Substrate conveying device, substrate processing system, substrate conveying method, electronic device manufacturing method and storage medium

Abstract

The present invention relates to conveying a substrate cut out from a large substrate, and suppressing deviations in conveying positions caused by differences in cutting positions. A substrate conveying device comprises: a conveying component that conveys any one of a plurality of substrates obtained by cutting a large substrate to a handover position in a processing device, and hands over the substrate to a substrate support component provided in the processing device; and a control component that controls the conveying component. An acquisition component acquires substrate information related to a position of the substrate conveyed by the conveying component in the large substrate before cutting. The control component causes the conveying component to convey the substrate to the handover position based on the substrate information acquired by the acquisition component.

Description

Technical Field

[0001] The invention relates to a substrate conveying device, a substrate processing system, a substrate conveying method, a method for manufacturing an electronic device and a storage medium. Background Art

[0002] In the manufacture of organic EL displays and the like, a substrate is subjected to a predetermined process such as a film forming process for forming a film of a vapor deposition substance on the substrate. When such a process is performed, the substrate is transported to various processing devices such as a film forming device by a transport robot or the like. Patent document 1 discloses that a transport robot transports a substrate to a taught transport position.

[0003] Prior Art Literature

[0004] Patent Literature:

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-153775 Summary of the invention

[0006] Problems to be solved by the invention

[0007] Organic EL displays are manufactured by forming multiple layers on a substrate using various film-forming processes. At this time, depending on the situation of the production line, a large substrate (also called base glass) is sometimes processed until a certain process, and then the large substrate is cut and divided into multiple smaller substrates, and the divided substrates are subjected to film-forming and other processes in subsequent processes. For example, in the manufacture of organic EL displays for smartphones, a 6th generation large substrate (about 1500mm×about 1850mm) is subjected to film-forming processes in the backplane process (TFT formation process, anode formation process, etc.). Afterwards, the large substrate is cut into two halves to form a 6th generation half-cut substrate (about 1500mm×about 925mm), and the 6th generation half-cut substrate is subjected to film-forming and other processes in subsequent processes.

[0008] In such a case, substrates cut from a large substrate at different positions are sequentially fed into a processing device used in a process subsequent to the splitting process. However, for substrates cut from a large substrate, the characteristics of the substrates such as size and rigidity distribution may differ depending on which part of the large substrate they are cut from (for example, depending on whether it is the left half or the right half of the base glass). If the characteristics of the substrates are different, differences may occur in the way the substrates slide when the substrates are transported while being placed on a transport robot, etc., which may sometimes cause deviations in the position of the substrates when they are fed into the processing device.

[0009] The present invention provides a technology for conveying a substrate cut out from a large substrate and suppressing deviation of the conveying position due to differences in the cutting positions.

[0010] Means for solving problems

[0011] According to one aspect of the present invention, there is provided a substrate conveying device, the substrate conveying device comprising:

[0012] a transport member that transports a substrate cut out from a large substrate to a delivery position in a processing device and delivers the substrate to a substrate support member provided in the processing device; and

[0013] a control component, which controls the conveying component,

[0014] It is characterized in that

[0015] The substrate conveying device includes an acquisition unit that acquires substrate information related to a portion of the large substrate from which the substrate is cut out.

[0016] The control unit causes the transport unit to transport the substrate to the delivery position based on the substrate information acquired by the acquisition unit.

[0017] According to another aspect of the present invention, there is provided a substrate conveying device, the substrate conveying device comprising:

[0018] a transport member that transports any one of the plurality of substrates obtained by dividing the large substrate to a delivery position in the processing device and delivers the substrate to a substrate support member provided in the processing device; and

[0019] a control component, which controls the conveying component,

[0020] It is characterized in that

[0021] The substrate conveying device includes an acquisition unit that acquires substrate information related to a portion of the large substrate before being divided, of the substrate conveyed by the conveying unit.

[0022] The control unit causes the transport unit to transport the substrate to the delivery position that differs according to the substrate information acquired by the acquisition unit.

[0023] According to another aspect of the present invention, there is provided a substrate processing system, the substrate processing system comprising:

[0024] A processing device including a substrate support member for supporting any one of a plurality of substrates obtained by dividing a large substrate, and processing the substrate supported by the substrate support member;

[0025] a conveying member that conveys the substrate to a delivery position in the processing device and delivers the substrate to the substrate supporting member; and

[0026] a control component, which controls the conveying component,

[0027] It is characterized in that

[0028] The substrate processing system includes an acquisition unit that acquires substrate information related to a portion of the large substrate before being divided, of the substrate conveyed by the conveying unit.

[0029] The control unit causes the transport unit to transport the substrate to the delivery position based on the substrate information acquired by the acquisition unit.

[0030] According to another aspect of the present invention, there is provided a substrate processing system, the substrate processing system comprising:

[0031] A processing device including a substrate support member for supporting any one of a plurality of substrates obtained by dividing a large substrate, and processing the substrate supported by the substrate support member;

[0032] a conveying member that conveys the substrate to a delivery position in the processing device and delivers the substrate to the substrate supporting member; and

[0033] a control component, which controls the conveying component,

[0034] It is characterized in that

[0035] The substrate processing system includes an acquisition unit that acquires substrate information related to a relative position of the substrate conveyed by the conveying unit with respect to the large substrate before being divided.

[0036] The control unit causes the transport unit to transport the substrate to the delivery position that differs according to the substrate information acquired by the acquisition unit.

[0037] According to another aspect of the present invention, there is provided a substrate conveying method, the substrate conveying method comprising a conveying step, in which any one of a plurality of substrates obtained by dividing a large substrate is conveyed to a delivery position in a processing device, and the substrate is delivered to a substrate support member provided in the processing device,

[0038] It is characterized in that

[0039] The method comprises an acquisition step of acquiring substrate information related to a portion of the large substrate before the substrate is divided.

[0040] In the conveying step, the substrate is conveyed to the handover position based on the substrate information acquired in the acquiring step.

[0041] According to another aspect of the present invention, there is provided a substrate conveying method, the substrate conveying method comprising a conveying step, in which any one of a plurality of substrates obtained by dividing a large substrate is conveyed to a delivery position in a processing device, and the substrate is delivered to a substrate support member provided in the processing device,

[0042] It is characterized in that

[0043] The method comprises an acquisition step of acquiring substrate information related to a portion of the large substrate before the substrate is divided.

[0044] In the conveying step, the substrate is conveyed to the delivery position that differs according to the substrate information acquired in the acquiring step.

[0045] In addition, according to another aspect of the present invention, there is provided a method for manufacturing an electronic device, characterized in that the manufacturing method comprises:

[0046] A conveying step of conveying a substrate by the substrate conveying method in the above manner; and

[0047] A film forming step of forming a film on the substrate transported to the film forming apparatus as the processing apparatus in the transport step.

[0048] According to another aspect of the present invention, there is provided a computer-readable storage medium, characterized in that a program for causing a computer to execute each step of the substrate transfer method of the above aspect is stored.

[0049] Effects of the Invention

[0050] According to the present invention, it is possible to provide a technology for conveying a substrate cut out from a large substrate and suppressing deviation in conveying position due to difference in cutting position. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic diagram of a portion of a production line for electronic devices.

[0052] Figure 2 This is a schematic diagram of a film forming apparatus according to one embodiment.

[0053] Figure 3 (A) and Figure 3 (B) is an explanatory diagram of a conveying device according to an embodiment.

[0054] Figure 4 The diagram shows examples of a large substrate and a cut substrate.

[0055] Figure 5This is a diagram schematically showing the deviation of a substrate from a target position after the transport robot transports the substrate to the film forming chamber.

[0056] Figure 6 This is a flowchart showing a processing example of a processing unit of a transport device and a control device of a film forming device.

[0057] Figure 7 This is a flowchart showing a processing example of the processing unit of the transport device.

[0058] Figure 8 (A) is a diagram showing an example of information managed by the host device. Figure 8 (B) is a diagram showing an example of information managed by the storage unit.

[0059] Fig. 9 (A) is an overall view of an organic EL display device. Fig. 9 (B) is a diagram showing the cross-sectional structure of one pixel. DETAILED DESCRIPTION

[0060] Hereinafter, the embodiments are described in detail with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention of the claims. Although a plurality of features are described in the embodiments, not all of these features are necessarily required features of the invention, and a plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same or similar structures are marked with the same reference numerals, and repeated descriptions are omitted.

[0061] <Electronic device production line>

[0062] Figure 1 This is a schematic diagram showing a part of the structure of a production line of electronic devices to which the film-forming apparatus of the present invention can be applied. Figure 1 The production line is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone. The substrate 100 is sequentially transported to the film forming module 301 , and an organic EL film is formed on the substrate 100 .

[0063] In the film forming module 301, a plurality of film forming chambers 303a to 303d for performing film forming on the substrate 100 and a mask storage chamber 305 for storing masks before and after use are arranged around a conveying chamber 302 having an octagonal shape when viewed from above. A conveying robot 151 (conveying unit) for conveying the substrate 100, which is provided in a conveying device 15 (substrate conveying device) described later, is arranged in the conveying chamber 302. In other words, the film forming module 301 is a cluster-type film forming unit in which a plurality of film forming chambers 303a to 303d are arranged in a manner surrounding the conveying robot 151. In addition, when the film forming chambers 303a to 303d are collectively referred to or when no distinction is made, they are expressed as film forming chambers 303.

[0064] In the conveying direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a transfer chamber 308 are respectively arranged on the upstream and downstream sides of the film forming module 301. During the manufacturing process, each chamber is maintained in a vacuum state. Figure 1 Only one film forming module 301 is shown in the figure, but the production line of this embodiment has a plurality of film forming modules 301, and the plurality of film forming modules 301 have a structure connected by a connecting device consisting of a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308. In addition, the structure of the connecting device is not limited thereto, and for example, it may be composed of only the buffer chamber 306 or the delivery chamber 308.

[0065] The transfer robot 151 carries substrates 100 from the upstream transfer chamber 308 to the transfer chamber 302 , transfers substrates 100 between film forming chambers 303 , transfers masks between the mask storage chamber 305 and the film forming chamber 303 , and carries substrates 100 out from the transfer chamber 302 to the downstream buffer chamber 306 .

[0066] The buffer chamber 306 is a chamber for temporarily storing substrates 100 according to the operation status of the production line. The buffer chamber 306 is provided with a multi-layered substrate storage rack (also referred to as a box) capable of storing a plurality of substrates 100 in a horizontal state with the processed surface (film-forming surface) of the substrate 100 facing downward in the direction of gravity, and a lifting mechanism for lifting the substrate storage rack in order to align the layer of the substrate 100 sent in or out with the conveying position. In this way, a plurality of substrates 100 can be temporarily stored in the buffer chamber 306 and retained in the buffer chamber 306.

[0067] The swirling chamber 307 is provided with a device for changing the orientation of the substrate 100. In the present embodiment, the swirling chamber 307 rotates the orientation of the substrate 100 by 180 degrees by a conveying robot (not shown) provided in the swirling chamber 307. The conveying robot provided in the swirling chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and transfers it to the transfer chamber 308, so that the front end and the rear end of the substrate are exchanged between the buffer chamber 306 and the transfer chamber 308. Thus, the orientation of the substrate 100 when it is fed into the film forming chamber 303 becomes the same in each film forming module 301, so that the scanning direction of the film formed with respect to the substrate 100 and the orientation of the mask can be made consistent in each film forming module 301. By adopting such a structure, the orientation of the mask set to the mask storage chamber 305 in each film forming module 301 can be made consistent, the management of the mask can be simplified, and the usability can be improved.

[0068] The control system of the production line includes a host device 300 that controls the entire production line as a host computer and control devices 14a to 14d, 309, and 310 that control each structure, which can communicate via a wired or wireless communication line 300a. The control devices 14a to 14d are provided corresponding to the film forming chambers 303a to 303d, and control the film forming device 1 described later. In addition, when the control devices 14a to 14d are collectively referred to or when no distinction is made, they are expressed as the control device 14.

[0069] The control device 309 controls the transfer robot 151 of the transfer device 15. The control device 310 controls the device of the swirl chamber 307. The host device 300 sends information related to the substrate 100 and instructions such as transfer timing to each control device 14, 309, 310, and each control device 14, 309, 310 controls each structure based on the received instructions.

[0070] <Overview of film forming equipment>

[0071] Figure 2 It is a schematic diagram of a film forming device 1 according to an embodiment of the present invention. The film forming device 1 is a device for forming a film of a vapor-deposited substance on a substrate 100, and a mask 101 is used to form a thin film of the vapor-deposited substance in a predetermined pattern. The material of the substrate 100 on which the film forming device 1 forms a film can be appropriately selected from materials such as glass, resin, and metal, and preferably a material having a resin layer such as polyimide formed on glass is used. The vapor-deposited substance is an organic material, an inorganic material (metal, metal oxide, etc.), and the like. The film forming device 1 can be applied to manufacturing devices for manufacturing electronic devices or optical elements such as display devices (flat panel displays, etc.), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), and in particular, can be applied to manufacturing devices for manufacturing organic EL panels. In the following description, an example in which the film forming device 1 forms a film on the substrate 100 by vacuum evaporation is described, but the present invention is not limited thereto, and various film forming methods such as sputtering and CVD can be applied. In each of the drawings, arrow Z indicates the up-down direction (direction of gravity), and arrow X and arrow Y indicate horizontal directions that are orthogonal to each other.

[0072] The film forming device 1 has a box-shaped vacuum chamber 3. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum environment or an inert gas environment such as nitrogen. In the present embodiment, the vacuum chamber 3 is connected to a vacuum pump not shown. In addition, in this specification, "vacuum" refers to a state filled with a gas at a pressure lower than the atmospheric pressure, in other words, a decompression state. In the internal space 3a of the vacuum chamber 3, there are arranged a substrate support unit 6 that supports the substrate 100 in a horizontal posture, a mask stage 5 that supports the mask 101, a film forming unit 4, and a plate unit 9. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 100, and is fixed on the mask stage 5. As the mask 101, a mask having a structure in which a mask foil with a thickness of about several μm to several tens of μm is welded and fixed to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but it is preferred to use a metal with a small thermal expansion coefficient such as Invar alloy. The film forming process is performed in a state where the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 overlap each other.

[0073] The plate unit 9 includes a cooling plate 10 for cooling the substrate 100 during film formation and a magnet plate 11 for attracting the mask 101 by magnetic force to bring the substrate 100 and the mask 101 into close contact. The plate unit 9 is provided to be movable up and down in the Z direction by a lifting unit 13 including, for example, a ball screw mechanism.

[0074] The film forming unit 4 is composed of a heater, a baffle, a driving mechanism of the evaporation source, an evaporation rate monitor, etc., and is an evaporation source that evaporates the evaporation material onto the substrate 100. More specifically, in the present embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction and the evaporation material is discharged from each nozzle. The film forming unit 4 reciprocates in the Y direction (the direction away from the connection portion between the film forming chamber 303 and the conveying chamber 302) by an evaporation source moving mechanism (not shown).

[0075] In addition, the film forming apparatus 1 includes an alignment device 2 for aligning the substrate 100 and the mask 101. In general, the alignment device 2 detects the alignment marks formed on the substrate 100 and the mask 101 using cameras (photographing devices) 7 and 8, and adjusts the relative positions of the substrate 100 and the mask 101 based on the detection results. The cameras 7 and 8 are arranged above the upper wall of the vacuum chamber 3, and can capture images in the vacuum chamber 3 through a window portion (not shown) formed on the upper wall. The cameras 7 and 8 capture substrate alignment marks provided on the substrate 100 and mask alignment marks provided on the mask 101 arranged in the vacuum chamber 3. The obtained images are processed by an image processing component not shown, so that the position information of the substrate 100 and the mask 101 can be obtained. The cameras 7 and 8 can also be said to be position information acquisition components that acquire the position information of the substrate 100 and the mask 101.

[0076] The alignment device 2 includes a substrate support unit 6 that supports the peripheral portion of the substrate 100. The substrate support unit 6 includes a pair of base portions 62 that are separated from each other in the X direction and extend in the Y direction, and a plurality of claw-shaped receiving portions 61 that protrude inward from the base portion 62. In addition, the receiving portion 61 is sometimes also referred to as a "receiving claw" or a "finger-like member". The plurality of receiving portions 61 are arranged at intervals on each of the pair of base portions 62. The portion on the long side of the peripheral portion of the substrate 100 is placed on the receiving portion 61. The base portion 62 is suspended from the beam member 222 via a plurality of pillars 64.

[0077] By forming a pair of base parts 62 separately in the X direction and not forming a structure of the base part 62 on the short side of the substrate 100 as in the present embodiment, the interference between the conveying robot 151 and the base part 62 when the conveying robot 151 hands over the substrate to the loading part 61 can be suppressed. Thus, the efficiency of conveying and handing over the substrate 100 can be improved. However, the base part 62 can also be a rectangular frame shape that surrounds the entire peripheral part of the substrate 100. In addition, the base part 62 can also be a rectangular frame shape with a cutout partially. By adopting a rectangular frame shape with a cutout partially, the interference between the conveying robot 151 and the base part 62 when the conveying robot 151 hands over the substrate to the loading part 61 can be suppressed, and the efficiency of conveying and handing over the substrate 100 can be improved.

[0078] The substrate support unit 6 further includes a clamping unit 63. The clamping unit 63 includes a plurality of clamping portions 66. Each clamping portion 66 is provided corresponding to each placement portion 61, and the peripheral edge of the substrate 100 can be clamped and held by the clamping portion 66 and the placement portion 61. As a supporting method for the substrate 100, in addition to the method of clamping and holding the peripheral edge of the substrate 100 by the clamping portion 66 and the placement portion 61, a method of placing the substrate 100 only on the placement portion 61 without providing the clamping portion 66 can also be adopted.

[0079] In addition, the alignment device 2 includes an adjustment unit 20 that adjusts the relative position of the substrate 100 supported by the substrate support unit 6 at the periphery and the mask 101. The adjustment unit 20 displaces the substrate support unit 6 on the X-Y plane based on the detection results of the cameras 7 and 8, thereby adjusting the relative position of the substrate 100 with respect to the mask 101. In the present embodiment, the position of the mask 101 is fixed and the substrate 100 is displaced to adjust their relative positions, but the mask 101 may be displaced to perform the adjustment, or both the substrate 100 and the mask 101 may be displaced.

[0080] In addition, the alignment device 2 includes a contact and separation unit 22 that moves the substrate support unit 6 upward and downward to bring the substrate 100 and the mask 101, whose peripheral portions are supported by the substrate support unit 6, closer and farther apart in the thickness direction (Z direction) of the substrate 100. In other words, the contact and separation unit 22 can bring the substrate 100 and the mask 101 closer in the overlapping direction. As the contact and separation unit 22, for example, an electric actuator using a ball screw mechanism may be used.

[0081] <Conveying device>

[0082] Figure 3 (A) and Figure 3 (B) is an explanatory diagram of the conveying device 15, Figure 3 (A) is a diagram showing a state when the substrate 100 is sent out from the delivery chamber 308. Figure 3 (B) is a side view schematically showing the structure of the conveying device 15. The conveying device 15 has a conveying robot 151 that conveys substrates cut out from a large substrate to a processing device. The conveying robot 151 is a horizontal multi-joint robot, and includes a main body 1511, a first arm 1512, a second arm 1513, and a manipulator 1514.

[0083] The main body 1511 constitutes the base portion of the conveying robot 151, and is disposed, for example, on the bottom surface of the conveying chamber 302. More specifically, the main body 1511 includes a bottomed cylindrical shell 1511d having a flange portion 1511c, and is fixed to an opening provided on the chamber wall 302a constituting the bottom surface of the conveying chamber 302 via the flange portion 1511c. The main body 1511 includes a lifting portion 1511b that supports one end of the first arm 1512 so that it can rotate, and a lifting mechanism 1511a that enables the lifting portion 1511b to be lifted and lowered. The lifting mechanism 1511a and the lifting portion 1511b are arranged inside the shell 1511d. The lifting mechanism 1511a may also be constituted by a ball screw mechanism, for example. In this case, the lifting mechanism 1511a includes a screw shaft, a ball nut threadedly engaged with the screw shaft, and a motor (not shown) that rotates the screw shaft. The screw shaft rotates under the driving force of the motor, thereby lifting and lowering the lifting part 1511b connected to the ball nut through the bracket.

[0084] A motor 1511e is installed on the lifting part 1511b for rotating the first arm 1512 relative to the main body 1511. In addition, the lifting part 1511b has a hollow rotating shaft (not shown) that fixes the base end side of the first arm 1512 and a holding member (not shown) that supports the hollow rotating shaft in a rotatable cylindrical shape. When the motor 1511e rotates, the power of the motor 1511e is transmitted to the first arm 1512 via the hollow rotating shaft, so that the first arm 1512 rotates. In addition, the first arm 1512 is connected to the second arm at the end on the opposite side of the end connected to the base part 1511. The second arm 1513 is configured to be able to rotate around an axis extending in the direction of gravity relative to the first arm 1512 using the motor 1513a as a driving source. In addition, the second arm is connected to the manipulator 1514 at the end on the opposite side of the end connected to the first arm 1512.

[0085] The robot 1514 has a hand base 1514a rotatably connected to the front end side of the second arm 1513 and four hand forks 1514b (loading parts) for mounting the substrate 100 and the mask 101. The robot 1514 can rotate around an axis extending in the gravity direction relative to the second arm 1513 using a motor 1514c as a driving source. Two of the four hand forks 1514b are arranged in parallel with a predetermined interval from each other. The two hand forks 1514b are fixed to the hand base 1514a in a manner protruding from the hand base 1514a to one side in the horizontal direction. The remaining two hand forks 1514b are fixed to the hand base 1514 in a manner protruding from the hand base 1514 toward the opposite side of the two hand forks 1514b protruding from the hand base 1514a to one side in the horizontal direction.

[0086] In addition, the structure of the above-mentioned conveying robot 151 is an example, and well-known technology can be appropriately adopted. For example, the conveying robot 151 can also be a vertical multi-joint robot. In addition, the manipulator 1514 is not limited to a structure that supports by placing the substrate 100, etc., and can also be a structure that holds the substrate 100 by holding the end of the substrate 100 or adsorbing the substrate 100.

[0087] The control device 309 controls the entire conveying device 15. More specifically, the control device 309 controls the conveying robot 151. The control device 309 includes a processing unit 3091 (control means), a storage unit 3092, an input / output interface (I / O) 3093, and a communication unit 3094.

[0088] The processing unit 3091 is a processor represented by a CPU (Central Processing Unit), and executes the program stored in the storage unit 3092 to control the conveying device 15. The storage unit 3092 is a storage device (storage component) such as ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), etc., and stores various control information in addition to the program executed by the processing unit 3091. The I / O (Input / Output) 3093 is an interface for sending and receiving signals between the processing unit 3091 and external devices. The communication unit 3094 is a communication device that communicates with the upper device 300 or other control devices 14, 310, etc. via the communication line 300a. The processing unit 3091 receives information from the upper device 300, etc., or sends information to the upper device 300, etc. via the communication unit 3094. In addition, all or part of the control devices 309, 14, 310 and the host device 300 may be constituted by a PLC (Programmable Logic Controller), an ASIC (Application Specific Integrated Circuit), or an FPGA (Field Programmable Gate Array).

[0089] <Substrate>

[0090] The substrate 100 of the present embodiment is a cut substrate cut out from a large substrate. Figure 4 2 is a diagram showing an example of a large substrate and a cut substrate. The large substrate MG is a 6th generation full-size (approximately 1500 mm × approximately 1850 mm) base glass having a rectangular shape. An orientation plane OF for determining the orientation of the large substrate MG is formed at a corner of a portion of the large substrate MG.

[0091] In addition, here, an example is shown in which only one of the four corners of the large substrate MG is cut off to form the orientation plane OF, but the present invention is not limited thereto, and the orientation plane OF may be formed by cutting off all four corners but cutting off one corner larger than the other corners. In this case, the portion cut off in a shape different from the other corners can be used as the orientation plane OF.

[0092] As described above, for example, in the manufacture of an organic EL display for a smartphone, a 6th generation full-size large substrate MG is subjected to film forming processing in the backplane process (TFT formation process, anode formation process, etc.). Thereafter, the large substrate MG is cut into two halves (cutting process), and the substrate 100 of the 6th generation half-cut size (approximately 1500 mm × approximately 925 mm) obtained by cutting is sent to the film forming module 301 for forming an organic layer in the production line of this embodiment. The substrate 100 sent to the film forming module 301 is any one of the two types of divided substrates obtained by cutting out from the large substrate MG, and in this embodiment, it is substrate 100A or substrate 100B. The large substrate MG is cut at a cutting line CTL at a distance L from a reference side serving as one side thereof, thereby obtaining substrate 100A and substrate 100B. Figure 1 In the illustrated production line, substrates 100A and substrates 100B are mixed and transported as substrates 100 to be subjected to various processes.

[0093] In addition, here, the large substrate MG is cut into two halves, but it is not limited to this, as long as the large substrate MG is cut and divided into a plurality of substrates of substantially the same size. For example, the large substrate MG can also be divided into four parts to form four substrates 100, which are sent to the film forming module 301.

[0094] Substrate 100A and substrate 100B sometimes have different substrate characteristics such as size and rigidity distribution. For example, substrate 100A is a substrate whose short side length is cut to L, but the short side length of substrate 100B is not cut, and sometimes the length of the short side is different between substrate 100A and substrate 100B. In addition, there is an orientation plane OF in substrate 100B, but there is no orientation plane OF in substrate 100A. The magnitude of the residual stress at the cut surface is sometimes different between substrate 100A and substrate 100B. In addition, the position of the cut surface is on the right side in substrate 100A and on the left side in substrate 100B, and the position is different. Such differences in substrate characteristics sometimes affect the movement of substrate 100 during substrate transportation.

[0095] Figure 51 is a diagram schematically showing the deviation of the substrate 100 from the target position after the conveying robot 151 conveys the substrate 100 to the film forming chamber 303. In the present embodiment, the conveying robot 151 conveys the substrate 100 while the substrate 100 is placed on the hand fork 1514b of the manipulator 1514. Therefore, during the conveying, the substrate 100 may sometimes slide relative to the hand fork 1514b. In this case, even if the conveying robot 151 itself delivers the substrate 100 at the same relative position relative to the loading section 61 in the film forming apparatus 1, the substrate 100 placed on the loading section 61 may sometimes deviate from the target conveying position (offset amounts Ax and Ay). Moreover, due to the difference in the characteristics of the above-mentioned substrates, the tendency of the offset amounts Ax and Ay may sometimes be different between the substrate 100A and the substrate 100B. That is, the delivery position of the conveying robot 151 to the film forming apparatus 1 may sometimes be different between the substrate 100A and the substrate 100B. On the other hand, the substrate 100 placed on the placement section 61 is subsequently aligned by the alignment device 2. However, if the transfer position between the substrate 100A and the substrate 100B is offset, alignment may take time or the alignment accuracy may decrease.

[0096] Therefore, in the present embodiment, as described below, the conveyance control of the substrate corresponding to the portion where the large substrate MG of the substrate 100 is cut out is performed.

[0097] <Control Example>

[0098] An example of controlling the transport device 15 executed by the processing unit 3091 of the control device 309 and an example of controlling the film forming device 1 executed by the control device 14 will be described. Figure 6 is a flowchart showing an example of processing by the processing unit 3091 and the control device 14. Figure 7 3091 is a flowchart showing a processing example of the processing unit 3091. This flowchart starts when the processing unit 3091 receives a conveyance instruction of the substrate 100 from the host device 300, for example.

[0099] In step S1 (hereinafter referred to as S1 for short. The same applies to other steps), the processing unit 3091 acquires substrate information of the substrate 100 to be conveyed next (acquisition process). In the present embodiment, the substrate information includes information related to the relative position of the substrate 100 in the large substrate MG before being divided. In other words, the information is location information related to the portion of the large substrate MG from which the substrate 100 is cut out, and may also be referred to as "cutting information" or "cutting information." In this way, the processing unit 141 has a function as an acquisition component for acquiring substrate information related to the portion of the substrate 100 in the large substrate MG before being divided. In the present embodiment, in Figure 4In the embodiment, the substrate 100A corresponding to the portion on the left side of the cutting line CTL of the large substrate MG and whose cutting position is on the right side of the drawing is set as A-cut, and the substrate 100B corresponding to the portion on the right side of the cutting line CTL of the large substrate MG and whose cutting position is on the left side of the drawing is set as B-cut. The processing unit 3091 obtains whether the substrate 100 to be conveyed is A-cut or B-cut as substrate information.

[0100] In addition, in the present embodiment, the substrate information is managed by the host device 300 in association with other information of the substrate 100 . Figure 8 (A) shows an example of information managed by the host device 300. In the present embodiment, the host device 300 stores identification information for identifying each substrate 100, substrate information of the substrate 100 (whether it is substrate 100A or substrate 100B), and conveying route information in correspondence. Then, when the host device 300 instructs the control device 309 etc. to process the substrate 100, the identification information and the substrate information are sent to the control device 309 etc. which is the object of instruction. That is, in S1, the processing unit 3091 obtains the substrate information by receiving information related to the substrate 100 from the host device 300 via the communication unit 3094. In addition, the host device 300 may also obtain the substrate information from, for example, a cutting device (substrate dividing device) for cutting a large substrate MG or other devices arranged in the production line at an upstream side of the film forming device 1, or a device outside the production line, or may accept the input of the operator of the production line and obtain the substrate information according to the input of the operator.

[0101] In S2, the processing unit 3091 sets the handover position of the substrate 100. In the present embodiment, the conveying device 15 stores the position information related to the handover position in the storage unit 3092 according to each film forming device 1 in each film forming chamber 303 provided in the film forming module 301. The processing unit 3091 confirms the film forming device 1 as the conveying destination based on the conveying route information obtained from the host device 300, and sets the handover position of the substrate 100 based on the position information corresponding to the film forming device 1. The position information related to the handover position may be, for example, coordinate information of a fixed coordinate system in the entire film forming module 301 or a fixed coordinate system in the film forming device 1, or may be control parameters of the conveying robot 151. The control parameters of the conveying robot 151 may be, for example, the output current and output voltage of each motor driving each part of the conveying robot 151, or may be the target value of a rotary encoder for detecting the rotation angle of each motor.

[0102] In S3 , the processing unit 3091 corrects the transfer position of the substrate 100 set in S2 based on the substrate information acquired in S1 . Figure 8(B) is a diagram showing an example of information managed by the storage unit 3092. In the case of the present embodiment, the storage unit 3092 stores the handover position offset as the handover position correction information for correcting the substrate information handover position in correspondence with the substrate information. The processing unit 3091 reads the handover position offset corresponding to the substrate information acquired in S1 from the storage unit 3092, and corrects the handover position of the substrate 100 according to the read offset. From a certain aspect, the processing unit 3091 sets a reference value of the handover position as the conveying destination in S2, and offsets the handover position from the reference value based on the substrate information in S3. In addition, the offset can be, for example, a relative distance from the reference value in the X direction and the Y direction, or a control parameter of the conveying robot 151, etc.

[0103] In addition, the offset amount for each substrate information may be set, for example, during a teaching operation for teaching the conveying trajectory and the handover position of the substrate 100, which is performed when the conveying robot 151 is installed in the production line. For example, during the teaching operation, the offset amount of the substrate 100 placed on the conveying robot 151 from the target position when the conveying robot 151 is moved to the handover position in the film forming apparatus 1 may be measured for each type of substrate 100 (A cutting, B cutting). Furthermore, based on the measurement result, the offset amount that differs depending on the substrate information may be set so as to offset the offset from the target position for each type of substrate 100.

[0104] The amount of deviation of the substrate 100 from the target position when the conveying robot 151 is moved to the delivery position in the film forming apparatus 1, which is used when setting the delivery position correction information, can also be measured using the camera 7 or 8 of the film forming apparatus 1. For example, after the conveying robot 151 is moved to the delivery position in the film forming apparatus 1 (after S1 to S5), the camera 7 or 8 is used to detect the substrate alignment mark formed on the substrate 100, the end or corner of the substrate 100, and the position information of the substrate 100 is acquired. Then, based on the acquired position information of the substrate 100 and the target position, the amount of deviation between the position of the substrate 100 after the actual delivery and the target position is acquired. In addition, the acquisition of the position information of the substrate 100 after being delivered to the delivery position can be performed in a state where the substrate 100 is supported by the conveying robot 151, or can be performed in a state where the substrate 100 is supported by the substrate support unit 6 after the delivery to the substrate support unit 6 is completed. The acquisition of the position information of the substrate 100 after being transported to the delivery position may also be used as the measurement by the camera 7 or 8 when the alignment device 2 performs the alignment between the substrate 100 and the mask 101 in S6 .

[0105] In this way, if the camera 7 or 8 of the film forming device 1 is used to measure the offset of the substrate 100 from the target position when the conveying robot 151 is moved to the handover position in the film forming device 1, there is no need to set up a measuring component for measuring the offset from the target position, so the device structure can be simplified. In addition, the offset can be updated not only during teaching operations but also during the operation of the production line. Therefore, it is also possible to timely respond to changes in the conveying offset caused by changes in the environment and changes in the device over time, and the conveying accuracy can be maintained. In addition, although it is set to update the offset based on the position information of the substrate 100 measured by the camera 7 or 8, it is not limited to this, and the position information of the handover position can also be directly updated in a manner to offset the above-mentioned offset.

[0106] In S4, the processing unit 3091 performs a substrate conveying operation (control unit). Specifically, the processing unit 3091 controls the conveying robot 151 to convey the substrate 100 to the handover position set in S2 and S3, and places the substrate 100. From a certain perspective, the processing unit 3091 causes the conveying robot 151 to convey the substrate 100 to the handover position based on the acquired substrate information through S2 to S4. In S5, the processing unit 3091 sends a conveying end notification to the control device 14 and / or the host device 300 of the film forming device 1 that is the handover object, indicating that the substrate conveying operation has ended. Through the above steps, the processing on the conveying device 15 side is completed.

[0107] When receiving the transport completion notification, the control device 14 of the film forming apparatus 1 performs alignment between the substrate 100 and the mask 101 in S6 by the alignment device 2. Although detailed description is omitted, a well-known technique can be adopted as a method of alignment.

[0108] In S7, the control device 14 of the film forming device 1 performs film forming processing after the alignment is completed. Here, a thin film is formed on the lower surface of the substrate 100 by the film forming unit 4 via the mask 101. When the film forming processing is completed, in step S8, the control device 14 sends a film forming completion notification to the control device 309 of the conveying device 15 and / or the host device 300 to indicate that the film forming has been completed. Through the above steps, the processing on the film forming device 1 side is completed.

[0109] Furthermore, when the next transport destination of the substrate 100 is the film forming apparatus 1 in another film forming chamber 303 in the film forming module 301, referring to the transport route information managed by the host device 300, the processing unit 3091 that has received the film forming end notification may repeat the process from S1 again. Furthermore, when the next transport destination is the buffer chamber 306, the processing unit 3091 may also change the delivery position of the substrate 100 based on the substrate information.

[0110] Figure 7This is a flowchart showing a specific example of the handover position correction shown in S3.

[0111] In S31, the processing unit 3091 confirms the substrate information obtained in S1, and if it is A-cut, it proceeds to S32, and if it is B-cut, it proceeds to S33. In S32, the processing unit 3091 Figure 8 (B) and the relationship between the substrate information and the transfer position offset, and obtain the offset (Δx=x1, Δy=y1). In S33, the processing unit 3091 obtains the offset (Δx=x1, Δy=y1). Figure 8 (B) shows the relationship between the substrate information and the handover position offset, and obtains the offset (Δx=x2, Δy=y2). In S34, the processing unit 3091 corrects the handover position set in S2 based on the offset obtained in S32 or S33. Thus, the handover position is changed when the substrate 100 is A-cut or B-cut.

[0112] In addition, the relationship between x1 and x2 and the relationship between y1 and y2 are not particularly limited. For example, the offsets Δx and Δy may be different between the A cut and the B cut (x2≠x1 and y2≠y1). In addition, any one of the offsets Δx and Δy may be different between the A cut and the B cut. For example, x2≠x1 and y2=y1 may be, or x2=x1 and y2≠y1 may be.

[0113] Alternatively, there may be a case where the offsets Δx and Δy of A-cut and B-cut are the same (x2=x1 and y2=y1). That is, in the present embodiment, although the storage unit 3092 stores the offset corresponding to A-cut and the offset corresponding to B-cut separately, there may be a case where their values ​​are the same. Further, as long as the storage unit 3092 stores the handover position offset in correspondence with the substrate information, any one of the stored multiple handover position offsets is selected and used according to the substrate information when handing over the substrate 100, then the specific value of the handover position offset is not particularly limited. In addition, for example, even if the handover position offset is the same value when the substrate 100 is A-cut and when it is B-cut when processing a certain substrate, the handover position offset is sometimes set or updated as described above after processing several substrates, so it is not necessarily always the same value.

[0114] As described above, in the present embodiment, the processing unit 3091 causes the conveying robot 151 to convey the substrate 100 to the handover position based on the substrate information. Thus, regarding the conveying of the substrate cut out from the large substrate, the deviation of the conveying position caused by the difference in the cut-out position can be suppressed. Further, in the present embodiment, different handover positions are set between the substrate 100A and the substrate 100B having different cut-out positions from the large substrate. Therefore, even if the characteristics of the substrate are different due to the different cut-out positions from the large substrate, and the difference in the characteristics affects the movement of the substrate 100 during the substrate conveyance, the deviation of the conveying position can be suppressed.

[0115] In addition, in the present embodiment, when the position of the substrate 100 relative to the mounting portion 61 of the substrate supporting unit 6 is adjusted, the substrate supporting unit 6 is not operated but the transport robot 151 is operated. Therefore, the position of the substrate 100 relative to the mounting portion 61 is adjusted while maintaining the relative positional relationship between the film forming unit 4 and the substrate supporting unit 6. Thus, after the substrate 100 is mounted on the mounting portion 61, it is not necessary to perform the position adjustment of the film forming unit 4 and the substrate supporting unit 6 every time, so that the operation time can be shortened.

[0116] <Method for manufacturing electronic device>

[0117] Next, an example of a method for manufacturing an electronic device is described. Next, as an example of an electronic device, the structure and manufacturing method of an organic EL display device are illustrated. In this example, Figure 1 The film forming modules 301 shown as an example are provided at, for example, three locations in the production line.

[0118] First, the organic EL display device to be manufactured will be described. Fig. 9 (A) is an overall view of an organic EL display device 50. Fig. 9 (B) is a diagram showing the cross-sectional structure of one pixel.

[0119] like Fig. 9 As shown in (A), a plurality of pixels 52 including a plurality of light emitting elements are arranged in a matrix in a display area 51 of an organic EL display device 50. Although the details will be described later, each light emitting element has a structure including an organic layer sandwiched by a pair of electrodes.

[0120] In addition, the pixel mentioned here refers to the minimum unit that can display the desired color in the display area 51. In the case of a color organic EL display device, the pixel 52 is formed by a combination of multiple sub-pixels, namely the first light-emitting element 52R, the second light-emitting element 52G, and the third light-emitting element 52B, which display different light emission. The pixel 52 is often composed of a combination of three sub-pixels, namely a red (R) light-emitting element, a green (G) light-emitting element, and a blue (B) light-emitting element, but is not limited to this. The pixel 52 only needs to include at least one sub-pixel, preferably includes two or more sub-pixels, and more preferably includes three or more sub-pixels. As the sub-pixels constituting the pixel 52, for example, it can also be a combination of four sub-pixels, namely a red (R) light-emitting element, a green (G) light-emitting element, a blue (B) light-emitting element, and a yellow (Y) light-emitting element.

[0121] Fig. 9 (B) Yes Fig. 9 (A) is a partial cross-sectional schematic diagram of the line AB. The pixel 52 has a plurality of sub-pixels composed of an organic EL element having a first electrode (anode) 54, a hole transport layer 55, any one of a red layer 56R, a green layer 56G, and a blue layer 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. Among them, the hole transport layer 55, the red layer 56R, the green layer 56G, the blue layer 56B, and the electron transport layer 57 are equivalent to organic layers. The red layer 56R, the green layer 56G, and the blue layer 56B are respectively formed into patterns corresponding to light-emitting elements (sometimes also described as organic EL elements) that emit red, green, and blue.

[0122] In addition, the first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common over the plurality of light-emitting elements 52R, 52G, and 52B, or may be formed for each light-emitting element. Fig. 9 As shown in (B), after the hole transport layer 55 is formed as a common layer in multiple sub-pixel areas, the red layer 56R, the green layer 56G, and the blue layer 56B are formed separately in each sub-pixel area, and then the electron transport layer 57 and the second electrode 58 are formed as a common layer in multiple sub-pixel areas.

[0123] In order to prevent short circuit between adjacent first electrodes 54, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer is degraded by moisture and oxygen, a protective layer 60 is provided to protect the organic EL element from moisture and oxygen.

[0124] exist Fig. 9In (B), the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer according to the structure of the organic EL display element. In addition, a hole injection layer having an energy band structure can be formed between the first electrode 54 and the hole transport layer 55 to enable holes to be smoothly injected from the first electrode 54 to the hole transport layer 55. Similarly, an electron injection layer can also be formed between the second electrode 58 and the electron transport layer 57.

[0125] The red layer 56R, the green layer 56G, and the blue layer 56B can be formed by a single light-emitting layer, or by stacking a plurality of layers. For example, the red layer 56R can be composed of two layers, with the upper layer being formed by a red light-emitting layer, and the lower layer being formed by a hole transport layer or an electron blocking layer. Alternatively, the lower layer can be formed by a red light-emitting layer, and the upper layer can be formed by an electron transport layer or a hole blocking layer. By providing a layer on the lower or upper side of the light-emitting layer in this way, the light-emitting position in the light-emitting layer is adjusted, and the optical path length is adjusted, thereby having the effect of improving the color purity of the light-emitting element.

[0126] In addition, although the example of the red layer 56R is shown here, the green layer 56G and the blue layer 56B may also adopt the same structure. In addition, the number of stacked layers may be 2 or more. Furthermore, layers of different materials such as the light-emitting layer and the electron blocking layer may be stacked, and layers of the same material may be stacked, such as stacking 2 or more light-emitting layers.

[0127] Here, it is assumed that the red layer 56R is composed of two layers, the lower layer 56R1 and the upper layer 56R2, and the green layer 56G and the blue layer 56B are composed of a single light-emitting layer.

[0128] First, a substrate 53 is prepared on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed. The material of the substrate 53 is not particularly limited, and can be made of glass, plastic, metal, etc. In this embodiment, as the substrate 53, a substrate in which a polyimide film is laminated on a glass substrate is used.

[0129] On the substrate 53 formed with the first electrode 54, a resin layer such as acrylic acid or polyimide is applied by bar coating or spin coating, and the resin layer is patterned by photolithography so as to form an opening in the portion where the first electrode 54 is formed, thereby forming an insulating layer 59. The opening corresponds to the light-emitting region where the light-emitting element actually emits light. In addition, in this embodiment, the large substrate is processed until the insulating layer 59 is formed, and after the insulating layer 59 is formed, a dividing step of dividing the substrate 53 is performed.

[0130] The substrate 53 with the patterned insulating layer 59 is introduced into the first film forming chamber 303, and the hole transport layer 55 is formed as a common layer on the first electrode 54 in the display region. The hole transport layer 55 is formed using a mask having an opening formed in accordance with the display region 51 of the panel portion of each organic EL display device.

[0131] Next, the substrate 53 formed to the hole transport layer 55 is sent to the second film forming chamber 303. The substrate 53 and the mask are aligned, the substrate is placed on the mask, and the red layer 56R is formed on the portion of the substrate 53 above the hole transport layer 55 where the elements emitting red are arranged (the region forming the red sub-pixel). Here, the mask used in the second film forming chamber is a high-precision mask having openings formed only in multiple regions that become red sub-pixels among multiple regions on the substrate 53 that become sub-pixels of the organic EL display device. As a result, the red layer 56R including the red light-emitting layer is formed only in the region that becomes the red sub-pixel among the regions that become the multiple sub-pixels on the substrate 53. In other words, the red layer 56R is not formed in the region that becomes the blue sub-pixel and the region that becomes the green sub-pixel among the regions that become the multiple sub-pixels on the substrate 53, and is selectively formed in the region that becomes the red sub-pixel.

[0132] Similar to the formation of the red layer 56R, the green layer 56G is formed in the third film forming chamber 303, and then the blue layer 56B is formed in the fourth film forming chamber 303. After the formation of the red layer 56R, the green layer 56G, and the blue layer 56B is completed, the electron transport layer 57 is formed on the entire display area 51 in the fifth film forming chamber 303. The electron transport layer 57 is formed as a common layer on the three color layers 56R, 56G, and 56B.

[0133] The substrate formed up to the electron transport layer 57 is moved to the sixth film forming chamber 303, and the second electrode 58 is formed. In the present embodiment, the film formation of each layer is performed by vacuum evaporation in the first film forming chamber 303 to the sixth film forming chamber 303. However, the present invention is not limited to this. For example, the film formation of the second electrode 58 in the sixth film forming chamber 303 can also be performed by sputtering. After that, the substrate formed up to the second electrode 58 is moved to the sealing device and the protective layer 60 is formed by plasma CVD (sealing process), and the organic EL display device 50 is completed. In addition, it is assumed here that the protective layer 60 is formed by the CVD method, but it is not limited to this, and it can also be formed by the ALD method or the inkjet method.

[0134] Here, the film formation in the first film forming chamber 303 to the sixth film forming chamber 303 is performed using a mask having openings corresponding to the patterns of the respective layers to be formed. When forming the film, after the relative positions of the substrate 53 and the mask are adjusted (aligned), the substrate 53 is placed on the mask to form the film. Here, the alignment process performed in each film forming chamber is performed as in the above-mentioned alignment process.

[0135] <Other embodiments>

[0136] In the above embodiment, the transport device 15 transports the substrate 100 to the film forming apparatus 1. However, the above process (S1 to S5) may be performed when the transport device 15 transports the substrate 100 to a processing apparatus that performs a process other than film forming. Examples of the processing apparatus that performs a process other than film forming include the above-mentioned sealing apparatus and the like.

[0137] In the above embodiment, the host device 300 stores the identification information, substrate information, and conveying route information of each substrate 100 in correspondence, and the storage unit 3092 of the conveying device 15 stores the substrate information and the handover position offset in correspondence. However, the host device 300 may manage these information in a unified manner.

[0138] In addition, the offset amount of the handover position may be set for each film forming device 1 in the film forming module 301. That is, the offset amount may be set based on the substrate information and the film forming device 1. However, the offset amount corresponds only to the substrate information, and a structure may be adopted in which the same offset amount is used in each film forming device 1 if the substrate information is the same.

[0139] In addition, in the above-mentioned embodiment, after setting the reference value of the handover position, the processing unit 3091 offsets the handover position based on the substrate information. However, the position information of the plurality of handover positions may be respectively corresponding to the plurality of substrate information (A cutting and B cutting in the above-mentioned embodiment) and the information may be stored in the storage unit 3092. In other words, the position information of the handover position that has been corrected in advance taking into account the conveying offset caused by the cut-out position of the substrate may be stored in the storage unit 3092 in correspondence with the information. Moreover, the processing unit 3091 may also read the position information corresponding to the acquired substrate information and control the conveying robot 151 so as to hand over the substrate 100 at the handover position according to the read position information. That is, the information corresponding to the substrate information is not limited to the offset from the reference value of the handover position, but may also be the position information of the handover position itself, such as the coordinate information of the fixed coordinate system in the entire film forming module 301 and the fixed coordinate system in the film forming device 1.

[0140] In addition, in the above-mentioned embodiment, the processing unit 3091 obtains the substrate information from the host device 300 through communication (S1). However, the processing unit 3091 may also obtain the substrate information in other ways. For example, the conveying device 15 may also be equipped with a detection device such as a camera that can detect the presence or absence of the orientation plane OF, and the processing unit 3091 may obtain the substrate information based on the detection result. In addition, an identifier such as a barcode indicating the substrate information may be assigned to each substrate 100, and the processing unit 3091 may obtain the substrate information by reading the identifier.

[0141] In addition, in the above-mentioned embodiment, the film forming device 1 in the film forming chamber 303 can be said to have one substrate stage including the substrate support unit 6 and the mask stage 5, but the film forming device 1 may also have two or more substrate stages. Thus, while the film forming unit 4 is forming a film on the substrate 100 located on one substrate stage, the substrate 100 can be sent to the other substrate stage, and the alignment of the alignment device 2 can be performed, etc., which can improve the working efficiency. Moreover, in such a structure, the storage unit 3092 can also store the offset amount based on the substrate information for each substrate stage. The processing unit 3091 can also control the conveying robot 151 so as to change the handover position based on the substrate information and the substrate stage on which the substrate 100 is placed.

[0142] In addition, in the above-mentioned embodiment, the substrate information and the identification information of the substrate 100 are managed by the host device 300 in association with each other, but the identification information of the substrate 100 itself may include the substrate information. For example, a part indicating the substrate information may be included in a character string constituting the identification information. In this case, the processing unit 3111 can obtain the substrate information based on the identification information of the substrate 100 received from the host device 300.

[0143] The present invention can also be implemented by the following processing: a program that implements one or more functions of the above-mentioned embodiment is supplied to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read and execute the program. In addition, it can also be implemented by a circuit (such as an ASIC) that implements one or more functions.

[0144] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are attached to disclose the scope of the invention.

[0145] Description of Reference Numerals

[0146] 1 film forming device, 15 conveying device (substrate conveying device), 151 conveying robot (conveying component), 3091 processing unit (acquisition component, control component), 3092 storage unit (storage component), 100 substrate, 101 mask.

Claims

1. A substrate conveying device, comprising: a transport member that transports any one of the plurality of substrates obtained by dividing the large substrate to a delivery position in the processing device and delivers the substrate to a substrate support member provided in the processing device; and a control component, which controls the conveying component, It is characterized in that The substrate conveying device includes an acquisition unit that acquires substrate information related to a portion of the large substrate before being divided, of the substrate conveyed by the conveying unit. The control unit causes the conveying unit to convey the substrate to the handover position based on the substrate information acquired by the acquisition unit. The substrate transfer device further includes a storage unit configured to store correction information for correcting the transfer position in association with the substrate information.

2. The substrate conveying device according to claim 1, characterized in that: The control unit corrects the handover position from a reference position and controls the transport unit based on the substrate information acquired by the acquisition unit and the correction information stored in the storage unit in correspondence with the substrate information.

3. The substrate conveying device according to claim 2, characterized in that: The correction information is an offset, the control unit reads the offset amount corresponding to the substrate information acquired by the acquisition unit from the storage unit, The conveying member is controlled so that the handover position is offset from the reference position according to the read offset amount.

4. The substrate conveying device according to claim 1, wherein: The substrate transfer device further includes a position information storage unit configured to store the position information of the plurality of transfer positions in association with the plurality of substrate information.

5. The substrate conveying device according to claim 4, characterized in that: the control unit reads the information of the handover position corresponding to the substrate information acquired by the acquisition unit from the position information storage unit, The conveying means is controlled so as to deliver the substrate at the delivery position according to the read information of the delivery position.

6. The substrate conveying device according to claim 1, wherein: The processing device is an evaporation device.

7. A substrate conveying device, comprising: a transport member that transports any one of the plurality of substrates obtained by dividing the large substrate to a delivery position in the processing device and delivers the substrate to a substrate support member provided in the processing device; and a control component, which controls the conveying component, It is characterized in that The substrate conveying device comprises: an acquisition unit that acquires substrate information related to a portion of the large substrate before being divided, of the substrate conveyed by the conveying unit; as well as a storage component, wherein the storage component stores correction information for correcting the handover position in correspondence with the substrate information, The control unit causes the transport unit to transport the substrate to the delivery position that is different according to the substrate information acquired by the acquisition unit, based on the correction information.

8. The substrate conveying device according to claim 7, characterized in that: The processing device is an evaporation device.

9. A substrate processing system, comprising: A processing device including a substrate support member for supporting any one of a plurality of substrates obtained by dividing a large substrate, and processing the substrate supported by the substrate support member; a conveying member that conveys the substrate to a delivery position in the processing device and delivers the substrate to the substrate supporting member; and a control component, which controls the conveying component, It is characterized in that The substrate processing system includes an acquisition unit that acquires substrate information related to a portion of the large substrate before being divided, of the substrate conveyed by the conveying unit. The control unit causes the conveying unit to convey the substrate to the handover position based on the substrate information acquired by the acquisition unit. The substrate processing system further includes a storage unit configured to store correction information for correcting the transfer position in association with the substrate information.

10. The substrate processing system according to claim 9, characterized in that: The processing device further includes a position information acquisition component, which acquires position information of the substrate in the processing device. An updating unit is provided for updating the correction information stored in the storage unit based on the position information of the substrate acquired by the position information acquiring unit.

11. The substrate processing system according to claim 9, characterized in that: The substrate processing system further includes a position information storage unit configured to store position information of the plurality of transfer positions in association with the plurality of substrate information.

12. The substrate processing system according to claim 11, characterized in that: The processing device further includes a position information acquisition component, which acquires position information of the substrate in the processing device. An updating unit is provided for updating the information of the handover position stored in the position information storage unit based on the position information of the substrate acquired by the position information acquisition unit.

13. A substrate processing system, comprising: A processing device including a substrate support member for supporting any one of a plurality of substrates obtained by dividing a large substrate, and processing the substrate supported by the substrate support member; a conveying member that conveys the substrate to a delivery position in the processing device and delivers the substrate to the substrate supporting member; and a control component, which controls the conveying component, It is characterized in that The substrate processing system comprises: an acquisition unit that acquires substrate information related to a relative position of the substrate conveyed by the conveying unit in the large substrate before being divided; as well as a storage component, wherein the storage component stores correction information for correcting the handover position in correspondence with the substrate information, The control unit causes the transport unit to transport the substrate to the delivery position that is different according to the substrate information acquired by the acquisition unit, based on the correction information.

14. A substrate conveying method, comprising a conveying step, in which any one of a plurality of substrates obtained by dividing a large substrate is conveyed to a delivery position in a processing device, and the substrate is delivered to a substrate support member provided in the processing device, It is characterized in that The method comprises an acquisition step of acquiring substrate information related to a portion of the large substrate before the substrate is divided. In the conveying step, the substrate is conveyed to the handover position based on the substrate information acquired in the acquiring step, The method further includes a storage step of storing correction information for correcting the transfer position in association with the substrate information.

15. A substrate conveying method, comprising a conveying step, in which any one of a plurality of substrates obtained by dividing a large substrate is conveyed to a delivery position in a processing device, and the substrate is delivered to a substrate support member provided in the processing device, It is characterized in that include: an acquisition step of acquiring substrate information related to a portion of the large substrate before division of the substrate; and a storage step, in which correction information for correcting the handover position is stored in correspondence with the substrate information, In the conveying step, the substrate is conveyed to the delivery position that is different according to the substrate information acquired in the acquiring step based on the correction information.

16. A method for manufacturing an electronic device, characterized in that: The manufacturing method comprises: A conveying step of conveying the substrate by the substrate conveying method according to claim 14 or 15; and A film forming step of forming a film on the substrate transported to the film forming apparatus as the processing apparatus in the transport step.

17. A computer-readable storage medium, characterized in that: A program for causing a computer to execute each step of the substrate transfer method according to claim 14 or 15 is stored.

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