A measuring and compiling integrated machine

Abstract

The application relates to a testing and coding integrated machine. The testing and coding integrated machine comprises a feeding assembly used for feeding and positioning ICs; a detection assembly arranged downstream of the feeding assembly and used for detecting the ICs after feeding and positioning; and a coding assembly arranged downstream of the detection assembly and used for coding processing the ICs after detection. The testing and coding integrated machine solves the problem that the ICs are mixed together after being detected and sorted by the sorting machine, which is not conducive to subsequent processing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit production equipment, in particular to a testing and taping integrated machine. BACKGROUND

[0002] With the continuous development and innovation of today's technology, the application and demand of integrated circuits (IC) are also increasing. Since ICs need to go through a series of precise manufacturing processes during production, they must undergo a series of tests before being sold to ensure product quality. The contents of the test include electrical performance test, visual inspection, etc. After all the tests are completed, the IC products that pass the test need to be taped before entering the market. After the existing sorting tester tests and sorts the ICs, the tested and sorted ICs are mixed together. In the subsequent IC application process, the ICs need to be positioned again for taping processing, resulting in low production efficiency. SUMMARY

[0003] Therefore, it is necessary to provide a testing and taping integrated machine to solve the technical problem of low production efficiency caused by mixing ICs together after testing and sorting by the existing sorting tester.

[0004] The testing and taping integrated machine provided by the present application comprises: a feeding assembly for positioning ICs; a detection assembly arranged downstream of the feeding assembly for detecting the positioned ICs; and a taping assembly arranged downstream of the detection assembly for taping the detected ICs.

[0005] In this way, the feeding assembly is used to position the ICs first, then the detection assembly is used to detect the positioned ICs, and finally the taping assembly is used to tape the detected ICs. In this way, the feeding and detection of the ICs can be directly performed by the feeding assembly and the detection assembly when the ICs are taped by the taping assembly. Therefore, it is not necessary to additionally arrange components for positioning and detecting the ICs, which greatly simplifies a series of processing procedures of the ICs and improves the production and installation efficiency of the ICs.

[0006] In another embodiment, the taping assembly comprises: a taping track connected with the output track of the detection assembly; and a taping robot for mounting the detected ICs on the tape.

[0007] In this way, the taping efficiency and automation degree can be improved.

[0008] In another embodiment, the taping assembly further comprises a top surface detector for detecting the top surface of the IC, the top surface detector being located upstream of the taping robot, if the top surface detector detects that the top surface of the IC does not meet the top surface detection standard, the taping robot will place the unqualified IC into the taping area drop box; if the top surface detector detects that the top surface of the IC meets the top surface detection standard, the taping robot will install the qualified IC on the tape.

[0009] In this way, the detection automation can be improved.

[0010] In another embodiment, the detection assembly comprises: a temperature and pressure detection assembly installed downstream of the feeding assembly, the temperature and pressure detection assembly being used for temperature control and pressure measurement of the IC; a 3D detection assembly installed downstream of the temperature and pressure detection assembly, the 3D detection assembly being used for shape detection of the IC, and the taping assembly being installed downstream of the 3D detection assembly.

[0011] In this way, the detection automation can be improved, and temperature and pressure tests can be realized.

[0012] In another embodiment, the temperature and pressure detection assembly comprises: a pre-warming disc installed downstream of the feeding assembly; a pre-warming feeding robot installed at the pre-warming disc, used for placing the IC positioned by the feeding assembly into the pre-warming disc; a pressure measurement area feeding shuttle installed downstream of the pre-warming disc; a pressure measurement feeding robot installed at the pressure measurement area feeding shuttle, used for placing the pre-warmed IC into the pressure measurement area feeding shuttle; a pressure measurer installed downstream of the pressure measurement area feeding shuttle, used for pressure measurement of the IC and marking the pressure measurement result of the IC; a pressure measurement area discharge shuttle installed downstream of the pressure measurer; a temperature and pressure screening robot installed at the pressure measurement area discharge shuttle, used for placing the qualified IC according to the pressure measurement result to the 3D detection assembly and placing the unqualified IC into the temperature and pressure area drop box.

[0013] In this way, preheating can be performed, and automatic feeding and discharging can be realized, pre-warming and pressure measurement can be performed.

[0014] In another embodiment, the 3D detection assembly comprises: a PNP shuttle installed downstream of the temperature and pressure screening robot, the PNP shuttle being used for receiving the qualified IC; a 3D detector arranged downstream of the PNP shuttle; a 3D detection robot installed between the 3D detector and the PNP shuttle, the 3D detection robot being used for grabbing the IC on the PNP shuttle at the 3D detector for 3D detection, and then placing the IC with the 3D detection result marked into the PNP shuttle; a 3D screening robot installed between the PNP shuttle and the taping assembly, the 3D screening robot being used for placing the qualified IC according to the 3D detection result to the taping assembly and placing the unqualified IC into the 3D detection drop box.

[0015] In this way, 3D detection can be automatically performed and automatic feeding can be performed.

[0016] In another embodiment, the feeding assembly comprises a vibration disc for receiving ICs which have not been sorted and detected; a guide rail installed downstream of the vibration disc for conveying the sorted ICs; an IC positioner installed downstream of the guide rail for positioning the ICs; a surface detection mechanism installed downstream of the IC positioner for detecting information of the surface of the ICs, and if the ICs pass the surface detection, the ICs are put into the detection assembly, and if the ICs do not pass the surface detection, the ICs are put into the feeding area discharge box.

[0017] In this way, automatic feeding and sorting can be achieved to facilitate sorting and positioning.

[0018] In another embodiment, the surface detection mechanism comprises a pin carrier for fixing the ICs in cooperation with the IC positioner; and a pin detector for detecting the pins of the ICs on the pin carrier.

[0019] In this way, pin cooperation and detection can be performed to improve automatic performance.

[0020] In another embodiment, the feeding assembly comprises an IC rotator installed downstream of the IC positioner, the IC rotator being used for rotating the ICs to a predetermined direction; and a feeding manipulator for placing the ICs rotated to the predetermined direction by the IC rotator into the detection assembly.

[0021] In this way, IC positioning and rotation can be performed to facilitate detection and positioning.

[0022] In another embodiment, the feeding assembly further comprises a feeding area shuttle installed downstream of the feeding manipulator, and the feeding manipulator places the ICs rotated to the predetermined direction onto the feeding area shuttle.

[0023] In this way, automatic feeding can be performed to improve the degree of automation and production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 Fig. 1 is a top view of a measuring and encoding integrated machine according to an embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] It should be noted that when a component is referred to as being "mounted on" another component, it may be mounted directly on the other component or there may be a central component. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a central component. When a component is considered to be "fixed to" another component, it may be directly fixed to the other component or there may be a central component.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0028] In order to facilitate understanding and clearly explain the method, the structure of the attaching device is briefly explained before explaining the method.

[0029] like Figure 1 As shown, Figure 1 The embodiment of the integrated testing and weaving machine of the present invention is shown, which includes a feeding assembly 10, a detection assembly 20 and a braiding assembly 30. The detection assembly 20 is arranged downstream of the feeding assembly 10, and the braiding assembly 30 is arranged downstream of the detection assembly 20.

[0030] Using the technical solution of the present invention, the loading assembly 10 is first used to load and position the IC, then the detection assembly 20 is used to detect the loaded and positioned IC, and finally the braiding assembly 30 directly performs the braiding process on the detected IC. In this way, when the braiding assembly 30 is braiding the IC, the loading assembly 10 and the detection assembly 20 can be directly used to load, position, and detect the IC, eliminating the need for additional components related to IC loading, positioning, and detection. This greatly simplifies the series of IC processing steps, improves the efficiency of IC detection and packaging, and saves time and labor costs.

[0031] As an optional embodiment, the tape assembly 30 includes a tape track 31 and a tape manipulator. The tape track 31 is connected to the output track of the detection assembly 20. During use, the tape manipulator mounts the detected IC on the tape.

[0032] More preferably, in the technical solution of the embodiment, the taping assembly 30 further comprises a top surface detector 32 for detecting the top surface of the IC, and the top surface detector 32 is located upstream of the taping robot. In use, if the top surface detector 32 detects that the top surface of the IC does not meet the top surface detection standard, the taping robot will put the unqualified IC into the taping area drop box; if the top surface detector 32 detects that the top surface of the IC meets the top surface detection standard, the taping robot will install the qualified IC on the tape. In this way, it can be determined whether the label on the top surface of the IC is accurate and clear, and the actual direction of the IC can also be determined.

[0033] As shown in Figure 1 In the technical solution of the embodiment, the detection assembly 20 comprises a temperature and pressure detection assembly and a 3D detection assembly. The temperature and pressure detection assembly is installed downstream of the feeding assembly 10, the 3D detection assembly is installed downstream of the temperature and pressure detection assembly, and the taping assembly 30 is installed downstream of the 3D detection assembly. In use, the temperature and pressure detection assembly controls the temperature and measures the pressure of the IC, and then the 3D detection assembly detects the shape of the IC. It should be noted that the 3D detection assembly mainly determines whether the shape of the IC is consistent with the standard shape through visual detection, so as to determine whether the IC has been deformed or damaged.

[0034] Optionally, in the technical scheme of the embodiment, the temperature and pressure detection assembly comprises a pre-warming disc 21, a pre-warming feeding manipulator 22, a pressure measurement feeding manipulator, a pressure measurement zone feeding shuttle 23, a pressure measurer 24, a pressure measurement zone discharging shuttle 25 and a temperature and pressure screening manipulator. The pre-warming disc 21 is installed downstream of the feeding assembly 10, the pre-warming feeding manipulator 22 is installed at the pre-warming disc 21, the pressure measurement zone feeding shuttle 23 is installed downstream of the pre-warming disc 21, the pressure measurement feeding manipulator is installed at the pressure measurement zone feeding shuttle 23, the pressure measurer 24 is installed downstream of the pressure measurement zone feeding shuttle 23, the pressure measurement zone discharging shuttle 25 is installed downstream of the pressure measurer 24, and the temperature and pressure screening manipulator is installed at the pressure measurement zone discharging shuttle 25. In use, the pre-warming feeding manipulator 22 places the IC positioned by the feeding assembly 10 on the pre-warming disc 21, thereby realizing pre-warming of the IC. The pressure measurement feeding manipulator places the pre-warmed IC in the pressure measurement zone feeding shuttle 23, the pressure measurer 24 is used for pressure measurement of the IC and marking of the pressure measurement result of the IC, the pressure measurer 24 mainly plays a role in electrical performance testing of the IC in a specific environment, and the temperature and pressure screening manipulator places the qualified IC at the 3D detection assembly and the unqualified IC in a temperature and pressure zone discharging box 26 according to the pressure measurement result. Optionally, the pre-warming disc 21 described above can realize temperature control function by providing refrigerant by a refrigerant machine and heating by a heating rod, the whole machine is sealed as a whole cavity, a dryer is used to blow air into the internal cavity, so that the feeding zone and the testing zone are dry environment, thereby meeting the demand of frost-free in the low-temperature environment for the IC and the environment around the IC. When it is necessary to heat the pre-warming disc 21, an electric heating structure can also be used for heating, so as to improve the heating efficiency. Optionally, in the technical scheme of the embodiment, the pre-warming feeding manipulator 22 and the pressure measurement feeding manipulator are the same manipulator, and the range of the pre-warming feeding manipulator 22 covers the pre-warming disc 21 and the pressure measurement zone feeding shuttle 23. As another optional embodiment, the pre-warming feeding manipulator 22 and the pressure measurement feeding manipulator can also be two different manipulators.

[0035] In the technical scheme of the embodiment, more preferably, the 3D detection assembly comprises a PNP feeding shuttle 27, a 3D detector 28, a 3D detection manipulator and a 3D screening manipulator 29. The PNP feeding shuttle 27 is installed downstream of the temperature and pressure screening manipulator, the 3D detector 28 is arranged downstream of the PNP feeding shuttle 27, the 3D detection manipulator is installed between the 3D detector 28 and the PNP feeding shuttle 27, and the 3D screening manipulator 29 is installed between the PNP feeding shuttle 27 and a ribbon assembly 30. In use, the PNP feeding shuttle 27 is used to receive the qualified IC, the 3D detection manipulator grabs the IC on the PNP feeding shuttle 27 to the 3D detector 28 for 3D detection, then places the IC with the 3D detection result marked after 3D detection into the PNP feeding shuttle 27, and finally the 3D screening manipulator 29 places the qualified IC at the ribbon assembly 30 and the unqualified IC in a 3D detection discharging box according to the 3D detection result.

[0036] As shown in Figure 1 the technical scheme of the embodiment, the feeding assembly 10 includes a vibrating disc 11, a guide rail, an IC positioner 12 and a surface detection mechanism 13. The guide rail is installed downstream of the vibrating disc 11, the IC positioner 12 is installed downstream of the guide rail, and the surface detection mechanism 13 is installed downstream of the IC positioner 12. In use, the vibrating disc 11 receives ICs to be sorted and detected, the guide rail conveys the ICs to be sorted, the IC positioner 12 is used to position the ICs, and finally the surface detection mechanism 13 detects the surface information of the ICs. If the ICs pass the surface detection, the ICs are transported to the detection assembly 20; if the ICs do not pass the surface detection, the ICs are placed into the feeding area discharge box 15. It should be noted that the surface information can include two-dimensional code information or bar code information.

[0037] As an optional implementation, in the technical scheme of the embodiment, the surface detection mechanism 13 includes a pin carrier and a pin detector. The pin carrier cooperates with the IC positioner 12 to fix the ICs, and the pin detector detects the pins of the ICs on the pin carrier.

[0038] As shown in Figure 1 the technical scheme of the embodiment, the feeding assembly 10 includes an IC rotator 14 and a discharge manipulator. The IC rotator 14 is installed downstream of the IC positioner 12. In use, the IC rotator 14 rotates the ICs to a predetermined direction, and the discharge manipulator places the ICs rotated to the predetermined direction by the IC rotator 14 at the detection assembly 20, so as to facilitate subsequent detection of the ICs and processing procedures of production and installation.

[0039] Optionally, in the technical scheme of the embodiment, the feeding assembly 10 further includes a feeding area shuttle 16, which is installed downstream of the discharge manipulator. The discharge manipulator places the ICs rotated to the predetermined direction on the feeding area shuttle 16.

[0040] Specifically, the use flow of the testing and taping integrated machine is as follows: the bulk IC is placed in the vibrating disc 11, enters the straight vibrating track through the curved track, and a blowing function is additionally arranged at the joint of the curved track and the straight track to jointly act on the IC to reach the end of the track. Then, the IC enters the rotating disc detection area, is first positioned by the IC positioner 12, and after positioning, the surface detection mechanism 13 is used for pin detection, the IC that does not pass the detection enters the feeding area and falls into the falling box 15, and the IC that passes the detection enters the IC rotator 14, is rotated to the corresponding angle of the pressure tester, and then enters the feeding area and falls into the shuttle 16. Then, the IC is taken by the pre-warming feeding manipulator 22, falls into the pre-warming disc 21 for pre-warming, and when the temperature of the IC reaches the preset temperature, the IC is sent into the pressure tester 24. After the electrical performance test is completed, the IC falls into the discharge shuttle 25 of the pressure testing area, is screened by the temperature and pressure screening manipulator, the qualified IC is placed at the PNP shuttle 27, and the unqualified IC is placed in the falling box 26 of the temperature and pressure area. The PNP shuttle 27 takes the IC to the 3D detector 28, and the 3D detector 28 is used for visual detection. After the visual detection is completed, the IC falls into the PNP shuttle 27, and the IC that does not pass the detection falls into the 3D detection falling box according to the unqualified items. Preferably, the 3D detection falling box can be classified, the IC with unqualified size is placed in the size falling box, and the IC with unqualified mark is placed in the mark falling box. Finally, the IC that passes the detection falls into the area where the taping assembly 30 is located, and the IC after the detection is installed on the taping by the taping track 31 and the taping manipulator. The IC installed on the taping can be output.

[0041] The various shuttle devices described above mainly serve as the conveying carrier of the IC, and facilitate the conveying of the IC in the current unknown state. Optionally, the positioner or the manipulator described above can be a holding type, a suction cup type, or even a soft bionic finger.

[0042] In this process, the bulk IC must pass the electrical performance test and the visual test to ensure the consistency and stability of the product. The IC that passes the test can be called a qualified product, and before the sale, the IC product needs to be taping processed, for example, 2500 pieces per tray, 4000 pieces per tray, etc., which is beneficial to the counting and storage of the product.

[0043] As known from the above, the technical scheme of the present application combines the sorting machine and the taping machine together, and a testing and taping integrated machine is invented, a large number of repeated steps are saved, the overall efficiency of the IC testing, sorting and taping is greatly improved on the premise of not losing the function, the labor cost and the production cost are saved, finally, due to the fact that the size of the machine is much smaller than the sum of two machines, the same factory planning can accommodate more machines, and the production scale is improved.

[0044] The technical features of the above-described embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features are described herein, but it is understood that any combination of the technical features is within the scope of the present specification.

[0045] Those skilled in the art will realize that the above embodiments are merely illustrative of the present application and should not be taken as limiting the present application. Any modifications, equivalent replacements, improvements, and the like made to the above embodiments within the spirit and principle of the present application shall fall within the scope of the present application.

[0046] For the sake of description, spatial relative terms such as "above", "upper", "top", "bottom", "lower", "horizontal", "vertical", "front", "rear", and the like can be used herein for describing the spatial relationship between one device or feature and another device or feature as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is turned over, the device described as "above" or "above" the other device or structure would then be positioned "below" or "below" the other device or structure. Thus, the exemplary term "above" can include both the "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0047] In the description of the present application, it should be understood that the orientation words such as "front, rear, upper, lower, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without the contrary description, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component.

[0048] The above description is only the preferred embodiments of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, and the like made to the above embodiments within the spirit and principle of the present application shall fall within the scope of the present application.

Claims

1. A machine for editing and compiling, characterized in that, The utility model relates to an IC testing and coding integrated machine, which comprises: an IC feeding assembly (10) for positioning ICs; a detection assembly (20) arranged downstream of the IC feeding assembly (10) for detecting the positioned ICs; a coding assembly (30) arranged downstream of the detection assembly (20) for coding the detected ICs; wherein the IC feeding assembly (10) comprises: a vibrating disc (11) for receiving unsorted and undetected ICs; a guide rail mounted downstream of the vibrating disc (11) for conveying the sorted ICs; an IC positioner (12) mounted downstream of the guide rail for positioning the ICs; a surface detection mechanism (13) mounted downstream of the IC positioner (12) for detecting information of the surface of the ICs, and if the ICs pass the surface detection, the ICs are put into the detection assembly (20), and if the ICs do not pass the surface detection, the ICs are put into a feeding area discharge box (15); the detection assembly (20) comprises a temperature and pressure detection assembly mounted downstream of the IC feeding assembly (10), which is used for temperature control and pressure measurement of the ICs, and the temperature and pressure detection assembly is used for low-temperature detection of the ICs; a 3D detection assembly mounted downstream of the temperature and pressure detection assembly, which is used for shape detection of the ICs, and the coding assembly (30) is mounted downstream of the 3D detection assembly; the coding assembly (30) comprises a top surface detector (32) and a coding mechanical arm for mounting the detected ICs on a coding tape, the top surface detector (32) is used for detecting the top surface of the ICs, and the top surface detector (32) is located upstream of the coding mechanical arm, if the top surface detector (32) detects that the top surface of the ICs does not meet the top surface detection standard, the coding mechanical arm puts the unqualified ICs into a coding area discharge box, and if the top surface detector (32) detects that the top surface of the ICs meets the top surface detection standard, the coding mechanical arm mounts the qualified ICs on the coding tape; the IC testing and coding integrated machine is sealed as a whole, and a dryer is used to blow air into the internal cavity to make the area where the IC feeding assembly and the detection assembly are located a dry environment.

2. The machine of claim 1, wherein, the coding assembly (30) further comprises: a coding track (31) connected with an output track of the detection assembly (20).

3. The machine of claim 1, wherein, the temperature and pressure detection assembly comprises: a pre-warming disc (21) mounted downstream of the IC feeding assembly (10); a pre-warming feeding mechanical arm (22) mounted at the pre-warming disc (21) for placing the ICs positioned by the IC feeding assembly (10) in the pre-warming disc (21); a pressure measurement area feeding shuttle (23) mounted downstream of the pre-warming disc (21); a pressure measurement feeding mechanical arm mounted at the pressure measurement area feeding shuttle (23) for placing the pre-warmed ICs in the pressure measurement area feeding shuttle (23); a pressure gauge (24) mounted downstream of the pressure measurement area feeding shuttle (23) for pressure measurement of the ICs and marking the pressure measurement results of the ICs. A pressure measuring area discharge shuttle (25) is installed downstream of the pressure gauge (24); A warm pressure screening manipulator is installed at the pressure measuring area discharge shuttle (25), and according to the pressure measuring result, the qualified ICs are placed at the 3D detection assembly, and the unqualified ICs are placed into a warm pressure area discharge box (26).

4. The machine of claim 3, wherein, The 3D detection assembly comprises: A PNP shuttle (27) is installed downstream of the warm pressure screening manipulator, and the PNP shuttle (27) is used to receive the qualified ICs; A 3D detector (28) is arranged downstream of the PNP shuttle (27); A 3D detection manipulator is installed between the 3D detector (28) and the PNP shuttle (27), and the 3D detection manipulator is used to grab the ICs on the PNP shuttle (27) for 3D detection at the 3D detector (28), and then mark the 3D detection result of the ICs after 3D detection and place them back to the PNP shuttle (27); A 3D screening manipulator (29) is installed between the PNP shuttle (27) and the taping assembly (30), and the 3D screening manipulator (29) places the qualified ICs according to the 3D detection result to the taping assembly (30), and places the unqualified ICs into a 3D detection discharge box.

5. The machine of claim 1, wherein, The surface detection mechanism (13) comprises: A pin carrier is used to fix the ICs in cooperation with the IC positioner (12); A pin detector is used to detect the pins of the ICs on the pin carrier.

6. The machine of claim 1, wherein, The feeding assembly (10) comprises: An IC rotator (14) is installed downstream of the IC positioner (12), and the IC rotator (14) is used to rotate the ICs to a predetermined direction; A discharge manipulator is used to place the ICs rotated to the predetermined direction by the IC rotator (14) to the detection assembly (20).

7. The machine of claim 6, wherein, The feeding assembly (10) further comprises a feeding area shuttle (16) installed downstream of the discharge manipulator, and the discharge manipulator places the ICs rotated to the predetermined direction onto the feeding area shuttle (16).

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