Touch control substrate and manufacturing method thereof, touch control display substrate and touch control display device

Abstract

Provided are a touch control substrate and a manufacturing method thereof, a touch control display substrate and a touch control display device. The touch control substrate includes a touch control structure, a first grounding wire and at least one second grounding wire. The touch control structure includes a sensor pattern and a touch control trace, the sensor pattern includes a first sensor pattern and a second sensor pattern, the first sensor pattern and the second sensor pattern cross each other and are insulated from each other, the touch control trace includes a first touch control trace and a second touch control trace, the first sensor pattern is connected to the first touch control trace, and the second sensor pattern is connected to the second touch control trace. The first grounding wire is located at the periphery of the touch control structure. At least one second grounding wire is located on the side of the first grounding wire away from the touch control structure. The touch control substrate can play a dual protection role, effectively reduce or avoid the influence of static electricity on the touch control structure, reduce the risk of touch control performance failure caused by ESD, and achieve the purpose of improving the anti-ESD capability.

Description

[0001] This patent application is a divisional application of Chinese patent application No. 201911121001.0 filed on November 15, 2019. Technical Field

[0002] At least one embodiment of the present disclosure relates to a touch substrate and a manufacturing method thereof, a touch display substrate and a touch display device. Background Art

[0003] With the rapid development of active-matrix organic light-emitting diodes (AMOLED), the development of touch display devices such as mobile phones has entered the era of full screens and narrow bezels. In order to bring users a better user experience, full screens, narrow bezels, high resolution, rollable wearables, and foldables will definitely become important development directions of AMOLED in the future. Summary of the invention

[0004] At least one embodiment of the present disclosure relates to a touch substrate and a manufacturing method thereof, a touch display substrate and a touch display device, which can play a dual protection role, effectively reduce or avoid the impact of static electricity on touch wiring and sensor graphics, reduce the risk of touch performance failure due to ESD, and achieve the purpose of improving ESD protection capability, thereby avoiding the decrease in product yield caused by ESD, and achieving the purpose of improving product yield.

[0005] At least one embodiment of the present disclosure provides a touch control substrate, comprising: a touch control structure, a first ground line, and at least one second ground line. The touch control structure comprises a sensor pattern and a touch control line, the sensor pattern comprises a first sensor pattern and a second sensor pattern, the first sensor pattern and the second sensor pattern intersect each other and are insulated from each other, the touch control line comprises a first touch control line and a second touch control line, the first sensor pattern is connected to the first touch control line, and the second sensor pattern is connected to the second touch control line. The first ground line is located at the periphery of the touch control structure. At least one second ground line is located at a side of the first ground line away from the touch control structure.

[0006] In one or more embodiments of the present disclosure, the second grounding line is short-circuited with the first grounding line at one side of the touch control structure.

[0007] In one or more embodiments of the present disclosure, the first ground line and the second ground line are insulated from the touch control structure.

[0008] In one or more embodiments of the present disclosure, the width of the second ground line is equal to or greater than the width of the first ground line.

[0009] In one or more embodiments of the present disclosure, the maximum distance between the first ground line and the second ground line is 20-50 μm, and the distance between the first ground line and the touch line closest to the first ground line 11 is 10-40 μm.

[0010] In one or more embodiments of the present disclosure, the width of the first ground line is 15-20 μm, and the width of the second ground line is 15-20 μm.

[0011] In one or more embodiments of the present disclosure, the first grounding wire is disposed around the touch control structure, the second grounding wire is disposed around the first grounding wire, and the first grounding wire and the second grounding wire have a first interval.

[0012] In one or more embodiments of the present disclosure, the second grounding line includes a first grounding sub-line and a second grounding sub-line, an insulating layer is between the first grounding sub-line and the second grounding sub-line, and the first grounding sub-line and the second grounding sub-line are connected by a first via hole penetrating the insulating layer.

[0013] In one or more embodiments of the present disclosure, the touch control substrate further includes a flexible circuit board, and two ends of the second ground line are connected to different pins of the flexible circuit board.

[0014] In one or more embodiments of the present disclosure, the touch control substrate also includes a third ground wire, the first ground wire and the second ground wire form an opening on one side of the touch control structure, the third ground wire is located in the opening, and both ends of the third ground wire are connected to different pins of the flexible circuit board.

[0015] In one or more embodiments of the present disclosure, at least one of the first touch routing and the second touch routing includes a first touch sub-wire and a second touch sub-wire, the first touch sub-wire and the second touch sub-wire are between the insulating layer, and the first touch sub-wire and the second touch sub-wire are connected by a second via hole penetrating the insulating layer.

[0016] In one or more embodiments of the present disclosure, one of the first sensor graphic and the second sensor graphic includes a main body portion and a bridge line, one of the main body portion and the bridge line is on the same layer as the first grounding sub-line, and the other of the main body portion and the bridge line is on the same layer as the second grounding sub-line.

[0017] In one or more embodiments of the present disclosure, the other of the first sensor pattern and the second sensor pattern includes an integrally formed portion, and the integrally formed portion is disposed in the same layer as the main body portion.

[0018] In one or more embodiments of the present disclosure, the first grounding line includes a third grounding sub-line and a fourth grounding sub-line, the third grounding sub-line and the fourth grounding sub-line are between the insulating layer, and the third grounding sub-line and the fourth grounding sub-line are connected by a third via hole penetrating the insulating layer.

[0019] In one or more embodiments of the present disclosure, the bridging line, the first grounding sub-line, the third grounding sub-line and the first touch sub-line are on the same layer, and the integral forming part, the main body part, the second grounding sub-line, the fourth grounding sub-line and the second touch sub-line are on the same layer.

[0020] In one or more embodiments of the present disclosure, at least one of the bridge line, the integrally formed portion, and the main body portion is a metal mesh structure.

[0021] In one or more embodiments of the present disclosure, a distance between a second ground wire closest to the first ground wire and the first ground wire is smaller than a distance between a touch wire closest to the first ground wire and the first ground wire.

[0022] In one or more embodiments of the present disclosure, a plurality of second grounding lines are included, and a distance between two adjacent second grounding lines is smaller than a distance between a second grounding line closest to the first grounding line and the first grounding line.

[0023] At least one embodiment of the present disclosure further provides a touch display substrate, including any of the above touch substrates.

[0024] In one or more embodiments of the present disclosure, the touch display substrate includes a display area and a peripheral area outside the display area, and the at least one second ground line is located in the peripheral area.

[0025] In one or more embodiments of the present disclosure, the touch display substrate further includes a base substrate and a packaging film, wherein the touch structure, the first ground line and the at least one second ground line are located on a side of the packaging film away from the base substrate.

[0026] In one or more embodiments of the present disclosure, the encapsulation film includes a first film, a second film and a third film, the second film is located between the first film and the third film, the first film and the third film contact each other at the edge to form a contact portion; the orthographic projection of the at least one second grounding line on the substrate falls within the orthographic projection of the second film on the substrate.

[0027] In one or more embodiments of the present disclosure, the encapsulation film includes a first film, a second film and a third film, the second film is located between the first film and the third film, the first film and the third film contact each other at the edge to form a contact portion; the orthographic projection of the at least one second grounding line on the substrate falls within the orthographic projection of the contact portion on the substrate.

[0028] At least one embodiment of the present disclosure further provides a touch display device, comprising any of the above-mentioned touch display substrates.

[0029] At least one embodiment of the present disclosure also provides a method for manufacturing a touch substrate, comprising: forming a first conductive film on a base substrate; patterning the first conductive film to form a first pattern; the first pattern includes a bridge line, a first touch sub-line, a first grounding sub-line, and a third grounding sub-line; forming an insulating film; forming a first via hole, a second via hole, a third via hole, a fourth via hole, and a fifth via hole in the insulating film; forming a second conductive film; and patterning the second conductive film to form a second pattern; the second pattern includes: a second touch sub-line, a second grounding sub-line, a fourth grounding sub-line, an integral forming part, and a main body part, the first grounding sub-line and the second grounding sub-line are connected through the first via hole to form a second grounding line, the first touch sub-line and the second touch sub-line are connected through the second via hole to form a touch line, the third grounding sub-line and the fourth grounding sub-line are connected through the third via hole to form a first grounding line, and adjacent main body parts are respectively connected to the bridge line through the fourth via hole and the fifth via hole.

[0030] In one or more embodiments of the present disclosure, the first graphic also includes a fifth grounding sub-line, a sixth via is formed in the insulating film, the second graphic also includes a sixth grounding sub-line, and the fifth grounding sub-line and the sixth grounding sub-line are connected through the sixth via to form a third grounding line. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, but are not intended to limit the present disclosure.

[0032] Figure 1 A plan view of a display substrate provided in accordance with an embodiment of the present disclosure;

[0033] Figure 2 A schematic plan view of a touch control substrate provided in one embodiment of the present disclosure;

[0034] Figure 3 for Figure 2 Sectional view at AB;

[0035] Figure 4 for Figure 2 Cross-sectional view at CD in the middle;

[0036] Figure 5 A schematic diagram of the principle of double protection against ESD in a touch control substrate provided by an embodiment of the present disclosure;

[0037] Figure 6 for Figure 5 Sectional view at EF;

[0038] Figure 7 for Figure 5 Cross-sectional view at the middle GH;

[0039] Figure 8 A partial cross-sectional view of a touch substrate provided in another embodiment of the present disclosure;

[0040] Fig. 9 A schematic plan view of a touch control substrate provided in another embodiment of the present disclosure;

[0041] Fig.10 A partial cross-sectional view of a touch control substrate provided in one embodiment of the present disclosure;

[0042] Fig.11 A partial cross-sectional view of a touch display substrate provided in one embodiment of the present disclosure;

[0043] Fig.12 A partial cross-sectional view of a touch display substrate provided in another embodiment of the present disclosure; and

[0044] FIG. 13A to FIG. 13F The present invention is a flowchart of a method for manufacturing a touch control substrate according to an embodiment of the present invention. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0046] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, "include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0047] In order to achieve a lighter, thinner and narrower frame for touch display panels to adapt to foldable and rollable products, touch technology (Flexible Multi-Layer On Cell, FMLOC) was born. In touch display devices, static electricity can easily cause touch failure and poor touch. Static electricity includes, but is not limited to, static electricity generated during the manufacturing or use process.

[0048] Figure 1 A plan view of a display substrate provided in an embodiment of the present disclosure. In terms of the panel design of the FMLOC technology, in terms of anti-electrostatic discharge (ESD), the purpose of releasing static electricity can be achieved by designing a single ground line 01 (i.e., GND line, with a voltage of 0V) around the panel. In the embodiments of the present disclosure, the voltage of the ground line is 0V.

[0049] Although a single ground line can play a role in intercepting ESD to a certain extent, there is still a risk that static electricity jumps over the ground line 01 and enters the trace line 02 in the peripheral area A2 or the touch pattern (TS) in the display area A1, damaging the trace line 02 or the touch pattern TS, thereby causing the touch failure. Figure 1 shown. Figure 1 A possible damaged area 001 is shown in FIG. The area where the display area A1 is located is also a touch area.

[0050] like Figure 1As shown, the touch structure TS includes a first sensor pattern SP1 and a second sensor pattern SP2, the first sensor pattern SP1 and the second sensor pattern SP2 are insulated from each other and arranged crosswise, the first sensor pattern SP1 includes an integral forming portion P0, and the second sensor pattern SP2 includes a plurality of main body portions MP and a bridge wire Bd connecting adjacent main body portions MP. The main body portions MP and the first sensor pattern SP1 can be formed by the same film layer using the same patterning process, and the bridge wire Bd can be formed by another film layer using another patterning process. An insulating layer can be arranged between the bridge wire Bd and the first sensor pattern SP1.

[0051] Figure 2 FIG. 1 is a schematic plan view of a touch control substrate provided by an embodiment of the present disclosure. Figure 2 As shown, the touch control substrate 10 includes: a touch control structure TS, a first grounding line 11 and at least one second grounding line 12 . Figure 2 The illustrated embodiment is described by taking the provision of one second grounding wire 12 as an example. In other embodiments, a plurality of second grounding wires 12 may also be provided.

[0052] For example, Figure 2 As shown, the touch structure TS includes a sensor pattern SP and a touch line TL. The sensor pattern SP includes a first sensor pattern SP1 and a second sensor pattern SP2, and the first sensor pattern SP1 and the second sensor pattern SP2 are insulated from each other. The first sensor pattern SP1 and the second sensor pattern SP2 are arranged crosswise. For example, the first sensor pattern SP1 is perpendicular to the second sensor pattern SP2, but it is not limited thereto. For example, Figure 2 As shown, the touch line TL includes a first touch line TL1 and a second touch line TL2. Figure 2 As shown, the first sensor pattern SP1 is connected to the first touch line TL1, and the second sensor pattern SP2 is connected to the second touch line TL2. Figure 2 Part of the touch lines TL are schematically shown in FIG.

[0053] In the touch substrate provided by the embodiment of the present disclosure, by setting a second grounding wire, the peripheral static electricity is first released by the second grounding wire, and the static electricity that jumps in is released by the first grounding wire, which can play a double protection role, effectively reduce or avoid the impact of static electricity on touch routing and sensor graphics, reduce the risk of touch performance failure caused by ESD, achieve the purpose of improving ESD protection capability, and further avoid the decrease in product yield caused by ESD, thereby achieving the purpose of improving product yield.

[0054] For example, Figure 2As shown, the second grounding line 12 and the first grounding line 11 are short-circuited at one side of the touch sensing structure TS, but the present invention is not limited thereto. Figure 2 As shown, the second grounding line 12 and the first grounding line 11 are short-circuited at one side of the touch structure TS and after the touch lines TL are gathered. Of course, in the embodiment of the present disclosure, the second grounding line 12 and the first grounding line 11 can also be short-circuited together at other locations through a connecting line. For example, Figure 2 As shown, the first grounding wire 11 and the second grounding wire 12 are insulated from the touch structure TS, respectively. That is, the first grounding wire 11 and the touch structure TS are insulated from each other, and the second grounding wire 12 and the touch structure TS are insulated from each other.

[0055] like Figure 2 As shown, the first grounding line 11 is located at the periphery of the touch-sensing structure TS. The at least one second grounding line 12 is located at a side of the first grounding line 11 away from the touch-sensing structure TS.

[0056] Figure 2 The illustrated embodiment is described by taking the example that the first sensor pattern SP1 extends in the horizontal direction and the second sensor pattern SP2 extends in the vertical direction, but the invention is not limited thereto. Figure 2 The illustrated embodiment is described by taking the first sensor pattern SP1 as a receiving sensor (Rx) and the second sensor pattern SP2 as a transmitting sensor (Tx) as an example, but is not limited thereto. In other embodiments, the two may be interchangeable.

[0057] Figure 2 , multiple first sensor patterns SP1 and multiple second sensor patterns SP2 are shown. One of the left and right ends of each first sensor pattern SP1 is connected to a first touch line TL1, or the left and right ends of each first sensor pattern SP1 are respectively connected to a first touch line TL1. One of the upper and lower ends of each second sensor pattern SP2 is connected to a second touch line TL2, or the upper and lower ends of each second sensor pattern SP2 are respectively connected to a second touch line TL2. Figure 2 In the illustrated embodiment, the left end of each first sensor pattern SP1 is connected to a first touch line TL1 , and the upper and lower ends of each second sensor pattern SP2 are respectively connected to a second touch line TL2 .

[0058] For example, Figure 2 As shown, the touch control substrate 10 further includes a flexible printed circuit board 20, and two ends of the second ground line 12 are connected to different pins of the flexible printed circuit board (FPC) 20. Figure 2 As shown, the second grounding wire 12 and the first grounding wire 11 are short-circuited together near the FPC. Figure 2As shown, the second grounding wire 12 is short-circuited with the first grounding wire 11 on one side of the touch structure TS close to the FPC 20. For example, the two ends of the second grounding wire 12 are short-circuited with the two ends of the first grounding wire 11 on one side of the touch structure TS. The first grounding wire 11 and the second grounding wire 12 can be respectively led to pads, and these pads are respectively bound to different pins of the flexible circuit board 20. For example, the second grounding wire 12 is short-circuited with the first grounding wire 11 on one side of the pad of the touch structure TS close to the touch trace TL. Figure 2 2 shows that the FPC 20 includes a plurality of pins 201. For example, different pins of the flexible circuit board 20 may be insulated from each other so that signals can be transmitted separately. For example, each pin 201 may correspond to a pad and be connected to the pad.

[0059] For example, Figure 2 As shown, one of the first sensor pattern SP1 and the second sensor pattern SP2 includes a main body portion MP and a bridge line Bd. The other of the first sensor pattern SP1 and the second sensor pattern SP2 includes an integral forming portion P0. Two adjacent main body portions MP among the plurality of main body portions MP are connected by a bridge line Bd. The plurality of main body portions MP and the integral forming portion P0 may be located in the same layer, formed by the same film layer using the same patterning process, and the bridge line Bd is located in another layer. Figure 2 In the embodiment, the first sensor pattern SP1 is formed as a whole and the second sensor pattern SP2 is formed in sections. In other embodiments, the second sensor pattern SP2 may be formed as a whole and the first sensor pattern SP1 may be formed in sections.

[0060] For example, in order to better protect against electrostatic discharge, the width of the second grounding line 12 is equal to or greater than the width of the first grounding line 11, but is not limited thereto. In other embodiments, the width of the second grounding line 12 may also be less than the width of the first grounding line 11.

[0061] For example, the width of the first ground line 11 is 15-20 μm, the width of the second ground line 12 is 15-20 μm, the maximum distance between the first ground line 11 and the second ground line 12 is 20-50 μm, and the distance between the first ground line 11 and the touch line TL closest to the first ground line 11 is 10-40 μm. In the embodiments of the present disclosure, the width of the ground line or the line is the dimension in a direction perpendicular to its extension direction.

[0062] For example, Figure 2 As shown, the first grounding line 11 is arranged around the touch structure TS, and the second grounding line 12 is arranged around the first grounding line 11. Figure 2As shown, the second grounding line 12 is arranged around the touch structure TS, and the first grounding line 11 is arranged around the touch structure TS. The second grounding line 12 is arranged around the sensor pattern SP and the touch line TL, and the first grounding line 11 is arranged around the sensor pattern SP and the touch line TL. Figure 2 As shown, the first grounding line 11 and the second grounding line 12 form an opening 30 on one side of the touch sensing structure TS. The opening 30 is located at the lower side of the touch sensing structure TS.

[0063] For example, in order to further play a role in electrostatic protection, the touch substrate further includes a third grounding line 13, and the third grounding line 13 is located in the opening 30. For example, both ends of the third grounding line 13 are connected to different pins of the flexible circuit board FPC20. For example, the third grounding line 13 is located between the first touch line TL1 and the second touch line TL2. For example, the third grounding line 13 is located between the pin of the FPC20 connected to the first touch line TL1 and the pin of the FPC20 connected to the second touch line TL2.

[0064] In some embodiments of the present disclosure, in order to reduce the wiring resistance, at least one of the first ground line 11, the second ground line 12, and the touch wiring TL can be formed by two sub-lines that overlap and are connected in a direction perpendicular to the substrate, that is, a double-layer sub-line design is used to form the wiring.

[0065] Figure 3 for Figure 2 Sectional view at AB. Figure 4 for Figure 2 The following is a cross-sectional view of the CD in the middle. Figure 2 , Figure 3 and Figure 4 Provide explanation.

[0066] For example, Figure 3 and Figure 4 As shown, in order to reduce the wiring resistance, the second grounding line 12 includes a first grounding sub-line 121 and a second grounding sub-line 122, and an insulating layer IS is between the first grounding sub-line 121 and the second grounding sub-line 122. The first grounding sub-line 121 and the second grounding sub-line 122 are connected through a first via V1 that penetrates the insulating layer IS. A plurality of first vias V1 are distributed in the insulating layer IS, and the first grounding sub-line 121 and the second grounding sub-line 122 are connected at a set position through the plurality of first vias V1. That is, the first grounding sub-line 121 and the second grounding sub-line 122 are connected in parallel. Figure 3 is a cross-sectional view of a position where a first via hole is provided in the insulating layer IS, Figure 4 It is a cross-sectional view of a position where no first via hole is provided in the insulating layer IS.

[0067] For example, to reduce trace resistance, such as Figure 3 and Figure 4As shown, the touch line TL (second touch line TL2) includes a first touch sub-line TL01 and a second touch sub-line TL02, an insulating layer IS is between the first touch sub-line TL01 and the second touch sub-line TL02, and the first touch sub-line TL01 and the second touch sub-line TL02 are connected through a second via V2 penetrating the insulating layer IS. A plurality of second vias V2 are distributed in the insulating layer IS, and the first touch sub-line TL01 and the second touch sub-line TL02 are connected at a set position through the plurality of second vias V2. That is, the first touch sub-line TL01 and the second touch sub-line TL02 are connected in parallel. Figure 3 is a cross-sectional view of a position where a second via hole is provided in the insulating layer IS, Figure 4 It is a cross-sectional view of a position in the insulating layer IS where no second via hole is provided. The first touch line TL1 may also adopt the same structure as the second touch line TL2.

[0068] For example, Figure 3 and Figure 4 As shown, in order to reduce the wiring resistance, the first grounding line 11 includes a third grounding sub-line 111 and a fourth grounding sub-line 112, and an insulating layer IS is between the third grounding sub-line 111 and the fourth grounding sub-line 112, and the third grounding sub-line 111 and the fourth grounding sub-line 112 are connected through a third via V3 penetrating the insulating layer IS. A plurality of third vias V3 are distributed in the insulating layer IS, and the third grounding sub-line 111 and the fourth grounding sub-line 112 are connected through the plurality of third vias V3 at a set position. That is, the third grounding sub-line 111 and the fourth grounding sub-line 112 are connected in parallel. Figure 3 is a cross-sectional view of a position where a third via hole is provided in the insulating layer IS, Figure 4 4 is a cross-sectional view of a position in the insulating layer IS where no third via hole is provided.

[0069] Figure 5 A schematic diagram of the principle of double protection against ESD in a touch control substrate provided by an embodiment of the present disclosure. Figure 5 for Figure 2 Schematic diagram of the structure of the touch substrate in the middle. Figure 5 The touch line TL is shown in FIG.

[0070] Reference Figure 2 and Figure 5 In a touch control substrate provided by an embodiment of the present disclosure, at least one second grounding line 12 is arranged at a certain distance outside the first grounding line 11. The peripheral static electricity is first released by the second grounding line 12, and the static electricity that jumps into the touch control line TL and the touch control structure TS is released. This plays a double protection role for the touch control line TL and the touch control structure TS, reduces the risk of touch control performance failure caused by ESD, and achieves the purpose of improving the anti-ESD capability, thereby avoiding the decrease in product yield caused by ESD, and achieving the purpose of improving product yield.

[0071] Figure 6 for Figure 5 The cross-sectional view at EF in the figure is as follows: Figure 7 for Figure 5 For example, Figure 6 As shown, the integral forming part P0 and the main body part MP are arranged in the same layer. For example, the integral forming part P0 and the main body part MP are metal mesh structures, but are not limited thereto.

[0072] For example, Figure 5 and Figure 6 As shown, two adjacent main body portions MP are connected to the bridge line Bd through a fourth via hole V11 and a fifth via hole V12 respectively.

[0073] For example, in order to simplify the manufacturing process, one of the main portion MP and the bridge line Bd is in the same layer as the first grounding sub-line 121 , and the other of the main portion MP and the bridge line Bd is in the same layer as the second grounding sub-line 122 .

[0074] For example, an array substrate provided by an embodiment of the present disclosure may be formed by the following method.

[0075] (1) A first conductive film is formed on the base substrate BS, and the first conductive film is patterned to form a bridge line Bd, a first touch sub-line TL01 , a first grounding sub-line 121 , and a third grounding sub-line 111 .

[0076] (2) Forming an insulating film.

[0077] (3) A first via hole V1, a second via hole V2, a third via hole V3, a fourth via hole V11 and a fifth via hole V12 are formed in the insulating film to form an insulating layer IS.

[0078] (4) forming a second conductive film, and patterning the second conductive film to form a second touch sub-line TL02, a second ground sub-line 122, a fourth ground sub-line 112, an integral forming portion P0 and a main portion MP; the first ground sub-line 121 and the second ground sub-line 122 are connected via a first via V1; the first touch sub-line TL01 and the second touch sub-line TL02 are connected via a second via V2; the third ground sub-line 111 and the fourth ground sub-line 112 are connected via a third via V3; and adjacent main portions MP are connected to the bridge wire Bd via a fourth via V11 and a fifth via V12, respectively.

[0079] For example, the first conductive film and the second conductive film may be made of metal material, the integral forming part P0 and the main part MP may form a metal grid structure, the bridge line Bd may form a metal grid structure, and the remaining structure may or may not form a metal grid structure.

[0080] Figure 8FIG. 1 is a partial cross-sectional view of a touch control substrate provided by another embodiment of the present disclosure. Figure 8 As shown, the touch substrate includes a first ground line 11, a second ground line 12 and a plurality of touch lines TL. The touch lines TL include a first touch sub-line TL01 and a second touch sub-line TL02. The first touch sub-line TL01 and the second touch sub-line TL02 are connected through a second via V2 penetrating the insulating layer IS. Figure 8 Four touch lines TL are shown. The number of touch lines TL in the touch substrate is determined according to needs.

[0081] refer to Figure 2 and Figure 8 There is a first interval INT1 between the second ground wire 12 closest to the first ground wire 11 and the first ground wire 11, there is a second interval INT2 between the touch line TL closest to the first ground wire 11 and the first ground wire 11, the distance between the second ground wire 12 closest to the first ground wire 11 and the first ground wire 11 is a first distance D1, and the distance between the touch line TL closest to the first ground wire 11 and the first ground wire 11 is a second distance D2. In order to improve the electrostatic protection effect, the first distance D1 is smaller than the second distance D2.

[0082] For example, in order to improve the electrostatic protection effect, such as Figure 8 As shown in FIG. 1 , the distance D between adjacent touch lines TL is less than the second distance D2. Figure 8 As shown, the distance D between adjacent touch lines TL is less than the first distance D1, but is not limited thereto.

[0083] Fig. 9 A schematic plan view of a touch control substrate provided in another embodiment of the present disclosure, and Figure 2 Compared with the touch substrate shown, Fig. 9 The touch control substrate shown is provided with a plurality of second grounding wires 12. Fig. 9 The touch control substrate shown is described by taking the arrangement of two second grounding wires 12 as an example. The plurality of second grounding wires 12 can be short-circuited with the first grounding wire 11. The distance between two adjacent second grounding wires 12 is a third distance D3, which is smaller than the first distance D1, so that both anti-static and narrow frame design can be taken into account. Of course, in other embodiments, the third distance D3 can also be greater than or equal to the first distance D1.

[0084] Fig.10 A partial cross-sectional view of a touch control substrate provided by an embodiment of the present disclosure. Figure 8 and Fig.10 The distance between adjacent second grounding lines 12 is a third distance D3, the third distance D3 is smaller than the first distance D1, and the third distance D3 is smaller than the second distance D2.

[0085] At least one embodiment of the present disclosure further provides a touch display substrate, including any of the above touch substrates.

[0086] For example, Figure 2 As shown, the touch display substrate includes a display area A1 and a peripheral area A2 outside the display area A1 , and at least one second ground line 12 is located in the peripheral area A2 . Figure 2 The area within the middle dotted line frame is the display area A1, and the area outside the display area A1 is the peripheral area A2. The peripheral area A2 surrounds the display area A1.

[0087] In order to realize the thin and light design of display devices (e.g., organic light emitting diode display devices), the display panel and the touch structure can be integrated together. Therefore, FMLOC (Flexible Multiple Layer On Cell) touch technology came into being. FMLOC touch technology is to directly make various electrode layers and various wirings of the touch structure on the packaging film, so as to integrate the touch structure on the display panel. Therefore, the display device using FMLOC touch technology can not only realize the thin and light design of the display device, but also realize touch based on flexible display.

[0088] Fig.11 FIG. 1 is a partial cross-sectional view of a touch display substrate provided in one embodiment of the present disclosure. Fig.11 As shown, a base substrate 100 is disposed on a support substrate 200. The base substrate 100 may be a flexible substrate, for example, polyimide (PI), but is not limited thereto. The support substrate 200 may be a glass substrate. A thin film transistor (TFT) 3123 array may be disposed on the base substrate 100. Fig.11 Only one thin film transistor 3123 is shown in FIG. The thin film transistor 3123 may include a semiconductor layer, a gate electrode, a gate insulating layer, a source electrode, a drain electrode, and the like. Fig.11As shown, a buffer layer 111a, a semiconductor layer 112a, a gate insulating layer 113, a gate 114, an interlayer dielectric layer 115 and a source-drain electrode layer 116 may be sequentially arranged on the substrate 100. The source-drain electrode layer 116 includes a source electrode 1161 and a drain electrode 1162. The source electrode 1161 and the drain electrode 1162 are spaced apart from each other and may be connected to the semiconductor layer 112a through via holes, respectively. A flat layer 117 may be arranged on the thin film transistor 3123, and a device to be packaged (OLED) 2123 may be arranged on the flat layer 117. The device to be packaged (OLED) 2123 may include a first electrode 121a, a light-emitting functional layer 122a and a second electrode 123. The first electrode 121a may be electrically connected to the drain electrode 1162 through a via hole penetrating the flat layer 117. A pixel defining layer 118 may be arranged on the first electrode 121a to facilitate the formation of the light-emitting functional layer 122a. The second electrode 123 may be electrically connected to the electrode lead 1163 via the connecting electrode 1211. The light-emitting functional layer 122a may include a light-emitting layer, and may also include other functional layers, for example, may also include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer, but is not limited thereto. For example, the electrode lead 1163 may be formed in the same layer as the source and drain electrode layer 116. The flat layer 117 may be a resin layer. An encapsulation film 1123 may be formed on the device to be encapsulated (OLED) 2123. The encapsulation film 1123 covers the device to be encapsulated 2123 to prevent water and oxygen from invading the device to be encapsulated 2123. The structure of the device to be encapsulated (OLED) 2123 is not limited thereto. Fig.11 The base substrate 100 in the embodiment may be the base substrate BS mentioned above.

[0089] like Fig.11As shown, the encapsulation film 1123 is disposed on the base substrate 100, and the encapsulation film 1123 includes a first film 101, a second film 102, and a third film 103 which are sequentially away from the base substrate 100, and the second film 102 is sandwiched between the first film 101 and the third film 103, and at the edge position, the first film 101 and the third film 103 are in contact. For example, the first film 101 and the third film 103 may be inorganic films, such as inorganic oxides such as SiNx, SiOx, SiCxNy, but not limited thereto. For example, the second film 102 may be an organic film, such as an organic substance such as a resin, but not limited thereto. The resin may be, for example, a thermosetting resin, such as an epoxy resin, but not limited thereto. The resin may be, for example, a thermoplastic resin, such as a thermoplastic resin, but not limited thereto. For example, the first film 101 and the third film 103 can be made by a chemical vapor deposition (CVD) method, and the second film 102 can be made by an inkjet printing (IJP) method. Both the first film 101 and the third film 103 can be used as a water-blocking layer. For example, the first film 101 can include a plurality of stacked sub-layers, and the second film 102 and the third film 103 can also include a plurality of stacked sub-layers.

[0090] Fig.11 Also shown are the first barrier dam 106 and the second barrier dam 107. The first barrier dam 106 may be formed in the same layer as the pixel defining layer 118. The second barrier dam 107 may include a first sub-barrier dam 1071 and a second sub-barrier dam 1072. For example, the first sub-barrier dam 1071 may be formed in the same layer as the planar layer 117, and the second sub-barrier dam 1072 may be formed in the same layer as the pixel defining layer 118.

[0091] like Fig.11 As shown, the second film 102 is located between the first film 101 and the third film 103 , and the first film 101 and the third film 103 contact each other at the edges to form a contact portion 1031 .

[0092] Fig.11 The display area A1 and the peripheral area A2 are also shown. Fig.11 As shown, the touch structure TS is located in the display area A1, and the touch trace TL is located in the peripheral area A2. Fig.11 As shown, the orthographic projection of the touch line TL on the base substrate 100 falls within the orthographic projection of the second film 102 on the base substrate 100 .

[0093] Fig.11In the touch display substrate shown, the orthographic projection of the first grounding line 11 on the base substrate 100 falls within the orthographic projection of the second film 102 on the base substrate 100, and the orthographic projection of the second grounding line 12 on the base substrate 100 falls within the orthographic projection of the second film 102 on the base substrate 100. When multiple second grounding lines 12 are provided, the orthographic projections of the multiple second grounding lines 12 on the base substrate 100 fall within the orthographic projection of the second film 102 on the base substrate 100.

[0094] Fig.12 A partial cross-sectional view of a touch display substrate provided in another embodiment of the present disclosure. Fig.12 The touch display substrate shown is Fig.11 Compared with the touch display substrate shown in FIG. 1 , the arrangement positions of the first grounding line 11 and the second grounding line 12 are adjusted. Fig.12 In the touch display substrate shown, the orthographic projection of the first grounding line 11 on the base substrate 100 is outside the orthographic projection of the second film 102 on the base substrate 100, and the orthographic projection of the second grounding line 12 on the base substrate 100 is outside the orthographic projection of the second film 102 on the base substrate 100. When a plurality of second grounding lines 12 are provided, the orthographic projections of the plurality of second grounding lines 12 on the base substrate 100 are outside the orthographic projection of the second film 102 on the base substrate 100.

[0095] For example, Fig.12 As shown, the orthographic projection of the second ground line 12 on the substrate 100 falls within the orthographic projection of the contact portion 1031 on the substrate 100 .

[0096] Further example, Fig.12 As shown, the orthographic projection of the first grounding line 11 on the base substrate 100 falls within the orthographic projection of the first blocking dam 106 on the base substrate 100 , and the orthographic projection of the second grounding line 12 on the base substrate 100 falls within the orthographic projection of the second blocking dam 107 on the base substrate 100 .

[0097] At least one embodiment of the present disclosure further provides a touch display device, comprising any of the above-mentioned touch display substrates.

[0098] In the embodiments of the present disclosure, the touch display device includes a flexible multi-layer on-cell (FMLOC) product, but is not limited thereto. The touch display device can be a display device such as a liquid crystal display, electronic paper, an OLED (Organic Light-Emitting Diode) display, and any product or component with touch and display functions, such as a TV, a digital camera, a mobile phone, a watch, a tablet computer, a laptop computer, a navigator, etc., which includes these display devices.

[0099] At least one embodiment of the present disclosure further provides a method for manufacturing a touch control substrate. FIG. 13A to FIG. 13F As shown, the following steps are included.

[0100] (1) Fig.13A As shown, a first conductive film L1 is formed on the base substrate.

[0101] (2) Fig. 13B As shown, the first conductive film L1 is patterned to form a first pattern P1 ; the first pattern P1 includes a bridge line Bd, a first touch sub-line TL01 , a first grounding sub-line 121 , a third grounding sub-line 111 and a fifth grounding sub-line 131 .

[0102] (3) Fig. 13C As shown, an insulating film ISF is formed.

[0103] (4) Fig.13D As shown, a first via hole V1 , a second via hole V2 , a third via hole V3 , a fourth via hole V11 , a fifth via hole V12 , and a sixth via hole V31 are formed in the insulating film ISF.

[0104] (5) Fig.13E As shown, a second conductive film L2 is formed.

[0105] (6) Fig.13F As shown, the second conductive film L2 is patterned to form a second graphic P2; the second graphic P2 includes: a second touch sub-line TL02, a second grounding sub-line 122, a fourth grounding sub-line 112, an integrally formed portion P0, a main portion MP and a sixth grounding sub-line 132, the first grounding sub-line 121 and the second grounding sub-line 122 are connected through a first via V1 to form a second grounding line 12, the first touch sub-line TL01 and the second touch sub-line TL02 are connected through a second via V2 to form a touch line TL, the third grounding sub-line 111 and the fourth grounding sub-line 112 are connected through a third via V3 to form a first grounding line 11, and the adjacent main portions MP are respectively connected to the bridge line Bd through a fourth via V11 and a fifth via V12 to form a second sensor graphic SP2; the integrally formed portion P0 is the first sensor graphic SP1; the fifth grounding sub-line 131 and the sixth grounding sub-line 132 are connected through a sixth via V31 to form a third grounding line 13.

[0106] (7) Bond the FPC 20 to the touch panel substrate by crimping.

[0107] The above forms Fig. 9 The touch control substrate shown in FIG. 1 is used as an example for explanation. When the third grounding line 13 is not provided, the fifth grounding sub-line 131 , the sixth grounding sub-line 132 , and the sixth via hole V31 are removed accordingly. The method is described below.

[0108] Another embodiment of the present disclosure further provides a method for manufacturing a touch control substrate, which can also be referred to FIG. 13A to FIG. 13F , including the following steps.

[0109] (1) Fig.13A As shown, a first conductive film L1 is formed on the base substrate.

[0110] (2) Fig. 13B As shown, the first conductive film L1 is patterned to form a first pattern P1 ; the first pattern P1 includes a bridge line Bd, a first touch sub-line TL01 , a first grounding sub-line 121 and a third grounding sub-line 111 .

[0111] (3) Fig. 13C As shown, an insulating film ISF is formed.

[0112] (4) Fig.13D As shown, a first via hole V1 , a second via hole V2 , a third via hole V3 , a fourth via hole V11 , and a fifth via hole V12 are formed in the insulating film ISF to form an insulating layer IS.

[0113] (5) Fig.13E As shown, a second conductive film L2 is formed.

[0114] (6) Fig.13F As shown, the second conductive film L2 is patterned to form a second graphic P2; the second graphic P2 includes: a second touch sub-line TL02, a second grounding sub-line 122, a fourth grounding sub-line 112, an integrally formed portion P0 and a main body portion MP, the first grounding sub-line 121 and the second grounding sub-line 122 are connected through a first via V1 to form a second grounding line 12, the first touch sub-line TL01 and the second touch sub-line TL02 are connected through a second via V2 to form a touch line TL, the third grounding sub-line 111 and the fourth grounding sub-line 112 are connected through a third via V3 to form a first grounding line 11, and the adjacent main body portions MP are respectively connected to the bridge line Bd through a fourth via V11 and a fifth via V12 to form a second sensor graphic SP2; the integrally formed portion P0 is the first sensor graphic SP1.

[0115] (7) Bond the FPC 20 to the touch panel substrate by crimping.

[0116] For clarity of illustration, FIG. 13A to FIG. 13F Not all touch lines TL are shown, only seven touch lines TL are schematically shown. In the embodiment of the present disclosure, a touch line TL is respectively set on the upper and lower sides of the second sensor pattern SP2, while the first sensor pattern SP1 is only set on the left side thereof.

[0117] Of course, the number and shape of the first sensor patterns SP1 and the second sensor patterns SP2 are not limited to those shown in the figure, and can be determined as needed. The number of the second grounding lines 12 is also not limited to those shown in the figure.

[0118] For example, the insulating film ISF may be made of an insulating material, such as silicon oxide, silicon nitride, silicon oxynitride, or resin, but is not limited thereto.

[0119] For example, the first conductive film L1 and the second conductive film L2 may be made of metal materials.

[0120] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of the layer or region is exaggerated. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element, or there may be an intermediate element.

[0121] In the embodiments of the present disclosure, the components arranged in the same layer are formed by the same film layer using the same patterning process. For example, the components arranged in the same layer are located on the surface of the same component away from the base substrate, but not limited thereto. The components arranged in the same layer may have different heights relative to the base substrate.

[0122] In the embodiments of the present disclosure, the patterning or patterning process may include only the photolithography process, or include the photolithography process and the etching step, or may include other processes such as printing and inkjetting for forming a predetermined pattern. The photolithography process refers to a process including film formation, exposure, and development, and a pattern is formed using a photoresist, a mask, an exposure machine, etc. The corresponding patterning process can be selected according to the structure formed in the embodiments of the present disclosure.

[0123] In the absence of conflict, features in the same embodiment and different embodiments of the present disclosure may be combined with each other.

[0124] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A touch substrate, comprising: A touch structure, comprising a sensor pattern and a touch wiring, wherein the sensor pattern comprises a plurality of first sensor patterns and a plurality of second sensor patterns, the plurality of first sensor patterns and the plurality of second sensor patterns intersect each other and are insulated from each other, the touch wiring comprises a plurality of first touch wirings and a plurality of second touch wirings, the first sensor pattern is connected to one of the plurality of first touch wirings, and the second sensor pattern is connected to one of the plurality of second touch wirings; A first grounding wire, located at the periphery of the touch control structure; as well as At least one second grounding line is located on a side of the first grounding line away from the touch control structure, Wherein, the first grounding line and the at least one second grounding line are combined at one side of the touch control structure and combined into a grounding connection line; Wherein, the touch control substrate further includes a flexible circuit board, and one end of the ground connection line is connected to the flexible circuit board.

2. The touch substrate according to claim 1, wherein: The at least one second grounding line includes a first second grounding line and a second second grounding line, the second second grounding line is located on a side of the first second grounding line away from the touch control structure, and the first grounding line, the first second grounding line and the second second grounding line are combined into the grounding connection line.

3. The touch substrate according to claim 2, wherein: The first grounding line and the first second grounding line have a first connection point, the grounding connection line has a first endpoint, and the first connection point and the first endpoint coincide with each other.

4. The touch control substrate according to claim 3, wherein: The first grounding line and the first second grounding line are combined into the ground connection line at the first connection point.

5. The touch control substrate according to claim 3, wherein: The first grounding line and the second grounding line have a second connection point, and the second connection point is located on the ground connection line.

6. The touch control substrate according to claim 5, wherein: The first grounding line and the second grounding line are combined into the ground connection line at the second connection point.

7. The touch control substrate according to claim 6, wherein: A minimum distance between the first connection point and the second connection point is greater than zero.

8. The touch control substrate according to any one of claims 1 to 7, wherein: The width of the first grounding line is the same as the width of the grounding connection line. The width of the first grounding line is the dimension of the first grounding line in a direction perpendicular to its extension direction and in a plane parallel to the substrate. The width of the grounding connection line is the dimension of the grounding connection line in a direction perpendicular to its extension direction and in a plane parallel to the substrate.

9. The touch control substrate according to any one of claims 1 to 7, wherein: The width of the first grounding line is greater than the width of the grounding connection line. The width of the first grounding line is the dimension of the first grounding line in a direction perpendicular to its extension direction and in a plane parallel to the substrate. The width of the grounding connection line is the dimension of the grounding connection line in a direction perpendicular to its extension direction and in a plane parallel to the substrate.

10. The touch control substrate according to any one of claims 1 to 7, wherein: The width of at least one of the at least one second grounding lines is greater than the width of the grounding connection line. The width of the second grounding line is the dimension of the second grounding line in a direction perpendicular to its extension direction and in a plane parallel to the substrate. The width of the grounding connection line is the dimension of the grounding connection line in a direction perpendicular to its extension direction and in a plane parallel to the substrate.

11. The touch control substrate according to claim 3, wherein: Two first connection points are provided, the touch substrate has a first center line, the two first connection points are arranged on both sides of the first center line, and the first center line extends in the same direction as the extension direction of the second sensor pattern.

12. The touch control substrate according to claim 11, wherein: The touch substrate further has a second center line, the second center line intersects with the first center line, and the two first connection points are located on the same side of the second center line.

13. The touch control substrate according to any one of claims 1 to 7, wherein: The first grounding wire and the second grounding wire are insulated from the touch control structure respectively.

14. The touch control substrate according to any one of claims 1 to 7, wherein: A maximum distance between the first ground line and the second ground line is 20-50 μm.

15. The touch control substrate according to any one of claims 1 to 7, wherein: The distance between the first ground line and the touch line closest to the first ground line is 10-40 μm.

16. The touch control substrate according to any one of claims 1 to 7, wherein: The width of the first ground line is 15-20 μm.

17. The touch control substrate according to any one of claims 1 to 7, wherein: The width of the second ground line is 15-20 μm.

18. The touch control substrate according to any one of claims 1 to 7, wherein: The first grounding wire is disposed around the touch control structure, the second grounding wire is disposed around the first grounding wire, and the first grounding wire and the second grounding wire have a first interval.

19. The touch control substrate according to any one of claims 1 to 7, wherein: The second grounding line includes a first grounding sub-line and a second grounding sub-line, an insulating layer is between the first grounding sub-line and the second grounding sub-line, and the first grounding sub-line and the second grounding sub-line are connected via a first via hole penetrating the insulating layer.

20. The touch control substrate according to claim 19, wherein: At least one of the first touch wiring and the second touch wiring includes a first touch sub-wire and a second touch sub-wire, the first touch sub-wire and the second touch sub-wire are between the insulating layer, and the first touch sub-wire and the second touch sub-wire are connected through a second via hole penetrating the insulating layer.

21. The touch control substrate according to claim 20, wherein: One of the first sensor pattern and the second sensor pattern includes an integrally formed part, and the other of the first sensor pattern and the second sensor pattern includes a main body part and a bridge line, one of the main body part and the bridge line is on the same layer as the first grounding sub-line, and the other of the main body part and the bridge line is on the same layer as the second grounding sub-line.

22. The touch control substrate according to claim 21, wherein: The first grounding line includes a third grounding sub-line and a fourth grounding sub-line, the insulating layer is between the third grounding sub-line and the fourth grounding sub-line, and the third grounding sub-line and the fourth grounding sub-line are connected via a third via hole penetrating the insulating layer.

23. The touch control substrate according to claim 22, wherein: The bridge line, the first grounding sub-line, the third grounding sub-line and the first touch sub-line are in the same layer, and the integral forming part, the main body part, the second grounding sub-line, the fourth grounding sub-line and the second touch sub-line are in the same layer.

24. The touch control substrate according to claim 23, wherein: At least one of the bridge line, the integrally formed portion, and the main body portion is a metal mesh structure.

25. The touch control substrate according to claim 23, wherein: The touch control substrate further includes a flexible circuit board, and two ground connection lines are provided. The two ground connection lines are connected to two different pins of the flexible circuit board.

26. A touch display substrate, comprising the touch substrate according to any one of claims 1 to 25.

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