Selective continuous wave soldering equipment based on electronic component

Abstract

The invention relates to the technical field of continuous wave soldering, in particular to selective continuous wave soldering equipment based on electronic components, which comprises a base, a conveying unit, a soldering unit, a guide component and an auxiliary component. According to the welding device, firstly, the upper die base and the lower die base are closed and locked, a welding area is accurately opposite to the nozzle by means of the guide assembly, the welding quality and welding efficiency of follow-up welding are ensured, and batch rapid production is facilitated; the upper die base and the lower die base serve as first-stage covering protection, and the guide assembly limits the height of the nozzle; the tin solution is cooled before welding to form second-stage temperature protection, then third-stage protection is formed by means of nitrogen filling in in the welding process, fourth-stage protection is formed through preheating and cooling protection in the auxiliary assembly, in conclusion, through the four-stage temperature protection, the problem that components are damaged due to high temperature is solved, and the welding quality is improved.

Description

Technical Field

[0001] This invention relates to the field of continuous wave soldering technology, specifically to a selective continuous wave soldering device based on electronic components. Background Technology

[0002] In the manufacturing process of electronic components, soldering is typically used to connect components to each other or pins to each other. For example, in the manufacturing of humidity and temperature sensors (primarily for PCB-related electronic components), pins need to be connected to the components to form the final product (see finished product documentation). Figure 8 ).

[0003] Currently, the above welding is mainly carried out through two operation methods: manual soldering and continuous wave soldering. The operation steps of manual soldering are: the person immerses the welding position into the molten solder to complete the welding. The operation steps of continuous wave soldering are: the external nozzle sprays molten solder and makes the molten solder come into contact with the welding area, and the above process is repeated to carry out continuous welding.

[0004] The above process has the following problems: First, in the manual soldering process, immersion in molten tin can easily lead to a lot of waste and low work efficiency. In addition, immersion is difficult to protect the areas of the components that do not need to be soldered, and the high temperature of the molten tin can damage the components.

[0005] Secondly, in the current wave soldering process, the temperature of the tin solution is usually 300℃, while the temperature required to ensure a normal soldering connection in the soldering area is 250℃-270℃. However, the temperature that the non-soldering area can withstand is less than 80℃. Therefore, when the tin solution is applied for soldering, it is easy to cause damage to the soldering area. Furthermore, when the temperature transmitted to the non-soldering area exceeds 80℃, it is easy to cause damage to the non-soldering area of ​​the component.

[0006] In summary, this invention provides a selective continuous wave soldering device based on electronic components, which can achieve precise and efficient soldering while protecting the components from high temperatures. Summary of the Invention

[0007] Therefore, it is necessary to provide a selective continuous wave soldering equipment based on electronic components, which aims to solve the problems of the prior art.

[0008] This application provides a selective continuous wave soldering device based on electronic components, comprising: a base, wherein a conveying unit and a soldering unit for continuously conveying components are disposed on the base.

[0009] The conveying unit includes a guide rail fixedly mounted on a base, a plurality of movable seats slidably mounted on the guide rail, a lower mold base fixedly mounted on the side of the movable seats away from the guide rail, and an upper mold base that slides up and down on the lower mold base. The upper mold base and the lower mold base close when they move above the welding unit and separate when they move away from the welding unit.

[0010] The upper mold base and the lower mold base are provided with mating grooves on their opposite surfaces for placing components. The mating grooves are the same shape as the components.

[0011] The welding unit includes a mounting base. The mounting base is fixedly mounted on the front end face of the base. Two nozzles that slide up and down and are used to spray molten solder are provided above the mounting base. Guide components are provided on the two nozzles.

[0012] An auxiliary component for detecting temperature and assisting welding is provided between the upper and lower mold bases.

[0013] The upper and lower mold bases close to position and lock the components and cover the non-welding areas of the components. The guide assembly guides the nozzle to align and weld with the welding area of ​​each component. The auxiliary assembly preheats the components before welding and forms a cooling protection for overheating.

[0014] According to an advantageous embodiment, four rectangularly distributed mounting rods with vertical axes are fixedly provided on the upper end surface of the lower mold base, and the upper mold base is slidably sleeved on the corresponding four mounting rods. A spring sleeved on the mounting rod is fixedly provided between the upper end of the mounting rod and the lower mold base.

[0015] According to an advantageous embodiment, an extrusion plate is fixedly disposed on the base. The extrusion plate consists of an inclined section and a horizontal section from left to right. The inclined section is inclined from top to bottom to the left. The extrusion plate is located above the lower die base.

[0016] According to an advantageous embodiment, the lower end face of the lower mold base is provided with a rectangular groove corresponding to the mating groove, and the upper side wall of the rectangular groove is provided with two through grooves distributed to the left and right, and the through grooves are connected to the corresponding mating grooves. The two through grooves are respectively opposite to the two corresponding welding areas on the corresponding components.

[0017] The openings of the fitting grooves are all chamfered, and the parts of the upper and lower mold bases adjacent to the welding area are made of ceramic material.

[0018] According to an advantageous embodiment, the guiding assembly includes guide posts, and guide posts with vertical axes are fixedly provided on both the front and rear sides of the nozzle. A positioning ring for controlling the upward movement distance of the nozzle is fixedly sleeved on the guide posts. A groove group corresponding to the fitting groove is opened on the lower end face of the lower mold base, and the groove group includes four rectangular guide grooves.

[0019] According to an advantageous embodiment, the mounting base has a slidingly recessed lifting platform at its upper end, and two nozzles are fixedly mounted on the lifting platform.

[0020] A rectangular sealing element is fixedly installed on the upper surface of the lifting platform.

[0021] According to an advantageous embodiment, a pipe assembly corresponding to the rectangular groove is fixedly provided on the lower mold base. The pipe assembly includes a main pipe and a secondary pipe. One end of the main pipe penetrates the front sidewall of the rectangular groove, and one end of the secondary pipe is connected to the main pipe, while the other end penetrates the rear sidewall of the rectangular groove.

[0022] According to an advantageous embodiment, the auxiliary component includes a temperature sensor, and a temperature sensor corresponding to the mating groove is fixedly disposed on the upper mold base. The temperature sensor has three sensing probes that pass through the upper mold base and are respectively located between two welding areas and between the welding area and the non-welding area on the component.

[0023] According to an advantageous embodiment, a lower pad is fixedly disposed on the upper side of the lower mold base, and an upper pad is fixedly disposed on the lower side of the upper mold base. Both the upper and lower pads have hollow internal structures.

[0024] According to an advantageous embodiment, two left-right distributed conveying pipes are fixedly disposed on both the upper and lower pads.

[0025] In summary, the present invention has the following beneficial effects: Firstly, by locking the upper and lower mold bases together and using the guide components, the welding area is precisely aligned with the nozzle, ensuring the welding quality and efficiency of subsequent welding, which is conducive to rapid mass production. Secondly, the upper and lower mold bases serve as the first level of coverage protection, and the guide components limit the nozzle height, cooling the tin solution before welding, forming the second level of temperature protection. Then, nitrogen gas is injected during the welding process to form the third level of protection, and preheating and cooling protection in the auxiliary components form the fourth level of protection. In summary, through four levels of temperature protection, the problem of component damage caused by high temperature is avoided, thus improving the welding quality. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0027] Figure 1 A schematic diagram of a selective continuous wave soldering device based on electronic components according to an embodiment of the present invention is shown.

[0028] Figure 2 A front view of the extrusion plate, upper die holder, and lower die holder provided according to an embodiment of the present invention is shown.

[0029] Figure 3 A partial cross-sectional perspective view of the three-dimensional structure of the lower mold base provided according to an embodiment of the present invention is shown.

[0030] Figure 4 The present invention provides an embodiment of the invention. Figure 3 Enlarged diagram of point A in the middle.

[0031] Figure 5 A bottom view of the upper mold base provided according to an embodiment of the present invention is shown.

[0032] Figure 6 A partial cross-sectional perspective view of the three-dimensional structure between the temperature sensor and the upper pad provided according to an embodiment of the present invention is shown.

[0033] Figure 7 A partial cross-sectional perspective view of the three-dimensional structure between the lower mold base, the seal, and the guide post provided according to an embodiment of the present invention is shown.

[0034] Figure 8 A schematic diagram of the finished product after soldering of components according to an embodiment of the present invention is shown.

[0035] The above-mentioned drawings include the following reference numerals: 1. Base; 2. Conveying unit; 20. Guide rail; 21. Moving seat; 22. Lower mold base; 220. Mounting rod; 221. Spring; 23. Upper mold base; 24. Fitting groove; 25. Extrusion plate; 26. Rectangular groove; 260. Through groove; 3. Welding unit; 30. Mounting seat; 31. Nozzle; 4. Guide assembly; 40. Guide post; 41. Positioning ring; 42. Guide groove; 43. Lifting platform; 44. Seal; 50. Main pipe; 51. Secondary pipe; 6. Auxiliary assembly; 60. Temperature sensor; 61. Sensor probe; 62. Lower pad; 63. Upper pad; 64. Conveying pipe. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0037] like Figure 1As shown, a selective continuous wave soldering device based on electronic components includes: a base 1, on which a conveying unit 2 for continuously conveying components and a welding unit 3 are provided, and the welding unit 3 is located in front of the conveying unit 2.

[0038] The conveying unit 2 includes a guide rail 20 fixedly mounted on the base 1. Multiple movable seats 21 are slidably arranged on the guide rail 20. A lower mold seat 22 is fixedly mounted on the side of the movable seat 21 away from the guide rail 20. An upper mold seat 23 is mounted on the lower mold seat 22 and slides up and down. When the upper mold seat 23 and the lower mold seat 22 move above the welding unit 3, they close together. When they move away from above the welding unit 3, they move away from each other.

[0039] like Figure 3 and Figure 5 As shown, the upper mold base 23 and the lower mold base 22 are provided with mating grooves 24 for placing components on their opposite surfaces. The mating grooves 24 have the same shape as the components.

[0040] like Figure 1 , Figure 2 and Figure 7 As shown, the welding unit 3 includes a mounting base 30. The mounting base 30 is fixedly mounted on the front end face of the base 1. Two nozzles 31 that slide up and down and are used to spray molten tin are provided above the mounting base 30. The two nozzles 31 are provided with guide components 4 that correspond to the mating groove 24 and are used to guide the welding reference.

[0041] like Figure 1 As shown, an auxiliary component 6 for detecting temperature and assisting welding is jointly provided between the upper mold base 23 and the lower mold base 22. The auxiliary component 6 detects the temperature of the non-welding area of ​​the component, preheats it before welding, and provides cooling protection in case of overheating.

[0042] It should be further explained that the conveying unit 2 also includes sprockets, chains, and a motor that drives the sprockets. All moving seats 21 are fixedly connected to the chains. Therefore, during operation, the motor drives the sprockets to rotate, and through the transmission between the sprockets and chains, all moving seats 21 drive the lower mold base 22 to move along the guide rail 20. Secondly, the mounting base 30 is equipped with an electromagnetic pump, controller, control system, and collection module. Therefore, during the welding process, the controller detects whether the nozzle 31 has moved to the set position. Then, the control system sends an electrical signal to control the electromagnetic pump to operate. The electromagnetic pump causes the internal molten solder to spray upwards through the nozzle 31 for welding. After a single welding operation is completed, the control system sends a signal to stop the electromagnetic pump. Furthermore, the above processes and components are all existing external technologies, which will not be elaborated further here.

[0043] During operation, electronic components are placed manually or by a robotic arm into the fitting groove 24 on the lower mold base 22 at the rear of the base 1, which is the loading process. Then, the moving seat 21 drives the lower mold base 22, the upper mold base 23 and the components to gradually move above the nozzle 31 through the operation of the motor. During this process, the upper mold base 23 gradually moves closer to the lower mold base 22. Finally, the upper mold base 23 and the lower mold base 22 close together to clamp the components, which determines the welding area of ​​the components, improves the welding accuracy, and at the same time covers and protects the non-welding areas of the components to avoid damage during subsequent welding processes.

[0044] As the lower mold base 22 continues to move, it moves the component above the nozzle 31 and then stops moving. The guide assembly 4 then guides the nozzle 31 to be directly below the corresponding welding position. The nozzle 31 then moves upward, so that the distance between the nozzle 31 and the welding area is a set distance, which is greater than the set distance in the traditional welding process (2mm-3mm). Therefore, at this set distance, the molten solder can be adsorbed onto the component for welding. By increasing the distance between the nozzle 31 and the component, the molten solder cools down during the spraying process, so that the molten solder will not damage the component when it comes into contact with it, thus protecting the component.

[0045] After the nozzle 31 moves to the set position, the electromagnetic pump operates to spray the molten solder from the nozzle 31 and perform soldering at the soldering position on the component. After a single soldering operation is completed, the motor resumes operation, causing the lower mold base 22 to move the component back to the next soldering position above the nozzle 31. The above operation is then repeated to continuously complete all soldering operations.

[0046] Before each welding operation, the components are preheated by auxiliary component 6 to avoid damage caused by large temperature differences during subsequent direct welding. During each welding process, the temperature of the non-welded areas on the components is constantly monitored by auxiliary component 6. When the temperature exceeds the maximum withstand temperature of the components, auxiliary component 6 provides cooling protection to prevent damage to the circuitry in the non-welded areas of the components during the welding process.

[0047] like Figure 2 As shown, four rectangular mounting rods 220 with vertical axes are fixedly arranged on the upper end face of the lower mold base 22. The upper mold base 23 is slidably sleeved on the corresponding four mounting rods 220. A spring 221 sleeved on the mounting rod 220 is fixedly arranged between the upper end of the mounting rod 220 and the lower mold base 22.

[0048] like Figure 2As shown, an extrusion plate 25 is fixedly installed on the base 1 via a connecting frame. The extrusion plate 25 consists of an inclined section and a horizontal section from left to right. The inclined section is inclined from top to bottom to the left. The extrusion plate 25 is located above the lower die base 22. The upper die base 23 is gradually closed with the lower die base 22 by being guided by the inclined plate. When the upper die base 23 and the lower die base 22 move to below the horizontal section, the horizontal section extrudes the upper die base 23, causing the upper die base 23 to close with the lower die base 22.

[0049] like Figure 3 and Figure 4 As shown, the lower end face of the lower mold base 22 is provided with a rectangular groove 26 corresponding to the mating groove 24. The upper side wall of the rectangular groove 26 is provided with two through grooves 260 distributed from left to right, and the through grooves 260 are connected to the corresponding mating groove 24. The two through grooves 260 are respectively opposite to the two welding areas on the corresponding components.

[0050] The openings of the fitting grooves 24 are all chamfered, and the parts of the lower mold base 22 adjacent to the welding area are all made of ceramic material.

[0051] During operation, after the component loading process is completed on the rear side of the base 1, the motor continues to operate, causing all moving seats 21 to drive the lower mold seat 22, the upper mold seat 23 and the components located in the mating groove 24 on the lower mold seat 22 to move counterclockwise along the length direction of the guide rail 20. At this time, the upper mold seat 23 and the lower mold seat 22 are in a separated state.

[0052] As the upper die holder 23 continues to move, it begins to contact the inclined section of the extrusion plate 25. The inclined section continuously presses the upper die holder 23, causing it to approach the lower die holder 22. The spring 221 stretches and deforms, and the upper die holder 23 continues to move to below the horizontal section of the extrusion plate 25. At this time, the upper die holder 23 and the lower die holder 22 are tightly closed. It should be noted that during the process of the upper die holder 23 being below the horizontal section of the extrusion plate 25, the components are continuously welded. After the welding is completed, the moving seat 21 moves the upper die holder 23 out of the extrusion plate 25. The elastic force generated by the deformation of the spring 221 causes the upper die holder 23 to move upward and reset. Then, the components that have undergone the welding step are removed.

[0053] The closing and limiting process of the upper mold base 23 and the lower mold base 22 not only completely defines the placement position of the components and determines the subsequent welding reference, but also covers all areas of the components except for the welding area, protecting the components during the welding process and avoiding damage to the non-welding areas of the components during the welding process.

[0054] It should be noted that when the upper mold base 23 and the lower mold base 22 are tightly closed, the welding areas on the components are all aligned with the corresponding through slots 260.

[0055] like Figure 1 and Figure 7 As shown, the guide assembly 4 includes guide posts 40. Guide posts 40 with vertical axes are fixedly installed on both the front and rear sides of the nozzle 31. A positioning ring 41 for controlling the upward movement distance of the nozzle 31 is fixedly sleeved on the guide post 40. The lower end face of the lower mold base 22 is provided with a groove group corresponding to the fitting groove 24. The groove group includes four rectangular guide grooves 42. Through the cooperation between the guide post 40 on the nozzle 31 and the corresponding guide groove 42, the nozzle 31 is located directly below the welding area.

[0056] like Figure 7 As shown, a lifting platform 43 with an inwardly recessed upper end is slidably disposed inside the mounting base 30. Two nozzles 31 are fixedly disposed on the lifting platform 43. The inwardly recessed area of ​​the lifting platform 43 is used to collect the tin solution overflowing during the soldering process. The lifting platform 43 is driven to move up and down by an external electric push rod (not shown in the figure). A rectangular sealing element 44 is fixedly disposed on the upper surface of the lifting platform 43.

[0057] During the process of the lower mold base 22 and the upper mold base 23 moving the components inside them to above the nozzle 31, it should be noted that the mounting base 30 is equipped with a transmitter, and the lower mold base 22 is equipped with a receiver corresponding to the mating groove 24 (both the transmitter and receiver are existing technologies and are not shown). When the component moves to above the nozzle 31, the receiver receives the signal transmitted by the transmitter and feeds it back to the control module, indicating that the component has moved to above the nozzle 31 and controlling the motor to stop working, so that the component stops above the nozzle 31 and can be used for subsequent welding steps. The position of the component is determined by the cooperation between the transmitter and each receiver. The above operation process and related components are all external existing technologies and will not be described in detail later.

[0058] After the component moves above the nozzle 31, the external electric push rod operates to move the nozzle 31 upward. The nozzle 31 drives the guide post 40 on it to insert into the corresponding guide groove 42. Through mechanical cooperation, the nozzle 31 is guided to be precisely aligned with the welding area. Finally, the positioning ring 41 fits into the lower mold base 22. At this time, the straight-line distance between the nozzle 31 and the component is the set welding distance. Welding is carried out at this distance to ensure the welding connection effect while cooling the molten solder during the spraying process, avoiding the impact of high temperature on the non-welding area of ​​the component.

[0059] As the nozzle 31 moves upward, the seal 44 moves upward simultaneously. The upper end of the seal 44 fits against the lower mold base 22 and covers the corresponding rectangular groove 26. At this time, an approximately sealed space is formed between the two welding areas of the component and the seal 44.

[0060] like Figure 3 and Figure 4As shown, a pipe assembly corresponding to the rectangular groove 26 is fixedly installed on the lower mold base 22. The pipe assembly includes a main pipe 50 and a secondary pipe 51. One end of the main pipe 50 passes through the front side wall of the rectangular groove 26, and the other end of the main pipe 50 is connected to an external air pump (not shown in the figure). One end of the secondary pipe 51 is connected to the main pipe 50, and the other end passes through the rear side wall of the rectangular groove 26.

[0061] After the sealed space is formed, the external air pump pumps nitrogen into the sealed space through the main pipe 50 and the auxiliary pipe 51. This reduces the dependence of the welding process window on high temperature and forms nitrogen protection (oxygen content <500ppm), which means that good welding can be achieved at a relatively low temperature of 225℃ to 245℃. This directly reduces the risk of thermal damage when the tin solution comes into contact with the components. At the same time, the nitrogen protection method improves the wettability of the solder several times and greatly reduces the formation of tin oxide dross, thus reducing defects in the welding process.

[0062] like Figure 1 , Figure 5 and Figure 6 As shown, the auxiliary component 6 includes a temperature sensor 60. The upper mold base 23 is fixedly provided with a temperature sensor 60 corresponding to the mating groove 24. The three sensing probes 61 on the temperature sensor 60 pass through the upper mold base 23 and are respectively located between the two welding areas and between the welding area and the non-welding area on the component.

[0063] like Figure 4 and Figure 6 As shown, a lower pad 62 is fixedly installed on the upper side of the lower mold base 22, and an upper pad 63 is fixedly installed on the lower side of the upper mold base 23. Both the upper pad 63 and the lower pad 62 have hollow internal structures. After the lower mold base 22 and the upper mold base 23 are closed, the components are locked by the upper pad 63 and the lower pad 62. Two left and right distributed conveying pipes 64 are fixedly installed on both the upper pad 63 and the lower pad 62.

[0064] During the closing process of the upper mold base 23 and the lower mold base 22, the upper pad 63 and the lower pad 62 respectively adhere to the upper and lower sides of the component. Then, before the soldering operation, the external water pump operates to pump high-temperature liquid through one of the delivery pipes 64 in the upper pad 63 and one of the delivery pipes 64 in the lower pad 62, and pumps it out from the remaining delivery pipes 64, thus forming a flow loop. The component is preheated by pumping in high-temperature liquid, avoiding the problem of damage caused by the temperature difference caused by direct contact with the solder solution. The high-temperature liquid is recovered during the soldering process, ending the preheating process.

[0065] During the welding process, the three sensing probes 61 of the temperature sensor 60 continuously detect the temperature at a set location on the component and convert the temperature into an electrical signal, which is then transmitted to the corresponding control module. When the detected temperature does not exceed the damage threshold of the non-welded area on the component, no additional auxiliary action is required. When the detected temperature exceeds the damage threshold of the non-welded area, the control module controls an external water pump to operate. The external water pump pumps a low-temperature liquid into the flow loop through the delivery pipe 64 to cool and protect the non-welded area of ​​the component, preventing high-temperature damage to the component. (The temperature detection and electrical signal conversion process and the operation of the control module are all existing external technologies.)

[0066] It should be noted that both the external air pump and the external water pump can be installed on the lower mold base 22. For the storage process of high-temperature liquids and low-temperature liquids, storage cavities can be set on the lower mold base 22 to form a circulation system for the lower mold base 22 as an individual unit. The above-mentioned components and processes are all existing external technologies and will not be described in detail.

[0067] In summary, it is worth noting that, compared to existing external soldering methods that directly immerse components in molten solder or spray excessive amounts of molten solder, this technical solution adds an upper mold base 23, a lower mold base 22, a guide component 4, and an auxiliary component 6. The close fit between the upper mold base 23 and the lower mold base 22 protects the non-soldering areas of the components, forming the first level of protection. Secondly, the guide component 4 precisely guides the molten solder spray position and increases the spray distance, ensuring a good soldering connection while simultaneously cooling the molten solder during spraying to prevent high temperatures from affecting the non-soldering areas of the components, forming the second level of protection. Finally, nitrogen is pumped into the sealed space to achieve good soldering at a relatively low temperature. Good soldering directly reduces the risk of thermal damage when the molten solder comes into contact with the components, forming a third level of protection. Finally, the preheating step in auxiliary component 6 reduces the risk of damage from the high temperature difference caused by direct contact soldering, and provides overheating cooling protection, forming a fourth level of protection. In summary, the four levels of protection work together to ensure accurate soldering while protecting the components and avoiding damage to the components during the soldering process. The added components are all external conventional mechanical parts, which can be used for a long time after a single installation. Compared with the economic benefits of protecting the components and accurate soldering, the added cost is negligible. Therefore, this technical solution is a specific improvement based on and to solve the defects of the existing technology.

[0068] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0069] Furthermore, the terms "first," "second," "number one," and "number two" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," "number one," or "number two" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "connected," "installed," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0071] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A selective continuous wave soldering equipment based on electronic components, characterized in that, include: A base, on which a conveying unit and a welding unit for continuously conveying components are provided; The conveying unit includes a guide rail fixedly mounted on a base, a plurality of movable seats slidably mounted on the guide rail, a lower mold base fixedly mounted on the side of the movable seats away from the guide rail, and an upper mold base that slides up and down on the lower mold base. The upper mold base and the lower mold base close when they move above the welding unit and separate when they move away from the welding unit. The upper mold base and the lower mold base are provided with mating grooves on their opposite surfaces for placing components. The mating grooves are the same shape as the components. The welding unit includes a mounting base, with the mounting base fixedly mounted on the front end face of the base. Two nozzles that slide up and down and are used to spray molten solder are provided above the mounting base, and guide components are provided on the two nozzles. An auxiliary component for detecting temperature and assisting welding is provided between the upper mold base and the lower mold base; The upper and lower mold bases close to position and lock the components and cover the non-welding areas of the components. The guide assembly guides the nozzle to align and weld with the welding area of ​​each component. The auxiliary assembly preheats the components before welding and forms a cooling protection for overheating.

2. The selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: The upper end face of the lower mold base is fixedly provided with four rectangularly distributed and vertically oriented mounting rods. The upper mold base is slidably sleeved on the corresponding four mounting rods. The upper end of the mounting rod and the lower mold base are jointly fixedly provided with springs sleeved on the mounting rods.

3. The selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: An extrusion plate is fixedly installed on the base. The extrusion plate consists of an inclined section and a horizontal section from left to right. The inclined section is inclined from top to bottom to the left. The extrusion plate is located above the lower mold base.

4. The selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: The lower end face of the lower mold base is provided with a rectangular groove corresponding to the mating groove. The upper side wall of the rectangular groove is provided with two through grooves distributed on the left and right, and the through grooves are connected to the corresponding mating grooves. The two through grooves are respectively opposite to the two welding areas on the corresponding components. The openings of the fitting grooves are all chamfered, and the parts of the upper and lower mold bases adjacent to the welding area are made of ceramic material.

5. A selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: The guiding assembly includes guide posts. Guide posts with vertical axes are fixedly installed on both the front and rear sides of the nozzle. Positioning rings for controlling the upward movement distance of the nozzle are fixedly sleeved on the guide posts. The lower end face of the lower mold base is provided with a groove group corresponding to the fitting groove. The groove group includes four rectangular guide grooves.

6. The selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: The mounting base has a sliding lifting platform with an inwardly recessed upper end, and two nozzles are fixedly mounted on the lifting platform. A rectangular sealing element is fixedly installed on the upper surface of the lifting platform.

7. A selective continuous wave soldering equipment based on electronic components according to claim 4, characterized in that: The lower mold base is fixedly provided with a pipe group corresponding to the rectangular groove. The pipe group includes a main pipe and a secondary pipe. One end of the main pipe passes through the front side wall of the rectangular groove, and one end of the secondary pipe is connected to the main pipe, while the other end passes through the rear side wall of the rectangular groove.

8. A selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: The auxiliary component includes a temperature sensor. A temperature sensor corresponding to the mating groove is fixedly installed on the upper mold base. Three sensing probes on the temperature sensor pass through the upper mold base and are respectively located between two welding areas and between the welding area and the non-welding area on the component.

9. A selective continuous wave soldering equipment based on electronic components according to claim 1, characterized in that: A lower pad is fixedly installed on the upper side of the lower mold base, and an upper pad is fixedly installed on the lower side of the upper mold base. Both the upper and lower pads have hollow internal structures.

10. A selective continuous wave soldering equipment based on electronic components according to claim 9, characterized in that: Two conveying pipes, distributed left and right, are fixedly installed on both the upper and lower pads.

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