Phase modulator and phase modulator array comprising a phase modulator

Abstract

A phase modulator is provided, including: an antenna pattern; a lower reflective layer spaced apart from the antenna pattern in a vertical direction; a spacer disposed between the antenna pattern and the lower reflective layer; and a phase shift pattern included in the spacer, the phase shift pattern including a phase shift material.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Patent Application No. 63 / 049,903, filed July 9, 2020 with the United States Patent and Trademark Office, and to Korean Patent Application No. 10-2021-0037549, filed March 23, 2021 with the Korean Intellectual Property Office, and Korean Patent Application No. 10-2021-0061637, filed May 12, 2021 with the Korean Intellectual Property Office, the disclosures of which are incorporated herein by reference in their entirety. Technical Field

[0003] The exemplary embodiments of this disclosure relate to phase modulators and phase modulator arrays. Background Technology

[0004] Optical modulators, which alter the transmission / reflection / scattering characteristics, phase, amplitude, polarization, intensity, and path of light, are used in various optical devices. To control the properties of light in a desired manner within optical systems, optical modulators with various structures have been proposed. For example, liquid crystals with optical anisotropy and microelectromechanical systems (MEMS) structures using light-blocking / reflecting elements with micromechanical motion are used in common optical modulators. Due to the characteristics of the driving method, optical modulators are limited in terms of operational response time. In the case of MEMS structures, it is necessary to correct for the nonlinearity of the voltage-displacement characteristics and ensure an optimized driving voltage distribution to compensate for the effects of vibrations in the motion system.

[0005] Recently, attempts have been made to use metastructures that utilize surface plasmons or gap surface plasmons for incident light in optical modulation devices. Summary of the Invention

[0006] One or more example embodiments provide a phase modulator that stably maintains an overcoupled state, and a phase modulator array including the phase modulator.

[0007] One or more example embodiments also provide a phase modulator with improved light reflection properties, and a phase modulator array including the phase modulator.

[0008] One or more example embodiments also provide a phase modulator with degrees of freedom regarding the distance between an antenna pattern and a phase shift pattern, and a phase modulator array including the phase modulator.

[0009] However, the objectives to be achieved are not limited to those disclosed above.

[0010] Additional aspects will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings or can be learned by practice of the example embodiments of the disclosure.

[0011] According to an aspect of an example embodiment, a phase modulator includes an antenna pattern, a lower reflective layer spaced apart from the antenna pattern in a vertical direction, a spacer disposed between the antenna pattern and the lower reflective layer, and a phase shift pattern including a phase shift material in the spacer.

[0012] The phase shift pattern can be surrounded by the spacer.

[0013] A thickness of a portion of the spacer disposed between the phase shift pattern and the antenna pattern in the vertical direction can be greater than a thickness of another portion of the spacer disposed between the phase shift pattern and the lower reflective layer in the vertical direction.

[0014] The phase shift pattern can overlap the antenna pattern in the vertical direction.

[0015] The phase shift pattern can be disposed in an effective resonator region configured to generate a gap plasmon in the spacer.

[0016] A width of the antenna pattern in a horizontal direction perpendicular to the vertical direction ranges from 50 nm to 2000 nm.

[0017] A width of the phase shift pattern in the horizontal direction perpendicular to the vertical direction can be the same as the width of the antenna pattern in the horizontal direction.

[0018] The phase modulator can further include a power source configured to apply a voltage to the antenna pattern, wherein the antenna pattern is configured to generate heat based on the voltage applied to the antenna pattern.

[0019] The phase shift pattern can be spaced apart from the antenna pattern such that, based on heat generated from the antenna pattern, a difference between a highest temperature of the phase shift pattern and a lowest temperature of the phase shift pattern is minimized.

[0020] The phase shift pattern can be spaced apart from the antenna pattern such that, based on heat generated from the antenna pattern, the lowest temperature of the phase shift pattern is greater than or equal to 280℃.

[0021] The antenna pattern can include a plurality of antenna patterns disposed in a horizontal direction perpendicular to the vertical direction, the phase shift pattern can include a plurality of phase shift patterns disposed between the plurality of antenna patterns and the lower reflective layer, the plurality of antenna patterns can have the same shape, and the plurality of phase shift patterns can be disposed in the horizontal direction.

[0022] The phase modulator can further include a power source configured to apply the same voltage to the plurality of antenna patterns, respectively, wherein the plurality of antenna patterns are configured to generate heat based on the voltage applied to the plurality of antenna patterns.

[0023] According to an aspect of an example embodiment, there is provided a phase modulator array including: a first phase modulator; a second phase modulator spaced apart from the first phase modulator in a horizontal direction; a first power source configured to apply a voltage to the first phase modulator; and a second power source configured to apply a voltage to the second phase modulator, wherein each of the first phase modulator and the second phase modulator includes: an antenna pattern disposed in the horizontal direction; a lower reflection layer spaced apart from the antenna pattern in a vertical direction perpendicular to the horizontal direction; a spacer disposed between the antenna pattern and the lower reflection layer; and a phase shift pattern included in the spacer and disposed in the horizontal direction, the phase shift pattern including a phase shift material, respectively.

[0024] The first power source can be further configured to apply a first voltage to the antenna pattern included in the first phase modulator, the second power source can be configured to apply a second voltage to the antenna pattern included in the second phase modulator, and the first voltage and the second voltage can be independent of each other.

[0025] A number of the phase shift pattern included in the first phase modulator can be the same as a number of the phase shift pattern included in the second phase modulator.

[0026] The spacer included in the first phase modulator and the spacer included in the second phase modulator can be different portions of one dielectric film.

[0027] The phase modulator array can further include a trench disposed between the first phase modulator and the second phase modulator, wherein the trench exposes the lower reflection layer.

[0028] The phase modulator array can further include an insulating pattern disposed in the trench, wherein a thermal conductivity of the insulating pattern is lower than a thermal conductivity of the spacer.

[0029] In each of the first phase modulator and the second phase modulator, the phase shift pattern can be surrounded by the spacer.

[0030] In each of the first phase modulator and the second phase modulator, a thickness of a portion of the spacer disposed between the phase shift pattern and the antenna pattern in the vertical direction can be greater than a thickness of another portion of the spacer disposed between the phase shift pattern and the lower reflection layer in the vertical direction.

[0031] According to an aspect of example embodiments, there is provided a phase modulator comprising: an antenna pattern; a lower reflective layer spaced apart from the antenna pattern in a vertical direction; a spacer disposed between the antenna pattern and the lower reflective layer, the spacer comprising a dielectric material; and a phase shift pattern comprised in the spacer, the phase shift pattern comprising a phase shift material. BRIEF DESCRIPTION OF DRAWINGS

[0032] The above and / or other aspects, features, and advantages of the example embodiments of the present disclosure will be more apparent from the following description taken in conjunction with the following drawings, in which:

[0033] Figure 1 is a perspective view of a phase modulator according to example embodiments;

[0034] Figure 2 is a cross-sectional view of the phase modulator taken along line I-I' of Figure 1

[0035] Figure 3A is a plot of the real part of the refractive index of the phase shift pattern of Figure 1

[0036] Figure 3B is a plot of the imaginary part of the refractive index of the phase shift pattern of Figure 1

[0037] Figure 4A is a plot of the reflection phase of the phase modulator for an image of the phase shift pattern according to Figure 1

[0038] Figure 4B is a plot of the reflectivity of the phase modulator for an image of the phase shift pattern according to Figure 1

[0039] Figure 5 is a plot of the modulation phase of the phase modulator according to Figure 1

[0040] Figure 6 is a perspective view of a phase modulator according to example embodiments;

[0041] Figure 7 is a cross-sectional view of the phase modulator taken along line II-II' of Figure 6

[0042] Figure 8 is a perspective view of a phase modulator array according to example embodiments;

[0043] Figure 9 is a perspective view of a phase modulator array according to example embodiments;

[0044] Figure 10 ​​​​​​​is a perspective view of a phase modulator array according to an example embodiment;

[0045] Figure 11 is a conceptual diagram of a light beam steering device according to an example embodiment;

[0046] Figure 12 is a conceptual diagram of a light beam steering device according to an example embodiment;

[0047] Figure 13 is a block diagram of an electronic device according to an example embodiment;

[0048] Figure 14 and Figure 15 is a conceptual diagram illustrating a case in which a light detection and ranging (LiDAR) device according to an example embodiment is applied to a vehicle;

[0049] Figure 16 is a conceptual diagram of a holographic display device according to an example embodiment;

[0050] Figure 17 is a schematic block diagram of a configuration of an electronic device according to an example embodiment;

[0051] Figure 18 is a schematic block diagram of a configuration of a camera module provided in an electronic device of Figure 17 ;

[0052] Figure 19 is a schematic block diagram of a configuration of a 3D sensor provided in an electronic device of Figure 17 ;

[0053] Figure 20 is a schematic block diagram of a configuration of an electronic device according to an example embodiment; and

[0054] Figure 21 is a schematic block diagram of an eye tracking sensor provided in an electronic device of Figure 20 . DETAILED DESCRIPTION

[0055] Reference will now be made in detail to the example embodiments, which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout. In this regard, the example embodiments can have different forms and should not be construed as being limited to the descriptions set forth herein. Accordingly, the example embodiments are merely described below, by referring to the drawings, to explain aspects. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding the term "comprising," "including," "containing," "characterized by," "comprised of," "including by reference," "having," "including," "with," or "wherein," indicate that the description using those phrases can include additional items not expressly stated. For example, the phrase "at least one of a, b, and c," should be construed to mean a, b, c, a-b, a-c, b-c, or a-b-c, where "a," "b," and "c" are members of sets.

[0056] Hereinafter, example embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Like reference numerals refer to like elements throughout the drawings. The size of components in the drawings can be exaggerated for the convenience of explanation. In the foregoing, although example embodiments have been described, these are merely examples and those skilled in the art to which the present disclosure pertains can make various modifications and changes from these descriptions.

[0057] When a constituent element is disposed "above" or "on" another constituent element, the constituent element can be directly on the other constituent element only or above the other constituent element in a non-contact manner.

[0058] Expressions used in the specification are used as descriptions and do not limit the scope of the present disclosure. Singular forms are intended to include plural forms unless otherwise clearly specified in the context. When a part "can" be included, it should be interpreted to mean that the part can or can not be included unless otherwise clearly specified in the context. The term "a number of" used herein should be interpreted as "one or more". Unless otherwise defined, all terms used herein, including technical terms and scientific terms, have the same meaning as those understood by one of ordinary skill in the art to which the present disclosure pertains. Terms defined in a dictionary should be interpreted as having a meaning that is the same as or similar to the meaning in the context of the related art, and should not be interpreted to have an ideal or excessively formal meaning unless otherwise clearly defined in the present disclosure.

[0059] In addition, terms such as "part," "unit," "module," and "block" stated in the specification can represent a unit processing at least one function or operation.

[0060] Figure 1 is a perspective view of a phase modulator 10 according to an example embodiment; Figure 2 is a cross-sectional view of the phase modulator 10 taken along line I-I' of Figure 1 Figure 3A is a graph of the real part of the refractive index of the phase shift pattern of Figure 1 Figure 3B is a graph of the imaginary part of the refractive index of the phase shift pattern of Figure 1 Figure 4A is a graph of the reflection phase of the phase modulator 10 according to the phase shift pattern of Figure 1 Figure 4B is a graph of the reflection phase of the phase modulator 10 according to the phase shift pattern of Figure 1 ​​​​a graph of the reflectivity of the phase modulator 10 of the image of the phase shift pattern. Figure 5 is Figure 1 a graph of the modulation phase of the phase modulator 10.

[0061] Referring to Figure 1 and Figure 2 , a phase modulator 10 can be provided. The phase modulator 10 can include a lower reflection layer 100, an antenna pattern 200, a spacer 300, a phase shift pattern 400, and a power element 500. The lower reflection layer 100 can extend in a first direction DR1 (e.g., a horizontal direction) and a second direction DR2 that intersect each other. The lower reflection layer 100 can include a conductive material. For example, the lower reflection layer 100 can include at least one metal selected from the group consisting of copper (Cu), aluminum (Al), nickel (Ni), iron (Fe), cobalt (Co), zinc (Zn), titanium (Ti), ruthenium (Ru), rhodium (Rh), palladium (Pd), platinum (Pt), osmium (Os), iridium (Ir), silver (Ag), gold (Au), and the like, or an alloy including at least one of the metals. However, embodiments are not limited thereto. For example, the lower reflection layer 100 can include a thin film in which metal nanoparticles of Ag, Au, and the like are distributed, a carbon nanostructure such as graphene or a carbon nanotube (CNT), a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), polypyrrole (PPy), poly(3-hexylthiophene) (P3HT), and the like, a conductive oxide, and the like.

[0062] The antenna pattern 200 can be disposed on the lower reflective layer 100. The antenna pattern 200 can be spaced apart from the lower reflective layer 100 by a first distance t5 in a third direction DR3 (e.g., a vertical direction) perpendicular to the first direction DR1 and the second direction DR2. For example, when the phase modulator 10 modulates a near-infrared phase having a wavelength of 1550 nanometers (nm), the first distance t5 can be 30 nm to 800 nm. The antenna pattern 200 can have a first width w1 and a first thickness t1. The first width w1 can be a size of the antenna pattern 200 in the first direction DR1. The first thickness t1 can be a size of the antenna pattern 200 in the third direction DR3. The first width w1 and the first thickness t1 can be smaller than a wavelength of an electromagnetic wave incident on the phase modulator 10. For example, the first width w1 and the first thickness t1 can be several tens to several hundreds of nanometers. In an example, the first width w1 can be 50 nm to 2000 nm with respect to an electromagnetic wave of a near-infrared band. The antenna pattern 200 can have a first side surface 201 in the first direction DR1 and a second side surface 202 in a fourth direction DR4 opposite the first direction DR1. The antenna pattern 200 can include a conductive material. For example, the antenna pattern 200 can include at least one metal selected from the group consisting of Cu, Al, Ni, Fe, Co, Zn, Ti, Ru, Rh, Pd, Pt, Os, Ir, Ag, Au, and the like, and an alloy including at least one of the metals. However, embodiments are not limited thereto. For example, the antenna pattern 200 can include a thin film in which metal nanoparticles such as Ag, Au, and the like are distributed, a carbon nanostructure such as graphene or CNT, a conductive polymer such as PEDOT, PPy, P3HT, and the like, a conductive oxide, and the like. In an example, the antenna pattern 200 can include the same material as the lower reflective layer 100.

[0063] The spacer 300 can be disposed between the lower reflective layer 100 and the antenna pattern 200. The spacer can include a dielectric material. For example, the spacer 300 can include a dielectric silicon compound (e.g., silicon oxide (SiOx), silicon nitride (SiNx), or silicon oxynitride (SiON)) or a dielectric metal compound (e.g., aluminum oxide (Al2O3), hafnium oxide (HfO), zirconium oxide (ZrO), or hafnium silicon oxide (HfSiO)). x N y ) or a dielectric metal compound (e.g., aluminum oxide (Al2O3), hafnium oxide (HfO), zirconium oxide (ZrO), or hafnium silicon oxide (HfSiO)).

[0064] The first reflective boundary 301 and the second reflective boundary 302 in the spacer 300 can be determined by the antenna pattern 200. The first reflective boundary 301 can be a boundary from which a gap plasma propagating in the spacer 300 in the first direction DR1 is reflected in the fourth direction DR4. The gap plasma is described below. The second reflective boundary 302 can be a boundary from which a gap plasma propagating in the spacer 300 in the fourth direction DR4 is reflected in the first direction DR1. The first reflective boundary 301 and the second reflective boundary 302 can be aligned with the first side surface 201 and the second side surface 202 of the antenna pattern 200, respectively. An area between the first reflective boundary 301 and the second reflective boundary 302 can be referred to as an effective resonator area. The first reflective boundary 301 and the second reflective boundary 302 can be spaced apart from each other by a second distance w3 in the first direction DR1. The second distance w3 can be referred to as an effective resonator length. The second distance w3 can be substantially the same as the first width w1.

[0065] The lower reflective layer 100, the spacer 300, and the antenna pattern 200 can form a gap plasma resonator having a metal-dielectric-metal (MIM) structure. The gap plasma is a coupling of photons and electrons resonating in a dielectric of the MIM structure. The gap plasma resonator including the lower reflective layer 100, the antenna pattern 200, and the spacer 300 uses a resonance condition for generating a gap plasma, which is shown in Equation 1 below.

[0066]

[0067] Here, λ0is a wavelength of an incident electromagnetic wave, l is a width (w1) of the antenna pattern 200, n eff is an effective refractive index of the gap plasma, is a reflection phase of the gap plasma when being reflected from the first reflective boundary 301 and the second reflective boundary 302, and m is a resonance order.

[0068] The phase shift pattern 400 can be disposed in the spacer 300. The phase shift pattern 400 can be inserted into the spacer 300. The phase shift pattern 400 can be surrounded by the spacer 300. For example, the spacer 300 can be disposed on the upper surface, the lower surface, and the two side surfaces of the phase shift pattern 400. The phase shift pattern 400 can overlap the antenna pattern 200 in the third direction DR3. The phase shift pattern 400 can be spaced apart from the lower reflective layer 100 in the third direction DR3 by a third distance t3. The phase shift pattern 400 and the antenna pattern 200 can be spaced apart from each other in the third direction DR3 by a fourth distance t4. The fourth distance t4 can be greater than the third distance t3. The phase shift pattern 400 can be located between the first reflective boundary 301 and the second reflective boundary 302. The phase shift pattern 400 can have a second width w2 and a second thickness t2. The second width w2 can be a size of the phase shift pattern 400 in the first direction DR1. The second thickness t2 can be a size of the phase shift pattern 400 in the third direction DR3. Although the second width w2 is illustrated as being smaller than the first width w1, embodiments are not limited thereto. In another example, the second width w2 can be equal to or greater than the first width w1. The phase shift pattern 400 can include a phase shift material. For example, the phase shift pattern 400 can include germanium antimony telluride (GeSbTe) or vanadium oxide (VO2).

[0069] The power element 500 can be a power source electrically connected to the antenna pattern 200. The power element 500 can apply an AC voltage to both end portions of the antenna pattern 200. For example, the both end portions of the antenna pattern 200 can be spaced apart from each other in the second direction DR2. When the power element 500 applies the AC voltage to the antenna pattern 200, heat can be generated from the antenna pattern 200. The heat generated from the antenna pattern 200 can reach the phase shift pattern 400 and change the temperature of the phase shift pattern 400. Accordingly, the power element 500 can adjust the temperature of the phase shift pattern 400.

[0070] When the antenna pattern 200 generates heat, the temperature of the phase shift pattern 400 can change differently for each portion of the phase shift pattern 400 accordingly. For example, the temperature of a portion of the phase shift pattern 400 relatively close to the antenna pattern 200 can rise relatively quickly, and the temperature of other portions of the phase shift pattern 400 relatively far from the antenna pattern 200 can rise relatively slowly. The fourth distance t4 can be determined such that a difference between the highest temperature and the lowest temperature of the phase shift pattern 400 is minimized when heat is generated from the antenna pattern 200, thereby optimizing the phase modulator 10. For example, the lowest temperature of the phase shift pattern 400 can be about 280℃ or more. Since the fourth distance t4 is adjustable by the spacer 300 during the manufacturing of the phase modulator 10, there is a degree of freedom with respect to the fourth distance t4, and the phase modulator 10 can be optimized.

[0071] Referring toFigure 3A and Figure 3B The phase-shift pattern 400 can have a refractive index determined according to a phase. Figure 3A The real part of the refractive index according to the phase of the phase-shift pattern 400 is shown, and Figure 3B The imaginary part of the refractive index according to the phase of the phase-shift pattern 400 is shown. The phase of the phase-shift pattern 400 can be determined according to a temperature of the phase-shift pattern 400. For example, according to the temperature of the phase-shift pattern 400, the phase-shift pattern 400 can have an amorphous phase, a crystalline phase, and an intermediate phase. The real part and the imaginary part of the refractive index of the phase-shift pattern 400 having the intermediate phase can have values between the real part and the imaginary part of the refractive index of the phase-shift pattern 400 having the amorphous phase and the phase-shift pattern 400 having the crystalline phase. Figure 3A In this regard, the curve C1 indicates the real part of the refractive index when the phase-shift pattern 400 has the crystalline phase, and the curve A1 indicates the real part of the refractive index when the phase-shift pattern 400 has the amorphous phase. In this regard, Figure 3B In this regard, the curve C2 indicates the imaginary part of the refractive index when the phase-shift pattern 400 has the crystalline phase, and the curve A2 indicates the imaginary part of the refractive index when the phase-shift pattern 400 has the amorphous phase.

[0072] The real part of the difference in the refractive index according to the phase of the phase-shift pattern 400 can be related to the degree of movement of the reflection phase spectrum of the phase modulator 10 along the wavelength axis. As the real part of the difference in the refractive index increases, the reflection phase spectrum of the phase modulator can be significantly moved along the wavelength axis. For example, as Figure 3A indicated, when the phase-shift pattern 400 includes GST (Ge x Sb y Te z ), the real part of the difference in the refractive index in the near-infrared band (about 1550 nm band) can be 0.5 to 3.

[0073] Referring to Figure 4A the reflection phase spectrum C4 when the phase-shift pattern 400 has the crystalline phase can be a reflection phase spectrum moved along the wavelength axis from the reflection phase spectrum A4 when the phase-shift pattern 400 has the amorphous phase. Referring to Figure 5 , the phase modulator 10 according to an example embodiment can modulate the phase in the near-infrared band in a range of about 260℃. According to an example embodiment, the phase modulator 10 can have a large phase modulation width.

[0074] The amount of the imaginary part of the refractive index according to the phase of the phase-shift pattern 400 can be related to the light absorption rate of the phase-shift pattern 400. As the imaginary part of the refractive index decreases, the light absorption rate of the phase-shift pattern 400 also decreases. For example, as Figure 3BAs shown, the imaginary part A2 of the refractive index of the phase shift pattern 400 is about 0.1 in the amorphous phase, and the imaginary part C2 of the refractive index of the phase shift pattern 400 is about 0.5 to 2 in the crystalline phase, both of which are relatively small values.

[0075] The phase shift pattern 400 according to the example embodiment can be surrounded by the spacer 300. Since the spacer 300 includes a dielectric material, the imaginary part of the effective refractive index of the gap plasmon can be smaller than the imaginary part of the refractive index of the phase shift pattern 400. Thus, the imaginary part of the effective refractive index of the gap plasmon between the lower reflective layer 100 and the antenna pattern 200 can have a relatively small value. Referring to Figure 4B The phase modulator 10 of the present disclosure can have a high reflectivity of 40% or more in the near-infrared wavelength band. In Figure 4B , the curve C3 indicates the reflectivity when the phase shift pattern 400 has a crystalline phase, and the curve A3 indicates the reflectivity when the phase shift pattern 400 has an amorphous phase. The phase modulator 10 according to the example embodiment can have a low optical absorption rate.

[0076] The photons and electrons in the phase modulator 10 can have an over-coupling state. In this case, the reflection phase spectrum of the phase modulator 10 can gradually change in a range of about 360°. When the photons and electrons have an under-coupling state rather than an over-coupling state, the maximum phase difference can be about 180°. As the optical absorption rate of the phase modulator 10 decreases, the over-coupling state of the photons and electrons can be stably maintained in the phase modulator 10. According to the example embodiment, since the phase shift pattern 400 having a smaller imaginary part of the refractive index and the spacer 300 surrounding the phase shift pattern 400 can be used, the optical absorption rate of the phase modulator 10 can be reduced. Thus, the photons and electrons in the phase modulator 10 can stably have an over-coupling state.

[0077] Figure 6 is a perspective view of a phase modulator 11 according to an example embodiment. Figure 7 is a cross-sectional view of the phase modulator 11 taken along line II-II’ of Figure 6 For brief explanation, descriptions basically the same as those presented with reference to Figure 1 and Figure 2 may be presented.

[0078] With reference to Figure 6 and Figure 7 , the phase modulator 11 can be provided. The phase modulator 11 can include a lower reflective layer 100, an antenna pattern 200, a spacer 300, a phase shift pattern 400, and a power element 500. The lower reflective layer 100, the spacer 300, and the power element 500 can be substantially the same as those described with reference to Figure 1 and Figure 2 .

[0079] The antenna patterns 200 can be disposed in the spacer 300. Each of the antenna patterns 200 can be substantially the same as the antenna pattern 200 described with reference to Figure 1 and Figure 2 The antenna patterns 200 can be arranged along the first direction DR1. For example, an arrangement period ap of the antenna patterns 200 can be 100 nm to 4000 nm. The antenna patterns 200 can have substantially the same shape and size. Accordingly, the surface plasmon resonators respectively including the antenna patterns 200 can form a gap plasma by receiving electromagnetic waves having substantially the same wavelength. The power element 500 can be electrically connected to the antenna patterns 200. The power element 500 can apply substantially the same AC voltage to each of the antenna patterns 200. Accordingly, the antenna patterns 200 can generate substantially the same level of heat.

[0080] The phase shift patterns 400 can be disposed in the spacer 300. Each of the phase shift patterns 400 can be substantially the same as the phase shift pattern 400 described with reference to Figure 1 and Figure 2 The phase shift patterns 400 can be arranged along the first direction DR1. For example, a distance between the phase shift patterns 400 can be 20 nm to 2000 nm. The phase shift patterns 400 can respectively overlap the antenna patterns 200 in the third direction DR3. A third distance t3 and a fourth distance t4 of the phase shift patterns 400 can be substantially the same as those of the antenna patterns 200 described with reference to Figure 2 Due to the antenna patterns 200 generating substantially the same level of heat and the fourth distance t4 being the same, a temperature variation of the phase shift patterns 400 can be substantially the same.

[0081] Figure 8 is a perspective view of a phase modulator array 12 according to an example embodiment. For brevity, descriptions that are substantially the same as those presented with reference to Figure 6 and Figure 7 may not be provided.

[0082] With reference to Figure 8 , a phase modulator array 12 can be provided. The phase modulator array 12 can include a plurality of phase modulators 12a arranged in two dimensions. For example, the phase modulator array 12 can include phase modulators 12a arranged along a first direction DR1 and phase modulators 12a arranged along a second direction DR2, respectively. Each of the phase modulators 12a can be substantially the same as the phase modulator 12a described with reference to Figure 6 and Figure 7The described phase modulators 11 are substantially the same. The lower reflective layer 100 of the phase modulator 12a can be connected to the spacers 300, respectively. For example, the lower reflective layer 100 can be different portions of an integrally formed lower reflective layer, and the spacers 300 can be different portions of an integrally formed spacer. The phase modulator 12a can include the power elements 500, respectively. In each of the phase modulators 12a, the power elements 500 can apply substantially the same AC voltage to the antenna pattern 200. The power elements 500 can apply AC voltages independent of each other. For example, the power elements 500 included in one phase modulator 12a can apply a first AC voltage to the antenna pattern 200 included in the one phase modulator 12a, and the power elements 500 included in another phase modulator 12a can apply a second AC voltage, which is the same as or different from the first AC voltage, to the antenna pattern 200 included in the other phase modulator 12a. The phase modulators 12a can have light modulation properties independent of each other.

[0083] The phase modulator array 12 is not limited to a phase modulator array including the phase modulators 12a arranged in two dimensions. In another example, the phase modulator array 12 can include the phase modulators 12a arranged in one dimension (e.g., in the first direction DR1 or the second direction DR2).

[0084] Figure 9 is a perspective view of a phase modulator array 13 according to an example embodiment. For brevity of explanation, the description presented with reference to Figure 8 is substantially the same.

[0085] With reference to Figure 9 , the phase modulator array 13 can be provided. The phase modulator array 13 can include a plurality of phase modulators 13a arranged in two dimensions. Unlike the description presented with reference to Figure 8 , a trench TR can be provided between the spacers 300 of the respective phase modulators 13a. The trench TR can separate the spacers 300 from each other. The trench TR can extend between the spacers 300 in the first direction DR1 and the second direction DR2. The trenches TR can be connected to each other. The trench TR can expose the upper surface of the lower reflective layer 100. The trench TR can be filled with air. Since the thermal conductivity of air is lower than that of the spacers 300, the phase modulators 13a arranged adjacent and proximate to each other can be thermally separated from each other. For example, the influence of heat generated from the antenna pattern 200 in one phase modulator 13a on the phase shift pattern 400 in another phase modulator 13a adjacent to the one phase modulator 13a can be reduced or prevented.

[0086] The phase modulator array 13 is not limited to comprising phase modulators 13a arranged in two dimensions. In another example, the phase modulator array 13 can comprise phase modulators 13a arranged in one dimension, e.g. in the first direction DR1 or the second direction DR2.

[0087] Figure 10 is a perspective view of a phase modulator array 14 according to an example embodiment. For brevity of explanation, the description presented with reference to Figure 9 the same description as presented with reference to

[0088] with reference to Figure 10 , a phase modulator array 14 can be provided. The phase modulator array 14 can comprise a plurality of phase modulators 14a arranged in two dimensions. Unlike the description presented with reference to Figure 9 , a plurality of insulating patterns 14b can be provided in the trench TR. For example, the insulating patterns 14b can fill the trench TR. The insulating patterns 14b can extend in the first direction DR1 and the second direction DR2 and can be interconnected. The insulating patterns 14b can comprise a dielectric material having a lower thermal conductivity than the spacers 300. For example, when the spacers 300 comprise AI2O3, the insulating patterns 14b can comprise amorphous SiO2 having a lower thermal conductivity than AI2O3. Thus, phase modulators 14a arranged adjacent and proximate to each other can be thermally decoupled from each other. For example, the influence of heat generated from an antenna pattern 200 in one phase modulator 14a on a phase shift pattern 400 in another phase modulator 14a adjacent to the one phase modulator 14a can be reduced or prevented.

[0089] The phase modulator array 14 is not limited to comprising phase modulators 14a arranged in two dimensions. In another example, the phase modulator array 14 can comprise phase modulators 14a arranged in one dimension, e.g. in the first direction DR1 or the second direction DR2.

[0090] Figure 11 is a conceptual view of a beam steering device 1000A according to an example embodiment.

[0091] with reference to Figure 11 , a beam steering device 1000A can be provided. The beam steering device 1000A can comprise a non-mechanical beam scanning arrangement. The beam steering device 1000A can steer a light beam in one dimension. The beam steering device 1000A can steer the light beam in a first adjustment direction DD1 towards the object OBJ. The beam steering device 1000A can comprise one of the phase modulator arrays 12, 13 and 14 described with reference to Figure 8 , Figure 9 and Figure 10 .

[0092] Figure 12is a conceptual diagram of a light beam steering device 1000B according to an example embodiment.

[0093] Referring to Figure 12 , a light beam steering device 1000B can be provided. The light beam steering device 1000B can include a non-mechanical light beam scanning apparatus. The light beam steering device 1000B can steer a light beam in two-dimensional directions. For example, the light beam steering device 1000B can steer a light beam toward an object OBJ in a first adjustment direction DD1 and a second adjustment direction DD2 intersecting the first adjustment direction DD1. The light beam steering device 1000A can include one of the phase modulator arrays 12, 13, and 14 described with reference to Figure 8 , Figure 9 and Figure 10 .

[0094] Figure 13 is a block diagram of an electronic device A1 according to an example embodiment.

[0095] Referring to Figure 13 , an electronic device A1 can be provided. The electronic device A1 can include a light beam steering device 1000. The light beam steering device 1000 can be substantially the same as the light beam steering devices 1000A and 1000B of Figure 13 and Figure 14 . The electronic device A1 can include a light source in the light beam steering device 1000, or include a light source provided separately from the light beam steering device 1000.

[0096] The electronic device A1 can include a detection unit 1100 for detecting light steered by the light beam steering device 1000 and reflected by an object. The detection unit 1100 can include a plurality of light detection elements, and can further include an optical member. In addition, the electronic device A1 can further include a circuit unit 1200 connected to at least one of the light beam steering device 1000 or the detection unit 1100. The circuit unit 1200 can include an operation unit for acquiring and operating data, and can further include a driving unit, a control unit, etc. In addition, the circuit unit 1200 can further include a power supply unit, a memory, etc.

[0097] Although Figure 13 an example in which the electronic device A1 includes the light beam steering device 1000 and the detection unit 1100 in one device is shown, the light beam steering device 1000 and the detection unit 1100 can be provided in separate devices. In addition, the circuit unit 1200 can be connected to the light beam steering device 1000 or the detection unit 1100 in a wireless communication manner rather than in a wired manner. In addition, the configuration of the electronic device A1 of Figure 13 can be changed in various ways.

[0098] The beam steering device 1000 according to the above example embodiment can be applied to various electronic devices. In the example, the beam steering device 1000 can be applied to a light detection and ranging (LiDAR) device. The LiDAR device may include a phase-shifting device or a time-of-flight (TOF) device. Furthermore, the phase modulator or beam steering device including the phase modulator according to the example embodiment can be mounted on electronic devices, such as smartphones, wearable devices (augmented reality (AR) and virtual reality (VR) glasses, etc.), Internet of Things (IoT) devices, home appliances, tablet PCs, personal digital assistants (PDAs), portable multimedia players (PMPs), navigation systems, drones, robots, self-driving cars, autonomous vehicles, advanced driver assistance systems (ADAS), etc.

[0099] Figure 14 and Figure 15 This is a conceptual diagram illustrating the application of a LiDAR device 51 to a vehicle 50 according to an example embodiment.

[0100] Reference Figure 14 and Figure 15 The LiDAR device 51 can be applied to vehicle 50, and information about object 60 can be obtained by using the LiDAR device 51. Vehicle 50 can be a vehicle with autonomous driving capabilities. The LiDAR device 51 can detect objects or people present in the direction of travel of vehicle 50, i.e., object 60. The LiDAR device 51 can measure the distance to object 60 by using information such as the time difference between transmitted and detected signals. Figure 15 As shown, the LiDAR device 51 can obtain information about objects 61 that are closer to the scan area and objects 62 that are farther away from the scan area.

[0101] Figure 16 This is a conceptual diagram of a holographic display device 70 according to an example embodiment.

[0102] Reference Figure 16 A holographic display device 70 can be provided. The holographic display device 70 may include a backlight unit 71, a Fourier lens 72, a phase modulator 73, and an image processor 74. The phase modulator 73 may include a plurality of pixels arranged in a two-dimensional manner. The phase modulator 73 may include... Figure 8 to Figure 10In an example, the phase modulators 12a, 13a, and 14a included in the phase modulator arrays 12, 13, and 14, respectively, can correspond to individual pixels of the phase modulation device 73. In another example, the phase modulators 12a, 13a, and 14a included in the phase modulator arrays 12, 13, and 14 can be divided into a plurality of phase modulator groups, and the phase modulator groups can correspond to pixels of the phase modulation device 73. Each of the phase modulator groups can include phase modulators adjacent to each other.

[0103] The image processor 74 can be connected to the phase modulation device 73 in a wired or wireless manner. The phase modulation device 73 can receive a holographic data signal from the image processor 74. The phase modulation device 73 can control the phase of light according to the holographic data signal from the image processor 74.

[0104] The backlight unit 71 can emit coherent light. For example, the backlight unit 71 can include a laser diode to provide light having high coherence. In addition to the laser diode, the backlight unit 71 can include any light source capable of emitting light having spatial coherence. Furthermore, the backlight unit 71 can further include an optical system that amplifies light emitted from the laser diode and produces collimated parallel light having a uniform intensity distribution. Accordingly, the backlight unit 71 can provide parallel coherent light having a spatially uniform intensity distribution to the entire area of the phase modulation device 73.

[0105] The Fourier lens 72 can focus an image in a hologram or in space. For example, a hologram image can be reproduced on a focal plane of the Fourier lens 72, and the user's eye E can be disposed on the focal plane to see the hologram image. Although the Fourier lens 72 is located on an incident light surface of the phase modulation device 73 (i.e., between the backlight unit 71 and the phase modulation device 73), the position of the Fourier lens 72 is not limited thereto. For example, the Fourier lens 72 can be located on a light exit surface of the phase modulation device 73.

[0106] Figure 17 is a schematic block diagram of a configuration of an electronic device 2201 according to an example embodiment.

[0107] Referring to Figure 17In the network environment 2200, the electronic device 2201 can communicate with another electronic device 2202 through a first network 2298 (a short-range wireless communication network, etc.), or an electronic device 2204 and / or a server 2208 through a second network 2299 (a long-range wireless communication network, etc.). The electronic device 2201 can communicate with the electronic device 2204 through the server 2208. The electronic device 2201 can include a processor 2220, a memory 2230, an input device 2250, an audio output device 2255, a display device 2260, an audio module 2270, a sensor module 2210, an interface 2277, a haptic module 2279, a camera module 2280, a power management module 2288, a battery 2289, a communication module 2290, a user identification module 2296, and / or an antenna module 2297. In the electronic device 2201, some (e.g., the display device 2260, etc.) of the constituent elements can be omitted, or other constituent elements can be added. Some of the constituent elements can be implemented as one integrated circuit. For example, the fingerprint sensor 2211, the iris sensor, the illuminance sensor, etc. of the sensor module 2210 can be implemented by being embedded in the display device 2260 (a display, etc.).

[0108] The processor 2220 can control one or more other constituent elements (hardware or software constituent elements, etc.) of the electronic device 2201 by executing software (the program 2240, etc.), and perform various data processing or operations. As part of the data processing or operations, the processor 2220 can load a command or data received from other constituent elements (the sensor module 2210, the communication module 2290, etc.) into the volatile memory 2232, process the command or the data stored in the volatile memory 2232, and store the result data in the non-volatile memory 2234. The processor 2220 can include a main processor 2221 (a central processing unit, an application processor, etc.) and an auxiliary processor 2223 (a graphics processing unit, an image signal processor, a sensor hub processor, a communication processor, etc.) that are operable independently or together. The auxiliary processor 2223 can consume less power than the main processor 2221 and perform a specialized function.

[0109] The auxiliary processor 2223 can control a function or a state of some (the display device 2260, the sensor module 2210, the communication module 2290, etc.) of the constituent elements of the electronic device 2201, instead of the main processor 2221 while the main processor 2221 is in an inactive state (a sleep state), or together with the main processor 2221 while the main processor 2221 is in an active state (an application execution state). The auxiliary processor 2223 (an image signal processor, a communication processor, etc.) can be implemented as a part of other constituent elements (the camera module 2280, the communication module 2290, etc.) that are functionally related.

[0110] The memory 2230 can store various data required for the constituent elements (the processor 2220, the sensor module 2210, etc.) of the electronic device 2201. The data can include, for example, software (a program 2240, etc.) and input data and / or output data about relevant commands. The memory 2230 can include a volatile memory 2232 and / or a non-volatile memory 2234. The non-volatile memory 2234 can include an internal memory 2236 and an external memory 2238.

[0111] The program 2240 can be stored in the memory 2230 as software, and can include an operating system 2242, middleware 2244, and / or an application 2246.

[0112] The input device 2250 can receive a command and / or data, which is to be used by the constituent elements (the processor 2220, etc.) of the electronic device 2201, from the outside (a user, etc.) of the electronic device 2201. The input device 2250 can include a microphone, a mouse, a keyboard, and / or a digital pen (a stylus pen, etc.).

[0113] The audio output device 2255 can output audio signals to the outside of the electronic device 2201. The audio output device 2255 can include a speaker and / or a receiver. The speaker can be used for general purposes, such as multimedia playbacks or record playback, and the receiver can be used for receiving calls. The receiver can be combined with the speaker as part of the speaker, or implemented as a separate standalone device.

[0114] The display device 2260 can visually provide information to the outside of the electronic device 2201. The display device 2260 can include a display, a hologram device, or a projector, and a control circuit for controlling such a device. The display device 2260 can include a touch circuit configured to sense a touch, and / or a sensor circuit (a pressure sensor, etc.) configured to measure the intensity of force generated by the touch.

[0115] The audio module 2270 can convert a sound into an electrical signal or vice versa. The audio module 2270 can obtain sound through the input device 2250, or can output sound through the audio output device 2255 and / or a speaker and / or a headphone of other electronic devices (an electronic device 2202, etc.) connected to the electronic device 2201 in wired or wireless manner.

[0116] The sensor module 2210 can sense an operational state (power, temperature, and the like) of the electronic device 2201 or an external environmental state (user state, and the like), and generate electrical signals and / or data values corresponding to the sensed state. The sensor module 2210 can include a fingerprint sensor 2211, an acceleration sensor 2212, a position sensor 2213, a 3D sensor 2214, and the like, and further include an iris sensor, a gyro sensor, a barometric sensor, a magnetic sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0117] The 3D sensor 2214 can sense a shape, motion, and the like of an object by radiating light to the object and analyzing light reflected from the object, and can include any one of the phase modulators according to the above-described embodiments.

[0118] The interface 2277 can support one or more designated protocols for connecting the electronic device 2201 to other electronic devices (the electronic device 2202, and the like) in a wired or wireless manner. The interface 2277 can include a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface.

[0119] The connection terminal 2278 can include a connector for physically connecting the electronic device 2201 to another electronic device (the electronic device 2202, and the like). The connection terminal 2278 can include a HDMI connector, a USB connector, an SD card connector, and / or an audio connector (a headphone connector, and the like).

[0120] The haptic module 2279 can convert an electrical signal into a mechanical stimulus (vibration, movement, and the like) or an electrical stimulus that a user can feel through a tactile or kinesthetic sense. The haptic module 2279 can include a motor, a piezoelectric device, and / or an electrical stimulation device.

[0121] The camera module 2280 can capture still images or video. The camera module 2280 can include a lens assembly including one or more lenses, an image sensor, an image signal processor, and / or a flash. The lens assembly included in the camera module 2280 can collect light emitted from an object that is a target of image capture, and the lens assembly can include any one of the phase modulators according to the above-described embodiments.

[0122] The power management module 2288 can manage power supplied to the electronic device 2201. The power management module 2288 can be implemented as a part of a power management integrated circuit (PMIC).

[0123] The battery 2289 can supply power to the constituent elements of the electronic device 2201. The battery 2289 can include a primary cell which is not rechargeable, a secondary cell which is rechargeable, and / or a fuel cell.

[0124] The communication module 2290 can establish a wired communication channel and / or a wireless communication channel between the electronic device 2201 and other electronic devices (the electronic device 2202, the electronic device 2204, the server 2208, etc.), and support communication through the established communication channel. The communication module 2290 can operate independently of the processor 2220 (application processor, etc.), and can include one or more communication processors supporting wired communication and / or wireless communication. The communication module 2290 can include a wireless communication module 2292 (cellular communication module, short-range wireless communication module, global navigation satellite system (GNSS) communication module, etc.) and / or a wired communication module 2294 (local area network (LAN) communication module, power line communication module, etc.). Among the above communication modules, the respective communication modules can communicate with other electronic devices through a first network 2298 (short-range communication network such as Bluetooth, Wi-Fi direct, or infrared data association (IrDA)) or a second network 2299 (long-range communication network such as a cellular network, the Internet, or a computer network (LAN, WAN, etc.)). These various types of communication modules can be integrated into one constituent element (single chip, etc.), or can be implemented as a plurality of separate constituent elements (a plurality of chips). The wireless communication module 2292 can authenticate and authorize the electronic device 2201 in a communication network such as the first network 2298 and / or the second network 2299 by using subscriber information (international mobile subscriber identifier (IMSI), etc.) stored in the subscriber identification module 2296.

[0125] The antenna module 2297 can transmit and / or receive signals and / or power to and / or from the outside (other electronic devices, etc.). The antenna can include a transmitter formed in a conductive pattern on a substrate (printed circuit board (PCB), etc.). The antenna module 2297 can include one or more antennas. When the antenna module 2297 includes a plurality of antennas, the communication module 2290 can select an appropriate antenna from among the antennas to use for a communication method used in a communication network such as the first network 2298 and / or the second network 2299. Signals and / or power can be transmitted or received between the communication module 2290 and other electronic devices through the selected antenna. Other components (RFIC, etc.) other than the antenna can be included as part of the antenna module 2297.

[0126] Some of the constituent elements can be connected to each other by a communication method between peripheral devices (buses, general purpose input and output (GPIO), serial peripheral interface (SPI), mobile industry processor interface (MIPI), etc.), and can exchange signals (commands, data, etc.) with each other.

[0127] Commands or data can be transmitted or received between the electronic device 2201 and an external electronic device 2204 via the server 2208 connected to the second network 2299. The electronic devices 2202 and 2204 can have the same or different types as the electronic device 2201. All or a part of operations performed in the electronic device 2201 can be performed in one or more electronic devices (2202, 2204, and 2208). For example, when the electronic device 2201 needs to perform a function or a service, the electronic device 2201 can request one or more electronic devices to perform the entire function or a part of the service instead of performing the function or the service. The one or more electronic devices receiving the request can perform an additional function or service related to the request and transmit the execution result to the electronic device 2201. To this end, cloud computing, distributed computing, and / or client-server computing technology can be used.

[0128] Figure 18 is disposed in the electronic device 2201 of Figure 17 is a schematic block diagram of a configuration of a camera module 2280 in the electronic device 2201.

[0129] Referring to Figure 18 , the camera module 2280 can include a lens assembly 2310, a flash 2320, an image sensor 2330, an image stabilizer 2340, a memory 2350 (a buffer memory, etc.), and / or an image signal processor 2360. The lens assembly 2310 can collect light emitted from an object for image capture, and can include any one of the phase modulators described above. The lens assembly 2310 can include one or more refractive lenses and a phase modulator. The phase modulator equipped in the lens assembly 2310 can have a specific phase distribution and a compensation structure, thereby enabling a lens having reduced phase discontinuity to be designed. The lens assembly 2310 equipped with the phase modulator can achieve a desired optical performance and a short total optical length.

[0130] In addition, the camera module 2280 can further include an actuator. The actuator can drive the positions of lens elements forming the lens assembly 2310 and adjust the interval distance between the lens elements, for example, for zooming and / or auto-focusing (AF).

[0131] The camera module 2280 can include a plurality of lens assemblies 2310, and in this case, the camera module 2280 can include a dual camera, a 360-degree camera, or a spherical camera. Some of the lens assemblies 2310 can have the same lens attributes (angle of view, focal length, auto focus, F number, optical zoom, etc.) or other lens attributes. The lens assemblies 2310 can include a wide-angle lens or a telephoto lens.

[0132] The flash 2320 can emit light for enhancing light emitted or reflected from an object. The flash 2320 can include one or more light emitting diodes (red-green-blue (RGB) LED, white LED, infrared (IR) LED, ultraviolet LED, etc.) and / or a xenon lamp. The image sensor 2330 can convert light emitted or reflected from an object and transmitted through the lens assembly 2310 into an electrical signal, thereby obtaining an image corresponding to the object. The image sensor 2330 can include one or more sensors selected from image sensors having different attributes, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor. Each sensor included in the image sensor 2330 can be implemented as a charge-coupled device (CCD) sensor and / or a complementary metal-oxide semiconductor (CMOS) sensor.

[0133] The image stabilizer 2340 can move one or more lenses included in the lens assembly 2310 or the image sensor 2330 in a certain direction in response to movement of the camera module 2280 or the electronic device including the camera module 2280, or can compensate for a negative effect due to movement by controlling (adjusting readout timing, etc.) a movement characteristic of the image sensor 2330. The image stabilizer 2340 can detect movement of the camera module 2280 or the electronic device 2201 by using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 2280. The image stabilizer 2340 can be implemented in an optical form.

[0134] The memory 2350 can store a part or all of the data of an image obtained through the image sensor 2330 for a subsequent image processing operation. For example, when a plurality of images are obtained at a high speed, only a low-resolution image is displayed, and raw data (Bayer pattern data, high-resolution data, etc.) obtained is stored in the memory 2350. Then, the memory 2350 can be used to transmit raw data of a selected (user selection, etc.) image to the image signal processor 2360. The memory 2350 can be incorporated into the memory 2230 of the electronic device 2201, or be configured as a separate memory that operates independently.

[0135] The image signal processor 2360 can perform one or more image processes on an image obtained through the image sensor 2330 or image data stored in the memory 2350. The image processes can include depth map generation, three-dimensional modeling, panorama generation, feature point extraction, image synthesis, and / or image compensation (noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, softening, etc.). The image signal processor 2360 can perform control (exposure time control or readout timing control, etc.) on the constituent elements included in the camera module 2280 (the image sensor 2330, etc.). The image processed by the image signal processor 2360 can be stored again in the memory 2350 for additional processing, or provided to the external constituent elements of the camera module 2280 (the memory 2230, the display device 2260, the electronic device 2202, the electronic device 2204, the server 2208, etc.). The image signal processor 2360 can be incorporated into the processor 2220, or configured as a separate processor operating independently of the processor 2220. When the image signal processor 2360 is configured by a processor separate from the processor 2220, the image processed by the image signal processor 2360 can be subjected to additional image processing by the processor 2220, and then displayed through the display device 2260.

[0136] The electronic device 2201 can include a plurality of camera modules 2280 having different attributes or functions. In this case, one of the camera modules 2280 can be a wide-angle camera, and the other can be a telephoto camera. Similarly, one of the camera modules 2280 can be a front-side camera, and the other can be a rear-side camera.

[0137] Figure 19 is a schematic block diagram of a configuration of a 3D sensor 2214 provided in an electronic device of Figure 17

[0138] Referring to Figure 19 , the 3D sensor 2214 can sense the shape, motion, etc. of an object by radiating light to the object and receiving and analyzing light reflected from the object. The 3D sensor 2214 can include a light source 2420, a phase modulator 2410, a light detection unit 2430, a signal processing unit 2440, and a memory 2450. Any one of the phase modulators according to the above-described embodiments can be employed as the phase modulator 2410, and a target phase delay distribution can be set such that the phase modulator 2410 functions as a beam deflector or a beam shaper.

[0139] ​The light source 2420 radiates light for analyzing the shape or position of the object. The light source 2420 can include a light source for generating and radiating light of a specific wavelength. The light source 2420 can include a light source such as a laser diode (LD), a light emitting diode (LED), a super luminescent diode (SLD), or the like, which generates and radiates light in a waveband suitable for analyzing the position and shape of the object, for example, light in an infrared waveband. The light source 2420 can include a wavelength-variable laser diode. The light source 2420 can generate and radiate light in a plurality of wavebands different from each other. The light source 2420 can generate and radiate pulsed light or continuous light.

[0140] The phase modulator 2410 modulates light radiated from the light source 2420 and emits the modulated light toward the object. When the phase modulator 2410 is a beam deflector, the phase modulator 2410 can deflect the incident light in a specific direction to propagate toward the object. When the phase modulator 2410 is a beam shaper, the phase modulator 2410 can modulate the incident light so that the incident light has a distribution of a specific pattern. The phase modulator 2410 can form structured light suitable for three-dimensional shape analysis.

[0141] As described above, the phase modulator 2410 can distribute a phase delay set to 0, a positive number, or a negative number, and achieve a continuous phase delay distribution. Accordingly, the phase modulator 2410 can perform light modulation without deviation according to the wavelength (achromatic). Conversely, the phase modulator 2410 can enable the light to be irradiated to the object with a varying direction for each wavelength or a beam pattern different according to the wavelength by enhancing the deviation according to the wavelength.

[0142] The light detection unit 2430 can receive reflected light of the light radiated to the object via the phase modulator 2410. The light detection unit 2430 can include an array of a plurality of sensors for sensing light or only one sensor.

[0143] The signal processing unit 2440 can process a signal sensed by the light detection unit 2430 to analyze the shape of the object, etc. The signal processing unit 2440 can analyze a three-dimensional shape of the object including a depth position.

[0144] For analysis of the three-dimensional shape, an operation of measuring a time of flight can be performed. Various operation methods can be used to measure the time of flight. For example, a direct time measurement method is to obtain a distance by measuring a time for which pulsed light is projected onto an object and returns after being reflected from the object. A correlation method is to measure a distance according to brightness of pulsed light projected onto an object and returned after being reflected from the object. A phase delay measurement method is a method of projecting continuous wave light such as a sine wave onto an object, detecting a phase difference of light reflected from the object, and converting the phase difference into a distance.

[0145] When structured light is radiated onto an object, a depth position of the object can be operated according to a pattern change of the structured light reflected from the object, that is, a result of comparison with an incident structured light pattern. Depth information of the object can be extracted by tracking the pattern change of each coordinate of the structured light reflected from the object, and three-dimensional information related to a shape, a motion, etc. of the object can be extracted from the extracted depth information.

[0146] The memory 2450 can store programs and other data required for the operation of the signal processing unit 2440.

[0147] The operation result of the signal processor 2440, that is, information about a shape, a position, etc. of an object can be transmitted to other units in the electronic device 2201 or other electronic devices. For example, such information can be used by an application 2246 stored in the memory 2230. Other electronic devices to which the transmitted result is transmitted can include a display device or a printer that outputs the result. In addition, the other electronic devices can include an autonomous driving device (for example, a self-driving car, an autonomous vehicle, a robot, a drone, etc.), a smart phone, a smart watch, a mobile phone, a PDA, a laptop computer, a PC, various wearable devices, other mobile or non-mobile computing devices, and IoT devices, but the present application is not limited thereto.

[0148] Figure 20 is a schematic block diagram of a configuration of an electronic device 3000 according to an embodiment.

[0149] Referring to Figure 20 The electronic device 3000 can be provided. The electronic device 3000 can include an AR device. For example, the electronic device 3000 can include a glasses-type AR device. The electronic device 3000 can include a display engine 3400, a processor 3300, an eye tracking sensor 3100, an interface 3500, and a memory 3200.

[0150] The processor 3300 can control the overall operation of the AR device including the display engine 3400 by driving an operating system or an application program, and perform processing and operation of various data including image data. For example, the processor 3300 can process image data including left-eye virtual images and right-eye virtual images rendered to have binocular parallax.

[0151] The interface 3500, through which data or operation commands from the outside are input / output, can include, for example, a user interface such as a touchpad, a controller, an operation button, etc., which can be operated by a user. The interface 3500 can include a wired communication module such as a USB module or a wireless communication module such as Bluetooth, and can receive user operation information or virtual image data transmitted from an interface included in an external device through the modules.

[0152] The memory 3200 can include an internal memory, for example, a volatile memory or a non-volatile memory. Under the control of the processor 3300, the memory 3200 can store various data, programs or applications for driving and controlling the AR device, and data of input / output signals or virtual images.

[0153] The display engine 3400 is configured to receive image data generated from the processor 3300 and produce light of a virtual image, and can include a left-eye optical engine 3410 and a right-eye optical engine 3420. Each of the left-eye optical engine 3410 and the right-eye optical engine 3420 can include a light source for outputting light and a display panel for forming a virtual image by using light output from the light source, and have a function as a compact projector. The light source can be implemented by, for example, an LED, and the display panel can be implemented by, for example, a liquid crystal on silicon (LCoS).

[0154] The eye tracking sensor 3100 can be installed at a position where the pupil of a user wearing the AR device can be tracked, and can transmit a signal corresponding to the gaze information of the user to the processor 3300. As such, the eye tracking sensor 3100 can detect gaze information such as the direction of the user's eyes, the pupil position or the coordinate of the pupil center point of the user's eyes, etc. The processor 3300 can detect the form of eye movement based on the gaze information of the user detected by the eye tracking sensor 3100. For example, the processor 3300 can determine gaze information of various forms including fixation of gazing at any point, tracking of chasing a moving object, saccade of rapidly moving a line of sight from one point to another point, etc. based on the gaze information obtained from the eye tracking sensor 3100.

[0155] Figure 21 is provided in the electronic device 3000 of Figure 20 is a schematic block diagram of the eye tracking sensor 3100 provided in the electronic device 3000 of

[0156] The eye tracking sensor 3100 can include an illumination optical unit 3110, a detection optical unit 3120, a signal processing unit 3150, and a memory 3160. The illumination optical unit 3110 can include a light source for radiating light (e.g., infrared light) to a position of an object (an eye of a user). The detection optical unit 3120 for detecting reflected light can include a hyperlens 3130 and a sensor unit 3140. The signal processing unit 3150 can operate a pupil position of the user's eye, etc., according to a sensing result of the detection optical unit 3120.

[0157] Any one of the phase modulators and the phase modulator array according to the above-described embodiments, combinations thereof, or modified examples thereof can be used as the hyperlens 3130. The hyperlens 3130 can focus light from an object at the sensor unit 3140. In the eye tracking sensor 3100 very close to the user's eye, an incident angle of light incident on the sensor unit 3140 can be, for example, 30° or more. The hyperlens 3130 has a structure including a compensation region, and mitigates a reduction in efficiency even for light having a large incident angle. Thus, accuracy of gaze tracking can be improved.

[0158] An electronic device used not only as an AR device but also as a VR device can track a gaze of a user on a VR image provided by the above-described device.

[0159] Example embodiments can provide a phase modulator and a phase modulator array that stably maintain an overcoupled state.

[0160] Example embodiments can provide a phase modulator and a phase modulator array having improved light reflection properties.

[0161] Example embodiments can provide a phase modulator and a phase modulator array having a degree of freedom with respect to a distance between an antenna pattern and a phase shift pattern.

[0162] However, the effects of the present disclosure are not limited to what has been described herein.

[0163] It should be understood that the example embodiments described herein are to be considered merely illustrative, and not restrictive, in nature. Descriptions of features or aspects within each example embodiment should generally be considered as applicable to other similar features or aspects within other embodiments. Although example embodiments have been described with reference to the attached figures, it will be evident that various modifications and changes can be made thereto without departing from the broader spirit and scope of the application as defined in the appended claims.

Claims

1. A phase modulator, comprising: an antenna pattern including a conductive material, such that the antenna pattern generates heat based on a voltage applied to the antenna pattern; a lower reflective layer spaced apart from the antenna pattern in a vertical direction; a spacer disposed between the antenna pattern and the lower reflective layer; and a phase shift pattern including a phase shift material in the spacer, wherein the spacer includes a dielectric material, wherein the phase shift pattern is surrounded by the spacer, the spacer being disposed on an upper surface, a lower surface, and two side surfaces of the phase shift pattern, wherein the phase shift pattern is spaced apart from the antenna pattern in the vertical direction by the spacer, and a distance by which the phase shift pattern is spaced apart from the antenna pattern in the vertical direction is adjustable by using the spacer. A portion of the spacer disposed between the phase shift pattern and the antenna pattern has a thickness in the vertical direction that is greater than a thickness in the vertical direction of another portion of the spacer disposed between the phase shift pattern and the lower reflective layer.

2. The phase modulator of claim 1, wherein, The phase shift pattern overlaps the antenna pattern in the vertical direction.

3. The phase modulator of claim 1, wherein, The phase shift pattern is disposed in an effective resonator region in the spacer configured to generate a gap plasmon.

4. The phase modulator of claim 1, wherein, 5.The phase modulator of claim 1, a width of the antenna pattern in a horizontal direction perpendicular to the vertical direction ranges from 50 nm to 2000 nm. wherein A width of the phase shift pattern in the horizontal direction perpendicular to the vertical direction is the same as the width of the antenna pattern in the horizontal direction.

6. The phase modulator of claim 1, wherein, 7.The phase modulator of claim 1, further comprising a power source configured to apply the voltage to the antenna pattern. The phase shift pattern is spaced apart from the antenna pattern such that, based on heat generated from the antenna pattern, a difference between a highest temperature of the phase shift pattern and a lowest temperature of the phase shift pattern is minimized.

8. The phase modulator of claim 7, wherein, The phase shift pattern is spaced apart from the antenna pattern such that, based on heat generated from the antenna pattern, the lowest temperature of the phase shift pattern is greater than or equal to 280℃.

9. The phase modulator of claim 7, wherein, The antenna pattern includes a plurality of antenna patterns disposed in a horizontal direction perpendicular to the vertical direction, the phase shift pattern includes a plurality of phase shift patterns disposed between the plurality of antenna patterns and the lower reflective layer, the plurality of antenna patterns have the same shape, and the plurality of phase shift patterns are disposed along the horizontal direction.

10. The phase modulator of claim 1, wherein, 11.The phase modulator of claim 10, further comprising a power source configured to apply the same voltage to the plurality of antenna patterns, respectively, The plurality of antenna patterns are configured to generate heat based on the voltage applied to the plurality of antenna patterns. wherein 12.A phase modulator array, comprising: a first phase modulator; a second phase modulator spaced apart from the first phase modulator in a horizontal direction; a first power source configured to apply a voltage to the first phase modulator; and a second power source configured to apply a voltage to the second phase modulator, wherein each of the first phase modulator and the second phase modulator comprises: ​ ​ an antenna pattern disposed along the horizontal direction, the antenna pattern including an electrically conductive material such that the antenna pattern generates heat based on application of a voltage to the antenna pattern; a lower reflective layer spaced apart from the antenna pattern in a vertical direction perpendicular to the horizontal direction; a spacer disposed between the antenna pattern and the lower reflective layer; and a phase shift pattern included in the spacer and disposed along the horizontal direction, the phase shift pattern including a phase shift material, respectively, wherein the spacer includes a dielectric material, wherein, in each of the first phase modulator and the second phase modulator, the phase shift pattern is surrounded by the spacer, the spacer being disposed on an upper surface, a lower surface, and two side surfaces of the phase shift pattern, wherein the phase shift pattern is spaced apart from the antenna pattern in the vertical direction by the spacer, and a distance by which the phase shift pattern is spaced apart from the antenna pattern in the vertical direction is adjustable by using the spacer.

13. The array of phase modulators of claim 12, wherein, the first power source is further configured to apply a first voltage to an antenna pattern included in the first phase modulator, the second power source is further configured to apply a second voltage to an antenna pattern included in the second phase modulator, and wherein the first voltage and the second voltage are independent of each other.

14. The phased modulator array of claim 12, wherein, a number of phase shift patterns included in the first phase modulator is the same as a number of phase shift patterns included in the second phase modulator.

15. The array of phase modulators of claim 12, wherein, the spacer included in the first phase modulator and the spacer included in the second phase modulator are different portions of one dielectric film.

16. The phase modulator array of claim 12, further comprising a trench disposed between the first phase modulator and the second phase modulator, wherein the trench exposing the lower reflective layer.

17. The phase modulator array of claim 16, further comprising an insulating pattern disposed in the trench, wherein a thermal conductivity of the insulating pattern is lower than a thermal conductivity of the spacer.

18. The phased modulator array of claim 12, wherein, in each of the first phase modulator and the second phase modulator, a thickness of a portion of the spacer disposed between the phase shift pattern and the antenna pattern in the vertical direction is greater than a thickness of another portion of the spacer disposed between the phase shift pattern and the lower reflective layer in the vertical direction.

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