Device testing apparatus with a small pitch

Abstract

A device testing apparatus with a small pitch, comprising a main body; a loading part provided on one side of the main body; a loading sorter provided on one side of the loading part; a vacuum chuck that forms vacuum holes respectively at the placement locations of the devices adsorbed and moved by the loading sorter and moves along a track; a loading area on the vacuum chuck; a device alignment part that is movably provided above the loading area along the X-Y-θ axes, confirms the positions of the devices adsorbed on the vacuum chuck, transmits coordinate values to the control unit, and further aligns the devices; a test bench where the devices adsorbed on the vacuum chuck move along the track in an aligned state and standby; a testing machine that moves the vacuum chuck located at the test bench and electrically contacts the bumps of each device; an unloading area in the testing machine; and an unloading sorter provided on one side of the unloading area, which adsorbs the tested devices from the vacuum chuck and sorts and unloads them as qualified and unqualified products onto the trays of the unloading part.

Description

Technical Field

[0001] The present invention relates to a device testing apparatus for singulating multiple stacked semiconductor chips. More specifically, after manufacturing a device such as a high-bandwidth memory (HBM) with a narrow pitch and numerous signal buses, a device testing apparatus with a fine pitch for accurately aligning and performing performance tests. Background Art

[0002] Currently, in the electronics industry, it has become a trend to manufacture lightweight, miniaturized, high-speed, multi-functional, and high-performance products at low cost. Moreover, to improve the performance of integrated circuits, three-dimensional structures such as multi-chip stacked packages have been developed.

[0003] In such multi-chip stacked packages, a high-bandwidth memory (HBM) is a high-performance (RAM) interface for three-dimensional stacked dynamic random access memories (DRAMs).

[0004] The high-bandwidth memory is formed by stacking multiple chips in sequence and then cutting them into individual units.

[0005] Figure 1 It is a bottom view showing ordinary bumps of a high-bandwidth memory. In the high-bandwidth memory 10, the pitch (p) of countless bumps 11 is about 125 - 170 μm, which is very narrow. However, during the cutting process, they are cut and separated, so there is a problem that the distance (s) between the center of the bumps arranged at the edge and the edge frame cannot be constant.

[0006] Therefore, in the state where a high-bandwidth memory with such a structure is manufactured, for bumps with a small size (outer diameter) and a narrow pitch, they cannot be accurately aligned with the terminals of the tester, so they are actually shipped without being tested.

[0007] Moreover, when installing these defective high-bandwidth memories to form a graphics processing unit (GPU), it seriously causes problems with the overall quality of the graphics processing unit.

[0008] Prior Art Documents

[0009] (Patent Document 0001) Korean Registered Patent Gazette 10 - 1149759 (registered on May 18, 2012);

[0010] (Patent Document 0002) Korean Registered Patent Gazette 10 - 1464990 (registered on November 19, 2014). Summary of the Invention

[0011] Technical Problem

[0012] The present invention is created to solve the above problems. Its purpose is to accurately align the position of a device such as a high-bandwidth memory after manufacturing a device with small bump sizes (outer diameters) and narrow pitches, and to make electrical contact with various types of test machines to perform performance testing.

[0013] Another object of the present invention is to accurately perform alignment of the device and then make electrical contact with the terminals of the test machine even if the distance between the center of the bump located at the edge and the edge frame is not constant.

[0014] Yet another object of the present invention is to symmetrically arrange a device alignment unit and a load / unload sorter on both sides of the test machine to reduce the cycle time that occurs during device testing.

[0015] Technical Solution

[0016] To achieve the above object, the present invention provides a device testing apparatus with a small pitch. According to an embodiment of the present invention, it includes: a main body; a loading unit provided on one side of the main body for a device to be tested to standby; a loading sorter provided on one side of the loading unit for successively adsorbing the device to be tested and placing it on a vacuum chuck; a vacuum chuck that has vacuum holes formed at the placement locations of the devices adsorbed and moved by the loading sorter and moves along a track; a loading area where the device to be tested is placed on the vacuum chuck; a device alignment unit that is movably provided above the loading area along the X-Y-θ axes, confirms the position of the device adsorbed on the vacuum chuck, transmits coordinate values to a control unit, and then aligns the device; a test table where the device adsorbed on the vacuum chuck moves in an aligned state along the track and stands by; a test machine located at the vacuum chuck that moves in the test table, makes electrical contact with the bumps of each device, and then tests the performance of the device within a set time; an unloading area where the vacuum chuck that has completed device testing in the test machine is located; and an unloading sorter provided on one side of the unloading area for adsorbing the tested device from the vacuum chuck and sorting it into qualified and unqualified products and unloading it to a tray in the unloading unit.

[0017] Advantageous Effects

[0018] Compared with the prior art, the present invention has the following various advantageous effects:

[0019] First, after loading the device to be tested into the loading unit, even if the distance between the center of the bump located at the edge and the edge frame is not constant, the device alignment unit automatically and accurately aligns the device, making the electrical contact between the bumps of the device and the terminals of the test machine possible. Therefore, it becomes possible to perform performance testing on devices with a small pitch.

[0020] Second, regardless of the type of the testing machine (top-mounted type, horizontal type, vertical type), the bumps of the device moved to the test bench are electrically contacted with the terminals of the testing machine, thereby implementing the device performance test.

[0021] Third, before loading the device to be aligned on the vacuum chuck, the temperature of the vacuum chuck is maintained at room temperature according to the test conditions, or heated or cooled, and the device is loaded in a state of expansion or contraction according to the expansion coefficient of the vacuum chuck, thereby reducing the alignment tolerance.

[0022] Fourth, after the device to be aligned is loaded on the vacuum chuck, the alignment state of the device to be aligned is reconfirmed by the first alignment vision, thereby further improving the reliability of alignment.

[0023] Fifth, with the vacuum chuck with the device alignment completed moved to the side of the testing machine, after confirming the X and Y values of the vacuum chuck through the second alignment vision and transmitting them to the control unit, the vacuum chuck posture correction device accurately corrects the posture of the vacuum chuck, thereby preventing poor contact.

[0024] Sixth, when the device alignment unit and the loading / unloading sorter are symmetrically arranged on both sides of the main body, the cycle period occurring during the device test can be reduced. Description of the Drawings

[0025] Figure 1 is a bottom view showing the bumps of a general high-bandwidth memory;

[0026] Figure 2 is a perspective view showing an embodiment of the present invention;

[0027] Figure 3 is Figure 2 a plan view of

[0028] Figure 4 is a perspective view showing the setting state of the vacuum chuck in the present invention;

[0029] Figure 5 is Figure 4 a bottom perspective view of

[0030] Figure 6 is a perspective view showing the device alignment unit in the present invention;

[0031] Figure 7 is Figure 6 a side view of

[0032] Figure 8a is a plan view of the state where the alignment jig of the present invention wraps the device;

[0033] Figure 8bIt is a state diagram in which both sides of the device are connected to the inner peripheral surface of the alignment jig of the present invention to push the device;

[0034] Figure 9a and Figure 9b It is a front view of the state in which the vacuum chuck moves along the track;

[0035] Figure 10 It is a bottom perspective view of the state in which a rotator is provided on the vacuum chuck of the present invention;

[0036] Figure 11a and Figure 11b It is a front view and a side view showing that the testing machine in the present invention is horizontal and vertical. Detailed Description of the Invention

[0037] Next, the technical solutions in the embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Those of ordinary skill in the art can implement in various forms, but all other embodiments obtained without creative efforts fall within the scope of protection of the present invention. It should be noted that the illustrations on the drawings are simplified and not drawn to scale. The relative dimensions and ratios in the drawings are exaggerated or reduced compared to their actual sizes for clarity and convenience in the drawings. Any dimensions are only for illustration purposes and are not limiting. The same reference signs are used for the same structures, elements, or components shown in more than one drawing to highlight their similar features.

[0038] Figure 2 It is a perspective view showing an embodiment of the present invention, Figure 3 is Figure 2The plan view of the present invention comprises: a main body 20; a loading part 40 provided on one side of the main body 20 for putting the device 30 to be tested on standby; a loading sorter 60 provided on one side of the loading part 40 for successively adsorbing the device 30 to be tested and placing it on the vacuum chuck 50; a vacuum chuck 50 which is provided with vacuum holes 51 respectively at the placement locations of the device 30 adsorbed and moved by the loading sorter 60 and moves along the track 21; a loading area 70 on the vacuum chuck 50 where the device 30 to be tested is placed; a device alignment part 80 which is movably provided above the loading area 70 along the X-Y-θ axes, confirms the position of the device 30 adsorbed on the vacuum chuck 50, transmits the coordinate values to the control part, and further aligns the device 30; a test bench 90 where the device 30 adsorbed on the vacuum chuck 50 moves along the track 21 in an aligned state and waits; a tester 100 which is located at the vacuum chuck 50 of the test bench 90, electrically contacts the bumps of each device 30, and further tests the device performance within a set time; an unloading area 110 where the vacuum chuck 50 of the tester 100 completes the test of the device 30; and an unloading sorter 140 provided on one side of the unloading area 110 for adsorbing the tested device 30 from the vacuum chuck 50 and sorting it into qualified products and unqualified products and unloading it to the tray 130 of the unloading part 120.

[0039] As illustrated in an embodiment of the present invention Figure 2 and Figure 3 In the present invention, the loading sorter 60 is arranged to be movable along the X-Y axis 61, the vacuum chuck 50 is arranged to be movable along the track 21. After the vacuum chuck 50 is located in the loading area 70, the loading sorter 60 moves along the X-Y axis 61 to adsorb the device 30 located in the loading part 40, and then successively places it into each vacuum hole 51 of the vacuum chuck 50.

[0040] However, according to requirements, even if the loading sorter 60 is arranged to be movable along the Y axis and the vacuum chuck 50 is arranged to be movable step by step along the X axis (the distance between the centers of the vacuum holes), it is obvious that the loading sorter 60 can still successively load the devices 30 into each vacuum hole 51 of the vacuum chuck 50.

[0041] Figure 4 is a perspective view showing the setting state of the vacuum chuck in the present invention, Figure 5 is showing Figure 4 The bottom perspective view of the present invention. A plurality of vacuum holes 51 are provided on the vacuum chuck 50 moving along the track 21 so that the device 30 can be kept in an adsorbed state by vacuum pressure after being placed by the loading sorter 60. A Z-axis motor 52 for moving the vacuum chuck 50 from the test bench 90 to the side of the tester 100 is provided at the lower part of the vacuum chuck 50.

[0042] The vacuum hole 51 is configured such that it will not move before aligning the device 30 that moves through the loading sorter 60 under the action of a primary vacuum pressure (about 5 - 50 mmHg).

[0043] In this state, when the vacuum pressure applied to the vacuum hole 51 is below 5 mmHg, even if the device 30 is aligned by the device alignment unit 80, the position of the device 30 may change due to vibration or other reasons. On the contrary, when it is above 50 mmHg, due to the excessive vacuum pressure, when the device alignment unit 80 corrects and aligns the position of the device 30, the device 30 may not move to the desired position.

[0044] For the vacuum hole 51, a vacuum pressure of about 2 - 50 mmHg can be continuously applied. However, more preferably, in the state where the alignment of the device 30 is completed by the device alignment unit 80, before moving the vacuum chuck 50 toward the tester 100, the pressure is increased so that a secondary vacuum pressure of about 50 - 100 mmHg is applied.

[0045] The purpose is to fundamentally eliminate the phenomenon of the device position changing during the movement of the vacuum chuck 50 or when the bumps of the device 30 contact the terminals of the tester 100 and the test is carried out.

[0046] As described above, the primary vacuum pressure applied to the vacuum hole 51 is applied sequentially before the device 30 is placed, or divided into certain regions. For example, a flow path is set with every ten as a region, so that the vacuum pressure is simultaneously applied to the partitioned vacuum holes.

[0047] Moreover, a heater or a cooling pipe (not shown) is installed in the vacuum chuck 50. Before loading the device on the vacuum chuck 50, according to the test conditions of the device 30, it is maintained at room temperature, or heated to about 50 - 170 °C, or cooled to 0 - -55 °C.

[0048] The purpose is that even if the material with the smallest coefficient of thermal expansion (for example, ceramics, etc.) is used as the vacuum chuck 50, assuming the size of the vacuum chuck 50 is 300×300 mm, with heating and cooling, it expands or contracts within a range of about 0.3 mm. Therefore, before the loading sorter 60 loads the device 30 onto the vacuum chuck 50, the temperature of the vacuum chuck 50 is adjusted according to the test conditions to reduce the error caused by the expansion or contraction of the vacuum chuck 50.

[0049] Figure 6 It is a perspective view showing the device alignment unit in the present invention. Figure 7 is Figure 6Side view thereof. The device alignment part 80 includes: an X-axis rail 81 provided on the main body 20; a Y-axis rail 82 provided on the X-axis rail 81 and moving along the X-axis rail; a movable body 83 provided on the Y-axis rail 82; an alignment jig block 85 provided on the lifting block 84 of the movable body 83 and having a vertically penetrating through hole 85a; an alignment jig 86 provided at the lower part of the alignment jig block 85 to push the device 30 adsorbed on the vacuum chuck 50 to correct the position; a θ-axis correction motor 87 provided on the alignment jig block 85 to correct the θ value of the alignment jig 86; and a first alignment vision 88 provided on the movable body 83 to confirm the position of the device 30 adsorbed on the vacuum chuck 50 through the through hole 85a of the alignment jig block 85 and then transmit the coordinate value to the control unit. After the position of the device 30 adsorbed on the vacuum chuck 50 is confirmed by the first alignment vision 88 and transmitted to the control unit (not shown), the alignment jig 86 descends according to the coordinate value of the device 30, causing the device 30 to move in the X-Y-θ directions and then be aligned.

[0050] The alignment jig 86 is as Figure 8a shown, having an opening 86a larger than the device 30 so as to keep the device 30 in a state of being received by the opening 86a of the alignment jig 86. When the alignment jig 86 moves according to the coordinate value of the device 30, as Figure 8b shown, the inner surface of the opening 86a is connected to move along two surfaces of the device 30, enabling the device 30 to be aligned.

[0051] In an embodiment of the present invention, coordinate identification marks 53 are marked on the vacuum chuck 50 as Figure 4 shown, and on the testing machine 100, as Figure 9a and Figure 11a shown, a second alignment vision 101 for confirming the position of the coordinate identification marks 53 is provided. At the lower part of the vacuum chuck 50, as Figure 5 shown, a vacuum chuck posture correction device 150 is provided.

[0052] Due to reasons such as machining tolerances or assembly tolerances of the accessories, when the vacuum chuck 50 moves toward the testing machine 100 side, the X and Y values may change.

[0053] Therefore, before moving the vacuum chuck 50 that has moved to the test table 90 toward the testing machine 100 side, as Figure 9a shown, the second alignment visions 101 provided on both sides of the testing machine 100 confirm the X-Y values of the coordinate identification marks 53 of the vacuum chuck 50 and then transmit them to the control unit, and then the vacuum chuck posture correction tool 140 corrects the posture of the vacuum chuck 50.

[0054] If the X and Y values of the vacuum chuck 50 change and the vacuum chuck 50 is moved toward the testing machine 100 such that the bumps of the device 30 contact the terminals of the testing machine 100, even if the device 30 is accurately aligned in the device alignment unit 80, a serious defect may occur where the bumps of the device 30 fail to contact the terminals of the testing machine 100.

[0055] Furthermore, some of the bumps can contact the terminals of the testing machine 100, but since the X and Y values of the vacuum chuck 50 have changed, the remaining bumps fail to contact the terminals of the testing machine 100, resulting in a serious error of misjudging a qualified device 30 as unqualified.

[0056] Regarding the vacuum chuck posture correction device 150, in one embodiment of the present invention, as Figure 5 shown, a Y-axis correction motor 151 for correcting the Y-axis value is provided on the bottom surface of the vacuum chuck 50, and an X-axis correction motor 152 for correcting the X-axis value is provided on the bottom surface of the Y-axis correction motor 151. The X-axis correction motor 152 is fixedly provided on a slider 153 that moves along the rail 21.

[0057] In an example of one embodiment of the present invention, a Z-axis motor 52 is provided below the vacuum chuck 50, and a vacuum chuck posture correction device 150 is provided below it. However, it is also possible to provide a vacuum chuck posture correction device 150 below the vacuum chuck 50 and a Z-axis motor 52 below it, so it is not limited thereto.

[0058] In one embodiment of the present invention, the testing machine 100 is shown as a top-mounted type. However, according to requirements, as Figure 11a and Figure 11b shown, the testing machine 100 can also be set up as a horizontal type or a vertical type for use.

[0059] Furthermore, when the testing machine 100 is of the horizontal type or the vertical type, a rotator 54 that rotates the vacuum chuck 50 by 180° or 90° should be provided in a state where the device 30 is aligned, after the vacuum chuck 50 moves directly below the testing machine 100.

[0060] In this state, second alignment visions 101 are provided on both sides of the testing machine 100 to confirm the posture of the vacuum chuck 50 rotated by 180° or 90° by the rotator 54 before the device 30 aligned on the vacuum chuck 50 moves to the side of the testing machine 100, so that the vacuum chuck posture correction device 150 corrects the posture of the vacuum chuck 50.

[0061] The functions of the present invention will be described below.

[0062] First, before loading the device 30 onto the vacuum chuck 50, maintain room temperature according to the test conditions of the device 30, or heat it to about 50 - 170 °C, or cool it to 0 - -55 °C.

[0063] As described above, with the vacuum chuck 50 maintained at a temperature conforming to the test conditions of the device 30, after the loading sorter 60 adsorbs one device 30 from the tray 130 located in the loading section 40 and places it in the vacuum hole 51 of the vacuum chuck 50 located in the loading area 70, it is adsorbed with a primary vacuum pressure that allows for slight movement through a vacuum device (not shown) connected to the vacuum hole 51.

[0064] The device is loaded into a certain vacuum hole 51 formed on the vacuum chuck 50 and then adsorbed by the primary vacuum pressure that allows for slight movement of the device. After that, the movable body 83 of the device alignment unit 80 moves to the position of the device 30 adsorbed on the vacuum chuck 50.

[0065] After the movable body 83 moves to the position of the device 30 adsorbed on the vacuum chuck 50, the first alignment vision 88 provided on the movable body 83 confirms the position of the device 30 through the through - hole 85a formed on the alignment jig block 85 and the opening 86a of the alignment jig 86, and then transmits the coordinate values to the control unit (not shown).

[0066] At this time, after the movable body 83 moves to the side of the device 30 to be corrected, the first alignment vision 88 Figure 1 identifies the mark 32 marked on the bottom surface of the device 30 shown in

[0067] As described above, when the first alignment vision 88 provided on the upper part of the movable body 83 identifies the position of the device 30 and transmits it to the control unit, since the alignment jig 86 is provided with an opening 86a, it becomes possible for the first alignment vision 88 to identify the position of the device 30 through the through - hole 85a and the opening 86a.

[0068] After the first alignment vision 88 provided on the movable body 83 transmits the coordinate values of the device 30 to the control unit, the movable body 83 moves along the X and Y - axis rails 81 and 82 according to the coordinate values of the device 30 adsorbed in the vacuum hole 51. While the lifting block 84 descends, the alignment jig block 85 rotates by a set value under the drive of the θ - axis correction motor 87, and thus the position of the alignment jig 86 is corrected.

[0069] The alignment jig block 85 provided with the alignment jig 86 is such that the drive of the θ-axis correction motor 87 is engaged with a worm and a worm gear (not shown), and thus rotates by a set value as the θ-axis correction motor 87 is driven.

[0070] In this state, the movable body 83 descends. After the opening 86a of the alignment jig 86 encloses the device 30, the movable body 83 moves along the X- and Y-axis rails 81 and 82. Therefore, through the control unit, the device 30 is pushed by the alignment jig 86 by a set value, and the position is further corrected for alignment.

[0071] As described above, when the alignment jig 86 descends toward the device 30 side through the movable body 83 to align the device 30, it is further preferable that the position of the device 30 is corrected in a state where the alignment jig 86 is separated from the upper surface of the vacuum chuck 50.

[0072] Because when moving while the alignment jig 86 is connected to the upper surface of the vacuum chuck 50 and aligning the position of the device 30, the generation of particles due to friction can be prevented.

[0073] Due to the above-described operation, after the alignment jig 86 pushes and corrects the device 30 adsorbed on the vacuum chuck 50 and completes the alignment, before the movable body 83 returns to the initial position, through the through hole 85a of the alignment jig block 85 and the opening 86a of the alignment jig 86, the first alignment vision 88 re-confirms the position of the aligned device 30 and transmits it to the control unit. If the alignment is correct, after separating the inner surface of the opening 86a of the alignment jig 86 from the device 30, the movable body 83 rises back to the initial position. If the alignment is not correct, the re-alignment operation of the device 30 is performed with the above-described operation.

[0074] The above-described operation is that the loading sorter 60 adsorbs the device 30, positions the device behind each vacuum hole 51 and then adsorbs it, and this is carried out uniformly, thereby aligning the device 30 adsorbed on the vacuum chuck 50.

[0075] Through the above operation, after correcting and aligning the positions of all the devices 30 adsorbed on all the vacuum holes 51 of the vacuum chuck 50, when moving the vacuum chuck 50 toward the tester 100 side, it is further preferable to adsorb the device with a secondary vacuum pressure (about 50 - 100 mmHg) to prevent the position of the device 30 from changing due to vibration or the like.

[0076] As described above, after correcting and aligning the positions of the multiple devices 30 loaded in the vacuum holes 51 of the vacuum chuck 50, the vacuum chuck 50 on which the multiple devices 30 are adsorbed moves along the rail 21 to the contact point of the tester 100, i.e., the test stage 90, as shown in FIG. 9.

[0077] After the vacuum chuck 50 moves along the rail 21 to the contact point of the testing machine 100, i.e., the test bench 90, the second alignment vision 101 provided on both sides of the testing machine 100 verifies the coordinate identification marks 53 marked on both sides of the vacuum chuck 50, and then determines the posture of the vacuum chuck 50.

[0078] Then, due to reasons such as machining tolerances and assembly tolerances, when the vacuum chuck 50 moves directly below the testing machine 100, i.e., to the test bench 90, although its position is not accurate, the posture of the vacuum chuck 50 can still be corrected by the vacuum chuck posture correction device 150.

[0079] Furthermore, after the second alignment vision 101 recognizes the coordinate identification marks 53 marked on the vacuum chuck 50 and transmits them to the control unit, when the X and Y values calculated by the control unit based on the locations of the coordinate identification marks 53 are inconsistent, as Figure 4 and Figure 5 shown, the X and Y axis correction motors 151 and 152 are driven to correct the posture of the vacuum chuck 50.

[0080] If the X and Y values of the vacuum chuck 50 change due to machining tolerances of components and assembly tolerances, etc., and it moves toward the testing machine 100 side, after the bumps of the device 30 contact the terminals of the testing machine 100, even if the device 30 is accurately aligned by the device alignment unit 80, there is still a serious defect that the bumps of the device 30 cannot contact the terminals of the testing machine 100.

[0081] Because some of the bumps contact the terminals of the testing machine 100, but the X and Y values of the vacuum chuck 50 have changed, and the remaining bumps cannot contact the terminals of the testing machine 100, a serious error occurs in which a qualified device 30 is judged as unqualified.

[0082] Therefore, in the state where the posture of the vacuum chuck 50 is corrected by the vacuum chuck posture correction device 150, when the Z-axis motor 52 provided below the vacuum chuck 50 is driven, as Figure 9b shown, the vacuum chuck 50 rises toward the testing machine 100 side. Therefore, the bumps of the device 30 adsorbed on the vacuum chuck 50 contact the terminals of the testing machine 100, and then the test of the device 30 is carried out for the set time.

[0083] After testing the performance of the device 30 adsorbed on the vacuum chuck 50, the vacuum chuck 50 descends, and then moves along the rail 21 toward the unloading area 110, i.e., the right side in the drawing. While releasing the vacuum pressure acting on the vacuum chuck 50, the unloading sorter 140 sequentially adsorbs the devices 30, and divides them into qualified and unqualified devices according to the test results, and loads them onto the trays located in the unloading section 120. Then, the qualified products leave the factory, and the unqualified products are retested or discarded.

[0084] However, the testing machine 100 is not a top-mounted type, but as Figure 11a shown, it is a horizontal type. When the vacuum chuck 50 reaches the test bench 90 and the rotator 54 rotates the vacuum chuck 50 by 180°, for the posture of the rotated vacuum chuck 50, the second alignment vision 101 provided on both sides of the testing machine 100 confirms the coordinate identification mark 53 and then transmits it to the control unit. After correcting the posture of the vacuum chuck 50, the Z-axis motor 52 moves the vacuum chuck 50 toward the testing machine 100 side, and then the test of the device 30 is implemented.

[0085] On the other hand, if the testing machine 100 is Figure 11b shown as a vertical type, when the vacuum chuck 50 reaches the test bench 90 and the vacuum chuck 50 is rotated by 90° by the rotator, for the posture of the rotated vacuum chuck 50, the second alignment vision 101 provided on both sides of the testing machine 100 confirms the coordinate identification mark 53 and then transmits it to the control unit. Then, after correcting the posture of the vacuum chuck 50, the Z-axis motor 52 moves the vacuum chuck 50 toward the testing machine 100 side, and then the test of the device 30 is achieved.

[0086] In summary, the process is as follows: a loading area 70 is set on one side of the track 21 (the left side in the drawing), and an unloading area 110 is set on the other side (the right side in the drawing). A loading sorter 60 and a device alignment unit 80 are set above the loading area 70, and an unloading sorter 140 is set in the unloading area 110. After the device alignment unit 80 aligns the position of the device 30 placed on the vacuum chuck 50, the vacuum chuck 50 moves along the track 21 toward the lower part of the testing machine 100. Then, after the electrical characteristics test of the device 30 is performed according to the set time, the vacuum chuck 50 reaches the unloading area 110. Then, the unloading sorter 140 divides the tested device 30 into qualified products and unqualified products according to the test results, and then unloads them onto the empty trays of the unloading unit 120.

[0087] According to the above configuration, when the device 30 is placed and adsorbed on the vacuum chuck 50 by the loading sorter 60, after confirming the coordinate value of the device, the time taken for alignment by the device alignment unit 80 is relatively long. On the contrary, the time for the unloading sorter 140 to unload the tested device is short, resulting in a decrease in the operating rate of high-end equipment.

[0088] Therefore, in order to maximize the operating rate of high-end equipment, further preferably, the device alignment unit 80 and the loading / unloading sorter 160 with the functions of loading and unloading devices are symmetrically arranged on both sides of the main body 20, so that the loading area 70 and the unloading area 110 simultaneously have loading / unloading functions.

[0089] Furthermore, on both sides of the testing machine 100 disposed at the center of the main body 20, there are loading / unloading areas 170 that simultaneously function as a loading area 70 and an unloading area 110 to load or unload the device 30 onto or from the vacuum chuck 50. Above each of the loading / unloading areas 170, there is a loading / unloading sorter 160 that adsorbs the device 30 by the loading unit 40 and loads it onto the upper surface of the vacuum chuck 50, or unloads the tested device 30 from the vacuum chuck 50 and unloads it to the unloading unit 120. Above each of the loading / unloading areas 170, there is a device alignment unit 80 that is movably arranged along the X-Y-θ axes, confirms the position of the device 30 adsorbed on the vacuum chuck 50, and then transmits the coordinate values to a control unit (not shown), and further aligns the device 30.

[0090] Subsequently, after the loading / unloading sorter adsorbs the device 30 and places it on the vacuum chuck 50 in the loading / unloading area 170 on one side (the left side in the drawing), it aligns the position through the device alignment unit 80. Then, the vacuum chuck 50 moves straight down to the testing machine 100 along the track 21, and further conducts the test. During this period, another loading / unloading sorter 160 adsorbs the device 30 and places it on the vacuum chuck 50 in the loading / unloading area 170 on the other side (the right side in the drawing), and then aligns the position of the device 30 through the device alignment unit 80.

[0091] As described above, while the device 30 is successively placed on the upper surface of the vacuum chuck 50 in the loading / unloading area 170 on the other side for alignment, the vacuum chuck 50 that initially moves to the testing machine 100 side to complete the test of the device is moved to the loading / unloading area 170 on the left side in the drawing. Then, it is unloaded by the loading / unloading sorter 160 according to the test result, and at the same time, the vacuum chuck 50 on the right side in the drawing is moved to the testing machine 100 side to conduct the test, thereby maximizing the operation rate of the high-end equipment.

[0092] The embodiments of the present invention have been described above in conjunction with the accompanying drawings. However, it is obvious that those of ordinary skill in the art to which the present invention pertains can implement it in other specific forms without changing the technical solution or essential features.

[0093] Therefore, the above embodiments are only used to illustrate the technical solution of the present invention, rather than to limit it; those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent replacements, and these modifications or equivalent replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions described in the embodiments of the present invention. The protection scope of the present invention should be interpreted according to the scope of the following claims, and any changes or deformation forms within the same scope should fall within the scope of the claims of the present invention.

[0094] Symbolic Explanation

[0095] 20: Main body; 21: Track;

[0096] 30: Device; 32: Mark;

[0097] 40: Loading section; 50: Vacuum chuck;

[0098] 51: Vacuum hole; 52: Z-axis motor;

[0099] 53: Coordinate recognition mark; 54: Rotator;

[0100] 60: Loading sorter; 61: X, Y axes;

[0101] 70: Loading area; 80: Device alignment section;

[0102] 81: X-axis track; 82: Y-axis track;

[0103] 83: Movable body; 85: Alignment jig block;

[0104] 85a: Through hole; 86: Alignment jig;

[0105] 86a: Opening; 87: θ-axis calibration motor;

[0106] 88: First alignment vision; 90: Test bench;

[0107] 100: Testing machine; 101: Second alignment vision;

[0108] 110: Unloading area; 120: Unloading section;

[0109] 140: Unloading sorter; 150: Vacuum chuck posture correction device;

[0110] 151: Y-axis calibration motor; 152: X-axis calibration motor.

Claims

1. A device testing apparatus with a small pitch, characterized in that, Comprising: A main body (20); A loading part (40) provided on one side of the main body (20) for putting the device (30) to be tested on standby; a loading sorter (60) provided on one side of the loading part (40) for successively adsorbing the device (30) to be tested and placing it on the vacuum chuck (50); a vacuum chuck (50) having vacuum holes (51) formed respectively at the placement locations of the devices (30) adsorbed and moved by the loading sorter (60) and moving along the track (21); a loading area (70) where the device (30) to be tested is placed on the vacuum chuck (50); a device alignment part (80) movably provided along the X-Y-θ axes above the loading area (70) for confirming the position of the device (30) adsorbed on the vacuum chuck (50), transmitting coordinate values to the control part, and further aligning the device (30), the device alignment part (80) having a θ-axis correction motor (87); a test bench (90) where the device (30) adsorbed on the vacuum chuck (50) moves along the track (21) in an aligned state and waits; a testing machine (100) located at the vacuum chuck (50) of the test bench (90) for electrically contacting the bumps of each device (30) and testing the device performance within a set time; an unloading area (110) where the vacuum chuck (50) of the testing machine (100) is located after completing the test of the device (30); an unloading sorter (140) provided on one side of the unloading area (110) for adsorbing the tested device (30) from the vacuum chuck (50) and sorting it into qualified and unqualified products and unloading it onto the tray (130) of the unloading part (120).

2. The device testing apparatus for devices with fine pitches according to claim 1, wherein The device alignment part (80) comprises: an X-axis track (81) provided on the main body (20); a Y-axis track (82) provided on the X-axis track (81) and moving along the X-axis track; a movable body (83) provided on the Y-axis track (82); an alignment jig block (85) provided on the lifting block (84) of the movable body (83) and having a vertically penetrating through hole (85a); an alignment jig (86) provided at the lower part of the alignment jig block (85) for pushing and correcting the position of the device (30) adsorbed on the vacuum chuck (50); the θ-axis correction motor (87) provided on the alignment jig block (85) for correcting the θ value of the alignment jig (86); a first alignment vision (88) provided on the movable body (83) for confirming the position of the device (30) adsorbed on the vacuum chuck (50) through the through hole (85a) of the alignment jig block (85) and then transmitting coordinate values to the control part; After the position of the device (30) adsorbed on the vacuum chuck (50) is confirmed by the first alignment vision (88) and transmitted to the control part, the alignment jig (86) descends according to the coordinate values of the device (30), so that the device (30) moves in the X-Y-θ directions for alignment.

3. The device testing apparatus with a small pitch according to claim 1, wherein a Z-axis motor (52) for raising the vacuum chuck (50) toward the testing machine (100) in the test bench (90) is disposed below the vacuum chuck (50), and a top-mounted testing machine (100) is disposed above the vacuum chuck (50). As the vacuum chuck (50) reaches the test bench (90), the Z-axis motor (52) raises the vacuum chuck (50) so that the device (30) adsorbed to the vacuum holes (51) is in electrical contact with the terminals of the testing machine (100).

4. The device testing apparatus with a small pitch according to claim 1, wherein a rotator (54) for rotating the vacuum chuck (50) by 180° and a Z-axis motor for lowering the vacuum chuck (50) toward the testing machine (100) in the test bench (90) are disposed below the vacuum chuck (50), and a horizontal testing machine (100) is disposed below the test bench (90). As the vacuum chuck (50) reaches the test bench (90), the rotator (54) rotates the vacuum chuck (50) by 180°, and then the Z-axis motor (52) moves the vacuum chuck (50) toward the testing machine (100) so that the device (30) adsorbed to the vacuum holes (51) is in electrical contact with the terminals of the testing machine (100).

5. The device testing apparatus with a small pitch according to claim 1, wherein a rotator (54) for rotating the vacuum chuck (50) by 90° and a Z-axis motor for horizontally moving the vacuum chuck (50) toward the testing machine (100) in the test bench (90) are disposed below the vacuum chuck (50), and a vertical testing machine (100) is disposed below the test bench (90). Further, as the vacuum chuck (50) reaches the test bench (90), the rotator (54) rotates the vacuum chuck (50) by 90°, and then the Z-axis motor moves the vacuum chuck (50) toward the testing machine (100), so that the device (30) adsorbed to the vacuum holes (51) is in electrical contact with the terminals of the testing machine (100).

6. The device testing apparatus with a small pitch according to any one of claims 3 to 5, wherein coordinate identification marks (53) are marked on the vacuum chuck (50), a second alignment vision (101) for confirming the position of the coordinate identification marks (53) is provided on the testing machine (100), and a vacuum chuck posture correction device (150) is provided below the vacuum chuck (50). Therefore, before the vacuum chuck (50) is moved toward the testing machine (100) on the test bench (90), the second alignment vision (101) confirms the X-Y values of the coordinate identification marks (53) of the vacuum chuck (50) and transmits them to the control unit, and then the vacuum chuck posture correction device (150) corrects the posture of the vacuum chuck (50).

7. The device testing apparatus with a small pitch according to claim 6, wherein The vacuum chuck posture correction device (150) is such that a Y-axis correction motor (151) for correcting the Y-axis value is provided on the bottom surface of the vacuum chuck (50), an X-axis correction motor (152) for correcting the X-axis value is provided on the bottom surface of the Y-axis correction motor (151), and the X-axis correction motor (152) is fixedly provided on a slider (153) that moves along a track (21).

8. The device for testing a device with a fine pitch according to claim 1, wherein a heater and a cooling pipe are provided inside the vacuum chuck (50).

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