Resin molding apparatus and method for manufacturing resin molded article

Abstract

Disclosed is a resin molding device and a method for manufacturing a resin molded article. The resin molding device is configured to manufacture a resin molded article. The resin molding device includes a supply mechanism, a photographing unit, and a control unit. The supply mechanism is configured to supply a resin material. The photographing unit is configured to photograph the supplied resin material from above and generate image data. The control unit is configured to analyze the image data and control the supply mechanism based on the analysis result.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Japanese Patent Application Publication No. 2006-286744 (Patent Document 1) discloses a semiconductor mounting substrate. In this semiconductor mounting substrate, an underfill is filled between the substrate and the semiconductor chip. A check pattern is formed on the substrate. When the underfill is properly filled, the check pattern is hidden by the underfill. On the other hand, when the underfill is inappropriately filled, the check pattern is exposed. Therefore, according to this semiconductor mounting substrate, by photographing the semiconductor mounting substrate and analyzing the photographed image, it is possible to determine whether the underfill has been formed properly (see Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2006-286744

[0006] In recent years, semiconductor packages (an example of resin molded products) have continued to become thinner. For example, the market demands products with thicknesses of 0.38 mm or 0.43 mm. On the other hand, thickness variations within a single resin molded product can affect the quality of the molding process. Even slight variations in thickness can significantly impact the quality of thin resin molded products. Patent Document 1 does not disclose a solution to this problem. Summary of the Invention

[0007] The present invention has been made to solve the above-mentioned problem, and an object of the present invention is to provide a resin molding apparatus and the like that can suppress thickness variations within a single resin molded product.

[0008] According to one aspect of the present invention, a resin molding apparatus is configured to manufacture resin molded products. The apparatus includes a supply mechanism, an imaging unit, and a control unit. The supply mechanism is configured to supply resin material. The imaging unit is configured to image the supplied resin material from above and generate image data. The control unit is configured to analyze the image data and control the supply mechanism based on the analysis results.

[0009] Another aspect of the present invention is a method for manufacturing a resin molded product using the aforementioned resin molding apparatus. The method comprises supplying a resin material, capturing the supplied resin material from above to generate image data, analyzing the image data and controlling a supply mechanism based on the analysis result, placing the supplied resin material on a lower mold, and closing the upper and lower molds to perform resin molding.

[0010] Effects of the Invention

[0011] According to the present invention, it is possible to provide a resin molding apparatus and the like capable of suppressing thickness variations within a single resin molded product. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a plan view schematically showing a resin molding device.

[0013] Figure 2 It is a cross-sectional view schematically showing a resin material supply mechanism.

[0014] Figure 3 It is a diagram for explaining the imaging state by the imaging unit.

[0015] Figure 4 This is a diagram showing an example of a recessed portion in a state where a resin material is supplied.

[0016] Figure 5 This is a flowchart showing a partial operation procedure of the resin molding apparatus.

[0017] Figure 6 Yes Figure 5 Flowchart of the analysis processing procedure performed in step S230.

[0018] Figure 7 This is a diagram for explaining a region included in image data representing a concave portion.

[0019] Figure 8 This is a diagram showing an example of analysis data.

[0020] Description of Reference Numerals

[0021] 1: Substrate supply unit

[0022] 2: Substrate storage

[0023] 3: Substrate placement part

[0024] 4: Substrate conveying mechanism

[0025] 5: Compression molding section

[0026] 6: Mobile Station

[0027] 7: Resin material storage unit

[0028] 8: Resin material supply device

[0029] 9: Resin material conveying mechanism

[0030] 11: Storage

[0031] 12: Conveying channel

[0032] 13: Vibration Department

[0033] 14: PLC

[0034] 16: Measurement Department

[0035] 51: Lower die

[0036] 51C: Cavity

[0037] 52: Upper mold

[0038] 53: Clamping mechanism

[0039] 71: Concave

[0040] 72: Frame-like components

[0041] 73: Release film

[0042] 100: Resin molding device

[0043] 150: Control Department

[0044] 200: HDD

[0045] 300: Photography Department

[0046] A: Substrate supply / storage module

[0047] B: Resin forming die block

[0048] C: Resin material supply module

[0049] D1: Parsing the data

[0050] P: Resin material

[0051] T1-T18, T30, T40: Area

[0052] X1, X2: threshold values. DETAILED DESCRIPTION

[0053] An embodiment according to one aspect of the present invention (hereinafter also referred to as "this embodiment") is described in detail below using the accompanying drawings. Identical or corresponding parts in the drawings are denoted by the same reference numerals, and their descriptions will not be repeated. Furthermore, to facilitate understanding, the drawings are schematically drawn with objects appropriately omitted or exaggerated.

[0054] [1. Structure of resin molding device]

[0055] Figure 1 This is a schematic top view of a resin molding apparatus 100 according to this embodiment. The resin molding apparatus 100 is configured to resin-seal a substrate on which electronic components such as semiconductor chips are mounted, thereby producing a resin molded product. In the resin molding apparatus 100, the component mounting surface of the substrate W, on which the electronic components are mounted, is resin-sealed.

[0056] Examples of substrate W include semiconductor substrates such as silicon wafers, lead frames, printed circuit boards, metal substrates, resin substrates, glass substrates, and ceramic substrates. Substrate W can be a carrier used in FOWLP (Fan-Out Wafer Level Packaging) or FOPLP (Fan-Out Panel Level Packaging). Substrate W may or may not have wiring applied.

[0057] like Figure 1 As shown, the resin molding apparatus 100 includes a substrate supply / storage module A (hereinafter referred to simply as "module A"), two resin molding mold blocks B (hereinafter referred to simply as "module B"), a resin material supply module C (hereinafter referred to simply as "module C"), and a programmable logic controller (PLC) 14. Each of the modules A to C is detachable from and replaceable with the other modules. Furthermore, the number of modules A to C in the resin molding apparatus 100 can be increased or decreased.

[0058] The PLC 14 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), and the like, and is configured to control each of the modules AC based on information processing.

[0059] Module A includes a substrate supply section 1, a substrate storage section 2, a substrate loading section 3, and a substrate conveying mechanism 4. The substrate supply section 1 is configured to supply a pre-sealed substrate W onto the substrate loading section 3. The substrate storage section 2 is configured to store a sealed substrate W (resin molded product). The substrate loading section 3 is configured to move in the direction of arrow Y between a position corresponding to the substrate supply section 1 and a position corresponding to the substrate storage section 2. The substrate conveying mechanism 4 is configured to move in the direction of arrow X and the direction of arrow Y in module A and each module B. The substrate conveying mechanism 4, for example, holds the pre-sealed substrate W on the substrate loading section 3 and conveys it to module B, so that the sealed substrate W is loaded on the substrate loading section 3.

[0060] Each module B includes a compression molding section 5. The compression molding section 5 is configured to manufacture a sealed substrate W (resin molded product) by compression molding. Granular resin material P is used in the compression molding. The color of the resin material P is, for example, black. The compression molding section 5 includes an upper mold 52 (first molding mold), a lower mold 51 (second molding mold) opposite to the upper mold 52, and a clamping mechanism 53. The upper mold 52 is configured to hold the substrate W on the lower surface. The lower mold 51 includes a bottom member and a side member. The bottom member constitutes the bottom surface of the cavity 51C, and the side member constitutes the side surface of the cavity 51C. That is, a concave cavity 51C is formed by the bottom member and the side member. Resin material P is arranged in the cavity 51C. The clamping mechanism 53 is configured to clamp the upper mold 52 and the lower mold 51.

[0061] The module C includes a moving table 6, a resin material storage section 7, a resin material supply mechanism 8, a release film supply section (not shown), an imaging section 300, and a resin material conveying mechanism 9. The moving table 6 is configured to move in the module C in the direction of arrow X and the direction of arrow Y. The resin material storage section 7 includes a release film 73 and a frame member 72 (see FIG. Figure 2 、 3 The resin material is supplied to the resin material storage section 7. A release film 73 forms the bottom surface of the resin material storage section 7, and a frame member 72 forms the side surface of the resin material storage section 7. A space (recess 71) corresponding in size to the cavity 51C of the lower mold 51 is formed in the frame member 72. The resin material storage section 7 is placed on the movable stage 6.

[0062] The resin material supply mechanism 8 is configured to supply the resin material P from above the resin material storage section 7 to the resin material storage section 7. The resin material P dropped from the discharge port of the resin material supply mechanism 8 is moved relative to the discharge port of the resin material supply mechanism 8 by the moving table 6, and is evenly distributed in the recess 71 of the resin material storage section 7.

[0063] Figure 22 is a cross-sectional view schematically showing the resin material supply mechanism 8. The resin material supply mechanism 8 is configured to supply a resin material P of a predetermined weight to the resin material storage portion 7.

[0064] like Figure 2 As shown, the resin material supply mechanism 8 includes a storage unit 11, a conveying passage 12, a vibrating unit 13, and a measuring unit 16. The storage unit 11 is configured to temporarily store granular resin material P. The conveying passage 12 is a conveying passage for the resin material P flowing from the storage unit 11. The vibrating unit 13 is configured to vibrate the conveying passage 12 to convey the resin material P to the discharge port. The measuring unit 16 is configured to measure the weight of the resin material P within the resin material supply mechanism 8. Based on the measurement results of the measuring unit 16, the PLC 14 controls the vibrating unit 13 so that the supply amount of the resin material P to the resin material storage unit 7 reaches a target value.

[0065] Refer again Figure 1 The imaging unit 300 is configured to capture the resin material P supplied to the resin material storage unit 7 from above and generate image data.

[0066] Figure 3 3 is a diagram for explaining the shooting state based on the shooting unit 300. Figure 3 As shown, the imaging unit 300 captures an image of the resin material P in the recess 71 of the resin material storage unit 7, for example, when the movable stage 6 is located below the imaging unit 300. The imaging unit 300 is configured as a camera module including an image sensor such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0067] Refer again Figure 1 The resin material feeding mechanism 9 is configured to move in the direction of arrow X and the direction of arrow Y in the modules C and B. The resin material feeding mechanism 9 is configured to feed the resin material storage portion 7 containing the resin material P toward the lower mold 51 and supply the resin material P to the cavity 51C of the lower mold 51.

[0068] The resin molding apparatus 100 further includes a HDD (Hard Disc Drive) 200 and a control unit 150. The HDD 200 is configured to store image data generated by the imaging unit 300. The HDD 200 may be replaced with another storage medium such as a solid state drive.

[0069] The control unit 150 includes a CPU, a RAM, a ROM, and the like, and is configured to perform control of the imaging unit 300 and the like based on information processing. Various controls by the control unit 150 and the PLC 14 will be described in detail later.

[0070] [2. Suppression of thickness deviation of resin molded products]

[0071] In recent years, the thinning of semiconductor packages (an example of resin molded products) has continued to develop, and the market is seeking products with a thickness of, for example, 0.38mm or 0.43mm. On the other hand, regarding the quality of the molding process, there is a situation where the thickness within a resin molded product deviates. In thinner resin molded products, slight deviations in thickness have a greater impact on the quality of the resin molded product. The thickness deviation within a resin molded product refers to the thickness deviation within the surface of a resin molded product, and is the thickness deviation of multiple parts within the resin molded product, rather than the thickness deviation when the thickness of multiple resin molded products is compared.

[0072] This problem becomes significant when, for example, the resin material P is not uniformly supplied to the recessed portion 71 of the resin material receiving portion 7. That is, when resin molding is performed with insufficient resin material P in a portion of the recessed portion 71, the thickness of the finished resin molded product varies from region to region.

[0073] Figure 4 1 is a diagram showing an example of the recessed portion 71 in a state where the resin material P is supplied. Figure 4 As shown, recess 71 includes region T30 and region T40. Resin material P is adequately supplied to region T30, but insufficiently supplied to region T40. In the insufficiently supplied region, the bottom surface of recess 71 is exposed. The bottom surface of recess 71 is a color closer to white than the resin material P.

[0074] In the resin molding apparatus 100 according to this embodiment, the resin material P supplied to the resin material storage section 7 is imaged by the imaging unit 300 before resin molding. The control unit 150 analyzes the image data generated by the imaging unit 300 and controls the resin material supply mechanism 8 based on the analysis results. In the resin molding apparatus 100, since the resin material supply mechanism 8 is controlled based on the analysis results of the supply state of the resin material P in the recess 71, the supply state of the resin material P in the recess 71 is improved. As a result, the resin molding apparatus 100 can prevent the production of resin molded products with thickness variations within a single resin molded product. The operation of the resin molding apparatus 100 will be described in detail below.

[0075] [3. Operation of the resin molding device]

[0076] Figure 5 This is a flowchart showing a partial operational sequence in resin molding apparatus 100. The processing shown in this flowchart is executed when resin material storage unit 7 is located below the discharge port of resin material supply mechanism 8. The processing shown in the left flowchart is executed by PLC 14, while the processing shown in the right flowchart is executed by control unit 150.

[0077] Reference Figure 5 On the left side of the resin material container 7, the PLC 14 controls the resin material supply mechanism 8 to discharge the resin material P toward the resin material container 7 (step S100). The PLC 14 determines whether the discharge of the resin material P has been completed (step S110). If it is determined that the discharge of the resin material P has not been completed ("No" in step S110), the PLC 14 continues to perform the necessary processing for the discharge of the resin material P. For example, the PLC 14 moves the movable stage 6 so that the resin material P is evenly supplied to the recess 71 of the resin material container 7.

[0078] On the other hand, when it is determined that the discharge of the resin material P is completed (YES in step S110 ), the PLC 14 transmits a signal (imaging instruction signal) instructing imaging by the imaging unit 300 to the control unit 150 ( S120 ).

[0079] Reference Figure 5 On the right side, the control unit 150 determines whether a shooting instruction signal is received from the PLC 14 (step S200). When it is determined that the shooting instruction signal is not received ("No" in step S200), the control unit 150 waits until a shooting instruction signal is received.

[0080] On the other hand, if the control unit 150 determines that the imaging instruction signal has been received ("YES" in step S200), the control unit 150 controls the imaging unit 300 to capture the resin material P in the recess 71 of the resin material storage unit 7 from above and generate image data (step S210). The control unit 150 controls the imaging unit 300 to store the image data generated by the imaging unit 300 in the HDD 200 (step S220). The control unit 150 performs image data analysis processing (step S230).

[0081] Figure 6 Yes Figure 5 Flowchart of the analysis process performed in step S230. Figure 6 The control unit 150 reads the image data stored in the HDD 200 (step S300 ) and applies grayscale processing and binarization processing to the read image data (step S310 ).

[0082] In grayscale processing, each pixel of image data is classified into 256 levels, ranging from 0 (dark) to 255 (light). For example, a white pixel is assigned "255," and a black pixel is assigned "0." In binarization processing, each pixel of image data is classified as either "white" or "black." For example, pixels assigned a value greater than a threshold value X1 (e.g., 200) through grayscale processing are classified as "white," while pixels assigned a value less than the threshold value X1 through grayscale processing are classified as "black."

[0083] Figure 7 71 is a diagram for explaining the area included in the image data representing the concave portion 71. Figure 7 As shown, the image data includes regions T1 to T18.

[0084] Refer again Figure 6 The control unit 150 calculates numerical data corresponding to each of the regions T1-T18 included in the image data (step S320). In this embodiment, this numerical data is the number of pixels classified as "white" in each region. Specifically, in step S320, the number of pixels classified as "white" in each of the regions T1-T18 is calculated. A large number of pixels classified as "white" indicates that the resin material P is not being supplied uniformly and that a wide area of ​​the surface of the resin material storage portion 7 is exposed.

[0085] The control unit 150 compares the numerical data calculated in step S320 with a threshold value X2 (e.g., 10) and determines whether a problem exists in each of regions T1-T18 (step S330). For example, the control unit 150 determines that regions where the numerical data exceeds the threshold value X2 are "unacceptable (NG)" and regions where the numerical data is below the threshold value X2 are "acceptable (OK)." Specifically, in step S320, the control unit 150 determines whether a shortage of resin material P exists in each region of the resin material storage section 7 corresponding to each of regions T1-T18 (whether the number of "white" pixels is greater than the threshold value X2). Based on the comparison results in step S330, the control unit 150 generates analysis data (step S340).

[0086] Figure 8 This is a diagram showing an example of analysis data. Figure 8 As shown, the analysis data D1 includes the OK / NG determination result in each area of ​​the image data and the number of pixels classified as “white” in each area of ​​the image data.

[0087] Refer again Figure 5 On the right side, when the image analysis is completed in step S230, the control unit 150 sends the analysis data D1 to the PLC 14 (step S240).

[0088] Refer again Figure 5On the left side, the PLC 14 determines whether the analysis data D1 has been received from the control unit 150 (step S130). If it is determined that the analysis data D1 has not been received ("No" in step S130), the PLC 14 waits until the analysis data D1 is received.

[0089] On the other hand, if the PLC 14 determines that the analysis data D1 has been received ("YES" in step S130), the PLC 14 determines whether there is a problem with the state of the resin material P in the resin material storage section 7 based on the analysis data D1 (step S140). For example, if any of the regions T1-T18 is determined to be "NG", the PLC 14 determines that there is a problem with the state of the resin material P in the resin material storage section 7 ("NG"). If none of the regions T1-T18 is determined to be "NG", the PLC 14 determines that there is no problem with the state of the resin material P in the resin material storage section 7 ("OK").

[0090] If it is determined that there is no problem with the state of the resin material P in the resin material storage section 7 ("OK" in step S140), the PLC 14 controls each component so as to transition to the resin molding process (step S150). In other words, even when the PLC 14 controls the resin material supply mechanism 8 next time, it does not specifically change the operating state of the resin material supply mechanism 8 and maintains the operating state of the resin material supply mechanism 8.

[0091] On the other hand, when it is determined that there is a problem with the state of the resin material P in the resin material storage section 7 ("NG" in step S140), the PLC14 performs processing for the case where it is determined to be "NG" (step S160). That is, the PLC14 changes the control content of the case where the resin material supply mechanism 8 is controlled next time and stores the changed content, and stops the resin molding device 100. For example, when the PLC14 controls the resin material supply mechanism 8 next time, it controls the resin material supply mechanism 8 in such a manner as to eliminate the shortage of the resin material P in the area (T1-T18) where it is determined that the shortage of the resin material P has occurred. More specifically, the PLC14 reduces the amount of the resin material P supplied to the area where the shortage of the resin material P has not occurred, and increases the amount of the resin material P supplied to the area where the shortage of the resin material P has occurred. As a result, the resin material P is uniformly supplied to the recess 71 of the resin material storage section 7.

[0092] [4. Features]

[0093] As described above, the resin molding apparatus 100 according to this embodiment is configured to manufacture resin molded products. The resin molding apparatus 100 includes a resin material supply mechanism 8, an imaging unit 300, and a control unit 150. The resin material supply mechanism 8 is configured to supply resin material P. The imaging unit 300 is configured to capture the supplied resin material P and generate image data. The control unit 150 is configured to analyze the image data and control the resin material supply mechanism 8 based on the analysis results.

[0094] In the resin molding apparatus 100, the supplied resin material P is imaged by the imaging unit 300. The control unit 150 analyzes the image data generated by the imaging unit 300 and controls the resin material supply mechanism 8 based on the analysis results. In the resin molding apparatus 100, since the resin material supply mechanism 8 is controlled based on the analysis results of the supply status of the resin material P, the supply status of the resin material P is improved. As a result, the resin molding apparatus 100 can prevent the production of resin molded products in which the thickness of the product varies within a single resin molded product.

[0095] [5. Other Implementation Methods]

[0096] The concept of the above embodiment is not limited to the above-described embodiment. Hereinafter, an example of another embodiment to which the concept of the above embodiment can be applied will be described.

[0097] In the above embodiment, the threshold X1 used to classify each pixel as "white" or "black" during the binarization process is common to each of the regions T1-T18. However, the threshold X1 can also be different for each region. Since the areas closer to the center of the image data are more important, for example, the threshold X1 used in the central regions T9 and T10 can be set to V1, the threshold X1 used in the relatively central regions T8 and T11 can be set to 1.1 times V1, and the threshold X1 used in the surrounding regions T1-T7 and T12-T18 can be set to 1.2 times V1. Therefore, in areas where insufficient resin material P is most affected, it is possible to more strictly detect the deficiency of resin material P. The reason why the areas closer to the center of the image data are more important will be further explained. The granular resin material P supplied to the resin material storage section 7 is transported and placed in the lower mold 51 of the forming mold. The resin material P is then melted by the heat of the forming mold, and the upper mold 52 and lower mold 51 are closed to form the resin. At this time, since the resin material P flows in a manner that spreads outward, insufficient resin material P in the central region can easily cause molding failure. For this reason, the region closer to the center of the image data is more important.

[0098] Furthermore, in the above embodiment, the threshold value X2 for comparing numerical data is common in each of regions T1-T18. However, the threshold value X2 for comparing numerical data may also be different for each region. Since regions closer to the center are more important, for example, the threshold value X2 in central regions T9 and T10 may be set to V2, the threshold value X2 used in regions T8 and T11 relatively close to the center may be set to 1.5 times V2, and the threshold value X2 used in surrounding regions T1-T7 and T12-T18 may be set to 2 times V2. For example, if image data includes a first region and a second region, the numerical data corresponding to the first region may be compared with a first threshold value (e.g., V2), and the numerical data corresponding to the second region may be compared with a second threshold value (e.g., 1.5 times V2). In other words, the image data may be divided into multiple regions, a threshold value may be set for the numerical data corresponding to each region, and the numerical data may be compared with the threshold value. This allows for more rigorous detection of resin material P deficiencies in regions where deficiencies in the resin material P have a greater impact.

[0099] Furthermore, in the above embodiment, the imaging unit 300 captures images after the resin material P has been discharged. However, the timing of the imaging unit 300 capturing images is not limited to this. For example, the imaging unit 300 may be positioned near the discharge port of the resin material supply mechanism 8, or the imaging unit 300 may continuously capture the dynamic image of the recess 71 while the resin material supply mechanism 8 is supplying the resin material P. In this case, the control unit 150 can determine in real time whether there is a problem with the state of the resin material P in the resin material storage unit 7 based on the captured dynamic image data, and can also adjust the control content of the resin material supply mechanism 8 in real time.

[0100] Furthermore, in the above-described embodiment, the control details of the resin material supply mechanism 8 are not changed unless the numerical data exceeds the threshold value X2 in any of the regions T1-T18. However, the conditions for changing the control details of the resin material supply mechanism 8 are not limited to this. For example, as long as there are pixels classified as "white" during the binarization process, the control details of the resin material supply mechanism 8 may be changed to eliminate such pixels. Furthermore, even in this case, the resin molding apparatus 100 is not forcibly stopped unless the numerical data exceeds the threshold value X2 in any of the regions T1-T18.

[0101] Furthermore, in the above embodiment, image analysis is performed using grayscale processing and binarization. However, the image analysis techniques are not limited thereto. For example, areas of insufficient resin material P in the concave portion 71 can be detected based on the results of concave-convex measurement using a 3D image of the concave portion 71. Alternatively, areas of insufficient resin material P in the concave portion 71 can be detected using pattern matching, statistical methods, or AI (artificial intelligence).

[0102] Furthermore, in the above embodiment, when it is determined that there is a problem in the state of the resin material P in the resin material storage portion 7 (in Figure 5 If the result of step S140 is "NG," the PLC 14 will, starting from the next step, reduce the amount of resin material P supplied to areas where there is no shortage of resin material P and increase the amount of resin material P supplied to areas where there is a shortage of resin material P. However, the control content of the PLC 14 starting from the next step is not limited to this. For example, the PLC 14 may refer to the analysis data D1 and significantly reduce the amount of resin material P supplied to areas with fewer pixels classified as "white" and significantly increase the amount of resin material P supplied to areas with more pixels classified as "white."

[0103] Furthermore, in the above embodiment, the resin molding apparatus 100 is controlled by the PLC 14 and the control unit 150. However, the control by the PLC 14 and the control unit 150 may be realized by, for example, one computer or three or more computers.

[0104] In the above embodiment, the resin molding apparatus 100 includes the HDD 200. However, the resin molding apparatus 100 does not necessarily need to include the HDD 200. The HDD 200 may be stored on a cloud server, for example. In this case, the control unit 150 accesses the cloud server via a communication unit (not shown).

[0105] The embodiments of the present invention have been described above by way of example. Specifically, the detailed description and accompanying drawings are provided for illustrative purposes. Therefore, the components described in the detailed description and accompanying drawings include components that are not essential for achieving the desired effect. Therefore, the fact that non-essential components are described in the detailed description and accompanying drawings does not necessarily mean that these non-essential components are immediately essential.

[0106] Furthermore, the above-described embodiments are merely examples of the present invention in all respects. Various modifications or changes can be made to the above-described embodiments within the scope of the present invention. That is, in the implementation of the present invention, specific structures can be appropriately adopted according to the embodiments.

Claims

1. A resin molding device configured to manufacture a resin molded product, comprising: a resin material supply mechanism configured to supply the resin material; a resin material storage portion configured to receive the supplied resin material; an imaging unit configured to image the supplied resin material from above and generate image data; a control unit configured to analyze the image data and control the resin material supply mechanism based on an analysis result; a forming die comprising an upper die and a lower die opposite to the upper die; and A mold clamping mechanism is used to clamp the forming mold. The image data includes a plurality of regions, The control unit is configured to generate numerical data corresponding to each of the plurality of areas based on the image data, and analyze the image data by comparing each numerical data with a threshold value. The plurality of regions include a first region and a second region different from the first region, The threshold value includes a first threshold value and a second threshold value different from the first threshold value, comparing the numerical data corresponding to the first region with the first threshold, comparing the numerical data corresponding to the second region with the second threshold, The first threshold value and the second threshold value are determined based on a flow state of the resin material when the resin material is formed by the forming die.

2. The resin molding device according to claim 1, wherein The control unit is configured to analyze the image data by performing grayscale processing and binarization processing on the image data.

3. The resin molding device according to claim 1 or 2, wherein: The control unit is configured to determine whether a shortage of the resin material occurs in each area to which the resin material corresponding to each of the multiple areas is supplied by comparing each of the numerical data with the threshold value, and to control the resin material supply mechanism in a manner to eliminate the shortage in the area determined to have occurred.

4. The resin molding device according to claim 1 or 2, wherein: The control unit is configured to control the resin material supply mechanism so as to maintain an operating state when the analysis result satisfies a predetermined condition, and to control the resin material supply mechanism so as to change an operating state when the analysis result does not satisfy the predetermined condition.

5. The resin molding device according to claim 1 or 2, wherein: The first region corresponds to one of a central region in the resin material storage portion and a peripheral region excluding the central region in the resin material storage portion, and the second region corresponds to the other of the central region and the peripheral region.

6. A method for manufacturing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 5, the method comprising: a step of supplying a resin material; a step of photographing the supplied resin material from above and generating image data; analyzing the image data and controlling the resin material supply mechanism based on the analysis result; a step of disposing the supplied resin material on a lower mold; as well as The resin molding step is performed by clamping the upper mold and the lower mold.

Images