Electronic devices

Abstract

The present application discloses an electronic device. The electronic device includes a shell, a heat dissipation structure and a guide structure. The shell includes a side wall and a top wall connected to the side wall, and an air outlet is provided on the top of the shell. The heat dissipation structure is arranged in the shell. The guide structure is arranged between the heat dissipation structure and the top wall, and the guide structure and the side wall jointly define a guide air duct, and the guide air duct is connected to the air outlet. In this way, the heat-conducting structure enables the high-temperature air heated by the heat dissipation structure to fully contact the side wall, thereby reducing the temperature of the high-temperature air, and the cooled air flows through the top air outlet. While achieving internal heat dissipation of the electronic device, it can also reduce the temperature near the top air outlet on the shell surface, thereby improving the user experience.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the advent of the 5G communication era, the power consumption density of electronic devices has increased rapidly (such as CPE, routers, PCs and other electronic products), resulting in huge challenges in the thermal design of electronic devices. In the thermal design goals, the surface temperature rise of electronic devices has strict standards and requirements, and the equipment temperature rise requirements in some regions are more stringent than the industry standards. Lower surface temperature rise allows users to have a better user experience when touching the device, so it is of great significance to reduce the surface temperature rise of the device through design solutions.

[0003] In the related art, a heat dissipation outlet is provided in the housing of the electronic device, and heat flows out of the housing through the heat dissipation outlet, resulting in a higher temperature of the electronic device at the outlet. Summary of the invention

[0004] An embodiment of the present application provides an electronic device.

[0005] The electronic device provided in the embodiment of the present application includes a housing, a heat dissipation structure and a guide structure. The housing includes a side wall and a top wall connected to the side wall, and an air outlet is provided on the top of the housing. The heat dissipation structure is arranged in the housing. The guide structure is arranged between the heat dissipation structure and the top wall, and the guide structure and the side wall jointly define a guide air duct, and the guide air duct is connected to the air outlet.

[0006] In this way, the thermal conductive structure enables the high-temperature air heated by the heat dissipation structure to fully contact the side walls, thereby reducing the temperature of the high-temperature air. The cooled air flows through the top air outlet, which not only achieves internal heat dissipation of the electronic equipment, but also reduces the temperature near the top air outlet on the shell surface, thereby improving the user experience.

[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0009] Figure 1 is a schematic plan view of an electronic device according to an embodiment of the present application;

[0010] Figure 2 is a plan view schematically showing another structure of an electronic device according to an embodiment of the present application;

[0011] Figure 3 is a plan view schematically showing another structure of an electronic device according to an embodiment of the present application;

[0012] Figure 4 It is a schematic plan view of yet another structure of an electronic device according to an embodiment of the present application.

[0013] Explanation of the main component symbols: electronic device 100, shell 10, side wall 11, top wall 12, top 13, air outlet 14, air inlet 15, bottom wall 16, heat dissipation structure 20, air guide structure 30, baffle 31, side panel 32, groove 33, air guide duct 40, heat source 50, circuit board 51, heating element 52, decorative part 60, gap 61. DETAILED DESCRIPTION

[0014] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0015] In the description of the present application, it should be understood that the terms, "length", "width", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0016] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0017] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0018] In the related art, in order to avoid the temperature near the air outlet on the top of the electronic device being too high after heat dissipation, the volume of the electronic device is often increased to increase the air convection path and heat dissipation area, thereby achieving cooling of the air outlet on the top of the electronic device. Increasing the volume of the electronic device not only increases the manufacturing cost of the electronic device, but also affects the user experience.

[0019] See also Figure 1 The electronic device 100 provided in the embodiment of the present application includes a housing 10, a heat dissipation structure 20 and a guide structure 30. The housing 10 includes a side wall 11 and a top wall 12 connected to the side wall 11, and an air outlet 14 is provided at the top 13 of the housing 10. The heat dissipation structure 20 is arranged in the housing 10. The guide structure 30 is arranged between the heat dissipation structure 20 and the top wall 12, and the guide structure 30 and the side wall 11 jointly define a guide air duct 40, and the guide air duct 40 is connected to the air outlet 14.

[0020] In this way, the thermal conductive structure enables the high-temperature air heated by the heat dissipation structure 20 to fully contact the side wall 11, thereby reducing the temperature of the high-temperature air. The cooled air flows through the air outlet 14 at the top 13, and while achieving internal heat dissipation of the electronic device 100, it can also reduce the temperature near the air outlet 14 at the top 13 of the surface of the shell 10, thereby improving the user experience.

[0021] Specifically, the housing 10 can be made of plastic material, and the shape of the housing 10 can be circular, rectangular, diamond-shaped, etc., and there is no limitation on the shape of the housing 10. The electronic device 100 can be a mobile phone, a tablet computer, a smart wearable device, etc.

[0022] After the electronic device 100 is used for a long time, the continuous operation of the electronic device 100 will cause a large amount of heat to be generated inside. The large amount of heat will affect the performance and life of the electronic device 100. Therefore, a heat dissipation structure 20 can be set in the shell 10 of the electronic device 100. The heat dissipation structure 20 is used to exchange heat with cold air to reduce the temperature inside the shell 10. After the air is heated by the heat dissipation structure 20, the air density decreases, the buoyancy increases, and the hot air continues to flow upward. Finally, it can leave the electronic device 100 from the outlet 14 on the top 13 and take away the heat of the heat source 50, forming natural convection heat exchange to achieve heat dissipation of the electronic device 100.

[0023] The heat dissipation structure 20 can be made of aluminum alloy, copper alloy, or alloy material, and there is no restriction on the material of the heat dissipation structure 20. The heat dissipation structure 20 can be a flat fin or a pin-fin radiator, and there is no restriction on the type of the heat dissipation structure 20.

[0024] More specifically, after the heat dissipation structure 20 exchanges heat with the air, the air heated by the heat dissipation structure 20 cannot flow out directly through the air outlet 14 of the top 13 due to the air guide structure 30 provided between the heat dissipation structure 20 and the top wall 12. The air guide structure 30 forces the air to flow out of the radiator and then flow through the air guide duct 40. The air guide duct 40 is defined by the air guide structure 30 and the side wall 11. Since the temperature of the side wall 11 is relatively low, the temperature of the air will decrease when the air flows through the air guide duct 40. The air cooled by the side wall 11 then flows from the air guide duct 40 to the air outlet 14 of the top 13, and finally the air flows out from the air outlet 14 of the top 13. In one example, the number of the air guide ducts 40 may be two, and along the length direction of the air guide structure 30, both ends of the air guide structure 30 form the air guide duct 40 with the side wall 11.

[0025] In some embodiments, the heat-conducting structure can also jointly define a guide air duct 40 with the top wall 12, and the guide air duct 40 is connected to the air outlet 14. The air cooled by the side wall 11 can flow from the guide air duct 40 jointly defined by the heat-conducting structure and the side wall 11 to the guide air duct 40 jointly defined by the heat-conducting structure and the top wall 12. This situation can be suitable for scenarios where an air flow channel with a longer flow path is required. Subsequently, the air flows from the guide air duct 40 jointly defined by the heat-conducting structure and the top wall 12 to the air outlet 14 at the top 13, and finally dissipates into the atmosphere.

[0026] In this way, the heat dissipation structure 20 performs heat exchange with the air to achieve heat dissipation of the electronic device 100, and the air guide structure 30 allows the heated high-temperature air to flow through the air guide duct 40 to contact the side wall 11, thereby using the low temperature of the side wall 11 to cool the air, and finally the air flows out of the air outlet 14 at a lower temperature, which can reduce the temperature near the air outlet 14 of the top 13. When the electronic device 100 is used, the top 13 of the surface of the electronic device 100 is easy to touch, and reducing the temperature near the air outlet 14 of the top 13 can improve the user experience.

[0027] The guide structure 30 may be made of plastic or metal. The guide structure 30 may be rectangular, circular, or annular, and the shape of the guide structure 30 is not limited. It is understood that the shape and size of the guide structure 30 may control the size of the guide air duct 40. The shape and size of the guide structure 30 may be selected according to actual needs without affecting the heat dissipation efficiency.

[0028] In one example, a bracket is connected to the inside of the housing 10, the bracket is located between the top wall 12 and the heat dissipation structure 20, and the guide structure 30 is fixedly connected to the bracket. In another example, a connecting rod is provided on the heat dissipation structure 20, the connecting rod is located between the top wall 12 and the heat dissipation structure 20, and the connecting rod is connected to the guide structure 30.

[0029] See also Figure 2 In some embodiments, the air guide structure 30 includes a baffle 31 and a side plate 32 connected to the baffle 31, the side plate 32 and the side wall 11 jointly define an air guide channel 40, and the baffle 31 and the side plate 32 surround a groove 33. In this way, the baffle 31 and the side plate 32 jointly surround the groove 33 to reduce the mass of the air guide structure 30, and the air guide channel 40 defined by the side plate 32 and the side wall 11 can adapt to the situation where a longer air flow channel is required.

[0030] Specifically, the number of the side panels 32 can be two, and along the length direction of the baffle 31, the two side panels 32 are respectively arranged at both ends of the baffle 31, and the side panels 32 can be placed vertically relative to the baffle 31, and the two side panels 32 can form a groove 33 with the baffle 31, and the two side panels 32 can form a guide air duct 40 with the side wall 11. The side panels 32 can also define a guide air duct 40 with the top wall 12, and the guide air duct 40 is connected to the air outlet 14.

[0031] In this case, the baffle 31 and the side panel 32 will force the air to flow out of the radiator and then flow through the guide air duct 40 formed by the side panel 32 and the side wall 11. Since the temperature of the side wall 11 is relatively low, the temperature of the air will decrease when flowing through the guide air duct 40. The air cooled by the side wall 11 flows from the guide air duct 40 formed by the side panel 32 and the side wall 11 to the guide air duct 40 defined by the side panel 32 and the top wall 12, and the air can finally flow out from the air outlet 14 at the top 13.

[0032] In this way, the air flow path is extended to adapt to the situation where a longer air flow path is required. At the same time, the low temperature of the side wall 11 is used to cool the air, which can reduce the temperature near the air outlet 14 after the air flows out from the air outlet 14 at the top 13.

[0033] In some embodiments, the number of side panels 32 may be multiple, such as 4, 6 or 8, etc., which is not limited here. Along the length direction of the baffle 31, multiple side panels 32 are respectively arranged at both ends of the baffle 31, and multiple side panels 32 at each end of the baffle 31 are connected in sequence, and the side panels 32 can be placed vertically relative to the baffle 31, and the side panels 32 at both ends of the baffle 31 can form a guide air duct 40 with the side wall 11. It should be pointed out that the number of side panels 32 connected at both ends of the baffle 31 is the same, for example, it can be 2, 3 or 4, etc., so that when the air flows through the guide air duct 40 defined by the side panels 32 and the side wall 11, the side wall 11 can have a consistent cooling effect on the air at both ends of the baffle 31.

[0034] See also Figure 3 In some embodiments, the air guide structure 30 includes a baffle 31 and a plurality of side panels 32 connected to the baffle 31, the side panels 32 and the side wall 11 together define an air guide duct 40, and the plurality of side panels 32 converge from the baffle 31 in a direction away from the top wall 12. In this way, it can be applied to situations where air needs to be guided.

[0035] Specifically, there can be multiple side panels 32, and multiple side panels 32 converge from the baffle 31 in a direction away from the top wall 12 and are connected one by one. The side panels 32 are placed obliquely relative to the baffle 31 so that the baffle 31 and multiple side panels 32 form an inverted triangle structure, and the baffle 31 also defines a guide air duct 40 together with the side wall 11.

[0036] In this case, the baffle 31 and the side panel 32 will force the air to flow out of the radiator and then flow through the guide air duct 40 formed by the multiple side panels 32 and the side wall 11. Since the temperature of the side wall 11 is relatively low, the temperature of the air will decrease when flowing through the guide air duct 40. The air cooled by the side wall 11 flows from the guide air duct 40 formed by the side panel 32 and the side wall 11 to the guide air duct 40 defined by the baffle 31 and the side wall 11. The air can also be cooled by the side wall 11. Finally, the air cooled by the side wall 11 can flow out from the air outlet 14 on the top 13.

[0037] In this way, the baffle 31 and the multiple side panels 32 form an inverted triangle structure to guide the air, and at the same time use the low temperature of the side wall 11 to cool the air, which can reduce the temperature near the air outlet 14 after the air flows out from the air outlet 14 on the top 13.

[0038] See also Figure 1-Figure 3 In some embodiments, the top wall 12 and / or the side wall 11 are provided with an air outlet 14. In this way, the air heated by the heat dissipation structure 20 inside the housing 10 can flow out through the air outlet 14 to achieve heat dissipation for the electronic device 100.

[0039] Specifically, in one example, the top wall 12 of the electronic device 100 is provided with an air outlet 14. In another example, the side wall 11 of the electronic device 100 is provided with an air outlet 14. In another example, both the top wall 12 and the side wall 11 of the electronic device 100 are provided with an air outlet 14. When the side wall 11 of the electronic device 100 is provided with an air outlet 14, the heat-conducting structure enables the high-temperature air heated by the heat dissipation structure 20 to flow through the guide air duct 40 defined by the heat-conducting structure and the side wall 11, and the air can fully contact the side wall 11, thereby reducing the temperature of the high-temperature air. The cooled air can flow through the air outlet 14 of the side wall 11 and directly enter the atmosphere, which not only achieves heat dissipation inside the electronic device 100, but also avoids increasing the temperature near the air outlet 14 of the side wall 11 of the electronic device 100, thereby improving the user experience.

[0040] There may be multiple air outlets 14, and the multiple air outlets 14 are arranged at intervals on the top wall 12 and / or the side wall 11. The air outlets 14 may be circular holes, square holes, or other openings of any shape.

[0041] See also Figure 1-Figure 3 In some embodiments, the electronic device 100 includes a heat source 50 disposed in the housing 10, and the heat dissipation structure 20 is in contact with the heat source 50. In this way, the heat dissipation structure 20 performs heat exchange with air to achieve heat dissipation of the heat source 50.

[0042] In some embodiments, the heat source 50 may include at least one of a battery, a chip, and a motherboard. The chip may be a heat-generating component such as a central processing unit, an image processing unit, etc. When the electronic device 100 is in a long-term working state, the heat source 50 will generate a large amount of heat. When the heat dissipation structure 20 contacts the heat source 50 so that the heat dissipation structure 20 exchanges heat with the air, the temperature of the heat source 50 can be reduced, thereby improving the performance of the electronic device 100.

[0043] See also Figure 1-Figure 3 In some embodiments, the heat source 50 includes a circuit board 51 and a heating element 52 disposed on the circuit board 51, and the heating element 52 is in contact with the heat dissipation structure 20. In this way, the heat dissipation structure 20 dissipates heat from the heating element 52 by exchanging heat with the air.

[0044] See also Figure 1-Figure 3 In some embodiments, the housing 10 is provided with an air inlet 15, and the air inlet 15 is located on a side of the housing 10 away from the air outlet 14. In this way, cooling air can enter the housing 10 from the air inlet 15, and the cooling air can flow out from the air outlet 14 after heat exchange with the heat dissipation structure 20, thereby dissipating heat for the electronic device 100. Specifically, the air inlet 15 can be provided on the side wall 11. Since the temperature of the side wall 11 is relatively low, the temperature of the air flowing into the housing 10 can be lower, thereby achieving a better heat dissipation effect for the inside of the electronic device 100.

[0045] In one example, the top wall 12 of the electronic device 100 is provided with an air outlet 14, and the side of the side wall 11 away from the top wall 12 is provided with an air inlet 15. In another example, the side wall 11 of the electronic device 100 is provided with an air outlet 14, and the side of the side wall 11 away from the air outlet 14 is provided with an air inlet 15. In another example, the top wall 12 and the side wall 11 of the electronic device 100 are both provided with an air outlet 14, and the side of the side wall 11 away from the top wall 12 and the air outlet 14 is provided with an air inlet 15.

[0046] There may be a plurality of air inlets 15, and the plurality of air inlets 15 are disposed at intervals on the side wall 11 of the housing 10. The air inlet 15 may be a circular hole, a square hole, or any other opening-shaped structure.

[0047] Please refer again Figure 1-Figure 3 In some embodiments, the housing 10 includes a bottom wall 16 opposite to the top wall 12, and the bottom wall 16 is provided with an air inlet 15. In this way, since the temperature of the bottom wall 16 of the electronic device 100 is relatively low, the temperature of the air flowing into the housing 10 from the air inlet 15 on the bottom wall 16 can be lower, thereby achieving a better heat dissipation effect inside the electronic device 100.

[0048] See also Figure 4 In some embodiments, the electronic device 100 further includes a decorative piece 60 connected to the housing 10, and the decorative piece 60 covers the air outlet 14. In this way, the decorative piece 60 can enhance the appearance of the housing 10. At the same time, the high-temperature air heated by the heat dissipation structure 20 can fully contact the side wall 11 when flowing through the guide air duct 40, thereby reducing the temperature of the high-temperature air. After the cooled air flows through the air outlet 14 at the top 13, the air can diffuse from the surrounding of the decorative piece 60 to the external environment, thereby reducing the temperature of the air outlet 14 at the top 13 of the electronic device 100 and the vicinity of the decorative piece 60, thereby improving the user experience.

[0049] The decorative element 60 can be made of plastic or metal, and there is no restriction on the material of the decorative element 60. The decorative element 60 can be a block structure or a sheet structure, and there is no restriction on the shape of the decorative element 60.

[0050] See also Figure 4 In some embodiments, a gap 61 is formed between the decorative member 60 and the housing 10. In this way, after the air cooled by the side wall 11 flows through the air outlet 14 of the top 13, the air can diffuse to the outside environment from the gap 61 between the decorative member 60 and the housing 10, thereby reducing the temperature near the air outlet 14 of the top 13 of the electronic device 100 and the decorative member 60, thereby improving the user experience.

[0051] In the description of this specification, the description with reference to the terms "one embodiment", "certain embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0052] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that: include: A shell, the shell comprising side walls and a top wall connected to the side walls, and an air outlet is provided on the top of the shell; a heat dissipation structure, wherein the heat dissipation structure is arranged in the housing; and A guide structure, wherein the guide structure is arranged between the heat dissipation structure and the top wall, the guide structure and the side wall jointly define a guide air duct, and the guide air duct is connected to the air outlet; wherein the guide structure comprises a baffle and a side plate connected to the baffle, the side plate and the side wall jointly define the guide air duct, and the baffle and the side plate form a groove; The guide structure allows the heated high-temperature air to flow through the guide air duct to contact the side wall, thereby utilizing the low temperature of the side wall to cool the air, and finally the air has a lower temperature when flowing out of the air outlet, thereby reducing the temperature of the air outlet on the top of the shell; The electronic device further comprises a decorative piece connected to the housing, wherein the decorative piece covers the air outlet; A gap is formed between the decoration member and the housing.

2. The electronic device according to claim 1, characterized in that: The electronic device includes a heat source disposed in the housing, and the heat dissipation structure is in contact with the heat source.

3. The electronic device according to claim 2, characterized in that: The heat source includes a circuit board and a heating element arranged on the circuit board, and the heating element is in contact with the heat dissipation structure.

4. The electronic device according to claim 1, characterized in that: The shell is provided with an air inlet, and the air inlet is located at a side of the shell away from the air outlet.

5. The electronic device according to claim 4, characterized in that: The shell includes a bottom wall opposite to the top wall, and the bottom wall is provided with the air inlet.

Images