Edge skin discharging device and silicon rod squaring equipment

Abstract

The present application discloses a skin edge unloading device for silicon rod squaring equipment and silicon rod squaring equipment; wherein, the skin edge unloading device comprises a skin edge lifting unit and a skin edge clamping unit, and in an idle state, the skin edge clamping unit can be stored in the space above the machine base of the silicon rod squaring equipment to save the equipment space occupied by the silicon rod squaring equipment as a whole; in the skin edge clamping and transporting state, the skin edge clamping mechanism can rotate around the swing arm shaft through a swing arm to transport the clamped skin edge to the skin edge unloading area, thereby shortening the transport path; at the same time, a plurality of skin edge clamping mechanisms can be arranged in the skin edge unloading device to correspond one to one with the silicon rod bearing structure of the silicon rod squaring equipment to improve the efficiency of skin edge clamping and transporting and reduce time cost.

Description

Technical Field

[0001] This application relates to the technical field of silicon rod processing, and in particular to a device for discharging the side skin of a silicon rod and a device for squaring a silicon rod. Background Art

[0002] At present, with the increasing attention and development of the society on the utilization and development of green renewable energy, the field of photovoltaic solar power generation has received more and more attention and development. In the field of photovoltaic power generation, ordinary crystalline silicon solar cells are made on high-quality silicon wafers, and such silicon wafers are cut from silicon ingots pulled or cast by a multi-wire saw. Generally, a device for squaring a silicon rod is used to square the silicon rod. At this time, the cutting mechanism feeds along the length direction of the silicon rod and cuts out four pairwise parallel planes on the circumference of the silicon rod; after squaring, a multi-wire slicing machine is used to slice the squared silicon rod along the length direction to obtain the required silicon wafers.

[0003] In the related operation of squaring a silicon rod, side skins will be formed after the silicon rod is squared and cut. Therefore, it is necessary to first unload the formed side skins. Generally, most of the side skin unloading methods still rely on manual operation by operators to separate the side skins from the cut silicon rod and carry them out of the silicon rod squaring device. This not only has low efficiency, but also increases the risk of damage to the cut silicon rod due to the collision between the side skins and the cut silicon rod during the handling process, making it difficult to reuse the side skins. Summary of the Invention

[0004] In view of the above-mentioned disadvantages of the related art, the purpose of this application is to provide a device for squaring a silicon rod and a device for discharging the side skin applied to the device for squaring a silicon rod, so as to solve the problems of low efficiency of manual transfer of side skins and easy damage to side skins in the prior art.

[0005] To achieve the above purpose and other related purposes, this application discloses a device for discharging the side skin applied to a device for squaring a silicon rod. The device for squaring a silicon rod includes a machine base, a wire cutting device, and a silicon rod bearing structure. The silicon rod bearing structure is used to bear the vertically placed silicon rod. The wire cutting device includes a liftable wire cutting support and a wire cutting unit provided on the wire cutting support. The wire cutting unit has a cutting wire saw, and the cutting wire saw cuts the silicon rod to form a cut silicon rod and side skins; the side skin discharging device includes: a side skin lifting unit for lifting the side skins so that the top ends of the side skins protrude from the cut silicon rod; a side skin clamping unit, including: a support column provided on the machine base; a first mounting part provided on the support column; at least one set of side skin clamping mechanisms connected to the first mounting part through a swing arm, for clamping the side skins and lifting the side skins away from the cut silicon rod, and being controlled to rotate around the swing arm rotation shaft to transfer the side skins to the side skin unloading area.

[0006] In a second aspect of the present application, a silicon rod squaring device is further provided for squaring a silicon rod with a circular cross-section. It is characterized by including: a machine base; a silicon rod bearing structure for bearing the vertically placed silicon rod; and a wire cutting device arranged above the silicon rod bearing structure, including a plurality of cutting wheels and a cutting wire around which at least one cutting wire saw is formed; a side skin unloading device as described in any one of the embodiments of the first aspect of the present application.

[0007] In summary, the side skin unloading device and the silicon rod squaring device provided by the present application have the following beneficial effects: The side skin unloading device can be stored in the space above the machine base of the silicon rod squaring device in the idle state to save the equipment space occupied by the overall silicon rod squaring device. In the state of clamping and transporting the side skin, the side skin clamping mechanism can rotate around the swing arm rotating shaft through the swing arm to transport the clamped side skin to the side skin unloading area, thereby shortening the transportation path. At the same time, multiple groups of side skin clamping mechanisms can be arranged in the side skin unloading device to correspond one by one with the silicon rod bearing structure of the silicon rod squaring device to improve the efficiency of side skin clamping and transportation and reduce the time cost. Description of the Drawings

[0008] The specific features of the invention involved in the present application are shown in the appended claims. The features and advantages of the invention involved in the present application can be better understood by referring to the exemplary embodiments and the drawings described in detail below. A brief description of the drawings is as follows:

[0009] Figure 1 It shows a schematic structural diagram of the silicon rod loading and unloading device of the present application in an embodiment.

[0010] Figure 2a It shows a partial structural schematic diagram of the silicon rod loading and unloading device in the state of clamping the silicon rod to be cut in an embodiment.

[0011] Figure 2b It shows a partial structural bottom view of the silicon rod loading and unloading device in the state of clamping the silicon rod to be cut in an embodiment.

[0012] Figure 3a It shows a partial structural schematic diagram of the silicon rod loading and unloading device in the state of clamping the cut silicon rod in an embodiment.

[0013] Figure 3b It shows a partial structural bottom view of the silicon rod loading and unloading device in the state of clamping the cut silicon rod in an embodiment.

[0014] Figure 4 It shows a schematic structural diagram of a silicon rod clamping member of the silicon rod loading and unloading device of the present application in an embodiment.

[0015] Figure 5Shown is a schematic structural view of the silicon rod loading and unloading device of the present application in an embodiment.

[0016] Figure 6 Shown is a schematic structural view of the lifting drive mechanism of the silicon rod loading and unloading device of the present application in an embodiment.

[0017] Figure 7a - 7b Shown are schematic structural views of the lifting drive mechanism of the silicon rod loading and unloading device in different states in an embodiment.

[0018] Figure 8a - 8d Shown are schematic views of the silicon rod loading and unloading device of the present application in different transfer states in an embodiment.

[0019] Figure 9 Shown is a schematic structural view of the silicon rod movement device of the silicon rod processing equipment of the present application in an embodiment.

[0020] Figure 10 Shown is a schematic structural view of the elastic push rod structure of the silicon rod processing equipment of the present application in an embodiment.

[0021] Figure 11 Shown is a partial schematic structural view of the silicon rod conveying device of the silicon rod processing equipment of the present application in an embodiment.

[0022] Figure 12 Shown is a schematic structural view of the silicon rod conveying device of the silicon rod processing equipment of the present application in an embodiment.

[0023] Figure 13 Shown is a schematic structural view of the silicon rod pressing device of the present application in an embodiment.

[0024] Figure 14a Shown is a schematic structural view of the silicon rod pressing device of the present application in an embodiment.

[0025] Figure 14b - 14c Shown as Figure 14a an enlarged view of B in different locking states in

[0026] Figure 15 Shown as Figure 13 an enlarged view of A in

[0027] Figure 16 Shown is a schematic structural view of the wire cutting device of the present application in an embodiment.

[0028] Figure 17 Implemented is a schematic structural view of the wire cutting device of the present application applied to a silicon rod squaring device in an embodiment.

[0029] Figure 18Shown is a schematic structural diagram of the wire cutting device of the present application applied to a silicon rod squaring device in an embodiment.

[0030] Figure 19 Shown is a schematic structural diagram of the wire cutting unit in the wire cutting device of the present application in an embodiment.

[0031] Figure 20 Shown is a schematic structural diagram of an intermediate cutting wheel and a transition wheel beside it in the wire cutting device in an embodiment.

[0032] Figure 21 Shown is a partial structural schematic diagram of the silicon rod processing device for a silicon rod truncating device of the present application in an embodiment.

[0033] Figure 22 Shown is a partial structural schematic diagram of the silicon rod processing device of a silicon rod cutting and grinding integrated machine in an embodiment.

[0034] Figure 23 Shown is a schematic structural diagram of the wire cutting device of the present application in an embodiment.

[0035] Figure 24 Shown is a schematic structural diagram of a transition wheel and a bracket in the wire cutting device of the present application in an embodiment.

[0036] Figure 25 Shown as Figure 23 An enlarged schematic diagram at position C in

[0037] Figure 26 Shown as Figure 17 An enlarged schematic diagram at position D in

[0038] Figure 27 Shown is a top view of the wire cutting device of the present application in an embodiment.

[0039] Figure 28 Shown is a side view of the wire cutting device of the present application in an embodiment.

[0040] Figure 29 Shown as Figure 28 An enlarged structural schematic diagram at position E in

[0041] Figure 30 Shown is a schematic structural diagram of the side skin unloading device of the present application applied to a silicon rod squaring device in an embodiment.

[0042] Figure 31 Shown is a schematic structural diagram of the side skin unloading device of the present application in an embodiment.

[0043] Figure 32 Shown is a schematic structural diagram of the side skin jacking mechanism of the side skin unloading device of the present application in an embodiment.

[0044] Figure 33 Shown is a schematic structural view of the edge skin lifting unit of the edge skin discharging device of the present application in an embodiment.

[0045] Figure 34 Shown is a schematic structural view of the clamping assembly of the edge skin discharging device of the present application in an embodiment.

[0046] Figure 35 Shown is a schematic sectional view of the clamping assembly of the edge skin discharging device of the present application in an embodiment.

[0047] Figure 36 Shown is a schematic sectional view of the clamping assembly of the edge skin discharging device of the present application in another embodiment.

[0048] Figure 37a - 37e Shown are schematic views of different states of the edge skin discharging device performing edge skin transfer in an embodiment. Detailed implementation manners

[0049] The following specific embodiments illustrate the implementation manners of the present application. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.

[0050] In the following description, reference is made to the accompanying drawings, which describe several embodiments of the present application. It should be understood that other embodiments may also be used, and mechanical composition, structure, and operational changes may be made without departing from the spirit and scope of the present disclosure. The following detailed description should not be considered restrictive, and the scope of the embodiments of the present application is only defined by the claims of the published patent. The terms used herein are only for describing specific embodiments and are not intended to limit the present application. Spatially related terms, such as "upper", "lower", "left", "right", "below", "beneath", "lower part", "above", "upper part", etc., may be used in the text to facilitate the description of the relationship between one element or feature shown in the drawings and another element or feature.

[0051] Although in some instances the terms first, second, etc. are used herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are only used to distinguish one element or parameter from another. For example, the first wire groove may be referred to as the second wire groove, and similarly, the second wire groove may be referred to as the first wire groove, without departing from the scope of the various described embodiments. The first wire groove and the second wire groove are both describing a wire groove, but they are not the same wire groove unless the context clearly indicates otherwise in other ways. Similar situations also include the first wire cutting unit and the second wire cutting unit, or the first cutting wheel set and the second cutting wheel set.

[0052] Crystalline silicon is usually processed into the form of silicon wafers in industrial production and then used for product manufacturing. Among them, the originally obtained silicon rods include single-crystal silicon rods and polycrystalline silicon rods. A single-crystal silicon rod is a rod-shaped single-crystal silicon grown from a melt by the Czochralski method or the floating zone melting method. For example, in silicon rod processing, single-crystal silicon rods with length specifications such as 5000 mm or 5360 mm are common, or single-crystal silicon rods with a length of approximately 800 mm, etc. Polycrystalline silicon is a silicon rod in which silicon is precipitated on the surface of a silicon core wire by using precipitation techniques such as chemical vapor deposition technology.

[0053] The existing production process of silicon wafers generally first pulls a polycrystalline silicon brittle material into a single-crystal silicon rod, and then uses a squaring machine for squaring; at this time, the cutting mechanism feeds along the length direction of the silicon rod and cuts out four pairwise parallel planes in the circumferential direction of the silicon rod, so that the cross-section of the silicon rod is a quasi-rectangle; after squaring, a multi-wire slicing machine is used to slice the squared silicon rod along the length direction to obtain the required silicon wafers.

[0054] In the squaring operation of the silicon rod, it is necessary to load the silicon rod to be cut (that is, the silicon rod that has not been squared) onto the preset bearing position on the silicon rod squaring equipment, so as to cooperate with the wire cutting device to cut the silicon rod according to the preset specifications. After squaring, it is necessary to transfer the cut silicon rod away from the bearing structure of the machine base so that the silicon rod squaring equipment can continue to cut and process the silicon rod to be cut.

[0055] The present application provides a silicon rod loading and unloading device for a silicon rod squaring equipment. The silicon rod squaring equipment includes a machine base, a silicon rod bearing structure, and a wire cutting device. The silicon rod bearing structure is used to bear a vertically placed silicon rod; the silicon rod loading and unloading device includes: a first bracket, which is hoisted on the machine base through a mounting frame; a silicon rod clamp, which is arranged on the first bracket and is used to clamp the silicon rod to be cut or the cut silicon rod; a displacement mechanism, which is used to drive the first bracket and the silicon rod clamp thereon to displace in at least one direction on the mounting frame, so that the silicon rod clamp moves to a first predetermined position to clamp the silicon rod to be cut or the cut silicon rod and transfer the clamped silicon rod to be cut or the cut silicon rod to a second predetermined position.

[0056] Here, the first predetermined position and the second predetermined position are not limited to fixed positions or regions established in the established coordinate system. In the examples provided in this application, by determining the transfer path of the loading and unloading device during loading and unloading and conforming to the chronological order of the transfer, the starting position of the first bracket in the silicon rod loading and unloading device in the transfer path is used as the first predetermined position, and the end position of the first bracket is used as the second predetermined position. Here, when the silicon rod loading and unloading device performs the feeding process, the position where the silicon rod clamp holds the silicon rod to be cut is the first predetermined position, and the position where the silicon rod to be cut is moved above the supporting surface of the silicon rod bearing structure by the movement of the moving mechanism to place the silicon rod to be cut on the silicon rod bearing structure is the second predetermined position; conversely, when the silicon rod loading and unloading device performs the unloading process of moving the cut silicon rod after squaring out of the machine base, the position where the first bracket is adjacent to the silicon rod bearing structure to hold the cut silicon rod is used as the starting position, that is, the first predetermined position, and the position where the cut silicon rod is transported away from the machine base by the silicon rod clamp and released is the second predetermined position.

[0057] Please refer to Figure 1 , which shows a schematic structural diagram of the silicon rod loading and unloading device of this application in an embodiment. As shown in the figure, the first bracket 31 is hoisted on the machine base by an installation frame 33. Here, the first bracket 31 can be used as the bearing structure of the silicon rod clamp 32. The first bracket 31 is movably arranged on the installation frame 33 and can move in at least one direction under the action of the displacement mechanism, thereby realizing the movement of the silicon rod to be cut or the cut silicon rod clamped by the silicon rod clamp 32.

[0058] The installation frame 33 is arranged above the machine base. Here, the installation frame 33 can be used to determine the path and range span of the movement of the first bracket 31 along the installation frame 33. In some embodiments, such as Figure 1 In the example shown, the installation frame 33 is arranged above the silicon rod bearing structure in the loading and unloading area of the silicon rod processing platform of the machine base. At the same time, the length range of the installation frame 33 in the first direction is greater than the loading and unloading area, or the length endpoints of the installation frame 33 in the first direction are located outside the silicon rod bearing structure in the loading and unloading area, so that when the first bracket 31 moves along the installation frame 33, it can move to the adjacent position of any silicon rod bearing structure in the loading and unloading area to place the silicon rod to be cut on the corresponding silicon rod bearing structure or transport the cut silicon rod on the silicon rod bearing structure away from the loading and unloading area. Here, the loading and unloading area is the area for loading and unloading on the silicon rod processing platform of the silicon rod squaring equipment. For example, in some examples, the installation frame 33 is arranged parallel to the wire cutting support of the silicon rod squaring equipment to make full use of the spare equipment space above the machine base.

[0059] The silicon rod loading and unloading device 3 can be arranged on the machine base of the silicon rod squaring device through the mounting frame 33. In some examples, the silicon rod loading and unloading device 3 can also be separated from the silicon rod squaring device as an independent component, such as an independent sales device. For example, the mounting frame 33 is detachably connected to the silicon rod squaring device, and the mounting frame 33, the first bracket 31 and the silicon rod clamp 32 can be arranged on the silicon rod squaring device; alternatively, the first bracket 31 is detachably connected to the mounting frame 33, and the first bracket 31 and the silicon rod clamp 32 can be arranged on the silicon rod squaring device including the mounting frame 33 or the lifting frame.

[0060] The silicon rod clamp 32 is arranged on the first bracket 31. Herein, the silicon rod clamp 32 includes a silicon rod clamping member that contacts the surface of the silicon rod and performs a clamping or releasing action. In some examples, the silicon rod clamp 32 includes one silicon rod clamping member. In this example, the clamping surface of the silicon rod clamping member can be set to have a certain height to ensure that the contact area between the silicon rod clamping member and the side surface of the vertically placed silicon rod in the clamped state can achieve clamping.

[0061] Please refer to Figure 2a , which shows a schematic structural diagram of the first bracket 31 and the silicon rod clamp of the silicon rod loading and unloading device of the present application in an example. As Figure 2a shown, any one of the silicon rod clamping members on the first bracket 31 includes a first clamping arm 321 and a second clamping arm 322 arranged oppositely, and a clamping arm driving mechanism 320 for driving the first clamping arm 321 and the first clamping arm 321 to perform an opening and closing action. It should be understood that the first clamping arm 321 and the second clamping arm 322 can be mirror-symmetrically arranged or symmetrically arranged. When the first clamping arm 321 and the second clamping arm 322 perform a closing action, they can be used to approach and clamp the silicon rod; when the first clamping arm 321 and the second clamping arm 322 perform an opening action, they can be used to release the clamped silicon rod.

[0062] In some embodiments, the first clamping arm and the second clamping arm have a clamping arc surface and a clamping plane. Herein, the silicon rod clamping member can be used to clamp the silicon rod to be cut or the cut silicon rod. To place the clamped silicon rod vertically on the silicon rod bearing structure or clamp the vertically placed silicon rod from the silicon rod bearing structure, the first clamping arm and the first clamping arm perform clamping on the side surface of the silicon rod through an opening and closing action, that is, the silicon rod is vertical in the clamped state. Correspondingly, the first clamping arm and the first clamping arm have a clamping arc surface adapted to the arc surface of the surface of the silicon rod to be cut, and a clamping plane adapted to the side plane of the cut silicon rod.

[0063] The clamping arc surfaces of the first clamping arm and the second clamping arm are not limited to providing an arc surface for contacting the silicon rod on the clamping arm. In some implementation manners, please refer to Figures 2a to 3b, showing the side view and bottom view of the silicon rod clamp of the present application in different clamping states, wherein, Figure 2a and Figure 2b The three-dimensional schematic diagram and bottom view of the silicon rod clamping piece clamping the silicon rod to be cut with an arc-shaped side surface are shown. Figure 3a and Figure 3b The three-dimensional schematic diagram and bottom view of the silicon rod clamping piece clamping the cut silicon rod. As shown in the figure, the first clamping arm and the second clamping arm are symmetrically provided with a clamping arc surface and a clamping plane.

[0064] like Figure 3a , Figure 3b As shown, the clamping arc surface can be a contact plane arranged in different directions in accordance with the curvature of the silicon rod surface. Figure 3b In the view shown, the planes in different directions on a single clamping arm are symmetrical to the diameter of the silicon rod cross section, so that the pressure applied to the silicon rod by the first clamping arm 321 and the second clamping arm 322 during clamping converges at the center of the silicon rod cross section, thereby preventing the extension line of the resultant pressure force on the silicon rod in the clamped state from being outside the clamping arc surface, causing the silicon rod to have a tendency to escape from the silicon rod clamping piece.

[0065] In some implementations, the clamping arc surface of the first clamping arm and the second clamping arm exceeds a quarter of the arc on the side of the silicon rod to be cut, and the clamping contact surface formed during clamping exceeds a half of the arc on the side of the silicon rod; furthermore, a buffer pad may be provided on the clamping arc surface to avoid damaging the surface of the silicon rod in the clamping state. The buffer pad is made of, for example, elastic rubber material, or silicone or other materials with elastic deformation, damping properties or buffering properties to prevent the surface of the silicon rod to be cut or the cut silicon rod from being scratched or broken during clamping and transportation.

[0066] In some examples, the clamp arm driving mechanism includes: an opening and closing gear, a rack and a driving source (not shown in the figure); wherein, the first clamp arm and the second clamp arm are respectively provided with an opening and closing gear, and the opposite sides of the rack are respectively provided with tooth patterns corresponding to the opening and closing gears on the first clamp arm and the second clamp arm, and the driving source is connected to the gear driving component for driving the gear driving component to move.

[0067] In one implementation, the gear drive is a rack, which is located between the first clamping arm and the second clamping arm. Tooth patterns corresponding to the opening and closing gears on the first clamping arm and the second clamping arm are respectively provided on the two outer side surfaces of the rack facing the clamping arms on both sides. The drive source can be, for example, a drive motor or a cylinder. Thus, according to the above implementation, in practical applications, when it is necessary to achieve the clamping of the clamping arms, the rack serving as the gear drive is driven upward by the drive motor or cylinder serving as the drive source, and the rack drives the opening and closing gears engaged on both sides to perform an outward rotation action. During the outward rotation of the opening and closing gears, the clamping arms (the opening and closing gears and the clamping arms can be connected through a rotating shaft) are driven to perform a lowering action to change from the loosening state to the clamping state; conversely, when it is necessary to achieve the loosening of the clamping arms, the rack serving as the gear drive is driven downward by the drive motor (or cylinder) serving as the drive source, and the rack drives the opening and closing gears engaged on both sides to perform an inward rotation action. During the inward rotation of the opening and closing gears, the clamping arms (the opening and closing gears and the clamping arms can be connected through a rotating shaft) are driven to perform a raising action to change from the clamping state to the loosening state. Of course, the above is only an example and is not used to limit the working state of the silicon rod clamping member. In fact, the above-mentioned state changes of "upward", "outward rotation", "lowering", "downward", "inward rotation", "raising", as well as "loosening" and "clamping" can have other changes according to the structure and operation mode of the clamping arms and the structure of the clamping arm drive mechanism.

[0068] In another implementation, please refer to Figure 4, which shows a schematic structural view of a silicon rod clamping member of the silicon rod loading and unloading device of the present application in an embodiment. As shown in the figure, the clamping arm driving mechanism 320 includes: a first rack 3201, a second rack 3202, a clamping cylinder 3203, and a transmission gear 3204; the first rack 3201 is linked to the first clamping arm, the second rack 3202 is linked to the second clamping arm, and the transmission gear 3204 meshes with the first rack 3201 and the second rack 3202, and is used to drive the first clamping arm and the second clamping arm to move towards each other to perform a closing action when rotating forward, and drive the first clamping arm and the second clamping arm to move away from each other to perform an opening action when rotating reversely. Based on the basic law of external meshing between gears or between a gear and a rack, when the transmission gear 3204 rotates, the first rack 3201 moves in the opposite direction to the linear velocity of the upper tooth part of the transmission gear 3204; when the transmission gear 3204 rotates, the second rack 3202 moves in the opposite direction to the linear velocity of the lower tooth part of the transmission gear 3204. When the transmission gear 3204 rotates, the first rack 3201 and the second rack 3202, which are centrosymmetric about the gear center, must satisfy the relationship that the linear velocity directions are opposite, that is, they show a movement of approaching each other or moving away from each other. For example, when the clamping cylinder 3203 pushes the first rack 3201 or the second rack 3202 to move to drive the transmission gear 3204 to rotate, when the transmission gear 3204 is in the forward rotation state, the first rack 3201 and the second rack 3202 approach each other to drive the first clamping arm and the second clamping arm to approach each other to perform a closing action; when the transmission gear 3204 is in the reverse rotation state, the first rack 3201 and the second rack 3202 move away from each other to drive the first clamping arm and the second clamping arm to move away from each other to perform an opening action.

[0069] In another implementation manner, the clamping arm driving mechanism includes a first rack, a second rack, and a driving gear; the first rack is linked to the first clamping arm, the second rack is linked to the second clamping arm, the driving gear is connected to the power output shaft of a driving motor (not shown), and meshes with the first rack and the second rack, and is used to drive the first clamping arm and the second clamping arm to move towards each other to perform a closing action when rotating forward, and drive the first clamping arm and the second clamping arm to move away from each other to perform an opening action when rotating reversely. The first rack and the second rack can be meshed on both sides of the driving gear, so that when the driving gear rotates, the linear velocity directions at the first rack and the second rack are opposite. The driving motor drives the driving gear to rotate. When the driving gear rotates forward, the first rack and the second rack move towards each other, that is, drive the first clamping arm and the second clamping arm to move towards each other to perform a closing action. When the driving gear is driven to rotate reversely, the first rack and the second rack move away from each other to drive the first clamping arm and the second clamping arm to move away from each other to perform an opening action.

[0070] In some examples, the silicon rod holder in the silicon rod clamp is fixedly arranged on the first bracket in the lifting direction and is used to hold silicon rods within the same specification or a preset specification range (for example, with a length of 500 mm to 800 mm). In some examples, multiple groups of silicon rod holders can be arranged on the first bracket to ensure that the silicon rods that can be held by the silicon rod loading and unloading device cover various length specifications.

[0071] Here, for single-wafer silicon rods, they are formed by truncating the original long silicon rods, which will inevitably result in significant differences in the sizes between single-wafer silicon rods. Given that the silicon rod holder is used to hold single-wafer silicon rods in a vertically placed state or the sawn and cut silicon rods after squaring, therefore, for the silicon rod clamp, the influence of the aforementioned size differences is mainly manifested as the concern about whether the silicon rod holder in the silicon rod clamp can correspondingly hold the single-wafer silicon rod due to the length difference of the single-wafer silicon rods.

[0072] To reduce or even eliminate the risk that the above silicon rod holder may not be able to hold the silicon rod, there are different design solutions for the silicon rod clamp.

[0073] In some examples, the silicon rod clamp includes at least two silicon rod holders, and the distance between the two silicon rod holders is set on the first bracket. For example Figure 2a 、 Figure 3a In the illustrated embodiment, the main body of the first bracket 31 is vertical, and the two silicon rod holders in the silicon rod clamp are arranged at an interval up and down on the first bracket 31. In a specific implementation manner, the silicon rod holder can be arranged on the first bracket 31 through a holder mounting seat. In some examples, the holder mounting seat is movably arranged on the first bracket 31 to adjust the clamping position of the silicon rod holder relative to the silicon rod or the distance between the spaced silicon rod holders. For example, in the illustrated embodiment, the first bracket 31 is provided with a lifting guide rail, and the holder mounting seat can be arranged as a slider movably arranged on the lifting guide rail, thereby enabling up and down movement along the first bracket 31. With this setting, the distance between different silicon rod holders can be adjusted, and thus different specifications of silicon rods can be held based on a smaller number of silicon rod holders, such as two.

[0074] In some examples, the silicon rod clamp further includes a lifting drive mechanism, and at least one of the at least two silicon rod holders is driven by the lifting drive mechanism to perform a lifting movement along the first bracket. For example, when the silicon rod clamp includes two silicon rod holders, one silicon rod holder can be fixed to the first bracket, and the other silicon rod holder is movably arranged on the first bracket and is driven by the lifting drive mechanism to move up and down along the first bracket; another example is that both of the two silicon rod holders in the silicon rod clamp can be movably arranged on the first bracket and are driven by the lifting drive mechanism to move up and down along the first bracket.

[0075] In some examples, the lifting drive mechanism includes: a transmission chain and at least one locking device; wherein, the transmission chain is wound around two transmission sprockets arranged vertically, at least one of the two transmission sprockets is pivotally connected to a sprocket drive source, and the at least one locking device is arranged on at least one silicon rod clamping member for switching between two states of locking and movement between the at least one silicon rod clamping member and the transmission chain.

[0076] Here, the at least one locking device corresponds to at least one silicon rod clamping member. For example, when there is one locking device, it is arranged on one silicon rod clamping member; when there are two locking devices, they are arranged on two silicon rod clamping members. Each locking device is used to control the locking or movement state between one silicon rod clamping member and the transmission chain, so as to realize the state switching of the silicon rod clamping member conforming to the movement of the transmission chain or stopping at a preset height on the first bracket.

[0077] Please refer to Figure 5 , which shows a schematic structural diagram of the silicon rod loading and unloading device of the present application in an embodiment. A transmission chain 3231 is provided in the lifting drive mechanism 323. The transmission chain 3231 can be set as a ring chain (as shown in the embodiment of Figure 5 ) or an open sprocket with endpoints. At least one of the wound transmission sprockets 3232 is driven to rotate by a sprocket drive source 3233 such as a drive motor, thereby driving the transmission chain 3231 engaged with the transmission sprocket 3232 to move. The movement direction of the transmission chain 3231 is determined by the positions of the vertically arranged transmission sprockets 3232. For example, when the vertically arranged transmission sprockets 3232 are on the same vertical line, the transmission chain 3231 between the two transmission sprockets 3232 moves in the lifting direction.

[0078] Please refer to Figure 6, which is shown as a simplified schematic diagram of a partial structure of the lifting drive mechanism of the present application in an embodiment. In some embodiments, the locking device 3234 includes: a locking sprocket 32341 and a locking mechanism 32340. The locking sprocket 32341 is rotatably arranged on the silicon rod clamping member and meshes with the transmission chain 3231. The locking mechanism 32340 is arranged on the silicon rod clamping member and is used to lock the locking sprocket 32341 so that the locking sprocket 32341 is stationary relative to the transmission chain 3231, so that the silicon rod clamping member connected to the locking sprocket 32341 is switched from an active state to a locked state with respect to the transmission chain 3231. Here, the locking sprocket 32341 can be connected to the silicon rod clamping member through a sprocket shaft. In the idle state of the locking mechanism 32340, the locking sprocket 32341 rotates around the sprocket shaft under the drive of the engaged transmission chain 3231; when the locking mechanism 32340 is in the working state, the locking mechanism 32340 restricts the rotation of the locking sprocket 32341 to apply a force in the lifting direction to the locking sprocket 32341 and the silicon rod clamping member by the movement of the transmission chain 3231 in the lifting direction. Therefore, in a state where the movement of the locking sprocket 32341 relative to the transmission chain is stationary, the silicon rod clamping member can move up and down along the first bracket under the drive of the transmission chain 3231. Here, the locking mechanism 32340 can, for example, restrict the rotation of the locking sprocket 32341 by clamping the teeth of the locking sprocket 32341.

[0079] Please refer to Figure 7a and Figure 7b , which is shown as a schematic diagram of the structure of the lifting drive mechanism of the present application in different locked states in an embodiment. In some embodiments, as shown in the figure, the locking mechanism 32340 includes a locking cylinder 32342 and a locking portion 32343. The locking portion 32343 is connected to the telescopic end of the locking cylinder 32342 and enters the teeth of the locking sprocket 32341 under the drive of the locking cylinder 32342 to lock the locking sprocket 32341.

[0080] In a specific embodiment, the detailed structure of the locking mechanism 32340 is: including a locking cylinder 32342 fixedly installed on the silicon rod clamping member. The telescopic rod of the locking cylinder 32342 can telescopically extend along the radial direction of the locking sprocket 32341. At the same time, a locking portion 32343 is fixed at the end of the telescopic rod of the locking cylinder 32342. The outer contour of the locking portion 32343 is a rectangular block structure. A plug pin is arranged on one side of the locking portion 32343 close to the locking sprocket 32341. When the locking portion 32343 is driven by the locking cylinder 32342 to extend into the locking sprocket 32341, the locking portion 32343 locks the locking sprocket 32341 so that there is no relative rotation between it and the transmission chain 3231 (as shown in Figure 7bThe state shown). At this time, the silicon rod clamping member connected to the locking mechanism 32340 moves up and down synchronously with the transmission chain 3231. When the silicon rod clamping member is lifted to a preset height, the locking portion 32343 contracts and retracts, so that the locking sprocket 32341 returns to the state of rotatably engaging with the transmission chain 3231 (in the state as shown in Figure 7a the state shown), and the silicon rod clamping member loses the force in the lifting direction transmitted by the locking sprocket 32341, and can be stably fixed at the preset height.

[0081] At the same time, in the specific implementation process, because the locking portion is under a relatively large force from the locking sprocket after entering the locking sprocket, it is easy to cause the telescopic rod of the locking cylinder to deform during the long-term force application process, affecting the service life of the locking cylinder. To solve this problem, in some examples, a holding portion is fixedly provided on the silicon rod clamping member. The holding portion is composed of two pressing plates, which are respectively arranged on both sides of the locking portion, and a sliding channel parallel to the telescopic direction of the locking cylinder is formed between the holding portion and the silicon rod clamping member. The locking portion is slidably arranged in this sliding channel. When the locking portion is subjected to a relatively large force from the locking sprocket and is about to change the shape of the telescopic rod of the locking cylinder, the holding portion presses on the outside of the locking portion, which can play a certain stabilizing role.

[0082] In other realizable ways, the holding portion 3235 can also be a rectangular block arranged along the movement track direction of the locking portion. A sliding groove is arranged in the rectangular block, and the locking portion is slidably arranged in the sliding groove and moves along the radial direction of the locking sprocket.

[0083] In some cases, the transmission chain 3231 may shake during the transmission process, resulting in the disengagement of the transmission chain 3231 from the locking sprocket 32341, so that the silicon rod clamping member and the transmission chain 3231 are always in an active state. To eliminate the possibility of this situation occurring, in some embodiments, an anti-disengagement mechanism 3235 is further provided in the lifting drive mechanism 323, as shown in Figure 5 the illustrated embodiment. The anti-disengagement mechanism 3235 is a U-shaped structure, and its two parallel side edges are fixed on the silicon rod clamping member to move up and down synchronously with the silicon rod clamping member, while the bottom of the groove at the bottom of the U-shaped structure of the anti-disengagement mechanism 3235 is close to the transmission chain 3231. When the transmission chain 3231 shakes and is about to disengage from the locking sprocket 32341, the bottom of the groove of the anti-disengagement mechanism 3235 will surely exert a force on the transmission chain 3231 in the radial direction of the locking sprocket 32341, thereby preventing the transmission chain 3231 from disengaging from the locking sprocket 32341.

[0084] Here, based on the locking device 3234, the locking state in which the silicon rod clamping member moves synchronously with the drive chain 3231 or the switching of the relative movement state between the silicon rod clamping member and the drive chain 3231 can be achieved. In an actual scenario, based on the preset adjustment height of the silicon rod clamping member, the locking device 3234 locks the silicon rod clamping member and the drive chain 3231. When the silicon rod clamping member is lifted or lowered to the preset height under the drive of the drive chain 3231, the locking device 3234 restores the movable state between the silicon rod clamping member and the drive chain 3231, so that the silicon rod clamping member can be stably positioned at the preset height position of the first bracket 31. Of course, the movement range of the silicon rod clamping member is related to the first bracket 31. With the silicon rod clamping member arranged in this movable manner, the range of the length specifications of the silicon rods that the silicon rod clamp can clamp is increased.

[0085] Please refer to Figure 1 and Figure 5 , the first bracket 31 and the silicon rod clamp 32 provided on the first bracket 31 can be displaced on the mounting frame 30 in at least one direction under the action of the displacement mechanism 33, so that the silicon rod clamp 32 transfers the silicon rod from the first predetermined position to the second predetermined position after clamping.

[0086] In some embodiments, the displacement mechanism 33 includes a first-direction displacement mechanism. The first-direction displacement mechanism includes a first-direction guide rail 3310 and a first driving device (not shown in the figure). The first-direction guide rail 3310 is provided on the mounting frame 30, and the first driving device is used to drive the first bracket 31 to displace along the first-direction guide rail on the mounting frame 30. The first bracket is connected to the mounting frame 30 based on a first slider 3311 adapted to the first-direction guide rail 3310 to form a degree of freedom of movement along the first-direction guide rail 3310.

[0087] Here, the first bracket 31 is hoisted on the machine base through the mounting frame 30, and can move along the mounting frame 30 above the machine base under the drive of the first driving device. In an actual scenario, the mounting frame 30 is provided with a first-direction guide rail 3310 for hoisting the first bracket 31. The first-direction guide rail 3310 can be set to span both ends of the first direction of the machine base, or the length of the first-direction guide rail 3310 can cover each silicon rod bearing structure in the loading and unloading area, so that the first frame 31 arranged on the first-direction guide rail 3310 can move along the first-direction guide rail 3310 to the adjacent position of each silicon rod bearing structure in the loading and unloading area under the drive of the first driving device. In some examples, the silicon rod bearing structures in the loading and unloading area of the silicon rod processing platform are arranged on the same straight line in the first direction, and the first-direction guide rail 3310 can be arranged above the straight line connecting the silicon rod bearing structures, so that the first frame 31 can move above the supporting part of the silicon rod bearing structure to clamp the cut silicon rod carried on the silicon rod bearing structure or place the silicon rod to be cut on the silicon rod bearing structure.

[0088] The first driving device is, for example, a traveling motor. The first bracket can be connected to the first-direction guide rail through a traveling lead screw. The traveling lead screw is laid on the first-direction guide rail and is simultaneously connected to the traveling motor, so that the first bracket can be driven by the traveling motor to move along the first-direction guide rail. In some examples, the first driving device can also be a driving motor that drives the first bracket to move by means of a ball screw. The present application does not make any restrictions.

[0089] By moving along the mounting frame 30, the first bracket 31 can realize loading and unloading in the equipment space above the machine base. When the silicon rod squaring equipment is in an idle state, the first frame 31 can move above the machine base to realize storage, thereby reducing the inconvenience of operation caused by the excessive space occupied by the equipment during the process flow, and then increasing the efficiency of the process flow in silicon rod processing.

[0090] In some embodiments, the displacement mechanism further includes a second-direction displacement mechanism. The second-direction displacement mechanism includes a second-direction guide rail and a second driving device. The second-direction guide rail is used to arrange the first bracket, and the second driving device is used to drive the first bracket to move along the second-direction guide rail. The second driving device is, for example, a traveling motor, which drives the first bracket to move along the second-direction guide rail through a traveling lead screw. Of course, the second driving device can also be set as other devices that can realize pushing the first frame to move, such as driving the first frame to move through a chain conveying mechanism. The present application does not make any restrictions.

[0091] Please continue to refer to Figure 1 and Figure 5, herein, the first bracket 31 is disposed on the first-direction guide rail 3310 of the mounting frame through the second-direction guide rail 3320. Herein, the first bracket 31 can be connected to the second-direction guide rail 3320 through the second slider 3321, for example. The first bracket 31 can move along the first direction, i.e., the length direction of the machine base, driven by the first driving device. At the same time, it can also move in the second direction along the second-direction guide rail 3320 driven by a second driving device (not shown in the figure). The moving range of the first bracket 31 and the silicon rod clamp 32 in space is increased, so that it can be applicable to transferring the silicon rod between a first preset position and a second preset position with different spatial position relationships. For example, when there is a certain distance between the first preset position and the second preset position in the second direction, the silicon rod clamp 32 can move along the second-direction guide rail 3320 to reach the target position.

[0092] In a scenario, when the first preset position is the position for placing the silicon rod to be cut outside the machine base, and the second preset position is the supporting position of the silicon rod bearing structure, the first bracket moves to a straight line in the second direction where the connection line with the first preset position is under the drive of the first driving device, and then approaches the first preset position under the drive of the second driving device; of course, it can also be first moved to a straight line in the first direction where the connection line between the first bracket and the first preset position is under the drive of the second driving device, and then moved to the first preset position through the drive of the first driving device; it should be noted here that the first driving device and the second driving device are independent of each other. Therefore, the moving path of the first bracket and the silicon rod clamp can also be a multi-segment broken line. For example, it first moves a certain distance along the first direction, then moves along the second direction, and then moves along the first direction again to the preset position. The foregoing moving directions are only examples to illustrate some achievable moving paths. The first bracket only needs to move to the preset position; at the same time, in the actual scenario, in accordance with the equipment layout and the direction of the moving guide rail of the moving mechanism, the moving path can also be changed accordingly. Similarly, after the first bracket reaches the first preset position, the moving path from the first preset position to the second preset position can also be set based on the moving range determined by the shifting mechanism. When the moving range can cover the first preset position and the second preset position, the transfer can be realized.

[0093] Herein, the moving path has various optional ways. However, based on the setting of the silicon rod loading and unloading device of the present application, the moving path transfers the silicon rod through a straight path or a broken path, and at the same time utilizes the equipment space above the machine base for transfer and can use the equipment space as the accommodation space of the silicon rod loading and unloading device. During the transfer, it can reduce the occupation of the space outside the machine base of the silicon rod squaring equipment. At the same time, the silicon rod loading and unloading device can be integrally set with the silicon rod squaring equipment, so that the process of calling the equipment of the silicon rod loading and unloading device is omitted, making the transfer process simpler.

[0094] Please refer to Figures 8a to 8d , which shows a schematic structural diagram of the silicon rod loading and unloading device of the present application in different transfer states.

[0095] In an embodiment of the present application, the process of the silicon rod loading and unloading device clamping the silicon rod to be cut is as follows:

[0096] The silicon rod clamping member follows the first bracket 31 and moves along the mounting frame 30 driven by the first direction displacement mechanism. The silicon rod clamping member and the first bracket 31 can be driven by a first driving device, for example, to move along the first direction guide rail provided on the mounting frame 30; at the same time, in some scenarios, the first bracket 31 and the silicon rod clamping member can be driven by a second direction displacement mechanism, for example, to move along the second direction guide rail driven by a second driving device; through the first displacement mechanism or / and the second displacement mechanism, the silicon rod clamping member follows the first bracket 31 to move closer to the silicon rod to be cut located at the first predetermined position (in the state as shown in Figure 8a ); furthermore, during the process of the silicon rod clamping member following the first bracket to move, the silicon rod clamping member can control the first clamping arm and the second clamping arm of the silicon rod clamping member to perform opening or closing actions based on the moving state (or moving position) it is in. For example: before reaching the first predetermined position, the driving gear of the silicon rod clamping member rotates reversely driven by the motor, so that the first clamping arm and the second clamping arm are separated until the clamping space between the clamping arms is larger than the diameter of the silicon rod or there is a gap with the silicon rod to form a receiving space for the silicon rod to be cut. When the first bracket 31 drives the silicon rod clamping member to move to the position where the silicon rod to be cut is located in the receiving space between the first clamping arm and the second clamping arm, the driving gear rotates forward to control the first clamping arm and the second clamping arm to approach each other, that is, to approach the silicon rod to be clamped. When the first clamping arm and the second clamping arm contact and clamp the silicon rod, they stop moving towards each other.

[0097] After the silicon rod clamping member clamps the silicon rod and maintains the clamping state, according to the preset placement position of the silicon rod, the first bracket 31 and the silicon rod clamping member are driven by the first direction displacement mechanism or / and the second direction displacement mechanism to transfer the silicon rod along the preset path until the clamped silicon rod is transported to the second predetermined position (in the state as shown in Figure 8b ), and then the first clamping arm and the second clamping arm perform an opening action to release the silicon rod. Here, the second predetermined position is, for example, directly above the supporting surface for supporting the silicon rod in the silicon rod bearing structure where the silicon rod to be cut is clamped.

[0098] In the embodiments shown in Figure 8a and Figure 8b , the process of the silicon rod clamping member loading the silicon rod to be cut into the silicon rod bearing structure should be understood that when the transportation of a silicon rod to be cut is completed (in the state as shown in Figure 8bthe state shown), the silicon rod holder returns to the first predetermined position (in the state as shown in Figure 8a the state shown) under the drive of the first-direction displacement mechanism or / and the second-direction displacement mechanism of the first bracket, so as to continue to perform the loading and transportation of the next silicon rod to be cut; after the silicon rod loading and unloading device has loaded all the silicon rods to be cut in the corresponding squaring operation, for example Figure 8a or Figure 8b in the silicon rod squaring equipment with the view shown, after the silicon rod loading and unloading device has loaded the corresponding silicon rods to be cut on multiple silicon rod bearing structures in the loading and unloading area on the machine base, the first bracket 31 and the silicon rod holder can also return to an initial position under the drive of the first-direction displacement mechanism or / and the second-direction displacement mechanism. The initial position is, for example, the waiting position of the silicon rod loading and unloading device in the non-working state. In the actual scenario, the initial position can be set based on the layout of the silicon rod squaring equipment. For example, in Figure 8a or Figure 8b the shown example, the initial position can be set at the end of the installation frame 30.

[0099] In some examples, when the silicon rod loading and unloading device performs the unloading process of the cut silicon rod, similarly, the silicon rod clamp and the first bracket 31 move along the installation frame 30 following the drive of the displacement mechanism. Here, when moving to the adjacent position of the silicon rod bearing structure carrying the cut silicon rod, that is, the first predetermined position (in the state as shown in Figure 8c the state shown), the first clamping arm and the second clamping arm approach each other, that is, approach the silicon rod to be clamped, and stop moving towards each other when contacting and clamping the silicon rod; the silicon rod clamp and the first bracket 31 move along a straight line or a broken line under the drive of the first-direction displacement mechanism and the second-direction displacement mechanism according to the second predetermined position to transfer the cut silicon rod out of the processing platform of the machine base and transfer the cut silicon rod to the second predetermined position for blanking (in the state as shown in Figure 8d the state shown). After the unloading operation is completed, the first bracket 31 and the silicon rod holder can also return to the aforementioned initial position.

[0100] On the other hand, the present application also provides a silicon rod squaring equipment, including a machine base, a silicon rod bearing structure, a wire cutting device, and a silicon rod loading and unloading device hoisted on the machine base as described in any one of the embodiments in Figures 1 to 8d the shown embodiments. Wherein, the silicon rod bearing structure is used to bear the vertically placed silicon rod, and the silicon rod loading and unloading device is used to clamp the silicon rod to be cut or the cut silicon rod and move the clamped silicon rod to be cut or the cut silicon rod to a predetermined position.

[0101] In some examples, the wire cutting device includes a liftable wire cutting support and a wire cutting unit provided on the wire cutting support. The wire cutting unit has a cutting wire saw, that is, the lifting movement of the wire cutting support can drive the cutting wire saw to cut the silicon rod placed vertically on the silicon rod bearing structure. Before cutting, the silicon rod to be cut needs to be placed in the loading and unloading area of the silicon rod squaring equipment, and after cutting, the cut silicon rod needs to be transferred out in time to perform the flow operation of squaring different silicon rods. The silicon rod loading and unloading device can transfer the silicon rod to be transferred from the first predetermined position to the second predetermined position to cooperate with the wire cutting device to cut different silicon rods.

[0102] Here, the silicon rod loading and unloading device is hoisted on the machine base. The silicon rod clamp realizes the conversion between the first predetermined position and the second predetermined position by means of a displacement mechanism. In some scenarios, the placement area of the silicon rod to be cut and the area where the cut silicon rod is placed are at a relatively long distance from the machine base. For example, it is necessary to transfer the silicon rod to be cut to the first predetermined position, and then the silicon rod loading and unloading device transfers the silicon rod to be cut to the silicon rod bearing structure; another example is that after the wire cutting saw finishes squaring the silicon rod, the silicon rod loading and unloading device transfers the cut silicon rod from the silicon rod bearing structure to the second predetermined position, and then transfers the cut silicon rod at the second predetermined position to the preset placement area of the cut silicon rod or to the next process equipment.

[0103] Here, the first predetermined position and the second predetermined position are not limited to the fixed positions or areas established in the established coordinate system. In the examples provided in this application, by determining the transfer path of the loading and unloading device during loading and unloading and conforming to the chronological order of the transfer, the starting position of the first support in the silicon rod loading and unloading device in the transfer path is used as the first predetermined position, and the end position of the first support is used as the second predetermined position. Here, when the silicon rod loading and unloading device performs the feeding process, the position where the silicon rod clamp clamps the silicon rod to be cut is the first predetermined position, and the position where the silicon rod to be cut is moved above the supporting surface of the silicon rod bearing structure by the movement of the moving mechanism to place the silicon rod to be cut on the silicon rod bearing structure is the second predetermined position; on the contrary, when the silicon rod loading and unloading device performs the unloading process of moving the cut silicon rod out of the machine base after squaring, the position where the first support is adjacent to the silicon rod bearing structure to clamp the cut silicon rod is used as the starting position, that is, the first predetermined position, and the position where the cut silicon rod is transferred away from the machine base by the silicon rod clamp and released is the second predetermined position.

[0104] In some examples, the silicon rod squaring equipment further includes a silicon rod conveying device. The silicon rod transfer device includes a feeding transfer part and a feeding driving source. Among them, the feeding transfer part is used to convey the silicon rod to be cut, and the feeding driving source is used to drive the feeding transfer part to move to drive the silicon rod to be cut to move.

[0105] The feeding and transferring part transfers the silicon rod to be cut carried thereon to the first predetermined position under the drive of the feeding drive source, and the silicon rod loading and unloading device can realize the transfer of the silicon rod. In some examples, the end of the feeding and transferring part is arranged at the first predetermined position where the silicon rod loading and unloading device performs the feeding process.

[0106] Please refer to Figure 9 , which shows a schematic structural diagram of the silicon rod conveying device of the silicon rod processing equipment of the present application in an embodiment. In some examples, the feeding and transferring part 41 includes a carrying part 411 for carrying the silicon rod to be cut and a chain conveying mechanism 412; wherein, the carrying part 411 has two rows of rollers arranged oppositely, and the chain conveying mechanism 412 includes a conveying chain 4121 and at least two sprockets 4122 arranged at both ends of the conveying chain 4121 and meshed with the conveying chain 4121. Here, the carrying part 411 is the part for realizing the support of the silicon rod, and the horizontally arranged silicon rod is contacted and transported through the oppositely arranged rollers. At least one of the sprockets 4122 meshed with the conveying chain is used as a driving sprocket and is connected to a sprocket drive source. For example, the driving sprocket 4122 is axially connected to the power output shaft of a motor to drive the conveying chain 4121 to rotate.

[0107] In some examples, the feeding and transferring part 41 has a relatively long conveying distance, and the corresponding conveying chain 4121 is relatively long. To prevent the conveying chain 4121 from becoming slack or disengaging from the sprocket 4122, a plurality of sprockets 4122 are provided in the chain conveying mechanism 412, and the plurality of sprockets 4122 can be arranged at equal intervals, for example, to ensure the tension of each part of the conveying chain 4121.

[0108] In some examples, the feeding and transferring part further includes at least one elastic push rod structure, and the at least one elastic push rod structure is connected to the conveying chain and is used to push the silicon rod to be cut to move along the feeding and transferring part.

[0109] Please refer to Figure 9 、 Figure 10 , wherein, Figure 10 which shows a schematic structural diagram of the elastic push rod structure 413 in an embodiment. As shown in the figure, the elastic push rod structure 413 includes a push rod 4131 and a torsion spring 4132. The elastic push rod structure 413 is arranged on the conveying chain 4121 and abuts against the end face of the silicon rod when the conveying chain 4121 of the feeding and transferring part moves forward (as shown by the arrow direction in Figure 9 ), so as to cooperate with the transferring part to move the abutted silicon rod to a preset position, and when the conveying chain 4121 moves backward (as shown by the arrow direction in Figure 9When avoiding an obstacle, i.e., the silicon rod to be cut in this scenario, in the opposite direction of the shown arrow, the torsion spring 4132 is disposed below the push rod 4131 to cooperate with the rotational movement of the push rod 4131.

[0110] Here, the push rod 4131 includes a swinging rod as the main body, a roller provided at the distal end of the swinging rod for contacting the silicon rod to be cut, and a rotating shaft at the proximal end of the swinging rod. The swinging rod can rotate along the rotating shaft. The torsion spring 4132 is sleeved on the rotating shaft to provide a torque for positioning the swinging rod at a certain angle. For example, when the swinging rod is not affected by an external force, it can be stabilized at the upright position of the swinging rod by the torsion spring 4132. The elastic push rod structure 413 further includes a support base 4133 fixedly connected to the conveying chain 4121 for arranging the push rod 4131 and the spring. The support base 4133 further includes a limiting baffle. As shown in the figure, when the swinging rod rotates counterclockwise, it will abut against the limiting baffle to reach the maximum rotation angle. During the process of the overall elastic push rod structure 413 conforming to the forward movement of the conveying chain 4121, the roller at the distal end of the swinging rod contacts the end face of the silicon rod to be cut and has a tendency to rotate counterclockwise relative to the rotating shaft. After abutting against the limiting baffle, the rotation stops. The push rod 4131 can generate a thrust on the silicon rod to be cut based on the limiting effect of the limiting baffle, thereby pushing the silicon rod to be cut to move along the bearing part in the forward direction.

[0111] Please refer to Figure 11 , which shows a partial structural schematic diagram of the silicon rod conveying device of the present application in an example. As shown in the figure, in a specific implementation, the bearing part 411 includes vertical plates 4111 arranged on opposite sides of the conveying chain 4121, and two rows of rollers 4112 are arranged oppositely on the two vertical plates 4111. It should be understood that the contact between the silicon rod to be cut and the rollers 4112 is a point contact. In some examples, the two rows of rollers 4112 arranged oppositely are rotatably arranged on the vertical plates 4111 above the conveying chain 4121. The elastic push rod structure moves with the conveying chain 4121. During the forward movement of the conveying chain 4121, the push rod abuts against the end face of the silicon rod to be cut to provide a thrust for the silicon rod to be cut to move along the axial direction of the silicon rod. Through the cooperation of the bearing part 411 including the rollers 4112 and the elastic push rod structure, when the silicon rod to be cut moves along the bearing part 411, the thrust only needs to overcome the rolling friction with the rollers 4112, and the resistance required to realize the transmission of the silicon rod is relatively small.

[0112] In some examples, the loading and transfer part, for example, includes a bearing part and a conveyor belt structure. The elastic push rod structure is fixedly arranged on the conveyor belt and moves with the conveyor belt to abut against the end face of the silicon rod to be cut when the conveyor belt moves forward to drive the silicon rod to move in the forward direction.

[0113] Of course, according to the requirements of the transfer direction during the feeding process of the silicon rod in the actual scenario, in some examples, the elastic push rod structure can also be set to abut against the end face of the silicon rod during the backward movement of the conveying chain or conveyor belt, so as to transport the silicon rod to be cut to the first predetermined position during the feeding process.

[0114] In some examples, the silicon rod transfer device further includes a blanking transfer part and a blanking driving source. The blanking transfer part is used to convey the cut silicon rod, and the blanking driving source is used to drive the blanking transfer part to move so as to drive the cut silicon rod to move. Here, the starting end of the blanking transfer part can be set, for example, at the second predetermined position during the blanking process of the silicon rod loading and unloading device. The silicon rod loading and unloading device clamps and transfers the cut silicon rod from the silicon rod bearing structure to the blanking transfer part, so that the silicon rod conveying device transfers the cut silicon rod to the next process position or the placement area of the cut silicon rod.

[0115] Please refer to Figure 12 , which shows a schematic structural diagram of the silicon rod conveying device of the present application in an embodiment. In some examples, the blanking transfer part 42 is a conveyor belt mechanism. It should be understood that the cut silicon rod is a cuboid-like shape with a flat side after squaring. Placing the cut silicon rod horizontally on the conveyor belt can achieve transportation by relying on the friction formed by the self-weight of the cut silicon rod on the surface of the conveyor belt. Here, the blanking driving source is, for example, a driving motor, which drives at least one synchronous pulley in the conveyor belt mechanism to rotate so as to make the conveyor belt rotate.

[0116] In some examples, the silicon rod conveying device further includes a flipping device, which is used to flip the carried silicon rod to be cut from a horizontal state to a vertical state and to flip the carried cut silicon rod from a vertical state to a horizontal state.

[0117] The silicon rod loading and unloading device in the silicon rod squaring equipment can be used to clamp the silicon rod to be cut or the cut silicon rod placed vertically. Here, the flipping device 43 can be used to flip the silicon rod to be cut from a horizontal state to a vertical state so that the silicon rod loading and unloading device can perform the loading and transportation of the silicon rod to be cut, or can be used to flip the cut silicon rod transported from the silicon rod bearing structure to the silicon rod transfer device from a vertical state to a horizontal state to realize the subsequent transportation of the cut silicon rod.

[0118] The flipping device 43 is docked with the end of the loading and transfer section or the starting end of the unloading and transfer section. In some examples, the loading and transfer section and the unloading and transfer section are arranged on the same side of the machine base, so that the silicon rod loading and unloading device can reach the loading and transfer section and the unloading and transfer section by moving on the same side of the machine base. Here, the flipping device 43 is arranged on a linear motion mechanism 44 to move from the loading and transfer section to dock with the unloading and transfer section, that is, the flipping device 43 can move between the loading and transfer section and the unloading and transfer section.

[0119] Please refer to Figure 8c , Figure 12 , the loading and transfer section and the unloading and transfer section are arranged on the same side of the machine base and are parallel. The flipping device 43 is arranged on the linear motion mechanism 44 laid in the second direction. The linear motion mechanism 44 includes, for example, a linear guide rail in the second direction, a traveling motor, and a traveling lead screw. The traveling lead screw connects the linear guide rail and the flipping device 43. The flipping device 43 moves along the linear guide rail in the second direction under the drive of the traveling motor, so that the loading and transfer section and the unloading and transfer section can share the same flipping device 43. For example, in an actual scenario, after the flipping device 43 flips the horizontally placed silicon rod to be cut into a vertical position at the loading and transfer section, it can move along the linear guide rail in the second direction to dock with the unloading and transfer section to flip the vertically placed cut silicon rod into a horizontal position.

[0120] Of course, in an actual scenario, the loading and transfer section and the unloading and transfer section can also be arranged on both sides of the machine base. For example, when the silicon rod processing platform with a silicon rod bearing structure is arranged on the translation mechanism, one side of the machine base is set as the loading area for loading. After the silicon rod is square-cut, it is translated towards the side away from the loading area to move the cut silicon rod to the unloading area. The loading and transfer section and the unloading and transfer section respectively correspond to the loading area and the unloading area.

[0121] In some examples, as Figure 12 shown, the flipping device 43 includes a flipping table 431. The flipping table 431 is provided with a flipping motor for driving the flipping table 431 to rotate. Here, the flipping table 431 includes a flipping part and a flipping rotating shaft. The flipping rotating shaft is arranged on the flipping part and is axially connected to a flipping motor, so as to drive the flipping part to rotate a predetermined angle under the drive of the flipping motor. The flipping part is used to carry the silicon rod to be cut or the cut silicon rod, and makes the silicon rod to be cut or the cut silicon rod always fit on the flipping part through clamping, adsorption, or limiting, etc. In a specific implementation manner, the flipping part includes a lifting seat arranged on the bearing plate of the flipping part and a pressing block or pressing plate arranged on the lifting seat. In other implementation manners, the flipping part can also include clamping arms or collars as limiting structures.

[0122] In as Figure 12In the shown view, the flipping rotating shaft is arranged on the right side of the flipping part. When the flipping device corresponds to the loading and transferring part, the flipping part rotates clockwise by 90° around the flipping rotating shaft under the drive of the flipping motor to flip the silicon rod to be cut carried thereon into a vertical placement; when the flipping device corresponds to the unloading and transferring part, the flipping part rotates counterclockwise by 90° around the flipping rotating shaft under the drive of the flipping motor to flip the cut silicon rod carried thereon into a horizontal placement.

[0123] Thus, for the silicon rod squaring equipment of the present application, the silicon rod to be cut is transported to the first predetermined position by the silicon rod transporting device. The silicon rod loading and unloading device can move along the installation frame above the machine base through the shifting mechanism to reach the first predetermined position, and can move along the installation frame to transfer the silicon rod to be cut onto the silicon rod bearing structure. The silicon rod transporting device and the silicon rod loading and unloading device cooperate with the wire cutting device to perform the transportation and cutting processing of the silicon rod, making the transfer between different processes automated, which can reduce labor costs and is beneficial to avoiding the silicon rod being knocked and damaged during the transfer; furthermore, the transfer path of the silicon rod loading and unloading device can be a straight line or a broken line, and the hoisting setting method reserves equipment space for arranging, for example, the silicon rod moving device on the ground. The silicon rod squaring equipment can achieve the automated process transfer in the silicon rod squaring operation by occupying a small equipment space.

[0124] Existing single crystal silicon rods are generally cylindrical structures. In existing squaring equipment, they are generally placed on the silicon rod bearing structure relying on the gravity of the silicon rod itself. When the wire cutting device cuts the silicon rod, the cutting wire will cause the silicon rod to shake during the cutting process along the length direction of the silicon rod, resulting in an uneven cutting surface and poor finished product quality. Therefore, it is necessary to propose a silicon rod squaring equipment that can ensure the silicon rod stands stably on the silicon rod bearing structure during the cutting process. The silicon rod mentioned in the present application is a single crystal silicon rod. The present application discloses a silicon rod pressing device and a silicon rod squaring equipment provided with the silicon rod pressing device. The silicon rod pressing device can press the top of the single crystal silicon rod on the silicon rod bearing structure when the wire cutting device cuts the single crystal silicon rod, so that the silicon rod stands stably on the silicon rod bearing structure, ensuring the smoothness of the silicon rod during the cutting operation and guaranteeing the cutting quality of the silicon rod.

[0125] The silicon rod pressing device of the present application can be used in the silicon rod squaring equipment. The silicon rod pressing device can be detachably arranged in the silicon rod squaring equipment as an independent unit to cooperate with the silicon rod squaring operation in the silicon rod squaring equipment and press the silicon rod during the squaring and cutting process, so that the silicon rod is in a stable state during the cutting process; of course, it should be understood that in some embodiments, the silicon rod pressing device can also be arranged in the silicon rod squaring equipment to form an integral structure.

[0126] Please refer to Figure 13, shown as the structural schematic diagram of the silicon rod pressing device in an embodiment. As shown in the figure, the silicon rod pressing device is applied to a silicon rod squaring device, and the silicon rod squaring device includes a machine base 10, a silicon rod bearing structure (not shown in the figure), and a wire cutting device; the silicon rod pressing device includes a pressing bracket 61 and a plurality of independent pressing components 60. Among them, the pressing bracket 60 is movably arranged on the cutting frame 20, and the plurality of independent pressing components 60 are respectively arranged on the pressing bracket 61 and are used to press the top of the silicon rod to be cut carried by the silicon rod bearing structure. Each pressing component 60 includes a pressing head 601 and a driving mechanism 602 for driving the pressing head 601 to move up and down relative to the pressing bracket 61.

[0127] The machine base 10 is set as the main component of the silicon rod squaring device of the present application and is used to provide a squaring operation platform. In one example, the volume and weight of the machine base 10 are both large to provide a larger installation surface and a more stable overall machine stability.

[0128] The silicon rod bearing structure is arranged on the silicon rod processing platform and is used to bear the silicon rod to be cut placed vertically.

[0129] At least one wire cutting unit 21 is arranged on the wire cutting device. A cutting wheel, a transition wheel, and a cutting wire wound between the cutting wheel and the transition wheel are arranged in the wire cutting unit. Thus, the wire cutting unit 21 forms a cutting wire saw for cutting the silicon rod.

[0130] The silicon rod pressing device includes a pressing bracket 61 and a pressing component 60 arranged on the pressing bracket 61 and corresponding to the silicon rod bearing structure in the cutting area. In one example, a slider cooperating with the lifting guide rail 22 is fixed on the pressing bracket 61. The pressing bracket 61 is erected on the cutting frame in a liftable manner through its slider cooperating with the lifting guide rail 22 and is located above the wire cutting device. The pressing component 60 is arranged on the pressing bracket 61 and can be lifted and lowered with the pressing bracket 61 to release or press the silicon rod to be cut on the silicon rod bearing structure in the cutting area.

[0131] Affected by the manufacturing process, the silicon rods to be cut on the silicon rod bearing structure in the cutting area are not exactly the same in height. When the pressing assembly 60 follows the pressing bracket 61 to descend, it cannot ensure that each pressing assembly 60 tightly presses on the silicon rod to be cut carried by its corresponding silicon rod bearing structure. Here, in the silicon rod pressing device provided in the present application, a plurality of independent pressing assemblies 60 are provided on the pressing bracket 61. Each pressing assembly 60 includes a pressing head 601 and a driving mechanism 602 for driving the pressing head 601 to move up and down along the pressing bracket 61. That is, each pressing assembly 60 has a degree of freedom to move along the cutting frame following the pressing bracket 61 and a degree of freedom to move up and down relative to the pressing bracket 61.

[0132] Each pressing assembly 60 can be used to perform the pressing operation on the silicon rod placed vertically on a silicon rod bearing structure. In an actual scenario, the silicon rod pressing device can, for example, adjust the overall lifting position of the pressing bracket 61 and each pressing assembly 60 provided on the pressing bracket 61. After the distance between the pressing head 601 of the pressing assembly 60 and the upper end surface of the silicon rod to be cut is within a preset range, the lifting amplitude of the corresponding pressing head 601 is adjusted based on the height of the upper end surface of each silicon rod to be cut on the silicon rod bearing structure, so that the pressing head 601 contacts and presses the silicon rod to be cut.

[0133] In some embodiments, the wire cutting unit 21 in the wire cutting device is movably arranged on the cutting frame 20 through a lifting mechanism. The lifting mechanism includes a lifting guide rail 22 and a lifting motor. The pressing bracket 61 in the silicon rod pressing device is movably arranged on the cutting frame 20 through the lifting guide rail 22. That is, here, the lifting and pressing device and the wire cutting unit 21 can share a lifting guide rail 22 to achieve movement in the lifting direction, and the lifting guide rail 22 is arranged on the cutting frame 20.

[0134] In order to simplify the structure of the silicon rod squaring equipment in the present application and reduce the manufacturing cost of the equipment, in one embodiment, the silicon rod pressing device is attached to the mounting beam 214 for supporting the wire cutting unit 21 by its own gravity and can move up and down along the lifting guide rail 22 following the mounting beam 214. The lifting motor drives the mounting beam 214 to drive the wire cutting unit 21 to descend along the lifting guide rail 22. The silicon rod pressing device attached to the mounting beam 214 also descends along the lifting guide rail 22 to the top of the silicon rod to be cut carried by the silicon rod bearing structure in the cutting area. The driving structure in its pressing assembly 60 drives the pressing head 601 to move up and down to press the corresponding silicon rod to be cut, while the mounting beam 214 will continue to be driven by the first driving mechanism 602 to drive the wire cutting unit 21 to descend for the cutting operation of the silicon rod to be cut.

[0135] In some embodiments, the wire cutting unit and the silicon rod pressing device are respectively configured with lifting drive devices. For example, the wire cutting unit can be driven by a lifting motor disposed on the mounting beam carrying the wire cutting unit to move up and down following the mounting beam; the pressing bracket in the silicon rod pressing device moves along the lifting guide rail of the cutting frame under the drive of the lifting drive device disposed on the pressing bracket.

[0136] In one example, a silicon rod squaring device provided with the silicon rod pressing device includes a first lifting drive mechanism and a second lifting drive mechanism. Among them, the first lifting drive mechanism is used to drive the wire cutting unit to move along the lifting guide rail; the second lifting drive mechanism is used to drive the silicon rod pressing device to move up and down along the lifting guide rail. At this time, the silicon rod pressing device no longer relies on gravity to attach to the mounting beam, but is driven by the second lifting drive mechanism to move up and down along the lifting guide rail. The second lifting drive mechanism is set as a cylinder assembly or a lead screw assembly driven by a motor. In practical applications, when the first lifting drive mechanism drives the mounting beam to carry the wire cutting unit down, and the second lifting drive mechanism drives the silicon rod pressing device down to a predetermined position, the second lifting drive mechanism stops driving the silicon rod pressing device so that the silicon rod pressing device is positioned at the predetermined position to press the silicon rod to be cut. Then, the first lifting drive mechanism continues to drive the mounting beam to carry the wire cutting unit down to complete the cutting of the silicon rod to be cut. After completing the cutting operation of the silicon rod to be cut, the first lifting drive mechanism drives the mounting beam to carry the wire cutting unit up, and the second lifting drive mechanism drives the silicon rod pressing device up.

[0137] In some embodiments, the wire cutting unit in the wire cutting device is movably disposed on the cutting frame through a first lifting mechanism, and the silicon rod pressing device is movably disposed on the cutting frame through a second lifting mechanism.

[0138] In some embodiments, the first lifting mechanism includes a first lifting guide rail and a first drive motor, and the second lifting mechanism includes a second lifting guide rail and a second drive motor.

[0139] Here, the first lifting guide rail and the second lifting guide rail are respectively guide rails arranged in the vertical direction, that is, the direction of the plumb line. The first lifting guide rail and the second lifting guide rail are both disposed on both sides of the cutting frame. The wire cutting unit is disposed on the mounting beam, and both ends of the mounting beam are respectively connected to the first lifting guide rails on the cutting frames on both sides of the machine base, and drive the wire cutting unit to move in the lifting direction under the drive of the first drive motor. Here, the cutting wire segment in the wire cutting unit moves up and down accordingly, and the cutting process of the silicon rod can be realized under the control of the first drive motor; both ends of the pressing bracket of the silicon rod pressing device are disposed on the second lifting guide rails on both sides of the cutting frame. Under the drive of the second drive motor, the pressing bracket carries the pressing assembly to move along the lifting guide rail, and the pressing head of the pressing assembly can be pressed against the top of the silicon rod.

[0140] In some embodiments, a guide rail locking mechanism is provided on the pressing bracket. For example, in order to prevent the silicon rod pressing device from continuously descending with the installation beam and damaging the silicon rod to be cut, a guide rail locking mechanism is provided on the pressing bracket of the silicon rod pressing device; for another example, in order to prevent the silicon rod pressing device from being unable to stably stay at a preset height when moving along the lifting guide rail or the second lifting guide rail for setting the pressing bracket under the action of the second driving motor, a guide rail locking mechanism is provided on the pressing bracket.

[0141] The guide rail locking mechanism can be used to position the silicon rod pressing device at a predetermined position on the lifting guide rail (or the second lifting guide rail). For example, the predetermined position is that the pressing component in the silicon rod pressing device is 0 to 5 cm above the corresponding silicon rod to be cut, but this is not limited thereto. As long as the pressing component is above the corresponding silicon rod to be cut and the pressing head in the pressing component can be driven to descend and press against the top surface of the corresponding silicon rod to be cut.

[0142] In one implementation, the guide rail locking mechanism includes a locking clamp block and a cylinder. The locking clamp block is provided on the pressing bracket, and the cylinder is used to provide a force for clamping the lifting guide rail or the second lifting guide rail. In the state where the cylinder is pushed out, the locking clamp block is forced to abut against the lifting guide rail or the second lifting guide rail connecting the pressing bracket. Based on the force in the state where the cylinder is pushed out, the locking clamp block remains relatively stationary with the abutted guide rail after abutting against the lifting guide rail or the second lifting guide rail.

[0143] Please refer to Figure 14a 、 14b 、 Figure 14c , Figure 14a which shows a schematic structural diagram of the silicon rod pressing device 6 of the present application in an embodiment, Figure 14b 、 Figure 14c which shows the enlarged schematic diagram of B in different motion states of the silicon rod pressing device 6 Figure 14a as shown in. As shown in the figure, the guide rail locking mechanism 62 is, for example, the pneumatic guide rail locking mechanism 62 shown in the figure. As Figure 14a shown, the silicon rod pressing device 6 is arranged on the lifting guide rail 22, thereby realizing the movement in the lifting direction to realize the pressing of the silicon rod. As Figure 14b or shown in 14c, the pneumatic guide rail locking mechanism 62 in this embodiment includes a locking clamp block 621 that cooperates with the lifting guide rail 22, a cylinder 622 that drives the locking clamp block 621 to act, and a spring 623. Here, the locking clamp block 621 and the lifting guide rail 22 are respectively provided with racks in the lifting direction, that is, along the guide rail direction. The locking clamp block 621 is arranged on the pressing bracket in the silicon rod pressing device 6. In a motion state, the silicon rod pressing device 6 descends with the installation beam (as shown in Figure 14bIn the state shown, at this time, the cylinder 622 is in a rest state, and the rack between the locking clamp block 621 and the lifting guide rail 22 is in a separated state due to the elastic force of the spring 623. Thus, the silicon rod pressing device 6 can move along the lifting guide rail 22. When it reaches a predetermined position, the cylinder 622 drives the locking clamp block 621 on the pressing support to move. Here, the pushing action of the cylinder 622 overcomes the elastic force of the spring 623, causing the locking clamp block 621 to tightly hold the lifting guide rail 22 and positioning the silicon rod pressing device 6 at the predetermined position (in the state as shown in Figure 14c ). The locking clamp block 621 meshes and bites with the rack of the lifting guide rail 22, thereby fixing the silicon rod pressing device 6 on the lifting guide rail 22 to position the silicon rod pressing device 6 at the predetermined position. The pressing assembly in the silicon rod pressing device 6 presses the corresponding silicon rod to be cut, and the mounting beam continues to be driven to drive the wire cutting unit to descend to complete the cutting of the silicon rod to be cut. After completing the cutting operation of the silicon rod to be cut, when the mounting beam is driven by the first driving mechanism to drive the wire cutting unit to rise to the position where the silicon rod pressing device 6 is positioned, the cylinder 622 drives the locking clamp block 621 on the pressing support to release the lifting guide rail 22 so that the silicon rod pressing device 6 continues to attach to the mounting beam and rise (in the state as shown in Figure 14b ).

[0144] In some embodiments, a guide rail clamp is provided on the pressing support 61 (in the embodiment as shown in Figure 13 ). The guide rail clamp can be arranged at both ends of the pressing support 61 to connect the pressing support 61 to the lifting guide rail 22 or the second lifting guide rail. When the lifting guide rails 22 or the second lifting guide rails on both sides of the cutting frame 20 are double guide rails, four guide rail clamps 221 can be configured and respectively connect the pressing support 61 at the double guide rails on both sides. In an actual scenario, the pressing support 61 can attach to the cutting frame 20 to move along the lifting guide rail 22 or move along the second lifting guide rail under the action of the second driving motor. After reaching the predetermined position, the guide rail clamp 221 presses the guide rail to make the pressing support 61 stable at the preset height.

[0145] Here, the multiple independent pressing components provided on the pressing support can move along the lifting guide rail under the drive of the pressing support. At the same time, the pressing head of each lifting component can move up and down along the lifting support under the drive of the drive mechanism.

[0146] In some embodiments, the drive mechanism includes a power structure and a guide track. The pressing head is linked with the power structure and controlled by the power structure to move up and down along the guide track.

[0147] Please refer to Figure 13 and Figure 15 , where Figure 15 is shown asFigure 13 An enlarged schematic view of part A. As shown in the figure, a plurality of pressing components 60 are provided on the pressing bracket 61, corresponding to a plurality of silicon rod bearing structures in the cutting area where the silicon rod is squared. Each pressing component 60 is provided with a pressing head 601 and a driving mechanism 602. The driving mechanism 602 includes a guiding track 6022 arranged on the pressing bracket 61 in the lifting direction, and a power structure 6021 serving as the lifting driving source of the pressing head 601. The pressing head 601 can move along the guiding track 6022 under the drive of the power structure 6021.

[0148] In some embodiments, the power structure 6021 includes: a cylinder or a hydraulic pump and a telescopic member. Wherein, the telescopic member is connected to the cylinder or the hydraulic pump, and the pressing head 601 is arranged at the bottom of the telescopic member.

[0149] In a specific implementation manner, the telescopic member moves in the lifting direction under the pushing action of the cylinder. For example, the telescopic member is connected to the piston rod of the cylinder, and the pressing head 601 is arranged at the bottom of the telescopic member (that is, on the end face of the telescopic member facing the silicon rod bearing structure in the cutting area). The cylinder drives the telescopic member to drive the pressing head 601 to move up and down to release or press the silicon rod to be cut on the silicon rod bearing structure in the cutting area.

[0150] In another specific implementation manner, the telescopic member is connected to the hydraulic pump. For example, the telescopic member is a rod body connected to the piston of the hydraulic cylinder or a lifting hydraulic cylinder connected to the hydraulic pump. The telescopic member can move up and down along the guiding track 6022 under the drive of the hydraulic pump, and drive the pressing head 601 at the bottom of the telescopic member to move up and down to adjust the distance between the pressing head 601 and the end face of the silicon rod to be cut.

[0151] In yet another specific implementation manner, the driving mechanism includes a guiding track and a lifting motor (not shown). The guiding track is arranged on the pressing bracket in the lifting direction. The pressing head moves up and down relative to the pressing bracket under the drive of the lifting motor to adjust the distance between the pressing head and the top of the silicon rod to be cut.

[0152] In some embodiments, the power structure includes a lifting motor and a telescopic member. Wherein, the telescopic member is connected to the lifting motor, and the pressing head is arranged at the bottom of the telescopic member. Here, the telescopic member is, for example, a connecting rod between the lifting motor and the pressing head. The lifting motor is, for example, a traveling motor that can move along the guiding track. The telescopic member drives the pressing head to move up and down under the movement of the traveling motor to realize the adjustment of the distance between the pressing head and the end face of the silicon rod to be cut; or, the telescopic member is an electric push rod driven by the lifting motor, and the extending end of the electric push rod is connected to the pressing head. The compression head is driven to move up and down by the drive of the lifting motor.

[0153] In some embodiments, the pressing head is connected to the driving mechanism through an extension arm.

[0154] Please continue to refer to Figure 15 , in a specific implementation, the proximal end of the extension arm 6011 is connected to the driving mechanism 602, and the distal end is connected to the pressing head 601, so that the extension arm 6011 drives the pressing head 601 at the distal end to move up and down relative to the pressing bracket under the drive of the driving mechanism 602. In an actual scenario, the extension arm 6011 can be connected to, for example, the telescopic member of the power structure 6021; alternatively, the distal end of the extension arm 6011 is connected to a slider that can move along the guiding track 6022, and the slider is driven by a lifting motor.

[0155] The extension arm 6011 can also be set in a form with adjustable length, and the distal end of the extension arm 6011 is the free end during length adjustment; here, the guiding rail in each pressing assembly 60 is arranged on one side of the silicon rod bearing structure, so that the guiding track 6022 and its extending direction are outside the corresponding silicon rod to be cut. For example Figure 1 as shown in the view, the guiding track 6022 is located on the right side of the silicon rod bearing structure, and the distal end of the extension arm 6011 extends to the left so that the pressing head 601 is directly above the end face of the silicon rod to be cut.

[0156] By connecting the pressing head 601 through the extension arm 6011 with adjustable length, it is possible to avoid the situation where the position of the pressing head 601 is not at the center of the silicon rod to be cut, resulting in poor pressing effect or even generating a moment with an overturning effect; at the same time, the length adjustment of the extension arm 6011 is easy to achieve, and the adjustment of the pressing position of the silicon rod can be realized by moving small components, and other silicon rod pressing devices or other structures or components in the silicon rod squaring equipment will not be disturbed during the adjustment process. The extension arm 6011 is, for example, a telescopic rod provided with a telescopic driving device. In some examples, a linear guide rail can be arranged on the extension arm 6011, and the pressing head 601 is arranged on the linear guide rail, which can equivalently achieve the effect of adjustable length of the extension arm 6011 to ensure that the pressing head 601 presses the silicon rod at the center of the end face of the silicon rod to be cut.

[0157] In some examples, the pressing head is a rotating pressing head.

[0158] In some examples, in a silicon rod squaring device provided with the silicon rod pressing device, the silicon rod bearing structure has a rotating mechanism that can drive the silicon rod to be cut located thereon to rotate to adjust the surface to be cut. In order to cooperate with the rotating mechanism of the silicon rod bearing structure, in one implementation, the pressing head is connected to the driving structure through a rotating shaft (not shown). For example, a bearing (not shown) is provided at the bottom of the telescopic member connected to the cylinder, and the pressing head has a rotating shaft adapted to the bearing. The pressing head is rotatably mounted on the bearing of the telescopic member through the rotating shaft. In this way, when the pressing head presses the silicon rod to be cut, the silicon rod bearing structure drives the silicon rod to be cut to rotate, and the pressing head can also cooperate with the silicon rod to be cut to rotate.

[0159] In some examples, each pressing head is rotatably arranged at the distal end of the extension arm. The pressing head can be connected to the extension arm through a rotating shaft, and the rotating shaft is arranged in the third direction, that is, the lifting direction. In the state where the pressing head presses the silicon rod to be cut, the pressing head can rotate along the rotating shaft when the silicon rod bearing structure drives the silicon rod to rotate.

[0160] In some examples, in order to better protect the silicon rod to be cut, a buffer pad (not shown) can be provided between the pressing head and the silicon rod to be cut, and the buffer pad is fixed to the pressing surface of the pressing head (this pressing surface is the lower surface of the pressing head).

[0161] In some embodiments, a detection device (not shown) is further provided at the bottom of the pressing head for detecting the contact state of the pressing head with the silicon rod to be cut. In one implementation, the detection device includes a pressure sensor provided on the lower surface of the pressing head for contacting the silicon rod to be cut. When the pressure-sensitive element of the pressure sensor contacts the silicon rod to be cut, a contact signal is output, and the pressure sensor can also be used to detect the magnitude of the pressure value to determine that the pressing force borne by the silicon rod to be cut is within a preset range.

[0162] In some embodiments, the lifting amplitude of the pressing head moving up and down along the pressing bracket is 200 millimeters to 400 millimeters. In the squaring process, the silicon rods to be cut may have different length specifications. The silicon rods to be cut are usually silicon rod segments obtained by truncating the rod-shaped single-crystal silicon rods grown from the melt by the Czochralski method or the floating zone melting method. There may be a certain height difference between different silicon rod segments, as shown in Figure 13 the state shown.

[0163] In a specific implementation manner, for example, the length of the guiding track can be set to 200 mm to 400 mm, or the telescopic distance of the telescopic member can be set to 200 mm to 400 mm. Thus, the height difference between the pressing heads in the pressing assembly arranged on the same pressing bracket can reach 200 mm to 400 mm, and the silicon rod pressing device can press the silicon rods to be cut with different lengths on the silicon rod bearing structure in the cutting area, so there is no need to group the silicon rods to be cut based on the same length and then load and cut them, making the squaring process simpler.

[0164] In an actual scenario, when the height difference between the silicon rods to be cut is greater than 400 mm, the silicon rods to be cut can be grouped based on their lengths and then loaded and cut. For example, in the silicon rod squaring equipment as shown in Figure 1 In the figure, there are 4 silicon rod bearing structures corresponding to the cutting area. Here, the silicon rods to be cut can be divided into groups of four, and the length difference between the silicon rods to be cut in each group is within 400 mm. The silicon rod pressing device can be used to press each group of silicon rods to be cut. Since there can be a length difference in each group of silicon rods to be cut, there is no need for precise measurement when determining the length, which can simplify the squaring process for silicon rods of different length specifications.

[0165] Here, the silicon rod pressing device provided in the present application can cooperate with the wire cutting device provided in the silicon rod squaring equipment. The silicon rod pressing device can share a lifting guide rail with the wire cutting device or move along a lifting guide rail respectively. The silicon rod pressing device can be simply arranged above the silicon rods to be cut by means of the mounting beam in the wire cutting device, or a second driving mechanism can be configured for the silicon rod pressing device to drive the silicon rod pressing device to move in the lifting direction along the lifting guide rail. At the same time, each lifting component in the silicon rod pressing device can move up and down along the pressing bracket to adapt to pressing silicon rods to be cut with different specifications. Before squaring and cutting, the silicon rod pressing device presses the top of the silicon rod to be cut to ensure that the silicon rod is stably placed vertically on the silicon rod bearing structure, effectively reducing or avoiding the situation that the silicon rod is disturbed, vibrates, displaces or even overturns during the subsequent cutting process, and improving the finished product quality of the squaring process.

[0166] The present application also provides a silicon rod squaring equipment, including a machine base, a silicon rod bearing structure, a wire cutting device, and a silicon rod pressing device as described in any one of the embodiments shown in FIGS. 13 to Figure 15 in the figure.

[0167] The machine base has a processing platform, and the silicon rod bearing structure is arranged on the silicon rod processing platform and is used to bear the vertically placed silicon rod. The wire cutting device includes a cutting frame arranged on the machine base and a wire cutting unit movably arranged on the cutting frame; wherein, the wire cutting unit includes a cutting wheel, a transition wheel, and a cutting wire, and the cutting wire is sequentially wound around the cutting wheel and the transition wheel to form at least one cutting wire saw, and the cutting wire saw can be used to perform squaring cutting on the silicon rod to be cut.

[0168] Here, in the silicon rod squaring device provided by the present application, the silicon rod pressing device can cooperate with the wire cutting device to press the top of the silicon rod, that is, the upper end face of the silicon rod, when the wire cutting device cuts the silicon rod borne by the silicon rod bearing structure, so as to ensure that the silicon rod is steadily vertically placed on the silicon rod bearing structure during the cutting process, thereby avoiding situations such as poor cutting quality and silicon rod overturning caused by silicon rod displacement.

[0169] In the silicon rod processing technology, wire cutting technology is adopted in multiple processes of silicon rod processing, such as the truncation operation, squaring operation, and slicing of the silicon rod.

[0170] Wire cutting technology is a relatively advanced silicon material processing technology in the world at present. Its principle is that a high-speed running steel wire drives the cutting abrasive attached to the steel wire or directly uses a diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. During the cutting process, the steel wire or diamond wire is guided by a guide wheel to form a wire saw or a wire mesh on the cutting roller, and the workpiece to be processed realizes the feeding of the workpiece through the up and down movement of the workbench or the up and down movement of the wire saw or wire mesh. Under the action of a pressure pump, the cooling water automatic spraying device assembled on the equipment sprays cold water onto the cutting part of the steel wire or diamond wire and the workpiece, and the reciprocating movement of the steel wire or diamond wire generates cutting to cut the material to be processed into multiple pieces at one time. Wire cutting technology has the advantages of high efficiency, high productivity, and high precision compared with traditional saw blades, grinding wheels, and internal circle cutting.

[0171] In the field of silicon rod processing technology, generally, polycrystalline silicon brittle materials are first pulled into single crystal silicon rods, the originally obtained single crystal silicon rods are truncated to obtain silicon rod segments of a predetermined length specification, and then a squaring machine is used for squaring; at this time, the cutting mechanism feeds along the length direction of the silicon rod and cuts out four pairwise parallel planes in the circumferential direction of the silicon rod, so that the cross-section of the silicon rod is in a quasi-rectangular shape; after squaring, a multi-wire slicing machine is used to slice the squared silicon rod along the length direction to obtain the required silicon wafers.

[0172] Here, multiple processes in silicon rod processing need to be completed with the help of a wire cutting device. The high-speed running steel wire drives the cutting abrasive attached to the steel wire or directly uses a diamond wire to rub the workpiece to be processed, so as to achieve the purpose of wire cutting. Generally, multiple cutting wheels and idler wheels are configured in a multi-wire cutting device. Multiple cutting wire saws are formed by sequentially winding the cutting wire on the wire grooves of the cutting wheels and the wire grooves of the idler wheels corresponding to the cutting wheels, so as to cut the silicon rod to be cut with multiple cutting wire saws. After long-term use, the wire grooves on the cutting wheels will wear, affecting the cutting effect. Therefore, it is necessary to replace the wire groove positions of the cutting wheels. Usually, to ensure that the silicon rod is cut into a preset specification, the moving distance of the cutting wheels needs to be adjusted after changing the grooves.

[0173] As described in the background art, in the relevant wire cutting device, the positional relationship between multiple cutting wheels does not easily change after installation. After one of the wire cutting wheels wears, it is necessary to adjust the positions of the cutting wheels or other components for overall groove changing, and the components whose positions are adjusted need to be further calibrated. The operation is cumbersome and the efficiency is low.

[0174] In view of this, the present application also provides a wire cutting device for a silicon rod processing device. The silicon rod processing device includes: a machine base having a silicon rod processing platform; a silicon rod carrying device provided on the silicon rod processing platform for carrying the silicon rod to be cut; the wire cutting device includes: a cutting frame provided on the machine base; at least one wire cutting unit movably provided on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels sequentially arranged in a first direction, and each cutting wheel has at least two cutting wire grooves; a cutting wire sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; at least one distance adjusting mechanism provided on the at least one wire cutting unit for driving the plurality of cutting wheels in the at least one wire cutting unit to move in a second direction to adjust the cutting position of at least one cutting wire saw in the at least one wire cutting unit, or to change the cutting wire groove around which the cutting wire is wound on the plurality of cutting wheels in the at least one wire cutting unit.

[0175] The wire cutting device can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the distance adjusting mechanism, or adjust the position of the cutting wire saw to change the cutting position (or processing specification) relative to the silicon rod. The silicon rod processing device applying the wire cutting device can be a silicon rod squaring device, a silicon rod truncating device, a silicon rod cutting and grinding integrated device, etc. It should be understood that the wire cutting device realizes groove changing or adjusting the position of the cutting wire saw only by a certain structure and winding method of the wire cutting device itself, and is not limited by the specific type of the silicon rod processing device.

[0176] Here, in the embodiments provided by the present application, the cutting wire saw is a line segment within a certain position area of the cutting wire that can be used for feeding and processing the silicon rod. It should be understood that during the cutting process, the cutting wire is in high-speed operation, and the position of the cutting wire saw is usually determined by the winding method of the cutting wheel and the cutting wire.

[0177] In the embodiments provided below, the wire cutting of the present application is taken as an example in the silicon rod squaring equipment for illustration, but it is not used to limit the application scenarios of the wire cutting device of the present application.

[0178] Please refer to Figure 16 and Figure 17 , wherein, Figure 16 shows a schematic structural diagram of the wire cutting device of the present application in an embodiment, Figure 17 and is implemented as a schematic structural diagram of the wire cutting device of the present application applied to the silicon rod squaring equipment in an embodiment. As shown in the figure, the wire cutting device includes a cutting frame 20, at least one wire cutting unit 21, and at least one distance adjusting mechanism 23.

[0179] Among them, the cutting frame 20 is arranged on the machine base 10. In some implementation manners, the cutting frame 20 is arranged at both ends of the machine base 10 to ensure that the cutting wire saw formed on the wire cutting unit 21 mounted on the cutting frame 20 can cover different processing stations. For example, in the example shown in Figure 2, the cutting frame 20 is a column arranged at both ends of the machine base 10. There are multiple silicon rod bearing structures on the machine base 10 in the silicon rod squaring equipment, and the span of the wire cutting unit 21 includes each silicon rod bearing structure within the cutting area.

[0180] The at least one wire cutting unit 21 is movably arranged on the cutting frame 20; the wire cutting unit 21 includes a plurality of cutting wheels 211 and a cutting wire 213 arranged in sequence along a first direction. In some implementation manners, as shown in the embodiment of Figure 2, the wire cutting unit 21 is arranged on the cutting frame 20 by means of a wire cutting support 24. The wire cutting support 24 is arranged on the cutting frame 20 and includes a guide rail arranged along a second direction. The wire cutting unit 21 is arranged on the guide rail of the wire cutting support 24 to form a degree of freedom of movement along the second direction; of course, a guide groove in the second direction, a slide bar in the second direction, or other limiting structures or guiding structures in the second direction can also be arranged on the wire cutting support 24 for arranging the at least one wire cutting unit 21, and the present application does not make any restrictions.

[0181] It should be understood that the multiple cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21. In some examples, the wire cutting unit 21 includes mounting beams 214 in a first direction. Both ends of the mounting beams 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, a wire cutting unit 21 is composed of a plurality of cutting wheels 211 arranged in the same direction (or on the same straight line), a cutting wire 213, and a bearing structure of the cutting wheels 211.

[0182] In some other embodiments, the multiple cutting wheels 211 in the wire cutting unit 21 are arranged on the cutting frame 20 through brackets, connecting plates, or mounting frames. Here, the carrier provided by the wire cutting unit 21 for arranging the multiple cutting wheels 211 can be in different forms, which is not limited in this application.

[0183] In some examples, when there are multiple wire cutting units 21 in the wire cutting device, different wire cutting units 21 belong to different straight lines. For example, the two wire cutting units 21 shown in FIG. 2 are parallel respectively. In some examples, the extending directions of different wire cutting units 21 can also intersect.

[0184] It should be noted that in each embodiment of the wire cutting device provided in this application, the first direction is the direction in which multiple cutting wheels in the wire cutting unit are arranged. For example, in some examples, it is the direction of the mounting beam of the wire cutting unit. The cutting wire saw formed by winding the cutting wire around the cutting wheel is also in the first direction; the second direction is the orthogonal direction of the first direction, and the at least one distance adjusting mechanism drives the at least one wire cutting unit to move in the second direction, that is, to make the cutting wire saw in the wire cutting unit move along its orthogonal direction.

[0185] It should be understood that the wire cutting device can realize the cutting process of the silicon rod based on the lifting movement of the wire cutting unit 21 along the cutting frame 20, and the cutting specifications are controlled by adjusting the relative position between the cutting wire saw and the silicon rod in the second direction. With reference to Figure 16 and Figure 17 , when the silicon rod is placed on the silicon rod bearing structure and its position is fixed, by moving the cutting wire saw in the second direction through the distance adjusting mechanism 23, the cutting position of at least one cutting wire saw in the at least one wire cutting unit 21 can be adjusted, which can be used to control the cutting amount of the silicon rod.

[0186] In some examples, the at least one wire cutting unit further includes at least one idler wheel, and each idler wheel has at least two wire guiding grooves; wherein, when the at least one distance adjusting mechanism drives the multiple cutting wheels in the at least one wire cutting unit to move in the second direction, at least one idler wheel in the at least one wire cutting unit remains relatively stationary with respect to the multiple cutting wheels.

[0187] In some implementation manners, please refer toFigure 16 , Figure 17 , taking a wire cutting unit 21 in a wire cutting device as an example for illustration. The wire cutting unit 21 includes at least one idler pulley 212, and the at least one idler pulley 212 is used to realize the direction guiding or tension adjustment when the cutting wire 213 winds around different cutting wheels 211. The at least one idler pulley 212 can be arranged on a carrier such as Figure 17 the mounting beam 214 shown, and the distance adjusting mechanism 23 can be used to drive the carrier to move along the second direction. The at least one idler pulley 212 and the multiple cutting wheels 211 move along the second direction together with the carrier. In this state, the at least one idler pulley 212 and the multiple cutting wheels 211 are relatively stationary, that is, the positional relationship between the idler pulley 212 and the cutting wheels 211 remains unchanged. When the distance adjusting mechanism 23 is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit 21, the positional relationship between the wire saw and the cutting wheels 211 and the idler pulley 212 remains unchanged, that is, only a movement along the second direction occurs, and the cutting position adjustment can be realized.

[0188] In some embodiments, multiple cutting wheels 211 belonging to the same wire cutting unit 21 are arranged on a mounting beam 214 arranged along the first direction, and the at least one idler pulley 212 is arranged on the mounting beam 214 through a bracket. Here, the distance adjusting mechanism 23 can be arranged to be connected to the mounting beam 214 to drive the multiple cutting wheels 211 carried by the mounting beam 214 to move along the second direction. The bracket moves along with the mounting beam 214 and drives the at least one idler pulley 212 to move along the second direction, so that the at least one idler pulley 212 in the wire cutting unit 21 and the multiple cutting wheels 211 remain relatively stationary.

[0189] The at least one idler pulley 212 has at least two wire guiding grooves. When the at least one distance adjusting mechanism 23 is used to change the cutting wire groove position of the cutting wire 213 wound around the multiple cutting wheels 211 in the at least one wire cutting unit 21, the at least one idler pulley 212 correspondingly changes the position of the cutting wire 213 on the wire guiding grooves so that the cutting wire wound around the idler pulley and the wire guiding wheel after changing the groove is still located in a plumb plane. In the actual scenario, the usually adopted wire winding method requires that the cutting wire between the idler pulley and the cutting wheel is located in the plumb plane. It should be understood that when the cutting wire groove and the wire guiding groove for winding the cutting wire are not in the same plane after changing the groove, the cutting wire has a component force along the second direction on the idler pulley and the cutting wheel, which is not conducive to the efficient operation of the cutting wire. Here, setting the idler pulley 212 to have at least two wire guiding grooves can be used to realize the direction adjustment of the cutting wire 213 after changing the groove.

[0190] Each cutting wheel 211 has at least two cutting grooves, different cutting grooves are parallel to each other and the projection of the cutting groove plane on the horizontal plane is along the first direction, and there is a cutting offset in the second direction between different cutting grooves. When the cutting wire 213 changes the groove position wound on the cutting wheel 211, the cutting wire 213 has a displacement in the second direction relative to the cutting wheel 211. It should be understood that since the transition wheel 212 and the cutting wheel 211 are relatively stationary, in order to make the cutting wire saw wound around the transition wheel and the guide wheel still be located in a plumb plane after the cutting wire 213 changes the groove position of the cutting wheel 211, the groove position of the cutting wire 213 wound around the transition wheel 212 also needs to be changed.

[0191] Each transition wheel 212 has at least two wire grooves, and the at least two wire grooves are parallel to each other, and the projection of the plane where the wire grooves are located on the horizontal plane is along the first direction. There is a transition offset in the second direction between different wire grooves. Based on the at least two wire grooves, the wire groove of the cutting wire 213 in the transition wheel 212 can be changed, so that after the groove change adjustment, the cutting wire saw wound around the transition wheel and the wire wheel is still located in a plumb plane.

[0192] In some implementations, the transition offset between adjacent wire grooves in the transition wheel 212 is equal to the cutting offset between adjacent cutting wire grooves in the cutting wheel 211, so as to realize the groove change of the cutting wire 213 according to the preset position. In this example, the cutting wheel 211 and the wire wheel can be set in the wire cutting unit 21 in a one-to-one correspondence between the wire groove and the cutting wire groove (the correspondence means that the cutting wire groove and the wire groove are coplanar), and the number of wire grooves in the transition wheel 212 is equal to the number of the cutting wheel 211, or it can be different.

[0193] In different silicon rod processing equipment, the cutting wheel 211 and the transition wheel 212 in the wire cutting unit 21 can be set to different positional relationships and configured with different winding methods.

[0194] In some embodiments, multiple cutting wheels belonging to the same wire cutting unit are paired in pairs to form at least two cutting wheel groups, and a transition wheel is further provided between two adjacent cutting wheels in two adjacent cutting wheel groups, the transition wheel having at least two wire grooves, and the cutting wire is sequentially wound around the cutting wheel and the transition wheel to form a cutting wire saw between the two cutting wheels in each cutting wheel group, wherein the cutting wire, when winding around two adjacent cutting wheels in the two adjacent cutting wheel groups, passes through the cutting wire groove of the rear cutting wheel in the previous cutting wheel group and then passes through the wire groove of the transition wheel into the cutting wire groove of the front cutting wheel in the next cutting wheel group; wherein, when the multiple cutting wheels in the at least one wire cutting unit are driven to move in the second direction by the at least one distance adjustment mechanism, the at least one transition wheel in the at least one wire cutting unit remains relatively stationary with the multiple cutting wheels.

[0195] Please refer to Figure 18 and Figure 19 wherein Figure 18 FIG. shows a schematic structural diagram of the wire cutting device of the present application applied to a silicon rod squaring device in an embodiment, Figure 19 FIG. shows a schematic structural diagram of the wire cutting unit in the wire cutting device in an embodiment. As shown in the figure, 4 cutting wheel sets are provided in the wire cutting unit of the wire cutting device. Among them, a transition wheel 212 is provided between two adjacent cutting wheel sets. Here, the cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form a cutting wire saw on the two cutting wheels 211 of each cutting wheel set. Among them, when the cutting wire 213 is wound around the adjacent two cutting wheels 211 in two adjacent cutting wheel sets, it passes out from the cutting wire groove of the rear cutting wheel 211 in the previous cutting wheel set and passes through the transition wheel 212 and then enters the cutting wire groove of the front cutting wheel 211 in the next cutting wheel set. Here, the same transition wheel 212 is shared for guiding between every two adjacent cutting wheel sets, which can reduce the length of the cutting wire 213 for tension adjustment and guiding, increase the length ratio of the cutting wire 213 for forming the cutting wire saw in the cutting wire 213, simplify the wire winding method while improving the utilization rate of the cutting wire 213 and reducing the production cost.

[0196] Please refer to in combination Figure 18 and Figure 19 , each cutting wire saw can correspond to a silicon rod on the silicon rod bearing structure 11 for cutting. It should be understood that by changing the position spacing of the cutting wheel 211 arranged in the first direction, the number of silicon rod bearing structures 11 corresponding to any one cutting wire saw can also be 2, 3, 4, etc. In a specific implementation manner, for example, the distance between the two cutting wheels 211 in each cutting wheel set in the first direction can be increased, or the spacing of the silicon rod bearing structures 11 in the first direction can be reduced, so that in the second direction, the two cutting wheels 211 in the cutting wheel set are respectively located at the two ends of 2, 3, or 4 silicon rod bearing structures 11; when the lifting device drives the wire cutting unit to move up and down, each cutting wire saw can simultaneously cut the silicon rods placed on its corresponding multiple silicon rod bearing structures 11. In a specific implementation manner, in order to prevent the situation that the cutting wire saw is too long and the tension in the cutting wire 213 is uneven, the number of silicon rod bearing structures 11 corresponding to each cutting wire saw can be selected according to the actual situation to stabilize the processing quality.

[0197] In some embodiments, multiple cutting wheels belonging to the same wire cutting unit include a first cutting wheel, a last cutting wheel, and at least one intermediate cutting wheel located between the first cutting wheel and the last cutting wheel. A transition wheel is further provided beside the at least one intermediate cutting wheel. The transition wheel has at least two wire grooves. The cutting wire is sequentially wound around the cutting wheels and the transition wheel to form a cutting wire saw between any two adjacent cutting wheels. Wherein, when the cutting wire is wound around the intermediate cutting wheel, it exits from one of the at least two cutting grooves on the intermediate cutting wheel and then passes through the transition wheel beside it and then enters another one of the at least two cutting grooves on the intermediate cutting wheel, so that there is a cutting offset in the second direction between any two adjacent cutting wire saws, and the cutting offset corresponds to the spacing between the two relevant cutting grooves; wherein, when the at least one wire cutting unit is driven by the at least one distance adjusting mechanism to move the multiple cutting wheels in the second direction, at least one transition wheel in the at least one wire cutting unit remains relatively stationary with respect to the multiple cutting wheels.

[0198] Please refer to Figure 20 , which shows a schematic structural diagram of an intermediate cutting wheel and a transition wheel provided beside it in an embodiment of the wire cutting device of the present application. Combining Figure 17 and Figure 20 to illustrate the wire winding method adopted by the wire cutting unit 21 in this example. When the cutting wire 213 winds around the cutting wheel group in a wire cutting unit 21, each intermediate cutting wheel 211 experiences two wire windings, and the first and last cutting wheels 211 experience at least one wire winding. When the cutting wire 213 is wound around the intermediate cutting wheel 211, it exits from the first cutting groove 2111 of the at least two cutting grooves on the intermediate cutting wheel 211 and then passes through the transition wheel 212 beside it (on the upper side of the cutting wheel 211 in the Figure 20 shown embodiment) and then enters the second cutting groove 2112 of the at least two cutting grooves on the intermediate cutting wheel 211, so that there is a cutting offset in the first direction between any two adjacent cutting wire saws, and the cutting offset corresponds to the spacing between the first cutting groove 2111 and the second cutting groove 2112.

[0199] In some implementation manners, for each intermediate cutting wheel and a transition wheel provided beside it, the connection line between the axis of the transition wheel and the axis of the cutting wheel is parallel to the plumb line. In this case, the lengths of the cutting wires on both sides of the transition wheel are equal or approximately equal, and the stress states are approximately the same during the cutting process, which is beneficial to preventing the problem that the cutting wires on both sides of the transition wheel are locally or unilaterally continuously stressed too much or the tension is insufficient.

[0200] In one example, as Figure 20As shown, here, the transition wheel 212 is arranged directly above the cutting wheel. The cutting line 213 passes through the first cutting wire groove 2111 of the cutting wheel 211 and is guided by the transition wheel 212 and then winds around to the second cutting wire groove 2112 of the cutting wheel 211. The projections of the cutting lines 213 on both sides of the formed transition wheel 212 on the plane in the plumb direction are line segments of equal length. In this example, the formed cutting wire saw is the tangent line below the cutting wire groove of the cutting wheel 211.

[0201] In another example, the transition wheel can also be arranged directly below the cutting wheel, that is, the connecting line of the axes of the transition wheel and the cutting wheel is a plumb line. The cutting line winds down from the first cutting wire groove of the cutting wheel to the transition wheel and is guided by the transition wheel and then passes upward into the second cutting wire groove of the cutting wheel. In this example, the formed cutting wire saw is the tangent line above the cutting wire groove of the cutting wheel.

[0202] It should be understood that the side is mainly used to determine the corresponding relationship between the intermediate cutting wheel and the transition wheel rather than a specific position and orientation. For example, the side can also be the left side, right side, upper side, lower side, oblique side, etc. of the cutting wheel, and the present application does not make any restrictions. Specifically, the arrangement manner of the multiple cutting wheels, the intermediate cutting wheel and the cutting line in the wire cutting unit can adopt the manner described in Chinese Patent Application CN2020204403178 (invention name: silicon rod squaring equipment).

[0203] In the foregoing examples, although the relative position relationship between the cutting wheel and the transition wheel and the winding manner of the cutting line are different, the multiple cutting wheels in the wire cutting unit can all move along the second direction under the action of the at least one distance adjustment mechanism to realize the adjustment of the cutting position of the cutting wire saw or the slot change.

[0204] Please continue to refer to Figure 16 , as described in the foregoing examples, each cutting wheel 211 belonging to the same wire cutting unit can move along the second direction under the drive of the distance adjustment mechanism 23. Therefore, by moving the cutting wire saw formed between the cutting wheels 211 in the second direction, the adjustment of the cutting position of the cutting wire saw can be realized; when the wire cutting unit further includes a transition wheel 212, when the at least one distance adjustment mechanism 23 drives the multiple cutting wheels 211 in the at least one wire cutting unit to move along the second direction, the transition wheel 212 and the cutting wheel 211 remain relatively stationary, and the corresponding cutting wire saw can be adjusted in the cutting position by moving in the second direction.

[0205] When the at least one distance adjustment mechanism 23 is used to realize the transformation that the cutting wire winds around the cutting wire grooves of multiple cutting wheels 211 in the at least one wire cutting unit 21, in an actual scenario, the cutting wire grooves corresponding to the cutting wire before and after the groove change can be determined in advance. For example, the position where the cutting wire is located before the groove change is the cutting wire groove a1, and after the groove change, the cutting wire winds around the cutting wire groove a2. Based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, the displacement of the at least one distance adjustment mechanism 23 driving multiple cutting wheels 211 in the wire cutting unit in the second direction is determined, that is, the displacement is set as the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize the replacement of the cutting wire from the cutting wire groove a1 to the cutting wire groove a2; it should be noted that the direction in which the at least one distance adjustment mechanism 23 drives multiple cutting wheels 211 in the wire cutting unit to move in the second direction is the direction from the cutting wire groove a2 to the cutting wire groove a1. After the groove change, the cutting position of the wire saw in space remains unchanged, so the step of further calibrating the position of the cutting wheels 211 or other components can be omitted, and the silicon rod can be cut according to the preset cutting amount, which simplifies the groove change process.

[0206] To further illustrate the implementation manner of the at least one distance adjustment mechanism for realizing the movement of multiple cutting wheels in the wire cutting unit in the second direction, the present application provides the following embodiments. In some examples, when the number of wire cutting units in the wire cutting is different, the specific form of the at least one distance adjustment mechanism can be changed accordingly.

[0207] In one embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjustment mechanism includes: a lead screw, arranged in the second direction and threadedly connected to the single-wire cutting unit; a driving source, used to drive the lead screw to rotate.

[0208] Here, the single-wire cutting unit is a wire cutting unit. The single-wire cutting unit in the wire cutting device includes multiple cutting wheels arranged in the first direction. The cutting wire winds around the multiple cutting wheels to form at least one wire saw, and the at least one wire saw is in the same straight-line direction. The lead screw of the distance adjustment mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the driving source and rotated under the drive of the driving source, and the distal end of the lead screw is threadedly connected to the single-wire cutting unit. By means of the connection methods at both ends of the lead screw, the lead screw can rotate based on the transmission of the driving source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the setting direction of the lead screw, that is, the second direction; by driving the lead screw to rotate through the driving source in the distance adjustment mechanism, the displacement of the single-wire cutting unit in the second direction can be realized. When the lead screw is driven to rotate in different helix directions, the forward or backward displacement of the single-wire cutting unit in the second direction can be realized.

[0209] In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjusting mechanism includes: a telescopic member disposed along a second direction and associated with the single-wire cutting unit; and a driving source for driving the telescopic member to perform a telescopic movement along the second direction. Here, the telescopic member can be arranged as a rod structure and the extending direction of the rod is the second direction. The telescopic member can perform a telescopic movement along its extending direction under the drive of the driving source. One end of the telescopic member can be connected to the driving source, and the telescopic free end is associated with the single-wire cutting unit, so that it can drive the single-wire cutting to move in the second direction under the action of the driving source. The telescopic member can be, for example, an electric telescopic rod, or a connecting rod connected to a cylinder taper rod, and the cylinder can be used as the driving source, which is not limited in this application. The manner in which the telescopic rod is associated with the single-wire cutting unit can be a direct connection or an indirect connection. For example, it can be directly connected to the mounting beam of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or a bearing. It should be understood that the extension or contraction of the telescopic member corresponds to the forward or backward movement of the single-wire cutting unit in the second direction.

[0210] Here, in the embodiment provided in this application, the association can be realized, for example, by one or more of clamping, screwing, bonding, and welding. For example, in the above embodiment, the telescopic rod can be associated with the wire cutting unit by one or more of clamping, screwing, bonding, and welding; of course, the implementation manner of the association is not limited thereto, but aims to achieve transmission in the second direction.

[0211] In yet another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjusting mechanism includes: a rack disposed along the second direction on the single-wire cutting unit; a transmission gear meshing with the rack; and a driving source for driving the transmission gear to rotate. The transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves correspondingly along the step direction of the rack. In this example, by the cooperation of the rack and the transmission gear, the rotational movement driven by the driving source can be converted into a linear movement along the rack direction. The rack is disposed along the second direction on the single-wire cutting unit, so that it can drive the single-wire cutting unit to move in the second direction. At the same time, by controlling the driving source to switch the rotation direction of the transmission gear, the displacement direction of the single-wire cutting unit moving forward or backward in the second direction can be switched.

[0212] In the foregoing embodiments, the distance adjusting mechanism may be provided as one or more. For example, when the span of the single-wire cutting unit in the first direction is relatively large and it is difficult to drive multiple cutting wheels in the single-wire cutting unit to move in the second direction by setting only one distance adjusting mechanism, multiple distance adjusting mechanisms may be provided for driving. For example, distance adjusting structures may be respectively provided at both ends of the single-wire cutting unit in the first direction or multiple distance adjusting mechanisms may be provided at equal intervals in the first direction. Here, multiple corresponding distance adjusting mechanisms on the single-wire cutting unit may cooperate with each other to ensure that the multiple distance adjusting mechanisms drive the multiple wire cutting wheels of the single-wire cutting unit to move in the second direction with the same displacement amount (magnitude and direction).

[0213] In one embodiment, the wire cutting device includes a first wire cutting unit and a second wire cutting unit oppositely arranged in the second direction, and at least one of the first wire cutting unit and the second wire cutting unit is driven by the at least one distance adjusting mechanism to move in the second direction, so as to adjust the wire saw distance between at least one wire saw in the first wire cutting unit and at least one wire saw in the second wire cutting unit, or change the cutting wire grooves of the multiple cutting wheels in the first wire cutting unit and / or the multiple cutting wheels in the second wire cutting unit around which the cutting wire winds.

[0214] In some embodiments, the wire cutting device includes two wire cutting units such as the first wire cutting unit and the second wire cutting unit. For example Figure 16 in the shown embodiment, the first wire cutting unit 21a and the second wire cutting unit 21b are arranged parallel to each other in the first direction, and the wire saws in the first wire cutting unit 21a and the second wire cutting unit 21b are also parallel. In an actual scenario, the wire cutting device may be used in a silicon rod squaring device, for example. The silicon rod on each silicon rod bearing structure in the silicon rod squaring device corresponds to the wire saws of the first cutting unit and the second cutting unit in the cutting area. Then, two parallel cut surfaces can be processed on the surface of the silicon rod by one lifting and cutting. Here, by adjusting the distance between the first wire cutting unit 21a and the second wire cutting unit 21b in the second direction, the cutting amount of the silicon rod can be controlled.

[0215] The at least one distance adjusting mechanism 23 may be provided to be connected to the first wire cutting unit 21a or the second wire cutting unit 21b, or may be associated with both the first wire cutting unit 21a and the second wire cutting unit 21b at the same time, so as to drive multiple cutting wheels 211 in the connected or associated first wire cutting unit 21a or / and the second wire cutting unit 21b to move in the second direction, and realize adjusting the cutting position of at least one wire saw in the connected or associated first wire cutting unit 21a or / and the second wire cutting unit 21b, or changing the cutting wire grooves of the multiple cutting wheels 211 in the connected or associated first wire cutting unit 21a or / and the second wire cutting unit 21b.

[0216] In one embodiment, the distance adjusting mechanism includes: a lead screw disposed along a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a driving source for driving the lead screw to rotate. The manner in which the lead screw and the driving source drive a plurality of cutting wheels on the first wire cutting unit or the second wire cutting unit to move in the second direction is similar to that of the foregoing embodiment. The first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism can be regarded as a single-wire cutting unit, which will not be elaborated herein. It should be understood that by providing the distance adjusting mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased and decreased, and the wire cutting device can cut the silicon rod into different specifications.

[0217] In another embodiment, the distance adjusting mechanism includes: a telescopic member disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; a driving source for driving the telescopic member to perform a telescopic movement along the second direction. Here, the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism can be regarded as a single-wire cutting unit, and the specific implementation manner can refer to the foregoing embodiment, which will not be elaborated herein.

[0218] In still another embodiment, the distance adjusting mechanism includes: a rack disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear meshing with the rack; a driving source for driving the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to move linearly along the rack direction, and the first wire cutting unit or the second wire cutting unit associated with the rack can drive a plurality of cutting wheels to move along the second direction by means of the rack.

[0219] In one embodiment, the distance adjusting mechanism includes: a bidirectional lead screw disposed along a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a driving source for driving the lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction. In one implementation manner, as shown in Figure 16 the embodiment shown, the bidirectional lead screw 231 is a double-threaded lead screw. Threads are provided at both ends of the bidirectional lead screw 231 and the thread directions are opposite. The driving source 232 can be disposed at any one end of the bidirectional lead screw 231 to drive the bidirectional lead screw 231 to rotate along the axis of the lead screw 231. By means of the threads with opposite directions at both ends of the bidirectional lead screw 231, when the bidirectional lead screw 231 rotates under the drive of the driving source 232, the movements at both ends of the bidirectional lead screw 231 are converted into linear movements in opposite axial directions, and the axial direction is the second direction in which the bidirectional lead screw 231 is disposed. Under the drive of the driving source 232, the first wire cutting unit 21a and the second wire cutting unit 21b can move towards each other or away from each other.

[0220] In one embodiment, the distance adjusting mechanism includes: a first rack, along a second direction and associated with the first wire cutting unit; a second rack, along the second direction and associated with the second wire cutting unit; a transmission gear, meshing with the first rack and the second rack; and a driving source, configured to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction.

[0221] In an implementation, the first rack is linked to the first wire cutting unit, the second rack is linked to the second wire cutting unit, the transmission gear is connected to the power output shaft of a driving source such as a servo motor, and meshes with the first rack and the second rack, and is configured to drive the first wire cutting unit and the second wire cutting unit to move towards each other to perform a closing action when rotating forward, and drive the first wire cutting unit and the second wire cutting unit to move away from each other when rotating backward. The first rack and the second rack can be meshed on both sides of the transmission gear, such that the linear velocity directions at the first rack and the second rack are opposite when the transmission gear rotates. The driving motor drives the transmission gear to rotate. When the transmission gear rotates forward, the first rack and the second rack move towards each other, which drives the first wire cutting unit and the second wire cutting unit to move towards each other. When the transmission gear is driven to rotate backward, the first rack and the second rack move away from each other to drive the first wire cutting unit and the second wire cutting unit to move away from each other. Herein, the transmission gear can be axially connected to the power output shaft of the driving source, or indirectly connected to the power output shaft, for example, axially connected to a rotating part connected to the power output shaft.

[0222] Herein, one or more distance adjusting mechanisms can be provided in the wire cutting device. Each distance adjusting mechanism is connected to the first wire cutting unit and the second wire cutting unit. The number of the distance adjusting mechanisms can be comprehensively determined based on factors such as the power requirement of the drive, the force on the lead screw, the smoothness of driving multiple cutting wheels in the wire cutting unit to move, and the equipment space of the wire cutting device. For example, when the span of the first wire cutting unit and the second wire cutting unit in a first direction is small, only one distance adjusting mechanism can be used to adjust the cutting position of the wire saw in the cutting unit or change the cutting wire groove. Then, one distance adjusting mechanism can be provided in the wire cutting device to drive the first wire cutting unit and the second wire cutting unit to move towards each other or away from each other along the second direction. Another example is that when the span of the first wire cutting unit and the second wire cutting unit in the first direction is long, the wire cutting unit requires a large driving power and needs to meet the force strength range of the power on transmission connection components such as the lead screw or the rack. Multiple distance adjusting mechanisms can be provided in the wire cutting device, and the multiple distance adjusting mechanisms cooperate with each other to ensure that the multiple distance adjusting mechanisms drive the multiple wire cutting wheels of the first wire cutting unit and the second wire cutting unit to move towards each other or away from each other in the second direction with the same displacement amount (magnitude and direction).

[0223] In some embodiments, the distance adjustment mechanism is a servo motor provided on at least one wire cutting unit. In an actual scenario, a servo motor is provided on at least one wire cutting unit or each wire cutting unit of the wire cutting device, and the corresponding wire cutting unit is controlled by the servo motor to displace in the second direction. The wire cutting unit can pre-determine the cutting offset amount for changing slots or the adjustment amount for adjusting the cutting position of the cutting wire. With the precise positioning function of the servo motor, multiple cutting wheels in the wire cutting unit are driven to move along the second direction by a preset displacement amount. For example, in the wire cutting device, there is a single wire cutting unit, and a servo motor is provided on the single wire cutting unit to drive the single wire cutting unit to move along the second direction; or, in the wire cutting device, there is a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or / and the second wire cutting unit move relatively independently along the second direction driven by their corresponding servo motors. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw, and the wire cutting unit can be driven by the traveling motor to move along the second direction on the wire cutting support.

[0224] Here, the wire cutting device of the silicon rod processing equipment provided in the present application includes at least one distance adjustment mechanism provided on at least one wire cutting unit. Under the action of the distance adjustment mechanism, multiple cutting wheels of at least one wire cutting unit in the wire cutting device can be driven to move along the second direction. Thus, at least one cutting wire saw formed by winding around the multiple cutting wheels can change the cutting position in the second direction under the action of the distance adjustment mechanism, or alternatively, based on the movement of the multiple cutting wheels in the second direction, the groove position of the cutting wire wound around the multiple cutting wheels can be changed. The process of realizing the cutting wire position transformation or slot change based on the distance adjustment mechanism is simple, easy to implement, and convenient to operate, which is beneficial to improving the operation efficiency.

[0225] The present application also provides a silicon rod processing equipment in another aspect, which includes a machine base, a silicon rod bearing structure, and a wire cutting device. Among them, the machine base has a silicon rod processing platform; the silicon rod bearing device is provided on the silicon rod processing platform and is used for bearing the silicon rod to be cut; the wire cutting device includes a cutting frame provided on the machine base; at least one wire cutting unit movably provided on the cutting frame; the wire cutting unit includes: multiple cutting wheels sequentially arranged in the first direction, and each cutting wheel has at least two cutting wire grooves; a cutting wire sequentially wound around the multiple cutting wheels to form at least one cutting wire saw; at least one distance adjustment mechanism provided on the at least one wire cutting unit, and is used for driving multiple cutting wheels in the at least one wire cutting unit to move along the second direction to adjust the cutting position of at least one cutting wire saw in the at least one wire cutting unit, or to change the cutting wire groove around which the cutting wire is wound on multiple cutting wheels in the at least one wire cutting unit.

[0226] In some embodiments, the silicon rod processing device is a silicon rod squaring device, and the silicon rod carrying device is a silicon rod carrying structure.

[0227] Here, one or more silicon rod carrying structures may be provided on the silicon rod processing platform, and each silicon rod carrying structure can be used to carry a single silicon rod. Correspondingly, the number of silicon rod carrying structures in the cutting area on the silicon rod processing platform can correspond to the number of cutting wire saws in the wire cutting unit of the wire cutting device. For example Figure 17 or Figure 18 In the illustrated embodiment, a plurality of silicon rod carrying structures 11 are provided in the cutting area of the silicon rod processing platform, and a wire cutting unit 21 in the wire cutting device includes multiple segments of cutting wire saws to respectively correspond to the plurality of silicon rod carrying structures 11.

[0228] Take Figure 17 the silicon rod processing device being a silicon rod squaring device in the illustrated embodiment as an example for illustration. In some embodiments, the silicon rod processing platform is provided on the machine base 10 through a workbench conversion mechanism. Here, the workbench conversion mechanism can be, for example, a rotating mechanism or a translation mechanism.

[0229] The rotating mechanism may include, for example, a rotating shaft and a rotation driving unit. The rotating shaft is pivotally connected to the silicon rod processing platform, and the rotation driving unit drives the rotating shaft to rotate to drive the silicon rod processing platform to rotate.

[0230] The translation mechanism may include, for example, a translation guide rail, a slider, and a translation driving unit. The translation guide rail is laid on the machine base, the slider is provided at the bottom of the silicon rod processing platform and is adapted to the translation guide rail to provide translation guidance for the silicon rod processing platform. The translation driving unit is used to drive the silicon rod processing platform to move along the translation guide rail so that the silicon rod carrying structure on the silicon rod processing platform switches between the cutting area and the loading and unloading area. The translation driving unit can adopt a cylinder assembly or a lead screw assembly driven by a motor. In other embodiments, the translation mechanism can also adopt a gear transmission method. Specifically, the translation mechanism includes a translation tooth rail and a rotating gear driven by a motor and adapted to the translation tooth rail. The translation tooth rail is provided at the bottom of the silicon rod processing platform and can be, for example, at least one rack with a certain length. In order to make the silicon rod processing platform move smoothly, each rack is adapted with at least two spaced rotating gears, and the motor drives the rotating gears to rotate to drive the silicon rod processing platform to move so that the silicon rod carrying structure on the silicon rod processing platform switches between the cutting area and the loading and unloading area.

[0231] In some examples, when the workbench conversion mechanism is a translation mechanism, the position of the silicon rod supported by the silicon rod supporting structure in the second direction can be controlled by the translation mechanism, and the cutting amount of the silicon rod can be determined by the position of the silicon rod determined by the translation mechanism and the position of the cutting wire saw determined by the distance adjustment mechanism of the wire cutting device; for example, when the wire cutting device is provided with a first wire cutting unit and a second wire cutting unit, the first wire cutting unit or the second wire cutting unit is provided with the distance adjustment mechanism, when the distance adjustment mechanism adjusts the cutting position of at least one cutting wire saw in the first wire cutting unit or the second wire cutting unit, the translation mechanism can adjust the position of the silicon rod based on the adjusted cutting wire saw position so that the axis of the silicon rod is located on the symmetry line of the cutting wire saws of the first wire cutting unit and the second wire cutting unit. Since the cross-section of the silicon rod is usually quasi-circular, the distances between the cutting wire saws of the first wire cutting unit and the second wire cutting unit are equal, so that the specifications of the two opposite cut surfaces formed on the surface of the silicon rod after cutting are roughly the same.

[0232] The silicon rod squaring device may be, for example, Figure 17 or Figure 18 The silicon rod squaring equipment of the illustrated embodiment may, of course, be other types of silicon rod squaring equipment. For example, the wire cutting device in the silicon rod squaring equipment may be set as a single wire cutting unit. For another example, the cutting wire saw in the wire cutting unit in the wire cutting device of the silicon rod squaring equipment is one section. Of course, the cutting wire saw may also be two sections, three sections, four sections, etc., and the present application does not impose any restrictions thereon. Correspondingly, the number of silicon rod supporting structures on the silicon rod processing platform may be changed accordingly. For another example, the number of silicon rod supporting structures corresponding to each cutting wire saw in the wire cutting unit in the wire cutting device of the silicon rod squaring equipment may be one, two, three, etc.

[0233] It should be understood that when the silicon rod squaring device is provided with Figures 16 to 20 According to any one of the wire cutting devices described in the embodiments, the silicon rod squaring equipment can adjust the cutting position of the cutting wire saw based on the at least one distance adjusting mechanism to determine the cutting amount of the silicon rod during squaring cutting, or after the wire groove of the cutting wheel of the silicon rod squaring equipment is worn out during long-term cutting operation, the wire groove position of the cutting wire can be changed based on the at least one distance adjusting mechanism to ensure the processing accuracy of the silicon rod squaring equipment in continuing the squaring operation.

[0234] In certain embodiments, when the silicon rod processing equipment is a silicon rod cutting machine, the silicon rod cutting machine includes a machine base, a silicon rod supporting device, and a wire cutting device.

[0235] Among them, the machine base has a silicon rod processing platform, and the silicon rod carrying device is arranged on the silicon rod processing platform. Herein, the silicon rod carrying device can be used, for example, for horizontally carrying the silicon rod to be cut; the wire cutting device includes a cutting frame arranged on the machine base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels sequentially arranged in a first direction, and each cutting wheel has at least two cutting wire grooves; a cutting wire sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; at least one distance adjusting mechanism arranged on the at least one wire cutting unit for driving the plurality of cutting wheels in the at least one wire cutting unit to move in a second direction to adjust the cutting position of at least one cutting wire saw in the at least one wire cutting unit, or to change the cutting wire wound around the cutting wire grooves of the plurality of cutting wheels in the at least one wire cutting unit. The feeding and cutting of the silicon rod to be cut can be realized by the lifting movement of the wire cutting unit in the wire cutting device relative to the cutting frame.

[0236] In some examples, a plurality of parallel wire cutting units are provided in the wire cutting device of the silicon rod cutting machine. The plurality of parallel wire cutting units move up and down along the cutting frame, and the silicon rod to be cut can be intercepted into a plurality of silicon rod segments in one cutting. Based on the at least one distance adjusting mechanism of the wire cutting device to adjust the cutting position of at least one cutting wire saw in the wire cutting unit in the second direction, the silicon rod to be cut can be intercepted into silicon rod segments of different length specifications. In one implementation manner, the arrangement manner of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device can refer to the arrangement manner disclosed in Chinese Patent CN105196433B. Of course, the wire cutting device of the silicon rod cutting machine includes the at least one distance adjusting mechanism to adjust the cutting position of at least one cutting wire saw in at least one wire cutting unit of the silicon rod cutting machine, or to change the cutting wire wound around the cutting wire grooves of the plurality of cutting wheels in the at least one wire cutting unit.

[0237] In some examples, the silicon rod cutting machine is, for example, a double-rod silicon rod cutting device. Herein, a first processing station and a second processing station are provided in the silicon rod carrying device of the silicon rod cutting machine to respectively carry a first silicon rod to be cut and a second silicon rod to be cut. Please refer to Figure 21, which shows a schematic structural diagram of the wire cutting device of the silicon rod cutting machine in an embodiment. In this example, the wire cutting support 24 is provided on the cutting frame 20. At least one wire cutting unit 21 is respectively arranged on both sides of the wire cutting support 24 along the first direction. At least one wire cutting unit 21 located on both sides of the wire cutting support 24 can respectively cut the silicon rod to be cut at the first processing station and the second processing station. A plurality of cutting wheels 211 and a cutting wire 213 wound around the cutting wheels 211 are provided in the wire cutting unit 21. In some examples, a transition wheel 212 is also provided in the wire cutting unit 21. Among them, the cutting wheel 211 has at least two cutting grooves, and the transition wheel 212 has at least two wire guiding grooves. Here, on either side of the wire cutting support 24, there is also included at least one distance adjusting mechanism (not shown in the figure). The distance adjusting mechanism can be set, for example, as any implementation mode of the distance adjusting mechanism shown in Figures 16 to 20 the distance adjusting mechanism in the shown embodiment. For example, it is connected to the first wire cutting unit or the second wire cutting unit by a lead screw, or connected to the first wire cutting unit and the second wire cutting unit by a bidirectional lead screw, or the distance adjusting mechanism is a servo motor, etc., which will not be elaborated here. Thus, by using the distance adjusting mechanism, the cutting position of at least one wire saw in the at least one wire cutting unit 21 can be adjusted, or the cutting wire groove around which the cutting wire 213 is wound around the plurality of cutting wheels 211 in the at least one wire cutting unit 21 can be changed.

[0238] When the distance adjusting mechanism is used to adjust the position of at least one wire saw or change the cutting wire groove around which the cutting wire 213 is wound around the cutting wheel 211, the transition wheel 212 in the wire cutting unit 21 remains relatively stationary with respect to the cutting wheel 211. Among them, when the distance adjusting mechanism is used to adjust the position of the wire saw, the distance adjusting mechanism can drive, for example, the cutting wheel 211 and the transition wheel 212 on the wire cutting unit 21 to move along the second direction. The positional relationship between the wire saw and the cutting wheel 211 and the transition wheel 212 remains unchanged, that is, only a movement along the second direction occurs, and the cutting position adjustment can be achieved. When the distance adjusting mechanism is used to change the position of the cutting wire groove around which the cutting wire 213 is wound around the cutting wheel 211, the position of the wire guiding groove for winding the cutting wire 213 in the transition wheel 212 also changes accordingly, so that after the cutting wire 213 changes the groove, the wire guiding groove for winding the cutting wire 213 and the cutting wire groove are still in the same plane.

[0239] In some embodiments, the wire cutting units 21 on both sides of the wire cutting support 24 can also form at least a pair of wire cutting units 21. For example, the wire cutting units 21 on both sides of the wire cutting support 24 are connected in one-to-one correspondence to form at least a pair of wire cutting units 21. The pair of wire cutting units 21 is located on the same straight line in the first direction. In this example, based on the same distance adjustment mechanism, a plurality of cutting wheels 211 in the pair of wire cutting units 21 can be driven to move in the second direction. Of course, the pair of wire cutting units 21 can also be driven by a plurality of distance adjustment mechanisms in cooperation.

[0240] Of course, the specific form of the silicon rod cutting machine is not limited by the foregoing embodiments. For example, based on the positional relationship between the placement position of the silicon rod on the silicon rod carrying device and the position of the cutting wire saw, each cutting wire saw in the silicon rod cutting machine can simultaneously perform truncating cutting on multiple silicon rods; another example is that the wire cutting device in the silicon rod cutting machine only includes a section of cutting wire saw, and when the section of cutting wire saw is used to truncate a single silicon rod or multiple silicon rods, a silicon rod segment is separated from the silicon rods to be cut in one truncating operation; this application does not make any restrictions. It should be noted that the wire cutting device of the silicon rod cutting machine includes at least one distance adjustment mechanism, which can be used to drive a plurality of cutting wheels in at least one wire cutting unit of the wire cutting device to move in the second direction, so as to adjust the cutting position of at least one wire cutting saw in the at least one wire cutting unit, or change the cutting wire groove around which the cutting wire winds on the plurality of cutting wheels in the at least one wire cutting unit.

[0241] In some embodiments, the silicon rod processing equipment is a silicon rod cutting and grinding integrated machine. Here, the silicon rod cutting and grinding integrated machine includes a machine base, a silicon rod carrying device, a wire cutting device, and a grinding device.

[0242] Among them, the machine base has a silicon rod processing platform. In the silicon rod cutting and grinding integrated machine, the silicon rod processing platform can be set as processing areas for performing different processing functions, such as consisting of a cutting station and a grinding station. The silicon rod carrying device is used to carry the silicon rod to be processed. The wire cutting device includes a cutting frame, which is arranged on the machine base; at least one wire cutting unit, which is movably arranged on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged in sequence along the first direction, and each cutting wheel has at least two cutting wire grooves; a cutting wire, which is sequentially wound around the plurality of cutting wheels to form at least one cutting wire saw; at least one distance adjustment mechanism, which is arranged on the at least one wire cutting unit and is used to drive the plurality of cutting wheels in the at least one wire cutting unit to move in the second direction, so as to adjust the cutting position of at least one wire cutting saw in the at least one wire cutting unit, or change the cutting wire groove around which the cutting wire winds on the plurality of cutting wheels in the at least one wire cutting unit.

[0243] Please refer to Figure 22 , which shows a schematic structural diagram of the silicon rod cutting and grinding integrated machine of the present application in an embodiment. In this example, asFigure 22 As shown, the integrated silicon rod cutting and grinding machine includes a machine base with a silicon rod processing platform; a wire cutting device disposed on the machine base for performing side cutting in a first direction on the silicon rod at the first processing area of the silicon rod processing platform and side cutting in a second direction on the silicon rod at the second processing area of the silicon rod processing platform to form a square silicon rod; a grinding device disposed on the machine base for grinding the surface and chamfering the square silicon rod at the third processing area of the silicon rod processing platform; and a silicon rod conversion device disposed on the silicon rod processing platform for converting the silicon rod among the first processing area, the second processing area, and the third processing area.

[0244] Here, the wire cutting device includes: a cutting frame 20, a wire cutting support 24, a first cutting unit group, and a second cutting unit group, and the first cutting unit group and the second cutting unit group are respectively used for cutting the silicon rod at the first processing area and the second processing area.

[0245] In this embodiment, since the wire cutting support 24 can be configured with the first cutting unit group and the second cutting unit group, that is, the first cutting unit group and the second cutting unit group share the wire cutting support 24. Therefore, in this embodiment, on the one hand, the cutting frame 20 and the wire cutting support 24 in the wire cutting device are disposed at a central position between the first processing area and the second processing area. On the other hand, the wire cutting support 24 is specially designed. As Figure 22 shown, the wire cutting support 24 in this embodiment may include a support body and a first support flank and a second support flank located on opposite sides of the support body. In some embodiments, the support body in the wire cutting support 24 is disposed at an angle of 45° with respect to the X-axis or the Y-axis, the first support flank forms an angle of 145° with the support body and is disposed along the Y-axis, and the second support flank forms an angle of 145° with the support body and is disposed along the X-axis.

[0246] In some embodiments, the first cutting unit group may include at least four first cutting wheels 211a. These four first cutting wheels 211a can be combined into a pair of first cutting wheel groups. That is, two first cutting wheels 211a arranged opposite to each other along the X-axis form a first cutting wheel group, and two first cutting wheel groups along the Y-axis form a pair of first cutting wheel groups, that is, two wire cutting units 21 arranged parallel to each other in the X direction are formed. The cutting wire 213 is sequentially wound around each first cutting wheel group in the first cutting unit group to form a cutting wire mesh. In actual applications, the cutting wire 213 is sequentially wound around the four first cutting wheels 211a in the first cutting unit group to form two cutting wire saws. These two cutting wire saws are arranged along the X-axis direction and are parallel to each other, constituting the cutting wire mesh. Specifically, the cutting wire 213 is wound around the two first cutting wheels 211a arranged along the X-axis direction in a first cutting wheel group to form a cutting wire saw, and the cutting wire 213 is wound around the two first cutting wheels 211a arranged along the X-axis direction in another first cutting wheel group to form another cutting wire saw. In this way, these two parallel cutting wire saws cooperate to form a first cutting wire mesh in the shape of "=" along the X-axis direction.

[0247] Similarly, the second cutting unit group may include at least four second cutting wheels 211b. Two second cutting wheels 211b arranged opposite to each other along the Y-axis form a second cutting wheel group, and two second cutting wheel groups along the X-axis form a pair of second cutting wheel groups, that is, two wire cutting units 21 arranged parallel to each other in the Y direction are formed; in actual applications, the cutting wire 213 is sequentially wound around the four second cutting wheels 211b in the second cutting unit group to form two cutting wire saws. These two cutting wire saws are arranged along the Y-axis direction and are parallel to each other, and the two parallel cutting wire saws cooperate to form a second cutting wire mesh in the shape of "=" along the Y-axis direction.

[0248] In some examples, the silicon rod conversion device is arranged in the central area of the silicon rod processing platform and is used to convert the silicon rod between the waiting position, the first processing position, the second processing position, and the third processing position on the silicon rod processing platform. In one embodiment, the silicon rod conversion device is rotatably arranged on the silicon rod processing platform. The silicon rod conversion device may further include: a conveying body, which is in a disk shape, a square disk shape or other similar shapes; a silicon rod positioning mechanism (i.e., a silicon rod carrying device) arranged on the conveying body, which is used to position the silicon rod; a conversion driving mechanism, which is used to drive the conveying body to rotate to drive the silicon rod positioned by the silicon rod positioning mechanism to change positions. In some examples, the silicon rod positioning mechanism further includes a rotating structure, which is used to drive the silicon rod carried on the silicon rod positioning mechanism to rotate along the axis of the silicon rod to adjust the cutting surface of the silicon rod.

[0249] Here, after the silicon rod to be cut is placed and positioned on the silicon rod positioning mechanism, the silicon rod to be cut is cut at the first processing position by the first cutting wire mesh in the shape of "=" along the X-axis direction in the wire cutting device to form two axial cutting surfaces along the X-axis direction; then, the conversion drive mechanism drives the conveying body to drive the silicon rod positioning mechanism to position the silicon rod to the second processing position, and is cut by the second cutting wire mesh in the shape of "=" along the Y-axis direction in the wire cutting device to form two axial cutting surfaces along the Y-axis direction, that is, a cut silicon rod with a quasi-rectangular cross-section is formed; the cut silicon rod can also be converted to the third processing position for subsequent grinding operations.

[0250] In the foregoing examples of the silicon rod cutting and grinding integrated machine, the wire cutting device further includes at least one distance adjustment mechanism (not shown in the figure). In a specific embodiment, at least one distance adjustment mechanism is included in the first cutting unit group at the first processing position and the second cutting unit group at the second processing position, and is provided on at least one wire cutting unit in the corresponding cutting unit group for driving a plurality of cutting wheels in the cutting wheel group of the at least one wire cutting unit to move along the second direction.

[0251] Here, the first direction and the second direction are defined based on the carrier coordinate system of the wire cutting unit. Therefore, when the directions of multiple wire cutting units in the silicon rod processing equipment (in this example, the silicon rod cutting and grinding integrated machine) are different, the first directions respectively corresponding to multiple wire cuttings are not in the same direction in the external space; correspondingly, the second direction is orthogonal to the first direction. Therefore, the driving and moving direction executed by the at least one distance adjustment mechanism is the orthogonal direction relative to the driven wire cutting unit. For example, in the first cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the X-axis direction. In the first cutting unit group, the first direction is the X-axis direction and the second direction is the Y-axis direction; in the second cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the Y-axis direction. In the second cutting unit group, the first direction is the Y-axis direction and the second direction is the X-axis direction.

[0252] Taking the first cutting unit group as an example, which includes two wire cutting units, the distance adjustment mechanism can be associated with, for example, the first wire cutting unit or the second wire cutting unit of the two wire cutting units, or simultaneously associated with the first wire cutting unit and the second wire cutting unit. The distance adjustment mechanism can be set to be, for example, Figures 16 to 20 the distance adjustment mechanism in any implementation manner of the embodiment shown, for example, connected to the first wire cutting unit or the second wire cutting unit by a lead screw, or connected to the first wire cutting unit and the second wire cutting unit by a bidirectional lead screw, or the distance adjustment mechanism is a servo motor, etc., which will not be elaborated here.

[0253] In the first cutting unit group, when at least one distance adjustment mechanism drives a plurality of cutting wheels in the first wire cutting unit and / or the second wire cutting unit to move in the second direction, the first wire cutting unit and / or the second wire cutting unit can, for example, move along the flank of the first support, that is, move in the second direction (Y-axis direction) in the first cutting unit group; it can be used to adjust the cutting position of at least one wire saw in the first wire cutting unit and / or the second wire cutting unit, or to change the cutting wire groove around which the cutting wire winds around a plurality of cutting wheels in the first wire cutting unit and / or the second wire cutting unit.

[0254] The structure of the second cutting unit group is similar to that of the first cutting unit group. The main difference lies in the different arrangement positions and directions in the silicon rod cutting and grinding integrated machine; however, in the second cutting unit group, the structure and function of at least one distance adjustment mechanism for driving a plurality of cutting wheels in the first wire cutting unit and / or the second wire cutting unit to move in the second direction are similar to those of the first cutting unit group, and will not be elaborated here.

[0255] It should be understood that in some embodiments, the positional relationship between the first processing area and the second processing area can be changed. For example, the first processing area and the second processing area can be set such that the silicon rod conversion device rotates the silicon rod by 60° to achieve switching between the two processing areas. Correspondingly, the directions of the wire cutting units in the first cutting unit group and the second cutting unit group may also change. In this example, the first directions corresponding to the wire cutting units in the first cutting unit group and the second cutting unit group change, but the position adjustment or groove change of the wire saw can still be achieved by at least one distance adjustment mechanism in the cutting unit group; in some embodiments, only single-wire cutting units are included at different processing stations in the silicon rod cutting and grinding integrated machine; in some embodiments, the silicon rod cutting and grinding integrated machine is, for example, only provided with one processing station for cutting. In a specific implementation, a "=" shaped cutting wire mesh can be set in the processing station for cutting, and the silicon rod positioning mechanism drives the silicon rod to rotate 90° and then cuts again; the silicon rod cutting and grinding integrated machine has various deformation forms, which are not limited in this application.

[0256] Generally speaking, in related wire cutting devices, the positional relationship between a plurality of cutting wheels after installation does not easily change. After one of the wire cutting wheels is worn, the overall groove needs to be changed by adjusting the position of the cutting wheel or other components, and the components whose positions are adjusted need to be further calibrated. The operation is cumbersome and the efficiency is low.

[0257] Here, the present application also provides a wire cutting device for a silicon rod processing apparatus. The silicon rod processing apparatus includes a machine base having a silicon rod processing platform; a silicon rod carrying device disposed on the silicon rod processing platform for carrying a silicon rod to be cut. The wire cutting device includes: a cutting frame disposed on the machine base; at least one wire cutting unit movably disposed on the cutting frame. The wire cutting unit includes: a plurality of cutting wheels sequentially arranged in a first direction, each cutting wheel having at least two cutting wire grooves; at least one idler wheel, each idler wheel having a wire guiding groove; a cutting wire sequentially wound around the plurality of cutting wheels and the idler wheels to form at least one cutting wire saw; and at least one shifting mechanism for driving the at least one idler wheel to move in a second direction, so that the currently wire-wound wire guiding groove in the at least one idler wheel moves from a first wire groove corresponding to the cutting wheel in the second direction to a second wire groove corresponding to the cutting wheel.

[0258] It should be understood that in a wire cutting device, a high-speed running steel wire drives the cutting abrasive attached to the steel wire or directly uses a diamond wire to friction the workpiece to be processed, so as to achieve the purpose of wire cutting. During the cutting process, the steel wire or diamond wire is guided by an idler wheel to form a wire saw or a wire mesh on the cutting wheel, and the workpiece to be processed realizes the feeding of the workpiece by the up and down movement of the workbench or the up and down movement of the wire saw or wire mesh. In long-term cutting operations, the cutting wire grooves of the cutting wheel and the wire guiding grooves of the idler wheel will inevitably wear, which affects the positioning accuracy of the cutting wire, thus leading to the need for groove changing.

[0259] In the following embodiments provided by the present application, the wire cutting device includes at least one wire cutting unit. The plurality of cutting wheels in the wire cutting unit are arranged in a first direction, that is, the plane where the cutting wire grooves of the plurality of cutting wheels are located is parallel to the first direction. For any one of the plurality of cutting wheels, there is an offset in the second direction between different cutting wire grooves. The at least one shifting mechanism can be used to drive at least one idler wheel to move in the second direction relative to the wire cutting unit, that is, the currently wire-wound wire guiding groove in the idler wheel can be moved from a first wire groove corresponding to the cutting wheel in the second direction to a second wire groove corresponding to the cutting wheel.

[0260] Here, the first wire groove (also referred to as the first cutting wire groove in the present application) and the second wire groove (also referred to as the second cutting wire groove in the present application) are used to refer to the cutting wire grooves of the cutting wheel corresponding to the wire-wound wire guiding grooves in the at least one idler wheel before and after being driven by the shifting mechanism. The number of cutting wire grooves of the cutting wheel is not limited to two. At the same time, the first wire groove and the second wire groove do not necessarily need to be adjacent cutting wire grooves on the cutting wheel, as long as they are different cutting wire grooves.

[0261] The silicon rod processing equipment applying the wire cutting device may be a silicon rod squaring equipment, a silicon rod truncating equipment, a silicon rod cutting and grinding integrated equipment, etc. In the following embodiments provided, the wire cutting of the present application is taken as an example applied to the silicon rod squaring equipment for illustration, but it is not used to limit the application scenarios of the wire cutting device of the present application.

[0262] Please refer to Figure 23 and Figure 17 , in which Figure 23 shows a schematic structural diagram of the wire cutting device of the present application in an embodiment, Figure 17 shows a schematic structural diagram of the wire cutting device of the present application applied to the silicon rod squaring equipment in an embodiment. As shown in the figure, the wire cutting device includes a cutting frame 20 and at least one wire cutting unit 21.

[0263] Among them, the cutting frame 20 is arranged on the machine base. In some embodiments, the cutting frame 20 is arranged at both ends of the machine base to ensure that the cutting wire saw formed on the wire cutting unit 21 mounted on the cutting frame 20 can cover different processing stations. For example, in the example shown in Figure 2, the cutting frame 20 is a column arranged at both ends of the machine base, and there are multiple silicon rod bearing structures on the machine base in the silicon rod squaring equipment, and the span of the wire cutting unit 21 includes each silicon rod bearing structure in the cutting area.

[0264] The wire cutting unit 21 includes a plurality of cutting wheels 211, at least one idler wheel 212, a cutting wire 213, and at least one shifting mechanism 215.

[0265] It should be understood that the plurality of cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21. In some examples, the wire cutting unit 21 includes a mounting beam 214 in the first direction, and both ends of the mounting beam 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, a wire cutting unit 21 is composed of a plurality of cutting wheels 211, a cutting wire 213 and the bearing structure of the cutting wheels 211 arranged in the same direction (or on the same straight line); the direction in which the plurality of cutting wheels 211 are arranged along the mounting beam 214 is the direction of the wheel surface of the cutting wheels 211 (or the plane where the cutting wire grooves are located) along the mounting beam 214 (i.e., the first direction).

[0266] In some examples, when there are multiple wire cutting units 21 in the wire cutting device, different wire cutting units 21 belong to different straight lines. For example, Figure 23 the two wire cutting units 21 shown are parallel respectively. In some examples, the extending directions of different wire cutting units 21 may also intersect.

[0267] It should be noted that in the embodiments of the wire cutting device provided in the present application, the first direction is the direction in which a plurality of cutting wheels 211 are arranged in the wire cutting unit 21. For example, in some examples, it is the direction of the mounting beam 214 of the wire cutting unit 21. The cutting wire saw formed by the cutting wire 213 wound around the cutting wheels 211 is also in the first direction. The second direction is the orthogonal direction of the first direction. The at least one distance adjustment mechanism drives the at least one wire cutting unit 21 to move in the second direction, that is, to move the cutting wire saw in the wire cutting unit 21 in its orthogonal direction.

[0268] The at least one idler wheel 212 is used to realize the direction guidance or tension adjustment when the cutting wire 213 is wound around different cutting wheels 211.

[0269] In some implementation manners, taking one wire cutting unit 21 as an example for illustration, the wire cutting unit 21 includes at least one idler wheel 212, and the at least one idler wheel 212 is movably arranged on a carrier for carrying a plurality of cutting wheels 211.

[0270] It should be understood that the plurality of cutting wheels 211 need to be attached to the carrier provided by the wire cutting unit 21. In some embodiments, the plurality of cutting wheels 211 belonging to the same wire cutting unit 21 are arranged on the mounting beam 214 arranged in the first direction. Both ends of the mounting beam 214 are movably connected to the cutting frame 20, and a plurality of cutting wheels 211 are sequentially arranged on each mounting beam 214. That is, one wire cutting unit 21 is composed of a plurality of cutting wheels 211 arranged in the same direction (or on the same straight line), the cutting wire 213, and the mounting beam 214 for arranging the cutting wheels 211. In some other embodiments, the plurality of cutting wheels 211 in the wire cutting unit 21 are arranged on the cutting frame 20 through a mounting frame, a connecting plate, or a frame. Here, the carrier provided by the wire cutting unit 21 for arranging the plurality of cutting wheels 211 can be in different forms, and the present application does not make any restrictions.

[0271] Such as Figure 17In the illustrated embodiment, multiple cutting wheels 211 in the same wire cutting unit 21 are arranged on a mounting beam 214. The mounting beam 214 is arranged in a first direction and moves in a second direction relative to the mounting beam 214 under the drive of the at least one shifting mechanism 215. The at least one idler wheel 212 then moves relative to the multiple cutting wheels 211 in the wire cutting unit 21 in the second direction. By controlling the displacement of the idler wheel 212 by the at least one shifting mechanism 215, the current wire groove wound by the wire in the at least one idler wheel 212 can be moved from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211 in the second direction. In an actual scenario, by changing the position of the cutting wire groove corresponding to the wire groove of the at least one idler wheel 212, the wire groove change of the cutting wire 213 on the cutting wheel 211 can be achieved without adjusting the idler wheel 212, effectively simplifying the wire groove change operation.

[0272] Here, the wire groove change process can be completed without changing the wire groove around which the cutting wire 213 is wound. In some examples, the idler wheel 212 is a single-wire-groove idler wheel 212.

[0273] In one embodiment, the at least one idler wheel is detachably arranged in the wire cutting unit. Here, the idler wheel can be set as a replaceable idler wheel. For example, the wheel shaft corresponding to the idler wheel is arranged in the wire cutting unit, and the wheel surface of the idler wheel is detachably sleeved on the wheel shaft corresponding to the idler wheel. In an actual scenario, to reduce production costs, the wheel surface of the idler wheel can be set as a consumable idler wheel made of plastic material. After the idler wheel is worn during use, it can be disassembled and replaced with a new one, eliminating operations such as installation positioning and calibration when changing the wire groove of the idler wheel, making the equipment maintenance of the wire cutting device simpler; of course, the idler wheel can also be integrally detachably arranged on the idler wheel bracket of the wire cutting unit, and the material of the idler wheel can also be rubber and similar materials, which is not limited in this application. Here, when the idler wheel is a consumable idler wheel, the idler wheel can be set as a single-wire-groove idler wheel.

[0274] Of course, in some other examples, the idler wheel can also be set as an idler wheel having at least two wire grooves. Here, the number of wire grooves in the idler wheel can be determined based on the positional relationship between the idler wheel and the cutting wheel and the winding mode of the cutting wire.

[0275] When each of the transition wheels has at least two wire grooves, and the at least two wire grooves are parallel to each other. In one example, the wire wheel is arranged such that the projection of the plane where the wire grooves are located on the horizontal plane is along a first direction, and there is a transition offset in a second direction between different wire grooves. In some implementations, the transition offset between adjacent wire grooves in the transition wheel is equal to the cutting offset between adjacent cutting wire grooves in the cutting wheel; in this example, the cutting wheel and the wire wheel in the wire cutting unit can be arranged in a one-to-one correspondence between the wire grooves and the cutting wire grooves (the correspondence means that the cutting wire grooves and the wire grooves are coplanar), and the number of wire grooves in the transition wheel may or may not be equal to the number of cutting wheels.

[0276] Here, based on the selected structural form of the transition wheel, such as the number of wire grooves, and the positional relationship between the transition wheel and the cutting wheel, and the winding manner of the cutting wire, the wire cutting unit can be arranged in different forms. For example, the present application provides the following embodiments of applying the wire cutting unit to a silicon rod squaring device:

[0277] In some embodiments, multiple cutting wheels belonging to the same wire cutting unit form at least two cutting wheel groups in a pairwise pairing manner. A transition wheel is provided between adjacent two cutting wheels in adjacent two cutting wheel groups. The cutting wire is sequentially wound around the cutting wheels and the transition wheels to form a cutting wire saw between two cutting wheels in each cutting wheel group. Among them, when the cutting wire is wound around adjacent two cutting wheels in adjacent two cutting wheel groups, it exits from the cutting wire groove of the rear cutting wheel in the previous cutting wheel group and then enters the cutting wire groove of the front cutting wheel in the next cutting wheel group after passing through the wire groove of the transition wheel.

[0278] Please refer to Figure 18 and Figure 19 , where Figure 18 shows a schematic structural diagram of the wire cutting device of the present application applied to a silicon rod squaring device in an embodiment. Figure 19It is a schematic diagram of the structure of the wire cutting unit in the wire cutting device in one embodiment. As shown in the figure, the wire cutting unit 21 in the wire cutting device is provided with 4 cutting wheel groups. Among them, a transition wheel 212 is provided between two adjacent cutting wheel groups, and the cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form a cutting wire saw on the two cutting wheels 211 of each cutting wheel group, wherein the cutting wire 213, when wound around the adjacent two cutting wheels 211 in the adjacent two cutting wheel groups, passes through the cutting wire groove of the rear cutting wheel 211 in the previous cutting wheel group and passes through the transition wheel 212 and then passes into the cutting wire groove of the front cutting wheel 211 in the next cutting wheel group. Here, every two adjacent cutting wheel groups share the same transition wheel 212 for guiding, which can reduce the length of the cutting line 213 used for tension adjustment and guiding, so that the proportion of the length of the cutting line 213 used to form a cutting wire saw in the cutting line 213 is increased, while simplifying the winding method, improving the utilization rate of the cutting line 213 and reducing production costs.

[0279] Based on the positional relationship between the cutting wheel 211 in each cutting wheel group and the silicon rod supporting structure, any cutting wire saw can be used to correspond to one (such as Figure 18 In the embodiment shown), the number of silicon rod bearing structures of 2, 3, 4, etc. silicon rods is cut. In a specific implementation manner, in order to prevent the cutting wire saw from being too long so as to cause uneven tension in the cutting wire 213, the number of silicon rod bearing structures corresponding to each cutting wire saw can be selected according to actual conditions to stabilize the processing quality.

[0280] In other embodiments, as shown in FIG. 2 , the plurality of cutting wheels 211 belonging to the same wire cutting unit 21 include a first cutting wheel 211, a tail cutting wheel 211, and at least one intermediate cutting wheel 211 located between the first cutting wheel 211 and the tail cutting wheel 211, and a transition wheel 212 is further provided beside the at least one intermediate cutting wheel 211, the transition wheel 212 having at least two wire grooves, the cutting wire 213 is sequentially wound around the cutting wheel 211 and the transition wheel 212 to form a cutting wire saw on any two adjacent cutting wheels 211, wherein when the cutting wire 213 is wound around the intermediate cutting wheel 211, it passes through one of the at least two cutting wire grooves on the intermediate cutting wheel 211, passes through the transition wheel 212 at the side, and then passes through another of the at least two cutting wire grooves on the intermediate cutting wheel 211, thereby providing a cutting offset in the second direction between any two adjacent cutting wire saws, and the cutting offset corresponds to the spacing between the two relevant cutting wire grooves.

[0281] The transition wheel and the at least one shifting mechanism may be directly connected or indirectly connected.

[0282] In some embodiments, each of the idler wheels is disposed on a bracket, and the bracket drives the idler wheel to move in a second direction along the at least one displacement mechanism.

[0283] In one embodiment, a bracket for carrying an idler wheel is provided in the wire cutting unit. The bracket is movably disposed on the mounting beam of the wire cutting unit. The bracket moves in a second direction under the drive of the at least one displacement mechanism, and the idler wheel disposed on the bracket follows the bracket to move in a second direction relative to the mounting beam.

[0284] Please refer to Figure 24 , which shows a schematic structural diagram of the idler wheel and the bracket in an embodiment of the wire cutting device of the present application. As shown in the figure, the bracket 2121 for setting the idler wheel 212 can be set as a triangular bracket or a truss structure for example. Of course, the bracket 2121 can also be set as other structures such as a vertical bearing plate, etc. The idler wheel 212 is rotatably disposed on the bracket 2121. When the at least one displacement mechanism drives the bracket 2121 to move in a second direction, the idler wheel 212 carried by the bracket 2121 can be driven to move accordingly.

[0285] In some embodiments, the at least one idler wheel is configured on independent displacement mechanisms, and each idler wheel is driven by a corresponding displacement mechanism to move in a second direction; or, the brackets of the at least one idler wheel are connected together by a connecting beam, and the connecting beam drives the at least one idler wheel to move in a second direction through the at least one displacement mechanism.

[0286] Herein, each idler wheel in the at least one idler wheel can be configured with a displacement mechanism to independently drive the corresponding idler wheel to move in a second direction, and the displacement mechanism can be connected to the idler wheel bracket; for another example, the brackets of the at least one idler wheel are connected together by a connecting beam. The specific form of the connecting beam is not limited to the beam structure. For example, the connecting beam can be a beam body, a truss structure, a frame structure, etc. The connecting beam only needs to connect the brackets of different idler wheels in the wire cutting unit. When the at least one displacement mechanism drives the connecting beam to move in a second direction, each idler wheel and its corresponding support seat relatively fixed by the connecting beam can be driven to move in a second direction following the connecting beam.

[0287] In some embodiments, the displacement mechanism is used to drive the at least one idler wheel to move in a second direction. At the same time, the displacement mechanism can also movably dispose the at least one idler wheel in the wire cutting unit.

[0288] In some examples, the displacement mechanism includes: a displacement guide rail disposed along the second direction; a power source for driving the at least one idler wheel to move along the displacement guide rail.

[0289] Please refer toFigure 25 , shown as Figure 23 The enlarged structural schematic diagram at position C in Figure 23 and Figure 25 , as shown in the figure, the shifting guide rail 2151 can be arranged on the mounting beam, for example, and is used to carry the idler wheel 212 to make the idler wheel 212 move along the guide rail driven by the power source; or for carrying the idler wheel bracket 2121 or the connecting beam 2122 connecting each idler wheel bracket 2121. Correspondingly, the power source can drive the bracket 2121 of the idler wheel 212 or the connecting beam 2122. In a specific implementation manner, the idler wheel 212, the bracket 2121 or the connecting beam 2122 can be arranged on the shifting guide rail 2151 through a slider. Under the action of the power source, the idler wheel 212, the bracket 2121 or the connecting beam 2122 carried on the shifting guide rail 2151 can displace along the second direction under the limiting action of the shifting guide rail 2151.

[0290] It should be noted that in the embodiments provided in the present application, when each idler wheel in the at least one idler wheel is configured with a shifting mechanism to independently drive the corresponding idler wheel to move in the second direction, the shifting guide rail in the shifting mechanism corresponds to an idler wheel, and the power source correspondingly drives the idler wheel arranged on the shifting guide rail; when the brackets of the at least one idler wheel are connected together through a connecting beam, the shifting guide rail is correspondingly arranged for the connecting beam, and the number of the shifting guide rails can be one, two, three, etc. In an actual scenario, the number of the shifting guide rails arranged can be comprehensively determined based on factors such as the span length of the connecting beam and the total weight of the connecting beam and the idler wheels carried by it.

[0291] In some embodiments, the power source is a cylinder assembly, including a cylinder or a hydraulic pump, and a telescopic rod; wherein, the telescopic rod is connected to the bracket of the idler wheel or the connecting beam.

[0292] Here, the telescopic rod is arranged along the second direction, one end of the telescopic rod is connected to the cylinder or the hydraulic pump, and the other end, i.e., the free end, is connected to the bracket of the idler wheel or the connecting beam. The free end of the telescopic rod makes a telescopic movement driven by the cylinder or the hydraulic pump, that is, makes a forward or backward movement along the second direction, thereby driving the idler wheel bracket or the connecting beam connected to the free end to move forward or backward along the second direction. The position of the wire groove of the idler wheel corresponding to the idler wheel bracket or the connecting beam thus moves relative to the cutting wire groove along the second direction. By controlling the displacement of the free end of the telescopic rod, the current wire groove that has been cut and wound in the corresponding idler wheel can be moved from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

[0293] In some embodiments, the power source includes: a lead screw and a driving source; wherein, the lead screw is connected to the bracket of the idler wheel or the connecting beam.

[0294] In one implementation, the lead screw is arranged in the second direction. One end of the lead screw is connected to the driving source and rotates along the lead screw axis under the drive of the driving source. The other end of the lead screw is threadedly connected to the idler wheel bracket or the connecting beam. By means of the threaded connection form, the lead screw converts the rotation driven by the driving source into a linear motion along the direction in which the lead screw is arranged. The idler wheel bracket or the connecting beam is driven by the lead screw to move along the displacement guide rail.

[0295] In another implementation, one end of the lead screw is connected to the driving source and the other end is connected to the idler wheel bracket or the connecting beam. The lead screw moves along the second direction under the drive of the driving source. For example, the lead screw is connected to the piston rod of a cylinder, or is connected to other mechanisms that can generate linear motion. The lead screw moves linearly along the second direction under the drive of the driving source and drives the bracket or the connecting beam of the connected idler wheel to displace in the second direction.

[0296] Here, the at least one idler wheel can move along the second direction under the action of the at least one displacement mechanism. By controlling the moving distance of the at least one idler wheel, the current wire groove wound by cutting in the at least one idler wheel can be moved from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. Thus, slot changing of the cutting wheel can be performed. During the slot changing process, there is no need to perform idler wheel slot changing and calibration, and the slot changing process is simplified.

[0297] In actual cutting operations, after the slot changing operation is performed, the cutting wire moves from the first wire groove to the second wire groove, and then the position of the wire saw in the second direction changes. Based on the processing requirements, usually, the position of the wire saw also needs to be adjusted to process the silicon rod according to the preset cutting amount. To simplify this process, the present application also provides the following embodiments:

[0298] In some embodiments, the wire cutting device further includes: at least one distance adjusting mechanism, arranged on the at least one wire cutting unit, for driving a plurality of cutting wheels in the at least one wire cutting unit to move along the second direction, so as to adjust the cutting position of at least one wire saw in the at least one wire cutting unit, or change the cutting wire groove around which the cutting wire winds on the plurality of cutting wheels in the at least one wire cutting unit.

[0299] The wire cutting device can realize the switching of the cutting wire between different cutting grooves of the cutting wheel based on the at least one distance adjusting mechanism, or adjust the position of the wire saw to change the cutting position (or processing specification) relative to the silicon rod.

[0300] In some implementations, please refer to Figure 26 , shown as Figure 17Enlarged schematic view at D in the figure. As shown in the figure, the wire cutting unit 21 can be arranged on the cutting frame 20 by means of a wire cutting support 24. The wire cutting support 24 is arranged on the cutting frame 20 and includes a guide rail arranged in the second direction. The wire cutting unit 21 is arranged on the guide rail of the wire cutting support 24 to form a degree of freedom of movement in the second direction. Of course, the upper part of the wire cutting support 24 can also be provided with a guide groove in the second direction, a slide bar in the second direction, or other limiting structures or guiding structures in the second direction for arranging the at least one wire cutting unit 21, and this application does not make any restrictions. The at least one distance adjusting mechanism 23 adjusts the position of the wire cutting unit 21 in the second direction on the wire cutting support 24.

[0301] It should be understood that the wire cutting device can realize the cutting process of the silicon rod based on the lifting movement of the wire cutting unit 21 along the cutting frame 20, and the cutting specifications are controlled by adjusting the relative position between the wire cutting saw and the silicon rod in the second direction. With reference to Figure 17 and Figure 26 , when the silicon rod is placed on the silicon rod bearing structure and its position is fixed, by moving the wire cutting saw in the second direction through the distance adjusting mechanism 23, the cutting position of at least one wire cutting saw in the at least one wire cutting unit 21 can be adjusted, which can be used to control the cutting amount of the silicon rod. Or, by adjusting the position of the cutting wheel carried by the wire cutting unit 21 in the second direction, the cutting wire can be changed slots and the position of the wire cutting saw in the second direction before and after the slot change can be controlled to remain unchanged.

[0302] In some embodiments, the wire cutting device includes a single wire cutting unit, and the distance adjusting mechanism includes: a lead screw, arranged in the second direction and threadedly connected to the single wire cutting unit; a driving source, used to drive the lead screw to rotate.

[0303] Here, the single wire cutting unit is a wire cutting unit. The single wire cutting unit in the wire cutting device includes a plurality of cutting wheels arranged in the first direction. The cutting wire is wound around the plurality of cutting wheels to form at least one wire cutting saw, and the at least one wire cutting saw is along the same straight line direction. The lead screw of the distance adjusting mechanism has a distal end and a proximal end. In a specific implementation manner, for example, the proximal end of the lead screw can be connected to the driving source and rotated under the drive of the driving source. The distal end of the lead screw is threadedly connected to the single wire cutting unit. By means of the connection methods at both ends of the lead screw, the lead screw can rotate based on the transmission of the driving source and convert the rotation of the lead screw into an axial displacement through the threaded connection. The axial displacement direction is the setting direction of the lead screw, that is, the second direction. By driving the lead screw to rotate through the driving source in the distance adjusting mechanism, the displacement of the single wire cutting unit in the second direction can be realized. When the lead screw is driven to rotate in different rotation directions, the forward or backward displacement of the single wire cutting unit in the second direction can be realized.

[0304] In another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjusting mechanism includes: a telescopic member disposed along a second direction and associated with the single-wire cutting unit; and a driving source for driving the telescopic member to perform telescopic movement along the second direction. Here, the telescopic member can be arranged as a rod structure and the extending direction of the rod is the second direction. The telescopic member can perform telescopic movement along its extending direction under the drive of the driving source. One end of the telescopic member can be connected to the driving source, and the telescopic free end is associated with the single-wire cutting unit, so that it can drive the single-wire cutting to move in the second direction under the action of the driving source. The telescopic member can be, for example, an electric telescopic rod, or a connecting rod connected to a cylinder taper rod, and the cylinder can be used as the driving source, which is not limited in this application. The manner in which the telescopic rod is associated with the single-wire cutting unit can be a direct connection or an indirect connection. For example, it can be directly connected to the mounting beam of the single-wire cutting unit, or indirectly connected to the single-wire cutting unit through a support or a bearing. It should be understood that when the telescopic member extends or contracts, it corresponds to the forward or backward movement of the single-wire cutting unit in the second direction.

[0305] Here, in the embodiments provided in this application, the association can be achieved, for example, through one or more of clamping, screwing, bonding, and welding. For example, in the above embodiment, the telescopic rod can be associated with the wire cutting unit through one or more of clamping, screwing, bonding, and welding; of course, the implementation manner of the association is not limited thereto, but aims to achieve transmission in the second direction.

[0306] In yet another embodiment, the wire cutting device includes a single-wire cutting unit; the distance adjusting mechanism includes: a rack disposed along a second direction on the single-wire cutting unit; a transmission gear meshing with the rack; and a driving source for driving the transmission gear to rotate. The transmission gear rotates under the drive of the driving source, and the rack meshing with the transmission gear moves correspondingly along the step direction of the rack. In this example, by the cooperation of the rack and the transmission gear, the rotational movement driven by the driving source can be converted into a linear movement along the rack direction. The rack is disposed along the second direction on the single-wire cutting unit, so that it can drive the single-wire cutting unit to move in the second direction. At the same time, by controlling the driving source to switch the rotation direction of the transmission gear, the displacement direction of the single-wire cutting unit can be switched between forward and backward movement in the second direction.

[0307] In the foregoing embodiments, the distance adjustment mechanism may be provided as one or more. For example, when the span of the single-wire cutting unit in the first direction is relatively large, and it is difficult to drive multiple cutting wheels in the single-wire cutting unit to move in the second direction by providing one distance adjustment mechanism, multiple distance adjustment mechanisms may be provided for driving. For example, distance adjustment structures may be provided at both ends of the single-wire cutting unit in the first direction or multiple distance adjustment mechanisms may be provided at equal intervals in the first direction. Here, multiple corresponding distance adjustment mechanisms on the single-wire cutting unit may cooperate with each other to ensure that the multiple distance adjustment mechanisms drive the multiple wire cutting wheels of the single-wire cutting unit to move in the second direction with the same displacement amount (magnitude and direction).

[0308] In some embodiments, the wire cutting device includes a first wire cutting unit and a second wire cutting unit oppositely arranged in the second direction, and at least one of the first wire cutting unit and the second wire cutting unit is driven to move in the second direction by the at least one distance adjustment mechanism, for adjusting the wire saw spacing between at least one wire saw in the first wire cutting unit and at least one wire saw in the second wire cutting unit, or changing the cutting wire grooves of the multiple cutting wheels in the first wire cutting unit and / or the multiple cutting wheels in the second wire cutting unit around which the cutting wire is wound.

[0309] In some embodiments, the wire cutting device includes two wire cutting units such as a first wire cutting unit and a second wire cutting unit, for example Figure 23 In the illustrated embodiment, the first wire cutting unit and the second wire cutting unit are arranged parallel to each other in the first direction, and the wire saws in the first wire cutting unit and the second wire cutting unit are also parallel. In an actual scenario, the wire cutting device may be used in a silicon rod squaring device, for example. For the silicon rods on each silicon rod bearing structure in the silicon rod squaring device, the wire saws of the first cutting unit and the second cutting unit correspond in the cutting area. Then, two parallel cut surfaces can be machined on the surface of the silicon rod by one up-and-down cutting. Here, by adjusting the distance between the first wire cutting unit and the second wire cutting unit in the second direction, the cutting amount of the silicon rod can be controlled.

[0310] The at least one distance adjustment mechanism may be configured to be connected to the first wire cutting unit or the second wire cutting unit, or may be associated with both the first wire cutting unit and the second wire cutting unit at the same time, so as to drive multiple cutting wheels in the connected or associated first wire cutting unit or / and second wire cutting unit to move in the second direction, and to adjust the cutting position of at least one wire saw in the connected or associated first wire cutting unit or / and second wire cutting unit, or to change the cutting wire grooves of the multiple cutting wheels in the connected or associated first wire cutting unit or / and second wire cutting unit.

[0311] In one embodiment, the distance adjusting mechanism includes: a lead screw disposed along a second direction and threadedly connected to the first wire cutting unit or the second wire cutting unit; and a driving source for driving the lead screw to rotate. The manner in which the lead screw and the driving source drive a plurality of cutting wheels on the first wire cutting unit or the second wire cutting unit to move in the second direction is similar to that of the foregoing embodiment. The first cutting unit or the second wire cutting unit driven by the distance adjusting mechanism can be regarded as a single-wire cutting unit, which will not be elaborated herein. It should be understood that by providing the distance adjusting mechanism on any wire cutting unit, the distance between the parallel cutting wire saws formed between the first wire cutting unit and the second wire cutting unit can be increased or decreased, and the wire cutting device can cut the silicon rod into different specifications.

[0312] In another embodiment, the distance adjusting mechanism includes: a telescopic member disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; and a driving source for driving the telescopic member to perform a telescopic movement along the second direction. Here, the first cutting unit or the second wire cutting unit provided with the distance adjusting mechanism can be regarded as a single-wire cutting unit, and the specific implementation manner can refer to the foregoing embodiment, which will not be elaborated herein.

[0313] In yet another embodiment, the distance adjusting mechanism includes: a rack disposed along a second direction and associated with the first wire cutting unit or the second wire cutting unit; a transmission gear meshing with the rack; and a driving source for driving the transmission gear to rotate. Through the meshing transmission gear and rack, the driving source can control the rack to perform a linear motion along the rack direction, and the first wire cutting unit or the second wire cutting unit associated with the rack can be driven by the rack to move along the second direction.

[0314] In one embodiment, the distance adjusting mechanism includes: a bidirectional lead screw disposed along a second direction and threadedly connected to the first wire cutting unit and the second wire cutting unit; and a driving source for driving the lead screw to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction. In one implementation manner, the bidirectional lead screw is a double-threaded lead screw, and threads with opposite directions are respectively provided at both ends of the bidirectional lead screw. The driving source can be disposed at any one end of the bidirectional lead screw to drive the bidirectional lead screw to rotate along the screw axis. By means of the threads with opposite directions at both ends of the bidirectional lead screw, when the bidirectional lead screw rotates driven by the driving source, the movements at both ends of the bidirectional lead screw are converted into axial linear motions with opposite directions, and the axial direction is the second direction where the bidirectional lead screw is disposed. Driven by the driving source, the first wire cutting unit and the second wire cutting unit can move towards each other or away from each other.

[0315] In one embodiment, the distance adjusting mechanism includes: a first rack, along a second direction and associated with the first wire cutting unit; a second rack, along the second direction and associated with the second wire cutting unit; a transmission gear, meshing with the first rack and the second rack; and a driving source, configured to drive the transmission gear to rotate so that the first wire cutting unit and the second wire cutting unit move towards each other or away from each other along the second direction.

[0316] In an implementation manner, the first rack is linked to the first wire cutting unit, the second rack is linked to the second wire cutting unit, the transmission gear is connected to the power output shaft (not shown) of a driving source such as a servo motor, and meshes with the first rack and the second rack, and is configured to drive the first wire cutting unit and the second wire cutting unit to move towards each other to perform a closing action when rotating forward, and drive the first wire cutting unit and the second wire cutting unit to move away from each other when rotating reversely. The first rack and the second rack can mesh on both sides of the transmission gear, such that when the transmission gear rotates, the linear velocity directions at the first rack and the second rack are opposite. The driving motor drives the transmission gear to rotate. When the transmission gear rotates forward, the first rack and the second rack move towards each other, that is, drive the first wire cutting unit and the second wire cutting unit to move towards each other. When the transmission gear is driven to rotate reversely, the first rack and the second rack move away from each other to drive the first wire cutting unit and the second wire cutting unit to move away from each other. Herein, the transmission gear can be axially connected to the power output shaft of the driving source, or indirectly connected to the power output shaft, for example, axially connected to a rotating part connected to the power output shaft.

[0317] In an actual scenario, one or more distance adjusting mechanisms can be provided in the wire cutting device. Each distance adjusting mechanism is connected to the first wire cutting unit and the second wire cutting unit. The number of the distance adjusting mechanisms can be determined comprehensively based on factors such as the driving power requirement, the stress state of a transmission mechanism such as a lead screw, the smoothness of driving multiple cutting wheels in the wire cutting unit to move, and the equipment space of the wire cutting device. For example, when the span of the first wire cutting unit and the second wire cutting unit in a first direction is small, only one distance adjusting mechanism can be used to adjust the cutting position of the wire saw in the cutting unit or change the cutting wire groove. Then, one distance adjusting mechanism can be provided in the wire cutting device to drive the first wire cutting unit and the second wire cutting unit to move towards each other or away from each other along the second direction. Another example is that when the span of the first wire cutting unit and the second wire cutting unit in the first direction is long, the wire cutting unit requires a large driving power and needs to meet the stress intensity range of the power on transmission connection components such as a lead screw or a rack. Multiple distance adjusting mechanisms can be provided in the wire cutting device, and the multiple distance adjusting mechanisms cooperate with each other to ensure that the multiple distance adjusting mechanisms drive the multiple wire cutting wheels of the first wire cutting unit and the second wire cutting unit to move towards each other or away from each other in the second direction with the same displacement amount (magnitude and direction).

[0318] In some embodiments, the distance adjustment mechanism is a servo motor provided on at least one wire cutting unit. In an actual scenario, a servo motor is provided on at least one wire cutting unit or on each wire cutting unit of the wire cutting device, and the corresponding wire cutting unit is controlled by the servo motor to displace in the second direction. The wire cutting unit can be adjusted by a pre-determined cutting offset amount for changing slots or an adjustment amount for changing the cutting position of the cutting wire. By virtue of the precise positioning function of the servo motor, a plurality of cutting wheels in the wire cutting unit are driven to move along the second direction by a preset displacement amount. For example, in the wire cutting device, there is a single wire cutting unit, and a servo motor is provided on the single wire cutting unit to drive the single wire cutting unit to move along the second direction; or, in the wire cutting device, there is a first wire cutting unit and a second wire cutting unit, and the first wire cutting unit or / and the second wire cutting unit move relatively independently along the second direction under the drive of their corresponding servo motors. In some examples, the servo motor can also be replaced with a traveling motor and a traveling lead screw, and the wire cutting unit can be driven by the traveling motor to move along the second direction on the wire cutting support.

[0319] In some embodiments, the at least one distance adjustment mechanism drives the lower wire cutting unit to move along the second direction, and the at least one idler wheel and a plurality of cutting wheels move along the second direction together following the mounting beam. In this state, the at least one idler wheel and the plurality of cutting wheels are relatively stationary, that is, the positional relationship between the idler wheel and the cutting wheels remains unchanged. When the distance adjustment mechanism is used to adjust the cutting position of at least one wire saw in the at least one wire cutting unit, the positional relationship between the wire saw and the cutting wheels and the idler wheel remains unchanged, that is, only a movement along the second direction occurs, and thus the cutting position adjustment can be achieved.

[0320] Please refer to Figure 27 、 Figure 28 and Figure 29 , Figure 27 which shows a top view of the wire cutting device of the present application in an embodiment, Figure 28 which shows a side view of the wire cutting device of the present application in an embodiment, Figure 29 which shows as Figure 28 the enlarged structural schematic diagram at position E in

[0321] Please refer to in combination Figure 27 and Figure 28 In some embodiments, when the at least one distance adjustment mechanism drives the wire cutting unit 21 to move along the second direction, the at least one idler wheel 212 and a plurality of cutting wheels 211 move along the second direction together following the mounting beam 214 (as shown in Figure 27in the direction of the arrow shown), and at the same time, the at least one shifting mechanism 215 drives the at least one idler wheel 212 or the connecting beam 2122 for connecting the idler wheel bracket 2121 to move along the shifting guide rail in the second direction (in the direction of the arrow shown above the middle bracket 2121), so that the at least one idler wheel 212 moves relative to the mounting beam 214 in the second direction, so that the currently cut and wound wire groove in the at least one idler wheel 212 moves from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211 in the second direction. With reference to Figure 28 When the idler wheel 212 moves relative to the cutting wheel 211 in the second direction, the wire groove of the idler wheel 212 can be switched to correspond to different cutting wire grooves. In this state, controlling the distance adjustment mechanism to drive the wire cutting unit 21 to move in the second direction by a distance equal to and in the opposite direction of the distance that the at least one shifting mechanism 215 drives the at least one idler wheel 212 to move in the second direction can be used to realize the slot change of the cutting wire 213 relative to the cutting wheel 211, and the spatial position of the cutting wire 213 remains unchanged before and after the slot change. That is, after the slot change, the silicon rod can be continuously cut according to the preset cutting specifications of the silicon rod before the slot change. In this example, the slot change adjustment of the idler wheel 212 and the position calibration operations of the cutting wire 213 and the cutting wheel 211 can be omitted during the slot change process. Figure 29 In an actual scenario, the cutting wire grooves corresponding to the cutting wire before and after the slot change can be determined in advance. For example, the position where the cutting wire is located before the slot change is the cutting wire groove a1, and after the slot change, the cutting wire is wound around the cutting wire groove a2. Based on the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, determine the displacement of the at least one distance adjustment mechanism driving the plurality of cutting wheels in the wire cutting unit in the second direction, that is, set the displacement as the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, which can be used to realize the replacement of the cutting wire from the cutting wire groove a1 to the cutting wire groove a2; it should be noted that the direction of the at least one distance adjustment mechanism driving the plurality of cutting wheels in the wire cutting unit to move in the second direction is the direction from the cutting wire groove a2 to the cutting wire groove a1; at the same time, the shifting mechanism drives the at least one idler wheel to move relative to the wire cutting unit in the second direction, and the moving distance is the cutting offset between the cutting wire groove a1 and the cutting wire groove a2, and the displacement direction of the at least one idler wheel relative to the wire cutting unit is the direction from the cutting wire groove a1 to the cutting wire groove a2. Before and after the movement, the position of the at least one idler wheel in the second direction in space (for example, with the machine base as a reference) remains unchanged; here, the cutting position of the wire saw in space remains unchanged after the slot change, so the step of further calibrating the position of the cutting wheel or other components can be omitted, and the silicon rod can be cut according to the preset cutting amount, which simplifies the slot change process.

[0322]

[0323] ​Here, the wire cutting device of the silicon rod processing equipment provided by the present application includes at least one shifting mechanism in the wire cutting unit for driving the at least one transition wheel to move in the second direction, so that the current wire groove wound by cutting in the at least one transition wheel moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. The wire cutting device provided by the present application can, by means of the at least one shifting mechanism, avoid adjusting the slot position of the cutting wire wound around the wire groove during the slot changing process, and operations such as adjustment and calibration of the transition wheel can be omitted after slot changing; at the same time, a single-slot transition wheel can be used for the transition wheel to achieve slot changing. In an actual scenario, the transition wheel can also be set as a replaceable consumable transition wheel. When the wire groove of the transition wheel is worn, the transition wheel can be directly replaced, simplifying the equipment maintenance process for equipment wear caused by cutting.

[0324] On the other hand, the present application also provides a silicon rod processing equipment, including a machine base, a silicon rod bearing structure, and a wire cutting device as described in any implementation manner of the embodiments shown in 23 to Figure 29 As shown. Wherein, the machine base has a silicon rod processing platform, and the silicon rod bearing device is arranged on the silicon rod processing platform for bearing the silicon rod to be cut.

[0325] In some embodiments, the silicon rod processing equipment is a silicon rod squaring equipment, and the silicon rod bearing device is a silicon rod bearing structure.

[0326] Here, one or more silicon rod bearing structures can be arranged on the silicon rod processing platform, and each silicon rod bearing structure can be used to bear a single silicon rod. Correspondingly, the number of silicon rod bearing structures in the cutting area on the silicon rod processing platform can correspond to the number of cutting wire saws in the wire cutting unit of the wire cutting device. For example Figure 17 or Figure 18 As shown in the embodiment, a plurality of silicon rod bearing structures 11 are arranged in the cutting area of the silicon rod processing platform, and a wire cutting unit 21 in the wire cutting device includes multiple segments of cutting wire saws to respectively correspond to the multiple silicon rod bearing structures 11.

[0327] Taking Figure 17 the silicon rod processing equipment shown in the embodiment as an example of a silicon rod squaring equipment for illustration, in some embodiments, the silicon rod processing platform is arranged on the machine base 10 through a workbench conversion mechanism. Here, the workbench conversion mechanism can be, for example, a rotating mechanism or a translation mechanism.

[0328] The rotating mechanism can include, for example, a rotating shaft and a rotation driving unit. The rotating shaft is pivotally connected to the silicon rod processing platform, and the rotation driving unit drives the rotating shaft to rotate to drive the silicon rod processing platform to rotate.

[0329] The translation mechanism may include, for example, a translation guide rail, a slider and a translation drive unit. The translation guide rail is laid on the machine base, the slider is arranged at the bottom of the silicon rod processing platform and is adapted to the translation guide rail to provide translation guidance for the silicon rod processing platform, and the translation drive unit is used to drive the silicon rod processing platform to move along the translation guide rail so that the silicon rod bearing structure can switch between the cutting area and the loading and unloading area; in other embodiments, the translation mechanism may also adopt a gear transmission method, specifically, the translation mechanism includes a translation rack and a rotating gear adapted to the translation rack driven by a motor, the translation rack is arranged at the bottom of the silicon rod processing platform, and may be, for example, at least one rack with a certain length, in order to make the silicon rod processing platform move smoothly, each rack is adapted to at least two rotating gears arranged at intervals, and the motor drives the rotating gear to rotate, so as to drive the silicon rod bearing structure located on the silicon rod processing platform to switch between the cutting area and the loading and unloading area.

[0330] The silicon rod squaring device may be, for example, Figure 17 or Figure 18 The silicon rod squaring equipment of the illustrated embodiment may, of course, be other types of silicon rod squaring equipment. For example, the wire cutting device in the silicon rod squaring equipment may be set as a single wire cutting unit. For another example, the cutting wire saw in the wire cutting unit in the wire cutting device of the silicon rod squaring equipment is one section. Of course, the cutting wire saw may also be two sections, three sections, four sections, etc., and the present application does not impose any restrictions thereon. Correspondingly, the number of silicon rod supporting structures on the silicon rod processing platform may be changed accordingly. For another example, the number of silicon rod supporting structures corresponding to each cutting wire saw in the wire cutting unit in the wire cutting device of the silicon rod squaring equipment may be one, two, three, etc.

[0331] The silicon rod squaring device is provided with Figures 23 to 29 The wire cutting device described in any one of the embodiments shown, wherein after the cutting wire groove of the cutting wheel in the silicon rod squaring device is worn out during the squaring operation, the shifting mechanism can be used to omit the transition wheel groove changing and the calibration of the transition wheel during the groove changing process, thereby making the groove changing process easier; Figures 23 to 29In some of the provided embodiments, at least one distance adjustment mechanism may be provided in the wire cutting device of the silicon rod squaring device. Based on the at least one distance adjustment mechanism, the cutting position of the cutting wire saw can be adjusted to determine the cutting amount of the silicon rod. Alternatively, after the wire grooves of the cutting wheels of the silicon rod squaring device are worn during long-term cutting operations, the wire groove position of the cutting wire can be changed based on the at least one distance adjustment mechanism to ensure the processing accuracy of the silicon rod squaring device during continued squaring operations. At the same time, when the at least one distance adjustment mechanism and the at least one shifting mechanism cooperate with each other, when the silicon rod squaring device changes the cutting wire groove, there is no need to adjust the guiding groove for winding the cutting wire in the idler wheel. At the same time, the cutting wire saw after changing the groove can maintain the same position in the second direction as before changing the groove, so the cutting wire position calibration operation can be omitted, simplifying the groove changing process.

[0332] In some embodiments, when the silicon rod processing device is a silicon rod cutting machine, the silicon rod cutting machine includes a machine base, a silicon rod carrying device, and a wire cutting device.

[0333] Among them, the machine base has a silicon rod processing platform, and the silicon rod carrying device is arranged on the silicon rod processing platform. Here, the silicon rod carrying device can be used, for example, for horizontally carrying the silicon rod to be cut. The wire cutting device includes: a cutting frame arranged on the machine base; at least one wire cutting unit movably arranged on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels sequentially arranged in a first direction, and each cutting wheel has at least two cutting wire grooves; at least one idler wheel, and each of the idler wheels has a wire guiding groove; a cutting wire that sequentially winds around the plurality of cutting wheels and the idler wheels to form at least one cutting wire saw; at least one shifting mechanism for driving the at least one idler wheel to move in a second direction, so that the current wire guiding groove wound by the cutting wire in the at least one idler wheel moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. The feeding and cutting of the silicon rod to be cut can be realized by the lifting movement of the wire cutting unit relative to the cutting frame.

[0334] In some examples, a plurality of parallel wire cutting units are provided in the wire cutting device of the silicon rod cutting machine. The plurality of parallel wire cutting units move up and down along the cutting frame, and the silicon rod to be cut can be intercepted into a plurality of silicon rod segments in one cutting. Based on the at least one shifting mechanism of the wire cutting device, at least one cutting wire saw in the wire cutting unit can be adjusted in the cutting wire groove of the cutting wheel, so that the worn cutting wheel can continue to be used after changing the cutting wire groove during the truncation operation. At the same time, the wire groove position of the cutting wire on the idler wheel does not need to be adjusted during the groove changing process.

[0335] In one embodiment, the arrangement of the wire cutting device of the silicon rod cutting machine and the form of the silicon rod carrying device may refer to the arrangement disclosed in Chinese Patent CN105196433B. Of course, the wire cutting device of the silicon rod cutting machine includes the at least one shifting mechanism for driving the at least one idler pulley to move in the second direction, so that the current wire groove wound by cutting in the at least one idler pulley moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

[0336] In some examples, the silicon rod cutting machine is, for example, a double-rod silicon rod cutting device. Here, the silicon rod carrying device of the silicon rod cutting machine is provided with a first processing station and a second processing station to respectively carry a first silicon rod to be cut and a second silicon rod to be cut. Please refer to Figure 21 , which shows a schematic structural diagram of the wire cutting device of the silicon rod cutting machine in an embodiment. In this example, the wire cutting support 24 is arranged on the cutting frame 20. At least one wire cutting unit 21 is respectively arranged on both sides of the wire cutting support 24 along the first direction. The at least one wire cutting unit 21 located on both sides of the wire cutting support 24 can respectively cut the silicon rods to be cut at the first processing station and the second processing station. Here, the wire cutting unit 21 of the wire cutting support 24 includes a cutting wheel 211, an idler pulley 212, a cutting wire 213 wound around the cutting wheel 211, and at least one shifting mechanism; wherein, the cutting wheel 211 has at least two cutting wire grooves, and the at least one shifting mechanism is used to drive the at least one idler pulley 212 to move in the second direction, so that the current wire groove wound by cutting in the at least one idler pulley 212 moves from the first wire groove corresponding to the cutting wheel 211 to the second wire groove corresponding to the cutting wheel 211 in the second direction. Based on the at least one shifting mechanism, the relative position between the idler pulley 212 and the cutting wheel 211 in the second direction in the wire cutting unit of the silicon rod cutting machine can be adjusted, and the wire groove of the idler pulley can be aligned with different cutting wire grooves in the cutting wheel under the drive of the at least one shifting mechanism. In an actual scenario, when changing the wire groove of the cutting wheel 211, it is not necessary to change the wire groove of the cutting wire 213 wound around the idler pulley 212, so that the wire grooves for winding the cutting wire 213 and the cutting wire grooves are aligned in the second direction before and after changing the groove.

[0337] Here, the form of the at least one shifting mechanism may also refer to the shifting mechanism described in any one of the embodiments shown in Figures 23 to 29 the embodiments shown.

[0338] In some embodiments, the wire cutting units 21 on both sides of the wire cutting support 24 may further form at least a pair of wire cutting units 21. For example, the wire cutting units 21 on both sides of the wire cutting support 24 are connected in one-to-one correspondence to form at least a pair of wire cutting units 21. The pair of wire cutting units 21 are located on the same straight line in the first direction. In this example, based on the same shifting mechanism, the idler wheels 212 on a pair of wire cutting units 21 can be driven to move in the second direction. For example, when the brackets of the idler wheels 212 of a pair of wire cutting units 21 are connected together by a connecting beam; of course, the pair of wire cutting units 21 can also be driven by multiple shifting mechanisms in cooperation, or each idler wheel 212 is driven by an independent shifting mechanism.

[0339] Here, the specific form of the shifting mechanism can refer to the implementation provided in the embodiment as shown in Figures 23 to 29 and will not be elaborated here. In some examples, a distance adjusting mechanism as described in the implementation provided in the embodiment as shown in Figures 23 to 29 may also be provided in the wire cutting unit; here, the implementation manner of the cooperation between the distance adjusting mechanism and the shifting mechanism to perform the position adjustment of the cutting wire saw or to change the cutting wire to wind around the cutting wire groove in the cutting wheel can refer to the implementation provided in the embodiment as shown in Figures 23 to 29 and will not be elaborated here.

[0340] Of course, the specific form of the silicon rod cutting machine is not limited by the foregoing embodiments. For example, based on the positional relationship between the placement position of the silicon rod on the silicon rod carrying device and the cutting wire saw, each cutting wire saw in the silicon rod cutting machine can simultaneously perform truncating cutting on multiple silicon rods; another example is that the wire cutting device in the silicon rod cutting machine only includes a section of cutting wire saw, and when the section of cutting wire saw is used to perform truncating operation on a single or multiple silicon rods, a silicon rod segment is separated from the silicon rods to be cut in one truncating operation; the present application does not make any limitations. It should be noted that the wire cutting device of the silicon rod cutting machine includes a shifting mechanism as described in any of the embodiments as shown in Figures 23 to 29 to adjust the position of the idler wheel in the wire cutting device relative to the cutting wheel in the second direction.

[0341] In some embodiments, the silicon rod processing equipment is a silicon rod cutting and grinding integrated machine. Here, the silicon rod cutting and grinding integrated machine includes a machine base, a silicon rod carrying device, a wire cutting device, and a grinding device.

[0342] The base has a silicon rod processing platform. In the integrated silicon rod cutting and grinding machine, the silicon rod processing platform can be set as processing areas for performing different processing functions, such as being composed of a cutting station and a grinding station; the silicon rod loading device is used to load the silicon rod to be processed; the wire cutting device includes: a cutting frame provided on the base; at least one wire cutting unit movably provided on the cutting frame; the wire cutting unit includes: a plurality of cutting wheels arranged in sequence along a first direction, and each cutting wheel has at least two cutting wire grooves; at least one transition wheel, and each of the transition wheels has a wire guiding groove; a cutting wire that sequentially winds around the plurality of cutting wheels and the transition wheels to form at least one cutting wire saw; at least one shifting mechanism for driving the at least one transition wheel to move along a second direction, so that the currently wire-guided groove of the at least one transition wheel that has been cut and wound moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction.

[0343] Please refer to Figure 22 , which shows a schematic structural diagram of the integrated silicon rod cutting and grinding machine of the present application in an embodiment. In this example, as Figure 22 shown, the integrated silicon rod cutting and grinding machine includes a base having a silicon rod processing platform; a wire cutting device provided on the base for performing side cutting in a first direction on the silicon rod at the first processing area of the silicon rod processing platform and performing side cutting in a second direction on the silicon rod at the second processing area of the silicon rod processing platform to form a square silicon rod; a grinding device provided on the base for grinding the surface and chamfering the square silicon rod at the third processing area of the silicon rod processing platform; a silicon rod conversion device provided on the silicon rod processing platform for converting the silicon rod among the first processing area, the second processing area, and the third processing area.

[0344] Here, the wire cutting device includes: a cutting frame 20, a wire cutting support 24, a first cutting unit group, and a second cutting unit group. The first cutting unit group and the second cutting unit group are used to cut the silicon rods at the first processing area and the second processing area respectively.

[0345] In this embodiment, since the wire cutting support 24 can be configured with the first cutting unit and the second cutting unit, that is, the first cutting unit and the second cutting unit share the wire cutting support 24. Therefore, in this embodiment, on the one hand, the cutting frame 20 and the wire cutting support 24 in the wire cutting device are arranged at a central position between the first processing area and the second processing area. On the other hand, the wire cutting support 24 has a special design. As Figure 22As shown, the wire cutting support 24 in this embodiment may include a support main body and a first support flank and a second support flank located on opposite sides of the support main body. In some embodiments, the support main body in the wire cutting support 24 is arranged at an angle of 45° with respect to the X-axis or the Y-axis. The first support flank forms an angle of 145° with the support main body and is arranged along the Y-axis, and the second support flank forms an angle of 145° with the support main body and is arranged along the X-axis.

[0346] In some embodiments, the first cutting unit group may include at least four first cutting wheels 211a and two first transition wheels. These four first cutting wheels 211a can be combined into a pair of first cutting wheel groups. That is, two first cutting wheels 211a arranged opposite to each other along the X-axis form a first cutting wheel group, and two first cutting wheel groups along the Y-axis form a pair of first cutting wheel groups. The cutting wire 213 is sequentially wound around each of the first cutting wheels 211a in the first cutting unit group to form a cutting wire mesh. In actual applications, the cutting wire 213 is sequentially wound around the four first cutting wheels 211a in the first cutting unit group to form two cutting wire saws. These two cutting wire saws are arranged along the X-axis direction and are parallel to each other, constituting a cutting wire mesh. Specifically, the two parallel cutting wire saws cooperate to form a first cutting wire mesh in the shape of "=" along the X-axis direction; at the same time, when the cutting wire 213 is wound around the first cutting wheel group, it is wound around the first transition wheel to perform commutation or tension adjustment of the cutting wire 213. Here, the first transition wheel is parallel to the wheel surface of the cutting wheel 211 of the corresponding first cutting wheel group, that is, both are parallel to the first direction. Two first cutting wheels 211a arranged opposite to each other along the X-axis, the cutting wire 213 wound around them, and a first transition wheel can form a wire cutting unit. In this embodiment, two mutually parallel wire cutting units 21 are formed in the first cutting unit group.

[0347] Similarly, the second cutting unit group may include at least four second cutting wheels 211b and two second transition wheels. Two second cutting wheels 211b arranged oppositely along the Y axis form a second cutting wheel group, and two second cutting wheel groups along the X axis form a pair of second cutting wheel groups. In actual application, the cutting wire 213 is sequentially wound around the four second cutting wheels 211b in the second cutting unit group to form two cutting wire saws, which are arranged along the Y axis and are parallel to each other. The two parallel cutting wire saws cooperate to form a second cutting wire net in the shape of "=" along the Y axis. At the same time, when the cutting wire 213 is wound around the second cutting wheel group, it is wound around the second transition wheel to change the direction of the cutting wire 213 or adjust the tension. Here, the second transition wheel is parallel to the wheel surface of the cutting wheel 211 of the corresponding second cutting wheel group, that is, both are parallel to the first direction. A wire cutting unit can be formed by two first cutting wheels 211a arranged oppositely along the Y axis, the cutting wire 213 wound around them, and a second transition wheel. In this embodiment, two mutually parallel wire cutting units 21 are formed in the second cutting unit group.

[0348] It should be noted that the first direction and the second direction are defined based on the carrier coordinate system of the wire cutting unit. Therefore, when the directions of multiple wire cutting units in a silicon rod processing device (a silicon rod cutting and grinding integrated machine in this example) are different, the first directions corresponding to multiple wire cuttings are not in the same direction in the external space. Correspondingly, the second direction is orthogonal to the first direction. Therefore, the moving direction of driving at least one transition wheel by the at least one shifting mechanism is the orthogonal direction relative to the wire cutting unit being driven. For example, in the first cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the X axis. In the first cutting unit group, the first direction is the X axis direction, and the second direction is the Y axis direction. In the second cutting unit group, the wire cutting unit and the cutting wire saw are arranged along the Y axis. In the second cutting unit group, the first direction is the Y axis direction, and the second direction is the X axis direction.

[0349] Of course, in the first cutting unit group and the second cutting unit group, the number of cutting wheels and transition wheels in any one of the wire cutting units can be correspondingly changed. For example, the number of cutting wheels in a wire cutting unit can also be three, four, etc., and the number of transition wheels can also be two or more.

[0350] In some examples, the silicon rod conversion device is disposed in the central area of the silicon rod processing platform and is used to convert the silicon rod among the waiting position, the first processing position, the second processing position, and the third processing position on the silicon rod processing platform. In one embodiment, the silicon rod conversion device is rotatably arranged on the silicon rod processing platform. The silicon rod conversion device may further include: a conveying body, which is in a disc shape, a square disc shape or other similar shapes; a silicon rod positioning mechanism (i.e., a silicon rod bearing device) disposed on the conveying body and used for positioning the silicon rod; and a conversion driving mechanism, which is used to drive the conveying body to rotate so as to drive the silicon rod positioned by the silicon rod positioning mechanism to change its position. In some examples, the silicon rod positioning mechanism further includes a rotating structure, which is used to drive the silicon rod carried on the silicon rod positioning mechanism to rotate along the axis of the silicon rod so as to adjust the cutting surface of the silicon rod.

[0351] Here, after the silicon rod to be cut is placed and positioned on the silicon rod positioning mechanism, the silicon rod to be cut is cut at the first processing position by the first cutting wire mesh in the wire cutting device that is in an "=" shape along the X-axis direction to form two axial cutting surfaces along the X-axis direction; then, the conversion driving mechanism drives the conveying body to drive the silicon rod positioning mechanism to position the silicon rod at the second processing position, and it is cut by the second cutting wire mesh in the wire cutting device that is in an "=" shape along the Y-axis direction to form two axial cutting surfaces along the Y-axis direction, that is, a cut silicon rod with a quasi-rectangular cross-section is formed; the cut silicon rod can also be converted to the third processing position for subsequent grinding operations.

[0352] In the foregoing examples of the silicon rod cutting and grinding integrated machine, each cutting wheel in the wire cutting unit has at least two cutting wire grooves. Here, any wire cutting unit of the wire cutting device further includes at least one shifting mechanism, which is used to drive the at least one idler wheel to move along the second direction, so that the currently cut wire groove wound around the at least one idler wheel moves from the first wire groove corresponding to the cutting wheel to the second wire groove corresponding to the cutting wheel in the second direction. With this setting, the idler wheel can be a single-wire groove idler wheel or a multi-wire groove idler wheel. Based on the driving action of the at least one shifting mechanism, the position of the cutting wire wound around the wire groove of the idler wheel does not need to be changed, and the cutting wire can be changed to a different groove on the cutting wheel. When the cutting wire grooves of the cutting wheels in the wire cutting units of the first cutting unit group or the second cutting unit group are worn due to performing square root operations, the cutting wheel can be reused by replacing the cutting wire groove position of the cutting wheel around which the cutting wire is wound through the shifting mechanism. Through the at least one shifting mechanism, the relative position of the cutting wire and the idler wheel does not need to be adjusted during the groove changing process. Here, the setting method of the shifting mechanism can refer to any implementation method of the shifting mechanism described in the embodiments shown in Figures 23 to 29 any implementation manner of the embodiment shown.

[0353] In the integrated silicon rod grinding machine, the first processing area and the second processing area include two parallel wire cutting units. In some examples, the first processing area and the second processing area further include at least one distance adjustment mechanism. The distance adjustment mechanism can be associated with, for example, the first wire cutting unit or the second wire cutting unit of the two wire cutting units, or simultaneously associated with the first wire cutting unit and the second wire cutting unit. The distance adjustment mechanism can be set, for example, as Figures 23 to 29 the distance adjustment mechanism described in any implementation manner of the embodiment shown. For example, it is connected to the first wire cutting unit or the second wire cutting unit by a lead screw, or connected to the first wire cutting unit and the second wire cutting unit by a bidirectional lead screw, or the distance adjustment mechanism is a servo motor, etc., which will not be elaborated here.

[0354] When the at least one distance adjustment mechanism drives a plurality of cutting wheels in the first wire cutting unit or / and the second wire cutting unit to move in the second direction, the first wire cutting unit or / and the second wire cutting unit can, for example, move along the flank of the first support, that is, move in the second direction (Y-axis direction) in the first cutting unit group; it can be used to adjust the cutting position of at least one wire saw in the first wire cutting unit or / and the second wire cutting unit, or change the cutting wire groove around which the cutting wire winds on a plurality of cutting wheels in the first wire cutting unit or / and the second wire cutting unit; the at least one distance adjustment mechanism cooperates with at least one displacement mechanism in the wire cutting unit to achieve groove changing without changing the state of the wire groove for winding the cutting wire in the idler pulley, and at the same time, the position of the wire saw in the second direction remains unchanged before and after groove changing.

[0355] The structural form of the second cutting unit group is similar to that of the first cutting unit group, and the main difference lies in the different arrangement positions and directions in the integrated silicon rod cutting and grinding machine; however, the structures and functions of the at least one displacement mechanism and the at least one distance adjustment mechanism at the second cutting unit group are similar to those of the at least one displacement mechanism and the at least one distance adjustment mechanism in the first cutting unit group, which will not be elaborated here.

[0356] It should be understood that in some embodiments, the positional relationship between the first processing area and the second processing area can be changed. For example, the first processing area and the second processing area can be set such that the silicon rod conversion device rotates the silicon rod by 60° to achieve switching between the two processing areas. Correspondingly, the directions of the wire cutting units in the first cutting unit group and the second cutting unit group may also change. In this example, the first directions corresponding to the wire cutting units in the first cutting unit group and the second cutting unit group change, but in any cutting unit group, the wire cutting unit can still be achieved by, for example, Figures 23 to 29At least one shifting mechanism described in any implementation manner of the illustrated embodiment realizes the position adjustment of the idler wheel relative to the cutting wheel in the second direction; in some implementation manners, different processing stations in the silicon rod cutting and grinding integrated machine only include a single-wire cutting unit, for example; in some implementation manners, the silicon rod cutting and grinding integrated machine is only provided with one station for cutting processing, for example. In a specific implementation manner, a "=" shaped cutting wire mesh can be arranged in the cutting processing station. After the silicon rod is cut by the cutting wire mesh once by lifting and lowering, the silicon rod positioning mechanism drives the silicon rod to rotate 90° and then cuts again; the silicon rod cutting and grinding integrated machine has various deformation forms, which are not limited in this application.

[0357] In the operation of squaring a silicon rod, a skin will be formed after the silicon rod is cut by squaring. Therefore, it is necessary to unload the formed skin first. Most of the existing skin unloading methods still rely on manual operation by the operator to separate the skin from the cut silicon rod and carry it out of the silicon rod squaring equipment. This not only has low efficiency, but also increases the risk of damage to the cut silicon rod due to the collision between the skin and the cut silicon rod during the handling process. Therefore, it is necessary to propose a silicon rod squaring equipment and a skin unloading device applied to the silicon rod squaring equipment, so that the skin can be unloaded in time and the operation efficiency can be improved.

[0358] Furthermore, in the skin unloading device, due to the need to transfer the skin from the cutting area to the skin unloading area, it will occupy a certain amount of equipment space. By determining the structure and transfer path of the skin unloading device, the simplicity of the equipment layout and the transfer efficiency of the skin unloading device are also different. Here, this application provides a skin unloading device. A skin clamping mechanism for transferring the skin is arranged in the skin unloading device. The skin clamping mechanism can transfer the skin by rotating the swing arm, and can also receive the skin clamping mechanism by rotating the swing arm in the non-transfer state, so that the equipment space occupied by the skin unloading device is reduced, the transfer path is simplified, and the transfer efficiency is improved.

[0359] In each of the embodiments provided in the application, a side skin unloading device applied to a silicon rod squaring device is provided. The silicon rod squaring device includes a machine base, a wire cutting device, and a silicon rod bearing structure. The silicon rod bearing structure is used to bear the vertically placed silicon rod. The wire cutting device includes a liftable wire cutting support and a wire cutting unit provided on the wire cutting support. The wire cutting unit has a cutting wire saw, and the cutting wire saw cuts the silicon rod to form a cut silicon rod and side skins. The side skin unloading device includes: a side skin lifting unit for lifting the side skins so that the top ends of the side skins protrude from the cut silicon rod; a side skin clamping unit for clamping and transporting the side skins. The side skin clamping unit includes: a support column provided on the machine base; a first mounting portion provided on the support column; at least one set of side skin clamping mechanisms connected to the first mounting portion through swing arms, for clamping the side skins and lifting the side skins away from the cut silicon rod, and being controlled to rotate around the swing arm rotation shaft to transport the side skins to the side skin unloading area.

[0360] Please refer to Figure 30 and Figure 31 , wherein, Figure 30 shows a schematic structural diagram of the side skin unloading device of the present application applied to a silicon rod squaring device in an embodiment. Figure 31 shows a schematic structural diagram of the side skin unloading device of the present application in an embodiment. As shown in the figure, the silicon rod squaring device has a silicon rod bearing structure 11, which can be used to bear the vertically placed silicon rod. After the cutting wire saw in the wire cutting device cuts the silicon rod, the formed side skins continue to stay on the silicon rod bearing structure 11 and lean against the cut silicon rod due to the action of their own gravity and the limiting action of the silicon rod bearing structure 11. Therefore, it is necessary to make the formed side skins have a relative displacement with the cut silicon rod, and the protruding parts formed by the displacement stagger are used to clamp the side skins, and then the side skins are transported. The side skin lifting unit of the present application is used to lift the side skins so that the top ends of the side skins protrude from the cut silicon rod.

[0361] In some examples, the supporting surface of the silicon rod bearing structure in the silicon rod squaring device provided with the side skin unloading device is a planar structure, then the formed side skins after cutting may have risks such as falling or tipping over due to the lack of corresponding support; in certain embodiments, the side skin unloading device further includes a side skin jacking mechanism for jacking the side skins formed after the square cutting of the silicon rod to be cut, and the side skin lifting unit lifts the mechanism supported by the side skin jacking machine. It should be noted that the side skin jacking mechanism can also be a part of the silicon rod squaring device, or the side skin jacking mechanism is not a necessary mechanism in the side skin unloading device or the silicon rod squaring device.

[0362] In an embodiment, refer to Figure 32, which shows a schematic structural diagram of the edge skin supporting mechanism in an embodiment. As shown in the figure, the edge skin supporting mechanism 53 includes a supporting member, and the supporting member includes a base 531 connected to one side surface of the silicon rod bearing structure 11 and a supporting portion 532 extending upward from the base 531. The base 531 can also be set as a flat plate structure, a curved plate structure or other special-shaped structures adapted to the side surface of the silicon rod bearing structure 11, and the present application does not make any restrictions. The supporting portion 532 is set as two supporting columns located on both sides of the base 531, and the height of the extension of the supporting columns is the same as the height of the bearing surface of the silicon rod bearing structure 11. In practice, the supporting portion 532 can also be a top plate or a top rod extending upward from the base 531. When the wire cutting device performs square cutting on the silicon rod to be cut on the silicon rod bearing structure 11, the supporting member can support the corresponding edge skin, thereby effectively preventing the cutting wire segment in the wire cutting device from chipping when passing through the silicon rod to be cut, and can avoid the edge skin from falling and overturning.

[0363] In another embodiment, the edge skin supporting mechanism includes a movable supporting member and a locking control member. In this embodiment, the movable supporting member includes a movable base connected to one side surface of the silicon rod carrying structure, a supporting portion extending upward from the movable base, and a power generating structure for providing the up-and-down movement of the supporting portion. In one implementation, the movable base can be, for example, a flat plate structure adapted to the side surface of the silicon rod carrying structure, but is not limited thereto. The movable base can also be, for example, a curved plate structure or other special-shaped structures. The supporting portion is at least two ejector rods extending upward from the movable base, but is not limited thereto. The supporting portion can also be, for example, a top plate or a top column extending upward from the movable base. The power generating structure includes two legs provided at the movable base and two springs respectively sleeved on the two legs, but is not limited thereto. The power generating structure can also adopt structures such as torsion springs and elastic sheets. By using the elastic force of the springs, the legs and the connected ejector rods can move up and down relative to the silicon rod carrying structure. In this embodiment, the locking control member is used to control the movable supporting member in a locked state when the movable supporting member abuts against the bottom of the silicon rod to be cut. In one implementation, the locking control member can be, for example, an electromagnetic lock. In the initial state, the ejector rods protrude from the bearing surface of the silicon rod carrying structure under the action of the legs and the springs. When the silicon rod to be cut is placed, the ejector rods move downward against the elastic force of the springs after being pressed by the silicon rod to be cut until the silicon rod to be cut is completely placed on the bearing surface of the silicon rod carrying structure. At this time, the electromagnetic lock serving as the locking control member is energized and tightly adsorbs the movable base in the movable supporting member through the strong magnetic force generated by the principle of electro-magnetic induction, thereby controlling the ejector rods in a locked state. When the wire cutting device performs squaring cutting on the silicon rod to be cut carried by the silicon rod carrying structure corresponding to the cutting area in the silicon rod conversion device, the movable supporting member in the locked state can support the corresponding edge skin, effectively preventing the cutting wire mesh in the wire cutting unit from chipping when passing through the silicon rod to be cut, and avoiding situations such as the edge skin falling off and tipping over.

[0364] The edge skin lifting unit and the edge skin clamping unit can be used to protrude the edge skin located on the silicon rod carrying structure from the cut silicon rod and transfer it.

[0365] In some examples, the edge skin lifting unit includes a lifting member that can move up and down, and the lifting member is controlled to support the edge skin to lift the edge skin.

[0366] In one example, the edge skin lifting unit is arranged on the machine base through a lifting guide rail. After the edge skin is formed by cutting, the edge skin lifting unit is controlled to lift to the bottom of the silicon rod carrying structure and lift the edge skin from the bottom of the edge skin so that the edge skin protrudes from the cut silicon rod.

[0367] In another example, the side skin lifting unit moves up and down by attaching to the liftable wire cutting support in the wire cutting device. Please refer to Figure 33 , which shows a schematic structural view of the side skin lifting unit 51 of the side skin discharging device of the present application in an embodiment. The side skin lifting unit 51 includes a jacking member 511 provided on the wire cutting support. The jacking member is driven by a telescopic member 512 to perform telescopic movement. After the jacking member 511 is controlled to perform an extending movement, it supports the bottom of the side skin to lift the side skin.

[0368] In an embodiment, the jacking member 511 includes a abutting plate and a supporting plate. The abutting plate extends upward from the bottom of the supporting plate. Further, the abutting plate can be an arc-shaped plate adapted to the arc-shaped surface of the side skin. When the abutting plate abuts against the side skin, it can be in full contact with the arc-shaped surface of the side skin. The contact part between the abutting plate and the side skin is designed to be smooth or a buffer pad is added to the inner surface of the abutting plate in contact with the side skin. The supporting plate is used to support the bottom of the side skin. Further, the supporting plate can be a bow-shaped plate adapted to the bottom surface of the side skin. In other embodiments, bumps can be added to the chord side of the bow-shaped plate serving as the supporting plate to increase the contact area with the bottom surface of the side skin.

[0369] In an embodiment, the telescopic member 512 is, for example, a cylinder with a telescopic rod. Among them, the telescopic rod can be connected to the supporting plate in the jacking member 511 through a connecting structure. The cylinder can drive the telescopic rod to drive the jacking member 511 to perform telescopic movement. Here, the telescopic movement of the jacking member 511 includes the contraction and extension movements of the jacking member 511. In an actual scenario, the contraction movement of the jacking member 511 is that the cylinder drives the telescopic rod to contract to drive the jacking member 511 away from the side skin, and the extension movement of the jacking member 511 specifically refers to the cylinder driving the telescopic rod to extend to drive the jacking member 511 close to the side skin. Of course, the foregoing telescopic member 512 can also adopt other implementation manners. For example, the telescopic member 512 can also be, for example, a servo motor with a lead screw. The lead screw is connected to the jacking member 511, and the servo motor drives the lead screw to rotate to drive the connected jacking member 511 to perform telescopic movement. For example, driving the lead screw to rotate forward drives the jacking member 511 to perform a contraction movement, and driving the lead screw to rotate reversely drives the jacking member 511 to perform an extension movement, or driving the lead screw to rotate forward drives the jacking member 511 to perform an extension movement and driving the lead screw to rotate reversely drives the jacking member 511 to perform a contraction movement.

[0370] In practical applications, in the initial state, the telescopic rod drives the lifting member 511 to be in a contracted state. The wire cutting unit is driven to descend along with the wire cutting support seat so that the cutting lines formed by the respective cutting segments in the wire cutting unit are located opposite the silicon rod to be cut in the cutting area for squaring cutting until the cutting segments penetrate through the silicon rod to be cut, completing a complete cutting of the silicon rod to be cut and forming a skin. At this time, the skin lifting mechanism has descended to the bottom along with the wire cutting support seat. The cylinder drives the telescopic rod to extend to drive the lifting member 511 close to the skin until the abutting plate in the lifting member 511 contacts the skin and abuts against it. Subsequently, the wire cutting unit is driven to rise along with the wire cutting support seat, and the skin lifting mechanism rises along with the wire cutting support seat, driving the skin to have an upward displacement relative to the silicon rod that has been cut once, such that the top end of the skin protrudes from the silicon rod to be cut. When the protruding portion of the top end of the skin compared to the silicon rod to be cut meets the set conditions, the rising of the wire cutting support seat can be controlled to stop. In this way, the top end of the skin can be used as the force-applying part for grasping, enabling the skin to be grasped and unloaded. Then, the cylinder drives the telescopic rod to contract to drive the lifting member 511 back to the initial state while controlling the wire cutting support seat to drive the wire cutting unit and the skin lifting mechanism to continue rising above the silicon rod to be cut in preparation for performing the next cutting operation.

[0371] In some examples, the skin lifting unit includes an adsorbing member that can move telescopically. After being controlled to perform an extending movement, the adsorbing member abuts against the skin to lift the skin.

[0372] In one implementation, the skin lifting mechanism may include an adsorbing member and a telescopic member that drives the adsorbing member to perform telescopic movement. The adsorbing member is controlled by the telescopic member to abut against the skin and adsorb the skin. The adsorbing member may further include an abutting plate and an adsorbing element. The abutting plate may be, for example, an arc-shaped plate adapted to the arc-shaped surface of the skin. When the abutting plate abuts against the skin, it can make full contact with the arc-shaped surface of the skin. The adsorbing element may be, for example, a vacuum chuck. A plurality of vacuum chucks may be arranged on the contact surface of the abutting plate that is to contact the skin. The telescopic member may be, for example, a cylinder with a telescopic rod or a servo motor with a lead screw. Taking the cylinder with a telescopic rod as an example, the telescopic rod may be connected to the abutting plate in the lifting member through a connecting structure. The cylinder can drive the telescopic rod to contract to drive the abutting plate away from the skin, and the cylinder can drive the telescopic rod to extend to drive the abutting plate close to the skin and, after the abutting plate contacts the skin, the adsorbing element adsorbs the skin. Subsequently, the wire cutting support seat is driven to rise, and the skin lifting mechanism and the wire cutting device rise along with the wire cutting support seat. The skin lifting mechanism can drive the skin to have an upward displacement relative to the cut silicon rod by using the adsorption force, such that the top end of the skin protrudes from the silicon rod that has undergone one cutting operation.

[0373] It should be noted that, in some examples, the silicon rod squaring equipment is provided with multiple cutting wheel groups to simultaneously cut multiple silicon rods to be cut, so multiple edge skin lifting mechanisms are provided on the online cutting support corresponding to the multiple cutting wheel groups to simultaneously unload the edge skins of multiple silicon rods that have been cut. In the case where the online cutting device includes one wire cutting unit, one downward cutting of the wire cutting device forms one edge skin, and an edge skin lifting mechanism is provided above a pair of cutting wheels corresponding to each silicon rod bearing structure on the online cutting support to unload the edge skin formed during the cutting operation in a timely manner. In the case where two wire cutting units are provided in the online cutting device, one downward cutting of the wire cutting device forms two edge skins, and two edge skin lifting mechanisms are provided above the online cutting support corresponding to each silicon rod bearing structure to support the edge skin formed during the cutting operation to protrude from the cut silicon rod to achieve timely unloading of the edge skin.

[0374] After the edge skin lifting unit forms a protruding portion of the edge skin relative to the cut silicon rod, the edge skin clamping unit continues to displace the edge skin based on the protruding portion to clamp the edge skin and transfer the edge skin to the unloading area.

[0375] Please continue reading Figure 30 , Figure 31 ,like Figure 30 As shown, the edge skin clamping unit 52 includes a support column 521 disposed on the silicon rod squaring device base 10, and the support column 521 is, for example, at least one guide column disposed in the first direction as shown in the figure. The support column 521 is provided with a first mounting portion 522 and an edge skin clamping mechanism 523 connected to the first mounting portion 522. In the example shown in the figure, the support column 521 is disposed in the middle of the silicon rod squaring device in the first direction, so as to reduce the distance from the edge skin clamping mechanism 523 to the edge skin. Of course, the position of the support column 521 is not limited to this.

[0376] The first mounting portion 522 is disposed on the support column 521 , and the first mounting portion 522 can serve as a transition portion between the edge skin clamping mechanism 523 and the support column 521 . In some examples, the first mounting portion 522 is, for example, a bearing block movably or fixedly disposed on the support column 521 .

[0377] The at least one set of edge skin clamping mechanisms 523 is connected to the first mounting portion 522 via a swing arm 524. In some examples, the first mounting portion 522 is fixed at a preset height of the support column 521, and the preset height is, for example, the top of the support column 521 to ensure that the edge skin clamping mechanism 523 connected to the first mounting portion 522 can lift the edge skin away from the cut silicon rod after clamping the edge skin.

[0378] In some other examples, the edge skin discharging device further includes a first lifting drive device (not shown) for driving the first mounting portion 522 to lift and move on the support column 521. Here, by controlling the first mounting portion 522 to move along the support column 521 based on the first lifting drive device, the edge skin clamping mechanism 523 connected to the first mounting portion 522 can be driven to perform a lifting movement in space. The edge skin clamping mechanism 523 can thereby achieve clamping and lifting of the edge skin. For example, after the edge skin is cut, the first lifting drive device drives the first mounting portion 522 to descend so that the edge skin clamping mechanism 523 contacts and clamps the edge skin protruding from the cut silicon rod after being lifted. The first lifting drive device can then drive the edge skin clamping mechanism 523 in the clamped state to rise so that the edge skin is separated from the cut silicon rod.

[0379] The edge skin clamping mechanism 523 is a component for clamping and transporting the edge skin. The at least one set of edge skin clamping mechanisms 523 is connected to the first mounting portion 522 through a swing arm 524. Among them, the swing arm 524 has a proximal end and a distal end. The proximal end of the swing arm 524 is provided on the first mounting portion 522, and the edge skin clamping mechanism 523 is provided at the distal end of the swing arm 524, that is, the extending end.

[0380] The edge skin clamping mechanism 523 is controlled to rotate around the swing arm rotation shaft 525. In some examples, the one set of edge skin clamping mechanisms 523 are edge skin clamping mechanisms 523 respectively provided at the extending ends of different swing arms 524 that share the same swing arm rotation shaft 525. As Figure 30 shown, the one set of edge skin clamping mechanisms 523 includes two edge skin clamping mechanisms 523. Each edge skin clamping mechanism 523 is provided at the extending end of a swing arm 524, and the proximal ends of different swing arms 524 in the one set of edge skin clamping mechanisms 523 are connected to the same swing arm rotation shaft 525. Here, the different swing arms 524 connected to the swing arm rotation shaft 525 corresponding to the one set of edge skin clamping mechanisms 523 can be of equal length...

Claims

1. An edge skin unloading device applied to a silicon rod squaring device, Characterized in that, The silicon rod squaring device includes a machine base, a wire cutting device and a silicon rod bearing structure. The silicon rod bearing structure is used to bear the vertically placed silicon rod. The wire cutting device includes a liftable wire cutting support and a wire cutting unit arranged on the wire cutting support. The wire cutting unit has a cutting wire saw, and the cutting wire saw cuts the silicon rod to form a cut silicon rod and edge skin; the edge skin unloading device includes: An edge skin lifting unit for lifting the edge skin so that the top of the edge skin protrudes from the cut silicon rod; An edge skin clamping unit, including: A support column arranged on the machine base; A first mounting part arranged on the support column; At least one group of edge skin clamping mechanisms connected to the first mounting part through a swing arm; the at least one group of edge skin clamping mechanisms is used to clamp the edge skin and lift the edge skin away from the cut silicon rod, and is controlled to rotate around the swing arm rotating shaft to transfer the edge skin to the edge skin unloading area; wherein, the first mounting part further includes at least one moving mechanism providing movement in at least one direction for setting the swing arm rotating shaft; the swing arm rotating shaft further includes a rotation driving device for driving the at least one group of edge skin clamping mechanisms at the extended end of the swing arm connected to the swing arm rotating shaft to rotate a preset angle after clamping the edge skin and driving the edge skin away from the cut silicon rod, so as to transfer the edge skin to the edge skin unloading area.

2. The edge skin unloading device applied to a silicon rod squaring device according to claim 1, Characterized in that, The edge skin lifting unit includes a liftable jacking member, and the jacking member is controlled to support the edge skin to lift the edge skin.

3. The edge skin unloading device applied to a silicon rod squaring device according to claim 1, Characterized in that, The edge skin lifting mechanism includes a telescopic suction member, and the suction member is controlled to abut against the edge skin and adsorb the edge skin to lift the edge skin.

4. The edge skin unloading device applied to a silicon rod squaring device according to claim 1, Characterized in that, It further includes: A first lifting driving device for driving the first mounting part to move up and down on the support column.

5. The edge skin unloading device applied to a silicon rod squaring device according to claim 1, Characterized in that, One group of edge skin clamping mechanisms is respectively arranged on the opposite sides of the first mounting part through a swing arm rotating shaft.

6. The edge skin unloading device applied to a silicon rod squaring device according to claim 1, Characterized in that, The one group of edge skin clamping mechanisms includes at least one edge skin clamping mechanism, and each edge skin clamping mechanism in the at least one edge skin clamping mechanism is arranged at an extended end of a swing arm.

7. The edge skin unloading device applied to a silicon rod squaring device according to claim 1, Characterized in that, Each edge skin clamping mechanism in the at least one group of edge skin clamping mechanisms includes: A clamping assembly for clamping or releasing the top of the edge skin; A second lifting driving structure for driving the clamping assembly to move up and down.

8. The edge skin unloading device applied to a silicon rod squaring device according to claim 7, Characterized in that, The clamping assembly includes: A cover body for covering the edge skin; and A telescopic clamping member is provided inside the cover body; a clamping space for clamping the edge skin is formed between the clamping member and the main body of the cover body.

9. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 8, characterized in that, The top of the main body of the cover body has an opening for the edge skin to be lifted to protrude from the cover body.

10. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 7, characterized in that, The clamping assembly includes: An arc-shaped plate; and A telescopic clamping member, a clamping space for clamping the edge skin is formed between the clamping member and the arc-shaped plate.

11. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 8 or 10, characterized in that, The clamping member is a movable pressing block controlled by a cylinder, and the movable pressing block is connected to the cylinder through a rotating arm.

12. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 11, characterized in that, The rotating arm has a first rotating shaft, a first cantilever, and a first connecting portion located in the middle of the first cantilever. Among them, the proximal end of the first cantilever is connected to the first rotating shaft, the distal end of the first cantilever is connected to the movable pressing block, and the first connecting portion is connected to the piston rod of the cylinder.

13. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 11, characterized in that, The rotating arm has a second cantilever, a second connecting portion, and a second rotating shaft located in the middle of the second cantilever. Among them, the second connecting portion is arranged at the proximal end of the second cantilever and connected to the piston rod of the cylinder, and the distal end of the second cantilever is connected to the movable pressing block.

14. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 11, characterized in that, The movable pressing block is provided with a buffer assembly for contacting the edge skin.

15. The edge skin discharging device applied to the silicon rod squaring equipment according to claim 1, characterized in that, further includes: An edge skin cylinder, arranged in the edge skin unloading area.

16. A silicon rod squaring equipment for performing squaring operations on a silicon rod with a circular cross-section, characterized in that, includes: A machine base; A silicon rod bearing structure for bearing a vertically placed silicon rod; and A wire cutting device is arranged above the silicon rod bearing structure, including a plurality of cutting wheels and a cutting wire around which at least one cutting wire saw is formed; The edge skin discharging device according to any one of claims 1 to 15.

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