Method for removing a carrier plate

Abstract

The present application provides a carrier plate removal method capable of easily removing a carrier plate from a workpiece. The carrier plate removal method removes the carrier plate from a workpiece provided on the front surface of the carrier plate by means of a temporary adhesive layer, the method including the following steps: a step difference portion forming step of processing the outer peripheral portion of the carrier plate from the front surface side on which the workpiece is provided along the outer periphery of the carrier plate to form a step difference portion in which the back surface side of the carrier plate protrudes sideways more than the front surface side of the carrier plate; a sticking step of sticking an adhesive tape on the front surface of the workpiece exposed on the side opposite to the carrier plate, and sticking the outer peripheral portion of the adhesive tape on a ring-shaped frame; a holding step of holding the workpiece from above with a holding unit through the adhesive tape in a state in which the workpiece is positioned above the carrier plate; and a carrier plate removal step of moving the carrier plate in a direction away from the workpiece by applying a downward force to the step difference portion with a pushing member to remove the carrier plate from the workpiece.

Description

TECHNICAL FIELD

[0001] The present application relates to a carrier plate removal method for removing a carrier plate from a workpiece provided with the carrier plate on a front surface thereof by means of a temporary adhesive layer. BACKGROUND

[0002] In electronic devices typified by mobile phones or personal computers, device chips having devices such as electronic circuits are becoming essential constituent elements. A device chip is obtained, for example, by dividing a front surface of a wafer formed of a semiconductor material such as silicon into a plurality of regions using division predetermined lines (streets), forming devices in each region, and then dividing the wafer along the division predetermined lines, thereby obtaining the device chips.

[0003] After the device chips obtained by the above-described method are fixed to a mother substrate for CSP (Chip Size Package) and electrically connected to terminals or the like of the mother substrate by wire bonding or the like, sealing is performed using a molding resin. In this way, a package device is formed by sealing the device chips with the molding resin, and thus the device chips can be protected from external causes such as impact, light, heat, water, and the like.

[0004] In recent years, a packaging technology called FOWLP (Fan-Out Wafer Level Package) has been adopted, in which a redistribution technology at the wafer level is used to form package terminals outside the regions of the device chips (see, for example, Patent Literature 1). In addition, a packaging technology called FOPLP (Fan-Out Panel Level Package) has been proposed, in which package devices are manufactured in a panel (typically, a glass substrate used in the manufacture of liquid crystal panels) level having a size larger than that of a wafer.

[0005] In the FOPLP, for example, a wiring layer (RDL: Redistribution Layer) is formed on a front surface of a carrier plate serving as a temporary substrate by means of a temporary adhesive layer, and a device chip is bonded to the wiring layer. Next, the device chip is sealed with a molding resin to obtain a package panel. Then, after the package panel is thinned by grinding or the like, the package panel is divided, thereby completing the package devices.

[0006] Patent Literature 1: Japanese Patent Application Publication No. 2016-201519

[0007] In the above-described FOPLP, for example, after the package panel is divided into package devices, the carrier plate is removed from the package devices. Specifically, each package device is picked up from the carrier plate. However, when the size of the package device is small, it is difficult to pick up the package device from the carrier plate.

[0008] On the other hand, the idea of ​​peeling and removing the carrier plate from the package panel before dividing it into packaged devices was also considered. However, the adhesive strength of the temporary adhesive layer is relatively strong, making it difficult to peel the carrier plate from the package panel without damaging the package panel and the carrier plate. Summary of the Invention

[0009] The present invention was made in view of the above-mentioned problems, and its object is to provide a method for removing a carrier plate, which can easily remove the carrier plate from workpieces such as packaging panels.

[0010] According to one aspect of the present invention, a method for removing a carrier plate is provided, wherein the carrier plate is removed from a workpiece disposed on the front side of the carrier plate by means of a temporary adhesive layer, the method comprising the following steps: a step-gap forming step, wherein the outer periphery of the carrier plate is processed along the outer periphery of the carrier plate from the front side on which the workpiece is disposed to form a step-gap where the back side of the carrier plate protrudes laterally from the front side of the carrier plate; an adhesive bonding step, wherein after performing the step-gap forming step, an adhesive tape is bonded to the front side of the workpiece exposed on the side opposite to the carrier plate, and the outer periphery of the adhesive tape is bonded to an annular frame; a holding step, wherein after performing the adhesive bonding step, the workpiece is held from above by a holding unit with the adhesive tape in a state where the workpiece is positioned above the carrier plate; and a carrier plate removal step, wherein after performing the holding step, a pressing member applies a downward force to the step-gap to move the carrier plate away from the workpiece, thereby removing the carrier plate from the workpiece.

[0011] In one aspect of the invention described above, the adhesive tape preferably has a through hole for the pushing member to pass through. In the carrier plate removal process, the pushing member inserted in the through hole applies a downward force to the stepped portion to remove the carrier plate from the workpiece.

[0012] In addition, in one aspect of the present invention described above, it is preferable that, in the carrier plate removal process, after fluid is blown between the workpiece and the carrier plate, a downward force is applied to the stepped difference portion, or a downward force is applied to the stepped difference portion while fluid is blown between the workpiece and the carrier plate, thereby removing the carrier plate from the workpiece.

[0013] Furthermore, in one aspect of the invention described above, it is preferable that, during the carrier plate removal process, a downward force is applied to the stepped portion while the workpiece and the carrier plate are immersed in a liquid. Alternatively, the liquid may contain a surfactant.

[0014] In addition, in one aspect of the present invention described above, it is preferable that, in the carrier plate removal process, while the workpiece and the carrier plate are immersed in the liquid, a downward force is applied to the stepped portion while the pushing member is vibrated.

[0015] In addition, in one aspect of the present invention described above, it is preferable that, during the carrier plate removal process, while the workpiece and the carrier plate are immersed in the liquid, a downward force is applied to the stepped portion while the liquid is vibrated.

[0016] In one aspect of the carrier plate removal method of the present invention, the outer periphery of the carrier plate is processed from the front side of the carrier plate on which the workpiece is disposed along the outer periphery of the carrier plate to form a stepped difference portion where the back side of the carrier plate protrudes laterally than the front side of the carrier plate. Therefore, by applying a downward force to the stepped difference portion while the workpiece is held from above using a holding unit, the carrier plate can be easily removed from the workpiece.

[0017] Furthermore, in one aspect of the carrier plate removal method of the present invention, since the downward force applied to the stepped portion and the gravity acting on the carrier plate can be utilized, the carrier plate can be removed from the workpiece even when the downward force applied to the stepped portion is small. Moreover, in one aspect of the carrier plate removal method of the present invention, before removing the carrier plate from the workpiece, adhesive tape is attached to the workpiece to hold it in a ring-shaped frame, thus preventing the workpiece from warping after the carrier plate is removed. Attached Figure Description

[0018] Figure 1 (A) is a cross-sectional view showing a structural example of a composite substrate including a carrier plate and a workpiece. Figure 1 (B) is a cross-sectional view showing the case where the carrier plate side of the composite substrate is held during the step difference formation process.

[0019] Figure 2 (A) is a cross-sectional view showing the formation of a stepped difference on a carrier plate during the stepped difference formation process. Figure 2 (B) is a cross-sectional view showing a state in which a stepped section is formed on the entire outer periphery of the carrier plate.

[0020] Figure 3 This is a cross-sectional view showing the state of adhesive tape being applied to the workpiece during the bonding process.

[0021] Figure 4 (A) is a cross-sectional view showing the holding process. Figure 4 (B) is a cross-sectional view showing the carrier plate removal process. Figure 4 (C) is a cross-sectional view showing the state after the carrier plate has been removed from the workpiece.

[0022] Figure 5 (A) is a cross-sectional view showing the carrier plate removal process of the first modified example. Figure 5 (B) is a cross-sectional view showing the carrier plate removal process of the second modified example.

[0023] Label Explanation

[0024] 1: Composite substrate; 3: Carrier plate; 3a: First side (front); 3b: Second side (back); 3c: Stepped section; 5: Temporary adhesive layer; 7: Workpiece; 7a: First side (front); 9: Device chip; 11: Molding resin layer; 21: Adhesive tape; 21a: Through hole; 23: Frame; 2: Cutting device; 4: Chuck table; 6: Frame; 6a: Flow path; 8: Holding plate; 8a: Holding surface; 10: Valve; 12: Suction source; 14: Cutting unit; 16: Spindle; 18: Cutting tool; 22: Peeling device; 24: Holding unit; 24a: Holding surface; 26: Pushing component; 32: Nozzle; 34: Fluid; 42: Groove; 44: Liquid. Detailed Implementation

[0025] An embodiment of one aspect of the present invention will be described with reference to the accompanying drawings. The carrier plate removal method of this embodiment is used when removing a carrier plate from a workpiece disposed on the front side of the carrier plate by means of a temporary adhesive layer. This method includes a step-gap forming process (see...). Figure 1 (B) Figure 2 (A) and Figure 2 (B) ), pasting process (refer to) Figure 3 ), holding process (refer to) Figure 4 (A) and the carrier plate removal process (refer to) Figure 4 (B) and Figure 4 (C)).

[0026] In the step-gap forming process, a cutting tool cuts into the outer periphery of the carrier plate from the front side where the workpiece is placed, forming a step-gap on the carrier plate. In the bonding process, adhesive tape is bonded to the exposed front side of the workpiece, and the outer periphery of the adhesive tape is bonded to the annular frame.

[0027] In the holding process, with the workpiece positioned above the carrier plate, it is held from above via the adhesive tape. In the carrier plate removal process, a downward force is applied to the stepped portion using a pushing member, causing the carrier plate to move away from the workpiece, thereby removing the carrier plate from the workpiece. The carrier plate removal method of this embodiment will be described in detail below.

[0028] Figure 1(A) is a cross-sectional view showing a structural example of the composite substrate 1 used in the carrier plate removal method of this embodiment. The composite substrate 1 includes, for example, a carrier plate 3 formed of an insulating material such as soda-lime glass, borosilicate glass, or quartz glass. The carrier plate 3 has, for example, a generally flat first surface (front) 3a and a second surface (back) 3b opposite to the first surface 3a, and is configured to be rectangular in a top view obtained from the first surface 3a side or the second surface 3b side. The thickness of the carrier plate 3 is, for example, 2 mm or less, typically 1.1 mm.

[0029] Furthermore, in this embodiment, a carrier plate 3 made of insulating materials such as soda-lime glass, borosilicate glass, or quartz glass is used, but there are no particular limitations on the material, shape, structure, or size of the carrier plate 3. For example, a plate made of materials such as semiconductors, ceramics, resins, or metals can also be used as the carrier plate 3. A disc-shaped semiconductor wafer can also be used as the carrier plate 3.

[0030] A workpiece 7 is disposed on the first surface 3a of the carrier plate 3 by means of a temporary adhesive layer 5. The temporary adhesive layer 5 is formed on the first surface 3a substantially by overlapping metal films, insulating films, etc., and has the function of bonding the carrier plate 3 and the workpiece 7. In addition, the temporary adhesive layer 5 is sometimes also composed of a resin film or the like that functions as an adhesive.

[0031] The thickness of the temporary adhesive layer 5 is, for example, less than 20 μm, typically 5 μm. When the carrier plate 3 is peeled off and removed from the workpiece 7 in the carrier plate removal process described later, the temporary adhesive layer 5 separates into a first portion 5a that is tightly attached to the side of the carrier plate 3 (see reference). Figure 4 (C) and the second part 5b that is close to the side of workpiece 7 (refer to) Figure 4 (C)).

[0032] The workpiece 7, also referred to as a packaged panel or packaged wafer, comprises: a wiring layer (RDL) (not shown) in contact with the temporary adhesive layer 5; a plurality of device chips 9 bonded to the wiring layer; and a molding resin layer 11 sealing each device chip 9. The workpiece 7 is formed, for example, to be approximately the same size and shape as the carrier plate 3 when viewed from above. Furthermore, the thickness of the workpiece 7 is, for example, 1.5 mm or less, typically 0.6 mm.

[0033] Furthermore, the first (front) side 7a of the workpiece 7 can be machined using methods such as grinding. Additionally, a predetermined dividing line (cutting predetermined line) is provided in the region between adjacent device chips 9 within the workpiece 7. The workpiece 7 is cut along any predetermined dividing line, thereby dividing it into multiple workpiece pieces, each containing one or more device chips 9.

[0034] If the workpiece 7 (or workpiece sheet) is cut along all the predetermined dividing lines, multiple packaged devices corresponding to each device chip 9 are obtained. However, there are no particular restrictions on the material, shape, structure, size, etc. of the workpiece 7. For example, the workpiece 7 may sometimes be mainly composed of wiring layers and does not include device chips 9, molding resin layers 11, etc.

[0035] In the carrier plate removal method of this embodiment, a step difference formation process is first performed to form a step difference on the outer periphery of the carrier plate 3 constituting the composite substrate 1. Specifically, the carrier plate 3 side of the composite substrate 1 is first held so that the workpiece 7 side is exposed upwards. Figure 1 (B) is a cross-sectional view showing the case where the composite substrate 1 is held on the carrier plate 3 side during the step difference formation process. Additionally, in Figure 1 In (B), functional blocks are used to represent a portion of the structural elements.

[0036] The step difference forming process uses Figure 1 The cutting device 2 shown in (B) etc. is used to perform the cutting. The cutting device 2 has a chuck stage 4 for holding the composite substrate 1. The chuck stage 4 includes, for example, a cylindrical frame 6 formed of a metal material, such as stainless steel; and a holding plate 8 formed of a porous material, disposed on the upper part of the frame 6.

[0037] The upper surface of the holding plate 8 serves as a holding surface 8a for attracting and holding the carrier plate 3 side of the composite substrate 1. The lower surface of the holding plate 8 is connected to the attraction source 12 via a flow path 6a and a valve 10 disposed inside the frame 6. Therefore, if the valve 10 is opened, the negative pressure of the attraction source 12 can be applied to the holding surface 8a.

[0038] The chuck table 4 (frame 6) is connected to a rotary drive source (not shown) such as an electric motor, and rotates about a rotation axis that is substantially perpendicular to the holding surface 8a by the force generated by the rotary drive source. In addition, the chuck table 4 (frame 6) is supported by a machining feed mechanism (not shown) and moves in a machining feed direction that is substantially parallel to the holding surface 8a.

[0039] When the workpiece 7 side is exposed upwards while the carrier plate 3 side of the composite substrate 1 is held, such as Figure 1 As shown in (B), for example, the second surface 3b of the carrier plate 3 is brought into contact with the holding surface 8a of the chuck table 4. Furthermore, the valve 10 is opened, so that the negative pressure of the suction source 12 acts on the holding surface 8a. As a result, the carrier plate 3 side of the composite substrate 1 is held by the chuck table 4, and the workpiece 7 side is exposed upward.

[0040] After holding the composite substrate 1 on the carrier plate 3 side so that the workpiece 7 side is exposed upward, a stepped difference is formed along the outer periphery of the carrier plate 3.Figure 2 (A) is a cross-sectional view showing the formation of a stepped difference 3c on the carrier plate 3 during the stepped difference forming process. Additionally, in Figure 2 In (A), functional blocks represent a portion of the structural elements.

[0041] like Figure 2 As shown in (A), a cutting unit 14 is arranged above the chuck table 4. The cutting unit 14 has a spindle 16 that serves as a rotation axis substantially parallel to the holding surface 8a. An annular cutting tool 18, formed by dispersing abrasive grains in the bonding material, is mounted on one end of the spindle 16.

[0042] A rotary drive source (not shown) such as an electric motor is connected to the other end of the spindle 16. The cutting tool 18, mounted on one end of the spindle 16, rotates by the force generated by this rotary drive source. The cutting unit 14 is supported, for example, by a lifting mechanism (not shown) and an indexing feed mechanism (not shown), and moves in a vertical direction that is approximately perpendicular to the holding surface 8a and in an indexing feed direction that is approximately perpendicular to both the vertical direction and the machining feed direction.

[0043] When the stepped difference portion 3c is formed on the carrier plate 3, the chuck table 4 holding the composite substrate 1 is first rotated so that a portion of the outer periphery of the carrier plate 3, which is the object to be processed (equivalent to one side of a rectangle in top view), is approximately parallel to the processing feed direction. Next, the chuck table 4 and the cutting unit 14 are moved relative to each other so that the cutting tool 18 is positioned above the extension line of the aforementioned portion of the outer periphery.

[0044] Furthermore, the lower end of the cutting tool 18 is positioned lower than the first surface 3a of the carrier plate 3 and higher than the second surface 3b. Then, while rotating the cutting tool 18, the chuck table 4 is moved along the machining feed direction. Thus, as... Figure 2 As shown in (A), the cutting tool 18 can cut into a portion of the outer periphery of the carrier plate 3 from the first surface 3a side, and remove a portion of the outer periphery of the carrier plate 3 corresponding to that portion of the outer periphery.

[0045] Here, the cutting tool 18 cuts to a depth that does not reach the second surface 3b of the carrier plate 3. Therefore, a stepped difference portion 3c is formed on a part of the outer periphery, which protrudes laterally (outward in a direction parallel to the first surface 3a or the second surface 3b) from the side of the second surface 3b.

[0046] The width of the overlap between the carrier plate 3 (outer periphery) and the cutting tool 18 (i.e., the width of the formed stepped difference portion 3c, or the amount of protrusion) is set within a range that does not affect the packaged device or the like cut from the workpiece 7. For example, if the width of the remaining area (outer periphery remaining area) of the outer periphery of the workpiece 7 is wide, the width of the overlap between the carrier plate 3 (outer periphery) and the cutting tool 18 (the width of the stepped difference portion 3c) can be set to be wide. When considering the ease of removal of the carrier plate 3, the width of the stepped difference portion 3c is preferably set to, for example, 0.2 mm or more and 5 mm or less.

[0047] As described above, the temporary adhesive layer 5 and the workpiece 7 are configured to be approximately the same size and shape as the carrier plate 3 when viewed from above. Therefore, when the cutting tool 18 cuts into a portion of the outer periphery of the carrier plate 3 from the side where the workpiece 7 is located, the corresponding areas of the temporary adhesive layer 5 and the workpiece 7 are also removed simultaneously.

[0048] After forming a stepped difference portion 3c on a portion of the outer periphery of the carrier plate 3 according to the steps described above, stepped difference portions 3c are also formed on other portions of the outer periphery of the carrier plate 3 according to the same steps. When the stepped difference portion 3c is formed on the entire outer periphery of the carrier plate 3, the stepped difference portion forming process is completed. Figure 2 (B) is a cross-sectional view showing the state in which a stepped difference portion 3c is formed on the entire outer periphery of the carrier plate 3.

[0049] In addition, in this embodiment, such as Figure 2 As shown in (B), a stepped portion 3c is formed on the entire outer periphery of the carrier plate 3, but the stepped portion 3c only needs to be formed on at least any part of the outer periphery of the carrier plate 3. In addition, when the carrier plate and the workpiece are circular (i.e., disk-shaped) when viewed from above, for example, the stepped portion can be formed on the carrier plate by rotating the chuck table 4 while the cutting tool 18 cuts into the outer periphery of the carrier plate.

[0050] After the step difference formation process, a bonding process is performed, in which adhesive tape is bonded to the exposed first surface 7a of the workpiece 7, and the outer periphery of the adhesive tape is bonded to the annular frame. Figure 3 This is a cross-sectional view showing the state in which adhesive tape 21 is adhered to workpiece 7 during the bonding process. Adhesive tape 21 includes, for example: a substrate, which is configured as a circular film larger than the diagonal of workpiece 7 (first surface 7a); and an adhesive layer (paste layer) disposed on one surface of the substrate.

[0051] The substrate of the adhesive tape 21 is formed of materials such as polyolefin, vinyl chloride, and polyethylene terephthalate, and the adhesive layer of the adhesive tape 21 is formed of materials such as acrylic or rubber. In the bonding process, for example, the central portion of the adhesive layer of the adhesive tape 21 is pressed tightly against the first surface 7a of the workpiece 7. Thus, the central portion of the adhesive tape 21 is bonded to the first surface 7a of the workpiece 7. Furthermore, in the bonding process, the outer peripheral portion of the adhesive layer of the adhesive tape 21 is pressed tightly against a ring-shaped frame 23 formed of metal such as stainless steel (SUS) or aluminum. Here, the ring-shaped frame 23 is positioned around the workpiece 7 such that the workpiece 7 is accommodated in the opening. Thus, the outer peripheral portion of the adhesive tape 21 is bonded to the ring-shaped frame 23, and the workpiece 7 is supported by the ring-shaped frame 23 by means of the adhesive tape 21.

[0052] Furthermore, in this bonding process, the adhesive tape 21 can be bonded to the frame 23 after being bonded to the workpiece 7, or it can be bonded to the workpiece 7 after being bonded to the frame 23. Of course, the bonding of the adhesive tape 21 to the workpiece 7 and the bonding of the adhesive tape 21 to the frame 23 can also be performed simultaneously. In this embodiment, an adhesive tape 21 with a through hole 21a is used, and the through hole 21a, extending through the adhesive tape 21 in the thickness direction, is provided in the region between the portion of the adhesive tape 21 bonded to the workpiece 7 and the portion bonded to the frame 23.

[0053] After the bonding process, a holding process is performed to hold the workpiece 7 side of the composite substrate 1 from above, separated by the adhesive tape 21. Figure 4 (A) is a cross-sectional view showing the holding process. The holding process uses... Figure 4 The peeling device 22 shown in (A) is used for this purpose. The peeling device 22 has a holding unit 24 for holding the workpiece 7 side of the composite substrate 1 from above.

[0054] A holding surface 24a is formed at the lower part of the holding unit 24, and the holding surface 24a has a size approximately the same as the first surface 7a of the workpiece 7. The holding surface 24a is connected to the suction source (not shown) via a flow path (not shown), a valve (not shown), etc. Therefore, if the valve is opened, the negative pressure of the suction source can be applied to the holding surface 24a. In addition, the holding unit 24 is supported by a lifting mechanism (not shown) and moves in the vertical direction.

[0055] In the holding process, such as Figure 4As shown in (A), for example, with the workpiece 7 positioned above the carrier plate 3, the holding surface 24a of the holding unit 24 is brought into contact with the adhesive tape 21 attached to the workpiece 7. That is, the holding surface 24a of the holding unit 24 is brought into contact with the first surface 7a of the workpiece 7 through the adhesive tape 21. Then, the valve is opened, and the negative pressure of the suction source is applied to the holding surface 24a. Thus, the workpiece 7 side of the composite substrate 1 is held from above by the holding unit 24 through the adhesive tape 21.

[0056] After the holding process, a carrier plate removal process is performed to remove the carrier plate 3 from the workpiece 7. Figure 4 (B) is a cross-sectional view showing the carrier plate removal process. Figure 4 (C) is a cross-sectional view showing the state in which the carrier plate 3 is removed from the workpiece 7. This carrier plate removal process is continued using the peeling device 22.

[0057] like Figure 4 As shown in (B), a rod-shaped pressing member 26 is disposed on the side of the holding unit 24 at a position corresponding to the stepped difference portion 3c of the composite substrate 1 held by the holding unit 24 and the through hole 21a of the adhesive tape 21. This pressing member 26 is supported, for example, by a lifting mechanism (not shown) that is different from the lifting mechanism that moves the holding unit 24, and moves independently in the vertical direction relative to the holding unit 24.

[0058] In the carrier plate removal process, firstly, both the holding unit 24 and the pushing member 26 are moved upward to lift the composite substrate 1 held by the holding unit 24. That is, the second surface 3b side of the carrier plate 3 is exposed downward. Next, while holding the holding unit 24 in its position, the pushing member 26 is moved downward so that its lower end passes through the through hole 21a, and the lower end of the pushing member 26 contacts the stepped portion 3c. That is, the pushing member 26 inserted in the through hole 21a applies a downward force to the stepped portion 3c of the carrier plate 3.

[0059] As described above, the composite substrate 1 is held from above by the holding unit 24 via the adhesive tape 21 on the workpiece 7 side. Therefore, when a downward force is applied to the stepped portion 3c of the carrier plate 3 by the pushing member 26, the carrier plate 3 is peeled off from the workpiece 7 and falls off, with the temporary adhesive layer 5 as the boundary. That is, the carrier plate 3 moves away from the workpiece 7. When the entire carrier plate 3 is separated from the workpiece 7 and the carrier plate 3 is removed from the workpiece 7, the carrier plate removal process ends.

[0060] In the carrier plate removal method of this embodiment, the outer periphery of the carrier plate 3 is processed along its outer periphery from the first surface (front) 3a side on which the workpiece 7 is disposed, forming a stepped difference portion 3c that protrudes laterally from the second surface (back) 3b side of the carrier plate 3 compared to the first surface 3a side. Therefore, while the workpiece 7 is held from above by the holding unit 24, a downward force is applied to the stepped difference portion 3c, thereby easily removing the carrier plate 3 from the workpiece 7.

[0061] Furthermore, since the downward force applied to the stepped portion 3c and the gravity acting on the carrier plate 3 can be utilized, the carrier plate 3 can be removed from the workpiece 7 even when the downward force applied to the stepped portion 3c is small. Moreover, before removing the carrier plate 3 from the workpiece 7, the adhesive tape 21 is attached to the workpiece 7, thus holding the workpiece 7 in a ring-shaped frame 23. Therefore, after removing the carrier plate 3 from the workpiece 7, the workpiece 7 is less prone to warping.

[0062] Furthermore, the present invention is not limited to the embodiments described above, and various modifications can be made to implement it. For example, the pushing member 26 in the above embodiment is configured to be able to move independently of the holding unit 24 in the vertical direction, but the pushing member 26 only needs to be able to move relative to the holding unit 24.

[0063] For example, the pressing member 26 can be fixed to the housing (not shown) of the peeling device 22, and only the holding unit 24 can be moved, thereby causing the pressing member 26 to move relative to the holding unit 24. Furthermore, in the above embodiment, one pressing member 26 is used, but multiple pressing members 26 can also be used.

[0064] Furthermore, in the above embodiment, the stepped portion 3c is formed by cutting the workpiece 7 side along the outer periphery of the carrier plate 3 with the cutting tool 18. However, the stepped portion 3c can also be formed, for example, by irradiating a laser beam from the workpiece 7 side along the outer periphery of the carrier plate 3. In this case, a laser processing apparatus (laser processing unit) capable of irradiating a laser beam with a wavelength absorbed by the carrier plate 3 is used instead of the cutting device 2 (cutting unit 14).

[0065] In addition, when the carrier plate 3 is removed in the carrier plate removal process, fluid can be blown between the carrier plate 3 and the workpiece 7 (the area corresponding to the temporary adhesive layer 5). Figure 5 (A) is a cross-sectional view showing the carrier plate removal process of the first modified example. Figure 5 As shown in (A), a nozzle 32 is disposed on the side of the holding unit 24 of the stripping device 22 used in this first modification. The nozzle 32 is connected to the supply source (not shown) of the fluid 34 via a flow path (not shown), a valve (not shown), etc.

[0066] After the fluid 34 is blown from the nozzle 32 between the carrier plate 3 and the workpiece 7, a downward force is applied to the stepped portion 3c by the pushing member 26, or the fluid 34 is blown between the carrier plate 3 and the workpiece 7 while a downward force is applied to the stepped portion 3c by the pushing member 26. This makes it easier to peel the carrier plate 3 from the workpiece 7. For example, air or water can be used as the fluid 34 blown between the carrier plate 3 and the workpiece 7. However, there are no particular limitations on the type of fluid 34.

[0067] Alternatively, when the carrier plate 3 is removed in the carrier plate removal process, the carrier plate 3 and the workpiece 7 can be immersed in liquid. Figure 5 (B) is a cross-sectional view showing the carrier plate removal process in the second modified example. Figure 5 As shown in (B), below the holding unit 24 of the peeling device 22 used in this second modification, a groove 42 is provided that is large enough to accommodate the carrier plate 3 and the workpiece 7. Liquid 44 such as water is stored in the groove 42.

[0068] With the carrier plate 3 and the workpiece 7 immersed in the liquid 44 within the tank 42, when the carrier plate 3 is peeled off from the workpiece 7 by applying a downward force to the stepped portion 3c using the pushing member 26, the carrier plate 3 peeled off from the workpiece 7 falls into the liquid 44. As a result, compared to the case where the carrier plate 3 falls into the air, the impact accompanying the fall is reduced, and damage to the carrier plate 3 and vibration of the peeling device 22 can be prevented.

[0069] Alternatively, the liquid 44 may contain a surfactant. Anionic surfactants, cationic surfactants, or similar surfactants that readily penetrate the temporary adhesive layer 5 can be used as surfactants contained in the liquid 44. This allows the liquid 44 to contain a surfactant that readily penetrates the temporary adhesive layer 5, making it easier to separate the temporary adhesive layer 5 from the area penetrated by the surfactant, and thus more easily peeling the carrier plate 3 from the workpiece 7.

[0070] Alternatively, in the second modification, after immersing the carrier plate 3 and the workpiece 7 in the liquid 44, the pushing member 26 can be subjected to ultrasonic or other vibrations while applying a downward force to the stepped difference portion 3c using the pushing member 26. Specifically, the pushing member 26 is subjected to ultrasonic or other vibrations while applying a downward force to the stepped difference portion 3c using the pushing member 26. In this case, the carrier plate 3 can be more easily peeled from the workpiece 7 by the action of the vibration transmitted from the pushing member 26.

[0071] Similarly, after immersing the carrier plate 3 and the workpiece 7 in the liquid 44, the liquid 44 can be subjected to ultrasonic or other vibrations while the pushing member 26 applies a downward force to the stepped portion 3c. Specifically, ultrasonic or other vibrations are applied to the liquid 44 while the pushing member 26 applies a downward force to the stepped portion 3c. In this case, the carrier plate 3 can be more easily peeled off from the workpiece 7 by the action of the vibration transmitted from the liquid 44.

[0072] Alternatively, the first modification can be further combined with the second modification. That is, after immersing the carrier plate 3 and the workpiece 7 in the liquid 44, fluid can be blown between the carrier plate 3 and the workpiece 7 (corresponding to the area of ​​the temporary adhesive layer 5). For example, after blowing fluid 34 between the carrier plate 3 and the workpiece 7, a downward force can be applied to the stepped difference portion 3c using the pushing member 26, or a downward force can be applied to the stepped difference portion 3c using the pushing member 26 while blowing fluid 34 between the carrier plate 3 and the workpiece 7, thereby making it easier to peel the carrier plate 3 from the workpiece 7.

[0073] Furthermore, the structures and methods involved in the above-described embodiments and variations can be appropriately modified and implemented as long as they do not depart from the scope of the present invention.

Claims

1. A method for removing a carrier plate, comprising removing the carrier plate from a workpiece disposed on the front side of the carrier plate by means of a temporary adhesive layer, characterized in that, The method for removing the carrier plate includes the following steps: The step difference forming process involves processing the outer periphery of the carrier plate from the front side where the workpiece is located along the outer periphery of the carrier plate to form a step difference that protrudes laterally from the back side of the carrier plate compared to the front side of the carrier plate. In the pasting process, after the step difference formation process is performed, adhesive tape is pasted on the exposed front side of the workpiece on the side opposite to the carrier plate, and the outer periphery of the adhesive tape is pasted on the ring-shaped frame. The holding process involves holding the workpiece from above, with the workpiece positioned above the carrier plate, using a holding unit to hold it across the adhesive tape, after the bonding process has been performed; and In the carrier plate removal process, after the holding process, a pushing member applies a downward force to the stepped difference section, causing the carrier plate to move away from the workpiece, thereby removing the carrier plate from the workpiece. The adhesive tape has a through hole for the pushing component to pass through. In the carrier plate removal process, the pusher inserted into the through hole applies a downward force to the stepped portion to remove the carrier plate from the workpiece.

2. The method for removing the carrier plate according to claim 1, characterized in that, In the carrier plate removal process, after fluid is blown between the workpiece and the carrier plate, a downward force is applied to the stepped difference, or a downward force is applied to the stepped difference while fluid is blown between the workpiece and the carrier plate, thereby removing the carrier plate from the workpiece.

3. The method for removing the carrier plate according to claim 1, characterized in that, In the carrier plate removal process, while the workpiece and the carrier plate are immersed in liquid, a downward force is applied to the stepped section.

4. The method for removing the carrier plate according to claim 3, characterized in that, This allows the liquid to contain surfactants.

5. The method for removing the carrier plate according to claim 3 or 4, characterized in that, In the carrier plate removal process, while the workpiece and the carrier plate are immersed in the liquid, a downward force is applied to the stepped section while the pushing member is vibrated.

6. The method for removing the carrier plate according to claim 3 or 4, characterized in that, In the carrier plate removal process, while the workpiece and the carrier plate are immersed in the liquid, a downward force is applied to the stepped section while the liquid is vibrated.

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