Monitoring devices, integrated circuit devices, electronic devices and battery protection systems

Abstract

The present disclosure provides a monitoring device, including: at least one overload number monitoring module, including a comparator and a counter, the first input end of the comparator receives a voltage signal between a fuse element of a current and / or voltage overload protection device and a PN junction element, the second input end of the comparator receives a voltage reference signal, the output end of the comparator is connected to the counter, and the counter counts the event that the voltage signal between the fuse element of the current and / or voltage overload protection device and the PN junction element is greater than the voltage reference signal as the overload number. The present disclosure also provides an integrated circuit device, an electronic device, and a battery protection system.

Description

Technical Field

[0001] The present disclosure belongs to the field of circuit technology, and in particular relates to a monitoring device, an integrated circuit device, an electronic device, and a battery protection system. Background Art

[0002] For integrated circuit devices and electronic devices (such as battery systems), current overload protection and voltage overload protection are crucial, and are directly related to whether the integrated circuit devices and electronic devices can work normally and the reliability of the integrated circuit devices and electronic devices.

[0003] When the current or voltage applied to electronic devices exceeds the limit, the excessive heat (EOS) generated will damage the electronic devices. Electrostatic discharge (ESD) may damage microchips. The ESD discharge voltage can be as high as tens of thousands of volts.

[0004] In the prior art, a melting fuse is often used for current overload protection. When an overcurrent flows through the melting fuse, the melting fuse is blown, disconnecting the current source from the electronic device, and the electronic device stops working.

[0005] In the prior art, surge devices (such as diodes) are often used for voltage overload protection. When an overvoltage is applied to the surge device, the surge device is broken down, forming a short circuit, and the electronic device no longer works.

[0006] When the melted fuse or surge device is destroyed, the electronic device must replace the melted fuse or surge device.

[0007] Furthermore, monitoring of current and / or voltage overload protection devices is crucial. Summary of the invention

[0008] In order to solve one of the above technical problems, the present disclosure provides a monitoring device, an integrated circuit device, an electronic device, and a battery protection system.

[0009] According to one aspect of the present disclosure, a monitoring device is provided, comprising: at least one overload number monitoring module, the overload number monitoring module comprising a comparator and a counter, the first input end of the comparator receiving a voltage signal between a fuse element of a current and / or voltage overload protection device and a PN junction element, the second input end of the comparator receiving a voltage reference signal, the output end of the comparator being connected to the counter, the counter counting events in which the voltage signal between the fuse element of the current and / or voltage overload protection device and the PN junction element is greater than the voltage reference signal as the overload number.

[0010] The monitoring device according to at least one embodiment of the present disclosure further includes: at least one voltage monitoring module, which collects the voltage signal between the fuse element and the PN junction element of the current and / or voltage overload protection device in real time to monitor the voltage between the fuse element and the PN junction element.

[0011] According to at least one embodiment of the present disclosure, the monitoring device further includes: at least one current monitoring module, the current monitoring module includes a voltage integrating amplifier, and the current monitoring module obtains the average value of the discharge current during the current and / or voltage overload period based at least on the integration time of the voltage integrating amplifier, the integrated voltage within the integration time, and the resistance value of the fuse element.

[0012] According to the monitoring device of at least one embodiment of the present disclosure, the overload number monitoring module also includes a low-pass filter, the low-pass filter performs low-pass filtering on the signal output by the comparator, and the counter counts the signal after the low-pass filtering.

[0013] According to the monitoring device of at least one embodiment of the present disclosure, the current monitoring module also includes an analog-to-digital converter and a low-pass filter, the analog-to-digital converter performs analog-to-digital conversion on the integrated voltage output by the voltage integrating amplifier, and the low-pass filter performs low-pass filtering on the integrated voltage after the analog-to-digital conversion, and the current monitoring module obtains the average value of the discharge current during the current and / or voltage overload period based at least on the integration time of the voltage integrating amplifier, the integrated voltage after low-pass filtering within the integration time, and the resistance value of the fuse element.

[0014] According to the monitoring device of at least one embodiment of the present disclosure, the voltage monitoring module includes an analog-to-digital converter and a low-pass filter connected to the analog-to-digital converter, the analog-to-digital converter performs analog-to-digital conversion on the collected voltage signal between the fuse element and the PN junction element of the current and / or voltage overload protection device, and outputs a digital signal, and the low-pass filter performs low-pass filtering on the digital signal output by the analog-to-digital converter to monitor the voltage between the fuse element and the PN junction element.

[0015] According to the monitoring device of at least one embodiment of the present disclosure, the resistance measurement module includes a reference current providing unit, an analog-to-digital converter and a low-pass filter, the reference current providing unit provides a reference current flowing through the fuse element to obtain the voltage drop of the fuse element, the analog-to-digital converter performs analog-to-digital conversion on the voltage drop, the low-pass filter performs low-pass filtering on the voltage drop after the analog-to-digital conversion, and the resistance measurement module obtains the resistance of the fuse element based at least on the reference current and the voltage drop of the fuse element after the low-pass filtering. According to the monitoring device of at least one embodiment of the present disclosure, it also includes: at least one resistance measurement module, the resistance measurement module obtains the resistance of the fuse element based at least on the reference current and the voltage drop of the fuse element.

[0016] According to the monitoring device of at least one embodiment of the present disclosure, the current and / or voltage overload protection device includes:

[0017] at least one protection component;

[0018] The protection component includes at least one fuse element and at least one PN junction element connected in series with the fuse element;

[0019] When the current is overloaded, the fuse element can be fused to achieve current overload protection, and when the voltage is overloaded, the PN junction element can be broken down to achieve voltage overload protection.

[0020] According to the monitoring device of at least one embodiment of the present disclosure, the first end of the current and / or voltage overload protection device is connected to the signal receiving end of the protection target device, and the second end of the current and / or voltage overload protection device is connected to the power supply end or the ground end of the protection target device.

[0021] According to the monitoring device of at least one embodiment of the present disclosure, the signal receiving end of the protection target device is used to receive an external input signal.

[0022] According to the monitoring device of at least one embodiment of the present disclosure, the protection target device is an integrated circuit chip.

[0023] According to the monitoring device of at least one embodiment of the present disclosure, the external input signal is an external input power signal.

[0024] According to the monitoring device of at least one embodiment of the present disclosure, the number of protection components is two or more than three, and the two or more protection components form a parallel structure between the signal receiving end of the protection target device and the power supply end or the grounding end of the protection target device.

[0025] According to the monitoring device of at least one embodiment of the present disclosure, the fuse element is formed of a metal material.

[0026] According to the monitoring device of at least one embodiment of the present disclosure, the PN junction element is preferably a diode, a triode, a MOS tube and / or a combination thereof.

[0027] According to the monitoring device of at least one embodiment of the present disclosure, the protection component includes two fuse elements and a PN junction element connected in series with the two fuse elements, and the PN junction element is arranged between the two fuse elements.

[0028] According to the monitoring device of at least one embodiment of the present disclosure, the fuse element is a resistor device.

[0029] According to the monitoring device of at least one embodiment of the present disclosure, the protection target device determines whether the corresponding fuse element is blown based on the voltage monitored by the voltage monitoring module.

[0030] According to another aspect of the present disclosure, there is provided an integrated circuit device, comprising:

[0031] At least two current and / or voltage overload protection devices;

[0032] At least two monitoring devices as described in any one of the above items, each monitoring device monitors a current and / or voltage overload protection device; and

[0033] at least one integrated circuit chip;

[0034] In which, the current and / or voltage overload protection device, the monitoring device and the integrated circuit chip are formed on a common substrate, at least one of the current and / or voltage overload protection devices is arranged between the power supply end of the integrated circuit chip and the signal receiving end of the integrated circuit chip, and at least another current and / or voltage overload protection device is arranged between the ground end of the integrated circuit chip and the signal receiving end of the integrated circuit chip.

[0035] According to yet another aspect of the present disclosure, an electronic device is provided, comprising the above-mentioned integrated circuit device.

[0036] According to another aspect of the present disclosure, there is provided a battery protection system, comprising: at least one current and / or voltage overload protection device, which performs overload protection on a battery assembly; and at least one monitoring device as described in any one of the above items, each monitoring device monitoring a current and / or voltage overload protection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0038] Figure 1 is a schematic structural diagram of an integrated circuit device according to an embodiment of the present disclosure.

[0039] Figure 2 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0040] Figure 3 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0041] Figure 4 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0042] Figure 5 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0043] Figure 6 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0044] Figure 7 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0045] Figure 8 is a schematic structural diagram of an integrated circuit device according to yet another embodiment of the present disclosure.

[0046] Fig. 9 It is a schematic structural diagram of a current and / or voltage overload protection device according to an embodiment of the present disclosure.

[0047] Fig.10 It is a structural schematic diagram of a current and / or voltage overload protection device according to another embodiment of the present disclosure.

[0048] Description of Reference Numerals

[0049] 100 Monitoring Devices

[0050] 101 Overload times monitoring module

[0051] 102 Voltage monitoring module

[0052] 103 Current monitoring module

[0053] 104 Resistance Measurement Module

[0054] 200 Current and / or voltage overload protection device

[0055] 201 Fuse element

[0056] 202 PN junction components

[0057] 300 Protect target device

[0058] 302 Signal receiving end

[0059] 1000 Integrated Circuit Devices

[0060] 1011 Comparator

[0061] 1012 Counter

[0062] 1021 Analog-to-Digital Converter

[0063] 1022 Filter

[0064] 1031 Voltage Integrating Amplifier. DETAILED DESCRIPTION

[0065] The present disclosure is further described in detail below in conjunction with the accompanying drawings and implementations. It is understood that the specific implementations described herein are only used to explain the relevant content, rather than to limit the present disclosure. It should also be noted that, for ease of description, only the parts related to the present disclosure are shown in the accompanying drawings.

[0066] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present disclosure can be combined with each other. The technical solution of the present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0067] Unless otherwise specified, the exemplary embodiments / embodiments shown will be understood as providing exemplary features of various details of some ways in which the technical concept of the present disclosure can be implemented in practice. Therefore, unless otherwise specified, the features of the various embodiments / embodiments can be combined, separated, interchanged and / or rearranged without departing from the technical concept of the present disclosure.

[0068] The use of cross-hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent components clear. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the accompanying drawings, the sizes and relative sizes of the components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed in a different order than described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same figure numbers represent the same components.

[0069] When a component is referred to as being "on" or "over," "connected to," or "coupled to" another component, the component may be directly on, directly connected to, or directly coupled to the other component, or intervening components may be present. However, when a component is referred to as being "directly on," "directly connected to," or "directly coupled to" another component, there are no intervening components. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, etc., with or without intervening components.

[0070] For descriptive purposes, the present disclosure may use spatially relative terms such as "under," "beneath," "under," "down," "over," "upper," "above," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "under" or "beneath" other components or features would subsequently be positioned "over" the other components or features. Thus, the exemplary term "under" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0071] The terms used here are for the purpose of describing specific embodiments, and are not intended to be restrictive. As used here, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, parts, assemblies and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups. It should also be noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values ​​and / or the values ​​provided that will be recognized by those of ordinary skill in the art.

[0072] Figure 1 is a schematic structural diagram of an integrated circuit device 1000 according to an embodiment of the present disclosure.

[0073] Figure 5 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

[0074] like Figure 1 and Figure 5 As shown, a monitoring device 100 of an embodiment of the present disclosure includes: at least one overload monitoring module 101, the overload monitoring module 101 includes a comparator 1011 and a counter 1012, the first input end of the comparator 1011 receives a voltage signal between the fuse element 201 of the current and / or voltage overload protection device 200 and the PN junction element 202, the second input end of the comparator 1011 receives a voltage reference signal (Vref), the output end of the comparator 1011 is connected to the counter 1012, and the counter 1012 counts the event that the voltage signal between the fuse element 201 of the current and / or voltage overload protection device 200 and the PN junction element 202 is greater than the voltage reference signal as the overload count.

[0075] According to a preferred embodiment of the present disclosure, the overload times monitoring module 101 further includes a low-pass filter, which performs low-pass filtering on the signal output by the comparator 1011, and the counter 1012 counts the signal after the low-pass filtering as the overload times.

[0076] Figure 1 and Figure 5 Two monitoring devices 100 are shown in each of the figures. Those skilled in the art should understand that the present disclosure does not specifically limit the number of monitoring devices 100 in the integrated circuit device 1000.

[0077] Figure 1 and Figure 5 Two current and / or voltage overload protection devices 200 are shown in each case.

[0078] like Figure 1 and Figure 5 As shown, the current and / or voltage overload protection device 200 includes: a protection component; the protection component includes a fuse element 201 and a PN junction element 202 connected in series with the fuse element 201; wherein, when the current is overloaded, the fuse element 201 can be fused to achieve current overload protection, and when the voltage is overloaded, the PN junction element 202 can be broken down to achieve voltage overload protection.

[0079] Through the structural design of the current and / or voltage overload protection device 200 described above, adaptive uniform distribution of the discharge current can be achieved, and due to the setting of the fuse element, a short circuit will not occur when the PN junction element is broken down.

[0080] Figure 2 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

[0081] like Figure 2 As shown, in Figure 1 or Figure 5 On the basis of the monitoring device 100 shown in the figure, the monitoring device 100 also includes: at least one voltage monitoring module 102, the voltage monitoring module 102 collects the voltage signal between the fuse element 201 and the PN junction element 202 of the current and / or voltage overload protection device 200 in real time to monitor the voltage between the fuse element 201 and the PN junction element 202.

[0082] Preferably, if Figure 6 In the illustrated integrated circuit device 1000 , the voltage monitoring module 102 includes an analog-to-digital converter 1021 and a filter 1022 connected to the analog-to-digital converter 1021 .

[0083] The analog-to-digital converter 1021 performs analog-to-digital conversion on the collected voltage signal between the fuse element 201 and the PN junction element 202 of the current and / or voltage overload protection device 200, and outputs a digital signal. The filter 1022 (low-pass filter) performs low-pass filtering on the digital signal output by the analog-to-digital converter 1021 to monitor the voltage between the fuse element 201 and the PN junction element 202.

[0084] Figure 3 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure. Figure 7 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

[0085] like Figure 3 and Figure 7 As shown, in Figure 1 , Figure 2 , Figure 5 or Figure 6 On the basis of the monitoring device 100 shown, the monitoring device 100 also includes: at least one current monitoring module 103, the current monitoring module 103 includes a voltage integrating amplifier 1031, and the current monitoring module 103 obtains the average value of the discharge current during the current and / or voltage overload period based at least on the integration time of the voltage integrating amplifier 1031, the integrated voltage within the integration time, and the resistance value of the fuse element 201.

[0086] According to a preferred embodiment of the present disclosure, the current monitoring module 103 also includes an analog-to-digital converter and a low-pass filter. The analog-to-digital converter performs analog-to-digital conversion on the integrated voltage output by the voltage integrating amplifier 1031, and the low-pass filter performs low-pass filtering on the integrated voltage after the analog-to-digital conversion. The current monitoring module 103 obtains the average value of the discharge current during the current and / or voltage overload period based at least on the integration time of the voltage integrating amplifier 1031, the integrated voltage after low-pass filtering within the integration time, and the resistance value of the fuse element 201.

[0087] Figure 4 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure. Figure 8 is a schematic structural diagram of an integrated circuit device 1000 according to yet another embodiment of the present disclosure.

[0088] like Figure 4 and Figure 8 As shown, in Figure 1 , Figure 2 , Figure 3 , Figure 5 , Figure 6 or Figure 7 On the basis of the monitoring device 100 shown, the monitoring device 100 further includes: at least one resistance measurement module 104 , and the resistance measurement module 104 obtains the resistance of the fuse element 201 based on at least the reference current and the voltage drop of the fuse element 201 .

[0089] According to a preferred embodiment of the present disclosure, the resistance measurement module 104 includes a reference current providing unit, an analog-to-digital converter and a low-pass filter. The reference current providing unit provides a reference current flowing through the fuse element 201 to obtain a voltage drop of the fuse element 201. The analog-to-digital converter performs analog-to-digital conversion on the voltage drop. The low-pass filter performs low-pass filtering on the voltage drop after the analog-to-digital conversion. The resistance measurement module 104 obtains the resistance of the fuse element 201 based at least on the reference current and the voltage drop of the fuse element 201 after low-pass filtering.

[0090] As an overload event (such as an ESD event) occurs, the resistance of the fuse element 201 will change, and the resistance measurement module 104 can measure the resistance of the fuse element 201 in real time.

[0091] In each of the above-mentioned embodiments, preferably, the current and / or voltage overload protection device 200 in the integrated circuit device 1000 includes: at least one protection component; the protection component includes at least one fuse element 201 and at least one PN junction element 202 connected in series with the fuse element 201; wherein, when the current is overloaded, the fuse element 201 can be blown to achieve current overload protection, and when the voltage is overloaded, the PN junction element 202 can be broken down to achieve voltage overload protection.

[0092] In each of the above-mentioned embodiments, the first end of the current and / or voltage overload protection device 200 in the integrated circuit device 1000 is connected to the signal receiving end 302 of the protection target device 300, and the second end of the current and / or voltage overload protection device 200 is connected to the power supply end (VDD) or the ground end of the protection target device 300.

[0093] In each of the above-mentioned implementation modes, the signal receiving terminal 302 of the protection target device 300 is used to receive an external input signal.

[0094] In each of the above-mentioned implementation modes, the protection target device 300 may be an integrated circuit chip.

[0095] In each of the above implementations, the external input signal may be an external input power signal.

[0096] In the above-mentioned various embodiments, the fuse element 201 is formed of a metal material.

[0097] In each of the above-mentioned embodiments, the fuse element 201 is a resistor device.

[0098] In the above-mentioned various embodiments, the PN junction element 202 is preferably a diode, a transistor, a MOS transistor and / or a combination thereof.

[0099] Exemplarily, the fuse element is a metal wire, and the PN junction-containing element is a diode.

[0100] According to one embodiment of the present disclosure, Figures 1 to 8 As shown, the current and / or voltage overload protection device 200 includes a protection component, and the protection component includes a fuse element 201 and a PN junction element.

[0101] According to another embodiment of the present disclosure, the number of protection components of the current and / or voltage overload protection device 200 is two or more than three, and the two or more protection components form a parallel structure between the signal receiving terminal 302 of the protection target device 300 and the power supply terminal (VDD) or the ground terminal of the protection target device 300, such as Fig. 9 and Fig.10 shown.

[0102] According to a preferred embodiment of the present disclosure, Fig.10 As shown, each protection component of the current and / or voltage overload protection device 200 includes two fuse elements 201 and a PN junction element 202 connected in series with the two fuse elements 201 , and the PN junction element 202 is arranged between the two fuse elements 201 .

[0103] According to a preferred embodiment of the present disclosure, the protection target device 300 determines whether the corresponding fuse element is blown based on the voltage monitored by the voltage monitoring module 102 .

[0104] An integrated circuit device 1000 according to an embodiment of the present disclosure includes:

[0105] at least two current and / or voltage overload protection devices 200;

[0106] At least two monitoring devices 100 of any one of the above items, each monitoring device 100 monitors a current and / or voltage overload protection device 200; and

[0107] at least one integrated circuit chip;

[0108] Among them, the current and / or voltage overload protection device 200, the monitoring device 100 and the integrated circuit chip are formed on a common substrate, at least one current and / or voltage overload protection device 200 is arranged between the power supply end of the integrated circuit chip and the signal receiving end of the integrated circuit chip, and at least another current and / or voltage overload protection device 200 is arranged between the ground end of the integrated circuit chip and the signal receiving end of the integrated circuit chip.

[0109] like Figures 1 to 8 In the shown integrated circuit device 1000 , the number of the current and / or voltage overload protection devices 200 is two, the number of the monitoring devices 100 is two, and the number of the integrated circuit chip is one.

[0110] In the above implementation manner, the chip function of the integrated circuit chip is not particularly limited.

[0111] An integrated circuit device having the current and / or voltage overload protection device 200 and the monitoring device 100 in the above-mentioned embodiment can realize ESD / EOS protection for the integrated circuit chip, and can monitor the state of the current and / or voltage overload protection device 200. By monitoring the state of the current and / or voltage overload protection device 200, it is possible to judge the environment in which the integrated circuit device / integrated circuit chip / electronic device is located, and whether it is necessary to replace the fuse element and / or the PN junction element in the current and / or voltage overload protection device 200, etc.

[0112] An electronic device having the integrated circuit device of the above-described embodiment may be a mobile phone, a computer, a car power system, and the like.

[0113] A battery protection system according to one embodiment of the present disclosure includes: at least one current and / or voltage overload protection device 200, which protects the battery assembly from overload; and at least one monitoring device 100 of any one of the above embodiments, each monitoring device 100 monitors a current and / or voltage overload protection device 200.

[0114] A battery system according to an embodiment of the present disclosure includes: a battery assembly; and the battery protection system of the above embodiment.

[0115] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments / methods or examples described in this specification and the features of the different embodiments / methods or examples, unless they are contradictory.

[0116] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0117] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A monitoring device, characterized in that: include: At least one overload number monitoring module, the overload number monitoring module includes a comparator and a counter, the first input end of the comparator receives the voltage signal between the fuse element of the current and voltage overload protection device and the PN junction element, the second input end of the comparator receives the voltage reference signal, the output end of the comparator is connected to the counter, and the counter counts the event that the voltage signal between the fuse element of the current and voltage overload protection device and the PN junction element is greater than the voltage reference signal as the overload number; At least one voltage monitoring module, the voltage monitoring module collects the voltage signal between the fuse element and the PN junction element of the current and voltage overload protection device in real time to monitor the voltage between the fuse element and the PN junction element; at least one current monitoring module, the current monitoring module comprising a voltage integrating amplifier, the current monitoring module obtaining an average value of the discharge current during the current and voltage overload period based at least on an integration time of the voltage integrating amplifier, an integrated voltage within the integration time, and a resistance value of the fuse element; as well as at least one resistance measurement module, the resistance measurement module obtains the resistance of the fuse element based on at least a reference current and a voltage drop of the fuse element, the resistance measurement module comprises a reference current providing unit, an analog-to-digital converter and a low-pass filter, the reference current providing unit provides a reference current flowing through the fuse element to obtain the voltage drop of the fuse element, the analog-to-digital converter performs analog-to-digital conversion on the voltage drop, the low-pass filter performs low-pass filtering on the voltage drop after the analog-to-digital conversion, and the resistance measurement module obtains the resistance of the fuse element in real time based on at least the reference current and the voltage drop of the fuse element after the low-pass filtering; The overload times monitoring module further includes a low-pass filter. The low-pass filter of the overload times monitoring module performs low-pass filtering on the signal output by the comparator, and the counter counts the signal after the low-pass filtering.

2. The monitoring device according to claim 1, characterized in that: The current monitoring module also includes an analog-to-digital converter and a low-pass filter. The analog-to-digital converter of the analog-to-digital converter performs analog-to-digital conversion on the integrated voltage output by the voltage integrating amplifier, and the low-pass filter of the analog-to-digital converter performs low-pass filtering on the integrated voltage after the analog-to-digital conversion. The current monitoring module obtains the average value of the discharge current during the current and voltage overload period based at least on the integration time of the voltage integrating amplifier, the integrated voltage after low-pass filtering within the integration time, and the resistance value of the fuse element.

3. The monitoring device according to claim 1, characterized in that: The voltage monitoring module includes an analog-to-digital converter and a low-pass filter connected to the analog-to-digital converter of the voltage monitoring module. The analog-to-digital converter of the voltage monitoring module performs analog-to-digital conversion on the collected voltage signal between the fuse element and the PN junction element of the current and voltage overload protection device, and outputs a digital signal. The low-pass filter of the voltage monitoring module performs low-pass filtering on the digital signal output by the analog-to-digital converter of the voltage monitoring module to monitor the voltage between the fuse element and the PN junction element.

4. The monitoring device according to claim 1, characterized in that: The current and voltage overload protection device comprises: at least one protection component; The protection component includes at least one fuse element and at least one PN junction element connected in series with the fuse element; When the current is overloaded, the fuse element can be fused to achieve current overload protection, and when the voltage is overloaded, the PN junction element can be broken down to achieve voltage overload protection.

5. The monitoring device according to claim 4, characterized in that: The first end of the current and voltage overload protection device is connected to the signal receiving end of the protection target device, and the second end of the current and voltage overload protection device is connected to the power supply end or the ground end of the protection target device.

6. The monitoring device according to claim 5, characterized in that: The signal receiving end of the protection target device is used to receive an external input signal.

7. The monitoring device according to claim 5, characterized in that: The protection target device is an integrated circuit chip.

8. The monitoring device according to claim 6, characterized in that: The external input signal is an external input power signal.

9. The monitoring device according to claim 5, characterized in that: The number of the protection components is two or more than three, and the two or more protection components form a parallel structure between the signal receiving end of the protection target device and the power supply end or the ground end of the protection target device.

10. The monitoring device according to claim 1, characterized in that: The fuse element is formed of a metal material.

11. The monitoring device according to claim 1, characterized in that: The PN junction element is a diode, a triode, a MOS tube or a combination thereof.

12. The monitoring device according to claim 4, characterized in that: The protection component includes two fuse elements and a PN junction element connected in series with the two fuse elements, and the PN junction element is arranged between the two fuse elements.

13. The monitoring device according to claim 1, characterized in that: The fuse element is a resistor device.

14. The monitoring device according to claim 5, characterized in that: The protection target device determines whether a corresponding fuse element is blown based on the voltage monitored by the voltage monitoring module.

15. An integrated circuit device, characterized in that: include: At least two current and voltage overload protection devices; At least two monitoring devices according to any one of claims 1 to 14, each monitoring device monitoring a current and voltage overload protection device; as well as at least one integrated circuit chip; In which, the current and voltage overload protection device, the monitoring device and the integrated circuit chip are formed on a common substrate, at least one of the current and voltage overload protection devices is arranged between the power supply end of the integrated circuit chip and the signal receiving end of the integrated circuit chip, and at least another current and voltage overload protection device is arranged between the ground end of the integrated circuit chip and the signal receiving end of the integrated circuit chip.

16. An electronic device, characterized in that: An integrated circuit device comprising the invention as claimed in claim 15.

17. A battery protection system, characterized in that: include: At least one current and voltage overload protection device, which protects the battery assembly from overload; as well as At least one monitoring device according to any one of claims 1 to 14, each monitoring device monitoring a current and voltage overload protection device.

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