Display panel

Abstract

The application discloses a display panel, which comprises a substrate, a protective layer, an electrode group, a light emitting element and a heat-conducting insulation layer. The substrate comprises a first surface, and the protective layer is arranged on the first surface of the substrate. The electrode group is arranged on the first surface of the substrate and the protective layer, wherein the electrode group comprises a first electrode and a second electrode, and the first electrode and the second electrode are spaced apart from each other. The light emitting element comprises a first contact pad and a second contact pad, and the first contact pad and the second contact pad of the light emitting element are electrically connected to the first electrode and the second electrode of the electrode group, respectively. The first electrode and the second electrode of the electrode group are contacted through the heat-conducting insulation layer, so that the light emitting element is bonded to the electrode group and the yield is improved.

Description

Technical Field

[0001] This invention relates to a display panel. Background Technology

[0002] Currently, the main bonding technology for light-emitting diodes (LEDs) is thermoforming. However, thermoforming requires high flatness, resulting in low mass production yield. This is especially true as the size of the LED decreases. To address this yield issue, bonding technology has gradually shifted from thermoforming to laser bonding.

[0003] To increase the number of LEDs that can be laser-bonded, multiple LEDs are laser-bonded simultaneously. However, if the same laser parameters are used for bonding, the materials and structures of LEDs emitting different colors will differ, leading to variations in the bonding and reducing the overall yield. Therefore, existing technologies need improvement. Summary of the Invention

[0004] Some embodiments of the present invention provide a display panel comprising a substrate, a protective layer, an electrode assembly, a light-emitting element, and a thermally conductive insulating layer. The substrate includes a first surface, and the protective layer is disposed on the first surface of the substrate. The electrode assembly is disposed on the first surface of the substrate and the protective layer, wherein the electrode assembly includes a first electrode and a second electrode, and the first electrode and the second electrode are spaced apart from each other. The light-emitting element includes a first pad and a second pad, the first pad and the second pad of the light-emitting element being electrically connected to the first electrode and the second electrode of the electrode assembly, respectively. The thermally conductive insulating layer contacts the first electrode and the second electrode of the electrode assembly.

[0005] In some embodiments, the first electrode includes a first bonding region disposed on a protective layer, and a first thermally conductive region adjacent to the first bonding region and disposed on the protective layer. The second electrode includes a second bonding region disposed on the protective layer, and a second thermally conductive region adjacent to the second bonding region and disposed on the protective layer. When projected perpendicularly onto the substrate, the first thermally conductive region, the second thermally conductive region, and the light-emitting element are spaced apart from each other.

[0006] In some embodiments, a thermally conductive insulating layer is disposed on the side of the protective layer opposite to the substrate, and completely covers the first thermally conductive area of ​​the first electrode and the second thermally conductive area of ​​the second electrode, wherein when projected vertically onto the substrate, the thermally conductive insulating layer is arranged around the light-emitting element.

[0007] In some embodiments, the thermally conductive insulating layer is disposed on the side of the protective layer opposite to the substrate.

[0008] In some embodiments, when projected vertically onto the substrate, a thermally conductive insulating layer is arranged around the light-emitting element.

[0009] In some embodiments, when projected vertically onto the substrate, the first thermally conductive region where the thermally conductive insulating layer overlaps with the first electrode and the second thermally conductive region where the thermally conductive insulating layer overlaps with the second electrode are located on the same side of the light-emitting element.

[0010] In some embodiments, the first electrode further includes a first extension extending from a first thermally conductive region in a first predetermined direction. The second electrode further includes a second extension extending from a second thermally conductive region in a second predetermined direction. The first and second predetermined directions are coplanar and intersect at an intersection point. The first and second extensions are spaced apart from each other. A thermally conductive insulating layer is disposed at the intersection point and covers the first and second extensions.

[0011] In some embodiments, a laser heating region is defined on the thermally conductive insulating layer. When projected vertically onto the substrate, the laser heating region is adjacent to the same side of the first electrode and the second electrode. The distance between the centroid of the laser heating region and the centroid of the first electrode, and the distance between the centroid of the laser heating region and the centroid of the second electrode are equal.

[0012] In some implementations, the display panel also includes a heating head disposed in the laser heating zone, the heating head providing a heat source.

[0013] In some embodiments, a laser heating region is defined on the thermally conductive insulating layer, and when projected perpendicularly onto the substrate, the distance between the centroid of the laser heating region and the centroid of the first electrode, and the distance between the centroid of the laser heating region and the centroid of the second electrode are equal.

[0014] In some implementations, the display panel also includes a heating head disposed in the laser heating zone, the heating head providing a heat source.

[0015] In some embodiments, there are multiple electrode groups, respectively disposed on a first surface of the substrate and a protective layer. Each first electrode is spaced apart from each other, and each second electrode is also spaced apart from each other. There are multiple light-emitting elements, with a first pad and a second pad of each light-emitting element electrically connected to the first electrode and the second electrode of each electrode group, respectively. A thermally conductive insulating layer is connected to the first electrode and the second electrode of at least two adjacent light-emitting elements.

[0016] In some embodiments, a thermally conductive insulating layer covers the same side of the first and second electrodes that are electrically connected to adjacent light-emitting elements.

[0017] In some embodiments, a thermally conductive insulating layer is disposed between the substrate and the protective layer.

[0018] In some embodiments, the protective layer disposed above the thermally conductive insulating layer is made of a low-reflectivity material including silicon oxide, silicon nitride, silicon nitride, or a combination thereof.

[0019] In some embodiments, the substrate further includes a second surface disposed opposite to the first surface.

[0020] In some embodiments, the thermally conductive insulating layer includes a layer disposed under the second surface of the substrate, and two pillars penetrating the substrate and the protective layer, with the pillars respectively contacting the first electrode and the second electrode.

[0021] In some embodiments, the substrate includes transistors connected to light-emitting elements.

[0022] In some implementations, with the substrate as the bottom layer, the upper surface of the thermally conductive insulating layer is positioned lower than the lower surface of the light-emitting element in a cross-section perpendicular to the substrate.

[0023] In some embodiments, the protective layer disposed beneath the thermally conductive insulating layer is made of a highly reflective material including silicon, germanium, or a combination thereof.

[0024] In some embodiments, the thermally conductive insulating layer is made of an anti-reflective material, including cobalt-like carbon, ceramic materials, or combinations thereof.

[0025] In some implementations, the light-emitting element is a light-emitting diode chip.

[0026] Some embodiments of the present invention also provide a display panel, comprising a substrate, a protective layer, a plurality of electrode groups, a plurality of light-emitting elements, and a plurality of thermally conductive insulating layers. The substrate includes a first surface, and the protective layer is disposed on the first surface of the substrate. The plurality of electrode groups are respectively disposed on the first surface of the substrate and the protective layer, and the electrode groups are spaced apart from each other. Each electrode group includes a first electrode and a second electrode, and the first electrode and the second electrode are spaced apart from each other. Each light-emitting element includes a first pad and a second pad, and the first pad and the second pad of each light-emitting element are electrically connected to the first electrode and the second electrode of each electrode group, respectively. Each thermally conductive insulating layer is in contact with the first electrode and the second electrode of at least two adjacent electrode groups, and the thermally conductive insulating layers are spaced apart from each other.

[0027] In some embodiments, each thermally conductive insulating layer covers the same side of the first and second electrodes that are electrically connected to adjacent light-emitting elements.

[0028] In some embodiments, each thermally conductive insulating layer is disposed between the substrate and the protective layer.

[0029] In some embodiments, the substrate further includes a second surface disposed opposite to the first surface. Each thermally conductive insulating layer includes a layer disposed on the second surface of the substrate, and two pillars penetrating the substrate and the protective layer, with the pillars respectively contacting the first electrode and the second electrode. Attached Figure Description

[0030] The various aspects of the invention will be most readily understood when read in conjunction with the accompanying drawings in the following detailed description. It should be noted that, according to industry standard operating procedures, the various features may not be drawn to scale. In fact, for clarity of explanation, the dimensions of the various features can be arbitrarily increased or decreased. To make the above and other objects, features, advantages, and embodiments of the invention more apparent, the accompanying drawings are described below:

[0031] Figure 1 A top view illustrating a display panel of some embodiments of the present invention.

[0032] Figure 2 Draw Figure 1 A cross-sectional view along section line 2-2.

[0033] Figure 3 A top view of a display panel illustrating some embodiments of the present invention, showing a thermally conductive insulating layer surrounding a light-emitting element and partially covering an electrode assembly.

[0034] Figure 4 A top view illustrating a display panel in which a thermally conductive insulating layer partially covers an electrode assembly located on the same side as a light-emitting element, according to some embodiments of the present invention.

[0035] Figure 5 A top view illustrating a display panel having first and second extensions according to some embodiments of the present invention.

[0036] Figure 6 A cross-sectional view of a display panel illustrating a direct contact heating thermally conductive insulating layer according to some embodiments of the present invention is shown.

[0037] Figure 7 A top view of a display panel illustrating multiple light-emitting elements and multiple electrode groups according to some embodiments of the present invention.

[0038] Figure 8 A cross-sectional view of a display panel in which a thermally conductive insulating layer is embedded between a substrate and an insulating layer, illustrating some embodiments of the present invention.

[0039] Figure 9 A cross-sectional view of a display panel having a thermally conductive insulating layer disposed on the bottom surface of a substrate, illustrating some embodiments of the present invention.

[0040] Symbol Explanation

[0041] 10, 10', 10”, 10”': Display panel

[0042] 100: Substrate

[0043] 102: First Page

[0044] 104: Second Page

[0045] 110: Base

[0046] 120: Gate insulating layer

[0047] 130: Interlayer insulation layer

[0048] 140: Active (Powered) Components

[0049] 142: Gate

[0050] 144: Source

[0051] 146: Drain

[0052] 148: Channel Layer

[0053] 200: Protective layer

[0054] 300: Electrode assembly

[0055] 310: First electrode

[0056] 311: Centroid

[0057] 312: First Integration Zone

[0058] 313: First conductive post

[0059] 314: First heat conduction zone

[0060] 316: First Extension

[0061] 320: Second electrode

[0062] 321: Centroid

[0063] 322: Second Integration Zone

[0064] 324: Second heat conduction zone

[0065] 326: Second Extension

[0066] 400: Light-emitting element

[0067] 402: Lower surface

[0068] 410: First bonding pad

[0069] 420: Second pad

[0070] 430: Ontology

[0071] 500: Thermally conductive insulating layer

[0072] 502: Upper surface

[0073] 510: Laser heating zone

[0074] 512: Centroid

[0075] 520: Layer

[0076] 530: Column

[0077] 600: Heating head

[0078] D1: First predetermined direction

[0079] D2: Second predetermined direction

[0080] L1: Distance

[0081] L2: Distance

[0082] S: Solder Detailed Implementation

[0083] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" can refer to the presence of other elements between two elements.

[0084] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.

[0085] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0086] Please see Figure 1 and Figure 2 , Figure 1A top view illustrating a display panel according to some embodiments of the present invention is shown. Figure 2 Draw Figure 1 A cross-sectional view along section line 2-2. The display panel 10 includes a substrate 100, a protective layer 200, an electrode assembly 300, a light-emitting element 400, and a thermally conductive insulating layer 500.

[0087] The substrate 100 includes a first surface 102 and a second surface 104 opposite to the first surface 102. In some embodiments, the substrate 100 includes a substrate 110, a gate insulator (GI), an interlayer dielectric layer (ILD), and an active element 140. In some embodiments, the active element 140 is disposed on the substrate 110 and includes a gate 142, a source 144, a drain 146, and a channel layer 148, but is not limited thereto. In some embodiments, the substrate 100 includes the substrate 110, the gate insulator 120, and the interlayer dielectric layer 130 sequentially disposed from bottom to top, with the gate 142 disposed on the gate insulator 120 and embedded by the interlayer dielectric layer 130. The source 144 and the drain 146 are disposed separately on the interlayer dielectric layer 130 and covered by a protective layer 200. The channel layer 148 is disposed on the substrate 110 and covered by the gate insulating layer 120. The source 144 and the drain 146 are electrically connected to the channel layer 148, respectively.

[0088] In some embodiments, the material of substrate 110 may include semiconductor elements such as germanium (Ge) or compound semiconductors such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), and indium phosphide (InP), for example, glass. The material of gate insulating layer 120 may include silicon oxide, silicon nitride, silicon oxide nitride, oxide / nitride / oxide (ONO), and high-k dielectric materials having a higher dielectric constant than silicon oxide. The material of interlayer insulating layer 130 may include silicon oxide, silicon nitride, silicon oxide nitride, or combinations thereof. The material of channel layer 148 may include amorphous silicon (a-Si).

[0089] A protective layer 200 is disposed on the first surface 102 of the substrate 100. In some embodiments, the protective layer 200 disposed under the thermally conductive insulating layer 500 is a highly reflective material (i.e., a low-absorption material), such as silicon, germanium, or a combination thereof. Furthermore, if the protective layer 200 is a low-absorption material for infrared laser wavelengths of 1064 nm, the thickness of the protective layer 200 does not need to be particularly limited. In other embodiments, the protective layer 200 disposed on the thermally conductive insulating layer 500 is a low-reflective material, such as silicon oxide, silicon nitride, silicon oxide nitride, or a combination thereof.

[0090] An electrode assembly 300 is disposed on the first surface 102 of the substrate 100 and the protective layer 200. The electrode assembly 300 includes a first electrode 310 and a second electrode 320, and the first electrode 310 and the second electrode 320 are spaced apart from each other. In other words, the first electrode 310 and the second electrode 320 are not connected to each other. In some embodiments, the first electrode 310 includes a first bonding region 312, a first conductive post 313, and a first thermally conductive region 314. The first bonding region 312 is disposed on the protective layer 200. One end of the first conductive post 313 is connected to the first surface 102 of the substrate 100, and the other end is connected to the first bonding region 312. The first thermally conductive region 314 is adjacent to the first bonding region 312 and is disposed on the protective layer 200. In some embodiments, the second electrode 320 includes a second bonding region 322, a second conductive post 323, and a second thermally conductive region 324. The second bonding region 322 is disposed on the protective layer 200. One end of the second conductive post 323 is connected to the first surface 102 of the substrate 100, and the other end is connected to the second bonding region 322. The second thermally conductive region 324 is adjacent to the second bonding region 322 and is disposed on the protective layer 200. When projected perpendicularly onto the substrate 100, the first thermally conductive region 314, the second thermally conductive region 324, and the light-emitting element 400 are spaced apart from each other (i.e., do not overlap). In some embodiments, the material of the electrode assembly 300 may include copper, tin, gold, silver, nickel, their alloys, or other metal alloys. In some embodiments, the second electrode 320 is electrically connected to the drain electrode 146.

[0091] The light-emitting element 400 includes a first pad 410, a second pad 420, and a body 430. The first pad 410 and the second pad 420 (or first leads and second leads) are disposed under the body 430. The first pad 410 and the second pad 420 of the light-emitting element 400 are electrically connected to the first electrode 310 and the second electrode 320 of the electrode assembly 300, respectively. In some embodiments, the first pad 410 and the second pad 420 of the light-emitting element 400 are electrically connected to the first electrode 310 and the second electrode 320 of the electrode assembly 300, respectively, through solder S or conductive adhesive, wherein the solder S includes tin, etc., and the conductive adhesive includes silver paste, anisotropic conductive adhesive, or the like. In some embodiments, the light-emitting element 400 may include a light-emitting diode chip, such as a sub-millimeter light-emitting diode (mini LED) chip or a micro light-emitting diode (micro LED) chip.

[0092] A thermally conductive insulating layer 500 is disposed on the side of the protective layer 200 opposite to the substrate 100, and completely covers the first thermally conductive area 314 of the first electrode 310 and the second thermally conductive area 324 of the second electrode 320 to facilitate heat conduction. Specifically, when projected vertically onto the substrate 100, the thermally conductive insulating layer 500 is arranged around the light-emitting element 400, but avoids the first pad 410 and the second pad 420 of the light-emitting element 400 (or there is a gap between the thermally conductive insulating layer 500 and the light-emitting element 400, maintaining a slight distance and not being in close contact), so that the light-emitting element 400 can be easily aligned with the first bonding area 312 of the first electrode 310 and the second bonding area 322 of the second electrode 320 during bonding, avoiding misalignment and bonding to the thermally conductive insulating layer 500; or, so that the first pad 410 and the second pad 420 will not be damaged when the light-emitting element 400 needs to be removed for repair.

[0093] In some embodiments, the material of the thermally conductive insulating layer 500 may include ceramic materials, diamond-like carbon (DLC), or combinations thereof. In some embodiments, when the thermally conductive insulating layer 500 fully covers the first electrode 310 and the second electrode 320 (while still avoiding the first pad 410 and the second pad 420 of the light-emitting element 400), and the material is black such as diamond-like carbon, it increases laser thermal conductivity and provides optical anti-reflection. Furthermore, because the thermally conductive insulating layer 500 has a dark perimeter, the solder S or conductive adhesive on the first pad 410 and the second pad 420 is more visible under ambient light, resulting in higher color contrast and making it easier to align the light-emitting element 400.

[0094] In some embodiments, the protective layer 200 disposed under the thermally conductive insulating layer 500 is a highly reflective material, such as silicon, germanium, or a combination thereof. When the laser heats the thermally conductive insulating layer 500, the heat energy in the thermally conductive insulating layer 500 is further transferred to the first thermally conductive region 314 of the first electrode 310 and the second thermally conductive region 324 of the second electrode 320, and then to the first bonding region 312 and the second bonding region 322, respectively. Finally, solder S is introduced between the first bonding region 312 and the first pad 410, and between the second bonding region 322 and the second pad 420, for welding. Through the thermally conductive insulating layer 500 and the highly reflective protective layer 200, when the laser heats the thermally conductive insulating layer 500, the highly reflective protective layer 200 can reflect the heat energy back to the first bonding region 312, the second bonding region 322, and the thermally conductive insulating layer 500, thereby reducing the heat energy transferred downward to the substrate 100 and avoiding damage, such as avoiding damage to the active element 140 or deformation of the substrate 100 due to high heat.

[0095] In some embodiments, in cross-section, the height of the thermally conductive insulating layer 500 is lower than the location of the body 430 of the light-emitting element 400 to improve the bonding yield. Specifically, the upper surface 502 of the thermally conductive insulating layer 500 is located lower than the lower surface 402 of the light-emitting element 400.

[0096] In some embodiments, the thermally conductive insulating layer 500 defines a laser heating region 510. The distance L1 between the centroid 512 of the laser heating region 510 and the centroid 311 of the first electrode 310, and the distance L2 between the centroid 512 of the laser heating region 510 and the centroid 321 of the second electrode 320, are equal. This ensures that the solder S between the first bonding area 312 and the first pad 410 of the first electrode 310, and the solder S between the second bonding area 322 and the second pad 420 of the second electrode 320, are uniformly heated to achieve welding. In other embodiments, in addition to the distances L1 and L2 being the same, the thermally conductive insulating layer 500 covers the same area of ​​the first electrode 310 and the second electrode 320. This ensures that the solder S located in the first bonding area 312 and the second bonding area 322 are uniformly heated, thereby improving the welding yield. In this document, "centroid" refers to the geometric center or centroid of an object K in n-dimensional space, which is the intersection of all hyperplanes that divide the object K into two equal parts. If the mass of an object is evenly distributed, its centroid is its center of gravity.

[0097] In some embodiments, an infrared laser (e.g., with a wavelength of 1064 nanometers) is applied to the laser heating area 510, and the heat energy is conducted through the thermally conductive insulating layer 500 to the solder S between the first bonding area 312 and the first pad 410 of the first electrode 310, and the solder S between the second bonding area 322 and the second pad 420 of the second electrode 320, thereby achieving welding.

[0098] In some embodiments, after the laser fabrication process is completed (i.e., after the light-emitting element 400 is welded to the electrode assembly 300 via the thermally conductive insulating layer 500), the light-emitting element 400 and the thermally conductive insulating layer 500 (not shown) are completely covered with optical adhesive (OCA) for protection and optical purposes. In addition to covering the light-emitting surface of the light-emitting element 400 (e.g., the upper surface of the body 430), the optical adhesive also partially or completely fills the space below the light-emitting element 400. For example, the space formed below the body 430, above the protective layer 200, and between the first pad 410 and the second pad 420.

[0099] Please also refer to Figure 2 and Figure 3 , Figure 3 A top view of a display panel illustrating some embodiments of the present invention, showing a thermally conductive insulating layer surrounding a light-emitting element and partially covering an electrode assembly. Figure 3 Some implementation methods and Figure 1Some implementations differ in that, when projected vertically onto the substrate 100, the thermally conductive insulating layer 500 is arranged around the light-emitting element 400 and exposes portions of the first electrode 310 and the second electrode 320. Specifically, the thermally conductive insulating layer 500 does not completely cover the first electrode 310 and the second electrode 320, but exposes a portion of the first thermally conductive area 314 of the first electrode 310 and a portion of the second thermally conductive area 324 of the second electrode 320, so that the light-emitting element 400 retains a working distance to facilitate the work when bonding or removing it for repair.

[0100] Please also refer to Figure 2 and Figure 4 , Figure 4 A top view illustrating a display panel in which a thermally conductive insulating layer partially covers an electrode assembly located on the same side as a light-emitting element, according to some embodiments of the present invention. Figure 4 Some implementation methods and Figure 3 Some implementations differ in that, when projected vertically onto the substrate 100, the first thermally conductive region 314 overlapping the thermally conductive insulating layer 500 with the first electrode 310 and the second thermally conductive region 324 overlapping the thermally conductive insulating layer 500 with the second electrode 320 are located on the same side of the light-emitting element 400. Specifically, the lower left corner of the first thermally conductive region 314 and the lower right corner of the second thermally conductive region 324 are covered by the thermally conductive insulating layer 500. The small area of ​​the thermally conductive insulating layer 500 is sufficient to allow heat energy to be transferred through the thermally conductive insulating layer 500 to the first electrode 310 and the second electrode 320 to complete the welding operation.

[0101] Furthermore, the laser heating zone 510 is located on the same side as the first electrode 310 and the second electrode 320, for example, on the side below the first electrode 310 and the second electrode 320. The distance L1 between the centroid 512 of the laser heating zone 510 and the centroid 311 of the first electrode 310 is equal to the distance L2 between the centroid 512 of the laser heating zone 510 and the centroid 321 of the second electrode 320, so that the solder S can be heated evenly to achieve welding.

[0102] Please also refer to Figure 2 and Figure 5 , Figure 5 A top view illustrating a display panel having first and second extensions according to some embodiments of the present invention. Figure 5 Some implementation methods and Figure 4The difference in some implementations is that the first electrode 310 further includes a first extension 316, which extends from the first heat-conducting region 314 toward a first predetermined direction D1; the second electrode 320 further includes a second extension 326, which extends from the second heat-conducting region 324 toward a second predetermined direction D2. The first predetermined direction D1 and the second predetermined direction D2 are both on the same plane and intersect at the intersection. The first extension 316 and the second extension 326 are spaced apart from each other and are not connected. The thermally conductive insulating layer 500 is disposed at the intersection and covers the first extension 316 and the second extension 326. Through the first extension 316 and the second extension 326, the laser heating region 510 can be heated away from the light-emitting element 400, or heated away from the position of the active element 140 in the substrate 100 below the thermally conductive insulating layer 500, so as to avoid damage to the active element 140. Furthermore, the orientation of the first extension 316 and the second extension 326 can be adjusted in different directions as needed.

[0103] Please see Figure 1 and Figure 6 , Figure 6 A cross-sectional view of a display panel illustrating a direct contact heating thermally conductive insulating layer according to some embodiments of the present invention is shown. Figure 6 Some implementation methods and Figure 2 Some implementations differ in that the display panel 10 also includes a heating head 600 disposed in the laser heating zone 510, which provides a heat source. Specifically, the heating head 600, such as a probe-type welding head, directly contacts the laser heating zone 510, conducting heat energy through the thermally conductive insulating layer 500 to the solder S between the first bonding area 312 and the first pad 410 of the first electrode 310, and the solder S between the second bonding area 322 and the second pad 420 of the second electrode 320, thereby achieving welding. Other implementations include... Figure 1 Implementation methods Figure 3 Implementation methods Figure 4 Implementation methods, or Figure 5 Alternatively, the method of applying laser to the laser heating zone 510 can be changed to heating by having the heating head 600 directly contact the laser heating zone 510.

[0104] Please see Figure 6 and Figure 7 , Figure 7 A top view of a display panel illustrating multiple light-emitting elements and multiple electrode groups according to some embodiments of the present invention. Figure 7 Some implementation methods and Figure 1Some implementations differ in that the display panel 10' has multiple electrode groups 300, multiple light-emitting elements 400, and a thermally conductive insulating layer 500 connected to a first electrode 310 and a second electrode 320 electrically connected to at least two adjacent light-emitting elements 400. Each thermally conductive insulating layer 500 is spaced apart from the others (i.e., not connected). Specifically, electrode groups 300 are respectively disposed on the first surface 102 of the substrate 100 and the protective layer 200. The first electrodes 310 and the second electrodes 320 are spaced apart from each other. The first pad 410 and the second pad 420 of the light-emitting elements 400 are electrically connected to the first electrode 310 and the second electrode 320 of the electrode groups 300, respectively. The first electrode 310 and the second electrode 320 of three adjacent light-emitting elements 400 (such as red, green, and blue light-emitting diodes) are connected to the thermally conductive insulating layer 500. That is, the thermally conductive insulating layer 500 covers the same side of the first electrode 310 and the second electrode 320, which are electrically connected to the three adjacent light-emitting elements 400. In other words, the thermally conductive insulating layer 500 can connect multiple light-emitting diodes in series. The laser heating area 510 is elongated and the laser beam is elongated, allowing for one-time laser heating. This avoids the disadvantage that the laser needs to be supplied with energy directly above the light-emitting element 400, which would require different laser energies for bonding different colored light-emitting elements 400. This increases the feasibility and yield of mass production.

[0105] Furthermore, the multiple thermally conductive insulating layers 500 are separated from each other (i.e., not connected), for example: the first electrode 310 and the second electrode 320 of three adjacent light-emitting elements 400 are connected to one of the thermally conductive insulating layers 500, and the first electrode 310 and the second electrode 320 of another three adjacent light-emitting elements 400 are connected to another thermally conductive insulating layer 500, and the two thermally conductive insulating layers 500 are separated from each other and not connected.

[0106] Please see Figure 8 , Figure 8 A cross-sectional view of a display panel in which a thermally conductive insulating layer is embedded between a substrate and an insulating layer, illustrating some embodiments of the present invention. Figure 8 Some implementation methods and Figure 2Some implementations differ in that the thermally conductive insulating layer 500 in the display panel 10” is disposed between the substrate 100 and the protective layer 200. Specifically, the thermally conductive insulating layer 500 is embedded in the protective layer 200 and contacts the first electrode 310 and the second electrode 320, but does not contact the active element 140 of the substrate 100. The material of the protective layer 200 above the thermally conductive insulating layer 500 is a low-reflectivity material, including silicon oxide, silicon nitride, silicon nitride, or combinations thereof, so that laser thermal energy can be smoothly transferred to the thermally conductive insulating layer 500. The protective layer 200 below the thermally conductive insulating layer 500 is a high-reflectivity material, such as silicon, germanium, or combinations thereof, so that the heat energy of the thermally conductive insulating layer 500 is reflected back to the thermally conductive insulating layer 500 and is no longer transferred downward to the substrate 100.

[0107] Please see Figure 9 , Figure 9 A cross-sectional view of a display panel having a thermally conductive insulating layer disposed on the bottom surface of a substrate, illustrating some embodiments of the present invention. Figure 9 Some implementation methods and Figure 2 Some implementations differ in that the thermally conductive insulating layer 500 in the display panel 10”' includes a layer 520 and two pillars 530. The layer 520 is disposed on the second surface 104 of the substrate 100, and the pillars 530 penetrate the substrate 100 and the protective layer 200, with the two pillars 530 respectively contacting the first electrode 310 and the second electrode 320. Specifically, the thermally conductive insulating layer 500 can be formed on the bottom surface of the substrate 110 to avoid the need for the laser to be powered directly above the light-emitting element 400, thereby increasing the feasibility of mass production and yield. In detail, the fabrication process involves drilling multiple through holes in the substrate 100 and the protective layer 200 until the lower surfaces of the first electrode 310 and the second electrode 320 are exposed. Then, the thermally conductive insulating layer 500 is disposed on the second surface 104 of the substrate 100 and fills the through holes to form the pillars 530.

[0108] In some embodiments of the present invention, a display panel is provided in which a thermally conductive insulating layer contacts a first electrode and a second electrode, so that the thermally conductive insulating layer can transfer heat energy to the first electrode and the second electrode, thereby achieving the purpose of bonding the light-emitting element to the electrode group and improving the yield.

[0109] Although the present invention has been disclosed above by way of embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A display panel, comprising: The substrate includes a first surface; A protective layer is disposed on the first surface of the substrate; At least one electrode group is disposed on the first surface of the substrate and the protective layer, wherein the at least one electrode group includes a first electrode and a second electrode, and the first electrode and the second electrode are spaced apart from each other. At least one light-emitting element, comprising a first pad and a second pad, wherein the first pad and the second pad of the at least one light-emitting element are respectively electrically connected to the first electrode and the second electrode of the at least one electrode group; and At least one thermally conductive insulating layer is disposed on the substrate and contacts the first electrode and the second electrode of the at least one electrode assembly. The material of the thermally conductive insulating layer includes ceramic materials, cobalt-like carbon, or combinations thereof. A laser heating area is defined on the at least one thermally conductive insulating layer. When projected vertically onto the substrate, the laser heating area is adjacent to the same side of the first electrode and the second electrode. The distance between the centroid of the laser heating area and the centroid of the first electrode, and the distance between the centroid of the laser heating area and the centroid of the second electrode are equal.

2. The display panel as claimed in claim 1, wherein The first electrode includes: The first bonding area is located on the protective layer; and The first heat-conducting zone is adjacent to the first bonding zone and is disposed on the protective layer; The second electrode comprises: The second bonding area is located on the protective layer; and The second heat-conducting zone is adjacent to the second bonding zone and is disposed on the protective layer. When projected vertically onto the substrate, the first heat-conducting area, the second heat-conducting area, and the light-emitting element are separated from each other.

3. The display panel as claimed in claim 2, wherein the at least one thermally conductive insulating layer is disposed on the side of the protective layer opposite to the substrate, and completely covers the first thermally conductive area of ​​the first electrode and the second thermally conductive area of ​​the second electrode. When projected vertically onto the substrate, at least one thermally conductive insulating layer is arranged around the light-emitting element.

4. The display panel as claimed in claim 1, wherein the at least one thermally conductive insulating layer is disposed on the side of the protective layer opposite to the substrate.

5. The display panel as claimed in claim 1, wherein when projected vertically onto the substrate, the at least one thermally conductive insulating layer is disposed around the light-emitting element.

6. The display panel of claim 1, wherein when projected vertically onto the substrate, the first thermally conductive area where the at least one thermally conductive insulating layer overlaps with the first electrode and the second thermally conductive area where the thermally conductive insulating layer overlaps with the second electrode are located on the same side of the light-emitting element.

7. The display panel as claimed in claim 2, wherein The first electrode further includes a first extension that extends from the first heat-conducting region toward a first predetermined direction; The second electrode further includes a second extension that extends from the second heat-conducting area toward a second predetermined direction. The first predetermined direction and the second predetermined direction are on the same plane and intersect at the intersection. The first extension and the second extension are spaced apart from each other. At least one thermally conductive insulating layer is disposed at the junction and covers the first extension and the second extension.

8. The display panel as claimed in claim 1 further includes a heating head disposed in the laser heating area, the heating head providing a heat source.

9. The display panel as claimed in claim 6 or 7, wherein a laser heating area is defined on the at least one thermally conductive insulating layer, and when projected vertically onto the substrate, the distance between the centroid of the laser heating area and the centroid of the first electrode, and the distance between the centroid of the laser heating area and the centroid of the second electrode are equal.

10. The display panel of claim 9 further includes a heating head disposed in the laser heating zone, the heating head providing a heat source.

11. The display panel as claimed in claim 1, wherein The number of at least one electrode group is multiple, respectively disposed on the first surface of the substrate and the protective layer, each of the first electrodes is spaced apart from each other, and each of the second electrodes is spaced apart from each other; The number of the at least one light-emitting element is multiple, and the first pad and the second pad of each light-emitting element are respectively electrically connected to the first electrode and the second electrode of each electrode group; The at least one thermally conductive insulating layer is connected to the first electrodes and the second electrodes that are electrically connected to at least two adjacent light-emitting elements.

12. The display panel of claim 11, wherein the at least one thermally conductive insulating layer covers the same side of the first electrodes and the second electrodes electrically connected to the adjacent light-emitting elements.

13. The display panel of claim 1, wherein the at least one thermally conductive insulating layer is disposed between the substrate and the protective layer.

14. The display panel of claim 13, wherein the material of the protective layer disposed above the at least one thermally conductive insulating layer is a low-reflectivity material comprising silicon oxide, silicon nitride, silicon nitride, or a combination thereof.

15. The display panel as claimed in claim 1, wherein: The substrate further includes a second surface, which is disposed opposite to the first surface; The at least one thermally conductive insulating layer comprises: A layer is disposed beneath the second surface of the substrate; and Two pillars penetrate the substrate and the protective layer, and the pillars are in contact with the first electrode and the second electrode, respectively.

16. The display panel of claim 1, wherein the substrate includes a transistor connected to the at least one light-emitting element.

17. The display panel of claim 1, wherein, with the substrate as the bottom layer, in a cross section perpendicular to the substrate, the upper surface of the at least one thermally conductive insulating layer is positioned lower than the lower surface of the light-emitting element.

18. The display panel of claim 1, wherein the material of the protective layer disposed beneath the at least one thermally conductive insulating layer is a highly reflective material comprising silicon, germanium, or a combination thereof.

19. The display panel as claimed in claim 1, wherein the light-emitting element is a light-emitting diode chip.

20. A display panel comprising: The substrate includes a first surface; A protective layer is disposed on the first surface of the substrate; Multiple electrode groups are respectively disposed on the first surface of the substrate and the protective layer, and each electrode group is separated from each other. Each electrode group includes a first electrode and a second electrode, and the first electrode and the second electrode are separated from each other. Multiple light-emitting elements, each light-emitting element including a first pad and a second pad, wherein the first pad and the second pad of each light-emitting element are respectively electrically connected to the first electrode and the second electrode of each electrode group; as well as Multiple thermally conductive insulating layers, each of which is in contact with the first and second electrodes of at least two adjacent electrode groups, and each of the thermally conductive insulating layers is spaced apart from each other, the material of the thermally conductive insulating layer including ceramic material, cobalt-like carbon, or a group thereof.

21. The display panel of claim 20, wherein each of the thermally conductive insulating layers covers the same side of the first electrodes and the second electrodes electrically connected to the three adjacent light-emitting elements.

22. The display panel of claim 20, wherein each of the thermally conductive insulating layers is disposed between the substrate and the protective layer.

23. The display panel as claimed in claim 20, wherein: The substrate further includes a second surface, which is disposed opposite to the first surface; Each of these thermally conductive insulating layers includes: A layer, disposed on the second surface of the substrate; and Two pillars penetrate the substrate and the protective layer, and the pillars are in contact with the first electrode and the second electrode, respectively.

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