Display panel and display device

Abstract

The present application provides a display panel and a display device, wherein the display panel includes a display area and a non-display area, the display area and the non-display area being adjacent to each other, and the display panel further includes an insulating thermally conductive film, a pixel light-emitting unit, and a heat dissipation structure formed by protrusions of multiple film layers, wherein the heat dissipation structure is formed in the non-display area, the insulating thermally conductive film and the pixel light-emitting unit are formed in the display area, and the insulating thermally conductive film surrounds the periphery of the pixel light-emitting unit, and the insulating thermally conductive film is at least partially connected to the heat dissipation structure to conduct the heat generated by the pixel light-emitting unit to the heat dissipation structure. In the display panel of the present application, by providing an insulating thermally conductive film in the display area and providing a heat dissipation structure formed by protrusions of multiple film layers in the non-display area, the insulating thermally conductive film can transfer the heat generated by the pixel light-emitting unit to the heat dissipation structure in the non-display area for heat dissipation. In this way, the heat dissipation area of ​​the display panel is effectively increased, the heat dissipation effect is improved, and the problems of reduced light efficiency and color deviation of the display panel are avoided.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel and a display device. Background Art

[0002] Micro-LEDs offer advantages such as thinness, long lifespan, and low power consumption, making them a new generation of display technology. However, the external quantum efficiency of Micro-LEDs currently is generally 20%-30%, making luminous efficiency low. The remaining 70%-80% is converted into heat. Furthermore, the extremely small size of Micro-LED devices makes it difficult to dissipate the heat generated, increasing the junction temperature of the LEDs, resulting in reduced luminous efficiency and color shift. Furthermore, more energy is converted into heat, exacerbating LED degradation. Summary of the Invention

[0003] In view of this, the present application provides a display panel and a display device.

[0004] The display panel of the embodiment of the present application includes a display area and a non-display area, and the display area and the non-display area are adjacent to each other. The display panel also includes an insulating thermally conductive film, a pixel light-emitting unit and a heat dissipation structure formed by multi-film layer protrusions. The heat dissipation structure is formed in the non-display area, and the insulating thermally conductive film and the pixel light-emitting unit are formed in the display area. In addition, the insulating thermally conductive film surrounds the periphery of the pixel light-emitting unit, and the insulating thermally conductive film is at least partially connected to the heat dissipation structure to conduct the heat generated by the pixel light-emitting unit to the heat dissipation structure.

[0005] In some embodiments, the insulating thermally conductive film includes an extending portion, and the extending portion extends from the display area to the non-display area to connect to the heat dissipation structure.

[0006] In some embodiments, the insulating thermally conductive film is further formed in the non-display area, and the insulating thermally conductive film in the non-display area at least partially covers the surface of the heat dissipation structure.

[0007] In some embodiments, the heat dissipation structure includes a plurality of heat dissipation structures, and the plurality of heat dissipation structures are arranged at intervals around the display area.

[0008] In some embodiments, the display panel includes a base substrate, a first buffer layer, a second buffer layer, an insulating layer, an interlayer dielectric layer, a first flat layer, a passivation layer, and a second flat layer stacked in sequence. The interlayer dielectric layer, the first flat layer, the passivation layer, and the second flat layer located in the non-display area protrude from the insulating layer to form the heat dissipation structure, or the first flat layer, the passivation layer, and the second flat layer located in the non-display area protrude from the interlayer dielectric layer to form the heat dissipation structure.

[0009] In certain embodiments, the insulating thermally conductive film is formed on the second planar layer.

[0010] In some embodiments, the cross-section of the heat dissipation structure is trapezoidal.

[0011] In certain embodiments, the insulating thermally conductive film includes one or more of aluminum nitride, silicon carbide, beryllium oxide, or boron nitride.

[0012] In some embodiments, the pixel light emitting unit includes a first sub-pixel, a second sub-pixel, and a third sub-pixel, the first sub-pixel is green, the second sub-pixel is blue, and the third sub-pixel is red.

[0013] A display device according to an embodiment of the present application includes the display panel described in any one of the above embodiments.

[0014] In the display panel and display device of the present application, an insulating thermally conductive film is formed in the display area and a heat dissipation structure with multiple film layer protrusions is formed in the non-display area. The insulating thermally conductive film is at least partially connected to the heat dissipation structure. On the one hand, the insulating thermally conductive film utilizes the temperature difference between the display area and the non-display area to evenly distribute the temperature on the display panel, thereby avoiding the generation of hot spots. In addition, the insulating thermally conductive film can conduct the heat generated by the pixel light-emitting unit to the heat dissipation structure, so that the insulating thermally conductive film and the heat dissipation structure can dissipate heat simultaneously, further improving the heat dissipation capacity of the display panel. On the other hand, the heat dissipation structure formed by the multiple film layer protrusions can increase the area of ​​contact between the heat dissipation structure and the air, thereby further improving the heat dissipation effect. In this way, problems such as reduced light efficiency and color shift in the display panel are effectively avoided.

[0015] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0017] Figure 1 2 is a schematic plan view of a display panel according to an embodiment of the present application.

[0018] Figure 2 yes Figure 1 Schematic cross-section of the number II.

[0019] Figure 3 yes Figure 1 Schematic cross-section of number III.

[0020] Figure 42 is a schematic plan view of a display panel according to an embodiment of the present application.

[0021] Figure 5 yes Figure 4 Schematic diagram of the cross section marked with number V.

[0022] Figure 6 yes Figure 4 Schematic cross-section of section VI.

[0023] Description of main component symbols:

[0024] Display panel 10, display area 101, non-display area 102, first side 1022, second side 1024, pixel light emitting unit 12, first sub-pixel 122, second sub-pixel 124, third sub-pixel 126, insulating thermally conductive film 14, extension portion 141, heat dissipation structure 16;

[0025] The base substrate 110 , the first buffer layer 120 , the second buffer layer 130 , the insulating layer 140 , the interlayer dielectric layer 150 , the first planarizing layer 160 , the passivation layer 170 , and the second planarizing layer 180 . DETAILED DESCRIPTION

[0026] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be understood as limiting the present application.

[0027] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0028] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0029] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0030] Micro-LED display technology achieves thin-film, miniaturization, and matrix-like LEDs by densely integrating tiny LED arrays on a single chip. The distance between pixels can reach micrometers, and each pixel can be addressed and individually illuminated. Micro-LED boasts advantages such as low power consumption, high brightness, ultra-high resolution and color saturation, fast response, ultra-low power consumption, long lifespan, and high efficiency, making it considered the most competitive next-generation display technology.

[0031] However, the current external quantum efficiency of Micro-LEDs is generally 20%-30%, which is not very efficient. The remaining 70%-80% is converted into heat. Furthermore, the extremely small size of Micro-LED devices makes it difficult to dissipate the heat generated, causing the LED junction temperature to rise, resulting in reduced LED luminous efficiency and color shift. Furthermore, more energy is converted into heat, exacerbating LED degradation.

[0032] In related technologies, the heat dissipation capacity of MicroLEDs can be improved by changing the display panel's film structure, thickness, or material. However, since MicroLED heat dissipation primarily depends on the thermal resistance of air, changing the display panel's film structure, thickness, or material has little effect on improving MicroLED heat dissipation. Therefore, improving MicroLED heat dissipation has become a pressing issue.

[0033] In view of this, please see Figure 1 The present application provides a display panel 10, which includes a display area 101 and a non-display area 102, wherein the display area 101 and the non-display area 102 are adjacent to each other. The display panel 10 also includes an insulating thermally conductive film 14, a pixel light-emitting unit 12, and a heat dissipation structure 16 formed by multiple film layer protrusions. The heat dissipation structure 16 is formed in the non-display area 102, and the insulating thermally conductive film 14 and the pixel light-emitting unit 12 are formed in the display area 101. The insulating thermally conductive film 14 surrounds the periphery of the pixel light-emitting unit 12, and the insulating thermally conductive film 14 is at least partially connected to the heat dissipation structure 16 to conduct heat generated by the pixel light-emitting unit 12 to the heat dissipation structure 16.

[0034] In the display panel 10 of the present application, an insulating thermally conductive film 14 is provided in the display area 101 and a heat dissipation structure 16 formed by multi-film-layer protrusions is provided in the non-display area 102, and the insulating thermally conductive film 14 is at least partially connected to the heat dissipation structure 16. On the one hand, the insulating thermally conductive film 14 utilizes the temperature difference between the display area 101 and the non-display area 102 to make the temperature evenly distributed on the display panel 10, thereby avoiding the generation of hot spots. In addition, the insulating thermally conductive film 14 conducts the heat generated by the pixel light-emitting unit to the heat dissipation structure 16, so that the insulating thermally conductive film 14 and the heat dissipation structure 16 can dissipate heat at the same time, thereby improving the heat dissipation capacity of the display panel 10; on the other hand, the heat dissipation structure 16 formed by the multi-film-layer protrusions can increase the contact area between the heat dissipation structure 16 and the air, thereby further improving the heat dissipation effect. In this way, the problems of reduced light efficiency and color deviation generated by the display panel 10 are effectively solved.

[0035] It should be noted that heat conduction refers to the transfer of heat through the motion of microscopic particles when two objects with different temperatures are in direct contact. It is categorized into steady-state heat conduction and transient heat conduction. Steady-state heat conduction is related to the thermal conductivity, heat transfer area, material thickness, and the temperature difference between the objects; transient heat conduction is related to density, specific heat capacity, thermal conductivity, heat transfer area, material thickness, and the temperature difference between the objects.

[0036] Heat dissipation refers to the phenomenon of heat transfer within a fluid or between a fluid and a solid surface in contact with each other, which is mainly related to the convection heat transfer coefficient, heat conduction area, and temperature difference.

[0037] Specifically, the display panel 10 may be a Micro LED display panel. The display panel 10 uses Micro LEDs for display, which can achieve autonomous illumination and customized pixel drive, without the need for a backlight, to achieve display functions. It has the advantages of low power consumption, high brightness, ultra-high resolution and color saturation, and power saving.

[0038] Please further combine Figure 1In this embodiment, the display panel 10 is substantially rectangular. Of course, in other embodiments, the display panel 10 may also be in other shapes, such as circular or elliptical. The display panel 10 can be divided into a display area 101 and a non-display area 102. The non-display area 102 surrounds the display area 101 and is adjacent to the periphery of the display area 101.

[0039] The display panel 10 includes a pixel light-emitting unit 12, an insulating thermally conductive film 14, and a heat dissipation structure 16. The pixel light-emitting unit 12 and the insulating thermally conductive film 14 are located in the display area 101, while the heat dissipation structure 16 is located in the non-display area 102. The heat dissipation structure 16 is formed by multiple raised film layers made of different materials. The pixel light-emitting unit 12 is used to emit light to display images, and the insulating thermally conductive film 14 is used to transfer heat generated by the pixel light-emitting unit 12 to the heat dissipation structure 16. The heat dissipation structure 16 is used to dissipate heat.

[0040] The pixel light-emitting unit 12 includes a plurality of pixel light-emitting units 12, and the plurality of pixel light-emitting units 12 are arranged in an array. It should be noted that the pixel light-emitting unit 12 refers to the smallest repeating unit in the display panel 10 that can achieve the same light-emitting effect and function. The plurality of pixel light-emitting units 12 are arranged in an array, which means that the centers of the plurality of pixel light-emitting units 12 are staggered along at least two directions to form an array. In particular, the plurality of pixel light-emitting units 12 can be staggered along two directions perpendicular to each other and arranged in an array. At this time, the two directions perpendicular to each other can be the row extension direction and the column extension direction of the pixel light-emitting units 12, respectively. The pixel light-emitting units 12 arranged along the row extension direction form pixel rows, and the pixel light-emitting units 12 arranged along the column extension direction form pixel columns. Among them, the rows and columns in which the pixel light-emitting units 12 are arranged in the display panel 10 are relative. In this embodiment, the pixel light-emitting units 12 arranged in rows may be the pixel light-emitting units 12 arranged in columns in other embodiments, which will not be elaborated here.

[0041] The pixel light emitting unit 12 includes a first sub-pixel 122, a second sub-pixel 124, and a third sub-pixel 126. The first sub-pixel 122 is a green sub-pixel, the second sub-pixel 124 is a blue sub-pixel, and the third sub-pixel 126 is a red sub-pixel.

[0042] In some examples, the area of ​​the blue sub-pixel is larger than that of the red sub-pixel, and the area of ​​the red sub-pixel is larger than that of the green sub-pixel. In particular, for LED displays, because blue luminescent materials generally have the lowest luminous efficiency and a relatively short lifespan compared to red and green, the area of ​​the blue sub-pixel can be larger than that of the red and green sub-pixels. Furthermore, because the human eye is more sensitive to green and green luminescent materials have the highest efficiency, the area of ​​the green sub-pixel can be minimized.

[0043] The insulating thermally conductive film 14 is arranged around the periphery of the pixel light-emitting unit 12 and covers the display area 101. The insulating thermally conductive film 14 can be made of a highly insulating thermally conductive material, and the insulating thermally conductive film 14 can be made of one or more insulating thermally conductive materials. For example, the insulating thermally conductive film 14 can be made of one or more of aluminum nitride, silicon carbide, beryllium oxide or boron nitride. Of course, in some other embodiments, the insulating thermally conductive film 14 can also be other insulating materials. It can be understood that since the insulating thermally conductive film 14 covers the display area 101 around the periphery of the pixel light-emitting unit 12, the heat generated by the pixel light-emitting unit 12 can be conducted to the entire display area 101 through the insulating thermally conductive film 14, so that the heat dissipation is uniform, and the heat generated by the pixel light-emitting unit 12 is avoided from accumulating in the pixel light-emitting unit 12 itself to generate hot spots, thereby improving the heat dissipation effect.

[0044] The thermal conductivity of the insulating thermally conductive film 14 is greater than 50 W / m·K. In this way, the insulating thermally conductive film 14 can achieve heat conduction while having an insulating function, thereby avoiding interference with the display panel 10 .

[0045] Please further combine Figure 1 In some embodiments, the insulating thermally conductive film 14 includes an extension portion 141 that extends from the display area 101 to the non-display area 102 to connect to the heat dissipation structure 16. In this way, the heat generated by the pixel light-emitting unit 12 can be transferred to the heat dissipation structure 16 through the extension portion 141 and dissipated by the heat dissipation structure 16.

[0046] Please combine Figure 4-6 In some embodiments, the insulating thermally conductive film 14 is also formed in the non-display area 102 . The insulating thermally conductive film 14 in the non-display area 102 at least partially covers the surface of the heat dissipation structure 16 to be connected to the heat dissipation structure 16 .

[0047] Thus, by forming the insulating thermally conductive film 14 in the non-display area 102 and at least partially covering the heat dissipation structure 16 , the area of ​​the insulating thermally conductive film 16 can be further increased, thereby further improving the heat dissipation effect of the display panel 10 .

[0048] In some embodiments, the heat dissipation structure 16 includes a plurality of heat dissipation structures 16 , which are arranged at intervals around the display area 101 .

[0049] Specifically, the non-display area 102 includes a first side 1022 and a second side 1024. The first side 1022 and the second side 1024 are adjacent to each other. The first side 1022 extends along the row direction of the pixel light-emitting units 12, and the second side 1024 extends along the column direction of the pixel light-emitting units 12. The plurality of heat dissipation structures 16 are arranged in a straight line along the row direction of the first side 1022. The plurality of heat dissipation structures 16 are arranged in a straight line along the column direction of the second side 1024.

[0050] Furthermore, the extension portion 141 may include a plurality of extension portions 141 , the plurality of extension portions 141 are arranged at intervals, and each extension portion 141 is connected to a corresponding heat dissipation structure 16 .

[0051] Please combine Figure 2-3 and Figure 5-6 In some embodiments, the display panel 10 is divided into a film layer structure, including a base substrate 110, a first buffer layer 120, a second buffer layer 130, an insulating layer 140, an interlayer dielectric layer 150, a first flat layer 160, a passivation layer 170, and a second flat layer 180 stacked in sequence. The interlayer dielectric layer 150, the first flat layer 160, the passivation layer 170, and the second flat layer 180 located in the non-display area 102 form a heat dissipation structure 16, or the first flat layer 160, the passivation layer 170, and the second flat layer 180 located in the non-display area 102 form a heat dissipation structure 16.

[0052] In this embodiment, the interlayer dielectric layer 150, the first planar layer 160, the passivation layer 170, and the second planar layer 180 are formed into the heat dissipation structure 16 in the non-display area 102, or the first planar layer 160, the passivation layer 170, and the second planar layer 180 are formed into the heat dissipation structure 16 in the non-display area 102. This allows the heat dissipation structure 16 to use the same mask as the pixel light-emitting unit 12 in the display area 101, eliminating the need for an additional mask, avoiding additional costs, and reducing costs.

[0053] In some embodiments, the cross-sectional shape of the heat dissipation structure 16 may be one or more of a trapezoid, a triangle, a rectangle, etc. For example, Figure 2 、 Figure 5 and Figure 6 In this embodiment, the cross-sectional shape of the heat dissipation structure 16 is a regular trapezoid. Specifically, when the interlayer dielectric layer 150, the first planar layer 160, the passivation layer 170, and the second planar layer 180 form the heat dissipation structure 16, the heat dissipation structure 16 protrudes from the insulating layer 140 along the film layer stacking direction to form a protruding structure. When the first planar layer 160, the passivation layer 170, and the second planar layer 180 form the heat dissipation structure 16, the heat dissipation structure 16 protrudes from the interlayer dielectric layer 150 along the film layer stacking direction to form a protruding structure, and the cross-sectional shape of the heat dissipation structure 16 is a regular trapezoid.

[0054] In this way, by adopting a raised structure in the heat dissipation structure 16 and using masks of film layers such as the interlayer dielectric layer 150, the first flat layer 160, the passivation layer 170 and the second flat layer 180 to make a raised structure in the non-display area 102, the heat dissipation area of ​​the display panel 10 is increased, and the heat dissipation effect is further improved.

[0055] Furthermore, the interlayer dielectric layer 150 can be made of a mixture of silicon nitride and silicon oxide materials. The first flat layer 160 and the second flat layer 180 can be made of a resin material, and the passivation layer 170 can be made of a silicon nitride material. Among them, the thermal conductivity coefficient of the passivation layer 170 is greater than the thermal conductivity coefficient of the interlayer dielectric layer 150, and the thermal conductivity coefficient of the interlayer dielectric layer 150 is greater than the thermal conductivity coefficient of the first flat layer 160 and the second flat layer 180. It can be understood that due to the different materials, the thermal conductivity coefficients of the various film layers are also different, so that there will be temperature differences between different film layers, resulting in a temperature difference between the display panel 10 and the air on the air contact surface, so that the air will also generate heat convection between the surfaces of different film layers, thereby further improving the heat dissipation effect.

[0056] Furthermore, in the manufacturing process of the heat dissipation structure 16, a base substrate 110 is first set, and a first buffer layer 120, a second buffer layer 130 and an insulating layer 140 are formed in sequence on the base substrate 110. Then, multiple openings are added in the non-display area 102, and then film layers such as an interlayer dielectric layer 150, a first flat layer 160, a passivation layer 170 and a second flat layer 180 are formed in sequence. After each film layer is formed, PR glue coating, exposure, development and etching and other process processes are performed at each opening in the non-display area 12 to form a protruding heat dissipation structure 16.

[0057] It can be understood that since only the film layers above the insulating layer 140 are processed during the manufacturing process of the heat dissipation structure 16, the film layers below the insulating layer 140 (including the insulating layer 140) of the non-display area 102 and the display area 101 are manufactured at the same time.

[0058] In some embodiments, the insulating and thermally conductive film 14 is formed on the second planar layer 180. As will be appreciated, the second planar layer 180 is located near the light-emitting side of the pixel light-emitting unit 14. Forming the insulating and thermally conductive film 14 on the second planar layer 180 brings the insulating and thermally conductive film 14 closer to the outside world, thereby facilitating the film's ability to dissipate heat generated by the pixel light-emitting unit 12. Furthermore, forming the insulating and thermally conductive film 14 on the second planar layer 180 eliminates the need to modify the existing film structure of the display panel 10, simplifying the manufacture of the display panel 10.

[0059] The present application also provides a display device, which includes the display panel 10 of any one of the above embodiments.

[0060] In the display device of the present application, an insulating thermally conductive film 14 is formed in the display area 101 and a heat dissipation structure 16 is formed in the non-display area 102. The insulating thermally conductive film 14 is at least partially connected to the heat dissipation structure 16, so that the insulating thermally conductive film 14 can conduct the heat generated by the pixel light-emitting unit 12 to the heat dissipation structure 16 in the non-display area 102, so that the heat dissipation of the entire surface is more uniform, avoiding the generation of hot spots, and can increase the heat dissipation area of ​​the device, improve the heat dissipation effect, and effectively avoid problems such as reduced light efficiency and color deviation in the display device.

[0061] Exemplarily, the display device can be any of various types of computer system devices that are mobile or portable and perform wireless communication. Specifically, the display device can be a mobile phone or smart phone (e.g., an iPhone™-based phone, an Android™-based phone), a portable gaming device (e.g., a Nintendo DS™, a PlayStation Portable™, a Gameboy Advance™, an iPhone™), a tablet computer, a portable internet device, a data storage device, etc. The display device 100 can also be other wearable devices (e.g., a smart bracelet, a smart watch, AR glasses, VR glasses, etc.).

[0062] In some cases, the display device can perform multiple functions (e.g., play music, display video, store pictures, and receive and send phone calls). If desired, the display device can be a portable device such as a cellular phone, media player, other handheld device, wristwatch device, earpiece device, or other compact portable device.

[0063] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0064] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a non-display area, the display area and the non-display area being adjacent to each other, the display panel further comprising an insulating thermally conductive film, a pixel light-emitting unit, and a heat dissipation structure formed by multi-film-layer protrusions, the heat dissipation structure being formed in the non-display area, the insulating thermally conductive film and the pixel light-emitting unit being formed in the display area, and the insulating thermally conductive film surrounding the periphery of the pixel light-emitting unit, the insulating thermally conductive film being at least partially connected to the heat dissipation structure to conduct heat generated by the pixel light-emitting unit to the heat dissipation structure; The display panel includes a base substrate, a first buffer layer, a second buffer layer, an insulating layer, an interlayer dielectric layer, a first flat layer, a passivation layer, and a second flat layer stacked in sequence. The interlayer dielectric layer, the first flat layer, the passivation layer, and the second flat layer located in the non-display area protrude from the insulating layer to form the heat dissipation structure, or the first flat layer, the passivation layer, and the second flat layer located in the non-display area protrude from the interlayer dielectric layer to form the heat dissipation structure. The thermal conductivity coefficient of the passivation layer is greater than the thermal conductivity coefficient of the interlayer dielectric layer, and the thermal conductivity coefficient of the interlayer dielectric layer is greater than the thermal conductivity coefficients of the first flat layer and the second flat layer.

2. The display panel according to claim 1, wherein: The insulating thermally conductive film includes an extending portion, and the extending portion extends from the display area to the non-display area to connect with the heat dissipation structure.

3. The display panel according to claim 1, wherein: The insulating heat-conductive film is also formed in the non-display area, and the insulating heat-conductive film in the non-display area at least partially covers the surface of the heat dissipation structure.

4. The display panel according to claim 1, wherein: The insulating thermally conductive film is formed on the second flat layer.

5. The display panel according to claim 1, wherein: The heat dissipation structures include a plurality of heat dissipation structures, which are arranged around the display area at intervals.

6. The display panel according to claim 5, wherein: The cross-section of each heat dissipation structure is trapezoidal.

7. The display panel according to claim 1, wherein: The insulating thermally conductive film includes one or more of aluminum nitride, silicon carbide, beryllium oxide or boron nitride.

8. The display panel according to claim 1, wherein: The pixel light emitting unit includes a first sub-pixel, a second sub-pixel, and a third sub-pixel. The first sub-pixel is green, the second sub-pixel is blue, and the third sub-pixel is red.

9. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 8.

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