Encapsulated file inspection method, device, equipment and computer-readable storage medium

By comparing the pad information list of current packaging files and template packaging files, the problem of low efficiency and accuracy of packaging files in the existing technology is solved, and more efficient and accurate inspection is achieved, reducing the risk of human error rate and electrical connection errors.

CN113962170BActive Publication Date: 2025-05-13YUNMI HULIAN TECH (GUANGDONG) CO LTD
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Patent Information

Application Number
CN202010707753.1
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-07-21
Publication Date
2025-05-13
Estimated Expiration
2040-07-21

AI Technical Summary

Technical Problem

The prior art has low efficiency and accuracy in the inspection of printed circuit board (PCB) package files, and is prone to pad coordinate offset and identification cross-section errors, and lacks an effective inspection mechanism.

Method used

By obtaining the pad setting parameters of the current package file, the pad information of each pad is determined, the first pad information list is generated, and the second pad information list is generated based on the preset template package file and the pad setting parameters, and the comparison is performed to check the package file.

Benefits of technology

It improves the inspection efficiency and accuracy of packaging files, reduces the artificial error rate when building a new PCB package, improves the correctness of the PCB in the design stage, and avoids electrical connection errors caused by packaging design problems during production.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a packaging file inspection method, device, equipment and computer-readable storage medium, the method comprising: obtaining pad setting parameters of a current packaging file, and determining pad information of each pad in the current packaging file to obtain a first pad information list; generating a second pad information list based on a preset template packaging file and the pad setting parameters; comparing the first pad information list with the second pad information list to inspect the current packaging file. The present application effectively improves the inspection efficiency and accuracy of packaging files.
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Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board design, and in particular to a packaging file inspection method, device, equipment and computer-readable storage medium. Background Art

[0002] Printed Circuit Board (PCB) is one of the important components of the electronics industry. Almost every electronic device, from electronic watches and calculators to computers, communication electronic equipment, military weapon systems, etc., as long as there are electronic components such as integrated circuits, PCBs are used for electrical interconnection between them. The existing PCB package design method is relatively mature, but with the diversification of package design, it is often necessary to modify the newly created package file. Due to the high degree of adjustment freedom, after modifying the pad array, pad size and other data of the package file, the pad coordinates are prone to offset, and the pad identification is prone to cross errors. The existing technology has almost no effective inspection mechanism for this, and can only rely on human eye inspection. The inspection efficiency of the package file is low and it is very easy to make mistakes. Summary of the invention

[0003] The main purpose of the present application is to provide a packaged file inspection method, device, equipment and computer-readable storage medium, aiming to improve the efficiency and accuracy of inspecting packaged files.

[0004] In a first aspect, the present application provides a packaged file inspection method, the packaged file inspection method comprising the following steps:

[0005] Obtaining pad setting parameters of a current package file, and determining pad information of each pad in the current package file to obtain a first pad information list;

[0006] Generate a second pad information list based on a preset template packaging file and the pad setting parameters;

[0007] The first pad information list and the second pad information list are compared to check the current packaging file.

[0008] In a second aspect, the present application also provides a packaged document inspection device, which includes a processor, a memory, and a computer program stored in the memory and executable by the processor, wherein when the computer program is executed by the processor, the steps of the packaged document inspection method as described above are implemented.

[0009] In a third aspect, the present application also provides a computer device, comprising a processor, a memory, and a computer program stored in the memory and executable by the processor, wherein when the computer program is executed by the processor, the steps of the encapsulated file inspection method as described above are implemented.

[0010] In a fourth aspect, the present application further provides a computer-readable storage medium, on which a computer program is stored, wherein when the computer program is executed by a processor, the steps of the encapsulated file inspection method as described above are implemented.

[0011] The embodiments of the present application provide a packaging file inspection method, device, equipment and computer-readable storage medium. The embodiments of the present application obtain the pad setting parameters of the current packaging file and determine the pad information of each pad in the current packaging file to obtain a first pad information list, and then generate a second pad information list based on a preset template packaging file and the pad setting parameters, and then compare the first pad information list with the second pad information list to inspect the current packaging file. This can effectively improve the inspection efficiency and accuracy of the packaging file, significantly reduce the human error rate when creating a new PCB package, improve the correctness of the PCB in the design stage, and avoid electrical connection errors due to packaging design problems during PCB production. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0013] Figure 1 A schematic diagram of a process flow of a packaged file inspection method provided in an embodiment of the present application;

[0014] Figure 2 for Figure 1 A schematic flow chart of sub-steps of the encapsulation file checking method in FIG.

[0015] Figure 3 A schematic diagram of a pad array provided for implementing this embodiment;

[0016] Figure 4 A schematic diagram of another pad array provided in an embodiment of the present application;

[0017] Figure 5 for Figure 1 A schematic flow chart of sub-steps of the encapsulation file checking method in FIG.

[0018] Figure 6A schematic block diagram of a packaged document inspection device provided in an embodiment of the present application;

[0019] Figure 7 A schematic block diagram of the structure of a computer device provided in an embodiment of the present application.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor do they have to be executed in the order described. For example, some operations / steps can also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions. In addition, although the functional modules are divided in the device schematic, in some cases, the module division can be different from that in the device schematic.

[0023] The embodiments of the present application provide a packaged file inspection method, device, equipment and computer-readable storage medium. The packaged file inspection method can be applied to a terminal device or a server, and the terminal device can be an electronic device such as a mobile phone, a tablet computer, a laptop computer, a desktop computer, a personal digital assistant and a wearable device; the server can be a single server or a server cluster composed of multiple servers. The following explanation is given by taking the packaged file inspection method applied to a terminal device as an example.

[0024] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0025] Please refer to Figure 1 , Figure 1 A flowchart of a packaged file inspection method provided in an embodiment of the present application.

[0026] like Figure 1 As shown, the package file inspection method includes steps S101 to S103.

[0027] Step S101: Acquire pad setting parameters of a current packaging file, and determine pad information of each pad in the current packaging file to obtain a first pad information list.

[0028] Among them, the pad setting parameters include the number of pads, the pad spacing and the coordinates of one foot of the device, and the pad information includes the pad identification and coordinate information. The number of pads includes the horizontal number of pads (ME) and the vertical number of pads (MD), and the pad spacing includes the horizontal spacing of pads (ev) and the vertical spacing of pads (eh). Usually, the horizontal spacing of pads (ev) and the vertical spacing of pads (eh) can be the same.

[0029] It should be noted that a device can include multiple pads, which are arranged in an array, and some pads will be randomly omitted. The coordinates of the first pad of the device (or the first pin coordinates) entered when creating the current package file can be represented by A1 (0, 0). The coordinate information of other pads usually needs to be determined based on the coordinates of the first pad of the device.

[0030] In one embodiment, the terminal device is installed with PCB package design software, and the package file of the PCB can be opened or created through the package design software. The user can adjust, design or modify the package file of the opened or newly created PCB. After the user adjusts, designs or modifies the package file of the opened or newly created PCB, a package file check instruction can be issued by triggering a setting option in the package design software to detect whether each pad in the current package file is set correctly.

[0031] For example, when the user clicks the "Check" option in the "Settings" option menu bar in the package design software with the mouse, the package design software will issue an inspection instruction for the package file of the current interface to obtain the pad setting parameters of the current package file and perform subsequent operations. It can automatically detect whether the pads in the package file of the current interface are set correctly according to the above inspection instructions, which greatly improves the efficiency and accuracy of checking package files.

[0032] In one embodiment, determining the pad information of each pad in the current package file to obtain a first pad information list includes: obtaining raw data of multiple pads from the current package file; filtering the raw data of each pad to obtain a pad identifier and coordinate information of each pad; and generating a first pad information list based on the pad identifier and coordinate information of each pad. The pad identifier can be a number, a letter, and / or a symbol.

[0033] For example, the raw data of a pad is obtained from the current package file as follows:

[0034]

[0035]

[0036] The original data of the above-mentioned pad is screened to obtain the pad identification and coordinate information of the pad. Specifically, the pad identification, i.e., "pin number: B3", and the coordinate information, i.e., "location-xy: (0.65001.3000)", are extracted from the above-mentioned original data to obtain the screened original data, and the screened original data is used as the first pad information, and the first pad information is "pin number: B3; location-xy: (0.65001.3000)". At the same time, deleting useless information in the original data except the pad identification and coordinate information can reduce the amount of data, speed up program processing, and reduce the error rate.

[0037] Further, a first pad information list can be generated based on the pad identification and coordinate information of each pad. As described in the above example, by filtering the raw data of a pad, a first pad information can be obtained, and by filtering the raw data of multiple pads, multiple first pad information can be obtained, and a first pad information list is generated. For example, the first pad information list is shown in Table 1.

[0038] Table 1

[0039]

[0040]

[0041] Step S102: Generate a second pad information list based on a preset template packaging file and the pad setting parameters.

[0042] Among them, the preset template packaging file can be a ball grid array package (Ball Grid Array Package, BGA) file, a thin small outline package (Thin Small Outline Package, TSOP) file, a small outline integrated circuit package (Small Outline Integrated Circuit Package, SOIC) file, a four-sided lead flat package (Plastic Quad Flat Package, QFP) and the like. The template packaging file can be a file that comes with the packaging design software, or a file that the user pre-added to the packaging design software, which is not specifically limited in this embodiment.

[0043] In one embodiment, if Figure 2 As shown, step S102 includes: sub-step S1021 to sub-step S1022.

[0044] Sub-step S1021, obtaining a preset template packaging file, and determining pad identifiers and coordinate information of a plurality of pads that can be generated by the template packaging file according to the pad setting parameters.

[0045] After obtaining the pad setting parameters, the terminal device determines the pad identification and coordinate information of the multiple pads that can be generated by the template encapsulation file based on the preset template encapsulation file and the pad setting parameters. Alternatively, the terminal device inputs the pad setting parameters into the preset template encapsulation file so that the template encapsulation file generates multiple pads based on the pad setting parameters, and obtains the pad identification and coordinate information corresponding to each of the multiple pads.

[0046] In one embodiment, the pad setting parameters include the number of pads, coordinate axis identification, pad spacing and device pin coordinates; based on the pad setting parameters, the identification information and coordinate information of multiple pads that can be generated by the template packaging file are determined, including: based on the number of pads and coordinate axis identification, determining the pad identification of multiple pads that can be generated by the template packaging file; and, based on the pad spacing and device pin coordinates, determining the coordinate information of each pad.

[0047] The number of pads includes the horizontal number of pads (ME) and the vertical number of pads (MD), the coordinate axis identifier includes the unit identifier of the horizontal coordinate axis (X axis) of the pad and the unit identifier of the vertical coordinate axis (Y axis), and the pads are arranged in an array. The unit identifier of the horizontal coordinate axis of the pad or the vertical coordinate axis of the pad can be a number, a letter and / or a symbol, and the pad identifier can also be a number, a letter and / or a symbol.

[0048] For example, the number of pads in the horizontal direction is 31, and the number of pads in the vertical direction is 31. The unit identifier of the horizontal coordinate axis is represented by letters, such as AH, JN, AA-AH, AJ-AN, etc. or letter combinations. For the sake of foolproofing, letters such as I, O, S, X, and Z are not included. The unit identifier of the vertical coordinate axis is represented by numbers, such as 1 to 31. Based on this, the coordinate of one pin of the device can be set to the lower left corner of the pad array, such as Figure 3 As shown, the pad corresponding to the coordinates of one foot of the device is marked as A1, that is, pad A1 is located at the first horizontally and vertically in the pad array, then the pad marker of the first pad to the right of pad A1 is B1, the pad marker of the second pad to the right of pad A1 is C1, the pad marker of the first pad above pad A1 is A2, the pad marker of the second pad above pad A1 is A3, and so on. The thirty-first horizontally and the thirty-first vertically in the pad array is pad AL31.

[0049] It is understandable that the coordinates of one pin of the device can be set to be located at the geometric center of the pad array, or at the upper left corner, upper left corner, lower left corner, etc. of the pad array, and the coordinate axis identification can also be flexibly set by the user, which is not specifically limited in the embodiments of the present application. In some embodiments, the pads in the pad array may have defaults, such as Figure 4 The pad B2 in the figure is default, which does not affect the identification and naming of other pads such as pad B3 and pad C2.

[0050] In one embodiment, the pad spacing includes the pad lateral spacing (ev) and the pad vertical spacing (eh). According to the pad spacing and the device pin coordinates, the coordinate information of each pad can be determined. Figure 3 As shown, the coordinate of one pin of the device is A1 (x, y), and the first pad corresponding to the coordinate of one pin of the device is located at the lower left corner of the pad array, and the horizontal spacing of the pads is e x , the vertical spacing of the pads is e y , then the coordinates of the first pad B1 to the right of pad A1 are (x+e x , y), the coordinates of the second pad C1 to the right of pad A1 are (x+2e x , y); the coordinates of the first pad A2 above pad A1 are (x, y+e y ), the coordinates of the second pad above pad A1, which is labeled A3, are (x, y+2e y ), then the coordinates of the pad labeled An above pad A1 are {x, (n-1)*e y}, the coordinates of the pad labeled Bn above pad B1 are {(x+e x ), (y+(n-1)*e y )}, the coordinates of the pad labeled Cn above pad C1 are {(x+2e x ), (y+(n-1)*e y )}, and so on.

[0051] For example, when the coordinate of A1 is (0, 0), the horizontal spacing and vertical spacing of the pads are both e, then the coordinate of pad B1 is (e, 0), the coordinate of pad A2 is (0, e), the coordinate of pad B2 is (e, e), the coordinate of pad B3 is (e, 2e), the coordinate of Bn is {(0+e*1), (0+e*(n-1))}, and the coordinate of Cn is {(0+e*2), (0+e*(n-1))}.

[0052] Sub-step S1022: Generate the second pad information list according to the pad identifiers and coordinate information of the plurality of pads that can be generated by the template packaging file.

[0053] It should be noted that the pad identification and the coordinate information correspond one to one, that is, one pad identification corresponds to one coordinate information, for example, the pad coordinates corresponding to pad A2 are (0, e), and the pad coordinates corresponding to pad B3 are (e, 2e). According to each pad identification and its corresponding coordinate information, a second pad information list can be generated, and an example of the second pad information list is shown in Table 2.

[0054] Table 2

[0055] Second pad identification Second coordinate A1 0.0000 0.0000 B1 0.6500 0.0000 A3 0.0000 1.3000 B3 0.6500 1.3000 A2 0.0000 0.6500 B2 0.6500 0.6500 A6 0.0000 3.2500 B6 0.6500 3.2500 A5 0.0000 2.6000 B5 0.6500 2.6000 A4 0.0000 1.9500 B4 0.6500 1.9500 A8 0.0000 4.5500 B8 0.6500 4.5500 A7 0.0000 3.9000 B7 0.6500 3.9000 A10 0.0000 5.8500 B10 0.6500 5.8500 A9 0.0000 5.2000 B9 0.6500 5.2000

[0056] In one embodiment, raw data of multiple pads are obtained from a template encapsulation file; the raw data of each pad is screened to obtain a pad identifier and coordinate information of each pad; and a second pad information list is generated based on the pad identifier and coordinate information of each pad. It should be noted that the specific implementation of this embodiment can refer to the corresponding process of the aforementioned embodiment of generating the first pad information list, and this embodiment will not be repeated here.

[0057] Step S103: Compare the first pad information list and the second pad information list to check the current packaging file.

[0058] After obtaining the first pad information list and the second pad information list, by comparing the relevant data in the first pad information list and the second pad information list, it is possible to check whether the pad information of multiple pads in the current package file matches the pad information of multiple pads in the template package file, thereby being able to quickly check whether there are pads with incorrect parameters in the current package file, saving time and effort, and greatly improving the efficiency and accuracy of checking package files.

[0059] In one embodiment, if Figure 5 As shown, step S103 includes: sub-step S1031 to sub-step S1032.

[0060] Sub-step S1031: compare the multiple pad information in the first pad information list with the multiple pad information in the second pad information list to obtain a comparison result of the multiple pads in the first pad information list.

[0061] In one embodiment, multiple pad identifiers in a first pad information list are compared with multiple pad identifiers in a second pad information list to obtain a first comparison result; a target comparison result with consistent pad identifiers is obtained from the first comparison result, and the coordinate information corresponding to the first pad information list in each target comparison result is compared with the coordinate information corresponding to the second pad information list to obtain a second comparison result; and the comparison results of multiple pads in the first pad information list are determined through the first comparison result and the second comparison result.

[0062] Exemplarily, a plurality of first pad identifiers in the first pad information list are compared with a plurality of second pad identifiers in the second pad information list to determine whether there is an identifier identical to each first pad identifier in the first pad information list in the second pad information list, thereby obtaining a first comparison result. Wherein, the first comparison result includes a comparison result of each first pad identifier in the first pad information list, and the comparison result includes that the pad identifiers are consistent or inconsistent. It should be noted that if the comparison result is that the pad identifiers are consistent, it is used as the target comparison result. If the comparison result is that the pad identifiers are inconsistent, it indicates that the first pad identifier does not exist in the second pad information list, that is, the first pad identifier cannot be found in the template encapsulation file, indicating that the first pad identifier in the current encapsulation file (or the first pad information list) is wrong, for example, it may be a user naming error.

[0063] Alternatively, multiple first pad identifiers in the first pad information list are compared with multiple second pad identifiers in the second pad information list to determine whether there is an identifier in the first pad information list that is the same as each second pad identifier in the second pad information list, thereby obtaining a comparison result for each second pad identifier, i.e., a first comparison result. Among them, the comparison result of each second pad identifier includes a consistent pad identifier or an inconsistent pad identifier. If the pad identifiers are consistent, it means that the second pad identifier exists in the current package file (or the first pad information list). If the pad identifiers are inconsistent, it means that the second pad corresponding to the second pad identifier does not exist in the current package file (or the first pad information list), and there may be vacancies in the pad array of the current package file, which need to be checked.

[0064] In one embodiment, a target comparison result with a consistent pad identifier is obtained from the first comparison result, and the first coordinate information corresponding to the first pad identifier in each target comparison result is compared with the second coordinate information corresponding to the second pad identifier to determine whether each first coordinate information is consistent with the respective corresponding second coordinate information, thereby obtaining a plurality of comparison results, i.e., a second comparison result. Among them, the comparison result includes consistent coordinate information or inconsistent coordinate information. If the comparison result is consistent coordinate information, it means that the pad information (pad identifier and coordinate information) of the pad in the current encapsulation file (or the first pad information list) is correct. If the comparison result is inconsistent coordinate information, it means that the coordinate information of the pad corresponding to the first pad identifier in the current encapsulation file (or the first pad information list) is wrong, for example, the pad position is slightly offset.

[0065] Further, the comparison results of the plurality of pads in the first pad information list can be determined by the first comparison result and the second comparison result, wherein the comparison result of each pad can include four types, namely, comparison correct, pad coordinate offset, pad identification error, and pad array vacancy to be checked.

[0066] It should be noted that when comparing the multiple pad information in the first pad information list with the multiple pad information in the second pad information list, the comparison method that can be used includes the vlookup function, or other search algorithms to traverse the first pad information list and the second pad information list, so as to find the pad identification and coordinate information of the current package file and the template package file. The search algorithm may include a sequential search algorithm, a binary search algorithm, an interpolation search algorithm, a tree table search algorithm, etc., which is not specifically limited in this embodiment.

[0067] For example, by comparing the first pad information list shown in Table 1 with the first pad information list shown in Table 2, the first pad identifier in Table 1 that is consistent with the second pad identifier in Table 2 can be found, and then the coordinate information corresponding to the first pad identifier with the consistent identifier is compared with the coordinate information corresponding to the second pad identifier in Table 2 to determine the pad B2 with the consistent identifier but inconsistent coordinate information, thereby realizing the inspection of the current packaging file.

[0068] Sub-step S1032: output the comparison results of the multiple pads in the first pad information list to obtain the inspection result of the current packaging file.

[0069] In one embodiment, the terminal device displays the comparison results of multiple pads in the first pad information list, and the comparison results can be expressed by text, pattern and / or color. For example, the package design software includes an information output box, in which the text comparison results of multiple pads in the first pad information list are displayed; or, according to the comparison results of multiple pads in the first pad information list, the corresponding pads are adjusted in pattern and color according to different patterns and colors, and the comparison results represented by different patterns or colors are marked, so that the user can easily determine the comparison result corresponding to the pad by adjusting the pattern and color of the pad.

[0070] In one embodiment, the comparison results of each pad may include four types, namely, correct comparison, pad coordinate offset, pad identification error, and pad array vacancy to be checked. Determine the comparison results of multiple pads other than the correct comparison, obtain multiple candidate comparison results, and output the multiple candidate comparison results. The method of outputting multiple candidate comparison results is, for example, to render corresponding pads of corresponding types in three different colors, for example, rendering pads with offset pad coordinates as red, rendering pads with incorrect pad identification as yellow, and rendering pads with pad array vacancy to be checked as blue.

[0071] In one embodiment, the pad setting parameters of multiple current packaging files are obtained, and the pad information of the pads in each current packaging file is determined to obtain multiple first pad information lists; based on a preset template packaging file and the multiple pad setting parameters, multiple second pad information lists are generated; each first pad information list is compared with its corresponding second pad information list to check each current packaging file, which can greatly improve the speed and accuracy of checking batch packaging files.

[0072] The package file inspection method provided in the above embodiment obtains the pad setting parameters of the current package file and determines the pad information of each pad in the current package file to obtain a first pad information list, and then generates a second pad information list based on a preset template package file and the pad setting parameters, and then compares the first pad information list with the second pad information list to check the current package file. This can effectively improve the inspection efficiency and accuracy of the package file, significantly reduce the human error rate when creating a new PCB package, improve the correctness of the PCB in the design stage, and avoid electrical connection errors due to package design problems during PCB production.

[0073] Please refer to Figure 6 , Figure 6 A schematic block diagram of a packaged document inspection device provided in an embodiment of the present application.

[0074] like Figure 6 As shown, the packaged document inspection device 200 includes a processor 202 and a memory 203 connected via a system bus 201, wherein the memory 203 may include a non-volatile storage medium and an internal memory.

[0075] The non-volatile storage medium can store a computer program. The computer program includes program instructions, and when the program instructions are executed, the processor 202 can execute any smart device startup method.

[0076] The processor 202 is used to provide computing and control capabilities to support the operation of the entire packaged document inspection device.

[0077] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor 202, the processor 202 can execute any smart device startup method.

[0078] In one embodiment, the packaged file inspection device 200 further includes a communication interface, which is used for communication, such as sending a boot instruction. Those skilled in the art will appreciate that Figure 6The structure shown in the figure is merely a block diagram of a portion of the structure related to the present application scheme, and does not constitute a limitation on the packaged document inspection device to which the present application scheme is applied. The specific packaged document inspection device may include more or fewer components than those shown in the figure, or combine certain components, or have a different component arrangement.

[0079] It should be understood that the processor 202 may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor, or the processor 202 may also be any conventional processor, etc.

[0080] It should be noted that those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the packaged document inspection device described above can refer to the corresponding process in the aforementioned packaged document inspection method embodiment, and will not be repeated here.

[0081] See also Figure 7 , Figure 7 A schematic block diagram of the structure of a computer device provided in an embodiment of the present application. The computer device may be a server or a terminal device.

[0082] like Figure 7 As shown, the computer device includes a processor, a memory, and a network interface connected via a system bus, wherein the memory may include a non-volatile storage medium and an internal memory.

[0083] The non-volatile storage medium can store an operating system and a computer program. The computer program includes program instructions, and when the program instructions are executed, the processor can execute any package file inspection method.

[0084] The processor is used to provide computing and control capabilities and support the operation of the entire computer equipment.

[0085] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor, the processor can execute any package file checking method.

[0086] The network interface is used for network communication, such as sending assigned tasks, etc. Those skilled in the art will understand that Figure 7 The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the computer device to which the solution of the present application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine certain components, or have a different arrangement of components.

[0087] It should be understood that the processor may be a central processing unit (CPU), and the processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0088] In one embodiment, the processor is used to run a computer program stored in the memory to implement the following steps:

[0089] Obtaining pad setting parameters of a current package file, and determining pad information of each pad in the current package file to obtain a first pad information list;

[0090] Generate a second pad information list based on a preset template packaging file and the pad setting parameters;

[0091] The first pad information list and the second pad information list are compared to check the current packaging file.

[0092] In one embodiment, the pad setting parameters include the number of pads, the pad spacing and the coordinates of a device pin, and the pad information includes pad identification and coordinate information.

[0093] In one embodiment, when the processor implements determining the pad information of each pad in the current package file to obtain the first pad information list, it is used to implement:

[0094] Acquire original data of multiple pads from the current package file;

[0095] Screening the original data of each of the pads to obtain pad identification and coordinate information of each of the pads;

[0096] The first pad information list is generated based on the pad identification and coordinate information of each of the pads.

[0097] In one embodiment, when the processor generates the second pad information list based on the preset template packaging file and the pad setting parameters, it is used to implement:

[0098] Obtaining a preset template packaging file, and determining pad identifiers and coordinate information of a plurality of pads that can be generated by the template packaging file according to the pad setting parameters;

[0099] The second pad information list is generated according to pad identifiers and coordinate information of a plurality of pads that can be generated by the template packaging file.

[0100] In one embodiment, the pad setting parameters include the number of pads, coordinate axis identification, pad spacing and device one-pin coordinates; when the processor implements the step of determining the identification information and coordinate information of multiple pads that can be generated by the template packaging file according to the pad setting parameters, it is used to implement:

[0101] Determining pad identifiers of a plurality of pads that can be generated by the template packaging file according to the number of pads and the coordinate axis identifiers; and

[0102] The coordinate information of each pad is determined according to the pad spacing and the coordinates of a pin of the device.

[0103] In one embodiment, when the processor implements the comparison of the first pad information list and the second pad information list to check the current packaging file, it is used to implement:

[0104] Comparing the plurality of pad information in the first pad information list with the plurality of pad information in the second pad information list to obtain a comparison result of the plurality of pads in the first pad information list;

[0105] Output the comparison results of the multiple pads in the first pad information list to obtain the inspection result of the current packaging file.

[0106] In one embodiment, when the processor implements the step of comparing the plurality of pad information in the first pad information list with the plurality of pad information in the second pad information list to obtain a comparison result of the plurality of pads in the first pad information list, the processor is used to implement:

[0107] Compare the plurality of pad identifiers in the first pad information list with the plurality of pad identifiers in the second pad information list to obtain a first comparison result;

[0108] Obtain a target comparison result with consistent pad identifiers from the first comparison result, and compare the coordinate information corresponding to the first pad information list in each of the target comparison results with the coordinate information corresponding to the second pad information list to obtain a second comparison result;

[0109] The comparison results of the plurality of pads in the first pad information list are determined according to the first comparison result and the second comparison result.

[0110] It should be noted that those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the computer device described above can refer to the corresponding process in the aforementioned encapsulation file inspection method embodiment, and will not be repeated here.

[0111] An embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. The computer program includes program instructions. The method implemented when the program instructions are executed can refer to the various embodiments of the encapsulated file inspection method of the present application.

[0112] The computer-readable storage medium may be an internal storage unit of the computer device described in the foregoing embodiment, such as a hard disk or memory of the computer device. The computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, a smart memory card (SmartMedia Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc., equipped on the computer device.

[0113] It should be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0114] It should also be understood that the term "and / or" used in the specification of this application and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, including these combinations. It should be noted that, in this article, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "including a..." does not exclude the presence of other identical elements in the process, method, article or system including the element.

[0115] The serial numbers of the embodiments of the present application are for description only and do not represent the advantages and disadvantages of the embodiments. The above description is only a specific implementation mode of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A packaging file inspection method, characterized in that: include: Obtaining pad setting parameters of the current package file, and determining pad information of each pad in the current package file to obtain a first pad information list; wherein the pad setting parameters include the number of pads, the pad spacing, and the coordinates of a device pin, and the pad information includes pad identification and coordinate information; Obtain a preset template encapsulation file, and determine pad identifiers and coordinate information of a plurality of pads that can be generated by the template encapsulation file according to the pad setting parameters; generate a second pad information list according to the pad identifiers and coordinate information of the plurality of pads that can be generated by the template encapsulation file; The first pad information list and the second pad information list are compared to check the current packaging file.

2. The packaged file inspection method according to claim 1, characterized in that: The determining the pad information of each pad in the current package file to obtain a first pad information list includes: Acquire original data of multiple pads from the current package file; Screening the original data of each of the pads to obtain pad identification and coordinate information of each of the pads; The first pad information list is generated based on the pad identification and coordinate information of each of the pads.

3. The encapsulated file inspection method according to claim 1, characterized in that: The pad setting parameters include the number of pads, coordinate axis identification, pad spacing and device pin coordinates; the identification information and coordinate information of multiple pads that can be generated by the template packaging file are determined according to the pad setting parameters, including: Determining pad identifiers of a plurality of pads that can be generated by the template packaging file according to the number of pads and the coordinate axis identifiers; and The coordinate information of each pad is determined according to the pad spacing and the coordinates of a pin of the device.

4. The encapsulated document inspection method according to any one of claims 1 to 3, characterized in that: The comparing the first pad information list with the second pad information list to check the current packaging file includes: Comparing the plurality of pad information in the first pad information list with the plurality of pad information in the second pad information list to obtain a comparison result of the plurality of pads in the first pad information list; Output the comparison results of the multiple pads in the first pad information list to obtain the inspection result of the current packaging file.

5. The encapsulated document inspection method according to claim 4, characterized in that: The comparing the plurality of pad information in the first pad information list with the plurality of pad information in the second pad information list to obtain a comparison result of the plurality of pads in the first pad information list includes: Compare the plurality of pad identifiers in the first pad information list with the plurality of pad identifiers in the second pad information list to obtain a first comparison result; Obtain a target comparison result with consistent pad identifiers from the first comparison result, and compare the coordinate information corresponding to the first pad information list in each of the target comparison results with the coordinate information corresponding to the second pad information list to obtain a second comparison result; The comparison results of the plurality of pads in the first pad information list are determined according to the first comparison result and the second comparison result.

6. A packaged document inspection device, characterized in that: The packaged document inspection device comprises a processor, a memory, and a computer program stored in the memory and executable by the processor, wherein when the computer program is executed by the processor, the steps of the packaged document inspection method according to any one of claims 1 to 5 are implemented.

7. A computer device, characterized in that: The computer device comprises a processor, a memory, and a computer program stored in the memory and executable by the processor, wherein when the computer program is executed by the processor, the steps of the packaged document inspection method according to any one of claims 1 to 5 are implemented.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps of the encapsulated document inspection method according to any one of claims 1 to 5 are implemented.

Citation Information

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