Inspection device for electronic components and method for inspecting electronic components

Abstract

Provided is an electronic component inspection device and an electronic component inspection method that can accurately determine an inspection position on a terminal of an electronic component. The electronic component inspection device is composed of: a holding portion (20) for holding an electronic component (1) having a component main body (10) and a terminal (11, 12); a light source (31, 32) and a reflection plate (21, 22) for irradiating reflected light (Lr) on at least the terminal (11, 12) of the electronic component (1) from the back of the electronic component (1) held by the holding portion (20) on the side opposite the mounting surface; a camera (25) for taking an image of the electronic component (1) irradiated with the reflected light (Lr) from the side of the mounting surface; and a control portion (5) for controlling processing related to inspection of the electronic component (1) based on the image of the electronic component (1) taken by the camera (25).

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic component inspection device and an electronic component inspection method. BACKGROUND

[0002] At a manufacturing site of an electronic component, a manufactured electronic component is inspected before shipment. As a known example of a device for inspecting an electronic component, there is, for example, an appearance inspection device described in Patent Literature 1. Patent Literature 1 describes the following: a 2-dimensional image with illumination, a camera that captures a 2-dimensional image of an object illuminated by the 2-dimensional image with illumination, a laser projection section that irradiates laser light to the object, and a laser light spot light receiving position detection element that receives reflected laser light from the object to detect a height displacement amount of the object are combined into one, and 2-dimensional image and 3-dimensional height information are acquired at one time.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 10-288508 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] Inspection of an electronic component includes inspection of mounting failure. In determination of mounting failure, the inclination (flatness) of a component main body at the time of mounting the electronic component to a substrate is used. In order to detect the flatness of the electronic component, the height of a terminal extending from the component main body of the electronic component, that is, the height of the terminal with the component main body as a reference is measured. At this time, by measuring the height of the terminal with higher accuracy, the accuracy of determination of mounting failure can be improved.

[0008] The height of the terminal is measured by capturing the terminal with a camera and based on an image obtained by the capturing. Therefore, in detecting the height of the terminal, it is conceivable to apply the appearance inspection device described in Patent Literature 1 to obtain the height information of the terminal based on a 2-dimensional image.

[0009] However, in the case of detecting the height of a terminal extending from a lower surface of a main body of an electronic component, if light is irradiated from the side of a mounting surface of the terminal in order to obtain a clear image as in Patent Literature 1, the irradiated light is scattered at the edge portion of the terminal surface, and sometimes the edge becomes unclear in the image. In this case, there is a concern that it is difficult to determine a position of the terminal as an inspection object (inspected position), and the accuracy of determination of flatness decreases.

[0010] The present application was completed in view of this situation, and the present application relates to an electronic component inspection device and an inspection method capable of accurately determining an inspected position on a terminal of an electronic component.

[0011] Solution for solving the problem

[0012] The electronic component inspection apparatus of the present invention comprises: a holding part for holding an electronic component having a component body and terminals; a light irradiation part for irradiating light onto at least the terminals of the electronic component from a back side of the electronic component held in the holding part, opposite to the mounting surface; an imaging part for capturing images of the electronic component irradiated by the light irradiation part from the mounting surface side; and a control part for controlling processing related to the inspection of the electronic component based on the images of the electronic component captured by the imaging part.

[0013] The inspection method for electronic components of the present invention includes: a light irradiation step, irradiating light onto at least the terminals of the electronic component from a back side of the electronic component having a component body and terminals opposite to the mounting surface; an imaging step, capturing an image of the electronic component irradiated with light from the mounting surface side; and a control step, controlling processing related to the inspection of the electronic component based on the captured image of the electronic component.

[0014] The effects of the invention

[0015] The inspection apparatus and method for electronic components of the present invention provide an inspection apparatus and method for electronic components that can accurately determine the position to be inspected on the terminals of the electronic component. Attached Figure Description

[0016] Figure 1 This is a perspective view showing the electronic component to be inspected by the inspection device for the electronic component of the present invention.

[0017] Figure 2 (a) is Figure 1 The lower surface view of the electronic component is shown. Figure 2 (b) is the top surface view.

[0018] Figure 3 This is a top surface view of the inspection device for electronic components according to the first embodiment.

[0019] Figure 4 This is a schematic diagram illustrating an inspection device for electronic components according to the first embodiment.

[0020] Figure 5 This is a schematic diagram used to illustrate the images of the terminals obtained by photography.

[0021] Figure 6 This is a diagram illustrating the inspection device for electronic components according to the second embodiment. Figure 6 (a) represents the reflector when the electronic component moves.Figure 6 (b) indicates a position of the reflection plate when the electronic component is photographed.

[0022] Figure 7 is a view for explaining a modification 1 of the second embodiment, Figure 7 (a) of FIG. 8 indicates a position of the reflection plate in photographing, Figure 7 (b) of FIG. 8 indicates a position of the reflection plate away from the imaging area after photographing is finished.

[0023] Figure 8 is a view of an electronic component inspection apparatus for explaining a modification 2 of the second embodiment.

[0024] Explanation of Reference Numerals

[0025] 1: electronic component; 5: control section; 10: component main body; 11, 12: terminal; 15: coil; 16: base; 17: outer leg portion; 21, 22: reflection plate; 25: video camera; 31, 32: light source; 100: placement portion; 101: bolt; 102: long hole; 103: recess; 111, 122: terminal; A: imaging area; I: area; L: irradiation light; Lr: reflected light; M0: position; M1: position; O: area; p0-p8: inspection point. DETAILED DESCRIPTION

[0026] [Outline]

[0027] Before explaining the embodiments of the present application, an outline of a first embodiment, a second embodiment (hereinafter, both will be collectively described as "the present embodiment") of the present application is explained. Figure 1 is a perspective view indicating an electronic component 1 as an inspection object of an electronic component inspection apparatus of the present embodiment, and is a view of the electronic component 1 observed from a side of a surface facing a mounting surface. Further, the "mounting surface" in the present specification is a virtual mounting surface assumed for mounting the electronic component 1.

[0028] Figure 2 (a) of FIG. 7, Figure 2 (b) of FIG. 7 is a view indicating upper and lower surfaces (hereinafter, the lower surface will also be described as a "terminal surface") of the electronic component 1, Figure 2 (a) of FIG. 7 is a lower surface view of the electronic component 1, Figure 2 (b) of FIG. 7 is an upper surface view of the electronic component 1. The electronic component 1 is composed of a component main body 10, terminals 11, 12. Further, the terminals 111, 122 extending from the component main body 10 are bundled terminals (Japanese: karami terminals), and do not constitute mounting terminals.

[0029] The component main body 10 has a winding drum (not shown) having a winding portion (not shown) for winding the coil 15 on the outer periphery, a base portion 16 that houses the winding drum, and an outer leg portion 17 that houses and exposes a part of the terminals 11, 12. The terminals 11, 12 are mounting terminals that are electrically connected to terminals 111, 122 for bundling the wire end portions (not shown) of the coil 15 and are mounted to a mounting substrate (not shown). A plurality of terminals 11, 12 are held side by side in the base portion 16.

[0030] In the present application, the surface on the opposite side of the mounting surface when the electronic component 1 is mounted is referred to as the "back surface". That is, the back surface in the present embodiment is determined with the mounting surface as the reference. The back surface is the same side as the upper surface of the electronic component 1.

[0031] The terminals 11, 12 are lead terminals that extend from the component main body 10 toward opposite directions from each other. In the present embodiment, for convenience, the terminal that extends from the base portion 16 toward the left in the drawing of (a) and (b) of FIG. 10 is referred to as the terminal 11, and the terminal that extends toward the right is referred to as the terminal 12. However, the present embodiment is not limited to inspecting lead terminals, and can be applied to any electronic component as long as the component main body 10 and a part of the terminals 11, 12 have a coincident region that coincides with each other from the side of the mounting surface. Figure 2 Figure 2 The terminals 11, 12 are lead terminals that extend from the component main body 10 toward opposite directions from each other. In the present embodiment, for convenience, the terminal that extends from the base portion 16 toward the left in the drawing of (a) and (b) of FIG. 10 is referred to as the terminal 11, and the terminal that extends toward the right is referred to as the terminal 12. However, the present embodiment is not limited to inspecting lead terminals, and can be applied to any electronic component as long as the component main body 10 and a part of the terminals 11, 12 have a coincident region that coincides with each other from the side of the mounting surface.

[0032] (First Embodiment)

[0033] In the electronic component inspection apparatus of the first embodiment, light is irradiated to the electronic component 1 from the back surface, and an image of the back surface is captured. Then, the profile shape on the terminals 11, 12 is detected based on the two-dimensional image captured, and the position (coordinates) on the terminals 11, 12 are detected with the edge of the terminals 11, 12 determined based on the profile as the reference. Then, processing of corresponding the detected positions to the inspection points set in advance is performed.

[0034] In the above processing, the irradiated light to the back surface of the terminals 11, 12 is sometimes blocked by the component main body 10 and cannot reach the terminals 11, 12. In order to eliminate this problem, in the first embodiment, a reflection plate is inserted to the region where the terminals 11, 12 and the component main body 10 coincide with each other from the side of the mounting surface, and the edge portions of the terminals 11, 12 are captured in a clear image (hereinafter referred to as a "backlight image") by reflecting the irradiated light.

[0035] [Electronic Component Inspection Apparatus]

[0036] ​Next, a first embodiment of the present application will be described using the drawings. The drawings show an example of an inspection apparatus of electronic components for explaining the structure, arrangement, and functions of the inspection apparatus of the first embodiment, and do not limit the specific shape and the like thereof. In the drawings, the same reference numerals are assigned to the same components, and a part of the description thereof is omitted.

[0037] Figure 3 is a plan view of the inspection apparatus 100. The inspection apparatus 100 includes a holding portion 20 that holds and fixes the electronic component 1. Figure 3 is a view of the inspection apparatus 100 as viewed from the mounting surface side of the electronic component 1.

[0038] The inspection apparatus 100 of the first embodiment is provided with a pair of reflection plates 21, 22 disposed in a manner to sandwich a camera region A for photographing the electronic component 1. The camera region A is a region photographed by a camera 25 shown in Figure 4 . The electronic component 1 is held and fixed in a manner that the terminal surface faces the camera 25 and is included in the range of the camera region A when photographed. The reflection plates 21, 22 are each arranged in the left and right of the camera region A, and are arranged so as to be inserted into a region in which the component main body 10 and the terminal 11 or the terminal 12 coincide. The top ends of the reflection plates 21, 22 are slightly inclined downward with respect to a virtual mounting surface when the electronic component 1 is mounted. The inclination of the reflection plates will be described later. Figure 4

[0039] Further, long holes 102 are formed in the reflection plates 21, 22, and bolts 101 inserted through the long holes 102 fix the reflection plates 21, 22 to a base not shown. The inspection apparatus 100 has a conveyance unit that conveys the electronic component 1. The specific structure of the conveyance unit is not particularly limited, and the electronic component 1 can be placed in the camera region A from the front of the paper surface by a robot arm or the like, or can be conveyed in the up and down direction of the paper surface by a belt conveyor or the like so as to be sequentially moved to the camera region A and be moved away from the camera region A after the photographing is completed. Figure 3 Figure 3

[0040] The holding portion 20 holds the terminals 11, 12 in a hollow, and irradiation light irradiated from below the terminals 11, 12 is irradiated to at least the terminals 11, 12 of the electronic component 1.

[0041] Figure 4 is a schematic view for explaining the inspection apparatus of the first embodiment. As Figure 4 ​​​As shown, the inspection device is provided with a holding section 20 that holds the electronic component 1 having the terminals 11, 12 at a prescribed position, and a light irradiation section that irradiates the at least terminals 11, 12 of the electronic component 1 held at the holding section 20 with reflected light Lr from the back. In the first embodiment, the light irradiation section is constituted by the light sources 31, 32 and the reflection plates 21, 22. A part of the irradiation light L irradiated from the light sources 31, 32 is reflected by the reflection plates 21, 22 and then irradiated to the terminals 11, 12 from the back as the reflected light Lr.

[0042] In addition, Figure 4 The structure shown is provided with a camera 25 as an imaging section that photographs the electronic component 1 in a state where the irradiation light L and the reflected light Lr are irradiated by the light sources 31, 32 and the reflection plates 21, 22, and a control section 5 that controls processing relating to inspection of the electronic component 1 based on an image of the electronic component 1 obtained by the camera 25. In the case of observation from the camera 25, the reflected light Lr is backlight when the terminals 11, 12 are photographed.

[0043] Further, in Figure 4 In the example shown, the light sources 31, 32 and the camera 25 are arranged at the lower side of the electronic component 1, but the first embodiment is not limited to such a structure. The first embodiment can also be such that the terminal face of the electronic component 1 faces upward, and the light sources 31, 32 and the camera 25 are arranged above the electronic component 1 to photograph the terminal face.

[0044] In the first embodiment, by irradiating the irradiation light L to the terminal face of the electronic component 1, the terminal face becomes bright, and a clear image of the terminals 11, 12 can be obtained. However, in this case, sometimes scattering of light occurs at the edge portion of the terminal and it is difficult to determine the outline of the edge based on the image. In addition, sometimes the irradiation light L is blocked by the component main body 10 and it is difficult to visually recognize the area where the terminals 11, 12 coincide with the component main body 10 based on the image. The inventors of the present application envisage a case where the height of a plurality of points on the terminals 11, 12 is measured, and there is a concern that the precision sufficient to measure the height of the positioned terminals 11, 12 cannot be obtained.

[0045] To eliminate the aforementioned problems, in the first embodiment, as described above, a light irradiation section is constructed using light sources 31 and 32 that irradiate the electronic components with irradiation light L, and reflective plates 21 and 22 that reflect the irradiation light L irradiated by the light sources 31 and 32 toward the terminals 11 and 12. The light sources 31 and 32 can be any light source, such as lamps or LEDs (Light Emitting Diodes). The reflective plates 21 and 22 are preferably components with high light reflectivity. For example, they can be metals such as aluminum or stainless steel. A portion of the irradiation light L irradiating toward the terminals 11 and 12 is reflected as Lr by the reflective plates 21 and 22 and irradiates from the back of the terminals 11 and 12.

[0046] As previously described, in the first embodiment, the electronic component 1 has lead terminals extending from the component body 10. A portion of the lead terminals and a portion of the component body 10 have overlapping areas that are separate from each other but coincide when viewed from the mounting surface side. The reflectors 21 and 22 are inserted into this overlapping area at a height between the component body 10 and the terminals 11 and 12. The terminals 11 and 12 each protrude downwards from the component body 10 and extend outwards from the component body 10. Figure 4 In the example shown, a portion of the portion extending outwards and the portion protruding downwards toward terminals 11 and 12 become overlapping areas that coincide with the component body 10.

[0047] exist Figure 4 In the example shown, reflectors 21 and 22 are inserted between the portion of reflectors 21 and 22 protruding downwards toward terminals 11 and 12 and a portion of the portion extending outwards, respectively. Reflectors 21 and 22 are then set to tilt downwards toward the mounting surface of the electronic component 1. However, the angles of terminals 11 and 12 are not limited to this configuration; they can be approximately parallel to the mounting surface or tilted upwards relative to the mounting surface. The angles of reflectors 21 and 22 are appropriately determined based on the spacing and depth between the component body 10 and terminals 11 and 12, as well as the location of inspection points, to increase the amount of reflected light at the desired location.

[0048] In addition, the position and spacing of the light sources 31 and 32 are determined by increasing the amount of reflected light Lr that illuminates the desired position on the back of the terminals 11 and 12 after the illumination light shines on the reflectors 21 and 22.

[0049] The camera 25 captures images of the area including terminals 11 and 12 from below the electronic component 1. Figure 5This is a schematic diagram illustrating an image of terminal 12 obtained by means of a photograph. In the image, reflected light Lr, obtained by reflection through reflector 22, illuminates the back of terminal 12, making the area around terminal 12 appear bright and terminal 12 itself appear dark. In this image, the brightness variation at the boundary between terminal 12 and the background is greater, and the edge portion of terminal 12 is clearly shown.

[0050] The control unit 5 acquires image data (image data) captured by the camera 25. Based on the image of the electronic component 1, the control unit 5 detects at least the outline shape of terminals 11 and 12. As mentioned earlier, the image captured by the camera 25 is a backlit image where the brightness of terminals 11 and 12 and the background varies significantly, making it easy to detect the outline shape of terminals 11 and 12. In the first embodiment, inspection points p1 to p8 are set as the inspection targets based on the outline shape detected by the control unit 5. Figure 5 ).

[0051] Contour shape detection can be performed, for example, by edge detection using known image processing techniques. In the first embodiment, edge detection can be performed entirely by the control unit 5, or partially by the operator of the inspection device. In this case, for example, the control unit 5 may detect the edges of terminals 11 and 12 and display them to the operator. Alternatively, the operator may input information for adjusting or correcting the edges detected by the control unit 5 through an input unit (not shown).

[0052] The setting of the inspection point can be, for example, automatically performed by the control unit 5 according to preset conditions. Regarding this process, for example, it could also be as follows: Figure 5 As shown, in the image, with the inspected point p0 located on the edge of terminal 12 as the origin, pixels that are a predetermined number of times away from the origin in the x-direction and a predetermined number of times away from the origin in the y-direction are set as candidates for inspected points p1 to p8. Alternatively, the control unit 5 can also determine at least a portion of the candidates for inspected points p1 to p8 as inspected points according to a predetermined number and configuration of inspected points.

[0053] Furthermore, in this process, a portion of the process can also be performed by the operator. For example, operator-performed processes may include fine-tuning or selecting the points to be checked.

[0054] (Inspection methods for electronic components)

[0055] As explained above, in the inspection apparatus of the first embodiment, the process of irradiating the at least terminals 11, 12 of the electronic component 1 with the reflected light Lr from the back surface of the electronic component 1 having the component main body 10 and the terminals 11, 12, the process of taking an image of the electronic component in a state where the reflected light Lr is irradiated, and the process of controlling the processing relating to the inspection of the electronic component based on the image of the electronic component taken are included.

[0056] The process of irradiating the electronic component 1 with the irradiation light L and the reflected light Lr among the above is performed by holding and fixing the electronic component 1. The process of holding the electronic component 1 to the holding portion can be performed by a device such as a robot arm, or can be performed manually by an operator.

[0057] The irradiation of the irradiation light L can be performed by the control portion 5, or can be performed by a device not shown that controls the mechanism. In this case, by performing the irradiation of the irradiation light L by the control portion 5, the first embodiment can easily perform the process of synchronizing the timing of the irradiation of the irradiation light L with the timing of the acquisition of the image data. In addition, the irradiation of the irradiation light L can be performed by manually turning on the switches of the light sources 31, 32 that are light sources of the laser light by an operator. The process of taking an image of the electronic component 1 irradiated with the irradiation light L and the reflected light Lr can be performed by the control portion 5 outputting a control signal that notifies the timing of the imaging to the camera 25. However, the imaging can be performed by operating the camera 25 by an operator.

[0058] The control of the processing relating to the inspection of the electronic component based on the image can be performed by the control portion 5, or can be performed in part by an operator as described above. The processing relating to the inspection of the electronic component is not limited to the setting of the inspection position. As other processing, for example, the deformation and the deviation of the shape in the planar direction of the terminals 11, 12 can be cited.

[0059] In addition, in the first embodiment, after the above processing, the distance from the camera 25 to the terminals 11, 12 can be measured next. The measurement of the height can be performed by a 3D camera using a TOF (Time Of Flight) method, for example. In the case where the setting of the inspection point to the measurement of the height is performed as a series of processes, as the camera 25, a 3D camera is preferably used.

[0060] Then, the flatness when the electronic component 1 is mounted is detected by performing an arithmetic process or the like on the measured distance, and it can be determined whether the electronic component 1 is a good product or a defective product.

[0061] According to the first embodiment described above, the reflected light Lr is irradiated onto the back side of terminals 11 and 12, thus enabling the capture of a backlit image with clear edges. Furthermore, by setting the inspection point based on the backlit image, the accuracy of the inspection point setting can be improved, as can the accuracy of subsequent flatness detection. This first embodiment of the electronic component inspection apparatus and method can accurately determine the inspection position on the terminals of the electronic component.

[0062] (Second Implementation)

[0063] Next, the second embodiment of the present invention will be described. In the first embodiment, the reflectors 21 and 22 are fixed at an angle with their tops pointing downwards. In contrast, in the inspection device of the second embodiment, the angles of the reflectors 21 and 22 are different when the electronic component 1 moves and when taking pictures, which is different from the first embodiment.

[0064] Figure 6 of (a), Figure 6 (b) is a diagram illustrating the inspection device of the second embodiment, both of which are schematic diagrams showing a portion of the terminal 11 side of the electronic component 1. Figure 6 (a) represents the reflector 21 when the electronic component 1 moves. Figure 6 (b) indicates the reflector 21 when photographing electronic component 1. Electronic component 1 is conveyed by a belt conveyor or other transport unit (not shown) of the inspection device. Figure 6 The paper in (a) is transported horizontally in the front-back direction.

[0065] As previously described, the camera 25 can continuously capture images of multiple electronic components 1. The inspection device of the second embodiment also includes an angle-changing unit that changes the angle at which the reflectors 21 and 22 are tilted relative to the mounting surface. The angle-changing unit adjusts the angle of the reflectors relative to the mounting surface when capturing images of electronic components in the imaging area A (e.g., ...). Figure 6 As shown in (b), the specified tilt angle is greater than the angle of the reflector relative to the mounting surface when the electronic component is moved from the outside to the inside of the camera area A or from the inside to the outside of the camera area A (e.g., Figure 6 As shown in (a), the changes are made in a roughly parallel manner.

[0066] In the second embodiment, the control section 5 functions as the angle changing section. If so, the second embodiment can easily determine the timing of changing the angle of the reflection plates 21, 22 in conjunction with the movement of the electronic component 1 and the start of the photographing. Further, it can be that the time taken for the movement of the electronic component 1 and the photographing is counted in advance based on the clock number or the like, and the timing of the movement of the electronic component 1 and the arrival at the imaging area A is detected. In addition, as to the timing, it can be that a light sensor, for example, the light emitting section and the light receiving section are arranged so as to sandwich the imaging area A, and the light sensor is turned off at the timing when the electronic component 1 has arrived at the imaging area A.

[0067] By so doing, the second embodiment can make the range of the reflection plates 21, 22 in the height direction in the overlapping area of the component main body 10 and the terminal 11 small when the electronic component 1 moves outside the imaging area A after the photographing of the electronic component 1 is completed, and can prevent the electronic component 1 from contacting the reflection plate 21 when moving. In addition, the reflection plates 21, 22 are inclined between the component main body 10 and the terminal 11 during the photographing. Thus, as shown in FIG. 6, the reflected light Lr obtained by reflecting the light from the light sources 31, 32 obliquely incident on the component main body 10 on the lower surfaces of the reflection plates 21, 22 is irradiated to the terminals 11, 12 substantially perpendicularly, and therefore the reflected light Lr can be efficiently concentrated on the terminals 11, 12. Figure 4

[0068] The above action of the reflection plates 21, 22 can be realized, for example, by providing a driving section such as a step motor or the like for changing the inclination of the reflection plates 21, 22, and outputting a control signal instructing the driving to the driver of the driving section by the control section 5. The control section 5 outputs a control signal instructing the driving section to change the inclination of the reflection plates 21, 22 to decrease the inclination of the reflection plates 21, 22 after acquiring the image data of the previous one of the electronic components 1. Then, the arrival of the subsequent other electronic component 1 at the imaging area A is detected, and a control signal instructing the driving section to change the inclination of the reflection plates 21, 22 to increase the inclination of the reflection plates 21, 22 is output to the driver. After outputting the control signal, the control section 5 instructs the camera 25 to start the photographing, and acquires the image data.

[0069] According to this second embodiment, it is possible to prevent the electronic component 1 from contacting the reflection plates 21, 22 when the electronic component 1 moves, and thus the series of processes is interrupted. This can prevent the decrease in the processing efficiency when inspecting the electronic component and reduce the possibility of the deformation or the like of the terminals 11, 12 of the electronic component 1 in the inspection.

[0070] ​However, in the second embodiment, as a structure to prevent the terminals 11, 12 from contacting the reflectors 21, 22 during the movement of the electronic component 1, the tilt angle of the reflectors 21, 22 is not limited to being changed as described above. Modifications 1 and 2 of the second embodiment for preventing contact between the terminals 11, 12 and the reflectors 21, 22 will be described below.

[0071] (Variation Example 1)

[0072] Figure 7 of (a), Figure 7 Figure (b) is for illustrating Modification 1 of the second embodiment. The inspection apparatus of Modification 1 further includes a reflector moving part that moves the reflectors 21 and 22 closer to or further away from the electronic component 1. The reflector moving part moves the reflectors 21 and 22 further away from the electronic component 1 in the extending direction of the terminals 11 and 12 compared to when the electronic component 1 is being photographed. In the inspection apparatus of Modification 1, the control unit 5 functions as the reflector moving part. The control unit 5 moves the reflectors 21 and 22 in the following manner: during the photographing of the electronic component 1, the reflectors 21 and 22 are moved closer to the electronic component 1, and after the photographing of the electronic component 1 is completed, the reflectors 21 and 22 are moved away from the electronic component 1. Figure 7 (a) indicates the position of reflector 21 during the shooting process. Figure 7 (b) indicates the position of the reflector 21 that is far away from the electronic component 1 after the shooting is completed.

[0073] The aforementioned actions of reflectors 21 and 22 can be achieved, for example, by providing a drive unit (not shown), such as a stepper motor, for moving reflectors 21 and 22 away from or closer to electronic component 1, and by having the control unit 5 output a control signal to the driver of this drive unit instructing it to drive. After acquiring image data from the previous component, the control unit 5 outputs an instruction to the drive unit of reflectors 21 and 22 to move reflectors 21 and 22 away from or closer to electronic component 1. Figure 7 The position shown in (a) is far away from the Figure 7 The control signal for the position shown in (b).

[0074] The drive unit, according to the control signal, moves the top position M0 of the reflector 21 away to a position M1 that does not coincide with terminals 11 and 12 when viewed from the mounting surface. As a result, in Modified Example 1, the reflector 21 retracts a distance ΔM from position M0. Therefore, regardless of the transport unit (not shown) of the inspection device... Figure 7 In either the up-down direction or the front-back direction of the paper, the electronic component 1 can be transported in any direction to avoid contact between the reflectors 21 and 22 and the electronic component 1.

[0075] Also, in the second embodiment, as a way to avoid contact of the electronic component 1 with the reflection plates 21, 22, it is not limited to driving the reflection plates 21, 22.

[0076] Figure 8 is a view for explaining an inspection device of a modification 2 of the second embodiment. In the modification 2, the reflection plates 21, 22 as the reflection portions are fixed in a range that does not coincide with the electronic component 1 from the mounting surface side. In the modification 2, the reflection plates 21, 22 are fixed in a range that does not coincide with the electronic component 1 from the mounting surface side. Figure 8 In the modification 2, the range that coincides with the electronic component is denoted as I, and the range that does not coincide with the electronic component is denoted as O.

[0077] In the modification 2, the entire reflection plates 21, 22 including the top ends thereof are fixed in the range of the region O. Also, the reflection plates 21, 22 are configured to be inclined toward the component main body 10 obliquely downward with the top ends thereof. If so, even if the reflection plates 21, 22 are fixed, the reflection plates 21, 22 do not contact the electronic component 1, and it is possible to reduce the possibility of problems such as stoppage of the device during inspection of the electronic component or damage to the terminals 11, 12 of the electronic component 1.

[0078] The above-described embodiments include the following technical ideas.

[0079] (1) An inspection device of an electronic component, comprising: a holding portion for holding an electronic component having a component main body and a terminal; a light irradiation portion for irradiating light to at least the terminal of the electronic component held by the holding portion from a back surface of the electronic component on a side opposite to a mounting surface; an imaging portion for imaging the electronic component to which the light is irradiated by the light irradiation portion from the mounting surface side; and a control portion for controlling a process related to inspection of the electronic component based on an image of the electronic component imaged by the imaging portion.

[0080] (2) The inspection device of an electronic component according to (1), the light irradiation portion including a light source for irradiating irradiation light to the electronic component and a reflection portion for reflecting the irradiation light irradiated by the light source from the back surface side.

[0081] (3) The inspection device of an electronic component according to (2), the terminal of the electronic component being a lead terminal extending from the component main body, a part of the lead terminal and a part of the component main body having a coinciding region that is separate from each other and coincides with each other from the mounting surface side,

[0082] the reflection portion being a reflection plate inserted into the coinciding region of the component main body and the lead terminal.

[0083] (4) The inspection apparatus of an electronic component according to (3), further comprising an angle changing section that changes an angle at which the reflection plate is inclined with respect to the mounting surface, the angle changing section changing the angle at which the reflection plate is inclined with respect to the mounting surface when the electronic component is imaged in such a way that the angle is larger than the angle when the electronic component is moved.

[0084] (5) The inspection apparatus of an electronic component according to (3), further comprising a reflection plate moving section that moves the reflection plate closer to or farther from the electronic component, the reflection plate moving section moving the reflection plate in such a way that the reflection plate is farther from the electronic component when the electronic component is moved than when the electronic component is imaged.

[0085] (6) The inspection apparatus of an electronic component according to (2), the reflection section being fixed in a range that does not coincide with the electronic component as viewed from the mounting surface side.

[0086] (7) The inspection apparatus of an electronic component according to any one of (1) to (6), the control section detecting at least a contour shape of the terminal based on an image of the electronic component, and setting a point to be inspected that is an inspection object in accordance with the detected contour shape.

[0087] (8) An inspection method of an electronic component, including: a light irradiation process of irradiating light on at least a terminal of an electronic component having a component main body and the terminal from a back surface of the electronic component on a side opposite to a mounting surface; an imaging process of imaging the electronic component on which the light is irradiated from the mounting surface side; and a control process of controlling a process related to inspection of the electronic component based on an image of the electronic component obtained by imaging.

[0088] This application claims priority based on Japanese Application No. 2020-105843 filed on June 19, 2020, and the disclosure of which is incorporated herein in its entirety.

Claims

1. An inspection device for electronic components, comprising: A retaining part, used to hold an electronic component having a component body and terminals; A light irradiation section that irradiates light onto at least the terminals of the electronic component held in the holding section from the back side of the electronic component on the side opposite to the mounting surface; as well as The camera unit captures images of the electronic components that have been illuminated by the light irradiation unit from the side of the mounting surface. as well as The control unit controls the processing related to the inspection of the electronic components based on the images of the electronic components captured by the camera unit. The light irradiation unit includes a light source that irradiates the electronic component with irradiation light and a reflective unit that reflects the irradiation light irradiated by the light source from the rear side. The terminals of the electronic component are lead terminals extending from the main body of the component. A portion of the lead terminal and a portion of the component body have overlapping areas that are separate from each other but coincide when viewed from the mounting surface side. The reflective part is a reflective plate inserted into the overlapping area of ​​the component body and the lead terminal.

2. The inspection device for electronic components according to claim 1, characterized in that, It also includes an angle changing unit that changes the angle of the reflector relative to the mounting surface, the angle changing unit changing the angle so that the angle of the reflector relative to the mounting surface when photographing the electronic component is greater than the angle when the electronic component moves.

3. The inspection device for electronic components according to claim 2, characterized in that, It also includes a reflector moving part that moves the reflector closer to or further away from the electronic component, the reflector moving part moving the reflector further away from the electronic component than when the electronic component is being photographed.

4. The inspection device for electronic components according to any one of claims 1 to 3, characterized in that, The reflector is fixed in a region that does not overlap with the electronic component when viewed from the mounting surface.

5. The inspection apparatus for electronic components according to any one of claims 1 to 3, characterized in that, The control unit detects at least the outline shape of the terminal based on the image of the electronic component, and sets the inspection point as the inspection object according to the detected outline shape.

6. A method for inspecting electronic components, comprising: In the light irradiation process, light is irradiated onto at least the lead terminals of the electronic component from the back side of the side opposite to the mounting surface of the electronic component, which has a component body and lead terminals extending from the component body. The camera process involves photographing the electronic component illuminated by the light from the side of the mounting surface. as well as The control process controls the procedures related to the inspection of the electronic components based on the images of the electronic components obtained from the photographs. Wherein, a portion of the lead terminal and a portion of the component body have overlapping areas that are separate from each other but coincide when viewed from the mounting surface side. In the light irradiation process, a reflector is inserted into the overlapping area of ​​the component body and the lead terminal. The reflector reflects the irradiation light irradiated by the light source irradiating the electronic component from the back side as reflected light, and the reflected light irradiates the lead terminal from the back side.

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