Signal Sources and Test Systems
By designing a signal source based on a signal transmission chip, the problems of large size and expensive traditional signal sources are solved, and the effects of small size, low cost and strong portability are achieved. They are suitable for testing scenarios of specific frequency bands and waveforms.
Patent Information
- Application Number
- CN202010568197.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-06-19
- Publication Date
- 2025-05-06
- Estimated Expiration
- 2040-06-19
AI Technical Summary
Traditional signal sources need to take into account multiple waveforms and large bandwidths, resulting in large sizes, expensive prices, and do not meet the actual needs of users, resulting in waste of resources and high testing costs.
A signal source based on a signal transmission chip is designed, and a transmission channel is selected to output millimeter wave signals in a specific frequency band through the control signal receiving device. Combined with a detachable waveguide structure and shield cover, a small size and low cost signal source is realized.
It realizes the small size, low cost and strong portability of the signal source, and is suitable for testing scenarios in specific frequency bands and waveforms, avoiding the problems of waste of resources and high testing costs.
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Figure CN113824454B_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present application relate to the technical field of electronic measuring instruments, and in particular to a signal source and a test system. Background Art
[0002] Signal sources can be used to provide signals of corresponding frequency bands and waveforms to the circuits or devices under test, including low-frequency signal sources, radio frequency signal sources, video signal sources, microwave signal sources, millimeter-wave signal sources, etc. In order to meet the needs of different scenarios, traditional signal sources generally need to provide signals of multiple waveforms, and the bandwidth is large (such as tens of G or even hundreds of G bandwidth), which makes the number of components that make up the signal source large and the requirements for components are very high. This will not only make the signal source large in size and expensive, but also difficult to implement.
[0003] However, in actual applications, users generally only use one or several specific waveforms, as well as signals in a very small frequency band (such as a bandwidth of several G, set to hundreds or tens of megabytes). Compared with the actual needs of users, traditional signal sources are not only inconvenient to operate due to their large size and high price, resulting in high user testing costs, but also a lot of waste of resources. Summary of the invention
[0004] The embodiments of the present application provide a signal source and a test system to achieve low cost, small size, easy reusability, and portability.
[0005] The present application embodiment provides a signal source, which may include:
[0006] Printed circuit boards, and
[0007] A control signal receiving device, a signal transmitting chip and a transmission device are arranged on the printed circuit board and connected in sequence;
[0008] Among them, the control signal receiving device can be used to receive an external control signal, the signal transmitting chip can be used to select at least part of the transmitting channel to output the millimeter wave signal of the first preset frequency band according to the control signal, and the transmission device is used to output the millimeter wave signal.
[0009] The signal source in the embodiment of the present application utilizes a signal transmitting chip to provide a millimeter wave signal of a preset frequency band, which not only has low design difficulty, but also has a small device size and is easy to operate. At the same time, compared with traditional signal sources costing hundreds of thousands of yuan, the signal source in the embodiment of the present application only costs about a thousand yuan, with obvious price advantages.
[0010] At the same time, since the waveform and signal bandwidth provided by the signal transmitting chip are smaller than those of the traditional signal source, for example, the traditional millimeter wave signal source can provide signals such as 30GHz-300GHz triangle wave, square wave and frequency modulated continuous wave, while the millimeter signal transmitting chip may only provide signals in the 60GHz-64GHz or 76GHz-81GHz frequency band, and the waveform of the signal provided is only FMCW wave or triangle wave. In actual production applications, the products of general enterprises (especially small and medium-sized enterprises) only need to be tested for signals of specific frequency bands and waveforms. For example, millimeter wave radar chips generally need to be tested for FMCW waves in the 77GHz frequency band. At this time, compared with the traditional millimeter wave signal source, the signal source in the embodiment of the present application is highly targeted and will not cause waste of product functions and frequency resources. Similarly, the signal source in the embodiment of the present application can also be applied to test scenarios of communication or sensor chips such as millimeter wave communication chips (such as 5G communications).
[0011] In addition, in an embodiment of the present application, an appropriate transmission channel of the signal transmitting chip and a millimeter wave signal of a corresponding frequency band are selected by controlling an external control signal received by a signal receiving device, that is, both the transmission channel and the frequency band of the signal are adjustable, so that the same signal transmitting chip can provide corresponding signals for different application scenarios, thereby effectively improving the breadth and flexibility of the signal source.
[0012] Optionally, the transmission device may include:
[0013] a waveguide structure connected to the signal transmitting chip, wherein the waveguide structure is detachably disposed on the printed circuit board; and
[0014] A waveguide connector is arranged on the printed circuit board so as to adapt to different application scenarios or test devices by replacing the waveguide structure when different signal transmitting chips share the same waveguide connector;
[0015] The waveguide structure outputs the millimeter wave signal of the first preset frequency band to an external device through the waveguide connector.
[0016] Optionally, the signal source may further include:
[0017] A storage device, arranged on a side of the printed circuit board away from the signal transmitting chip;
[0018] The storage device is connected to the signal transmitting chip and can be used to store firmware data (such as firmware) of the signal transmitting chip. The firmware data can be used to regulate the functions and working status that can be achieved by the signal transmitting chip.
[0019] Optionally, the signal source may further include:
[0020] The shielding cover is arranged on the signal transmitting chip to shield the leakage signal of the signal transmitting chip to prevent the leakage signal from forming an interference signal in the test environment, thereby improving the accuracy of the test. At the same time, the shielding cover can also shield the interference of the antenna feeder and the external interference to the signal transmitting chip.
[0021] Optionally, the signal source may further include:
[0022] A power supply device is connected to the signal transmitting chip and is used to provide working power to the signal transmitting chip. The power supply device can be various types of power supplies. In an optional embodiment, it can be a USB power supply device, that is, the signal transmitting chip can be powered by a USB interface on a computer, thereby improving the convenience of the operator using a computer to control the signal source in the embodiment of the present application for testing.
[0023] In another optional embodiment, the power supply device further has an electric energy conversion unit, which can be used to convert the received external power into multiple branches with different electrical parameters to provide corresponding electric energy to each electric energy input interface of the signal transmitting chip. For example, the electric energy conversion unit can convert the 5V electrical signal received through the USB into 3.3V, 1.8V and / or 1.5V branches.
[0024] Optionally, the signal source may further include:
[0025] A housing having a receiving cavity;
[0026] The printed circuit board is placed in the accommodating cavity. The housing not only accommodates and protects the printed circuit board and the components arranged thereon, but also has certain heat dissipation and signal shielding functions, thereby improving the working stability of the signal source and providing a high-quality testing environment.
[0027] Optionally, the bandwidth of the first preset frequency band is less than or equal to 5G, for example, 5G, 2G, 500M, 200M, 100M or 50M.
[0028] Optionally, the first preset frequency band may be a high frequency signal frequency band such as 24 GHz, 60 GHz or 70 GHz. For example, the range of the first preset frequency band may be [60 GHz, 64 GHz] or [76 GHz, 81 GHz].
[0029] In a second aspect, an embodiment of the present application further provides a signal source, which can be applied to perform performance testing on a device under test, and the signal source includes:
[0030] A signal transmitting chip, used for providing a test signal of a preset frequency band; and
[0031] The waveguide device is used to output the test signal to perform a performance test on the device under test.
[0032] The embodiment of the present application provides a chip-level signal source, which can not only effectively reduce the size of the signal source, making it easier to operate and carry, but also greatly reduce the price of the signal source due to the economical price of the signal transmission chip, thereby facilitating promotion and application and reducing the cost of device testing.
[0033] Optionally, the bandwidth of the preset frequency band is less than or equal to 10G, for example, 10G, 8G, 4G, 1G, 800M, 400M, 800M or 40M.
[0034] Optionally, the device under test is a signal transceiver device, and the frequency band of the test signal matches the frequency band of the signal that can be received by the signal transceiver device.
[0035] Optionally, the device under test and the signal transmitting chip are chips of the same model, the same type, or chips capable of achieving the same functions, etc.;
[0036] Among them, the signal transmission chip is a chip that has been tested and verified, and the device to be tested is a chip that has not been tested and verified. Using the tested and verified chip to form a new signal source to test various performance and scenarios of the subsequent chips to be tested and verified can save the process of debugging the signal source compared to the traditional signal source test, which not only greatly reduces the test cost, but also effectively improves the efficiency and accuracy of the test. For example, you can first rent a traditional signal source or other signal source based on the chip for testing and verification, and then use the chip that has passed the test to build a new signal source, and use the new signal source to test the subsequent chips to be tested.
[0037] Optionally, the signal source may further include:
[0038] a carrier board, on which the signal transmitting chip and the waveguide device are arranged; and
[0039] A shielding cover covers the signal transmitting chip and is fixed on the carrier board to shield the leaked signal of the signal transmitting chip, as well as the interference of the antenna feeder and the external interference to the signal transmitting chip, so as to improve the quality of the test environment.
[0040] In a third aspect, an embodiment of the present application further provides a test system, which may include:
[0041] a sensor device to be tested; and
[0042] at least one test signal source, providing a test signal for testing the sensor device to be tested;
[0043] Among them, each of the test signal sources is a signal source described in any one of the embodiments of the present application.
[0044] Since a chip-level signal source is used, when the test system provided in the embodiment of the present application is used to test the scenarios and functions such as signal transmission, signal reception and / or signal processing of the sensor device to be tested (such as a sensor chip, a communication chip / device, etc.), it can not only effectively reduce the test cost, but also improve the flexibility of the test operation and the accuracy of the test results.
[0045] Optionally, the at least one test signal source includes a first signal source, and the test system further includes:
[0046] A first analog signal sampler connected to an intermediate frequency signal output terminal of the sensor device to be tested;
[0047] The signal receiving end of the sensor device to be tested is connected to the first signal source and can be used to receive the test signal. That is, the test signal is generated by the first signal source, and the sensor device to be tested directly receives the test signal through a medium such as a waveguide, performs signal processing to output an intermediate frequency signal, and then uses the first analog signal sampler to sample the intermediate frequency signal. Subsequently, the sampled signal can be analyzed and processed, thereby realizing functional tests such as signal reception and signal processing of the sensor device to be tested.
[0048] Optionally, the testing system may further include:
[0049] a first attenuator, wherein the first signal source is connected to a signal receiving end of the sensor device to be tested through the first attenuator;
[0050] The first attenuator may be used to adjust the power of the test signal to match the signal receiving parameter of the sensor device to be tested, so as to prevent the test signal power output by the first signal source from being greater than the rated signal receiving power of the sensor device to be tested.
[0051] Optionally, the at least one test signal source includes a second signal source, and the test system may further include:
[0052] a mixer having two signal input terminals and a signal output terminal; and
[0053] A second analog signal sampler, connected to the signal output terminal of the mixer, and used for sampling the mixed signal output by the mixer;
[0054] Among them, the RF signal output end of the sensor device to be tested and the signal output end of the second signal source are respectively connected to a signal input end of the mixer, so as to use the signal generated by the second signal source as a reference signal to down-convert the RF signal output by the sensor device to be tested, and then use the second analog signal sampler to sample the down-converted signal, and then analyze and process the sampled signal, so as to test the signal emitted by the sensor device to be tested.
[0055] Optionally, the testing system may further include:
[0056] a second attenuator, through which a signal output terminal of the second signal source is connected to a signal input terminal connector of the mixer;
[0057] an amplifier, wherein the signal output end of the mixer is connected to the second analog signal sampler through the amplifier; and
[0058] a low noise amplifier and a third attenuator;
[0059] Wherein, the radio frequency signal output terminal of the sensor device to be tested is connected to another signal input terminal of the mixer via the low noise amplifier and the third attenuator in sequence.
[0060] Optionally, the at least one test signal source includes a third signal source, and the test system further includes:
[0061] A first connection port, a connection cable, a second connection port, and a fourth attenuator connected in sequence;
[0062] The signal receiving end of the sensor device to be tested is connected to the first connection port, and the third signal source is connected to the fourth attenuator. This scenario can be used to simulate the performance of a receiving channel in receiving an echo signal.
[0063] Optionally, each signal source in the at least one test signal source is a sensor chip of the same type with adjustable output signal.
[0064] Optionally, the testing system may further include:
[0065] A power detector having a signal input terminal and a signal output terminal, wherein the signal input terminal of the power detector is connected to the signal output terminal of the sensor device to be tested; and
[0066] A measuring unit (such as an ATE detection device, etc.) is connected to the signal output terminal of the power detector and is used to measure the voltage signal and current signal output by the power detector, thereby obtaining parameters (such as power, etc.) of the output signal of the sensor device to be tested.
[0067] Optionally, the various signal sources mentioned in the present application, and / or the signal sources and the sensor devices to be tested, may be the same chip, the same type of chip, the same model of chip, or chips that can achieve the same functions, etc., and the signal source based on the same model of chip can adapt to different test scenarios by utilizing control signals to adjust the frequency (within a preset frequency band), power, waveform and other parameters of the transmitted signal, and different test scenarios can also be achieved based on the same signal source.
[0068] The signal source and test system provided in the embodiment of the present application can meet the actual needs of users based on the millimeter wave signal in the control signal emission characteristic frequency band, thereby avoiding waste of resources and reducing the size of the signal source because there is no need to take into account the needs of different scenarios. That is, the signal source provided by the embodiment has a reasonable structure, small size, low cost, and easy to carry, which solves the problem that the signal source in the prior art is large in size, inconvenient to operate and expensive. In addition, the signal source provided by the embodiment can also quickly realize the replacement of the signal emission chip according to needs, so as to meet the needs of signal sources in different frequency bands. BRIEF DESCRIPTION OF THE DRAWINGS
[0069] Figure 1 is a structural schematic diagram of a signal source provided in an embodiment of the present application;
[0070] Figure 2 is a structural schematic diagram of another signal source provided in an embodiment of the present application;
[0071] Figure 3 is a structural schematic diagram of another signal source provided in an embodiment of the present application;
[0072] Figure 4 is a structural schematic diagram of another signal source provided in an embodiment of the present application;
[0073] Figure 5 is a structural schematic diagram of a test system provided in an embodiment of the present application;
[0074] Figure 6 It is a structural diagram of another test system provided in an embodiment of the present application. DETAILED DESCRIPTION
[0075] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present application, rather than to limit the present application. It should also be noted that, for ease of description, only the parts related to the present application, rather than all structures, are shown in the accompanying drawings.
[0076] Figure 1 is a schematic diagram of a structure of a signal source provided in an embodiment of the present application, such as Figure 1As shown, the signal source 100 provided in the embodiment of the present application may include: a printed circuit board 10, and devices such as a control signal receiving device 20, a signal transmitting chip 30 and a transmission device 40 arranged on the printed circuit board 10 and connected in sequence; wherein the control signal receiving device 20 can be used to receive an external control signal, the signal transmitting chip 30 can be used to select at least part of the transmitting channel to output a millimeter wave signal of a first preset frequency band (for example, a signal of a 24 GHz band, a 60 GHz band or a 77 GHz band), and the transmission device 40 can be used to output the millimeter wave signal.
[0077] In an optional embodiment, if Figure 1 As shown, the control signal receiving device 20 can be, for example, a serial peripheral interface (SPI). An external control device, such as a computer or other controllable device, controls the signal transmitting chip 30 through the SPI interface to select at least part of the transmitting channel to output the millimeter wave signal of the first preset frequency band. Among them, the signal transmitting chip 30 can transmit the millimeter wave signal of the second preset frequency band, and the first preset frequency band is within the range of the second preset frequency band; the first preset frequency band can be, for example, 74-74.6GHz, 79.2-79.4GHz or 83.6-84GHz and other frequency bands.
[0078] Exemplarily, different series of signal transmitting chips 30 transmit different first preset frequency bands. For example, the signal transmitting chip 30 includes ALPS series chips or Rhine series chips, etc. If the signal transmitting chip 30 is an ALPS chip, it is a 77G source, and if the signal transmitting chip 30 is a Rhine chip, it is a 60G source. Those skilled in the art can understand that the signal transmitting chip 30 is not limited to the ALPS chip or the Rhine chip, and other frequency chips can also be used as transmitters, that is, different signal transmitting chips 30 can be used to generate different transmission sources.
[0079] Optional, such as Figure 1 As shown, the signal transmitting chip 30 is integrated on the printed circuit board 10, and accordingly, other structures electrically connected to the signal transmitting chip 30, such as the transmission device 40, can be adaptively adjusted according to needs and requirements. In different application scenarios, different signal transmitting chips 30 can be integrated to provide signals of corresponding frequencies.
[0080] Optional, such as Figure 1 As shown, the external control device controls the signal transmitting chip 30 to generate the millimeter wave signal of the first preset frequency band, and specifically can generate the millimeter wave signal of the first preset frequency band by debugging the internal register of the signal transmitting chip 30.
[0081] It should be noted that the size of the printed circuit board 10 is not specifically limited in this embodiment, as long as the control signal receiving device 20, the signal transmitting chip 30 and the transmission device 40 can be arranged on the printed circuit board 10 and their corresponding functions can be realized; this embodiment also does not specifically limit the positions of the control signal receiving device 20, the signal transmitting chip 30 and the transmission device 40 on the printed circuit board 10, which are optional. Figure 1 The signal transmitting chip 30 is located in the middle of the printed circuit board 10 , the control signal receiving device 20 is arranged at the receiving end of the signal transmitting chip 30 , and the transmission device 40 is arranged at the transmitting end of the signal transmitting chip 30 .
[0082] The signal source provided in the embodiment of the present application can meet the actual needs of users because the signal transmitting chip can control the millimeter wave signal of the characteristic frequency band of the signal transmission, thereby avoiding waste of resources and reducing the size of the signal source because there is no need to take into account the needs of different scenarios. That is, the signal source provided in the embodiment has a reasonable structure, small size, low cost, and easy to carry, which solves the problem that the signal source in the prior art is large in size, inconvenient to operate and expensive; in addition, the signal source provided in the embodiment can also quickly realize the replacement of the signal transmitting chip according to needs, so as to meet the needs of signal sources in different frequency bands.
[0083] In an optional embodiment, the bandwidth of the first preset frequency band may be less than or equal to 5G, and the range of the first preset frequency band may be [60 GHz, 64 GHz] or [76 GHz, 81 GHz].
[0084] It is understandable that the broadband of the first preset frequency band is not limited thereto; and the range of the first preset frequency band is not limited thereto.
[0085] Optional, continue to see Figure 1 The transmission device 40 includes: a waveguide structure 41, which is detachably arranged on the printed circuit board 10 and connected to the signal transmitting chip 30; and a waveguide connector 42, which is arranged on the printed circuit board 10; wherein the waveguide structure 41 outputs the millimeter wave signal of the first preset frequency band to the external device through the waveguide connector 42.
[0086] Among them, when the frequency band of the millimeter wave signal emitted by the signal transmitting chip 30 is different, the waveguide structure 41 is also different, that is, the waveguide structure 41 must correspond to the millimeter wave signal of the specific frequency band emitted by the signal transmitting chip 30, so as to output the millimeter wave signal of the first preset frequency band to the external device through the waveguide connector 42.
[0087] It should be noted that the waveguide structure 41 may be diverse, and this embodiment does not specifically limit the waveguide structure 41 .
[0088] Optional, continue to see Figure 1 The signal source 100 may further include: a storage device 50, which is arranged on a side of the printed circuit board 10 away from the signal transmitting chip 30; wherein the storage device 50 is connected to the signal transmitting chip 30 and can be used to store firmware data of the signal transmitting chip 30.
[0089] The storage device 50 may be, for example, a device with a storage function such as a flash.
[0090] Optional, continue to see Figure 1 The signal source 100 further includes: a shielding cover 60, which is disposed on the signal transmitting chip 30 and is used to shield the leakage signal of the signal transmitting chip 30. The shielding cover 60 can also shield the interference of the antenna feeder and the external interference to the signal transmitting chip 30.
[0091] Considering that the leakage signal of the signal transmitting chip 30 may interfere with the millimeter wave signal of the first preset frequency band output by the signal transmitting chip 30, the present embodiment provides a shielding cover 60 on the signal transmitting chip 30 to shield the leakage signal of the signal transmitting chip 30, so that the performance of the millimeter wave signal of the first preset frequency band output is better. The shielding cover 60 may be a metal plate of a specific material such as aluminum or copper.
[0092] Optional, continue to see Figure 1 The signal source 100 may further include: a power supply device 70 connected to the signal transmitting chip 30 and used to provide working power for the signal transmitting chip 30 .
[0093] Specifically, the power supply device 70 provides working power to the signal transmitting chip 30 , so that the signal transmitting chip 30 can start and work normally.
[0094] Optionally, the power supply device 70 may include, for example, a USB power supply and a power conversion module. The USB power supply generally has a supply voltage of 5V, which passes through various power conversion modules to output multiple power supply branch signals (such as 3.3v, 1.8v, 1.5v, etc.) to the signal transmitting chip 30, so that the signal transmitting chip 30 can start and work normally.
[0095] Optionally, the power supply device 70 may include, for example, a power socket, which is directly plugged into the power socket and connected to a power transmitting device to provide working power for the power supply device 70 .
[0096] Optional, Figure 2 is a structural diagram of another signal source provided in an embodiment of the present application, such as Figure 2 As shown, the signal source 100 further includes: a housing 80 having a receiving cavity; wherein the printed circuit board 10 is placed in the receiving cavity.
[0097] The housing 80 not only accommodates and protects the printed circuit board 10 , but also has a certain heat dissipation function.
[0098] Optionally, when the power supply device 70 is a USB power supply, the USB power supply is placed close to the printed circuit board 10, and the corresponding position of the housing 80 needs to be hollowed out (such as Figure 2 The USB port is exposed in area AA.
[0099] Optional, Figure 3 is a structural diagram of another signal source provided in an embodiment of the present application, such as Figure 3 As shown, a fixing hole 90 is provided on the printed circuit board 10; the vertical projection of the fixing hole 90 on the plane where the printed circuit board 10 is located does not overlap with the vertical projection of the control signal receiving device 20, the signal transmitting chip 30 and the transmission device 40 on the plane where the printed circuit board 10 is located.
[0100] The setting of the fixing hole 90 facilitates the fixing and installation of the signal source 100 , and can also dissipate heat for the signal source 100 by using a heat-conducting bolt structure, and can connect the housing 80 to the printed circuit board 10 through the fixing hole 90 .
[0101] Optionally, the fixing holes 90 are evenly distributed around the printed circuit board 10 . The present embodiment does not limit the size of the fixing holes 90 , and only needs to avoid the device settings on the printed circuit board 10 .
[0102] On the basis of the above scheme, optional, continue to refer to Figure 3 A heat dissipation structure 91 is arranged around the fixing hole 90 .
[0103] Among them, the heat dissipation structure 91 can be a circle of upper and lower window openings along the fixing hole 90 to expose the surface substrate. At the same time, the exposed surface substrate can also be connected to the shell 80, thereby increasing the contact area with the shell 80 and better dissipating heat. The heat dissipation structure 91 can also be a hollow structure that runs through the front and back sides of the printed circuit board 10.
[0104] Based on the same inventive concept, the embodiment of the present application further provides a signal source for performing performance testing on a device under test. Figure 4 is a structural diagram of another signal source provided in an embodiment of the present application, such as Figure 4 As shown, the signal source 100 includes: a signal transmitting chip 30', used for providing a test signal of a preset frequency band; and a waveguide device 40', used for outputting the test signal to perform a performance test on the device under test.
[0105] The signal source provided in the embodiment of the present application can be used as a standard signal source to perform performance testing on the device under test. Since the signal transmitting chip can provide a test signal of a preset frequency band to meet the actual needs of users, it not only avoids waste of resources, but also reduces the size of the signal source because there is no need to take into account the needs of different scenarios. That is, the signal source provided in the present embodiment has a reasonable structure, small size, low cost, and easy to carry, which solves the problem that the signal source in the prior art is large in size, inconvenient to operate and expensive. In addition, the signal source provided in the present embodiment can also quickly realize the replacement of the signal transmitting chip according to needs, so as to meet the needs of signal sources in different frequency bands.
[0106] Optionally, the bandwidth of the preset frequency band may be less than 10G.
[0107] Optionally, the device under test is a signal transceiver device, and the frequency band of the test signal matches the frequency band of the signal that can be received by the signal transceiver device.
[0108] Optionally, the device under test and the signal transmitting chip 30 ′ are the same chip; wherein the signal transmitting chip 30 ′ is a chip that has been tested and verified, and the device under test is a chip that has not been tested and verified.
[0109] Optional, continue to see Figure 4 , further comprising: a carrier board 10', a signal transmitting chip 30' and a waveguide device 40' are arranged on the carrier board 10'; and a shielding cover 60', which covers the signal transmitting chip 30' and is fixed on the carrier board 10'. By covering the shielding cover 60' on the signal transmitting chip 30', the leakage signal of the signal transmitting chip 30' is shielded.
[0110] Based on the same inventive concept, the embodiment of the present application also provides a testing system, Figure 5 is a schematic diagram of the structure of a test system provided in an embodiment of the present application, such as Figure 5 As shown, the test system 300 includes: a sensor device 200 to be tested; and at least one test signal source, providing a test signal for testing the sensor device 200 to be tested; wherein each test signal source is a signal source 100 as claimed in any one of claims 1-13.
[0111] Exemplarily, the sensor device 200 to be tested can be, for example, a millimeter-wave radar-related device. Specifically, in the process of detecting millimeter-wave radar-related devices, it is generally necessary to purchase a millimeter-wave signal source; however, a traditional millimeter-wave signal source can generally provide a signal with a frequency range of 30GHz-300GHz, while in actual applications, the millimeter-wave signal source only needs to provide an FMCW wave signal with a frequency of 60-64GHz and 76-81GHz, so that nearly 97% of the frequency band of the signal provided by the millimeter-wave signal source is wasted. Therefore, the signal source 100 provided by the above embodiment can transmit a millimeter-wave signal of a characteristic frequency band to meet the actual needs of users, avoiding the waste of resources. At the same time, because it can also take into account the needs of different scenarios, the flexibility of the test system 300 is maintained.
[0112] The signal source 100 provided in the present application will be further described below in conjunction with specific application scenarios, but this does not constitute a limitation to the present application.
[0113] Optional, Figure 6 This is a schematic diagram of the structure of another test system provided in the embodiment of the present application, see Figure 6 In block 1, at least one test signal source includes a first signal source 101, and the test system 300 also includes: a first analog signal sampler 110, which is connected to the intermediate frequency signal output end of the sensor device 200 to be tested; wherein the signal receiving end of the sensor device 200 to be tested is connected to the first signal source 101 for receiving the test signal.
[0114] Specifically, the first signal source 101 generates a test signal of a certain frequency and power to the sensor device 200 under test, and the intermediate frequency signal generated by the sensor device 200 under test based on the test signal is collected by the first analog signal sampler 110, that is, the first analog signal sampler 110 receives the performance test of the intermediate frequency signal.
[0115] Optional, continue to see Figure 6 In block 1, the test system 300 also includes: a first attenuator 120, and the first signal source 101 is connected to the signal receiving end of the sensor device 200 to be tested through the first attenuator 120; wherein the first attenuator 120 can be used to adjust the power of the test signal to match the signal receiving parameters of the sensor device to be tested.
[0116] Specifically, the test signal output by the first signal source 101 is transmitted to the first attenuator 120, and the first attenuator 120 generates an appropriate attenuation coefficient to adjust the power of the test signal to ensure that the power of the test signal is always appropriate when it is transmitted to the signal receiving end of the sensor device 200 to be tested. By connecting the first signal source 101 and the first attenuator 120 in series, the power of the test signal has a large adjustable range, and by using test signals of different bands, the test signal can provide frequencies of multiple bands.
[0117] Optional, see Figure 6 In block 2, at least one test signal source includes a second signal source 102, and the test system 300 also includes: a mixer 130, having two signal input terminals and a signal output terminal; and a second analog signal sampler 111, connected to the signal output terminal of the mixer 130, for sampling the mixed signal output by the mixer 130; wherein the RF signal output terminal of the sensor device 200 to be tested and the signal output terminal of the second signal source 102 are respectively connected to a signal input terminal of the mixer 130.
[0118] in, Figure 6 Block 2 in the example is to test the RF signal emitted by the sensor device 200. Specifically, the sensor device 200 emits a RF signal, which is downconverted based on the signal emitted by the second signal source 102 as a standard signal after passing through the mixer 130 to determine whether the output RF signal is within the preset requirements.
[0119] Optional, see Figure 6 In block 2, the test system 300 also includes: a second attenuator 121, through which the signal output end of the second signal source 102 is connected to a signal input end connector of the mixer 130; an amplifier 140, through which the signal output end of the mixer 130 is connected to the second analog signal sampler 111; and a low noise amplifier (LNA) 141 and a third attenuator 122; wherein the RF signal output end of the sensor device 200 to be tested is connected to another signal input end of the mixer 130 via the low noise amplifier (LNA) 141 and the third attenuator 122 in sequence.
[0120] Specifically, the signal power emitted by the second signal source 102 is adjusted to an appropriate value through the second attenuator 121, that is, through adjustment, the difference between the output signal frequency of the second signal source 102 and the output signal frequency of the sensor device 200 to be tested, that is, the frequency of the analog signal output by the mixer 130, will be a frequency value suitable for the second analog signal sampler 111 to accurately test.
[0121] Specifically, when the analog signal output by the mixer 130 is relatively small, the amplifier 140 performs appropriate amplification to ensure that the second analog signal sampler 111 can accurately test the power of the analog signal.
[0122] Specifically, the signal emitted by the second signal source 102 is transmitted to the low noise amplifier (LNA) 141, where the signal with relatively low power will be appropriately enhanced, and then transmitted to the third attenuator 122, where the signal with relatively high power will be appropriately attenuated.
[0123] In this embodiment, by using a precise calibration method, the corresponding relationship between the output power of the sensor device 200 to be tested and the power of the analog signal output by the mixer 130 can be determined.
[0124] Optional, see Figure 6 In block 4, at least one test signal source includes a third signal source 103, and the test system 300 also includes: a first connection port 150, a connection cable 160, a second connection port 151 and a fourth attenuator 123 connected in sequence; wherein the signal receiving end of the sensor device 200 to be tested is connected to the first connection port 150, and the third signal source 103 is connected to the fourth attenuator 123.
[0125] Specifically, in order to make the signal emitted by the third signal source 103 calibrable, a first connection port 150, a connection cable 160, and a second connection port 151 are added on the basis of the above structure. The calibration equipment measures the test signal output frequency and power of the second connection port 151, and the frequency and loss parameters of the connection cable 160 to confirm the calibration compensation parameters of the entire block 4, so that the block 4 can output a signal with a precise frequency and power.
[0126] Optionally, each signal source 100 in at least one test signal source is a sensor chip of the same type with adjustable output signal.
[0127] Optional, see Figure 6 In block 3, the test system 300 also includes: a power detector 170, having a signal input terminal and a signal output terminal; the signal input terminal of the power detector 170 is connected to the signal output terminal of the sensor device 200 to be tested; and a measuring unit 180, connected to the signal output terminal of the power detector 170, for measuring the voltage signal and the current signal output by the power detector 170, and thereby obtaining the parameters (such as power, etc.) of the output signal of the sensor device 200 to be tested.
[0128] Specifically, the radio frequency signal emitted by the sensor device 200 to be tested is input to the power detector 170, and the output characteristics (voltage, current intensity, etc.) of the power detector 170 change with the power of the input radio frequency signal, and the output of the power detector 170 is measured using the measuring unit 180. A corresponding relationship between the output characteristics of the power detector 170 and the input power of the radio frequency signal is established, and the power of the radio frequency signal output is calculated by measuring the output of the power detector 170.
[0129] It should be noted that the frequency and power of the test signal emitted by the signal source 100 are adjustable. The above four blocks can be performed separately or simultaneously, and this embodiment does not specifically limit it. If performed simultaneously, the signal transmitting chip in the signal source 100 and the sensor device 200 to be tested can use the same chip, but the frequencies of the test signals in different blocks are different.
[0130] Note that the above are only preferred embodiments of the present application and the technical principles used. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application is described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present application, and the scope of the present application is determined by the scope of the appended claims.
Claims
1. A testing system, characterized in that: include: The sensor device to be tested; as well as At least one test signal source, the test signal source is generated by a signal transmitting chip and provides a test signal for testing the sensor device to be tested; The at least one test signal source includes a second signal source, and the test system further includes: a mixer having two signal input terminals and a signal output terminal; and A second analog signal sampler, connected to the signal output terminal of the mixer, and used for sampling the mixed signal output by the mixer; Wherein, the RF signal output terminal of the sensor device to be tested and the signal output terminal of the second signal source are respectively connected to a signal input terminal of the mixer; The test system further comprises: a second attenuator, through which a signal output terminal of the second signal source is connected to a signal input terminal of the mixer; an amplifier, wherein the signal output end of the mixer is connected to the second analog signal sampler through the amplifier; and a low noise amplifier and a third attenuator; Wherein, the radio frequency signal output terminal of the sensor device to be tested is connected to another signal input terminal of the mixer via the low noise amplifier and the third attenuator in sequence.
2. The test system according to claim 1, characterized in that: The at least one test signal source comprises: Printed circuit boards, and A control signal receiving device, a signal transmitting chip and a transmission device are arranged on the printed circuit board and connected in sequence; The control signal receiving device is used to receive an external control signal, the signal transmitting chip is used to select at least part of the transmitting channels to output a millimeter wave signal of a first preset frequency band according to the control signal, and the transmission device is used to output the millimeter wave signal; The signal transmitting chip is capable of transmitting a millimeter wave signal in a second preset frequency band, and the first preset frequency band is within the range of the second preset frequency band.
3. The test system according to claim 2, characterized in that: The at least one test signal source further comprises: A storage device, arranged on a side of the printed circuit board away from the signal transmitting chip; Wherein, the storage device is connected to the signal transmitting chip and can be used to store firmware data of the signal transmitting chip.
4. The test system according to claim 2, characterized in that: The at least one test signal source further comprises: A shielding cover is arranged on the signal transmitting chip and is used for shielding the leakage signal of the signal transmitting chip.
5. The test system according to claim 2, characterized in that: The at least one test signal source further comprises: A power supply device is connected to the signal transmitting chip and is used to provide working power for the signal transmitting chip.
6. The test system according to claim 2, characterized in that: The at least one test signal source further comprises: A housing having a receiving cavity; Wherein, the printed circuit board is placed in the accommodating cavity.
7. The test system according to any one of claims 2 to 6, characterized in that: The bandwidth of the first preset frequency band is less than or equal to 5G.
8. The test system according to claim 7, characterized in that: The range of the first preset frequency band is [60 GHz, 64 GHz] or [76 GHz, 81 GHz].
9. The test system according to claim 1, characterized in that it is used for: The sensor device to be tested is a signal transceiver device, and the frequency band of the test signal matches the frequency band of the signal that can be received by the signal transceiver device.
10. The test system according to claim 1, characterized in that it is used for: The sensor device to be tested and the signal transmitting chip are the same chip; The signal transmitting chip is a chip that has been tested and verified, and the sensor device to be tested is a chip that has not been tested and verified.
11. The test system according to claim 1, characterized in that: The at least one test signal source includes a first signal source, and the test system further includes: A first analog signal sampler connected to an intermediate frequency signal output terminal of the sensor device to be tested; Wherein, the signal receiving end of the sensor device to be tested is connected to the first signal source for receiving the test signal.
12. The test system according to claim 11, characterized in that: The test system further comprises: a first attenuator, wherein the first signal source is connected to a signal receiving end of the sensor device to be tested through the first attenuator; The first attenuator may be used to adjust the power of the test signal to match the signal receiving parameters of the sensor device to be tested.
13. The test system according to claim 1, characterized in that: The at least one test signal source includes a third signal source, and the test system further includes: A first connection port, a connection cable, a second connection port, and a fourth attenuator connected in sequence; Wherein, the signal receiving end of the sensor device to be tested is connected to the first connection port, and the third signal source is connected to the fourth attenuator.
14. The test system according to claim 1, characterized in that: Each signal source in the at least one test signal source is a sensor chip of the same type with adjustable output signal.
15. The test system according to claim 1, characterized in that: The test system further comprises: a power detector; and The measuring unit is connected to the signal output terminal of the sensor device to be tested through the power detector, and is used to measure the parameters of the signal output by the sensor device to be tested.
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