Optical system and method of assembling an optical system

Abstract

An optical system and a method for assembling the optical system are provided. The optical system includes a fixed part, a first movable part, a driving component, and a positioning component. The first movable part is used to connect a first optical element. The first movable part is movable relative to the fixed part. The driving component is used to drive the first movable part to move relative to the fixed part. The positioning component is used to position the first movable part relative to the fixed part at a first assembly position during a first assembly step. The first assembly step includes assembling the first optical element into the optical system.

Description

Technical Field

[0001] This disclosure relates to an optical system and a method for assembling an optical system. Background Technology

[0002] With the development of technology, many electronic devices (such as tablets and smartphones) are now equipped with optical systems. Users can take pictures through these optical systems. However, during the assembly of optical systems, accumulated assembly tolerances between components may cause misalignment, resulting in poor image quality, such as center shift or blurry images. Therefore, active alignment (AA) processes are now widely used in the assembly of optical systems. Specifically, the active alignment process detects the actual position of the semi-finished product and adjusts the position of the components to be assembled next, ensuring that the relative positions of the components are as aligned as possible. Summary of the Invention

[0003] Some embodiments of this disclosure provide an optical system. The optical system includes a fixed portion, a first movable portion, a driving assembly, and a positioning assembly. The first movable portion is used to connect a first optical element. The first movable portion is movable relative to the fixed portion. The driving assembly is used to drive the first movable portion to move relative to the fixed portion. The positioning assembly is used to position the first movable portion relative to the fixed portion at a first assembly position during a first assembly step. The first assembly step includes assembling the first optical element into the optical system.

[0004] In some embodiments, the optical system further includes a second movable portion. At least a portion of the fixed portion is located between the first movable portion and the second movable portion. The second movable portion is movable relative to the fixed portion. During the first assembly step, the positioning component is used to position the second movable portion relative to the fixed portion in a second assembly position.

[0005] In some embodiments, the positioning component includes an assembly positioning part for corresponding to an assembly device, which temporarily fixes the first movable part in a first assembly position. In some embodiments, the positioning component further includes an energized positioning part, fixedly disposed on the fixing part, the first movable part, the second movable part, or the driving component. The energized positioning part corresponds to a power supply of the assembly device, which energizes the positioning component to temporarily fix the first movable part in the first assembly position. When the assembly device temporarily fixes the first movable part in the first assembly position, the energized positioning part directly contacts at least a portion of the assembly device. The energized positioning part includes an exposed metal portion for corresponding to a temporary pin of the assembly device. In some embodiments, the assembly positioning part and the energized positioning part are integrally formed.

[0006] In some embodiments, the optical system further includes a second optical element. A second assembly step is performed after the first assembly step, in which the second optical element is positioned relative to the fixing portion such that a first optical axis of the first optical element coincides with a second optical axis of the second optical element. The positioning assembly includes a plate-like structure. A first movable portion and a fixing portion are arranged along a main axis. When viewed along the main axis, a removal portion of the positioning assembly does not overlap with the fixing portion. After the second assembly step, the removal portion of the positioning assembly is removed. The maximum dimension of the removal portion on the main axis is smaller than the maximum dimension of the rest of the positioning assembly. In some embodiments, the positioning assembly comprises a metallic material, and the positioning assembly is fixedly connected to the first movable portion or the fixing portion. At least a portion of the positioning assembly is embedded in a first support of the first movable portion or a base of the fixing portion, and the first support or base comprises a resin material.

[0007] In some embodiments, the optical system further includes a circuit assembly. The circuit assembly is used to electrically connect an electronic device, wherein the driving assembly is electrically connected to the electronic device via the circuit assembly. The positioning assembly includes a loop for connecting an assembly device. When the electronic device outputs a driving signal to the optical system, the driving signal does not pass through at least a portion of the loop.

[0008] This disclosure provides a method for assembling an optical system. The method includes assembling an optical system comprising a movable portion, a fixed portion, and a positioning assembly, and the optical system being used to connect a first optical element and a second optical element. The method further includes contacting the positioning assembly with an assembly device to temporarily fix the movable portion relative to the fixed portion. The method further includes mounting the first optical element, the second optical element, and an external circuit such that a first optical axis of the first optical element coincides with a second optical axis of the second optical element, wherein the external circuit is used for electrically connecting an electronic device. The method further includes removing the assembly device. In some embodiments, the method further includes removing at least a portion of the positioning assembly. Attached Figure Description

[0009] When reading the accompanying drawings, the following detailed description will provide the best understanding of all aspects of this disclosure. It should be noted that, in accordance with industry standard practice, the various features are not drawn to scale. In fact, the dimensions of the components may be arbitrarily enlarged or reduced for clear illustration.

[0010] Figure 1 It is a schematic diagram of an electronic device, a first optical element, a second optical element, and an optical system.

[0011] Figure 2 This is a schematic diagram of the first optical element, the second optical element, and the optical system.

[0012] Figure 3 yes Figure 2An exploded view of the optical system in the image.

[0013] Figure 4 yes Figure 2 A schematic diagram of the optical system during the first assembly step.

[0014] Figure 5 yes Figure 2 A schematic diagram of the optical system during the second assembly step.

[0015] Figure 6 This is a perspective view of the second carrier of the optical system in some other embodiments.

[0016] Figure 7 This is a perspective view of the second carrier of the optical system in some other embodiments.

[0017] Figure 8 yes Figure 7 A schematic diagram of the optical system during the first assembly step.

[0018] Figure 9 This is a flowchart of a method for assembling an optical system.

[0019] The reference numerals in the attached figures are explained as follows:

[0020] 10: Electronic devices

[0021] 11: First optical element

[0022] 12: Second optical element:

[0023] 100: Optical System

[0024] 110: Outer Cover

[0025] 111: First optical axis

[0026] 120: Top Cover

[0027] 121: Second optical axis

[0028] 130: Outer shell

[0029] 140: First circuit board

[0030] 150: First bearing seat

[0031] 160: Upper elastic element

[0032] 170: Lower elastic element

[0033] 180: Magnetic components

[0034] 190: Coil

[0035] 200: Base

[0036] 210: Positioning element

[0037] 220: Fixing plate

[0038] 230: Movable board

[0039] 240: Bias element

[0040] 250, 250A, 250B: Second bearing seat

[0041] 260: Second circuit board

[0042] 300, 300B: Assembly equipment

[0043] 301B: Contact Part

[0044] 400: Cutting equipment

[0045] 500: Methods

[0046] 1001: Spindle

[0047] 1101: Protrusion

[0048] 2101: Ontology

[0049] 2102: Removal Department

[0050] 2103: Assembly and positioning section

[0051] 2104: Power-on positioning unit

[0052] D1: First Drive Component

[0053] D2: Second drive component

[0054] E: Flexible component

[0055] I: Fixed part

[0056] L: Light

[0057] L1: Light incident side

[0058] M1: First Activity Department

[0059] M2: Second Activity Department

[0060] P, PA, PB: Positioning components

[0061] S01, S02, S03, S04: Steps Detailed Implementation

[0062] The following disclosure provides many different embodiments or examples, and describes specific examples of various components and their arrangements to implement different features of this disclosure. The ordinal numbers in the specification and claims, such as "first," "second," etc., do not have a sequential relationship; they are only used to identify and distinguish different components with the same name. Furthermore, repeated symbols or letters may be used in different examples of this disclosure.

[0063] The embodiments may use relative spatial terms, such as "below," "below," "above," and "above," to facilitate the description of the relationship between elements or features in the drawings and other elements or features. In addition to the orientations shown in the drawings, these spatial terms are intended to encompass different orientations of the device in use or operation. The device may be turned to different orientations (rotated 90 degrees or other orientations), and the spatial terms used herein can be interpreted in the same way.

[0064] Please refer to Figure 1 as well as Figure 2 . Figure 1 It is a schematic diagram of an electronic device 10, a first optical element 11, a second optical element 12, and an optical system 100. Figure 2 This is a schematic diagram of a first optical element 11, a second optical element 12, and an optical system 100. The electronic device 10 may be a tablet computer, smartphone, etc. The optical system 100 is typically located in the top region of the electronic device 10. The optical system 100 connects the first optical element 11 and the second optical element 12. The first optical element 11 may be a lens, such as a telescope. In some embodiments, the outline of the first optical element 11 may be circular, elliptical, or a circle or ellipse with straight line segments, etc. The second optical element 12 may be a photosensitive element, such as a charge-coupled detector (CCD). In some embodiments, the outline of the second optical element 12 may be polygonal, such as a rectangle. When a ray L enters the optical system 100 from outside, the ray L passes through the first optical element 11 and is imaged on the second optical element 12. Therefore, the side of the optical system 100 closest to the first optical element 11 can be defined as a light incident side L1.

[0065] The first optical element 11 includes a first optical axis 111, which is a virtual axis passing through the center of the first optical element 11. The second optical element 12 includes a second optical axis 121, which is a virtual axis passing through the center of the second optical element 12. The optical system 100 includes a principal axis 1001, which is a virtual axis passing through and perpendicular to the entire optical system 100. The first optical axis 111, the second optical axis 121, and the principal axis 1001 will be used to illustrate the relevant features of this disclosure in the figures and the following description.

[0066] Figure 3 yes Figure 2 An exploded view of the optical system 100. In this embodiment, the optical system 100 includes a fixed part I, a first movable part M1, an elastic component E, a first driving component D1, a first circuit component C1, a second movable part M2, a second driving component D2, a second circuit component C2, and a positioning component P.

[0067] When the optical system 100 is used to capture images, the first drive assembly D1 drives the first movable part M1 to move relative to the fixed part I, and the second drive assembly D2 drives the second movable part M2 to move relative to the fixed part I. The movement of the first movable part M1 relative to the fixed part I by the first optical element 11 achieves focusing, which is commonly referred to as autofocus (AF). Furthermore, the movement of the second movable part M2 relative to the fixed part I by the second optical element 12 compensates for the problem of image shift and image blur caused by user shaking or external impact, improving the motion capture effect of the optical system 100, which is commonly referred to as sensor shift.

[0068] like Figure 3 As shown, in this embodiment, the fixing part I includes an outer cover 110, a top cover 120, a housing 130, and a base 200. The first movable part M1 includes a first support 150. The elastic component E includes an upper elastic element 160 and a lower elastic element 170. The first driving component D1 includes at least one magnetic element 180 and at least one coil 190. The first circuit component C1 includes a first circuit board 140. The second movable part M2 includes a second support 250. The second driving component D2 includes a fixing plate 220, a movable plate 230, and at least one biasing element 240. The second circuit component C2 includes a second circuit board 260. The positioning component P includes a positioning element 210. The components can be added or removed according to user needs.

[0069] The top cover 120, outer shell 130, and base 200 of the fixing part I are arranged along the main shaft 1001. The outer shell 130 can be joined to the base 200 by welding or fusion, and the space formed inside after joining can accommodate the first movable part M1, the elastic component E, the first drive component D1, the first circuit component C1, etc. The base 200 is located between the first movable part M1 and the second movable part M2.

[0070] The first support 150 of the first movable part M1 is used to connect the first optical element 11. A corresponding threaded structure can be configured between the first support 150 and the first optical element 11, so that the first optical element 11 is better fixed to the first support 150. The first support 150 is spaced apart from the housing 130 and the base 200 by a distance. Specifically, through the elastic component E, the first support 150 does not directly contact the housing 130 and the base 200.

[0071] The upper elastic element 160 and lower elastic element 170 of the elastic component E are made of elastic or ductile materials, such as metal. In the art, the upper elastic element 160 and lower elastic element 170 may be referred to as "springs," "leaf springs," etc. The upper elastic element 160 connects a portion of the housing 130 to the top surface of the first support 150, while the lower elastic element 170 connects a portion of the base 200 to the bottom surface of the first support 150, thereby elastically clamping the first support 150. When the first movable part M1 moves relative to the fixed part I, the elastic clamping of the upper elastic element 160 and lower elastic element 170 restricts the range of motion of the first support 150, preventing damage to the first support 150 and the first optical element 11 within it from colliding with the housing 130 or base 200 when the optical system 100 moves or is subjected to external impact.

[0072] The magnetic element 180 of the first drive assembly D1 can be a permanent magnet. The magnetic element 180 is generally elongated and disposed inside the housing 130. The position of the magnetic element 180 corresponds to the position of the coil 190. The coil 190 is generally elliptical, but may also have other shapes. The coil 190 is disposed on the first support 150. The winding axis of the coil 190 is perpendicular to the main shaft 1001. A magnetic force is generated between the coil 190 and the magnetic element 180 in a direction parallel to the first optical axis 111 of the first optical element 11, driving the first support 150 to move along the direction parallel to the first optical axis 111, thereby causing the first optical element 11 within the first support 150 to move along the direction parallel to the first optical axis 111, achieving automatic focusing.

[0073] It is worth noting that in some other embodiments, the optical system 100 may further include a reference element and a sensing element (not shown). The reference element is disposed adjacent to the first carrier 150, and the position of the sensing element corresponds to the position of the reference element. The reference element may be a permanent magnet. The sensing element may be a giant magnetoresistance (GMR) sensing element or a tunneling magnetoresistance (TMR) sensing element, etc. When the first carrier 150 moves, the adjacent reference element also moves with the first carrier 150, and the magnetic field of the reference element changes accordingly. By sensing the change in the magnetic field of the reference element through the sensing element, the position of the first carrier 150 can be determined, so as to adjust the position of the first carrier 150 and precisely control the first carrier 150.

[0074] The first circuit board 140 of the first circuit assembly C1 can be a flexible printed circuit (FPC) or a rigid-flex PCB, etc. The first circuit assembly C1 is electrically connected to the first drive assembly D1. For example... Figure 3 As shown, the outer cover 110 may include a protrusion 1101 for connection with the first circuit board 140.

[0075] The second carrier 250 of the second movable part M2 is used to connect the second optical element 12. In detail, the second optical element 12 can be disposed on the second circuit board 260, and the second carrier 250 can be connected to the second circuit board 260.

[0076] The movable plate 230 of the second drive assembly D2 is connected to the fixed plate 220 via a biasing element 240, and the movable plate 230 is movable relative to the fixed plate 220 via the biasing element 240. The fixed plate 220 and / or the movable plate 230 may be multilayer boards. It is worth noting that, since the fixed plate 220 and the movable plate 230 can move relative to each other, in some other embodiments, it is possible for the fixed plate 220 to move relative to the movable plate 230. In such a case, the fixed plate 220 is movable, while the movable plate 230 is fixed. That is to say, the terms "fixed plate" and "movable plate" as used herein are not intended to be limiting.

[0077] The bias element 240 may be made of shape memory alloy (SMA) material, such as titanium-nickel alloy (TiNi), titanium-palladium alloy (TiPd), titanium-nickel-copper alloy (TiNiCu), titanium-nickel-palladium alloy (TiNiPd), etc. Furthermore, the length of the bias element 240 can be changed by applying a drive signal (e.g., current) to the bias element 240 through a power source. Also, different drive signals can be applied to the bias element 240 to independently control the length change of each bias element 240. For example, when a drive signal is applied to the bias element 240, different bias elements 240 can produce the same or different length changes, causing the movable plate 230 to move relative to the fixed plate 220, thereby causing the second support 250 and the second optical element 12 to move, including translation and rotation.

[0078] Although the foregoing described embodiments in which the first driving component D1 includes magnetic elements and coils, and the second driving component D2 includes a shape memory alloy, the driving methods of the first driving component D1 and the second driving component D2 are not limited thereto. For example, in some other embodiments, the first driving component D1 may include a ball, a roller, or the like.

[0079] The second circuit board 260 of the second circuit assembly C2 can be a flexible circuit board or a rigid-flex board, etc. The second circuit assembly C2 is used to electrically connect to the electronic device 10. Moreover, the second drive assembly D2 is electrically connected to the electronic device 10 via the second circuit assembly C2. That is to say, the second circuit assembly C2 can be referred to as a pair of external circuits of the optical system 100.

[0080] In this embodiment, the positioning element 210 of the positioning component P is disposed between the first driving component D1 and the second movable part M2. However, the location of the positioning component P is not limited to this. The positioning element 210 includes a plate-like structure, comprising a body 2101 and at least one removal part 2102. The removal part 2102 is disposed on the body 2101. When viewed along the main axis 1001, the removal part 2102 does not overlap with the fixing part I. In some embodiments, the positioning component P is made of a conductive material, such as metal.

[0081] In this disclosure, the positioning component P assists in the active alignment process between the first optical element 11 and the second optical element 12. Next, please refer to... Figure 4 as well as Figure 5This study aims to understand how to perform the active alignment process between the first optical element 11 and the second optical element 12. The active alignment process between the first optical element 11 and the second optical element 12 can be broadly divided into a first assembly step and a second assembly step. The first assembly step includes assembling the first optical element 11 into the optical system 100. The second assembly step includes assembling the second optical element 12 and the second circuit assembly C2 (external circuitry) into the optical system 100. Figure 4 yes Figure 2 A schematic diagram of the state of the optical system 100 during the first assembly step. Figure 5 yes Figure 2 A schematic diagram showing the state of the optical system 100 during the second assembly step. Figure 4 as well as Figure 5 The various components, an assembly device 300, and a cutting device 400 are shown in a rather general manner.

[0082] Before performing the active alignment process between the first optical element 11 and the second optical element 12, at least a portion of the optical system 100, including the fixed part I, the first movable part M1, the second movable part M2, and the positioning component P, must be assembled. For example, an adhesive element may be applied between the fixed part I, the first movable part M1, the second movable part M2, and the positioning component P. It is worth noting that in some other embodiments, if the optical system 100 does not require the sensor offset function, the second movable part M2 and / or the second drive component D2, etc., may be omitted. However, even if the optical system 100 does not require the sensor offset function, the active alignment process between the first optical element 11 and the second optical element 12 can still be performed using the following description.

[0083] In the first assembly step, the positioning component P is used to position the first movable part M1 relative to the fixed part I in a first assembly position, and to position the second movable part M2 relative to the fixed part I in a second assembly position. Specifically, the positioning component P is used to position the first support 150, which has not yet had the first optical element 11 installed, relative to the base 200, and to position the second support 250, which has not yet had the second optical element 12 installed, relative to the base 200.

[0084] The positioning element 210 includes an assembly positioning part 2103 for corresponding to the assembly device 300. Specifically, during the first assembly step, the assembly device 300 directly contacts the assembly positioning part 2103, so the assembly device 300 can temporarily fix the first movable part M1 in the first assembly position and fix the second movable part M2 in the second assembly position by physical contact.

[0085] In some embodiments, the positioning element 210 further includes an energized positioning section 2104 for corresponding to a power source of the assembly device 300. The energized positioning section 2104 is electrically connected to other components of the optical system 100, such as the second drive assembly D2. The power source of the assembly device 300 is used to energize the energized positioning section 2104, so other components electrically connected to the positioning element 210 (e.g., the second drive assembly D2) are also energized and can be used to temporarily fix the first movable part M1 in the first assembly position and fix the second movable part M2 in the second assembly position in the first assembly step.

[0086] When the assembly equipment 300 temporarily fixes the first movable part M1 to the first assembly position and the second movable part M2 to the second assembly position by the energized positioning part 2104 of the positioning element 210, the energized positioning part 2104 directly contacts at least a portion of the assembly equipment 300. For example, the energized positioning part 2104 includes an exposed metal portion to correspond to a temporary pin of the assembly equipment 300. In some embodiments, the assembly positioning part 2103 and the energized positioning part 2104 are the same part on the positioning element 210. That is, the assembly positioning part 2103 and the energized positioning part 2104 are integrally formed.

[0087] After temporarily fixing the first movable part M1 relative to the fixed part I in the first assembly position and temporarily fixing the second movable part M2 relative to the fixed part I in the second assembly position, the first optical element 11 is installed into the optical system 300 to complete the first assembly step.

[0088] Next, the second optical element 12 is positioned relative to the fixing part I, such that the first optical axis 111 of the first optical element 11 coincides with the second optical axis 121 of the second optical element 12, to complete the second assembly step. In some embodiments, during the second assembly step, it may be decided whether to remove the removal part 2102 of the positioning element 210, depending on actual needs. The removal part 2102 of the positioning element 210 can be removed by means of laser cutting or manual removal. For example, the removal part 2102 can be cut by a cutting device 400. In some embodiments, the maximum size of the removal part 2102 on the main shaft 1001 is smaller than the maximum size of the rest of the positioning element 210 on the main shaft 1001, to facilitate the removal of the removal part 2102. That is, the thickness of the removal part 2102 is smaller than the thickness of the rest of the positioning element 210.

[0089] After the second assembly step, the assembly equipment 300 is removed. Next, the optical system 100, with the first optical element 11 and the second optical element 12 mounted, can be installed onto the electronic device 10. It should be understood that the positioning component P includes a circuit for electrically connecting to the assembly equipment 300 (e.g., an energized positioning section 2104), but this circuit primarily functions only in the active alignment process. When the electronic device 10 outputs a drive signal to the optical system 100, the drive signal does not pass through at least a portion of the circuit of the positioning component P. For example, when the electronic device 10 outputs a drive signal to the optical system 100, the drive signal is input to the first drive component D1 and / or the second drive component D2 via the second circuit component C2.

[0090] In the foregoing embodiments, the positioning component P includes a separate positioning element 210. However, in some other embodiments, the positioning component P may be disposed within other components. For example, the positioning component P may be formed in at least one of the components such as the fixed part I, the first movable part M1, the second movable part M2, and the second drive component D2. That is, the positioning component P may be fixedly connected to at least one of the components such as the fixed part I, the first movable part M1, the second movable part M2, and the second drive component D2.

[0091] For example, when the first support 150, base 200, or second support 250 comprises a resin material, at least a portion of the positioning component P can be formed on (e.g., embedded in) the first support 150, base 200, or second support 250 by means of in-mold molding or the like. Alternatively, at least a portion of the positioning component P can be formed on the second circuit board 260 by means of bonding or the like. Moreover, the positioning component P can still include the functions of the assembly positioning part 2103 and / or the energized positioning part 2104. That is, the assembly equipment 300 can still physically contact the positioning component P and / or energize the positioning component P. The assembly positioning part 2103 and / or the energized positioning part 2104 can be fixedly disposed on the fixed part I, the first movable part M1, the second movable part M2, the second drive component D2, the second circuit component C2, etc.

[0092] In the following text, the same components will be represented by the same symbols, similar components by similar symbols, and identical features will not be described again. Please refer to the following... Figures 6 to 8 . Figure 6 This is a perspective view of a second carrier 250A of an optical system in some other embodiments. Figure 7 This is a perspective view of a second carrier 250B of an optical system in some embodiments. Figure 8 yes Figure 7 A schematic diagram of the optical system during the first assembly step. Figure 8 The various components and an assembly device 300B are shown in a rather general manner.

[0093] exist Figure 6 In the illustrated embodiment, at least a portion of a positioning component PA is formed on the second carrier 250A and includes a structure similar to a removal portion 2102 of the positioning element 210. Figure 7 In the illustrated embodiment, at least a portion of a positioning component PB is formed on the second support 250B, and it does not include a structure similar to the removal portion 2102 of the positioning component P. Because Figure 7 The positioning component PB in the illustrated embodiment does not include a structure similar to the removal portion 2102 of the positioning element 210. Figure 8 The assembly equipment 300B may include a contact portion 301B for contacting the positioning component PB. Although only an embodiment in which the positioning component is formed on the second carrier is shown herein, the positioning component may also be formed on other components, and the shape and structure of the positioning component are not limited thereto.

[0094] Figure 9 This is a flowchart of a method 500 for assembling an optical system. In step S01, at least a portion of an optical system is assembled, including a movable part (e.g., the first movable part and / or the second movable part in the aforementioned embodiments), a fixed part, a positioning component, etc. In step S02, the positioning component is contacted by an assembly device to temporarily fix at least a portion of the optical system. Temporary fixing may include physical contact, such as clamping. In some embodiments, temporary fixing may further include energizing; for example, the assembly device may include a temporary pin to energize the positioning component and further control the position of the movable part of the optical system relative to the fixed part. In step S03, a first optical element, a second optical element, and an external circuit are installed such that a first optical axis of the first optical element coincides with a second optical axis of the second optical element, wherein the external circuit is used to electrically connect to an electronic device. In step S04, the assembly device is removed. In addition, it may be decided whether to remove part or all of the positioning component according to actual needs. After assembly is completed, the optical system can be installed into the electronic device.

[0095] In summary, during the active alignment process of the first and second optical elements, the positioning component can be temporarily fixed by physically contacting and / or energizing the assembly equipment, thereby facilitating the active alignment of the second optical element. In some other embodiments, the portion of the optical system connected to the second optical element can be temporarily fixed first, and the active alignment process can be completed by adjusting the position of the first optical element. Furthermore, the positioning component can be a separate element or formed within other elements. Also, depending on actual needs, it can be decided whether to remove or cut off a portion or the entire positioning component.

[0096] The foregoing outlines features of numerous embodiments, enabling those skilled in the art to better understand this disclosure from various perspectives. Those skilled in the art will understand that other processes and structures can be readily designed or modified based on this disclosure to achieve the same purpose and / or the same advantages as the embodiments described herein. Those skilled in the art will also understand that these equivalent structures do not depart from the spirit and scope of this disclosure. Modifications, substitutions, and refinements can be made without departing from the spirit and scope of this disclosure. Furthermore, the scope of protection of this disclosure is not limited to the specific embodiments described in the specification; each claim constitutes a separate embodiment, and the scope of protection of this disclosure also includes combinations of the various claims and embodiments.

Claims

1. An optical system, comprising: One fixed part; A first movable part is used to connect a first optical element, wherein the first movable part is movable relative to the fixed part; A drive component is used to drive the first movable part to move relative to the fixed part; A positioning component for positioning the first movable part relative to the fixed part at a first assembly position during a first assembly step, the first assembly step including assembling the first optical element into the optical system; The positioning component includes an energized positioning part for corresponding to a power supply of an assembly device. The power supply is used to energize the positioning component to temporarily fix the first movable part in the first assembly position. When the assembly device temporarily fixes the first movable part in the first assembly position, the energized positioning part directly contacts at least a portion of the assembly device. The energized positioning part includes an exposed metal part for corresponding to a temporary pin of the assembly device.

2. The optical system of claim 1, further comprising a second movable part, wherein at least a portion of the fixed part is located between the first movable part and the second movable part, the second movable part being movable relative to the fixed part, wherein during the first assembly step, the positioning component is used to position the second movable part relative to the fixed part at a second assembly position.

3. The optical system as claimed in claim 1, wherein, The positioning component also includes an assembly positioning part for aligning with the assembly equipment.

4. The optical system of claim 3, further comprising a second movable part, wherein at least a portion of the fixed part is located between the first movable part and the second movable part, wherein the electrically energized positioning part is fixedly disposed on the fixed part, the first movable part, the second movable part, or the drive assembly.

5. The optical system as claimed in claim 4, wherein, The assembly positioning part is integrally formed with the power-on positioning part.

6. The optical system of claim 1, further comprising a second optical element, wherein a second assembly step is performed after the first assembly step, wherein the second optical element is positioned relative to the fixing portion in the second assembly step such that a first optical axis of the first optical element coincides with a second optical axis of the second optical element, wherein the positioning assembly includes a plate-like structure, the first movable portion and the fixing portion are arranged along a main axis, wherein when viewed along the main axis, a removal portion of the positioning assembly does not overlap with the fixing portion, wherein after the second assembly step, the removal portion of the positioning assembly is removed, wherein the maximum dimension of the removal portion on the main axis is smaller than the maximum dimension of the remaining portion of the positioning assembly.

7. The optical system of claim 1, wherein, The positioning component comprises a metal material and is fixedly connected to the first movable part or the fixed part. At least a portion of the positioning component is embedded in a first support of the first movable part or a base of the fixed part, and the first support or the base comprises a resin material.

8. The optical system of claim 1, further comprising a circuit assembly for electrically connecting an electronic device, wherein the driving assembly is electrically connected to the electronic device via the circuit assembly, the positioning assembly includes a loop for connecting an assembly device, wherein when the electronic device outputs a driving signal to the optical system, the driving signal does not pass through at least a portion of the loop.

9. A method for assembling an optical system, comprising: Assemble an optical system, wherein the optical system includes a movable part, a fixed part, a positioning component, and the optical system is used to connect a first optical element and a second optical element; The positioning component is contacted by an assembly device, wherein the positioning component includes an energized positioning part for corresponding to a power supply of the assembly device, the power supply being used to energize the positioning component to temporarily fix the movable part in a first assembly position, and when the assembly device temporarily fixes the movable part in the first assembly position, the energized positioning part directly contacts at least a portion of the assembly device, wherein the energized positioning part includes an exposed metal part for corresponding to a temporary pin of the assembly device; The first optical element, the second optical element, and an external circuit are installed such that a first optical axis of the first optical element coincides with a second optical axis of the second optical element, wherein the external circuit is used to electrically connect an electronic device; and Remove the assembly equipment.

10. The method of assembling an optical system as claimed in claim 9, further comprising removing at least a portion of the positioning component.

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