A new type of fully automatic packaging device and packaging method

Abstract

The present invention relates to the field of display packaging technology, and specifically to a new type of fully automatic packaging device and packaging method, which belongs to the new technical field of semiconductor component packaging. The device is mainly composed of five parts: a control unit, a CCD positioning system, a red light sensing unit, a sealing device, and a sliding folding heater. It is a brand-new automatic packaging device. The control unit in the device controls the entire operation process. After the fixture reaches the corresponding position on the track, it will issue a command to make the various components work together. The CCD positioning system and the red light sensing unit work perfectly together to accurately locate the position and height difference of the components, and then transmit the data to the sealing device, so that it can work under the best conditions. With the cooperation of the sliding folding heater, the best product is produced. The design of the present invention is reasonable and efficient, and can be adapted to various packaging equipment and packaging products.

Description

Technical Field

[0001] The present invention relates to the technical field of display packaging, and in particular to a novel fully automatic packaging device and packaging method, belonging to the new technical field of semiconductor component packaging. Background Art

[0002] Microdisplays are a very important development direction in the semiconductor industry. As the most prominent link in its appearance, the quality of packaging directly affects the market competitiveness of microdisplays. However, the manufacturing of microdisplay packaging equipment in the market is still very lacking. The main shortcomings are as follows:

[0003] First, the cofferdam and filling in the packaging process must be completed by two devices, which not only increases the equipment cost but also reduces production efficiency.

[0004] Second, the height difference problem was not taken into consideration, and there was a lack of a height difference measuring device. There was a height difference between the component chip and the PCB board. Special attention should be paid to the height difference during cofferdam and filling. If the filling effect is too high, it will be poor, and if it is too low, it will hit the welding wire. There was no height difference testing system. Before each work and after changing the glue, the staff could only manually adjust the height difference, which not only wasted working time, but also failed to achieve the best accuracy.

[0005] Third, to ensure that the packaging surface is uniform and smooth, it is necessary to flow on the heater for a while after packaging so that the entire surface can flow evenly. However, the existing equipment lacks this function and requires another heating device, which not only affects the flow speed and thus the texture, but also increases the equipment cost.

[0006] Based on comprehensive considerations of equipment cost, work efficiency and quality improvement, this invention invents a new packaging device that integrates the functions of three devices into one, adds an infrared testing system, improves accuracy and work efficiency, and at the same time, the addition of a folding sliding heating plate effectively improves the uniformity and smoothness of the glue surface, increasing the product's market competitiveness. Summary of the Invention

[0007] In order to solve the above technical problems, the present invention provides a new type of fully automatic packaging device and packaging method.

[0008] The present invention adopts the following technical solutions:

[0009] A new type of fully automatic packaging device, including

[0010] The control unit controls the operation of the packaging device, receives and processes the signals collected by the CCD positioning system and the red light sensing unit, and transmits them to the sealing device and the sliding folding heater;

[0011] CCD positioning system to locate the position of the components to be packaged;

[0012] The red light sensing unit measures and calculates the height difference between the chip and the PCB board;

[0013] Sealing device to dam and fill components;

[0014] A sliding folding heater is fixed on a track and can move along the track to heat the bottom of the fixture that carries the component;

[0015] The control unit is electrically connected to the CCD positioning system, the red light sensing unit, the sealing device, and the sliding and folding heater respectively. The CCD positioning system, the red light sensing unit, and the sealing device are located above the sliding and folding heater.

[0016] Specifically, the CCD positioning system, the red light sensing unit and the sealing device are fixed on a movable platform.

[0017] Specifically, the sealing device includes two heatable shells, wherein the cofferdam glue and the filling glue are respectively provided in the two heatable shells, and a heater is provided outside the two heatable shells.

[0018] Specifically, the sliding folding heater includes a foldable bracket and a heating plate fixed on the top thereof, and the foldable bracket is slidably fixed on a track.

[0019] The method for packaging components using the packaging device described above comprises the following specific steps:

[0020] S1 The fixture for loading components is transferred to the middle of the track, and the control unit controls the sliding folding heater to move under the fixture to heat it;

[0021] The S2 CCD positioning system moves above the fixture to position the component;

[0022] The S3 red light sensing unit measures the component based on its position and calculates the height difference between the chip and the PCB board;

[0023] The S4 control unit receives and processes the data collected in steps S2-S3, and then controls the packaging device to perform cofferdam and filling on the components respectively. After the packaging is completed, the sliding folding heater returns to the origin along the track.

[0024] Specifically, the CCD positioning system uses a camera to find components on the fixture, and then accurately locates the packaging position of each component using the Mark point.

[0025] Specifically, the red light sensing unit measures the corresponding position of the component multiple times and takes the average value of the height difference between the chip and the PCB board.

[0026] Specifically, when the sliding folding heater heats the bottom of the clamp, its foldable bracket is unfolded and the heating plate starts heating; when the foldable bracket is retracted, the heating plate stops heating.

[0027] Specifically, when the packaging device performs cofferdamming and filling, the heatable shell is heated to improve the fluidity of the packaging glue, and the amount of glue is controlled by nitrogen. The control unit controls the packaging device to perform accurate packaging.

[0028] Beneficial effects:

[0029] 1. The overall structural design of the present invention is reasonable, and multiple functions are integrated into one, which greatly reduces production costs, increases plant space utilization, and improves production efficiency.

[0030] 2. The present invention perfectly matches the CCD positioning system and the infrared sensing system, effectively solving the problems of component packaging accuracy and height difference, improving work efficiency and product quality. In addition, the cooperation of the bottom sliding heating plate can ensure the fluidity of the glue surface in time, effectively ensure the uniform and smooth surface, further improve production quality, and ensure the quality of the packaged products.

[0031] 3. The present invention has a simple and compact structure and can produce the best products at low cost and high efficiency, which greatly enhances the market competitiveness.

[0032] 4. This method can be applied to the packaging of various types of components. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 : A schematic structural diagram of the packaging device of the present invention;

[0034] Numbers in the figure: 1-CCD positioning system, 2-red light sensing unit, 3-sealing device, 4-sliding folding heater, 5-track, 6-movable platform, 31-heatable shell, 32-bracket, 41-foldable bracket, 42-heating plate. DETAILED DESCRIPTION

[0035] In order to make the purpose and technical solution of the present invention clearer, the present invention is further described and explained in detail below with reference to the accompanying drawings and specific embodiments.

[0036] Example 1: Figure 1As shown, a new type of fully automatic packaging device mainly includes five parts, a control unit, a CCD positioning system 1, a red light sensing unit 2, a sealing device 3 and a sliding folding heater 4, wherein the CCD positioning system 1, the red light sensing unit 2 and the sealing device 3 are fixed on the upper integral movable platform 6, and the lower part is a track 5 and a sliding folding heater 4 slidingly fixed thereon. The control unit is electrically connected to the CCD positioning system 1, the red light sensing unit 2, the sealing device 3 and the sliding folding heater 4 respectively. The control unit is mainly used to control the coordinated work of each part and information analysis to achieve precise automatic packaging of components.

[0037] The sealing device 3 is used to cofferdam and fill the components. It is set up as two separate glue containers and fixed on the movable platform 6 by a bracket 32. The container shell is a heatable shell 31 and is equipped with a corresponding heater to improve the fluidity of the glue and ensure the cofferdam and filling effects. The glue amount is controlled by nitrogen.

[0038] At the same time, the sliding folding heater 4 is configured as a foldable bracket 41 and a heating plate 42 fixed on the top thereof. The foldable bracket 41 is slidably fixed on the track 5 and can move along the track 5.

[0039] When the above device is used for component packaging, the fixture carrying the component will move to the packaging area in the middle of the track 5. At this time, the sliding folding heater 4 is at the origin, and the control unit controls the entire device to perform component packaging according to the following steps:

[0040] S1 control unit controls the sliding folding heater 4 to move to the bottom of the clamp to heat it, and its foldable bracket 41 automatically unfolds and heats it through the heating plate 42;

[0041] The S2 control unit controls the CCD positioning system 1 to move above the fixture to position the components. The CCD positioning system 1 mainly uses the camera to find the components on the fixture, and then accurately locates the packaging position of each component by the mark point;

[0042] S3 red light sensing unit 2 measures the component according to its position and calculates the height difference between the chip and the PCB board. It measures multiple times around the corresponding position of the component and takes the average value of the height difference between the chip and the PCB board.

[0043] The S4 control unit receives and processes the data collected in steps S2-S3, and then controls the packaging device 3 to cofferdam and fill the components respectively. After the packaging is completed, the foldable bracket 41 in the sliding folding heater 4 is folded, the heating plate 42 stops heating, and automatically returns to the origin along the track 5.

[0044] During the entire packaging process, the sliding folding heater 4 continuously heats the fixture until the packaging is completed, which can ensure the fluidity of the glue surface in time and effectively ensure the surface is uniform and smooth. The entire packaging process is processed by the CPU in the control unit and instructions are issued. The CCD positioning system 1 and the infrared sensor 2 cooperate with each other to achieve precise positioning of the components, and return the data to the control unit, and then transmit the corresponding component position and height difference to the packaging device 3. The packaging device 3 performs precise packaging according to the received instructions. After the packaging is completed, the sliding folding heater 4 moves to its original position and waits for the next packaging. The entire packaging process is fully automated, effectively ensuring quality and efficiency. It is not only suitable for the packaging of micro displays, but also for various types of packaging equipment.

[0045] It should be understood that the description of the above embodiments is merely exemplary and is not intended to limit the scope of the present invention. Various modifications made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention are all within the scope of protection of the present invention.

Claims

1. A fully automatic packaging device, characterized in that: include: A control unit controls the operation of the packaging device, receives and processes signals collected by the CCD positioning system (1) and the red light sensing unit (2), and transmits the signals to the sealing device (3) and the sliding folding heater (4); CCD positioning system (1) to locate the position of the component to be packaged; A red light sensing unit (2) measures and calculates the height difference between the chip and the PCB board; Sealing device (3) for damming and filling components; A sliding folding heater (4) is fixed on the track (5) and can move along the track (5) to heat the bottom of the fixture carrying the component; The control unit is electrically connected to the CCD positioning system (1), the red light sensing unit (2), the sealing device (3), and the sliding folding heater (4), respectively. The CCD positioning system (1), the red light sensing unit (2), and the sealing device (3) are located above the sliding folding heater (4); The sealing device (3) comprises two heatable shells (31), wherein the two heatable shells (31) are respectively provided with a cofferdam glue and a filling glue, and a heater is provided outside the two heatable shells (31); The sliding folding heater (4) comprises a foldable bracket (41) and a heating plate (42) fixed on the top thereof, wherein the foldable bracket (41) is slidably fixed on a track (5); When the sliding folding heater (4) heats the bottom of the clamp, its foldable bracket (41) unfolds and the heating plate (42) starts heating; when the foldable bracket (41) is retracted, the heating plate (42) stops heating.

2. The fully automatic packaging device according to claim 1, characterized in that: The CCD positioning system (1), the red light sensing unit (2) and the sealing device (3) are fixed on a movable platform (6).

3. A method for component packaging using the packaging device according to claim 1 or 2, characterized in that: The steps include: S1 The fixture carrying the component is transferred to the middle of the track (5), and the control unit controls the sliding folding heater (4) to move under the fixture to heat it; The S2 CCD positioning system (1) moves above the fixture to position the component; The S3 red light sensing unit (2) measures the component according to its position and calculates the height difference between the chip and the PCB board; S4 The control unit receives and processes the data collected in steps S2-S3, and then controls the sealing device (3) to respectively cofferdam and fill the components. After the sealing is completed, the sliding folding heater (4) returns to the origin along the track (5).

4. The method according to claim 3, characterized in that The CCD positioning system (1) uses a camera to find the components on the fixture, and then accurately locates the packaging position of each component using the Mark point.

5. The component packaging method according to claim 3, wherein: The red light sensing unit (2) measures the corresponding position of the component multiple times, and takes the average value of the height difference between the chip and the PCB board.

6. The method according to claim 3, characterized in that When the sealing device (3) performs cofferdamming and filling, the heatable shell (31) is heated to improve the fluidity of the sealing glue, and the amount of glue is controlled by nitrogen. The control unit controls the sealing device (3) to perform accurate sealing.

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