Silicon rod grinder and silicon rod grinding method

Abstract

The application discloses a silicon rod grinding machine and a silicon rod grinding method, wherein the silicon rod grinding machine is provided with a rough grinding device and a fine grinding device at a first machining position and a second machining position of a silicon rod machining platform, and is provided with a first transfer device and a second transfer device which simultaneously penetrate the first machining position and the second machining position, and the first transfer device and the second transfer device are both provided with a silicon rod clamp and a driving mechanism. Through coordinated control of the first transfer device, the second transfer device, the rough grinding device and the fine grinding device, the silicon rod grinding machine is kept in a working state at the same time, the grinding efficiency is greatly improved, the grinding time is shortened, and the economic benefit is improved on the basis of maintaining the size specification and the cost of the silicon rod grinding machine.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of silicon workpiece processing, in particular to a silicon rod grinding machine and a silicon rod grinding method. BACKGROUND

[0002] At present, with the attention and opening of society to green renewable energy utilization, the field of photovoltaic solar power generation is increasingly valued and developed. In the field of photovoltaic power generation, a common crystalline silicon solar cell is made on a high-quality silicon wafer, which is formed by multi-wire saw cutting and subsequent processing after being cut from a pulled or cast silicon ingot.

[0003] The existing silicon wafer manufacturing process takes a single crystal silicon product as an example. Generally, the approximate operation procedure can include: first, using a silicon rod cutting machine to cut the original long silicon rod to form multiple short silicon rods; after cutting, using a silicon rod squaring machine to perform squaring operation on the cut short silicon rod to form a single crystal silicon rod; then performing surface grinding, chamfering and other finishing operations on each silicon rod to shape the surface of the silicon rod to meet the corresponding flatness and dimensional tolerance requirements; and then performing slicing operation on the silicon rod to obtain a silicon wafer.

[0004] When using a silicon rod processing device to perform corresponding finishing operations (such as squaring operation, grinding operation, etc.) on a silicon rod, position calibration of the silicon rod to be loaded is required, which can calibrate the axis of the silicon rod. However, in the related art, there is no special silicon rod axis calibration device or the existing silicon rod axis calibration device has a complex structure.

[0005] In addition, in the process of grinding and chamfering the silicon rod, it must go through two processes of rough grinding and fine grinding. A single silicon rod is loaded and sequentially subjected to rough grinding and fine grinding, and then is unloaded and moved. Another silicon rod is loaded, ground (roughly and finely), and unloaded. In a typical mass production, the silicon rod grinding machine repeats this processing process. The grinding mill of the silicon rod grinding machine has a large amount of idle time, the grinding efficiency is low, and the economic benefit of silicon rod processing is affected. SUMMARY

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present application is to provide a silicon rod grinding machine and a silicon rod grinding method to solve the problem of low processing efficiency in the prior art.

[0007] To achieve the above-mentioned purpose and other related purposes, a first aspect of the present application discloses a silicon rod grinding machine, comprising:

[0008] A machine base has a silicon rod processing platform; the silicon rod processing platform is provided with a waiting area, a first processing area and a second processing area;

[0009] A silicon rod loading device is configured to load a silicon rod to be ground into a waiting position, wherein the axial center line of the silicon rod in the waiting position is aligned with a predetermined center line.

[0010] A first transfer device includes a first silicon rod clamp, a first transfer rail arranged in a transfer direction, and a first driving mechanism configured to drive the first silicon rod clamp and a silicon rod clamped thereby to move along the first transfer rail and transfer between the waiting position, the first processing position, and the second processing position, wherein a clamped center of the first silicon rod clamp is aligned with the predetermined center line.

[0011] A second transfer device includes a second silicon rod clamp, a second transfer rail arranged in a transfer direction, and a second driving mechanism configured to drive the second silicon rod clamp and a silicon rod clamped thereby to move along the second transfer rail and transfer between the waiting position, the first processing position, and the second processing position, wherein a clamped center of the second silicon rod clamp is aligned with the predetermined center line.

[0012] A rough grinding device is arranged at the first processing position of the silicon rod processing platform and configured to perform a rough grinding operation on a silicon rod clamped by the first silicon rod clamp of the first transfer device or a silicon rod clamped by the second silicon rod clamp of the second transfer device; and

[0013] A fine grinding device is arranged at the second processing position of the silicon rod processing platform and configured to perform a fine grinding operation on a silicon rod clamped by the first silicon rod clamp of the first transfer device or a silicon rod clamped by the second silicon rod clamp of the second transfer device.

[0014] The silicon rod grinding machine has the following beneficial effects: the rough grinding device and the fine grinding device of the silicon rod grinding machine are arranged at the first processing position and the second processing position of the silicon rod processing platform, respectively, and the first transfer device and the second transfer device are arranged to simultaneously pass through the first processing position and the second processing position, and the silicon rod clamp and the driving mechanism are configured for the first transfer device and the second transfer device. By coordinating the control of the first transfer device, the second transfer device, the rough grinding device, and the fine grinding device, the silicon rod grinding machine rough grinding device and the fine grinding device are in a working state at the same time, which greatly improves the grinding efficiency, reduces the grinding time, and improves the economic benefit while maintaining the size specification and cost of the silicon rod grinding machine.

[0015] In some embodiments of the first aspect of the application, the silicon rod loading device includes a silicon rod bearing structure configured to bear a silicon rod to be ground, a centering adjustment mechanism configured to adjust the position of the silicon rod to be ground so that its axial center line corresponds to the predetermined center line, and a feeding driving mechanism configured to drive the silicon rod bearing structure and the silicon rod to be ground borne thereby to move in a feeding direction to the waiting position, the feeding direction being orthogonal to the transfer direction.

[0016] In some embodiments of the first aspect of the application, the silicon rod carrying structure comprises a carrying base and a carrying component, and the centering adjustment mechanism comprises a vertical lifting mechanism for driving the carrying component and the silicon rod to be ground carried thereby to make vertical lifting movement relative to the carrying base so as to align the axial centerline of the silicon rod to be ground with the predetermined centerline.

[0017] In some embodiments of the first aspect of the application, the vertical lifting mechanism comprises a vertical lifting guide portion for arranging the carrying component, and a vertical lifting driving unit for driving the carrying component and the silicon rod to be ground carried thereby to make lifting movement along the vertical lifting guide portion.

[0018] In some embodiments of the first aspect of the application, the silicon rod carrying structure comprises a carrying base and a carrying component, and the centering adjustment mechanism comprises a diagonal lifting mechanism for driving the carrying component and the silicon rod to be ground carried thereby to make diagonal lifting movement relative to the carrying base so as to align the axial centerline of the silicon rod to be ground with the predetermined centerline.

[0019] In some embodiments of the first aspect of the application, the diagonal lifting mechanism comprises a diagonal lifting guide rail arranged on the carrying base, a sliding block arranged on the carrying component, and a diagonal lifting driving unit.

[0020] In some embodiments of the first aspect of the application, the diagonal lifting driving unit comprises a driving motor, and a diagonally arranged synchronous belt assembly associated with the carrying component and controlled by the driving motor.

[0021] In some embodiments of the first aspect of the application, the diagonal lifting driving unit comprises a driving motor, and a diagonally arranged screw assembly driven by the driving motor, or a driving motor and a diagonally arranged gear-rack transmission assembly driven by the driving motor.

[0022] In some embodiments of the first aspect of the application, the carrying component is further provided with a silicon rod holding mechanism.

[0023] In some embodiments of the first aspect of the application, the silicon rod loading device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be ground in the transfer direction so as to be located in the centering area of the silicon rod carrying structure.

[0024] In some embodiments of the first aspect of the application, the feeding driving mechanism comprises a feeding guide rail arranged on the machine base in the feeding direction, a sliding block arranged on the silicon rod carrying structure, and a feeding driving unit.

[0025] In some embodiments of the first aspect of the application, the first and second transfer devices are arranged above the silicon rod processing platform by a mounting frame, or the first transfer device is arranged above the silicon rod processing platform by a first mounting frame and the second transfer device is arranged above the silicon rod processing platform by a second mounting frame.

[0026] In some embodiments of the first aspect of the application, the first silicon rod clamp comprises: a first clamp arm mounting seat arranged on the first transfer rail; at least one pair of first clamp arms arranged in opposition along the transfer direction on the first clamp arm mounting seat for clamping two end faces of a silicon rod; and a first clamp arm driving mechanism for driving at least one first clamp arm of the at least one pair of first clamp arms to move along the transfer direction to adjust the clamping spacing between the at least one pair of first clamp arms.

[0027] In some embodiments of the first aspect of the application, the first silicon rod clamp is a lifting type silicon rod clamp.

[0028] In some embodiments of the first aspect of the application, the first clamp arm is of a rotary structure; and the first silicon rod clamp further comprises a first clamp arm rotating mechanism for driving the first clamp arm to rotate.

[0029] In some embodiments of the first aspect of the application, the second silicon rod clamp comprises: a second clamp arm mounting seat arranged on the second transfer rail; at least one pair of second clamp arms arranged in opposition along the transfer direction on the second clamp arm mounting seat for clamping two end faces of a silicon rod; and a second clamp arm driving mechanism for driving at least one second clamp arm of the at least one pair of first clamp arms to move along the transfer direction to adjust the clamping spacing between the at least one pair of second clamp arms.

[0030] In some embodiments of the first aspect of the application, the second silicon rod clamp is a lifting type silicon rod clamp.

[0031] In some embodiments of the first aspect of the application, the second clamp arm is of a rotary structure; and the second silicon rod clamp further comprises a second clamp arm rotating mechanism for driving the second clamp arm to rotate.

[0032] In some embodiments of the first aspect of the application, the first driving mechanism comprises: a first moving toothed rail arranged along the transfer direction; a first driving gear arranged on the first silicon rod clamp and engaged with the first moving toothed rail; and a first driving power source for driving the first driving gear.

[0033] In some embodiments of the first aspect of the present application, the second driving mechanism comprises: a second moving rack arranged along the transfer direction; a second driving gear arranged on the second silicon rod clamp and engaged with the second moving rack; and a first driving power source configured to drive the second driving gear.

[0034] In some embodiments of the first aspect of the present application, the coarse grinding device comprises: at least one pair of coarse grinding wheels arranged at the first processing position of the silicon rod processing platform; and a coarse grinding wheel driving mechanism configured to drive at least one coarse grinding wheel of the at least one pair of coarse grinding wheels to move laterally along a feeding direction, wherein the feeding direction is perpendicular to the transfer direction.

[0035] In some embodiments of the first aspect of the present application, the fine grinding device comprises: at least one pair of fine grinding wheels arranged at the first processing position of the silicon rod processing platform; and a fine grinding wheel driving mechanism configured to drive at least one fine grinding wheel of the at least one pair of fine grinding wheels to move laterally along a feeding direction, wherein the feeding direction is perpendicular to the transfer direction.

[0036] In some embodiments of the first aspect of the present application, the silicon rod grinding machine further comprises a grinding repair device comprising: a mounting body; and at least one grinding part arranged on the mounting body and configured to grind the at least one pair of fine grinding wheels.

[0037] In some embodiments of the first aspect of the present application, the mounting body is arranged on at least one of the first silicon rod clamp and the second silicon rod clamp, and the mounting body is configured to move reciprocally along a predetermined direction driven by the first silicon rod clamp or the second silicon rod clamp.

[0038] In some embodiments of the first aspect of the present application, the mounting body is arranged on the machine base, and the grinding repair device further comprises a driving unit configured to drive the mounting body to move reciprocally along a predetermined direction.

[0039] In some embodiments of the first aspect of the present application, the grinding repair device further comprises at least one pair of sensing devices arranged on opposite sides of the mounting body and configured to detect the at least one pair of fine grinding wheels correspondingly.

[0040] In some embodiments of the first aspect of the present application, the sensing devices are contact sensors or distance measuring sensors.

[0041] In some embodiments of the first aspect of the present application, the silicon rod grinding machine further comprises a silicon rod unloading device configured to unload the silicon rod after the fine grinding operation on the silicon rod processing platform.

[0042] The second aspect of the present application discloses a silicon rod grinding method applied to a silicon rod grinding machine, wherein the silicon rod grinding machine comprises a machine base provided with a silicon rod processing platform, the silicon rod processing platform is provided with a first processing area and a second processing area, the silicon rod grinding machine further comprises a silicon rod loading device, a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device comprises a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, the second transfer device comprises a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism; the silicon rod grinding method comprises the following steps:

[0043] loading the first silicon rod to be ground onto the waiting area so that the axial center line of the first silicon rod on the waiting area is aligned with the predetermined center line;

[0044] holding the first silicon rod by the first silicon rod clamp in the first transfer device, wherein the holding center of the first silicon rod clamp is aligned with the predetermined center line; driving the first silicon rod clamp and the first silicon rod held thereby by the first driving mechanism in the first transfer device to move along the first transfer guide rail to transfer from the waiting area to the first processing area; and performing rough grinding work on the first silicon rod located at the first processing area by the rough grinding device;

[0045] driving the first silicon rod clamp and the first silicon rod held thereby by the first driving mechanism in the first transfer device to move along the first transfer guide rail to transfer from the first processing area to the second processing area; performing fine grinding work on the first silicon rod located at the second processing area by the fine grinding device; at this stage, loading the second silicon rod to be ground onto the waiting area by the silicon rod loading device so that the axial center line of the second silicon rod on the waiting area is aligned with the predetermined center line; holding the second silicon rod by the second silicon rod clamp in the second transfer device, wherein the holding center of the second silicon rod clamp is aligned with the predetermined center line; driving the second silicon rod clamp and the second silicon rod held thereby by the second driving mechanism in the second transfer device to move along the second transfer guide rail to transfer from the waiting area to the first processing area; performing rough grinding work on the second silicon rod located at the first processing area by the rough grinding device; and

[0046] The first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to be transferred from the second processing position to the waiting position, the first silicon rod is unloaded from the waiting position and the third silicon rod is loaded, wherein the third silicon rod is loaded to the waiting position by the silicon rod loading device, the axial center line of the third silicon rod on the waiting position is aligned with the predetermined center line; the first driving mechanism in the first transfer device drives the first silicon rod clamp and the third silicon rod clamped thereby to move along the first transfer rail to be transferred from the waiting position to the first processing position, the coarse grinding device performs coarse grinding work on the third silicon rod on the first processing position; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer rail to be transferred from the first processing position to the second processing position; the fine grinding device performs fine grinding work on the second silicon rod on the second processing position.

[0047] The silicon rod grinding method has the following beneficial effects: the coarse grinding device and the fine grinding device of the silicon rod grinding machine are arranged at the first processing position and the second processing position of the silicon rod processing platform respectively, and the first transfer device and the second transfer device are arranged to simultaneously penetrate the first processing position and the second processing position, and the silicon rod clamp and the driving mechanism are arranged for the first transfer device and the second transfer device, the first transfer device, the second transfer device, the coarse grinding device and the fine grinding device are controlled coordinately, so that the coarse grinding device and the fine grinding device of the silicon rod grinding machine are in working state at the same time, the grinding work efficiency is greatly improved, the grinding work time is reduced, and the economic benefit is improved on the basis of maintaining the size specification and cost of the silicon rod grinding machine. BRIEF DESCRIPTION OF DRAWINGS

[0048] The specific features of the invention involved in the present application are shown in the appended claims. The features and advantages of the invention involved in the present application can be better understood by referring to the exemplary embodiments described in detail below and the accompanying drawings. A brief description of the drawings is as follows:

[0049] Figure 1 The structure schematic diagram of the silicon rod grinding machine of the present application in an embodiment is shown.

[0050] Figure 2 The simplified structure schematic diagram of the silicon rod grinding machine of the present application is shown. Figure 1

[0051] Figure 3 The top view schematic diagram of the silicon rod grinding machine of the present application in an embodiment is shown.

[0052] Figure 4 ​Fig. 1 shows a schematic diagram of a structure of a silicon rod loading device in a silicon rod grinder of the present application in an embodiment.

[0053] Figure 5 Fig. 2 shows a schematic diagram of a structure of a first silicon rod clamp or a second silicon rod clamp in a silicon rod grinder of the present application.

[0054] Figure 6 Fig. 3 shows a simplified schematic diagram of a structure of a silicon rod grinder of the present application in an embodiment.

[0055] Figures 7 to 13 Fig. 4 shows a simplified schematic diagram of a structure of a silicon rod grinder of the present application in an embodiment during a grinding operation. DETAILED DESCRIPTION

[0056] The advantages and benefits of the present application are readily appreciated through a consideration of the following detailed description in conjunction with the accompanying figures.

[0057] In the following description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without such specific details. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure the present application. The detailed description is presented largely for the purpose of illustrating exemplary embodiments of the present application, which are described in connection with details of various embodiments. As such, the detailed description is not intended to limit the scope of the present application. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application. Spatially relative terms, such as "upper", "lower", "left", "right", "beneath", "below", "bottom", "above", "top", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures.

[0058] While in some examples the terms first, second, etc. are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first transfer device could be termed a second transfer device, and, similarly, a second transfer device could be termed a first transfer device, without departing from the scope of the various described embodiments. A first transfer device and a second transfer device are both transfer devices, but they are not the same transfer device, unless the context clearly indicates otherwise. Similar situations include a first transfer rail and a second transfer rail, a first processing site and a second processing site, a first drive mechanism and a second drive mechanism, a first silicon rod clamp and a second silicon rod clamp, etc.

[0059] Furthermore, as used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including" when used herein, specify the presence of stated features, steps, operations, elements, components, items, kinds and / or groups but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, items, kinds and / or groups. As used herein, the terms "or" and "and / or" are to be interpreted as inclusive, i.e., as meaning one or more of the stated items. Therefore, "A, B or C" or "A, B and / or C" means any of the following: A; B; C; A and B; A and C; B and C; A, B and C. Only when a combination of elements, functions, steps or operations is inherently mutually exclusive is an exception to this definition presented.

[0060] In the processing of silicon material, the silicon wafer for industrial production is usually obtained through multiple processes. The original silicon material is usually a long silicon rod in a cylindrical structure. The long silicon rod is cut into multiple short silicon rods by a silicon rod cutting machine. The cut short silicon rods are then squared by a silicon rod squaring machine to form single crystal silicon rods, which have a cross section in the shape of a rectangle (including a square). The single crystal silicon rods obtained by squaring need to have surface damage removed and the corners chamfered to eliminate internal stress. Then, the single crystal silicon rods need to be ground and chamfered so that the surface of the silicon rod is shaped to meet the flatness and dimensional tolerance requirements for subsequent slicing.

[0061] In the process of grinding the single crystal silicon rod, rough grinding is needed before fine grinding, which is realized by corresponding rough grinding tools and fine grinding tools. In the traditional working method, a single single crystal silicon rod is rough ground and then transported to the fine grinding working area for fine grinding. After fine grinding is completed, the processed silicon rod is transported out of the working area. This process is repeated in a large number of grinding operations. The grinding sequence of fine grinding and rough grinding makes it inevitable for the silicon rod grinding machine to have grinding tools in a waiting state during operation, for example, the fine grinding tool is in a waiting state while the rough grinding tool is rough grinding, and the rough grinding tool is in a waiting state while the fine grinding tool is fine grinding. The grinding operation process takes a long time.

[0062] In the embodiments provided in the present application, in order to define the direction and the operation mode between different structures, a three-dimensional space is defined by a first direction, a second direction and a third direction, wherein the first direction, the second direction and the third direction are straight directions and perpendicular to each other. For example, the length extension direction of the silicon rod grinding machine, i.e. the length direction when the silicon rod is placed on the silicon rod grinding machine, is defined as the first direction (i.e. the front-rear direction or the transfer direction), the width extension direction of the silicon rod grinding machine, i.e. the left-right direction, is defined as the second direction (i.e. the left-right direction or the feeding direction), and the direction perpendicular to the horizontal plane formed by the first direction and the second direction is defined as the third direction (i.e. the vertical direction, the vertical direction, the up-down direction or the lifting direction).

[0063] The present application discloses a silicon rod grinding machine for rough grinding and fine grinding of a silicon rod, comprising a base frame having a silicon rod processing platform, wherein the silicon rod processing platform is provided with a waiting area, a first processing area and a second processing area; a silicon rod loading device for loading a silicon rod to be ground into the waiting area; a first transfer device comprising a first silicon rod clamp, a first transfer guide rail arranged in a transfer direction, and a first driving mechanism for driving the first silicon rod clamp and the silicon rod clamped thereby to move along the first transfer guide rail and transfer between the waiting area, the first processing area and the second processing area; a second transfer device comprising a second silicon rod clamp, a second transfer guide rail arranged in a transfer direction, and a second driving mechanism for driving the second silicon rod clamp and the silicon rod clamped thereby to move along the second transfer guide rail and transfer between the waiting area, the first processing area and the second processing area; a rough grinding device arranged at the first processing area of the silicon rod processing platform for rough grinding of the silicon rod clamped by the first silicon rod clamp of the first transfer device or the silicon rod clamped by the second silicon rod clamp of the second transfer device; and a fine grinding device arranged at the second processing area of the silicon rod processing platform for fine grinding of the silicon rod clamped by the first silicon rod clamp of the first transfer device or the silicon rod clamped by the second silicon rod clamp of the second transfer device.

[0064] The silicon rod grinding machine disclosed in the present application integrates the rough grinding device and the fine grinding device, and arranges the rough grinding device and the fine grinding device at different processing areas respectively, so that the rough grinding device and the fine grinding device are both in working state at the same time, thereby completing the integrated operation of silicon rod grinding and greatly improving the grinding operation efficiency.

[0065] Please refer to Figure 1 and Figure 2 , wherein, Figure 1 shows the structural schematic diagram of the silicon rod grinding machine in an embodiment of the present application, Figure 2 shows the simplified structural schematic diagram of Figure 1 . As Figure 1 and Figure 2As shown, the silicon rod grinder comprises a base 1, a silicon rod loading device 2, a first transfer device 3, a second transfer device 4, a rough grinding device 5, and a fine grinding device 6.

[0066] In the embodiments provided in the present application, in order to define the definition of the direction and the operation mode between different structures, a three-dimensional space defined by a first direction, a second direction and a third direction is defined, the first direction, the second direction and the third direction are all straight directions and perpendicular to each other, and in the embodiments as shown in the drawings, Figure 1 and Figure 2 In the embodiments as shown, the X-axis of the illustrated coordinate axis is the first direction, the Y-axis of the illustrated coordinate axis is the second direction, and the Z-axis of the illustrated coordinate axis is the third direction.

[0067] The silicon rod grinder of the present application is used for grinding a silicon rod with a cross section in the shape of a rectangle (including a square), wherein most of the silicon rods can be, for example, single crystal silicon rods or polycrystalline silicon rods, and taking the single crystal silicon rod as an example, the single crystal silicon rod is obtained by cutting a raw silicon rod and then performing a square cutting operation on the silicon rod by a silicon rod square cutting device, and the raw silicon rod is usually a rod-shaped single crystal silicon grown from a melt by using a Czochralski method or a floating zone melting method.

[0068] The base has a silicon rod processing platform, and the silicon rod processing platform is provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the base, and in an implementation manner of the present application, the processing platform is designed in the shape of a rectangle in accordance with the shape of the base, and the first processing area and the second processing area correspond to the rough grinding processing area and the fine grinding processing area in the grinding process, respectively. As shown in Figure 1 and Figure 2 As shown in the drawings, the base 1 has a silicon rod processing platform, and the first processing area and the second processing area are arranged in parallel at the front and rear positions of the silicon rod processing platform, and the first processing area and the second processing area are independent of each other, so that the corresponding silicon rods to be processed can be processed independently in the first processing area and the second processing area, respectively.

[0069] The silicon rod loading device is arranged on the silicon rod processing platform and is used for loading the silicon rod to be ground into a waiting area. In an embodiment of the present application, as shown in Figure 1 and Figure 2 As shown in the drawings, the silicon rod loading device 2 is arranged at one end (for example, the front end or the rear end) of the silicon rod processing platform, and the silicon rod loading device 2 can be used to move the silicon rod 100 to be ground to the waiting area.

[0070] The silicon rod loading device can also make the silicon rod moved to the waiting area complete the centering operation before the grinding operation. In the embodiments of the present application, the centering operation specifically means that the axis of the silicon rod is in the same straight line as the center line of the corresponding device component.

[0071] Please refer toFigure 3 The image shown is a simplified top view of one embodiment of the silicon rod grinding machine of this application. Figure 3 As shown, the silicon rod loading device 2 is disposed at one end of the silicon rod processing platform along the transfer direction (hereinafter referred to as the first direction) (this end may be assumed to be the front end). The silicon rod loading device 2 is used to load the silicon rod 100 to be ground into the waiting area, which is located inside the silicon rod processing platform.

[0072] In some embodiments, the silicon rod grinding machine further includes a loading area, and the silicon rod loading device 2 is movable between the loading area and a waiting area to load the silicon rod 100 to be ground. The loading area is located outside the silicon rod processing platform. In some embodiments, the outside may be the edge of the silicon rod processing platform, and in other embodiments, the outside may be outside the silicon rod processing platform but adjacent to it.

[0073] As previously described, the silicon rod grinding machine of this application includes a first transfer device 3, a second transfer device 4, a coarse grinding device 5, and a fine grinding device 6. After the silicon rod 100 to be ground is moved to the waiting area by the silicon rod loading device 2, the silicon rod 100 can be clamped by the first transfer device 3 or the second transfer device 4 and transferred. Therefore, the waiting area may further include a position corresponding to the first transfer device 3 and a position corresponding to the second transfer device 4. For ease of understanding, in the following description, when referring to the positions corresponding to the first transfer device 3 and the second transfer device 4, we will further refine the waiting area, that is, the waiting area includes a first waiting area corresponding to the first transfer device 3 and a second waiting area corresponding to the second transfer device 4.

[0074] Please see Figure 4 The image shows a schematic diagram of the silicon rod loading device in one embodiment of the silicon rod grinding machine of this application. As mentioned above, in this application, the silicon rod loading device can load the silicon rod to be ground (see reference...). Figure 1 or Figure 2 The silicon rod 100 is moved to the waiting area, allowing it to complete the centering operation before the grinding operation. Figures 1 to 4 As shown, the silicon rod loading device 2 includes: a silicon rod bearing structure 21, a centering adjustment mechanism 23, and a feed drive mechanism.

[0075] The silicon rod support structure is used to support the silicon rod to be ground. In one embodiment of this application, the silicon rod support structure 21 is used to support the silicon rod 100 to be ground. The silicon rod support structure 21 includes a support base 211 and a support component 213, wherein the support component 213 is movable relative to the support base 211, thereby enabling the support component 213 and the silicon rod 100 it supports to move relative to the support base 211.

[0076] Regarding the support component 213, it is used to support the silicon rod 100 to be ground. In some embodiments, the support component 213 is generally a plate-like structure, on which a support strip may be provided. To protect the supported silicon rod 100, the support strip may be made of a flexible material, such as rubber, acrylic, plastic, etc.

[0077] In practical applications, the support component 213 is also provided with a silicon rod holding mechanism to ensure that the silicon rod 100 to be ground can be kept stable on the support component 213. In some embodiments, the silicon rod holding mechanism includes a silicon rod stop 2131, which is disposed on at least one side of the support component 213 along the feed direction (hereinafter referred to as the second direction). Figure 4 As shown, there is one silicon rod stop 2131, which is disposed on one side of the bearing member 213 along the second direction, relatively adjacent to the loading area. However, this is not a limitation, and there may be, for example, two silicon rod stops, disposed on opposite sides of the bearing member 213 along the second direction.

[0078] In some embodiments, the silicon rod holding mechanism is a silicon rod clamping mechanism, which includes a silicon rod stop and a clamping drive. For example... Figure 4 As shown, the silicon rod stop 2131 is disposed on the side of the bearing member 213 relatively adjacent to the loading area along the second direction, and the clamping drive 2133 is disposed on the side of the bearing member 213 relatively away from the loading area along the second direction. The clamping drive 2133 can be, for example, a clamping cylinder with a lead screw assembly that feeds back and forth along the second direction. In practical applications, the clamping cylinder moves away from the silicon rod stop 2131 along the second direction via the lead screw assembly, thereby increasing the distance between the clamping cylinder and the silicon rod stop 2131, forming an effective clamping space to ensure that the clamping space can accommodate the silicon rod 100 to be ground. After the silicon rod 100 is placed in the clamping space of the bearing member 213, the clamping cylinder moves closer to the silicon rod stop 2131 along the second direction via the lead screw assembly, thereby reducing the distance between the clamping cylinder and the silicon rod stop 2131 until the silicon rod 100 in the clamping space is clamped.

[0079] Continue back Figure 4In the silicon rod carrying structure 21, the relative movement of the carrying part 213 and the silicon rod 100 carried thereby relative to the carrying base 211 can be achieved by means of the centering adjustment mechanism 23. In the present application, the centering adjustment mechanism 23 is used to adjust the position of the silicon rod 100 to be lapped so that the axial centerline of the silicon rod 100 corresponds to the predetermined centerline. As mentioned above, the centering operation specifically refers to the axial centerline of the silicon rod 100 being in line with the centerline of the corresponding device part, i.e. the axial centerline of the silicon rod 100 coincides with the centerline of the corresponding device part, wherein the device part can be, for example, the first transfer device 3 and the second transfer device 4, i.e. the centering operation specifically refers to the axial centerline of the silicon rod 100 being in line with the centerline of the first transfer device 3 and the centerline of the second transfer device 4. In actual applications, taking the first transfer device 3 as an example, we can determine the centerline of the first transfer device 3 in advance, and determine the predetermined centerline based on the centerline of the first transfer device 3, wherein the predetermined centerline is the same as the centerline of the first transfer device 3 in the third direction (i.e. the vertical direction), and similarly, taking the second transfer device 4 as an example, we can determine the centerline of the second transfer device 4 in advance, and determine the predetermined centerline based on the centerline of the second transfer device 4, wherein the predetermined centerline is the same as the centerline of the second transfer device 4 in the third direction (i.e. the vertical direction). Therefore, the centering adjustment mechanism used to adjust the position of the silicon rod 100 to be lapped so that the axial centerline of the silicon rod 100 corresponds to the predetermined centerline is used to adjust the position of the silicon rod 100 to be lapped in the third direction (i.e. the vertical direction) so that the axial centerline of the silicon rod 100 coincides with the predetermined centerline in the third direction.

[0080] Regarding the centering adjustment mechanism, in some embodiments, the centering adjustment mechanism comprises a diagonal lifting mechanism for driving the carrying part and the silicon rod to be lapped carried thereby to make diagonal lifting movement relative to the carrying base so that the axial centerline of the silicon rod to be lapped is aligned with the predetermined centerline in the third direction. Figure 4 As shown in the figure, the diagonal lifting mechanism 23 as the centering adjustment mechanism further comprises a diagonal lifting guide rail 231, a sliding block 233, and a diagonal lifting driving unit 235, wherein the diagonal lifting guide rail 231 is arranged on the carrying base 211, the sliding block 233 is arranged on the carrying part 213, and the diagonal lifting driving unit 235 is used to drive the carrying part 213 and the silicon rod to be lapped carried thereby to make diagonal lifting movement along the diagonal lifting guide rail 231.

[0081] In the above-mentioned diagonal lifting driving unit, the lifting driving unit can comprise a driving motor and a diagonally arranged synchronous belt assembly, and the synchronous belt assembly is two sets. As Figure 4As shown, two sets of the synchronous belt assemblies are arranged on opposite sides of the bearing base 211 along the first direction, and each set of the synchronous belt assemblies is arranged on the bearing base 211 and associated with the bearing component 213. Each set of the synchronous belt assemblies further includes a driving pulley 2352, a driven pulley 2354, and a belt 2353 wound around the driving pulley 2352 and the driven pulley 2354.

[0082] In the diagonal lifting driving unit 235, the driving pulleys 2352 of the two sets of the synchronous belt assemblies are kept in synchronization through the transmission shaft 2355, and the driving pulley 2352 of one set of the synchronous belt assemblies is further kept in synchronization with the driving motor 2351. The driving motor 2351 can be a servo motor, for example. The motor shaft of the servo motor 2351 is provided with a motor pulley 2350, which is kept in synchronization with the driving pulley 2352 of one set of the synchronous belt assemblies through the associated belt.

[0083] In addition, each set of the synchronous belt assemblies is associated with the bearing component. As shown, Figure 4 The synchronous belt assemblies can be associated with the bearing component 213 through a belt clamping structure 2356, which can include a connecting block and a fixing block. The connecting block is connected to the bearing component 213 and extends to one side of the belt 2353 in the synchronous belt assembly, and the fixing block is located on the other side of the belt 2353. When the fixing block and the connecting block are locked and fixed, the belt 2353 can be clamped therebetween, thereby realizing the association of the bearing component 213 and the belt 2353.

[0084] When the diagonal lifting driving unit 235 is used, the driving motor 2351 drives the motor shaft and the motor pulley 2350 on the motor shaft to rotate, thereby driving the driving pulley 2352 of one set of the synchronous belt assemblies to rotate through the associated belt and driving the driving pulley 2352 of the other set of the synchronous belt assemblies to rotate through the transmission shaft 2355. Then, the corresponding belt 2353 in each set of the synchronous belt assemblies makes a diagonal lifting movement, and thus the bearing component 213 associated with the belt 2353 in the two sets of the synchronous belt assemblies makes a diagonal lifting movement with the belt 2353.

[0085] In Figure 4 In the embodiment shown, in the synchronous belt assemblies, the driving pulley 2352 is higher than the driven pulley 2354. During the diagonal lifting movement, when the driving pulley 2352 rotates forward (e.g., clockwise), the bearing component 213 can make a diagonal upward movement along the diagonal guide rail, and when the driving pulley 2352 reverses (e.g., counterclockwise), the bearing component 213 can make a diagonal downward movement along the diagonal guide rail.

[0086] To limit the travel of the load-carrying member along the inclined guide rail, the inclined lifting mechanism can further comprise a limit structure for limiting the movement range of the slider provided on the load-carrying member on the inclined lifting guide rail. In some embodiments, the limit structure is provided on any one of the two sets of synchronous belt assemblies. In some embodiments, the limit structure is provided on one of the two sets of synchronous belt assemblies, and the two sets of synchronous belt assemblies are correspondingly provided and kept in synchronization by the transmission shaft.

[0087] In Figure 4 In the illustrated embodiment, each set of synchronous belt assembly is configured with a limit structure, which can be, for example, a limit sensor 2357, which can include two, which can be referred to as an upper limit sensor and a lower limit sensor, respectively. The upper limit sensor is configured at the top of the allowed inclined lifting range, and the lower limit sensor is configured at the bottom of the allowed inclined lifting range. The distance between the upper limit sensor and the lower limit sensor along the inclination is the allowed inclined lifting range. The limit sensor 2357 can be, for example, a contact sensor, which is in communication with the drive motor 2351. The contact sensor has a movable contact that deforms when it is actuated, thereby triggering the contact sensor to generate a trigger signal. The contact sensor can be connected to the drive motor 2351 by a communication line or by wireless communication.

[0088] When the oblique lifting driving unit 235 is used, the driving motor 2351 drives the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate forward, and then drives the belt 2353 to move upward obliquely. Thus, the bearing component 213 associated with the belt 2353 moves upward obliquely with the belt 2353 until the upper limit sensor 2357 is touched by the belt clamping structure 2356 to generate an upper limit trigger signal and send the upper limit trigger signal to the driving motor 2351. After receiving the upper limit trigger signal, the driving motor 2351 can stop the rotation of the driving motor shaft to stop the movement of the belt 2353 in the associated two sets of synchronous belt assemblies, or the driving motor shaft can be reversed to drive the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate reversely to drive the belt 2353 to move downward obliquely. When the oblique lifting driving unit 235 is used, the driving motor 2351 drives the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate reversely, and then drives the belt 2353 to move downward obliquely. Thus, the bearing component 213 associated with the belt 2353 moves downward obliquely with the belt 2353 until the lower limit sensor 2357 is touched by the belt clamping structure 2356 to generate a lower limit trigger signal and send the lower limit trigger signal to the driving motor 2351. After receiving the lower limit trigger signal, the driving motor 2351 can stop the rotation of the driving motor shaft to stop the movement of the belt 2353 in the associated two sets of synchronous belt assemblies, or the driving motor shaft can be reversed to drive the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate forward to drive the belt 2353 to move upward obliquely.

[0089] Therefore, in the present embodiment, the oblique lifting mechanism as shown in Figure 4 is used as a centering adjustment mechanism to adjust the centering of the bearing silicon rod. The process can generally include:

[0090] First, the silicon rod to be ground is placed on the bearing component 213. Of course, in some embodiments, if the bearing component 213 is provided with a silicon rod holding mechanism, the silicon rod is stably held on the bearing component 213 by the silicon rod holding mechanism. For example, the silicon rod holding mechanism is a silicon rod clamping mechanism, which includes a silicon rod stopper and a clamping driving member. The silicon rod is stably clamped between the silicon rod stopper and the clamping driving member by the clamping driving member.

[0091] Then, the silicon rod on the bearing component 213 is detected to obtain the position information of the axial center line of the silicon rod 100 in the third direction (i.e., the height information). The height information can be selected according to the design of the device, for example, in some embodiments, the height information can be an absolute value or a relative value. Taking the relative value as an example, the height information can be a relative value relative to a preset reference or a specified object, for example, taking the silicon rod processing platform or the bearing base 211 as the reference position. In this way, the height difference between the axial center line of the silicon rod 100 and the center line of the first transfer device 3 or the center line of the second transfer device 4 can be determined according to the detected height information of the axial center line of the silicon rod 100 and the known height information of the center line of the first transfer device 3 or the center line of the second transfer device 4. In some embodiments, the height information of the center line of the first transfer device 3 or the center line of the second transfer device 4 can be an absolute value or a relative value. Taking the relative value as an example, the height information can be a relative value relative to a preset reference or a specified object, for example, taking the silicon rod processing platform or the bearing base 211 as the reference position.

[0092] Then, the bearing component 213 and the silicon rod 100 to be ground carried thereby are driven by the inclined lifting mechanism to make inclined lifting movement relative to the bearing base 211 so that the axial center line of the silicon rod to be ground is aligned with the predetermined center line in the third direction. Figure 4 As shown in the figure, the driving motor 2351 drives the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate, and then drives the belt 2353 to make inclined lifting movement. The bearing component 213 associated with the belt 2353 makes inclined lifting movement with the belt 2353.

[0093] When it is detected that the current height of the axial center line of the silicon rod to be ground is lower than the height of the center line of the first transfer device 3 (or the center line of the second transfer device 4), the driving motor 2351 drives the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate in the positive direction, and then drives the belt 2353 and the bearing component 213 associated with the belt 2353 to make inclined upward movement with the belt 2353, until the height of the axial center line of the silicon rod 100 is aligned with the height of the center line of the first transfer device 3 (or the center line of the second transfer device 4).

[0094] When the detected current height of the axis of the silicon rod 100 to be ground is higher than the height of the center line of the first transfer device 3 (or the center line of the second transfer device 4), the driving motor 2351 drives the driving pulley 2352 in the associated two sets of synchronous belt assemblies to rotate reversely, thereby driving the belt 2353 and the bearing part 213 associated with the belt 2353 to move obliquely downward along the belt 2353 until the height of the axis of the silicon rod 100 is consistent with the height of the center line of the first transfer device 3 (or the center line of the second transfer device 4).

[0095] The oblique lifting and lowering driving unit in the present application is not limited to Figure 4 The structure shown can still have other changes.

[0096] In some embodiments, the oblique lifting and lowering driving unit comprises a driving motor and a screw rod assembly obliquely arranged and driven by the driving motor, wherein the driving motor is arranged on a bearing base, and the screw rod assembly can comprise a screw rod obliquely arranged on the bearing base and associated with the driving motor, and a movable block screwed on the screw rod and connected with the bearing part. In this way, when the oblique lifting and lowering driving unit is used, the driving motor drives the screw rod in the screw rod assembly to rotate, thereby driving the movable block and the bearing part connected therewith to move obliquely along the screw rod. For example, during the implementation of the oblique lifting and lowering movement, when the driving motor drives the screw rod in the screw rod assembly to rotate forward (e.g. clockwise), the bearing part can be driven to move obliquely upward along the screw rod, and when the driving motor drives the screw rod in the screw rod assembly to rotate reversely (e.g. counterclockwise), the bearing part can be driven to move obliquely downward along the screw rod.

[0097] In some embodiments, the oblique lifting and lowering driving unit comprises a driving motor and a gear and rack transmission assembly obliquely arranged and driven by the driving motor, wherein the driving motor can be arranged on the bearing part, and the gear and rack transmission assembly can comprise a rack obliquely arranged on the bearing base, and a gear associated with the driving motor. In this way, when the oblique lifting and lowering driving unit is used, the driving motor drives the gear in the gear and rack transmission assembly to rotate, thereby driving the gear and the bearing part associated therewith to move obliquely along the rack. For example, during the implementation of the oblique lifting and lowering movement, when the driving motor drives the gear in the gear and rack transmission assembly to rotate forward (e.g. clockwise), the bearing part can be driven to move obliquely upward along the rack, and when the driving motor drives the gear in the gear and rack transmission assembly to rotate reversely (e.g. counterclockwise), the bearing part can be driven to move obliquely downward along the rack.

[0098] The centering adjustment mechanism in the present application is used to adjust the position of the silicon rod to be ground so that its axis corresponds to the predetermined center line. Among them, the adjustment of the position of the silicon rod to be ground so that its axis corresponds to the predetermined center line is mainly in the vertical direction (third direction), so in other embodiments, the centering adjustment mechanism may, for example, be a vertical lifting mechanism for driving the carrier component and the carried silicon rod to be ground to make vertical lifting movement relative to the carrier base so that the axis of the silicon rod to be ground is vertically aligned with the predetermined center line.

[0099] In certain embodiments, the vertical lifting mechanism can include a vertical lifting guide portion for arranging the carrier component, and a vertical lifting driving unit for driving the carrier component and the carried silicon rod to be ground to move up and down along the vertical lifting guide portion.

[0100] The vertical lifting guide portion is used to arrange the carrier component. In certain embodiments, the vertical lifting guide portion may, for example, be a vertical lifting guide rail provided on the carrier base of the silicon rod carrying structure, and the carrier component of the silicon rod carrying structure can be arranged on the vertical lifting guide rail by a sliding block. In certain embodiments, the vertical lifting guide portion may, for example, be a vertical lifting guide rod provided on the carrier base of the silicon rod carrying structure, and the carrier component of the silicon rod carrying structure is arranged on the vertical lifting guide rail.

[0101] The vertical lifting driving unit is used to drive the carrier component and the carried silicon rod to be ground to move up and down along the vertical lifting guide portion.

[0102] In certain embodiments, the vertical lifting driving unit includes a driving motor and a vertically arranged screw rod assembly driven by the driving motor, wherein the driving motor is arranged on the carrier base, and the screw rod assembly can include a screw rod obliquely arranged on the carrier base and associated with the driving motor, and a movable block screwed to the screw rod and connected with the carrier component, so that when the vertical lifting driving unit is used, the driving motor drives the screw rod in the screw rod assembly to rotate, thereby driving the movable block and the connected carrier component to move up and down vertically along the screw rod.

[0103] In some embodiments, the vertical lifting driving unit comprises a driving motor and a rack and pinion transmission assembly vertically arranged and driven by the driving motor, wherein the driving motor can be arranged on the bearing part, the rack and pinion transmission assembly can comprise a rack vertically arranged on the bearing base, and the pinion is associated with the driving motor, so that when the vertical lifting driving unit is used, the driving motor drives the pinion in the rack and pinion transmission assembly to rotate, thereby driving the pinion and the associated bearing part to move vertically along the rack.

[0104] The feeding driving mechanism is used to drive the silicon rod bearing structure and the silicon rod to be ground carried thereby to move from the loading position to the waiting position in the feeding direction (i.e., the second direction).

[0105] In Figures 1 to 3 In the illustrated embodiment, the feeding driving mechanism is used to drive the silicon rod bearing structure 21 and the silicon rod 100 carried thereby to move from the loading position to the waiting position in the second direction, wherein in the case involving the position corresponding to the first transfer device 3 and the position corresponding to the second transfer device 4, the waiting position is further refined, i.e., the waiting position comprises a first waiting position corresponding to the first transfer device 3 and a second waiting position corresponding to the second transfer device 4.

[0106] Regarding the feeding driving mechanism, in some embodiments, the feeding driving mechanism comprises a feeding guide rail, a sliding block, and a feeding driving unit.

[0107] The feeding guide rail is arranged on the base of the silicon rod grinding machine in the second direction.

[0108] The sliding block is arranged on the silicon rod bearing structure 21. In the embodiment of the present application, the sliding block is arranged on the bearing base 211 of the silicon rod bearing structure 21.

[0109] The feeding driving unit is used to drive the silicon rod bearing structure 21 to move along the feeding guide rail.

[0110] In some embodiments, the feeding driving unit comprises a driving motor and a screw rod assembly arranged in the second direction and driven by the driving motor, wherein the driving motor can be arranged on the base of the silicon rod grinding machine, the screw rod assembly can comprise a screw rod arranged in the second direction on the base of the silicon rod grinding machine and associated with the driving motor, and a movable block screwed on the screw rod and connected with the bearing base 211 of the silicon rod bearing structure 21, so that when the feeding driving unit is used, the driving motor drives the screw rod in the screw rod assembly to rotate, thereby driving the movable block and the connected silicon rod bearing structure 21 to move in the feeding direction along the screw rod.

[0111] In some embodiments, the feeding driving unit comprises a driving motor and a gear-rack transmission assembly arranged in the second direction and driven by the driving motor, wherein the driving motor can be arranged on the carrying base 211 of the silicon rod carrying structure 21, and the gear-rack transmission assembly can comprise a rack arranged on the machine base in the second direction, and the gear is associated with the driving motor, so that when the feeding driving unit is used, the driving motor drives the gear in the gear-rack transmission assembly to rotate, thereby driving the gear and its associated silicon rod carrying structure 21 to move along the rack.

[0112] In some embodiments, the feeding driving unit is arranged as a conveying belt mechanism, which conveys in the second direction to transport the silicon rod on the silicon rod carrying structure to the waiting area. The two ends of the conveying belt can be arranged on the left and right sides of the machine base, and the conveying distance covers the width of the silicon rod grinding machine. According to the processing needs, the silicon rod can be transferred from the feeding position to the first transfer rail or the second transfer rail at the first processing area, or the silicon rod at the first processing area or the second processing area can be transferred out of the silicon rod processing platform to the discharging position. The feeding position and the discharging position can be the same position and arranged at the same end of the silicon rod transfer device, or can be arranged at the two ends of the silicon rod transfer device in the second direction, i.e., the left and right ends.

[0113] Therefore, in the present embodiment, the silicon rod to be ground is driven by the feeding driving mechanism as shown in Figure 4 to complete the feeding work, and the process can generally include:

[0114] First, the movement amount is determined according to the movement destination of the silicon rod.

[0115] The silicon rod placed on the bearing part 213 of the silicon rod bearing structure is detected and the position information of the axial center line of the silicon rod 100 in the second direction is obtained. In addition, as mentioned above, the silicon rod grinding machine of the present application comprises the first transfer device 3 and the second transfer device 4, so here the moving destination of the silicon rod refers to the first waiting area corresponding to the first transfer device 3 or the second waiting area corresponding to the second transfer device 4. The position information of the first waiting area or the position information of the second waiting area can be determined. Here, since the feeding work of the silicon rod to be ground in the second direction is mainly driven by the feeding drive mechanism, the position information of the first waiting area or the position information of the second waiting area focuses on the position information in the second direction. In actual application, the position of the first waiting area in the second direction is consistent with the center line position of the first transfer device 3 in the second direction, and the position of the second waiting area in the second direction is consistent with the center line position of the second transfer device 4 in the second direction. Therefore, when the silicon rod 100 is to be moved to the first waiting area, according to the position information of the axial center line of the silicon rod on the silicon rod bearing structure 21 in the second direction and the position information of the first waiting area in the second direction, the moving amount required for the feeding drive mechanism to move the silicon rod 100 to the first waiting area in the second direction is determined. When the silicon rod 100 is to be moved to the second waiting area, according to the position information of the axial center line of the silicon rod on the silicon rod bearing structure 21 in the second direction and the position information of the second waiting area in the second direction, the moving amount required for the feeding drive mechanism to move the silicon rod 100 to the second waiting area in the second direction is determined.

[0116] Then, according to the determined moving amount, the silicon rod bearing structure 21 and the silicon rod 100 carried thereby are driven by the feeding drive mechanism to move from the loading area to the waiting area in the second direction by the determined moving amount.

[0117] In actual application, when the silicon rod 100 is to be moved to the first waiting area, the silicon rod bearing structure 21 and the silicon rod 100 carried thereby are driven by the feeding drive mechanism to move from the loading area to the first waiting area in the second direction by the determined moving amount, so that the axial center line of the silicon rod 100 on the silicon rod bearing structure 21 reaching the first waiting area is consistent with the center line of the first transfer device 3 in the second direction. When the silicon rod 100 is to be moved to the second waiting area, the silicon rod bearing structure 21 and the silicon rod 100 carried thereby are driven by the feeding drive mechanism to move from the loading area to the second waiting area in the second direction by the determined moving amount, so that the axial center line of the silicon rod 100 on the silicon rod bearing structure 21 reaching the second waiting area is consistent with the center line of the second transfer device 4 in the second direction.

[0118] Thus, in the silicon rod grinder of the present application, the silicon rod loading device 2 can move the silicon rod 100 to be ground from the loading area to the waiting area, and the axial center line of the silicon rod 100 moved to the waiting area is aligned with the center line of the corresponding device component, i.e., the axial center line of the silicon rod 100 moved to the first waiting area is aligned with (coincides with) the center line of the first transfer device 3, or the axial center line of the silicon rod 100 moved to the second waiting area is aligned with (coincides with) the center line of the second transfer device 4.

[0119] To achieve the alignment of the axial center line of the silicon rod 100 with the center line of the first transfer device 3 or the center line of the second transfer device 4, in actual applications, the operation sequence of the centering adjustment mechanism 23 and the feed drive mechanism in the silicon rod loading device 2 can be flexibly changed.

[0120] In some embodiments, the centering adjustment mechanism 23 can be operated first, and then the feed drive mechanism is operated. For example, the position of the silicon rod can be adjusted first by using the centering adjustment mechanism 23 so that the axial center line of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4 in the third direction, and then the silicon rod is driven to move in the second direction to the first waiting area or the second waiting area by using the feed drive mechanism, so that the axial center line of the silicon rod at the first waiting area is aligned with the center line of the first transfer device 3 in the second direction or the axial center line of the silicon rod at the second waiting area is aligned with the center line of the second transfer device 4 in the second direction, so that after adjustment, the axial center line of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4.

[0121] In some embodiments, the feed drive mechanism can be operated first, and then the centering adjustment mechanism 23 is operated.

[0122] In some embodiments, assuming that the centering adjustment mechanism 23 is a vertical lifting mechanism, the silicon rod can be first driven to move in the second direction to the first waiting area or the second waiting area by using the feed drive mechanism, so that the axial center line of the silicon rod at the first waiting area is aligned with the center line of the first transfer device 3 in the second direction or the axial center line of the silicon rod at the second waiting area is aligned with the center line of the second transfer device 4 in the second direction, and then the position of the silicon rod is adjusted by using the centering adjustment mechanism 23 so that the axial center line of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4 in the third direction, so that after adjustment, the axial center line of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4 in the same straight line along the first direction.

[0123] In some embodiments, when the centering adjustment mechanism 23 is a bevel lifting mechanism, the feeding driving mechanism can first drive the silicon rod to move in the second direction to the first waiting area or the second waiting area, wherein the axis of the silicon rod in the first waiting area is offset from the center line of the first transfer device or the axis of the silicon rod in the second waiting area is offset from the center line of the second transfer device in the second direction, and the offset is determined according to the difference (i.e., the height difference) between the current height information of the axis of the silicon rod 100 detected and the height information of the center line of the first transfer device 3 or the height information of the center line of the second transfer device 4 when the centering adjustment mechanism 23 is the bevel lifting mechanism; then the centering adjustment mechanism 23 is used to adjust the position of the silicon rod so that the axis of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4 in the third direction. Since the silicon rod also produces a certain displacement in the second direction when the silicon rod is adjusted by the bevel lifting mechanism as the centering adjustment mechanism 23, and the displacement is calculated in advance, it can be ensured that the displacement of the silicon rod in the third direction after the silicon rod is adjusted in the third direction is consistent with the previous offset, so that the axis of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4 in the same straight line after adjustment.

[0124] Of course, after the silicon rod to be ground is moved from the loading area to the waiting area by the silicon rod loading device 2 according to the movement determined based on the detection result, the silicon rod in the waiting area can also be detected by the detection device in some embodiments to detect whether the axis of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4. If the detection result shows that the axis of the silicon rod is aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4, it indicates that the silicon rod loading device 2 loads the silicon rod in place, and if the detection result shows that the axis of the silicon rod is not aligned with the center line of the first transfer device 3 or the center line of the second transfer device 4, the position of the silicon rod is continuously adjusted by the silicon rod loading device 2 until the silicon rod is loaded in place.

[0125] The silicon rod loading device in the silicon rod grinding equipment of the present application can also have other changes. For example, in some embodiments, the silicon rod loading device can also include a centering adjustment mechanism for adjusting the position of the silicon rod to be ground in the first direction so that it is located in the centering area of the silicon rod carrying structure. Please refer to Figures 1 to 4 The silicon rod loading device 2 can also include a centering adjustment mechanism 27, which includes a bracket 271, a sliding rail 273 arranged on the bracket 271, two push pieces 275 oppositely arranged on both sides of the bracket 271 and capable of moving on the sliding rail 273, and a driving motor.

[0126] The support 271 can be arranged along a first direction, for example, the support 271 can be arranged on the base 1, or the support 271 can be arranged on a mounting frame (or a first mounting frame or a second mounting frame). The slide rails 273 are arranged on the support 271 along the first direction, and the number of the slide rails 273 is not limited. Taking two slide rails 273 as an example, the two slide rails 273 are arranged on the support 271 along the first direction in parallel vertically. The two push-up pieces 275 are arranged on the slide rails 273 and are associated with the driving motor through, for example, a bidirectional screw rod. The push-up pieces 275 can be, for example, push-up plates or push-up blocks, and a jack rod can be further arranged on the push-up plates or the push-up blocks. Thus, in actual application, when the silicon rod 100 is to be located in the central region of the silicon rod bearing structure, the centering adjusting mechanism 27 is used to drive the silicon rod 100 to adjust the position of the silicon rod 100 along the first direction. For example, the two push-up pieces 275 are driven by the driving motor to move towards each other along the slide rails 273, and in the process of moving, the silicon rod 100 located between the two push-up pieces 275 is pushed up. Thus, after adjustment, the silicon rod 100 is located in the central region of the silicon rod bearing structure 21.

[0127] With respect to the centering adjusting mechanism 23 and the feeding driving mechanism in the silicon rod bearing device, after the silicon rod 100 is placed on the silicon rod bearing structure 21, the centering adjusting mechanism 27 can be operated, so that the silicon rod 100 is adjusted to the central region of the silicon rod bearing structure 21.

[0128] The silicon rod loading device disclosed in the application can realize the centering operation of the silicon rod in the loading work of moving the silicon rod from the loading area to the waiting area, so that the axis of the silicon rod is in the same straight line as the center line of the corresponding transfer device, which is beneficial to subsequent grinding work. Compared with the related art, the silicon rod loading device has the advantages of simple structure, convenient operation, accurate centering, high efficiency and the like.

[0129] The silicon rod grinding machine of the application is used for grinding a single crystal silicon rod obtained by cutting and squaring a raw silicon rod through a silicon rod cutting and squaring device. The raw silicon rod is usually a rod-shaped single crystal silicon grown from a melt by using a Czochralski method or a floating zone melting method.

[0130] As shown in Figure 1 The base 1 has a silicon rod processing platform provided with a first processing area and a second processing area. The silicon rod processing platform is arranged on the upper surface of the base 1. In an implementation manner of the embodiment, the processing platform is designed in a rectangular shape in accordance with the shape of the base 1, and the first processing area and the second processing area correspond to a rough grinding processing area and a fine grinding processing area in grinding, respectively. Figure 1As shown, the first processing area and the second processing area are arranged symmetrically and in parallel on the front and back sides of the silicon rod processing platform, and the single crystal silicon rods carried by the first processing area and the second processing area can be processed independently.

[0131] The first transfer device 3 and the second transfer device 4 are arranged above the silicon rod processing platform through a mounting frame 12. The mounting frame 12 is arranged on the machine base 1 in a vertical frame structure, and the upper surface of the frame body is higher than the silicon rod processing platform and carries the first transfer device 3 and the second transfer device 4. In an embodiment of the present application, as shown in Figure 1 , the first transfer device 3 and the second transfer device 4 are arranged in parallel on the left and right sides of the mounting frame 12. The support structure of the mounting frame 12 is arranged on the upper surface of the machine base 1. In the illustrated embodiment, the upper surface of the machine base 1 is rectangular, and the support structure of the mounting frame 12 is arranged on the outer edge of the rectangle. The upper surface of the mounting frame 12 is approximately the same shape and size as the upper surface of the machine base 1.

[0132] Regarding the first transfer device, in the present application, the first transfer device includes a first silicon rod clamp, a first transfer guide arranged in the transfer direction, and a first driving mechanism. The first silicon rod clamp is used to clamp a silicon rod, and the silicon rod is clamped horizontally by the first silicon rod clamp, that is, the silicon rod is clamped in a manner in which the axis of the silicon rod is aligned with the first direction. In the present embodiment, the clamping center of the first silicon rod clamp is aligned with the predetermined center line. As previously described, the position of the silicon rod can be adjusted by the silicon rod loading device, so that the axis of the silicon rod is aligned with the predetermined center line. Therefore, the clamping center of the first silicon rod clamp is aligned with the axis of the silicon rod. The first transfer driving mechanism is used to drive the first silicon rod clamp and the silicon rod clamped thereby to move along the first direction and transfer between the waiting area, the first processing area, and the second processing area.

[0133] Please refer to Figure 3 , the first transfer device 3 includes a first silicon rod clamp 31, a first transfer guide 32, and a first driving mechanism (not shown in the figure). The first silicon rod clamp 31 is carried on the first transfer guide 32. The first transfer guide 32 is arranged on the upper surface of the mounting frame 12 and arranged in the first direction, thereby limiting the movement of the first silicon rod clamp 31 in the first direction. The first driving mechanism is used to drive the first silicon rod clamp 31 and the silicon rod clamped thereby to move along the first transfer guide 32, and to enable the first silicon rod clamp 31 to transfer between the first processing area and the second processing area.

[0134] The first silicon rod clamp comprises a first clamp arm mounting seat, at least one pair of first clamp arms are arranged on the first clamp arm mounting seat, and the at least one pair of first clamp arms are oppositely arranged on the first clamp arm mounting seat in the first direction, so as to clamp two end surfaces of a silicon rod, and at least one first clamp arm in the at least one pair of first clamp arms can be moved along the first direction by a first clamp arm driving mechanism, so as to adjust the clamping distance between the at least one pair of first clamp arms.

[0135] Please refer to Figure 5 , which shows the structural schematic diagram of the first silicon rod clamp or the second silicon rod clamp in the silicon rod grinding machine of the present application. In some embodiments of the present application, taking the first silicon rod clamp as an example, as shown in Figure 5 , the first silicon rod clamp 31 comprises a first clamp arm mounting seat 311, at least one pair of first clamp arms 313, and a first clamp arm driving mechanism (not identified in the drawing). The first silicon rod clamp 31 is overall shown as the first clamp arm mounting seat 311 arranged above, the part outside the first clamp arm mounting seat 311 comprises the first clamp arms 313 in a suspended state, the first clamp arm mounting seat 311 is mounted on the mounting frame, and the first clamp arms 313 are suspended and extended from the first clamp arm mounting seat 311 below the hollow part of the mounting frame, so as to realize that the silicon rod clamped by the first clamp arms 313 is on the machining surface of the silicon rod machining platform.

[0136] The first clamp arm mounting seat is arranged on the first transfer guide rail, and in an implementation manner of the present embodiment, the bottom of the first clamp arm mounting seat is provided with a guide groove structure matched with the first transfer guide rail, the first transfer guide rail is arranged in the first direction, and the length range of the first transfer guide rail in the first direction covers at least the positions of the first working area and the second working area in the first direction, so as to ensure the transfer of the silicon rod clamped by the first silicon rod clamp between the two working areas. In an implementation manner of the present embodiment, the first transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.

[0137] The first clamp arm mounting seat is further provided with a first guide structure in the first direction, and the at least one pair of first clamp arms are arranged on the first clamp arm mounting seat through the first guide structure and can move in the first direction. In actual application, the first guide structure may, for example, be a first clamp arm guide rail, a first clamp arm guide groove, or a first clamp arm guide rod, etc.

[0138] The at least one pair of first clamp arms are oppositely arranged in the first direction, so as to clamp two end surfaces of a silicon rod.

[0139] For the silicon rod to be ground, the silicon rod is a cuboid structure with a certain length (the cross section is rectangular or similar to a rectangle), and the length direction is placed along the first direction, and the end surfaces are the cross sections at both ends of the length direction.

[0140] The first clamping arm is hung from a first clamping arm mounting seat, and includes a clamping portion below the first clamping arm for directly contacting and clamping the silicon rod. Figure 5 As shown in the figure, one end of the first clamping arm 313 is connected to the first clamping arm mounting seat 311, and the other end of the first clamping arm 313 is connected with a clamping portion 314 for contacting the end face of the silicon rod. The first clamping arm mounting seat 311 is movably arranged on the first transfer guide and moves along the first transfer guide under the drive of the first transfer drive unit, thereby driving the first clamping arm 313 to move along the first transfer guide.

[0141] The first silicon rod clamp further includes a first clamping arm drive mechanism, which is configured to drive at least one of the at least one pair of first clamping arms to move along the first direction, so as to adjust the clamping interval between the pair of oppositely arranged first clamping arms. Thus, the clamping portions of the at least one pair of first clamping arms can be driven by the first clamping arm drive mechanism to move towards or away from each other, so as to perform clamping or releasing actions on the silicon rod. For example, the clamping portions of two first clamping arms oppositely arranged along the first direction are driven by the first clamping arm drive mechanism to move towards each other to clamp the silicon rod, and the clamping state is maintained to move the silicon rod between different work areas and perform work, and after the work is completed, the silicon rod is transported to the carrying position, and then the clamping portions are driven by the first clamping arm drive mechanism to move away from each other to release the processed silicon rod.

[0142] In some embodiments of the present application, the first clamping arm drive mechanism includes a drive motor, a drive gear and a pair of racks. The drive motor drives the gear to rotate, and the pair of racks are engaged with the opposite ends of the drive gear. When the drive gear rotates, the pair of racks are driven to move towards or away from each other at opposite linear speeds at the two ends of the gear. In one implementation of the present embodiment, one end of each rack of the pair of racks is engaged with the drive gear, and the other end of each rack is connected with a first clamping arm, so that the at least one pair of first clamping arms move away from or towards each other along the first clamping arm mounting seat guide in the first direction.

[0143] In some embodiments of the present application, the first clamping arm drive mechanism includes a lead screw and a drive source. The lead screw is arranged along the first direction and associated with any one of the pair of first clamping arms, and the drive source is connected with the lead screw and configured to drive the lead screw to rotate so that the associated first clamping arm moves along the first direction.

[0144] The first clamping arm driving mechanism includes a screw rod having a distal end and a proximal end, in a specific implementation, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to any one of the first clamping arms, by the connection of the screw rod at both ends, the screw rod can be rotated based on the transmission of the driving source and the rotation of the screw rod is converted into axial displacement by the threaded connection, and the axial displacement direction is the setting direction of the screw rod, i.e., the first direction; the rotation of the screw rod driven by the driving source can realize the movement of the first clamping arm connected to the distal end of the screw rod in the first direction, and the rotation direction of the screw rod driven to rotate can realize the forward movement or the backward movement of the associated first clamping arm in the first direction.

[0145] In some embodiments of the present application, the first clamping arm driving mechanism includes a bidirectional screw rod arranged in the first direction and threadedly connected to the at least one pair of first clamping arms at both ends, and a driving source for driving the screw rod to rotate so that the at least one pair of first clamping arms move towards each other or move away from each other in the first direction.

[0146] In an implementation, the bidirectional screw rod of the first clamping arm driving mechanism is threadedly connected to the pair of first clamping arms at both ends, and the bidirectional screw rod is a double-thread screw rod and the thread directions at both ends are opposite, the driving source can be arranged at any one end of the bidirectional screw rod or connected to the bidirectional screw rod to drive the bidirectional screw rod to rotate along the screw rod axis, and by the opposite thread directions at both ends of the bidirectional screw rod, the movement of the bidirectional screw rod at both ends is converted into linear motion in the opposite directions along the screw rod axis and the first direction when the bidirectional screw rod is rotated under the driving of the driving source. Under the driving of the driving source, the pair of first clamping arms can move towards each other or move away from each other in the first direction.

[0147] In an implementation, the first clamping arm mounting seat can be a plurality of mounting seats connected by the first clamping arm driving mechanism, any one of the pair of first clamping arms corresponds to a mounting seat, and the driving source is arranged between the pair of first clamping arms, in which any first clamping arm can move along the guide structure; when the first silicon rod clamp needs to move as a whole along the guide structure, the driving source of the first clamping arm driving mechanism can be controlled to make the pair of first clamping arms relatively stationary, at this time, different mounting seats can be relatively stationary by the connection of the first clamping arm driving mechanism, and the power source of the first silicon rod clamp can drive any mounting seat to move along the guide structure to realize the overall movement of the first silicon rod clamp.

[0148] In yet another implementation, the first clamping arm driving mechanism comprises a first rack, a second rack and a driving gear; the first and second racks are respectively linked to a first clamping arm, the driving gear is connected to a power output shaft (not shown) of a driving motor and engaged with the first and second racks, and the driving gear is used to drive the pair of first clamping arms to move towards each other to perform a clamping action when rotating in a forward direction, and to move away from each other to perform a releasing action when rotating in a reverse direction.

[0149] In an embodiment of the present application, the first clamping arm is of a rotating structure, for example, the first silicon rod clamp further comprises a first clamping arm rotating mechanism for driving the first clamping arm to rotate. In an implementation of the embodiment, any one clamping part of the at least one pair of first clamping arms or the two clamping parts of the pair of first clamping arms are provided with a rotatable structure, which is driven by the first clamping arm rotating mechanism to rotate the clamping part of the first clamping arm with the length direction of the silicon rod, i.e. the first direction, as the axis of rotation, so that the clamped silicon rod rotates correspondingly with the first direction as the axis of rotation. For example, in some examples, the first clamping arm rotating mechanism can be a rotating motor, and the clamping parts of the two first clamping arms of the pair of first clamping arms are provided with rotatable structures, and the clamping parts of the two first clamping arms or the clamping part of one of the first clamping arms are connected with the output shaft of the rotating motor, for example, the clamping parts of the two first clamping arms are respectively connected with a rotating motor, and the clamping parts of the corresponding first clamping arms are driven to rotate by the two rotating motors, or the clamping part of one of the first clamping arms is connected with a rotating motor, and the clamping part of the corresponding first clamping arm is driven to rotate by the rotating motor, and the clamping part of the other first clamping arm is also driven to rotate by the friction force through the conduction of the clamped silicon rod.

[0150] In some implementations of the embodiment, the clamping part of the at least one pair of first clamping arms has a contact surface for clamping the silicon rod. When the clamping end of the silicon rod is two end surfaces at both ends of the elongated structure, the contact surface of the clamping part can be a contact surface in the direction of the perpendicular or a contact surface including a plane in the direction of the perpendicular. The contact surface is arranged on a rotatable platform, and the cross section of the platform can be arranged as a self-defined regular geometric shape or irregular geometric shape.

[0151] In an embodiment of the present application, the rotatable platform can be arranged as a whole of a hinged device with a locking function, which can rotate along the axis of the first direction. The axis of the rotating shaft is connected to the first clamping arm rotating mechanism.

[0152] In an embodiment of the present application, the clamping portion of the first clamping arm is a rotatable circular platform, the circular plane of the circular platform is in contact with the end face of the silicon rod and remains stationary relative to the end face of the silicon rod after being in contact with the end face of the silicon rod. The clamping portion further comprises a locking structure, the clamping portion is in a locked state when the silicon rod is subjected to a corresponding work operation (the work operation can be, for example, surface grinding, chamfering, etc.). In the switching of the silicon rod, for example, the switching of the grinding surface, the clamping portion is rotated along the center of the circular platform under the driving of the first clamping arm rotating mechanism.

[0153] In an embodiment, the clamping portion of the first clamping arm comprises a rotatable circular platform and a series of protruding contacts arranged on the circular platform, each contact has a contact plane. The circular platform is rotated under the driving of the first clamping arm rotating mechanism. In an implementation of the embodiment, the protruding length of the contact, i.e., the position in the first direction, is adjustable, so that in the process of clamping the silicon rod, for the silicon rod with a lower flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact plane is in contact with the end face of the silicon rod. The protruding length is the length in the first direction from the circular plane of the circular platform to the contact plane of the contact. In the embodiment as shown in FIG. 3, the protruding length of the contact is adjustable, so that the contact plane of the contact is in contact with the end face of the silicon rod. Figure 5 In the embodiment as shown in FIG. 3, the clamping portion 314 of the first clamping arm 313 is a rotatable circular platform, and a series of protruding contacts 3141 are arranged on the circular platform.

[0154] In an embodiment of the present application, the clamping portion of the first silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of first clamping arms of the first silicon rod clamp is driven by the first clamping arm driving mechanism to move towards each other in the first direction until the contact plane of the clamping portion is in contact with the end face of the silicon rod to be clamped. When the clamping portion is provided with a plurality of contacts and it is detected that the pressure value of the contact between the part of the contacts and the end face of the contacted silicon rod is less than a set value or a set range, the clamping degree can be changed by adjusting the protruding length of the contact (generally in the direction of approaching the end face of the silicon rod); or, each clamping portion of a pair of first clamping arms of the first silicon rod clamp is provided as a contact plane, and in the process of clamping the silicon rod, a pair of first clamping arms are driven by the first clamping arm driving mechanism to move towards each other to achieve the end faces of the two ends of the silicon rod, so that after the clamping portion is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and when the set pressure range is reached, the first clamping arm driving mechanism controls the movement of the pair of first clamping arms to stop.

[0155] The first clamping arm rotating mechanism can be arranged on one of the first clamping arms (the other first clamping arm only has a rotating function) to drive the clamping part of the pair of first clamping arms to rotate with the clamped silicon rod; or the first clamping arm rotating mechanism is arranged on each of the pair of first clamping arms and cooperatively controls the two clamping parts of the pair of first clamping arms to rotate by the same angle and in the same direction. In some implementations, the first clamping arm rotating mechanism can be arranged as a driving motor.

[0156] When the silicon rod is ground by the coarse grinding device or the fine grinding device, the first clamping arm rotating mechanism can be used to drive the clamping part to rotate. When the silicon rod is generally ground, the first clamping arm rotating mechanism can control the clamping part to rotate by an angle of, for example, 90°, so that one side or opposite two sides of the silicon rod are ground by the coarse grinding device or the fine grinding device.

[0157] When different sides of the silicon rod are ground or the edges are chamfered by the coarse grinding device or the fine grinding device, the first clamping arm rotating mechanism can be used to drive the clamping part to rotate. When the single crystal silicon rod is generally opened, the first clamping arm rotating mechanism can control the clamping part to rotate by an angle of, for example, 90°, so that different sides are ground, or the first clamping arm rotating mechanism can control the clamping part to rotate by an angle of, for example, 45°, 135°, etc., so that different edges are chamfered. When the grinding surface provided by the coarse grinding device or the fine grinding device is a plane, the first clamping arm rotating mechanism can control the clamping part and the silicon rod clamped thereby to rotate by different angles to achieve multiple chamfering, for example, after the silicon rod is ground on one side, the adjacent edge of the side and the edge opposite to the edge can be chamfered by rotating by an angle of, for example, 40°, 45°, 50°, etc., so that the silicon rod has a smoother transition at the junction of different sides. The angles are all rotation angles starting from the initial position of grinding. The chamfering method can be referred to, for example, CN108942570A, etc., by driving the silicon rod to rotate by a certain angle and the grinding tool to feed in the second direction transversely to grind the edge.

[0158] In an embodiment of the present application, the first silicon rod clamp is a lifting type silicon rod clamp. In an implementation, the first silicon rod clamp comprises a lifting guide rail and a lifting driving device in a lifting direction, the first clamp arm of the first silicon rod clamp and the clamp arm guide rail of the first clamp arm mounting seat carrying the first clamp arm are movable along the lifting guide rail in a third direction (i.e., a direction perpendicular to the gravity line), which can be used to control the relative position of the outer surface of the silicon rod and the coarse grinding device or the fine grinding device in the direction perpendicular to the gravity line, so as to select the grinding area of the silicon rod to be ground by the coarse grinding device or the fine grinding device. In an implementation of the embodiment, the lifting guide rail is arranged on the vertical surface of the first clamp arm mounting seat, and a guide groove corresponding to the lifting guide rail and a driving mechanism driving the first clamp arm to move up and down are arranged on the first clamp arm correspondingly; the driving mechanism comprises a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected to the traveling motor, and the first clamp arm is driven to move in the third direction by the traveling motor. In another implementation, each first clamp arm of the pair of first clamp arms is cantilevered as a telescopic device, and simultaneously moves up and down under the driving of the telescopic driving mechanism.

[0159] As to the first transfer driving mechanism, the first transfer driving mechanism comprises a first transfer guide rail and a first transfer driving unit, wherein the first transfer guide rail is arranged along a first direction for arranging the first clamp arm mounting seat, and the first transfer driving unit is used to drive the first clamp arm mounting seat and at least one pair of first clamp arms thereof to move along the first transfer guide rail.

[0160] The first transfer driving unit comprises a first moving rack, a first driving gear and a first driving source. The first moving rack is arranged along the first direction and parallel to the first transfer guide rail. In an embodiment, the first moving rack is fixed on the upper surface, the side surface or the lower surface of the mounting frame and arranged to have approximately the same first direction dimension as the first transfer guide rail, parallel to and adjacent to the first transfer guide rail.

[0161] The first driving gear is arranged on the first silicon rod clamp and engaged with the first moving rack, for driving the first silicon rod clamp to move along the first transfer guide rail. The first driving source is used to drive the first driving gear. In an implementation of the present application, the first driving gear is arranged on the first clamp arm mounting seat of the first silicon rod clamp, the first driving gear is driven to rotate by the first driving source, the teeth of the first driving gear are engaged with the first moving rack, the first driving gear moves along the first moving rack, and the first silicon rod clamp connected to the first driving gear moves correspondingly on the first transfer guide rail.

[0162] In an embodiment of the present application, the first transfer driving unit can be arranged on the first silicon rod clamp, comprising a first moving screw rod and a first driving source, wherein the first moving screw rod is arranged along the first direction and associated with the first clamp arm mounting seat, and the first driving source is used to drive the first moving screw rod to rotate so as to drive the associated first clamp arm mounting seat and at least one pair of first clamp arms to move along the first transfer rail.

[0163] In an implementation manner of the present embodiment, the first driving source can be arranged as a driving motor, a power output shaft of the driving motor is connected with the first driving gear shaft, and the movement state of the first driving gear is controlled, and then the first driving source controls the movement of the first silicon rod clamp and the silicon rod clamped thereby in the first direction.

[0164] Regarding the second transfer device, in the present application, the second transfer device comprises a second silicon rod clamp, a second transfer rail arranged along the transfer direction, and a second driving mechanism. Wherein, the second silicon rod clamp is used to clamp a silicon rod, and the silicon rod is clamped by the second silicon rod clamp in a horizontal manner, i.e., the silicon rod is clamped in a manner that the axial center line of the silicon rod is consistent with the first direction. In the present embodiment, the clamping center of the second silicon rod clamp is aligned with the predetermined center line, as described above, the position of the silicon rod is adjusted by the silicon rod loading device, so that the axial center line of the silicon rod is aligned with the predetermined center line, and thus the clamping center of the second silicon rod clamp is aligned with the axial center line of the silicon rod. The second transfer driving mechanism is used to drive the second silicon rod clamp and the silicon rod clamped thereby to move along the first direction and transfer between the waiting area, the second processing area, and the second processing area.

[0165] Please refer to Figure 3 , the second transfer device 4 comprises a second silicon rod clamp 41, a second transfer rail 42, and a second driving mechanism (not shown in the figure). Wherein, the second silicon rod clamp 41 is carried on the second transfer rail 42; the second transfer rail 42 is arranged on the upper surface of the mounting frame 12 and arranged along the first direction, and the second silicon rod clamp 41 restricted thereon moves along the first direction. The second driving mechanism is used to drive the second silicon rod clamp 41 and the silicon rod clamped thereby to move along the second transfer rail 42, and make the second silicon rod clamp 41 realize the transfer between the second processing area and the second processing area.

[0166] The second silicon rod clamp comprises a second clamp arm mounting seat, at least one pair of second clamp arms is arranged on the second clamp arm mounting seat, the at least one pair of second clamp arms is arranged on the second clamp arm mounting seat in a manner of facing each other along the first direction, and is used to clamp two end faces of a silicon rod, and at least one second clamp arm in the at least one pair of second clamp arms can move along the first direction by a second clamp arm driving mechanism to adjust the clamping spacing between the at least one pair of second clamp arms.

[0167] Referring to Figure 5 , a structural diagram of a second silicon rod clamp or a second silicon rod clamp in a silicon rod grinder of the present application is shown. In some embodiments of the present application, the second silicon rod clamp is taken as an example, as shown in Figure 5 , the second silicon rod clamp 41 includes a second clamp arm mounting seat 411, at least one pair of second clamp arms 413, and a second clamp arm driving mechanism (not identified in the figure). The second silicon rod clamp 41 as a whole presents that the second clamp arm mounting seat 411 is arranged above, the second clamp arm mounting seat 411 includes the second clamp arms 413 in a suspended state outside, the second clamp arm mounting seat 411 is mounted on the mounting frame, and the second clamp arms 413 are suspended and extended from the second clamp arm mounting seat 411 below the hollow part of the mounting frame to achieve that the silicon rod clamped by the second clamp arms 413 is on the processing surface of the silicon rod processing platform.

[0168] The second clamp arm mounting seat is arranged on the second transfer guide rail, and in an implementation manner of the embodiment, the bottom of the second clamp arm mounting seat is provided with a guide groove structure matched with the second transfer guide rail, the second transfer guide rail is arranged along the first direction, and the length range of the second transfer guide rail in the first direction covers at least the positions of the second work area and the second work area in the first direction, so as to ensure the transfer of the silicon rod clamped by the second silicon rod clamp between the two work areas. In an implementation manner of the embodiment, the second transfer guide rail is arranged to span the entire length of the mounting frame in the first direction.

[0169] The second clamp arm mounting seat is further provided with a second guide structure along the first direction, and the at least one pair of second clamp arms are arranged on the second clamp arm mounting seat through the second guide structure and can move in the first direction. In actual application, the second guide structure can be, for example, a second clamp arm guide rail, a second clamp arm guide groove, or a second clamp arm guide rod, etc.

[0170] The at least one pair of second clamp arms are arranged opposite to each other along the first direction, for clamping two end surfaces of the silicon rod.

[0171] For the silicon rod to be ground, the silicon rod is a cuboid structure (the cross section is rectangular or similar) with a certain length, and the length direction is placed along the first direction, and the end surfaces are the cross sections at both ends of the length direction.

[0172] The second clamp arms are suspended from the second clamp arm mounting seat, and the lower part of the second clamp arms includes a clamping part for directly contacting and clamping the silicon rod. As Figure 5As shown, one end of the second clamping arm 413 is connected to the second clamping arm mounting seat 411, and the other end of the second clamping arm 413 is connected with a clamping part 414 for contacting the end face of the silicon rod. The second clamping arm mounting seat 411 is movably arranged on the second transfer guide and moves along the second transfer guide under the driving of the second transfer driving unit, thereby driving the second clamping arm 413 to move along the second transfer guide.

[0173] The second silicon rod clamp further comprises a second clamping arm driving mechanism, which can drive at least one second clamping arm of the at least one pair of second clamping arms to move along the first direction, so as to adjust the clamping spacing between the pair of oppositely arranged second clamping arms. Thus, the clamping parts of the at least one pair of second clamping arms can approach or move away from each other under the action of the second clamping arm driving mechanism, so as to perform the clamping or releasing action on the silicon rod. For example, the clamping parts of the two second clamping arms oppositely arranged along the first direction approach each other to clamp the silicon rod under the driving of the second clamping arm driving mechanism, and the silicon rod is transferred between different working areas and subjected to working operation in the clamped state. After the working operation is completed, the silicon rod is transported to the carrying position, and then the clamping parts of the two second clamping arms move away from each other under the driving of the second clamping arm driving mechanism to release the processed silicon rod.

[0174] In some embodiments of the present application, the second clamping arm driving mechanism comprises a driving motor, a driving gear and a pair of racks. The driving motor drives the gear to rotate, and the pair of racks are engaged with the opposite ends of the driving gear. When the driving gear rotates, the pair of racks are driven to approach or move away from each other at the linear speed in the opposite direction of the two ends of the gear. In one implementation of the present embodiment, one end of each rack of the pair of racks is engaged with the driving gear, and the other end of each rack is connected with a second clamping arm, respectively, so that the at least one pair of second clamping arms move away from or approach each other along the second clamping arm mounting seat guide in the first direction.

[0175] In some embodiments of the present application, the second clamping arm driving mechanism comprises a lead screw and a driving source, wherein the lead screw is arranged along the first direction and associated with any second clamping arm of the pair of second clamping arms, and the driving source is connected with the lead screw for driving the lead screw to rotate so that the associated second clamping arm moves along the first direction.

[0176] The second clamping arm driving mechanism has a screw rod with a distal end and a proximal end. In a specific implementation, the proximal end of the screw rod can be connected to the driving source and rotated under the driving of the driving source, and the distal end of the screw rod is threadedly connected to any one of the second clamping arms. Through the connection of the two ends of the screw rod, the screw rod can rotate based on the transmission of the driving source and convert the rotation of the screw rod into axial displacement through the threaded connection. The axial displacement direction is the setting direction of the screw rod, i.e., the first direction. The driving of the driving source to rotate the screw rod can realize the movement of the second clamping arm connected to the distal end of the screw rod in the first direction. The rotation direction of the screw rod driven to rotate can change, thereby realizing the forward movement or backward movement of the associated second clamping arm in the first direction.

[0177] In some embodiments of the present application, the second clamping arm driving mechanism includes a bidirectional screw rod arranged in the first direction and threadedly connected to the at least one pair of second clamping arms at both ends, and a driving source for driving the screw rod to rotate so that the at least one pair of second clamping arms move towards each other or move away from each other in the first direction.

[0178] In an implementation, the bidirectional screw rod of the second clamping arm driving mechanism is threadedly connected to the pair of second clamping arms at both ends, and the bidirectional screw rod is a double-threaded screw rod and the thread directions at both ends are opposite. The driving source can be arranged at any one end of the bidirectional screw rod or connected to the bidirectional screw rod to drive the bidirectional screw rod to rotate along the screw rod axis. Through the opposite threads at both ends of the bidirectional screw rod, the movement of both ends of the bidirectional screw rod is converted into linear motion in the opposite directions along the screw rod axis and in the first direction when the bidirectional screw rod is driven to rotate. Under the driving of the driving source, the pair of second clamping arms can move towards each other or move away from each other in the first direction.

[0179] In an implementation, the second clamping arm mounting seat can be a plurality of mounting seats connected by the second clamping arm driving mechanism. Any one of the pair of second clamping arms corresponds to a mounting seat, and the driving source is arranged between the pair of second clamping arms, in which any second clamping arm can move along the guide structure. When the second silicon rod clamp needs to move as a whole along the guide structure, the driving source of the second clamping arm driving mechanism can be controlled to keep the pair of second clamping arms relatively stationary. At this time, different mounting seats can be kept relatively stationary through the connection of the second clamping arm driving mechanism. The power source of the second silicon rod clamp can drive any mounting seat to move along the guide structure, thereby realizing the overall movement of the second silicon rod clamp.

[0180] In yet another implementation, the second clamping arm driving mechanism comprises a second rack, a second rack and a driving gear; the second rack and the second rack are respectively linked to a second clamping arm, the driving gear is connected to the power output shaft (not shown) of the driving motor and is engaged with the second rack and the second rack, and the driving gear is used to drive the pair of second clamping arms to move towards each other to perform a clamping action when rotating in a forward direction, and to move away from each other to perform a releasing action when rotating in a reverse direction.

[0181] In an embodiment of the present application, the second clamping arm is of a rotating structure, for example, the second silicon rod clamp further comprises a second clamping arm rotating mechanism for driving the second clamping arm to rotate. In an implementation of the embodiment, any one clamping part of the at least one pair of second clamping arms or the two clamping parts of the pair of second clamping arms are provided with a rotatable structure, which is driven by the second clamping arm rotating mechanism to rotate the clamping part of the second clamping arm with the length direction of the silicon rod, i.e. the first direction, as the axis of rotation, so that the clamped silicon rod rotates accordingly with the first direction as the axis of rotation. For example, in some examples, the second clamping arm rotating mechanism can be a rotating motor, the clamping parts of the two second clamping arms of the pair of second clamping arms are provided with rotatable structures, and the clamping parts of the two second clamping arms or the clamping part of one of the second clamping arms are connected to the output shaft of the rotating motor, for example, the clamping parts of the two second clamping arms are respectively connected to a rotating motor, and the clamping parts of the corresponding second clamping arms are driven to rotate by the two rotating motors, or the clamping part of one of the second clamping arms is connected to a rotating motor, and the clamping part of the corresponding second clamping arm is driven to rotate by the rotating motor, and another clamping part of the second clamping arm is also driven to rotate by the friction force through the conduction of the clamped silicon rod.

[0182] In some implementations of the embodiment, the clamping part of the at least one pair of second clamping arms has a contact surface for clamping the silicon rod. When the clamping end of the silicon rod is two end faces at both ends of the elongated structure, the contact surface of the clamping part can be a contact surface in the direction of the perpendicular or a contact surface including a plane in the direction of the perpendicular. The contact surface is provided on a rotatable platform, and the cross section of the platform can be provided as a self-defined regular geometric shape or irregular geometric shape.

[0183] In an embodiment of the present application, the rotatable platform can be provided as a whole hinged by a hinge device with a locking function, and can rotate along the axis of the first direction. The axis of the rotation shaft is connected to the second clamping arm rotating mechanism.

[0184] In an embodiment of the present application, the clamping portion of the second clamping arm is a rotatable circular platform, the circular plane of the circular platform is in contact with the end face of the silicon rod and remains stationary relative to the end face of the silicon rod after being in contact with the end face of the silicon rod. The clamping portion further comprises a locking structure, the clamping portion is in a locked state when the silicon rod is subjected to a corresponding work operation (the work operation can be, for example, surface grinding, chamfering, etc.). In the switching of the silicon rod, for example, the switching of the grinding surface, the clamping portion is rotated along the center of the circular platform under the driving of the second clamping arm rotating mechanism.

[0185] In an embodiment, the clamping portion of the second clamping arm comprises a rotatable circular platform and a series of protruding contacts arranged on the circular platform, each contact has a contact plane. The circular platform rotates under the driving of the second clamping arm rotating mechanism. In an implementation of the embodiment, the protruding length of the contact, i.e., the position in the first direction, is adjustable, so that in the process of clamping the silicon rod, for the silicon rod with a lower flatness of the end face, the protruding length of the contact can be adjusted according to the end face of the silicon rod, so that each contact plane is in contact with the end face of the silicon rod. The protruding length is the length in the first direction from the circular plane of the circular platform to the contact plane of the contact. In the embodiment as shown in FIG. 4B, the protruding length of the contact is adjustable by adjusting the position of the contact in the first direction. Figure 5 In the embodiment as shown in FIG. 4B, the clamping portion 414 of the second clamping arm 413 is a rotatable circular platform, and a series of protruding contacts 4141 are arranged on the circular platform.

[0186] In an embodiment of the present application, the clamping portion of the second silicon rod clamp is provided with a pressure sensor to adjust the protruding length of the contact based on the detected pressure state. Generally, in the process of clamping the silicon rod, a pair of second clamping arms of the second silicon rod clamp are driven by the second clamping arm driving mechanism to move towards each other in the first direction until the contact plane of the clamping portion is in contact with the end face of the silicon rod to be clamped. When the clamping portion is provided with a plurality of contacts and it is detected that the pressure value of the contact between the part of the contacts and the end face of the contacted silicon rod is less than a set value or a set range, the clamping degree can be changed by adjusting the protruding length of the contact (generally in the direction of approaching the end face of the silicon rod). Alternatively, each clamping portion of a pair of second clamping arms of the second silicon rod clamp is provided with a contact plane. In the process of clamping the silicon rod, a pair of second clamping arms are driven by the second clamping arm driving mechanism to move towards each other to achieve that, after the clamping portion is in contact with the end face of the silicon rod, the clamping degree of the silicon rod is detected by the pressure sensor, and the movement of the pair of second clamping arms towards each other is stopped by the second clamping arm driving mechanism when the set pressure range is reached.

[0187] The second clamping arm rotating mechanism can be arranged on one of the second clamping arms (the other second clamping arm only has a rotating function) to drive the clamping part of the pair of second clamping arms to rotate with the clamped silicon rod; or the second clamping arm rotating mechanism is arranged on each of the pair of second clamping arms and cooperatively controls the two clamping parts of the pair of second clamping arms to rotate by the same angle and in the same direction. In some implementations, the second clamping arm rotating mechanism can be arranged as a driving motor.

[0188] When the silicon rod is ground by the coarse grinding device or the fine grinding device, the clamping part can be driven to rotate by the second clamping arm rotating mechanism. When the silicon rod is generally ground, the second clamping arm rotating mechanism controls the clamping part to rotate by an angle of, for example, 90°, so that one side or opposite two sides of the silicon rod are ground by the coarse grinding device or the fine grinding device.

[0189] When different sides of the silicon rod are ground or the edges are chamfered by the coarse grinding device or the fine grinding device, the clamping part is driven to rotate by the second clamping arm rotating mechanism. When the single crystal silicon rod after being cut is ground on different sides, the second clamping arm rotating mechanism controls the clamping part to rotate by an angle of, for example, 90°, and when different edges are chamfered, the clamping part can be controlled to rotate by an angle of, for example, 45°, 135°, etc. When the grinding surface provided by the coarse grinding device or the fine grinding device is a plane, when the silicon rod is chamfered, the second clamping arm rotating mechanism can control the clamping part and the silicon rod clamped thereby to rotate by different angles to achieve multiple chamfering, for example, after the silicon rod is ground on one side, the adjacent edge of the side and the edge opposite to the edge can be chamfered by rotating by an angle of, for example, 40°, 45°, 50°, etc., to obtain a silicon rod with a smoother transition at the junction of different sides. The angles are all rotation angles starting from the initial position of grinding. The chamfering manner can be referred to, for example, CN108942570A, etc. The silicon rod is driven to rotate by an angle, and the grinding tool is cooperatively fed in the second direction to grind the edge.

[0190] In an embodiment of the present application, the second silicon rod clamp is a lifting type silicon rod clamp. In an implementation, the second silicon rod clamp comprises a lifting guide rail and a lifting driving device in the lifting direction, the second clamp arms of the second silicon rod clamp and the clamp arm guide rails of the second clamp arm mounting seat carrying the second clamp arms are movable along the lifting guide rail in the third direction (i.e., the direction of the plumb line), which can be used to control the relative position of the outer surface of the silicon rod and the coarse grinding device or the fine grinding device in the direction of the plumb line, so as to select the grinding area of the silicon rod to be ground by the coarse grinding device or the fine grinding device. In an implementation of the embodiment, the lifting guide rail is arranged on the vertical surface of the second clamp arm mounting seat, and a guide groove corresponding to the lifting guide rail and a driving mechanism driving the second clamp arm to move up and down are arranged on the second clamp arm correspondingly; the driving mechanism comprises a traveling screw and a traveling motor, the traveling screw is arranged along the lifting guide rail and connected to the traveling motor, and the second clamp arm is driven to move in the third direction by the traveling motor. In another implementation, each second clamp arm of the pair of second clamp arms is arranged as a telescopic device and is simultaneously driven to move up and down by a telescopic driving mechanism.

[0191] As to the second transfer driving mechanism, the second transfer driving mechanism comprises a second transfer guide rail and a second transfer driving unit, wherein the second transfer guide rail is arranged along the first direction for arranging the second clamp arm mounting seat, and the second transfer driving unit is used to drive the second clamp arm mounting seat and at least one pair of second clamp arms thereof to move along the second transfer guide rail.

[0192] The second transfer driving unit comprises a second moving rack rail, a second driving gear and a second driving source. The second moving rack rail is arranged along the first direction and is parallel to the second transfer guide rail. In an embodiment, the second moving rack rail is fixed on the upper surface, the side surface or the lower surface of the mounting frame and is arranged to have approximately the same first direction dimension as the second transfer guide rail, i.e., the second moving rack rail is arranged parallel to and adjacent to the second transfer guide rail.

[0193] The second driving gear is arranged on the second silicon rod clamp and is engaged with the second moving rack rail, and is used to drive the second silicon rod clamp to move along the second transfer guide rail. The second driving source is used to drive the second driving gear. In an implementation of the present application, the second driving gear is arranged on the second clamp arm mounting seat of the second silicon rod clamp, the second driving gear is driven to rotate by the second driving source, the teeth of the second driving gear are engaged with the second moving rack rail, the second driving gear travels along the second moving rack rail, and the second silicon rod clamp connected to the second driving gear thus moves correspondingly on the second transfer guide rail.

[0194] In an embodiment of the present application, the second transfer driving unit can be arranged on the second silicon rod clamp, comprising a second moving lead screw and a second driving source, wherein the second moving lead screw is arranged along the first direction and associated with the second clamp arm mounting seat, and the second driving source is used to drive the second moving lead screw to rotate so as to drive the associated second clamp arm mounting seat and at least one pair of second clamp arms to move along the second transfer guide rail.

[0195] In an implementation manner of the present embodiment, the second driving source can be arranged as a driving motor, a power output shaft of the driving motor is connected with the second driving gear shaft, and the movement state of the second driving gear is controlled, and then the second driving source controls the movement of the second silicon rod clamp and the silicon rod clamped thereby in the first direction.

[0196] In combination with the aforementioned first transfer device, the second transfer guide rail in the second transfer device is arranged in parallel with the first transfer guide rail in the first transfer device along the first direction, and the first silicon rod clamp of the first transfer device and the second silicon rod clamp of the second transfer device move in mutually parallel paths defined by the first transfer guide rail and the second transfer guide rail respectively. When the first silicon rod clamp and the silicon rod clamped thereby are transferred between different processing positions, the second silicon rod clamp and the silicon rod clamped thereby can also be transferred between different processing positions, and the movement of the first silicon rod clamp and the second silicon rod clamp is independent of each other, and the first transfer guide rail and the second transfer guide rail defining the movement range thereof are arranged at different spatial positions and do not interfere with each other. In an embodiment of the present application, the machine base of the silicon rod grinding machine and the top view of the mounting frame are both regular rectangles, and the first transfer guide rail and the second transfer guide rail are both arranged along the first direction, and are arranged in parallel and symmetrically, and the symmetry line is the center axis of the machine base in the first direction.

[0197] As can be seen from the above, the first transfer device and the second transfer device are used to realize the movement control of the silicon rod, for example, the first transfer device is used to clamp the silicon rod and drive the silicon rod to move along the first direction, and the second transfer device is used to clamp the silicon rod and drive the silicon rod to move along the first direction, so that any one silicon rod can be moved relative to the coarse grinding device located at the first processing position or the fine grinding device located at the second processing position along the first direction to realize the preset grinding operation of the silicon rod.

[0198] In the silicon rod grinding machine of the present application, the coarse grinding device and the fine grinding device are included.

[0199] The coarse grinding device is arranged at the first processing position of the silicon rod processing platform, and is used to perform coarse grinding operation on the silicon rod clamped by the first silicon rod clamp in the first transfer device or the silicon rod clamped by the second silicon rod clamp in the second transfer device.

[0200] The coarse grinding device includes at least one pair of coarse grinding tools. The first silicon rod clamp or the second silicon rod clamp drives the silicon rod to be ground to move in the first direction, so that the coarse grinding device can be set in a fixed state when performing the coarse grinding operation, and the relative feeding between the coarse grinding tools and the silicon rod can be realized.

[0201] In an embodiment, the coarse grinding device includes a coarse grinding tool mounting seat, at least one pair of coarse grinding tools, and a coarse grinding tool feeding and withdrawing mechanism.

[0202] The coarse grinding tool mounting seat is used to arrange the at least one pair of coarse grinding tools. The specific structure of the coarse grinding tool mounting seat can be different forms based on the arrangement requirements of the coarse grinding tools, such as a beam body, a plate frame, etc.

[0203] In some embodiments, the at least one pair of coarse grinding tools are arranged on the coarse grinding tool mounting seat, or the at least one pair of coarse grinding tools are arranged on the coarse grinding tool mounting seat through a support, a connecting plate, or a mounting frame. The carrier for arranging the at least one pair of coarse grinding tools can be different forms, which are not limited in the present application.

[0204] The coarse grinding tool feeding and withdrawing mechanism is used to drive at least one coarse grinding tool in the at least one pair of coarse grinding tools to move laterally in the feeding direction (i.e., the second direction) to adjust the relative distance between the two coarse grinding tools in the at least one pair of coarse grinding tools in the second direction, so as to control the feeding amount in the grinding process, that is, to determine the grinding amount. According to the grinding requirements, the coarse grinding tool feeding and withdrawing mechanism drives one coarse grinding tool or both coarse grinding tools in the at least one pair of coarse grinding tools to move a predetermined distance in the second direction to adjust the feeding amount. In this way, the first silicon rod clamp or the second silicon rod clamp drives the silicon rod to move in the first direction and contact and relatively feed with the at least one pair of coarse grinding tools of the coarse grinding device to realize the grinding of the silicon rod.

[0205] In addition, the coarse grinding tool feeding and withdrawing mechanism can also be used to drive the at least one pair of coarse grinding tools on the coarse grinding tool mounting seat to switch between the first transfer guide rail and the second transfer guide rail, so that the at least one pair of coarse grinding tools perform the coarse grinding operation on the silicon rod clamped by the first silicon rod clamp or the silicon rod clamped by the second silicon rod clamp.

[0206] Please refer to Figure 2 and Figure 6 , wherein, Figure 6 shows a simplified structure schematic diagram of the silicon rod grinding machine in an embodiment of the present application. As shown in the figure, the coarse grinding device 5 includes a coarse grinding tool mounting seat 51, at least one pair of coarse grinding tools 52, and a coarse grinding tool feeding and withdrawing mechanism 53.

[0207] The coarse grinding tool mounting seat 51 is arranged on the first processing area of the silicon rod processing platform, and is used for arranging at least one pair of coarse grinding tools 52. In some embodiments, the coarse grinding tool mounting seat 51 spans the width dimension of the silicon rod processing platform in the second direction.

[0208] The at least one pair of coarse grinding tools 52 is arranged on the coarse grinding tool mounting seat 51, and the at least one pair of coarse grinding tools 52 is arranged in opposition in the second direction. In some embodiments, any coarse grinding tool 52 can be erected on the coarse grinding tool mounting seat 51 by a coarse grinding tool support.

[0209] In some embodiments, the coarse grinding tool 52 includes a grinding wheel and a rotating shaft. The grinding wheel has a certain granularity and roughness, and the two grinding wheels arranged in opposition provide two grinding surfaces symmetrically to the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is consolidated by abrasive particles and a binder to form a surface with abrasive particles in contact with the surface of the silicon rod to be ground. The coarse grinding wheel has a certain abrasive particle size and abrasive particle density, and has pores in the grinding wheel. The abrasive of the grinding wheel can be set as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. with a hardness greater than that of silicon material according to the need of grinding the silicon rod.

[0210] The coarse grinding tool advancing and retreating mechanism 53 is used to drive at least one coarse grinding tool 52 of the at least one pair of coarse grinding tools 52 to move laterally in the second direction, i.e. the width direction of the defined silicon rod grinder perpendicular to the first direction. The coarse grinding tool advancing and retreating mechanism 53 controls the movement of at least one coarse grinding tool 52 of the pair of coarse grinding tools 52 in the second direction to adjust the relative distance between the two coarse grinding tools 52 of the pair of coarse grinding tools 52 in the second direction, thereby controlling the feed amount in the grinding process, i.e. determining the grinding amount. When the first transfer device and / or the second transfer device carries and transfers the silicon rod to move from the first processing area to the second processing area or when the grinding of the silicon rod is completed and the silicon rod is transferred through the first processing area to be removed from the processing area, the at least one pair of coarse grinding tools 52 moves in the second direction under the control of the coarse grinding tool advancing and retreating mechanism 53 to form a safe transfer path for the silicon rod, i.e. the first transfer device and / or the second transfer device and the silicon rod carried thereby do not collide with the coarse grinding tools 52 during the transfer process.

[0211] Please refer to Figure 6In some embodiments, a rough grinding wheel advancing and retreating mechanism is configured for each pair of rough grinding wheels 52, which includes a sliding guide rail 522, a driving motor 521, and a ball screw (not shown). The sliding guide rail 522 is arranged along the second direction on the first machining area of the machine base, and the bottom of the rough grinding wheel 52 is provided with a guide groove along the second direction which cooperates with the sliding guide rail 522. The ball screw is arranged along the sliding guide rail 522 and is connected with the driving motor 521.

[0212] In an embodiment of the present application, one rough grinding wheel of the at least one pair of rough grinding wheels is configured with the driving motor and the ball screw, and the relative distance between the two rough grinding wheels is changed by moving one rough grinding wheel of the pair of rough grinding wheels arranged oppositely.

[0213] In an embodiment of the present application, each rough grinding wheel of the at least one pair of rough grinding wheels is configured with the driving motor and the ball screw, and the driving motor can control the position of the corresponding rough grinding wheel in the second direction individually or make the two rough grinding wheels move away from or close to each other at the same linear speed based on a certain cooperative relationship. For example, in the grinding process, the pair of rough grinding wheels is fed towards each other at the same linear speed in the second direction, and the pair of rough grinding wheels rotates at the same linear speed for grinding.

[0214] In an embodiment of the present application, a pair of rough grinding wheels is driven by the same driving motor to move in the second direction at the same linear speed in opposite directions. In an implementation of the embodiment, the rough grinding wheel advancing and retreating mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail is arranged along the second direction on the first machining area of the machine base, and the bottom of the rough grinding wheel is provided with a guide groove along the second direction which cooperates with the guide rail. The driving motor drives the gear to rotate, and the pair of racks are engaged with the opposite ends of the driving gear. When the driving gear rotates, the pair of racks are driven to move away from or close to each other at the linear speed in the opposite directions of the gear ends. In an implementation of the embodiment, one end of each rack of the pair of racks is engaged with the driving gear, and the other end is connected with a rough grinding wheel respectively, so that the pair of rough grinding wheels move away from or close to each other along the guide rail in the second direction.

[0215] In an embodiment of the present application, the coarse grinding device 5 further comprises a cooling device to cool down the at least one pair of coarse grinding wheels, to reduce the damage of the surface layer of the silicon rod during the grinding process, and to improve the grinding efficiency and service life of the grinding wheel. In an implementation of the embodiment, the cooling device comprises a cooling water pipe, a flow guide groove and a flow guide hole. In some embodiments, the outer edge of the circumference of the grinding wheel is provided with a protective cover for placing the cooling water into the rotating drive motor of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The flow guide groove is arranged on the protective cover as the contact point of the protective cover and the cooling water pipe. The flow guide hole is arranged in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water sucked through the cooling water pipe is guided to the flow guide groove and the flow guide hole on the surface of the grinding wheel, and is guided to the contact surface between the grinding wheel and the ground silicon rod for cooling. During the grinding of the grinding wheel, the cooling water in the flow guide hole is guided into the interior of the grinding wheel by centrifugal force for sufficient cooling.

[0216] The at least one pair of coarse grinding wheels corresponds to the first silicon rod clamp. During the grinding process, the silicon rod is clamped by the opposite pair of clamping arms in the first direction to control the order of grinding and chamfering the side and corner of the silicon rod. The sufficient grinding of the silicon rod by the at least one pair of coarse grinding wheels in the length direction of the silicon rod can be ensured by reciprocating motion. The opposite pair of coarse grinding wheels is moved in the second direction to determine the feed amount of the contact surface between the coarse grinding wheel and the silicon rod.

[0217] Please continue to refer to Figure 2 and Figure 6 In the illustrated embodiment, the fine grinding device 6 comprises a fine grinding wheel mounting seat 61, at least one pair of fine grinding wheels 62 and a fine grinding wheel advance and retreat mechanism 63.

[0218] The fine grinding wheel mounting seat 61 is arranged on the second machining position of the silicon rod machining platform, and is used to arrange the at least one pair of fine grinding wheels 62. In some embodiments, the fine grinding wheel mounting seat 61 spans the width dimension of the silicon rod machining platform in the second direction.

[0219] The at least one pair of fine grinding wheels 62 is arranged on the fine grinding wheel mounting seat 61, and the at least one pair of fine grinding wheels 62 is arranged opposite to each other in the second direction. In some embodiments, any fine grinding wheel 62 can be arranged on the fine grinding wheel mounting seat 61 by a fine grinding wheel support.

[0220] In some embodiments, the fine grinding tool 62 comprises a grinding wheel and a rotating shaft. The grinding wheel has a certain granularity and roughness, and the two grinding wheels arranged oppositely provide two grinding surfaces symmetrically to the clamped silicon rod. In some embodiments, the grinding wheel is circular and has a through hole in the middle. The grinding wheel is consolidated by abrasive particles and a binder to form a surface with abrasive particles in contact with the surface of the silicon rod to be ground. The fine grinding wheel has a certain abrasive particle size and abrasive particle density, and has pores in the grinding wheel. The abrasive of the grinding wheel can be set as alumina, silicon carbide, diamond, cubic boron nitride, etc. with a hardness greater than that of silicon material according to the need of grinding the silicon rod.

[0221] The fine grinding tool advancing and retreating mechanism 63 is used to drive at least one of the at least one pair of fine grinding tools 62 to move laterally in a second direction, i.e. the width direction of the defined silicon rod grinding machine perpendicular to the first direction. The fine grinding tool advancing and retreating mechanism 63 controls the movement of at least one of the pair of fine grinding tools 62 in the second direction to adjust the relative distance between the two fine grinding tools 62 in the second direction, thereby controlling the feed rate in the grinding process, i.e. determining the grinding amount. When the first transfer device and / or the second transfer device carries and transfers the silicon rod to move from the second processing area to the first processing area or when the grinding of the silicon rod is completed and the silicon rod is transferred through the second processing area to be removed from the processing area, the at least one pair of fine grinding tools 62 moves in the second direction under the control of the fine grinding tool advancing and retreating mechanism 63 to form a safe transfer path for the silicon rod, i.e. the first transfer device and / or the second transfer device and the silicon rod carried thereby do not collide with the fine grinding tools 62 during the transfer process.

[0222] Please continue to refer to Figure 6 In some embodiments, a fine grinding tool advancing and retreating mechanism is configured for each pair of fine grinding tools 62, which comprises a sliding guide rail 622, a driving motor 621, and a ball screw (not shown in the figure). The sliding guide rail 622 is arranged in the second direction and is provided on the second processing area of the machine base. The bottom of the fine grinding tool 62 is provided with a guide groove in the second direction matched with the sliding guide rail 622. The ball screw is arranged along the sliding guide rail 622 and is connected with the driving motor 621.

[0223] In an embodiment of the present application, one of the at least one pair of fine grinding tools is configured with the driving motor and the ball screw, and the relative distance between the two fine grinding tools is changed by moving one of the oppositely arranged pair of fine grinding tools.

[0224] In an embodiment of the present application, each of the at least one pair of lapping tools is configured with the driving motor and ball screw, the driving motor can be individually controlled to control the position of the corresponding lapping tool in the second direction, or based on a certain cooperative relationship to make the two lapping tools move away from each other or move closer to each other at the same linear speed, such as in the grinding process, the pair of lapping tools are fed at the same speed in the second direction, and the pair of lapping tools rotate at the same linear speed to grind.

[0225] In an embodiment of the present application, a pair of lapping tools are driven by the same driving motor to move in the second direction at the same size and opposite speed. In an implementation of the embodiment, the lapping tool advancing and retreating mechanism includes a driving motor, a driving gear, a pair of racks, and a guide rail. The guide rail is arranged in the second direction and is arranged on the second machining position of the machine base. The bottom of the lapping tool is provided with a guide groove in the second direction matched with the guide rail. The driving motor drives the gear to rotate, and the pair of racks are engaged with the opposite ends of the driving gear. When the driving gear rotates, the pair of racks are driven to move away from each other or move closer to each other at the opposite linear speed of the two ends of the gear. In an implementation of the embodiment, one end of each rack of the pair of racks is engaged with the driving gear, and the other end is connected with a lapping tool respectively, so that the pair of lapping tools move away from each other or move closer to each other in the second direction along the guide rail.

[0226] In an embodiment of the present application, the lapping device 6 further includes a cooling device to cool the at least one pair of lapping tools, reduce the damage to the surface layer of the silicon rod during grinding, and improve the grinding efficiency and service life of the grinding wheel. In an implementation of the embodiment, the cooling device includes a cooling water pipe, a flow guide groove, and a flow guide hole. In some implementations, the outer edge of the circumference of the grinding wheel is provided with a protective cover for placing the cooling water into the rotating driving motor of the grinding wheel. One end of the cooling water pipe is connected to a cooling water source, and the other end is connected to the surface of the protective cover of the grinding wheel. The flow guide groove is arranged on the protective cover as the contact point of the protective cover and the cooling water pipe, and the flow guide hole is arranged in the cooling groove. The coolant of the cooling device can be common cooling water. The cooling water sucked through the cooling water pipe is guided to the flow guide groove and the flow guide hole on the surface of the grinding wheel, and is guided to the contact surface between the grinding wheel and the ground silicon rod for cooling. In the grinding of the grinding wheel, the cooling water in the flow guide hole is introduced into the interior of the grinding wheel by centrifugal action for sufficient cooling.

[0227] The at least one pair of fine grinding tools corresponds to the first silicon rod clamp, and in the grinding process, the silicon rod is clamped by the opposite pair of clamp arms in the first direction to control the order of grinding and chamfering the side surface and the corner of the silicon rod. The reciprocating motion ensures that the silicon rod is fully ground by the at least one pair of fine grinding tools in the length direction of the silicon rod, and the opposite pair of fine grinding tools moves in the second direction to determine the feed amount of the contact surface between the fine grinding tool and the silicon rod.

[0228] Generally, the grinding tools of the silicon rod grinding machine are in a fatigue state in use. The uneven wear of different areas of the grinding tool surface causes the grinding tool surface to be uneven or the flatness to decrease. The grinding tool surface may be contaminated with silicon rod debris or grinding tool debris. Therefore, long-term grinding work inevitably changes the surface state of the grinding tool, which reduces the grinding performance. The current solution to this problem is to use a grinding stone or other tool to correct the grinding tool surface, or to replace the grinding tool when it reaches the fatigue life. When using a grinding stone to grind the grinding tool, the surface of the grinding stone may be uneven, which may result in the surface state of the grinding tool still being poor after grinding.

[0229] In this application, the silicon rod grinding machine also includes a grinding repair device for grinding and repairing the grinding tool to ensure that the grinding tool can achieve the required accuracy after being used to grind the silicon rod. The grinding repair device includes a mounting body and at least one grinding part. The at least one grinding part is arranged on the mounting body and used to grind the corresponding at least one grinding tool.

[0230] Please refer to Figure 5 , which shows the structure of the grinding repair device in an example of the silicon rod grinding machine. As Figure 5 shown, the grinding repair device is arranged on the silicon rod clamp of the silicon rod grinding machine. That is, the mounting body 81 of the grinding repair device is arranged on one of the clamp arms of the silicon rod clamp, and the grinding part 83 of the grinding repair device is arranged on the side of the mounting body 81 facing the grinding tool. In some embodiments, the grinding repair device is applied to the silicon rod grinding machine as Figure 1The shown silicon rod grinder includes a first transfer device 3, a second transfer device 4, a rough grinding device 5, and a fine grinding device 6, wherein the grinding repair device is arranged on a rear first clamping arm 313 (or a front first clamping arm 313) of a first silicon rod clamp 31 in the first transfer device 3, and arranged on a front second clamping arm 413 (or a rear second clamping arm 413) of a second silicon rod clamp 41 in the second transfer device 4, each of the grinding repair devices includes a mounting body 81 and two grinding portions 83 arranged on opposite sides of the mounting body 81 along a second direction, and the mounting body 81 and the grinding portions 83 thereon are driven to reciprocate along a first direction by the corresponding silicon rod clamp (the first silicon rod clamp 31 or the second silicon rod clamp 41).

[0231] The grinding repair device is not limited to Figure 5 In the shown structure, in other embodiments, the mounting body in the grinding repair device can be arranged on a base of the silicon rod grinder, the grinding portions in the grinding repair device are arranged on the mounting body, and the grinding repair device can further include a driving unit for driving the mounting body and the grinding portions thereon to reciprocate along a predetermined direction.

[0232] Back to Figure 5 In Figure 5 In the shown embodiment, the grinding repair device includes two grinding portions 83 arranged on opposite sides of the mounting body 81, and in this arrangement, the grinding repair device can be used to simultaneously grind two grinding tools (for example, two rough grinding tools 52 in the rough grinding device 5 or two fine grinding tools 62 in the fine grinding device 6) in the silicon rod grinder. Taking the fine grinding device 6 as an example, the fine grinding device 6 includes a pair of fine grinding tools 62, and the pair of oppositely arranged fine grinding tools 62 are moved to the outside of the two grinding portions 83, the silicon rod clamp (the first silicon rod clamp 31 or the second silicon rod clamp 41) is driven to move along the first direction so that the two grinding portions 83 on opposite sides of the mounting body 81 reciprocate along the first direction, and in this state, the pair of fine grinding tools 62 in the fine grinding device 6 are allowed to move towards the grinding portions 83 to contact the surfaces of the grinding portions 83 to achieve grinding.

[0233] Generally, in the grinding operation of the silicon rod, to achieve the grinding of the side surface of the silicon rod, the corresponding grinding tool (for example, two coarse grinding tools 52 in the coarse grinding device 5 or two fine grinding tools 62 in the fine grinding device 6) is a material with a certain hardness, such as a grinding wheel, which is formed by consolidating abrasive particles with a binder to form a surface with abrasive particles for contact with the surface of the silicon rod to be ground and for silicon rod grinding. The grinding wheel has a certain abrasive size and abrasive density, and the abrasive of the grinding wheel can be set to be harder than the hardness of the silicon material, such as aluminum oxide, silicon carbide, diamond, cubic boron nitride, etc. In some examples, different particle sizes of the grinding part 83 can also be provided in the grinding repair device, which are respectively used for grinding different types of grinding tools in the silicon rod grinding machine, such as coarse grinding tools and fine grinding tools.

[0234] Here, the grinding part 83 of the grinding repair device has a surface for contact with the at least one grinding tool (for example, the coarse grinding tool 52 in the coarse grinding device 5 or the fine grinding tool 62 in the fine grinding device 6), and in some embodiments, the grinding part 83 has high adhesion, wear resistance, and hardness, etc. Performance to achieve grinding of the grinding tool (for example, the coarse grinding tool 52 in the coarse grinding device 5 or the fine grinding tool 62 in the fine grinding device 6).

[0235] In some embodiments, the grinding part 83 is a sharpening stone. Here, the sharpening stone is, for example, a diamond sharpening stone, a boron carbide sharpening stone, a fine grinding stone, a general sharpening stone, etc. The sharpening stone can achieve the dressing of the surface of the contacted grinding tool by means of the particle size of the surface of the sharpening stone. In the dressing process, the surface of the sharpening stone contacts the grinding tool, and the surface of the grinding tool is dressed to a uniform particle size and improves the flatness and perpendicularity of the grinding tool plane.

[0236] In some embodiments, the at least one grinding part 83 rotates the at least one grinding tool under the drive of the motor when dressing the corresponding at least one grinding tool.

[0237] Compared with the traditional grinding mode, the grinding device such as oil stone is usually contacted in the state of rotating grinding tool to achieve grinding, so that there may be high and low points on the surface of the oil stone, and the flatness of the surface of the grinding tool after grinding is poor. In the embodiments provided in the present application, the grinding repair device is used for grinding the grinding tool. The grinding tool is in a rotating state, and the grinding tool is in a rotating state. The surface of the oil stone formed by the oil stone in the reciprocating motion is different from the surface of the oil stone in the static state. The surface of the oil stone (i.e. the surface for grinding) in the reciprocating motion has no high and low points, so that the surface of the grinding tool can be ground flat, and the grinding quality is improved. Furthermore, the grinding efficiency is related to the rotating speed between the workpiece and the grinding tool. The grinding tool is in a rotating state, and the grinding tool is in a rotating state. Therefore, the relative motion between the grinding tool and the grinding tool is beneficial to the grinding process, and the grinding efficiency is improved.

[0238] In some embodiments, the grinding surface of the grinding tool is rectangular, circular, elliptical, annular, regular polygonal or other custom shape, etc. It should be understood that only when the grinding tool is made of a predetermined material that meets the grinding requirements and can achieve surface contact with the grinding tool can the grinding repair be achieved. The above-mentioned various shapes are only optional embodiments, and the present application does not make any limitation.

[0239] In some embodiments, the grinding repair device further comprises a sensor device arranged on the base for detecting the grinding tool of the silicon rod grinding machine.

[0240] The grinding repair device is used to repair the grinding surface of the grinding tool. After grinding repair by the grinding tool, the surface layer of the grinding tool is ground and removed, for example, when the grinding tool is a grinding wheel, the particles on the surface of the grinding wheel are gradually removed after grinding repair, and a certain thickness of the grinding wheel is removed after grinding repair, thereby forming a new grinding surface that meets the grinding requirements of the silicon rod. In subsequent grinding of the silicon rod, the silicon rod is ground with the new grinding surface. It should be noted that the grinding amount of the silicon rod needs to be controlled in the grinding operation of the silicon rod, and the grinding amount can be determined in advance based on the specifications of the silicon rod grinding machine and the specifications of the silicon rod. For example, the grinding tool in the silicon rod grinding machine can be fed relative to the silicon rod, and the initial position of the grinding surface of the grinding tool can be used as a known input value (or calculated from multiple input values) in the control system of the silicon rod grinding machine. Therefore, the grinding amount of the grinding tool relative to the silicon rod can be controlled based on the preset grinding amount. However, after the grinding tool is ground by the grinding repair device, the initial position of the grinding surface changes, and therefore the silicon rod grinding machine needs to know the specifications of the grinding tool in the grinding repair, so as to correct the actual position of the grinding surface and control the grinding amount of the silicon rod in subsequent processing according to the preset value.

[0241] In the examples of the present application, the sensor device in the grinding repair device can be used to determine the size specification of the grinding tool after grinding repair, mainly to determine the thickness. Here, the sensor device can determine the distance from the sensor to the grinding surface or the distance between the two grinding surfaces of a pair of grinding tools arranged oppositely to confirm the size of the grinding tool after grinding repair.

[0242] As shown in Figure 5 The sensor device is a contact sensor 85 with a probe head for contacting the grinding surface. In actual scenarios, the grinding tool of the silicon rod grinder can move relative to the grinding part 83, and the feed movement can be driven by a servo motor, for example. Here, the servo motor can control the feed amount of the grinding tool, but the feed amount determined by the servo motor is not equal to the thickness of the layer ground during the grinding repair process, or it can be understood that the accurate grinding amount of the grinding repair process cannot be obtained by the feed control device of the grinding tool, i.e., the actual size specification of the grinding tool needs to be obtained by measurement.

[0243] Taking the grinding repair device with two opposite grinding parts 83 as an example, the contact sensor 85 can be arranged with probe heads at both ends to contact the two opposite grinding surfaces of a pair of grinding tools. The contact sensor 85 can be arranged on the mounting body 81, and the line connecting the probe heads at both ends of the contact sensor 85 is parallel to the second direction. During measurement, the grinding tool can be driven by the servo motor to move towards the probe heads. The contact sensor 85 can obtain and record the distance between the probe heads at both ends. When the grinding tool contacts the probe heads, the movement is stopped and the position data of the servo motor is recorded. Based on the position data of the servo motor and the probe head data of the contact sensor 85, the size of the grinding tool after grinding repair can be determined again, and the silicon rod grinder can use the measured size of the grinding tool as input data in the control system.

[0244] In some examples, the probe head of the contact sensor 85 is further provided with a retractable spring. When the probe head contacts an object, the probe head can be retracted under the drive of the retractable spring, which can be used to protect the probe head from being damaged by touching.

[0245] In some examples, the sensor device can be a probe displacement sensor.

[0246] In some embodiments, the sensor device can also be a distance measuring sensor. Here, the distance measuring direction of the distance measuring sensor can be arranged parallel to the rotating shaft (i.e., perpendicular to the grinding surface of the grinding tool), so as to obtain the size of the grinding tool after grinding repair. The distance measuring sensor can be an infrared distance measuring sensor, a laser distance measuring sensor, an ultrasonic sensor, a radar sensor, etc.

[0247] In some embodiments, the grinding repair device comprises a protective cover arranged above the sensor device for covering the sensor device in the closed state and exposing the sensor device in the open state.

[0248] The accommodating space of the protective cover groove can only be used for covering the sensor device completely. In this case, the groove of the protective cover can be arranged in different shapes, for example, the cross section of the protective cover is arranged in a "convex" shape, and the long side of the "convex" groove covers the sensor device. Of course, in other embodiments, the groove of the protective cover can also be arranged in a rectangular shape, a trapezoidal shape, etc., which is not limited in the present application.

[0249] In an embodiment, the protective cover further comprises a lifting driving device (not shown) for controlling the lifting movement of the groove of the protective cover along the guide column to switch the covering or exposing state of the sensor device. When the grinding part performs the grinding repair operation, the protective cover is attached to the bearing surface on the upper surface of the mounting body. When the grinding repair is completed, the groove of the protective cover is lifted relative to the mounting body under the driving of the lifting driving device, so that the sensor device is exposed to the external space.

[0250] In some embodiments, the groove structure of the protective cover is combined with the bearing surface through magnetic force adsorption accessories, for example, the bearing surface and the opening of the groove structure are both provided with magnetic force adsorption materials to form magnetic force adsorption accessories. When the protective cover needs to be opened, the lifting driving device overcomes the attractive force between the magnetic force adsorption accessories. Alternatively, in other embodiments, the protective cover and the bearing surface are combined through buckles. The buckles can be arranged on the bearing surface or the protective cover. When the protective cover needs to be opened, a certain separation force is applied to the buckle to make the buckle switch from the connected state to the disengaged state, so that the protective cover can be lifted and moved under the driving of the lifting driving device.

[0251] In some embodiments, the protective cover can be arranged on the bearing surface through a rotating shaft (not shown). In the closed state, the protective cover is tightly attached to the bearing surface. When the sensor device needs to be used for measurement, the protective cover can be rotated around the rotating shaft to reach the open state.

[0252] Generally, the sensor device has high precision, and the device needs to be maintained to avoid damage to the sensor device and destroy the precision. By setting the protective cover, the sensor device is only exposed to the external space when measurement is needed, that is, the sensor device can be effectively maintained. Furthermore, in some examples, when the grinding repair device is grinding the grinding tool, the contact surface temperature of the grinding part and the grinding tool rises, and both the grinding part and the grinding tool surface can be damaged by high temperature. Therefore, cooling liquid needs to be sprayed to cool the surface of the grinding tool. In this scenario, the protective cover can isolate the external environment during grinding to prevent the sensor device from contacting the cooling liquid.

[0253] In this application, the grinding tool of the silicon rod grinding machine is close to and contacts the grinding part of the grinding repair device to achieve grinding of the grinding tool. At this time, the reciprocating motion of the grinding part in the predetermined direction and the rotation of the corresponding contacted grinding tool can be controlled to improve the grinding efficiency. After the grinding is completed, the grinding repair device can also measure the grinding tool by the sensor device to determine the size of the ground grinding tool, which is beneficial to the subsequent grinding surface operation of the silicon rod grinding machine.

[0254] The silicon rod grinding machine disclosed in the application can simultaneously work in the first processing position and the second processing position during actual grinding, and can perform rough grinding and fine grinding on different silicon rods. In an embodiment, a first silicon rod clamp (or a second silicon rod clamp) is used to move a single crystal silicon rod to be ground along a first transfer rail to the first processing position. A pair of rough grinding tools of the rough grinding device moves to the two sides of the silicon rod along a second direction under the drive of a rough grinding tool advance and retreat mechanism, and the silicon rod is clamped by the first silicon rod clamp (or the second silicon rod clamp) to cooperate with the rough grinding device to perform rough grinding. After the rough grinding is completed, the first silicon rod clamp (or the second silicon rod clamp) moves the rough ground silicon rod along the first transfer rail to the second processing position. The fine grinding tool at the second processing position moves to the two sides of the silicon rod along the second direction under the drive of a fine grinding tool advance and retreat mechanism, and then the silicon rod is clamped by the first silicon rod clamp (or the second silicon rod clamp) to cooperate with the fine grinding tool to perform fine grinding. At the same time, another single crystal silicon rod to be ground is moved by a second silicon rod clamp (or a first silicon rod clamp) along a first transfer rail to a first processing position. A pair of rough grinding tools of the rough grinding device moves to the two sides of the silicon rod along a second direction under the drive of a rough grinding tool advance and retreat mechanism, and the silicon rod is clamped by the second silicon rod clamp (or the first silicon rod clamp) to cooperate with the rough grinding device to perform rough grinding. When the rough grinding is completed, the silicon rod at the second processing position is fine ground, and the rough ground silicon rod is transferred to the second processing position by the second silicon rod clamp (or the first silicon rod clamp) for fine grinding. The silicon rod clamped by the first silicon rod clamp (or the second silicon rod clamp) is moved out of the silicon rod processing platform, and the first silicon rod clamp (or the second silicon rod clamp) continues to clamp the silicon rod without grinding to repeat the above process.

[0255] In some embodiments of the present application, the first and second silicon rod clamps comprise a plurality of pairs of clamping arms arranged opposite to each other in the first direction, and a plurality of pairs of coarse grinding tools and fine grinding tools are arranged opposite to each other at the coarse grinding device and the fine grinding device respectively. In some implementations, the number of pairs of clamping arms and the number of pairs of grinding tools in the first silicon rod clamp, the second silicon rod clamp, the coarse grinding device, and the fine grinding device are the same, and the driving mechanisms of each pair of clamping arms and each pair of grinding tools are relatively independent, and the transfer and grinding of multiple silicon rods between the first processing area and the second processing area can be performed at the same time and relatively independently.

[0256] Please continue to refer to Figure 3 , the silicon rod loading device 2 is adjacent to the first processing area of the silicon rod processing platform and penetrates the first transfer device 3 and the second transfer device 4. As Figure 3 shown, the waiting area is located inside the silicon rod processing platform, and in the case of corresponding to the first transfer device 3 and the second transfer device 4, the waiting area is further refined, that is, the waiting area includes a first waiting area corresponding to the first transfer device 3 and a second waiting area corresponding to the second transfer device 4.

[0257] In some embodiments, the silicon rod grinding machine further comprises a loading area arranged beside the machine base in the second direction, and the silicon rod loading device 2 can move between the loading area and the waiting area. In some implementations, the loading area can serve as a loading position of the silicon rod, and the silicon rod loading device 6 can be used to transfer the silicon rod to be ground from the loading area to the waiting area. In some implementations, the loading area can serve as a loading device of the silicon rod and a unloading device of the silicon rod after grinding, and the silicon rod loading device 6 can be used to transfer the silicon rod to be ground from the loading area to the waiting area or transfer the ground silicon rod on the waiting area 113 to the loading area.

[0258] The specific structure of the silicon rod loading device 2 and its working principle have been discussed in the foregoing, and the specific content can be referred to the foregoing.

[0259] Through the silicon rod grinding machine provided by the present application, the coarse grinding device and the fine grinding device of the first working area and the second working area can grind the silicon rods in different grinding stages respectively, which improves the grinding efficiency to twice, reduces the processing time of the silicon rod, and improves the economic benefit while maintaining the size specification and cost of the silicon rod grinding machine.

[0260] To achieve the use of the silicon rod grinding machine provided in the present application, the present application further provides a silicon rod grinding method in a second aspect. The silicon rod grinding method can be used in a silicon rod grinding machine. The silicon rod grinding machine comprises a machine base having a silicon rod processing platform, wherein the silicon rod processing platform is provided with a first processing area and a second processing area; the silicon rod grinding machine further comprises a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein the first transfer device comprises a first silicon rod clamp, a first transfer guide rail, and a first driving mechanism, and the second transfer device comprises a second silicon rod clamp, a second transfer guide rail, and a second driving mechanism.

[0261] The waiting area is adjacent to the first processing area and is used for loading the silicon rods to be ground into the processing area or for unloading the ground silicon rods. In the embodiments provided in the present application, the waiting area is further refined in the case of corresponding positions of the first transfer device and the second transfer device, i.e., the waiting area comprises a first waiting area corresponding to the first transfer device and a second waiting area corresponding to the second transfer device.

[0262] The fine grinding device and the rough grinding device are located in different processing areas. In the embodiments provided in the present application, the rough grinding device is located in the first processing area, and the fine grinding device is located in the second processing area.

[0263] The rough grinding device comprises at least one pair of rough grinding tools, which can simultaneously perform rough grinding on opposite sides of the silicon rod, and the fine grinding device comprises at least one pair of fine grinding tools, which can simultaneously perform fine grinding on opposite sides of the silicon rod. In some implementations, at least one of the pair of rough grinding tools of the rough grinding device has a degree of freedom of movement in the second direction, and at least one of the pair of fine grinding tools of the fine grinding device has a degree of freedom of movement in the second direction. For the silicon rod clamped on the first transfer guide rail or the second transfer guide rail in the first processing area, the rough grinding device can move to both sides of the silicon rod in the second direction to perform rough grinding and control the grinding amount of the ground silicon rod in the rough grinding; for the silicon rod clamped on the first transfer guide rail or the second transfer guide rail in the second processing area, the fine grinding device can move to both sides of the silicon rod in the second direction to perform fine grinding and control the grinding amount of the ground silicon rod in the fine grinding.

[0264] The first driving mechanism drives the first silicon rod clamp to move along the first transfer guide rail; and the second driving mechanism drives the second silicon rod clamp to move along the second transfer guide rail. The first transfer guide rail and the second transfer guide rail are arranged in parallel on the machine base and are arranged in the first direction.

[0265] The first direction and the second direction are perpendicular to each other. In the embodiments provided in the present application, the first direction is along the length direction of the machine base, and the second direction is the width direction of the machine base.

[0266] In some embodiments, the silicon rod grinding machine to which the silicon rod grinding method can be applied includes a silicon rod grinding machine according to any one of the embodiments shown in Figures 1 to 6

[0267] The silicon rod grinding method includes the following steps:

[0268] The first silicon rod to be ground is placed on the silicon rod loading device, and the silicon rod loading device adjusts the position of the first silicon rod so that the axis line thereof corresponds to the predetermined center line.

[0269] Referring to Figure 7 , a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment is shown. In the state shown in Figure 7 , the first silicon rod 101 is placed on the silicon rod loading device 2, and the position of the first silicon rod 101 is adjusted by the silicon rod loading device 2 so that the axis line thereof corresponds to the predetermined center line. In some implementations, the centering adjustment mechanism in the silicon rod loading device 2 drives the first silicon rod 101 to make vertical lifting movement in at least the third direction so that the axis line of the first silicon rod 101 is vertically aligned with the predetermined center line. The centering adjustment mechanism can adopt a vertical lifting mechanism or an inclined lifting mechanism. The specific structure and operation of the vertical lifting mechanism and the inclined lifting mechanism are described above.

[0270] Then, the silicon rod loading device loads the first silicon rod to the waiting position so that the axis line of the first silicon rod at the waiting position corresponds to the center line of the first silicon rod clamp or the second silicon rod clamp.

[0271] Referring to Figure 8 , a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application in an embodiment is shown. In the state shown in Figure 8 , the first silicon rod 101 is driven by the feeding drive mechanism in the silicon rod loading device 2 to move from the loading position along the second direction by a determined movement amount until reaching the first waiting position, so that the axis line of the first silicon rod 101 reaching the first waiting position corresponds to the center line of the first silicon rod clamp 31 in the first transfer device.

[0272] Then, the first silicon rod clamp in the first transfer device clamps the first silicon rod, the first drive mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to transfer from the first waiting position to the first processing position, and the coarse grinding device performs coarse grinding operation on the first silicon rod at the first processing position. ​

[0273] Referring to Fig. 1, a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application is shown. In the state as shown in Fig. 1, a first silicon rod 101 is loaded in a first processing station, and a first silicon rod clamp 31 in a first transfer device clamps the first silicon rod 101, and a rough grinding device 5 performs rough grinding work on the first silicon rod 101 located in the first processing station. In some implementations, the first silicon rod 101 moves along a first transfer rail 32 under the clamping of the first silicon rod clamp 31, and the first silicon rod 101 is moved by the first silicon rod clamp 31 during the rough grinding process and the subsequent fine grinding process, so that the contact surface of the first silicon rod 101 with the grinding tool moves from one end of the silicon rod to the other end, i.e., the grinding of the two opposite sides is completed; or, the first silicon rod 101 is moved along the first transfer rail 32 by the first silicon rod clamp 31 in a circuitous manner, so that the contact surface of the first silicon rod 101 with the rough grinding tool fully covers the side surface of the first silicon rod 101 in the movement. The first silicon rod clamp 31 includes at least one pair of clamping arms, which are rotatable, and the first silicon rod 101 can rotate along the axis of the first direction under the clamping of the clamping arms, i.e., the switching and chamfering of different side surfaces of the first silicon rod 101 are realized. Figure 9 Figure 9 Next, the first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to transfer from the first processing station to the second processing station, and the fine grinding device performs fine grinding work on the first silicon rod located in the second processing station; at this stage, the silicon rod loading device loads a second silicon rod to be ground into the waiting station, so that the axis of the second silicon rod in the waiting station is aligned with the predetermined center line; the second silicon rod clamp in the second transfer device clamps the second silicon rod, wherein the clamping center of the second silicon rod clamp is aligned with the predetermined center line; the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer rail to transfer from the waiting station to the first processing station; and the rough grinding device performs rough grinding work on the second silicon rod located in the first processing station.

[0274] Next, the first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to transfer from the first processing station to the second processing station, and the fine grinding device performs fine grinding work on the first silicon rod located in the second processing station; at this stage, the silicon rod loading device loads a second silicon rod to be ground into the waiting station, so that the axis of the second silicon rod in the waiting station is aligned with the predetermined center line; the second silicon rod clamp in the second transfer device clamps the second silicon rod, wherein the clamping center of the second silicon rod clamp is aligned with the predetermined center line; the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer rail to transfer from the waiting station to the first processing station; and the rough grinding device performs rough grinding work on the second silicon rod located in the first processing station.

[0275] Referring to Fig. 1, a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application is shown. In the state as shown in Fig. 1, a first silicon rod 101 is loaded in a first processing station, and a first silicon rod clamp 31 in a first transfer device clamps the first silicon rod 101, and a rough grinding device 5 performs rough grinding work on the first silicon rod 101 located in the first processing station. In some implementations, the first silicon rod 101 moves along a first transfer rail 32 under the clamping of the first silicon rod clamp 31, and the first silicon rod clamp 31 during the rough grinding process and the subsequent fine grinding process, so that the first silicon rod 101 is moved by the first silicon rod clamp 31, so that the contact surface of the first silicon rod 101 with the grinding tool moves from one end of the silicon rod to the other end, i.e., the grinding of the two opposite sides is completed; or, the first silicon rod 101 is moved along the first transfer rail 32 by the first silicon rod clamp 31 in a circuitous manner, so that the contact surface of the first silicon rod 101 with the rough grinding tool fully covers the side surface of the first silicon rod 101 in the movement. The first silicon rod clamp 31 includes at least one pair of clamping arms, which are rotatable, and the first silicon rod 101 can rotate along the axis of the first direction under the clamping of the clamping arms, i.e., the switching and chamfering of different side surfaces of the first silicon rod 101 are realized. Figure 10 Figure 10 Next, the first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to transfer from the first processing station to the second processing station, and the fine grinding device performs fine grinding work on the first silicon rod located in the second processing station; at this stage, the silicon rod loading device loads a second silicon rod to be ground into the waiting station, so that the axis of the second silicon rod in the waiting station is aligned with the predetermined center line; the second silicon rod clamp in the second transfer device clamps the second silicon rod, wherein the clamping center of the second silicon rod clamp is aligned with the predetermined center line; the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer rail to transfer from the waiting station to the first processing station; and the rough grinding device performs rough grinding work on the second silicon rod located in the first processing station.

[0276] ​​In this stage, the silicon rod loading device 2 loads the second silicon rod 102 to be ground and loads the second silicon rod 102 to the second waiting position, wherein the position of the first silicon rod 101 is adjusted by the silicon rod loading device 2 so that the axis of the second silicon rod 102 located in the second waiting position is consistent with the center line of the second silicon rod clamp 41 in the second transfer device;

[0277] The second silicon rod clamp 41 in the second transfer device clamps the second silicon rod 102, and the second driving mechanism in the second transfer device drives the second silicon rod clamp 41 and the second silicon rod 102 clamped thereby to move along the first transfer rail 32 to be transferred from the first waiting position to the first processing position, and the second silicon rod 102 is loaded in the first processing position. The second silicon rod clamp 41 in the second transfer device clamps the second silicon rod 102, and the rough grinding device 5 performs rough grinding on the second silicon rod 102 located in the first processing position.

[0278] In some implementations, the second silicon rod 102 moves along the second transfer rail 42 under the clamping of the second silicon rod clamp 41, and in the rough grinding process and the subsequent fine grinding process, the second silicon rod clamp 41 drives the second silicon rod 102 to move so that the contact surface of the second silicon rod 102 with the grinding tool moves from one end of the silicon rod to the other end, that is, the grinding of the two opposite sides is completed. Alternatively, the second silicon rod clamp 41 drives the second silicon rod 102 to move along the second transfer rail 42 in a circuitous manner, so that the contact surface of the second silicon rod 102 with the grinding tool fully covers the side surface of the first silicon rod 101 in the movement. The second silicon rod clamp 41 includes at least one pair of clamping arms, which are rotatable, and under the clamping of the clamping arms, the second silicon rod 102 can rotate along the axis of the first direction, that is, the grinding switching and chamfering of different sides of the clamped second silicon rod 102 are realized.

[0279] Then, the first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to transfer the first silicon rod from the second processing position to the waiting position, unload the first silicon rod from the waiting position and load a third silicon rod, wherein the third silicon rod is loaded to the waiting position by the silicon rod loading device, and the third silicon rod on the waiting position is aligned with the predetermined center line in terms of the axial center line; the first silicon rod clamp in the first transfer device clamps the third silicon rod, wherein the clamping center of the first silicon rod clamp is aligned with the predetermined center line; the first driving mechanism in the first transfer device drives the first silicon rod clamp and the third silicon rod clamped thereby to move along the first transfer rail to transfer the third silicon rod from the waiting position to the first processing position, and the coarse grinding device performs coarse grinding operation on the third silicon rod on the first processing position; at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer rail to transfer the second silicon rod from the first processing position to the second processing position; and the fine grinding device performs fine grinding operation on the second silicon rod on the second processing position.

[0280] Referring to Figures 11 to 13 , a simplified structural schematic diagram of a silicon rod grinding machine for performing the silicon rod grinding method of the present application is shown in an embodiment. When the fine grinding operation of the first silicon rod 101 on the first processing position is completed, the coarse grinding operation of the second silicon rod 102 on the second processing position is completed.

[0281] In the state as shown in Figure 11 , the first driving mechanism in the first transfer device drives the first silicon rod clamp 31 and the first silicon rod 101 clamped thereby to move along the first transfer rail 32 to transfer the first silicon rod 101 from the second processing position via the first processing position to the first waiting position, and then the silicon rod loading device 2 unloads the first silicon rod 101.

[0282] In the state as shown in Figure 12 , the silicon rod loading device 2 loads a third silicon rod 103 to the first waiting position, wherein the position of the third silicon rod 103 is adjusted by the silicon rod loading device 2 to make the axial center line of the third silicon rod 103 on the first waiting position consistent with the center line of the first silicon rod clamp 31 in the second transfer device.

[0283] In the state as shown in Figure 12 , the first silicon rod clamp 31 in the first transfer device clamps the third silicon rod 103, and the coarse grinding device 5 performs coarse grinding operation on the third silicon rod 103 on the first processing position.

[0284] In the state as shown in Figures 11 to 13In the shown state, at this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp 41 and the second silicon rod 102 clamped thereby to move along the second transfer rail 42, so as to transfer the second silicon rod 102 from the first processing position to the second processing position, and the lapping device 6 performs lapping operation on the second silicon rod 102 located at the second processing position.

[0285] When the lapping operation of the second silicon rod 102 located at the second processing position is completed, the third silicon rod 103 located at the first processing position completes the rough grinding operation. The second driving mechanism of the second transfer device drives the second silicon rod clamp 41 and the second silicon rod 102 clamped thereby to move along the second transfer rail 42 from the second processing position to the second waiting position via the first processing position, so as to unload the lapped second silicon rod 102 and load a new silicon rod to be lapped.

[0286] The silicon rod lapping method provided by the present application sets the rough grinding device and the lapping device of the silicon rod lapping machine at the first processing position and the second processing position of the silicon rod processing platform respectively, and sets the first transfer device and the second transfer device which simultaneously penetrate the first processing position and the second processing position, and configures the silicon rod clamp and the driving mechanism for the first transfer device and the second transfer device. By coordinating and controlling the first transfer device, the second transfer device, the rough grinding device and the lapping device, the silicon rod lapping machine rough grinding device and the lapping device are in working state at the same time, that is, different silicon rods are lapped by the same silicon rod lapping machine at the same time, which greatly improves the lapping efficiency, reduces the lapping time and improves the economic benefit while maintaining the size specification and cost of the silicon rod lapping machine.

[0287] The above embodiments are only illustrative of the principles and effects of the present application, and are not intended to limit the present application. Any person skilled in the art can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical idea of the present application should be covered by the claims of the present application.

Claims

1. A silicon rod polisher characterized by comprising: The application relates to a silicon rod processing machine, which comprises: a machine base provided with a silicon rod processing platform, the silicon rod processing platform being provided with a waiting area, a first processing area and a second processing area; a silicon rod loading device for loading a silicon rod to be ground into the waiting area, wherein the axial center line of the silicon rod in the waiting area is aligned with a predetermined center line; the silicon rod loading device comprises a silicon rod bearing structure for bearing the silicon rod to be ground, and a feeding driving mechanism for driving the silicon rod bearing structure and the silicon rod to be ground borne by the silicon rod bearing structure to move to the waiting area along a feeding direction, wherein the feeding direction is orthogonal to a transfer direction; a first transfer device comprising a first silicon rod clamp, a first transfer guide rail arranged along the transfer direction, and a first driving mechanism for driving the first silicon rod clamp and the silicon rod clamped by the first silicon rod clamp to move along the first transfer guide rail and transfer between the waiting area, the first processing area and the second processing area, wherein the clamping center of the first silicon rod clamp is aligned with the predetermined center line; a second transfer device comprising a second silicon rod clamp, a second transfer guide rail arranged along the transfer direction, and a second driving mechanism for driving the second silicon rod clamp and the silicon rod clamped by the second silicon rod clamp to move along the second transfer guide rail and transfer between the waiting area, the first processing area and the second processing area, wherein the clamping center of the second silicon rod clamp is aligned with the predetermined center line; a rough grinding device arranged at the first processing area of the silicon rod processing platform and used for rough grinding the silicon rod clamped by the first silicon rod clamp of the first transfer device or the silicon rod clamped by the second silicon rod clamp of the second transfer device; and a fine grinding device arranged at the second processing area of the silicon rod processing platform and used for fine grinding the silicon rod clamped by the first silicon rod clamp of the first transfer device or the silicon rod clamped by the second silicon rod clamp of the second transfer device; the rough grinding device and the fine grinding device can simultaneously work to respectively perform rough grinding and fine grinding on different silicon rods; wherein the first transfer device and the second transfer device are arranged above the silicon rod processing platform through a mounting frame, or the first transfer device is arranged above the silicon rod processing platform through a first mounting frame and the second transfer device is arranged above the silicon rod processing platform through a second mounting frame.

2. The silicon-rod polisher according to claim 1, characterized by The silicon rod loading device further comprises a centering adjusting mechanism for adjusting the position of the silicon rod to be ground so that the axial center line of the silicon rod to be ground corresponds to the predetermined center line.

3. The silicon-rod polisher according to claim 2, wherein The silicon rod bearing structure comprises a bearing base and a bearing component, and the centering adjusting mechanism comprises a vertical lifting mechanism for driving the bearing component and the silicon rod to be ground borne by the bearing component to perform vertical lifting movement relative to the bearing base so that the axial center line of the silicon rod to be ground is vertically aligned with the predetermined center line.

4. The silicon-rod polisher according to claim 3, wherein The vertical lifting mechanism comprises: a vertical lifting guide part for arranging the bearing component; and a vertical lifting driving unit for driving the bearing component and the silicon rod to be ground borne by the bearing component to move up and down along the vertical lifting guide part.

5. The silicon-rod polisher of claim 2, wherein The silicon rod carrying structure comprises a carrying base and a carrying component, the centering adjustment mechanism comprises a diagonal lifting mechanism for driving the carrying component and the silicon rod to be ground carried thereby to make diagonal lifting movement relative to the carrying base so as to vertically align the axial centerline of the silicon rod to be ground with the predetermined centerline.

6. The silicon-rod polisher according to claim 5, wherein The diagonal lifting mechanism comprises: a diagonal lifting guide rail arranged on the carrying base; a sliding block arranged on the carrying component; and a diagonal lifting driving unit.

7. The silicon-rod polisher according to claim 6, wherein The diagonal lifting driving unit comprises: a driving motor; and a diagonally arranged synchronous belt assembly associated with the carrying component and controlled by the driving motor.

8. The silicon-rod polisher of claim 6, wherein, The diagonal lifting driving unit comprises a driving motor and a diagonally arranged screw rod assembly driven by the driving motor, or a driving motor and a diagonally arranged gear rack transmission assembly driven by the driving motor.

9. The silicon-rod grinding machine according to claim 3 or 5, characterized by The carrying component is further provided with a silicon rod holding mechanism.

10. The silicon-rod polisher of claim 2, wherein, The silicon rod loading device further comprises a centering adjustment mechanism for adjusting the position of the silicon rod to be ground in the transfer direction so as to be located in the centering area of the silicon rod carrying structure.

11. The silicon-rod polisher of claim 2, wherein, The feeding driving mechanism comprises: a feeding guide rail arranged on the machine base in the feeding direction; a sliding block arranged on the silicon rod carrying structure; and a feeding driving unit.

12. The silicon-rod polisher of claim 1, wherein, The first silicon rod clamp comprises: a first clamp arm mounting seat arranged on the first transfer guide rail; at least one pair of first clamp arms arranged on the first clamp arm mounting seat in opposition in the transfer direction for clamping the two end faces of the silicon rod; and a first clamp arm driving mechanism for driving at least one first clamp arm of the at least one pair of first clamp arms to move along the transfer direction to adjust the clamping spacing between the at least one pair of first clamp arms.

13. The silicon-rod polisher of claim 12, wherein, The first silicon rod clamp is a lifting type silicon rod clamp.

14. The silicon-rod polisher of claim 12, wherein, The first clamp arm is of a rotary structure; the first silicon rod clamp further comprises a first clamp arm rotating mechanism for driving the first clamp arm to rotate.

15. The silicon-rod polisher of claim 1, wherein, The second silicon rod clamp comprises: a second clamp arm mounting seat arranged on the second transfer guide rail; at least one pair of second clamp arms arranged on the second clamp arm mounting seat in opposition in the transfer direction for clamping the two end faces of the silicon rod; and a second clamp arm driving mechanism for driving at least one second clamp arm of the at least one pair of first clamp arms to move along the transfer direction to adjust the clamping spacing between the at least one pair of second clamp arms.

16. The silicon-rod polisher of claim 15, wherein, The second silicon rod clamp is a lifting type silicon rod clamp.

17. The silicon-rod polisher of claim 15, wherein, The second clamp arm is of a rotary structure; the second silicon rod clamp further comprises a second clamp arm rotating mechanism for driving the second clamp arm to rotate.

18. The silicon-rod polisher of claim 1, wherein, The first driving mechanism comprises: a first moving toothed rail arranged in the transfer direction; a first driving gear arranged on the first silicon rod clamp and engaged with the first moving toothed rail; and a first driving power source for driving the first driving gear.

19. The silicon-rod polisher of claim 1, wherein, The second driving mechanism comprises: a second moving toothed rail arranged in the transfer direction; a second driving gear arranged on the second silicon rod clamp and engaged with the second moving toothed rail; and a first driving power source for driving the second driving gear.

20. The silicon-rod polisher of claim 1, wherein, The coarse grinding device comprises: at least one pair of coarse grinding tools arranged in opposition at the first machining position of the silicon rod machining platform; and a coarse grinding driving mechanism for driving the at least one pair of coarse grinding tools to move along the transfer direction. A coarse grinding tool feeding mechanism is configured to drive at least one of the at least one pair of coarse grinding tools to move laterally along a feeding direction, wherein the feeding direction is perpendicular to the transferring direction.

21. The silicon-rod polisher of claim 1, wherein, The fine grinding device comprises: at least one pair of fine grinding tools, which are oppositely arranged at the first processing position of the silicon rod processing platform; and A fine grinding tool feeding mechanism is configured to drive at least one of the at least one pair of fine grinding tools to move laterally along a feeding direction, wherein the feeding direction is perpendicular to the transferring direction.

22. The silicon-rod polisher of claim 21, wherein, The grinding repair device further comprises: a mounting body; and at least one grinding part, which is arranged on the mounting body and is configured to grind the at least one pair of fine grinding tools.

23. The silicon-rod polisher of claim 22, wherein, The mounting body is arranged on at least one of the first silicon rod clamp and the second silicon rod clamp, and is configured to move reciprocally along a predetermined direction under the driving of the first silicon rod clamp or the second silicon rod clamp.

24. The silicon-rod polisher of claim 22, wherein, The mounting body is arranged on the machine base, and the grinding repair device further comprises a driving unit configured to drive the mounting body to move reciprocally along a predetermined direction.

25. The silicon-rod polisher of claim 22, wherein, The grinding repair device further comprises at least one pair of sensor devices, which are arranged on opposite sides of the mounting body and are configured to detect the at least one pair of fine grinding tools correspondingly.

26. The silicon-rod polisher of claim 25, wherein, The sensor devices are contact sensors or distance measuring sensors.

27. The silicon-rod polisher of claim 1, wherein The silicon rod unloading device is configured to unload the silicon rod after the fine grinding operation on the silicon rod processing platform. The first transferring device comprises a first silicon rod clamp, a first transferring rail, and a first driving mechanism, and the second transferring device comprises a second silicon rod clamp, a second transferring rail, and a second driving mechanism, and the silicon rod grinding method comprises the following steps:

28. A method for grinding a silicon rod, applied to a silicon rod grinding machine, the silicon rod grinding machine comprising a machine base having a silicon rod processing platform, the silicon rod processing platform being provided with a first processing position and a second processing position, the silicon rod grinding machine further comprising a silicon rod loading device, a first transfer device, a second transfer device, a rough grinding device, and a fine grinding device, wherein, loading the first silicon rod to be ground into the waiting position by the silicon rod loading device, so that the axis of the first silicon rod in the waiting position is aligned with the predetermined center line; clamping the first silicon rod by the first silicon rod clamp in the first transferring device, wherein the clamping center of the first silicon rod clamp is aligned with the predetermined center line; driving the first silicon rod clamp and the clamped first silicon rod to move along the first transferring rail by the first driving mechanism in the first transferring device to transfer from the waiting position to the first processing position; and performing coarse grinding operation on the first silicon rod in the first processing position by the coarse grinding device; driving the first silicon rod clamp and the clamped first silicon rod to move along the first transferring rail by the first driving mechanism in the first transferring device to transfer from the first processing position to the second processing position; performing fine grinding operation on the first silicon rod in the second processing position by the fine grinding device; at this stage, loading the second silicon rod to be ground into the waiting position by the silicon rod loading device, so that the axis of the second silicon rod in the waiting position is aligned with the predetermined center line; clamping the second silicon rod by the second silicon rod clamp in the second transferring device, wherein the clamping center of the second silicon rod clamp is aligned with the predetermined center line; driving the second silicon rod clamp and the clamped second silicon rod to move along the second transferring rail by the second driving mechanism in the second transferring device to transfer from the waiting position to the first processing position; and performing coarse grinding operation on the second silicon rod in the first processing position by the coarse grinding device; and ​ The first driving mechanism in the first transfer device drives the first silicon rod clamp and the first silicon rod clamped thereby to move along the first transfer rail to transfer from the second processing position to the waiting position, unload the first silicon rod from the waiting position and load a third silicon rod, wherein the third silicon rod is loaded to the waiting position by the silicon rod loading device, and the third silicon rod on the waiting position is aligned with the predetermined center line at the axial center line thereof; the first silicon rod clamp in the first transfer device clamps the third silicon rod, wherein the clamping center of the first silicon rod clamp is aligned with the predetermined center line; the first driving mechanism in the first transfer device drives the first silicon rod clamp and the third silicon rod clamped thereby to move along the first transfer rail to transfer from the waiting position to the first processing position, and the coarse grinding device performs coarse grinding operation on the third silicon rod at the first processing position; in this stage, the second driving mechanism in the second transfer device drives the second silicon rod clamp and the second silicon rod clamped thereby to move along the second transfer rail to transfer from the first processing position to the second processing position; and the fine grinding device performs fine grinding operation on the second silicon rod at the second processing position.

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