Radio frequency power supply apparatus, heating device, and refrigeration device

Abstract

The embodiment of the present application provides a radio frequency power source device, a heating device and a refrigeration device. The radio frequency power source device comprises a radio frequency power source module and a heat dissipation medium. The radio frequency power source module comprises a first substrate and a radio frequency power amplifier, and the radio frequency power amplifier is attached to the heat dissipation medium and is electrically connected with the first substrate. Specifically, the heat dissipation medium can comprise a shell and / or a heat sink of the radio frequency power source device. Compared with the prior art, in the embodiment of the present application, the heat dissipation medium which is attached to the radio frequency power amplifier and is suitable for heat conduction is adopted, the radio frequency power amplifier is cooled by heat conduction, and the heat dissipation efficiency of the radio frequency power amplifier can be effectively improved, so that the normal work of the radio frequency power source module and the heating device can be ensured.

Description

Technical Field

[0001] This invention relates to the field of household appliance technology, and in particular to a radio frequency power source device, a heating device, and a cooling device. Background Technology

[0002] Currently, radio frequency heating technology has promising application prospects due to its advantages such as short heating time, good temperature uniformity of food after heating, and minimal loss of nutrients.

[0003] However, during the radio frequency heating process, the high power and large heat generation of the radio frequency power source device can cause the temperature of the entire device and its electrical components to rise sharply, thereby affecting the normal operation of the radio frequency heating. Summary of the Invention

[0004] The purpose of this invention is to provide an improved radio frequency power source device, heating device, and cooling device.

[0005] The radio frequency power source device provided in this embodiment of the invention includes a radio frequency power source module and a heat dissipation medium. The radio frequency power source module includes a first substrate and a radio frequency power amplifier. The radio frequency power amplifier is attached to the heat dissipation medium and is electrically connected to the first substrate.

[0006] Optionally, the heat dissipation medium includes a housing for accommodating the RF power source module and suitable for thermal conduction.

[0007] Optionally, the heat dissipation medium includes a heat sink located on the side of the RF power amplifier away from the first substrate.

[0008] Optionally, it includes a housing for accommodating the RF power source module and the heat sink and is adapted for thermal conduction, with the heat sink attached to the housing.

[0009] Optionally, the device includes a housing for accommodating the RF power source module and the heat sink, and a first fan housed within the housing. The housing is provided with a first air outlet, and the first fan is adapted to direct heat from the RF power source module and / or the heat sink to the first air outlet.

[0010] Optionally, a power supply module for supplying power to the radio frequency power source module is included, the power supply module being located on the side of the first substrate facing the heat sink.

[0011] Optionally, both the RF power source module and the power supply module have a first side facing away from the heat sink and suitable for arranging electrical components. The first fan is located on the same side of the RF power source module, the heat sink, and the power supply module, and the airflow driven by the first fan passes through the heat sink and the electrical components.

[0012] Optionally, it includes a power supply module for providing power to the radio frequency power source module, the power supply module being arranged side by side with the first substrate and located on the side of the first substrate away from the radio frequency power amplifier.

[0013] Optionally, it includes a power supply module for providing power to the radio frequency power source module, the power supply module being arranged side by side with the first substrate.

[0014] Optionally, the first substrate has through-holes corresponding to the RF power amplifier, the through-holes being adapted to solder the pins of the RF power amplifier to the first substrate.

[0015] This invention also provides a heating device, including the radio frequency power source device described above.

[0016] This invention also provides a refrigeration device, including the heating device described above.

[0017] Optionally, it includes an equipment bay suitable for accommodating radio frequency power source devices.

[0018] Optionally, the equipment compartment includes at least one wall suitable for heat conduction.

[0019] Optionally, the housing of the RF power source device is fitted to the wall.

[0020] Optionally, the wall is formed through the rear wall and / or side wall of the refrigeration equipment.

[0021] Optionally, it includes a second fan housed within the equipment compartment and a second air inlet and a second air outlet disposed within the equipment compartment. The second fan is adapted to generate an airflow suitable for heat dissipation within the equipment compartment through the second air inlet and the second air outlet.

[0022] Optionally, the RF power source device is positioned closer to the second air inlet than the second air outlet.

[0023] Optionally, the equipment compartment is a compressor compartment.

[0024] Optionally, a top wall and / or a rear wall suitable for thermal conduction are included, with the RF power source device attached to the top wall or the rear wall.

[0025] Optionally, it includes a condenser and a heat-conducting element, the heat-conducting element contacting the radio frequency power source device and the condenser respectively, and is adapted to conduct heat from the radio frequency power source device to the condenser.

[0026] Compared with the prior art, the technical solution of the embodiments of the present invention has beneficial effects. For example, by using a heat dissipation medium that is attached to the RF power amplifier and suitable for thermal conduction, the RF power amplifier can be cooled by heat conduction, which can effectively improve the heat dissipation efficiency of the RF power amplifier and ensure the normal operation of the RF power source module and the heating device.

[0027] For example, using a thermally conductive housing and / or heat sink to dissipate heat from the RF power amplifier not only results in high heat dissipation efficiency but also in a simple structural design and lower equipment improvement costs.

[0028] For example, by setting the first fan to simultaneously cool the RF power source module and the heat sink, not only can the heat dissipation effect be better, but the power consumption is also low.

[0029] For example, by setting a first fan to simultaneously cool the RF power source module, the heat sink, and the power supply module, not only can the heat dissipation effect be better, but the power consumption can also be lower.

[0030] For example, the RF power source device can be placed in the compressor compartment, and the existing fans and / or the heat-conducting walls of the compressor compartment can be used to dissipate heat from the RF power source device, without the need to modify the cooling equipment, thus effectively saving costs.

[0031] For example, the radio frequency power source device can be thermally connected to the condenser of the refrigeration equipment through a heat-conducting component. The large surface area of ​​the condenser can quickly dissipate heat from the radio frequency power source device, which not only has a good heat dissipation effect, but also requires minimal equipment modification and has low cost.

[0032] For example, placing the RF power source module and the power supply module side by side in an RF power source device can effectively save space in the RF power source device, making it easier and faster to apply the RF power source device to cooling equipment or other suitable equipment, and saving space in the cooling equipment or other suitable equipment.

[0033] For example, both the RF power source module and the power supply module have electrical components arranged on only one side, which can effectively save space and reduce the size of the RF power source device, so that the RF power source device can be more conveniently and quickly applied to cooling equipment or other suitable equipment, and save space in cooling equipment or other suitable equipment. Attached Figure Description

[0034] Figure 1 This is a partial perspective view of the refrigeration equipment in an embodiment of the present invention;

[0035] Figure 2 This is a simplified schematic diagram of the heating device in an embodiment of the present invention;

[0036] Figure 3 This is a cross-sectional schematic diagram of a radio frequency power source device in an embodiment of the present invention;

[0037] Figure 4 This is another cross-sectional schematic diagram of the radio frequency power source device in an embodiment of the present invention;

[0038] Figure 5This is a third cross-sectional schematic diagram of the radio frequency power source device in this embodiment of the invention;

[0039] Figure 6 This is a fourth cross-sectional schematic diagram of the radio frequency power source device in this embodiment of the invention;

[0040] Figure 7 This is another partial schematic diagram of the refrigeration equipment in an embodiment of the present invention;

[0041] Figure 8 This is a schematic diagram of the structure of the equipment compartment cover in an embodiment of the present invention;

[0042] Figure 9 This is a schematic diagram showing the positional relationship between the radio frequency power source device and the wall of the device compartment in an embodiment of the present invention;

[0043] Figure 10 A schematic diagram illustrating the connection relationship between the radio frequency power source device and the condenser in an embodiment of the present invention;

[0044] Figure 11 This is a schematic block diagram of the refrigeration equipment in an embodiment of the present invention. Detailed Implementation

[0045] In the existing technology, because the power of radio frequency power source equipment is high and the heat generation is large, the temperature of the entire equipment and its electrical components will rise sharply, which will affect the normal operation of radio frequency heating.

[0046] Unlike existing technologies, this invention provides an improved radio frequency (RF) power source device. The RF power source device includes an RF power source module and a heat dissipation medium. The RF power source module includes a first substrate and an RF power amplifier, the RF power amplifier being attached to the heat dissipation medium and electrically connected to the first substrate.

[0047] Specifically, the heat dissipation medium may include a housing and / or a heat sink suitable for conducting heat.

[0048] Compared to existing technologies, in this embodiment of the invention, a heat dissipation medium that is attached to the RF power amplifier and suitable for thermal conduction is used to dissipate heat from the RF power amplifier through thermal conduction, which can effectively improve the heat dissipation efficiency of the RF power amplifier and ensure the normal operation of the RF power source module and the heating device.

[0049] To make the objectives, features, and beneficial effects of the embodiments of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0050] This invention provides a refrigeration device. This refrigeration device can be a refrigerator, freezer, cooler, refrigerated truck, or other appliance suitable for storing objects at lower temperatures.

[0051] Figure 1 This is a partial perspective view of the refrigeration equipment in an embodiment of the present invention.

[0052] like Figure 1 As shown, the refrigeration equipment 1 includes a storage compartment adapted to accommodate at least part of the heating device 10.

[0053] Specifically, the storage compartment may include a refrigerator compartment 21 and / or a freezer compartment 22.

[0054] The heating device 10 is adapted to receive the load 2 and to raise the temperature of the load 2. In different embodiments, the heating device 10 can perform a heating operation on the load 2 having any initial temperature to increase the thermal energy or temperature of the load 2. For example, in some embodiments, the heating device 10 is adapted to raise the temperature of the load 2, which has an initial temperature below 0 degrees Celsius, to a temperature above or below 0 degrees Celsius. In other embodiments, the heating device 10 is adapted to raise the temperature of the load 2, which has an initial temperature above 0 degrees Celsius, to a predetermined temperature.

[0055] In this embodiment of the invention, the heating device 10 uses radio frequency heating to increase the heat energy or temperature of the load 2.

[0056] Figure 2 This is a simplified schematic diagram of the heating device in an embodiment of the present invention.

[0057] like Figure 2 As shown, the heating device 10 includes a radio frequency power source device 100 and a heating device 200.

[0058] Specifically, the radio frequency power source device 100 includes a housing 110 and a radio frequency power source module 120 and a power supply module 130 located within the housing 110.

[0059] Heating device 200 is adapted to be housed within the storage chamber of refrigeration device 1, and includes an outer cavity 210, an inner cavity 220, a radio frequency antenna 230, and a door 240. The outer cavity 210 is adapted to shield the radio frequency electromagnetic waves generated by the radio frequency antenna 230. The inner cavity 220 is located within the outer cavity 210 and has a processing chamber 221 adapted to house the load 2. The radio frequency antenna 230 is located between the outer cavity 210 and the inner cavity 220 to apply radio frequency energy to the load 2 within the processing chamber 221. The door 240 is installed on the outer cavity 210 and is adapted to open or close the processing chamber 221.

[0060] The heating device 200 may also include a partition 250 suitable for shielding radio frequency electromagnetic waves and a regulating and / or filtering unit 260 connected to the radio frequency antenna 230.

[0061] Specifically, the partition 250 is located between the outer cavity 210 and the inner cavity 220 and is adapted to separate the conditioning and / or filtering unit 260 from the processing chamber 221 and the radio frequency antenna 230, so as to shield the radio frequency electromagnetic waves radiated by the radio frequency antenna 230 to the conditioning and / or filtering unit 260.

[0062] The heating device 200 may also include a user interface unit 270.

[0063] Specifically, the user interface unit 270 is mounted on the outer cavity 210 and is adapted to display the operating status information of the heating device 10 and / or be operated to control the operation of the heating device 10.

[0064] The heating device 10 also includes a radio frequency line 300 and a signal line 400.

[0065] Specifically, the radio frequency line 300 is used to connect the radio frequency power source device 100 and the heating device 200, and is adapted to transmit radio frequency signals from the radio frequency power source device 100 to the heating device 200.

[0066] The signal line 400 is used to connect the radio frequency power source device 100 and the heating device 200, and is adapted to transmit control signals between the radio frequency power source device 100 and the heating device 200.

[0067] Figure 3 This is a cross-sectional schematic diagram of a radio frequency power source device in an embodiment of the present invention.

[0068] In an embodiment of the present invention, the radio frequency power source device 100 includes a housing 110 and a radio frequency power source module 120 and a power supply module 130 located within the housing 110.

[0069] like Figure 3 As shown, the radio frequency power source module 120 includes a first substrate 121 and a radio frequency power generator electrically connected to the first substrate 121. Figure 3 (not shown in the image) and RF power amplifier 122.

[0070] Specifically, the first substrate 121 may be a PCB (Printed Circuit Board). An RF power generator is used to generate RF signals. An RF power amplifier 122 is connected to the RF power generator and is adapted to amplify the RF signals generated by the RF power generator for use by the heating device 200.

[0071] In some specific examples, the first substrate 121 also has a via 121a corresponding to the radio frequency power amplifier 122. The pins 122a of the radio frequency power amplifier 122 are adapted to be soldered to the first substrate 121 through the via 121a. Specifically, the pins 122a of the radio frequency power amplifier 122 can be soldered to the portion of the first substrate 121 used to form the via 121a.

[0072] In this embodiment of the invention, the power supply module 130 is connected to the radio frequency power source module 120 and is used to provide power to the radio frequency power source module 120.

[0073] Specifically, the power supply module 130 includes a second substrate 131 and a power converter electrically connected to the second substrate 131. Figure 3 (Not shown in the image). The second substrate 131 can be a PCB board. In some specific examples, the second substrate 131 can be located on the side of the first substrate 121 opposite to the RF power amplifier 122. The power converter is connected to an external AC power source of the heating device 10 and is adapted to convert the AC voltage from the external AC power source into a DC voltage to provide a DC voltage to the RF power source module 120.

[0074] In some specific examples, the power converter can convert AC voltage from an external AC power source into 50V DC voltage and 12V DC voltage, respectively. The 50V DC voltage is suitable for powering the RF power amplifier 122. The 12V DC voltage is suitable for powering the first substrate 121 and the electrical components disposed on the first substrate 121.

[0075] The radio frequency power amplifier 122 is an important electrical component in the radio frequency power source module 120. It requires a large power supply and generates a lot of heat during operation.

[0076] In the prior art, the heat generated by the RF power amplifier 122 often affects the normal operation of the entire RF power source device 100, or even the entire heating device 10.

[0077] In this embodiment of the invention, the radio frequency power source device 100 further includes a heat dissipation medium suitable for dissipating heat from the radio frequency power amplifier 122 by means of thermal conduction.

[0078] Specifically, the RF power amplifier 122 can be attached to a heat dissipation medium to conduct the heat generated during operation to the heat dissipation medium for heat dissipation.

[0079] In this embodiment of the invention, the housing 110 of the radio frequency power source device 100 may be made of a material suitable for thermal conductivity and serve as a heat dissipation medium to dissipate heat from the radio frequency power amplifier 122.

[0080] In some preferred specific examples, the housing 110 may be made of a metal material with high thermal conductivity.

[0081] Reference Figure 3 The radio frequency power amplifier 122 can be attached to the inner wall of the housing 110 to conduct the heat generated during operation to the housing 110, thereby dissipating heat through the housing 110.

[0082] In some specific examples, the RF power amplifier 122 can be directly fixed to the inner wall of the housing 110 using bolts 123.

[0083] Figure 4 This is another cross-sectional schematic diagram of the radio frequency power source device in an embodiment of the present invention.

[0084] and Figure 3 The example shown is different in that... Figure 4 In the example shown, the heat dissipation medium includes a heat sink 140 housed within a housing 110 and located on the side of the RF power amplifier 122 facing away from the first substrate 121.

[0085] Reference Figure 4 The radio frequency power amplifier 122 can be attached to the heat sink 140 to conduct the heat generated during operation to the heat sink 140 for heat dissipation.

[0086] In some specific examples, the RF power amplifier 122 can be directly fixed to the heat sink 140 using bolts 123.

[0087] Reference Figure 4 The radio frequency power source device 100 also includes a first fan 150 housed in a housing 110, and a first air inlet 111 and a first air outlet 112 disposed in the housing 110.

[0088] Specifically, the first air inlet 111 and the first air outlet 112 can be arranged opposite to each other. The first fan 150 can be disposed at the first air inlet 111 and is adapted to form an airflow between the first air inlet 111 and the first air outlet 112 to guide the heat from the RF power source module 120 and / or the heat sink 140 to the first air outlet 112, thereby dissipating heat from the RF power source module 120 and / or the heat sink 140.

[0089] In some specific examples, the first fan 150 may be an axial fan.

[0090] Reference Figure 4 ,arrow The direction shown is the direction of airflow. Specifically, external airflow can enter the housing 110 through the first air inlet 111, and under the drive of the first fan 150, it flows along the direction from the first air inlet 111 to the first air outlet 112, and finally flows out of the housing 110 through the first air outlet 112.

[0091] In some specific examples, multiple first air inlets 111 and multiple first air outlets 112 can be provided to increase airflow and improve heat dissipation.

[0092] In some preferred embodiments, the first air inlet 111 and the first air outlet 112 may be located on opposite sides of the heat sink 140, so that the first fan 150 is adapted to quickly direct the heat from the heat sink 140 to the first air outlet 112, thereby improving the heat dissipation efficiency of the RF power amplifier 122.

[0093] In some other preferred embodiments, the heat sink 140 may be attached to a thermally conductive housing 110 on the side of its opposite side from the RF power amplifier 122, so that heat from the RF power amplifier 122 can be rapidly conducted to the outside of the RF power source device 100 via the heat sink 140 and the housing 110, thereby improving the heat dissipation efficiency of the RF power amplifier 122.

[0094] Figure 5 This is a third cross-sectional schematic diagram of the radio frequency power source device in this embodiment of the invention.

[0095] and Figure 4 The example shown is different in that... Figure 5 In the example shown, the heat sink 140 is attached to a thermally conductive housing 110 on its side facing away from the RF power amplifier 122. The first substrate 121 and the second substrate 131 are arranged side by side. A first air inlet 111 and a first air outlet 112 are respectively provided on two adjacent walls of the housing 110.

[0096] By attaching the heat sink 140 to the heat-conducting housing 110 on the side of the RF power amplifier 122 away from it, the heat from the RF power amplifier 122 can be quickly conducted to the outside of the RF power source device 100 through the heat sink 140 and the housing 110 in sequence, thereby improving the heat dissipation efficiency of the RF power amplifier 122.

[0097] To facilitate the description of the positional relationship between the first substrate 121 and the second substrate 131, in this embodiment of the invention, the positional relationship when the first substrate 121 and the second substrate 131 face each other can be referred to as parallel, and the positional relationship when the first substrate 121 and the second substrate 131 are located in the same plane and their sides face each other can be referred to as side by side.

[0098] Therefore, in Figure 3 and Figure 4 In the example shown, the first substrate 121 and the second substrate 131 are arranged side by side. Figure 5 In the example shown, the first substrate 121 and the second substrate 131 are arranged side by side.

[0099] Compared to side-by-side arrangement, arranging the first substrate 121 and the second substrate 131 side-by-side can effectively reduce the thickness of the radio frequency power source device 100, thereby making it easier to install the radio frequency power source device 100 in the cooling device 1 or other suitable devices without occupying too much space in the corresponding cooling device 1 or other devices.

[0100] exist Figure 5 In the example shown, in order to improve heat dissipation efficiency and save power consumption, the first air inlet 111 and the first air outlet 112 can be respectively set on the two walls of the housing 110 near the heat sink 140, so that all the airflow driven by the first fan 150 flows through the heat sink 140, thereby improving the heat dissipation efficiency of the heat sink 140.

[0101] In order to form an airflow suitable for cooling the radiator 140 between the first air inlet 111 and the first air outlet 112, Figure 5 In the example shown, the first fan 150 can be a turbine fan and is located at the first air inlet 111.

[0102] Figure 6 This is a fourth cross-sectional schematic diagram of the radio frequency power source device in the embodiments of the present invention.

[0103] and Figure 4 The example shown is different in that... Figure 6 In the example shown, the power supply module 130 is located on the side of the first substrate 121 facing the heat sink 140, that is, the radio frequency amplifier 122 and the heat sink 140 are both located between the first substrate 121 and the second substrate 131.

[0104] Reference Figure 6 The first substrate 121 has a first surface 121b facing away from the heat sink 140 and adapted to arrange electrical components, and the second substrate 131 has a first surface 131a facing away from the heat sink 140 and adapted to arrange electrical components.

[0105] The first fan 150 is located on the same side of the RF power source module 120, the heat sink 140, and the power supply module 130, and the airflow driven by the first fan 150 can pass through the heat sink 140 and the electrical components arranged in the RF power source module 120 and the power supply module 130 at the same time, so that the first fan 150 can simultaneously dissipate heat from the heat sink 140 and the electrical components arranged in the RF power source module 120 and the power supply module 130.

[0106] Specifically, the first fan 150 may extend to the outer side of the first surface 121b of the first substrate 121 and the outer side of the first surface 131a of the second substrate 131, so as to allow the airflow driven by the first fan 150 to pass through the electrical components arranged in the radio frequency power source module 120 and the power supply module 130.

[0107] In some specific examples, electrical components arranged on the first surface 121b of the first substrate 121 may include a radio frequency power generator 124 and / or an inductor 125, which are electrically connected to the first substrate 121.

[0108] In some specific examples, electrical components arranged on the first surface 131a of the second substrate 131 may include power converters 132 and the like, which are electrically connected to the second substrate 131.

[0109] Figure 7 This is another partial schematic diagram of the refrigeration equipment in an embodiment of the present invention.

[0110] like Figure 7 As shown, the cooling device 1 also includes a device compartment 30 suitable for accommodating the radio frequency power source device 100.

[0111] In some preferred specific examples, the equipment compartment 30 can be the compressor compartment of the refrigeration equipment 1.

[0112] Reference Figure 7 The refrigeration equipment 1 also includes a second fan 31 and a compressor 32 housed in the equipment compartment 30.

[0113] Furthermore, the equipment compartment 30 is also provided with a second air inlet and a second air outlet. The second fan 31 is adapted to form an airflow suitable for heat dissipation between the second air inlet and the second air outlet to dissipate heat from the radio frequency power source device 100 and the compressor 32, etc., located in the equipment compartment 30.

[0114] Specifically, the equipment compartment 30 may have an opening 33 and an equipment compartment cover adapted to close the opening 33. Figure 7 (Not shown in the image).

[0115] In some specific examples, the opening 33 can be used to access and place devices such as the radio frequency power source device 100, compressor 32, and second fan 31 into the device compartment 30.

[0116] In other specific examples, the opening 33 can also be used to maintain equipment such as the radio frequency power source device 100, compressor 32, and second fan 31 located in the equipment compartment 30.

[0117] Figure 8 This is a schematic diagram of the structure of the equipment compartment cover in an embodiment of the present invention.

[0118] like Figure 8 As shown, the equipment compartment cover 34 has a second air inlet 341 and a second air outlet 342.

[0119] After the equipment compartment cover 34 closes to the opening 33 of the equipment compartment 30, the second fan 31 is adapted to form an airflow suitable for heat dissipation in the equipment compartment 30 through the second air inlet 341 and the second air outlet 342, so as to dissipate heat from the RF power source device 100 and the compressor 32 and other devices located in the equipment compartment 30.

[0120] Since the temperature at the second air inlet 341 is close to room temperature and is lower than that at the second air outlet 342, in some preferred embodiments, the RF power source device 100 can be positioned closer to the second air inlet 341 relative to the second air outlet 342 to improve the heat dissipation efficiency of the RF power source device 100.

[0121] In some preferred embodiments, the device compartment 30 may also include at least one wall suitable for conducting heat to the radio frequency power source device 100. For example, the device compartment 30 may include at least one wall made of metal.

[0122] Figure 9 This is a schematic diagram showing the positional relationship between the radio frequency power source device and the wall of the device compartment in an embodiment of the present invention.

[0123] Reference Figure 9 The device compartment 30 includes a wall 35 suitable for heat conduction, and the radio frequency power source device 100 is attached to the wall 35 of the device compartment 30. Thus, the heat of the radio frequency power source device 100 can be conducted to the wall 35 by thermal conduction, and the wall 35 can dissipate heat from the radio frequency power source device 100.

[0124] Specifically, the RF power amplifier 122 in the RF power source device 100 can be attached to the housing 110 of the RF power source device 100, and the housing 110 of the RF power source device 100 can be attached to the wall 35 of the device compartment 30.

[0125] In some specific examples, wall 35 may be formed by the rear wall and / or side wall of the refrigeration device 1.

[0126] In some other specific examples, the wall 35 of the equipment compartment 30 is adjacent to the foam layer 36 of the refrigeration equipment 1, and the foam layer 36 is adjacent to the inner liner 37 of the refrigeration equipment 1.

[0127] In this embodiment of the invention, the cooling device 1 may further include a top wall and / or a rear wall adapted to conduct heat to the radio frequency power source device 100. For example, the cooling device 1 may include a top wall and / or a rear wall made of metal.

[0128] The radio frequency power source device 100 can be attached to the top wall and / or rear wall of the cooling device 1 to conduct heat from the radio frequency power source device 100 to the top wall and / or rear wall by means of thermal conduction, and to dissipate heat from the radio frequency power source device 100 through the top wall and / or rear wall.

[0129] Specifically, the RF power amplifier 122 in the RF power source device 100 can be attached to the housing 110 of the RF power source device 100, and the housing 110 of the RF power source device 100 can be attached to the top wall and / or rear wall of the cooling device 1.

[0130] In some preferred examples, when the RF power source device 100 is attached to the top wall and / or rear wall of the cooling device 1, the RF power source device 100 can be used... Figure 5 The layout shown is to save space in the cooling unit 1 to accommodate the radio frequency power source device 100.

[0131] Furthermore, the refrigeration equipment 1 may also include a condenser connected to the compressor 32.

[0132] In the prior art, both the condenser and the compressor 32 are located in the refrigeration circuit of the refrigeration equipment 1. The compressor 32 is adapted to compress the low-temperature, low-pressure gaseous refrigerant in the refrigeration circuit into a high-temperature, high-pressure gaseous refrigerant. The condenser is connected to the compressor 32 and is adapted to condense the high-temperature, high-pressure gaseous refrigerant from the compressor 32 into a low-temperature, high-pressure liquid refrigerant.

[0133] In this embodiment of the invention, the condenser is made of metal and has a large surface area, which is suitable for heat dissipation of the radio frequency power source device 100.

[0134] Figure 10 A schematic diagram illustrating the connection relationship between the radio frequency power source device and the condenser in an embodiment of the present invention.

[0135] like Figure 10 As shown, the radio frequency power source device 100 and the condenser 38 can be thermally connected through the heat-conducting component 39.

[0136] Specifically, the heat-conducting component 39 can be made of metal and is in direct contact with the housing 110 of the RF power source device 100 and the condenser 91, respectively. It is suitable for conducting the heat of the RF power source device 100 to the condenser 38 so as to dissipate heat from the RF power source device 100 through the condenser 38.

[0137] It is worth noting that in this embodiment of the invention, when the radio frequency power source device 100 is working, the cooling circuit in the cooling device 1 is closed, so that the condenser 38 does not work, and the temperature of the condenser 38 is close to or lower than the temperature when the radio frequency power source device 100 is working, so that heat can be conducted from the radio frequency power source device 100 to the condenser 38 and dissipated through the large surface area of ​​the condenser 38 itself.

[0138] Figure 11 This is a schematic block diagram of the refrigeration equipment in an embodiment of the present invention.

[0139] like Figure 11 As shown, the refrigeration device 1 includes a heating device 10, a refrigeration device user interface 40, and a refrigeration device control unit 50. The heating device 10 includes a radio frequency power source device 100 and a heating device 200.

[0140] Specifically, the user interface 40 of the refrigeration equipment is adapted to display the operating status information of the refrigeration equipment 1 and / or be operated to control the operation of the refrigeration equipment 1.

[0141] The refrigeration equipment control unit 50 is connected to the refrigeration equipment user interface 40 and the heating device 10 respectively, and is adapted to be triggered by the refrigeration equipment user interface 40 to provide power to the heating device 10 and / or to control the operation of the heating device 10.

[0142] In some specific examples, the refrigeration equipment control unit 50 may be connected to the radio frequency power source device 100 in the heating device 10 to provide power to the radio frequency power source device 100 and / or to control the operation of the radio frequency power source device 100.

[0143] Specifically, the cooling equipment control unit 50 can be connected to the power supply module in the radio frequency power source device 100 to provide a 220V AC voltage to the power supply module. The power converter 132 in the power supply module is used to convert the 220V AC voltage into a DC voltage and deliver it to the radio frequency power source module.

[0144] The cooling equipment control unit 50 can also be connected to the radio frequency power source module in the radio frequency power source device 100 to control the operation of the radio frequency power source module.

[0145] Reference Figure 11The radio frequency power source device 100 may also include a radio frequency control unit 160 for controlling the operation of the radio frequency power generator 124 and the radio frequency power amplifier 122.

[0146] In some specific examples, the radio frequency control unit 160 may be connected to the cooling equipment control unit 50 and is adapted to be triggered by the cooling equipment control unit 50 to control the operation of the radio frequency power generator 124 and the radio frequency power amplifier 122.

[0147] In other specific examples, the radio frequency control unit 160 may also be connected to the power converter 132 and adapted to provide the DC voltage from the power converter 132 to the radio frequency power generator 124 and the radio frequency power amplifier 122.

[0148] Reference Figure 11 The radio frequency power source device 100 may also include an input power switch 170 connected to the cooling device control unit 50.

[0149] The input power switch 170 can be used to control the power input of the power supply module 130 and / or the RF power source module 120 to reduce unnecessary power consumption generated by the RF power source device 100, thereby reducing the standby power consumption of the RF power source device 100.

[0150] In some specific examples, the input power switch 170 may include a relay circuit.

[0151] In other specific examples, the regulation and / or filtering unit in the heating device 200 may include a regulation subunit 261 connected to the radio frequency power amplifier 122 and the radio frequency antenna 230, respectively.

[0152] Specifically, the adjustment subunit 261 may include impedance matching elements to adjust the radio frequency power delivered by the radio frequency power amplifier 122 to the radio frequency antenna 230 and improve the transmission efficiency of the radio frequency power.

[0153] Reference Figure 11 The heating device 200 may also include a heating device door switch 281, and / or a heating device light 282, and / or a heating device fan 283.

[0154] Specifically, the heating equipment door switch 281 is connected to the door of the heating equipment 200 to control the opening and closing of the door 240 and / or the opening and closing state of the sensor door 240. The heating equipment lighting 282 is installed inside the processing chamber 221 to illuminate the processing chamber 221. The heating equipment fan 283 is installed inside the outer cavity 210 to dissipate heat from the electrical components in the heating equipment 200.

[0155] Reference Figure 11The conditioning and / or filtering unit may also include a filtering subunit 262 that is connected to the radio frequency control unit 160 and the conditioning subunit 261, respectively.

[0156] Specifically, the filtering subunit 262 can be connected to the user interface unit 270, the heating equipment door switch 281, the heating equipment light 282, and the heating equipment fan 283 respectively, and is used to eliminate the interference of radio frequency electromagnetic waves on the user interface unit 270, the heating equipment door switch 281, the heating equipment light 282, and the heating equipment fan 283, so as to ensure the normal operation of the user interface unit 270, the heating equipment door switch 281, the heating equipment light 282, and the heating equipment fan 283.

[0157] In some specific examples, the housing 110 of the RF power source module 100 and the outer cavity 210 of the heating device 200 may be made of metal to be suitable for shielding RF electromagnetic waves.

[0158] Furthermore, the housing 110 of the RF power source module 100 and the outer cavity 210 of the heating device 200 are both grounded to prevent leakage of RF electromagnetic waves and ensure safety.

[0159] Although specific embodiments have been described above, these embodiments are not intended to limit the scope of the invention, even when only a single embodiment is described with respect to a particular feature. The feature examples provided in this disclosure are intended to be illustrative and not limiting, unless otherwise stated. In practice, one or more technical features of the dependent claims may be combined with the technical features of the independent claims as needed and where technically feasible, and the technical features from the respective independent claims may be combined in any suitable manner rather than solely by the specific combinations listed in the claims.

[0160] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A radio frequency power source device (100), comprising a radio frequency power source module (120) and a heat dissipation medium, wherein, The radio frequency power source module (120) includes a first substrate (121) and a radio frequency power amplifier (122), characterized in that the radio frequency power amplifier (122) is attached to the heat dissipation medium and electrically connected to the first substrate (121); the first substrate (121) has a through hole (121a) corresponding to the radio frequency power amplifier (122), the through hole (121a) being adapted to solder the pin (122a) of the radio frequency power amplifier (122) to the first substrate (121).

2. The radio frequency power source device (100) according to claim 1, characterized in that, The heat dissipation medium includes a housing (110) for accommodating the radio frequency power source module (120) and adapted for thermal conduction.

3. The radio frequency power source device (100) according to claim 1, characterized in that, The heat dissipation medium includes a heat sink (140) located on the side of the radio frequency power amplifier (122) away from the first substrate (121).

4. The radio frequency power source device (100) according to claim 3, characterized in that, Includes a housing (110) for accommodating the radio frequency power source module (120) and the heat sink (140) and adapted for thermal conduction, wherein the heat sink (140) is attached to the housing (110).

5. The radio frequency power source device (100) according to claim 3, characterized in that, The device includes a housing (110) for accommodating the radio frequency power source module (120) and the heat sink (140) and a first fan (150) housed within the housing (110). The housing (110) is provided with a first air outlet (112), and the first fan (150) is adapted to direct heat from the radio frequency power source module (120) and / or the heat sink (140) to the first air outlet (112).

6. The radio frequency power source device (100) according to claim 5, characterized in that, Includes a power supply module (130) for supplying power to the radio frequency power source module (120), the power supply module (130) being located on the side of the first substrate (121) facing the heat sink (140).

7. The radio frequency power source device (100) according to claim 6, characterized in that, Both the radio frequency power source module (120) and the power supply module (130) have a first side (121b, 131a) facing away from the heat sink (140) and suitable for arranging electrical components. The first fan (150) is located on the same side of the radio frequency power source module (120), the heat sink (140) and the power supply module (130), and the airflow driven by the first fan (150) passes through the heat sink (140) and the electrical components.

8. The radio frequency power source device (100) according to any one of claims 1 to 5, characterized in that, Includes a power supply module (130) for supplying power to the radio frequency power source module (120), the power supply module (130) being arranged side by side with the first substrate (121) and located on the side of the first substrate (121) away from the radio frequency power amplifier (122).

9. The radio frequency power source device (100) according to any one of claims 1 to 5, characterized in that, It includes a power supply module (130) for supplying power to the radio frequency power source module (120), the power supply module (130) being arranged side by side with the first substrate (121).

10. A heating device (10), characterized in that, Includes the radio frequency power source device (100) as described in any one of claims 1 to 9.

11. A refrigeration device (1), characterized in that, Includes the heating device (10) as described in claim 10.

12. The refrigeration equipment (1) according to claim 11, characterized in that, Includes a device compartment (30) suitable for accommodating the radio frequency power source device (100).

13. The refrigeration equipment (1) according to claim 12, characterized in that, The equipment compartment (30) includes at least one wall (35) suitable for heat conduction.

14. The refrigeration equipment (1) according to claim 13, characterized in that, The housing (110) of the radio frequency power source device (100) is attached to the wall (35).

15. The refrigeration equipment (1) according to claim 13 or 14, characterized in that, The wall (35) is formed through the rear wall and / or side wall of the refrigeration device (1).

16. The refrigeration equipment (1) according to any one of claims 12-14, characterized in that, Includes a second fan (31) housed within the equipment compartment (30) and a second air inlet (341) and a second air outlet (342) disposed within the equipment compartment (30). The second fan (31) is adapted to generate an airflow suitable for heat dissipation within the equipment compartment (30) through the second air inlet (341) and the second air outlet (342).

17. The refrigeration equipment (1) according to claim 16, characterized in that, The radio frequency power source device (100) is closer to the second air inlet (341) than the second air outlet (342).

18. The refrigeration device (1) according to any one of claims 12-14, 17, characterized in that, The equipment compartment (30) is a compressor compartment.

19. The refrigeration equipment (1) according to claim 11, characterized in that, Includes a top wall and / or a rear wall suitable for thermal conduction, to which the radio frequency power source device (100) is attached.

20. The refrigeration equipment (1) according to claim 19, characterized in that, It includes a condenser (38) and a heat conductor (39), the heat conductor (39) being in contact with the radio frequency power source device (100) and the condenser (38) respectively, and being adapted to conduct heat from the radio frequency power source device (100) to the condenser (38).

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