Display substrate, display substrate, display device, and method for manufacturing display substrate

Abstract

The present disclosure provides a display substrate, a display panel, a display device and a manufacturing method of the display substrate, wherein the display area includes: a first display area including a first thin film encapsulation structure; a second display area including a second thin film encapsulation structure; a transition display area including a third thin film encapsulation structure; the first thin film encapsulation structure includes: a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer; the second thin film encapsulation structure includes: a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer; the third thin film encapsulation structure includes a first part and a second part, the first part includes a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer; the second part includes a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer. The display substrate, display panel, display device and manufacturing method of the display substrate disclosed in the present disclosure can enhance the visual experience of users.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to PCT patent application No. PCT / CN2020 / 089413 filed in China on May 9, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present disclosure relates to the field of display, and in particular to a display substrate, a display panel, a display device, and a method for manufacturing a display substrate. Background Art

[0004] Organic Light-Emitting Diode (OLED) has an organic compound film that emits light in response to an electric current, wherein the organic material is sandwiched between two electrodes, and at least one of the electrodes is a light-transmitting electrode. OLED has good light-emitting performance and efficiency, and requires a low driving voltage, so it is a good candidate for use as a display screen. Summary of the invention

[0005] The embodiments of the present disclosure provide a display substrate, a display panel, a display device and a method for manufacturing a display substrate, which can enhance the visual experience of users.

[0006] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0007] The present disclosure provides a display substrate, including a display area, wherein the display area includes:

[0008] A first display area includes a plurality of display units disposed on a substrate and a first thin film encapsulation structure disposed on a light emitting side of the plurality of display units;

[0009] A second display area includes a plurality of display units disposed on the substrate and a second thin film encapsulation structure disposed on the light emitting side of the plurality of display units;

[0010] and, a transitional display area, comprising a plurality of display units disposed on a substrate and a third thin film encapsulation structure disposed on a light emitting side of the plurality of display units, the transitional display area being located between the first display area and the second display area;

[0011] The first thin film encapsulation structure comprises: a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units;

[0012] The second thin film encapsulation structure comprises: a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer sequentially stacked on the light emitting side of the plurality of display units;

[0013] The third thin film encapsulation structure includes a first part located on a side close to the first display area and a second part located on a side close to the second display area, the first part includes a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, and a second organic encapsulation layer stacked in sequence on the light-emitting side of the multiple display units; the second part includes a first inorganic encapsulation layer, a second inorganic encapsulation layer, and a second organic encapsulation layer stacked in sequence on the light-emitting side of the multiple display units.

[0014] Exemplarily, the light transmittance of the second organic encapsulation layer is greater than the light transmittance of the first organic encapsulation layer.

[0015] Exemplarily, the display area includes:

[0016] A plurality of side edges, wherein adjacent side edges of the plurality of side edges intersect to form a plurality of corners;

[0017] The second display area is located at at least one of the plurality of corners.

[0018] Exemplarily, a first retaining wall is provided between the first display area and the transition display area; and a second retaining wall is provided between the second display area and the transition display area.

[0019] Exemplarily, the transition display area is provided with a first retaining wall and a second retaining wall, the first retaining wall and the second retaining wall do not overlap with the orthographic projection of the display unit of the transition display area on the substrate, and the first retaining wall is arranged on a side of the transition display area close to the first display area, and the second retaining wall is arranged on a side of the transition display area close to the second display area.

[0020] Exemplarily, the first inorganic encapsulation layer, the first organic encapsulation layer and the second inorganic encapsulation layer of the first part are formed by extending the first thin film encapsulation structure toward the side where the transition display area is located, and the first inorganic encapsulation layer, the first organic encapsulation layer and the second inorganic encapsulation layer of the first part cover the first retaining wall;

[0021] The second portion is formed by extending the second thin film encapsulation structure toward the side where the transition display area is located, and the second portion covers the second retaining wall;

[0022] The second organic encapsulation layer of the first portion is formed by extending the second organic encapsulation layer in the second portion toward the side where the transition display area is located.

[0023] Exemplarily, the first organic encapsulation layer of the first portion has a climbing surface on a side close to the second display area; and the second organic encapsulation layer of the first portion covers a side of the climbing surface away from the substrate.

[0024] Exemplarily, a surface of the second organic encapsulation layer in the second thin film encapsulation structure and a surface of the second organic encapsulation layer in the third thin film encapsulation structure on a side away from the substrate.

[0025] Exemplarily, the first display area has a first pixel density, the second display area has a second pixel density, and the transition display area has a third pixel density; the second pixel density and the third pixel density are both less than or equal to the first pixel density.

[0026] Exemplarily, the second display area includes:

[0027] A stretchable substrate, a plurality of opening patterns distributed along a surface of the stretchable substrate, wherein each of the plurality of opening patterns comprises a plurality of first openings, a plurality of bridge regions surrounding an island region are formed between at least some adjacent first openings of the plurality of first openings, and a plurality of second display units are arranged on the island regions formed by each of the opening patterns;

[0028] A plurality of routing units are respectively connected between the plurality of display units on the island area and are respectively arranged in the plurality of bridge areas.

[0029] Exemplarily, at least one of the plurality of display units includes:

[0030] A first planarization layer, located on the front side of the substrate along the light emitting direction of the display substrate;

[0031] an organic insulating layer, located on a side of the first planarization layer away from the substrate;

[0032] and, a first electrode layer, located on a side of the first planarization layer away from the substrate; wherein,

[0033] The first retaining wall comprises a first groove, the first groove is arranged on the first planarization layer, and the organic insulating layer conformally covers the first groove; or the first groove is arranged on the organic insulating layer;

[0034] The second retaining wall comprises a second groove, the second groove is arranged on the first planarization layer, and the organic insulating layer conformally covers the second groove; or the second groove is arranged on the organic insulating layer;

[0035] The first inorganic encapsulation layer is located on a side of the first electrode layer away from the substrate and covers the first electrode layer;

[0036] The first organic encapsulation layer covers a portion of the first inorganic encapsulation layer located on a side of the first groove away from the second groove, the first groove, and a portion between the first groove and the second groove close to the first groove, but does not cover a portion of the first inorganic encapsulation layer between the first groove and the second groove close to the second groove, and a portion of the second groove and a side of the second groove away from the first groove;

[0037] The second inorganic encapsulation layer covers the first organic encapsulation layer and a portion of the first inorganic encapsulation layer that is not covered by the first organic encapsulation layer;

[0038] The second organic encapsulation layer covers the second inorganic encapsulation layer located in the first groove and a portion of the first groove far away from the first display area, but does not cover the first opening.

[0039] Exemplarily, the organic insulating layer includes a first supporting pad disposed in the first display area, a second supporting pad disposed in the transition display area, and a third supporting pad disposed in the second display area, the first groove is disposed on the first supporting pad, and the second groove is disposed on the second supporting pad.

[0040] Exemplarily, the first groove and the second groove include continuous grooves extending along a first direction, and the first direction is an extending direction of a boundary line between the first display area and the transition display area.

[0041] Exemplarily, the continuous groove has a groove width of about 5 to 15 μm in the second direction, and a groove height of about 1.5 to 2.5 μm in the third direction, the second direction is perpendicular to the first direction and parallel to the stretchable substrate, and the third direction is perpendicular to the stretchable substrate.

[0042] Exemplarily, the first groove and / or the second groove includes at least one column of discrete grooves arranged in sequence in a second direction, wherein the second direction is perpendicular to the first direction and parallel to the stretchable substrate, and each column of discrete grooves includes a plurality of discrete grooves arranged at intervals along the first direction.

[0043] Exemplarily, the at least one column of discrete grooves includes a plurality of columns of discrete grooves, and a spacing between adjacent columns of discrete grooves in the plurality of columns of discrete grooves is about 2-15 μm.

[0044] Exemplarily, at least one of the plurality of display units further includes:

[0045] A first isolation structure is located between the second groove and the first opening and is configured to disconnect the first electrode layers on both sides of the first isolation structure.

[0046] The first electrode layer covers the first isolation structure and is located on a side of the first isolation structure adjacent to the second groove and a side of the first opening.

[0047] Exemplarily, at least one of the plurality of display units in the second display area further comprises:

[0048] a first passivation layer, wherein a portion of the first passivation layer is located between the organic insulating layer of the second display area and the first opening, and at least a portion of the first passivation layer is located on a side of the first planarization layer away from the stretchable substrate;

[0049] The first isolation structure includes at least one third groove located in the first passivation layer and the first planarization layer, and the first electrode layer covered by the bottom of the at least one third groove is disconnected from the first electrode layer covered by the surface of the first passivation layer.

[0050] Exemplarily, at least one of the plurality of display units in the second display area further comprises:

[0051] a second passivation layer, the second passivation layer being at least partially located on a side of the first planarization layer close to the stretchable substrate;

[0052] The first passivation layer includes a first portion located on a side of the first planarization layer away from the stretchable substrate and a second portion located on a side of the first planarization layer adjacent to the first opening, and the second portion covers a surface of the first planarization layer adjacent to the first opening and is connected to a surface of the second passivation layer to form isolation protection of the first passivation layer for the surface of the first planarization layer adjacent to the first opening.

[0053] Exemplarily, at least one of the plurality of display units in the second display area further comprises:

[0054] an interlayer insulating layer, located on the front side of the stretchable substrate along the light emitting direction of the display substrate;

[0055] Among them, the first isolation structure includes at least one first bump located on the surface of the interlayer insulating layer away from the stretchable substrate, the first electrode layer covers the top of the at least one first bump and a portion of the surface of the interlayer insulating layer, and the first electrode layer located on the top of the at least one first bump is disconnected from the first electrode layer located on the surface of the interlayer insulating layer.

[0056] Exemplarily, at least one of the plurality of routing units includes:

[0057] a second planarization layer, located on the front side of the stretchable substrate along the light emitting direction of the display substrate;

[0058] a pixel definition layer, located on a side of the second planarization layer away from the stretchable substrate, covering a portion of the surface of the second planarization layer and having at least one fourth groove; and a third electrode layer, covering the bottom of the at least one fourth groove and the surface of the pixel definition layer;

[0059] The third electrode layer covered by the bottom of the at least one fourth groove and the third electrode layer covered by the surface of the pixel definition layer are disconnected from each other.

[0060] Exemplarily, the number of the third grooves in the at least one third groove is the same as the number of the fourth grooves in the at least one fourth groove, and the at least one fourth groove and the at least one third groove are respectively interconnected to form a closed ring around the first opening.

[0061] Exemplarily, at least one of the plurality of routing units includes:

[0062] a gate insulating layer, located at a front side of the stretchable substrate along a light emitting direction of the display substrate;

[0063] at least one second bump, located on a surface of the gate insulating layer away from the stretchable substrate;

[0064] a third electrode layer, covering a top of the at least one second bump and a portion of a surface of the gate insulating layer not covered by the at least one second bump;

[0065] The third electrode layer covered on the top of the at least one second bump and the third electrode layer covered on the surface of the gate insulating layer are disconnected from each other.

[0066] Exemplarily, the number of the second protrusions in the at least one second protrusion is the same as the number of the first protrusions in the at least one first protrusion, and the at least one second protrusion and the at least one first protrusion are respectively interconnected to form a closed ring around the first opening.

[0067] Exemplarily, the first opening includes an opening end located on a side away from the substrate, a bottom end located on a side close to the substrate, and a hole body portion located between the opening end and the bottom end, and the opening width of at least one of the multiple first openings is: the opening width of the hole body portion gradually increases along the light emitting direction of the display substrate, the opening width of the opening end is smaller than the maximum opening width of the hole body portion, and the maximum opening width of the hole body portion is larger than the opening width of the bottom end.

[0068] Exemplarily, at least a portion of the side wall of the hole portion close to the opening end is in an arc-shaped curved surface.

[0069] The present disclosure also provides a display panel, which includes:

[0070] The display substrate provided by the embodiment of the present disclosure; and

[0071] The cover plate is located on the light-emitting side of the display substrate and is packaged with the display substrate.

[0072] The present disclosure also provides a display device, including:

[0073] The display panel provided by the embodiment of the present disclosure.

[0074] The present disclosure also provides a method for manufacturing a display substrate, comprising:

[0075] providing a substrate;

[0076] A display area is formed on a substrate, wherein the display area includes: a first display area, including a plurality of display units arranged on the substrate and a first thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; a second display area, including a plurality of display units arranged on the substrate and a second thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; and a transition display area, including a plurality of display units arranged on the substrate and a third thin film encapsulation structure arranged on the light-emitting side of the plurality of display units, wherein the transition display area is located between the first display area and the second display area; wherein the first thin film encapsulation structure includes: a first thin film encapsulation structure sequentially superimposed on the light-emitting side of the plurality of display units The third thin-film encapsulation structure comprises a first portion located on a side close to the first display area and a second portion located on a side close to the second display area, the first portion comprising a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer stacked in sequence on the light-emitting side of the plurality of display units; the second thin-film encapsulation structure comprises: a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer stacked in sequence on the light-emitting side of the plurality of display units; the third thin-film encapsulation structure comprises a first portion located on a side close to the first display area and a second portion located on a side close to the second display area, the first portion comprising a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer stacked in sequence on the light-emitting side of the plurality of display units; the second portion comprising a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer stacked in sequence on the light-emitting side of the plurality of display units.

[0077] Exemplarily, the forming of the display area on the substrate specifically includes:

[0078] forming a first retaining wall and a second retaining wall in the display area;

[0079] forming a first inorganic encapsulation layer in the display area;

[0080] Printing a first organic material on the first inorganic encapsulation layer to form a first organic material layer, wherein a portion of the first organic material layer is located in the first display area, and another portion extends to cover the first retaining wall and / or the second retaining wall;

[0081] Performing a thinning process on the first organic material layer to remove a portion of the first organic material layer to form the first organic encapsulation layer, so that the first inorganic encapsulation layer in the transition display area is at least partially exposed;

[0082] forming a second inorganic encapsulation layer, wherein a portion of the second inorganic encapsulation layer covers the first organic encapsulation layer, and another portion of the second inorganic encapsulation layer covers a portion of the first inorganic encapsulation layer not covered by the first organic encapsulation layer;

[0083] A second organic encapsulation layer is coated on the second inorganic encapsulation layer, wherein a portion of the second organic encapsulation layer covers a portion of the second inorganic encapsulation layer covering the first organic encapsulation layer, and another portion of the second organic encapsulation layer covers a portion of the first inorganic encapsulation layer not covered by the first organic encapsulation layer.

[0084] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0085] The display substrate, display panel, display device and display substrate manufacturing method provided by the embodiments of the present disclosure have different thin film encapsulation layer structures in different areas of the display area, which can ensure the light extraction efficiency and product life of different areas of the display area and enhance the user's visual experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] The accompanying drawings, which constitute a part of the specification, illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0087] The present disclosure may be more clearly understood from the following detailed description with reference to the accompanying drawings, in which:

[0088] Figure 1 is a schematic structural diagram of an embodiment of a display panel according to the present disclosure;

[0089] Figure 2 is a schematic diagram of the layout of a display substrate in an embodiment of a display panel according to the present disclosure;

[0090] Figure 3 is a partial top view of a first display area, a second display area, and a transition display area according to an embodiment of a display panel of the present disclosure;

[0091] Figure 4 is a schematic structural diagram of a portion of a display substrate corresponding to a second display area formed on a glass substrate according to an embodiment of a display panel disclosed herein;

[0092] Figure 5 is a schematic structural diagram of a portion of a display substrate corresponding to a second display area detached from a glass substrate according to an embodiment of a display panel disclosed herein;

[0093] Figure 6 is a schematic structural diagram of a display substrate in which a portion corresponding to a first display area, a second display area and a transitional display area is formed on a glass substrate according to an embodiment of a display panel of the present disclosure;

[0094] Figure 7 is a schematic structural diagram of another embodiment of the display panel of the present disclosure, in which a portion of the display substrate corresponding to the first display area, the second display area and the transition display area is formed on a glass substrate;

[0095] Figure 8 They are respectively schematic diagrams of arrangement of the island area, the first opening and the bridge area in some embodiments of the display panel according to the present disclosure;

[0096] Fig. 9 and Fig.10 They are respectively schematic diagrams of arrangement of the island area, the first opening and the bridge area in some embodiments of the display panel according to the present disclosure;

[0097] Fig.11 and Fig.12 They are respectively cross-sectional schematic diagrams of the first groove in some embodiments of the display panel according to the present disclosure;

[0098] Figures 13 to 16 FIG. 4 is a schematic diagram of some steps of an embodiment of a method for manufacturing a display panel according to the present disclosure.

[0099] It should be understood that the size of each part shown in the accompanying drawings is not drawn according to the actual proportional relationship. In addition, the same or similar reference numerals represent the same or similar components. DETAILED DESCRIPTION

[0100] Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is in no way intended to limit the present disclosure and its application or use. The present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present disclosure thorough and complete and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the components and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary and not as limiting.

[0101] The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. The words "include" or "comprise" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0102] In the present disclosure, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other device without an intermediate device, or may not be directly connected to the other device but have an intermediate device.

[0103] All terms (including technical terms or scientific terms) used in the present disclosure have the same meanings as those understood by ordinary technicians in the field to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, such as general dictionaries, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined herein.

[0104] In the present disclosure, the term “about” refers to numerical ranges and / or values ​​that are substantially the same as those recited herein within an allowable process error and measurement error range.

[0105] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0106] In some related technologies, flexible OLED uses polymer materials as a protective cover plate, and the resulting OLED device is not easy to break. The inventors have found through research that some OLED flexible display devices have black edges at the four corners, which affects the user's visual experience. In order to enhance the user's visual experience, the display substrate can improve the black edge phenomenon by setting display areas at the four corners of the display screen. However, there is a difference in luminescence between the normal display area and the four corner display areas, which can easily produce color mixing visible to the human eye.

[0107] In view of this, the embodiments of the present disclosure provide a display substrate, a display panel, a display device and a method for manufacturing a display substrate, which can enhance the visual experience of users.

[0108] Figure 1 The present invention is a schematic structural diagram of an embodiment of a display panel. Figure 2 is based on Figure 1 The diagram shows a layout diagram of a display substrate in one embodiment of a display panel.

[0109] refer to Figure 1 and Figure 2 In some embodiments, the display panel includes: a display substrate A and a cover plate B. The cover plate B is located in front of the display substrate A along the light emitting direction of the display substrate A, that is, located on the light emitting side of the display substrate A. The display substrate A and the cover plate B can be packaged by a packaging glue C (such as optical glue OCA, etc.). Figure 2 In the embodiment, the display substrate A has a display area A1 and a non-display area A2 surrounding the display area A1. The display substrate A can be packaged with the cover plate B in the non-display area A2. The material of the cover plate B can be a rigid or flexible material, such as glass or a colorless polyimide (CPI) film.

[0110] refer to Figure 2 The display area A1 includes a plurality of side edges A11, and adjacent side edges A11 of the plurality of side edges A11 intersect to form a plurality of corner portions A12. Figure 2 In the figure, the display area A1 has two sets of opposite sides A11, and the adjacent sides A11 are perpendicular to each other. Correspondingly, the display area A1 has four corners A12. The display area A1 includes a first display area A13, a second display area A14, and a transition area A15 between the first display area A13 and the second display area A14. Among them, the first display area A13 has a first pixel density, the second display area A14 has a second pixel density, and the transition area A15 has a third pixel density. The second pixel density is lower than the first pixel density, and the third pixel density may be equal to the first pixel density or the second pixel density, or be between the first pixel density and the second pixel density. The pixel density here refers to the number of pixels per unit area.

[0111] refer to Figure 2 In some embodiments, the second display area A14 is located at at least one of the plurality of corners A12. Figure 2 In the embodiment, the second display area A14 is provided at each of the four corners A12. Considering that the corners of the display substrate of some related technologies are filled and encapsulated with organic ink between the corners and the cover plate, resulting in black edges at the corners, this embodiment provides a second display area with a lower pixel density than the first display area at the corners. On the one hand, it can realize image display at the corners, thereby improving the screen-to-body ratio, reducing the display frame, and thus providing users with a better visual experience. On the other hand, it can also reduce the difficulty of the processing technology of the corners.

[0112] Figure 3 is a schematic diagram of a partial top view of an embodiment of a display panel according to the present disclosure. Figure 4 1 is a schematic structural diagram of a display substrate in which a portion corresponding to a second display area is formed on a glass substrate according to an embodiment of a display panel disclosed herein. Figure 5 1 is a schematic structural diagram of a display panel according to an embodiment of the present disclosure in which a portion of the display substrate corresponding to the second display area is separated from the glass substrate.

[0113] refer to Figure 3-Figure 5 In some embodiments, the second display area A14 includes: a stretchable substrate 1, a plurality of display units 2, and a plurality of wiring units 3. The stretchable substrate 1 may be made of a flexible material, such as polyimide PI, etc. Figure 3 The stretchable substrate 1 includes a plurality of opening patterns 10 (e.g. Figure 3 Each of the plurality of opening patterns 10 includes a plurality of first openings 11, and a plurality of bridge regions 12 surrounding the island region 13 are formed between at least some of the plurality of adjacent first openings 11. By providing a plurality of opening patterns 10 on the stretchable substrate 1, a stretched display of the second display region A14 can be achieved. Through the stretched display of the second display region, the corner of the display region of the display substrate can be more closely fitted with the cover plate, reducing or avoiding the situation that affects the fit between the corner and the cover plate during packaging, such as bubbles.

[0114] exist Figure 3 In the embodiment, three first openings 11 are respectively arranged around the island area 13 of the opening pattern 10, and two bridge areas 12 can be formed between the three adjacent first openings 11. In other embodiments, the positions of the first openings 11 around the island area 13 relative to the island area 13 and the number of the first openings 11 are not limited to Figure 3 The width of the first opening 11 can be about 15 to 25 μm. Figure 4 In some embodiments, a plurality of display units 2 are respectively arranged on the island areas 13 formed by the respective opening patterns 10, and a plurality of wiring units 3 are respectively connected between the plurality of display units 2 and respectively arranged in the plurality of bridge areas 12. The display unit 2 has display sub-pixels (e.g., RGB sub-pixels) and driving circuits, and can realize image display. The plurality of display units 2 are respectively connected through a plurality of wiring units 3.

[0115] In order to ensure that the display units in each display area can emit light normally and prevent material failure and electrode corrosion, each display area can be encapsulated and protected by a thin film encapsulation layer. Among them, the first display area A13 includes a plurality of display units arranged on a substrate and a first thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; the second display area A14 includes a plurality of display units arranged on a substrate and a second thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; the transition display area A15 includes a plurality of display units arranged on a substrate and a third thin film encapsulation structure arranged on the light-emitting side of the plurality of display units.

[0116] In some related technologies, the thin film encapsulation layer on the display substrate is usually a laminated structure formed by a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer stacked in sequence on the light-emitting side of the display unit. The first inorganic encapsulation layer and the second inorganic encapsulation layer can be formed by plasma enhanced chemical vapor deposition, and the organic encapsulation layer can be formed by printing. In order to avoid the organic material (such as organic ink) of the printed organic encapsulation layer from overflowing into the first opening, causing the risk of water and oxygen corrosion of the display unit in the second display area A14, a retaining wall can be set between the display unit in the second display area A14 and the first opening to control the edge position of the organic material. However, if the thin film encapsulation layer of the second display area A14 and the transition display area A15 both adopt the same thin film encapsulation layer structure as the first display area A13, when the pixel density of the second display area A14 and the transition display area A15 is lower than that of the first display area A13, it will affect the abnormal luminescence of the transition display area A15 and the second display area A14, resulting in mixed colors seen by the human eye.

[0117] To improve the above problems, please refer to Figure 6 , Figure 6The cross-sectional structure of the thin film encapsulation layer structure of the first display area A13, the second display area A14 and the transition display area in the display substrate provided by the embodiment of the present disclosure, the first thin film encapsulation structure in the first display area A13 includes a first inorganic encapsulation layer 251, a first organic encapsulation layer 252 and a second inorganic encapsulation layer 253 sequentially stacked on the light-emitting side of the plurality of display units; the second thin film encapsulation structure in the second display area A14 includes: the second thin film encapsulation structure includes: a first inorganic encapsulation layer 251, a second inorganic encapsulation layer 253 and a second organic encapsulation layer 254 sequentially stacked on the light-emitting side of the plurality of display units; the third thin film encapsulation structure includes a first part 250A and a second Part 250B, the first part 250A is located on a side close to the first display area A13, and the second part 250B is located on a side close to the second display area A14, the first part 250A includes a first inorganic encapsulation layer 251, a first organic encapsulation layer 252, a second inorganic encapsulation layer 253 and a second organic encapsulation layer 254 stacked in sequence on the light-emitting side of the multiple display units; the second part 250B includes a first inorganic encapsulation layer 251, a second inorganic encapsulation layer 253 and a second organic encapsulation layer 254 stacked in sequence on the light-emitting side of the multiple display units, and the transmittance of the second organic encapsulation layer 254 is greater than the transmittance of the first organic encapsulation layer 252.

[0118] In the above scheme, the structures of the thin film encapsulation layers of the first display area A13, the second display area A14 and the transition display area A15 are different. The first inorganic encapsulation layer 251 and the second inorganic encapsulation layer 253 can be formed by plasma enhanced chemical vapor deposition, and the first organic encapsulation layer 252 can be formed by printing. The second organic encapsulation layer 25 can be formed by coating with optical glue, etc. The transmittance of the second organic encapsulation layer 254 is greater than that of the first organic encapsulation layer 252. Therefore, the transmittance of the first thin film encapsulation structure is less than that of the second thin film encapsulation structure and the third thin film encapsulation structure, which can improve the abnormal light emission phenomenon of the transition display area A15 and the second display area A14 and enhance the visual experience.

[0119] In addition, since the first organic encapsulation layer 252 is completed by printing, the organic material (such as organic ink) of the first organic encapsulation layer 252 has fluidity, and there is a long climbing distance after printing, and the printing ink between the first display area A13 and the transition display area A15 is uncontrollable ( Fig.13 As shown), therefore, refer to Figure 6 In some embodiments, a first retaining wall 271 is provided between the first display area A13 and the transition display area A15, and a second retaining wall 272 is provided between the transition display area A15 and the second display area A14, thereby reducing the risk of organic ink overflow.

[0120] refer to Figure 6The first retaining wall 271 is disposed between the light-emitting area of ​​the multiple display units in the first display area A13 and the light-emitting area of ​​the multiple display units in the transition display area A15; the second retaining wall 272 is disposed between the light-emitting area of ​​the multiple display units in the second display area A14 and the light-emitting area of ​​the multiple display units in the transition display area A15.

[0121] The first inorganic encapsulation layer 251, the first organic encapsulation layer 252 and the second inorganic encapsulation layer 253 of the first part 250A are formed by extending the first thin film encapsulation structure toward the side where the transition display area A15 is located, and the first inorganic encapsulation layer 251, the first organic encapsulation layer 252 and the second inorganic encapsulation layer 253 of the first part 250A cover the first retaining wall 271, but do not cover the second retaining wall 272. In other words, the film layers in the first thin film encapsulation structure of the first display area A13 are made of the same material and the same material as the corresponding film layers in the first part 250A, and after the first thin film encapsulation structure extends a distance toward the transition display area A15, it reaches a position covering the first retaining wall 271 but not covering the second retaining wall 272, thereby forming the first inorganic encapsulation layer 251, the first organic encapsulation layer 252 and the second inorganic encapsulation layer 253 of the first part 250A.

[0122] The second portion 250B is formed by extending the second thin film encapsulation structure toward the side where the transition display area A15 is located, and the second portion 250B covers the second retaining wall 272 but does not cover the first retaining wall 271;

[0123] And the second organic encapsulation layer 254 of the first part 250A is formed by extending the second organic encapsulation layer 254 in the second part 250B toward the side where the transition display area A15 is located. That is to say, each film layer in the second thin film encapsulation structure of the second display area A14 and the corresponding film layers in the second part 250B are made of the same material and the same material, each film layer in the second thin film encapsulation structure of the second display area A14 extends a distance toward the transition display area A15 to cover the second retaining wall 272, and the second organic encapsulation layer 254 of the second part 250B extends to the position covering the second inorganic encapsulation layer 253 of the first part 250A.

[0124] It should be noted that, in the above embodiment, the first retaining wall 271 is disposed between the first display area A13 and the transition display area A15; the second retaining wall 272 is disposed between the second display area A14 and the transition display area A15. In other embodiments, it may also be:

[0125] A first retaining wall 271 and a second retaining wall 272 are provided in the transition display area A15, and the first retaining wall 271 and the second retaining wall 272 do not overlap with the orthographic projection of the display unit of the transition display area A15 on the substrate, and the first retaining wall 271 is arranged on a side of the transition display area A15 close to the first display area A13, and the second retaining wall 272 is arranged on a side of the transition display area A15 close to the second display area A14.

[0126] In addition, please refer to Figure 6 Since the first organic encapsulation layer 252 is printed and its printed material is fluid, a climbing surface 2520 is formed on the side close to the second display area A14, and the second inorganic encapsulation layer 253 covers the first organic encapsulation layer 252. Therefore, the first part 250A has a climbing surface 2520 on the side close to the second display area A14, and the second organic encapsulation layer 254 of the first part 250A covers the side of the climbing surface 2520 away from the substrate 1.

[0127] Please refer to Figure 6 A surface of the second organic encapsulation layer 254 in the second thin film encapsulation structure on a side away from the substrate is substantially flush with a surface of the second organic encapsulation layer 254 in the third thin film encapsulation structure on a side away from the substrate.

[0128] refer to Figure 4 and Figure 5 In some embodiments, the display substrate A is first formed on the glass substrate 4, and then the display substrate A is peeled off from the glass substrate 4. In the process of forming the display substrate, the entire film layer can be dug at the position corresponding to the first opening 11, and the entire surface is coated (such as the electrode layer and inorganic packaging layer of the display substrate) at the corresponding positions of the island area 13, the bridge area 12 and the first opening 11.

[0129] When the display substrate A is peeled off (e.g., by laser peeling), it has been found that during laser peeling, there is a risk of peeling of the film layer between the film layer located in the first opening 11 and the film layer located in the island area and cracking of the local irregular film layer. Figure 4 In the process, a hole is opened on the display substrate A at a position corresponding to the first opening 11 in a direction perpendicular to the display substrate, and then the electrode layer, inorganic packaging layer and other film layers are evaporated on the entire surface, so that the first opening 11 also has the electrode layer, inorganic packaging layer and other film layers.

[0130] It should be noted that the first opening 11 may be formed by dry etching. Subject to process conditions, in some embodiments, the first opening 11 includes an opening end 111 located at a side away from the substrate 1, a bottom end 112 located at a side close to the substrate 1, and a hole body portion 113 located between the opening end 111 and the bottom end 112. The opening width of at least one of the plurality of first openings 11 is as follows: the opening width of the hole body portion 113 gradually increases along the light emitting direction of the display substrate A, the opening width d1 of the opening end 111 is less than the maximum opening width d2 of the hole body portion, and the maximum opening width d2 of the hole body portion 113 is greater than the opening width d3 of the bottom end 112, that is, a first opening shape is formed that is narrow at the top and bottom and wide in the middle. At least a portion of the side wall of the hole body portion 113 close to the opening end 111 is in an arc-shaped curved surface.

[0131] After laser stripping verification, such an opening shape can form a relatively flat cross-section on the hole wall on the side adjacent to the island area 13 and the hole wall on the side adjacent to the bridge area 12 in the first opening 11 during stripping, thereby effectively improving the process. After stripping, the film layer 15 at the bottom of the first opening 11 remains on the stripping substrate 4. The flat cross-section here means that the disconnected portion between the hole walls on both sides of the first opening 11 and the film layer 15 is relatively flat, and there is no uneven cross-section due to local film stripping or irregular film breakage. It should be noted that the opening width of the hole body part 113 can range from 5 to 25 microns, the opening width of the opening end 111 can range from 3 to 20 microns, and the depth h of the hole body part 113 can range from 5 to 25 microns.

[0132] In addition, it should be noted that the difference between the maximum opening width d2 of the hole body portion 113 and the opening width d1 of the opening end 111 is in the range of 0.4 to 4 microns. That is, on the two opposite sides of the first opening 11, the opening width of the hole body portion 113 on each side is 0.2 to 2 microns greater than the opening width of the opening end 111.

[0133] It should be noted that if the thin film encapsulation layer structures of the first display area A13, the second display area A14 and the transition display area A15 all adopt the conventional stacked structure of the first inorganic encapsulation layer 251, the organic encapsulation layer and the second inorganic encapsulation layer 253, the organic encapsulation layer will have the risk of overflowing into the first opening 11. Figure 5 As shown in the figure), the risk of film peeling (Peeling) and local irregular film cracking (Crack) between the film layer located in the first opening 11 and the film layer located in the island area when the display substrate is subjected to laser lift-off will be increased.

[0134] Based on the display substrate provided by the embodiment of the present disclosure, in the second thin film packaging structure of the second display area A14, the second organic packaging layer 254 is located at the topmost layer of the packaging structure. The second organic packaging layer 254 can be made of materials such as photoresist. Before the display substrate is peeled off, the second organic packaging layer 254 can be patterned so that the second organic packaging layer 254 at the position corresponding to the first opening is removed. In this way, the risk of film peeling and cracking can be reduced when the display substrate is peeled off.

[0135] In addition, reference Figure 6 In some embodiments, the display substrate A is first formed on the glass substrate 4, and then the display substrate A is peeled off from the glass substrate 4. In the process of forming the display substrate, the position corresponding to the first opening 11 can also be a blind hole, that is, a part of the flexible substrate base is retained, so that there is no risk of film cracks or film shedding during laser peeling. In practical applications, the first opening 11 can be selected as a blind hole or a full-film hole according to the stretchability of the stretchable substrate.

[0136] Figure 6 1 is a schematic structural diagram of a display substrate in which portions corresponding to the first display area A13, the second display area A14 and the transitional display area A15 are formed on a glass substrate in some embodiments of the display panel of the present disclosure. Figure 8 1 is a schematic structural diagram of a portion of a display substrate corresponding to a second display area A14 formed on a glass substrate in some embodiments of the display panel of the present disclosure. Fig. 9 and Fig.10 They are schematic diagrams of the arrangement of the island area, the first opening and the bridge area in some embodiments of the display panel according to the present disclosure. Fig.10 and Fig.11 They are respectively cross-sectional schematic diagrams of the first groove in some embodiments of the display panel according to the present disclosure.

[0137] In some embodiments, a plurality of display units are disposed in the first display area A13, the second display area A14, and the transition display area A15, and the structures of the display units in each display area may be the same or different.

[0138] by Figure 6 As an example, at least one of the multiple display units 2 includes: a thin film transistor 22, a first planarization layer 241, a second electrode layer 243, an organic insulating layer 26, a first organic light emitting layer 245, and a first electrode layer 244. Figure 6 In some embodiments, the organic insulating layer includes a plurality of post spacers (PS for short).

[0139] exist Figure 6 and Figure 7In the embodiment, the thin film transistor 22 is disposed on the substrate 1. The thin film transistor 22 includes an active layer 221, a gate 222, a first source electrode 223, a first drain electrode 224, a second source electrode 225, and a second drain electrode 226. The first source electrode 223 and the first drain electrode 224 are electrically connected to the active layer 221 through vias, and the second source electrode 225 and the second drain electrode 226 are electrically connected to the first source electrode 223 and the first drain electrode 224 through vias, respectively. The thin film transistor 22 is not limited to Figure 6 and Figure 7 The structural form shown in the figure may also be other structural forms in other embodiments, for example, the thin film transistor includes a single-layer source and a single-layer drain.

[0140] The first planarization layer 241 is located on the front side of the substrate 1 along the light emitting direction of the display substrate, that is, on the side of the substrate 1 adjacent to the cover plate B. Specifically, the first planarization layer 241 is located on the side of the thin film transistor 22 away from the substrate 1, and covers the thin film transistor 22. The first planarization layer 241 can be used to provide a flat surface for the formation of the upper film layer.

[0141] In some embodiments, the organic insulating layer 236 is located on a side of the first planarization layer 241 away from the stretchable substrate 1, and the first retaining wall 271 may include a first groove, which may be set on the first planarization layer 241, and the organic insulating layer conformally covers the first groove to form the first retaining wall 271; the second retaining wall 272 may include a second groove, which may be set on the first planarization layer 241, and the organic insulating layer conformally covers the second groove to form the second retaining wall 272.

[0142] In some other embodiments, the first groove and the second groove may also be disposed on the organic insulating layer to form a first retaining wall 271 and a second retaining wall 272 , respectively.

[0143] For details, see Figure 6 In some embodiments, the organic insulating layer includes a first supporting pad 236a disposed in the first display area A13, a second supporting pad 236b disposed in the transition display area A15, and a third supporting pad 236c disposed in the second display area A14, the first groove is disposed on the first supporting pad 236a, the second groove is disposed on the second supporting pad 236b, and no groove is disposed on the third supporting pad 236c.

[0144] The second electrode layer 243 is located on a side of the first planarization layer 241 away from the stretchable substrate 1 and is electrically connected to the thin film transistor 22 through a via hole.

[0145] The first organic light emitting layer 245 is located on a side of the second electrode layer 243 away from the substrate 1 . The first electrode layer 244 is located on a side of the first organic light emitting layer 245 away from the substrate 1 . The first electrode layer 244 also covers the first organic light emitting layer 245 .

[0146] In some embodiments, the second electrode layer 243 is an anode layer, and the first electrode layer 244 is a cathode layer. The second electrode layer 243, the first organic light-emitting layer 245, and the first electrode layer 244 can form a light-emitting element driven by the thin film transistor 22. According to different materials used in the first organic light-emitting layer 245, sub-pixels of different colors can be realized.

[0147] refer to Figure 6 and Figure 7 In some embodiments, the first organic encapsulation layer 252 covers a portion of the first inorganic encapsulation layer 251 located on the side of the first groove (i.e., the first retaining wall 271) away from the second groove (i.e., the second retaining wall 272) and a portion between the first groove and the second groove close to the first groove, but does not cover a portion of the first inorganic encapsulation layer 251 between the first groove and the second groove close to the second groove and a portion of the second groove and the second groove away from the first groove; the second inorganic encapsulation layer 253 covers the first organic encapsulation layer 252 and a portion of the first inorganic encapsulation layer 251 not covered by the first organic encapsulation layer 252; the second organic encapsulation layer 254 covers a portion of the second inorganic encapsulation layer 253 located in the first groove and a portion of the first groove away from the first display area, but does not cover the first opening 11.

[0148] The first groove is arranged on a side of the first organic insulating layer 236 away from the substrate 1, and the second groove is arranged on a side of the second organic insulating layer 236 away from the substrate 1, for preventing the overflow of the organic material forming the first organic encapsulation layer 252. In this way, the first organic encapsulation layer 252 covers the first inorganic encapsulation layer 251, covers the portion of the first inorganic encapsulation layer 251 located on the side of the first groove away from the second groove, and the portion between the first groove and the second groove close to the first groove, but does not cover the portion of the first inorganic encapsulation layer 251 on the side of the first groove and the second groove close to the second groove, and the portion of the second groove and the side of the second groove away from the first groove.

[0149] The locations of the first groove and the second groove may be determined according to the spacing and arrangement of sub-pixels in the island area of ​​the transition display area A15 and the second display area A14.

[0150] exist Figure 6 and Figure 7 In the process, the first groove and the second groove can be completed by an exposure and development process. When printing the organic material, after the organic material flows into the second groove, it is not easy to continue to overflow to the side of the second groove 27 adjacent to the first opening.

[0151] refer to Fig. 9 In some embodiments, the first groove and the second groove both include a continuous groove 27a extending along the first direction, and the first direction is the extension direction of the boundary line between the first display area and the transition display area, that is, the length direction of the first opening 11. Fig. 9 and Fig.11 , the groove width w1 of the continuous groove 27a in the second direction is about 5 to 15 μm, and the groove height h1 in the third direction is about 1.0 to 2.5 μm, the second direction is perpendicular to the first direction and parallel to the stretchable substrate, and the third direction is perpendicular to the stretchable substrate. That is to say, the groove width w1 here refers to the dimension of the continuous groove 27a on the organic insulating layer 236 along the direction perpendicular to the first direction and parallel to the stretchable substrate 1, and the groove height h1 refers to the dimension of the continuous groove 27a on the organic insulating layer 236 along the direction perpendicular to the stretchable substrate 1.

[0152] refer to Fig.10 In some embodiments, the first groove and the second groove each include at least one column of discrete grooves 27b arranged along the second direction, the second direction is perpendicular to the first direction and parallel to the stretchable substrate, and each column of discrete grooves 27b includes a plurality of discrete grooves 27b arranged at intervals along the first direction. Wherein, when the first groove and the second groove include at least two columns of discrete grooves 27b, at least two columns of release grooves 27b may be distributed in an array, that is, the row direction of at least two columns of release grooves 27b is the second direction, and the column direction is the first direction.

[0153] refer to Fig.10 and Fig.12 The groove width w2 of the plurality of discrete grooves 27b is about 5 to 15 μm, and the groove height h2 is about 1.0 to 2.5 μm. The groove width w2 here refers to the size of each discrete groove 27b on the organic insulating layer 236 along the second direction, and the groove height h2 refers to the size of each discrete groove 27b on the organic insulating layer 236 along the third direction perpendicular to the stretchable substrate 1.

[0154] exist Fig.10 In the embodiment, at least one column of discrete grooves 27b includes a plurality of columns of discrete grooves 27b (eg, two columns of discrete grooves) sequentially arranged in the second direction.

[0155] The spacing d between adjacent columns of discrete grooves 27b in the plurality of columns of discrete grooves 27b is about 2-15 μm. The spacing d here refers to the distance between adjacent columns of discrete grooves 27b along the second direction.

[0156] It should be noted that, in some embodiments, the first groove and the second groove have the same shape and size, and in other embodiments, the first groove and the second groove may have different shapes and sizes.

[0157] In the manufacturing process of some display panel embodiments, some film layers (such as organic light-emitting layers or electrode layers) are formed by full-surface coating in the second display area A14. Accordingly, in order to prevent the film layer corresponding to the first opening from being connected to the film layer corresponding to the island area and causing a risk of failure, in some embodiments, a first isolation structure is provided between the first groove and the first opening 11 to achieve a separation effect of the film layer.

[0158] refer to Figure 6 and Figure 8 In some embodiments, at least one of the plurality of display units 2 further includes a first isolation structure 28, 28'. The first isolation structure 28, 28' is located between the first groove and the first opening 11, and is configured to disconnect the first electrode layer 244 on both sides of the first isolation structure 28, 28' to increase the lateral effective packaging distance. The first electrode layer 244 covers the first isolation structure 28, 28' and is located on one side of the first isolation structure 28, 28' adjacent to the first groove and one side adjacent to the first opening 11.

[0159] refer to Figure 6 , at least one of the plurality of display units 2 further includes: a first passivation layer 235. The first passivation layer 235 is located between the third support spacer 236c and the first opening 11, and at least a portion of the first passivation layer 235 is located on a side of the first planarization layer 241 away from the stretchable substrate 1. In addition, at least one of the plurality of display units 2 may further include a first buffer layer 21, a first gate insulating layer 231, a second gate insulating layer 232, an interlayer insulating layer 233, and a second passivation layer 234.

[0160] Research has found that when the first inorganic encapsulation layer 251 and the second inorganic encapsulation layer 253 are formed by a plasma film forming process, the lateral film layer formed at the portion of the first planarization layer 241 adjacent to the first opening 11 (i.e., the portion of the first inorganic encapsulation layer 251 and the second inorganic encapsulation layer 253 located on the side wall of the first opening 11) will be relatively thin due to the large step difference, and water vapor from the side of the first opening 11 may enter devices such as thin film transistors from the thinner lateral film layer through the first planarization layer, thereby causing device failure.

[0161] exist Figure 6 and Figure 7 In the embodiment, the first passivation layer 235 includes a first passivation portion 235a located on the side of the first planarization layer 241 away from the stretchable substrate 1 and a second passivation portion 235b located on the side of the first planarization layer 241 adjacent to the first opening 11. The second passivation portion 235b is connected to the surface of the second passivation layer 234 to form an isolation protection of the first passivation layer 235 on the surface of the first planarization layer 241 adjacent to the first opening 11, thereby reducing or avoiding the risk of water vapor from the side of the first opening 11 entering a device such as a thin film transistor through the first planarization layer. In some embodiments, the first passivation layer 235 and the second passivation layer 234 are made of the same material so that a closer bond is achieved between the two.

[0162] The first buffer layer 21 is located on a side of the stretchable substrate 1 adjacent to the first planarization layer 241. The first gate insulating layer 231 is located on a side of the first buffer layer 21 away from the stretchable substrate 1, and covers the active layer 221 of the thin film transistor 22. The second gate insulating layer 232 is located on a side of the first gate insulating layer 231 away from the stretchable substrate 1, and covers the gate 222 of the thin film transistor 22.

[0163] The interlayer insulating layer 233 is located on the side of the second gate insulating layer 232 away from the stretchable substrate 1. The second passivation layer 234 is located between the interlayer insulating layer 233 and the first planarization layer 241. The first passivation layer 235 is located on the side of the first planarization layer 241 away from the stretchable substrate 1, and is located between the organic insulating layer 236 and the first opening 11.

[0164] The gate electrode 222 of the thin film transistor 22 is located on the surface of the first gate insulating layer 231 away from the stretchable substrate 1. The first source electrode 223 and the first drain electrode 224 of the thin film transistor 22 are located on the surface of the interlayer insulating layer 233 away from the stretchable substrate 1, and are electrically connected to the active layer 221 through vias penetrating the first gate insulating layer 231, the second gate insulating layer 232 and the interlayer insulating layer 233. The second source electrode 225 and the second drain electrode 226 of the thin film transistor 22 are located on the surface of the second passivation layer 234 away from the stretchable substrate 1, and are electrically connected to the active layer 221 through vias penetrating the second passivation layer 234. In other embodiments, the display unit 2 includes only the first gate insulating layer 231, but not the second gate insulating layer 232. In other embodiments, the thin film transistor 22 includes a single-layer source and drain.

[0165] exist Figure 6 and Figure 7In the embodiment, the first isolation structure 28 includes at least one third groove 281 located in the first passivation layer 235. The first electrode layer 244 covered by the bottom of the at least one third groove 281 is disconnected from the first electrode layer 244 covered by the surface of the first passivation layer 235. Figure 6 and Figure 7 , the groove width w3 of at least one third groove 281 is about 3-10 μm, and the groove height h3 is about 1000-3000 nm. The groove width w3 here refers to the size of each third groove 281 along the second direction perpendicular to the first opening 11, and the groove height h3 refers to the size of each third groove 281 along the third direction perpendicular to the stretchable substrate 1.

[0166] refer to Figure 6 and Figure 7 In some embodiments, at least one of the plurality of wiring units 3 includes: a second planarization layer 331, a pixel definition layer 332, and a third electrode layer 333. The second planarization layer 331 is located on the front side of the stretchable substrate 1 along the light emitting direction of the display substrate, that is, on the side of the stretchable substrate 1 adjacent to the cover plate B. The pixel definition layer 332 is located on the side of the second planarization layer 331 away from the stretchable substrate 1, covers a portion of the surface of the second planarization layer 331, and has at least one fourth groove 361.

[0167] exist Figure 6 In the embodiment, at least one of the plurality of routing units 3 further includes: a second buffer layer 31, a first conductive routing 371, a gate insulating layer 32, and a second conductive routing 372. The second buffer layer 31 is located on the surface of the stretchable substrate 1. The first conductive routing 371 is located on the surface of the second buffer layer 31 away from the stretchable substrate 1. The gate insulating layer 32 is located on the side of the second buffer layer 31 away from the stretchable substrate 1 and covers the first conductive routing 371. The second conductive routing 372 is located on the surface of the gate insulating layer 32 away from the stretchable substrate 1.

[0168] exist Figure 6 In the embodiment, the second planarization layer 331 is located on a side of the second conductive trace 372 away from the stretchable substrate 1 and covers the second conductive trace 372. At least one fourth groove 361 is disposed adjacent to the first opening 11. Moreover, the third electrode layer 333 covers the bottom of the at least one fourth groove 361 and the surface of the pixel definition layer 332.

[0169] The third electrode layer 333 covering the bottom of at least one fourth groove 361 is disconnected from the third electrode layer 333 covering the surface of the pixel definition layer 332, so that the third electrode layer 333 located in the bridge area is separated from the third electrode layer 333 corresponding to the first opening 11 to prevent the film layer corresponding to the first opening from being connected to the film layer corresponding to the island area via the film layer corresponding to the bridge area.

[0170] In the aforementioned Figure 4 and Figure 5 In the embodiment shown, the display substrate is formed on the glass substrate 4 and then peeled off by laser. Accordingly, in some embodiments, the corresponding film layers respectively arranged in the first display area A13, the second display area A14 and the transition display area A15 can be located in the same layer and made of the same material, and the corresponding film layers of the island area and the bridge area of ​​the second display area A14 can be located in the same layer and made of the same material to simplify the process. Here and in the following, the same layer and the same material can be a layer structure formed by using the same film forming process to form a film layer for forming a specific pattern, and then using the same mask template to pattern the film layer through a single composition process. Depending on the specific pattern, a single composition process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous. These specific patterns may also be at different heights or have different thicknesses.

[0171] For example, the second buffer layer 31 and the first buffer layer 21 are located in the same layer and are made of the same material. The first conductive trace 371 and part of the source and drain of the thin film transistor 22 (for example, the first source 223 and the first drain 224) are located in the same layer and are made of the same material, so that the second conductive trace 372 and part of the source and drain of the thin film transistor 22 (for example, the second source 225 and the second drain 226) are located in the same layer and are made of the same material, so that the second planarization layer 331 and the first planarization layer 241 are located in the same layer and are made of the same material, and the third electrode layer 333 and the first electrode layer 244 are located in the same layer and are made of the same material.

[0172] refer to Fig. 9 and Fig.10 In some embodiments, the number of the fourth grooves 361 in the at least one fourth groove 361 is the same as the number of the third grooves 281 in the at least one third groove 281, and the at least one third groove 361 and the at least one third groove 281 are connected to each other to form a closed ring around the first opening 11. Fig. 9 and Fig.10 In the embodiment, two third grooves 281 (281a, 281b) on one side of the first opening 11 adjacent to the island sub-pixel are respectively connected to two fourth grooves 361 (361a, 361b) on one side of the first opening 12 adjacent to the bridge region.

[0173] and Figure 6 Compared with the embodiment shown in Figure 8 In the embodiment, the first isolation structure 28' includes at least one first bump 282 located on the surface of the interlayer insulating layer 233 away from the stretchable substrate 1. The first electrode layer 244 covers the top of the at least one first bump 282 and the surface of the interlayer insulating layer 233. The first electrode layer 244 located on the top of the at least one first bump 282 is disconnected from the first electrode layer 244 located on the surface of the interlayer insulating layer 233. Figure 8 , the protrusion width w4 of at least one first protrusion is about 3-10 μm, and the protrusion height h4 is about 400-800 nm. The protrusion width w4 here refers to the size of each first protrusion 282 along the second direction perpendicular to the first opening 11, and the protrusion height h4 refers to the size of each first protrusion 282 along the third direction perpendicular to the stretchable substrate 1. The material of the first protrusion 282 can be a Ti-Al-Ti three-layer structure.

[0174] Accordingly, refer to Figure 8 In some embodiments, at least one of the plurality of routing units 3 includes: a gate insulating layer 32, at least one second bump 362, and a third electrode layer 333. The gate insulating layer 32 is located on the front side of the stretchable substrate 1 along the light emitting direction of the display substrate, that is, on the side of the stretchable substrate 1 adjacent to the cover plate B. At least one second bump 362 is located on the surface of the gate insulating layer 32 away from the stretchable substrate 1.

[0175] exist Figure 8 In the embodiment, at least one of the plurality of wiring units 3 may further include: a second buffer layer 31, a first conductive wiring 371, a second conductive wiring 372, a second planarization layer 331, and a pixel definition layer 332. The second buffer layer 31 is located on the surface of the stretchable substrate 1. The first conductive wiring 371 is located on the surface of the second buffer layer 31 away from the stretchable substrate 1. The third gate insulating layer 32 is located on the side of the second buffer layer 31 away from the stretchable substrate 1, and covers the first conductive wiring 371. The second conductive wiring 372 is located on the surface of the third gate insulating layer 32 away from the stretchable substrate 1.

[0176] The second planarization layer 331 is located on a side of the second conductive trace 372 away from the stretchable substrate 1 and covers the second conductive trace 372. The pixel definition layer 332 is located on a side of the second planarization layer 331 away from the stretchable substrate 1 and covers a portion of the surface of the second planarization layer 331.

[0177] At least one second bump 362 may be disposed adjacent to the first opening 11. The third electrode layer 333 covers the top of the at least one second bump 362 and a portion of the surface of the third gate insulating layer 32 that is not covered by the third gate insulating layer 32. The third electrode layer 333 covered on the top of the at least one second bump 362 and the third electrode layer 333 covered on the surface of the third gate insulating layer 32 are disconnected from each other, so that the third electrode layer 333 located in the bridge area is isolated from the third electrode layer 333 corresponding to the first opening 11, so as to prevent the film layer corresponding to the first opening from being connected to the film layer corresponding to the island area via the film layer corresponding to the bridge area.

[0178] In some embodiments, the corresponding film layers respectively arranged in the island area and the bridge area can be located in the same layer and made of the same material. For example, the second buffer layer 31 and the first buffer layer 21 are located in the same layer and made of the same material. The first conductive trace 371 and part of the source and drain of the thin film transistor 22 (for example, the first source 223 and the first drain 224) are located in the same layer and made of the same material, so that the second conductive trace 372 and part of the source and drain of the thin film transistor 22 (for example, the second source 225 and the second drain 226) are located in the same layer and made of the same material, so that the second planarization layer 331 and the first planarization layer 241 are located in the same layer and made of the same material, and the third electrode layer 333 and the first electrode layer 244 are located in the same layer and made of the same material.

[0179] refer to Fig. 9 and Fig.10 In some embodiments, the number of the second bumps 362 in the at least one second bump 362 is the same as the number of the first bumps 282 in the at least one first bump 282, and they are connected to each other to form a closed ring around the first opening 11. The second bumps 362 and the first bumps 282 can be formed in the same patterning process.

[0180] refer to Figure 6 and Figure 7 In some embodiments, in the bridge area, the thin film encapsulation structure on the side of the multiple routing units 3 away from the stretchable substrate may include: a first inorganic side encapsulation layer, a second inorganic encapsulation layer 253 and a second organic encapsulation layer 254 stacked in sequence on the side of the multiple routing units 3 away from the stretchable substrate, the thin film encapsulation structure in the bridge area is the same as the film layer structure of the thin film encapsulation structure in the island area, and the bridge area and the second organic encapsulation layer 254 in the island area are flush with the surface on the side away from the stretchable substrate.

[0181] In the case of meeting product reliability requirements, no other film layer may be provided between the second organic encapsulation layer 254 and the cover plate B, so that the display substrate can be flexibly attached to the cover plate at a position corresponding to the bridge area.

[0182] The second organic encapsulation layer 254 may be formed by first coating an organic material on the second inorganic encapsulation layer 253, and then performing patterning processes such as exposure and development to remove the organic material at the first opening position to obtain the second organic encapsulation layer 254. The organic material of the second organic encapsulation layer 254 may be 1-methoxy-2-propyl acetate, acrylic resin, etc.

[0183] In some embodiments, the third electrode layer 333 and the first electrode layer 244 are located in the same layer and made of the same material to simplify the process.

[0184] In addition, the surface of the second organic encapsulation layer 254 in the bridge area away from the stretchable substrate also includes an organic encapsulation layer pattern, and the organic encapsulation layer pattern includes at least one second opening, and the length direction of the at least one second opening is parallel to the length direction of the adjacent first opening 11. In some embodiments, the organic encapsulation layer pattern includes a plurality of second openings parallel to each other. The second openings of the coating pattern can be formed by an exposure and development process. By the second openings in the second organic encapsulation layer 254 in the bridge area, the stretching properties of the bridge area can be effectively improved.

[0185] The above display panel embodiments of the present disclosure can be applied to various display devices. Therefore, the present disclosure also provides a display device, including the above display panel. The display device can be: a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, or any other product or component with a display function.

[0186] Figures 13 to 16 is a schematic diagram of some steps in a process of an embodiment of a method for manufacturing a display panel according to the present disclosure. Figures 13 to 16 The manufacturing method embodiment shown is manufactured.

[0187] refer to Figures 13 to 16 In some embodiments, a method for manufacturing a display substrate includes:

[0188] Step S01, providing a substrate;

[0189] Step S02, forming a display area on a substrate, wherein the display area includes: a first display area A13, including a plurality of display units arranged on the substrate and a first thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; a second display area A14, including a plurality of display units arranged on the substrate and a second thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; and a transitional display area A15, including a plurality of display units arranged on the substrate and a third thin film encapsulation structure arranged on the light-emitting side of the plurality of display units, wherein the transitional display area A15 is located between the first display area A13 and the second display area A14; wherein the first thin film encapsulation structure includes: a first inorganic encapsulation layer 251, a first organic encapsulation layer 252 sequentially stacked on the light-emitting side of the plurality of display units and a second inorganic encapsulation layer 253; the second thin-film encapsulation structure includes: a first inorganic encapsulation layer 251, a second inorganic encapsulation layer 253 and a second organic encapsulation layer 254 which are sequentially stacked on the light-emitting side of the multiple display units; the third thin-film encapsulation structure includes a first part 250A located on a side close to the first display area A13 and a second part 250B located on a side close to the second display area A14, the first part 250A includes a first inorganic encapsulation layer 251, a first organic encapsulation layer 252 and a second inorganic encapsulation layer 253 which are sequentially stacked on the light-emitting side of the multiple display units; the second part 250B includes a first inorganic encapsulation layer 251, a second inorganic encapsulation layer 253 and a second organic encapsulation layer 254 which are sequentially stacked on the light-emitting side of the multiple display units.

[0190] Step S02 specifically includes:

[0191] Step S021, forming a first retaining wall 271 and a second retaining wall 272 on the light emitting side of the plurality of display units in the display area;

[0192] Specifically, the first groove and the second groove may be formed on the organic insulating layer or the first planarization layer 241 through an exposure and development process to serve as the first retaining wall 271 and the second retaining wall 272 , respectively.

[0193] Step S022, forming a first inorganic encapsulation layer 251 on the light-emitting side of the plurality of display units in the display area;

[0194] Specifically, the first inorganic encapsulation layer 251 may be formed by plasma enhanced chemical vapor deposition.

[0195] Step S023, printing a first organic material on the first inorganic encapsulation layer 251 to form a first organic material layer, wherein a portion of the first organic material layer is located in the first display area A13, and another portion extends to cover the first retaining wall 271 and / or the second retaining wall 272;

[0196] Specifically, Fig.13 As shown, the first organic material layer can be formed by printing an organic material, and the organic material has fluidity and a long climbing distance, and extends to cover the first retaining wall 271 but not the second retaining wall 272, or extends to cover the second retaining wall 272;

[0197] Step S024, thinning the first organic material layer to remove a portion of the first organic material layer to form a first organic encapsulation layer 252, so that the first inorganic encapsulation layer 251 in the transition display area A15 is at least partially exposed;

[0198] Specifically, Fig.14 As shown, a plasma thinning process can be used, and the first organic material layer is thinned to a thickness of about several hundred angstroms, so that the thinner organic material on the transition display area A15 is removed, and the first inorganic encapsulation layer 251 of the transition display area A15 is exposed, and the following is obtained: Fig.15 The display substrate is shown.

[0199] Step S025, forming a second inorganic encapsulation layer 253, wherein a portion of the second inorganic encapsulation layer 253 covers the first organic encapsulation layer 252, and another portion covers a portion of the first inorganic encapsulation layer 251 not covered by the first organic encapsulation layer 252;

[0200] Specifically, the second inorganic encapsulation layer 253 may be formed by plasma enhanced chemical vapor deposition.

[0201] Step S026: Fig.16 As shown, a second organic encapsulation layer 254 is coated on the second inorganic encapsulation layer 253, a portion of the second organic encapsulation layer 254 covers a portion of the second inorganic encapsulation layer 253 that covers the first organic encapsulation layer 252, and another portion covers a portion of the first inorganic encapsulation layer 251 that is not covered by the first organic encapsulation layer 252.

[0202] Specifically, the second organic encapsulation layer 254 may be formed by coating.

[0203] In this specification, multiple embodiments are described in a progressive manner, and the focus of each embodiment is different, and the same or similar parts between the embodiments can be referred to each other. For the method embodiment, since its overall and the steps involved correspond to the contents in the display panel embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the display panel embodiment.

[0204] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0205] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.

Claims

1. A display substrate, characterized in that: Comprising a display area, the display area comprising: A first display area includes a plurality of display units disposed on a substrate and a first thin film encapsulation structure disposed on a light emitting side of the plurality of display units; A second display area includes a plurality of display units disposed on the substrate and a second thin film encapsulation structure disposed on the light emitting side of the plurality of display units; and, a transitional display area, comprising a plurality of display units disposed on a substrate and a third thin film encapsulation structure disposed on a light emitting side of the plurality of display units, the transitional display area being located between the first display area and the second display area; The first thin film encapsulation structure comprises: a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units; The second thin film encapsulation structure comprises: a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer sequentially stacked on the light emitting side of the plurality of display units; The third thin film encapsulation structure includes a first portion located on a side close to the first display area and a second portion located on a side close to the second display area, the first portion includes a first inorganic encapsulation layer, a first organic encapsulation layer, a second inorganic encapsulation layer, and a second organic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units; the second portion includes a first inorganic encapsulation layer, a second inorganic encapsulation layer, and a second organic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units; The display area includes: a plurality of side edges, wherein adjacent side edges of the plurality of side edges intersect to form a plurality of corners; The second display area is located at least one of the plurality of corners; The first display area has a first pixel density, the second display area has a second pixel density, and the transition display area has a third pixel density; the second pixel density and the third pixel density are both less than or equal to the first pixel density.

2. The display substrate according to claim 1, characterized in that: The light transmittance of the second organic encapsulation layer is greater than the light transmittance of the first organic encapsulation layer.

3. The display substrate according to claim 1, characterized in that: A first retaining wall is provided between the first display area and the transition display area; a second retaining wall is provided between the second display area and the transition display area.

4. The display substrate according to claim 1, characterized in that: The transition display area is provided with a first retaining wall and a second retaining wall, the first retaining wall and the second retaining wall do not overlap with the orthographic projection of the display unit of the transition display area on the substrate, and the first retaining wall is arranged on a side of the transition display area close to the first display area, and the second retaining wall is arranged on a side of the transition display area close to the second display area.

5. The display substrate according to claim 3 or 4, characterized in that: The first inorganic encapsulation layer, the first organic encapsulation layer and the second inorganic encapsulation layer of the first part are formed by extending the first thin film encapsulation structure toward the side where the transition display area is located, and the first inorganic encapsulation layer, the first organic encapsulation layer and the second inorganic encapsulation layer of the first part cover the first retaining wall; The second portion is formed by extending the second thin film encapsulation structure toward the side where the transition display area is located, and the second portion covers the second retaining wall; The second organic encapsulation layer of the first portion is formed by extending the second organic encapsulation layer in the second portion toward the side where the transition display area is located.

6. The display substrate according to claim 3 or 4, characterized in that: The first organic encapsulation layer of the first portion has a climbing surface on a side close to the second display area; the second organic encapsulation layer of the first portion covers a side of the climbing surface away from the substrate.

7. The display substrate according to claim 6, characterized in that: The second organic encapsulation layer in the second thin film encapsulation structure is substantially flush with the second organic encapsulation layer in the third thin film encapsulation structure at a surface away from the substrate.

8. The display substrate according to claim 3 or 4, characterized in that: The second display area includes: A stretchable substrate, a plurality of opening patterns distributed along a surface of the stretchable substrate, wherein each of the plurality of opening patterns comprises a plurality of first openings, a plurality of bridge regions surrounding an island region are formed between at least some adjacent first openings of the plurality of first openings, and a plurality of second display units are arranged on the island regions formed by each of the opening patterns; A plurality of routing units are respectively connected between the plurality of display units on the island area and are respectively arranged in the plurality of bridge areas.

9. The display substrate according to claim 8, characterized in that: At least one of the plurality of display units comprises: A first planarization layer, located on the front side of the substrate along the light emitting direction of the display substrate; an organic insulating layer, located on a side of the first planarization layer away from the substrate; and, a first electrode layer, located on a side of the first planarization layer away from the substrate; wherein, The first retaining wall comprises a first groove, the first groove is arranged on the first planarization layer, and the organic insulating layer conformally covers the first groove; or the first groove is arranged on the organic insulating layer; The second retaining wall comprises a second groove, the second groove is arranged on the first planarization layer, and the organic insulating layer conformally covers the second groove; or the second groove is arranged on the organic insulating layer; The first inorganic encapsulation layer is located on a side of the first electrode layer away from the substrate and covers the first electrode layer; The first organic encapsulation layer covers a portion of the first inorganic encapsulation layer located on a side of the first groove away from the second groove, the first groove, and a portion between the first groove and the second groove close to the first groove, but does not cover a portion of the first inorganic encapsulation layer between the first groove and the second groove close to the second groove, and a portion of the second groove and a side of the second groove away from the first groove; The second inorganic encapsulation layer covers the first organic encapsulation layer and a portion of the first inorganic encapsulation layer that is not covered by the first organic encapsulation layer; The second organic encapsulation layer covers the second inorganic encapsulation layer located in the first groove and a portion of the first groove far away from the first display area, but does not cover the first opening.

10. The display substrate according to claim 9, characterized in that: The organic insulating layer includes a first supporting spacer arranged in the first display area, a second supporting spacer arranged in the transition display area, and a third supporting spacer arranged in the second display area. The first groove is arranged on the first supporting spacer, and the second groove is arranged on the second supporting spacer.

11. The display substrate according to claim 9, characterized in that: The first groove and the second groove include continuous grooves extending along a first direction, and the first direction is an extending direction of a boundary line between the first display area and the transition display area.

12. The display substrate according to claim 11, characterized in that: The continuous groove has a groove width of 5 to 15 μm in the second direction, and a groove height of 1 to 2.5 μm in the third direction. The second direction is perpendicular to the first direction and parallel to the stretchable substrate, and the third direction is perpendicular to the stretchable substrate.

13. The display substrate according to claim 11, characterized in that: The first groove and / or the second groove include at least one column of discrete grooves arranged in sequence in a second direction, wherein the second direction is perpendicular to the first direction and parallel to the stretchable substrate, and each column of discrete grooves includes a plurality of discrete grooves arranged at intervals along the first direction.

14. The display substrate according to claim 13, characterized in that: The at least one column of discrete grooves includes a plurality of columns of discrete grooves, and a spacing between adjacent columns of discrete grooves in the plurality of columns of discrete grooves is 2-15 μm.

15. The display substrate according to claim 10, characterized in that: At least one of the plurality of display units further comprises: A first isolation structure is located between the second groove and the first opening and is configured to disconnect the first electrode layers on both sides of the first isolation structure. The first electrode layer covers the first isolation structure and is located on a side of the first isolation structure adjacent to the second groove and a side of the first opening.

16. The display substrate according to claim 15, characterized in that: At least one of the plurality of display units in the second display area further comprises: a first passivation layer, a portion of the first passivation layer is located between the third supporting spacer of the second display area and the first opening, and at least a portion of the first passivation layer is located on a side of the first planarization layer away from the stretchable substrate; The first isolation structure includes at least one third groove located in the first passivation layer and the first planarization layer, and the first electrode layer covered by the bottom of the at least one third groove is disconnected from the first electrode layer covered by the surface of the first passivation layer.

17. The display substrate according to claim 16, characterized in that: At least one of the plurality of display units in the second display area further comprises: a second passivation layer, the second passivation layer being at least partially located on a side of the first planarization layer close to the stretchable substrate; The first passivation layer includes a first passivation portion located on a side of the first planarization layer away from the stretchable substrate and a second passivation portion located on a side of the first planarization layer adjacent to the first opening, and the second passivation portion covers a surface of the first planarization layer adjacent to the first opening and is connected to a surface of the second passivation layer to form isolation protection of the first passivation layer for the surface of the first planarization layer adjacent to the first opening.

18. The display substrate according to claim 16, characterized in that: At least one of the plurality of display units in the second display area further comprises: an interlayer insulating layer, located on the front side of the stretchable substrate along the light emitting direction of the display substrate; Among them, the first isolation structure includes at least one first bump located on the surface of the interlayer insulating layer away from the stretchable substrate, the first electrode layer covers the top of the at least one first bump and a portion of the surface of the interlayer insulating layer, and the first electrode layer located on the top of the at least one first bump is disconnected from the first electrode layer located on the surface of the interlayer insulating layer.

19. The display substrate according to claim 18, characterized in that: At least one of the plurality of routing units comprises: a second planarization layer, located on the front side of the stretchable substrate along the light emitting direction of the display substrate; a pixel definition layer, located on a side of the second planarization layer away from the stretchable substrate, covering a portion of the surface of the second planarization layer, and having at least one fourth groove; and a third electrode layer covering a bottom of the at least one fourth groove and a surface of the pixel definition layer; The third electrode layer covered by the bottom of the at least one fourth groove and the third electrode layer covered by the surface of the pixel definition layer are disconnected from each other.

20. The display substrate according to claim 19, characterized in that: The number of the third grooves in the at least one third groove is the same as the number of the fourth grooves in the at least one fourth groove, and the at least one fourth groove and the at least one third groove are respectively interconnected to form a closed ring around the first opening.

21. The display substrate according to claim 20, characterized in that: At least one of the plurality of routing units comprises: a gate insulating layer, located at a front side of the stretchable substrate along a light emitting direction of the display substrate; at least one second bump, located on a surface of the gate insulating layer away from the stretchable substrate; a third electrode layer, covering a top of the at least one second bump and a portion of a surface of the gate insulating layer not covered by the at least one second bump; The third electrode layer covered on the top of the at least one second bump and the third electrode layer covered on the surface of the gate insulating layer are disconnected from each other.

22. The display substrate according to claim 21, characterized in that: The number of the second protrusions in the at least one second protrusion is the same as the number of the first protrusions in the at least one first protrusion, and the at least one second protrusion and the at least one first protrusion are respectively connected to each other to form a closed ring around the first opening.

23. The display substrate according to claim 8, characterized in that: The first opening includes an opening end located on a side away from the substrate, a bottom end located on a side close to the substrate, and a hole body portion located between the opening end and the bottom end. The opening width of at least one of the multiple first openings is: the opening width of the hole body portion gradually increases along the light emitting direction of the display substrate, the opening width of the opening end is smaller than the maximum opening width of the hole body portion, and the maximum opening width of the hole body portion is larger than the opening width of the bottom end.

24. The display substrate according to claim 23, characterized in that: At least a portion of the side wall of the hole body portion close to the opening end is in an arc-shaped curved surface.

25. A display panel, characterized in that: include: The display substrate according to any one of claims 1 to 24; and The cover plate is located on the light-emitting side of the display substrate and is packaged with the display substrate.

26. A display device, characterized in that: include: The display panel as claimed in claim 25.

27. A method for manufacturing a display substrate, characterized in that: include: providing a substrate; A display area is formed on a substrate, wherein the display area includes: a first display area, including a plurality of display units arranged on the substrate and a first thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; a second display area, including a plurality of display units arranged on the substrate and a second thin film encapsulation structure arranged on the light-emitting side of the plurality of display units; and a transition display area, including a plurality of display units arranged on the substrate and a third thin film encapsulation structure arranged on the light-emitting side of the plurality of display units, wherein the transition display area is located between the first display area and the second display area; wherein the first thin film encapsulation structure includes: a first thin film encapsulation structure sequentially superimposed on the light-emitting side of the plurality of display units The second thin-film encapsulation structure comprises: a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units; the third thin-film encapsulation structure comprises a first portion located on a side close to the first display area and a second portion located on a side close to the second display area, the first portion comprises a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units; the second portion comprises a first inorganic encapsulation layer, a second inorganic encapsulation layer and a second organic encapsulation layer sequentially stacked on the light-emitting side of the plurality of display units; The display area includes: A plurality of side edges, wherein adjacent side edges of the plurality of side edges intersect to form a plurality of corners; The second display area is located at least one of the plurality of corners; The first display area has a first pixel density, the second display area has a second pixel density, and the transition display area has a third pixel density; the second pixel density and the third pixel density are both less than or equal to the first pixel density.

28. The method for manufacturing a display substrate according to claim 27, wherein: The forming of the display area on the substrate specifically includes: forming a first blocking wall and a second blocking wall on the light emitting side of the plurality of display units in the display area; forming a first inorganic encapsulation layer on the light emitting side of the plurality of display units in the display area; Printing a first organic material on the first inorganic encapsulation layer to form a first organic material layer, wherein a portion of the first organic material layer is located in the first display area, and another portion extends to cover the first retaining wall and / or the second retaining wall; Performing a thinning process on the first organic material layer to remove a portion of the first organic material layer to form the first organic encapsulation layer, so that the first inorganic encapsulation layer in the transition display area is at least partially exposed; A second inorganic encapsulation layer is formed, wherein a portion of the second inorganic encapsulation layer covers the first organic encapsulation layer, and another portion covers a portion of the first inorganic encapsulation layer not covered by the first organic encapsulation layer; a second organic encapsulation layer is coated on the second inorganic encapsulation layer, wherein a portion of the second organic encapsulation layer covers a portion of the second inorganic encapsulation layer covering the first organic encapsulation layer, and another portion covers a portion of the first inorganic encapsulation layer not covered by the first organic encapsulation layer.

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