Dynamic release tape for assembling discrete components

Abstract

The method includes positioning a discrete component assembly at a support fitting of a component delivery system, the discrete component assembly including a dynamic release tape including a flexible support layer and a dynamic release structure disposed at the flexible support layer, and a discrete component adhered to the dynamic release tape. The method includes irradiating the dynamic release structure to release the discrete component from the dynamic release tape.

Description

[0001] Priority claim

[0002] This application claims priority to U.S. Patent Application No. 62 / 843,904, filed May 6, 2019, and U.S. Patent Application No. 62 / 806,154, filed February 15, 2019, which are hereby incorporated by reference in their entireties. Background Art

[0003] This description generally relates to assembling discrete components to a substrate. Summary of the Invention

[0004] In one aspect, a method comprises positioning a discrete component assembly on a support accessory of a component conveying system, the discrete component assembly comprising a dynamic release belt comprising a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and discrete components adhered to the dynamic release belt; and irradiating the dynamic release structure to release the discrete components from the dynamic release belt, wherein at least a portion of the flexible support layer is free-standing when the discrete component assembly is positioned on the support accessory.

[0005] Implementations can have one or more of the following features.

[0006] Positioning the discrete component assembly on the support assembly includes mounting a wafer ring of the discrete component assembly to a frame of the support assembly.

[0007] The method includes adhering the discrete components to the dynamic release tape. Adhering the discrete components to the dynamic release tape includes adhering the discrete components to a component adhesive layer of the dynamic release structure. Adhering the discrete components to the dynamic release tape includes transferring the discrete components from a cutting tape to the dynamic release tape.

[0008] The method includes adhering a wafer to the dynamic release tape. Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure. The method includes dicing the adhered wafer to form discrete components. Positioning the discrete component assembly on the transparent support plate includes attaching the dynamic release tape containing the discrete components to a support plate of the support assembly. Positioning the discrete component assembly on the support plate includes retaining the discrete component assembly on the support plate by applying suction.

[0009] Illuminating the dynamic release structure includes illuminating the dynamic release structure with light from a light source of the component transport system.

[0010] In one aspect, a method includes positioning a discrete component assembly on a support accessory of a component conveying system, the discrete component assembly including a dynamic release belt including a flexible support layer, and a dynamic release structure arranged on the flexible support layer, and discrete components adhered to the dynamic release belt; wherein positioning the discrete component assembly on the support accessory includes positioning the flexible support layer of the dynamic release belt directly on a support plate of the support accessory; and irradiating the dynamic release structure to release the discrete components from the dynamic release belt.

[0011] Implementations can have one or more of the following features.

[0012] Positioning the discrete component assembly on the support assembly includes mounting a wafer ring of the discrete component assembly to a frame of the support assembly.

[0013] The method includes irradiating the dynamic release structure through the support plate to release the discrete components from the dynamic release belt. The method includes orienting the component transport system so that the discrete components are positioned between the support plate and a target substrate.

[0014] Positioning the discrete component assembly on a support plate includes positioning the discrete component assembly on a rigid support plate.

[0015] Positioning the discrete component assembly to the support assembly includes directly attaching the flexible support layer to the support plate.

[0016] Positioning the discrete component assembly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

[0017] Positioning the discrete component assembly on the support plate includes stretching the dynamic release strap over the support plate.

[0018] The method includes adhering the discrete components to the dynamic release tape. Adhering the discrete components to the dynamic release tape includes adhering the discrete components to a component adhesive layer of the dynamic release structure. Adhering the discrete components to the dynamic release tape includes transferring the discrete components from a cutting tape to the dynamic release tape.

[0019] The method includes adhering a wafer to the dynamic release tape. Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure. The method includes dicing the adhered wafer to form discrete components. Positioning the discrete component assembly on the transparent support plate includes attaching the dynamic release tape containing the discrete components to a support plate of the support assembly. Positioning the discrete component assembly on the support plate includes retaining the discrete component assembly on the support plate by applying suction.

[0020] Illuminating the dynamic release structure includes illuminating the dynamic release structure using light from a light source of the component transport system.

[0021] In one aspect, a discrete component transport system includes: a light source; a discrete component support assembly including: a support frame; a support plate positioned on the support frame, the support plate being transparent to light emitted by the light source; and an optical element arranged between the light source and the support frame.

[0022] Implementations can have one or more of the following features.

[0023] The system includes a suction source configured to apply suction to the airflow channel of the discrete component support assembly to hold the flexible support layer of the discrete component assembly against the support plate.

[0024] The system comprises a discrete component assembly comprising: a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and a discrete component adhered to the dynamic release tape; wherein the flexible support layer of the dynamic release tape is positioned directly on the support plate and is held in place by suction via an airflow channel of the discrete component support assembly. The airflow channel is formed through the thickness of the support frame. The airflow channel is formed through the thickness of the support plate.

[0025] The top surface of the support plate is offset from the top surface of the support frame by an amount sufficient to induce tensile stress in the dynamic release straps retained on the discrete component support fittings.

[0026] The support plate includes a glass plate.

[0027] The support plate includes a quartz plate.

[0028] The support plate is rigid.

[0029] The optical element includes a lens.

[0030] In one aspect, a discrete component conveying system includes: a light source; a discrete component support accessory; a discrete component assembly arranged on the discrete component support accessory, the discrete component assembly including: a dynamic release belt including a flexible support layer and a dynamic release structure arranged on the flexible support layer, and discrete components adhered to the dynamic release belt, wherein the dynamic release belt is independent when the discrete component assembly is arranged on the discrete component support accessory; and an optical element arranged between the light source and the discrete component assembly.

[0031] Implementations may include one or more of the following features.

[0032] The discrete component assembly includes a wafer ring disposed on the discrete component support assembly.

[0033] In one aspect, a method includes: cutting a wafer adhered to a dicing tape to form discrete components; and transferring the discrete components from the dicing tape to a dynamic release tape to form a discrete component assembly, the discrete component assembly including: a flexible support layer, and a dynamic release structure arranged on the flexible support layer; and directly positioning the flexible support layer of the discrete component assembly on a support plate of a component transfer system.

[0034] Implementations may include one or more of the following features.

[0035] Transferring the discrete components to the dynamic release belt includes adhering the discrete components to a component adhesive layer of the dynamic release structure.

[0036] The dynamic release structure of the dynamic release tape comprises a plurality of layers, the dynamic release structure comprising an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape comprises adhering the wafer to the assembly adhesive layer.

[0037] Positioning the flexible supporting layer directly to the support plate includes directly attaching the flexible supporting layer to the support plate.

[0038] Positioning the flexible support layer directly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

[0039] Positioning the flexible support layer directly to the support plate includes stretching the dynamic release tape over the support plate.

[0040] The method includes irradiating a dynamic release structure of the discrete assembly through the support plate to release the discrete components from the dynamic release belt.

[0041] In one aspect, a method includes: cutting a wafer adhered to a dicing tape to form a discrete component; transferring the discrete component from the dicing tape to a dynamic release tape to form a discrete component assembly, the discrete component assembly including: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; and positioning the dynamic release tape in a component transfer system such that at least a portion of the dynamic release tape is free-standing.

[0042] Implementations can include one or more of the following features.

[0043] The method includes irradiating the dynamic release tape to release the discrete component from the dynamic release tape.

[0044] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, wherein adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0045] In one aspect, a method includes: adhering a wafer to a dynamic release tape, the dynamic release tape including: a flexible support layer that is free-standing, and a dynamic release structure disposed on the flexible support layer; and cutting the adhered wafer to form a discrete component adhered to the dynamic release tape.

[0046] Implementations can include one or more of the following features.

[0047] Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure.

[0048] The dynamic release structure of the dynamic release tape includes a plurality of layers. The dynamic release structure includes an active layer structure and a component adhesive layer, wherein adhering the wafer to the dynamic release tape includes adhering the wafer to the component adhesive layer.

[0049] In one aspect, a method includes: adhering a wafer to a dynamic release tape, the dynamic release tape including: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; cutting the adhered wafer to form a discrete component adhered to the dynamic release tape, wherein the discrete component adhered to the dynamic release tape includes a discrete component assembly; and positioning the flexible support layer of the discrete component assembly directly to a support plate of a component transfer system.

[0050] Implementations can include one or more of the following features.

[0051] Positioning the flexible support layer directly to the support plate includes directly attaching the flexible support layer of the dynamic release tape to the support plate.

[0052] Positioning the flexible support layer directly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

[0053] Positioning the flexible support layer to the support plate includes stretching the dynamic release tape over the support plate.

[0054] The method includes irradiating a dynamic release structure of the discrete assembly through the support plate to release the discrete component from the dynamic release tape.

[0055] The dynamic release structure of the dynamic release tape comprises a plurality of layers, the dynamic release structure comprising an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape comprises adhering the wafer to the assembly adhesive layer.

[0056] In one aspect, a method includes: adhering a wafer to a dynamic release tape, the dynamic release tape comprising: a flexible support layer, and a dynamic release structure arranged on the flexible support layer; cutting the adhered wafer to form discrete components adhered to the dynamic release tape, wherein the discrete components adhered to the dynamic release tape include a discrete component assembly; and positioning the discrete component assembly in a component conveying system so that at least a portion of the dynamic release tape is independent.

[0057] Implementations may include one or more of the following features.

[0058] The method includes irradiating individual said dynamic release bands to release said discrete components from said dynamic release bands.

[0059] The dynamic release structure of the dynamic release tape comprises a plurality of layers, the dynamic release structure comprising an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape comprises adhering the wafer to the assembly adhesive layer.

[0060] In one aspect, an apparatus includes a dynamic release belt comprising a flexible support layer; and a dynamic release structure disposed on the flexible support layer.

[0061] Implementations may include one or more of the following features.

[0062] The dynamic release tape is sufficiently rigid to enable laser transfer of discrete components from the dynamic release tape.

[0063] The dynamic release tape is sufficiently rigid to maintain a substantially planar configuration during laser transfer of a discrete component from the dynamic release tape. The flexible support layer comprises a polymer. The dynamic release structure comprises a plurality of layers. The dynamic release structure on the absorption and adhesive layer comprises: an absorption and adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer and to generate a gas in response to irradiation of light; and an action layer disposed on the absorption and adhesive layer. The action layer comprises a blister layer configured to mechanically respond to generation of the gas by the absorption and adhesive layer. The dynamic release structure comprises: an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an action layer structure disposed on the adhesive layer. The action layer structure comprises an absorption and blister layer configured to generate a gas in response to irradiation of light and to mechanically respond to generation of the gas. The action layer structure comprises: an absorption layer disposed on the adhesive layer and configured to generate a gas in response to irradiation of light; and a blister layer configured to mechanically respond to generation of the gas by the absorption layer. One of the layers of the dynamic release structure comprises a component adhesive layer. Adhesion of the component adhesive layer is responsive to application of a stimulus.

[0064] The tape is stretchable.

[0065] The flexible support layer is transparent to ultraviolet light.

[0066] The apparatus includes a discrete component adhered to the dynamic release structure. The discrete component comprises a light emitting diode, i.e., an LED.

[0067] In one aspect, a method includes forming a dynamic release structure on a flexible support layer to form a dynamic release tape.

[0068] Implementations can include one or more of the following features.

[0069] Forming the dynamic release structure includes forming a plurality of layers on the flexible supporting layer. Forming the dynamic release structure includes: forming an absorption and adhesive layer on the flexible supporting layer, the absorption and adhesive layer being configured to adhere to the flexible supporting layer and generate gas in response to irradiation of light; and forming an active layer on the absorption and adhesive layer. The active layer includes a bubbling layer, the bubbling layer being configured to mechanically respond to the generation of gas passing through the absorption and adhesive layer. Forming the dynamic release structure includes: forming an adhesive layer on the flexible supporting layer, the adhesive layer being configured to adhere to the flexible supporting layer; and forming an active layer structure on the adhesive layer. The active layer structure includes an absorption and bubbling layer, the absorption and bubbling layer being configured to generate gas in response to irradiation of light and mechanically respond to the generation of gas. Forming the active layer structure includes forming an absorption layer on the adhesive layer, the absorption layer being configured to generate gas in response to irradiation of light; and forming a bubbling layer on the absorption layer, the bubbling layer being configured to mechanically respond to generation of gas through the absorption layer.

[0070] In one aspect, a dynamic release device includes: a flexible support layer; and a dynamic release structure arranged on the flexible support layer, the dynamic release structure including: an adhesive layer arranged on the flexible support layer and constructed to adhere to the flexible support layer; and an active layer structure arranged on the adhesive layer.

[0071] Implementations may include one or more of the following features.

[0072] The active layer structure includes an absorption and bubbling layer configured to generate gas in response to the illumination of light and mechanically respond to the generation of gas.

[0073] The active layer structure includes an absorption layer disposed on the adhesive layer and configured to generate gas in response to irradiation of light; and a bubbling layer configured to mechanically respond to the generation of gas through the absorption layer.

[0074] The dynamic release structure includes a component adhesive layer.

[0075] In one aspect, a method includes positioning a discrete component assembly on a support assembly of a component transport system, the discrete component assembly including a dynamic release belt comprising a flexible support layer, a dynamic release structure disposed on the flexible support layer, and discrete components adhered to the dynamic release belt. The method includes irradiating the dynamic release structure to release the discrete components from the dynamic release belt.

[0076] In one aspect, a discrete component transport system includes: a light source; and a discrete component support assembly comprising a support frame, a support plate located on the support frame, the support plate being transparent to light emitted by the light source; and an optical element arranged between the light source and the support frame.

[0077] In one aspect, a discrete component transport system includes: a light source; a discrete component support assembly; and a discrete component assembly disposed on the discrete component support assembly. The discrete component assembly includes: a dynamic release belt comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and a discrete component adhered to the dynamic release belt. The discrete component transport system includes an optical element disposed between the light source and the discrete component assembly.

[0078] In one aspect, a method includes dicing a wafer adhered to a dicing tape to form discrete components; and transferring the discrete components from the dicing tape to a dynamic release tape to form a discrete component assembly including a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0079] In one aspect, a method includes adhering a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and dicing the adhered wafer to form discrete components adhered to the dynamic release tape.

[0080] In one aspect, an apparatus includes a dynamic release belt comprising: a flexible support layer; and a dynamic release structure disposed on the flexible support layer.

[0081] In one aspect, a method includes forming a dynamic release structure on a flexible support layer to form a dynamic release belt.

[0082] In one aspect, a dynamic release device includes: a support layer; and a dynamic release structure arranged on the support layer, the dynamic release structure including: an adhesive layer arranged on the support layer and configured to adhere to the support layer; and an active layer structure arranged on the adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0083] Figure 1A and Figure 1B is a diagram of the laser-assisted delivery procedure.

[0084] Figure 2A and Figure 2B is a diagram of a dynamic release strap with support fittings.

[0085] Figure 3 is a diagram of a dynamic release strap with support fittings.

[0086] Figure 4 and Figure 5 is a diagram of a system for laser-assisted transfer of discrete components.

[0087] Figure 6 and Figure 7 It is a program diagram.

[0088] Figures 8A to 8C is a diagram of a multi-layer dynamic release strip mounted on a support plate.

[0089] Figures 9A to 9C is a diagram of a multi-layer dynamic release structure.

[0090] Figure 10 is a diagram of a dynamic release strap with support fittings. DETAILED DESCRIPTION

[0091] Applicants herein describe a method for laser-assisted transfer of discrete components from a thin, flexible dynamic release tape positioned on a support plate of a component transfer system. The dynamic release tape comprises a multi-layer dynamic release structure disposed on a support layer, such as a backing. Each layer of the dynamic release structure can be specifically designed to target one or more functionalities of the dynamic release structure, such as adhesion, optical properties, or mechanical properties. Applicants also describe laser-assisted transfer of discrete components from the dynamic release tape disposed on a carrier substrate.

[0092] Figure 1A and Figure 1B A laser-assisted transfer procedure for high-throughput, low-cost, contactless assembly of discrete components 102 onto rigid or flexible substrates is described. The term discrete component generally refers to any unit, such as to become a part of a product or electronic device, such as an electronic, electromechanical, photovoltaic, photonic, or optoelectronic component, module, or system (e.g., any semiconductor material having a circuit formed on a portion of a semiconductor material). In some examples, the discrete component may be a light emitting diode (LED). The discrete component may be ultrathin, meaning having a maximum thickness of 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The discrete component may be ultrasmall, meaning having a maximum length or width dimension of less than or equal to 300 μm per side, less than or equal to 100 μm per side, less than or equal to 50 μm per side, less than or equal to 20 μm per side, or less than or equal to 5 μm per side. The discrete component may be both ultrathin and ultrasmall.

[0093] Figure 1A and Figure 1BA portion of a support assembly 100 of a component transfer system for laser-assisted transfer of discrete components 102 is shown. The support assembly 100 holds a flexible discrete component assembly 108 in place for a laser-assisted transfer procedure. The support assembly (described in more detail below) can include a rigid support plate 106 mounted to a frame (not shown, described in more detail below). The frame provides stability to the rigid support plate 106. In some examples, the frame can be manipulated, for example, for alignment purposes. As described in more detail below, the discrete component assembly 108 can be attached to the support plate 106 by suction, tensile stress, or otherwise. The positioning of the discrete component assembly 108 on the support plate 106 is non-permanent, for example, so that after the laser-assisted transfer procedure is completed, the discrete component assembly 108 can be removed from the support plate 106 without damaging the support plate 106. The non-permanent attachment of the discrete component assembly 108 to the support plate 106 enables the support plate 106 to be used for multiple transfer procedures involving multiple discrete component assemblies 108.

[0094] The discrete component assembly 108 includes a dynamic release tape 110 that is mounted to a wafer ring (not shown) with discrete components 102 adhered to the dynamic release tape 110. Although applicants have shown only a single discrete component 102 here, multiple discrete components 102 can be adhered to the dynamic release tape 110 and transported by the component transport system. The dynamic release tape (e.g., tape 110) is a tape that includes a flexible support layer 112 and a dynamic release structure 114 disposed on the flexible support layer 112. The tape is a thin, flexible material composed of one or more layers. The flexible support layer 112 contacts the support plate 106 of the support assembly 100, and the discrete components 102 adhere to the dynamic release structure 114. The dynamic release structure 114 can be a multi-layer structure, such as a structure having two, three, four, or more layers, as discussed in more detail below.

[0095] Also refer to Figure 1BIn a laser-assisted delivery procedure, the backside of the support plate 106 is irradiated with radiation 116 (such as light, for example, a laser beam). Both the support plate 106 and the flexible support layer 112 of the dynamic release tape 110 are transparent to the wavelength of the radiation 116 (for example, laser energy). An element transparent to a given wavelength is an element through which at least some radiation of the given wavelength passes. The radiation 116 passes through the support plate 106 and the flexible support layer 112 of the dynamic release tape 110 and is incident on an area of ​​the dynamic release structure 114, thereby causing ablation of a portion of the thickness of the dynamic release structure 114 in the area upon which the radiation 116 is incident (which applicants refer to as the irradiation area). The ablation creates a confined gas that expands, thereby creating stress in the dynamic release structure 114. The stress causes at least some of the material of the dynamic release structure 114 to deform, thereby forming a bubble 118. The bubble 118 exerts a mechanical force on the discrete component 102. When the mechanical force applied by the bubble 118 is sufficient to overcome the adhesion between the discrete component 102 and the dynamic release structure 114 , the mechanical force applied by the bubble 118 (combined with gravity) pushes the discrete component (e.g., in a downward direction) away from the support plate 106 for transfer to the target substrate 130 .

[0096] The target substrate 130 can be positioned in close proximity to the discrete components 102 (e.g., at a distance between about 5 μm and about 300 μm). Using a rigid support plate 106 to support the tape-based discrete component assembly 108 helps maintain consistent separation between the discrete components 102 of the discrete component assembly 108 and the target substrate 130, for example, by preventing sagging or other structural changes in the tape 110. In some examples, the support plate 106 can be provided with a high surface flatness. For example, the support plate 106 can be machined to a high degree of precision.

[0097] In some laser-assisted transfer procedures, discrete components are adhered to a rigid, transparent carrier substrate via a dynamic release structure. The carrier substrate with the adhered discrete components is provided to a component transfer system for laser-assisted transfer of the discrete components. The component transfer system described herein incorporates a rigid, transparent support plate into the component transfer system itself, enabling the transfer of discrete components from a belt rather than from a rigid carrier substrate, thereby reducing the cost (e.g., in terms of materials, manufacturing, transportation, etc.) of the end-to-end discrete component transfer procedure. For example, a rigid carrier substrate can be significantly more expensive than a dynamic release belt. In addition, the dynamic release belt is disposable, thereby eliminating the need for trimming the rigid carrier substrate and the associated costs.

[0098] In some examples, the dynamic release tape used in the discrete component transfer process is a standalone tape. A standalone tape is a tape that is not attached to a rigid substrate. In some examples, the standalone tape can be positioned on a rigid substrate without being attached to the rigid substrate for one or more steps of the discrete component transfer process. For example, the standalone tape can be positioned on a rigid substrate during attachment of discrete components to the tape, during introduction into a component transfer system, or during laser-assisted transfer of discrete components.

[0099] In some examples, the dynamic release tape used in the discrete component transfer procedure is not a stand-alone tape, but is instead attached to a rigid substrate during attachment of the discrete components to the tape, during introduction into the component transfer system, or during laser-assisted transfer of the discrete components.

[0100] Further description of the laser-assisted delivery procedure can be found in U.S. Patent Publication No. US 2014 / 0238592, the entire contents of which are incorporated herein by reference.

[0101] Figure 2A and Figure 2B A cross-sectional view of an exemplary support assembly 200 is shown, which includes a support plate 206 for positioning a discrete component assembly 208 for a laser-assisted delivery procedure. The support plate 206 is a rigid plate that is transparent to the wavelength of radiation (e.g., ultraviolet (UV) light) used in the laser delivery procedure. For example, the support plate 206 can be a glass plate, a quartz plate, or a plate of other materials. The support plate 206 is mounted to a frame 220 of the support assembly. In a laser-assisted delivery procedure, such as Figure 2A and Figure 2B In some examples shown, the frame 220 has openings 221 to allow radiation to reach the support plate 206. In some examples, the frame 220 can be without openings and can be transparent to the wavelength of the radiation such that the radiation is transmitted through the frame 220.

[0102] The discrete component assembly 208 includes a separate dynamic release tape 210 mounted on a wafer ring 222, wherein the discrete components 102 are adhered to the dynamic release tape 210. For example, the dynamic release tape 210 can be stretched over the wafer ring 222. Figures 2A to 2B In the example of FIG, a dynamic release tape 210 includes a flexible support layer 212 and a multi-layer dynamic release structure 214 disposed on the flexible support layer 212. The exemplary multi-layer dynamic release structure 214 includes a plurality of sub-layers 224a, 224b having adhesive, radiation absorbing, and blistering functionalities, and an element adhesive layer 226 that is adhered to the discrete element 102. The multi-layer dynamic release structure 214 is discussed in more detail below.

[0103] specifically refer to Figure 2BTo position discrete component assembly 208 on support plate 206 of a component transport system, wafer ring 222 is brought into contact with frame 220 and the backside of flexible support layer 212 of dynamic release tape 210 is brought into contact with support plate 206. When positioned, top surface 223 of wafer ring 222 is substantially flush (e.g., aligned) with top surface 207 of support plate 206, such that dynamic release tape 210 is substantially flat across its entire lateral extent.

[0104] For example, suction is applied by a suction source of the component transport system through the airflow channel 228 to hold the dynamic release strip 210 against the support plate 206. For example, the airflow channel 228 can be defined by the thickness of the component transport system frame 220 (as shown) or by the thickness of the support plate 206, or both. For example, the application of suction firmly pulls the dynamic release strip 210 against the support plate 206 such that the dynamic release structure 214 is substantially flat.

[0105] Reference Figure 10 In some examples, the support assembly 150 includes the frame 170 but does not include a support plate (eg, does not include a support plate such as Figure 2A and Figure 2B 10. The wafer ring 222 of the discrete component assembly 208 is mounted to the frame 170 of the support assembly 150, and the dynamic release tape 210 is otherwise maintained freestanding for the laser-assisted transfer procedure. Direct laser-assisted transfer from the freestanding dynamic release tape 210 can be performed when the dynamic release tape 210 is sufficiently rigid (such as sufficiently rigid to maintain a substantially flat configuration during the entire duration of the laser-assisted transfer procedure). For example, the dynamic release tape 210 can be sufficiently rigid such that when the discrete component assembly 208 is mounted to the frame 170, the maximum deviation of the dynamic release tape 210 in a direction z perpendicular to the plane of the tape 210 is less than a threshold amount, e.g., less than 20 μm, less than 10 μm, or less than 5 μm.

[0106] Figure 3 A cross-sectional view of an exemplary support assembly 300 is shown, which includes a support plate 306 for positioning discrete component assembly 208 for a laser-assisted delivery procedure. Support plate 306 is a rigid plate that is transparent to the wavelength of radiation (e.g., UV light) used in the laser delivery procedure. Support plate 306 is mounted to a frame 320 of support assembly 300. Frame 320 has an opening 321 to allow radiation to reach support plate 306. In some examples, frame 320 can be transparent to the wavelength of radiation so that the radiation is transmitted through frame 320.

[0107] exist Figure 3In the example shown, when the discrete component assembly 208 is positioned on the support assembly 300, the top surface 223 of the wafer ring 222 is at a height below (e.g., offset from) the top surface 307 of the support plate 306. For example, the frame 320 of the support assembly 300 can be offset from the top surface of the support plate 306 by an amount such that when the discrete component assembly 208 is positioned on the support plate, there is still an offset between the support plate 306 and the wafer ring 222. This offset introduces a tensile stress in the dynamic release strip 210 that maintains the dynamic release strip 210 against the support plate 306, for example, such that the dynamic release structure 214 is substantially flat. The amount of tensile stress, and therefore the force that maintains the dynamic release strip 210 against the support plate 306, can be controlled by varying the height difference between the top surface 223 of the wafer ring 222 and the top surface 307 of the support plate 306.

[0108] In some examples, other methods can be employed to position dynamic release belt 210 to a support plate of a component transport system, such as by using methods involving magnetic forces, static electricity, mechanical fastening, or other methods.

[0109] Figure 4 An example of a component transport system 450 is shown. Component transport system 450 includes a support assembly 400 having a support plate 406 mounted to a frame 420. Support assembly 400 is positioned so that discrete component assembly 408 is held to support plate 406. Discrete component assembly 408 includes a dynamic release tape 410 to which discrete components 102 are attached, wherein dynamic release tape 410 is mounted to (e.g., stretched over) a wafer ring 422. For example, wafer ring 422 is positioned to frame 420 and stretched dynamic release tape 410 is held against support plate 406. Discrete component assembly 408 can be illuminated with radiation (e.g., light such as UV light) from a light source 452 (e.g., a laser). Light from light source 452 can be manipulated (e.g., focused) by an optical element 454 (e.g., a lens) disposed between light source 452 and support plate 406. Frame 420 has an opening 421 to allow radiation from light source 452 to reach support plate 406. The substrate holder 432 holds a target substrate 430 for transfer of discrete components through a laser-assisted transfer process.

[0110] In some examples, such as when the support accessory 400 is constructed to hold the discrete component assembly against the support plate 406 by applying suction, the component transfer system 450 can include a suction source 434 fluidly connected (e.g., via tubing, not shown) to one or more air flow channels (not shown) in the support plate 406 or frame 420.

[0111] Figure 5An example of a component transfer system 550 is shown having a light source 552 and an optical element 554. The component transfer system 550 includes a support assembly 500, which includes a frame 520. A support plate is not mounted to the frame 520. A discrete component assembly 508 is held on the frame 520, and the discrete component assembly 508 includes a dynamic release belt 510 mounted to a wafer ring 522. In this configuration, during the laser-assisted transfer process, the wafer ring 522 of the discrete component assembly 508 is positioned on the frame 520, and the dynamic release belt 510 is a standalone belt (meaning a belt that is not supported by a rigid base plate or support plate). The discrete components 102 are transferred to a target substrate 530 held by a substrate holder 532.

[0112] In some examples, the component transport systems 450, 550 can be constructed for parallel transport of multiple discrete components, or can be constructed to have a single component transport mode and a multiple component transport mode, as described in more detail in WO 2018 / 231344 filed on April 25, 2018, the entire contents of which are incorporated herein by reference.

[0113] Reference Figure 6 In some examples, after the dicing process, the discrete components 602 can be transferred to a dynamic release tape 610. A wafer 630 containing one or more electronic components (e.g., integrated circuits) is adhered (650) to a dicing tape 632 and diced (652) to form discrete components 602, for example, using standard wafer handling techniques for wafer dicing. For example, the dicing tape 632 can be mounted on a wafer ring. In some examples, the dicing process can include, for example, stretching the dicing tape 632 laterally by extending it to the wafer ring to separate the discrete components 602.

[0114] The discrete components 602 are transferred (654) to the dynamic release tape 610 and the cutting tape 632 is removed (656), thereby adhering the discrete components 602 to the dynamic release tape 610. For example, the discrete components 602 can be adhered to the component adhesive layer (discussed below) of the dynamic release tape 610. The dynamic release tape 610 with the discrete components 602 adhered thereto is attached (658) to the transparent rigid support plate 606 of the component transfer system for laser-assisted transfer of the discrete components 602 to the target substrate. The flexible support layer of the dynamic release tape 610 is attached to the support plate, for example, by suction, tensile stress, or other means.

[0115] Reference Figure 7In some examples, discrete components 702 can be cut directly on dynamic release tape 710. A wafer 730 containing one or more semiconductor dies (e.g., integrated circuits) is adhered (750) to dynamic release tape 710 (e.g., adhered to a component adhesive layer of dynamic release tape 710). The adhered wafer 730 is cut (752) to form discrete components 702, for example, using standard wafer handling techniques for wafer cutting. For example, dynamic release tape 710 can be mounted on a wafer ring. In some examples, dynamic release layer tape 710 is stretchable and the cutting process can include, for example, stretching the dynamic release layer tape 710 laterally by extending the dynamic release tape over the wafer ring to separate discrete components 702.

[0116] The dynamic release layer tape 710 with the discrete components 702 adhered thereto is attached (754) to a transparent rigid support plate 706 of a component transfer system for laser-assisted transfer of the discrete components 702 to a target substrate. For example, the flexible support layer of the dynamic release tape 710 is attached to the support plate by suction, tensile stress, or other means.

[0117] exist Figure 7 The process does not include the step of transferring the cut discrete components 702 from the cutting tape to the dynamic release layer tape, so that Figure 7 The procedure is simplified and effective.

[0118] Reference Figures 8A to 8C The dynamic release layer tapes 800, 820, 840 can be multilayer tapes having a flexible support layer 812 and having multilayer dynamic release structures 814, 834, 854 disposed on the flexible support layer 812, respectively. The discrete components 802 can be adhered to the dynamic release structures 814, 834, 854 by component adhesive layers 808 forming part of each multilayer dynamic release structure 814, 834, 854. The multilayer dynamic release structures 814, 834, 854 can be formed from a different number of layers having various compositions and functions. Figures 8A to 8C As shown, dynamic release layer tapes 800, 820, 840 can be positioned on a rigid support that is transparent to radiation used in a laser-assisted transfer procedure, such as a support plate 806 of a component transfer system. In some examples, dynamic release layer tapes 800, 820, 840 can be used in other environments, such as attached to a wafer ring or used in other ways.

[0119] The flexible support layer 812 is a flexible film that is transparent to radiation used in the laser-assisted delivery procedure (e.g., transparent to UV light). For example, the flexible support layer 812 can be a polymer film such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or polymethyl methacrylate (PMMA). The flexible support layer 812 is thin and flexible enough to allow the dynamic release layer strips 800, 820, 840 to be manipulated (e.g., rolled, bent, or stretched) without damaging the strip. The presence of the flexible support layer 812 allows the dynamic release layer strips 800, 820, 840 to be freestanding strips, for example, with sufficient mechanical integrity to be handled without attachment to a rigid substrate.

[0120] specifically refer to Figure 8A In some examples, the dynamic release structure 814 of the dynamic release layer strip 800 may be an absorbent and adhesive layer 804 disposed on the flexible support layer 812 and an active layer 805 (such as a blister layer (such as Figure 8A The component adhesive layer 808 is arranged on the active layer 805.

[0121] The absorptive and adhesive layer 804 has dual functionality: bonding the active layer 805 to the flexible support layer 812; and absorbing energy from the radiation during the laser-assisted delivery procedure. For example, the absorptive and adhesive layer 804 may absorb at least 90%, at least 95%, at least 98%, or at least 99% of the energy incident on the absorptive and adhesive layer 804, for example to prevent the radiation from reaching and potentially damaging discrete components adhered to the tape 800.

[0122] Energy absorption by the absorption and adhesion layer 804 results in ablation of the layer, thereby generating gas. The generated gas triggers a mechanical response in the adjacent active layer 805. For example, Figure 8A As shown, the active layer 805 may be one in which bubbles are formed in response to gas generation (e.g., as Figure 1B As shown) of the foaming layer.

[0123] Reference Figure 8B In some examples, the dynamic release structure 834 of the dynamic release layer strip 820 may be a structure having an adhesive layer 824 disposed on the flexible support layer 812 and an active layer 826 (such as an absorbent and blistering layer (such as Figure 8B The component adhesive layer 808 is arranged on the active layer 826.

[0124] The adhesive layer 824 exhibits sufficient adhesion to bond the active layer 826 to the flexible supporting layer 812. Figure 8BIn the example of the dynamic release layer 840, the active layer 826 is an absorbing and blistering layer. The active layer 826 absorbs energy from the irradiation during a laser-assisted transfer procedure, resulting in a gas that initiates a mechanical response (such as the formation of a blister) in the active layer 826. For example, the active layer 826 can be capable of absorbing at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy.

[0125] Referring to Figure 8C In some examples, the dynamic release structure 854 of the dynamic release layer 840 can be a four-layer structure having an adhesive layer 844 disposed on the flexible support layer 812 and an active layer structure 846 disposed on the adhesive layer 844. The assembly adhesive layer 808 is disposed on the active layer structure 846.

[0126] The adhesive layer 844 exhibits adhesion sufficient to bond the active layer structure 846 to the flexible support layer 812. The active layer structure 846 includes two layers, an absorbing layer 848 and a blistering layer 850. The absorbing layer 848 absorbs energy from the irradiation during a laser-assisted transfer procedure, resulting in a gas. For example, the absorbing layer 848 can be capable of absorbing at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy. The generation of the gas initiates a mechanical response (such as the formation of a blister) in the blistering layer 850.

[0127] The dynamic release structures (e.g., dynamic release structures 814, 834, 854) have multiple functionalities, such as adhesion to the flexible support layer, internal adhesion between layers, absorption of incident radiation, and mechanical response (e.g., blistering). The multi-layer nature of the dynamic release structures 814, 834, 854 can allow each layer to be specifically designed to achieve one or more of these functionalities.

[0128] In Figure 8AIn some examples, the absorbing and adhesive layer 804 can be designed to adhere to the support layer 812, absorb incident radiation, and generate a sufficient amount of gas to cause the formation of bubbles in the active layer 805. In some examples, the absorbing and adhesive layer 804 can be designed to promote internal adhesion, for example, adhering to the active layer 805 with sufficient adhesiveness to at least partially avoid delamination of the bubbles, which can result in large diameter bubbles that have the potential to affect the transport of discrete components in adjacent locations (e.g., discrete components not intended for transport). In the design of the absorbing and adhesive layer 804, the optical and adhesive properties of the layer can be the primary focus of the design, while the mechanical properties of the layer (such as its strength or modulus) can be a secondary focus of the design. Conversely, the thickness and composition of the active layer 805 can be designed to focus on mechanical properties (e.g., to achieve a desired bubbling response), while the optical and adhesive properties of the layer can be secondary. In some examples, the active layer 805 can be designed to have mechanical properties that allow the formation of bubbles of a target size without rupture, and to prevent any gas generated by the absorption and adhesion layer 804 from escaping from the dynamic release structure 814. For example, the target size of the bubble can be a height-to-diameter ratio of about one and a base diameter no greater than about three times the diameter of the irradiation beam (e.g., a laser beam). In a specific example, the active layer 805 can be a polymer film, such as PET or a polyimide film, having a thickness between about 2 μm and about 5 μm.

[0129] In addition, Figure 8A In the dynamic release structure 814, the active layer 805 itself does not absorb energy and is therefore not partially ablated. In fact, ablation occurs in the adjacent absorbing and adhesive layer 804. Since no ablation occurs in the active layer 805, the thickness of the active layer 805 is not affected by the amount of laser energy delivered to the bubble location, which means that the active layer 805 is not thinned by the irradiation. This separation of ablation and bubble formation into two distinct layers allows the use of higher pulse energies to produce larger bubbles.

[0130] In some examples, such as when discrete components 802 are cut from a tape (e.g., Figure 6When transferring a wafer (or other source substrate) to the dynamic release layer tape, or when cutting the wafer directly on the dynamic release layer tape to form discrete components 802, the component adhesive layer 808 can be designed to have an adhesive strength that is greater than the force holding the discrete components 802 to their source substrates. In some examples, the relatively low adhesion between the component adhesive layer 808 and the discrete components 802 can facilitate high precision during the laser-assisted transfer procedure. The component adhesive layer 808 can be designed to have an adhesive strength that is as low as possible while still sufficient to keep the discrete components adhered to the dynamic release layer tape prior to the laser-assisted transfer procedure. In some examples, in order to meet these conflicting criteria of having a component adhesive layer 808 with both high and low adhesive strengths, the component adhesive layer 808 can be designed to have an adhesive strength that can be modified by the application of a stimulus (such as UV light or heat). The initial strong adhesion of the component adhesive layer 808 can facilitate reliable transfer of the discrete components 802 from their source substrates to the dynamic release layer tape. The initial tack of the component adhesive layer 808 can also support the wafer during the dicing process used to form discrete components. Prior to the laser-assisted transfer process, a stimulus can be applied to reduce the adhesion between the component adhesive layer 808 and the discrete components 802 to a level that facilitates accurate component placement during transfer.

[0131] Reference Figures 9A to 9C In some examples, multiple layers of dynamic release structures 914, 934, 954 can be applied to a rigid carrier substrate 910 (such as a glass carrier substrate). Discrete components 902 can be adhered to the rigid carrier substrate 910 via the dynamic release structures 914, 934, 954 to form discrete component assemblies 900, 920, 940. Discrete components 902 can be transferred directly from the rigid carrier substrate 910 to a target substrate via a laser-assisted transfer process.

[0132] The dynamic release structure can be provided as a separate tape and applied as a tape to the carrier substrate 910, for example, by roller coating or other tape application methods. In some examples, the dynamic release structure can be spin-coated onto the carrier substrate. Applying the dynamic release structure to the carrier substrate in tape form can have advantages over spin coating, such as reduced cost, less labor-intensive processing, and more efficient application.

[0133] The dynamic release structure 914, 934, 954 provided in tape form for application to the rigid carrier substrate 910 may be a multi-layer structure such as described above with respect to Figures 8A to 8C Described multi-layer structure.

[0134] specifically refer to Figure 9A In some examples, the dynamic release structure 914 can be a three-layer structure having an absorbent and adhesive layer 904 adhered to a rigid carrier substrate 910. The active layer 906 (such as a blister layer (e.g. Figure 9A) is arranged on the absorbent and adhesive layer 904. The component adhesive layer 908 is arranged on the active layer 906.

[0135] The absorption and adhesion layer 904 has a dual functionality: to bond the active layer 906 to the rigid carrier substrate 910; and to absorb energy from the irradiation during the laser-assisted delivery process. Energy absorption by the absorption and adhesion layer 904 results in ablation of the layer, thereby generating gas. The generated gas induces a mechanical response in the adjacent active layer 906. For example, Figure 9A As shown, the active layer 906 may be a bubbler layer, wherein bubbles are formed in response to gas generation, thereby enabling the transfer of the discrete components 902 .

[0136] Reference Figure 9B In some examples, the dynamic release structure 934 can be an adhesive layer 924 adhered to the rigid carrier substrate 910 and an active layer 926 (such as an absorbent and blistering layer (such as Figure 9B The component adhesive layer 908 is arranged on the active layer 926. The adhesive layer 924 exhibits sufficient adhesion to the carrier substrate 910. Figure 9B In the example of FIG. 1 , the active layer 926 is an absorbing and bubbling layer that absorbs energy from the irradiation during the laser-assisted delivery procedure, thereby generating a gas that triggers a mechanical response in the active layer 926 , such as bubble formation.

[0137] Reference Figure 9C In some examples, the dynamic release structure 954 can be a four-layer structure having an adhesive layer 944 adhered to the rigid carrier substrate 910 and an active layer structure 946 disposed on the adhesive layer 944. The component adhesive layer 908 is disposed on the active layer structure 946. The active layer structure 946 includes two layers: an absorbent layer 948 and a blistering layer 950. The absorbent layer 948 absorbs energy from the irradiation during the laser-assisted delivery procedure, thereby generating gas. The generation of gas triggers a mechanical response (such as bubble formation) in the blistering layer 950.

[0138] The individual layers of the multi-layer dynamic release structure can be designed to achieve the desired functionality, as described above with respect to Figures 8A to 8C For example, the adhesive layers 904, 924, 954 adhered to the carrier substrate 910 can be designed to have an adhesion to the carrier substrate that is low enough to allow for easy removal, thereby facilitating refurbishment of the carrier substrate after the laser transfer process is completed.

[0139] A number of embodiments have been described. However, it will be appreciated that various modifications may be made without departing from the spirit and scope of the present invention. For example, some of the steps described above may be order-independent and thus can be performed in an order other than that described.

[0140] Other implementations are within the scope of the following claims.

Claims

1. A method comprising: Positioning a discrete component assembly on a support assembly of a component conveying system, the discrete component assembly comprising: Dynamic release straps comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape; and irradiating the dynamic release structure to release the discrete components from the dynamic release tape, wherein at least a portion of the flexible support layer is freestanding when the discrete component assembly is positioned in the support assembly; The top surface of the support plate of the support fitting is offset from the top surface of the support frame of the support fitting by an amount sufficient to induce tensile stress in the dynamic release strap retained on the support fitting.

2. The method according to claim 1, characterized in that Positioning the discrete component assembly on the support assembly includes mounting a wafer ring of the discrete component assembly to a frame of the support assembly.

3. A method according to claim 1 or 2, comprising adhering the discrete components to the dynamic release tape.

4. The method according to claim 3, characterized in that Adhering the discrete components to the dynamic release tape includes adhering the discrete components to a component adhesive layer of the dynamic release structure.

5. The method according to claim 3, characterized in that Adhering the discrete components to the dynamic release tape includes transferring the discrete components from a cutting tape to the dynamic release tape.

6. The method of claim 1 or 2, comprising adhering a wafer to the dynamic release tape.

7. The method according to claim 6, characterized in that Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure.

8. The method of claim 6, comprising dicing the bonded wafer to form discrete components.

9. The method according to claim 8, characterized in that Positioning the discrete component assembly on the support plate includes attaching the dynamic release strap containing the discrete components to a support plate of the support accessory.

10. The method according to claim 8, characterized in that Positioning the discrete component assembly on the support plate includes retaining the discrete component assembly to the support plate by applying suction.

11. The method according to claim 1 or 2, characterized in that Illuminating the dynamic release structure includes illuminating the dynamic release structure with light from a light source of the component transport system.

12. A method comprising: A support assembly for positioning a discrete component assembly on a component conveyor system, the discrete component assembly comprising: Dynamic release straps comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape; wherein positioning the discrete component assembly to the support assembly comprises positioning the flexible support layer of the dynamic release band directly to a support plate of the support assembly; and irradiating the dynamic release structure to release the discrete components from the dynamic release belt; The top surface of the support plate of the support fitting is offset from the top surface of the support frame of the support fitting by an amount sufficient to induce tensile stress in the dynamic release strap retained on the support fitting.

13. The method according to claim 12, characterized in that Positioning the discrete component assembly on the support assembly includes mounting a wafer ring of the discrete component assembly to a frame of the support assembly.

14. A method according to claim 12 or 13, comprising irradiating the dynamic release structure through the support plate to release the discrete components from the dynamic release tape.

15. The method of claim 14, comprising orienting the component transport system such that the discrete components are positioned between the support plate and a target substrate.

16. The method according to claim 12 or 13, characterized in that Positioning the discrete component assembly on a support plate includes positioning the discrete component assembly on a rigid support plate.

17. The method according to claim 12 or 13, characterized in that Positioning the discrete component assembly to the support assembly includes directly attaching the flexible support layer to the support plate.

18. The method according to claim 12 or 13, characterized in that Positioning the discrete component assembly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

19. The method according to claim 12 or 13, characterized in that Positioning the discrete component assembly on the support plate includes stretching the dynamic release strap over the support plate.

20. The method of claim 12 or 13, comprising adhering the discrete components to the dynamic release tape.

21. The method according to claim 20, characterized in that Adhering the discrete components to the dynamic release tape includes adhering the discrete components to a component adhesive layer of the dynamic release structure.

22. The method according to claim 20, characterized in that Adhering the discrete components to the dynamic release tape includes transferring the discrete components from a cutting tape to the dynamic release tape.

23. The method of claim 12 or 13, comprising adhering a wafer to the dynamic release tape.

24. The method according to claim 23, wherein Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure.

25. The method of claim 23, comprising dicing the bonded wafer to form discrete components.

26. The method according to claim 25, characterized in that Positioning the discrete component assembly to the support plate includes attaching the dynamic release strap containing the discrete components to a support plate of the support accessory.

27. The method according to claim 25, characterized in that Positioning the discrete component assembly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

28. The method according to claim 12 or 13, characterized in that Illuminating the dynamic release structure includes illuminating the dynamic release structure using light from a light source of the component transport system.

29. A discrete component transport system comprising: light source; Discrete component support assembly, comprising: Support frame; a support plate positioned on the support frame, the support plate being transparent to light emitted by the light source; an optical element disposed between the light source and the support frame; and a discrete component assembly positioned on the discrete component support fitting, the discrete component assembly comprising a dynamic release band and a discrete component adhered to the dynamic release band; wherein the top surface of the support plate is offset from the top surface of the support frame by an amount sufficient to induce tensile stress in the dynamic release strap retained on the discrete component support fitting.

30. The system of claim 29, comprising a suction source configured to apply suction to the airflow channel of the discrete component support accessory to maintain the flexible support layer of the discrete component assembly against the support plate, the dynamic release belt comprising the flexible support layer and a dynamic release structure arranged on the flexible support layer.

31. The system of claim 29 or 30, wherein the dynamic release belt comprises a flexible support layer and a dynamic release structure arranged on the flexible support layer; the flexible support layer of the dynamic release belt is directly positioned on the support plate and is held in place by suction via the airflow channel of the discrete component support accessory.

32. The system according to claim 30, wherein: The air flow channel is formed through a thickness of the support frame.

33. The system according to claim 30, wherein: The air flow channel is formed through the thickness of the support plate.

34. The system according to claim 29 or 30, characterized in that The support plate includes a glass plate.

35. The system according to claim 29 or 30, characterized in that The support plate includes a quartz plate.

36. The system according to claim 29 or 30, characterized in that The support plate is rigid.

37. The system according to claim 29 or 30, characterized in that The optical element includes a lens.

38. A discrete component transport system comprising: light source; Discrete component support accessories; A discrete component assembly is arranged on the discrete component support fitting, the discrete component assembly comprising: A dynamic release belt comprising a flexible support layer and a dynamic release structure arranged on the flexible support layer, and discrete components adhered to the dynamic release tape, wherein the dynamic release strap is independent when the discrete component assembly is disposed on the discrete component support assembly; and an optical element disposed between the light source and the discrete component assembly; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of the support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release band retained on the discrete component support assembly.

39. The system according to claim 38, wherein: The discrete component assembly includes a wafer ring disposed on the discrete component support assembly.

40. A method comprising: cutting the wafer adhered to the dicing tape to form discrete components; as well as transferring the discrete components from the cutting belt to a dynamic release belt to form a discrete component assembly, the discrete component assembly comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; and Positioning the flexible support layer of the discrete component assembly directly on a support plate of a discrete component support assembly of a component transport system; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of a support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release strap retained on the discrete component support assembly.

41. The method according to claim 40, characterized in that Transferring the discrete components to the dynamic release belt includes adhering the discrete components to a component adhesive layer of the dynamic release structure.

42. The method according to claim 40 or 41, characterized in that The dynamic release structure of the dynamic release tape comprises a plurality of layers.

43. The method according to claim 42, wherein The dynamic release structure includes an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape includes adhering the wafer to the assembly adhesive layer.

44. The method according to claim 40 or 41, characterized in that Positioning the flexible supporting layer directly to the support plate includes directly attaching the flexible supporting layer to the support plate.

45. The method according to claim 40 or 41, characterized in that Positioning the flexible support layer directly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

46. ​​The method according to claim 40 or 41, characterized in that Positioning the flexible support layer directly to the support plate includes stretching the dynamic release tape over the support plate.

47. The method of claim 40 or 41, comprising irradiating the dynamic release structure of the discrete component assembly through the support plate to release the discrete components from the dynamic release belt.

48. A method comprising: cutting the wafer adhered to the dicing tape to form discrete components; transferring the discrete components from the cutting belt to a dynamic release belt to form a discrete component assembly, the discrete component assembly comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; and positioning the discrete component assembly on a support plate of a discrete component support assembly of a component transport system such that at least a portion of the dynamic release belt is freestanding; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of a support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release strap retained on the discrete component support assembly.

49. The method of claim 48, comprising irradiating the individual dynamic release bands to release the discrete components therefrom.

50. The method according to claim 48 or 49, characterized in that The dynamic release structure of the dynamic release tape comprises a plurality of layers.

51. The method according to claim 50, characterized in that The dynamic release structure includes an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape includes adhering the wafer to the assembly adhesive layer.

52. A method comprising: Adhering the wafer to a dynamic release tape comprising: Independent flexible support layer, and a dynamic release structure disposed on the flexible support layer; and cutting the bonded wafer to form discrete components bonded to the dynamic release tape, the discrete components bonded to the dynamic release tape comprising a discrete component assembly; positioning the discrete component assembly on a discrete component support assembly; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of the support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release band retained on the discrete component support assembly.

53. The method according to claim 52, characterized in that Adhering the wafer to the dynamic release tape includes adhering the wafer to a component adhesive layer of the dynamic release structure.

54. The method according to claim 52 or 53, characterized in that The dynamic release structure of the dynamic release tape comprises a plurality of layers.

55. The method according to claim 54, characterized in that The dynamic release structure includes an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape includes adhering the wafer to the assembly adhesive layer.

56. A method comprising: Adhering the wafer to a dynamic release tape comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; dicing the adhered wafer to form discrete components adhered to the dynamic release tape, wherein the discrete components adhered to the dynamic release tape include a discrete component assembly; and Positioning the flexible support layer of the discrete component assembly directly on a support plate of a discrete component support assembly of a component transport system; wherein a top surface of the support plate is offset from a top surface of a support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release strap retained on the discrete component support assembly.

57. The method according to claim 56, characterized in that Positioning the flexible support layer directly to the support plate includes attaching the flexible support layer of the dynamic release strip directly to the support plate.

58. The method according to claim 56 or 57, characterized in that Positioning the flexible support layer directly to the support plate includes retaining the discrete component assembly to the support plate by applying suction.

59. The method according to claim 56 or 57, characterized in that Positioning the flexible support layer to the support plate includes stretching the dynamic release tape over the support plate.

60. The method of claim 56 or 57, comprising irradiating the dynamic release structure of the discrete component assembly through the support plate to release the discrete components from the dynamic release belt.

61. The method according to claim 56 or 57, characterized in that The dynamic release structure of the dynamic release tape comprises a plurality of layers.

62. The method according to claim 61, characterized in that The dynamic release structure includes an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape includes adhering the wafer to the assembly adhesive layer.

63. A method comprising: Adhering the wafer to a dynamic release tape comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; dicing the adhered wafer to form discrete components adhered to the dynamic release tape, wherein the discrete components adhered to the dynamic release tape include a discrete component assembly; and positioning the discrete component assembly in a component transport system such that at least a portion of the dynamic release belt is freestanding; wherein the top surface of the support plate of the discrete component support assembly of the component transfer system is offset from the top surface of the support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release band retained on the discrete component support assembly.

64. The method of claim 63, comprising irradiating the individual dynamic release bands to release the discrete components therefrom.

65. The method according to claim 63 or 64, characterized in that The dynamic release structure of the dynamic release tape comprises a plurality of layers.

66. The method of claim 65, wherein the dynamic release structure comprises an active layer structure and an assembly adhesive layer, wherein adhering the wafer to the dynamic release tape comprises adhering the wafer to the assembly adhesive layer.

67. An apparatus comprising: Dynamic release straps comprising: a flexible support layer; and a dynamic release structure disposed on the flexible support layer; and Discrete component support accessories; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of the support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release band retained on the discrete component support assembly.

68. The apparatus according to claim 67, wherein The dynamic release tape is sufficiently rigid to enable laser transfer of discrete components from the dynamic release tape.

69. The apparatus according to claim 67 or 68, characterized in that The dynamic release tape is sufficiently rigid to maintain a substantially flat configuration during laser transfer of discrete components from the dynamic release tape.

70. The apparatus according to claim 67, wherein The flexible supporting layer includes a polymer.

71. The apparatus according to claim 67 or 68, characterized in that The dynamic release structure comprises a plurality of layers.

72. The apparatus according to claim 71, wherein The dynamic release structure includes: an absorption and adhesion layer disposed on the flexible supporting layer and configured to adhere to the flexible supporting layer and generate gas in response to exposure to light; and The active layer is arranged on the absorption and adhesive layer.

73. The apparatus according to claim 72, wherein The active layer includes a bubble layer configured to mechanically respond to generation of gas through the absorbent and adhesive layer.

74. The apparatus according to claim 71, wherein The dynamic release structure includes: an adhesive layer disposed on the flexible supporting layer and configured to adhere to the flexible supporting layer; and The active layer structure is arranged on the adhesive layer.

75. The apparatus according to claim 74, wherein The active layer structure includes an absorption and bubbling layer configured to generate gas in response to the illumination of light and mechanically respond to the generation of gas.

76. The apparatus of claim 74, wherein the active layer structure comprises: an absorbing layer disposed on the adhesive layer and configured to generate gas in response to irradiation with light; as well as A bubble layer is configured to mechanically respond to the generation of gas through the absorbent layer.

77. The apparatus according to claim 71, wherein One of the layers of the dynamic release structure includes a component adhesion layer.

78. The apparatus according to claim 77, wherein The adhesion of the component adhesive layer is responsive to application of a stimulus.

79. The apparatus according to claim 67 or 68, characterized in that The strap is stretchable.

80. The apparatus according to claim 67 or 68, characterized in that The flexible supporting layer is transparent to ultraviolet light.

81. The device of claim 67 or 68, comprising discrete components adhered to the dynamic release structure.

82. The apparatus according to claim 81, wherein The discrete components include light emitting diodes, or LEDs.

83. A method comprising: forming a dynamic release structure on the flexible support layer to form a dynamic release strip, the dynamic release strip forming an assembly of discrete components; positioning the discrete component assembly on a discrete component support assembly of a component transport system; The top surface of the support plate of the discrete component support assembly is offset from the top surface of the support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release strap retained on the discrete component support assembly.

84. The method according to claim 83, wherein Forming the dynamic release structure includes forming a plurality of layers on the flexible supporting layer.

85. The method according to claim 84, characterized in that Forming the dynamic release structure includes: forming an absorption and adhesion layer on the flexible supporting layer, the absorption and adhesion layer being configured to adhere to the flexible supporting layer and generate gas in response to irradiation of light; and An active layer is formed on the absorbent and adhesive layer.

86. The method according to claim 85, characterized in that The active layer includes a bubble layer configured to mechanically respond to generation of gas through the absorbent and adhesive layer.

87. The method according to claim 84, characterized in that Forming the dynamic release structure includes: forming an adhesive layer on the flexible supporting layer, the adhesive layer being configured to adhere to the flexible supporting layer; and An active layer structure is formed on the adhesive layer.

88. The method according to claim 87, characterized in that The active layer structure includes an absorption and bubbling layer configured to generate gas in response to the illumination of light and mechanically respond to the generation of gas.

89. The method according to claim 87, characterized in that Forming the active layer structure includes: forming an absorption layer on the adhesive layer, the absorption layer being configured to generate gas in response to irradiation of light; and A blister layer is formed on the absorbent layer, the blister layer being configured to mechanically respond to generation of gas through the absorbent layer.

90. A dynamic release device comprising: Dynamic release straps comprising: flexible support layer; A dynamic release structure is arranged on the flexible support layer, and the dynamic release structure comprises: an adhesive layer disposed on the flexible supporting layer and configured to adhere to the flexible supporting layer; an active layer structure disposed on the adhesive layer; and A discrete component support assembly, the discrete component support assembly comprising: Support plates and support frames; wherein the top surface of the support plate is offset from the top surface of the support frame by an amount sufficient to induce tensile stress in the dynamic release strap retained on the discrete component support fitting.

91. The apparatus according to claim 90, wherein The active layer structure includes an absorption and bubbling layer configured to generate gas in response to the illumination of light and mechanically respond to the generation of gas.

92. The apparatus according to claim 90, wherein The active layer structure comprises: an absorbing layer disposed on the adhesive layer and configured to generate gas in response to irradiation with light; and A bubble layer is configured to mechanically respond to the generation of gas through the absorbent layer.

93. The apparatus according to any one of claims 90 to 92, characterized in that The dynamic release structure includes a component adhesive layer.

94. A method comprising: Positioning a discrete component assembly on a support assembly of a component conveying system, the discrete component assembly comprising: Dynamic release straps comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer, and a discrete component adhered to the dynamic release tape; and irradiating the dynamic release structure to release the discrete components from the dynamic release belt; wherein a top surface of the support plate of the support fitting is offset from a top surface of the support frame of the support fitting by an amount sufficient to induce tensile stress in the dynamic release strap retained on the support fitting.

95. A discrete component transport system comprising: light source; Discrete component support accessories; A discrete component assembly is arranged on the discrete component support fitting, the discrete component assembly comprising: A dynamic release belt comprising a flexible support layer and a dynamic release structure arranged on the flexible support layer, and a discrete component adhered to the dynamic release tape; and an optical element disposed between the light source and the discrete component assembly; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of the support frame of the discrete component support assembly by an amount sufficient to induce tensile stress in the dynamic release band retained on the discrete component support assembly.

96. A method comprising: cutting the wafer adhered to the dicing tape to form discrete components; and transferring the discrete components from the cutting belt to a dynamic release belt to form a discrete component assembly, the discrete component assembly comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; positioning the discrete component assembly on a support assembly of a component transport system; wherein a top surface of the support plate of the support assembly is offset from a top surface of the support frame of the support assembly by an amount sufficient to induce tensile stress in the dynamic release band retained on the discrete component support assembly.

97. A method comprising: Adhering the wafer to a dynamic release tape comprising: a flexible support layer, and a dynamic release structure disposed on the flexible support layer; dicing the adhered wafer to form discrete components adhered to the dynamic release tape, wherein the discrete components adhered to the dynamic release tape include a discrete component assembly; and positioning the discrete component assembly directly on a discrete component support assembly; wherein a top surface of the support plate of the discrete component support assembly is offset from a top surface of the support frame of the support assembly by an amount sufficient to induce tensile stress in the dynamic release strap retained on the support assembly.

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