Ultrasonic device

Abstract

An ultrasonic device includes at least one flexible ultrasonic transducer; and a clamp configured to mount the at least one transducer to a test object. Optionally, the clamp may include one or more straps, wherein the one or more straps may optionally be metallic or at least a portion of the one or more straps may be formed of a conformal material such that the one or more straps include conformal straps or conformal strap portions.

Description

Technical Field

[0001] This disclosure relates to ultrasonic devices and other piezoelectric devices. Background Technology

[0002] Ultrasound spans a range of sound frequencies much higher than what humans can hear, typically exceeding 20 kHz. Typical operating ranges extend from 100 kHz to several gigahertz. Due to the much higher frequencies involved, ultrasonic devices are generally quite different from those typically used for hearing applications.

[0003] The use of ultrasound in analysis has shown great promise in a range of applications, particularly in imaging such as medical imaging, but also in fields such as non-destructive testing (NDT) (especially in industrial NDT), and in measurements of other challenging applications such as pipe wall thickness measurement, corrosion and erosion monitoring, and asset integrity management. However, ultrasound has a wide range of uses, and its applications are not limited to these examples.

[0004] An ultrasonic transducer is operable to generate ultrasonic waves that are transmitted to an object and to detect ultrasonic waves reflected from interfaces between layers of a sample or from defects within the sample and from the object. By using techniques such as time-of-flight and other analytical methods, the layers of the sample can be imaged and the sample can be characterized.

[0005] Traditional ultrasonic transducers are typically formed from bulk ceramic materials, which can be costly, bulky, and difficult to manufacture, particularly in terms of achieving the shapes and performance desired for many applications. Traditional ceramic materials used for ultrasound are often unsuitable for very high-temperature operation, making them unsuitable for certain applications. In particular, the combination of high-temperature operation and sufficient resolution is challenging for many traditional ultrasonic transducers. The ability to record ultrasonic measurements at high temperatures is further limited by the requirements for the coupling agent material between the sensor and the object. Furthermore, traditional ultrasonic transducers are not easily manufactured using automated techniques and often require a high degree of manual operation. Therefore, improved ultrasonic transducers and methods for manufacturing them are desired. Summary of the Invention

[0006] Various aspects of the invention are defined in the independent claims. Certain preferred features are defined in the dependent claims.

[0007] According to a first aspect of this disclosure, a piezoelectric device and / or an ultrasonic device are included, the device comprising:

[0008] At least one transducer; and

[0009] A fixture is configured to mount the at least one transducer onto a test object.

[0010] At least one transducer may be a piezoelectric transducer. At least one transducer may be an ultrasonic transducer. At least one transducer may be a flexible transducer. At least one transducer may be a thin-film transducer.

[0011] The test object can be a pipeline, conduit, or other cylindrical component, or include pipelines, conduits, or other cylindrical components.

[0012] The device can be a high-temperature device configured to operate at high temperatures. For example, the device can be configured to operate above 30°C, such as above 50°C, such as above 100°C. The device can be configured to operate at temperatures between 30°C and 500°C, such as between 100°C and 500°C. The device can be configured to operate at temperatures below 30°C, such as below 30°C, such as below -10°C, such as down to -100°C.

[0013] The device can be configured to measure temperature or a performance representative thereof, for example, configured to measure the temperature of the device and / or the temperature of a region directly adjacent to the device. The device can be, include, or be incorporated into a combined ultrasonic and temperature measurement device. The device may include one or more temperature sensors, which may be attached to a piezoelectric transducer, or the one or more piezoelectric transducers may have dual temperature measurement and ultrasonic wave generation and / or receiving capabilities, such that they can operate as both temperature sensors and ultrasonic transducers. The transducers may have both piezoelectric and thermoelectric properties.

[0014] The clamp may include one or more belts. While the clamp may advantageously include belts, it should be understood that other clamping mechanisms, such as gripping members (e.g., adjustable or resiliently deformable gripping members), may be used. The choice of clamp may depend on the application and the amount of clamping force required.

[0015] At least part or all of one or more bands may be conformal and / or flexible. One or more bands may be formed of or comprise conformal materials; for example, one or more bands may comprise conformal and / or flexible bands or band portions.

[0016] The conformal tape or conformal tape portion may be a tape or tape portion configured to face or be adjacent to the test object during use. The conformal material may be an elastic material, such as a high-temperature engineering polymer, which may be stable at temperatures of 150°C, 250°C, 300°C, or higher. The conformal material may optionally be a fluorinated elastomer, a perfluoroelastomer, a silicone blend, a graphite-based blend, and / or the like, or include fluorinated elastomers, perfluoroelastomers, silicone blends, graphite-based blends, and / or the like.

[0017] By providing a conformal band or a portion thereof, the device can operate without a coupling agent, which is particularly suitable for high-temperature and / or long-term applications.

[0018] At least one transducer or transducer array may be at least partially or completely embedded or molded into the conformal belt or conformal belt portion. At least one transducer or transducer array may be inserted or selectively insertable or removable into the conformal belt or conformal belt portion; for example, at least one transducer or transducer array may be configured as an insert that is inserted into the conformal belt or conformal belt portion.

[0019] At least one of the multiple strips, or each of the multiple strips, may be a metal strip or include a metal strip. At least one of the multiple strips, or each of the multiple strips, may be a rigid or semi-rigid strip, or include a rigid or semi-rigid strip.

[0020] The conformal tape or conformal tape portion can be attached to a metal tape or a rigid or semi-rigid tape. The conformal tape or conformal tape portion can at least partially or completely surround the metal tape. The conformal tape or conformal tape portion can mount a piezoelectric transducer or transducer array to the metal tape.

[0021] At least one transducer may have wiring that can be molded from a conformal material and / or channeled between the conformal material and a metal strip. At least one transducer or transducer array may include connectors, such as surface mount connectors or micro coaxial connectors, for connecting the transducer to an input signal source to receive drive signals used to drive the transducer and / or connecting the transducer to an output system to provide output signals from the transducer to the output system. This arrangement can allow the transducer or transducer array to be connected with individual wires, which can allow for additional modularity.

[0022] The at least one belt may be configured with a retainer for locking the belt to the test object and / or selectively releasing the belt from the test object and / or for adjusting the tension in the belt. The retainer may be a ratchet mechanism, a screw / bolt closure, a worm gear device, etc., or may include such mechanisms. The retainer may be configured to adjust the circumference of at least one belt, for example, to fasten at least one belt to the test object and / or loosen at least one belt from the test object during use. The retainer may be a selective closure mechanism or may be included in a selective closure mechanism for allowing the belt to be selectively placed on and / or removed from the test object.

[0023] In addition to conformal straps, metal straps can provide the necessary structural strength to securely fasten the device to the test object.

[0024] The clamp may or may not include a conformal band or portion thereof, or conformal material. For example, the clamp may consist only of a metal band, only of a conformal band formed of conformal material, or of a band having both a metal band and a portion of conformal material. However, in those embodiments that do include conformal material, the conformal material may extend between at least one piezoelectric transducer and at least one metal band. The conformal material may be electrically insulating; for example, it may electrically insulate at least one piezoelectric transducer from the metal band. The conformal material may provide some protection for at least one transducer. The conformal material may advantageously distribute forces on at least one transducer. The conformal material may also provide a degree of compensation for the movement or expansion and contraction of the test object, which may be particularly applicable when the test object is a pipe or conduit designed to transport fluids at different temperatures.

[0025] The apparatus may include a urging mechanism configured to push, press against, and / or bring into contact with a test object during use. The urging mechanism may be configured to move at least one transducer or transducer array and / or apply a force to at least one transducer or transducer array, such as axially moving at least one transducer or transducer array or applying a force axially to at least one transducer or transducer array. The urging mechanism may be configured such that the position (e.g., axial position) of at least one transducer or transducer array and / or the force applied to at least one transducer or transducer array by the urging mechanism may be selectively variable or adjustable, for example, through operation of the urging mechanism. The urging mechanism may be manually or automatically adjusted.

[0026] This arrangement allows for the adjustment of forces or interfaces between at least one transducer or transducer array, for example, for optimal acoustic transmission. This is particularly advantageous for conformal devices (especially those configured to operate without a coupling agent) that include flexible transducers or transducer arrays and conformal materials or buffers, since the force-applying mechanism can provide a favorable interface between at least one transducer or transducer array and the test object that would otherwise be provided by a coupling agent.

[0027] The force-applying mechanism may include a screw or other rotating component. The screw or other rotating component may be configured to operate on at least one transducer or transducer array, for example, to push the transducer or transducer array toward and / or bring the transducer or transducer array into contact with the test object during use. The device may include a device body. At least one transducer or transducer array and / or the force-applying mechanism may be housed in or mounted on the device body.

[0028] A force-applying mechanism (e.g., a screw) can be coupled to at least one transducer or transducer array via a coupling member. The coupling member can accommodate the rotational movement of the screw or other rotating mechanism without transmitting the rotational movement to at least one transducer or transducer array. The coupling member can be a ball-and-socket joint or include a ball-and-socket joint. This prevents damage to the transducer or transducer array from friction with the test object while still allowing axial travel to allow the transducer or transducer array to press against the surface of the test object. The force-applying mechanism (e.g., the screw and / or coupling member) can be formed of or comprise a rigid material, such as a metal, e.g., stainless steel.

[0029] A conformal buffer can be provided between the coupling element and / or force application mechanism and at least one transducer or transducer array. The conformal buffer can adapt to the shape of the test object by fitting a flexible transducer or flexible transducer array to the shape of the test object, while still applying force from the force application mechanism to the transducer or transducer array, for example, to push the transducer or transducer array toward or onto the test object. The conformal buffer can distribute the thrust more evenly and can help prevent damage to the transducer or transducer array. The conformal buffer can also help accommodate the expansion and / or contraction and / or other movements of at least a portion of the test object and can help maintain good acoustic coupling. The conformal buffer can be configured to withstand high temperatures, such as 150°C, 250°C, 300°C, or higher. The buffer can be non-polymeric. The buffer can include graphite, fiber-reinforced materials, minerals such as soft minerals, such as vermiculite, talc, layered silicates, pyrophyllite, mica, and / or calcium silicate, etc.

[0030] While examples of force-applying mechanisms in the form of screw mechanisms have been described in detail above, force-applying mechanisms are not limited to these. For example, at least one conformal band or portion of a conformal band, or conformal material or other elastically deformable material may be provided, and this at least one conformal band or portion of a conformal band, or conformal material or other elastically deformable material may be configured to perform the actions of the force-applying mechanism, such as pushing a transducer or transducer array toward and / or bringing the transducer or transducer array into contact with the test object during use. In this case, the lateral extension, elongation, tensioning, or application of force on the conformal band or portion of the conformal band, or conformal member or other elastically deformable material may cause it to apply an axial force to the transducer or transducer array during use, which may push the transducer or transducer array toward and / or bring the transducer or transducer array into contact with the test object. A retainer may be used to perform tensioning. Other examples of force-applying mechanisms include piston / injector / friction fit arrangements, quick-release / asymmetric bolts, and lever-type mechanisms and / or the like.

[0031] The transducer can be configured to, for example, generate and emit ultrasonic waves in response to a drive signal, and / or receive and detect ultrasonic waves, such as by receiving and detecting reflections of emitted ultrasonic waves. The device can be an ultrasonic apparatus for imaging, measurement, or testing (e.g., nondestructive testing). The device can be a medical ultrasound imager. The device can be a nondestructive testing apparatus. The transducer can be configured to provide an output signal representing the received ultrasonic waves or one or more of its properties (e.g., amplitude, frequency, wavelength, and / or timing of the ultrasonic waves). The transducer can be configured to emit ultrasonic waves and / or detect and / or measure reflections of received ultrasonic waves.

[0032] Integrating temperature sensor capabilities into the device allows for greater accuracy in measurements affected by temperature effects, such as wall thickness calculated from time-of-flight measurements. For example, temperature measurements at the sensor surface can be used instead of computer models of heat transfer via delay lines or couplers to compensate for variations in sound speed with temperature.

[0033] The device may include a transducer array, with at least one transducer included in the transducer array. The transducer array may be a flexible transducer array. At least one transducer and / or the transducer array may include a piezoelectric material layer disposed on a substrate (e.g., directly disposed on a surface of the substrate). Each transducer in the transducer array may include one or more discrete electrodes disposed directly on the layer material. At least one transducer and / or the transducer array may include a dielectric material layer, such as a photoresist (e.g., SU-8), deposited on the piezoelectric layer and / or between the discrete electrodes. The substrate may be a counter electrode, include a counter electrode, or be included in a counter electrode. The substrate may be a conductive substrate. At least one transducer and / or the transducer array may include one or more electrical contacts coupled to one or more electrodes via conductive traces, e.g., coupled to a corresponding electrode. The one or more electrical contacts and / or the conductive traces may be disposed on the substrate, on the piezoelectric layer, and / or on the dielectric material. Individual electrodes and / or transducers may be individually addressed using corresponding conductive traces. The apparatus may include one or more features of ultrasonic transducers disclosed in GB1803444.7, GB1803257.3, GB2555835, WO2018 / 087560, PCT / GB2019 / 050567 and / or PCT / 050549 (all of which are in the name of the applicant), and the contents of each of these documents are incorporated herein by reference as if they were fully disclosed herein.

[0034] The substrate can be flexible and / or conformal, such as a foil, which can be a metallic foil, such as aluminum foil. The piezoelectric material can be a metal or transition metal compound, or contain a metal or transition metal compound, such as a metal oxide or nitride, which can be the primary piezoelectric material. The piezoelectric material can be a zinc or aluminum compound, or contain a zinc or aluminum compound, such as aluminum nitride (AlN) or zinc oxide (ZnO). The piezoelectric material can optionally be doped with, for example, a transition metal or transition metal compound, such as vanadium or scandium. The piezoelectric material can be crystalline (e.g., polycrystalline) or columnar. The piezoelectric material can be non-polymeric or may not be contained in a polymeric material. The piezoelectric material can be a continuous material layer with piezoelectric properties or include a continuous material layer with piezoelectric properties; for example, the piezoelectric material may not be included in discrete domains of piezoelectric material with piezoelectric properties within a non-piezoelectric material matrix. The thickness of the piezoelectric material layer can range from 2 μm to 20 μm. The piezoelectric material layer can be thinner than the substrate.

[0035] Piezoelectric materials can be doped with dopants or other materials, such as transition metals or their compounds, such as vanadium. Dopants or other materials can be present in the piezoelectric material at levels up to 10% by weight (e.g., from 0.01 to 10% w / w). The primary piezoelectric material, such as a metal oxide or metal nitride, can be present in the piezoelectric material layer at levels from 90% w / w to 99.99% w / w. Dopants or other materials can be integrated, co-deposited, or reacted into the primary piezoelectric material, for example, alloyed with or doped into the primary piezoelectric material, and can be either not mixed with the primary piezoelectric material, coated onto the primary piezoelectric material, or located in a discrete domain with the primary piezoelectric material.

[0036] The device body can be formed of metal, polymer materials, and / or the like. For example, the device body can be formed of stainless steel. The device body can be rigid. The device body can be hollow, for example, to house at least one transducer or transducer array and / or a force-applying mechanism and / or any wiring, connectors, and / or electronics for operating at least one transducer or transducer array. Clamps, such as one or more straps, can pass through the device body, for example, so that the device body can be securely fastened to the test object using the clamps.

[0037] However, it should be understood that the device body does not need to be rigid. For example, at least one transducer or at least a portion of a transducer array (and optionally, at least one of other components identified above or below as being housed in the device body) may be embedded or otherwise disposed in a conformal material such that the conformal material effectively serves as the device body.

[0038] For example, multiple devices can be configured as a sheet, wherein the sheet can be formed primarily of a deformable material. At least one transducer or transducer array can be embedded in or inserted into the sheet. The sheet can be cut to, for example, the length of a variable number of transducers to suit a given application. The sheet can be mounted on and / or fed from a spool or bobbin. The sheet can include or be configured to receive multiple transducers with different internal transducer spacings between them, which can further allow for devices with various configurations.

[0039] The device may include a power source, such as a battery, capacitor, inductive power coupling system, or other electrochemical, electrostatic, or electromagnetic power source. The device may be wired or wireless. The device may receive power and / or drive signals and / or output signals via a wired or other physical connector. Alternatively or additionally, the device may wirelessly receive drive signals and / or provide output signals. The device may include a wireless communication system for wirelessly communicating with remote and / or individual devices, for example, to receive drive signals and / or transmit output signals. The wireless communication system may be configured to use Bluetooth. RTM ZigBee RTM WiFi RTM WiMAX RTM Communication can be made via NFC, cellular phones and / or data networks, or other suitable communication channels or mechanisms. Optionally, power for the device can be provided wirelessly, for example, via an inductive coupler. Drive signals can be provided by control electronics, which can be onboard on the device, for example housed within the device body, and can be powered by a power source. The device can include or be configured to access data memory, and the device can be configured to record, for example, time-varying output signals in the data memory. The data memory can be onboard, for example within the device body, and can be powered by a power source. The data memory can be external and / or remote from the device, for example, so that data can be output from the device to the data memory, for example, via wired or wireless communication.

[0040] The above arrangement offers various advantages. For example, the device can be installed more easily and / or faster. The device can be securely clamped to the test object, such as a pipe. The device can achieve and maintain good acoustic coupling between at least one transducer or transducer array and the test object, and can achieve and maintain good acoustic coupling without the use of a coupling agent (e.g., gel). The device can more easily conform to the shape of the test object. The device can have a very low profile, which can be beneficial in certain applications, such as in confined spaces, around corners, near joints, in complex and closed piping networks, and especially in oil and gas pipelines where deployment requires minimal disruption to pipeline design.

[0041] According to a second aspect of this disclosure, there is a method for manufacturing, repairing, or assembling the device of the first aspect. The method may include providing a fixture and at least one transducer. The transducer may be a piezoelectric transducer. The transducer may be an ultrasonic transducer. At least one transducer may be a flexible transducer. The method may include providing at least a portion of at least one transducer on or within the device body. The method may include mounting the device body onto the fixture, or the fixture may be integrally formed with the device body.

[0042] The method may include providing and mounting one or more temperature sensors. The one or more temperature sensors may be attached to one or more transducers, or one or more transducers may have dual temperature measurement and ultrasonic generation and / or receiving capabilities, enabling them to operate as both temperature sensors and ultrasonic transducers. The clamp may include one or more straps, which may include one or more metal straps and / or conformal straps and / or conformal strap portions. The method may include providing retainers for locking the straps to the test object and / or selectively releasing the straps from the test object. The method may include providing a force-applying mechanism, which may be configured to push a transducer or transducer array toward the test object and / or bring a transducer or transducer array into contact with the test object during use. The force-applying mechanism may include a screw mechanism. The method may include providing a coupling between the force-applying mechanism (e.g., a screw) and at least one transducer or transducer array. The method may include providing a conformal buffer between the coupling or force-applying mechanism and at least one transducer or transducer array.

[0043] The method may include providing and installing a power source, such as a battery, capacitor, inductive power coupling system, or other electrochemical, electrostatic, or electromagnetic power source, which may be disposed within the device body. The method may include providing and installing a wireless communication system for wireless communication with remote and / or individual devices. The method may include providing and installing control electronics receptacle within the device body. The method may include providing and installing data storage.

[0044] According to a third aspect of this disclosure, there is a method using the apparatus of the first aspect. This method may include a method for obtaining nondestructive testing (NDT) data or be included in a method for obtaining NDT data. This method may include a method for obtaining imaging data such as ultrasound imaging data (e.g., medical imaging) or be included in a method for obtaining imaging data such as ultrasound imaging data (e.g., medical imaging). This method may include a method for obtaining measurement data (e.g., measuring wall thickness) or be included in a method for obtaining measurement data (e.g., measuring wall thickness).

[0045] The method may include mounting the device to a test object using a clamp. The method may include placing at least partially or entirely of a conformal band or portion of a conformal band around the test object. The method may include providing at least partially or entirely of a metal band around the test object. The method may include securing the clamp with a retainer. The method may include operating a force-applying mechanism to contact at least one transducer or transducer array with the test object and / or pushing a transducer or transducer array onto the surface of the test object. The method may include providing a test signal to the transducer array and / or receiving an output signal from the ultrasonic transducer array.

[0046] According to a fourth aspect of this disclosure, there is computer-readable code configured such that, when processed by an automated manufacturing system controller, the automated manufacturing system produces at least a portion of the means of the first aspect and / or performs the method of the second aspect.

[0047] Automated manufacturing systems can include 3D printers, additive manufacturing equipment, robotic assembly systems, pickers and placers, computer numerical control (CNC) machines, etc.

[0048] In any other aspect or embodiment of the invention, the independent features and / or combinations of features defined above according to any aspect of the invention or below with respect to any specific embodiment of the invention may be used separately and independently, alone, or in combination with any other defined features.

[0049] Furthermore, this invention is intended to cover: devices configured to perform any of the features described herein with respect to methods, and / or methods of using or producing, employing or manufacturing any of the device features described herein. Attached Figure Description

[0050] These and other aspects of this disclosure will now be described by way of example only with reference to the accompanying drawings, in which:

[0051] Figure 1 This is a perspective view of an ultrasound device;

[0052] Figure 2 It is installed on the test object in the form of a pipe during use. Figure 1 A perspective view of an ultrasound device;

[0053] Figure 3 It is installed on the test object in the form of a pipe during use. Figure 1 A top view of an ultrasonic device;

[0054] Figure 4 It is installed on the test object in the form of a pipe during use. Figure 1 A side view of an ultrasound device;

[0055] Figure 5 It is installed on the test object in the form of a pipe during use. Figure 1 An end view of the ultrasound device;

[0056] Figure 6 It is installed on the test object in the form of a pipe during use. Figure 1 The ultrasonic device through Figure 5 The cross-sectional view of section AA indicated above;

[0057] Figure 7 It is installed on the test object in the form of a pipe during use. Figure 1 The ultrasonic device through Figure 8 The cross-sectional view of section BB indicated above;

[0058] Figure 8 It is installed on the test object in the form of a pipe during use. Figure 1 A side view of an ultrasound device;

[0059] Figure 9 It can be used Figure 1 A top view of a flexible ultrasonic transducer array in an ultrasonic device.

[0060] Figure 10 yes Figure 9 A cross-sectional side view of an ultrasonic transducer array;

[0061] Figure 11 This is a perspective view of another ultrasonic device installed on a test object in the form of a pipe during use;

[0062] Figure 12 It is installed on the test object in the form of a pipe during use. Figure 11 A side view of an ultrasound device;

[0063] Figure 13 yes Figure 11 A perspective view of the ultrasonic device shown;

[0064] Figure 14 It is a flat configuration Figure 11 Side view of the ultrasound device shown;

[0065] Figure 15 Through Figure 11 A cross-sectional view of the band of the ultrasonic device shown;

[0066] Figure 16 This is a flowchart of the method for assembling an ultrasonic transducer; and

[0067] Figure 17 This is a flowchart of a method using an ultrasonic transducer. Detailed Implementation

[0068] Figures 1 to 8 An example of an ultrasonic device 5 is shown, which is used to emit ultrasonic waves and receive and measure reflected ultrasonic waves to generate a signal representing one or more parameters of the received ultrasonic waves. Figures 2 to 8 The specific example shown illustrates the use of an ultrasonic device for advantageously performing non-destructive testing (NDT) (e.g., wall thickness measurement) on a test object, where, in this particular example, the test object is a pipe, such as a pipeline of oil or other fluids or gases. However, the ultrasonic device 5 is not limited to this application and should be understood to be usable in other applications (e.g., imaging, such as medical imaging).

[0069] The device includes a device body 15, a clamp 20, and one or more ultrasonic transducers (in this example, multiple ultrasonic transducers are arranged in an ultrasonic transducer array 25). Figure 6 , Figure 7 , Figure 9 and Figure 10 (Especially visible in the middle).

[0070] like Figure 9 and Figure 10 As shown, in one example, the ultrasonic transducer array 25 is a flexible ultrasonic transducer array comprising a flexible conductive substrate 30, which in this example is in the form of a metal foil, having a piezoelectric layer 35 on its surface. In this example, the piezoelectric layer 35 is in the form of a non-polymeric inorganic piezoelectric material layer (e.g., zinc oxide (ZnO) or aluminum nitride (AlN)), optionally doped with a transition metal or transition metal compound, such as vanadium. The piezoelectric layer 35 can be deposited directly onto the substrate by methods such as sputtering coating. In this example, the substrate 30 serves as a counter electrode in use and is arranged toward the test object 10.

[0071] An array of electrodes 40 is disposed on the surface of the piezoelectric layer 35 on the side opposite to the substrate 30, such that the piezoelectric layer 35 is located between the electrodes 40 and the substrate 30. Each electrode 40 is electrically connected to a corresponding electrical contact 45 via a corresponding conductive trace 50. Each electrode, and the corresponding portion of the piezoelectric layer 35 and the substrate 30, can be considered as forming a transducer of the transducer array 25. Each electrode 40 can be individually addressed to drive the electrode 40 and read out the signal collected by the electrode 40. A resistive dielectric material, such as a photoresist (e.g., SU-8), may optionally be disposed between the piezoelectric layer 35 and the conductive traces 50 and the electrical contacts 45, and between the discrete electrodes 40, the electrical contacts 45, and the conductive traces 50, to mitigate crosstalk.

[0072] For example, a control device (not shown) can be connected to the electrical contact 45 to provide alternating drive signals to the electrode 40 via a corresponding conductive trace 50, so as to generate a potential difference across the corresponding portion of the piezoelectric layer 35 corresponding to the driven electrode 40, thereby causing the corresponding portion of the piezoelectric layer 35 to oscillate at a frequency corresponding to the frequency of the drive signal, thus generating ultrasonic waves with a corresponding frequency. The reflection of the emitted ultrasonic waves can also be received by the ultrasonic transducer array 25, causing at least a portion of the piezoelectric layer 35 to oscillate, thereby generating an electrical signal with a frequency depending on the frequency of the received ultrasonic waves. This can be received by the control device via the electrode 40, the conductive trace 50, and the electrical contact 45.

[0073] Examples (or at least their features) of flexible ultrasonic transducers and ultrasonic transducer arrays that may be used in this example are described in GB1803444.7, GB1803257.3, GB2555835, WO2018 / 087560, PCT / GB2019 / 050567 and / or PCT / GB2019 / 050549 (all of which are in the name of the applicant), and the contents of each of them are incorporated herein by reference as if they were fully disclosed herein.

[0074] In this example, the device body 15 includes a hollow metal shell housing the ultrasonic transducer array 25 and any associated wiring and electronics. The device body 15 includes an electrical connector 55 for connecting the electrical contacts 45 of the ultrasonic transducer array 25 to a control device. For example, the electrical connector 55 may be a micro-coaxial connector, but is not limited thereto. The device body 15 includes a plurality of pins 60 designed to engage with the test object 10 to securely mount the device 5 onto the test object 10.

[0075] For example, the device body 15 is mounted on the clamp 10 by passing a portion of the clamp 20 through a channel in the device body, by a physical connection, and / or the like. In this example, the clamp 20 includes a plurality of straps 65. In this case, the straps 65 are metal straps for strength and safety, but are not limited thereto. The straps 65 are configured to extend around at least a portion of the test object during use and are selectively opened and closed. For example, the straps 65 may be configured to pass through a channel in the device body 15 and be secured by screws, ratchet or other one-way mechanisms, locking levers, interference fits or press fits, clamps, and / or the like.

[0076] If it is possible to specifically Figure 6 and Figure 7As seen in the diagram, the flexible ultrasonic transducer array 25 is disposed within the device body 15 and arranged such that an active (e.g., transmitting / receiving) surface 70 or a coating (such as a dielectric coating or film) is provided thereon on the inner surface of the ultrasonic device 5, which is configured to adjoin and interface with the test object 10 during use. In the example above, the active surface is the surface of the substrate 30 opposite to the surface of the substrate on which a piezoelectric material layer 35 is disposed. The device includes a force-applying mechanism 75 for pushing the active surface of the ultrasonic transducer array 25 onto the outer surface of the test object 10.

[0077] exist Figures 1 to 8 In the example, the force application mechanism 75 includes a screw 80 threaded into a complementary threaded channel in the top of the device body 15, so that the screw 80 can be screwed into the device body toward the test object 10 and screwed out of the device body 15 away from the test object 10 during use. The proximal end 85 of the screw 80 is provided with a rotation aid, such as a finger grip and / or a slot, hexagonal recess, or other tool interface, to allow the screw 80 to be easily rotated.

[0078] The distal end 90 of the screw 80 engages with a coupling 95 disposed between the screw 80 and the transducer array 25. The coupling 95 accommodates the rotational movement of the screw 80 without transmitting the rotational movement to the transducer array 25. Examples of suitable couplings 95 include socket joints, bearing mechanisms, etc.

[0079] The coupling element 95 is further provided with a conformal buffer 100, which is located between the rest of the coupling element 95 and the ultrasonic transducer 25. The buffer 100 is elastically deformable. The conformal buffer 100 helps the flexible ultrasonic transducer array 25 conform to the curved surface of the test object, while uniformly distributing forces on the transducer array 25, thereby reducing damage to the transducer array 25. The conformal buffer 100 also provides some compensation for the expansion / contraction of the test object during heating. However, the conformal buffer 100 is preferably constructed to withstand high temperatures, which may limit material selection, excluding conventional engineered polymers and elastomers. Therefore, high-temperature materials such as graphite, fiber-reinforced materials, or certain minerals such as vermiculite can be used in the buffer 100 to provide the desired temperature and adaptability.

[0080] In this way, during use, the screws 80 of the force application mechanism 75 can be operated to apply and change the axial force acting on the transducer array 25 to push the action surface 70 of the transducer array 25 onto the corresponding surface of the test object 10. Therefore, the force application mechanism 75 is operable to achieve the desired acoustic coupling between the transducer array 25 and the test object 10, preferably without using coupling agents, such as gels, that may be detrimental or unsuitable for high temperatures or long-term use.

[0081] exist Figure 11-15 Another example of an ultrasonic device 205 is shown in the image. (Compared to...) Figures 1 to 8 The features on device 5 shown are given similar reference numerals to the features of device 205, but with the addition of 200.

[0082] The device 205 includes a clamp 220 and one or more ultrasonic transducers located in the clamp 220 (in this example, multiple ultrasonic transducers are arranged in multiple ultrasonic transducer arrays 225, which is particularly important in...). Figure 9 , Figure 10 and Figure 13 (As can be seen in the image). The ultrasonic transducer array 225 can be, for example, about... Figure 9 and Figure 10 Those shown and described herein, or those described in any of GB1803444.7, GB 1803257.3, GB2555835, WO2018 / 087560, PCT / GB2019 / 050567 and / or PCT / GB2019 / 050549 (all of which are in the name of this applicant), and the contents of each of them are incorporated herein by reference as if they were fully disclosed herein.

[0083] and Figure 1 The clamp 20 in device 5 is the same. Figures 11 to 15 The clamp 220 in the device 205 includes a band 265. However, a portion of the band 265 in the device 205 is formed of a conformal material such as an elastomer, preferably an elastomer capable of withstanding high temperatures (e.g., up to 200°C, 250°C, or even 300°C). Suitable elastomers may include, but are not limited to: fluorinated elastomers; perfluorinated elastomers; high-temperature silicone blends; and graphite-based blends. The conformal properties of the device 205 allow it to operate without a coupling agent (e.g., a gel), thus making it advantageous for high-temperature and / or long-term applications.

[0084] Specifically, the band 265 includes a conformal material sub-band 305 formed of conformal material and disposed around the fixing band 310. The band 265 can be used to secure the device 205 around the test object 10 and provide sufficient force for coupling-free operation. The band 265 can be secured and tensioned using a closure mechanism 315. For example, the closure mechanism may include a ratchet mechanism, a screw / bolt closure, or a worm gear mechanism, etc. The fixing band 310 is preferably formed of a suitable durable material, such as metal, for example stainless steel.

[0085] A conformal material (e.g., a flexible elastomer) forming the conformal sub-band 305 holds the ultrasonic transducer or transducer array 225. The ultrasonic transducer or transducer array 225 may optionally be molded into the conformal material or may be a removable insert. The conformal material is electrically insulating, and the conformal material layer extends between the metal retaining band 310 and the ultrasonic transducer or transducer array 225 and / or any electronics required to operate them. This arrangement protects the ultrasonic transducer or transducer array 225 by uniformly distributing forces. This conformal material backing also provides some degree of compensation for the expansion / contraction of the test object upon heating. The ultrasonic transducer or transducer array 225 may optionally have integrated wiring that can be molded from the conformal material or guided between the conformal sub-band 305 and the metal retaining band 310. Alternatively, the ultrasonic transducer or transducer array 225 may be fitted with surface mount connectors (e.g., micro coaxial connectors) that allow them to be coupled with individual wires to improve modularity.

[0086] For example, in particular Figure 14 As shown, device 205 can be manufactured in different lengths for different pipe diameters, or as a long roll cut to specific lengths for customization. The length of device 205 can be manufactured with different intervals of ultrasonic transducers or transducer arrays 225 to allow for an optimal number of ultrasonic transducers or transducer arrays 225 and their placement on a test object 10 of a given diameter. Combining the cut-to-length winding system, the insertable ultrasonic transducers or transducer arrays 225, with the inherent mass-producibility of the aforementioned arrangement makes device 205 ideally suited for continuous monitoring on large infrastructures. Furthermore, if desired, the design of device 205 allows it to be manufactured with a very low profile. This allows device 205 to be deployed in close proximity, such as in tight pipe networks and near joints and corners. The low profile also makes device 205 well-suited for installation under insulation in oil and gas pipeline applications with minimal disruption to insulation design.

[0087] Figure 16 The figure illustrates a method of assembling or repairing devices 5, 205, wherein one or more ultrasonic transducers 25, 225 are disposed in the device body 15 and / or conformal sub-band 305 (step 1605) and mounted on clamp 20 or fixing band 310 (step 1610).

[0088] Figure 17The diagram illustrates a method of using devices 5, 205, wherein the ultrasonic devices 5, 205 are secured to the test object 10 using clamp 20 (step 1705). Thereafter, the force application mechanism is adjusted to forcefully push the transducer array 25 onto the test object 10 (step 1710). This may involve rotating the screw 80 or stretching the conformal sub-band 305. The transducer 25 is then driven using a drive signal to generate ultrasonic waves, and the transducer 25 is interrogated by a control device to receive the output signal generated by the reflected ultrasonic waves received by the transducer 25 (step 1715).

[0089] Although specific examples have been described above in conjunction with the accompanying drawings, it should be understood that variations of the above examples are possible. Therefore, the scope of protection is defined by the claims, not by the specific examples described above.

[0090] For example, although examples of ZnO or AlN as piezoelectric materials are given above, it should be understood that other piezoelectric materials can be used instead. Furthermore, although transition metal-doped piezoelectric materials are described, it should be understood that undoped piezoelectric materials can be used. Additionally, although various thicknesses, sizes, numbers, and geometric arrangements of electrodes, conductive traces, and electrical contacts are given above, it should be understood that other thicknesses, sizes, numbers, and geometric arrangements of electrodes, conductive traces, and electrical contacts can be used. In fact, although all electrodes are shown as having the same size and shape, it should be understood that at least some or all of the electrodes may have different sizes and / or shapes.

[0091] Furthermore, although a belt-type clamp is used, it should be understood that other clamping mechanisms, such as gripping members, interference fit mechanisms, or press fit mechanisms, can be used. Additionally, although various examples of suitable conformal materials have been given, it should be understood that other suitable conformal materials can be used.

Claims

1. An ultrasound device comprising: at least one flexible ultrasound transducer; a clamp configured to mount the at least one flexible ultrasound transducer to a test object; a force application device separate from the clamp and coupled to the at least one flexible ultrasound transducer via a coupling, the force application device configured to, in use, urge the at least one flexible ultrasound transducer towards and / or onto the test object; a device body, wherein the at least one flexible ultrasound transducer and the force application device are housed in or mounted on the device body; and a conformable cushion between the force application device and the at least one flexible ultrasound transducer, the conformable cushion comprising at least one of graphite, a fibre reinforced material and / or a mineral, the conformable cushion configured to withstand temperatures of 150 °C or higher; wherein the at least one flexible ultrasound transducer comprises a layer of polycrystalline inorganic piezoelectric material deposited directly on a metal foil substrate, the metal foil substrate being capable of use as a counter electrode, and the layer of piezoelectric material being thinner than the metal foil substrate; and wherein the clamp comprises one or more straps, and at least a portion of the one or more straps is formed from a conformable, resilient material that is stable at temperatures of 150 °C and higher or at temperatures of -10 °C or lower. The force application device is configured such that the position of the at least one flexible ultrasound transducer or the force applied by the force application device on the at least one flexible ultrasound transducer is selectively variable or adjustable by operation of the force application device. The force application device comprises a screw or other rotational component.

2. The ultrasound apparatus of claim 1, wherein, The screw or other rotational component is coupled to the at least one flexible ultrasound transducer via the coupling, the coupling being configured to accommodate rotational movement of the screw without transmitting rotational movement to the at least one flexible ultrasound transducer or array of flexible ultrasound transducers.

3. The ultrasound apparatus of claim 1, wherein, 5. The ultrasound device of any one of claims 1 to 4, configured to operate at temperatures between 100 °C and 500 °C.

4. The ultrasound apparatus of claim 3, wherein, 6. The ultrasound device of any one of claims 1 to 4, further comprising one or more temperature sensors integrated into the ultrasound device.

7. The ultrasound device of any one of claims 1 to 4, wherein the at least one flexible ultrasound transducer comprises a plurality of flexible ultrasound transducers arranged in a transducer array. The at least one flexible ultrasound transducer comprises one or more discrete electrodes disposed directly on the layer of polycrystalline inorganic piezoelectric material. The piezoelectric material layer has a thickness in the range 2 pm to 20 pm.

8. The ultrasound apparatus of any of claims 1 to 4, wherein, The force application device is configured to move the at least one flexible ultrasound transducer and exert a force on the at least one flexible ultrasound transducer.

9. The ultrasound apparatus of any of claims 1 to 4, wherein, The coupling comprises a ball and socket joint.

10. The ultrasound apparatus of any of claims 1 to 4, wherein, The coupling is formed from a rigid material.

11. The ultrasound apparatus of any of claims 1 to 4, wherein, The coupling comprises a rigid material.

12. The ultrasound apparatus of claim 11, wherein, ​ 13. The ultrasound apparatus of any of claims 1 to 4, wherein, ​ 14. A method of manufacturing, repairing or assembling an ultrasound device according to any one of claims 1 to 13, the method comprising providing a clamp and at least one flexible ultrasound transducer, and mounting the at least one flexible ultrasound transducer to the clamp, wherein at least a portion of the at least one flexible ultrasound transducer is provided on or in a device body.

15. A method of using an ultrasound device according to any one of claims 1 to 13, the method comprising: mounting the ultrasound device to a test object using the clamp; contacting the at least one flexible ultrasound transducer to and / or onto a surface of the test object using a separate force applying device; and providing a test signal to and / or receiving an output signal from the at least one flexible ultrasound transducer. ​

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