A phased array architecture with separate transmitting and receiving and integrated thermal control

Abstract

The present invention discloses a separate receiving and transmitting thermal control integrated phased array architecture, including: a receiving array face, a receiving thermal control structure body, a transmitting array face, and a transmitting thermal control structure body; the receiving thermal control structure body and the transmitting thermal control structure body form a thermal control body, the receiving array face and the transmitting array face are respectively arrayed, the receiving array face is located on the receiving thermal control structure body, the transmitting array face is located on the transmitting thermal control structure body, and the receiving thermal control structure body and the transmitting thermal control structure body can be independently spliced. The present invention solves the difficulties of independent thermal control of the receiving and transmitting array faces and detachable adjustment and testing, and has the characteristics of high structural design integration, small longitudinal size, and light weight of the whole machine.

Description

Technical Field

[0001] The present invention relates to a phased array system, and in particular to a transmitting-receiving separated thermal control integrated phased array architecture. Background Art

[0002] Phased array antennas are gradually emerging in the field of satellite communications with their superior performance and user experience, but their high-density integration and high heat flux density are also the core difficulties in the design of phased array systems. The highly consistent and coordinated design also directly affects the assembly results of the product, and the thermal control solution directly affects whether the antenna can be turned on and work normally. However, the above aspects cannot be carried out independently of each other. They are system-level difficulties that are complicated, intertwined, and even contradictory. Therefore, a reasonable overall system architecture is particularly important. Summary of the invention

[0003] The object of the present invention is to provide a phased array architecture with separate transmitting and receiving elements and integrated thermal control to solve the above technical problems.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A transmitting-receiving separated thermal control integrated phased array architecture comprises: a receiving array face, a receiving thermal control structure body, a transmitting array face, and a transmitting thermal control structure body; the receiving thermal control structure body and the transmitting thermal control structure body constitute a thermal control body, the receiving array face and the transmitting array face are respectively arrayed, the receiving array face is located on the receiving thermal control structure body, the transmitting array face is located on the transmitting thermal control structure body, and the receiving thermal control structure body and the transmitting thermal control structure body are independently spliced.

[0006] Preferably, both the receiving thermal control structure body and the transmitting thermal control structure body adopt a heat spreader for heat dissipation, and the inner cavity of the heat spreader is filled with a working fluid.

[0007] Preferably, the receiving thermal control structure body and the transmitting thermal control structure body are provided with integrated heat dissipation fins on the side, and fans are also installed.

[0008] Preferably, the network components are installed on the back of the thermal control body, and the network components include network components A and network components B. Holes are opened on the thermal control body to achieve vertical interconnection between the thermal control body and the network components.

[0009] Preferably, the receiving array face and the transmitting array face are passed through the antenna through hole through a grounding column and then welded at the top end to fix the antenna and the thermal control body into one. A group of positioning columns are designed on the receiving thermal control structure body and the transmitting thermal control structure body. The receiving array face and the transmitting array face are first positioned and then fixed one by one through the countersunk holes on the back of the receiving thermal control structure body and the transmitting thermal control structure body by screws.

[0010] Preferably, the receiving thermal control structure body and the transmitting thermal control structure body are designed to be complementary and nested in appearance, and the connection is achieved by installing and fixing from the receiving thermal control structure body to the transmitting thermal control structure body with front screws, installing and fixing from the transmitting thermal control structure body to the receiving thermal control structure body with back screws, and installing and fixing from the transmitting thermal control structure body to the receiving thermal control structure body with side screws.

[0011] Preferably, the air-cooling fan is directly installed on the side of the heat dissipation fin.

[0012] Preferably, the control power supply interface, the radio frequency interface and the corresponding interface on the network component of the receiving array and the transmitting array pass through the avoidance through hole of the thermal control body to realize a vertically interconnected stacked architecture.

[0013] Compared with the prior art, the present invention has the following advantages: the present invention solves the difficulties of independent thermal control of the transmitting and receiving arrays and detachable adjustment and testing, and has the characteristics of high structural design integration, small longitudinal size, and light weight of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 Receive the main structure diagram of the thermal control structure;

[0016] Figure 3 Main structure diagram of launch thermal control structure;

[0017] Figure 4 Structural diagram of the receiving thermal control structure body and the transmitting thermal control structure body;

[0018] Figure 5 The stacked architecture diagram of the present invention;

[0019] Figure 6 Schematic diagram of vertical interconnection of the present invention;

[0020] In the figure: receiving array (1), receiving thermal control structure body (2), transmitting array (3), transmitting thermal control structure body (4), network component A (5), network component B (6), control power supply interface (7), radio frequency interface (8), side screws (9), front screws (10). DETAILED DESCRIPTION

[0021] The present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0022] like Figure 1-6As shown, a separate receiving and transmitting thermal control integrated phased array architecture includes: a receiving array face 1, a receiving thermal control structure body 2, a transmitting array face 3, and a transmitting thermal control structure body 4; the receiving thermal control structure body 2 and the transmitting thermal control structure body 4 form a thermal control body, the receiving array face 1 and the transmitting array face 3 are respectively arrayed, the receiving array face 1 is located on the receiving thermal control structure body 2, the transmitting array face 3 is located on the transmitting thermal control structure body 4, and the receiving thermal control structure body 2 and the transmitting thermal control structure body 4 are independently spliced. The receiving thermal control structure body 2 and the transmitting thermal control structure body 4 are designed to be complementary in appearance and nested, and the connection is achieved by installing and fixing the receiving thermal control structure body 2 to the transmitting thermal control structure body 4 with front screws 10, installing and fixing the transmitting thermal control structure body 4 to the receiving thermal control structure body 2 with back screws, and installing and fixing the transmitting thermal control structure body 4 to the receiving thermal control structure body 2 with side screws 9.

[0023] The receiving thermal control structure body 2 and the transmitting thermal control structure body 4 both use a heat spreader for heat dissipation, and the inner cavity of the heat spreader is filled with working fluid. This achieves efficient heat conduction and heat expansion, and ensures the array surface temperature index requirements. At the same time, the heat spreader cavity frame is used as the array surface installation body, which is highly integrated with the array surface structure, meeting the installation requirements of the array surface components and realizing an integrated array surface architecture.

[0024] The receiving thermal control structure body 2 and the transmitting thermal control structure body 4 are provided with integrated heat dissipation fins on the side, and fans are installed at the same time. The air-cooling fan is directly installed on the side of the heat dissipation fin. The heat dissipation surface can be fully exposed to the environment without obstruction, forming the best combination with the whole machine structure. At the same time, the heat dissipation teeth are integrated with the whole machine structure to avoid the risk of low thermal conduction efficiency of the assembly, and the reliability is high. In addition, the air-cooling fan is directly installed on the side of the heat dissipation fin to maximize the heat conduction and heat dissipation capabilities.

[0025] The network components are installed on the back of the thermal control body. The network components include network components A5 and network components B6. Holes are opened on the thermal control body to realize vertical interconnection between the thermal control body and the network components. The control power supply interface 7 and radio frequency interface 8 of the receiving array 1 and the transmitting array 3 and the corresponding interface on the network components pass through the through holes of the thermal control body to realize vertical interconnection and stacked architecture.

[0026] The receiving array face 1 and the transmitting array face 3 pass through the antenna through-hole through the grounding column and are welded at the top to fix the antenna and the thermal control body into one. A group of positioning columns are designed on the receiving thermal control structure body 2 and the transmitting thermal control structure body 4. The receiving array face 1 and the transmitting array face 3 are first positioned, and then fixed one by one through the countersunk holes on the back of the receiving thermal control structure body 2 and the transmitting thermal control structure body 4 through screws.

[0027] When assembling the whole machine, this separate design can first connect and install the receiving thermal control structure body and the transmitting thermal control structure body to form an installation platform for the whole machine components, and then install each component in turn; or first install the components installed in each thermal control system separately, and then connect and install the receiving component and the transmitting component. This installation method greatly improves the efficiency of assembly and the efficiency of synchronous testing of the receiving and transmitting arrays. At the same time, the joint between the receiving thermal control structure body and the transmitting thermal control body also serves as a separation wall between the receiving and transmitting arrays to improve the isolation of the receiving and transmitting arrays.

[0028] The above is a preferred embodiment of the present invention. For ordinary technicians in this field, according to the teachings of the present invention, without departing from the principles and spirit of the present invention, changes, modifications, substitutions and variations made to the implementation methods are still within the scope of protection of the present invention.

Claims

1. A phased array architecture with separate transmitting and receiving thermal control integration, characterized in that: include: A receiving array face (1), a receiving thermal control structure body (2), a transmitting array face (3), and a transmitting thermal control structure body (4); the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) form a thermal control body, the receiving array face (1) and the transmitting array face (3) are respectively arrayed, the receiving array face (1) is located on the receiving thermal control structure body (2), the transmitting array face (3) is located on the transmitting thermal control structure body (4), the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are independently spliced, and the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are independently spliced. The body (2) and the transmitting thermal control structure body (4) both adopt a heat spreader for heat dissipation, the inner cavity of the heat spreader is filled with a working medium, the receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are provided with integrated heat dissipation fins on the side, and a fan is installed at the same time, the network component is installed on the back of the thermal control body, the network component includes a network component A (5) and a network component B (6), a hole is opened on the thermal control body to realize the vertical interconnection between the thermal control body and the network component, and the receiving array surface (1) and the transmitting array surface (3) are welded at the top after passing through the antenna through hole through the grounding column. The antenna and the thermal control body are fixed together. A group of positioning columns are designed on the receiving thermal control structure body (2) and the transmitting thermal control structure body (4). The receiving array surface (1) and the transmitting array surface (3) are first positioned and then fixed one by one through the countersunk holes on the back of the receiving thermal control structure body (2) and the transmitting thermal control structure body (4). The receiving thermal control structure body (2) and the transmitting thermal control structure body (4) are designed to be complementary in shape and nested. The connection is made from the receiving thermal control structure body (2) to the transmitting thermal control structure body (4) through the front screws (10). The transmitting thermal control structure body (4) is installed and fixed, the rear screws are installed and fixed from the transmitting thermal control structure body (4) to the receiving thermal control structure body (2), and the side screws (9) are installed and fixed from the transmitting thermal control structure body (4) to the receiving thermal control structure body (2) to achieve splicing, the air cooling fan is directly installed on the side of the heat dissipation fin, and the control power supply interface (7) and the radio frequency interface (8) of the receiving array surface (1) and the transmitting array surface (3) and the corresponding interface on the network component pass through the thermal control body avoidance through hole to realize a vertically interconnected stacked architecture.

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