Electromagnetic wave shielding film with wireless energy conversion function

Abstract

The present invention discloses an electromagnetic wave shielding film with a wireless energy conversion function, which is used to be attached to the outer surface of a microwave oven door to absorb the electromagnetic waves released by the microwave oven when it is running. The electromagnetic wave shielding film includes: a substrate carrier, which has a first light transmittance; a first substrate layer, which has a second light transmittance and is arranged on one side of the substrate carrier, and a wireless energy conversion unit is arranged on the first substrate layer. The wireless energy conversion unit is used to receive electromagnetic waves and convert the electromagnetic waves into direct current; and an optically variable assembly, which is arranged on the other side of the substrate carrier and electrically connected to the wireless energy conversion unit. The optically variable assembly includes an electrochromic layer and an electrode layer. The electrode layer is electrically connected to the wireless energy conversion unit and the electrochromic layer, and is used to receive the direct current of the wireless energy conversion unit and drive the electrochromic layer to change its light transmittance.

Description

Technical Field

[0001] The present invention relates to an electromagnetic wave shielding device, and in particular to an electromagnetic wave shielding film with a wireless energy conversion function. Background Art

[0002] As modern people are busy, many people choose to use microwave ovens to heat food, which is time-saving and convenient, making microwave ovens one of the necessities of daily life. The principle of microwave ovens is to use electrical energy to convert into high energy generated by microwaves, and to heat the food by friction of water molecules in the food. The high frequency and high permeability of microwaves make the food heat up quickly. However, a small amount of electromagnetic waves will be released during the operation of the microwave oven, and users may have concerns about the impact on their health during operation. In addition, if you look directly at the light emitted by the microwave oven when it is running, there is a risk of cataracts.

[0003] Therefore, most scholars, experts or microwave oven suppliers recommend that a certain distance should be maintained during the operation of the microwave oven. Anti-electromagnetic wave isolation cloth has also appeared on the market, claiming that it can effectively block electromagnetic waves if installed on the outside of the microwave oven door. However, most of these anti-electromagnetic wave isolation cloths only have the function of shielding electromagnetic waves, and the energy cannot be recovered and reused. Moreover, after installation, they also shield the oven door. Users cannot know whether there are any abnormal conditions in the internal environment of the microwave oven during operation. Summary of the invention

[0004] In view of this, the purpose of the present invention is to provide an electromagnetic wave shielding film with a wireless energy conversion function, which can be directly attached to the outer surface of the oven door of a microwave oven to receive electromagnetic waves from the microwave oven and convert the electromagnetic energy of the electromagnetic waves into direct current, so that the electromagnetic waves emitted by the microwave oven can be used regularly to obtain electrical energy when the microwave oven is running. In addition, the electromagnetic wave shielding film of the present invention can also display the operating status of the microwave oven, allowing users to confirm whether the microwave oven is operating normally.

[0005] In other words, the present invention can provide an electromagnetic wave shielding film with a wireless energy conversion function, which is used to be attached to the outer surface of the oven door of a microwave oven to absorb the electromagnetic waves released by the microwave oven when it is running. The electromagnetic wave shielding film includes: a substrate carrier, which has a first light transmittance; a first substrate layer, which has a second light transmittance and is arranged on one side of the substrate carrier, and a wireless energy conversion unit is arranged on the first substrate layer. The wireless energy conversion unit is used to receive electromagnetic waves and convert the electromagnetic waves into direct current; and an optically variable assembly, which is arranged on the other side of the substrate carrier and electrically connected to the wireless energy conversion unit. The optically variable assembly includes an electrochromic layer and an electrode layer, wherein the electrode layer is electrically connected to the wireless energy conversion unit and the electrochromic layer, and is used to receive direct current from the wireless energy conversion unit and drive the electrochromic layer to change its light transmittance; wherein the wireless energy conversion unit is an antenna assembly composed of multiple antenna units that can receive electromagnetic waves and an electric energy processing module; the antenna assembly is composed of multiple antenna units that can send and receive electromagnetic waves; each of the antenna units is arranged in an array and includes an energy transfer portion, a grounding portion, and a wiring portion arranged in a first substrate layer, and the energy transfer portion is composed of a first The metal circuit layer is arranged, the grounding part is arranged on the periphery of the energy transfer part and is arranged by the second metal circuit layer, the power processing module includes a rectifier filter device and a DC power supply part; the rectifier filter device is electrically connected to the energy transfer part of the antenna assembly, and is used to receive electromagnetic waves from the antenna assembly and perform rectification and filtering on the electromagnetic waves to become direct current; the DC power supply part is arranged by the third metal circuit layer, and is electrically connected to the rectifier filter device and the optically variable assembly, and is used to receive direct current and output it to the optically variable assembly; the wiring part in the antenna assembly The wiring part is configured between the energy transfer part and the grounding part, and in other areas outside the energy transfer part, the grounding part, and the DC power supply part. The wiring part includes a plurality of conductor elements, each of which maintains a first distance between them to be insulated from each other, and each of the conductor elements respectively maintains a second distance with the energy transfer part, the grounding part, the first DC power supply part, and the first DC power supply part to be insulated from each other; and the second light transmittance is between 50% and 95%, and the second light transmittance and the first light transmittance satisfy the following relationship: -10%≦T1-T2≦+10%.

[0006] According to one embodiment of the present invention, the electromagnetic wave shielding film also includes a real-time display unit electrically connected to the wireless energy conversion unit; the real-time display unit includes a display module and a sensing module; the sensing module is used to sense the temperature inside the microwave oven and record real-time images inside the microwave oven, and transmit them to the display module for real-time display.

[0007] According to one embodiment of the present invention, the real-time display unit further includes a microcontroller and a wireless transceiver module. The microcontroller is used to receive the temperature information measured by the sensing module and communicate with the microwave oven via the wireless transceiver module to control the operation of the microwave oven.

[0008] According to an embodiment of the present invention, the widths of the first metal circuit layer, the second metal circuit layer and the third metal circuit layer constituting the energy receiving portion, the grounding portion and the DC power supply portion are respectively equal to a fixed width or unequal to each other.

[0009] According to one embodiment of the present invention, the first metal circuit layer, the second metal circuit layer and the third metal circuit layer constituting the energy receiving portion, the grounding portion and the DC power supply portion are crisscrossed to form square grids, respectively, and the side lengths of the square grids are the same or different from each other.

[0010] According to an embodiment of the present invention, the first spacing between the conductor elements gradually increases from any one of the energy receiving portion, the grounding portion and the DC power supply portion to each outer edge of the substrate carrier, and gradually increases in an equidistant cumulative manner.

[0011] According to one embodiment of the present invention, the antenna assembly includes m antenna units, the power processing module includes m rectifier filter devices, the energy receiving part in each antenna unit and the DC power supply part in the power processing module are respectively connected to each rectifier filter device in series, or the energy receiving part in each antenna unit and the DC power supply part in the power processing module are respectively connected to each rectifier filter device in parallel to output power to the optically variable assembly, and m≧2.

[0012] According to an embodiment of the present invention, the energy receiving portion, the grounding portion, the DC power supply portion and the wiring portion are all disposed in the first substrate layer and are not in contact with the substrate carrier.

[0013] According to an embodiment of the present invention, the energy receiving portion, the grounding portion, the DC power supply portion and the wiring portion are all disposed in the first substrate layer and are in contact with the substrate carrier.

[0014] According to one embodiment of the present invention, the first substrate layer is respectively configured on the upper surface side and the lower surface side of the substrate carrier, the energy receiving part, the DC power supply part and the wiring part of the antenna unit are all arranged in the first substrate layer on the upper surface side, and the grounding part is arranged in the first substrate layer on the lower surface side.

[0015] According to one embodiment of the present invention, the energy receiving portion, the DC power supply portion and the wiring portion arranged on the upper surface side are not in contact with the substrate carrier, and the grounding portion arranged on the lower surface side is not in contact with the substrate carrier.

[0016] According to an embodiment of the present invention, the energy receiving portion, the DC power supply portion and the wiring portion disposed on the upper surface side are all in contact with the substrate carrier, and the grounding portion disposed on the lower surface side is in contact with the substrate carrier.

[0017] According to one embodiment of the present invention, the first metal circuit layer, the second metal circuit layer and the third metal circuit layer are respectively made of any material selected from indium tin oxide (ITO), graphene, nano silver paste, copper wire and silver-containing alloy, the substrate carrier and the first substrate layer are made of glass, polyethylene terephthalate (PET) or polyimide film (PI), and the first substrate layer is bonded to the substrate carrier by optical adhesive (OCA).

[0018] According to an embodiment of the present invention, the thickness of the first substrate layer is between 0.05 mm and 2 mm, and the sheet resistances of the first metal circuit layer, the second metal circuit layer, and the third metal circuit layer are respectively less than 2 ohms.

[0019] According to one embodiment of the present invention, the first substrate layer is made of glass, and a plurality of grooves are formed in the first substrate layer by physical or chemical etching. The first metal circuit layer, the second metal circuit layer, and the third metal circuit layer are respectively formed in the grooves by physical or chemical deposition to form the energy receiving portion, the grounding portion, and the DC power supply portion.

[0020] According to one embodiment of the present invention, the electromagnetic wave shielding film further includes a second substrate layer having the first light transmittance, the second substrate layer is arranged on the outermost side of the electromagnetic wave shielding film, and its hardness meets the pencil hardness specification >5H to protect the internal components of the electromagnetic wave shielding film from scratches or wear.

[0021] According to an embodiment of the present invention, the energy receiving portion further includes a signal feeding portion, and the signal feeding portion is a portion of the first metal circuit layer extending straight to the edge of the first substrate layer.

[0022] According to an embodiment of the present invention, the energy receiving portion further includes a filter resonant circuit, and the filter resonant circuit is configured in the first metal circuit layer so that the energy receiving portion can filter out harmonic energy while radiating energy.

[0023] According to an embodiment of the present invention, the filter resonant circuit is a one-step impedance resonant (SIR) structure, which is used to filter out the second-order harmonic or third-order harmonic energy.

[0024] According to an embodiment of the present invention, the substrate carrier is a flat plate structure, and the antenna assembly is a coplanar waveguide (CPW) fed planar antenna unit.

[0025] According to one embodiment of the present invention, the wireless energy conversion unit further includes an energy storage module connected to the DC power supply unit for storing the electric energy converted from the electromagnetic waves received by the antenna assembly. The detailed features and advantages of the present invention are described in detail in the following embodiments, and the content is sufficient for anyone familiar with the relevant art to understand the technical content of the present invention and implement it accordingly. According to the content disclosed in this specification, the claims and the drawings of the specification, any person skilled in the art can easily understand the relevant purposes and advantages of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram showing the configuration of the electromagnetic wave shielding film with wireless energy conversion function of the present invention.

[0027] Figure 2A It is a schematic diagram showing the top view of the electromagnetic wave shielding film with wireless energy conversion function of the present invention.

[0028] Figure 2B It is a diagram showing the radiation field pattern of the electromagnetic wave shielding film with wireless energy conversion function of the present invention when it is in operation.

[0029] Figure 3 A schematic diagram showing the configuration of a wireless energy conversion unit.

[0030] Figures 4A to 4G Schematic diagrams showing the cross-sectional configurations of the energy receiving portion 1224 , the grounding portion 1225 , the DC power supply portion 1227 and the wiring portion 1226 in different embodiments.

[0031] Figure 5A and 5B The schematic block diagrams respectively show various application embodiments of the electromagnetic wave shielding film with wireless energy conversion function of the present invention.

[0032] Wherein: 100: wireless energy conversion unit; 110: substrate carrier; 112, 112': first substrate layer; 120: antenna assembly; 122: antenna unit; 1224: energy receiving part; 1225: grounding part; 1226: wiring part; 124: second substrate layer; 130: power processing module; 131: rectifier filter device; 1227: DC power supply part; 140: power storage module; 150: optically variable assembly; 151: electrochromic layer; 152: electrode layer; 1521: first electrode layer; 1522: second electrode layer; 400: real-time display unit; 410: display module; 420: sensing module; 430: microcontroller; 440: wireless transceiver module; P: microwave oven. DETAILED DESCRIPTION

[0033] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation methods of the present invention are now described in detail with reference to the accompanying drawings. The detailed description and technical content of the invention are described as follows with the accompanying drawings. However, the accompanying drawings are only provided for reference and explanation, and are not used to limit the present invention. The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, such as "up", "down", "left", "right", "front", "back", etc., are only reference to the directions of the attached drawings. Therefore, the directional terms used are used for explanation, not for limiting the present invention; furthermore, in the following embodiments, the same or similar components will use the same or similar component numbers.

[0034] Please refer to Figure 1 and Figure 2A , which are schematic diagrams showing the configuration and top view of the electromagnetic wave shielding film with wireless energy conversion function of the present invention. In this embodiment, the electromagnetic wave shielding film includes a substrate carrier 110, a first substrate layer 112, and an optically variable assembly 150. The first substrate layer 112 is provided with a wireless energy conversion unit 100.

[0035] Specifically, the electromagnetic wave shielding film is a multilayer structure composed of at least a substrate carrier 110, a first substrate layer 112, and an optically variable assembly 150, and the first substrate layer 112 and the optically variable assembly 150 are respectively arranged on different side surfaces of the substrate carrier 100; the wireless power conversion unit 100 in the first substrate layer 112 includes an antenna assembly 120 and an electric energy processing module 130, and the optically variable assembly 150 is electrically connected to the electric energy processing module 130.

[0036] The substrate carrier 110 has a first transmittance T1 and is implanted with an electrical active area and a non-electrical active area; the first substrate layer 111 has a second transmittance T2, the second transmittance T2 is between 50% and 95%, and the difference (T1-T2) between the second transmittance T2 and the first transmittance T1 is between -10% and +10%, preferably between -5% and +5%.

[0037] The antenna assembly 120 in the wireless energy conversion unit is a plurality of antenna units 122 arranged in an array. The antenna units 122 are mainly formed in the first substrate layer 112 by physical or chemical deposition methods to receive electromagnetic waves from the microwave oven or the external environment and transmit the electromagnetic waves to the power processing module 130; the power processing module 130 can convert the electromagnetic waves into direct current for the operation of the optically variable assembly 150. Therefore, the electromagnetic wave shielding film of the present invention is preferably used to place the first substrate layer 112 toward the oven door of the microwave oven, thereby improving the efficiency of electromagnetic wave absorption, and the optically variable assembly 150 is facing the user.

[0038] To further illustrate, the optically variable assembly 150 includes an electrochromic layer 151 and an electrode layer 152. The electrode layer 152 is electrically connected to the power processing module 130 and the electrochromic layer 151, and can receive power transmitted from the wireless power conversion unit 100 to drive the electrochromic layer 151 to change the optical properties of the transmitted light, such as changing the wavelength or transmittance, that is, adjusting the color or brightness of the transmitted light.

[0039] like Figure 2A As shown, in this embodiment, the transparent substrate carrier 110 includes a first surface S1 and a second surface S2 opposite to each other, the first substrate layer 112 and the optically variable assembly 150 are respectively disposed on the first surface S1 and the second surface S2, the electrode layer 152 includes a first electrode 1521 and a second electrode 1522, the electrochromic layer 151 is located between the first electrode 1521 and the second electrode 1522, and the first electrode 1421 and the second electrode 1422 are respectively electrically connected to the power processing module 130. The power processing module 130 transmits electrical energy to the first electrode 1521 and the second electrode 1522, and the first electrode 1521 and the second electrode 1522 apply voltage to the electrochromic layer 151 to change the color of the optical property variable layer 141. In this embodiment, the color change also includes a change in the transmittance of the electrochromic layer 151; for example, before applying voltage, the transmittance of the optically variable assembly 150 is preferably above 90%, and after applying voltage, the transmittance of the optically variable assembly 150 is generally between 15% and 60%, preferably between 30% and 60%, which can reduce the harm caused by the light emitted by the microwave oven.

[0040] In addition, the first electrode 1521 in the electrode layer 152 also has the function of reflecting electromagnetic waves. Figure 2B As shown, it is a diagram showing the radiation field pattern of the electromagnetic wave shielding film of the present invention when it is in operation. The first electrode 1521 can be used as a reflecting surface of the antenna assembly 120, so that the electromagnetic waves emitted by the microwave oven can be more concentrated toward the antenna assembly 120, thereby reducing the amount of electromagnetic wave radiation radiated to the outside world.

[0041] Next, please refer to Figure 2A Also refer to Figure 3 , Figure 3 To show the configuration diagram of the wireless energy conversion unit 100, the antenna unit 122 in the antenna assembly 120 includes an energy receiving portion 1224, a grounding portion 1225, and a wiring portion 1226, wherein the energy receiving portion 1224 is a metal circuit layer configured in the electrical action area and having a third light transmittance; the grounding portion 1225 is a second metal circuit layer configured in the electrical action area and disposed on the periphery of the energy receiving portion 1224 and having a third light transmittance. In addition, the power processing module 130 includes at least one rectifying filter device 131 and a DC power supply portion 1227 electrically connected to the rectifying filter device 131, the rectifying filter device 131 is electrically connected to the energy receiving portion 1224 of the antenna assembly 120, and receives electromagnetic waves from indoors or outdoors through the energy receiving portion 1224 and performs rectification and filtering on the electromagnetic waves to become DC power, and then outputs power through the DC power supply portion 1227. The DC power supply part 1227 is a third metal circuit layer configured in the electrical active area and having a third transmittance. The DC power supply part 1227 is connected to the optically variable assembly 150 to supply power. The wiring part 1226 is configured in the non-electrical active area, and the wiring part 1226 is a plurality of conductor elements configured between the transceiver 1224 and the grounding part 1225, and in other areas outside the energy receiving part 1224, the grounding part 1225, and the DC power supply part 1227 and having a third transmittance. A first distance d1 is maintained between each conductor element to insulate each other, and a second distance d2 is maintained between each conductor element and the energy receiving part 1224, the grounding part 1225, and the DC power supply part 1227 to insulate each other. The energy receiving portion 1224 , the grounding portion 1225 and the DC power supply portion 1227 are respectively a square grid-shaped metal circuit layer, and the grid-shaped spacings are the same, and the first spacing d1 and the second spacing d2 are respectively a fixed spacing and are equal to each other.

[0042] According to another embodiment of the present invention, the first spacing d1 is a non-fixed spacing, and the second spacing d2 is a fixed spacing. It is explained here that the first spacing d1 of the non-fixed spacing is mainly formed from any one of the energy receiving portion 1224, the grounding portion 1225 and the DC power supply portion 1227 to the outer edges of the substrate carrier 110, and the length of each increase is the same, for example: the first spacing d1 of the wiring portion 1226 adjacent to the grounding portion 1225 gradually increases by 1 μm at each interval toward the outer edge.

[0043] As mentioned above, the energy receiving part 1224, the grounding part 1225 and the DC power supply part 1227 may have a specific pattern, and the area between the energy receiving part 1224, the grounding part 1225 and the DC power supply part 1227 (electrical active area) and the wiring part 1226 (non-electrical active area) may have substantially the same light transmittance. For some special design requirements, the energy receiving part 1224, the grounding part 1225 and the DC power supply part 1227 may also have a different light transmittance from the wiring part 1226. In addition, the pattern of the energy receiving part 1224, the grounding part 1225, the DC power supply part 1227 and the wiring part 1226 is not limited, as long as the electrical active area and the non-electrical active area can be separated, and it can be any shape.

[0044] According to an embodiment of the present invention, the energy receiving portion 1224 further includes a signal feeding portion (not shown), and the signal feeding portion is a portion of the metal mesh extending straight to the edge of the substrate carrier 110 .

[0045] The antenna unit 122 may be an antenna array circuit, and the antenna array circuit is a plurality of antenna circuits arranged in an array, and these circuits are integrated into one, and other identical or similar elements are not repeated. In addition, the antenna array circuit includes a plurality of antennas arranged in an array, and each antenna group includes two energy receiving parts 1224 and a grounding part 1225. A gap G is formed between each grounding part 1224, so that the area of ​​the grounding part 1225 of each antenna is reduced, and a better electromagnetic wave conversion energy receiving efficiency can be obtained.

[0046] Furthermore, the antenna unit 122 of the present invention may also be composed of a plurality of dipole antenna groups, each of which includes a pair of symmetrically placed conductors, and the two ends of the conductors close to each other are respectively connected to the feeder. When the dipole antenna groups are used as transmitting antennas, the electrical signal is fed into the conductor from the center of the antenna; and when the dipole antenna groups are used as receiving antennas, the received signal is also obtained from the conductor at the center of the antenna. The dipole antenna group and the diode can receive electromagnetic waves of different polarity directions through series-parallel connection, and the conversion efficiency can be adjusted through series-parallel connection.

[0047] Based on the above embodiments, please refer to FIGS. 4A-4C , which are schematic cross-sectional configuration diagrams showing the energy receiving portion 1224 , the grounding portion 1225 , the DC power supply portion 1227 and the wiring portion 1226 in different embodiments.

[0048] like Figure 4A In the embodiment shown, the substrate carrier 110 has an upper surface side S1 and a lower surface side S2 on the opposite side, and the first substrate layers 112 and 112' are respectively arranged on the upper surface side S1 and the lower surface side S2, the energy receiving portion 1224, the wiring portion 1226 and the DC power supply portion 1227 of the power processing module 130 in the antenna assembly 120 are respectively arranged on the surface of the first substrate layer 112 away from the substrate carrier 110, and the grounding portion 1225 in the antenna assembly 120 is arranged on the surface of the first substrate layer 112' away from the substrate carrier 110; furthermore, the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 are not in contact with the substrate carrier 110.

[0049] like Figure 4B In the embodiment shown, the substrate carrier 110 has the upper surface side S1 and the lower surface side S2 on the opposite side, and the first substrate layers 112 and 112' are respectively arranged on the upper surface side S1 and the lower surface side S2, the energy receiving part 1224, the wiring part 1226 and the DC power supply part 1227 of the power processing module 130 in the antenna assembly 120 are respectively arranged inside the first substrate layer 112, and the grounding part 1225 in the antenna assembly 120 is arranged inside the first substrate layer 112'; furthermore, the energy receiving part 1224, the grounding part 1225, the wiring part 1226 and the DC power supply part 1227 are not in contact with the substrate carrier 110.

[0050] like Figure 4C In the embodiment shown, the substrate carrier 110 has an upper surface side S1 and an opposite lower surface side S2, and the first substrate layers 112 and 112' are respectively arranged on the upper surface side S1 and the lower surface side S2, the energy receiving portion 1224, the wiring portion 1226 and the DC power supply portion 1227 of the power processing module 130 in the antenna assembly 120 are respectively arranged on the surface of the first substrate layer 112 adjacent to the substrate carrier 110, and the grounding portion 1225 in the antenna assembly 120 is arranged on the surface of the first substrate layer 112' adjacent to the substrate carrier 110, and the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 are all in contact with the substrate carrier 110.

[0051] Please refer to 4D-4F, which are schematic cross-sectional views of the energy receiving portion 1224, the grounding portion 1225, the DC power supply portion 1227, and the wiring portion 1226 in different embodiments:

[0052] like Figure 4D In the embodiment shown, the substrate carrier 110 has an upper surface side S1 and an opposite lower surface side S2, and the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 of the power processing module 130 are respectively arranged on the surface of the first substrate layer 112 away from the substrate carrier 110, and the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 are not in contact with the substrate carrier 110.

[0053] like Figure 4E In the embodiment shown, the substrate carrier 110 has the upper surface side S1 and the lower surface side S2 on the opposite side, and the first substrate layer 112 is only arranged on the upper surface side S1, and the energy receiving part 1224, the grounding part 1225, the wiring part 1226 and the DC power supply part 1227 of the power processing module 130 in the antenna assembly 120 are respectively arranged inside the first substrate layer 112; furthermore, the energy receiving part 1224, the grounding part 1225, the wiring part 1226 and the DC power supply part 1227 are not in contact with the substrate carrier 110.

[0054] like Figure 4F In the embodiment shown, the substrate carrier 110 has an upper surface side S1 and an opposite lower surface side S2, and the first substrate layer 112 is only arranged on the upper surface side S1, and the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 of the power processing module 130 in the antenna assembly 120 are respectively arranged on the surface of the first substrate layer 112 adjacent to the substrate carrier 110, and the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 are all in contact with the substrate carrier 110.

[0055] The first substrate layer 112 is detachably combined with the substrate carrier 110. For example, the first substrate layer 112 is adhesive and can be attached to the substrate carrier 110. Specifically, the first substrate layer 112 is attached to the upper surface side and the lower surface side of the substrate carrier 110 through optical adhesive (OCA).

[0056] In addition, the energy receiving portion 1224, the grounding portion 1225, the wiring portion 1226 and the DC power supply portion 1227 are film layers made of any of the materials selected from indium tin oxide (ITO), graphene, nano silver paste, copper wire or silver-containing alloy and patterned; the substrate carrier 110 and the first substrate layer 112 can be made of polyethylene terephthalate (PET) or polyimide film (PI), respectively, but are not limited to this.

[0057] According to an embodiment of the present invention, the first substrate layer 112 has a predetermined thickness, preferably between 0.05 mm and 2 mm, and the square resistance of the metal circuit layer serving as the energy receiving portion 1224 and the grounding portion 1225 is less than 2 ohms, but is not limited thereto.

[0058] Please refer to Figure 4G , its Figure 2A The structure of is used as an example to illustrate the cross-sectional structure of another embodiment of the present invention; in this embodiment, Figure 2A The main difference of the structure shown is that a second substrate layer 124 having the first light transmittance is further provided on the outermost surface of the electromagnetic wave shielding film, and the second substrate layer 124 can be respectively covered on the first substrate layer 112 and / or the outermost surface of the optically variable assembly 150 to prevent the antenna assembly 120, the power processing module 130, and the optically variable assembly 150 from being scratched or worn, wherein the second substrate layer 124 can be a protective layer that meets the pencil hardness specification>5H, for example, made of silicon nitride hardening coating or PET material. Supplementary explanation, Figures 4B-4F The structures described in the various embodiments shown may also include the second substrate layer 124 , which will not be described in detail herein.

[0059] In the above-mentioned embodiments, the wiring part 1226 mainly includes a plurality of conductor elements, each of which is light-transmissive and electrically insulated between the conductor layers. The conductor elements are electrically insulated by being spaced a predetermined distance apart, that is, a short circuit is formed between the conductor elements. In addition, due to the electrically insulated structure between the above-mentioned conductor elements, the wiring part 1226 itself cannot collect electromagnetic waves. The purpose of setting the wiring part 1226 is mainly to make the difference in light transmittance of each part not too large or even the same when light passes through the antenna unit 122 of the present invention. For example, the antenna unit 122 is formed on the first substrate layer 112. When light passes through the transparent substrates and the antenna unit 122, it has light transmittance. In the case where the wiring portion 1226 is not provided, the area between the two antennas has only the first substrate layer 112. Therefore, when light only passes through the first substrate layer 112, the light transmittance will be significantly higher than the light transmittance when the wiring portion 1226 is provided. In this way, when the antenna unit 122 of the present invention is visually attached to the substrate carrier 110, different light and dark areas will be produced, which will affect the original visual effect of the substrate carrier. Therefore, in the case of providing a transparent wiring portion 1226, when the antenna unit of the present invention is applied to the substrate carrier 110, the area provided with the wiring portion 1226 and by appropriately designing the pattern of the wiring portion 1226, after the light passes through the wiring portion 1226 and the first substrate layer 112, the problem of generating different light and dark areas can be greatly reduced, so that even if the substrate carrier 110 is attached with the antenna unit of the present invention, it will not affect the visual effect originally intended to be presented by the substrate carrier 110. In addition, an ink layer (not shown) can be further provided on the surface of the transceiver portion 1224, the grounding portion 1225, the wiring portion 1226, and the DC power supply portion 1227 away from the first substrate layer 112. The ink layer is mainly used to weaken the metal color in the transceiver portion 1224, the grounding portion 1225, the wiring portion 1226, and the power supply portion 1227. For example, if the metal line made of silver paste is gray in color, the ink with relatively low light transmittance can be used to darken the color to achieve a consistency effect.

[0060] In other embodiments of the present invention, the antenna assembly 120 may include m groups (m≧2) of the antenna units 122, the power processing module 130 may include m rectifier filter devices 131, and the energy receiving portion 1224 in each of the antenna units 122 and the DC power supply portion 1227 of the power processing module 130 may be connected in parallel to each of the rectifier filter devices; or the energy receiving portion 1224 in each of the antenna units 122 and the DC power supply portion 1227 of the power processing module 130 may be connected in series to each of the rectifier filter devices to output to the optically variable assembly 150. In addition, the above connection form may also be a combination of series and parallel.

[0061] According to the electromagnetic wave shielding films described in the above embodiments, the substrate carrier 110 may be a flat plate structure, and the antenna assembly 120 is a planar antenna unit fed by a coplanar waveguide (CPW).

[0062] In addition, since the front end of the antenna often contains nonlinear devices such as amplifiers, a large number of harmonic components will be generated. If the antenna does not have the function of harmonic suppression, the harmonic energy will be emitted through the antenna, causing serious electromagnetic interference; or the harmonic energy will enter the system through the receiving antenna, causing the system performance to deteriorate. Therefore, based on the antenna unit of the above embodiments, the energy receiving unit 1224 further includes a filter resonant circuit, which is configured in the metal line layer with the second transmittance, and the filter resonant circuit and the energy receiving unit 1224 are structurally integrated and designed, so that the antenna unit can filter out harmonic energy while radiating energy. In this embodiment, the filter resonant circuit embedded in the antenna unit can be a U-shaped resonant structure, and the length of the resonant structure satisfies the band-stop filtering effect of a specific frequency that can be formed by a quarter of the wavelength of the resonant frequency, which can effectively suppress the effect of second-order harmonics or third-order harmonic energy, and improve the efficiency of electromagnetic wave to direct current conversion.

[0063] Also, see Figure 5A and 5B , which is a diagram showing the architecture configuration of other embodiments of the present invention. Figure 5A In the embodiment shown, the electromagnetic wave shielding film further includes an energy storage module 140 and a real-time display unit 400. The energy storage module 140 is electrically connected to the energy processing module 130 to store direct current from the energy processing module 130 and supply power to the optical property variable module 150 and the real-time display unit 400. The real-time display unit 400 includes at least a display module 410 and a sensing module 420. The sensing module 420 is arranged on the side of the electromagnetic wave shielding film or the outer surface of the first substrate layer 112, and can sense the temperature inside the microwave oven P and record the real-time image inside the microwave oven and transmit it to the display module 410; the display module 410 can be a low-power liquid crystal display (LCD) or an electronic paper display, and is arranged on the outer surface of the optical property variable module, and can display the temperature information and image inside the microwave oven P in real time, so that the user can confirm the operation of the microwave oven.

[0064] Again, in Figure 5BIn the embodiment shown, the real-time display unit 400 further includes a microcontroller 430 and a wireless transceiver module 440. The microcontroller 430 is used to receive the temperature information measured by the sensing module 420, and can communicate with the microwave oven P via the wireless transceiver module 440 to control the operation of the microwave oven. When the sensing module 420 detects that the temperature inside the microwave oven P is abnormal, the microcontroller 430 can issue a control command to stop the operation of the microwave oven P, thereby avoiding abnormal hazards.

[0065] In the aforementioned embodiment, the rectifier filter device 131 and the power storage module 140 in the power processing module 130 are arranged in the first substrate layer 111, but this is not limited to it. Since the rectifier filter device 131 and the power storage module 140 are not necessarily made of transparent materials, they can be arranged on the side of the first substrate layer and / or the substrate carrier 110 instead of on the first substrate layer 111, so as not to affect the transmittance and aesthetics.

[0066] To sum up, the electromagnetic wave shielding film of the present invention has three major functions of electromagnetic wave shielding, electromagnetic wave recovery, and electromagnetic wave reuse. It can convert the electromagnetic waves emitted by the microwave oven (the front of the oven door or the upper, lower, left and right door gaps) into direct current through the antenna assembly. This electric energy can be used to drive the optically variable assembly and the real-time display unit, thereby protecting the user's safety in use.

[0067] Although the technical contents of the present invention have been disclosed as above in the form of preferred embodiments, they are not intended to limit the present invention. Any slight changes and modifications made by any person skilled in the art without departing from the spirit of the present invention should be included in the scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the appended claims.

Claims

1. An electromagnetic wave shielding film with wireless energy conversion function, characterized in that: Used to be attached to the outer surface of the oven door of a microwave oven to absorb the electromagnetic waves released by the microwave oven when it is running. The electromagnetic wave shielding film includes: A substrate carrier having a first light transmittance; A first substrate layer is disposed on one side of the substrate carrier and has a second light transmittance between 50% and 95%. A wireless energy conversion unit is disposed in the first substrate layer, and the wireless energy conversion unit is used to receive electromagnetic waves and convert the electromagnetic waves into direct current; and An optically variable assembly is disposed on the other side of the substrate carrier and electrically connected to the wireless energy conversion unit. The optically variable assembly includes an electrochromic layer and an electrode layer. The electrode layer is electrically connected to the wireless energy conversion unit and the electrochromic layer to receive direct current from the wireless energy conversion unit and drive the electrochromic layer to change its light transmittance; wherein The wireless energy conversion unit is an antenna assembly composed of a plurality of antenna units capable of receiving electromagnetic waves and an electric energy processing module; The antenna assembly is composed of a plurality of antenna units capable of transmitting and receiving electromagnetic waves; each of the antenna units is arranged in an array and comprises an energy receiving portion, a grounding portion, and a wiring portion disposed in the first substrate layer; the energy receiving portion is formed by laying out a first metal circuit layer, and the grounding portion is disposed outside the energy receiving portion and is formed by laying out a second metal circuit layer. The power processing module includes a rectifying filter device and a DC power supply unit; the rectifying filter device is electrically connected to the energy receiving unit of the antenna assembly, and is used to receive electromagnetic waves from the antenna assembly and perform rectification and filtering on the electromagnetic waves to become DC power; the DC power supply unit is formed by laying out the third metal circuit layer, and is electrically connected to the rectifying filter device and the optically variable assembly, and is used to receive DC power and output it to the optically variable assembly; The wiring portion in the antenna assembly is arranged between the energy receiving portion and the grounding portion, and arranged in other areas outside the energy receiving portion, the grounding portion, and the DC power supply portion. The wiring portion includes a plurality of conductor elements, each of which maintains a first distance between them to be insulated from each other, and each of the conductor elements maintains a second distance between them and the energy receiving portion, the grounding portion, and the DC power supply portion to be insulated from each other; and The second light transmittance T2 of the first substrate layer and the first light transmittance T1 of the substrate carrier meet the following relationship: -10%≦T1-T2≦+10%.

2. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: It also includes a real-time display unit electrically connected to the wireless energy conversion unit; the real-time display unit includes a display module and a sensing module; the sensing module is used to sense the temperature inside the microwave oven and record the real-time image inside the microwave oven, and transmit it to the display module for real-time display.

3. The electromagnetic wave shielding film with wireless energy conversion function according to claim 2, characterized in that: The real-time display unit also includes a microcontroller and a wireless transceiver module. The microcontroller is used to receive the temperature information measured by the sensing module and communicate with the microwave oven via the wireless transceiver module to control the operation of the microwave oven.

4. According to claim 1, the electromagnetic wave shielding film with wireless energy conversion function, wherein the widths of the first metal circuit layer constituting the energy receiving part, the second metal circuit layer constituting the grounding part, and the third metal circuit layer constituting the DC power supply part are respectively a fixed width equal to each other or unequal to each other.

5. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The first metal circuit layer constituting the energy receiving portion, the second metal circuit layer constituting the grounding portion and the third metal circuit layer constituting the DC power supply portion are crisscrossed to form square grids respectively, and the side lengths of the square grids are the same or different.

6. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The first spacing between the conductor elements gradually increases from any one of the energy receiving portion, the grounding portion and the DC power supply portion to each outer edge of the substrate carrier, and gradually increases in an equidistant cumulative manner.

7. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The energy receiving portion, the grounding portion, the DC power supply portion and the wiring portion are all arranged in the first substrate layer and are not in contact with the substrate carrier.

8. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The energy receiving portion, the grounding portion, the DC power supply portion and the wiring portion are all arranged in the first substrate layer and are in contact with the substrate carrier.

9. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The first substrate layer is respectively arranged on the upper surface side and the lower surface side of the substrate carrier, the energy receiving part, the DC power supply part and the wiring part are all arranged in the first substrate layer on the upper surface side, and the grounding part is arranged in the first substrate layer on the lower surface side.

10. The electromagnetic wave shielding film with wireless energy conversion function according to claim 9, characterized in that: The energy receiving portion, the DC power supply portion and the wiring portion arranged on the upper surface side are not in contact with the substrate carrier, and the grounding portion arranged on the lower surface side is not in contact with the substrate carrier.

11. The electromagnetic wave shielding film with wireless energy conversion function according to claim 9, characterized in that: The energy receiving portion, the DC power supply portion and the wiring portion disposed on the upper surface side are all in contact with the substrate carrier, while the grounding portion disposed on the lower surface side is in contact with the substrate carrier.

12. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The first metal circuit layer, the second metal circuit layer and the third metal circuit layer are respectively made of any material selected from indium tin oxide ITO, graphene, nano silver paste, copper wire and silver-containing alloy. The substrate carrier and the first substrate layer are made of any material selected from glass, polyethylene terephthalate PET or polyimide film PI, and the first substrate layer is bonded to the substrate carrier by optical adhesive OCA.

13. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The thickness of the first substrate layer is between 0.05 mm and 2 mm, and the square resistances of the first metal circuit layer, the second metal circuit layer and the third metal circuit layer are respectively less than 2 ohms.

14. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The first substrate layer is made of glass, and a plurality of grooves are formed in the first substrate layer by physical or chemical etching. The first metal circuit layer, the second metal circuit layer, and the third metal circuit layer are respectively formed in the grooves by physical or chemical deposition to form the energy receiving portion, the grounding portion, and the DC power supply portion.

15. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: It also includes a second substrate layer with the first light transmittance, which is arranged on the outermost side of the electromagnetic wave shielding film and has a hardness that meets the pencil hardness specification of >5H to protect the internal components of the electromagnetic wave shielding film from scratches or wear.

16. The electromagnetic wave shielding film with wireless energy conversion function according to claim 1, characterized in that: The energy receiving part further includes a filter resonant circuit, and the filter resonant circuit is configured in the first metal circuit layer, so that the energy receiving part can filter out harmonic energy while radiating energy. 17 . The electromagnetic wave shielding film with wireless energy conversion function according to claim 1 , wherein the wireless energy conversion unit further comprises an electric energy storage module connected to the DC power supply unit for storing electric energy converted from electromagnetic waves received by the antenna assembly.

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