A splicing method, device, electronic device and storage medium for a triangular chip

Abstract

The present application provides a splicing method, device, electronic device and storage medium for a triangular chip. The splicing method includes: determining the row where the to-be-spliced marking point is located based on the serial number of the already-spliced marking point; determining the linear regression equation corresponding to the row where the to-be-spliced marking point is located according to the mapping relationship between the preset row position and the linear regression equation; and determining the position coordinates of the to-be-spliced marking point according to the position coordinates of the already-spliced marking point, the preset parameters and the linear regression equation. By adopting the technical solution provided by the present application, when splicing the to-be-spliced chip, the linear regression equation can be determined through the position of the already-spliced chip, and the next splicing position can be determined according to the linear regression equation, so that the chips in each spliced row always remain on their respective fitting straight lines, ensuring the accuracy of chip splicing and improving the yield.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular, to a method, device, electronic device and storage medium for splicing a character 'pin'-shaped chip. Background Art

[0002] In the actual chip splicing process, due to various factors such as personnel and equipment, the actual positions of the chips solidified in the previous process are not exactly equal to the ideal positions obtained through pre-analysis and optimization calculations. Moreover, with the development of the splicing process, the position errors of each chip will be coupled with each other, continuously accumulate and spread, becoming a kind of dynamic error, which needs to be compensated in real time.

[0003] Currently, chip splicing mainly relies on manual operation, with large randomness and low precision. At the same time, the splicing of infrared detectors has the characteristics of irreversibility, high cost and high risk, making it difficult to ensure the splicing precision and yield. Therefore, how to improve the precision and yield of chip splicing has become an urgent problem to be solved. Summary of the Invention

[0004] In view of this, the purpose of the present application is to provide a method, device, electronic device and storage medium for splicing a character 'pin'-shaped chip, which can determine a linear regression equation based on the positions of the already spliced chips when splicing the chips to be spliced, and determine the next splicing position according to the linear regression equation, so that the chips in each row of the splicing always remain on their respective fitting straight lines, ensuring the precision of chip splicing and improving the yield.

[0005] The present application mainly includes the following aspects:

[0006] In the first aspect, an embodiment of the present application provides a method for splicing a character 'pin'-shaped chip, and the splicing method includes:

[0007] Based on the serial numbers of the already spliced marking points, determine the row where the marking point to be spliced is located; wherein, the already spliced marking points are the splicing marking points whose splicing order is connected to that of the marking point to be spliced and whose splicing order is before the marking point to be spliced;

[0008] According to the mapping relationship between the row position and the linear regression equation preset, determine the linear regression equation corresponding to the row where the marking point to be spliced is located;

[0009] According to the position coordinates of the already spliced marking points, preset parameters and the linear regression equation, determine the position coordinates of the marking point to be spliced.

[0010] Further, the determining, based on the serial numbers of the already spliced marking points, the row where the marking point to be spliced is located includes:

[0011] Obtain the total marking serial number of the already spliced marking points and the sub-marking serial number of the row where they are located;

[0012] Determine the row where the spliced marker point is located according to the parity property of the sub-marker serial number and the preset mapping relationship between the sub-marker serial number and the total marker serial number;

[0013] Determine the row where the marker point to be spliced is located according to the row where the spliced marker point is located.

[0014] Further, determine the linear regression equation corresponding to the row position through the following steps:

[0015] According to the row where the spliced marker point is located, store the position coordinates of the spliced marker point into the array of the corresponding row;

[0016] Determine the linear regression equation corresponding to each row according to the number of position coordinates of the spliced marker points in the array of the corresponding row, wherein the array stores the historical position coordinates corresponding to each historical spliced marker point consistent with the row where the spliced marker point is located.

[0017] Further, the step of determining the linear regression equation corresponding to each row according to the number of position coordinates of the spliced marker points in the array of the corresponding row includes:

[0018] If the number of position coordinates of the spliced marker points in the array of the corresponding row is less than the preset threshold, obtain the linear regression equation by the two-point form;

[0019] If the number of position coordinates of the spliced marker points in the array of the corresponding row is not less than the preset threshold, obtain the linear regression equation by the least squares method.

[0020] Further, the step of determining the position coordinates of the marker point to be spliced according to the position coordinates of the spliced marker point, the preset parameter, and the linear regression equation includes:

[0021] Determine the horizontal position of the marker point to be spliced according to the position coordinates of the spliced marker point and the preset parameter;

[0022] Substitute the horizontal position into the linear regression equation corresponding to the row where the marker point to be spliced is located to obtain the vertical position of the marker point to be spliced;

[0023] Determine the position coordinates of the marker point to be spliced according to the horizontal position and the vertical position of the marker point to be spliced.

[0024] Further, before determining the row where the marker point to be spliced is located based on the serial number of the spliced marker point, the splicing method further includes:

[0025] Obtain the center point of the monitoring image and two marker points of the chip to be spliced, and align one marker point of the chip to be spliced with the center point of the monitoring image;

[0026] Obtain the position of the marked point after alignment and determine it as the position of the spliced marked point;

[0027] Obtain the serial number of the spliced marked point according to the position of the spliced marked point.

[0028] Further, after determining the position coordinates of the to-be-spliced marked point according to the position coordinates of the spliced marked point, preset parameters, and the linear regression equation, the splicing method further includes:

[0029] After determining the position coordinates of the to-be-spliced marked point, move the center point of the monitoring image to the position coordinates of the to-be-spliced marked point;

[0030] Adjust the position coordinates of the to-be-spliced marked point, align the to-be-spliced marked point with the center point of the monitoring image, and determine the aligned to-be-spliced marked point as the spliced marked point.

[0031] In a second aspect, an embodiment of the present application further provides a splicing device for a triangular chip, and the splicing device includes:

[0032] A first processing module, configured to determine the row where the to-be-spliced marked point is located based on the serial number of the spliced marked point; wherein, the spliced marked point is a splicing marked point whose splicing order is connected to that of the to-be-spliced marked point and whose splicing order is before the to-be-spliced marked point;

[0033] A second processing module, configured to determine the linear regression equation corresponding to the row where the to-be-spliced marked point is located according to the mapping relationship between the preset row position and the linear regression equation;

[0034] A determination module, configured to determine the position coordinates of the to-be-spliced marked point according to the position coordinates of the spliced marked point, preset parameters, and the linear regression equation.

[0035] In a third aspect, an embodiment of the present application further provides an electronic device, including: a processor, a memory, and a bus. The memory stores machine-readable instructions executable by the processor. When the electronic device runs, the processor communicates with the memory through the bus. When the machine-readable instructions are executed by the processor, the steps of the splicing method for the triangular chip as described above are executed.

[0036] In a fourth aspect, an embodiment of the present application further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is run by a processor, the steps of the splicing method for the triangular chip as described above are executed.

[0037] A method, device, electronic device and storage medium for splicing a triangular chip provided by an embodiment of the present application determine the row where a to-be-spliced marking point is located based on the serial number of the already-spliced marking point; wherein, the already-spliced marking point is a splicing marking point whose splicing order is connected to that of the to-be-spliced marking point and is before the to-be-spliced marking point in the splicing order; determine the linear regression equation corresponding to the row where the to-be-spliced marking point is located according to the mapping relationship between the preset row position and the linear regression equation; and determine the position coordinates of the to-be-spliced marking point according to the position coordinates of the already-spliced marking point, the preset parameters and the linear regression equation.

[0038] In this way, by adopting the technical solution provided by the present application, the linear regression equation can be determined based on the position of the already-spliced chip when splicing the to-be-spliced chip, and the next splicing position can be determined according to the linear regression equation, so that the chips in each spliced row are always kept on their respective fitting straight lines, ensuring the accuracy of chip splicing and improving the yield.

[0039] To make the above objects, features and advantages of the present application more obvious and understandable, the following specific preferred embodiments are given, and detailed descriptions are made in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] To more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0041] Figure 1 Shows a flowchart of a method for splicing a triangular chip provided by an embodiment of the present application;

[0042] Figure 2 Shows a flowchart of another method for splicing a triangular chip provided by an embodiment of the present application;

[0043] Figure 3 Shows a schematic diagram of the splicing effect of a triangular chip provided by an embodiment of the present application;

[0044] Figure 4 Shows a schematic diagram of the structure of a device for splicing a triangular chip provided by an embodiment of the present application;

[0045] Figure 5 Shows a schematic diagram of the structure of another device for splicing a triangular chip provided by an embodiment of the present application;

[0046] Figure 6 Shows a schematic diagram of the structure of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0047] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of this application. It should be understood that the accompanying drawings in this application are only for the purposes of illustration and description, and are not used to limit the protection scope of this application. In addition, it should be understood that the schematic drawings are not drawn to scale. The flowcharts used in this application illustrate the operations implemented according to some embodiments of this application. It should be understood that the operations in the flowchart may not be implemented in sequence, and steps without logical context relationships may be reversed or implemented simultaneously. In addition, those skilled in the art can add one or more other operations to the flowchart or remove one or more operations from the flowchart under the guidance of the content of this application.

[0048] In addition, the described embodiments are only some of the embodiments of this application, rather than all of the embodiments. The components of the embodiments of this application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application that is required to be protected, but only represents the selected embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of this application.

[0049] To enable those skilled in the art to use the content of this application, the following implementation manners are given in combination with a specific application scenario, namely, the splicing of "pin-shaped chips". For those skilled in the art, the general principles defined here can be applied to other embodiments and application scenarios without departing from the spirit and scope of this application.

[0050] The following methods, devices, electronic devices, or computer-readable storage media in the embodiments of this application can be applied to any scenario that requires the splicing of pin-shaped chips. The embodiments of this application do not limit the specific application scenarios. Any solution that uses the method, device, electronic device, and storage media for splicing a pin-shaped chip provided by the embodiments of this application falls within the protection scope of this application.

[0051] It should be noted that the detection distance required by the spaceborne infrared imaging system is extremely far, and at the same time, the imaging system is required to have large field of view and high-resolution performance. This requires that the spaceborne infrared focal plane detector must be a very large-scale or very long linear array detector assembly. Due to limitations in materials and processes, it is currently difficult for infrared focal plane detectors to meet the requirements of space applications in terms of array scale. Therefore, a precise splicing method must be adopted to combine multiple infrared focal plane detector chips into a single assembly for use. On the other hand, space remote sensing requires that infrared focal plane detectors have the ability to perform multi-spectral detection. Therefore, infrared focal plane detectors with different spectral bands must be spliced together for application. The chips to be spliced all have geometric parameter discreteness. Therefore, for a given number of chips, an optimal layout needs to be carried out to determine the best arrangement and combination method to improve the overall splicing accuracy. During the actual splicing process, due to various factors such as personnel and equipment, the actual positions of the chips solidified in the previous process are not exactly equal to the ideal positions obtained through pre-analysis and optimization calculations. Moreover, with the development of the splicing process, the position errors of each chip will couple with each other, continuously accumulate and propagate, becoming a dynamic error that needs to be compensated in real time.

[0052] Currently, chip splicing mainly relies on manual operation, which has a large degree of randomness and low accuracy. At the same time, infrared detector splicing has the characteristics of irreversibility, high cost, and high risk, making it difficult to ensure the splicing accuracy and yield. Therefore, how to improve the splicing accuracy and yield of chips has become an urgent problem to be solved.

[0053] Based on this, the present application proposes a splicing method, device, electronic device, and storage medium for L-shaped chips. Based on the serial numbers of the already spliced marking points, the row where the marking point to be spliced is located is determined; wherein, the already spliced marking points are the splicing marking points that are connected to the splicing order of the marking point to be spliced and whose splicing order is before the marking point to be spliced; according to the mapping relationship between the preset row position and the linear regression equation, the linear regression equation corresponding to the row where the marking point to be spliced is located is determined; the position coordinates of the marking point to be spliced are determined according to the position coordinates of the already spliced marking points, the preset parameters, and the linear regression equation. By using the technical solution provided by the present application, the linear regression equation can be determined through the positions of the already spliced chips when splicing the chips to be spliced, and the next splicing position can be determined according to the linear regression equation, so that the chips in each row of the splicing always remain on their respective fitting straight lines, ensuring the splicing accuracy of the chips, not only improving the stability and production efficiency of chip splicing, but also increasing the yield.

[0054] To facilitate the understanding of the present application, the technical solutions provided by the present application will be described in detail below in conjunction with specific embodiments.

[0055] Please refer to Figure 1 , Figure 1The flowchart of a method for splicing a triangular chip provided by an embodiment of the present application. As Figure 1 shown, the splicing method includes:

[0056] S101. Determine the row where the to-be-spliced marking point is located based on the serial number of the already-spliced marking point;

[0057] In this step, the already-spliced marking point is the splicing marking point whose splicing order is connected to that of the to-be-spliced marking point and whose splicing order is before the to-be-spliced marking point; please refer to Figure 2 , Figure 2 The flowchart of another method for splicing a triangular chip provided by an embodiment of the present application. As Figure 2 shown, the splicing method includes:

[0058] S201. Obtain the total marking serial number of the already-spliced marking point and the sub-marking serial number of the row where it is located;

[0059] In this step, the triangular splicing process refers to the process of splicing two rows of chips. Among them, each chip includes multiple marking points in the shape of lightning bolts. Two marking points selected for splicing are numbered in sequence. The distances between the two marking points on all the chips to be spliced are fixed and equal. Each marking point on the chip has two numbers. One is numbered in sequence from left to right or from right to left for each row, and this number is determined as the sub-marking serial number of the row where it is located; the other is to regard the two rows as a whole and number the whole in sequence from left to right or from right to left without distinguishing rows, and this number is determined as the total marking serial number; obtain the total marking serial number of the already-spliced marking point and the sub-marking serial number of the row where it is located. Exemplarily, please refer to Figure 3 , Figure 3 The schematic diagram of the splicing effect of a triangular chip provided by an embodiment of the present application. As Figure 3 shown, it is the splicing of two rows of six chips. The circled numbers above the chips are the sub-marking serial numbers of the spliced chips. For example, the numbers ①, ②, ③, ④, etc. above the first-row chips are the sub-marking serial numbers of the first-row spliced chips, and the numbers ①, ②, ③, ④, etc. above the second-row chips are the sub-marking serial numbers of the second-row spliced chips; the numbers below the chips are the total marking serial numbers of the spliced chips. For example, the numbers 1, 2, 3, 4, etc. below the chips are the total marking serial numbers of the two rows of spliced chips.

[0060] S202. Determine the row where the already-spliced marking point is located according to the parity property of the sub-marking serial number and the preset mapping relationship between the sub-marking serial number and the total marking serial number;

[0061] In this step, since there are two marked position points on each chip, the distribution of the marked points on the two rows of chips is a piecewise sequence. Among them, the mapping relationship between the preset sub-marked serial number and the total marked serial number includes:

[0062] If the sub-marked serial number of the spliced marked point in the first row is odd, the row number of the spliced marked point that satisfies the total marked serial number equal to the difference between twice the sub-marked serial number and 1 is determined as the first row;

[0063] If the sub-marked serial number of the spliced marked point in the first row is even, the row number of the spliced marked point that satisfies the total marked serial number equal to the difference between twice the sub-marked serial number and 2 is determined as the first row;

[0064] If the sub-marked serial number of the spliced marked point in the second row is odd, the row number of the spliced marked point that satisfies the total marked serial number equal to the sum of twice the sub-marked serial number and 1 is determined as the second row;

[0065] If the sub-marked serial number of the spliced marked point in the second row is even, the row number of the spliced marked point that satisfies the total marked serial number equal to twice the sub-marked serial number is determined as the second row.

[0066] Exemplarily, taking m as the serial number of the total marked point and n 1 as the serial number of the chip marked point on the first row, and n 2 as the serial number of the chip marked point on the second row, then the general term formula for the distribution of the marked points on the chips in the first row is m = 2n 1 -1 (n is odd), m = 2n 1 -2 (n is even); then the general term formula for the distribution of the marked points on the chips in the second row is m = 2n 2 +1 (n is odd), m = 2n 2 (n is even). For example, as Figure 3 shown, taking the left marked point of the middle chip in the first row as an example, the sub-marked serial number n 1 = 3 of the spliced marked point of this chip is odd, and the total marked serial number m satisfies m = 2n 1 -1 = 5, so the spliced marked point of this chip belongs to the first row.

[0067] S203. Determine the row where the to-be-spliced marked point is located according to the row where the spliced marked point is located.

[0068] In this step, the row where the stitched marker points are located is determined through step 202. Since the next chip after assembling one chip in the triangular chip pattern is always in another row, it is determined whether the stitched marker point is the first marker point on this chip. If so, the marker point to be stitched is the second marker point on this chip, and thus the row where the marker point to be stitched is located is the same as the row where the stitched marker point is located. If not, the stitched marker point is the second marker point on this chip, and the marker point to be stitched is the first marker point on the next chip, so the row where the marker point to be stitched is located is the other row of the row where the stitched marker point is located.

[0069] Exemplarily, as Figure 3 shown, taking the middle chip in the second row as an example, the marker point with the total marker serial number 7 is the stitched marker point and is the first marker point on this chip. The marker point to be stitched is the marker point with the total marker serial number 8 and is the second marker point on this chip. Therefore, the row where the marker point to be stitched is located is the same as the row where the stitched marker point is located, which belongs to the second row. Taking the middle chip in the second row as an example, the marker point with the total marker serial number 8 is the stitched marker point and is the second marker point on this chip, belonging to the second row. The marker point to be stitched is the marker point with the total marker serial number 9 and is the first marker point on the next chip. So the row where the marker point to be stitched is located is the other row of the row where the stitched marker point is located, which is the second row.

[0070] S102. Determine the linear regression equation corresponding to the row where the marker point to be stitched is located according to the mapping relationship between the preset row position and the linear regression equation.

[0071] In this step, the linear regression equation corresponding to the row position is determined through the following steps:

[0072] A. According to the row where the stitched marker point is located, store the position coordinates of the stitched marker point into the array corresponding to the row.

[0073] In this step, for the triangular chip splicing where two rows of chips are spliced, the position coordinates of the stitched marker points on each row of chips are stored in different arrays. For example, if the stitched marker point is in the first row, its position coordinates are stored in the first array; if the stitched marker point is in the second row, its position coordinates are stored in the second array.

[0074] B. Determine the linear regression equation corresponding to each row according to the number of position coordinates of the stitched marker points in the array corresponding to the row, where the array stores the historical position coordinates corresponding to each historical stitched marker point that is consistent with the row where the stitched marker point is located.

[0075] In this step, the historical position coordinates stored in the array to which each row belongs are the position coordinates of the spliced marker points that have been spliced previously. The steps of determining the linear regression equation corresponding to each row by judging the number of the position coordinates of the spliced marker points in the array include:

[0076] a. When the number of the position coordinates of the spliced marker points in the array corresponding to the row is less than the preset threshold, the two-point form is used to obtain the linear regression equation;

[0077] In this step, by way of example, when the number of the position coordinates of the spliced marker points in the first array is less than 3, the two-point form is used to obtain the linear regression equation; for example, when the number of the position coordinates of the spliced marker points in the first array is 2, that is, the straight-line equation of the chip splicing in the row to which the array belongs is determined as the first-row linear regression equation by using the two-point form of the straight-line equation. For another example, when the number of the position coordinates of the spliced marker points in the second array is 2, that is, the straight-line equation of the chip splicing in the row to which the array belongs is determined as the second-row linear regression equation by using the two-point form of the straight-line equation.

[0078] b. When the number of the position coordinates of the spliced marker points in the array corresponding to the row is not less than the preset threshold, the least squares method is used to obtain the linear regression equation.

[0079] In this step, by way of example, when the number of the position coordinates of the spliced marker points in the first array is greater than or equal to 3, the least squares method is used to obtain the linear regression equation; for example, when the number of the position coordinates of the spliced marker points in the first array is 4, that is, the straight-line equation of the chip splicing in the row to which the array belongs is determined as the first-row linear regression equation by fitting with the least squares method. The calculation of obtaining the linear regression equation for another array is the same as the above process.

[0080] S103. Determine the position coordinates of the marker points to be spliced according to the position coordinates of the spliced marker points, the preset parameters and the linear regression equation.

[0081] In this step, the preset parameters include: the vertical distance between two rows of chips, the horizontal distance between adjacent chips, and the distance between two marker points on the chip; among them, the vertical distance between two rows of chips is the vertical distance between the marker points of the first row and the marker points of the second row; the horizontal distance between adjacent chips is the horizontal distance between the first marker point of the previous chip and the first marker point of the next chip or the horizontal distance between the second marker point of the previous chip and the second marker point of the next chip; the distance between two marker points on the chip is the horizontal distance between two marker points on the same chip; the specific steps of determining the position coordinates of the marker points to be spliced include:

[0082] A. Determine the horizontal position of the marker points to be spliced according to the position coordinates of the spliced marker points and the preset parameters;

[0083] In this step, the horizontal position of the to-be-spliced marker point is determined according to the horizontal position coordinate among the position coordinates of the already-spliced marker points and the preset parameters. In step S203, it has been determined whether the already-spliced marker point is the first marker point of the chip. If so, the preset parameter is the distance between two marker points on the chip. At this time, the horizontal position of the to-be-spliced marker point is the sum of the horizontal position coordinate in the position coordinates of the already-spliced marker point and the distance between two marker points on the chip. If the already-spliced marker point is the second marker point of the chip, the preset parameters are the horizontal distance between adjacent chips and the distance between two marker points on the chip. At this time, the horizontal position of the to-be-spliced marker point is the difference between the sum of the horizontal position coordinate in the position coordinates of the already-spliced marker point and the horizontal distance between adjacent chips and the distance between two marker points on the chip.

[0084] Exemplarily, as Figure 3 shown, the already-spliced marker point 4 (total marker serial number) is the second marker point on the chip. First, calculate the sum of the horizontal position coordinate of the already-spliced marker point 4 (total marker serial number) and the horizontal distance between adjacent chips (for example, the horizontal distance between total marker point 2 and total marker point 4), that is, obtain the horizontal position of the to-be-spliced marker point 6 (total marker serial number), and then subtract the distance between two marker points on the same chip (for example, the horizontal distance between total marker point 3 and total marker point 4). The obtained result is the horizontal position of the to-be-spliced marker point 5 (total marker serial number).

[0085] B. Substitute the horizontal position into the linear regression equation corresponding to the row where the to-be-spliced marker point is located to obtain the vertical position of the to-be-spliced marker point;

[0086] In this step, through step 203, the row where the to-be-spliced marker point is located has been obtained. Substituting the horizontal position of the to-be-spliced marker point obtained in step A of step 103 into the linear regression equation corresponding to the row where the to-be-spliced marker point is located can determine the vertical position of the to-be-spliced marker point. Exemplarily, if the row where the to-be-spliced marker point is located is the first row, substitute the horizontal position coordinate of the to-be-spliced marker point into the first-row linear regression equation to obtain the vertical position of the to-be-spliced marker point; if the row where the to-be-spliced marker point is located is the second row, substitute the horizontal position coordinate of the to-be-spliced marker point into the second-row linear regression equation to obtain the vertical position of the to-be-spliced marker point.

[0087] C. Determine the position coordinates of the to-be-spliced marker point according to the horizontal position and vertical position of the to-be-spliced marker point.

[0088] Furthermore, before step 101, that is, before determining the row where the to-be-spliced marker point is located based on the serial number of the already-spliced marker point, a splicing method for a triangular chip further includes:

[0089] A. Obtain the center point of the monitored image and two marking points of the chip to be spliced, and align one marking point of the chip to be spliced with the center point of the monitored image;

[0090] In this step, the first chip to be spliced is positioned through the center point of the monitored image. Under the monitoring of the camera, the center point of the monitored image is made to coincide with the first marking point of the chip to be spliced. Exemplarily, under the monitoring of a CCD camera, the center point of the monitored image with crosshairs can be used to position the marking point of the chip to be spliced.

[0091] B. Obtain the position of the marking point after alignment and determine it as the position of the spliced marking point;

[0092] C. Obtain the serial number of the spliced marking point according to the position of the spliced marking point.

[0093] In this step, for each position of the spliced marking point, there is a corresponding serial number of a marking point. This serial number includes a sub-marking serial number and a total marking serial number, starting from 1 respectively. For each determined position of the spliced marking point, the serial number of the marking point increases by 1 accordingly.

[0094] It should be noted that to obtain the position coordinates of the marking point to be spliced using the linear regression equation, at least two position coordinates of the spliced marking points are required for each row. Therefore, after the first marking point (total marking serial number 1) of the first chip in the first row is positioned through the center point of the monitored image, the position coordinates are stored in the first array; for the next marking point to be spliced, i.e., the horizontal position of the total marking serial number 2 is determined by the horizontal position of the total marking serial number 1 and the distance between the two marking points on the chip, and the vertical position of the total marking serial number 2 is the vertical position of the total marking serial number 1. The marking point coordinates of the total marking serial number 2 are stored in the first array; the horizontal position coordinate of the first marking point (total marking serial number 3) of the first chip in the second row is determined by adding the horizontal position of the total marking serial number 2 and the horizontal distance between adjacent chips, and then subtracting the distance between the two marking points on the same chip. The vertical position of the total marking serial number 3 is determined by the vertical position of the total marking serial number 2 and the vertical distance between the two rows of chips. The marking point coordinates of the total marking serial number 3 are stored in the second array; the horizontal position of the total marking serial number 4 is determined by the horizontal position of the total marking serial number 3 and the distance between the two marking points on the chip, and the vertical position of the total marking serial number 4 is the vertical position of the total marking serial number 3. The marking point coordinates of the total marking serial number 4 are stored in the second array.

[0095] Further, after step 103, that is, after determining the position coordinates of the marking point to be spliced according to the position coordinates of the spliced marking point, the preset parameters, and the linear regression equation, the splicing method further includes:

[0096] A. After determining the position coordinates of the to-be-spliced marker point, move the center point of the monitoring image to the position coordinates of the to-be-spliced marker point;

[0097] In this step, after determining the position coordinates of the to-be-spliced marker point, the driving motor controls the crosshair at the center point of the monitoring image to move to the position coordinates of the to-be-spliced marker point obtained in step 103.

[0098] B. Adjust the position coordinates of the to-be-spliced marker point, align the to-be-spliced marker point with the center point of the monitoring image, and determine the aligned to-be-spliced marker point as the spliced marker point.

[0099] In this step, through step A above, move the position of the center point of the monitoring image to the position coordinates of the to-be-spliced marker point. With the assistance of the monitoring image, adjust the position coordinates of the to-be-spliced marker point to align and coincide the center point of the monitoring image with the to-be-spliced marker point. After adjustment, determine the to-be-spliced marker point as the spliced marker point, and continue to use it as a reference for determining the coordinates of the next to-be-spliced marker point until all chips are spliced.

[0100] Exemplarily, under the monitoring of a CCD camera, there is a center point with crosshairs in the monitoring image. The position of the marker point of the to-be-spliced chip can be adjusted using this center point for position calibration. After calibration, determine the to-be-spliced marker point as the spliced marker point, that is, the spliced marker point coincides with the center point of the monitoring image; determine whether this marker point is the last marker point of the last spliced chip. If so, the chip splicing process ends. If not, continue to calculate the position coordinates of the next to-be-spliced marker point.

[0101] A method, device, electronic device, and storage medium for splicing a triangular chip provided in an embodiment of the present application determine the row where the to-be-spliced marker point is located based on the serial number of the spliced marker point; wherein, the spliced marker point is a spliced marker point whose splicing order is connected to that of the to-be-spliced marker point and whose splicing order is before the to-be-spliced marker point; according to the mapping relationship between the preset row position and the linear regression equation, determine the linear regression equation corresponding to the row where the to-be-spliced marker point is located; determine the position coordinates of the to-be-spliced marker point according to the position coordinates of the spliced marker point, preset parameters, and the linear regression equation.

[0102] In this way, by adopting the technical solution provided in the present application, the linear regression equation can be determined based on the position of the spliced chips when splicing the to-be-spliced chips, and the next splicing position can be determined according to the linear regression equation, so that the chips in each spliced row always remain on their respective fitting straight lines, ensuring the accuracy of chip splicing and improving the yield.

[0103] Based on the same inventive concept, an embodiment of the present application further provides a splicing device for a triangular chip corresponding to the above-described method for splicing a triangular chip. Since the principle of solving problems by the device in the embodiment of the present application is similar to that of the method for splicing a triangular chip in the above embodiment of the present application, the implementation of the device can refer to the implementation of the method, and repeated parts will not be described again.

[0104] Please refer to Figure 4 、 Figure 5 , Figure 4 which is one of the structural schematic diagrams of a splicing device for a triangular chip provided by an embodiment of the present application, Figure 5 and which is the second structural schematic diagram of a splicing device for a triangular chip provided by an embodiment of the present application. As shown in Figure 4 、 Figure 5 , the splicing device 410 includes:

[0105] A first processing module 411, configured to determine the row where the to-be-spliced marker point is located based on the serial number of the already-spliced marker point; wherein, the already-spliced marker point is a spliced marker point whose splicing order is connected to that of the to-be-spliced marker point and whose splicing order is before that of the to-be-spliced marker point;

[0106] A second processing module 412, configured to determine the linear regression equation corresponding to the row where the to-be-spliced marker point is located according to the mapping relationship between the preset row position and the linear regression equation;

[0107] A determination module 413, configured to determine the position coordinates of the to-be-spliced marker point according to the position coordinates of the already-spliced marker point, the preset parameters, and the linear regression equation.

[0108] Optionally, when the first processing module 411 is used to determine the row where the to-be-spliced marker point is located, the first processing module 411 specifically:

[0109] Obtain the total marker serial number of the already-spliced marker point and the sub-marker serial number of the row where it is located;

[0110] Determine the row where the already-spliced marker point is located according to the parity property of the sub-marker serial number and the mapping relationship between the preset sub-marker serial number and the total marker serial number;

[0111] Determine the row where the to-be-spliced marker point is located according to the row where the already-spliced marker point is located.

[0112] Optionally, when the second processing module 412 is used to determine the linear regression equation corresponding to the row position, the second processing module 412 specifically:

[0113] According to the row where the already-spliced marker point is located, store the position coordinates of the already-spliced marker point into an array corresponding to the row;

[0114] Determine the linear regression equation corresponding to each row according to the number of position coordinates of the spliced marker points in the array corresponding to the row, where the array stores the historical position coordinates corresponding to each historical spliced marker point consistent with the row where the spliced marker points are located.

[0115] Optionally, when the second processing module 412 is used to determine the linear regression equation corresponding to each row according to the number of position coordinates of the spliced marker points in the array corresponding to the row, the second processing module 412 is specifically used for:

[0116] When the number of position coordinates of the spliced marker points in the array corresponding to the row is less than the preset threshold, obtain the linear regression equation by using the two-point form;

[0117] When the number of position coordinates of the spliced marker points in the array corresponding to the row is not less than the preset threshold, obtain the linear regression equation by using the least squares method.

[0118] Optionally, when the determination module 413 is used to determine the position coordinates of the marker points to be spliced, the determination module 413 is specifically used for:

[0119] Determine the horizontal position of the marker points to be spliced according to the position coordinates of the spliced marker points and the preset parameters;

[0120] Substitute the horizontal position into the linear regression equation corresponding to the row where the marker points to be spliced are located to obtain the vertical position of the marker points to be spliced;

[0121] Determine the position coordinates of the marker points to be spliced according to the horizontal position and the vertical position of the marker points to be spliced.

[0122] Optionally, the splicing device 410 further includes an acquisition module 414. When the acquisition module 414 is used to determine the row where the marker points to be spliced are located based on the serial number of the spliced marker points, the acquisition module 414 is specifically used for:

[0123] Acquire the center point of the monitoring image and two marker points of the chip to be spliced, and align one marker point of the chip to be spliced with the center point of the monitoring image;

[0124] Acquire the positions of the marker points after alignment and determine them as the positions of the spliced marker points;

[0125] Obtain the serial number of the spliced marker points according to the positions of the spliced marker points.

[0126] Optionally, the splicing device 410 further includes an adjustment module 415. After the adjustment module 415 is used to determine the position coordinates of the to-be-spliced marker points according to the position coordinates of the spliced marker points, preset parameters, and the linear regression equation, the adjustment module 415 is specifically configured to:

[0127] After determining the position coordinates of the to-be-spliced marker points, move the center point of the monitoring image to the position coordinates of the to-be-spliced marker points;

[0128] Adjust the position coordinates of the to-be-spliced marker points, align the to-be-spliced marker points with the center point of the monitoring image, and determine the aligned to-be-spliced marker points as the spliced marker points.

[0129] A splicing device for a triangular chip provided by an embodiment of the present application, a first processing module, configured to determine the row where the to-be-spliced marker points are located based on the serial numbers of the spliced marker points; wherein, the spliced marker points are the spliced marker points whose splicing order is connected to the to-be-spliced marker points and whose splicing order is before the to-be-spliced marker points; a second processing module, configured to determine the linear regression equation corresponding to the row where the to-be-spliced marker points are located according to the mapping relationship between the preset row position and the linear regression equation; a determination module, configured to determine the position coordinates of the to-be-spliced marker points according to the position coordinates of the spliced marker points, preset parameters, and the linear regression equation.

[0130] In this way, by adopting the technical solution provided by the present application, the linear regression equation can be determined based on the position of the spliced chips when splicing the to-be-spliced chips, and the next splicing position can be determined according to the linear regression equation, so that the chips in each spliced row are always kept on their respective fitting straight lines, ensuring the splicing accuracy of the chips and improving the yield.

[0131] Please refer to Figure 6 , Figure 6 which is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As Figure 6 shown in, the electronic device 600 includes a processor 610, a memory 620, and a bus 630.

[0132] The memory 620 stores machine-readable instructions executable by the processor 610. When the electronic device 600 runs, the processor 610 communicates with the memory 620 through the bus 630. When the machine-readable instructions are executed by the processor 610, the steps of the splicing method for the triangular chips in the method embodiments as described above Figure 1 and Figure 2 can be executed. The specific implementation manners can be referred to the method embodiments and will not be elaborated here.

[0133] The embodiments of the present application further provide a computer-readable storage medium, on which a computer program is stored. When the computer program is run by a processor, it can execute the steps of the method for splicing the pin-shaped chips in the method embodiments as described above. For the specific implementation manners, reference can be made to the method embodiments and will not be elaborated herein. Figure 1 and Figure 2 shown in the method embodiments. For the specific implementation manners, reference can be made to the method embodiments and will not be elaborated herein.

[0134] Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, devices, and units described above can refer to the corresponding processes in the foregoing method embodiments and will not be elaborated herein.

[0135] In several embodiments provided by the present application, it should be understood that the disclosed systems, devices, and methods can be implemented in other ways. The device embodiments described above are only illustrative. For example, the division of the units is only a logical function division, and there can be other division manners in actual implementation. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed couplings or direct couplings or communication connections to each other can be through some communication interfaces. The indirect couplings or communication connections of the devices or units can be in electrical, mechanical, or other forms.

[0136] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0137] In addition, in each embodiment of the present application, the functional units can be integrated in one processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit.

[0138] When the above-mentioned functions are implemented in the form of software function units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium executable by a processor. Based on such understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to enable a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in various embodiments of this application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memories (ROM), random access memories (RAM), magnetic disks, or optical discs that can store program codes.

[0139] Finally, it should be noted that the above-mentioned embodiments are only specific implementation manners of this application, used to illustrate the technical solutions of this application, rather than limiting them. The protection scope of this application is not limited thereto. Although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: any person skilled in the art within the technical scope disclosed in this application can still modify the technical solutions recorded in the foregoing embodiments or can easily think of changes, or perform equivalent replacements on some of the technical features; and these modifications, changes, or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of this application and should all be covered by the protection scope of this application. Therefore, the protection scope of this application should be subject to the protection scope of the claims.

Claims

1. A splicing method for a triangular chip, characterized in that, the splicing method includes: Based on the serial number of the spliced marker point, determine the row where the marker point to be spliced is located; wherein, the spliced marker point is a spliced marker point whose splicing order is connected to the marker point to be spliced and whose splicing order is before the marker point to be spliced; According to the mapping relationship between the preset row position and the linear regression equation, determine the linear regression equation corresponding to the row where the marker point to be spliced is located; Determine the position coordinates of the marker point to be spliced according to the position coordinates of the spliced marker point, the preset parameters and the linear regression equation; The determining the row where the marker point to be spliced is located based on the serial number of the spliced marker point includes: Obtain the total marker serial number of the spliced marker point and the sub-marker serial number of the row where it is located; According to the parity property of the sub-marker serial number and the preset mapping relationship between the sub-marker serial number and the total marker serial number, determine the row where the spliced marker point is located; wherein, the preset mapping relationship between the sub-marker serial number and the total marker serial number includes: If the sub-marker serial number of the spliced marker point in the first row is odd, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to the difference between twice the sub-marker serial number and 1 as the first row; If the sub-marker serial number of the spliced marker point in the first row is even, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to the difference between twice the sub-marker serial number and 2 as the first row; If the sub-marker serial number of the spliced marker point in the second row is odd, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to the sum of twice the sub-marker serial number and 1 as the second row; If the sub-marker serial number of the spliced marker point in the second row is even, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to twice the sub-marker serial number as the second row; According to the row where the spliced marker point is located, determine the row where the marker point to be spliced is located; The determining the row where the marker point to be spliced is located according to the row where the spliced marker point is located includes: Judge whether the spliced marker point is the first marker point; If so, the marker point to be spliced is the second marker point, and the row where the marker point to be spliced is located is the row where the spliced marker point is located; If not, the spliced marker point is the second marker point, the marker point to be spliced is the first marker point of the next chip, and the row where the marker point to be spliced is located is the other row of the row where the spliced marker point is located.

2. The splicing method according to claim 1, characterized in that, Determine the linear regression equation corresponding to the row position through the following steps: According to the row where the spliced marker point is located, store the position coordinates of the spliced marker point into the array corresponding to the row; According to the number of position coordinates of the spliced marker point in the corresponding row array, determine the linear regression equation corresponding to each row, wherein the array stores the historical position coordinates corresponding to each historical spliced marker point that is consistent with the row where the spliced marker point is located.

3. The splicing method according to claim 2, characterized in that, The step of determining the linear regression equation corresponding to each row according to the number of position coordinates of the spliced marker points in the array corresponding to the corresponding row includes: When the number of position coordinates of the spliced marker points in the array corresponding to the corresponding row is less than a preset threshold, a two-point form is used to obtain the linear regression equation; When the number of position coordinates of the spliced marker points in the array corresponding to the corresponding row is not less than the preset threshold, the least squares method is used to obtain the linear regression equation.

4. The splicing method according to claim 1, wherein, The step of determining the position coordinates of the to-be-spliced marker points according to the position coordinates of the spliced marker points, preset parameters, and the linear regression equation includes: Determining the horizontal position of the to-be-spliced marker points according to the position coordinates of the spliced marker points and preset parameters; Substituting the horizontal position into the linear regression equation corresponding to the row where the to-be-spliced marker points are located to obtain the vertical position of the to-be-spliced marker points; Determining the position coordinates of the to-be-spliced marker points according to the horizontal position and vertical position of the to-be-spliced marker points.

5. The splicing method according to claim 1, wherein, Before determining the row where the to-be-spliced marker points are located based on the serial numbers of the spliced marker points, the splicing method further includes: Obtaining the center point of the monitoring image and two marker points of the to-be-spliced chip, and aligning one marker point of the to-be-spliced chip with the center point of the monitoring image; Obtaining the position of the marker points after alignment and determining it as the position of the spliced marker points; Obtaining the serial numbers of the spliced marker points according to the positions of the spliced marker points.

6. The splicing method according to claim 1, wherein, After determining the position coordinates of the to-be-spliced marker points according to the position coordinates of the spliced marker points, preset parameters, and the linear regression equation, the splicing method further includes: After determining the position coordinates of the to-be-spliced marker points, moving the center point of the monitoring image to the position coordinates of the to-be-spliced marker points; Adjusting the position coordinates of the to-be-spliced marker points, aligning the to-be-spliced marker points with the center point of the monitoring image, and determining the aligned to-be-spliced marker points as the spliced marker points.

7. A splicing device for a triangular chip, wherein, The splicing device includes: A first processing module for determining the row where the to-be-spliced marker points are located based on the serial numbers of the spliced marker points; wherein, the spliced marker points are the splicing marker points whose splicing order is connected to the to-be-spliced marker points and whose splicing sequence is before the to-be-spliced marker points; A second processing module for determining the linear regression equation corresponding to the row where the to-be-spliced marker points are located according to the mapping relationship between the preset row positions and the linear regression equations; A determination module for determining the position coordinates of the to-be-spliced marker points according to the position coordinates of the spliced marker points, preset parameters, and the linear regression equation; When the first processing module is used to determine the row where the to-be-spliced marker points are located based on the serial numbers of the spliced marker points, the first processing module specifically is used for: Obtaining the total marker serial number of the spliced marker points and the sub-marker serial number of the row where they are located; Determine the row where the spliced marker point is located according to the parity property of the sub-marker serial number and the preset mapping relationship between the sub-marker serial number and the total marker serial number; wherein, the preset mapping relationship between the sub-marker serial number and the total marker serial number includes: If the sub-marker serial number of the spliced marker point in the first row is odd, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to the difference between twice the sub-marker serial number and 1 as the first row; If the sub-marker serial number of the spliced marker point in the first row is even, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to the difference between twice the sub-marker serial number and 2 as the first row; If the sub-marker serial number of the spliced marker point in the second row is odd, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to the sum of twice the sub-marker serial number and 1 as the second row; If the sub-marker serial number of the spliced marker point in the second row is even, determine the row number of the spliced marker point that satisfies the total marker serial number of the spliced marker point being equal to twice the sub-marker serial number as the second row; Determine the row where the marker point to be spliced is located according to the row where the spliced marker point is located; When the first processing module is used to determine the row where the marker point to be spliced is located according to the row where the spliced marker point is located, the first processing module specifically is used for: Judge whether the spliced marker point is the first marker point; If so, the marker point to be spliced is the second marker point, and the row where the marker point to be spliced is located is the row where the spliced marker point is located; If not, the spliced marker point is the second marker point, the marker point to be spliced is the first marker point of the next chip, and the row where the marker point to be spliced is located is the other row of the row where the spliced marker point is located.

8. An electronic device Characterized in that Comprising: A processor, a memory and a bus, the memory stores machine-readable instructions executable by the processor. When the electronic device runs, the processor communicates with the memory through the bus. When the machine-readable instructions are run by the processor, the steps of the splicing method of the triangular chip as described in any one of claims 1 to 6 are executed.

9. A computer-readable storage medium Characterized in that A computer program is stored on the computer-readable storage medium. When the computer program is run by a processor, the steps of the splicing method of the triangular chip as described in any one of claims 1 to 6 are executed.

Images