensated. The first block, 2402, stores parameters associated with the cylinder used to fill the system substrate. Furthermore, the microdevice location 2403 is passed to block 2402 to extract the cylinder parameters associated with the cylinder from which the microdevice is extracted. The microdevice is processed by value calculator block 2404 to generate a compensation value 2408. The calculator block can be a lookup table or a calculation block. Here, the value of microdevice 2406 is also passed to value calculator block 2404.

[0023] In some cases, compensation involves using other types of microdevices. In one embodiment, the color point of the display can be adjusted by using different micro-LEDs.

[0024] Figure 5 An exemplary implementation of this compensation is shown. Here, the value of microdevice 2502 is converted into luminance by luminance calculator 2504 using luminance parameter 2506. Furthermore, the luminance value can be extracted from a gamma curve, which displays the expected luminance level for each grayscale. The gamma curve can be normalized by peak luminance to eliminate dependence on peak luminance.

[0025] Furthermore, the location 2503 of microdevice 1 is passed to block 2505 to extract compensation parameters 2522 associated with the cylinder from which the microdevice is extracted. These parameters 2522, along with the microdevice's brightness value, are passed to compensation calculator 2518 to calculate the compensation value 2520 required by other devices. The compensation value is in brightness format. The brightness value of microdevice 1 is also combined with the required compensation values ​​2508 and 2510 associated with other microdevices. The combined value 2512 is then passed to calculator block 2514 to calculate the programmed value 2516. In one case, compensation values ​​2508 and 2510 are added to the brightness of microdevice 1. Other functions, such as compensating for microdevice 1's non-uniformity, pixel non-uniformity, and gamma adjustment (related to the gamma curve of adjacent areas), may be covered in block 2514.

[0026] The invention described above can be varied in many ways. Such variations should not be considered as departing from the scope of the invention, and all such modifications that will be apparent to those skilled in the art are intended to be included within the scope of the appended claims.

Claims

1. A method for filling a system substrate with microdevices, the method comprising: The microdevices are packed in adjacent areas of the cylinder; Extract at least one parameter for at least one microdevice in the cylinder; and The cylinders are selected and arranged to fill the system substrate such that the parameters extracted for adjacent cylinders are within a predetermined threshold.

2. The method of claim 1, wherein the system is a receiver.

3. A method for filling a system substrate microdevice, the method comprising: The microdevices are packed in adjacent areas of the cylinder; Extract a distribution map of at least one parameter for the microdevice in the cylinder; and The cylinders are selected and arranged to fill the system substrate such that a distribution map of at least one parameter is formed as a stepped continuous map within a defined threshold between the maps of the cylinders associated with corresponding adjacent regions on the system substrate.

4. The method of claim 3, wherein the system is a receiver.

5. A method for calculating microdevice variation compensation values ​​during transfer from different cylinders to a system substrate, the method comprising: Use the microdevice location to obtain cylinder parameters; The compensation value is calculated using the cylinder parameters and the microdevice value; and Compensation of multiple cylinder parameters is performed using blocks in series or in parallel.

6. The method of claim 5, wherein the microdevice value is converted into a brightness value, and the cylinder parameter is passed to a compensation block, where it converts the brightness value into a compensation value.

7. A compensation method for microdevices in a system substrate, the method comprising: Different microdevices are provided, wherein the output of at least one microdevice different from the microdevice is adjusted to compensate for parameters in the microdevice; The method further includes: The compensation values ​​for different microdevices are calculated based on the cylinder parameters obtained by using the location of the microdevices.

8. The compensation method according to claim 7, further comprising: Calculate the brightness value of the microdevice; The modified brightness is obtained by adding the compensation value to the brightness value; and The modified brightness is used to calculate the programmed value.

9. The compensation method according to claim 7, wherein programmed values ​​are extracted from the gamma curve, pixel uniformity, and temperature value.

10. The compensation method according to claim 7, wherein the luminance value is extracted from the gamma curve.

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