A heat dissipation device for electronic components
By designing a heat dissipation device for electronic components, the water circulation and serpentine design of the ventilation duct reduces the temperature of the air blown out by the fan, the problem of hot air blowing directly to the fin shell in the prior art is solved, and the heat dissipation effect is improved, so that the electronic components can work normally.
Patent Information
- Application Number
- CN202111417647.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-11-25
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2041-11-25
AI Technical Summary
In the high temperature environment of existing phase change radiators, the hot air blown by the fan directly blows to the fin shell, reducing the heat dissipation effect and affecting the normal operation of electronic components.
A heat dissipation device for electronic components is designed, including a top plate, a bottom plate, a first tube, a heat dissipation box, a fan and a cooling assembly. The cooling assembly includes a water pump, a water box, a refrigeration piece and a ventilation duct. Through the water circulation and the serpentine design of the ventilation duct, it reduces the temperature of the air blown by the fan and reduces the possibility of hot air blowing directly to the first tube.
It effectively reduces the temperature of the air blown by the fan, improves the heat dissipation effect, and enables the electronic components to work normally. Through the water circulation and ventilation duct design, the cooling effect on the wind is enhanced and the overall performance of the heat dissipation device is improved.
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Figure CN114025585B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of radiators, and in particular to a heat dissipation device for electronic components. Background Art
[0002] With the emergence of high-power electronic components and the development of ultra-high-integration electronic components towards high speed, high frequency and high power, the heat generated by electronic devices is increasing, the heat flux density and surface temperature are getting higher and higher, which affects the reliability and service life of the devices and puts forward higher requirements for heat dissipation. The existing phase change radiator has a slow return speed of the working medium after liquefaction and cannot meet the current heat dissipation requirements.
[0003] Chinese Patent with publication number CN201609005U discloses a finned phase change electronic radiator, which includes a heat pipe chamber, a finned shell, a foam metal and a phase change material. The heat pipe chamber is connected to the finned shell to form an integral cavity, and there is a phase change material in the cavity. A forced convection fan is installed on the side or top of the finned shell.
[0004] Regarding the above related technologies, the inventor believes that there are the following defects: when the working environment temperature where the fan is located is relatively high, the temperature of the air blown by the fan onto the finned shell is relatively high, which reduces the heat dissipation effect of the fan on the finned shell, makes the heat dissipation effect of the radiator on the electronic components poor, and affects the normal operation of the electronic components. Summary of the Invention
[0005] In order to enable the normal use of electronic components, the present application provides a heat dissipation device for electronic components.
[0006] The heat dissipation device for electronic components provided by the present application adopts the following technical solutions:
[0007] A heat dissipation device for electronic components includes a top plate and a bottom plate. Both the top plate and the bottom plate are hollowly arranged. A plurality of first pipes are communicated between the top plate and the bottom plate. A first liquid pipe for adding phase change liquid is provided on the bottom plate, and the first liquid pipe is communicated with the bottom plate. A heat dissipation box is commonly connected to the vertical side walls of the top plate and the bottom plate. A heat dissipation opening is formed on one side wall of the heat dissipation box, and the plurality of first pipes block the heat dissipation opening. A fan is arranged in the heat dissipation box, and the fan is arranged towards the heat dissipation opening. A temperature reduction component for cooling the air blown by the fan is provided on the heat dissipation box.
[0008] By adopting the above technical solution, during use, the operator starts the cooling component and the fan. When the wind passes through the cooling component, the temperature of the wind decreases, and then it blows towards the multiple first tubes through the heat dissipation port, capable of dissipating heat from the first tubes. Therefore, the possibility of directly blowing hot air onto the first tubes is reduced, enabling the heat dissipation device to operate normally. In summary, the present application enables the normal use of electronic components.
[0009] Optionally, the cooling component includes a first water box, a water pump, a connecting pipe, a first water supply pipe, a first return pipe, a refrigerating member for refrigerating the water in the first water box, multiple water belts, and a ventilation pipe. Both ends of the ventilation pipe are closed. The ventilation pipe is communicated with the air outlet end of the fan. The ventilation pipe is arranged in a serpentine shape. The refrigerating member is arranged on the first water box. The water pump is arranged on the first water box. The water inlet end of the water pump is communicated with the water in the first water box through the connecting pipe. The water outlet end of the water pump is communicated with the first water supply pipe. The first return pipe is communicated with the side wall of the first water box. Multiple water belts are communicated between the first water supply pipe and the first return pipe. The ventilation pipe is sleeved outside the multiple water belts. Multiple air outlet openings are opened at one end of the ventilation pipe close to the heat dissipation port, and the multiple air outlet openings are arranged towards the heat dissipation port.
[0010] By adopting the above technical solution, during use, the operator cools the water in the first water box through the refrigerating member. Then, the water pump is started. The water pump extracts the cooling water in the first water box and conveys it into the first water supply pipe, and then it flows into the multiple water belts respectively, causing the water belts to expand due to being filled with water. The cross-section of the water belt is circular. Then it flows into the first return pipe, forming a water cycle. The operator starts the fan. The wind blown by the fan enters the ventilation pipe and contacts the water belts, passing through the gap between the water belts and the inner wall of the ventilation pipe. Under the action of the cooling water, the water belts can cool the wind, and then it is blown out from the air outlet openings. Arranging the ventilation pipe in a serpentine shape increases the moving time of the wind in the ventilation pipe, thereby increasing the time for the wind to be cooled by the water belts, capable of increasing the cooling effect. And by arranging the ventilation pipe, the possibility that the wind blown by the fan contacts the outside and heats up is reduced, further improving the cooling effect on the wind.
[0011] Optionally, a second pipe is arranged at one end of each of the multiple water belts close to the first water supply pipe. One end of the second pipe is communicated with the first water supply pipe, and the other end is communicated with the water belt. A control valve is arranged on the second pipe.
[0012] By adopting the above technical solution, during use, the operator can achieve individual control of each water hose through the control valve. When it is necessary to increase the air volume, the operator can close the control valve to reduce the amount of water flowing into the water hose. Consequently, the volume of the water hose supported by the cooling water decreases, and the air volume blown out from the ventilation pipe increases accordingly. When it is necessary to reduce the air volume, the operator can open the control valve to increase the volume of the water hose supported by the cooling water, thereby reducing the pores through which the air supply in the ventilation pipe passes, and thus playing a role in reducing the air volume. Furthermore, the air volume at the air outlet is adjusted by the expansion volume of the water hose.
[0013] Optionally, a plurality of support protrusions are provided on the outer side wall of the water hose. When the cooling water fills the water hose, the support protrusions abut against the side wall of the ventilation pipe.
[0014] By adopting the above technical solution, when the water hose is supported by the cooling water, the support protrusions can abut against the side wall of the ventilation pipe, ensuring that there is always a gap between the water hose and the inside of the ventilation pipe, and ensuring that the air blown by the fan can pass through normally.
[0015] Optionally, heat dissipation fins are provided between adjacent two of the first pipes. The heat dissipation fins are arranged in a wavy shape and are in contact with the first pipes.
[0016] By adopting the above technical solution, by providing the heat dissipation fins, the contact area with the air blown out from the heat dissipation port is increased, which is beneficial to the heat dissipation of the gaseous phase change liquid in the first pipe to form a liquid state and continue to dissipate heat from the electronic components.
[0017] Optionally, a maintenance opening is provided at the top of the heat dissipation box. A baffle plate for covering the maintenance opening is hinged on the heat dissipation box. A plurality of support rods are provided on the inner side wall of the heat dissipation box. A clamping plate is provided on the support rod. The clamping plate is arranged in an arc shape and is clamped with the ventilation pipe.
[0018] By adopting the above technical solution, the operator clamps the ventilation pipe in the clamping plate. The clamping plate clamps the ventilation pipe, and the support rod supports the ventilation pipe. When the air passes through the ventilation pipe, the clamping plate can play a clamping role, reducing the possibility of noise generated by the ventilation pipe due to shaking.
[0019] Optionally, through holes corresponding to the plurality of water hoses are provided at both ends of the ventilation pipe. The water hoses are connected to the through holes through Velcro. One end of the water hose is detachably connected to the first water supply pipe, and the other end is detachably connected to the return pipe.
[0020] By adopting the above technical solution, when the water volume in a certain water hose decreases, the top support force of the cooling water on the side wall of the water hose decreases, and the water hose is prone to collapse, thus generating a gap between the water hose and the through hole, which is prone to air leakage. The magic tape can keep the water hose adhered to the side wall of the through hole all the time, reducing the possibility of air leakage. When the water hose needs to be replaced, one end of the water hose is disassembled from the first water supply pipe, and the other end is disassembled from the first return pipe. Then, the hook surface and the plush surface of the magic tape are manually disassembled, which is convenient for removing the damaged water hose.
[0021] Optionally, a buffer pad is provided on the side wall of the clamping plate, and the buffer pad is attached to the side wall of the ventilation pipe.
[0022] By adopting the above technical solution, on the one hand, it plays a buffering role and reduces the possibility of the ventilation pipe shaking. On the other hand, the buffer pad is in elastic contact with the ventilation pipe and can produce a certain amount of deformation, making the clamping plate clamp the ventilation pipe more stably.
[0023] In summary, the present application includes at least one of the following beneficial technical effects:
[0024] In the present application, by providing a heat dissipation box, a heat dissipation port, a fan and a cooling component, during use, the operator starts the cooling component and the fan. When the air passes through the cooling of the cooling component, the temperature of the air decreases, and then blows through the heat dissipation port to a plurality of first pipes, which can dissipate heat from the first pipes. Therefore, the possibility of directly blowing hot air onto the first pipes is reduced, enabling the heat dissipation device to work normally. In summary, the present application enables the electronic components to be used normally;
[0025] In the present application, by providing a second pipe and a control valve, the operator can individually control each water hose through the control valve. When it is necessary to increase the air volume, the control valve can be closed to reduce the water volume flowing into the water hose. As a result, the volume of the water hose supported by the cooling water decreases, and thus the air volume blown out from the ventilation pipe increases. When it is necessary to reduce the air volume, the operator can open the control valve to increase the volume of the water hose supported by the cooling water, thereby reducing the pores through which the air supply passes in the ventilation pipe, and thus playing a role in reducing the air volume. Furthermore, the air volume at the air outlet is adjusted by the expansion volume of the water hose. BRIEF DESCRIPTION OF THE DRAWINGS
[0026] Figure 1 is a schematic structural diagram of a heat dissipation device for electronic components according to the present application.
[0027] Figure 2 is a schematic diagram of the internal structure of the heat dissipation box in the embodiment of the present application.
[0028] Figure 3 is a schematic diagram of the structures of the heat dissipation port and the air outlet in the embodiment of the present application.
[0029] Figure 4 This is a cross-sectional view of the heat dissipation box in the embodiments of the present application.
[0030] Figure 5 It is Figure 4 an enlarged view of part A in
[0031] Explanation of reference numerals: 1, top plate; 2, bottom plate; 3, first pipe; 4, heat dissipation fins; 5, first liquid pipe; 6, heat dissipation box; 7, heat dissipation opening; 8, fan; 9, temperature reduction assembly; 91, first water box; 92, water pump; 93, connecting pipe; 94, first water supply pipe; 95, first return pipe; 96, refrigeration component; 97, water belt; 98, ventilation pipe; 10, load-bearing plate; 11, installation pipe; 12, second pipe; 13, control valve; 14, clamp; 15, clamping through hole; 16, air inlet pipe; 17, air collection funnel; 18, air outlet; 19, through hole; 20, magic tape; 21, support protrusion; 22, inspection opening; 23, shielding plate; 24, support rod; 25, clamping plate; 26, buffer pad; 27, temperature sensor; 28, drying fan. Detailed implementation manners
[0032] The following further describes the present application in detail in conjunction with the attached Figures 1-5 drawings.
[0033] Embodiments of the present application disclose a heat dissipation device for electronic components. Referring to Figure 1 , a heat dissipation device for electronic components includes a top plate 1 and a bottom plate 2. Both the top plate 1 and the bottom plate 2 are hollowly arranged, and the electronic components can be connected to the bottom of the bottom plate 2 by bolts. A plurality of first pipes 3 are communicated between the top plate 1 and the bottom plate 2. The first pipes 3 are square pipes, and there is a spacing between two adjacent first pipes 3. And heat dissipation fins 4 are arranged between two adjacent first pipes 3. The heat dissipation fins 4 are arranged in a wavy shape and are in contact with the side walls of the first pipes 3.
[0034] Referring to Figure 1 , Figure 2 and Figure 3 , a first liquid pipe 5 for adding phase change liquid is communicated with the side wall of the bottom plate 2. A heat dissipation box 6 is jointly connected to the vertical side walls of the top plate 1 and the bottom plate 2. A heat dissipation opening 7 is opened on one side wall of the heat dissipation box 6. The heat dissipation opening 7 faces the first pipes 3. The plurality of first pipes 3 block the heat dissipation opening 7. A fan 8 is arranged on the side wall of the heat dissipation box 6 away from the heat dissipation opening 7. The air outlet end of the fan 8 faces the heat dissipation opening 7. A temperature sensor 27 is arranged on the heat dissipation box 6. The temperature sensor 27 is electrically connected to the fan 8 through a control system. When the sensing end of the temperature sensor 27 detects that the temperature in the heat dissipation box 6 decreases, the temperature sensor 27 reduces the rotation speed of the fan 8 through the control system to play a role in saving electric energy.
[0035] Referring to Figure 1, a cooling component 9 for cooling the air blown by the fan 8 is provided on the heat dissipation box 6. The cooling component 9 includes a first water box 91, a water pump 92, a connecting pipe 93, a first water supply pipe 94, a first return pipe 95, a refrigerating member 96 for refrigerating the water in the first water box 91, three water belts 97 and a ventilation pipe 98.
[0036] Refer to Figure 1 , a load-bearing plate 10 is fixedly connected to the side wall of the heat dissipation box 6, the first water box 91 is fixedly connected to the load-bearing plate 10, the refrigerating member 96 is a refrigerating sheet, the refrigerating sheet is bolted to the side wall of the first water box 91, the refrigerating surface of the refrigerating sheet is attached to the side wall of the first water box 91, and a plurality of refrigerating sheets are arranged on the side wall of the first water box 91. The water pump 92 is arranged on the top of the first water box 91, the water inlet end of the water pump 92 is communicated with the cooling water in the first water box 91 through the connecting pipe 93, the water outlet end of the water pump 92 is communicated with the first water supply pipe 94, and one end of the first water supply pipe 94 away from the water pump 92 is closed.
[0037] Refer to Figure 1 and Figure 2 , the first return pipe 95 is communicated with the side wall of the first water box 91, and one end of the first return pipe 95 away from the first water box 91 is closed. Installation pipes 11 corresponding to the water belts 97 one by one are arranged on the first return pipe 95, and the installation pipes 11 are communicated with the first return pipe 95. The water belts 97 are communicated between the first water supply pipe 94 and the first return pipe 95, the first water supply pipe 94 is communicated with second pipes 12 corresponding to the water belts 97 one by one, a control valve 13 is arranged on each second pipe 12, one end of the water belt 97 is connected to the end of the second pipe 12 away from the first water supply pipe 94 through a clamp 14, and the other end is also connected to the end of the installation pipe 11 away from the first return pipe 95 through a clamp 14.
[0038] Refer to Figure 1 , both ends of the ventilation pipe 98 are closed, two clamping through holes 15 for clamping both ends of the ventilation pipe 98 are opened on the side wall of the heat dissipation box 6, one clamping through hole 15 clamps one end of the ventilation pipe 98, the ventilation pipe 98 can be a corrugated pipe, the ventilation pipe 98 is arranged in a snake shape in the heat dissipation box 6. During installation, the ventilation pipe 98 can be straightened first, and after the water belts 97 are installed, the ventilation pipe 98 can be bent, which is convenient for operation. An air inlet pipe 16 is communicated with the side wall of the ventilation pipe 98, an air collecting funnel 17 is communicated with the air inlet pipe 16, one end of the air collecting funnel 17 has a large opening and the other end has a small opening, the end with the large opening is communicated with the air outlet 18 of the fan 8, and the end with the small opening is communicated with the air inlet pipe 16.
[0039] Refer to Figure 1 , Figure 2 and Figure 3, one end of the ventilation pipe 98 close to the heat dissipation port 7 is provided with a plurality of air outlets 18, the plurality of air outlets 18 are arranged towards the heat dissipation port 7, through holes 19 corresponding to the water hoses 97 one by one are opened on both end faces of the ventilation pipe 98, the water hose 97 is inserted into the ventilation pipe 98 through a through hole 19 at one end and then passes out through a through hole 19 at the other end of the ventilation pipe 98, so that the ventilation pipe 98 is sleeved outside the water hose 97, and the part of the water hose 97 passing through the through hole 19 is connected to the side wall of the through hole 19 through a magic tape 20. A plurality of support protrusions 21 are fixedly connected to the outer side wall of the water hose 97. When the cooling water fills the water hose 97, the support protrusions 21 abut against the side wall of the ventilation pipe 98, so that there is always a gap between the water hose 97 and the inside of the ventilation pipe 98, which can ensure that the air blown by the fan 8 passes through normally.
[0040] Refer to Figure 1 , Figure 2 and Figure 4 , a maintenance opening 22 is opened on the top of the heat dissipation box 6, a shielding plate 23 is hinged on the heat dissipation box 6, the shielding plate 23 shields the maintenance opening 22, two drying fans 28 are arranged on the shielding plate, the air outlets of the drying fans are arranged towards the inside of the heat dissipation box 6, which can not only cool the inside of the heat dissipation box 6, but also extract the water vapor therein to keep the inside of the heat dissipation box 6 dry. A plurality of support rods 24 are vertically and fixedly connected to the inner side wall of the heat dissipation box 6, and a clamping plate 25 is fixedly connected to each support rod 24. The clamping plate 25 is arc-shaped and is clamped with the side wall of the ventilation pipe 98.
[0041] Refer to Figure 2 and Figure 5 , a buffer pad 26 is adhered to the side wall of the clamping plate 25. The buffer pad 26 is a rubber pad, and the buffer pad 26 is closely attached to the side wall of the ventilation pipe 98. The buffer pad 26 can not only play a buffering role, reducing the possibility of the ventilation pipe 98 shaking, but also elastically contacting with the ventilation pipe 98, being able to generate a certain amount of deformation, so that the clamping plate 25 clamps the ventilation pipe 98 more stably.
[0042] The implementation principle of a heat dissipation device for electronic components in an embodiment of the present application is as follows: when the electronic components are working, the operator adds phase change liquid into the bottom plate 2 through the first liquid pipe 5. The heat generated by the electronic components is transferred to the bottom plate 2, and the phase change liquid in the bottom plate 2 absorbs the heat and is converted from a liquid state to a gaseous state, and moves to the top plate 1 through the first pipe 3. At this time, the operator starts the fan 8, and also starts the water pump 92 and the refrigeration sheet. The refrigeration sheet cools the water in the first water box 91, and the water pump 92 extracts the water in the first water box 91 and transports it into the first water supply pipe 94;
[0043] The operator opens the control valve 13, the cooling water flows into the water belt 97, and props up the water belt 97, and finally moves to the first water box 91 through the first return pipe 95, thereby forming a water cycle, and the wind from the fan 8 enters the ventilation pipe 98 through the air collecting funnel 17. Since the ventilation pipe 98 is arranged in a serpentine shape, the wind blown by the fan 8 has a longer moving time in the ventilation pipe 98, which not only increases the contact time with the water, but also can improve the cooling effect of the wind. Finally, it is blown out from multiple air outlets 18 and blown to the first tube 3 from the heat dissipation port 7, so as to cool the first tube 3, convert the gaseous phase change liquid into liquid, and flow back to the bottom plate 2 to dissipate heat for the electronic components. Therefore, the present application can continuously cool the wind blown by the fan 8, so that the heat dissipation effect of the radiator on the electronic components is improved, thereby enabling the electronic components to be used normally.
[0044] When the air volume blown out from the air outlet 18 is small, the operator adjusts the control valve 13 to reduce the amount of cooling water entering the water hose 97. After the water pressure is reduced, the volume of the water hose 97 supported by the cooling water is reduced, so the air volume blown out from the ventilation pipe 98 increases. When the air volume needs to be reduced, the operator can open the control valve 13 to increase the volume of the water hose 97 supported by the cooling water, thereby reducing the gap in the ventilation pipe 98 for air to pass through, thereby reducing the air volume, and then the air volume is regulated by the expansion volume of the water hose 97.
[0045] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A heat dissipation device for electronic components, comprising a top plate (1) and a bottom plate (2), both the top plate (1) and the bottom plate (2) are hollowly arranged, a plurality of first pipes (3) are communicated between the top plate (1) and the bottom plate (2), a first liquid pipe (5) for adding a phase change liquid is arranged on the bottom plate (2), and the first liquid pipe (5) is communicated with the bottom plate (2). Characterized in that: A heat dissipation box (6) is jointly connected to the vertical side walls of the top plate (1) and the bottom plate (2). A heat dissipation opening (7) is formed in one side wall of the heat dissipation box (6). The plurality of first pipes (3) block the heat dissipation opening (7). A fan (8) is arranged in the heat dissipation box (6), and the fan (8) is arranged towards the heat dissipation opening (7). A temperature reduction assembly (9) for cooling the air blown out by the fan (8) is arranged on the heat dissipation box (6). The temperature reduction assembly (9) comprises a first water box (91), a water pump (92), a connecting pipe (93), a first water supply pipe (94), a first return pipe (95), a refrigerating member (96) for refrigerating the water in the first water box (91), a plurality of water belts (97) and a ventilation pipe (98). Both ends of the ventilation pipe (98) are closed. The ventilation pipe (98) is communicated with the air outlet end of the fan (8). The ventilation pipe (98) is arranged in a serpentine shape. The refrigerating member (96) is arranged on the first water box (91). The water pump (92) is arranged on the first water box (91). The water inlet end of the water pump (92) is communicated with the water in the first water box (91) through the connecting pipe (93). The water outlet end of the water pump (92) is communicated with the first water supply pipe (94). The first return pipe (95) is communicated with the side wall of the first water box (91). The plurality of water belts (97) are communicated between the first water supply pipe (94) and the first return pipe (95). The ventilation pipe (98) is sleeved outside the plurality of water belts (97). A plurality of air outlet openings (18) are formed at one end of the ventilation pipe (98) close to the heat dissipation opening (7), and the plurality of air outlet openings (18) are arranged towards the heat dissipation opening (7). A second pipe (12) is arranged at one end of each of the plurality of water belts (97) close to the first water supply pipe (94). One end of the second pipe (12) is communicated with the first water supply pipe (94), and the other end is communicated with the water belt (97). A control valve (13) is arranged on the second pipe (12). A plurality of support protrusions (21) are arranged on the outer side wall of the water belt (97). When the cooling water fills the water belt (97), the support protrusions (21) abut against the side wall of the ventilation pipe (98).
2. A heat dissipation device for electronic components according to claim 1, Characterized in that: Heat dissipation fins (4) are arranged between two adjacent first pipes (3). The heat dissipation fins (4) are arranged in a wavy shape and are in contact with the first pipes (3).
3. A heat dissipation device for electronic components according to claim 1, Characterized in that: An inspection opening (22) is provided at the top of the heat dissipation box (6). A shielding plate (23) for shielding the inspection opening (22) is hinged on the heat dissipation box (6). A plurality of support rods (24) are provided on the inner side wall of the heat dissipation box (6). A clamping plate (25) is provided on the support rod (24). The clamping plate (25) is arc-shaped and is clamped with the ventilation pipe (98).
4. A heat dissipation device for electronic components according to claim 3, characterized in that: Through holes (19) corresponding to the plurality of water hoses (97) one by one are provided at both ends of the ventilation pipe (98). The water hoses (97) are connected to the through holes (19) through magic tapes (20). One end of the water hose (97) is detachably connected to the first water supply pipe (94), and the other end is detachably connected to the first return pipe (95).
5. A heat dissipation device for electronic components according to claim 3, characterized in that: A buffer pad (26) is provided on the side wall of the clamping plate (25). The buffer pad (26) is attached to the side wall of the ventilation pipe (98).
Citation Information
Patent Citations
Fin-shaped phase change electronic heat sink
CN201609005U
Phase change type cooling heat exchanger
CN113624042A
Portable cooling fan device
TWM566309U